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  • 型号: MIC4451YN
  • 制造商: Micrel
  • 库位|库存: xxxx|xxxx
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MIC4451YN产品简介:

ICGOO电子元器件商城为您提供MIC4451YN由Micrel设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 MIC4451YN价格参考。MicrelMIC4451YN封装/规格:PMIC - 栅极驱动器, Low-Side Gate Driver IC Inverting 8-PDIP。您可以下载MIC4451YN参考资料、Datasheet数据手册功能说明书,资料中有MIC4451YN 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)半导体

描述

IC DRIVER MOSF 12A LO SIDE 8DIP门驱动器 12A Hi-Speed, Hi-Current Single MOSFET Driver (Lead Free)

产品分类

PMIC - MOSFET,电桥驱动器 - 外部开关集成电路 - IC

品牌

Micrel

产品手册

点击此处下载产品Datasheet

产品图片

rohs

符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

电源管理 IC,门驱动器,Micrel MIC4451YN-

数据手册

点击此处下载产品Datasheet

产品型号

MIC4451YN

上升时间

25 ns

下降时间

25 ns

产品

MOSFET Gate Drivers

产品目录页面

点击此处下载产品Datasheet

产品种类

门驱动器

供应商器件封装

8-PDIP

其它名称

576-1209

包装

管件

商标

Micrel

安装类型

通孔

安装风格

Through Hole

封装

Tube

封装/外壳

8-DIP(0.300",7.62mm)

封装/箱体

PDIP-8

工作温度

-40°C ~ 85°C

工厂包装数量

50

延迟时间

15ns

最大关闭延迟时间

80 ns

最大功率耗散

960 mW

最大工作温度

+ 85 C

最大开启延迟时间

80 ns

最小工作温度

- 40 C

标准包装

50

电压-电源

4.5 V ~ 18 V

电流-峰值

12A

电源电压-最大

18 V

电源电压-最小

4.5 V

电源电流

450 uA

类型

Low Side

系列

MIC4451

输入类型

反相

输出数

1

输出电压

25 mV

输出电流

12 A

输出端数量

1

配置

Inverting

配置数

1

高压侧电压-最大值(自举)

-

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PDF Datasheet 数据手册内容提取

MIC4451/4452 12A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features MIC4451 and MIC4452 CMOS MOSFET drivers are • BiCMOS/DMOS construction robust, efficient, and easy to use. The MIC4451 is an • Latch-up proof: fully-isolated process is inherently inverting driver, while the MIC4452 is a non-inverting immune to any latch-up driver. • Input will withstand negative swing of up to 5V Both versions are capable of 12A (peak) output and can • Matched rise and fall times: 25ns drive the largest MOSFETs with an improved safe • High peak output current: 12A peak operating margin. The MIC4451/4452 accepts any logic input from 2.4V to V without external speed-up capacitors • Wide operating range: 4.5V to 18V S or resistor networks. Proprietary circuits allow the input to • High capacitive load drive: 62,000Pf swing negative by as much as 5V without damaging the • Low delay time: 30ns (typ.) part. Additional circuits protect against damage from • Logic high input for any voltage from 2.4V to V electrostatic discharge. S • Low supply current 450µA with logic 1 input MIC4451/4452 drivers can replace three or more discrete components, reducing PCB area requirements, simplifying • Low output impedance: 1.0Ω product design, and reducing assembly cost. • Output voltage swing to within 25mV of GND or V S Modern Bipolar/CMOS/DMOS construction guarantees • Low equivalent input capacitance (typ.): 7pF freedom from latch-up. The rail-to-rail swing capability of CMOS/DMOS insures adequate gate voltage to the Applications MOSFET during power up/down sequencing. Since these • Switch mode power supplies devices are fabricated on a self-aligned process, they have very low crossover current, run cool, use little power, and • Motor controls are easy to drive. • Pulse transformer driver Data sheets and support documentation can be found on • Class-D switching amplifiers Micrel’s web site at: www.micrel.com. • Line drivers • Driving MOSFET or IGBT parallel chip modules • Local power ON/OFF switch • Pulse generators ____________________________________________________________________________________________________________ Functional Diagram V S MIC4451 0.3mA INVERTING 0.1mA OUT IN 2kΩ MIC4452 NONINVERTING GND Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-01200 • fax + 1 (408) 474-1000 • http://www.micrel.com October 2011 M9999-103111-B

