® MCF5272 ColdFire Integrated Microprocessor User’s Manual ® ColdFire Microcontrollers MCF5272UM Rev. 3 03/2007 freescale.com

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Overview 1 ColdFire Core 2 Hardware Multiply/Accumulate (MAC) Unit 3 Local Memory 4 Debug Support 5 System Integration Module (SIM) 6 Interrupt Controller 7 Chip-Select Module 8 SDRAM Controller 9 DMA Controller Module 10 Ethernet Module 11 Universal Serial Bus (USB) 12 Physical Layer Interface Controller (PLIC) 13 Queued Serial Peripheral Interface (QSPI) Module 14 Timer Module 15 UART Modules 16 General-Purpose I/O Module 17 Pulse-Width Modulation (PWM) Module 18 Signal Descriptions 19 Bus Operation 20 IEEE 1149.1 Test Access Port (JTAG) 21 Mechanical Data 22 Electrical Characteristics 23 Appendix A: List of Memory Maps A Appendix B: Buffering and Impedence Matching B Index IND

1 Overview 2 ColdFire Core 3 Hardware Multiply/Accumulate (MAC) Unit 4 Local Memory 5 Debug Support 6 System Integration Module (SIM) 7 Interrupt Controller 8 Chip-Select Module 9 SDRAM Controller 10 DMA Controller Module 11 Ethernet Module 12 Universal Serial Bus (USB) 13 Physical Layer Interface Controller (PLIC) 14 Queued Serial Peripheral Interface (QSPI) Module 15 Timer Module UART Modules 16 General-Purpose I/O Module 17 Pulse-Width Modulation (PWM) Module 18 Signal Descriptions 19 Bus Operation 20 IEEE 1149.1 Test Access Port (JTAG) 21 Mechanical Data 22 Electrical Characteristics 23 Appendix A: List of Memory Maps A Appendix B: Buffering and Impedence Matching B Index IND

List of Figures Figure Page Number Title Number 1-1 MCF5272 Block Diagram........................................................................................................1-2 2-1 ColdFire Pipeline.....................................................................................................................2-2 2-2 ColdFire Multiply-Accumulate Functionality Diagram..............................................................2-3 2-3 ColdFire Programming Model.................................................................................................2-5 2-4 Condition Code Register (CCR)..............................................................................................2-6 2-5 Status Register (SR)...............................................................................................................2-8 2-6 Vector Base Register (VBR)...................................................................................................2-8 2-7 Organization of Integer Data Formats in Data Registers......................................................2-10 2-8 Organization of Integer Data Formats in Address Registers.................................................2-10 2-9 Memory Operand Addressing...............................................................................................2-11 2-10 Exception Stack Frame Form................................................................................................2-27 3-1 ColdFire MAC Multiplication and Accumulation......................................................................3-1 3-2 MAC Programming Model.......................................................................................................3-2 4-1 SRAM Base Address Register (RAMBAR).............................................................................4-3 4-2 ROM Base Address Register (ROMBAR)..............................................................................4-5 4-3 Instruction Cache Block Diagram............................................................................................4-8 4-4 Cache Control Register (CACR)...........................................................................................4-12 4-5 Access Control Register Format (ACRn)..............................................................................4-14 5-1 Processor/Debug Module Interface.........................................................................................5-1 5-2 PSTCLK Timing......................................................................................................................5-2 5-3 Example JMP Instruction Output on PST/DDATA..................................................................5-5 5-4 Debug Programming Model....................................................................................................5-6 5-5 Address Attribute Trigger Register (AATR).............................................................................5-7 5-6 Address Breakpoint Registers (ABLR, ABHR)........................................................................5-9 5-7 Configuration/Status Register (CSR)....................................................................................5-10 5-8 Data Breakpoint/Mask Registers (DBR and DBMR).............................................................5-12 5-9 Program Counter Breakpoint Register (PBR).......................................................................5-13 5-10 Program Counter Breakpoint Mask Register (PBMR)...........................................................5-13 5-11 Trigger Definition Register (TDR)..........................................................................................5-14 5-12 BDM Serial Interface Timing.................................................................................................5-17 5-13 Receive BDM Packet............................................................................................................5-18 5-14 Transmit BDM Packet...........................................................................................................5-18 5-15 BDM Command Format........................................................................................................5-20 5-16 Command Sequence Diagram..............................................................................................5-21 5-17 RAREG/RDREG Command Format ..........................................................................................5-22 5-18 RAREG/RDREG Command Sequence......................................................................................5-22 5-19 WAREG/WDREG Command Format.........................................................................................5-23 5-20 WAREG/WDREG Command Sequence....................................................................................5-23 5-21 READ Command/Result Formats...........................................................................................5-24 5-22 READ Command Sequence...................................................................................................5-24 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor v

List of Figures (Continued) Figure Page Number Title Number 5-23 WRITE Command Format.......................................................................................................5-25 5-24 WRITE Command Sequence..................................................................................................5-26 5-25 DUMP Command/Result Formats..........................................................................................5-27 5-26 DUMP Command Sequence...................................................................................................5-27 5-27 FILL Command Format.........................................................................................................5-28 5-28 FILL Command Sequence......................................................................................................5-29 5-29 GO Command Format............................................................................................................5-29 5-30 GO Command Sequence.......................................................................................................5-29 5-31 NOP Command Format..........................................................................................................5-30 5-32 NOP Command Sequence.....................................................................................................5-30 5-33 RCREG Command/Result Formats.........................................................................................5-30 5-34 RCREG Command Sequence.................................................................................................5-31 5-35 WCREG Command/Result Formats........................................................................................5-31 5-36 WCREG Command Sequence................................................................................................5-31 5-37 RDMREG BDM Command/Result Formats..............................................................................5-32 5-38 RDMREG Command Sequence...............................................................................................5-32 5-39 WDMREG BDM Command Format..........................................................................................5-33 5-40 WDMREG Command Sequence..............................................................................................5-33 5-41 Recommended BDM Connector...........................................................................................5-41 6-1 SIM Block Diagram.................................................................................................................6-1 6-2 Module Base Address Register (MBAR).................................................................................6-4 6-3 System Configuration Register (SCR)....................................................................................6-5 6-4 System Protection Register (SPR)..........................................................................................6-6 6-5 Power Management Register (PMR)......................................................................................6-7 6-6 Activate Low-Power Register (ALPR)...................................................................................6-10 6-7 Device Identification Register (DIR)......................................................................................6-11 6-8 Watchdog Reset Reference Register (WRRR).....................................................................6-12 6-9 Watchdog Interrupt Reference Register (WIRR)...................................................................6-12 6-10 Watchdog Counter Register (WCR)......................................................................................6-13 6-11 Watchdog Event Register (WER)..........................................................................................6-13 7-1 Interrupt Controller Block Diagram..........................................................................................7-2 7-2 Interrupt Control Register 1 (ICR1).........................................................................................7-4 7-3 Interrupt Control Register 2 (ICR2).........................................................................................7-5 7-4 Interrupt Control Register 3 (ICR3).........................................................................................7-5 7-5 Interrupt Control Register 4(ICR4)..........................................................................................7-5 7-6 Interrupt Source Register (ISR)...............................................................................................7-6 7-7 Programmable Interrupt Transition Register (PITR)...............................................................7-7 7-8 Programmable Interrupt Wakeup Register (PIWR).................................................................7-8 7-9 Programmable Interrupt Vector Register (PIVR).....................................................................7-9 8-1 Chip Select Base Registers (CSBRn).....................................................................................8-3 8-2 Chip Select Option Registers (CSORn).................................................................................8-5 9-1 SDRAM Controller Signals......................................................................................................9-2 9-2 54-Pin TSOP SDRAM Pin Definition.......................................................................................9-3 9-3 SDRAM Configuration Register (SDCR).................................................................................9-6 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 vi Freescale Semiconductor

List of Figures (Continued) Figure Page Number Title Number 9-4 SDRAM Timing Register (SDTR)............................................................................................9-8 9-5 Example Setup Time Violation on SDRAM Data Input during Write.....................................9-12 9-6 Timing Refinement with Inverted SDCLK..............................................................................9-13 9-7 Timing Refinement with True CAS Latency and Inverted SDCLK........................................9-13 9-8 Timing Refinement with Effective CAS Latency....................................................................9-14 9-9 SDRAM Burst Read, 32-Bit Port, Page Miss, Access = 9-1-1-1...........................................9-16 9-10 SDRAM Burst Read, 32-Bit Port, Page Hit, Access = 5-1-1-1..............................................9-17 9-11 SDRAM Burst Write, 32-Bit Port, Page Miss, Access = 7-1-1-1...........................................9-18 9-12 SDRAM Burst Write, 32-Bit Port, Page Hit, Access = 3-1-1-1..............................................9-19 9-13 SDRAM Refresh Cycle..........................................................................................................9-20 9-14 Enter SDRAM Self-Refresh Mode.........................................................................................9-21 9-15 Exit SDRAM Self-Refresh Mode...........................................................................................9-22 10-1 DMA Mode Register (DMR)..................................................................................................10-2 10-2 DMA Interrupt Register (DIR)................................................................................................10-4 10-3 DMA Source Address Register (DSAR)................................................................................10-5 10-4 DMA Destination Address Register (DDAR).........................................................................10-6 10-5 DMA Byte Count Register (DBCR).......................................................................................10-6 11-1 Ethernet Block Diagram........................................................................................................11-2 11-2 Fast Ethernet Module Block Diagram...................................................................................11-2 11-3 Ethernet Frame Format.........................................................................................................11-4 11-4 Ethernet Address Recognition Flowchart..............................................................................11-7 11-5 Ethernet Control Register (ECR).........................................................................................11-11 11-6 Interrupt Event Register (EIR).............................................................................................11-12 11-7 Interrupt Mask Register (EIMR).........................................................................................11-13 11-8 Interrupt Vector Status Register (IVSR)..............................................................................11-14 11-9 Receive Descriptor Active Register (RDAR).......................................................................11-15 11-10 Transmit Descriptor Active Register (TDAR)......................................................................11-16 11-11 MII Management Frame Register (MMFR).........................................................................11-17 11-12 MII Speed Control Register (MSCR)..................................................................................11-18 11-13 FIFO Receive Bound Register (FRBR)..............................................................................11-19 11-14 FIFO Receive Start Register (FRSR).................................................................................11-20 11-15 Transmit FIFO Watermark (TFWR)....................................................................................11-21 11-16 FIFO Transmit Start Register (TFSR).................................................................................11-22 11-17 Receive Control Register (RCR).........................................................................................11-23 11-18 Maximum Frame Length Register (MFLR)..........................................................................11-24 11-19 Transmit Control Register (TCR)........................................................................................11-25 11-20 RAM Perfect Match Address Low (MALR)..........................................................................11-26 11-21 RAM Perfect Match Address High (MAUR)........................................................................11-27 11-22 Hash Table High (HTUR)...................................................................................................11-28 11-23 Hash Table Low (HTLR)....................................................................................................11-29 11-24 Pointer-to-Receive Descriptor Ring (ERDSR).....................................................................11-30 11-25 Pointer-to-Transmit Descriptor Ring (ETDSR)....................................................................11-31 11-26 Receive Buffer Size (EMRBR)............................................................................................11-32 11-27 Receive Buffer Descriptor (RxBD)......................................................................................11-35 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor vii

List of Figures (Continued) Figure Page Number Title Number 11-28 Transmit Buffer Descriptor (TxBD).....................................................................................11-37 12-1 The USB “Tiered Star” Topology...........................................................................................12-2 12-2 USB Module Block Diagram..................................................................................................12-3 12-3 USB Frame Number Register (FNR)....................................................................................12-9 12-4 USB Frame Number Match Register (FNMR).......................................................................12-9 12-5 USB Real-Time Frame Monitor Register (RFMR)...............................................................12-10 12-6 USB Real-Time Frame Monitor Match Register (RFMMR).................................................12-11 12-7 USB Function Address Register (FAR)...............................................................................12-11 12-8 USB Alternate Settings Register (ASR)..............................................................................12-12 12-9 USB Device Request Data 1 Register (DRR1)...................................................................12-13 12-10 USB Device Request Data 2 Register (DRR2)...................................................................12-13 12-11 USB Specification Number Register (SPECR)...................................................................12-14 12-12 USB Endpoint 0 Status Register (EP0SR)..........................................................................12-14 12-13 USB Endpoint 0 IN Configuration Register (IEP0CFG)......................................................12-15 12-14 USB Endpoint 0 OUT Configuration Register.....................................................................12-16 12-15 USB Endpoint 1–7 Configuration Register..........................................................................12-16 12-16 USB Endpoint 0 Control Register (EP0CTL).......................................................................12-17 12-17 USB Endpoint 1-7 Control Register (EPnCTL)...................................................................12-20 12-18 USB Endpoint 0 Interrupt Mask (EP0IMR) and General/Endpoint 0 Interrupt Registers (EP0ISR).......................................................12-22 12-19 USB Endpoints 1–7 Interrupt Status Registers (EPnISR)...................................................12-25 12-20 USB Endpoint 1-7 Interrupt Mask Registers (EPnIMR)......................................................12-26 12-21 USB Endpoint 0-7 Data Registers (EPnDR).......................................................................12-27 12-22 USB Endpoint 0-7 Data Present Registers (EPnDPR).......................................................12-28 12-23 Example USB Configuration Descriptor Structure..............................................................12-29 12-24 Recommended USB Line Interface.....................................................................................12-36 12-25 USB Protection Circuit........................................................................................................12-37 13-1 PLIC System Diagram...........................................................................................................13-2 13-2 GCI/IDL Receive Data Flow..................................................................................................13-3 13-3 GCI/IDL B-Channel Receive Data Register Demultiplexing..................................................13-4 13-4 GCI/IDL Transmit Data Flow.................................................................................................13-4 13-5 GCI/IDL B Data Transmit Register Multiplexing....................................................................13-5 13-6 B-Channel Unencoded and HDLC Encoded Data................................................................13-6 13-7 D-Channel HDLC Encoded and Unencoded Data................................................................13-7 13-8 D-Channel Contention ..........................................................................................................13-8 13-9 GCI/IDL Loopback Mode ......................................................................................................13-9 13-10 Periodic Frame Interrupt.....................................................................................................13-10 13-11 PLIC Internal Timing Signal Routing...................................................................................13-12 13-12 PLIC Clock Generator.........................................................................................................13-12 13-13 B1 Receive Data Registers P0B1RR–P3B1RR..................................................................13-15 13-14 B2 Receive Data Registers P0B2RR – P3B2RR................................................................13-16 13-15 D Receive Data Registers P0DRR–P3DRR.......................................................................13-16 13-16 B1 Transmit Data Registers P0B1TR–P3B1TR..................................................................13-17 13-17 B2 Transmit Data Registers P0B2TR–P3B2TR..................................................................13-17 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 viii Freescale Semiconductor

