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  • 型号: MCT0603MD2490BP100
  • 制造商: Vishay
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MCT0603MD2490BP100产品简介:

ICGOO电子元器件商城为您提供MCT0603MD2490BP100由Vishay设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 MCT0603MD2490BP100价格参考¥0.45-¥0.45。VishayMCT0603MD2490BP100封装/规格:芯片电阻 - 表面安装, 249 Ohms ±0.1% 0.125W,1/8W 薄膜 芯片电阻 0603(1608 公制) 耐硫,汽车级 AEC-Q200 汽车认证 薄膜。您可以下载MCT0603MD2490BP100参考资料、Datasheet数据手册功能说明书,资料中有MCT0603MD2490BP100 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

电阻器

描述

RES 249 OHM 1/8W .1% 0603

产品分类

芯片电阻 - 表面安装

品牌

Vishay Beyschlag

数据手册

点击此处下载产品Datasheet

产品图片

产品型号

MCT0603MD2490BP100

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

MCT 0603 - 精密型

供应商器件封装

0603

其它名称

MCT0603-249-MBCT

功率(W)

0.125W,1/8W

包装

剪切带 (CT)

大小/尺寸

0.061" 长 x 0.033" 宽(1.55mm x 0.85mm)

容差

±0.1%

封装/外壳

0603(1608 公制)

成分

薄膜

标准包装

1

温度系数

±25ppm/°C

特性

获得 AEC-Q200 汽车认证

电阻(Ω)

249

端子数

2

高度

0.022"(0.55mm)

