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MCP1703T-5002E/MC产品简介:

ICGOO电子元器件商城为您提供MCP1703T-5002E/MC由Microchip设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 MCP1703T-5002E/MC价格参考。MicrochipMCP1703T-5002E/MC封装/规格:PMIC - 稳压器 - 线性, Linear Voltage Regulator IC Positive Fixed 1 Output 5V 250mA 8-DFN (2x3)。您可以下载MCP1703T-5002E/MC参考资料、Datasheet数据手册功能说明书,资料中有MCP1703T-5002E/MC 详细功能的应用电路图电压和使用方法及教程。

产品参数 图文手册 常见问题
参数 数值
产品目录

集成电路 (IC)

描述

IC REG LDO 5V 0.25A 8DFN

产品分类

PMIC - 稳压器 - 线性

品牌

Microchip Technology

数据手册

http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en530937http://www.microchip.com/mymicrochip/filehandler.aspx?ddocname=en023833

产品图片

产品型号

MCP1703T-5002E/MC

rohs

无铅 / 符合限制有害物质指令(RoHS)规范要求

产品系列

-

产品目录页面

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供应商器件封装

8-DFN(2x3)

其它名称

MCP1703T-5002E/MCTR
MCP1703T5002EMC

包装

带卷 (TR)

安装类型

表面贴装

封装/外壳

8-VFDFN 裸露焊盘

工作温度

-40°C ~ 125°C

标准包装

3,300

电压-跌落(典型值)

0.33V @ 250mA

电压-输入

最高 16V

电压-输出

5V

电流-输出

250mA

电流-限制(最小值)

-

稳压器拓扑

正,固定式

稳压器数

1

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PDF Datasheet 数据手册内容提取

MCP1703 250 mA, 16V, Low Quiescent Current LDO Regulator Features Description • 2.0µA Typical Quiescent Current The MCP1703 is a family of CMOS low dropout (LDO) • Input Operating Voltage Range: 2.7V to16.0V voltage regulators that can deliver up to 250mA of current while consuming only 2.0µA of quiescent • 250mA Output Current for Output Voltages ≥2.5V current (typical). The input operating range is specified • 200mA Output Current for Output Voltages <2.5V from 2.7V to 16.0V, making it an ideal choice for two to • Low Drop Out Voltage, 625mV typical @ 250mA six primary cell battery-powered applications, 9V for VR = 2.8V alkaline and one or two cell Li-Ion-powered • 0.4% Typical Output Voltage Tolerance applications. • Standard Output Voltage Options: The MCP1703 is capable of delivering 250mA with - 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, only 625mV (typical) of input to output voltage 5.0V differential (V =2.8V). The output voltage tolerance OUT • Output voltage range: 1.2V to 5.5V in 0.1V of the MCP1703 is typically ±0.4% at +25°C and ±3% increments (50mV increments available upon maximum over the operating junction temperature request) range of -40°C to +125°C. Line regulation is ±0.1% typical at +25°C. • Stable with 1.0µF to 22µF ceramic output capacitance Output voltages available for the MCP1703 range from • Short-Circuit Protection 1.2V to 5.5V. The LDO output is stable when using only 1µF of output capacitance. Ceramic, tantalum, or • Overtemperature Protection aluminum electrolytic capacitors can all be used for input and output. Overcurrent limit and overtemperature Applications shutdown provide a robust solution for any application. • Battery-powered Devices Package options include the SOT-223-3, SOT-23A, • Battery-powered Alarm Circuits 2x3DFN-8, and SOT-89-3. • Smoke Detectors Package Types • CO2 Detectors • Pagers and Cellular Phones 2x3DFN-8 * 3-Pin SOT-23A • Smart Battery Packs • Low Quiescent Current Voltage Reference VOUT 1 8 VIN VIN • PDAs NC 2 EP 7 NC 3 9 • Digital Cameras NC 3 6 NC • Microcontroller Power GND 4 5 NC 1 2 • Solar-Powered Instruments GND V • Consumer Products OUT • Battery Powered Data Loggers 3-Pin SOT-89 SOT-223-3 Related Literature V IN • AN765, “Using Microchip’s Micropower LDOs”, DS00765, Microchip Technology Inc., 2002 • AN766, “Pin-Compatible CMOS Upgrades to BiPolar LDOs”, DS00766, 1 2 3 1 2 3 Microchip Technology Inc., 2002 • AN792, “A Method to Determine How Much GNDVIN VOUT VIN GND VOUT Power a SOT23 Can Dissipate in an Application”, * Includes Exposed Thermal Pad (EP); see Table3-1. DS00792, Microchip Technology Inc., 2001 © 2009 Microchip Technology Inc. DS22049D-page 1

MCP1703 Functional Block Diagrams MCP1703 V V IN OUT Error Amplifier +V IN Voltage - Reference + Overcurrent Overtemperature GND Typical Application Circuits MCP1703 V OUT 3.3V V OUT I OUT COUT 50mA VIN 1µF Ceramic VIN VIN 9V + C IN Battery 1µF Ceramic GND DS22049D-page 2 © 2009 Microchip Technology Inc.

MCP1703 1.0 ELECTRICAL † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is CHARACTERISTICS a stress rating only and functional operation of the device at those or any other conditions above those indicated in the Absolute Maximum Ratings † operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods VDD..................................................................................+18V may affect device reliability. All inputs and outputs w.r.t. .............(V -0.3V) to (V +0.3V) SS IN Peak Output Current...................................................500mA Storage temperature.....................................-65°C to +150°C Maximum Junction Temperature.................................+150°C ESD protection on all pins (HBM;MM)...............≥ 4kV; ≥ 400V DC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for V = V + V , Note1, IN OUT(MAX) DROPOUT(MAX) I = 100µA, C = 1µF (X7R), C = 1µF (X7R), T = +25°C. LOAD OUT IN A Boldface type applies for junction temperatures, T (Note7) of -40°C to +125°C. J Parameters Symbol Min Typ Max Units Conditions Input / Output Characteristics Input Operating Voltage V 2.7 — 16.0 V Note1 IN Input Quiescent Current I — 2.0 5 µA I = 0mA q L Maximum Output Current I 250 — — mA For V ≥ 2.5V OUT_mA R 50 100 — mA For V < 2.5V, V ≥ 2.7V R IN 100 130 — mA For V < 2.5V, V ≥ 2.95V R IN 150 200 — mA For V < 2.5V, V ≥ 3.2V R IN 200 250 — mA For V < 2.5V, V ≥ 3.45V R IN Output Short Circuit Current I — 400 — mA V = V (Note1), V = GND, OUT_SC IN IN(MIN) OUT Current (average current) measured 10ms after short is applied. Output Voltage Regulation V V -3.0% V ±0.4 V +3.0% V Note2 OUT R R R V -2.0% % V +2.0% R R V Temperature Coefficient TCV — 50 — ppm/°C Note3 OUT OUT Line Regulation ΔV / -0.3 ±0.1 +0.3 %/V (V + V ) ≤ V OUT OUT(MAX) DROPOUT(MAX) IN (V XΔV ) ≤ 16V, Note1 OUT IN Load Regulation ΔV /V -2.5 ±1.0 +2.5 % I = 1.0mA to 250mA for V >= 2.5V OUT OUT L R I = 1.0mA to 200mA for V < 2.5V L R V = 3.65V, Note4 IN Note 1: The minimum V must meet two conditions: V ≥ 2.7V and V ≥ (V + V ). IN IN IN OUT(MAX) DROPOUT(MAX) 2: V is the nominal regulator output voltage. For example: V = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. R R The input voltage V = V + V or Vi = 2.7V (whichever is greater); I = 100µA. IN OUT(MAX) DROPOUT(MAX) IN OUT 3: TCV = (V - V ) *106 / (V * ΔTemperature), V = highest voltage measured over the OUT OUT-HIGH OUT-LOW R OUT-HIGH temperature range. V = lowest voltage measured over the temperature range. OUT-LOW 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCV . OUT 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of V + V or 2.7V, whichever is greater. OUT(MAX) DROPOUT(MAX) 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., T , T , θ ). Exceeding the maximum allowable power A J JA dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. © 2009 Microchip Technology Inc. DS22049D-page 3

