MCP73213 Dual-Cell Li-Ion/Li-Polymer Battery Charge Management Controller with Input Overvoltage Protection Features Description • Complete Linear Charge Management Controller: The MCP73213 is a highly integrated Li-Ion battery - Integrated Input Overvoltage Protection charge management controller for use in space-limited and cost-sensitive applications. The MCP73213 - Integrated Pass Transistor provides specific charge algorithms for dual-cell Li-Ion/ - Integrated Current Sense Li-Polymer batteries to achieve optimal capacity and - Integrated Reverse Discharge Protection safety in the shortest charging time possible. Along • Constant Current/Constant Voltage Operation with its small physical size, the low number of external with Thermal Regulation components makes the MCP73213 ideally suitable for • 4.15V Undervoltage Lockout (UVLO) portable applications. The absolute maximum voltage, • 13V Input Overvoltage Protection up to 18V, allows the use of MCP73213 in harsh environments, such as low-cost wall wart or voltage • High Accuracy Preset Voltage Regulation through spikes from plug/unplug. Full Temperature Range (–5°C to +55°C ±0.6%) The MCP73213 employs a constant current/constant • Battery Charge Voltage Options: voltage charge algorithm. The various charging voltage - 8.20V, 8.40V, 8.7V or 8.8V regulations provide design engineers flexibility to use in • Resistor Programmable Fast Charge Current: different applications. The fast charge, constant current - 130 mA-1100 mA value is set with one external resistor from 130 mA to • Preconditioning of Deeply Depleted Cells: 1100 mA. The MCP73213 limits the charge current based on die temperature during high-power or high- - Available Options: 10% or Disable ambient conditions. This thermal regulation optimizes • Integrated Precondition Timer: the charge cycle time while maintaining device - 32 Minutes or Disable reliability. • Automatic End-of-Charge Control: The PROG pin of the MCP73213 also serves as enable - Selectable Minimum Current Ratio: pin. When high impedance is applied, the MCP73213 5%, 7.5%, 10% or 20% will be in Standby mode. - Elapse Safety Timer: 4 hr., 6 hr., 8 hr. or The MCP73213 is fully specified over the ambient Disable temperature range of -40°C to +85°C. The MCP73213 • Automatic Recharge: is available in a 10-lead DFN package. - Available Options: 95% or Disable Package Types (Top View) • Factory Preset Charge Status Output: - On/Off or Flashing • Soft Start MCP73213 • Temperature Range: –40°C to +85°C 3x3 DFN * • Packaging: DFN-10 (3 mm x 3 mm) V 1 10 PROG DD V 2 9 V Applications VBDADT 3 E11P 8 VSSSS V 4 7 STAT BAT • Digital Camcorders NC 5 6 NC • Portable Media Players * Includes Exposed Thermal Pad (EP); see Table 3-1. • Ultra Mobile Personal Computers • Netbook Computers • Handheld Devices • Walkie-Talkie • Low-Cost 2-Cell Li-Ion/Li-Poly Chargers/Cradles  2009-2018 Microchip Technology Inc. DS20002190D-page 1

MCP73213 Typical Application 1 3 AC-DC-Adapter VDD VBAT + 4 2 V BAT C VDD 3 COUT IN R 1 LED 7 STAT 732 PROG 10 2L-i-CIoenll P Battery C 5 NC M 9 R V PROG SS 6 NC V 8 - SS DS20002190D-page 2  2009-2018 Microchip Technology Inc.

 TABLE 1: AVAILABLE FACTORY PRESET OPTIONS 2 00 Charge Preconditioning Preconditioning Precondition Elapse End-of-Charge Automatic Output 9 OVP -2 Voltage Charge Current Threshold Timer Timer Control Recharge Status 0 1 8 8.2V 13V Disable/10% 66.5%/71.5% Disable/ Disable/4 hr/ 5%/7.5%/ No/ Type 1/ M ic 32 Minimum 6 hr/8 hr 10%/20% Yes Type 2 ro c 8.4V 13V Disable/10% 66.5%/71.5% Disable/ Disable/4 hr/ 5%/7.5%/ No/ Type 1/ h ip 32 Minimum 6 hr/8 hr 10%/20% Yes Type 2 T ec 8.7V 13V Disable/10% 66.5%/71.5% Disable/ Disable/4 hr/ 5%/7.5%/ No/ Type 1/ h n 32 Minimum 6 hr/8 hr 10%/20% Yes Type 2 o lo g 8.8V 13V Disable/10% 66.5%/71.5% Disable/ Disable/4 hr/ 5%/7.5%/ No/ Type 1/ y In 32 Minimum 6 hr/8 hr 10%/20% Yes Type 2 c . Note 1: I : Regulated fast charge current. REG 2: V : Regulated charge voltage. REG 3: I /I : Preconditioning charge current; ratio of regulated fast charge current. PREG REG 4: I /I : End-of-Charge control; ratio of regulated fast charge current. TERM REG 5: V /V : Recharge threshold; ratio of regulated battery voltage. RTH REG 6: V /V : Preconditioning threshold voltage. PTH REG 7: Type 1: On/Off; Type 2: Flashing. Please refer to Table 5-2. TABLE 2: STANDARD SAMPLE OPTIONS Part V OVP I /I Precharge Elapse I /I V /V V /V Output REG PREG REG TERM REG RTH REG PTH REG Number Timer Timer Status MCP73213-B6S/MF 8.20V 13V 10% 32 Minimum 6 hr 10% 95% 71.5% Type 1 MCP73213-A6S/MF 8.40V 13V 10% 32 Minimum 6 hr 10% 95% 71.5% Type 1 Note 1: Customers should contact their distributor, representatives or field application engineer (FAE) for support and sample. Local sales offices are also avail- able to help customers. A listing of sales offices and locations is included at the back of this document. Technical support is available through the web site at: http://www.microchip.com/support M C D S P 2 0 0 7 0 21 3 9 0 2 D -p 1 a g e 3 3