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PDF Datasheet 数据手册内容提取

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag Precision Thin Film Chip Resistors FEATURES • Rated dissipation P up to 0.4 W for size 1206 70 • AEC-Q200 qualified • Approved to EN 140401-801 • Superior temperature cycling robustness • Superior moisture resistivity, |R/R| < 0.5 % (85 °C; 85 % RH; 1000 h) • Advanced sulfur resistance verified according to ASTM B 809 • Material categorization: for definitions of complianc e Vishay Automotive Grade MC AT precision thin film chip please see www.vishay.com/doc?99912 resistors are the perfect choice for most fields of modern precision electronics where reliability and stability is of major APPLICATIONS concern. Typical applications include automotive, industrial, telecommunication and medical equipment, as well as • Automotive precision test and measuring equipment. • Industrial equipment • Telecommunication • Medical equipment TECHNICAL SPECIFICATIONS DESCRIPTION MCS 0402 AT MCT 0603 AT (2) MCU 0805 AT MCA 1206 AT Imperial size 0402 0603 0805 1206 Metric size code RR1005M RR1608M RR2012M RR3216M Resistance range 47  to 221 k 47  to 511 k 47  to 1 M 47  to 10 M Resistance tolerance ± 0.1 % ± 25 ppm/K; ± 15 ppm/K; ± 25 ppm/K; ± 15 ppm/K; Temperature coefficient ± 25 ppm/K; ± 15 ppm/K; ± 10 ppm/K ± 10 ppm/K ± 10 ppm/K; ± 5 ppm/K Rated dissipation P (1) 0.100 W 0.125 W 0.200 W 0.400 W 70 Operating voltage, U AC /DC 50 V 75 V 150 V 200 V max. RMS Permissible film temperature, F max. (1) 155 °C Operating temperature range -55 °C to 155 °C Internal thermal resistance (1) 90 K/W 63 K/W 38 K/W 32 K/W Permissible voltage against ambient (insulation): 1 min; U 75 V 100 V 200 V 300 V ins Failure rate: FITobserved  0.1 x 10-9/h Notes (1) Please refer to APPLICATION INFORMATION, see below (2) AEC-Q200 qualification for TCR ± 5 ppm/K pending, CECC not applicable for TCR ± 5 ppm/K Revision: 30-Jan-2020 1 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications ” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drif t increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION OPERATION MODE STANDARD POWER MCS 0402 AT 0.063 W 0.100 W MCT 0603 AT 0.100 W 0.125 W Rated dissipation, P 70 MCU 0805 AT 0.125 W 0.200 W MCA 1206 AT 0.250 W 0.400 W Operating temperature range -55 °C to 125 °C -55 °C to 155 °C Permissible film temperature, F max. 125 °C 155 °C MCS 0402 AT 47  to 221 k 47  to 221 k MCT 0603 AT 47  to 511 k 47  to 511 k MCU 0805 AT 47  to 1 M 47  to 1 M Max. resistance change at P70 MCA 1206 AT 47  to 10 M 47  to 10 M for resistance range, |R/R| after: 1000 h  0.1 %  0.2 % 8000 h  0.2 %  0.4 % 225 000 h  0.6 % - Note • The presented operation modes do not refer to different types of resistors, but actually show examples of different loads, that lead to different film temperatures and different achievable load-life stability (drift) of the resistance value. A suitable low thermal resistance of th e circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES ± 25 ppm/K 47  to 221 k MCS 0402 AT ± 15 ppm/K ± 0.1 % 47  to 100 k E24; E192 ± 10 ppm/K 47  to 10 k ± 25 ppm/K 47  to 511 k ± 15 ppm/K 47  to 221 k MCT 0603 AT ± 0.1 % E24; E192 ± 10 ppm/K 47  to 100 k ± 5 ppm/K 3.9 k to 100 k ± 25 ppm/K 47  to 1 M MCU 0805 AT ± 15 ppm/K ± 0.1 % 47  to 332 k E24; E192 ± 10 ppm/K 47  to 33.2 k ± 25 ppm/K 47  to 10 M MCA 1206 AT ± 15 ppm/K ± 0.1 % 47  to 511 k E24; E192 ± 10 ppm/K 47  to 43.2 k Revision: 30-Jan-2020 2 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag PACKAGING PACKAGING PACKAGING TYPE / SIZE CODE QUANTITY WIDTH PITCH STYLE DIMENSIONS E1 1000 MCS 0402 AT E5 5000 2 mm Ø 180 mm / 7" E0 10 000 P1 1000 Ø 180 mm / 7" MCT 0603 AT P5 5000 Paper tape acc. PW 20 000 IEC 60286-3, 8 mm Ø 330 mm / 13" type 1a P1 1000 4 mm Ø 180 mm / 7" MCU 0805 AT P5 5000 PW 20 000 Ø 330 mm / 13" P1 1000 MCA 1206 AT Ø 180 mm / 7" P5 5000 PART NUMBER AND PRODUCT DESCRIPTION Part Number: MCT0603MD4641BPW00 M C T 0 6 0 3 M D 4 6 4 1 B P W 0 0 TYPE/SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING MCS0402 M = AT G = ± 5 ppm/K 3 digit value B = ± 0.1 % E1 MCT0603 (automotive) F = ± 10 ppm/K 1 digit multiplier E5 MCU0805 E = ± 15 ppm/K E0 MCA1206 D = ± 25 ppm/K Multiplier P1 9 = *10-1 P5 0 = *100 PW 1 = *101 2 = *102 3 = *103 4 = *104 5 = *105 Product Description: MCT 0603-25 0.1 % AT PW 4K64 