MCP1703 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise specified, all limits are established for V = V + V , Note1, IN OUT(MAX) DROPOUT(MAX) I = 100µA, C = 1µF (X7R), C = 1µF (X7R), T = +25°C. LOAD OUT IN A Boldface type applies for junction temperatures, T (Note7) of -40°C to +125°C. J Parameters Symbol Min Typ Max Units Conditions Dropout Voltage V — 330 650 mV I = 250mA, V = 5.0V DROPOUT L R Note1, Note5 — 525 725 mV I = 250mA, 3.3V ≤ V < 5.0V L R — 625 975 mV I = 250mA, 2.8V ≤ V < 3.3V L R — 750 1100 mV I = 250mA, 2.5V ≤ V < 2.8V L R — — — mV V < 2.5V, See Maximum Output R Current Parameter Output Delay Time T — 1000 — µs V = 0V to 6V, V = 90% V , DELAY IN OUT R R = 50Ω resistive L Output Noise e — 8 µV/(Hz)1/2 I = 50mA, f = 1kHz, C = 1µF N L OUT Power Supply Ripple PSRR — 44 — dB f = 100Hz, C = 1µF, I = 100µA, OUT L Rejection Ratio V = 100mV pk-pk, C = 0µF, INAC IN V =1.2V R Thermal Shutdown Protection T — 150 — °C SD Note 1: The minimum V must meet two conditions: V ≥ 2.7V and V ≥ (V + V ). IN IN IN OUT(MAX) DROPOUT(MAX) 2: V is the nominal regulator output voltage. For example: V = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V. R R The input voltage V = V + V or Vi = 2.7V (whichever is greater); I = 100µA. IN OUT(MAX) DROPOUT(MAX) IN OUT 3: TCV = (V - V ) *106 / (V * ΔTemperature), V = highest voltage measured over the OUT OUT-HIGH OUT-LOW R OUT-HIGH temperature range. V = lowest voltage measured over the temperature range. OUT-LOW 4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCV . OUT 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured value with an applied input voltage of V + V or 2.7V, whichever is greater. OUT(MAX) DROPOUT(MAX) 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., T , T , θ ). Exceeding the maximum allowable power A J JA dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant. TEMPERATURE SPECIFICATIONS1 Parameters Sym Min Typ Max Units Conditions Temperature Ranges Operating Junction Temperature Range T -40 — +125 °C Steady State J Maximum Junction Temperature T — — +150 °C Transient J Storage Temperature Range T -65 — +150 °C A Thermal Package Resistance (Note2) Thermal Resistance, 3LD SOT-223 θ — 62 — EIA/JEDEC JESD51-7 JA °C/W θ — 15 — FR-4 0.063 4-Layer Board JC Thermal Resistance, 3LD SOT-23A θ — 336 — EIA/JEDEC JESD51-7 JA °C/W θ — 110 — FR-4 0.063 4-Layer Board JC Thermal Resistance, 3LD SOT-89 θ — 153,3 — EIA/JEDEC JESD51-7 JA °C/W θ — 100 — FR-4 0.063 4-Layer Board JC Thermal Resistance, 8LD 2x3DFN θ — 93 — EIA/JEDEC JESD51-7 JA °C/W θ — 26 — FR-4 0.063 4-Layer Board JC Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., T , T , θ ). Exceeding the maximum allowable power A J JA dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability. 2: Thermal Resistance values are subject to change. Please visit the Microchip Website for the latest packaging information. DS22049D-page 4 © 2009 Microchip Technology Inc.

MCP1703 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated: V = 1.8V, C = 1µF Ceramic (X7R), C = 1µF Ceramic (X7R), I = 100µA, R OUT IN L T = +25°C, V = V + V or 2.7V, whichever is greater. A IN OUT(MAX) DROPOUT(MAX) Note: Junction Temperature (T) is approximated by soaking the device under test to an ambient temperature equal to the desired junction J temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant. 6.00 120 VOUT = 1.2V VOUT = 1.2V urrent (µA) 45..0000 -45°C +130°C IOUT = 0 µA ent (µA) 10800 VIN = 2.7V nt C 3.00 +25°C +90°C Curr 60 ce 2.00 D 40 s N uie 1.00 G 20 Q 0°C 0.00 0 2 4 6 8 10 12 14 16 18 0 40 80 120 160 200 Input Voltage (V) Load Current (mA) FIGURE 2-1: Quiescent Current vs. Input FIGURE 2-4: Ground Current vs. Load Voltage. Current. 6.00 120 VOUT = 2.5V VOUT = 5.0V A) 5.00 IOUT = 0 µA 100 VIN = 6.0V escent Current (µ 234...000000 +90°C +130°C-45°C +25°C GND Current (µA) 468000 VVOINU =T =3 .25.V5V ui 1.00 20 Q 0°C 0.00 0 2 4 6 8 10 12 14 16 18 0 50 100 150 200 250 Input Voltage (V) Load Current (mA) FIGURE 2-2: Quiescent Current vs. Input FIGURE 2-5: Ground Current vs. Load Voltage. Current. 6.00 3.00 µA) 5.00 VIOOUUTT = = 0 5 µ.0AV µA) 2.50 VVOINU =T =3 .25.V5V VVOINU =T =2 .17.V2V IOUT = 0 mA nt ( 0°C nt ( 2.00 Curre 4.00 +130°C -45°C Curre 1.50 nt 3.00 nt uiesce 2.00 +90°C +25°C uiesce 01..5000 VVOINU =T =6 .50.V0V Q Q 1.00 0.00 6 8 10 12 14 16 18 -45 -20 5 30 55 80 105 130 Input Voltage (V) Junction Temperature (°C) FIGURE 2-3: Quiescent Current vs. Input FIGURE 2-6: Quiescent Current vs. Voltage. Junction Temperature. © 2009 Microchip Technology Inc. DS22049D-page 5

MCP1703 Note: Unless otherwise indicated: V = 1.8V, C = 1µF Ceramic (X7R), C = 1µF Ceramic (X7R), I = 100µA, R OUT IN L T = +25°C, V = V + V or 2.7V, whichever is greater. A IN OUT(MAX) DROPOUT(MAX) 1.240 1.24 VOUT = 1.2V 1.230 ILOAD = 0.1 mA 1.23 V) -45°C V) -45°C 0°C +25°C e ( 1.220 0°C e ( 1.22 g g a a olt 1.210 olt 1.21 +90°C V V utput 1.200 +90°C +130°C utput 1.20 +130°C O 1.190 +25°C O 1.19 VIN= 3.0V VOUT= 1.2V 1.180 1.18 2 4 6 8 10 12 14 16 18 0 20 40 60 80 100 120 140 160 180 200 Input Voltage (V) Load Current (mA) FIGURE 2-7: Output Voltage vs. Input FIGURE 2-10: Output Voltage vs. Load Voltage. Current. 2.58 2.54 2.56 VILOOUADT == 20..51V mA 2.53 VVIONU =T =3 .25.V5V ge (V) 2.54 +130°C +90°C ge (V) 22..5512 +90°C +25°C olta 2.52 olta 2.50 ut V 2.50 ut V 2.49 Outp 2.48 +25°C 0°C -45°C Outp 2.48 0°C +130°C 2.46 2.47 -45°C 2.44 2.46 2 4 6 8 10 12 14 16 18 0 50 100 150 200 250 Input Voltage (V) Load Current (mA) FIGURE 2-8: Output Voltage vs. Input FIGURE 2-11: Output Voltage vs. Load Voltage. Current. 5.16 5.06 VOUT = 5.0V VIN = 6V V) 5.12 ILOAD = 0.1 mA V) 5.04 +130°C +90°C VOUT = 5.0V ge ( 5.08 +130°C +90°C ge ( 5.02 a 5.04 a 5.00 olt olt Output V 45..9060 +25°C 0°C -45°C Output V 44..9968 +25°C -45°C 0°C 4.92 4.94 4.88 4.92 6 8 10 12 14 16 18 0 50 100 150 200 250 Input Voltage (V) Load Current (mA) FIGURE 2-9: Output Voltage vs. Input FIGURE 2-12: Output Voltage vs. Load Voltage. Current. DS22049D-page 6 © 2009 Microchip Technology Inc.