MCP73213 Functional Block Diagram VOREG DIRECTION CONTROL VDD VBAT CURRENT LIMIT + VREF - G=0.001 PROG CA + REFERENCE, VREF (1.21V) BIAS, UVLO, - AND SHDN VOREG UVLO + - - PRECONDITION + TERM - + CHARGE CHARGE STAT CONTROL, + VA TIMER, AND - STATUS LOGIC VSS - 13V + VDD Input OverVP - 95% VREG - 110°C + VBAT + TSD *Recharge Thermal Regulation *Only available on selected options DS20002190D-page 4  2009-2018 Microchip Technology Inc.

MCP73213 1.0 ELECTRICAL † Notice: Stresses above those listed under “Maximum CHARACTERISTICS Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those Absolute Maximum Ratings† indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions V ......................................................................18.0V DD for extended periods may affect device reliability. V ...................................................................6.0V PROG All Inputs and Outputs w.r.t. V .....-0.3 to (V +0.3)V SS DD Maximum Junction Temperature, T .Internally Limited J Storage Temperature........................–65°C to +150°C ESD Protection on All Pins4 kV HBM ESD Protection on All Pins300V MM DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V (Typical) + 0.3V] to 12V, DD REG T = -40°C to +85°C. Typical values are at +25°C, V = [V (Typical) + 1.0V] A DD REG Parameters Sym. Min. Typ. Max. Units Conditions Supply Input Input Voltage Range V 4 — 16 V DD Operating Supply Voltage V 4.2 — 13 V DD Supply Current I — 4 5.5 μA Shutdown (V ≤ V – 150 mV) SS DD BAT — 700 1500 μA Charging — 50 125 μA Standby (PROG Floating) — 50 150 μA Charge Complete; No Battery; V < V DD STOP Battery Discharge Current Output Reverse Leakage I — 0.5 2 μA Standby (PROG Floating) DISCHARGE Current — 0.5 2 μA Shutdown (V ≤ V DD BAT or V < V ) DD STOP — 10 17 μA Charge Complete; V is present DD Undervoltage Lockout UVLO Start Threshold V 4.10 4.15 4.25 V START UVLO Stop Threshold V 4.00 4.05 4.10 V STOP UVLO Hysteresis V — 100 — mV HYS Overvoltage Protection OVP Start Threshold V 12.8 13 13.2 V OVP OVP Hysteresis V — 150 — mV OVPHYS Voltage Regulation (Constant Voltage Mode) Regulated Output Voltage V 8.15 8.20 8.25 V T = –5°C to +55°C REG A Options 8.35 8.40 8.45 V VDD = [VREG(Typical)+1V] I = 50 mA 8.65 8.70 8.75 V OUT 8.75 8.80 8.85 V Output Voltage Tolerance V –0.6 — 0.6 % RTOL Line Regulation V / — 0.05 0.20 %/V V = [V (Typical)+1V] to 12V BAT DD REG V )/V | I = 50 mA BAT DD OUT Load Regulation V /V | — 0.05 0.20 % I = 50 mA – 150 mA BAT BAT OUT V = [V (Typical)+1V] DD REG Note 1: Not production tested. Ensured by design.  2009-2018 Microchip Technology Inc. DS20002190D-page 5