MCT 0603 -25 0.1 % AT PW 4K64 TYPE SIZE TCR TOLERANCE VERSION PACKAGING RESISTANCE MCS 0402 ± 5 ppm/K ± 0.1 % AT = automotive E1 4K64 = 4.64 k MCT 0603 ± 10 ppm/K E5 MCU 0805 ± 15 ppm/K E0 MCA 1206 ± 25 ppm/K P1 P5 PW Note • Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION Revision: 30-Jan-2020 3 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag DESCRIPTION The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see Production is strictly controlled and follows an extensive www.vishay.com/how/leadfree. set of instructions established for reproducibility. A Hence the products fully comply with the following homogeneous film of special metal alloy is deposited on a directives: high grade ceramic substrate (Al O ) and conditioned to 2 3 achieve the desired temperature coefficient. Speciall y • 2000/53/EC End-of-Life Vehicle Directive (ELV) and designed inner contacts are deposited on both sides. A Annex II (ELV II) special laser is used to achieve the target value by smoothly • 2011/65/EU Restriction of the Use of Hazardous cutting a meander groove in the resistive layer withou t Substances Directive (RoHS) with amendmen t damaging the ceramics. The resistor elements are covered 2015/863/EU by a unique protective coating designed for electrical, • 2012/19/EU Waste Electrical and Electronic Equipment mechanical and climatic protection. The termination s Directive (WEEE) receive a final pure matte tin on nickel plating. Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy a t The result of the determined production is verified by an www.vishay.com/doc?49037. extensive testing procedure and optical inspection performed on 100 % of the individual chip resistors. Thi s APPROVALS includes full screening for the elimination of products with The resistors are approved within the IECQ-CECC Quality potential risk of early field failures (feasible for R  10 ). Assessment System for Electronic Components to the detail Only accepted products are laid directly into the paper tape specification EN 140401-801 which refers to EN 60115-1, in accordance with IEC 60286-3 Type 1a (1). EN 60115-8 and the variety of environmental tes t procedures of the IEC 60068 (1) series. The detail ASSEMBLY specification refers to the climatic categories 55/125/56, The resistors are suitable for processing on automatic SMD which relates to the “standard operation mode” of thi s assembly systems. They are suitable for automatic datasheet. soldering using wave, reflow or vapour phase as shown i n Conformity is attested by the use of the CECC logo ( ) IEC 61760-1 (1). The encapsulation is resistant to all as the mark of conformity on the package label. cleaning solvents commonly used in the electronic s Vishay Beyschlag has achieved “Approval of industry, including alcohols, esters and aqueous solutions. Manufacturer” in accordance with IECQ 03-1. The release The suitability of conformal coatings, potting compounds certificate for “Technology Approval Schedule” i n and their processes, if applied, shall be qualified b y accordance with CECC 240001 based on IECQ 03-3-1 is appropriate means to ensure the long-term stability of th e granted for the Vishay Beyschlag manufacturing process. whole system. The resistors are qualified according to AEC-Q200. The resistors are RoHS-compliant; the pure matte tin plating provides compatibility with lead (Pb)-free an d RELATED PRODUCTS lead-containing soldering processes. Solderability is For more information about products with higher operatio n specified for 2 years after production or requalification. The temperature please refer to the MC AT - Professional permitted storage time is 20 years. The immunity of th e datasheet (www.vishay.com/doc?28760). plating against tin whisker growth has been proven unde r Chip resistor arrays may be used in sensing applications or extensive testing. precision amplifiers where close matching between multiple resistors is necessary. Please refer to the ACAS AT - MATERIALS Precision datasheet (www.vishay.com/doc?28770). Vishay acknowledges the following systems for the MC AT - Precision is also available with gold regulation of hazardous substances: termination for conductive gluing: MC ATAU - Precision. • IEC 62474, Material Declaration for Products of and for the Please refer to the datasheet (www.vishay.com/doc?28877). Electrotechnical Industry, with