MCP1703 Note: Unless otherwise indicated: V = 1.8V, C = 1µF Ceramic (X7R), C = 1µF Ceramic (X7R), I = 100µA, R OUT IN L T = +25°C, V = V + V or 2.7V, whichever is greater. A IN OUT(MAX) DROPOUT(MAX) 1.00 0.90 VOUT = 2.5V V) 0.80 +130°C e ( 0.70 +90°C g a 0.60 olt 0.50 +25°C V ut 0.40 +0°C po 0.30 -45°C Dro 0.20 0.10 0.00 0 25 50 75 100 125 150 175 200 225 250 Load Current (mA) FIGURE 2-13: Dropout Voltage vs. Load FIGURE 2-16: Dynamic Line Response. Current. 0.50 900 0.45 VOUT = 5.0V A) 800 VOUT = 2.5V oltage (V) 0000....23345050 +25°C+90°C +130°C Current (m 567000000 ROUT < 0.1? Dropout V 0000....01125050 -45°C +0°C hort Circuit 123400000000 S 0.00 0 0 25 50 75 100 125 150 175 200 225 250 2 4 6 8 10 12 14 16 18 Load Current (mA) Input Voltage (V) FIGURE 2-14: Dropout Voltage vs. Load FIGURE 2-17: Short Circuit Current vs. Current. Input Voltage. 1.00 n (%) 00..8900 VIN = V12INV = 6V VIOOUUTT = = 1 1 m.2AV to 200 mA o 0.70 ati ul 0.60 g Re 0.50 oad 0.40 VIN = 16V VIN = 14V L 0.30 VIN = 3.8V VIN = 3.2V 0.20 -45 -20 5 30 55 80 105 130 Temperature (°C) FIGURE 2-15: Dynamic Line Response. FIGURE 2-18: Load Regulation vs. Temperature. © 2009 Microchip Technology Inc. DS22049D-page 7

MCP1703 Note: Unless otherwise indicated: V = 1.8V, C = 1µF Ceramic (X7R), C = 1µF Ceramic (X7R), I = 100µA, R OUT IN L T = +25°C, V = V + V or 2.7V, whichever is greater. A IN OUT(MAX) DROPOUT(MAX) 1.20 0.20 Regulation (%) 00001.....2468000000 VIN = 16V VIOOUUTT = = 1 2 m.5AV toV 2IN5 =0 6mVA egulation (%/V) 000...011826 200 mA 250 mA VIN = 3V.O5UVT t=o 2 1.56VV Load -00..2000 VIN = 3.5V VIN = 12V Line R 0.04 0 mA 100 mA VIN = 14V -0.40 0.00 -45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130 Temperature (°C) Temperature (°C) FIGURE 2-19: Load Regulation vs. FIGURE 2-22: Line Regulation vs. Temperature. Temperature. 1.00 0.18 VOUT = 5.0V VOUT = 5.0V %) 0.80 VIN = 16V IOUT = 1 to 250 mA V) 0.16 VIN = 6.0V to 16.0V ulation ( 00..4600 VIN = 6V VIN = 12V ation (%/ 00..1124 200mA 250 mA Reg 0.20 gul d 0.00 VIN = 8V Re 0.10 Loa -0.20 VIN = 14V Line 0.08 0 mA 100 mA -0.40 0.06 -45 -20 5 30 55 80 105 130 -45 -20 5 30 55 80 105 130 Temperature (°C) Temperature (°C) FIGURE 2-20: Load Regulation vs. FIGURE 2-23: Line Regulation vs. Temperature. Temperature. 0.16 0 V) 0.14 VVIONU =T =3 .10. 2toV 16.0V -10 %/ 0.12 -20 gulation ( 000...001680 200 mA 1 mA RR (dB)---543000 VR=1.2V Re 0 mA PS-60 VIN=2.7V Line 00..0024 100 mA -70 VCIINNA=C0 =μ F100 mV p-p -80 IOUT=100 µA 0.00 -90 -45 -20 5 30 55 80 105 130 0.01 0.1 1 10 100 1000 Temperature (°C) Frequency (kHz) FIGURE 2-21: Line Regulation vs. FIGURE 2-24: PSRR vs. Frequency. Temperature. DS22049D-page 8 © 2009 Microchip Technology Inc.

MCP1703 Note: Unless otherwise indicated: V = 1.8V, C = 1µF Ceramic (X7R), C = 1µF Ceramic (X7R), I = 100µA, R OUT IN L T = +25°C, V = V + V or 2.7V, whichever is greater. A IN OUT(MAX) DROPOUT(MAX) 0 -10 -20 B)-30 d-40 RR (-50 VR=5.0V PS-60 VVIINN=AC6 .=0 V100 mV p-p -70 CIN=0 μF -80 IOUT=100 µA -90 0.01 0.1 1 10 100 1000 Frequency (KHz) FIGURE 2-25: PSRR vs. Frequency. FIGURE 2-28: Dynamic Load Response. 100 VR=5.0V, VIN=6.0V IOUT=50 mA 10 z) H√ 1 VR=2.8V, VIN=3.8V V/ µ se ( 0.1 VR=1.2V, VIN=2.7V oi N 0.01 0.001 0.01 0.1 1 10 100 1000 Frequency (kHz) FIGURE 2-26: Output Noise vs. Frequency. FIGURE 2-29: Dynamic Load Response. FIGURE 2-27: Power Up Timing. © 2009 Microchip Technology Inc. DS22049D-page 9

MCP1703 NOTES: DS22049D-page 10 © 2009 Microchip Technology Inc.

MCP1703 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table3-1. TABLE 3-1: MCP1703 PIN FUNCTION TABLE Pin No. Pin No. Pin No. Pin No. Name Function 2x3DFN-8 SOT-223-3 SOT-23A SOT-89-3 4 2,Tab 1 1 GND Ground Terminal 1 3 2 3 V Regulated Voltage Output OUT 8 1 3 2,Tab V Unregulated Supply Voltage IN 2, 3, 5, 6, 7 — — — NC No Connection 9 — — — EP Exposed Thermal Pad (EP); must be connected to VSS. 3.1 Ground Terminal (GND) 3.3 Unregulated Input Voltage (V ) IN Regulator ground. Tie GND to the negative side of the Connect V to the input unregulated source voltage. IN output and the negative side of the input capacitor. Like all low dropout linear regulators, low source Only the LDO bias current (2.0µA typical) flows out of impedance is necessary for the stable operation of the this pin; there is no high current. The LDO output LDO. The amount of capacitance required to ensure regulation is referenced to this pin. Minimize voltage low source impedance will depend on the proximity of drops between this pin and the negative side of the the input source capacitors or battery type. For most load. applications, 1µF of capacitance will ensure stable operation of the LDO circuit. For applications that have 3.2 Regulated Output Voltage (V ) load currents below 100mA, the input capacitance OUT requirement can be lowered. The type of capacitor Connect VOUT to the positive side of the load and the used can be ceramic, tantalum, or aluminum positive terminal of the output capacitor. The positive electrolytic. The low ESR characteristics of the ceramic side of the output capacitor should be physically will yield better noise and PSRR performance at located as close to the LDO VOUT pin as is practical. high-frequency. The current flowing out of this pin is equal to the DC load current. 3.4 Exposed Thermal Pad (EP) There is an internal electrical connection between the Exposed Thermal Pad (EP) and the V pin; they must SS be connected to the same potential on the Printed Circuit Board (PCB). © 2009 Microchip Technology Inc. DS22049D-page 11

MCP1703 NOTES: DS22049D-page 12 © 2009 Microchip Technology Inc.

MCP1703 4.0 DETAILED DESCRIPTION 4.1 Output Regulation 4.3 Overtemperature A portion of the LDO output voltage is fed back to the The internal power dissipation within the LDO is a internal error amplifier and compared with the precision function of input-to-output voltage differential and load internal band-gap reference. The error amplifier output current. If the power dissipation within the LDO is will adjust the amount of current that flows through the excessive, the internal junction temperature will rise P-Channel pass transistor, thus regulating the output above the typical shutdown threshold of 150°C. At that voltage to the desired value. Any changes in input point, the LDO will shut down and begin to cool to the voltage or output current will cause the error amplifier typical turn-on junction temperature of 130°C. If the to respond and adjust the output voltage to the target power dissipation is low enough, the device will voltage (refer to Figure4-1). continue to cool and operate normally. If the power dissipation remains high, the thermal shutdown 4.2 Overcurrent protection circuitry will again turn off the LDO, protecting it from catastrophic failure. The MCP1703 internal circuitry monitors the amount of current flowing through the P-Channel pass transistor. In the event of a short-circuit or excessive output current, the MCP1703 will turn off the P-Channel device for a short period, after which the LDO will attempt to restart. If the excessive current remains, the cycle will repeat itself. MCP1703 V V IN OUT Error Amplifier +V IN Voltage - Reference + Overcurrent Overtemperature GND FIGURE 4-1: Block Diagram. © 2009 Microchip Technology Inc. DS22049D-page 13

MCP1703 NOTES: DS22049D-page 14 © 2009 Microchip Technology Inc.