MCP73213 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V (Typical) + 0.3V] to 12V, DD REG T = -40°C to +85°C. Typical values are at +25°C, V = [V (Typical) + 1.0V] A DD REG Parameters Sym. Min. Typ. Max. Units Conditions Supply Ripple Attenuation PSRR — –46 — dB I = 20 mA, 10 Hz to 1 kHz OUT — –30 — dB I = 20 mA, 10 Hz to 10 kHz OUT Battery Short Protection BSP Start Threshold V — 3.4 — V SHORT BSP Hysteresis V — 150 — mV BSPHYS BSP Regulation Current I — 25 — mA SHORT Current Regulation (Fast Charge, Constant-Current Mode) Fast Charge Current I 130 — 1100 mA T = –5°C to +55°C REG A Regulation 117 130 143 mA PROG = 10 k 900 1000 1100 mA PROG = 1.1 k Preconditioning Current Regulation (Trickle Charge Constant-Current Mode) Precondition Current I /I — 10 — % PROG = 1 kto 10 k PREG REG Ratio T =-5°C to +55°C A — 100 — % No Preconditioning Precondition Voltage V /V 64 66.5 69 % V Low-to-High PTH REG BAT Threshold Ratio 69 71.5 74 % V Low-to-High BAT Precondition Hysteresis V — 100 — mV V High-to-Low (Note 1) PHYS BAT Charge Termination Charge Termination I /I 3.7 5 6.3 % PROG = 1 kto 10 k TERM REG Current Ratio 5.6 7.5 9.4 % TA=–5°C to +55°C 7.5 10 12.5 % 15 20 25 % Automatic Recharge Recharge Voltage V /V 93 95.0 97 % V High-to-Low RTH REG BAT Threshold Ratio — 0 — % No Automatic Recharge Pass Transistor ON-Resistance ON-Resistance R — 350 — m V = 4.5V, T = 105°C (Note 1) DSON DD J Status Indicator - STAT Sink Current I — 20 35 mA SINK Low Output Voltage V — 0.2 0.5 V I = 4 mA OL SINK Input Leakage Current I — 0.001 1 μA High Impedance, V on pin LK DD PROG Input Charge Impedance R 1 — 22 k PROG Range Shutdown Impedance R — 200 — k Impedance for Shutdown PROG Automatic Power-Down Automatic Power-Down V V + 10 V + 50 — V V Falling PDENTRY BAT BAT DD Entry Threshold mV mV Automatic Power-Down V — V + 150 V + 250 V V Rising PDEXIT BAT BAT DD Exit Threshold mV mV Note 1: Not production tested. Ensured by design. DS20002190D-page 6  2009-2018 Microchip Technology Inc.

MCP73213 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V (Typical) + 0.3V] to 12V, DD REG T = -40°C to +85°C. Typical values are at +25°C, V = [V (Typical) + 1.0V] A DD REG Parameters Sym. Min. Typ. Max. Units Conditions Thermal Shutdown Die Temperature T — 150 — C SD Die Temperature T — 10 — C SDHYS Hysteresis Note 1: Not production tested. Ensured by design. AC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits apply for V = [V (Typical)+0.3V] to 12V, DD REG T =–40°C to +85°C. Typical values are at +25°C, V = [V (Typical)+1.0V] A DD REG Parameters Sym. Min. Typ. Max. Units Conditions Elapsed Timer Elapsed Timer Period t — 0 — Hours Timer Disabled EL- APSED 3.6 4.0 4.4 Hours 5.4 6.0 6.6 Hours 7.2 8.0 8.8 Hours Preconditioning Timer Preconditioning Timer Period t — 0 — Hours Disabled Timer PRECHG 0.4 0.5 0.6 Hours Status Indicator Status Output Turn-Off t — — 500 μs I = 1 mA to 0 mA OFF SINK (Note 1) Status Output Turn-On t — — 500 μs I = 0 mA to 1 mA ON SINK (Note 1) Note 1: Not production tested. Ensured by design. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits apply for V = [V (Typical) + 0.3V] to 6V. DD REG Typical values are at +25°C, V = [V (Typical) + 1.0V] DD REG Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Specified Temperature Range T –40 — +85 °C A Operating Temperature Range T –40 — +125 °C J Storage Temperature Range T –65 — +150 °C A Thermal Package Resistances Thermal Resistance, DFN-10LD  — 62 — °C/W 4-Layer JC51-7 Standard JA (3x3) Board, Natural Convection  — 20.5 — °C/W JC  2009-2018 Microchip Technology Inc. DS20002190D-page 7

MCP73213 NOTES: DS20002190D-page 8  2009-2018 Microchip Technology Inc.

MCP73213 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, V = [V (Typical) + 1V], T = +25°C, Constant Voltage mode. DD REG A FIGURE 2-1: Battery Regulation Voltage FIGURE 2-4: Battery Regulation Voltage (V ) vs. Supply Voltage (V ). (V ) vs. Ambient Temperature (T ). BAT DD BAT A FIGURE 2-2: Battery Regulation Voltage FIGURE 2-5: Charge Current (I ) vs. OUT (V ) vs. Supply Voltage (V ). Programming Resistor (R ). BAT DD PROG FIGURE 2-3: Battery Regulation Voltage FIGURE 2-6: Charge Current (I ) vs. OUT (V ) vs. Ambient Temperature (T ). Supply Voltage (V ). BAT A DD  2009-2018 Microchip Technology Inc. DS20002190D-page 9