Micrel Inc. MIC4451/4452 Ordering Information Part Number Temperature Range Package Configuration Standard Pb-Free − MIC4451YN −40°C to +85°C 8-Pin Plastic DIP Inverting MIC4451BM MIC4451YM −40°C to +85°C 8- Pin SOIC Inverting − MIC4451ZT 0°C to +70°C 5- Pin TO-220 Inverting − MIC4452YN −40°C to +85°C 8- Pin Plastic DIP Non-Inverting MIC4452BM MIC4452YM −40°C to +85°C 8- Pin SOIC Non-Inverting − MIC4452ZT 0°C to +70°C 5- Pin TO-220 Non-Inverting − MIC4452VM −40°C to +125°C 8- Pin SOIC Non-Inverting Pin Configurations VS 1 8 VS IN 2 7 OUT NC 3 6 OUT GND 4 5 GND 5 OUT 4 GND 3 VS 2 GND 1 IN Pin Description Pin Number Pin Number Pin Name Pin Function T0-220-5 DIP, SOIC 1 2 IN Control Input. 2, 4 4, 5 GND Ground: Duplicate Pins must be externally connected together. 3, TAB 1, 8 V Supply Input: Duplicate pins must be externally connected together. S 5 6, 7 OUT Output: Duplicate pins must be externally connected together. 3 NC Not Connected. October 2011 2 M9999-103111-B

Micrel Inc. MIC4451/4452 Absolute Maximum Ratings(1, 2) Operating Ratings Operating Temperature (Chip) ..................................150°C Supply Voltage ..............................................................20V Operating Temperature (Ambient) Input Voltage....................................V + 0.3V to GND −5V S Z Version..................................................0°C to +70°C Input Current (V > V ).................................................5mA IN S Y Version.............................................−40°C to + 85°C Power Dissipation, T ≤ 25°C AMBIENT V Version...........................................−40°C to + 125°C PDIP..................................................................960mW Thermal Impedances (To Case) SOIC................................................................1040mW 5-Pin TO-220(θJC) ...........................................10°C/W 5-Pin TO-220............................................................2W Power Dissipation, T ≤ 25°C CASE 5-Pin TO-220.......................................................12.5W Derating Factors (to Ambient) PDIP..............................................................7.7mW/°C SOIC..............................................................8.3mW/°C 5-Pin TO-220..................................................17mW/°C Storage Temperature................................−65°C to +150°C Lead Temperature(10s) ............................................300°C Electrical Characteristics(3) (T = 25oC, with 4.5V ≤ V ≤ 18V unless otherwise specified.) A S Symbol Parameter Condition Min. Typ. Max. Units Input V Logic 1 Input Voltage 2.4 1.3 V IH V Logic 0 Input Voltage 1.1 0.8 V IL VIN Input Voltage Range −5 V S + .3 V IIN Input Current 0 ≤ VIN ≤ VS −10 10 μA Output VOH High Output Voltage See Figure 1 VS −.025 V V Low Output Voltage See Figure 1 0.025 V OL Output Resistance, R I = 10mA, V = 18V 0.6 1.5 Ω O OUT S Output High R Output Resistance, Output Low I = 10mA, V = 18V 0.8 1.5 Ω O OUT S I Peak Output Current V = 18V (See Figure 6) 12 A PK S I Continuous Output Current 2 A DC Latch-up Protection Duty Cycle ≤ 2% IR >1500 mA Withstand Reverse Current t ≤ 300μs Switching Time(3) t Rise Time Test Figure 1, C = 15,000pF 20 40 ns R L t Fall Time Test Figure 1, C = 15,000pF 24 50 ns F L t Delay Time Test Figure 1 25 50 ns D1 t Delay Time Test Figure 1 40 60 ns D2 Power Supply V = 3V 0.4 1.5 mA IN I Power Supply Current S V = 0V 80 150 μA IN V Operating Input Voltage 4.5 V S October 2011 3 M9999-103111-B