List of Figures (Continued) Figure Page Number Title Number 13-18 D Transmit Data Registers P0DTR–P3DTR.......................................................................13-18 13-19 Port Configuration Registers (P0CR–P3CR)......................................................................13-18 13-20 Loopback Control Register (PLCR).....................................................................................13-20 13-21 Interrupt Configuration Registers (P0ICR–P3ICR)..............................................................13-20 13-22 Periodic Status Registers (P0PSR–P3PSR).......................................................................13-22 13-23 Aperiodic Status Register (PASR)......................................................................................13-23 13-24 GCI Monitor Channel Receive Registers (P0GMR–P3GMR).............................................13-24 13-25 GCI Monitor Channel Transmit Registers (P0GMT–P3GMT).............................................13-25 13-26 GCI Monitor Channel Transmit Abort Register (PGMTA)...................................................13-26 13-27 GCI Monitor Channel Transmit Status Register (PGMTS)..................................................13-27 13-28 GCI C/I Channel Receive Registers (P0GCIR–P3GCIR)...................................................13-28 13-29 GCI C/I Channel Transmit Registers (P0GCIT–P3GCIT)...................................................13-29 13-30 GCI C/I Channel Transmit Status Register (PGCITSR)......................................................13-30 13-31 D-Channel Status Register (PDCSR).................................................................................13-31 13-32 D-Channel Request Registers (PDRQR)............................................................................13-32 13-33 Sync Delay Registers (P0SDR–P3SDR)............................................................................13-33 13-34 Clock Select Register (PCSR)............................................................................................13-34 13-35 Port 1 Configuration Register (P1CR).................................................................................13-36 13-36 Port 1 Interrupt Configuration Register (P1ICR).................................................................13-37 13-37 ISDN SOHO PABX Example..............................................................................................13-38 13-38 Standard IDL2 10-Bit Mode ................................................................................................13-39 13-39 ISDN SOHO PABX Example..............................................................................................13-40 13-40 Standard IDL2 10-Bit Mode ................................................................................................13-41 13-41 Two-Line Remote Access...................................................................................................13-41 13-42 Standard IDL2 8-Bit Mode ..................................................................................................13-42 14-1 QSPI Block Diagram.............................................................................................................14-2 14-2 QSPI RAM Model..................................................................................................................14-5 14-3 QSPI Mode Register (QMR).................................................................................................14-9 14-4 QSPI Clocking and Data Transfer Example........................................................................14-10 14-5 SPI Modes Timing...............................................................................................................14-11 14-6 QSPI Delay Register (QDLYR)...........................................................................................14-11 14-7 QSPI Wrap Register (QWR)...............................................................................................14-12 14-8 QSPI Interrupt Register (QIR).............................................................................................14-13 14-9 QSPI Address Register.......................................................................................................14-14 14-10 QSPI Data Register ............................................................................................................14-14 14-11 Command RAM Registers (QCR0–QCR15).......................................................................14-15 15-1 Timer Block Diagram.............................................................................................................15-2 15-2 Timer Mode Registers (TMR0–TMR3)..................................................................................15-3 15-3 Timer Reference Registers (TRR0–TRR3)...........................................................................15-4 15-4 Timer Capture Registers (TCAP0–TCAP3)..........................................................................15-4 15-5 Timer Counter (TCN0–TCN3)...............................................................................................15-4 15-6 Timer Event Registers (TER0–TER3)...................................................................................15-5 16-1 Simplified Block Diagram......................................................................................................16-1 16-2 UART Mode Registers 1 (UMR1n)........................................................................................16-4 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor ix

List of Figures (Continued) Figure Page Number Title Number 16-3 UART Mode Register 2 (UMR2n).........................................................................................16-6 16-4 UART Status Registers (USRn)............................................................................................16-7 16-5 UART Clock-Select Registers (UCSRn)...............................................................................16-8 16-6 UART Command Registers (UCRn).....................................................................................16-9 16-7 UART Receiver Buffer (URBn)............................................................................................16-10 16-8 UART Transmitter Buffers (UTBn)......................................................................................16-11 16-9 UART Input Port Change Registers (UIPCRn)...................................................................16-11 16-10 UART Auxiliary Control Registers (UACRn).......................................................................16-12 16-11 UART Interrupt Status/Mask Registers (UISRn/UIMRn).....................................................16-13 16-12 UART Divider Upper Registers (UDUn)..............................................................................16-14 16-13 UART Divider Lower Registers (UDLn)...............................................................................16-14 16-14 UART Autobaud Upper Registers (UABUn)........................................................................16-14 16-15 UART Autobaud Lower Registers (UABLn)........................................................................16-14 16-16 UART Transmitter FIFO Registers (UTFn).........................................................................16-15 16-17 UART Receiver FIFO Registers (URFn).............................................................................16-16 16-18 UART Fractional Precision Divider Control Registers (UFPDn)..........................................16-17 16-19 UART Input Port Registers (UIPn)......................................................................................16-17 16-20 UART Output Port Command Registers (UOP1/UOP0).....................................................16-18 16-21 UART Block Diagram Showing External and Internal Interface Signals.............................16-18 16-22 UART/RS-232 Interface......................................................................................................16-19 16-23 Clocking Source Diagram...................................................................................................16-20 16-24 Transmitter and Receiver Functional Diagram....................................................................16-22 16-25 Transmitter Timing..............................................................................................................16-23 16-26 Receiver Timing..................................................................................................................16-24 16-27 Automatic Echo...................................................................................................................16-27 16-28 Local Loop-Back.................................................................................................................16-27 16-29 Remote Loop-Back.............................................................................................................16-28 16-30 Multidrop Mode Timing Diagram.........................................................................................16-29 16-31 UART Mode Programming Flowchart (Sheet 1 of 5)..........................................................16-30 17-1 Port A Control Register (PACNT)..........................................................................................17-3 17-2 Port B Control Register (PBCNT)..........................................................................................17-5 17-3 Port D Control Register (PDCNT).........................................................................................17-8 17-4 Port A Data Direction Register (PADDR)............................................................................17-10 17-5 Port B Data Direction Register (PBDDR)............................................................................17-10 17-6 Port C Data Direction Register (PCDDR)............................................................................17-11 17-7 Port x Data Register (PADAT, PBDAT, and PCDAT).........................................................17-11 18-1 PWM Block Diagram (3 Identical Modules)...........................................................................18-1 18-2 PWM Control Registers (PWCRn)........................................................................................18-3 18-3 PWM Width Register (PWWDn)............................................................................................18-4 18-4 PWM Waveform Examples (PWCRn[EN] = 1)......................................................................18-4 19-1 MCF5272 Block Diagram with Signal Interfaces...................................................................19-2 20-1 Internal Operand Representation..........................................................................................20-5 20-2 MCF5272 Interface to Various Port Sizes.............................................................................20-5 20-3 Longword Read; EBI = 00; 32-Bit Port; Internal Termination................................................20-8 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 x Freescale Semiconductor

List of Figures (Continued) Figure Page Number Title Number 20-4 Word Write; EBI = 00; 16-/32-Bit Port; Internal Termination.................................................20-9 20-5 Longword Read with Address Setup; EBI = 00; 32-Bit Port; Internal Termination................20-9 20-6 Longword Write with Address Setup; EBI = 00; 32-Bit Port; Internal Termination..............20-10 20-7 Longword Read with Address Hold; EBI = 00; 32-Bit Port; Internal Termination................20-10 20-8 Longword Write with Address Hold; EBI = 00; 32-Bit Port; Internal Termination................20-11 20-9 Longword Read; EBI = 00; 32-Bit Port; Terminated by TA with One Wait State................20-11 20-10 Longword Read; EBI=11; 32-Bit Port; Internal Termination................................................20-12 20-11 Word Write; EBI=11; 16/32-Bit Port; Internal Termination..................................................20-13 20-12 Read with Address Setup; EBI=11; 32-Bit Port; Internal Termination.................................20-14 20-13 Longword Write with Address Setup; EBI=11; 32-Bit Port; Internal Termination................20-14 20-14 Read with Address Hold; EBI=11; 32-Bit Port; Internal Termination...................................20-15 20-15 Longword Write with Address Hold; EBI=11; 32-Bit Port; Internal Termination..................20-15 20-16 Longword Read with Address Setup and Address Hold; EBI = 11; 32-Bit Port, Internal Termination.........................................................................20-16 20-17 Longword Write with Address Setup and Address Hold; EBI = 11; 32-Bit Port, Internal Termination.........................................................................20-17 20-18 Example of a Misaligned Longword Transfer......................................................................20-18 20-19 Example of a Misaligned Word Transfer.............................................................................20-18 20-20 Longword Write Access To 32-Bit Port Terminated with TEA Timing.................................20-20 20-21 Master Reset Timing...........................................................................................................20-22 20-22 Normal Reset Timing..........................................................................................................20-23 20-23 Software Watchdog Timer Reset Timing............................................................................20-24 20-24 Soft Reset Timing ...............................................................................................................20-25 21-1 Test Access Port Block Diagram...........................................................................................21-2 21-2 TAP Controller State Machine...............................................................................................21-3 21-3 Output Cell (O.Cell) (BC–1)..................................................................................................21-4 21-4 Input Cell (I.Cell). Observe only (BC–4)................................................................................21-5 21-5 Output Control Cell (En.Cell) (BC–4)....................................................................................21-5 21-6 Bidirectional Cell (IO.Cell) (BC–6).........................................................................................21-6 21-7 General Arrangement for Bidirectional Pins..........................................................................21-6 21-8 Bypass Register....................................................................................................................21-8 22-1 MCF5272 Pinout (196 MAPBGA).........................................................................................22-1 22-2 196 MAPBGA Package Dimensions (Case No. 1128A-01)..................................................22-2 23-1 Clock Input Timing Diagram..................................................................................................23-5 23-2 General Input Timing Requirements.....................................................................................23-7 23-3 Read/Write SRAM Bus Timing..............................................................................................23-9 23-4 SRAM Bus Cycle Terminated by TA...................................................................................23-10 23-5 SRAM Bus Cycle Terminated by TEA.................................................................................23-11 23-6 Reset and Mode Select/HIZ Configuration Timing..............................................................23-12 23-7 Real-Time Trace AC Timing................................................................................................23-13 23-8 BDM Serial Port AC Timing.................................................................................................23-13 23-9 SDRAM Signal Timing........................................................................................................23-15 23-10 SDRAM Self-Refresh Cycle Timing....................................................................................23-16 23-11 MII Receive Signal Timing Diagram....................................................................................23-17 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xi

List of Figures (Continued) Figure Page Number Title Number 23-12 MII Transmit Signal Timing Diagram...................................................................................23-18 23-13 MII Async Inputs Timing Diagram.......................................................................................23-19 23-14 MII Serial Management Channel Timing Diagram..............................................................23-20 23-15 Timer Timing.......................................................................................................................23-21 23-16 UART Timing.......................................................................................................................23-22 23-17 IDL Master Timing...............................................................................................................23-23 23-18 IDL Slave Timing.................................................................................................................23-25 23-19 GCI Slave Mode Timing......................................................................................................23-26 23-20 GCI Master Mode Timing....................................................................................................23-27 23-21 General-Purpose I/O Port Timing........................................................................................23-28 23-22 USB Interface Timing..........................................................................................................23-29 23-23 IEEE 1149.1 (JTAG) Timing................................................................................................23-30 23-24 QSPI Timing........................................................................................................................23-31 23-25 PWM Timing........................................................................................................................23-32 B-1 Buffering and Termination.......................................................................................................B-2 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xii Freescale Semiconductor

Table of Contents Paragraph Page Number Title Number Chapter 1 Overview 1.1 MCF5272 Key Features .................................................................................................................1-1 1.2 MCF5272 Architecture ..................................................................................................................1-4 1.2.1 Version 2 ColdFire Core .....................................................................................................1-4 1.2.2 System Integration Module (SIM) ......................................................................................1-5 1.2.2.1 External Bus Interface ..........................................................................................1-5 1.2.2.2 Chip Select and Wait State Generation .................................................................1-5 1.2.2.3 System Configuration and Protection ...................................................................1-5 1.2.2.4 Power Management ..............................................................................................1-6 1.2.2.5 Parallel Input/Output Ports ...................................................................................1-6 1.2.2.6 Interrupt Inputs .....................................................................................................1-6 1.2.3 UART Module ....................................................................................................................1-6 1.2.4 Timer Module .....................................................................................................................1-7 1.2.5 Test Access Port .................................................................................................................1-7 1.3 System Design ..............................................................................................................................1-7 1.3.1 System Bus Configuration ..................................................................................................1-7 1.4 MCF5272-Specific Features ..........................................................................................................1-7 1.4.1 Physical Layer Interface Controller (PLIC) .......................................................................1-7 1.4.2 Pulse-Width Modulation (PWM) Unit ...............................................................................1-8 1.4.3 Queued Serial Peripheral Interface (QSPI) ........................................................................1-8 1.4.4 Universal Serial Bus (USB) Module ..................................................................................1-8 Chapter 2 ColdFire Core 2.1 Features and Enhancements ...........................................................................................................2-1 2.1.1 Decoupled Pipelines ...........................................................................................................2-1 2.1.1.1 Instruction Fetch Pipeline (IFP) ............................................................................2-2 2.1.1.2 Operand Execution Pipeline (OEP) ......................................................................2-2 2.1.1.2.1 Illegal Opcode Handling..............................................................................2-3 2.1.1.2.2 Hardware Multiply/Accumulate (MAC) Unit..............................................2-3 2.1.1.2.3 Hardware Divide Unit..................................................................................2-4 2.1.2 Debug Module Enhancements ............................................................................................2-4 2.2 Programming Model ......................................................................................................................2-4 2.2.1 User Programming Model ..................................................................................................2-4 2.2.1.1 Data Registers (D0–D7) .......................................................................................2-5 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xiii

Table of Contents (Continued) Paragraph Page Number Title Number 2.2.1.2 Address Registers (A0–A6) ..................................................................................2-5 2.2.1.3 Stack Pointer (A7, SP) ..........................................................................................2-5 2.2.1.4 Program Counter (PC) ..........................................................................................2-6 2.2.1.5 Condition Code Register (CCR) ...........................................................................2-6 2.2.1.6 MAC Programming Model ...................................................................................2-7 2.2.2 Supervisor Programming Model ........................................................................................2-7 2.2.2.1 Status Register (SR) ..............................................................................................2-8 2.2.2.2 Vector Base Register (VBR) .................................................................................2-8 2.2.2.3 Cache Control Register (CACR) ..........................................................................2-9 2.2.2.4 Access Control Registers (ACR0–ACR1) ............................................................2-9 2.2.2.5 ROM Base Address Register (ROMBAR) ...........................................................2-9 2.2.2.6 RAM Base Address Register (RAMBAR) ...........................................................2-9 2.2.2.7 Module Base Address Register (MBAR) .............................................................2-9 2.3 Integer Data Formats .....................................................................................................................2-9 2.4 Organization of Data in Registers ................................................................................................2-10 2.4.1 Organization of Integer Data Formats in Registers ..........................................................2-10 2.4.2 Organization of Integer Data Formats in Memory ...........................................................2-11 2.5 Addressing Mode Summary ........................................................................................................2-12 2.6 Instruction Set Summary .............................................................................................................2-13 2.6.1 Instruction Set Summary ..................................................................................................2-15 2.7 Instruction Timing ........................................................................................................................2-19 2.7.1 MOVE Instruction Execution Times ................................................................................2-20 2.7.2 Execution Timings—One-Operand Instructions ..............................................................2-22 2.7.3 Execution Timings—Two-Operand Instructions ..............................................................2-22 2.7.4 Miscellaneous Instruction Execution Times .....................................................................2-24 2.7.5 Branch Instruction Execution Times ................................................................................2-25 2.8 Exception Processing Overview ..................................................................................................2-25 2.8.1 Exception Stack Frame Definition ...................................................................................2-27 2.8.2 Processor Exceptions ........................................................................................................2-28 Chapter 3 Hardware Multiply/Accumulate (MAC) Unit 3.1 Overview ........................................................................................................................................3-1 3.1.1 MAC Programming Model .................................................................................................3-2 3.1.2 General Operation ..............................................................................................................3-3 3.1.3 MAC Instruction Set Summary ..........................................................................................3-4 3.1.4 Data Representation ............................................................................................................3-4 3.2 MAC Instruction Execution Timings .............................................................................................3-4 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xiv Freescale Semiconductor