MCP73213 TYPICAL PERFORMANCE CURVES (CONTINUED) Note: Unless otherwise indicated, V = [V (Typical) + 1V], T = +25°C, Constant-voltage mode. DD REG A FIGURE 2-7: Charge Current (I ) vs. FIGURE 2-10: Charge Current (I ) vs. OUT OUT Supply Voltage (V ). Ambient Temperature (T ). DD A FIGURE 2-8: Charge Current (I ) vs. FIGURE 2-11: Battery Short Protection OUT Supply Voltage (V ). Regulation Current (I ) vs. Ambient DD SHORT Temperature (T ). A 9.0 A) 8.0 µ 7.0 nt ( 6.0 e urr 5.0 End of Charge C 4.0 ge 3.0 ar 2.0 h sc 1.0 VDD< VBAT Di 0.0 V < V -1.0 DD STOP -5.0 5.0 15.0 25.0 35.0 45.0 55.0 Ambient Temperature (°C) FIGURE 2-9: Charge Current (I ) vs. FIGURE 2-12: Output Leakage Current OUT Ambient Temperature (T ). (I ) vs. Ambient Temperature (T ). A DISCHARGE A DS20002190D-page 10  2009-2018 Microchip Technology Inc.

MCP73213 TYPICAL PERFORMANCE CURVES (CONTINUED) Note: Unless otherwise indicated, V = [V (Typical) + 1V], T = +25°C, Constant-voltage mode. DD REG A 200 mA/div 2V/div 5V/div FIGURE 2-16: Input Overvoltage Protection FIGURE 2-13: Battery Voltage Accuracy (V ) vs. Supply Voltage (V ). (V = 5V/Div, V = 2V/Div, I = 200 mA/Div, Time: RTOL DD IN BAT LOAD 200 ms/Div) 12V Output Ripple (V) Source Voltage (V) 9.2V Output Current (mA) Output Ripple (V) FIGURE 2-14: Load Transient Response FIGURE 2-17: Line Transient Response (I = 50 mA/Div, Output: 100 mV/Div, Time: LOAD (I = 10 mA, V = 1V/Div, V = 100 mV/Div, 100 μs/Div). LOAD IN OUT Time: 100 μs/Div). 12V Source Voltage (V) 9.2V Output Ripple (V) FIGURE 2-15: Complete Charge Cycle. FIGURE 2-18: Line Transient Response (I = 100 mA, V = 1V/Div, V = 100 mV/ LOAD IN OUT Div, Time:100 μs/Div).  2009-2018 Microchip Technology Inc. DS20002190D-page 11

MCP73213 NOTES: DS20002190D-page 12  2009-2018 Microchip Technology Inc.

MCP73213 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP73213 Symbol I/O Description DFN-10 1, 2 V I Battery Management Input Supply Pin DD 3, 4 V I/O Battery Charge Control Output Pin BAT 5, 6 NC — No Connection Pin 7 STAT O Battery Charge Status Output Pin 8, 9 V — Battery Management 0V Reference Pin SS 10 PROG I/O Battery Charge Current Regulation Program and Charge Control Enable Pin 11 EP — Exposed Pad Pin 3.1 Battery Management Input Supply 3.5 Battery Management 0V Reference (V ) (V ) DD SS A supply voltage of [V (Typical) + 0.3V] to 13.0V is Connect to the negative terminal of the battery and REG recommended. Bypass to V with a minimum of 1 μF. input supply. SS The V pin is rated 18V absolute maximum to prevent DD a sudden rise in input voltage from spikes or low-cost 3.6 Current Regulation Set (PROG) AC-DC wall adapters from causing an over-voltage condition and damaging the device. The fast charge current is set by placing a resistor from PROG to V during constant current (CC) mode. SS 3.2 Battery Charge Control Output PROG pin also serves as charge control enable. When a typical 200 k impedance is applied to the PROG (V ) BAT pin, the MCP73213 will go into standby mode until the Connect to the positive terminal of the battery. Bypass high impedance is removed. Refer to Section 5.5 to V with a minimum of 1 μF to ensure loop stability “Constant-Current Mode - Fast Charge” for details. SS when the battery is disconnected. 3.7 Exposed Pad (EP) 3.3 No Connection (NC) Connect the Exposed Thermal Pad (EP) to the No connection. exposed copper area on the Printed Circuit Board (PCB) for thermal enhancement. Additional vias in the 3.4 Status Output (STAT) copper area under the MCP73213 device can improve heat dissipation performance and simplify the STAT is an open-drain logic output for connection to an assembly process. LED for charge status indication in stand-alone applications. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. Refer to Table 5-2 for a summary of the status output during a charge cycle.  2009-2018 Microchip Technology Inc. DS20002190D-page 13

MCP73213 NOTES: DS20002190D-page 14  2009-2018 Microchip Technology Inc.