MCP1703 5.0 FUNCTIONAL DESCRIPTION 5.2 Output The MCP1703 CMOS low dropout linear regulator is The maximum rated continuous output current for the intended for applications that need the lowest current MCP1703 is 250mA (VR ≥ 2.5V). For applications consumption while maintaining output voltage where VR < 2.5V, the maximum output current is regulation. The operating continuous load range of the 200mA. MCP1703 is from 0mA to 250mA (VR ≥ 2.5V). The A minimum output capacitance of 1.0µF is required for input operating voltage range is from 2.7V to 16.0V, small signal stability in applications that have up to making it capable of operating from two or more 250mA output current capability. The capacitor type alkaline cells or single and multiple Li-Ion cell batteries. can be ceramic, tantalum, or aluminum electrolytic. The esr range on the output capacitor can range from 0Ω to 5.1 Input 2.0Ω. The input of the MCP1703 is connected to the source The output capacitor range for ceramic capacitors is of the P-Channel PMOS pass transistor. As with all 1µF to 22µF. Higher output capacitance values may LDO circuits, a relatively low source impedance (10Ω) be used for tantalum and electrolytic capacitors. Higher is needed to prevent the input impedance from causing output capacitor values pull the pole of the LDO the LDO to become unstable. The size and type of the transfer function inward that results in higher phase capacitor needed depends heavily on the input source shifts which in turn cause a lower crossover frequency. type (battery, power supply) and the output current The circuit designer should verify the stability by range of the application. For most applications (up to applying line step and load step testing to their system 100mA), a 1µF ceramic capacitor will be sufficient to when using capacitance values greater than 22µF. ensure circuit stability. Larger values can be used to improve circuit AC performance. 5.3 Output Rise time When powering up the internal reference output, the typical output rise time of 1000µs is controlled to prevent overshoot of the output voltage. © 2009 Microchip Technology Inc. DS22049D-page 15

MCP1703 NOTES: DS22049D-page 16 © 2009 Microchip Technology Inc.

MCP1703 6.0 APPLICATION CIRCUITS & EQUATION 6-2: ISSUES T = P ×Rθ +T J(MAX) TOTAL JA AMAX Where: 6.1 Typical Application T = Maximum continuous junction J(MAX) The MCP1703 is most commonly used as a voltage temperature regulator. Its low quiescent current and low dropout P = Total device power dissipation voltage make it ideal for many battery-powered TOTAL applications. RθJA = Thermal resistance from junction-to-ambient T = Maximum ambient temperature MCP1703 AMAX V IN V GND 2.7V to 4.8V The maximum power dissipation capability for a OUT V 1.8V IN C package can be calculated given the junction-to- VOUT IN ambient thermal resistance and the maximum ambient I 1µF Ceramic OUT C temperature for the application. The following equation 50mA OUT 1µF Ceramic can be used to determine the package maximum internal power dissipation. FIGURE 6-1: Typical Application Circuit. EQUATION 6-3: 6.1.1 APPLICATION INPUT CONDITIONS (T –T ) P = ------J---(--M----A---X---)------------A---(--M----A---X---)--- Package Type = SOT-23A D(MAX) Rθ JA Input Voltage Range = 2.7V to 4.8V Where: V maximum = 4.8V IN P = Maximum device power dissipation D(MAX) V typical = 1.8V OUT T = Maximum continuous junction J(MAX) IOUT = 50mA maximum temperature T = Maximum ambient temperature A(MAX) 6.2 Power Calculations Rθ = Thermal resistance from JA junction-to-ambient 6.2.1 POWER DISSIPATION The internal power dissipation of the MCP1703 is a function of input voltage, output voltage and output EQUATION 6-4: current. The power dissipation, as a result of the T = P ×Rθ quiescent current draw, is so low, it is insignificant J(RISE) D(MAX) JA (2.0µA x V ). The following equation can be used to IN Where: calculate the internal power dissipation of the LDO. T = Rise in device junction temperature J(RISE) EQUATION 6-1: over the ambient temperature P = Maximum device power dissipation P = (V –V )×I TOTAL LDO IN(MAX)) OUT(MIN) OUT(MAX)) Rθ = Thermal resistance from junction to Where: JA ambient P = LDO Pass device internal power LDO dissipation EQUATION 6-5: V = Maximum input voltage IN(MAX) VOUT(MIN) = LDO minimum output voltage TJ = TJ(RISE)+TA Where: The maximum continuous operating junction temperature specified for the MCP1703 is +125°C. To TJ = Junction Temperature estimate the internal junction temperature of the T = Rise in device junction temperature J(RISE) MCP1703, the total internal power dissipation is over the ambient temperature multiplied by the thermal resistance from junction to T = Ambient temperature A ambient (Rθ ). The thermal resistance from junction to JA ambient for the SOT-23A pin package is estimated at 336°C/W. © 2009 Microchip Technology Inc. DS22049D-page 17

MCP1703 6.3 Voltage Regulator T = T + T J JRISE A(MAX) Internal power dissipation, junction temperature rise, T = 91.3°C J junction temperature and maximum power dissipation Maximum Package Power Dissipation at +40°C are calculated in the following example. The power Ambient Temperature dissipation, as a result of ground current, is small enough to be neglected. SOT-23A (336.0°C/Watt = Rθ ) JA 6.3.1 POWER DISSIPATION EXAMPLE PD(MAX) = (+125°C - 40°C) / 336°C/W P = 253 milli-Watts Package D(MAX) SOT-89 (75°C/Watt = Rθ ) Package Type: SOT-23A JA P = (+125°C - 40°C) / 75°C/W Input Voltage: D(MAX) P = 1.133 Watts V = 2.7V to 4.8V D(MAX) IN SOT-223 (62.9°C/Watt = Rθ ) LDO Output Voltages and Currents JA P = (+125°C - 40°C) / 62.9°C/W V = 1.8V D(MAX) OUT P = 1.35 Watts I = 50mA D(MAX) OUT Maximum Ambient Temperature 6.4 Voltage Reference T = +40°C A(MAX) The MCP1703 can be used not only as a regulator, but Internal Power Dissipation also as a low quiescent current voltage reference. In Internal Power dissipation is the product of the LDO many microcontroller applications, the initial accuracy output current times the voltage across the LDO of the reference can be calibrated using production test (V to V ). equipment or by using a ratio measurement. When the IN OUT P = (V - V ) x I initial accuracy is calibrated, the thermal stability and LDO(MAX) IN(MAX) OUT(MIN) OUT(MAX) line regulation tolerance are the only errors introduced P = (4.8V - (0.97 x 1.8V)) x 50mA LDO by the MCP1703 LDO. The low-cost, low quiescent PLDO = 152.7 milli-Watts current and small ceramic output capacitor are all advantages when using the MCP1703 as a voltage Device Junction Temperature Rise reference. The internal junction temperature rise is a function of internal power dissipation and the thermal resistance Ratio Metric Reference from junction to ambient for the application. The MCP1703 PIC® thermal resistance from junction to ambient (RθJA) is 2µA Bias Microcontroller derived from an EIA/JEDEC standard for measuring V thermal resistance for small surface mount packages. C1IµNF GINNVDOUT COUT VREF The EIA/JEDEC specification is JESD51-7, “High 1µF Effective Thermal Conductivity Test Board for Leaded ADO Surface Mount Packages”. The standard describes the AD1 test method and board specifications for measuring the thermal resistance from junction to ambient. The actual Bridge Sensor thermal resistance for a particular application can vary depending on many factors, such as copper area and thickness. Refer to AN792, “A Method to Determine FIGURE 6-2: Using the MCP1703 as a How Much Power a SOT23 Can Dissipate in an Voltage Reference. Application”, (DS00792), for more information regarding this subject. 6.5 Pulsed Load Applications TJ(RISE) = PTOTAL x RqJA For some applications, there are pulsed load current TJRISE = 152.7 milli-Watts x 336.0°C/Watt events that may exceed the specified 250mA maximum specification of the MCP1703. The internal TJRISE = 51.3°C current limit of the MCP1703 will prevent high peak Junction Temperature Estimate load demands from causing non-recoverable damage. The 250mA rating is a maximum average continuous To estimate the internal junction temperature, the rating. As long as the average current does not exceed calculated temperature rise is added to the ambient or 250mA, pulsed higher load currents can be applied to offset temperature. For this example, the worst-case the MCP1703. The typical current limit for the junction temperature is estimated below. MCP1703 is 500mA (T +25°C). A DS22049D-page 18 © 2009 Microchip Technology Inc.