Table of Contents (Continued) Paragraph Page Number Title Number Chapter 4 Local Memory 4.1 Interactions between Local Memory Modules ..............................................................................4-1 4.2 Local Memory Registers ................................................................................................................4-2 4.3 SRAM Overview ...........................................................................................................................4-2 4.3.1 SRAM Operation ................................................................................................................4-2 4.3.2 SRAM Programming Model ..............................................................................................4-2 4.3.2.1 SRAM Base Address Register (RAMBAR) .........................................................4-3 4.3.2.2 SRAM Initialization .............................................................................................4-4 4.3.2.3 Programming RAMBAR for Power Management ...............................................4-4 4.4 ROM Overview ..............................................................................................................................4-5 4.4.1 ROM Operation ..................................................................................................................4-5 4.4.2 ROM Programming Model .................................................................................................4-5 4.4.2.1 ROM Base Address Register (ROMBAR) ...........................................................4-5 4.4.2.2 Programming ROMBAR for Power Management ...............................................4-6 4.5 Instruction Cache Overview ..........................................................................................................4-7 4.5.1 Instruction Cache Physical Organization ...........................................................................4-7 4.5.2 Instruction Cache Operation ...............................................................................................4-8 4.5.2.1 Interaction with Other Modules ............................................................................4-8 4.5.2.2 Cache Coherency and Invalidation .......................................................................4-8 4.5.2.3 Caching Modes .....................................................................................................4-9 4.5.2.3.1 Cacheable Accesses.....................................................................................4-9 4.5.2.3.2 Cache-Inhibited Accesses............................................................................4-9 4.5.2.4 Reset ...................................................................................................................4-10 4.5.2.5 Cache Miss Fetch Algorithm/Line Fills .............................................................4-10 4.5.3 Instruction Cache Programming Model ...........................................................................4-12 4.5.3.1 Cache Control Register (CACR) ........................................................................4-12 4.5.3.2 Access Control Registers (ACR0 and ACR1) ....................................................4-14 Chapter 5 Debug Support 5.1 Overview ........................................................................................................................................5-1 5.2 Signal Description ..........................................................................................................................5-2 5.3 Real-Time Trace Support ...............................................................................................................5-3 5.3.1 Begin Execution of Taken Branch (PST= 0x5) .................................................................5-4 5.4 Programming Model ......................................................................................................................5-5 5.4.1 Revision A Shared Debug Resources .................................................................................5-7 5.4.2 Address Attribute Trigger Register (AATR) ......................................................................5-7 5.4.3 Address Breakpoint Registers (ABLR, ABHR) .................................................................5-9 5.4.4 Configuration/Status Register (CSR) ...............................................................................5-10 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xv

Table of Contents (Continued) Paragraph Page Number Title Number 5.4.5 Data Breakpoint/Mask Registers (DBR, DBMR) ............................................................5-12 5.4.6 Program Counter Breakpoint/Mask Registers (PBR, PBMR) ............................................................................................................................5-13 5.4.7 Trigger Definition Register (TDR) ...................................................................................5-14 5.5 Background Debug Mode (BDM) ...............................................................................................5-15 5.5.1 CPU Halt ..........................................................................................................................5-16 5.5.2 BDM Serial Interface .......................................................................................................5-17 5.5.2.1 Receive Packet Format .......................................................................................5-18 5.5.2.2 Transmit Packet Format ......................................................................................5-18 5.5.3 BDM Command Set .........................................................................................................5-19 5.5.3.1 ColdFire BDM Command Format ......................................................................5-20 5.5.3.1.1 Extension Words as Required....................................................................5-20 5.5.3.2 Command Sequence Diagrams ...........................................................................5-21 5.5.3.3 Command Set Descriptions ................................................................................5-22 5.5.3.3.1 Read A/D Register (RAREG/RDREG)...........................................................5-22 5.5.3.3.2 Write A/D Register (WAREG/WDREG)........................................................5-23 5.5.3.3.3 Read Memory Location (READ).................................................................5-24 5.5.3.3.4 Write Memory Location (WRITE)...............................................................5-25 5.5.3.3.5 Dump Memory Block (DUMP)...................................................................5-27 5.5.3.3.6 Fill Memory Block (FILL)..........................................................................5-28 5.5.3.3.7 Resume Execution (GO).............................................................................5-29 5.5.3.3.8 No Operation (NOP)....................................................................................5-30 5.5.3.3.9 Read Control Register (RCREG)..................................................................5-30 5.5.3.3.10 Write Control Register (WCREG)..............................................................5-31 5.5.3.3.11 Read Debug Module Register (RDMREG).................................................5-32 5.5.3.3.12 Write Debug Module Register (WDMREG)...............................................5-33 5.6 Real-Time Debug Support ...........................................................................................................5-33 5.6.1 Theory of Operation ..........................................................................................................5-34 5.6.1.1 Emulator Mode ...................................................................................................5-35 5.6.2 Concurrent BDM and Processor Operation ......................................................................5-35 5.7 Processor Status, DDATA Definition ...........................................................................................5-36 5.7.1 User Instruction Set ..........................................................................................................5-36 5.7.2 Supervisor Instruction Set ................................................................................................5-40 5.8 Freescale-Recommended BDM Pinout .......................................................................................5-41 Chapter 6 System Integration Module (SIM) 6.1 Features ..........................................................................................................................................6-1 6.2 Programming Model ......................................................................................................................6-2 6.2.1 SIM Register Memory Map ................................................................................................6-2 6.2.2 Module Base Address Register (MBAR) ...........................................................................6-3 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xvi Freescale Semiconductor

Table of Contents (Continued) Paragraph Page Number Title Number 6.2.3 System Configuration Register (SCR) ...............................................................................6-5 6.2.4 System Protection Register (SPR) ......................................................................................6-6 6.2.5 Power Management Register (PMR) ..................................................................................6-7 6.2.6 Activate Low-Power Register (ALPR) ............................................................................6-10 6.2.7 Device Identification Register (DIR) ...............................................................................6-11 6.2.8 Software Watchdog Timer ................................................................................................6-11 6.2.8.1 Watchdog Reset Reference Register (WRRR) ...................................................6-12 6.2.8.2 Watchdog Interrupt Reference Register (WIRR) ................................................6-12 6.2.8.3 Watchdog Counter Register (WCR) ...................................................................6-13 6.2.8.4 Watchdog Event Register (WER) .......................................................................6-13 Chapter 7 Interrupt Controller 7.1 Overview ........................................................................................................................................7-1 7.2 Interrupt Controller Registers ........................................................................................................7-2 7.2.1 Interrupt Controller Registers .............................................................................................7-3 7.2.2 Interrupt Control Registers (ICR1–ICR4) ..........................................................................7-4 7.2.2.1 Interrupt Control Register 1 (ICR1) .....................................................................7-4 7.2.2.2 Interrupt Control Register 2 (ICR2) .....................................................................7-5 7.2.2.3 Interrupt Control Register 3 (ICR3) .....................................................................7-5 7.2.2.4 Interrupt Control Register 4 (ICR4) .....................................................................7-5 7.2.3 Interrupt Source Register (ISR) ..........................................................................................7-6 7.2.4 Programmable Interrupt Transition Register (PITR) ..........................................................7-7 7.2.5 Programmable Interrupt Wakeup Register (PIWR) ............................................................7-8 7.2.6 Programmable Interrupt Vector Register (PIVR) ...............................................................7-9 Chapter 8 Chip Select Module 8.1 Overview ........................................................................................................................................8-1 8.1.1 Features ...............................................................................................................................8-1 8.1.2 Chip Select Usage ...............................................................................................................8-1 8.1.3 Boot CS0 Operation ...........................................................................................................8-2 8.2 Chip Select Registers .....................................................................................................................8-2 8.2.1 Chip Select Base Registers (CSBR0–CSBR7) ...................................................................8-3 8.2.2 Chip Select Option Registers (CSOR0–CSOR7) ...............................................................8-5 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xvii

Table of Contents (Continued) Paragraph Page Number Title Number Chapter 9 SDRAM Controller 9.1 Overview ........................................................................................................................................9-1 9.2 SDRAM Controller Signals ...........................................................................................................9-1 9.3 Interface to SDRAM Devices ........................................................................................................9-4 9.4 SDRAM Banks, Page Hits, and Page Misses ................................................................................9-6 9.5 SDRAM Registers .........................................................................................................................9-6 9.5.1 SDRAM Configuration Register (SDCR) ..........................................................................9-6 9.5.2 SDRAM Timing Register (SDTR) .....................................................................................9-8 9.6 Auto Initialization ..........................................................................................................................9-9 9.7 Power-Down and Self-Refresh ......................................................................................................9-9 9.8 Performance .................................................................................................................................9-10 9.9 Solving Timing Issues with SDCR[INV] ....................................................................................9-12 9.10 SDRAM Interface ......................................................................................................................9-14 9.10.1 SDRAM Read Accesses .................................................................................................9-15 9.10.2 SDRAM Write Accesses ................................................................................................9-18 9.10.3 SDRAM Refresh Timing ................................................................................................9-20 Chapter 10 DMA Controller 10.1 DMA Data Transfer Types .........................................................................................................10-1 10.2 DMA Address Modes ................................................................................................................10-2 10.3 DMA Controller Registers .........................................................................................................10-2 10.3.1 DMA Mode Register (DMR) .........................................................................................10-2 10.3.2 DMA Interrupt Register (DIR) .......................................................................................10-4 10.3.3 DMA Source Address Register (DSAR) ........................................................................10-5 10.3.4 DMA Destination Address Register (DDAR) ................................................................10-6 10.3.5 DMA Byte Count Register (DBCR) ...............................................................................10-6 Chapter 11 Ethernet Module 11.1 Overview ....................................................................................................................................11-1 11.1.1 Features ...........................................................................................................................11-1 11.2 Module Operation ......................................................................................................................11-1 11.3 Transceiver Connection .............................................................................................................11-3 11.4 FEC Frame Transmission ...........................................................................................................11-4 11.4.1 FEC Frame Reception ....................................................................................................11-5 11.4.2 CAM Interface ................................................................................................................11-6 11.4.3 Ethernet Address Recognition ........................................................................................11-6 11.4.4 Hash Table Algorithm .....................................................................................................11-8 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xviii Freescale Semiconductor

Table of Contents (Continued) Paragraph Page Number Title Number 11.4.5 Interpacket Gap Time .....................................................................................................11-8 11.4.6 Collision Handling ..........................................................................................................11-8 11.4.7 Internal and External Loopback .....................................................................................11-8 11.4.8 Ethernet Error-Handling Procedure ................................................................................11-9 11.4.8.1 Transmission Errors ..........................................................................................11-9 11.4.8.2 Reception Errors ...............................................................................................11-9 11.5 Programming Model ................................................................................................................11-10 11.5.1 Ethernet Control Register (ECR) ...................................................................................11-11 11.5.2 Interrupt Event Register (EIR) .....................................................................................11-12 11.5.3 Interrupt Mask Register (EIMR) ..................................................................................11-13 11.5.4 Interrupt Vector Status Register (IVSR) .......................................................................11-14 11.5.5 Receive Descriptor Active Register (RDAR) ...............................................................11-15 11.5.6 Transmit Descriptor Active Register (TDAR) .............................................................11-16 11.5.7 MII Management Frame Register (MMFR) .................................................................11-17 11.5.8 MII Speed Control Register (MSCR) ...........................................................................11-18 11.5.9 FIFO Receive Bound Register (FRBR) ........................................................................11-19 11.5.10 FIFO Receive Start Register (FRSR) .........................................................................11-20 11.5.11 Transmit FIFO Watermark (TFWR) ...........................................................................11-21 11.5.12 FIFO Transmit Start Register (TFSR) ........................................................................11-22 11.5.13 Receive Control Register (RCR) ................................................................................11-23 11.5.14 Maximum Frame Length Register (MFLR) ...............................................................11-24 11.5.15 Transmit Control Register (TCR) ...............................................................................11-25 11.5.16 RAM Perfect Match Address Low (MALR) ..............................................................11-26 11.5.16.1 RAM Perfect Match Address High (MAUR) ...............................................11-27 11.5.17 Hash Table High (HTUR) ...........................................................................................11-28 11.5.18 Hash Table Low (HTLR) ............................................................................................11-29 11.5.19 Pointer-to-Receive Descriptor Ring (ERDSR) ...........................................................11-30 11.5.20 Pointer-to-Transmit Descriptor Ring (ETDSR) ..........................................................11-31 11.5.21 Receive Buffer Size Register (EMRBR) ....................................................................11-32 11.5.22 Initialization Sequence ...............................................................................................11-33 11.5.22.1 Hardware Initialization .................................................................................11-33 11.5.23 User Initialization (Prior to Asserting ETHER_EN) ..................................................11-33 11.5.24 FEC Initialization .......................................................................................................11-34 11.5.24.1 User Initialization (after setting ETHER_EN) ..............................................11-34 11.6 Buffer Descriptors ....................................................................................................................11-34 11.6.1 FEC Buffer Descriptor Tables ......................................................................................11-35 11.6.1.1 Ethernet Receive Buffer Descriptor (RxBD) ..................................................11-35 11.6.1.2 Ethernet Transmit Buffer Descriptor ..............................................................11-37 11.7 Differences between MCF5272 FEC and MPC860T FEC ......................................................11-39 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xix