the list of declarable For high power and high temperature applications substances given therein (2) MCW AT wide terminal thin film chip resistors offe r • The Global Automotive Declarable Substance List extremely high power ratings and extraordinary temperatur e (GADSL) (3) cycling robustness. • The REACH regulation (1907/2006/EC) and the related lis t Please refer to the datasheets for of substances with very high concern (SVHC) (4) for it s precision (www.vishay.com/doc?28847) and supply chain professional (www.vishay.com/doc?28796) specification. These wide-terminal products are also available i n low-ohmic values, NCW AT (www.vishay.com/doc?28849). Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 30-Jan-2020 4 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag FUNCTIONAL PERFORMANCE 0.3 P n o MCS 0402 AT ati MCT 0603 AT p si MCU 0805 AT Dis 0.2 MCA 1206 AT r e w W o P 0.1 0 -50 0 50 70 100 °C 150 Ambient Temperatureϑ amb Derating - Standard Operation 0.5 P n o MCS 0402 AT ati 0.4 MCT 0603 AT p si MCU 0805 AT Dis MCA 1206 AT r 0.3 e w W o P 0.2 0.1 -50 0 50 70 100 °C 150 Ambient Temperatureϑ amb Derating - Power Operation A1 10 MCS 0402 AT e ois MCT 0603 AT N MCU 0805 AT nt MCA 1206 AT e 1 r ur µV/V C 0.1 0.01 10 Ω 100 Ω 1 kΩ 10 kΩ 100 kΩ 1 MΩ Resistance ValueR Current noise A in accordance with IEC 60195 1 Current Noise Revision: 30-Jan-2020 5 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag TESTS AND REQUIREMENTS All tests are carried out in accordance with the following The testing also covers most of the requirements specifie d specifications: by EIA/ECA-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheri c EN 60115-8 (successor of EN 140400), sectional conditions in accordance with IEC 60068-1, 4.3, whereupon specification the following values are applied: EN 140401-801, detail specification Temperature: 15 °C to 35 °C IEC 60068-2-xx, test methods Relative humidity: 25 % to 75 % The components are approved under the IECQ-CEC C Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) quality assessment system for electronic components. A climatic category LCT / UCT / 56 is applied, defined by the The parameters stated in the Test Procedures an d lower category temperature (LCT), the upper categor y Requirements table are based on the required tests and temperature (UCT), and the duration of exposure in th e permitted limits of EN 140401-801. The table presents only damp heat, steady state test (56 days). the most important tests, for the full test schedule refer t o The components are mounted for testing on printed circuit the documents listed above. However, some additional boards in accordance with EN 60115-8, 2.4.2, unless tests and a number of improvements against thos e otherwise specified. minimum requirements have been included. TEST PROCEDURES AND REQUIREMENTS IEC 60068-2 (1) REQUIREMENTS EN 60115-1 TEST TEST PROCEDURE PERMISSIBLE CHANGE (R) CLAUSE METHOD STABILITY CLASS 0.25 OR BETTER (2) Stability for product types: MCS 0402 AT 47  to 221 k MCT 0603 AT 47  to 511 k MCU 0805 AT 47  to 1 M MCA 1206 AT 47  to 10 M 4.5 - Resistance ± 0.1 % R Temperature At (20 / -55 / 20) °C and ± 25 ppm/K; ± 15 ppm/K; 4.8 - coefficient (20 / 155 / 20) °C ± 10 ppm/K; ± 5 ppm/K U = P x R or U = U ; 70 max. whichever is the less severe; Endurance at 70 °C: 1.5 h on; 0.5 h off; Standard operation mode 70 °C; 1000 h ± (0.1 % R + 0.02 ) 70 °C; 8000 h ± (0.2 % R + 0.02 ) 4.25.1 - U = P x R or U = U ; 70 max. whichever is the less severe; Endurance at 70 °C: 1.5 h on; 0.5 h off; Power operation mode ± (0.2 % R + 0.02 ) 70 °C; 1000 h ± (0.4 % R + 0.05 ) 70 °C; 8000 h Endurance at 125 °C; 1000 h ± (0.15 % R + 0.02 ) 4.25.3 - upper category 155 °C; 1000 h ± (0.3 % R + 0.02 ) temperature Damp heat, (40 ± 2) °C; 56 days; 4.24 78 (Cab) ± (0.1 % R + 0.02 ) steady state (93 ± 3) % RH Damp heat, (85 ± 2) °C steady state, (85 ± 5) % RH 4.37 67 (Cy) ± (0.5 % R + 0.05 ) accelerated U = 0.1 x P x R; 70 Standard operation mode U  0.3 x Umax.; 1000 h Revision: 30-Jan-2020 6 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS IEC 60068-2 (1) REQUIREMENTS EN 60115-1 TEST TEST PROCEDURE PERMISSIBLE CHANGE (R) CLAUSE METHOD STABILITY CLASS 0.25 OR BETTER (2) Stability for product types: MCS 0402 AT 47  to 221 k MCT 0603 AT 47  to 511 k MCU 0805 AT 47  to 1 M MCA 1206 AT 47  to 10 M Climatic sequence: 