Micrel Inc. MIC4451/4452 Electrical Characteristics (Over operating temperature range with 4.5V ≤ V ≤ 18V unless otherwise specified.) S Symbol Parameter Condition Min. Typ. Max. Units Input V Logic 1 Input Voltage 2.4 V IH V Logic 0 Input Voltage 0.8 V IL VIN Input Voltage Range −5 V S + .3 V IIN Input Current 0 ≤ VIN ≤ VS −10 10 μA Output VOH High Output Voltage See Figure 1 VS − .025 V V Low Output Voltage See Figure 1 0.025 V OL R Output Resistance, Output High I = 10mA, V = 18V 2.2 Ω O OUT S Output Resistance, R I = 10mA, V = 18V 2.2 Ω O OUT S Output Low Switching Time (3) t Rise Time Test Figure 1, C = 15,000pF 50 ns R L t Fall Time Test Figure 1, C = 15,000pF 60 ns F L t Delay Time Test Figure 1 65 ns D1 t Delay Time Test Figure 1 80 ns D2 Power Supply V = 3V 3 mA IN I Power Supply Current S V = 0V 0.4 IN V Operating Input Voltage 4.5 18 V S Notes: 1. Functional operation above the absolute maximum stress ratings is not implied. 2. Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to prevent damage from static discharge. 3. Specification for packaged product only. October 2011 4 M9999-103111-B

Micrel Inc. MIC4451/4452 Test Circuits Figure 1. Inverting Driver Switching Time Figure 2. Noninverting Driver Switching Time Figure 3. Peak Output Current Test Circuit October 2011 5 M9999-103111-B

Micrel Inc. MIC4451/4452 Typical Characteristics October 2011 6 M9999-103111-B

Micrel Inc. MIC4451/4452 Typical Characteristics Curves (Continued) October 2011 7 M9999-103111-B

Micrel Inc. MIC4451/4452 Applications Information Supply Bypassing Input Stage Charging and discharging large capacitive loads quickly The input voltage level of the MIC4451 changes the requires large currents. For example, changing a quiescent supply current. The N channel MOSFET input 10,000pF load to 18V in 50ns requires 3.6A. stage transistor drives a 320µA current source load. With a logic “1” input, the maximum quiescent supply current The MIC4451/4452 has double bonding on the supply is 400µA. Logic “0” input level signals reduce quiescent pins, the ground pins and output pins. This reduces current to 80µA typical. parasitic lead inductance. Low inductance enables large currents to be switched rapidly. It also reduces internal The MIC4451/4452 input is designed to provide 200mV ringing that can cause voltage breakdown when the of hysteresis. This provides clean transitions, reduces driver is operated at or near the maximum rated voltage. noise sensitivity, and minimizes output stage current spiking when changing states. Input voltage threshold Internal ringing can also cause output oscillation due to level is approximately 1.5V, making the device TTL feedback. This feedback is added to the input signal compatible over the full temperature and operating since it is referenced to the same ground. supply voltage ranges. Input current is less than ±10µA. To guarantee low supply impedance over a wide The MIC4451 can be directly driven by the TL494, frequency range, a parallel capacitor combination is SG1526/1527, SG1524, TSC170, MIC38C42, and recommended for supply bypassing. Low inductance similar switch mode power supply integrated circuits. By ceramic disk capacitors with short lead lengths (< 0.5 offloading the power-driving duties to the MIC4451/4452, inch) should be used. A 1µF low ESR film capacitor in the power supply controller can operate at lower parallel with two 0.1µF low ESR ceramic capacitors, (such as AVX RAM GUARD®), provides adequate dissipation. This can improve performance and reliability. bypassing. Connect one ceramic capacitor directly The input can be greater than the VS supply, however, between pins 1 and 4. Connect the second ceramic current will flow into the input lead. The input currents capacitor directly between pins 8 and 5. can be as high as 30mA p-p (6.4mARMS) with the input. No damage will occur to MIC4451/4452 however, and it Grounding will not latch. The high current capability of the MIC4451/4452 The input appears as a 7pF capacitance and does not demands careful PC board layout for best performance. change even if the input is driven from an AC source. Since the MIC4451 is an inverting driver, any ground While the device will operate and no damage will occur lead impedance will appear as negative feedback which up to 25V below the negative rail, input current will can degrade switching speed. Feedback is especially increase up to 1mA/V due to the clamping action of the noticeable with slow-rise time inputs. The MIC4451 input input, ESD diode, and 1kΩ resistor. structure includes 200mV of hysteresis to ensure clean transitions and freedom from oscillation, but attention to Power Dissipation layout is still recommended. CMOS circuits usually permit the user to ignore power Figure 4 shows the feedback effect in detail. As the dissipation. Logic families such as 4000 and 74C have MIC4451 input begins to go positive, the output goes outputs which can only supply a few milliamperes of negative and several amperes of current flow in the current, and even shorting outputs to ground will not ground lead. As little as 0.05Ω of PC trace resistance force enough current to destroy the device. The can produce hundreds of millivolts at the MIC4451 MIC4451/4452 on the other hand, can source or sink ground pins. If the driving logic is referenced to power several amperes and drive large capacitive loads at high ground, the effective logic input level is reduced and frequency. The package power dissipation limit can oscillation may result. easily be exceeded. Therefore, some attention should be given to power dissipation when driving low impedance To insure optimum performance, separate ground traces loads and/or operating at high frequency. should be provided for the logic and power connections. Connecting the logic ground directly to the MIC4451 GND pins will ensure full logic drive to the input and ensure fast output switching. Both of the MIC4451 GND pins should, however, still be connected to power ground. October 2011 8 M9999-103111-B

