MIC4421/4422 Micrel, Inc. MIC4421/4422 9A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features • BiCMOS/DMOS Construction MIC4421 and MIC4422 MOSFET drivers are rugged, ef- • Latch-Up Proof: Fully Isolated Process is Inherently ficient, and easy to use. The MIC4421 is an inverting driver, Immune to Any Latch-up. while the MIC4422 is a non-inverting driver. • Input Will Withstand Negative Swing of Up to 5V Both versions are capable of 9A (peak) output and can drive • Matched Rise and Fall Times ...............................25ns the largest MOSFETs with an improved safe operating mar- • High Peak Output Current ...............................9A Peak gin. The MIC4421/4422 accepts any logic input from 2.4V to • Wide Operating Range ..............................4.5V to 18V V without external speed-up capacitors or resistor networks. • High Capacitive Load Drive ...........................47,000pF S Proprietary circuits allow the input to swing negative by as • Low Delay Time .............................................30ns Typ. much as 5V without damaging the part. Additional circuits • Logic High Input for Any Voltage from 2.4V to V S protect against damage from electrostatic discharge. • Low Equivalent Input Capacitance (typ) .................7pF • Low Supply Current ..............450µA With Logic 1 Input MIC4421/4422 drivers can replace three or more discrete • Low Output Impedance .........................................1.5Ω components, reducing PCB area requirements, simplifying • Output Voltage Swing to Within 25mV of GND or V product design, and reducing assembly cost. S Modern Bipolar/CMOS/DMOS construction guarantees Applications freedom from latch-up. The rail-to-rail swing capability of • Switch Mode Power Supplies CMOS/DMOS insures adequate gate voltage to the MOS- • Motor Controls FET during power up/down sequencing. Since these devices • Pulse Transformer Driver are fabricated on a self-aligned process, they have very low • Class-D Switching Amplifiers crossover current, run cool, use little power, and are easy • Line Drivers to drive. • Driving MOSFET or IGBT Parallel Chip Modules • Local Power ON/OFF Switch • Pulse Generators Functional Diagram V S MIC4421 0.3mA INVERTING 0.1mA OUT IN 2kΩ MIC4422 NONINVERTING GND Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com August 2005 1 M9999-081005

MIC4421/4422 Micrel, Inc. Ordering Information Part Number Standard PbFree Configuration Temp. Range Package MIC4421BM MIC4421YM Inverting –40ºC to +85ºC 8-pin SOIC MIC4421BN MIC4421YN Inverting –40ºC to +85ºC 8-pin DIP MIC4421CM MIC4421ZM Inverting –0ºC to +70ºC 8-pin SOIC MIC4421CN MIC4421ZN Inverting –0ºC to +70ºC 8-pin DIP MIC4421CT MIC4421ZT Inverting –0ºC to +70ºC 5-pin TO-220 MIC4422BM MIC4422YM Non-inverting –40ºC to +85ºC 8-pin SOIC MIC4422BN MIC4422YN Non-inverting –40ºC to +85ºC 8-pin DIP MIC4422CM MIC4422ZM Non-inverting –0ºC to +70ºC 8-pin SOIC MIC4422CN MIC4422ZN Non-inverting –0ºC to +70ºC 8-pin DIP MIC4422CT MIC4422ZT Non-inverting –0ºC to +70ºC 5-pin TO-220 Pin Configurations VS 1 8 VS IN 2 7 OUT NC 3 6 OUT GND 4 5 GND Plastic DIP (N) SOIC (M) 5 OUT 4 GND 3 VS 2 GND 1 IN TO-220-5 (T) Pin Description Pin Number Pin Number Pin Name Pin Function TO-220-5 DIP, SOIC 1 2 IN Control Input 2, 4 4, 5 GND Ground: Duplicate pins must be externally connected together. 3, TAB 1, 8 V Supply Input: Duplicate pins must be externally connected together. S 5 6, 7 OUT Output: Duplicate pins must be externally connected together. 3 NC Not connected. M9999-081005 2 August 2005