MCP73213 4.0 DEVICE OVERVIEW The MCP73213 are simple, but fully integrated linear charge management controllers. Figure 4-1 depicts the operational flow algorithm. SHUTDOWN MODE VDD < VUVLO VDD < VPD or PROG > 200 k STAT = High Z VBAT < VPTH VDD < VOVP PRECONDITIONING MODE Timer Expired NoT CIMhEaRrg eF ACUuLrrTent Charge Current = IPREG STAT = Flashing (Type 2) STAT = LOW STAT = High Z (Type 1) Timer Reset Timer Suspended Timer Enable VDD > VOVP VDD > VOVP VBAT > VPTH VBAT > VPTH FAST CHARGE MODE OVERVNOo LCThAaGrgEe PCRuOrrTenEtCTION Charge Current = IREG Timer Expired STAT = LOW STAT = High Z TIMER FAULT Timer Suspended T iTmimere Er nRaebsleetd VBAT < VRTH No Charge Current STAT = Flashing (Type 2) STAT = High Z (Type 1) Timer Suspended VDD > VOVP VDD < VOVP VBAT = VREG VDD < VOVP CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT = LOW VBAT < ITERM Die Temperature < TSDHYS Charge Mode Resume CHARGE COMPLETE MODE VBAT > VSHORT No Charge Current Charge Mode Resume STAT = High Z Timer Reset Die Temperature > TSD VBAT < VSHORT TEMPERATURE FAULT No Charge Current BATTERY SHORT PROTECTION STAT = Flashing (Type 2) Charge Current = ISHORT STAT = High Z (Type 1) STAT = Flashing (Type 2) Timer Suspended STAT = High Z (Type 1) Timer Suspended FIGURE 4-1: The MCP73213 Flow Chart.  2009-2018 Microchip Technology Inc. DS20002190D-page 15

MCP73213 NOTES: DS20002190D-page 16  2009-2018 Microchip Technology Inc.

MCP73213 5.0 DETAILED DESCRIPTION 5.3.2 BATTERY CHARGE CONTROL OUTPUT (V ) BAT 5.1 Undervoltage Lockout (UVLO) The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73213 An internal undervoltage lockout (UVLO) circuit provides constant current and voltage regulation to the monitors the input voltage and keeps the charger in battery pack by controlling this MOSFET in the linear shutdown mode until the input supply rises above the region. The battery charge control output should be UVLO threshold. In the event a battery is present when connected to the positive terminal of the battery pack. the input power is applied, the input supply must rise approximately 150 mV above the battery voltage 5.3.3 BATTERY DETECTION before the MCP73213 device becomes operational. The MCP73213 detects the battery presence with The UVLO circuit places the device in shutdown mode charging of the output capacitor. The charge flow will if the input supply falls to approximately 150 mV above initiate when the voltage on V is pulled below the BAT the battery voltage.The UVLO circuit is always active. V threshold. Refer to Section 1.0 “Electrical RECHARGE Any time the input supply is below the UVLO threshold Characteristics” for V values. The value will RECHARGE or approximately 150 mV of the voltage at the VBAT pin, be the same for nonrechargeable devices. the MCP73213 device is placed in a shutdown mode. When V > V + Hysteresis, the charge will be BAT REG suspended (or not started, depending on the condition) 5.2 Overvoltage Protection (OVP) to prevent overcharging. An internal overvoltage protection (OVP) circuit monitors the input voltage and keeps the charger in 5.4 Preconditioning shutdown mode when the input supply rises above the typical 13V OVP threshold. The OVP hysteresis is If the voltage at the VBAT pin is less than the approximately 150 mV for the MCP73213 device. preconditioning threshold, the MCP73213 device enters a preconditioning mode. The preconditioning The MCP73213 device is operational between UVLO threshold is factory set. Refer to Section 1.0 and OVP thresholds. The OVP circuit is also recog- “Electrical Characteristics” for preconditioning nized as overvoltage lockout (OVLO). threshold options. In this mode, the MCP73213 device supplies 10% of 5.3 Charge Qualification the fast charge current (established with the value of When the input power is applied, the input supply must the resistor connected to the PROG pin) to the battery. rise 150 mV above the battery voltage before the When the voltage at the VBAT pin rises above the MCP73213 becomes operational. preconditioning threshold, the MCP73213 device The automatic power-down circuit places the device in enters the Constant Current (Fast Charge) mode. a shutdown mode if the input supply falls to within +50 mV of the battery voltage. Note: The MCP73213 device also offers options with no preconditioning. The automatic circuit is always active. At any time the input supply is within +50 mV of the voltage at the VBAT 5.4.1 TIMER EXPIRED DURING pin, the MCP73213 is placed in a shutdown mode. PRECONDITIONING MODE For a charge cycle to begin, the automatic If the internal timer expires before the voltage threshold power-down conditions must be met and the charge is reached for Fast Charge mode, a timer fault is enable input must be above the input high threshold. indicated and the charge cycle terminates. The MCP73213 device remains in this condition until the bat- 5.3.1 BATTERY MANAGEMENT INPUT tery is removed or input power is cycled. If the battery is SUPPLY (V ) DD removed, the MCP73213 device enters the Standby The VDD input is the input supply to the MCP73213. The mode, where it remains until a battery is reinserted. MCP73213 automatically enters a power-down mode if the voltage on the VDD input falls to within +50 mV of the Note: The typical preconditioning timer for battery voltage. This feature prevents draining the MCP73213 is 32 minutes. The battery pack when the VDD supply is not present. MCP73213 also offers options with no preconditioning timer.  2009-2018 Microchip Technology Inc. DS20002190D-page 17