MCP1703 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 3-Pin SOT-23A Example: Standard Options for SOT-23A and SOT-89 Extended Temp XXNN HWNN Symbol Voltage * Symbol Voltage * HM 1.2 HT 3.0 HP 1.5 HU 3.3 HQ 1.8 HV 4.0 3-Lead SOT-89 Example: HR 2.5 HW 5.0 HS 2.8 — — XXXYYWW * Custom output voltages available upon request. Contact HM0934 your local Microchip sales office for more information. NNN 256 Standard Options for SOT-223 Extended Temp Symbol Voltage * Symbol Voltage * 3-Lead SOT-223 12 1.2 30 3.0 Example: 15 1.5 33 3.3 Tab is GND Tab is GND 18 1.8 40 4.0 25 2.5 50 5.0 XXXXXXX MCP1703 28 2.8 — — XXXYYWW 15E0934 * Custom output voltages available upon request. Contact NNN 256 your local Microchip sales office for more information. 1 2 3 Standard Options for 8-Lead DFN (2x3) 8-Lead DFN (2x3) Extended Temp Example: Symbol Voltage * Symbol Voltage * XXX AAU 1.2 AAY 3.3 AAU YWW AAV 1.8 AFR 4.0 934 NN AAW 2.5 AAZ 5.0 25 AAT 3.0 — — * Custom output voltages available upon request. Contact your local Microchip sales office for more information. Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( e 3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2009 Microchip Technology Inc. DS22049D-page 19

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MCP1703 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)(cid:15)(cid:16)(cid:6)(cid:10)(cid:10)(cid:8)(cid:17)(cid:18)(cid:12)(cid:10)(cid:13)(cid:19)(cid:5)(cid:8)(cid:20)(cid:21)(cid:6)(cid:19)(cid:11)(cid:13)(cid:11)(cid:12)(cid:22)(cid:21)(cid:8)!(cid:5)(cid:6)(cid:7)(cid:5)(cid:21)(cid:8)(cid:23)"(cid:25)(cid:26)(cid:8)(cid:27)(cid:15)(cid:17)(cid:20)(cid:3)#$(cid:30) (cid:31)(cid:22)(cid:12)(cid:5) .(cid:22)(cid:21)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:31)(cid:22) #(cid:14)(cid:20)$(cid:21)(cid:21)(cid:13)(cid:25)#(cid:14)(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)!(cid:21)(cid:11)-(cid:19)(cid:25)(cid:12) 0(cid:14)(cid:10)(cid:26)(cid:13)(cid:11) (cid:13)(cid:14) (cid:13)(cid:13)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)#(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)#(cid:13)!(cid:14)(cid:11)#(cid:14) (cid:23)##(cid:10)+22---(cid:29)(cid:31)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)(cid:31)2(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) D D1 E H L 1 2 N b b1 b1 e e1 E1 A C 3(cid:25)(cid:19)# (cid:18)(cid:28)44(cid:28)(cid:18)"(cid:24)"(cid:8)(cid:3) (cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:14)4(cid:19)(cid:31)(cid:19)# (cid:18)(cid:28)5 (cid:18)(cid:7)7 5$(cid:31)8(cid:13)(cid:21)(cid:14)(cid:22)%(cid:14)4(cid:13)(cid:11)! 5 (cid:15) 1(cid:19)#(cid:20)(cid:23) (cid:13) (cid:30)(cid:29)((cid:4)(cid:14))(cid:3)* 6$# (cid:19)!(cid:13)(cid:14)4(cid:13)(cid:11)!(cid:14)1(cid:19)#(cid:20)(cid:23) (cid:13)(cid:30) (cid:15)(cid:29)(cid:4)(cid:4)(cid:14))(cid:3)* 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)9(cid:13)(cid:19)(cid:12)(cid:23)# (cid:7) (cid:30)(cid:29)(cid:5)(cid:4) (cid:30)(cid:29)=(cid:4) 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)<(cid:19)!#(cid:23) 9 (cid:15)(cid:29)(cid:6)(cid:5) (cid:5)(cid:29)(cid:16)( (cid:18)(cid:22)(cid:26)!(cid:13)!(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)<(cid:19)!#(cid:23)(cid:14)(cid:11)#(cid:14))(cid:11) (cid:13) " (cid:16)(cid:29)(cid:16)(cid:6) (cid:16)(cid:29)=(cid:4) (cid:18)(cid:22)(cid:26)!(cid:13)!(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)<(cid:19)!#(cid:23)(cid:14)(cid:11)#(cid:14)(cid:24)(cid:22)(cid:10) "(cid:30) (cid:16)(cid:29)(cid:30)(cid:15) (cid:16)(cid:29)(cid:16)(cid:6) 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)4(cid:13)(cid:25)(cid:12)#(cid:23) (cid:2) (cid:5)(cid:29)(cid:15)(cid:6) (cid:5)(cid:29)=(cid:4) (cid:24)(cid:11)8(cid:14)4(cid:13)(cid:25)(cid:12)#(cid:23) (cid:2)(cid:30) (cid:30)(cid:29)(cid:5)(cid:4) (cid:30)(cid:29):(cid:15) .(cid:22)(cid:22)#(cid:14)4(cid:13)(cid:25)(cid:12)#(cid:23) 4 (cid:4)(cid:29)(cid:17)(cid:6) (cid:30)(cid:29)(cid:16)(cid:4) 4(cid:13)(cid:11)!(cid:14)(cid:24)(cid:23)(cid:19)(cid:20)/(cid:25)(cid:13) (cid:20) (cid:4)(cid:29)(cid:15)( (cid:4)(cid:29)(cid:5)(cid:5) 4(cid:13)(cid:11)!(cid:14)(cid:16)(cid:14)<(cid:19)!#(cid:23) 8 (cid:4)(cid:29)(cid:5)(cid:30) (cid:4)(cid:29)(= 4(cid:13)(cid:11)! (cid:14)(cid:30)(cid:14)?(cid:14)(cid:15)(cid:14)<(cid:19)!#(cid:23) 8(cid:30) (cid:4)(cid:29)(cid:15)= (cid:4)(cid:29)(cid:5): (cid:31)(cid:22)(cid:12)(cid:5)(cid:11) (cid:30)(cid:29) (cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25) (cid:14)(cid:2)(cid:14)(cid:11)(cid:25)!(cid:14)"(cid:14)!(cid:22)(cid:14)(cid:25)(cid:22)#(cid:14)(cid:19)(cid:25)(cid:20)(cid:26)$!(cid:13)(cid:14)(cid:31)(cid:22)(cid:26)!(cid:14)%(cid:26)(cid:11) (cid:23)(cid:14)(cid:22)(cid:21)(cid:14)(cid:10)(cid:21)(cid:22)#(cid:21)$ (cid:19)(cid:22)(cid:25) (cid:29)(cid:14)(cid:18)(cid:22)(cid:26)!(cid:14)%(cid:26)(cid:11) (cid:23)(cid:14)(cid:22)(cid:21)(cid:14)(cid:10)(cid:21)(cid:22)#(cid:21)$ (cid:19)(cid:22)(cid:25) (cid:14) (cid:23)(cid:11)(cid:26)(cid:26)(cid:14)(cid:25)(cid:22)#(cid:14)(cid:13)&(cid:20)(cid:13)(cid:13)!(cid:14)(cid:4)(cid:29)(cid:30)(cid:16)(cid:17)(cid:14)(cid:31)(cid:31)(cid:14)(cid:10)(cid:13)(cid:21)(cid:14) (cid:19)!(cid:13)(cid:29) (cid:16)(cid:29) (cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:19)(cid:25)(cid:12)(cid:14)(cid:11)(cid:25)!(cid:14)#(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:19)(cid:25)(cid:12)(cid:14)(cid:10)(cid:13)(cid:21)(cid:14)(cid:7)(cid:3)(cid:18)"(cid:14)’(cid:30)(cid:5)(cid:29)((cid:18)(cid:29) )(cid:3)*+ )(cid:11) (cid:19)(cid:20)(cid:14)(cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:29)(cid:14)(cid:24)(cid:23)(cid:13)(cid:22)(cid:21)(cid:13)#(cid:19)(cid:20)(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)(cid:13)&(cid:11)(cid:20)#(cid:14),(cid:11)(cid:26)$(cid:13)(cid:14) (cid:23)(cid:22)-(cid:25)(cid:14)-(cid:19)#(cid:23)(cid:22)$#(cid:14)#(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13) (cid:29) (cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:24)(cid:13)(cid:20)(cid:23)(cid:25)(cid:22)(cid:26)(cid:22)(cid:12)(cid:27)(cid:2)(cid:21)(cid:11)-(cid:19)(cid:25)(cid:12)*(cid:4)(cid:5)(cid:9)(cid:4)(cid:16)(cid:6)) © 2009 Microchip Technology Inc. DS22049D-page 21