Micrel Inc. MIC4451/4452 +18 Resistive Load Power Dissipation WIMA Dissipation caused by a resistive load can be calculated MKS-2 as: 1µF 5.0V 1 TEK CURRENT 18 V PL = I2 RO D 8 6, 7 PROBE 6302 MIC4451 where: 0 V 5 0 V 0.1µF 4 0.1µF 2,500 pF I = the current drawn by the load POLYCARBONATE R = the output resistance of the driver when the output O LOGIC 12 AMPS GROUND is high, at the power supply voltage used. (See data 300 mV PC TRACE RESISTANCE = 0.05Ω sheet) POWER GROUND D = fraction of time the load is conducting (duty cycle) Capacitive Load Power Dissipation Figure 4. Switching Time Degradation Due to Negative Dissipation caused by a capacitive load is simply the Feedback energy placed in, or removed from, the load capacitance by the driver. The energy stored in a capacitor is The supply current vs. frequency and supply current vs described by the equation: capacitive load characteristic curves aid in determining power dissipation calculations. Table 1 lists the E = 1/2 C V2 maximum safe operating frequency for several power supply voltages when driving a 10,000pF load. More accurate power dissipation figures can be obtained by VS Max. Frequency summing the three dissipation sources. 18V 220kHz Given the power dissipation in the device, and the 15V 300kHz thermal resistance of the package, junction operating 10V 640kHz temperature for any ambient is easy to calculate. For 5V 2MHz example, the thermal resistance of the 8-pin plastic DIP package, from the data sheet, is 130°C/W. In a 25°C ambient, then, using a maximum junction temperature of Table 1: MIC4451 Maximum Operating Frequency 125°C, this package will dissipate 960mW. Accurate power dissipation numbers can be obtained by As this energy is lost in the driver each time the load is summing the three sources of power dissipation in the charged or discharged, for power dissipation calculations device: the 1/2 is removed. This equation also shows that it is • Load Power Dissipation (P ) good practice not to place more voltage on the capacitor L than is necessary, as dissipation increases as the • Quiescent power dissipation (P ) Q square of the voltage applied to the capacitor. For a • Transition power dissipation (PT) driver with a capacitive load: Calculation of load power dissipation differs depending P = f C (V )2 L S on whether the load is capacitive, resistive or inductive. where: f = Operating Frequency C = Load Capacitance V = Driver Supply Voltage S October 2011 9 M9999-103111-B