MIC4421/4422 Micrel, Inc. Absolute Maximum Ratings (Notes 1, 2 and 3) Operating Ratings Supply Voltage ..............................................................20V Junction Temperature ................................................150°C Input Voltage ...................................V + 0.3V to GND – 5V Ambient Temperature S Input Current (V > V ) ..............................................50 mA C Version ....................................................0°C to +70°C IN S Power Dissipation, T ≤ 25°C B Version ................................................–40°C to +85°C A PDIP ....................................................................960mW Thermal Resistance SOIC ..................................................................1040mW 5-Pin TO-220 (θ ) ...............................................10°C/W JC 5-Pin TO-220 ..............................................................2W Power Dissipation, T ≤ 25°C CASE 5-Pin TO-220 .........................................................12.5W Derating Factors (to Ambient) PDIP ................................................................7.7mW/°C SOIC ................................................................8.3mW/°C 5-Pin TO-220 ....................................................17mW/°C Storage Temperature ................................–65°C to +150°C Lead Temperature (10 sec) .......................................300°C Electrical Characteristics: (T = 25°C with 4.5 V ≤ V ≤ 18 V unless otherwise specified.) A S Symbol Parameter Conditions Min Typ Max Units INPUT V Logic 1 Input Voltage 2.4 1.3 V IH V Logic 0 Input Voltage 1.1 0.8 V IL V Input Voltage Range –5 V +0.3 V IN S I Input Current 0 V ≤ V ≤ V –10 10 µA IN IN S OUTPUT V High Output Voltage See Figure 1 V –.025 V OH S V Low Output Voltage See Figure 1 0.025 V OL R Output Resistance, I = 10 mA, V = 18 V 0.6 Ω O OUT S Output High R Output Resistance, I = 10 mA, V = 18 V 0.8 1.7 Ω O OUT S Output Low I Peak Output Current V = 18 V (See Figure 6) 9 A PK S I Continuous Output Current 2 A DC I Latch-Up Protection Duty Cycle ≤ 2% >1500 mA R Withstand Reverse Current t ≤ 300 µs SWITCHING TIME (Note 3) t Rise Time Test Figure 1, C = 10,000 pF 20 75 ns R L t Fall Time Test Figure 1, C = 10,000 pF 24 75 ns F L t Delay Time Test Figure 1 15 60 ns D1 t Delay Time Test Figure 1 35 60 ns D2 POWER SUPPLY I Power Supply Current V = 3 V 0.4 1.5 mA S IN V = 0 V 80 150 µA IN V Operating Input Voltage 4.5 18 V S August 2005 3 M9999-081005

MIC4421/4422 Micrel, Inc. Electrical Characteristics: (Over operating temperature range with 4.5V ≤ V ≤ 18V unless otherwise specified.) S Symbol Parameter Conditions Min Typ Max Units INPUT V Logic 1 Input Voltage 2.4 1.4 V IH V Logic 0 Input Voltage 1.0 0.8 V IL V Input Voltage Range –5 V +0.3 V IN S I Input Current 0V ≤ V ≤ V –10 10 µA IN IN S OUTPUT V High Output Voltage Figure 1 V –.025 V OH S V Low Output Voltage Figure 1 0.025 V OL R Output Resistance, I = 10mA, V = 18V 0.8 3.6 Ω O OUT S Output High R Output Resistance, I = 10mA, V = 18V 1.3 2.7 Ω O OUT S Output Low SWITCHING TIME (Note 3) t Rise Time Figure 1, C = 10,000pF 23 120 ns R L t Fall Time Figure 1, C = 10,000pF 30 120 ns F L t Delay Time Figure 1 20 80 ns D1 t Delay Time Figure 1 40 80 ns D2 POWER SUPPLY I Power Supply Current V = 3V 0.6 3 mA S IN V = 0V 0.1 0.2 IN V Operating Input Voltage 4.5 18 V S Note 1: Functional operation above the absolute maximum stress ratings is not implied. Note 2: Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to prevent damage from static discharge. Note 3: Switching times guaranteed by design. Test Circuits V = 18V V = 18V S S 0.1µF 0.1µF 4.7µF 0.1µF 0.1µF 4.7µF IN OUT IN OUT 15000pF 15000pF MIC4421 MIC4422 5V 5V 2.5V 2.5V 90% 90% INPUT t ≥ 0.5µs INPUT t ≥ 0.5µs 10% PW 10% PW 0V 0V t t PW PW tD1 tF tD2 tR tD1 tR tD2 tF V V S S 90% 90% OUTPUT OUTPUT 10% 10% 0V 0V Figure 1. Inverting Driver Switching Time Figure 2. Noninverting Driver Switching Time M9999-081005 4 August 2005

