ICGOO在线商城 > 电路保护 > PTC 可复位保险丝 > MF-PSMF050X-2
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MF-PSMF050X-2产品简介:
ICGOO电子元器件商城为您提供MF-PSMF050X-2由Bourns设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 MF-PSMF050X-2价格参考¥2.92-¥4.02。BournsMF-PSMF050X-2封装/规格:PTC 可复位保险丝, 聚合物 PTC 自恢复保险丝 6V 500mA Ih 表面贴装 0805(2012 公制),凹陷。您可以下载MF-PSMF050X-2参考资料、Datasheet数据手册功能说明书,资料中有MF-PSMF050X-2 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | FUSE PTC RESETTABLE SMD 0805可复位保险丝—PPTC .50A 6V 0.15ohm Hold .5 Trip 1 |
产品分类 | |
品牌 | Bourns Inc. |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | Bourns MF-PSMF050X-2MF-PSMF |
mouser_ship_limit | 该产品可能需要其他文件才能进口到中国。 |
数据手册 | |
产品型号 | MF-PSMF050X-2 |
PCN设计/规格 | |
RoHS指令信息 | |
R(最小/最大值) | 0.150 ~ 0.900 欧姆 |
产品培训模块 | http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=5252 |
产品目录绘图 | |
产品目录页面 | |
产品种类 | 可复位保险丝—PPTC |
保持电流 | 0.5 A |
其它名称 | MF-PSMF050X-2CT |
包装 | 剪切带 (CT) |
商标 | Bourns |
商标名 | Multifuse |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | 0805(2012 公制),凹陷 |
封装/箱体 | 0805 (2012 metric) |
尺寸 | 2.3 mm L x 1.5 mm W x 0.85 mm H |
工作温度范围 | - 40 C to + 85 C |
工厂包装数量 | 3000 |
最大电压 | 6 VDC |
标准包装 | 1 |
电压-最大值 | 6V |
电流-保持(Ih)(最大值) | 500mA |
电流-最大值 | 40A |
电流-跳闸(It) | 1A |
电阻 | 900 mOhms |
端接类型 | SMD/SMT |
类型 | PTC Resettable Fuses |
系列 | MF-PSMF |
跳闸时间 | 0.1s |
跳闸电流 | 1 A |
额定电流—最大值 | 40 A |
NT *RoHS VCEOARVMSIAPILOLINAASB LE Features Applications NT MPLIA n Compact design to save board space - n USB port protection - USB 2.0, 3.0 & OTG RoHS CO n 0S8m0a5l l fsoiozetp rreinstults in very fast time to react nn HPCD MmIo 1th.4e rSboouarrcdes p- rPoltuegc taionnd Play * to fault events protection n Symmetrical design n Mobile phones - Battery and port protection n Low profile n PDAs / digital cameras REE n RoHS compliant* and halogen free** n Game console port protection D F n Agency recognition: LEA MF-PSMF Series - PTC Resettable Fuses Electrical Characteristics Model VV molatsx. IA mmapxLsVE.EA RDH SISF ORCNEOSE MAPRLIIEh ANoT*ldAmperesI trip ReOsihsmtasn ce AmpeMreTasox .T TriiSmpeec onds DiTsPWrsioipapwptateestrid o n Ro at 23 °C at 23 °C at 23 °C at 23 °C at 23 °C Hold Trip RMin. R1Max. Typ. MF-PSMF010X 15 40 0.10 0.30 1.0 7.5 0.5 1.5 0.5 MF-PSMF010/24X*** 24 80 0.10 0.30 1.0 7.5 0.5 1.5 0.5 MF-PSMF020X 9 40 0.20 0.50 0.65 3.5 8.00 0.02 0.5 MF-PSMF035X 6 40 0.35 0.75 0.250 1.200 8.00 0.10 0.5 MF-PSMF050X 6 40 0.50 1.00 0.150 0.900 8.00 0.10 0.5 MF-PSMF075X 6 40 0.75 1.50 0.090 0.350 8.00 0.20 0.6 MF-PSMF110X 6 40 1.10 2.20 0.060 0.210 8.00 0.30 0.6 ***TÜV approval pending. Environmental Characteristics Operating Temperature .........................................-40 °C to +85 °C Passive Aging .......................................................+85 °C, 1000 hours ...............................................±5 % typical resistance change Humidity Aging......................................................+85 °C, 85 % R.H. 1000 hours .............................±5 % typical resistance change Thermal Shock .....................................................+85 °C to -40 °C, 20 times ....................................