Micrel Inc. MIC4451/4452 Inductive Load Power Dissipation where (A × s) is a time-current factor derived from the For inductive loads the situation is more complicated. typical characteristic curve “Crossover Energy vs. For the part of the cycle in which the driver is actively Supply Voltage.” Total power (P ) then, as previously forcing current into the inductor, the situation is the same D described is: as it is in the resistive case: P = P + P + P P = I2 R D D L Q T L1 O Definitions However, in this instance the R required may be either C = Load Capacitance in Farads. O L the on resistance of the driver when its output is in the D = Duty Cycle expressed as the fraction of time the high state, or its on resistance when the driver is in the input to the driver is high. low state, depending on how the inductor is connected, f = Operating Frequency of the driver in Hertz and this is still only half the story. For the part of the cycle when the inductor is forcing current through the IH = Power supply current drawn by a driver when both driver, dissipation is best described as: inputs are high and neither output is loaded. IL = Power supply current drawn by a driver when both inputs are low and neither output is loaded. P = I V (1 – D) L2 D I = Output current from a driver in Amps. D P = Total power dissipated in a driver in Watts. where V is the forward drop of the clamp diode in the D D driver (generally around 0.7V). The two parts of the load PL = Power dissipated in the driver due to the driver’s dissipation must be summed in to produce P : load in Watts. L PQ = Power dissipated in a quiescent driver in Watts. PL = PL1 + PL2 PT = Power dissipated in a driver when the output changes states (“shoot-through current”) in watts. Quiescent Power Dissipation R = Output resistance of a driver in Ωs. O Quiescent power dissipation (P , as described in the Q V = Power supply voltage to the IC in volts. input section) depends on whether the input is high or S low. A low input will result in a maximum current drain (per driver) of ≤ 0.2mA; a logic high will result in a current drain of ≤ 3.0mA. Quiescent power can therefore be found from: P = V [D I + (1 – D) I ] Q S H L where: I = quiescent current with input high H I = quiescent current with input low L D = fraction of time input is high (duty cycle) V = power supply voltage S Transition Power Dissipation Transition power is dissipated in the driver each time its output changes state, because during the transition, for a very brief interval, both the N- and P-channel MOSFETs in the output totem-pole are ON simultaneously, and a current is conducted through them from V to ground. The transition power dissipation is S approximately: P = 2 f V (A × s) T S October 2011 10 M9999-103111-B

Micrel Inc. MIC4451/4452 Package Information PIN 1 DIMENSIONS: INCH (MM) 0.380 (9.65) 0.255 (6.48) 0.370 (9.40) 0.135 (3.43) 0.245 (6.22) 0.125 (3.18) 0.300 (7.62) 0.013 (0.330 0.010 (0.254 0.018 (0.57) 0.130 (3.30) 0.380 (9.65) 0.320 (8.13) 0.100 (2.54) 0.0375 (0.952) 8-Pin Plastic DIP (N) 0.026 (0.65) MAX) PIN 1 0.157 (3.99) DIMENSIONS: 0.150 (3.81) INCHES (MM) 0.020 (0.51) 0.013 (0.33) 0.050 (1.27) TYP 0.0098 (0.249) 45° 0.010 (0.25) 0.0040 (0.102) 0.007 (0.18) 0.197 (5.0) 0°–8° 0.050 (1.27) 0.064 (1.63) 0.189 (4.8) SEATING 0.016 (0.40) 0.045 (1.14) PLANE 0.244 (6.20) 0.228 (5.79) 8-Pin SOIC (M) October 2011 11 M9999-103111-B

Micrel Inc. MIC4451/4452 Package Information (Continued) 5-Pin TO-220 (T) October 2011 12 M9999-103111-B

Micrel Inc. MIC4451/4452 MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 1998 Micrel, Incorporated. October 2011 13 M9999-103111-B

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrochip: MIC4451YM MIC4452ZT MIC4452YM MIC4451YN MIC4451ZT MIC4452YN MIC4451YM-TR MIC4452YM-TR MIC4452VM-TR MIC4452VM