C L D - D PRODUCT FAMILY DATA SHEET S 3 9 R E V 7 J Cree® XLamp® ML-B LEDs PRODUCT DESCRIPTION FEATURES TABLE OF CONTENTS The Cree XLamp® ML-B LED • Available in white (2200 K and Characteristics .........................................2 brings lighting-class reliability and 2600 K to 8300 K CCT) and 80-, 85- Flux Characteristics .................................2 performance to 1/4-watt LEDs. The and 90-CRI minimum Relative Spectral Power Distribution ......3 XLamp ML-B LED expands Cree’s • ANSI-compatible sub-bins Relative Flux vs. Junction Temperature ..3 lighting-class leadership to linear and • Maximum drive current: 175 mA Electrical Characteristics .........................4 distributed lighting applications. With • 120° viewing angle, uniform Relative Flux vs. Current ..........................4 XLamp LED lighting-class reliability, a chromaticity profile Typical Spatial Distribution ......................5 wide viewing angle, uniform light output, • Electrically neutral thermal path Thermal Design ........................................5 and industry-leading chromaticity • RoHS and REACh compliant Reflow Soldering Characteristics ............6 binning in a 3.5-mm X 3.5-mm package, • UL® recognized component Notes ........................................................7 the XLamp ML-B LED continues (E349212) Mechanical Dimensions ..........................9 Cree’s history of segment-focused Tape and Reel .........................................10 product innovation in LEDs for lighting Packaging ...............................................11 applications. The XLamp ML-B LED brings high performance and a smooth look to a wide range of lighting applications, including linear lighting, fluorescent retrofits and retail-display lighting. P M A L X / M O C E. E R C W. W W Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and Cree, Inc. XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300

XLAMP® ML-B LED CHARACTERISTICS Characteristics Unit Minimum Typical Maximum Thermal resistance, junction to solder point °C/W 25 Viewing angle (FWHM) degrees 120 Temperature coefficient of voltage mV/°C -3.5 ESD classification (HBM per Mil-Std-883D) Class 2 DC forward current mA 175 Reverse voltage V 5 Forward voltage (@ 80 mA) V 3.3 3.5 LED junction temperature °C 150 FLUX CHARACTERISTICS (T = 25 °C) J The following table provides several base order codes for XLamp ML-B LEDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order- code nomenclature, please consult the XLamp ML LED Family Binning and Labeling document. Minimum Luminous Flux CCT Range (lm) @ 80 mA Color Order Code Min. Max. Group Flux (lm) Cool White 4500 K 8300 K J0 23.5 MLBAWT-A1-0000-000W51 J0 23.5 MLBAWT-A1-0000-000WE5 3700 K 4300 K H0 18.1 MLBAWT-A1-0000-000VE5 Warm White J0 23.5 MLBAWT-A1-0000-000WE7 2800 K 3200 K H0 18.1 MLBAWT-A1-0000-000VE7 2000 K 2400 K G0 13.9 MLBAWT-A1-0000-000UEA 3700 K 4300 K H0 18.1 MLBAWT-H1-0000-000VE5 80-CRI Warm White 2800 K 3200 K H0 18.1 MLBAWT-H1-0000-000VE7 85-CRI Warm 3700 K 4300 K H0 18.1 MLBAWT-P1-0000-000VE5 White 2800 K 3200 K H0 18.1 MLBAWT-P1-0000-000VE7 3700 K 4300 K H0 18.1 MLBAWT-U1-0000-000VE5 90-CRI Warm White 2800 K 3200 K H0 18.1 MLBAWT-U1-0000-000VE7 Notes: • Cree maintains a tolerance of ±7% on flux measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2% for CRI measurements. See the Measurements section (page 7). • Typical CRI for Cool White (4300 K – 8300 K CCT) is 75. • Typical CRI for Warm White (2600 K – 4300 K CCT) is 80. • Minimum CRI for 80-CRI White is 80. • Minimum CRI for 85-CRI White is 85. • Minimum CRI for 90-CRI White is 90. Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 2