Table of Contents (Continued) Paragraph Page Number Title Number Chapter 12 Universal Serial Bus (USB) 12.1 Introduction ................................................................................................................................12-1 12.2 Module Operation ......................................................................................................................12-2 12.2.1 USB Module Architecture ..............................................................................................12-2 12.2.1.1 USB Transceiver Interface ................................................................................12-3 12.2.1.2 Clock Generator ................................................................................................12-4 12.2.1.3 USB Control Logic ...........................................................................................12-4 12.2.1.4 Endpoint Controllers .........................................................................................12-5 12.2.1.5 USB Request Processor ....................................................................................12-5 12.3 Register Description and Programming Model .........................................................................12-7 12.3.1 USB Memory Map .........................................................................................................12-7 12.3.2 Register Descriptions ......................................................................................................12-9 12.3.2.1 USB Frame Number Register (FNR) ...............................................................12-9 12.3.2.2 USB Frame Number Match Register (FNMR) .................................................12-9 12.3.2.3 USB Real-Time Frame Monitor Register (RFMR) ........................................12-10 12.3.2.4 USB Real-Time Frame Monitor Match Register (RFMMR) .........................12-11 12.3.2.5 USB Function Address Register (FAR) ..........................................................12-11 12.3.2.6 USB Alternate Settings Register (ASR) .........................................................12-12 12.3.2.7 USB Device Request Data 1 and 2 Registers (DRR1/ 2) ...............................12-13 12.3.2.8 USB Specification Number Register (SPECR) ..............................................12-14 12.3.2.9 USB Endpoint 0 Status Register (EP0SR) ......................................................12-14 12.3.2.10 USB Endpoint 0 IN Configuration Register (IEP0CFG) .............................12-15 12.3.2.11 USB Endpoint 0 OUT Configuration Register (OEP0CFG) ........................12-16 12.3.2.12 USB Endpoint 1–7 Configuration Register (EPnCFG) ................................12-16 12.3.2.13 USB Endpoint 0 Control Register (EP0CTL) ..............................................12-17 12.3.2.14 USB Endpoint 1–7 Control Register (EPnCTL) ..........................................12-20 12.3.2.15 USB Endpoint 0 Interrupt Mask (EP0IMR) and General/Endpoint 0 Interrupt Registers (EP0ISR) ..........................................................................................................12-22 12.3.2.16 USB Endpoints 1–7 Status / Interrupt Registers (EPnISR) ..........................12-25 12.3.2.17 USB Endpoint 1–7 Interrupt Mask Registers (EPnIMR) .............................12-26 12.3.2.18 USB Endpoint 0–7 Data Registers (EPnDR) ................................................12-27 12.3.2.19 USB Endpoint 0–7 Data Present Registers (EPnDPR) .................................12-28 12.3.3 Configuration RAM ......................................................................................................12-28 12.3.3.1 Configuration RAM Content ..........................................................................12-28 12.3.3.2 USB Device Configuration Example ..............................................................12-29 12.3.4 USB Module Access Times ..........................................................................................12-30 12.3.4.1 Registers .........................................................................................................12-30 12.3.4.2 Endpoint FIFOs ..............................................................................................12-30 12.3.4.3 Configuration RAM ........................................................................................12-30 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xx Freescale Semiconductor

Table of Contents (Continued) Paragraph Page Number Title Number 12.4 Software Architecture and Application Notes .........................................................................12-31 12.4.1 USB Module Initialization ...........................................................................................12-31 12.4.2 USB Configuration and Interface Changes ..................................................................12-31 12.4.3 FIFO Configuration ......................................................................................................12-32 12.4.4 Data Flow .....................................................................................................................12-32 12.4.4.1 Control, Bulk, and Interrupt Endpoints ..........................................................12-33 12.4.4.1.1 IN Endpoints..........................................................................................12-33 12.4.4.1.2 OUT Endpoints......................................................................................12-33 12.4.4.2 Isochronous Endpoints ....................................................................................12-33 12.4.4.2.1 IN Endpoints..........................................................................................12-34 12.4.4.2.2 OUT Endpoints......................................................................................12-34 12.4.5 Class- and Vendor-Specific Request Operation ............................................................12-34 12.4.6 remote wakeup and resume Operation .........................................................................12-35 12.4.7 Endpoint Halt Feature ...................................................................................................12-35 12.5 Line Interface ...........................................................................................................................12-36 12.5.1 Attachment Detection ...................................................................................................12-36 12.5.2 PCB Layout Recommendations ...................................................................................12-36 12.5.3 Recommended USB Protection Circuit ........................................................................12-37 Chapter 13 Physical Layer Interface Controller (PLIC) 13.1 Introduction ................................................................................................................................13-1 13.2 GCI/IDL Block ..........................................................................................................................13-3 13.2.1 GCI/IDL B- and D-Channel Receive Data Registers .....................................................13-3 13.2.2 GCI/IDL B- and D-Channel Transmit Data Registers ...................................................13-4 13.2.3 GCI/IDL B- and D-Channel Bit Alignment ...................................................................13-5 13.2.3.1 B-Channel Unencoded Data .............................................................................13-5 13.2.3.2 B-Channel HDLC Encoded Data ......................................................................13-6 13.2.3.3 D-Channel HDLC Encoded Data .....................................................................13-6 13.2.3.4 D-Channel Unencoded Data .............................................................................13-7 13.2.3.5 GCI/IDL D-Channel Contention .....................................................................13-8 13.2.4 GCI/IDL Looping Modes ...............................................................................................13-8 13.2.4.1 Automatic Echo Mode ......................................................................................13-9 13.2.4.2 Local Loopback Mode ......................................................................................13-9 13.2.4.3 Remote Loopback Mode ...................................................................................13-9 13.2.5 GCI/IDL Interrupts .........................................................................................................13-9 13.2.5.1 GCI/IDL Periodic Frame Interrupt ...................................................................13-9 13.2.5.2 GCI Aperiodic Status Interrupt ......................................................................13-10 13.2.5.3 Interrupt Control .............................................................................................13-11 13.3 PLIC Timing Generator ...........................................................................................................13-11 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxi

Table of Contents (Continued) Paragraph Page Number Title Number 13.3.1 Clock Synthesis ............................................................................................................13-11 13.3.2 Super Frame Sync Generation ......................................................................................13-13 13.3.3 Frame Sync Synthesis ...................................................................................................13-13 13.4 PLIC Register Memory Map ...................................................................................................13-13 13.5 PLIC Registers .........................................................................................................................13-15 13.5.1 B1 Data Receive Registers (P0B1RR–P3B1RR) .........................................................13-15 13.5.2 B2 Data Receive Registers (P0B2RR–P3B2RR) .........................................................13-16 13.5.3 D Data Receive Registers (P0DRR–P3DRR) ..............................................................13-16 13.5.4 B1 Data Transmit Registers (P0B1TR–P3B1TR) .........................................................13-17 13.5.5 B2 Data Transmit Registers (P0B2TR–P3B2TR) ........................................................13-17 13.5.6 D Data Transmit Registers (P0DTR–P3DTR) .............................................................13-18 13.5.7 Port Configuration Registers (P0CR–P3CR) ...............................................................13-18 13.5.8 Loopback Control Register (PLCR) .............................................................................13-20 13.5.9 Interrupt Configuration Registers (P0ICR–P3ICR) .....................................................13-20 13.5.10 Periodic Status Registers (P0PSR–P3PSR) ................................................................13-22 13.5.11 Aperiodic Status Register (PASR) ..............................................................................13-23 13.5.12 GCI Monitor Channel Receive Registers (P0GMR–P3GMR) ...................................13-24 13.5.13 GCI Monitor Channel Transmit Registers (P0GMT–P3GMT) ..................................13-25 13.5.14 GCI Monitor Channel Transmit Abort Register (PGMTA) .......................................13-26 13.5.15 GCI Monitor Channel Transmit Status Register (PGMTS) .......................................13-27 13.5.16 GCI C/I Channel Receive Registers (P0GCIR–P3GCIR) ..........................................13-28 13.5.17 GCI C/I Channel Transmit Registers (P0GCIT–P3GCIT) .........................................13-29 13.5.18 GCI C/I Channel Transmit Status Register (PGCITSR) ............................................13-30 13.5.19 D-Channel Status Register (PDCSR) .........................................................................13-31 13.5.20 D-Channel Request Register (PDRQR) .....................................................................13-32 13.5.21 Sync Delay Registers (P0SDR–P3SDR) ....................................................................13-33 13.5.22 Clock Select Register (PCSR) ....................................................................................13-34 13.6 Application Examples ..............................................................................................................13-35 13.6.1 Introduction ..................................................................................................................13-35 13.6.2 PLIC Initialization ........................................................................................................13-35 13.6.2.1 Port Configuration Example ...........................................................................13-35 13.6.2.2 Interrupt Configuration Example ....................................................................13-37 13.6.3 Example 1: ISDN SOHO PBX with Ports 0, 1, 2, and 3 ..............................................13-38 13.6.4 Example 2: ISDN SOHO PBX with Ports 1, 2, and 3 ..................................................13-40 13.6.5 Example 3: Two-Line Remote Access with Ports 0 and1 ...........................................13-41 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxii Freescale Semiconductor

Table of Contents (Continued) Paragraph Page Number Title Number Chapter 14 Queued Serial Peripheral Interface (QSPI) Module 14.1 Overview ....................................................................................................................................14-1 14.2 Features ......................................................................................................................................14-1 14.3 Module Description ...................................................................................................................14-1 14.3.1 Interface and Pins ...........................................................................................................14-3 14.3.2 Internal Bus Interface .....................................................................................................14-3 14.4 Operation ...................................................................................................................................14-3 14.4.1 QSPI RAM .....................................................................................................................14-4 14.4.1.1 Receive RAM ...................................................................................................14-5 14.4.1.2 Transmit RAM ..................................................................................................14-6 14.4.1.3 Command RAM ...............................................................................................14-6 14.4.2 Baud Rate Selection .......................................................................................................14-6 14.4.3 Transfer Delays ...............................................................................................................14-7 14.4.4 Transfer Length ..............................................................................................................14-8 14.4.5 Data Transfer ..................................................................................................................14-8 14.5 Programming Model ..................................................................................................................14-9 14.5.1 QSPI Mode Register (QMR) ..........................................................................................14-9 14.5.2 QSPI Delay Register (QDLYR) ...................................................................................14-11 14.5.3 QSPI Wrap Register (QWR) ........................................................................................14-12 14.5.4 QSPI Interrupt Register (QIR) ......................................................................................14-13 14.5.5 QSPI Address Register (QAR) .....................................................................................14-14 14.5.6 QSPI Data Register (QDR) ..........................................................................................14-14 14.5.7 Command RAM Registers (QCR0–QCR15) ...............................................................14-15 14.5.8 Programming Example .................................................................................................14-16 Chapter 15 Timer Module 15.1 Overview ....................................................................................................................................15-1 15.2 Timer Operation .........................................................................................................................15-1 15.3 General-Purpose Timer Registers ..............................................................................................15-3 15.3.1 Timer Mode Registers (TMR0–TMR3) ..........................................................................15-3 15.3.2 Timer Reference Registers (TRR0–TRR3) ....................................................................15-4 15.3.3 Timer Capture Registers (TCAP0–TCAP3) ...................................................................15-4 15.3.4 Timer Counters (TCN0–TCN3) .....................................................................................15-4 15.3.5 Timer Event Registers (TER0–TER3) ...........................................................................15-5 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxiii

Table of Contents (Continued) Paragraph Page Number Title Number Chapter 16 UART Modules 16.1 Overview ....................................................................................................................................16-1 16.2 Serial Module Overview ............................................................................................................16-2 16.3 Register Descriptions .................................................................................................................16-2 16.3.1 UART Mode Registers 1 (UMR1n) ...............................................................................16-4 16.3.2 UART Mode Register 2 (UMR2n) .................................................................................16-6 16.3.3 UART Status Registers (USRn) .....................................................................................16-7 16.3.4 UART Clock-Select Registers (UCSRn) ........................................................................16-8 16.3.5 UART Command Registers (UCRn) ..............................................................................16-9 16.3.6 UART Receiver Buffers (URBn) .................................................................................16-10 16.3.7 UART Transmitter Buffers (UTBn) .............................................................................16-11 16.3.8 UART Input Port Change Registers (UIPCRn) ............................................................16-11 16.3.9 UART Auxiliary Control Registers (UACRn) .............................................................16-12 16.3.10 UART Interrupt Status/Mask Registers (UISRn/UIMRn) ..........................................16-12 16.3.11 UART Divider Upper/Lower Registers (UDUn/UDLn) ............................................16-14 16.3.12 UART Autobaud Registers (UABUn/UABLn) ..........................................................16-14 16.3.13 UART Transmitter FIFO Registers (UTFn) ...............................................................16-15 16.3.14 UART Receiver FIFO Registers (URFn) ...................................................................16-16 16.3.15 UART Fractional Precision Divider Control Registers (UFPDn) ..............................16-17 16.3.16 UART Input Port Registers (UIPn) ............................................................................16-17 16.3.17 UART Output Port Command Registers (UOP1n/UOP0n) .......................................16-18 16.4 UART Module Signal Definitions ...........................................................................................16-18 16.5 Operation .................................................................................................................................16-19 16.5.1 Transmitter/Receiver Clock Source ..............................................................................16-19 16.5.1.1 Programmable Divider ....................................................................................16-20 16.5.1.2 Calculating Baud Rates ...................................................................................16-20 16.5.1.2.1 CLKIN Baud Rates................................................................................16-20 16.5.1.2.2 External Clock........................................................................................16-21 16.5.1.2.3 Autobaud Detection...............................................................................16-21 16.5.2 Transmitter and Receiver Operating Modes .................................................................16-22 16.5.2.1 Transmitting ...................................................................................................16-22 16.5.2.2 Receiver ..........................................................................................................16-24 16.5.2.3 Transmitter FIFO ............................................................................................16-25 16.5.2.4 Receiver FIFO ...............................................................................................16-25 16.5.3 Looping Modes .............................................................................................................16-26 16.5.3.1 Automatic Echo Mode ....................................................................................16-27 16.5.3.2 Local Loop-Back Mode ..................................................................................16-27 16.5.3.3 Remote Loop-Back Mode ...............................................................................16-27 16.5.4 Multidrop Mode ............................................................................................................16-28 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxiv Freescale Semiconductor

Table of Contents (Continued) Paragraph Page Number Title Number 16.5.5 Bus Operation ...............................................................................................................16-29 16.5.5.1 Read Cycles ....................................................................................................16-29 16.5.5.2 Write Cycles ...................................................................................................16-29 16.5.5.3 Interrupt Acknowledge Cycles .......................................................................16-29 16.5.6 Programming ................................................................................................................16-30 16.5.6.1 UART Module Initialization Sequence ..........................................................16-30 Chapter 17 General Purpose I/O Module 17.1 Overview ....................................................................................................................................17-1 17.2 Port Control Registers ................................................................................................................17-2 17.2.1 Port A Control Register (PACNT) ..................................................................................17-3 17.2.2 Port B Control Register (PBCNT) ..................................................................................17-5 17.2.3 Port C Control Register ..................................................................................................17-8 17.2.4 Port D Control Register (PDCNT) .................................................................................17-8 17.3 Data Direction Registers ..........................................................................................................17-10 17.3.1 Port A Data Direction Register (PADDR) ....................................................................17-10 17.3.2 Port B Data Direction Register (PBDDR) ....................................................................17-10 17.3.3 Port C Data Direction Register (PCDDR) ....................................................................17-11 17.4 Port Data Registers ..................................................................................................................17-11 17.4.1 Port Data Register (PxDAT) .........................................................................................17-11 Chapter 18 Pulse-Width Modulation (PWM) Module 18.1 Overview ....................................................................................................................................18-1 18.2 PWM Operation .........................................................................................................................18-2 18.3 PWM Programming Model .......................................................................................................18-2 18.3.1 PWM Control Register (PWCRn) ..................................................................................18-3 18.3.2 PWM Width Register (PWWDn) ...................................................................................18-4 Chapter 19 Signal Descriptions 19.1 MCF5272 Block Diagram with Signal Interfaces .....................................................................19-1 19.2 Signal List ..................................................................................................................................19-3 19.3 Address Bus (A[22:0]/SDA[13:0]) ..........................................................................................19-19 19.4 Data Bus (D[31:0]) ..................................................................................................................19-19 19.4.1 Dynamic Data Bus Sizing ............................................................................................19-19 19.5 Chip Selects (CS7/SDCS, CS[6:0]) .........................................................................................19-19 19.6 Bus Control Signals .................................................................................................................19-20 19.6.1 Output Enable/Read (OE/RD) ......................................................................................19-20 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxv

Table of Contents (Continued) Paragraph Page Number Title Number 19.6.2 Byte Strobes (BS[3:0]) .................................................................................................19-20 19.6.3 Read/Write (R/W) .........................................................................................................19-21 19.6.4 Transfer Acknowledge (TA/PB5) .................................................................................19-22 19.6.5 Hi-Z ..............................................................................................................................19-22 19.6.6 Bypass ...........................................................................................................................19-22 19.6.7 SDRAM Row Address Strobe (RAS0) ........................................................................19-22 19.6.8 SDRAM Column Address Strobe (CAS0) ...................................................................19-22 19.6.9 SDRAM Clock (SDCLK) .............................................................................................19-22 19.6.10 SDRAM Write Enable (SDWE) .................................................................................19-22 19.6.11 SDRAM Clock Enable (SDCLKE) ............................................................................19-22 19.6.12 SDRAM Bank Selects (SDBA[1:0]) ..........................................................................19-23 19.6.13 SDRAM Row Address 10 (A10)/A10 Precharge (A10_PRECHG) ..........................19-23 19.7 CPU Clock and Reset Signals ..................................................................................................19-23 19.7.1 RSTI .............................................................................................................................19-23 19.7.2 DRESETEN ..................................................................................................................19-23 19.7.3 CPU External Clock (CLKIN) .....................................................................................19-23 19.7.4 Reset Output (RSTO) ...................................................................................................19-23 19.8 Interrupt Request Inputs (INT[6:1]) .........................................................................................19-23 19.9 General-Purpose I/O (GPIO) Ports ..........................................................................................19-24 19.10 UART0 Module Signals and PB[4:0] ....................................................................................19-24 19.10.1 Transmit Serial Data Output (URT0_TxD/PB0) ........................................................19-24 19.10.2 Receive Serial Data Input (URT0_RxD/PB1) ............................................................19-25 19.10.3 Clear-to-Send (URT0_CTS/PB2) ...............................................................................19-25 19.10.4 Request to Send (URT0_RTS/PB3) ............................................................................19-25 19.10.5 Clock (URT0_CLK/PB4) ...........................................................................................19-25 19.11 USB Module Signals and PA[6:0] .........................................................................................19-25 19.11.1 USB Transmit Serial Data Output (USB_TP/PA0) ....................................................19-25 19.11.2 USB Receive Serial Data Input (USB_RP/PA1) ........................................................19-25 19.11.3 USB Receive Data Negative (USB_RN/PA2) ............................................................19-25 19.11.4 USB Transmit Data Negative (USB_TN/PA3) ...........................................................19-26 19.11.5 USB Suspend Driver (USB_SUSP/PA4) ....................................................................19-26 19.11.6 USB Transmitter Output Enable (USB_TxEN/PA5) ..................................................19-26 19.11.7 USB Rx Data Output (USB_RxD/PA6) .....................................................................19-26 19.11.8 USB_D+ and USB_D- ................................................................................................19-26 19.11.9 USB_CLK ..................................................................................................................19-26 19.11.10 INT1/USB Wake-on-Ring (USB_WOR) .................................................................19-26 19.12 Timer Module Signals ............................................................................................................19-27 19.12.1 Timer Input 0 (TIN0) ..................................................................................................19-27 19.12.2 Timer Output (TOUT0)/PB7 ......................................................................................19-27 19.12.3 Timer Input 1 (TIN1)/PWM Mode Output 2 (PWM_OUT2) ....................................19-27 19.12.4 Timer Output 1 (TOUT1)/PWM Mode Output 1 (PWM_OUT1) ..............................19-27 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxvi Freescale Semiconductor

Table of Contents (Continued) Paragraph Page Number Title Number 19.13 Ethernet Module Signals ........................................................................................................19-27 19.13.1 Transmit Clock (E_TxCLK) .......................................................................................19-27 19.13.2 Transmit Data (E_TxD0) ............................................................................................19-28 19.13.3 Collision (E_COL) .....................................................................................................19-28 19.13.4 Receive Data Valid (E_RxDV) ...................................................................................19-28 19.13.5 Receive Clock (E_RxCLK) ........................................................................................19-28 19.13.6 Receive Data (E_RxD0) .............................................................................................19-28 19.13.7 Transmit Enable (E_TxEN) ........................................................................................19-28 19.13.8 Transmit Data (E_TxD[3:1]/PB[10:8]) ......................................................................19-28 19.13.9 Receive Data (E_RxD[3:1]/PB[13:11]) ......................................................................19-28 19.13.10 Receive Error (E_RxER/PB14) ................................................................................19-29 19.13.11 Management Data Clock (E_MDC/PB15) ...............................................................19-29 19.13.12 Management Data (E_MDIO) ..................................................................................19-29 19.13.13 Transmit Error (E_TxER) .........................................................................................19-29 19.13.14 Carrier Receive Sense (E_CRS) ...............................................................................19-29 19.14 PWM Module Signals (PWM_OUT0–PWM_OUT2]) .........................................................19-29 19.15 Queued Serial Peripheral Interface (QSPI) Signals ...............................................................19-29 19.15.1 QSPI Synchronous Serial Data Output (QSPI_Dout/WSEL) ....................................19-30 19.15.2 QSPI Synchronous Serial Data Input (QSPI_Din) .....................................................19-30 19.15.3 QSPI Serial Clock (QSPI_CLK/BUSW1) ..................................................................19-30 19.15.4 Synchronous Peripheral Chip Select 0 (QSPI_CS0/BUSW0) ...................................19-30 19.15.5 Synchronous Peripheral Chip Select 1 (QSPI_CS1/PA11) ........................................19-30 19.15.6 Synchronous Peripheral Chip Select 2 (QSPI_CS2/URT1_CTS) ..............................19-30 19.15.7 Synchronous Peripheral Chip Select 3 (PA7/DOUT3/QSPI_CS3) ............................19-30 19.16 Physical Layer Interface Controller TDM Ports and UART 1 ..............................................19-31 19.16.1 GCI/IDL TDM Port 0. ................................................................................................19-31 19.16.1.1 Frame Sync (FSR0/FSC0/PA8) ....................................................................19-31 19.16.1.2 D-Channel Grant (DGNT0/PA9) ..................................................................19-31 19.16.1.3 Data Clock (DCL0/URT1_CLK) ..................................................................19-31 19.16.1.4 Serial Data Input (DIN0/URT1_RxD) ..........................................................19-31 19.16.1.5 UART1 CTS (URT1_CTS/QSPI_CS2) ........................................................19-32 19.16.1.6 UART1 RTS (URT1_RTS/INT5) .................................................................19-32 19.16.1.7 Serial Data Output (DOUT0/URT1_TxD) ...................................................19-32 19.16.1.8 D-Channel Request(DREQ0/PA10) .............................................................19-32 19.16.1.9 QSPI Chip Select 1 (QSPI_CS1/PA11) ........................................................19-32 19.16.2 GCI/IDL TDM Port 1 .................................................................................................19-32 19.16.2.1 GCI/IDL Data Clock (DCL1/GDCL1_OUT) ...............................................19-32 19.16.2.2 GCI/IDL Data Out (DOUT1) .......................................................................19-33 19.16.2.3 GCI/IDL Data In (DIN1) ..............................................................................19-33 19.16.2.4 GCI/IDL Frame Sync (FSC1/FSR1/DFSC1) ...............................................19-33 19.16.2.5 D-Channel Request (DREQ1/PA14) ............................................................19-33 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxvii

Table of Contents (Continued) Paragraph Page Number Title Number 19.16.2.6 D-Channel Grant (DGNT1_INT6/PA15_INT6) ...........................................19-33 19.16.3 GCI/IDL TDM Ports 2 and 3 ......................................................................................19-34 19.16.3.1 GCI/IDL Delayed Frame Sync 2 (DFSC2/PA12) .........................................19-34 19.16.3.2 GCI/IDL Delayed Frame Sync 3 (DFSC3/PA13) .........................................19-34 19.16.3.3 QSPI_CS3, Port 3 GCI/IDL Data Out 3, PA7 (PA7/DOUT3/QSPI_CS3) ...19-34 19.16.3.4 INT4 and Port 3 GCI/IDL Data In (INT4/DIN3) .........................................19-35 19.17 JTAG Test Access Port and BDM Debug Port ......................................................................19-35 19.17.1 Test Clock (TCK/PSTCLK) ........................................................................................19-35 19.17.2 Test Mode Select and Force Breakpoint (TMS/BKPT) ..............................................19-35 19.17.3 Test and Debug Data Out (TDO/DSO) ......................................................................19-36 19.17.4 Test and Debug Data In (TDI/DSI) ............................................................................19-36 19.17.5 JTAG TRST and BDM Data Clock (TRST/DSCLK) ................................................19-36 19.17.6 Freescale Test Mode Select (MTMOD) .....................................................................19-36 19.17.7 Debug Transfer Error Acknowledge (TEA) ...............................................................19-36 19.17.8 Processor Status Outputs (PST[3:0]) ..........................................................................19-36 19.17.9 Debug Data (DDATA[3:0]) ........................................................................................19-37 19.17.10 Device Test Enable (TEST) ......................................................................................19-37 19.18 Operating Mode Configuration Pins ......................................................................................19-37 19.19 Power Supply Pins .................................................................................................................19-38 Chapter 20 Bus Operation 20.1 Features ......................................................................................................................................20-1 20.2 Bus and Control Signals ............................................................................................................20-1 20.2.1 Address Bus (A[22:0]) ...................................................................................................20-2 20.2.2 Data Bus (D[31:0]) .........................................................................................................20-2 20.2.3 Read/Write (R/W) ...........................................................................................................20-2 20.2.4 Transfer Acknowledge (TA) ...........................................................................................20-2 20.2.5 Transfer Error Acknowledge (TEA) ...............................................................................20-3 20.3 Bus Exception: Double Bus Fault ..............................................................................................20-3 20.4 Bus Characteristics ....................................................................................................................20-3 20.5 Data Transfer Mechanism ..........................................................................................................20-4 20.5.1 Bus Sizing .......................................................................................................................20-4 20.6 External Bus Interface Types .....................................................................................................20-7 20.6.1 Interface for FLASH/SRAM Devices with Byte Strobes ...............................................20-8 20.6.2 Interface for FLASH/SRAM Devices without Byte Strobes ........................................20-12 20.7 Burst Data Transfers ................................................................................................................20-17 20.8 Misaligned Operands ...............................................................................................................20-18 20.9 Interrupt Cycles ........................................................................................................................20-19 20.10 Bus Errors ..............................................................................................................................20-19 20.11 Bus Arbitration .......................................................................................................................20-21 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxviii Freescale Semiconductor

Table of Contents (Continued) Paragraph Page Number Title Number 20.12 Reset Operation ......................................................................................................................20-21 20.12.1 Master Reset ...............................................................................................................20-22 20.12.2 Normal Reset ..............................................................................................................20-23 20.12.3 Software Watchdog Timer Reset Operation ...............................................................20-24 20.12.4 Soft Reset Operation ...................................................................................................20-25 Chapter 21 IEEE 1149.1 Test Access Port (JTAG) 21.1 Overview ....................................................................................................................................21-1 21.2 JTAG Test Access Port and BDM Debug Port ..........................................................................21-2 21.3 TAP Controller ...........................................................................................................................21-3 21.4 Boundary Scan Register .............................................................................................................21-4 21.5 Instruction Register ....................................................................................................................21-7 21.6 Restrictions ................................................................................................................................21-8 21.7 Non-IEEE 1149.1 Operation ......................................................................................................21-8 Chapter 22 Mechanical Data 22.1 Pinout .........................................................................................................................................22-1 22.2 Package Dimensions ..................................................................................................................22-2 Chapter 23 Electrical Characteristics 23.1 Maximum Ratings ......................................................................................................................23-1 23.1.1 Supply, Input Voltage, and Storage Temperature ...........................................................23-1 23.1.2 Operating Temperature ...................................................................................................23-2 23.1.3 Resistance .......................................................................................................................23-2 23.2 DC Electrical Specifications ......................................................................................................23-3 23.2.1 Output Driver Capability and Loading ...........................................................................23-3 23.3 AC Electrical Specifications ......................................................................................................23-5 23.3.1 Clock Input and Output Timing Specifications ..............................................................23-5 23.3.2 Processor Bus Input Timing Specifications ....................................................................23-6 23.3.3 Processor Bus Output Timing Specifications .................................................................23-8 23.4 Debug AC Timing Specifications ............................................................................................23-13 23.5 SDRAM Interface Timing Specifications ................................................................................23-14 23.6 Fast Ethernet AC Timing Specifications .................................................................................23-17 23.6.1 MII Receive Signal Timing (E_RxD[3:0], E_RxDV, E_RxER, and E_RxCLK) ........23-17 23.6.2 MII Transmit Signal Timing (E_TxD[3:0], E_TxEN, E_TxER, E_TxCLK) ..............23-18 23.6.3 MII Async Inputs Signal Timing (CRS and COL) .......................................................23-19 23.6.4 MII Serial Management Channel Timing (MDIO and MDC) .....................................23-20 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxix

Table of Contents (Continued) Paragraph Page Number Title Number 23.7 Timer Module AC Timing Specifications ................................................................................23-21 23.8 UART Modules AC Timing Specifications .............................................................................23-22 23.9 PLIC Module: IDL and GCI Interface Timing Specifications ................................................23-23 23.10 General-Purpose I/O Port AC Timing Specifications ............................................................23-28 23.11 USB Interface AC Timing Specifications ..............................................................................23-29 23.12 IEEE 1149.1 (JTAG) AC Timing Specifications ...................................................................23-30 23.13 QSPI Electrical Specifications ...............................................................................................23-31 23.14 PWM Electrical Specifications ..............................................................................................23-32 Appendix A List of Memory Maps A.1 List of Memory Map Tables............................................................................................................ A-1 Appendix B Buffering and Impedance Matching Index 1 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxx Freescale Semiconductor

List of Tables Table Page Number Title Number 2-1 CCR Field Descriptions ..........................................................................................................2-6 2-2 MOVEC Register Map.............................................................................................................2-7 2-3 Status Field Descriptions........................................................................................................2-8 2-4 Integer Data Formats..............................................................................................................2-9 2-5 ColdFire Effective Addressing Modes..................................................................................2-12 2-6 Notational Conventions........................................................................................................2-13 2-7 User-Mode Instruction Set Summary....................................................................................2-15 2-8 Supervisor-Mode Instruction Set Summary.........................................................................2-18 2-9 Misaligned Operand References..........................................................................................2-19 2-10 Move Byte and Word Execution Times.................................................................................2-20 2-11 Move Long Execution Times................................................................................................2-21 2-12 Move Execution Times.........................................................................................................2-21 2-13 One-Operand Instruction Execution Times...........................................................................2-22 2-14 Two-Operand Instruction Execution Times...........................................................................2-22 2-15 Miscellaneous Instruction Execution Times..........................................................................2-24 2-16 General Branch Instruction Execution Times........................................................................2-25 2-17 Bcc Instruction Execution Times..........................................................................................2-25 2-18 Exception Vector Assignments.............................................................................................2-26 2-19 Format Field Encoding..........................................................................................................2-27 2-20 Fault Status Encodings.........................................................................................................2-28 2-21 MCF5272 Exceptions..........................................................................................................2-28 3-1 MAC Instruction Summary......................................................................................................3-4 4-1 Memory Map of Instruction Cache Registers..........................................................................4-2 4-2 RAMBAR Field Description.....................................................................................................4-3 4-3 Examples of Typical RAMBAR Settings..................................................................................4-4 4-4 ROMBAR Field Description.....................................................................................................4-6 4-5 Examples of Typical ROMBAR Settings.................................................................................4-6 4-6 Instruction Cache Operation as Defined by CACR[CENB,CEIB]..........................................4-11 4-7 Memory Map of Instruction Cache Registers........................................................................4-12 4-8 CACR Field Descriptions......................................................................................................4-13 4-9 ACRn Field Descriptions.......................................................................................................4-14 5-1 Debug Module Signals............................................................................................................5-2 5-2 Processor Status Encoding.....................................................................................................5-3 5-3 BDM/Breakpoint Registers......................................................................................................5-6 5-4 Rev. A Shared BDM/Breakpoint Hardware.............................................................................5-7 5-5 AATR Field Descriptions.........................................................................................................5-7 5-6 ABLR Field Description...........................................................................................................5-9 5-7 ABHR Field Description..........................................................................................................5-9 5-8 CSR Field Descriptions.........................................................................................................5-10 5-9 DBR Field Descriptions.........................................................................................................5-12 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxxi

List of Tables (Continued) Table Page Number Title Number 5-10 DBMR Field Descriptions......................................................................................................5-12 5-11 Access Size and Operand Data Location.............................................................................5-12 5-12 PBR Field Descriptions.........................................................................................................5-13 5-13 PBMR Field Descriptions......................................................................................................5-13 5-14 TDR Field Descriptions.........................................................................................................5-14 5-15 Receive BDM Packet Field Description................................................................................5-18 5-16 Transmit BDM Packet Field Description...............................................................................5-18 5-17 BDM Command Summary....................................................................................................5-19 5-18 BDM Field Descriptions.........................................................................................................5-20 5-19 Control Register Map............................................................................................................5-30 5-20 Definition of DRc Encoding—Read.......................................................................................5-32 5-21 DDATA[3:0]/CSR[BSTAT] Breakpoint Response.................................................................5-34 5-22 PST/DDATA Specification for User-Mode Instructions.........................................................5-37 5-23 PST/DDATA Specification for Supervisor-Mode Instructions................................................5-40 6-1 SIM Registers .........................................................................................................................6-3 6-2 MBAR Field Descriptions.......................................................................................................6-4 6-3 SCR Field Descriptions...........................................................................................................6-5 6-4 SPR Field Descriptions...........................................................................................................6-6 6-5 PMR Field Descriptions...........................................................................................................6-8 6-6 USB and USART Power Down Modes...................................................................................6-9 6-7 Exiting Sleep and Stop Modes..............................................................................................6-10 6-8 DIR Field Descriptions..........................................................................................................6-11 6-9 WRRR Field Descriptions.....................................................................................................6-12 6-10 WIRR Field Descriptions.......................................................................................................6-13 6-11 WER Field Descriptions........................................................................................................6-13 7-1 Interrupt Controller Registers..................................................................................................7-2 7-2 Interrupt and Power Management Register Mnemonics.........................................................7-3 7-3 ICR Field Descriptions............................................................................................................7-4 7-4 ISR Field Descriptions.............................................................................................................7-6 7-5 PITR Field Descriptions..........................................................................................................7-7 7-6 PIWR Field Descriptions.........................................................................................................7-8 7-7 PIVR Field Descriptions..........................................................................................................7-9 7-8 MCF5272 Interrupt Vector Table...........................................................................................7-10 8-1 CSCR and CSOR Values after Reset.....................................................................................8-2 8-2 CSBRn Field Descriptions.......................................................................................................8-3 8-3 Output Read/Write Strobe Levels versus Chip Select EBI Code............................................8-4 8-4 Chip Select Memory Address Decoding Priority.....................................................................8-5 8-5 CSORn Field Descriptions......................................................................................................8-5 9-1 SDRAM Controller Signal Descriptions...................................................................................9-2 9-2 Connecting BS[3:0] to DQMx..................................................................................................9-4 9-3 Configurations for 16-Bit Data Bus..........................................................................................9-4 9-4 Configurations for 32-Bit Data Bus..........................................................................................9-4 9-5 Internal Address Multiplexing (16-Bit Data Bus).....................................................................9-5 9-6 Internal Address Multiplexing (32-Bit Data Bus).....................................................................9-5 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxxii Freescale Semiconductor

List of Tables (Continued) Table Page Number Title Number 9-7 SDCR Field Descriptions........................................................................................................9-7 9-8 SDTR Field Descriptions.........................................................................................................9-8 9-9 SDRAM Controller Performance, 32-Bit Port, (RCD = 0, RP = 1) or (RCD = 1, RP = 0)......9-10 9-10 SDRAM Controller Performance, 32–Bit Port, (RCD = 0, RP = 0)........................................9-10 9-11 SDRAM Controller Performance (RCD = 1, RP = 1), 16-Bit Port..........................................9-11 9-12 SDRAM Controller Performance, 16-Bit Port, (RCD=0, RP=1) or (RCD=1, RP = 0)9-11 9-13 SDRAM Controller Performance, 16-Bit Port, (RCD=0, RP=0).............................................9-12 10-1 DMA Data Transfer Matrix....................................................................................................10-1 10-2 DMR Field Descriptions........................................................................................................10-2 10-3 DIR Field Descriptions..........................................................................................................10-4 11-1 MII Mode...............................................................................................................................11-3 11-2 Seven-Wire Mode Configuration...........................................................................................11-4 11-3 Ethernet Address Recognition..............................................................................................11-7 11-4 Transmission Errors..............................................................................................................11-9 11-5 Reception Errors...................................................................................................................11-9 11-6 FEC Register Memory Map.................................................................................................11-10 11-7 ECR Field Descriptions.......................................................................................................11-11 11-8 EIR Field Descriptions.........................................................................................................11-12 11-9 EIMR Register Field Descriptions.......................................................................................11-13 11-10 IVSR Field Descriptions......................................................................................................11-14 11-11 RDAR Register Field Descriptions......................................................................................11-15 11-12 TDAR Field Descriptions.....................................................................................................11-16 11-13 MMFR Field Descriptions....................................................................................................11-17 11-14 MSCR Field Descriptions....................................................................................................11-18 11-15 Programming Examples for MSCR Register.......................................................................11-19 11-16 FRBR Field Descriptions.....................................................................................................11-19 11-17 FRSR Field Descriptions.....................................................................................................11-20 11-18 TFWR Field Descriptions....................................................................................................11-21 11-19 TFSR Field Descriptions.....................................................................................................11-22 11-20 RCR Field Descriptions.......................................................................................................11-23 11-21 MFLR Field Descriptions.....................................................................................................11-24 11-22 TCR Field Descriptions.......................................................................................................11-25 11-23 MALR Field Descriptions.....................................................................................................11-26 11-24 MAUR Field Descriptions....................................................................................................11-27 11-25 HTUR Field Descriptions.....................................................................................................11-28 11-26 HTLR Field Descriptions.....................................................................................................11-29 11-27 ERDSR Field Descriptions..................................................................................................11-30 11-28 ETDSR Field Descriptions..................................................................................................11-31 11-29 EMRBR Field Descriptions..................................................................................................11-32 11-30 Hardware Initialization.........................................................................................................11-33 11-31 ETHER_EN = 0...................................................................................................................11-33 11-32 User Initialization Process (before ETHER_EN).................................................................11-33 11-33 User Initialization (after ETHER_EN)..................................................................................11-34 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxxiii

List of Tables (Continued) Table Page Number Title Number 11-34 RxBD Field Descriptions.....................................................................................................11-36 11-35 TxBD Field Descriptions......................................................................................................11-37 12-1 USB Device Requests...........................................................................................................12-5 12-2 USB Memory Map.................................................................................................................12-7 12-3 FNR Field Descriptions.........................................................................................................12-9 12-4 FNMR Field Descriptions......................................................................................................12-9 12-5 RFMR Field Descriptions....................................................................................................12-10 12-6 RFMMR Field Descriptions.................................................................................................12-11 12-7 FAR Field Descriptions.......................................................................................................12-11 12-8 ASR Field Descriptions.......................................................................................................12-12 12-9 SPECR Field Descriptions..................................................................................................12-14 12-10 EP0SR Field Descriptions...................................................................................................12-14 12-11 IEP0CFG Field Descriptions...............................................................................................12-15 12-12 EP0CTL Field Descriptions.................................................................................................12-17 12-13 EPnCTL Field Descriptions.................................................................................................12-20 12-14 EP0IMR and EP0ISR Field Descriptions............................................................................12-22 12-15 EPnISR Field Descriptions..................................................................................................12-25 12-16 EPnIMR Field Descriptions.................................................................................................12-26 12-17 EPnDR Field Descriptions...................................................................................................12-27 12-18 EPnDPR Field Descriptions................................................................................................12-28 12-19 USB FIFO Access Timing...................................................................................................12-30 12-20 Example FIFO Setup ..........................................................................................................12-32 13-1 PLIC Module Memory Map.................................................................................................13-13 13-2 P0CR–P3CR Field Descriptions.........................................................................................13-19 13-3 PLCR Field Description.......................................................................................................13-20 13-4 P0ICR–P3ICR Field Descriptions.......................................................................................13-21 13-5 P0PSR–P3PSR Field Descriptions.....................................................................................13-22 13-6 PASR Field Descriptions.....................................................................................................13-23 13-7 P0GMR–P3GMR Field Descriptions...................................................................................13-24 13-8 P0GMT–P3GMT Field Descriptions....................................................................................13-25 13-9 PGMTA Field Descriptions..................................................................................................13-26 13-10 PGMTS Field Descriptions..................................................................................................13-27 13-11 P0GCIR–P3GCIR Field Descriptions..................................................................................13-28 13-12 P0GCIT–P3GCIT Field Descriptions...................................................................................13-29 13-13 PGCITSR Field Descriptions...............................................................................................13-30 13-14 PDCSR Field Descriptions..................................................................................................13-31 13-15 PDRQR Field Descriptions..................................................................................................13-32 13-16 P0SDR–P3SDR Field Descriptions.....................................................................................13-33 13-17 PCSR Field Descriptions.....................................................................................................13-34 14-1 QSPI Input and Output Signals and Functions.....................................................................14-3 14-2 QSPI_CLK Frequency as Function of CPU Clock and Baud Rate.......................................14-7 14-3 QMR Field Descriptions........................................................................................................14-9 14-4 QDLYR Field Descriptions..................................................................................................14-11 14-5 QWR Field Descriptions......................................................................................................14-12 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxxiv Freescale Semiconductor

List of Tables (Continued) Table Page Number Title Number 14-6 QIR Field Descriptions........................................................................................................14-13 14-7 QCR0–QCR15 Field Descriptions.......................................................................................14-15 15-1 TMRn Field Descriptions.......................................................................................................15-3 15-2 TERn Field Descriptions.......................................................................................................15-5 16-1 UART Module Programming Model......................................................................................16-3 16-2 UMR1n Field Descriptions....................................................................................................16-5 16-3 UMR2n Field Descriptions....................................................................................................16-6 16-4 USRn Field Descriptions.......................................................................................................16-7 16-5 UCSRn Field Descriptions....................................................................................................16-8 16-6 UCRn Field Descriptions.......................................................................................................16-9 16-7 UIPCRn Field Descriptions.................................................................................................16-11 16-8 UACRn Field Descriptions..................................................................................................16-12 16-9 UISRn/UIMRn Field Descriptions........................................................................................16-13 16-10 UTFn Field Descriptions......................................................................................................16-15 16-11 URFn Field Descriptions.....................................................................................................16-16 16-12 UFPDn Field Descriptions...................................................................................................16-17 16-13 UIPn Field Descriptions.......................................................................................................16-17 16-14 UOP1/UOP0 Field Descriptions..........................................................................................16-18 16-15 UART Module Signals.........................................................................................................16-19 16-16 Transmitter FIFO Status Bits...............................................................................................16-25 16-17 Receiver FIFO Status Bits...................................................................................................16-26 17-1 GPIO Signal Multiplexing......................................................................................................17-1 17-2 GPIO Port Register Memory Map.........................................................................................17-2 17-3 PACNT Field Descriptions....................................................................................................17-3 17-4 Port A Control Register Function Bits...................................................................................17-5 17-5 PBCNT Field Descriptions....................................................................................................17-6 17-6 Port B Control Register Function Bits...................................................................................17-7 17-7 PDCNT Field Descriptions....................................................................................................17-8 17-8 Port D Control Register Function Bits...................................................................................17-9 17-9 PADDR Field Descriptions..................................................................................................17-10 18-1 PWM Module Memory Map...................................................................................................18-2 18-2 PWCRn Field Descriptions....................................................................................................18-3 18-3 PWWDn Field Descriptions...................................................................................................18-4 19-1 Signal Descriptions Sorted by Function................................................................................19-3 19-2 Signal Name and Description by Pin Number.....................................................................19-11 19-3 Byte Strobe Operation for 32-Bit Data Bus.........................................................................19-20 19-4 Byte Strobe Operation for 16-Bit Data Bus—SRAM Cycles19-21 19-5 Byte Strobe Operation for 16-Bit Data Bus—SDRAM Cycles19-21 19-6 Connecting BS[3:0] to DQMx..............................................................................................19-21 19-7 Processor Status Encoding.................................................................................................19-37 19-8 MCF5272 Bus Width Selection19-38 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxxv

List of Tables (Continued) Table Page Number Title Number 19-9 MCF5272 CS0 Memory Bus Width Selection19-38 19-10 MCF5272 High Impedance Mode Selection19-38 20-1 ColdFire Bus Signal Summary.............................................................................................20-1 20-2 Chip Select Memory Address Decoding Priority20-4 20-3 Byte Strobe Operation for 32-Bit Data Bus...........................................................................20-6 20-4 Byte Strobe Operation for 16-Bit Data Bus—SRAM Cycles20-6 20-5 Byte Strobe Operation for 16-Bit Data Bus—SDRAM Cycles20-6 20-6 Data Bus Requirement for Read/Write Cycles......................................................................20-7 20-7 External Bus Interface Codes for CSBRs.............................................................................20-8 21-1 JTAG Signals........................................................................................................................21-2 21-2 Instructions............................................................................................................................21-7 23-1 Maximum Supply, Input Voltage and Storage Temperature.................................................23-1 23-2 Operating Temperature.........................................................................................................23-2 23-3 Thermal Resistance..............................................................................................................23-2 23-4 DC Electrical Specifications.................................................................................................23-3 23-5 I/O Driver Capability..............................................................................................................23-3 23-6 Clock Input and Output Timing Specifications......................................................................23-5 23-7 Processor Bus Input Timing Specifications...........................................................................23-6 23-8 Processor Bus Output Timing Specifications........................................................................23-8 23-9 Debug AC Timing Specification..........................................................................................23-13 23-10 SDRAM Interface Timing Specifications.............................................................................23-14 23-11 MII Receive Signal Timing..................................................................................................23-17 23-12 MII Transmit Signal Timing.................................................................................................23-18 23-13 MII Async Inputs Signal Timing...........................................................................................23-19 23-14 MII Serial Management Channel Timing.............................................................................23-20 23-15 Timer Module AC Timing Specifications.............................................................................23-21 23-16 UART Modules AC Timing Specifications...........................................................................23-22 23-17 IDL Master Mode Timing, PLIC Ports 1, 2, and 3...............................................................23-23 23-18 IDL Slave Mode Timing, PLIC Ports 0–3............................................................................23-24 23-19 GCI Slave Mode Timing, PLIC Ports 0–3............................................................................23-25 23-20 GCI Master Mode Timing, PLIC PORTs 1, 2, 3..................................................................23-26 23-21 General-Purpose I/O Port AC Timing Specifications..........................................................23-28 23-22 USB Interface AC Timing Specifications.............................................................................23-29 23-23 IEEE 1149.1 (JTAG) AC Timing Specifications..................................................................23-30 23-24 QSPI Modules AC Timing Specifications............................................................................23-31 23-25 PWM Modules AC Timing Specifications............................................................................23-32 A-1 On-Chip Module Base Address Offsets from MBAR...............................................................A-1 A-2 CPU Space Registers Memory Map.......................................................................................A-2 A-3 On-Chip Peripherals and Configuration Registers Memory Map............................................A-2 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxxvi Freescale Semiconductor