±10 % typical resistance change Solvent Resistance ...............................................MIL-STD-202, Method 215 ...................................No change Vibration ...............................................................MIL-STD-883C, Method 2007.1, ...........................No change Condition A Test Procedures And Requirements For Model MF-PSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech. .........................................................Verify dimensions and materials ...........................Per MF physical description Resistance ............................................................In still air @ 23 °C .................................................Rmin ≤ R ≤ R1max Time to Trip ...........................................................At specified current, Vmax, 23 °C .........................T ≤ max. time to trip (seconds) Hold Current .........................................................30 min. at Ihold .....................................................No trip Trip Cycle Life .......................................................Vmax, Imax, 100 cycles ........................................No arcing or burning Trip Endurance .....................................................Vmax, 48 hours .....................................................No arcing or burning Solderability ..........................................................ANSI/J-STD-002 ...................................................95 % min. coverage UL File Number ....................................................E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 TÜV Certificate Number .......................................R 50171531 http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 50171531 Thermal Derating Chart - Ihold (Amps) Ambient Operating Temperature Model -40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C MF-PSMF010X 0.15 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.05 MF-PSMF010/24X 0.15 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.05 MF-PSMF020X 0.28 0.25 0.23 0.20 0.17 0.14 0.12 0.10 0.07 MF-PSMF035X 0.47 0.44 0.39 0.35 0.30 0.27 0.24 0.20 0.14 MF-PSMF050X 0.68 0.62 0.55 0.50 0.40 0.37 0.33 0.29 0.23 MF-PSMF075X 1.00 0.90 0.79 0.75 0.63 0.57 0.53 0.42 0.35 MF-PSMF110X 1.45 1.35 1.20 1.10 0.92 0.84 0.75 0.65 0.52 * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. **Bourns considers a product to be “halogen free” if (a) the Bromine (Br ) content is 900 ppm or less; (b) the Chlorine ( Cl ) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine ( Cl ) content is 1500 ppm or less. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Additional Applications n Automotive electronic control modules MF-PSMF Series - PTC Resettable Fuses Product Dimensions A B C D Model Min. Max. Min. Max. Min. Max. Min. 2.00 2.30 1.20 1.50 0.48 0.85 0.20 MF-PSMF010X (0.079) (0.091) (0.047) (0.059) (0.019) (0.033) (0.008) 2.00 2.30 1.20 1.50 0.48 0.85 0.20 MF-PSMF010/24X (0.079) (0.091) (0.047) (0.059) (0.019) (0.033) (0.008) 2.00 2.30 1.20 1.50 0.48 0.85 0.20 MF-PSMF020X (0.079) (0.091) (0.047) (0.059) (0.019) (0.033) (0.008) 2.00 2.30 1.20 1.50 0.48 0.85 0.20 MF-PSMF035X (0.079) (0.091) (0.047) (0.059) (0.019) (0.033) (0.008) 2.00 2.30 1.20 1.50 0.48 0.85 0.20 MF-PSMF050X (0.079) (0.091) (0.047) (0.059) (0.019) (0.033) (0.008) 2.00 2.30 1.20 1.50 0.75 1.25 0.20 MF-PSMF075X (0.079) (0.091) (0.047) (0.059) (0.030) (0.049) (0.008) 2.00 2.30 1.20 1.50 0.75 1.25 0.20 MF-PSMF110X (0.079) (0.091) (0.047) (0.059) (0.030) (0.049) (0.008) Packaging: 3000 pcs. per reel. DIMENSIONS: MM (INCHES) Top View Bottom View Side View Recommended Pad Layout Terminal material: Nickel/gold plated. A C Termination pad solderability: Standard Au finish: 1.50 ± 0.10 4 B (.059 ± .004) Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 °C max./70 % RH max. D 1.00 ± 0.05 1.20 ± 0.10 (.039 ± .002) (.047 ± .004) Typical Time to Trip at 23 ˚C 10 The Time to Trip curves represent typical performance of MF-PSMF020X MF-PSMF035X a device in a simulated application environment. Actual MF-PSMF050X performance in specific customer applications may differ MF-PSMF075X from these values due to the influence of other variables. MF-PSMF110X 1 s) d n co MF-PSMF010X e S p ( 0.1 Tri o me t MF-PSMF010/24X Ti 0.01 0.001 Specifications are subject to change without notice. Users should verify actual device performance in their 0.0001 specific applications. 0.1 1 10 100 The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this Current (Amps) document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-PSMF Series - PTC Resettable Fuses Solder Reflow Recommendations tp Notes: TP CRITICAL ZONE • MF-FSML models cannot be wave soldered or hand soldered. Please RAMP-UP TLTO TP contact Bourns for soldering recommendations. TL • All temperatures refer to topside of the package, measured on the tL package body surface. ature TSMAX. RAMP-DOWN • nIf orte mfloewe tt ethmep peurabtluisrheesd e sxpceeceidfi cthaetio rnesc.ommended profile, devices may er • Compatible with Pb and Pb-free solder reflow profiles. Temp TSMIN. PREtHsEAT • Esoxlcdeesrisn gso. lPdleera msea yre cfearu tsoe t hae s hMourltt icfuirsceu®it ,P eoslpymeceiar lPlyT dCu rSinogld hearinndg Recommendation guidelines. 25 • Designed for single solder reflow operations. t 25 *C TO PEAK 8 MINS. Time MM DIMENSIONS: (INCHES) Profile Feature Pb-Free Assembly Average Ramp-Up Rate (TSmax to Tp) 3 °C / second max. PREHEAT: Temperature Min. (TSmin) 150 °C Temperature Max. (TSmax) 200 °C TimDePesr c(otrcsiepmstisoinn to tsmax) Materials Temperature InTtiemrveal Iancscpeepctat bsloel d(ie.er .j oe6ixnh0ti b~toi1t sd8 ew0tee rtsmtieningce oo ifnf jsodoisnldt’esr sjouirnfat cise). Use the following criteria (ref. acceptability of printed 1.TApIMplyE s oMldAerI NpaTstAe ItNoED AB•OSVn E96: .5 / Ag 3.0 / Cu 0.5 Room temperature board assemblies, IPC-A-610): t e s t Tbeoamrdp (e8 r-a 1t0u rmeil (tThiIc)k ) cAlleloayn wsoaltdeer rs poalusbtele or no A) Acceptable (see Fig2ur1e7 1 )°C Time (tL) (see note 1) (1)The solde6r 0c~on1n5ec0t iosne wcoetntindgs angle (solder to •single sided epoxy glass component and solder to PCB termination) Peak / Classification Tem(Gp1e0r)a (tUuLr eap p(rTovPe)d) does not exceed2 9600 ° .°C •PC board approx. 4x4x.06 in. Time within 5 °C of Actual Peak Temperature (tp) (2)Solder bal2ls0 t~ha4t 0do s neoct ovinoldatse minimum 2.Place test units onto board 6 units/board electrical clearances and are attached 3.RRaammp pu-pDown Rate Convection oven (see note 2) 2.5 °C ± 0.5 °/sec. (soldere6d )° tCo a/ mseetcalo snudrf amcea.x. 4.TPrimeheea tw (TitSh)in 25 °C to Peak Temperature 150°Cto190°C 90±30sec. B) Unacceptable 8(s mee iFniguutrees 2 )max. 5.Time above liquidus (TL) 220°C 60-90sec. (1)Solder connection wetting angle exceeding 90 °. 6.Peak temperature (TP) 250°C+0°/-5° How to Order Typical Part M10a-2r0k sinecg. within (2)Incomplete reflow of solder paste. 5 °C of peak (3)Dewetting. 