MIC4120/4129 Micrel, Inc. MIC4120/4129 6A-Peak Low-Side MoSfet Driver Bipolar/CMoS/DMoS Process General Description features • CMOS Construction MIC4120 and MIC4129 MOSFET drivers are resilient, • Latch-Up Protected: Will Withstand >200mA efficient, and easy to use. The MIC4129 is an inverting Reverse Output Current driver, while the MIC4120 is a non-inverting driver. The • Logic Input Withstands Negative Swing of Up to 5V MIC4120 and MIC4129 are improved versions of the • Matched Rise and Fall Times ................................25ns MIC4420 and MIC4429. • High Peak Output Current ...............................6A Peak The drivers are capable of 6A (peak) output and can drive • Wide Operating Range ...............................4.5V to 20V the largest MOSFETs with an improved safe operating • High Capacitive Load Drive ............................10,000pF margin. The MIC4120/4129 accept any logic input from • Low Delay Time ..............................................55ns Typ 2.4V to V without external speed-up capacitors or resis- • Logic High Input for Any Voltage From 2.4V to V S S tor networks. Proprietary circuits allow the input to swing • Low Equivalent Input Capacitance (typ) ..................6pF negative by as much as 5V without damaging the part. Ad- • Low Supply Current ...............450µA With Logic 1 Input ditional circuits protect against damage from electrostatic • Low Output Impedance .........................................2.5Ω discharge. • Output Voltage Swing Within 25mV of Ground or V S • Exposed backside pad packaging reduces heat MIC4120/4129 drivers can replace three or more discrete - ePAD SOIC-8L (θ = 58°C/W) components, reducing PCB area requirements, simplifying JA - 3mm x 3mm MLF™-8L (θ = 60°C/W) product design, and reducing assembly cost. JA Modern BiCMOS/DMOS construction guarantees freedom Applications from latch-up. The rail-to-rail swing capability insures ad- • Switch Mode Power Supplies equate gate voltage to the MOSFET during power up/down • Motor Controls sequencing. • Pulse Transformer Driver • Class-D Switching Amplifiers functional Diagram V S MIC4129 0.4mA INVERTING 0.1mA OUT IN 2kΩ MIC4120 NONINVERTING GND . MLF is a registered trademark of Amkor Technology, Inc Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com July 2010 1 M9999-072010

MIC4120/4129 Micrel, Inc. Ordering Information Part Number Package Configuration Lead Finish MIC4120YME EPAD 8-Pin SOIC Non-Inverting Pb-Free MIC4120YML 8-Pin MLF Non-Inverting Pb-Free MIC4129YME EPAD 8-Pin SOIC Inverting Pb-Free MIC4129YML 8-Pin MLF Inverting Pb-Free Pin Configurations VS 1 8 VS IN 2 7 OUT NC 3 6 OUT GND 4 5 GND EPAD SOIC-8 (ME) MLF-8 (ML) Pin Description Pin Number Pin Name Pin Function 2 IN Control Input 4, 5 GND Ground: Duplicate pins must be externally connected together 1, 8 VS Supply Input: Duplicate pins must be externally connected together 6, 7 OUT Output: Duplicate pins must be externally connected together 3 NC Not connected EP GND Ground: Backside M9999-072010 2 July 2010