MIC4421/4422 Micrel, Inc. Typical Characteristics Rise Time Fall Time Rise and Fall Times vs. Supply Voltage vs. Supply Voltage vs. Temperature 220 220 60 200 200 CL = 10,000pF 180 180 50 VS = 18V RISE TIME (ns)1111642086000000 2427,,000000ppFF FALL TIME (ns)1111642086000000 4272,,000000ppFF TIME (ns) 432000 tFAtRLILSE 40 10,000pF 40 10,000pF 10 20 20 04 6 8 10 12 14 16 18 04 6 8 10 12 14 16 18 0 -40 0 40 80 120 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) TEMPERATURE (°C) Rise Time Crossover Energy Fall Time vs. Capacitive Load vs. Capacitive Load vs. Supply Voltage 300 300 10-7 s) PER TRANSITION 250 5V 250 Y (A• E (ns)200 E (ns)200 5V NERG TIM150 TIM150 R E10-8 RISE 100 10V FALL 100 10V SOVE 18V S 50 18V 50 RO C 0100 1000 10k 100k 0100 1000 10k 100k 10-94 6 8 10 12 14 16 18 CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF) VOLTAGE (V) Supply Current Supply Current Supply Current vs. Capacitive Load vs. Capacitive Load vs. Capacitive Load 220 150 75 200 VS = 18V VS = 12V VS = 5V mA)180 mA)120 mA) 60 T (160 T ( T ( N140 N N E E 90 E 45 URR112000 1 M Hz URR URR UPPLY C 684000 200kHz 50kHz UPPLY C 3600 1 M Hz 200kHz 50kHz UPPLY C 1350 1 M Hz 200kHz 50kHz S S S 20 0 0 0 100 1000 10k 100k 100 1000 10k 100k 100 1000 10k 100k CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF) CAPACITIVE LOAD (pF) Supply Current Supply Current Supply Current vs. Frequency vs. Frequency vs. Frequency 180 120 60 VS = 18V VS = 12V VS = 5V A)160 A)100 A) 50 µF LY CURRENT (m1110246800000 0.1µF 0.01µF 1000pF LY CURRENT (m 468000 0.1µF 0.01µF 1000pF LY CURRENT (m 342000 0.1µF 0.01 000pF P P P 1 UP 40 UP UP S S 20 S 10 20 0 0 0 10k 100k 1M 10M 10k 100k 1M 10M 10k 100k 1M 10M FREQUENCY (Hz) FREQUENCY (Hz) FREQUENCY (Hz) August 2005 5 M9999-081005

MIC4421/4422 Micrel, Inc. Typical Characteristics Propagation Delay Propagation Delay Propagation Delay vs. Supply Voltage vs. Input Amplitude vs. Temperature 50 120 50 110 VS = 10V 100 40 40 90 E (ns) 30 tD2 E (ns) 768000 E (ns) 30 tD2 TIM 20 TIM 50 TIM 20 40 tD1 30 tD2 tD1 10 20 10 10 0 0 tD1 0 4 6 8 10 12 14 16 18 0 2 4 6 8 10 -40 0 40 80 120 SUPPLY VOLTAGE (V) INPUT (V) TEMPERATURE (°C) Quiescent Supply Current High-State Output Resist. Low-State Output Resist. T (µA)1000 VvS s= .1 8TVemperature CE (Ω)22..42 vs. Supply Voltage CE (Ω) 22..42 vs. Supply Voltage N N N E A2.0 A 2.0 PLY CURR100 INPUT =1 UT RESIST1111....4268 TJ = 150°C UT RESIST 1111....4268 TJ = 150°C SUP INPUT =0 UTP1.0 UTP 1.0 TJ = 25°C T O0.8 O 0.8 N E 0.6 E 0.6 CE AT0.4 TJ = 25°C AT 0.4 S T T E S0.2 S 0.2 QUI 10 -40 0 40 80 120 HIGH- 04 6 8 10 12 14 16 18 LOW- 04 6 8 10 12 14 16 18 TEMPERATURE (°C) SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) M9999-081005 6 August 2005