XLAMP® ML-B LED Relative Spectral Power ML-B OK RELATIVE SPECTRAL POWER DISTRIBUTION 100 %) 80 ( r e w o P 60 nt 5000 K - 8300 K CCT a di 3500 K - 5000 K CCT a e R 40 2600 K - 3500 K CCT v ati el R 20 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Flux Output vs. Junction Temperature RELATIVE FLUX VS. JUNCTION TEMPERATURE (I  = 80 mA) F 100% 90% 80% x u Fl 70% s ou 60% n mi 50% u L e 40% v ti ela 30% R 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 3

XLAMP® ML-B LED Electrical Characteristics (Tj = 25ºC) ML-B Good ELECTRICAL CHARACTERISTICS (T = 25 °C) J 180 160 A) 140 m ( nt 120 e urr 100 C d ar 80 w or F 60 40 20 0 Relative In2t.5e0 nsity2 .v75s. Cur3.r00ent (T3.j2 5= 25º3C.50) 3.75 4.00 Forward Voltage (V) RELATIVE FLUX VS. CURRENT (T = 25 °C) J 200% 180% 160% x u Fl 140% s u o 120% n mi u 100% L ve 80% ti a el 60% R 40% 20% 0% 0 25 50 75 100 125 150 175 Forward Current (mA) Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 4

XLAMP® ML-B LED Typical Spatial Radiation Pattern TYPICAL SPATIAL DISTRIBUTION 100 %) 80 y ( sit n e nt 60 s I u o n mi 40 u L e v ati el 20 R 0 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) THERMAL DESIGN The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be Tdehsiegnremd ian al mDaensneirg thnat minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. 200 180 160 A) 140 m nt ( 120 e urr C 100 m u m 80 xi a M 60 Rj-a = 30°C/W 40 Rj-a = 40°C/W 20 Rj-a = 50°C/W Rj-a = 60°C/W 0 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 5

XLAMP® ML-B LED REFLOW SOLDERING CHARACTERISTICS In testing, Cree has found XLamp ML-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. t T P Critical Zone P T to T L P Ramp-up T ure L Tsmax tS t a r e p Ts m min e T ts Ramp-down Preheat 25 t 25˚C to Peak Time IPC/JEDEC J-STD-020C Profile Feature Lead-Free Solder Average Ramp-Up Rate (Ts to Tp) 1.2 °C/second max Preheat: Temperature Min (Ts ) 120 °C min Preheat: Temperature Max (Ts ) 170 °C max Preheat: Time (ts to ts ) 65-150 seconds min max Time Maintained Above: Temperature (T) 217 °C L Time Maintained Above: Time (t) 45-90 seconds L Peak/Classification Temperature (Tp) 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Note: While the high reflow temperatures (above) have been approved, Cree’s best practice guideline for reflow is to use as low a temperature as possible during the reflow soldering process for these LEDs. Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 6

XLAMP® ML-B LED NOTES Measurements The luminous flux, radiant power, chromaticity, forward voltage and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are provided for informational purposes only and are not intended or provided as specifications. Pre‑Release Qualification Testing Please read the LED Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs. Lumen Maintenance Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document. Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LED junction temperature. Moisture Sensitivity Cree recommends keeping XLamp ML-B LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp ML-B LEDs should be handled and Maximum Percent Relative Humidity Temp. stored as MSL 2a per JEDEC J-STD-033, meaning they have limited 30% 40% 50% 60% 70% 80% 90% exposure time before damage to the LED may occur during the soldering 35 ºC - - - 17 1 .5 .5 operation. The table on the right specifies the maximum exposure time 30 ºC - - - 28 1 1 1 in days depending on temperature and humidity conditions. LEDs with 25 ºC - - - - 2 1 1 20 ºC - - - - 2 1 1 exposure time longer than the specified maximums must be baked according to the baking conditions listed below. Baking Conditions It is not necessary to bake all XLamp ML-B LEDs. Only the LEDs that meet all of the following criteria must be baked: 1. LEDs that have been removed from the original MBP. 2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above. 3. LEDs that have not been soldered. Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 7