MCP73213 5.5 Constant-Current Mode - Fast Constant-Current mode is maintained until the voltage Charge at the VBAT pin reaches the regulation voltage, VREG. When Constant Current mode is invoked, the internal During Constant-Current mode, the programmed timer is reset. charge current is supplied to the battery or load. 5.5.1 TIMER EXPIRED DURING The charge current is established using a single CONSTANT-CURRENT - FAST resistor from PROG to V . The program resistor and SS CHARGE MODE the charge current are calculated using the following equation: If the internal timer expires before the recharge voltage threshold is reached, a timer fault is indicated and the EQUATION 5-1: charge cycle terminates. The MCP73213 device remains in this condition until the battery is removed. If –0.93 IREG = 1104RPROG the battery is removed or input power is cycled, the MCP73213 device enters the Standby mode where it Where: remains until a battery is reinserted. R = kilohm (k) PROG I = milliampere (mA) 5.6 Constant-Voltage Mode REG When the voltage at the V pin reaches the BAT EQUATION 5-2: regulation voltage, V , constant voltage regulation REG begins. The regulation voltage is factory set to 8.2V, log1-I--R-1--E-0--G-4--–0.93 8.4V, 8.7V or 8.8V with a tolerance of ± 0.5%. R = 10 PROG Where: 5.7 Charge Termination R = kilohm (k) The charge cycle is terminated when, during Constant- PROG I = milliampere (mA) Voltage mode, the average charge current diminishes REG below a threshold established with the value of 5%, 7.5%, 10% or 20% of fast charge current or the internal Table 5-1 provides commonly seen E96 (1%) and E24 timer expires. A 1 ms filter time on the termination com- (5%) resistors for various charge current to reduce parator ensures that transient load conditions do not design time. result in premature charge cycle termination. The timer period is factory set and can be disabled. Refer to TABLE 5-1: RESISTOR LOOKUP TABLE Section 1.0 “Electrical Characteristics” for timer Charge Recommended Recommended period options. Current (mA) E96 Resistor () E24 Resistor () 130 10k 10k 5.8 Automatic Recharge 150 8.45k 8.20k The MCP73213 device continuously monitors the 200 6.20k 6.20k voltage at the VBAT pin in the charge complete mode. If 250 4.99k 5.10k the voltage drops below the recharge threshold, 300 4.02k 3.90k another charge cycle begins and current is once again supplied to the battery or load. The recharge threshold 350 3.40k 3.30k is factory set. Refer to Section 1.0 “Electrical 400 3.00k 3.00k Characteristics” for recharge threshold options. 450 2.61k 2.70k 500 2.32k 2.37k Note: The MCP73213 also offers options with 550 2.10k 2.20k no automatic recharge. 600 1.91k 2.00k For the MCP73213 device with no recharge option, the 650 1.78k 1.80k MCP73213 will go into Standby mode when the termi- 700 1.62k 1.60k nation condition is met. The charge will not restart until 750 1.50k 1.50k the following conditions have been met: 800 1.40k 1.50k • Battery is removed from the system and inserted 850 1.33k 1.30k again 900 1.24k 1.20k • VDD is removed and plugged in again 950 1.18k 1.20k • RPROG is disconnected (or high-impedance) and reconnected 1000 1.10k 1.10k 1100 1.00k 1.00k DS20002190D-page 18  2009-2018 Microchip Technology Inc.

MCP73213 5.9 Thermal Regulation TABLE 5-2: STATUS OUTPUTS The MCP73213 shall limit the charge current based on CHARGE CYCLE the die temperature. The thermal regulation optimizes STATE STAT the charge cycle time while maintaining device reliability. Figure 5-1 depicts the thermal regulation for Shutdown High Z the MCP73213 device. Refer to Section 1.0 Standby High Z “Electrical Characteristics” for thermal package Preconditioning L resistances and Section 6.1.1.2 “Thermal Constant Current Fast L Considerations” for calculating power dissipation. Charge . Constant Voltage L Charge Complete - Standby High Z Temperature Fault 1.6 second 50% D.C. Flashing (Type 2) High Z (Type 1) Timer Fault 1.6 second 50% D.C. Flashing (Type 2) High Z (Type 1) Preconditioning Timer Fault 1.6 second 50% D.C. Flashing (Type 2) High Z (Type 1) 5.12 Battery Short Protection FIGURE 5-1: Thermal Regulation. Once a single-cell Li-Ion battery is detected, an internal battery short protection (BSP) circuit starts monitoring 5.10 Thermal Shutdown the battery voltage. When VBAT falls below a typical 1.7V battery short protection threshold voltage, the The MCP73213 suspends charge if the die charging behavior is postponed. A typical 25 mA temperature exceeds +150°C. Charging will resume detection current is supplied for recovering from the when the die temperature has cooled by approximately battery short condition. 10°C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the Preconditioning mode resumes when VBAT raises above the battery short protection threshold. The bat- thermal regulation circuitry. tery voltage must rise approximately 150 mV above the battery short protection voltage before the MCP73213 5.11 Status Indicator device becomes operational. The charge status outputs are open-drain outputs with two different states: Low (L), and High-Impedance (High Z). The charge status outputs can be used to illuminate LEDs. Optionally, the charge status outputs can be used as an interface to a host microcontroller. Table 5-2 summarizes the state of the status outputs during a charge cycle.  2009-2018 Microchip Technology Inc. DS20002190D-page 19

MCP73213 NOTES: DS20002190D-page 20  2009-2018 Microchip Technology Inc.