MIC4421/4422 Micrel, Inc. Applications Information To guarantee low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for Supply Bypassing supply bypassing. Low inductance ceramic disk capacitors with short lead lengths (< 0.5 inch) should be used. A 1µF low Charging and discharging large capacitive loads quickly ESR film capacitor in parallel with two 0.1µF low ESR ceramic requires large currents. For example, charging a 10,000pF capacitors, (such as AVX RAM Guard®), provides adequate load to 18V in 50ns requires 3.6A. bypassing. Connect one ceramic capacitor directly between pins 1 and 4. Connect the second ceramic capacitor directly The MIC4421/4422 has double bonding on the supply pins, between pins 8 and 5. the ground pins and output pins. This reduces parasitic lead inductance. Low inductance enables large currents to Grounding be switched rapidly. It also reduces internal ringing that can cause voltage breakdown when the driver is operated at or The high current capability of the MIC4421/4422 demands near the maximum rated voltage. careful PC board layout for best performance. Since the MIC4421 is an inverting driver, any ground lead impedance Internal ringing can also cause output oscillation due to will appear as negative feedback which can degrade switching feedback. This feedback is added to the input signal since it speed. Feedback is especially noticeable with slow-rise time is referenced to the same ground. inputs. The MIC4421 input structure includes about 200mV of hysteresis to ensure clean transitions and freedom from oscillation, but attention to layout is still recommended. VS Figure 5 shows the feedback effect in detail. As the MIC4421 1µF input begins to go positive, the output goes negative and several amperes of current flow in the ground lead. As little MIC4451 VS as 0.05Ω of PC trace resistance can produce hundreds of millivolts at the MIC4421 ground pins. If the driving logic is Ø2 referenced to power ground, the effective logic input level is Ø1DRIVE SIGNAL reduced and oscillation may result. CCOONNDTURCOTLIO0N° T AON 1G8L0E° LDORGIVICE Ø1 M Ø3 To insure optimum performance, separate ground traces CCOONTNRDOULC T18IO0°N T AON 3G6L0E° VS should be provided for the logic and power connections. Con- 1µF VS necting the logic ground directly to the MIC4421 GND pins will ensure full logic drive to the input and ensure fast output MIC4452 switching. Both of the MIC4421 GND pins should, however, still be connected to power ground. PHASE 1 of 3 PHASE MOTOR DRIVER USING MIC4420/4429 Figure 3. Direct Motor Drive +15 (x2) 1N4448 5.6kΩ OUTPUT VOLTAGE vs LOAD CURRENT 560Ω 30 0.1µF 29 50V S28 + T 1µF OL 12Ω LINE 50V BYV 10 (x 2) V27 1 MKS2 8 26 2 6,7 + MIC4421 0.1µF 25 WIMA 5 560µF 50V + 0 50 100 150 200 250 300 350 MKS2 4 100µF 50V mA UNITED CHEMCON SXE Figure 4. Self Contained Voltage Doubler August 2005 7 M9999-081005