MIC4120/4129 Micrel, Inc. Absolute Maximum Ratings (Notes 1, 2 and 3) operating Ratings Supply Voltage ...........................................................24V Supply Voltage ..............................................4.5V to 20V Input Voltage ...............................V + 0.3V to GND – 5V Junction Temperature ............................–40°C to +125°C S Input Current (V > V ) ..........................................50mA Package Thermal Resistance IN S Storage Temperature .............................–65°C to +150°C 3x3 MLF™ (q ) ...............................................60°C/W JA Lead Temperature (10 sec.) ...................................300°C EPAD SOIC-8 (q ) ..........................................58°C/W JA ESD Rating, note 4 Electrical Characteristics: (T = 25°C with 4.5V ≤ V ≤ 20V unless otherwise specified. Note 3.) Input Voltage slew rate A S >1V/µs Symbol Parameter Conditions Min Typ Max Units INPUT V Logic 1 Input Voltage 2.4 1.9 V IH V Logic 0 Input Voltage 1.5 0.8 V IL V Input Voltage Range –5 V + 0.3 V IN S I Input Current 0 V ≤ V ≤ V –10 10 µA IN IN S OUTPUT V High Output Voltage See Figure 1 V –0.025 V OH S V Low Output Voltage See Figure 1 0.025 V OL R Output Resistance, I = 10 mA, V = 20 V 1.4 5 Ω O OUT S Output Low R Output Resistance, I = 10 mA, V = 20 V 1.5 5 Ω O OUT S Output High I Peak Output Current V = 20 V (See Figure 6) 6 A PK S I Latch-Up Protection 200 mA R Withstand Reverse Current SwItChInG tIMe t Rise Time Test Figure 1, C = 2200 pF 12 30 ns R L 35 ns t Fall Time Test Figure 1, C = 2200 pF 13 30 ns F L 35 ns t Delay Time Test Figure 1 45 75 ns D1 100 ns t Delay Time Test Figure 1 50 75 ns D2 100 ns POWER SUPPLY I Power Supply Current V = 3 V 0.45 3 mA S IN V = 0 V 60 400 µA IN V Operating Input Voltage 4.5 20 V S Notes: 1. Functional operation above the absolute maximum stress ratings is not implied. 2. Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to prevent damage from static discharge. 3. Specification for packaged product only. 4. Devices are ESD sensitive. Handling precautions recommended. Human body model: 1.5kΩ in series with 100pF. July 2010 3 M9999-072010

MIC4120/4129 Micrel, Inc. test Circuits VS = 20V VS = 20V 0.1µF 0.1µF 1.0µF 0.1µF 0.1µF 1.0µF IN OUT IN OUT 2200pF 2200pF MIC4129 MIC4120 5V 5V 2.5V 2.5V 90% 90% INPUT INPUT 10% 10% 0V 0V tPW tPW VS tD1 tF tD2 tR VS tD1 tR tD2 tF 90% 90% OUTPUT OUTPUT 10% 10% 0V 0V Figure 1. Inverting Driver Switching Time Figure 2. Non-inverting Driver Switching Time M9999-072010 4 July 2010

MIC4120/4129 Micrel, Inc. Typical Characteristics Delay Time Rise Time Fall Time vs. InputVoltage 60 60 60 10000pF 50 50 50 10000pF td2 RISE TIME (ns)234000 42720000ppFF FALL TIME (ns)234000 4700pF DELAY TIME (ns)234000 td1 2200pF 10 10 10 0 0 0 5 10 15 20 5 10 15 20 5 10 15 20 INPUT VOLTAGE (V) INPUT VOLTAGE (V) INPUT VOLTAGE (V) OutputResistance vs. Supply Voltage 3.0 2.5 Output High 2.0 Ω) E ( NC1.5 OutputLow A T SIS1.0 E R 0.5 0 5 10 15 20 SUPPLY VOLTAGE (V) July 2010 5 M9999-072010

MIC4120/4129 Micrel, Inc. Applications Information Grounding The high current capability of the MIC4120/4129 demands Supply Bypassing careful PC board layout for best performance. Since the Charging and discharging large capacitive loads quickly MIC4129 is an inverting driver, any ground lead impedance requires large currents. For example, charging a 2500pF will appear as negative feedback which can degrade switch- load to 18V in 25ns requires a 1.8 A current from the device ing speed. Feedback is especially noticeable with slow-rise power supply. time inputs. The MIC4120/4129 has double bonding on the supply pins, Figure 3 shows the feedback effect in detail. As the MIC4129 the ground pins and output pins This reduces parasitic lead input begins to go positive, the output goes negative and inductance. Low inductance enables large currents to be several amperes of current flow in the ground lead. As little switched rapidly. It also reduces internal ringing that can as 0.05Ω of PC trace resistance can produce hundreds of cause voltage breakdown when the driver is operated at or millivolts at the MIC4129 ground pins. If the driving logic is near the maximum rated voltage. referenced to power ground, the effective logic input level is reduced and oscillation may result. Internal ringing can also cause output oscillation due to feedback. This feedback is added to the input signal since it To insure optimum performance, separate ground traces is referenced to the same ground. should be provided for the logic and power connections. Con- necting the logic ground directly to the MIC4129 GND pins To guarantee low supply impedance over a wide frequency will ensure full logic drive to the input and ensure fast output range, a parallel capacitor combination is recommended switching. Both of the MIC4129 GND pins should, however, for supply bypassing. Low inductance ceramic capacitors still be connected to power ground. should be used. A 1µF low ESR film capacitor in parallel with two 0.1 µF low ESR ceramic capacitors provide adequate The E-Pad and MLF packages have an exposed pad under bypassing. Connect one ceramic capacitor directly between the package. It's important for good thermal performance that pins 1 and 4. Connect the second ceramic capacitor directly this pad is connected to a ground plane. between pins 8 and 5. M9999-072010 6 July 2010