List of Tables (Continued) Table Page Number Title Number A-4 Interrupt Control Register Memory Map..................................................................................A-2 A-5 Chip Select Register Memory Map.........................................................................................A-3 A-6 GPIO Port Register Memory Map...........................................................................................A-3 A-7 QSPI Module Memory Map.....................................................................................................A-4 A-8 PWM Module Memory Map.....................................................................................................A-4 A-9 DMA Module Memory Map.....................................................................................................A-4 A-10 UART0 Module Memory Map..................................................................................................A-5 A-11 UART1 Module Memory Map..................................................................................................A-6 A-12 SDRAM Controller Memory Map.............................................................................................A-7 A-13 Timer Module Memory Map....................................................................................................A-7 A-14 PLIC Module Memory Map.....................................................................................................A-8 A-15 Ethernet Module Memory Map................................................................................................A-9 A-16 USB Module Memory Map....................................................................................................A-10 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxxvii

MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xxxviii Freescale Semiconductor

® MCF5272 ColdFire Integrated Microprocessor User’s Manual To provide the most up-to-date information, the revision of our documents on the World Wide Web will be the most current. Your printed copy may be an earlier revision. To verify you have the latest information available, refer to: http://www.freescale.com/ The following revision history table summarizes changes contained in this document. For your convenience, the page number designators have been linked to the appropriate location. Document Revision History Rev. No. Substantive Change(s) 2.1 Updated to meet Freescale identity guidelines. 3 (cid:129) Formatting, layout, spelling, and grammar corrections. (cid:129) Corrected the TxFIFO bit description In Table16-9 (was “Once set, this bit is cleared by reading UTBn”, is “After being set, this bit is cleared by writing UTBn”). (cid:129) Corrected Figure20-12 (OE signal was asserting on the third SDCLK clock cycle, is asserting on the second SDCLK clock cycle). (cid:129) Corrected Figure20-13 (R/W and BS signals were asserting on the third SDCLK clock cycle, are asserting on the second SDCLK clock cycle). (cid:129) Corrected Figure20-16 (OE signal was asserting on the third SDCLK clock cycle, is asserting on the second SDCLK clock cycle). (cid:129) Corrected Figure20-17 (R/W and BS signals were asserting on the third SDCLK clock cycle, are asserting on the second SDCLK clock cycle). Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. ©Freescale Semiconductor, Inc., 2005. All rights reserved. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xxxix

About This Book The primary objective of this user’s manual is to define the functionality of the MCF5272 processors for use by software and hardware developers. The information in this book is subject to change without notice, as described in the disclaimers on the title page of this book. As with any technical documentation, it is the readers’ responsibility to be sure he is using the most recent version of the documentation. To locate any published errata or updates for this document, refer to the world-wide web at http://www.freescale.com. Audience This manual is intended for system software and hardware developers and applications programmers who want to develop products with the MCF5272. It is assumed that the reader understands operating systems, microprocessor system design, basic principles of software and hardware, and basic details of the ColdFire® architecture. Organization Following is a summary and brief description of the major sections of this manual: • Chapter 1, “Overview,” includes general descriptions of the modules and features incorporated in the MCF5272, focussing in particular on new features. • Chapter 2, “ColdFire Core,” provides an overview of the microprocessor core of the MCF5272. The chapter describes the organization of the Version 2 (V2) ColdFire 5200 processor core and an overview of the program-visible registers (the programming model) as they are implemented on the MCF5272. It also includes a full description of exception handling and a table of instruction timings. • Chapter 3, “Hardware Multiply/Accumulate (MAC) Unit,” describes the MCF5272 multiply/accumulate unit, which executes integer multiply, multiply-accumulate, and miscellaneous register instructions. The MAC is integrated into the operand execution pipeline (OEP). • Chapter 4, “Local Memory.” This chapter describes the MCF5272 implementation of the ColdFire V2 local memory specification. It consists of three major sections, as follows. — Section4.3, “SRAM Overview,” describes the MCF5272 on-chip static RAM (SRAM) implementation. It covers general operations, configuration, and initialization. It also provides information and examples of how to minimize power consumption when using the SRAM. — Section4.4, “ROM Overview,” describes the MCF5272 on-chip static ROM. The ROM module contains tabular data that the ColdFire core can access in a single cycle. — Section4.5, “Instruction Cache Overview,” describes the MCF5272 cache implementation, including organization, configuration, and coherency. It describes cache operations and how the cache interacts with other memory structures. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xl Freescale Semiconductor

• Chapter 5, “Debug Support,” describes the Revision A hardware debug support in the MCF5272. • Chapter 6, “System Integration Module (SIM),” describes the SIM programming model, bus arbitration, power management, and system-protection functions for the MCF5272. • Chapter 7, “Interrupt Controller,” describes operation of the interrupt controller portion of the SIM. Includes descriptions of the registers in the interrupt controller memory map and the interrupt priority scheme. • Chapter 8, “Chip Select Module,” describes the MCF5272 chip-select implementation, including the operation and programming model, which includes the chip-select address, mask, and control registers. • Chapter 9, “SDRAM Controller,” describes configuration and operation of the synchronous DRAM controller component of the SIM, including a general description of signals involved in SDRAM operations. It provides interface information for memory configurations using most common SDRAM devices for both 16- and 32-bit-wide data buses. The chapter concludes with signal timing diagrams. • Chapter 10, “DMA Controller,” provides an overview of the MCF5272’s one-channel DMA controller intended for memory-to-memory block data transfers. This chapter describes in detail its signals, registers, and operating modes. • Chapter 11, “Ethernet Module,” describes the MCF5272 fast Ethernet media access controller (MAC). This chapter begins with a feature-set overview, a functional block diagram, and transceiver connection information for both MII and seven-wire serial interfaces. The chapter concludes with detailed descriptions of operation and the programming model. • Chapter 12, “Universal Serial Bus (USB),” provides an overview of the USB module of the MCF5272, including detailed operation information and the USB programming model. Connection examples and circuit board layout considerations are also provided. • The USB Specification, Revision 1.1 is a recommended supplement to this chapter. It can be downloaded from http://www.usb.org. Chapter 2 of this specification, Terms and Abbreviations, provides definitions of many of the words found here. • Chapter 13, “Physical Layer Interface Controller (PLIC),” provides detailed information about the MCF5272’s physical layer interface controller, a module intended to support ISDN applications. The chapter begins with a description of operation and a series of related block diagrams starting with a high-level overview. Each successive diagram depicts progressively more internal detail. The chapter then describes timing generation and the programming model and concludes with three application examples. • Chapter 14, “Queued Serial Peripheral Interface (QSPI) Module,” provides a feature-set overview and description of operation, including details of the QSPI’s internal RAM organization. The chapter concludes with the programming model and a timing diagram. • Chapter 15, “Timer Module,” describes configuration and operation of the four general-purpose timer modules, timer 0, 1, 2 and 3. • Chapter 16, “UART Modules,” describes the use of the universal asynchronous/synchronous receiver/transmitters (UARTs) implemented on the MCF5272, including example register values for typical configurations. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xli

• Chapter 17, “General Purpose I/O Module,” describes the operation and programming model of the three general purpose I/O (GPIO) ports on the MCF5272. The chapter details pin assignment, direction-control, and data registers. • Chapter 18, “Pulse-Width Modulation (PWM) Module,” describes the configuration and operation of the pulse-width modulation (PWM) module. It includes a block diagram, programming model, and timing diagram. • Chapter 19, “Signal Descriptions,” provides a listing and brief description of all the MCF5272 signals. Specifically, it shows which are inputs or outputs, how they are multiplexed, and the state of each signal at reset. The first listing is organized by function, with signals appearing alphabetically within each functional group. This is followed by a second listing sorted by pin number. • Chapter 20, “Bus Operation,” describes the functioning of the bus for data-transfer operations, error conditions, bus arbitration, and reset operations. It includes detailed timing diagrams showing signal interaction. Operation of the bus is defined for transfers initiated by the MCF5272 as a bus master. The MCF5272 does not support external bus masters. Note that Chapter9, “SDRAM Controller,” describes DRAM cycles. • Chapter 21, “IEEE 1149.1 Test Access Port (JTAG),” describes configuration and operation of the MCF5272 Joint Test Action Group (JTAG) implementation. It describes those items required by the IEEE 1149.1 standard and provides additional information specific to the MCF5272. For internal details and sample applications, see the IEEE 1149.1 document. • Chapter 22, “Mechanical Data,” provides a functional pin listing and package diagram for the MCF5272. • Chapter 23, “Electrical Characteristics,” describes AC and DC electrical specifications and thermal characteristics for the MCF5272. Because additional speeds may have become available since the publication of this book, consult Freescale’s ColdFire web page, http://www.freescale.com, to confirm that this is the latest information. This manual includes the following two appendixes: • AppendixA, “List of Memory Maps,” provides the entire address-map for MCF5272 memory-mapped registers. • AppendixB, “Buffering and Impedance Matching,” provides some suggestions regarding interface circuitry between the MCF5272 and SDRAMs. This manual also includes an index. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xlii Freescale Semiconductor

Suggested Reading This section lists additional reading that provides background for the information in this manual as well as general information about the ColdFire architecture. General Information The following documentation provides useful information about the ColdFire architecture and computer architecture in general: ColdFire Documentation The ColdFire documentation is available from the sources listed on the back cover of this manual. Document order numbers are included in parentheses for ease in ordering. • ColdFire Programmers Reference Manual, R1.0 (MCF5200PRM/AD) • User’s manuals—These books provide details about individual ColdFire implementations and are intended to be used in conjunction with The ColdFire Programmers Reference Manual. These include the following: — ColdFire MCF5102 User’s Manual (MCF5102UM/AD) — ColdFire MCF5202 User’s Manual (MCF5202UM/AD) — ColdFire MCF5204 User’s Manual (MCF5204UM/AD) — ColdFire MCF5206 User’s Manual (MCF5206EUM/AD) — ColdFire MCF5206E User’s Manual (MCF5206EUM/AD) — ColdFire MCF5307 User’s Manual (MCF5307UM/AD) — ColdFire MCF5407 User’s Manual (MCF5407UM/AD) • ColdFire Programmers Reference Manual, R1.0 (MCF5200PRM/AD) • Using Microprocessors and Microcomputers: The Motorola Family, William C. Wray, Ross Bannatyne, Joseph D. Greenfield Additional literature on ColdFire implementations is being released as new processors become available. For a current list of ColdFire documentation, refer to the World Wide Web at http://www.freescale.com. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xliii

Conventions This document uses the following notational conventions: MNEMONICS In text, instruction mnemonics are shown in uppercase. mnemonics In code and tables, instruction mnemonics are shown in lowercase. italics Italics indicate variable command parameters. Book titles in text are set in italics. 0x0 Prefix to denote hexadecimal number 0b0 Prefix to denote binary number REG[FIELD] Abbreviations for registers are shown in uppercase. Specific bits, fields, or ranges appear in brackets. For example, RAMBAR[BA] identifies the base address field in the RAM base address register. nibble A 4-bit data unit byte An 8-bit data unit word A 16-bit data unit1 longword A 32-bit data unit x In some contexts, such as signal encodings, x indicates a don’t care. n Used to express an undefined numerical value ¬ NOT logical operator & AND logical operator | OR logical operator 1.The only exceptions to this appear in the discussion of serial communication modules that support variable-length data transmission units. To simplify the discussion these units are referred to as words regardless of length. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xliv Freescale Semiconductor

Acronyms and Abbreviations Table i lists acronyms and abbreviations used in this document. Tablei. Acronyms and Abbreviated Terms Term Meaning ADC Analog-to-digital conversion ALU Arithmetic logic unit AVEC Autovector BDM Background debug mode BIST Built-in self test BSDL Boundary-scan description language CODEC Code/decode DAC Digital-to-analog conversion DMA Direct memory access DSP Digital signal processing EA Effective address EDO Extended data output (DRAM) FIFO First-in, first-out GPIO General-purpose I/O I2C Inter-integrated circuit IEEE Institute for Electrical and Electronics Engineers IFP Instruction fetch pipeline IPL Interrupt priority level JEDEC Joint Electron Device Engineering Council JTAG Joint Test Action Group LIFO Last-in, first-out LRU Least recently used LSB Least-significant byte lsb Least-significant bit MAC Multiply accumulate unit, also Media access controller MBAR Memory base address register MSB Most-significant byte msb Most-significant bit Mux Multiplex NOP No operation MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xlv

Tablei. Acronyms and Abbreviated Terms (continued) Term Meaning OEP Operand execution pipeline PC Program counter PCLK Processor clock PLIC Physical layer interface controller PLL Phase-locked loop PLRU Pseudo least recently used POR Power-on reset PQFP Plastic quad flat pack PWM Pulse-width modulation QSPI Queued serial peripheral interface RISC Reduced instruction set computing Rx Receive SIM System integration module SOF Start of frame TAP Test access port TTL Transistor transistor logic Tx Transmit UART Universal asynchronous/synchronous receiver transmitter USB Universal serial bus MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xlvi Freescale Semiconductor

Terminology Conventions Table ii shows terminology conventions used throughout this document. Tableii. Notational Conventions Instruction Operand Syntax Opcode Wildcard cc Logical condition (example: NE for not equal) Register Specifications An Any address register n (example: A3 is address register 3) Ay,Ax Source and destination address registers, respectively Dn Any data register n (example: D5 is data register 5) Dy,Dx Source and destination data registers, respectively Rc Any control register (example VBR is the vector base register) Rm MAC registers (ACC, MAC, MASK) Rn Any address or data register Rw Destination register w (used for MAC instructions only) Ry,Rx Any source and destination registers, respectively Xi index register i (can be an address or data register: Ai, Di) Register Names ACC MAC accumulator register CCR Condition code register (lower byte of SR) MACSR MAC status register MASK MAC mask register PC Program counter SR Status register Port Name DDATA Debug data port PST Processor status port Miscellaneous Operands #<data> Immediate data following the 16-bit operation word of the instruction <ea> Effective address MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xlvii

