ICGOO在线商城 > 滤波器 > EMI/RFI 滤波器(LC,RC 网络) > MEM2012S35R0T001
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MEM2012S35R0T001产品简介:
ICGOO电子元器件商城为您提供MEM2012S35R0T001由TDK设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 MEM2012S35R0T001价格参考。TDKMEM2012S35R0T001封装/规格:EMI/RFI 滤波器(LC,RC 网络), LC (T-Type) EMI Filter 3rd Order Low Pass 1 Channel 100mA 0805 (2012 Metric), 3 PC Pad。您可以下载MEM2012S35R0T001参考资料、Datasheet数据手册功能说明书,资料中有MEM2012S35R0T001 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | FILTER 3-TERM 35MHZ 100MA SMDEMI网络滤波器 35MHz |
ESD保护 | 无 |
产品分类 | EMI/RFI 滤波器(LC、RC 网络)EMI/RFI 器件 |
品牌 | TDK |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | EMI网络滤波器,TDK MEM2012S35R0T001MEM |
数据手册 | |
产品型号 | MEM2012S35R0T001 |
中心/截止频率 | 35MHz(截止值) |
产品 | EMI Network Filters |
产品目录绘图 | |
产品种类 | EMI网络滤波器 |
其它名称 | 445-6200-6 |
包装 | Digi-Reel® |
商标 | TDK |
外壳宽度 | 1.25 mm |
外壳长度 | 2 mm |
外壳高度 | 0.85 mm |
大小/尺寸 | 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) |
封装 | Reel |
封装/外壳 | 0805(2012 公制),3 PC 板 |
封装/箱体 | 0805 (2012 metric) |
工作温度 | -40°C ~ 85°C |
工作温度范围 | - 40 C to + 85 C |
工厂包装数量 | 4000 |
应用 | 移动设备的数据线路 |
截止频率 | 35 MHz |
技术 | LC(T 型) |
数值 | - |
标准包装 | 1 |
滤波器阶数 | 3rd |
电压额定值 | 10 VDC |
电容 | - |
电感 | - |
电流 | 100mA |
电流额定值 | 100 mA |
电路类型 | LC (T) Filter |
电阻 | - |
电阻-通道(Ω) | - |
端接类型 | SMD/SMT |
类型 | Three Terminal Filter for Signal Line |
衰减值 | 30dB @ 90MHz ~ 2GHz |
通道数 | 1 |
频率范围 | 90 MHz to 2 GHz |
高度 | 0.037"(0.95mm) |
E M C C o m p o n e n t s 3-terminal filters Cl Pb Br Signal line MEM series RoHS SRVEHCA-CFrHee HaFlroegeen LFereaed MEM2012S type FEATURES Multilayer chip EMC filter. Monolithic structure makes it highly reliable. Closed magnetic circuit structure makes it possible to achieve high-density mounting without crosstalk. Has sharp attenuation characteristics with excellent EMC suppression. Wide range of products compatible with passing frequencies and attenuating frequencies. T-type circuit is used. Operating temperature range: –40 to +85°C APPLICATION Noise removal from signal lines of data terminals, digital cameras, computers, game machines, flat TVs, etc. Application guides: Smart phones/tablets PART NUMBER CONSTRUCTION MEM 2012 S 25R0 T 001 L×W×T dimensions Product internal Cutoff frequency Series name Packaging style Internal code 2.0×1.25×0.85 mm code (MHz) CHARACTERISTICS SPECIFICATION TABLE Cutoff frequency Insertion loss Rated voltage Rated current Part No. (MHz) (dB) (V)max. (mA)max. 25 30[70MHz to 2GHz] 10 100 MEM2012S25R0T001 35 30[90MHz to 2GHz] 10 100 MEM2012S35R0T001 50 30[200MHz to 2GHz] 10 100 MEM2012S50R0T001 100 30[400MHz to 2GHz] 10 250 MEM2012S101RT001 200 30[530MHz to 2GHz] 10 250 MEM2012S201RT001 Measurement equipment Measurement item Product No. Manufacturer Frequency characteristics N5230C Keysight Technologies *Equivalent measurement equipment may be used. Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. (1/4) Please note that the contents may change without any prior notice due to reasons such as upgrading. 20190207 3tf_commercial_signal_mem2012s_en.fm
E M C C o m p o n e n t s MEM2012S type INSERTION LOSS VS. FREQUENCY CHARACTERISTICS 0 10 20 )B 101R 201R d (s 30 s o n l 50R0 ertio 40 s 35R0 n I 50 25R0 60 70 1 10 100 1000 10000 Frequency (MHz) Measurement equipment Product No. Manufacturer N5230C Keysight Technologies *Equivalent measurement equipment may be used. Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. (2/4) Please note that the contents may change without any prior notice due to reasons such as upgrading. 20190207 3tf_commercial_signal_mem2012s_en.fm