MCP1703 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)(cid:15)(cid:16)(cid:6)(cid:10)(cid:10)(cid:8)(cid:17)(cid:18)(cid:12)(cid:10)(cid:13)(cid:19)(cid:5)(cid:8)(cid:20)(cid:21)(cid:6)(cid:19)(cid:11)(cid:13)(cid:11)(cid:12)(cid:22)(cid:21)(cid:8)(cid:23)%(cid:25)(cid:26)(cid:8)(cid:27)(cid:15)(cid:17)(cid:20)(cid:3)(cid:28)(cid:28)(cid:2)(cid:30) (cid:31)(cid:22)(cid:12)(cid:5) .(cid:22)(cid:21)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:31)(cid:22) #(cid:14)(cid:20)$(cid:21)(cid:21)(cid:13)(cid:25)#(cid:14)(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)!(cid:21)(cid:11)-(cid:19)(cid:25)(cid:12) 0(cid:14)(cid:10)(cid:26)(cid:13)(cid:11) (cid:13)(cid:14) (cid:13)(cid:13)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)#(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)#(cid:13)!(cid:14)(cid:11)#(cid:14) (cid:23)##(cid:10)+22---(cid:29)(cid:31)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)(cid:31)2(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) D b2 E1 E 1 2 3 e e1 A A2 c φ b A1 L 3(cid:25)(cid:19)# (cid:18)(cid:28)44(cid:28)(cid:18)"(cid:24)"(cid:8)(cid:3) (cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:14)4(cid:19)(cid:31)(cid:19)# (cid:18)(cid:28)5 56(cid:18) (cid:18)(cid:7)7 5$(cid:31)8(cid:13)(cid:21)(cid:14)(cid:22)%(cid:14)4(cid:13)(cid:11)! 5 (cid:15) 4(cid:13)(cid:11)!(cid:14)1(cid:19)#(cid:20)(cid:23) (cid:13) (cid:16)(cid:29)(cid:15)(cid:4)(cid:14))(cid:3)* 6$# (cid:19)!(cid:13)(cid:14)4(cid:13)(cid:11)!(cid:14)1(cid:19)#(cid:20)(cid:23) (cid:13)(cid:30) (cid:5)(cid:29)=(cid:4)(cid:14))(cid:3)* 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)9(cid:13)(cid:19)(cid:12)(cid:23)# (cid:7) ; ; (cid:30)(cid:29):(cid:4) (cid:3)#(cid:11)(cid:25)!(cid:22)%% (cid:7)(cid:30) (cid:4)(cid:29)(cid:4)(cid:16) ; (cid:4)(cid:29)(cid:30)(cid:4) (cid:18)(cid:22)(cid:26)!(cid:13)!(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)9(cid:13)(cid:19)(cid:12)(cid:23)# (cid:7)(cid:16) (cid:30)(cid:29)((cid:4) (cid:30)(cid:29)=(cid:4) (cid:30)(cid:29)(cid:17)(cid:4) 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)<(cid:19)!#(cid:23) " =(cid:29)(cid:17)(cid:4) (cid:17)(cid:29)(cid:4)(cid:4) (cid:17)(cid:29)(cid:15)(cid:4) (cid:18)(cid:22)(cid:26)!(cid:13)!(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)<(cid:19)!#(cid:23) "(cid:30) (cid:15)(cid:29)(cid:15)(cid:4) (cid:15)(cid:29)((cid:4) (cid:15)(cid:29)(cid:17)(cid:4) 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)4(cid:13)(cid:25)(cid:12)#(cid:23) (cid:2) =(cid:29)(cid:15)(cid:4) =(cid:29)((cid:4) =(cid:29)(cid:17)(cid:4) 4(cid:13)(cid:11)!(cid:14)(cid:24)(cid:23)(cid:19)(cid:20)/(cid:25)(cid:13) (cid:20) (cid:4)(cid:29)(cid:16)(cid:15) (cid:4)(cid:29)(cid:15)(cid:4) (cid:4)(cid:29)(cid:15)( 4(cid:13)(cid:11)!(cid:14)<(cid:19)!#(cid:23) 8 (cid:4)(cid:29)=(cid:4) (cid:4)(cid:29)(cid:17)= (cid:4)(cid:29):(cid:5) (cid:24)(cid:11)8(cid:14)4(cid:13)(cid:11)!(cid:14)<(cid:19)!#(cid:23) 8(cid:16) (cid:16)(cid:29)(cid:6)(cid:4) (cid:15)(cid:29)(cid:4)(cid:4) (cid:15)(cid:29)(cid:30)(cid:4) .(cid:22)(cid:22)#(cid:14)4(cid:13)(cid:25)(cid:12)#(cid:23) 4 (cid:4)(cid:29)(cid:17)( ; ; 4(cid:13)(cid:11)!(cid:14)(cid:7)(cid:25)(cid:12)(cid:26)(cid:13) (cid:3) (cid:4)> ; (cid:30)(cid:4)> (cid:31)(cid:22)(cid:12)(cid:5)(cid:11) (cid:30)(cid:29) (cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25) (cid:14)(cid:2)(cid:14)(cid:11)(cid:25)!(cid:14)"(cid:30)(cid:14)!(cid:22)(cid:14)(cid:25)(cid:22)#(cid:14)(cid:19)(cid:25)(cid:20)(cid:26)$!(cid:13)(cid:14)(cid:31)(cid:22)(cid:26)!(cid:14)%(cid:26)(cid:11) (cid:23)(cid:14)(cid:22)(cid:21)(cid:14)(cid:10)(cid:21)(cid:22)#(cid:21)$ (cid:19)(cid:22)(cid:25) (cid:29)(cid:14)(cid:18)(cid:22)(cid:26)!(cid:14)%(cid:26)(cid:11) (cid:23)(cid:14)(cid:22)(cid:21)(cid:14)(cid:10)(cid:21)(cid:22)#(cid:21)$ (cid:19)(cid:22)(cid:25) (cid:14) (cid:23)(cid:11)(cid:26)(cid:26)(cid:14)(cid:25)(cid:22)#(cid:14)(cid:13)&(cid:20)(cid:13)(cid:13)!(cid:14)(cid:4)(cid:29)(cid:30)(cid:16)(cid:17)(cid:14)(cid:31)(cid:31)(cid:14)(cid:10)(cid:13)(cid:21)(cid:14) (cid:19)!(cid:13)(cid:29) (cid:16)(cid:29) (cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:19)(cid:25)(cid:12)(cid:14)(cid:11)(cid:25)!(cid:14)#(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:19)(cid:25)(cid:12)(cid:14)(cid:10)(cid:13)(cid:21)(cid:14)(cid:7)(cid:3)(cid:18)"(cid:14)’(cid:30)(cid:5)(cid:29)((cid:18)(cid:29) )(cid:3)*+ )(cid:11) (cid:19)(cid:20)(cid:14)(cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:29)(cid:14)(cid:24)(cid:23)(cid:13)(cid:22)(cid:21)(cid:13)#(cid:19)(cid:20)(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)(cid:13)&(cid:11)(cid:20)#(cid:14),(cid:11)(cid:26)$(cid:13)(cid:14) (cid:23)(cid:22)-(cid:25)(cid:14)-(cid:19)#(cid:23)(cid:22)$#(cid:14)#(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13) (cid:29) (cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:24)(cid:13)(cid:20)(cid:23)(cid:25)(cid:22)(cid:26)(cid:22)(cid:12)(cid:27)(cid:2)(cid:21)(cid:11)-(cid:19)(cid:25)(cid:12)*(cid:4)(cid:5)(cid:9)(cid:4)(cid:15)(cid:16)) DS22049D-page 22 © 2009 Microchip Technology Inc.