MIC4120/4129 Micrel, Inc. Input Stage can easily be exceeded. Therefore, some attention should be given to power dissipation when driving low impedance The input voltage level of the 4129 changes the quiescent loads and/or operating at high frequency. supply current. The N channel MOSFET input stage transistor drives a 450µA current source load. With a logic “1” input, the The supply current vs frequency and supply current vs capaci- maximum quiescent supply current is 450µA. Logic “0” input tive load characteristic curves aid in determining power dissi- level signals reduce quiescent current to 55µA maximum. pation calculations. Table 1 lists the maximum safe operating frequency for several power supply voltages when driving a The MIC4120/4129 input is designed to provide hysteresis. 2500pF load. More accurate power dissipation figures can This provides clean transitions, reduces noise sensitivity, be obtained by summing the three dissipation sources. and minimizes output stage current spiking when changing states. Input voltage threshold level is approximately 1.5V, Given the power dissipation in the device, and the thermal making the device TTL compatible over the 4.5V to 20V resistance of the package, junction operating temperature operating supply voltage range. Input current is less than for any ambient is easy to calculate. For example, the ther- 10µA over this range. mal resistance of the 8-pin EPAD MSOP package, from the data sheet, is 60°C/W. In a 25°C ambient, then, using a The MIC4129 can be directly driven by the MIC9130, MIC3808, maximum junction temperature of 150°C, this package will MIC38HC42 and similar switch mode power supply. By offload- dissipate 2W. ing the power-driving duties to the MIC4120/4129, the power supply controller can operate at lower dissipation. This can Accurate power dissipation numbers can be obtained by total- improve performance and reliability. ing the three sources of power dissipation in the device: The input can be greater than the +VS supply, however, current • Load Power Dissipation (PL) will flow into the input lead. The propagation delay for TD2 • Quiescent power dissipation (PQ) will increase to as much as 400ns at room temperature. The • Transition power dissipation (P ) T input currents can be as high as 30mA p-p (6.4mA ) with RMS the input, 6 V greater than the supply voltage. No damage Calculation of load power dissipation differs depending upon will occur to MIC4120/4129 however, and it will not latch. whether the load is capacitive, resistive or inductive. The input appears as a 7pF capacitance, and does not change Resistive Load Power Dissipation even if the input is driven from an AC source. Care should be Dissipation caused by a resistive load can be calculated taken so that the input does not go more than 5 volts below as: the negative rail. P = I2 R D Power Dissipation L O CMOS circuits usually permit the user to ignore power dis- where: sipation. Logic families such as 4000 and 74C have outputs I = the current drawn by the load which can only supply a few milliamperes of current, and even R = the output resistance of the driver when the output shorting outputs-to-ground will not force enough current to O is high, at the power supply voltage used. (See data destroy the device. The MIC4120/4129, on the other hand, sheet) can source or sink several amperes and drive large capacitive D = fraction of time the load is conducting (duty cycle) loads at high frequency. The package power dissipation limit +18V WIMA MK22 1 µF Table 1: MIC4129 Maximum 5.0V 1 TEK CURRENT 18V operating frequency 8 PROBE 6302 6,7 MIC4121 V Max Frequency 0V 5 0V S 0.1µF 4 0.1µF 2,500 pF 20V 1Mhz POLYCARBONATE 15V 1.5MHz LOGIC(cid:31) 6 AMPS GROUND 10V 3.5MHz POWER(cid:31) Conditions: T = 25°C, 3. C = 2500pF A L GROUND PC TRACE RESISTANCE = 0.05 Ω Figure 3. Switching Time Degradation Due to negative feedback July 2010 7 M9999-072010