MCP73213 6.0 APPLICATIONS The MCP73213 is designed to operate in conjunction with a host microcontroller or in stand-alone applications. The MCP73213 provides the preferred charge algorithm for dual Lithium-Ion or Lithium-Polymer cells: Constant Current followed by Constant Voltage. Figure 6-1 depicts a typical stand-alone application circuit, while Figure 6-2 depicts the accompanying charge profile. 1 3 AC-DC-Adapter VDD VBAT + 4 2 V BAT CIN RLED 7 VDD 213 10 COUT 2-Cell STAT 73 PROG Li-Ion P Battery C 5 NC M 9 R V PROG SS 6 NC V 8 - SS FIGURE 6-1: Typical Application Circuit. FIGURE 6-2: Typical Charge Profile (875 mAh Li-Ion Battery).  2009-2018 Microchip Technology Inc. DS20002190D-page 21

MCP73213 6.1 Application Circuit Design Power dissipation with a 9V, ±10% input voltage source, 350 mA ±10% and preconditioning threshold Due to the low efficiency of linear charging, the most voltage at 6V is: important factors are thermal design and cost, which are a direct function of the input voltage, output current EQUATION 6-2: and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is Power dissipation = 9.9V–6.0V385 mA = 1.50W when the device has transitioned from the Preconditioning mode to the Constant Current mode. In This power dissipation with the battery charger in the this situation, the battery charger has to dissipate the DFN-10 package will result approximately 93C above maximum power. A trade-off must be made between room temperature. the charge current, cost and thermal requirements of the charger. 6.1.1.3 External Capacitors 6.1.1 COMPONENT SELECTION The MCP73213 is stable with or without a battery load. In order to maintain good AC stability in Constant-Volt- Selection of the external components in Figure 6-1 is age mode, a minimum capacitance of 1 μF is crucial to the integrity and reliability of the charging recommended to bypass the V pin to V . This system. The following discussion is intended as a guide BAT SS capacitance provides compensation when there is no for the component selection process. battery load. In addition, the battery and 6.1.1.1 Charge Current interconnections appear inductive at high frequencies. These elements are in the control feedback loop during The preferred fast charge current for Li-Ion/Li-Poly cells Constant Voltage mode. Therefore, bypass is below the 1C rate, with an absolute maximum current capacitance may be necessary to compensate for the at the 2C rate. The recommended fast charge cur- inductive nature of the battery pack. rent should be obtained from the battery manufacturer. For example, a 500 mAh battery pack For typical applications, it is recommended to apply a with 0.7C preferred fast charge current has a charge minimum of 16V rated 1 μF to the output capacitor and current of 350 mA. Charging at this rate provides the a minimum of 25V rated 1 μF to the input capacitor. shortest charge cycle times without degradation to the battery pack performance or life. TABLE 6-1: MLCC CAPACITOR EXAMPLE MLCC Temperature Note: Please consult with your battery supplier Tolerance Capacitors Range or refer to the battery data sheet for the preferred charge rate. X7R -55C to +125C ±15% X5R -55C to +85C ±15% 6.1.1.2 Thermal Considerations The worst-case power dissipation in the battery Virtually any good quality output filter capacitor can be charger occurs when the input voltage is at the used independent of the capacitor’s minimum Effective maximum and the device has transitioned from Series Resistance (ESR) value. The actual value of the Preconditioning mode to Constant-Current mode. In capacitor (and its associated ESR) depends on the out- this case, the power dissipation is: put load current. A 1 μF ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient EQUATION 6-1: to ensure stability. PowerDissipation = V –V I DDMAX PTHMIN REGMAX 6.1.1.4 Reverse-Blocking Protection Where: The MCP73213 provides protection from a faulted or V = the maximum input voltage shorted input. Without the protection, a faulted or DDMAX shorted input would discharge the battery pack through I = the maximum fast charge current REGMAX the body diode of the internal pass transistor. V = the minimum transition threshold PTHMIN voltage DS20002190D-page 22  2009-2018 Microchip Technology Inc.

MCP73213 6.2 PCB Layout Issues For optimum voltage regulation, place the battery pack as close as possible to the device’s V and V pins BAT SS to minimize voltage drops along the high-current- carrying PCB traces. If the PCB layout is used as a heatsink, adding multiple vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the junction temperature. Figures 6-4 and 6-5 depict a typical layout with PCB heatsinking. FIGURE 6-5: Typical Layout (Bottom). 102-00261 MCP73213EV FIGURE 6-3: Typical Layout (Top). FIGURE 6-4: Typical Layout (Top Metal).  2009-2018 Microchip Technology Inc. DS20002190D-page 23

MCP73213 NOTES: DS20002190D-page 24  2009-2018 Microchip Technology Inc.