XLAMP® ML-B LED NOTES - CONTINUED LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Storage Conditions XLamp ML-B LEDs that have been removed from the original MBP but not soldered should be stored in one of the following ways: • Store the parts in a rigid metal container with a tight-fitting lid. Verify that the storage temperature is <30 °C, and place fresh desiccant and an RH indicator in the container to verify that the RH is no greater than 60%. • Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater than 60%. • For short-term store only: LEDs can be resealed in the original MBP soon after opening. Fresh desiccant may be needed. Use the included humidity indicator card to verify <60% RH. If an environment of <60% RH is not available for storage, XLamp ML-B LEDs should be baked (described above) before reflow soldering. RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Ecology section of the Cree website. REACh Compliance REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available upon request. UL® Recognized Component This product meets the requirements to be considered a UL Recognized Component with Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/UL 8750. Vision Advisory WARNING: Do not look at an exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the LED Eye Safety application note. Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 8

XLAMP® ML-B LED MECHANICAL DIMENSIONS (T  = 25 °C) A MX3535 Pad Layout All measurements are ±.13 mm unless otherwise indicated. Top View Top View Bottom View Side View Recommended FR4 Solder Pad Recommended MCPCB Solder Pad Alternative Solder Pad Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 9

160.0 A B A SECTION A-A SCALE 2 : 1 DETAIL B SCALE 2 : 1 6 5 4 3 2 1 NOTICE REVISONS CCORENET ACIONNEFDI DWEINTTHIIANL A. TRHE ITSH PEL OPRT OAPNRDIE TTHAER IYN AFNODRMATION REV DESCRIPTION BY DATE APP'D CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT A Released J.L. 7/1/09 UMNAAYU NTOHTO BREIZ CEOD PPIEERDS, ROENP RWOITDHUCOEUDT ORT DHIES CWLROISTETDEN T OC OANNSYE NT B ADDED CATHODE AND ANODE NOTES DC 2/26/12 OF CREE INC. 4.0±.1 1.5±.1 XLAMP® ML-B LED 8.0±.1 D 1.75±.10 2.5±.1 D Cathode Side TAPE AND REEL +.3 All Cree carr1ie2r .t0ap.e0s conform to EIA-481D, Automated Component Handling Systems Standard. Except as noted, all dimensions in mm. Cathode Mark (4) (8) Anode Side C (denoted by + and circle) C (Ø1.5) User Feed Direction (1.75) CATHODE SIDE (1.65) END START (12) Loaded Pockets ANODE SIDE Trailer Leader (1,000 Lamps) 160mm (min) of 400mm (min) of B B em pTrtayile rpockets Loaded Pockets Leader empty pockets with sea16le0 mdm w (mitinh) otfape (1,400 pcs /Reel 400 mm (min) of at least 100mm empty pockets empty pockets with (20s epaoledc wkieth ttsap emin.) at least 100 mm sealed by tape (20 pockets min.) sealed by tape (50 empty pockets min.) (50 empty pockets min.) User Feed Direction Cover Tape A MTUIOLNLLLIEMERDSEAISMTN EOECRTNE..SHXXS UXXAEION XRN N LW D E S ±ISA S±ASFER T SSEEPP RI..ENE21 CFC52 II5INFFIIIESEDHD:. CADHPRAPEDRWCOK.N VS BEeYDibel DDDAAA7TTT/EEE1/09 TITLE 4PDF6ahu0xorh 0n(a 9eSm1 i(l99,i c)N1 o39.nC1) 3D32-1r75i3v75-e05538300 A THIRD ANGLE PROJECTION FOR SHEETX M° E T A±L PAR .T5S° ONLY MATERIAL Carrier Loading Specification-MX6 .X ± 1.5 ..XXX°XX X ± ±± ...52755° FINAL PROTECTIVE FINISH SIZE C DRAWING NO2.402-00005 REBV. SURFACE FINPISHo: c1.k6et Tape SCALE 4.000 SHEET OF 1/2 6 5 4 3 2 1 13mm 7" Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 10

XLAMP® ML-B LED PACKAGING Unpackaged Reel Vacuum-Sealed MVaocuisutmu-rSee aBleadrrier Bag Moisture Barrier Bag CLRaEbEe Bli nw Ciotdhe Cree Bin &C oBadreco,d Qe Ltayb, eLlot # Label with Cree Bin Code, Quantity, Reel ID LLaabbeel wl iwthi tChu sCtormeeer Bin CP/oNd, Qet,y ,Q Lotyt ,# , LPoOt # # Packaged Reel Patent Label Dessicant (inside bag) LLaabbeel lw iwthi tChus tComreere O Orderrd er Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Humidity Indicator Card (inside bag) Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 11