MCP1703 (cid:2)(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)(cid:15)(cid:16)(cid:6)(cid:10)(cid:10)(cid:8)(cid:17)(cid:18)(cid:12)(cid:10)(cid:13)(cid:19)(cid:5)(cid:8)(cid:20)(cid:21)(cid:6)(cid:19)(cid:11)(cid:13)(cid:11)(cid:12)(cid:22)(cid:21)(cid:8)(cid:23)%(cid:25)(cid:26)(cid:8)(cid:27)(cid:15)(cid:17)(cid:20)(cid:3)(cid:28)(cid:28)(cid:2)(cid:30) (cid:31)(cid:22)(cid:12)(cid:5) .(cid:22)(cid:21)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:31)(cid:22) #(cid:14)(cid:20)$(cid:21)(cid:21)(cid:13)(cid:25)#(cid:14)(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)!(cid:21)(cid:11)-(cid:19)(cid:25)(cid:12) 0(cid:14)(cid:10)(cid:26)(cid:13)(cid:11) (cid:13)(cid:14) (cid:13)(cid:13)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)#(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)#(cid:13)!(cid:14)(cid:11)#(cid:14) (cid:23)##(cid:10)+22---(cid:29)(cid:31)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)(cid:31)2(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) © 2009 Microchip Technology Inc. DS22049D-page 23

MCP1703 #(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)%(cid:18)(cid:6)(cid:10)(cid:8)&(cid:10)(cid:6)(cid:12)’(cid:8)(cid:31)(cid:22)(cid:8)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:6)(cid:14)((cid:6))(cid:5)(cid:8)(cid:23)"(cid:24)(cid:26)(cid:8)*(cid:8)(cid:28)+(cid:2)+,-$(cid:8)(cid:16)(cid:16)(cid:8)(cid:25)(cid:22)(cid:7).(cid:8)(cid:27)%&(cid:31)(cid:30) (cid:31)(cid:22)(cid:12)(cid:5) .(cid:22)(cid:21)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:31)(cid:22) #(cid:14)(cid:20)$(cid:21)(cid:21)(cid:13)(cid:25)#(cid:14)(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)!(cid:21)(cid:11)-(cid:19)(cid:25)(cid:12) 0(cid:14)(cid:10)(cid:26)(cid:13)(cid:11) (cid:13)(cid:14) (cid:13)(cid:13)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)#(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)#(cid:13)!(cid:14)(cid:11)#(cid:14) (cid:23)##(cid:10)+22---(cid:29)(cid:31)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)(cid:31)2(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) D e b N N L K E E2 EXPOSEDPAD NOTE1 NOTE1 1 2 2 1 D2 TOPVIEW BOTTOMVIEW A NOTE2 A3 A1 3(cid:25)(cid:19)# (cid:18)(cid:28)44(cid:28)(cid:18)"(cid:24)"(cid:8)(cid:3) (cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:14)4(cid:19)(cid:31)(cid:19)# (cid:18)(cid:28)5 56(cid:18) (cid:18)(cid:7)7 5$(cid:31)8(cid:13)(cid:21)(cid:14)(cid:22)%(cid:14)1(cid:19)(cid:25) 5 : 1(cid:19)#(cid:20)(cid:23) (cid:13) (cid:4)(cid:29)((cid:4)(cid:14))(cid:3)* 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)9(cid:13)(cid:19)(cid:12)(cid:23)# (cid:7) (cid:4)(cid:29):(cid:4) (cid:4)(cid:29)(cid:6)(cid:4) (cid:30)(cid:29)(cid:4)(cid:4) (cid:3)#(cid:11)(cid:25)!(cid:22)%%(cid:14) (cid:7)(cid:30) (cid:4)(cid:29)(cid:4)(cid:4) (cid:4)(cid:29)(cid:4)(cid:16) (cid:4)(cid:29)(cid:4)( *(cid:22)(cid:25)#(cid:11)(cid:20)#(cid:14)(cid:24)(cid:23)(cid:19)(cid:20)/(cid:25)(cid:13) (cid:7)(cid:15) (cid:4)(cid:29)(cid:16)(cid:4)(cid:14)(cid:8)". 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)4(cid:13)(cid:25)(cid:12)#(cid:23) (cid:2) (cid:16)(cid:29)(cid:4)(cid:4)(cid:14))(cid:3)* 6,(cid:13)(cid:21)(cid:11)(cid:26)(cid:26)(cid:14)<(cid:19)!#(cid:23) " (cid:15)(cid:29)(cid:4)(cid:4)(cid:14))(cid:3)* "&(cid:10)(cid:22) (cid:13)!(cid:14)1(cid:11)!(cid:14)4(cid:13)(cid:25)(cid:12)#(cid:23) (cid:2)(cid:16) (cid:30)(cid:29)(cid:15)(cid:4) ; (cid:30)(cid:29)(( "&(cid:10)(cid:22) (cid:13)!(cid:14)1(cid:11)!(cid:14)<(cid:19)!#(cid:23) "(cid:16) (cid:30)(cid:29)((cid:4) ; (cid:30)(cid:29)(cid:17)( *(cid:22)(cid:25)#(cid:11)(cid:20)#(cid:14)<(cid:19)!#(cid:23) 8 (cid:4)(cid:29)(cid:16)(cid:4) (cid:4)(cid:29)(cid:16)( (cid:4)(cid:29)(cid:15)(cid:4) *(cid:22)(cid:25)#(cid:11)(cid:20)#(cid:14)4(cid:13)(cid:25)(cid:12)#(cid:23) 4 (cid:4)(cid:29)(cid:15)(cid:4) (cid:4)(cid:29)(cid:5)(cid:4) (cid:4)(cid:29)((cid:4) *(cid:22)(cid:25)#(cid:11)(cid:20)#(cid:9)#(cid:22)(cid:9)"&(cid:10)(cid:22) (cid:13)!(cid:14)1(cid:11)! @ (cid:4)(cid:29)(cid:16)(cid:4) ; ; (cid:31)(cid:22)(cid:12)(cid:5)(cid:11) (cid:30)(cid:29) 1(cid:19)(cid:25)(cid:14)(cid:30)(cid:14),(cid:19) $(cid:11)(cid:26)(cid:14)(cid:19)(cid:25)!(cid:13)&(cid:14)%(cid:13)(cid:11)#$(cid:21)(cid:13)(cid:14)(cid:31)(cid:11)(cid:27)(cid:14),(cid:11)(cid:21)(cid:27)0(cid:14)8$#(cid:14)(cid:31)$ #(cid:14)8(cid:13)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)#(cid:13)!(cid:14)-(cid:19)#(cid:23)(cid:19)(cid:25)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:23)(cid:11)#(cid:20)(cid:23)(cid:13)!(cid:14)(cid:11)(cid:21)(cid:13)(cid:11)(cid:29) (cid:16)(cid:29) 1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)(cid:31)(cid:11)(cid:27)(cid:14)(cid:23)(cid:11),(cid:13)(cid:14)(cid:22)(cid:25)(cid:13)(cid:14)(cid:22)(cid:21)(cid:14)(cid:31)(cid:22)(cid:21)(cid:13)(cid:14)(cid:13)&(cid:10)(cid:22) (cid:13)!(cid:14)#(cid:19)(cid:13)(cid:14)8(cid:11)(cid:21) (cid:14)(cid:11)#(cid:14)(cid:13)(cid:25)! (cid:29) (cid:15)(cid:29) 1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)(cid:19) (cid:14) (cid:11)-(cid:14) (cid:19)(cid:25)(cid:12)$(cid:26)(cid:11)#(cid:13)!(cid:29) (cid:5)(cid:29) (cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:19)(cid:25)(cid:12)(cid:14)(cid:11)(cid:25)!(cid:14)#(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:19)(cid:25)(cid:12)(cid:14)(cid:10)(cid:13)(cid:21)(cid:14)(cid:7)(cid:3)(cid:18)"(cid:14)’(cid:30)(cid:5)(cid:29)((cid:18)(cid:29) )(cid:3)*+ )(cid:11) (cid:19)(cid:20)(cid:14)(cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)(cid:29)(cid:14)(cid:24)(cid:23)(cid:13)(cid:22)(cid:21)(cid:13)#(cid:19)(cid:20)(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)(cid:13)&(cid:11)(cid:20)#(cid:14),(cid:11)(cid:26)$(cid:13)(cid:14) (cid:23)(cid:22)-(cid:25)(cid:14)-(cid:19)#(cid:23)(cid:22)$#(cid:14)#(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13) (cid:29) (cid:8)".+ (cid:8)(cid:13)%(cid:13)(cid:21)(cid:13)(cid:25)(cid:20)(cid:13)(cid:14)(cid:2)(cid:19)(cid:31)(cid:13)(cid:25) (cid:19)(cid:22)(cid:25)0(cid:14)$ $(cid:11)(cid:26)(cid:26)(cid:27)(cid:14)-(cid:19)#(cid:23)(cid:22)$#(cid:14)#(cid:22)(cid:26)(cid:13)(cid:21)(cid:11)(cid:25)(cid:20)(cid:13)0(cid:14)%(cid:22)(cid:21)(cid:14)(cid:19)(cid:25)%(cid:22)(cid:21)(cid:31)(cid:11)#(cid:19)(cid:22)(cid:25)(cid:14)(cid:10)$(cid:21)(cid:10)(cid:22) (cid:13) (cid:14)(cid:22)(cid:25)(cid:26)(cid:27)(cid:29) (cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:24)(cid:13)(cid:20)(cid:23)(cid:25)(cid:22)(cid:26)(cid:22)(cid:12)(cid:27)(cid:2)(cid:21)(cid:11)-(cid:19)(cid:25)(cid:12)*(cid:4)(cid:5)(cid:9)(cid:30)(cid:16)(cid:15)* DS22049D-page 24 © 2009 Microchip Technology Inc.