MCP73213 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 10-Lead DFN (3x3) Example: Standard * Z3HI XXXX Part Number Code 1443 YYWW MCP73213-A6SI/MF Z3HI 256 NNN MCP73213T-A6SI/MF Z3HI MCP73213-B6SI/MF Y3HI MCP73213T-B6SI/MF Y3HI Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC® designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2009-2018 Microchip Technology Inc. DS20002190D-page 25

MCP73213 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002190D-page 26  2009-2018 Microchip Technology Inc.

MCP73213 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2009-2018 Microchip Technology Inc. DS20002190D-page 27

MCP73213 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002190D-page 28  2009-2018 Microchip Technology Inc.

MCP73213 APPENDIX A: REVISION HISTORY Revision D (January 2018) The following is the list of modifications: 1. Changed captions for Figure 2-16, Figure 2-17, Figure 2-18. 2. Minor typographical corrections. Revision C (December 2014) The following is the list of modifications: 1. Added Note 7 in Table 1 regarding the Type 1 and Type 2 descriptions. 2. Updated the Functional Block Diagram. 3. Updated the thermal resistances in the Temperature Specifications. 4. Changed captions for the Figures 2-7, 2-8, 2-15, 2-16. 5. Updated Figure 4-1. 6. Updated Section 6.1.1.2, Thermal Considerations. 7. Updated Section 7.1, Package Marking Information. 8. Minor typographical corrections. Revision B (December 2009) The following is the list of modifications: 1. Updated the Battery Short Protection values in the DC Characteristics table. Revision A (July 2009) • Original Release of this Document.  2009-2018 Microchip Technology Inc. DS20002190D-page 29

MCP73213 NOTES: DS20002190D-page 30  2009-2018 Microchip Technology Inc.

MCP73213 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Examples: PART NO. [X](1) X /XX XXX a) MCP73213-A6SI/MF: Dual Cell Li-Ion/ Device Tape and Reel Temperature Package Pattern Li-Polymer Battery Device Option Range b) MCP73213-B6SI/MF: Dual Cell Li-Ion/ Li-Polymer Battery Device c) MCP73213T-A6SI/MF:Tape and Reel, Device: MCP73213-xxx: Dual Cell Li-Ion/Li-Polymer Battery Device Dual Cell Li-Ion/ MCP73213T-xxx: Dual Cell Li-Ion/Li-Polymer Battery Device, Li-Polymer Battery Device Tape and Reel d) MCP73213T-B6SI/MF:Tape and Reel, Dual Cell Li-Ion/ Tape and Reel T = Tape and Reel(1) Li-Polymer Battery Device Option: Note1: Tape and Reel identifier only appears in the catalog part number description. This identifier Temperature I = -40C to +85C (Industrial) is used for ordering purposes and is not Range: printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. Package: MF = 10-Lead Plastic Dual Flat, No Lead - 3x3 mm Body (DFN)  2009-2018 Microchip Technology Inc. DS20002190D-page 31

MCP73213 NOTES: DS20002190D-page 32  2009-2018 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, AnyRate, AVR, and may be superseded by updates. It is your responsibility to AVR logo, AVR Freaks, BeaconThings, BitCloud, chipKIT, chipKIT ensure that your application meets with your specifications. logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, MICROCHIP MAKES NO REPRESENTATIONS OR Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK WARRANTIES OF ANY KIND WHETHER EXPRESS OR MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST IMPLIED, WRITTEN OR ORAL, STATUTORY OR logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 OTHERWISE, RELATED TO THE INFORMATION, logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, INCLUDING BUT NOT LIMITED TO ITS CONDITION, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are QUALITY, PERFORMANCE, MERCHANTABILITY OR registered trademarks of Microchip Technology Incorporated in FITNESS FOR PURPOSE. Microchip disclaims all liability the U.S.A. and other countries. arising from this information and its use. Use of Microchip ClockWorks, The Embedded Control Solutions Company, devices in life support and/or safety applications is entirely at EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, the buyer’s risk, and the buyer agrees to defend, indemnify and mTouch, Precision Edge, and Quiet-Wire are registered hold harmless Microchip from any and all damages, claims, trademarks of Microchip Technology Incorporated in the U.S.A. suits, or expenses resulting from such use. No licenses are Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any conveyed, implicitly or otherwise, under any Microchip Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, intellectual property rights unless otherwise stated. CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter- Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Silicon Storage Technology is a registered trademark of Microchip Tempe, Arizona; Gresham, Oregon and design centers in California Technology Inc. in other countries. and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping GestIC is a registered trademark of Microchip Technology devices, Serial EEPROMs, microperipherals, nonvolatile memory and Germany II GmbH & Co. KG, a subsidiary of Microchip Technology analog products. In addition, Microchip’s quality system for the design Inc., in other countries. and manufacture of development systems is ISO 9001:2000 certified. All other trademarks mentioned herein are property of their respective companies. © 2009-2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2559-5  2009-2018 Microchip Technology Inc. DS20002190D-page 33

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