MIC4120/4129 Micrel, Inc. Capacitive Load Power Dissipation transition Power Dissipation Dissipation caused by a capacitive load is simply the energy Transition power is dissipated in the driver each time its out- placed in, or removed from, the load capacitance by the put changes state, because during the transition, for a very driver. The energy stored in a capacitor is described by the brief interval, both the N- and P-channel MOSFETs in the equation: output totem-pole are ON simultaneously, and a current is conducted through them from V+ to ground. The transition E = 1/2 C V2 S power dissipation is approximately: As this energy is lost in the driver each time the load is charged P = 2 f V (A•s) or discharged, for power dissipation calculations the 1/2 is T S removed. This equation also shows that it is good practice where (A•s) is a time-current factor derived from the typical not to place more voltage on the capacitor than is necessary, characteristic curves. as dissipation increases as the square of the voltage applied Total power (P ) then, as previously described is: to the capacitor. For a driver with a capacitive load: D P = f C (V )2 P D = PL + PQ +PT L S Definitions where: C = Load Capacitance in Farads. f = O perating Frequency L C = Load Capacitance D = Duty Cycle expressed as the fraction of time the V = Driver Supply Voltage S input to the driver is high. Inductive Load Power Dissipation f = Operating Frequency of the driver in Hertz. For inductive loads the situation is more complicated. For I = Power supply current drawn by a driver when both the part of the cycle in which the driver is actively forcing H inputs are high and neither output is loaded. current into the inductor, the situation is the same as it is in the resistive case: I = Power supply current drawn by a driver when both L inputs are low and neither output is loaded. P = I2 R D L1 O I = Output current from a driver in Amps. However, in this instance the R required may be either D O the on resistance of the driver when its output is in the high P = Total power dissipated in a driver in Watts. D state, or its on resistance when the driver is in the low state, P = Power dissipated in the driver due to the driver’s depending on how the inductor is connected, and this is still L load in Watts. only half the story. For the part of the cycle when the induc- tor is forcing current through the driver, dissipation is best P = Power dissipated in a quiescent driver in Watts. Q described as P = Power dissipated in a driver when the output T P L2 = I VD (1-D) changes states (“shoot-through current”) in Watts. NOTE: The “shoot-through” current from a dual where V is the forward drop of the clamp diode in the driver D transition (once up, once down) for both drivers (generally around 0.7V). The two parts of the load dissipation is shown by the "Typical Characteristic Curve": must be summed in to produce P L Crossover Area vs. Supply Voltage and is in am- P = P + P pere-seconds. This figure must be multiplied by L L1 L2 the number of repetitions per second (frequency) Quiescent Power Dissipation to find Watts. Quiescent power dissipation (P , as described in the input Q R = Output resistance of a driver in Ohms. section) depends on whether the input is high or low. A low O input will result in a maximum current drain (per driver) of V = Power supply voltage to the IC in Volts. S ≤0.2mA; a logic high will result in a current drain of ≤2.0mA. Quiescent power can therefore be found from: P = V [D I + (1-D) I ] Q S H L where: I = quiescent current with input high H I = quiescent current with input low L D = fraction of time input is high (duty cycle) V = power supply voltage S M9999-072010 8 July 2010

MIC4120/4129 Micrel, Inc. +18 V WIMA MK22 1 µF 5.0V 18 V 1 TEK CURREN T 8 PROBE 6302 2 6, 7 MIC4129 0 V 5 0 V 0.1µF 0.1µF 4 10,000 pF POLYCARBONATE figure 4. Peak output Current test Circuit July 2010 9 M9999-072010

MIC4120/4129 Micrel, Inc. Package Information 8-Pin 3x3 MLF (ML) 8-Pin Exposed Pad SOIC (ME) MICREL INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA tel + 1 (408) 944-0800 fax + 1 (408) 474-1000 web http://www.micrel.com This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2004 Micrel Incorporated M9999-072010 10 July 2010

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: M icrel: MIC4120YML TR M icrochip: MIC4129YME MIC4120YME MIC4120YME-TR MIC4129YML-TR MIC4129YME-TR MIC4120YML-TR