MIC4421/4422 Micrel, Inc. Input Stage dissipation limit can easily be exceeded. Therefore, some attention should be given to power dissipation when driving The input voltage level of the MIC4421 changes the quies- low impedance loads and/or operating at high frequency. cent supply current. The N channel MOSFET input stage transistor drives a 320µA current source load. With a logic The supply current vs. frequency and supply current vs “1” input, the maximum quiescent supply current is 400µA. capacitive load characteristic curves aid in determining Logic “0” input level signals reduce quiescent current to power dissipation calculations. Table 1 lists the maximum 80µA typical. safe operating frequency for several power supply volt- ages when driving a 10,000pF load. More accurate power The MIC4421/4422 input is designed to provide 300mV of dissipation figures can be obtained by summing the three hysteresis. This provides clean transitions, reduces noise dissipation sources. sensitivity, and minimizes output stage current spiking when changing states. Input voltage threshold level is ap- Given the power dissipation in the device, and the thermal proximately 1.5V, making the device TTL compatible over resistance of the package, junction operating temperature the full temperature and operating supply voltage ranges. for any ambient is easy to calculate. For example, the Input current is less than ±10µA. thermal resistance of the 8-pin plastic DIP package, from the data sheet, is 130°C/W. In a 25°C ambient, then, using The MIC4421 can be directly driven by the TL494, a maximum junction temperature of 150°C, this package SG1526/1527, SG1524, TSC170, MIC38C42, and similar will dissipate 960mW. switch mode power supply integrated circuits. By offloading the power-driving duties to the MIC4421/4422, the power Accurate power dissipation numbers can be obtained by supply controller can operate at lower dissipation. This can summing the three sources of power dissipation in the improve performance and reliability. device: The input can be greater than the V supply, however, cur- • Load Power Dissipation (P ) S rent will flow into the input lead. The input currents can be L • Quiescent power dissipation (P ) as high as 30mA p-p (6.4mA ) with the input. No damage Q RMS • Transition power dissipation (P ) will occur to MIC4421/4422 however, and it will not latch. T Calculation of load power dissipation differs depending on The input appears as a 7pF capacitance and does not whether the load is capacitive, resistive or inductive. change even if the input is driven from an AC source. While the device will operate and no damage will occur up Resistive Load Power Dissipation to 25V below the negative rail, input current will increase Dissipation caused by a resistive load can be calculated up to 1mA/V due to the clamping action of the input, ESD as: diode, and 1kΩ resistor. P = I2 R D Power Dissipation L O CMOS circuits usually permit the user to ignore power where: dissipation. Logic families such as 4000 and 74C have out- I = the current drawn by the load puts which can only supply a few milliamperes of current, R = the output resistance of the driver when the output and even shorting outputs to ground will not force enough O is high, at the power supply voltage used. (See data current to destroy the device. The MIC4421/4422 on the sheet) other hand, can source or sink several amperes and drive D = fraction of time the load is conducting (duty cycle) large capacitive loads at high frequency. The package power +18 WIMA MKS-2 1 µF 5.0V 1 TEK CURRENT 18 V 8 PROBE 6302 6, 7 Table 1: MIC4421 Maximum MIC4421 Operating Frequency 0 V 5 0 V 0.1µF 4 0.1µF 2,500 pF VS Max Frequency POLYCARBONATE 18V 220kHz LOGIC 6 AMPS GROUND 15V 300kHz 300 mV PC TRACE RESISTANCE = 0.05Ω 10V 640kHz POWER GROUND 5V 2MHz Conditions: 1. θ = 150°C/W JA 2. T = 25°C A Figure 5. Switching Time Degradation Due to 3. C = 10,000pF L Negative Feedback M9999-081005 8 August 2005

MIC4421/4422 Micrel, Inc. Capacitive Load Power Dissipation Transition Power Dissipation Dissipation caused by a capacitive load is simply the energy Transition power is dissipated in the driver each time its placed in, or removed from, the load capacitance by the output changes state, because during the transition, for a driver. The energy stored in a capacitor is described by the very brief interval, both the N- and P-channel MOSFETs in equation: the output totem-pole are ON simultaneously, and a current is conducted through them from V to ground. The transition E = 1/2 C V2 S power dissipation is approximately: As this energy is lost in the driver each time the load is charged P = 2 f V (A•s) or discharged, for power dissipation calculations the 1/2 is T S removed. This equation also shows that it is good practice where (A•s) is a time-current factor derived from the typical not to place more voltage in the capacitor than is necessary, characteristic curve “Crossover Energy vs. Supply Volt- as dissipation increases as the square of the voltage applied age.” to the capacitor. For a driver with a capacitive load: Total power (P ) then, as previously described is just D P = f C (V )2 L S P = P + P + P D L Q T where: Definitions f = O perating Frequency C = Load Capacitance in Farads. C = Load Capacitance L V = Driver Supply Voltage S D = Duty Cycle expressed as the fraction of time the input to the driver is high. Inductive Load Power Dissipation f = Operating Frequency of the driver in Hertz For inductive loads the situation is more complicated. For the part of the cycle in which the driver is actively forcing I = Power supply current drawn by a driver when both current into the inductor, the situation is the same as it is in H inputs are high and neither output is loaded. the resistive case: I = Power supply current drawn by a driver when both P = I2 R D L L1 O inputs are low and neither output is loaded. However, in this instance the R required may be either O I = Output current from a driver in Amps. the on resistance of the driver when its output is in the high D state, or its on resistance when the driver is in the low state, P = Total power dissipated in a driver in Watts. D depending on how the inductor is connected, and this is still P = Power dissipated in the driver due to the driver’s only half the story. For the part of the cycle when the induc- L load in Watts. tor is forcing current through the driver, dissipation is best described as P = Power dissipated in a quiescent driver in Watts. Q P = I V (1 – D) P = Power dissipated in a driver when the output L2 D T changes states (“shoot-through current”) in Watts. where V is the forward drop of the clamp diode in the driver D NOTE: The “shoot-through” current from a dual (generally around 0.7V). The two parts of the load dissipation transition (once up, once down) for both drivers is must be summed in to produce P L stated in Figure 7 in ampere-nanoseconds. This P = P + P figure must be multiplied by the number of repeti- L L1 L2 tions per second (frequency) to find Watts. Quiescent Power Dissipation R = Output resistance of a driver in Ohms. Quiescent power dissipation (P , as described in the input O Q section) depends on whether the input is high or low. A low V = Power supply voltage to the IC in Volts. S input will result in a maximum current drain (per driver) of ≤ 0.2mA; a logic high will result in a current drain of ≤ 3.0mA. Quiescent power can therefore be found from: P = V [D I + (1 – D) I ] Q S H L where: I = quiescent current with input high H I = quiescent current with input low L D = fraction of time input is high (duty cycle) V = power supply voltage S August 2005 9 M9999-081005