MCP1703 #(cid:3)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:10)(cid:6)(cid:11)(cid:12)(cid:13)(cid:14)(cid:8)%(cid:18)(cid:6)(cid:10)(cid:8)&(cid:10)(cid:6)(cid:12)’(cid:8)(cid:31)(cid:22)(cid:8)(cid:4)(cid:5)(cid:6)(cid:7)(cid:8)(cid:9)(cid:6)(cid:14)((cid:6))(cid:5)(cid:8)(cid:23)"(cid:24)(cid:26)(cid:8)*(cid:8)(cid:28)+(cid:2)+,-$(cid:8)(cid:16)(cid:16)(cid:8)(cid:25)(cid:22)(cid:7).(cid:8)(cid:27)%&(cid:31)(cid:30) (cid:31)(cid:22)(cid:12)(cid:5) .(cid:22)(cid:21)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:31)(cid:22) #(cid:14)(cid:20)$(cid:21)(cid:21)(cid:13)(cid:25)#(cid:14)(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:13)(cid:14)!(cid:21)(cid:11)-(cid:19)(cid:25)(cid:12) 0(cid:14)(cid:10)(cid:26)(cid:13)(cid:11) (cid:13)(cid:14) (cid:13)(cid:13)(cid:14)#(cid:23)(cid:13)(cid:14)(cid:18)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:14)1(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12)(cid:14)(cid:3)(cid:10)(cid:13)(cid:20)(cid:19)%(cid:19)(cid:20)(cid:11)#(cid:19)(cid:22)(cid:25)(cid:14)(cid:26)(cid:22)(cid:20)(cid:11)#(cid:13)!(cid:14)(cid:11)#(cid:14) (cid:23)##(cid:10)+22---(cid:29)(cid:31)(cid:19)(cid:20)(cid:21)(cid:22)(cid:20)(cid:23)(cid:19)(cid:10)(cid:29)(cid:20)(cid:22)(cid:31)2(cid:10)(cid:11)(cid:20)/(cid:11)(cid:12)(cid:19)(cid:25)(cid:12) © 2009 Microchip Technology Inc. DS22049D-page 25

MCP1703 NOTES: DS22049D-page 26 © 2009 Microchip Technology Inc.

MCP1703 APPENDIX A: REVISION HISTORY Revision D (September 2009) The following is the list of modifications: 1. Added the 8-Lead 2x3DFN package. 2. Updated the Temperature Specification table. 3. Updated Table3-1. 4. Added Section3.4 “Exposed Thermal Pad (EP)”. 5. Updated the Package Outline Drawings and the information for the 8-Lead 2x3DFN package. 6. Added the information for the 8-Lead 2x3DFN package in the Product Identification System section. Revision C (June 2009) The following is the list of modifications: 1. Absolute Maximum Ratings: Updated this section. 2. DC Characteristics table: Updated. 3. Temperature Specifications table: Updated. 4. Package Information: Update Package Outline Drawings. Revision B (February 2008) The following is the list of modifications: 1. Updated Temperature Specifications table. 2. Updated Table3-1. 3. Updated Section5.2 “Output”. 4. Added SOT-223 Landing Patterm Outline drawing. Revision A (June 2007) • Original Release of this Document. © 2009 Microchip Technology Inc. DS22049D-page 27

MCP1703 NOTES: DS22049D-page 28 © 2009 Microchip Technology Inc.

MCP1703 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X- XX X X X/ XX Examples: a) MCP1703T-1202E/XX:1.2V Low Quiescent Device Tape Output Feature Tolerance Temp. Package LDO, Tape and Reel and Reel Voltage Code b) MCP1703T-1502E/XX:1.5V Low Quiescent LDO, Tape and Reel c) MCP1703T-1802E/XX:1.8V Low Quiescent Device: MCP1703: 250mA, 16V Low Quiescent Current LDO LDO, Tape and Reel d) MCP1703T-2502E/XX:2.5V Low Quiescent LDO, Tape and Reel Tape and Reel: T = Tape and Reel e) MCP1703T-2802E/XX:2.8V Low Quiescent LDO, Tape and Reel f) MCP1703T-3002E/XX:3.0V Low Quiescent Output Voltage *: 12 = 1.2V “Standard” LDO, Tape and Reel 15 = 1.5V “Standard” g) MCP1703T-3302E/XX:3.3V Low Quiescent 18 = 1.8V “Standard” LDO, Tape and Reel 25 = 2.5V “Standard” h) MCP1703T-3602E/XX:3.6V Low Quiescent 28 = 2.8V “Standard” LDO, Tape and Reel 30 = 3.0V “Standard” i) MCP1703T-4002E/XX:4.0V Low Quiescent 33 = 3.3V “Standard” LDO, Tape and Reel 40 = 4.0V “Standard” j) MCP1703T-5002E/XX:5.0V Low Quiescent 50 = 5.0V “Standard” LDO, Tape and Reel *Contact factory for other output voltage options. Extra Feature 0 = Fixed XX = CB for 3LD SOT-23A package Code: = DB for 3LD SOT-223 package = MB for 3LD SOT-89 package Tolerance: 2 = 2.0% (Standard) = MC for 8LD DFN package. Temperature: E = -40°C to +125°C Package Type: CB = Plastic Small Outline Transistor (SOT-23A) 3-lead, DB = Plastic Small Outline Transistor (SOT-223) 3-lead, MB = Plastic Small Outline Transistor (SOT-89) 3-lead. MC = Plastic Dual Flat, No Lead Package (DFN) 2x3, 8-lead. © 2009 Microchip Technology Inc. DS22049D-page 29

MCP1703 NOTES: DS22049D-page 30 © 2009 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device Trademarks applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC, and may be superseded by updates. It is your responsibility to KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, ensure that your application meets with your specifications. rfPIC and UNI/O are registered trademarks of Microchip MICROCHIP MAKES NO REPRESENTATIONS OR Technology Incorporated in the U.S.A. and other countries. WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, OTHERWISE, RELATED TO THE INFORMATION, MXDEV, MXLAB, SEEVAL and The Embedded Control INCLUDING BUT NOT LIMITED TO ITS CONDITION, Solutions Company are registered trademarks of Microchip QUALITY, PERFORMANCE, MERCHANTABILITY OR Technology Incorporated in the U.S.A. FITNESS FOR PURPOSE. Microchip disclaims all liability Analog-for-the-Digital Age, Application Maestro, CodeGuard, arising from this information and its use. Use of Microchip dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, devices in life support and/or safety applications is entirely at ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial the buyer’s risk, and the buyer agrees to defend, indemnify and Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified hold harmless Microchip from any and all damages, claims, logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code suits, or expenses resulting from such use. No licenses are Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, conveyed, implicitly or otherwise, under any Microchip PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total intellectual property rights. Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2009 Microchip Technology Inc. DS22049D-page 31

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