7.Rampdown MF - PSMF 010 /24 X - 2 RRooemptreemspeenrattsu rteota3l °cCo±n0te.5n°tC. /sLeacy.outI f munaaycc vepatrayb.le, determine cause and correct prior to (see note 2) PART IDEnNeTxIFt IrCuAnT.ION: MD8.euCsllteiigfaunnsianetgo® rwPartoedr uclceta n profile High pressure deionized 72 °F to 160 °F As required MMFF--PPSSMMFFN0011O00TX/2E 4=SX 1: = 1 Series water 65 PSI max. (22 °C to 71 °C) 4 MF-PSMF10.20XW =a t2er soluble solder pAasstei aon-lPy aabcovifie 1c0:0 K. PSMF = 0805 Surface Mount MF-PSMF20.35XR e=f 3er to ref. temperatuTree pl:r o+fi8le8. T6e-m2p e2ra5tu6r2e -a4t 117 Component MF-PSMF050X = 4 BIWEEKLY DATE CODE MF-PSMF075Xle =a d5/pad junction with E“Km” taypile: tahesrimaoccuosup@leb.ourns.com H Toelmd0 1pC0eu-rr1ar1et0nu tr(,e0 I .ho1o0fl d L- e1a.1d0/ PAamdp sJ)unction WILL APPEAR ON THE MF-PSMF31.10XU n= i6ts that are board mEouuntreod pfoer :e n vironmental (HDeigrihveedr uVsoinltga g6e-z oOnpe tCioonn vection Oven) PWAECEKKA 1G AINNGD L 2A =B EAL: tzeosntein, ga sm supsetc sifeieed a. pTehaisTk eitsel mt:o +p ee3nrsa6utu r8ree 8t hin a5 tt h2ael0l rte e3fslot9 w0 Blank = Standard Voltage WEEK 51 AND 52 = Z units will see “worst caEsem caonild:i teiounsro”.cus@bourns.com /24 = 24 V Multifuse® freeXpansion™ Design 4. Ramp down rate to be Tmheaes uAremd ferormic 2a45s :° C to 150 °C. Packaging Tel: +1-951 781-5500 Packaged per EIA 481-1 5. Process Description 8 Edomesa niol:t aapmplye troic oupesn@ bourns.com -2 = Tape and Reel frame trimmers. www.bourns.com MF-PSMF SERIES, REV. O 05/17 “freeXpansion Design” is a trademark of Bourns, Inc. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-PSMF Series Tape and Reel Specifications MF-PSMF010X, MF-PSMF010/24X, MF-PSMF020X, MF-PSMF035X & MF-PSMF075X & MF-PSMF050X MF-PSMF110X Tape Dimensions per EIA 481-1 per EIA 481-1 8.0 ±0.30 8.0 ±0.30 W (0.315 ±0.012) (0.315 ±0.012) 4.0 ±0.10 4.0 ±0.10 P0 (0.157 ±0.004) (0.157 ±0.004) 4.0 ±0.10 4.0 ±0.10 P1 (0.157 ±0.004) (0.157 ±0.004) 2.0 ±0.05 2.0 ±0.05 P2 (0.079 ±0.002) (0.079 ±0.002) 1.65 ±0.10 1.65 ±0.10 A0 (0.065 ±0.004) (0.065 ±0.004) 2.4 ±0.10 2.4 ±0.10 B0 (0.094 ±0.004) (0.094 ±0.004) 4.35 4.35 B1max. (0.171) (0.171) 1.50 + 0.10/-0.0 1.50 + 0.10/-0.0 D0 (0.059 + 0.004/-0) (0.059 + 0.004/-0) 3.5 ±0.05 3.5 ±0.05 F (0.138 ±0.002) (0.138 ±0.002) 1.75 ±0.10 1.75 ±0.10 E1 (0.069 ±0.004) (0.069 ±0.004) 6.25 6.25 E2min. (0.246) (0.246) 0.6 0.6 T max. (0.024) (0.024) 0.10 0.10 T1max. (0.004) (0.004) 0.95 ±0.10 1.25 ±0.10 K0 (0.037 ±0.004) (0.049 ±0.004) 390 390 Leader min. (15.35) (15.35) 160 160 Trailer min. (6.30) (6.30) Reel Dimensions 185 185 A max. (7.28) (7.28) 50 50 N min. (1.97) (1.97) 8.4 + 1.5/ -0.0 8.4 + 1.5/ -0.0 W1 (0.331 + 0.059/-0) (0.331 + 0.059/-0) 14.4 14.4 W2 max. (0.567) (0.567) MM UNIT = (INCHES) P0 T D0 P2 E1 W2(MEASURED AT HUB) COVER TAPE F A N(HUB DIA.) E2W B1 B0 K0 P1 W1(AMT EHAUSBU)RED T1 A0 Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
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The characteristics and parameters of a Bourns® product in a user application may vary from the data sheet characteristics and parameters due to (i) the combination of the Bourns® product with other components in the user’s application, or (ii) the environment of the user application itself. The characteristics and parameters of a Bourns® product also can and do vary in different applications and actual performance may vary over time. Users should always verify the actual performance of the Bourns® product in their specific devices and applications, and make their own independent judgments regarding the amount of additional test margin to design into their device or application to compensate for differences between laboratory and real world conditions. 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