MIC4421/4422 Micrel, Inc. +18V WIMA MK22 1 µF 5.0V 1 TEK CURRENT 18 V 8 PROBE 6302 2 6, 7 MIC4421 0 V 5 0 V 0.1µF 4 0.1µF 10,000 pF POLYCARBONATE Figure 6. Peak Output Current Test Circuit M9999-081005 10 August 2005

MIC4421/4422 Micrel, Inc. Package Information PIN 1 INCH (MM) 0.370 (9.40) 0.245 (6.22) 0.125 (3.18) 0.300 (7.62) 0.013 (0.330) 0.010 (0.254) 0.018 (0.57) 0.130 (3.30) 0.100 (2.54) 0.0375 (0.952) 8-Pin Plastic DIP (N) MAX) PIN 1 0.150 (3.81) INCHES (MM) 0.013 (0.33) TYP 45° 0.010 (0.25) 0.0040 (0.102) 0.007 (0.18) 0°–8° 0.189 (4.8) 0.016 (0.40) 0.045 (1.14) PLANE 0.228 (5.79) 8-Pin SOIC (M) August 2005 11 M9999-081005

MIC4421/4422 Micrel, Inc. 0.112 (2.84) 0.187 (4.74) INCH (MM) 0.116 (2.95) 0.032 (0.81) 0.038 (0.97) 0.007 (0.18) 0.012 (0.30) R 0.005 (0.13) 0.012 (0.03) 5° 0.012 (0.03) R 0.004 (0.10) 0° MIN 0.0256 (0.65) TYP 0.035 (0.89) 0.021 (0.53) 8-Pin MSOP (MM) 0.150 D ±0.005 0.177 ±0.008 (3.81 D ±0.13) (4.50 ±0.20) 0.400 ±0.015 0.050 ±0.005 (10.16 ±0.38) (1.27 ±0.13) 0.108 ±0.005 (2.74 ±0.13) 0.241 ±0.017 (6.12 ±0.43) 0.578 ±0.018 (14.68 ±0.46) SEATING PLANE 7° Typ. 0.550 ±0.010 (13.97 ±0.25) 0.067 ±0.005 (1.70 ±0.127) 0.032 ±0.005 (0.81 ±0.13) 0.018 ±0.008 0.103 ±0.013 0.268 REF (0.46 ±0.20) (2.62±0.33) (6.81 REF) inch Dimensions: (mm) 5-Lead TO-220 (T) MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2004 Micrel, Inc. M9999-081005 12 August 2005

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrel: MIC4422ZM TR M icrochip: MIC4422YM MIC4422ZT MIC4422ZM MIC4422ZN MIC4421ZM MIC4421ZT MIC4421ZN MIC4421YN MIC4422YN MIC4421YM MIC4421ZM-TR MIC4421YM-TR MIC4422ZM-TR