MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag Precision Wide Terminal Thin Film Chip Resistors FEATURES • Rated dissipation P up to 250 mW 70 • Resistance range down to 1  • Superior temperature cycling robustness • Operating temperature up to 155 °C • Advanced sulfur resistance verified according to ASTM B 809 • Superior moisture resistivity MCW 0406 AT Precision Wide Terminal Resistors are the • AEC-Q200 qualified perfect choice for most fields of modern professional power • Material categorization: for definitions of compliance measurement electronics where reliability, stability, power please see www.vishay.com/doc?99912 dissipation, and robust design is of major concern. Beside extremely high power ratings, the MCW 0406 AT APPLICATIONS is characterized by extraordinary temperature cycling • Automotive robustness, verified through extensive testing. • Industrial The permissible power rating is specified with 250 mW. • High power applications Typical applications include power electronics in automotive and industrial appliances. TECHNICAL SPECIFICATIONS DESCRIPTION MCW 0406 AT Imperial size 0406 Metric size code RR1016M Resistance range 1  to 100 k Resistance tolerance ± 0.1 % Temperature coefficient ± 15 ppm/K; ± 25 ppm/K Rated dissipation P (1) 0.25 W 70 Operating voltage, U AC /DC 50 V max. RMS Permissible film temperature, F max. (1) 155 °C Operating temperature range -55 °C to 155 °C Permissible voltage against ambient (insulation): 1 min; U 75 V ins Note (1) Please refer to APPLICATION INFORMATION, see next page. Revision: 24-Mar-16 1 Document Number: 28847 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION OPERATION MODE STANDARD POWER Rated dissipation, P 0.200 W 0.250 W 70 Operating temperature range -55 °C to 125 °C -55 °C to 155 °C Permissible film temperature, F max. 125 °C 155 °C 1  to 100 k 1  to 100 k 1000 h  0.1 %  0.2 % Max. resistance change at P for 70 resistance range, |R/R| after: 8000 h  0.2 %  0.4 % 225 000 h  0.6 % - Note • The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of the circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance. The resistance value is influenced by the resistance of the terminations. The exact resistance value of the soldered part on the PCB may deviate depending on e.g. solder quantity, pad layout, and soldering method. The resistance value of the unmounted part can be verified by a 4-point probe on the top side termination as shown below. 600 μm 870 μm Fig. 1 Revision: 24-Mar-16 2 Document Number: 28847 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES ± 25 ppm/K ± 0.1 % 1  to 100 k E24; E192 MCW 0406 AT ± 15 ppm/K ± 0.1 % 47  to 100 k E24; E192 PACKAGING PACKAGING TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH DIMENSIONS P1 1000 Tape and reel Ø 180 mm / 7" MCW 0406 AT P5 5000 cardboard tape acc. 8 mm 4 mm IEC 60286-3, Type 1a PW 20 000 Ø 330 mm / 13" PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: MCW0406MD4641BPW00 M C W 0 4 0 6 M D 4 6 4 1 B P W 0 0 TYPE / SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING MCW0406 M = AT (Automotive) E = ± 15 ppm/K 3 digit value B = ± 0.1 % P1 D = ± 25 ppm/K 1 digit P5 multiplier PW Multiplier 8 = *10-2 9 = *10-1 0 = *100 1 = *101 2 = *102 3 = *103 PRODUCT DESCRIPTION: MCW 0406-25 0.1 % AT PW 4K64 MCW 0406 -25 0.1 % AT PW 4K64 TYPE SIZE TCR TOLERANCE VERSION PACKAGING RESISTANCE MCW 0406 ± 15 ppm/K ± 0.1 % AT = Automotive P1 4K64 = 4.64 k ± 25 ppm/K P5 PW Note • Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION. Revision: 24-Mar-16 3 Document Number: 28847 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag DESCRIPTION The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A www.vishay.com/how/leadfree. homogeneous film of special metal alloy is deposited on a Hence the products fully comply with the following high grade ceramic substrate (Al O ) and conditioned to directives: 2 3 achieve the desired temperature coefficient. Specially • 2000/53/EC End-of-Life Vehicle Directive (ELV) and designed inner contacts are deposited on both sides. A Annex II (ELV II) special laser is used to achieve the target value by smoothly • 2011/65/EU Restriction of the Use of Hazardous cutting a meander groove in the resistive layer without Substances Directive (RoHS) with amendment damaging the ceramics. The resistor elements are covered 