4.23 Standard operation mode 4.23.2 2 (Bb) Dry heat 125 °C; 16 h 55 °C; 24 h;  90 % RH; 4.23.3 30 (Db) Damp heat, cyclic 1 cycle ± (0.25 % R + 0.02 ) 4.23.4 1 (Ab) Cold -55 °C; 2 h 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 55 °C; 24 h;  90 % RH; 4.23.6 30 (Db) Damp heat, cyclic 5 cycles 4.23.7 - DC load U = P70 x R  Umax.; 1 min Storage at low - 1 (Aa) -55 °C; 2 h ± (0.05 % R + 0.01 ) temperature 30 min at -55 °C and Rapid change of 30 min at 155 °C; ± (0.25 % R + 0.02 ) temperature 1000 cycles 30 min at -40 °C; 4.19 14 (Na) 30 min at 125 °C (3); Extended rapid change MCS 0402 AT: 3000 cycles ± (0.25 % R + 0.05 ); of temperature MCT 0603 AT: 2000 cycles ( 50 % of initial shear force) MCU 0805 AT: 1500 cycles MCA 1206 AT: 1000 cycles U = 2.5 x P x R or 70 Short time overload: U = 2 × U ; 4.13 - max. ± (0.05 % R + 0.01 ) Standard operation mode whichever is the less severe; 5 s Severity no. 4: Single pulse high U = 10 x P x R or 70 4.27 - voltage overload: U = 2 x Umax.; ± (0.25 % R + 0.05) Standard operation mode whichever is the less severe; 10 pulses 10 μs/700 μs U = 15 x P x R or 70 Periodic electric U = 2 x U max. 4.39 - overload: whichever is the less severe; ± (0.5 % R + 0.05) Standard operation mode 0.1 s on; 2.5 s off; 1000 cycles IEC 61340-3-1 (1); 3 pos. + 3 neg. (equivalent to MIL-STD-883, Electro static discharge method 3015) 4.38 - ± (0.5 % R + 0.05) (human body model) MCS 0402 AT: 500 V MCT 0603 AT: 1000 V MCU 0805 AT: 1500 V MCA 1206 AT: 2000 V Revision: 30-Jan-2020 7 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag TEST PROCEDURES AND REQUIREMENTS IEC 60068-2 (1) REQUIREMENTS EN 60115-1 TEST TEST PROCEDURE PERMISSIBLE CHANGE (R) CLAUSE METHOD STABILITY CLASS 0.25 OR BETTER (2) Stability for product types: MCS 0402 AT 47  to 221 k MCT 0603 AT 47  to 511 k MCU 0805 AT 47  to 1 M MCA 1206 AT 47  to 10 M Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.05 % R + 0.01) 4.22 6 (Fc) Vibration no resonance; no visible damage amplitude  1.5 mm or 200 m/s2; 7.5 h Solder bath method; Good tinning ( 95 % covered); SnPb40; non-activated flux no visible damage (215 ± 3) °C; (3 ± 0.3) s 4.17 58 (Td) Solderability Solder bath method; SnAg3Cu0.5 or SnAg3.5; Good tinning (95 % covered); non-activated flux; no visible damage (235 ± 3) °C; (2 ± 0.2) s Resistance to Solder bath method; 4.18 58 (Td) ± (0.05 % R + 0.01) (4) soldering heat (260 ± 5) °C; (10 ± 1) s Component solvent Isopropyl alcohol +50 °C; 4.29 45 (XA) No visible damage resistance method 2 MCS 0402 AT and MCT 0603 AT; 9 N 4.32 21 (Ue ) Shear (adhesion) No visible damage 3 MCU 0805 AT and MCA 1206 AT; 45 N ± (0.05 % R + 0.01) 4.33 21 (Ue ) Substrate bending Depth 2 mm, 3 times no visible damage; 1 no open circuit in bent position 4.7 - Voltage proof U = U ; (60 ± 5) s No flashover or breakdown RMS ins IEC 60695-11-5 (1), 4.35 - Flammability No burning after 30 s needle flame test; 10 s Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their respective test conditions (3) Tested on a 4-layer printed circuit board with SAC micro alloy (4) For resistance values above 1 M in case size 1206: ± (0.10 % R + 0.01 ) Revision: 30-Jan-2020 8 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision www.vishay.com Vishay Beyschlag DIMENSIONS T t W W T H T b L DIMENSIONS AND MASS H L W W T T MASS TYPE / SIZE T t b (mm) (mm) (mm) (mm) (mm) (mm) (mg) MCS 0402 AT 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 0.6 MCT 0603 AT 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9 MCU 0805 AT 0.52 ± 0.1 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6 MCA 1206 AT 0.55 ± 0.1 3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2 SOLDER PAD DIMENSIONS G X Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G Y X Z G Y X Z (mm) (mm) (mm) (mm) (mm) (mm) (mm) (mm) MCS 0402 AT - - - - 0.35 0.55 0.55 1.45 MCT 0603 AT 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05 MCU 0805 AT 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70 MCA 1206 AT 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80 Notes • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1), or in publication IPC-7351 (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 30-Jan-2020 9 Document Number: 28785 For technical questions, contact: thinfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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