E M C C o m p o n e n t s MEM2012S type SHAPE & DIMENSIONS PACKAGING STYLE 2±0.2 REEL DIMENSIONS GND 4 2.0±0.5 E 0.1min. ±1.250.2 1 2 3 IN/OUT GND OUT/IN 0.2min 0.2min n. mi 0 ±0.850.15 ø6 1.0 0.4±0.15 0.4±0.15 0.4±0.15 Dimensions in mm ø13±0.2 8.4+–02..00 ø21±0.8 14.4max. ø180±2.0 RECOMMENDED LAND PATTERN Dimensions in mm TAPE DIMENSIONS 2 1 5 1 0 Sprocket 0. 0. 0.4 hole 1.5+–00.1 2.0±0.05 4.0±0.1 1.75± 3.5± 1.4 3 1.6 0. ± 3 B 8.0 Dimensions in mm K A Cavity 4.0±0.1 Dimensions in mm CIRCUIT DIAGRAM Type A B K MEM2012S 1.55±0.20 2.30±0.20 1.10max. GND 160min. Taping 200min. RECOMMENDED REFLOW PROFILE Drawing direction 300min. Preheating Soldering Natural cooling Peak Dimensions in mm 250 to 260°C PACKAGE QUANTITY e 230°C 230°C Package quantity 4,000 pcs/reel ur at er p m TEMPERATURE RANGE, INDIVIDUAL WEIGHT e 180°C T 10s max. Operating Storage Individual 150°C temperature range temperature range weight –40 to +85 °C –40 to +85 °C 8 mg 60 to 120s 30 to 60s The storage temperature range is for after the assembly. Time Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. (3/4) Please note that the contents may change without any prior notice due to reasons such as upgrading. 20190207 3tf_commercial_signal_mem2012s_en.fm
E M C C o m p o n e n t s REMINDERS FOR USING THESE PRODUCTS Before using these products, be sure to request the delivery specifications. SAFETY REMINDERS Please pay sufficient attention to the warnings for safe designing when using this products. REMINDERS The storage period is less than 12 months. Be sure to follow the storage conditions (temperature: 5 to 40°C, humidity: 10 to 75% RH or less). If the storage period elapses, the soldering of the terminal electrodes may deteriorate. Do not use or store in locations where there are conditions such as gas corrosion (salt, acid, alkali, etc.). Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature does not exceed 150°C. Soldering corrections after mounting should be within the range of the conditions determined in the specifications. If overheated, a short circuit, performance deterioration, or lifespan shortening may occur. When embedding a printed circuit board where a chip is mounted to a set, be sure that residual stress is not given to the chip due to the overall distortion of the printed circuit board and partial distortion such as at screw tightening portions. Self heating (temperature increase) occurs when the power is turned ON, so the tolerance should be sufficient for the set thermal design. Carefully lay out the coil for the circuit board design of the non-magnetic shield type. A malfunction may occur due to magnetic interference. Use a wrist band to discharge static electricity in your body through the grounding wire. Do not expose the products to magnets or magnetic fields. Do not use for a purpose outside of the contents regulated in the delivery specifications. The products listed on this catalog are intended for use in general electronic equipment (AV equipment, telecommunications equip- ment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement equip- ment, industrial robots) under a normal operation and use condition. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or qual- ity require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society, person or property. If you intend to use the products in the applications listed below or if you have special requirements exceeding the range or conditions set forth in the each catalog, please contact us. (1) Aerospace/aviation equipment (8) Public information-processing equipment (2) Transportation equipment (cars, electric trains, ships, etc.) (9) Military equipment (3) Medical equipment (10) Electric heating apparatus, burning equipment (4) Power-generation control equipment (11) Disaster prevention/crime prevention equipment (5) Atomic energy-related equipment (12) Safety equipment (6) Seabed equipment (13) Other applications that are not considered general-purpose (7) Transportation control equipment applications When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing pro- tection circuit/device or providing backup circuits in your equipment. Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use. (4/4) Please note that the contents may change without any prior notice due to reasons such as upgrading. 20190207 3tf_commercial_signal_mem2012s_en.fm