2015/863/EU by a unique protective coating designed for electrical, • 2012/19/EU Waste Electrical and Electronic Equipment mechanical and climatic protection. The terminations Directive (WEEE) receive a final pure tin on nickel plating. Vishay pursues the elimination of conflict minerals from its The result of the determined production is verified by an supply chain, see the Conflict Minerals Policy at extensive testing procedure and optical inspection www.vishay.com/doc?49037. performed on 100 % of the individual chip resistors. This includes full screening for the elimination of products with APPROVALS potential risk of early field failures (feasible for R  10 ). Where applicable the resistors are tested within the Only accepted products are laid directly into the paper tape IECQ-CECC Quality Assessment System for Electronic in accordance with IEC 60286-3 Type 1a (1). Components to the detail specification EN 140401-801 which refers to EN 60115-1, EN 60115-8 and the variety of ASSEMBLY environmental test procedures of the IEC 60068 (1) series. The resistors are suitable for processing on automatic SMD The detail specification refers to the climatic category assembly systems. They are suitable for automatic 55/125/56, which relates to the “standard operation mode” soldering using reflow or vapour phase as shown in of this datasheet. The MCW 0406 AT is AEC-Q200 qualified. IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics Vishay BEYSCHLAG has achieved “Approval of industry, including alcohols, esters and aqueous solutions. Manufacturer” in accordance with IECQ 03-1. The release The suitability of conformal coatings, potting compounds certificate for “Technology Approval Schedule” in and their processes, if applied, shall be qualified by accordance with CECC 240001 based on IECQ 03-3-1, is appropriate means to ensure the long-term stability of the granted for the Vishay BEYSCHLAG manufacturing whole system. process. The resistors are RoHS compliant; the pure tin plating RELATED PRODUCTS provides compatibility with lead (Pb)-free and For an alternative range of TCR and tolerance see the lead-containing soldering processes. Solderability is datasheet: specified for 2 years after production or requalification. The • Professional Wide Terminal Thin Film Chip Resistors permitted storage time is 20 years. The immunity of the (www.vishay.com/doc?28796) plating against tin whisker growth has been proven by extensive testing. MATERIALS Vishay acknowledges the following systems for the regulation of hazardous substances: • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474. (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org. (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table. Revision: 24-Mar-16 4 Document Number: 28847 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag FUNCTIONAL PERFORMANCE % 120 n Pn i 100 o ati 80 p si s Di 60 r e w o 40 P 20 0 -50 0 50 70 100 125 155 175 Ambient Temperature in °C Derating - Standard Operation % 120 n Pn i 100 o ati 80 p si s Di 60 r e w o 40 P 20 0 -50 0 50 70 100 125 155 175 Ambient Temperature in °C Derating - Power Operation TESTS AND REQUIREMENTS All tests are carried out in accordance with the following The testing also covers most of the requirements specified specifications: by EIA / ECA-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheric EN 60115-8 (successor of EN 140400), sectional conditions in accordance with IEC 60068-1, 4.3, whereupon specification the following values are applied: EN 140401-801, detail specification Temperature: 15 °C to 35 °C IEC 60068-2-xx, test methods Relative humidity: 25 % to 75 % The parameters stated in the Test Procedures and Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). Requirements table are based on the required tests and A climatic category LCT / UCT / 56 is applied, defined by the permitted limits of EN 140401-801. The table presents only lower category temperature (LCT), the upper category the most important tests, for the full test schedule refer to temperature (UCT), and the duration of exposure in the the documents listed above. However, some additional damp heat, steady state test (56 days). tests and a number of improvements against those The components are mounted for testing on printed circuit minimum requirements have been included. boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified. Revision: 24-Mar-16 5 Document Number: 28847 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS IEC EN 60068-2 (1) REQUIREMENTS 60115-1 TEST PROCEDURE TEST PERMISSIBLE CHANGE (R) CLAUSE METHOD Stability for product types: MCW 0406 AT 1  to 100 k 4.5 - Resistance - ± 0.1 % R Temperature At (20 / -55 / 20) °C and 4.8 - ± 15 ppm/K; ± 25 ppm/K coefficient (20 / 155 / 20) °C U = P70 x R or U = Umax.; whichever is the less severe; Endurance at 70 °C: 1.5 h on; 0.5 h off; Standard operation mode 70 °C; 1000 h ± (0.1 % R + 0.02 ) 70 °C; 8000 h ± (0.2 % R + 0.02 ) 4.25.1 - U = P70 x R or U = Umax.; whichever is the less severe; Endurance at 70 °C: 1.5 h on; 0.5 h off; Power operation mode 70 °C; 1000 h ± (0.2 % R + 0.02 ) 70 °C; 8000 h ± (0.4 % R + 0.05 ) Endurance at 125 °C; 1000 h ± (0.15 % R + 0.02 ) 4.25.3 - upper category 155 °C; 1000 h ± (0.3 % R + 0.05 ) temperature Damp heat, (40 ± 2) °C; 56 days; 4.24 78 (Cab) ± (0.1 % R + 0.02 ) steady state (93 ± 3) % RH Damp heat, (85 ± 2) °C steady state, (85 ± 5) % RH 4.37 67 (Cy) ± (0.5 % R + 0.05 ) accelerated: U = 0.1 x P x R; 70 Standard operation mode U0.3 x Umax.; 1000 h Climatic sequence: 4.23 Standard operation mode: 4.23.2 2 (Bb) Dry heat UCT; 16 h 55 °C; 24 h;  90 % RH; 4.23.3 30 (Db) Damp heat, cyclic 1 cycle 4.23.4 1 Cold LCT; 2 h ± (0.25 % R + 0.05 ) 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 55 °C; 24 h;  90 % RH; 4.23.6 30 (Db) Damp heat, cyclic 5 cycles U = P70 x R  Umax.; 1 min; 4.23.7 - DC load LCT = -55 °C; UCT = 125 °C Storage at low - 1 (Ab) -55 °C; 2 h ± (0.05 % R + 0.01) temperature 30 min at -55 °C; Rapid change 30 min at 155 °C; ± (0.25 % R + 0.05 ) of temperature 1000 cycles 4.19 14 (Na) 30 min at -40 °C; Extended rapid change ± (0.25 % R + 0.05 ); 30 min at 125 °C; of temperature ( 50 % of initial shear force) 3000 cycles (2) Revision: 24-Mar-16 6 Document Number: 28847 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS IEC EN 60068-2 (1) REQUIREMENTS 60115-1 TEST PROCEDURE TEST PERMISSIBLE CHANGE (R) CLAUSE METHOD Stability for product types: MCW 0406 AT 1  to 100 k U = 2.5 x P x R 70 4.13 - Short time overload:  2 × Umax.; ± (0.05 % R + 0.01) Standard operation mode whichever is the less severe; 5 s IEC 61340-3-1 (1); 3 pos. + 3 neg. Electro Static Discharge 4.38 - (equivalent to MIL-STD-883, ± (0.5 % R + 0.05) (Human Body Model) method 3015) 500 V Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.05 % R + 0.01) 4.22 6 (Fc) Vibration no resonance; no visible damage amplitude  1.5 mm or 200 m/s2; 7.5 h Solder bath method; Good tinning ( 95 % covered); SnPb40; non-activated flux no visible damage (215 ± 3) °C; (3 ± 0.3) s 4.17 58 (Td) Solderability Solder bath method; SnAg3Cu0.5 or SnAg3.5; Good tinning (95 % covered); non-activated flux; no visible damage (235 ± 3) °C; (2 ± 0.2) s Resistance to Solder bath method; ± (0.1 % R + 0.02 ) 4.18 58 (Td) soldering heat (260 ± 5) °C; (10 ± 1) s no visible damage Component solvent Isopropyl alcohol +50 °C; 4.29 45 (XA) No visible damage resistance method 2 4.32 21 (Ue ) Shear (adhesion) 9 N No visible damage 3 ± (0.05 % R + 0.01) 4.33 21 (Ue ) Substrate bending Depth 2 mm, 3 times 1 no visible damage; no open circuit in bent position 4.7 - Voltage proof U = U ; (60 ± 5) s No flashover or breakdown RMS ins 4.35 - Flammability Needle flame test; 10 s No burning after 30 s Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. (2) Tested on a 4-layer printed circuit board with SAC micro alloy. Revision: 24-Mar-16 7 Document Number: 28847 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCW 0406 AT - Precision www.vishay.com Vishay Beyschlag DIMENSIONS T t W WT H T b L DIMENSIONS AND MASS H L W W T T MASS TYPE / SIZE T t b (mm) (mm) (mm) (mm) (mm) (mm) (mg) MCW 0406 AT 0.3 ± 0.05 1.0 ± 0.15 1.5 ± 0.15 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 1.9 SOLDER PAD DIMENSIONS G X Y Z RECOMMENDED SOLDER PAD DIMENSIONS REFLOW SOLDERING TYPE / SIZE G Y X Z (mm) (mm) (mm) (mm) MCW 0406 AT 0.35 0.55 1.75 1.45 Notes • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1), or in publication IPC-7351. (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. Revision: 24-Mar-16 8 Document Number: 28847 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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