Tableii. Notational Conventions (continued) Instruction Operand Syntax <ea>y,<ea>x Source and destination effective addresses, respectively <label> Assembly language program label <list> List of registers for MOVEM instruction (example: D3–D0) <shift> Shift operation: shift left (<<), shift right (>>) <size> Operand data size: byte (B), word (W), longword (L) bc Both instruction and data caches dc Data cache ic Instruction cache # <vector> Identifies the 4-bit vector number for trap instructions <> identifies an indirect data address referencing memory <xxx> identifies an absolute address referencing memory dn Signal displacement value, n bits wide (example: d16 is a 16-bit displacement) SF Scale factor (x1, x2, x4 for indexed addressing mode, <<1n>> for MAC operations) Operations + Arithmetic addition or postincrement indicator – Arithmetic subtraction or predecrement indicator x Arithmetic multiplication / Arithmetic division ~ Invert; operand is logically complemented & Logical AND | Logical OR ^ Logical exclusive OR << Shift left (example: D0 << 3 is shift D0 left 3 bits) >> Shift right (example: D0 >> 3 is shift D0 right 3 bits) → Source operand is moved to destination operand ←→ Two operands are exchanged sign-extended All bits of the upper portion are made equal to the high-order bit of the lower portion If <condition> Test the condition. If true, the operations after ‘then’ are performed. If the condition is false and the optional then <operations> ‘else’ clause is present, the operations after ‘else’ are performed. If the condition is false and else is else <operations> omitted, the instruction performs no operation. Refer to the Bcc instruction description as an example. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 xlviii Freescale Semiconductor

Tableii. Notational Conventions (continued) Instruction Operand Syntax Subfields and Qualifiers {} Optional operation () Identifies an indirect address d Displacement value, n-bits wide (example: d is a 16-bit displacement) n 16 Address Calculated effective address (pointer) Bit Bit selection (example: Bit 3 of D0) lsb Least significant bit (example: lsb of D0) LSB Least significant byte LSW Least significant word msb Most significant bit MSB Most significant byte MSW Most significant word Condition Code Register Bit Names C Carry N Negative V Overflow X Extend Z Zero MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor xlix

Register Identifiers Register identifiers in this user’s manual were changed from names used in early versions of the manual released under non-disclosure agreement (NDA). Because a significant amount of collateral documentation, such as source code, was developed using the old register names, Tableiii through Table xvi list the new register names and mnemonics as they should appear in the data book, along with the old ones. Identifiers that have changed are displayed in boldface type. Those that have not changed are marked “no change” in the ‘New Mnemonic’ column. Tableiii. On-Chip Peripherals and Configuration Registers Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0000 Module Base Address Register, Read Only MBAR No change 0x0004 System Configuration Register SCR No change 0x0006 System Protection Register SPR No change 0x0008 Power Management Register PMR No change 0x000E Activate Low Power Register ALPR No change 0x0010 Device Identification Register DIR No change Tableiv. Interrupt Control Register Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0020 Interrupt Control Register 1 ICR1 No change 0x0024 Interrupt Control Register 2 ICR2 No change 0x0028 Interrupt Control Register 3 ICR3 No change 0x002C Interrupt Control Register 4 ICR4 No change 0x0030 Interrupt Source Register ISR No change 0x0034 Programmable Interrupt Transition Register PITR No change 0x0038 Programmable Interrupt Wakeup Register PIWR No change 0x003F Programmable Interrupt Vector Register PIVR No change Tablev. Chip Select Register Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0040 CS Base Register 0 CSBR0 No change 0x0044 CS Option Register 0 CSOR0 No change 0x0048 CS Base Register 1 CSBR1 No change 0x004C CS Option Register 1 CSOR1 No change MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 l Freescale Semiconductor

Tablev. Chip Select Register Memory Map (continued) MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0050 CS Base Register 2 CSBR2 No change 0x0054 CS Option Register 2 CSOR2 No change 0x0058 CS Base Register 3 CSBR3 No change 0x005C CS Option Register 3 CSOR3 No change 0x0060 CS Base Register 4 CSBR4 No change 0x0064 CS Option Register 4 CSOR4 No change 0x0068 CS Base Register 5 CSBR5 No change 0x006C CS Option Register 5 CSOR5 No change 0x0070 CS Base Register 6 CSBR6 No change 0x0074 CS Option Register 6 CSOR6 No change 0x0078 CS Base Register 7 CSBR7 No change 0x007C CS Option Register 7 CSOR7 No change Tablevi. GPIO Port Register Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0080 Port A Control Register PACNT No change 0x0084 Port A Data Direction Register PADDR No change 0x0086 Port A Data Register PADAT No change 0x0088 Port B Control Register PBCNT No change 0x008C Port B Data Direction Register PBDDR No change 0x008E Port B Data Register PBDAT No change 0x0094 Port C Data Direction Register PCDDR No change 0x0096 Port C Data Register PCDAT No change 0x0098 Port D Control Register PDCNT No change Tablevii. QSPI Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x00A0 QSPI Mode Register SPMODE QMR 0x00A4 QSPI Delay Register SPDELAY QDLYR 0x00A8 QSPI Wrap Register SPWRAP QWR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor li

Tablevii. QSPI Module Memory Map (continued) MBAR Register Name Old Mnemonic New Mnemonic Offset 0x00AC QSPI Interrupt Register SPINT QIR 0x00B0 QSPI Address Register SPADDR QAR 0x00B4 QSPI Data Register SPDATA QDR Tableviii. PWM Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x00C0 PWM Control Register 0 PWMCR1 PWCR0 0x00C4 PWM Control Register 1 PWMCR2 PWCR1 0x00C8 PWM Control Register 2 PWMCR3 PWCR2 0x00D0 PWM Pulse-Width Register 0 PWMWD1 PWWD0 0x00D4 PWM Pulse-Width Register 1 PWMWD2 PWWD1 0x00D8 PWM Pulse-Width Register 2 PWMWD3 PWWD2 Tableix. DMA Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x00E0 DMA Mode Register DCMR No change 0x00E6 DMA Interrupt Register DCIR No change 0x00E8 DMA Byte Count Register DBCR No change 0x00EC DMA Source Address Register DSAR No change 0x00F0 DMA Destination Address Register DDAR No change Tablex. UART0 Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0100 UART0 Mode Register 1/2 U1MR1/U1MR2 U0MR1/U0MR2 0x0104 UART0 Status U1SR U0SR 0x0104 UART0 Clock Select Register U1CSR U0CSR 0x0108 UART0 Command Register U1CR U0CR 0x010C UART0 Receive Buffer U1RxB U0RxB 0x010C UART0 Transmit Buffer U1TxB U0TxB MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 lii Freescale Semiconductor

Tablex. UART0 Module Memory Map (continued) MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0110 UART0 CTS Change Register U1CCR U0CCR 0x0110 UART0 Auxiliary Control Register U1ACR U0ACR 0x0114 UART0 Interrupt Status Register U1ISR U0ISR 0x0114 UART0 Interrupt Mask Register U1IMR U0IMR 0x0118 UART0 Baud Prescaler MSB U1BG1 U0BG1 0x011C UART0 Baud Prescaler LSB U1BG2 U0BG2 0x0120 UART0 AutoBaud MSB Register U1ABR1 U0ABR1 0x0124 UART0 AutoBaud LSB Register U1ABR2 U0ABR2 0x0128 UART0 TxFIFO Control/Status Register U1TxFCSR U0TxFCSR 0x012C UART0 RxFIFO Control/Status Register U1RxFCSR U0RxFCSR 0x0134 UART0 CTS Unlatched Input U1IP U0IP 0x0138 UART0 RTS O/P Bit Set Command Register U1OP1 U0OP1 0x013C UART0 RTS O/P Bit Reset Command Register U1OP0 U0OP0 Tablexi. UART1 Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0140 UART1 Mode Register 1/2 U2MR1/U2MR2 U1MR1/U1MR2 0x0144 UART1 Status U2SR U1SR 0x0144 UART1 Clock Select Register U2CSR U1CSR 0x0148 UART1 Command Register U2CR U1CR 0x014C UART1 Receive Buffer U2RxB U1RxB 0x014C UART1 Transmit Buffer U2TxB U1TxB 0x0150 UART1 CTS Change Register U2CCR U1CCR 0x0150 UART1 Auxiliary Control Register U2ACR U1ACR 0x0154 UART1 Interrupt Status Register U2ISR U1ISR 0x0154 UART1 Interrupt Mask Register U2IMR U1IMR 0x0158 UART1 Baud Prescaler MSB U2BG1 U1BG1 0x015C UART1 Baud Prescaler LSB U2BG2 U1BG2 0x0160 UART1 AutoBaud MSB Register U2ABR1 U1ABR1 0x0164 UART1 AutoBaud LSB Register U2ABR2 U1ABR2 0x0168 UART1 TxFIFO Control/Status Register U2TxFCSR U1TxFCSR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor liii

Tablexi. UART1 Module Memory Map (continued) MBAR Register Name Old Mnemonic New Mnemonic Offset 0x016C UART1 RxFIFO Control/Status Register U2RxFCSR U1RxFCSR 0x0174 UART1 CTS Unlatched Input U2IP U1IP 0x0178 UART1 RTS O/P Bit Set Command Register U2OP1 U1OP1 0x017C UART1 RTS O/P Bit Reset Command Register U2OP0 U1OP0 Tablexii. SDRAM Controller Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0182 SDRAM Configuration Register SDCCR SDCR 0x0186 SDRAM Timing Register SDCTR SDTR Tablexiii. Timer Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0200 Timer 0 Mode Register TMR1 TMR0 0x0204 Timer 0 Reference Register TRR1 TRR0 0x0208 Timer 0 Capture Register TCR1 TCAP0 0x020C Timer 0 Counter Register TCN1 TCN0 0x0210 Timer 0 Event Register TER1 TER0 0x0220 Timer 1 Mode Register TMR2 TMR1 0x0224 Timer 1 Reference Register TRR2 TRR1 0x0228 Timer 1 Capture Register TCR2 TCAP1 0x022C Timer 1 Counter Register TCN2 TCN1 0x0230 Timer 1 Event Register TER2 TER1 0x0240 Timer 2 Mode Register TMR3 TMR2 0x0244 Timer 2 Reference Register TRR3 TRR2 0x0248 Timer 2 Capture Register TCR3 TCAP2 0x024C Timer 2 Counter Register TCN3 TCN2 0x0250 Timer 2 Event Register TER3 TER2 0x0260 Timer 3 Mode Register TMR4 TMR3 0x0264 Timer 3 Reference Register TRR4 TRR3 0x0268 Timer 3 Capture Register TCR4 TCAP3 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 liv Freescale Semiconductor

Tablexiii. Timer Module Memory Map (continued) MBAR Register Name Old Mnemonic New Mnemonic Offset 0x026C Timer 3 Counter Register TCN4 TCN3 0x0270 Timer 3 Event Register TER4 TER3 0x0280 Watchdog Reset Reference Register WRRR No change 0x0284 Watchdog Interrupt Reference Register WIRR No change 0x0288 Watchdog Counter Register WCR No change 0x028C Watchdog Event Register WER No change Tablexiv. PLIC Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0300 Port0 B1 Data Receive PLRB10 P0B1RR 0x0304 Port1 B1 Data Receive PLRB11 P1B1RR 0x0308 Port2 B1 Data Receive PLRB12 P2B1RR 0x030C Port3 B1 Data Receive PLRB13 P3B1RR 0x0310 Port0 B2 Data Receive PLRB20 P0B2RR 0x0314 Port1 B2 Data Receive PLRB21 P1B2RR 0x0318 Port2 B2 Data Receive PLRB22 P2B2RR 0x031C Port3 B2 Data Receive PLRB23 P3B2RR 0x0320 Port0-3 D Data Receive PLRD0 P0DRR PLRD1 P1DRR PLRD2 P2DRR PLRD3 P3DRR 0x0328 Port0 B1 Data Transmit PLTB10 P0B1TR 0x032C Port1 B1 Data Transmit PLTB11 P1B1TR 0x0330 Port2 B1 Data Transmit PLTB12 P2B1TR 0x0334 Port3 B1 Data Transmit PLTB13 P3B1TR 0x0338 Port0 B2 Data Transmit PLTB20 P0B2TR 0x033C Port1 B2 Data Transmit PLTB21 P1B2TR 0x0340 Port2 B2 Data Transmit PLTB22 P2B2TR 0x0344 Port3 B2 Data Transmit PLTB23 P3B2TR 0x0348 Port0-3 D Data Transmit PLTD0 P0DTR PLTD1 P1DTR PLTD2 P2DTR PLTD3 P3DTR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor lv

Tablexiv. PLIC Module Memory Map (continued) MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0350 Port0-1 GCI/IDL Configuration Register PLCR0 P0CR PLCR1 P1CR 0x0354 Port2-3 GCI/IDL Configuration Register PLCR2 P2CR PLCR3 P3CR 0x0358 Port0-1 Interrupt Configuration Register PLICR0 P0ICR PLICR1 P1ICR 0x035C Port2-3 Interrupt Configuration Register PLICR2 P2ICR PLICR3 P3ICR 0x0360 Port0-1 GCI Monitor RX PLGMR0 P0GMR PLGMR1 P1GMR 0x0364 Port2-3 GCI Monitor RX PLGMR2 P2GMR PLGMR3 P3GMR 0x0368 Port0-1 GCI Monitor TX PLGMT0 P0GMT PLGMT1 P1GMT 0x036C Port2-3 GCI Monitor TX PLGMT2 P2GMT PLGMT3 P3GMT 0x0370 GCI Monitor TX Status PLGMTS PGMTS GCI Monitor TX abort PLGMTA PGMTA 0x0374 Port0-3 GCI C/I RX PLGCIR0 P0GCIR PLGCIR1 P1GCIR PLGCIR2 P2GCIR PLGCIR3 P3GCIR 0x0378 Port0-3 GCI C/I TX PLGCIT0 P0GCIT PLGCIT1 P1GCIT PLGCIT2 P2GCIT PLGCIT3 P3GCIT 0x037C GCI C/I TX Status PGCITSR No change 0x0384 Port0-1 Periodic Status PLPSR0 P0PSR PLPSR1 P1PSR 0x0388 Port2-3 Periodic Status PLPSR2 P2PSR PLPSR3 P3PSR 0x038C Aperiodic Interrupt Status Register; PLASR PASR Loop back Control PLLCR PLCR 0x0392 D Channel Request PLDRQ PDRQR 0x0394 Port0-1 Sync Delay PLSD0 P0SDR PLSD1 P1SDR 0x0398 Port2-3 Sync Delay PLSD2 P2SDR PLSD3 P3SDR 0x039C Clock Select PLCKSEL PCSR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 lvi Freescale Semiconductor

Tablexv. Ethernet Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x0840 Ethernet Control Register ECNTRL ECR 0x0844 Ethernet Interrupt Event Register IEVENT EIR 0x0848 Ethernet Interrupt Mask Register IMASK EIMR 0x084C Ethernet Interrupt Vector Status IVEC IVSR 0x0850 Ethernet Rx Ring Updated Flag R_DES_ACTIVE RDAR 0x0854 Ethernet Tx Ring Updated Flag X_DES_ACTIVE TDAR 0x0880 Ethernet MII Data Register MII_DATA MMFR 0x0884 Ethernet MII Speed Register MII_SPEED MSCR 0x08CC Ethernet Receive Bound Register R_BOUND FRBR 0x08D0 Ethernet Rx FIFO Start Address R_FSTART FRSR 0x08E4 Transmit FIFO Watermark X_WMRK TFWR 0x08EC Ethernet Tx FIFO Start Address X_FSTART TFSR 0x0944 Ethernet Rx Control Register R_CNTRL RCR 0x0948 Maximum Frame Length Register MAX_FRM_LEN MFLR 0x0984 Ethernet Tx Control Register X_CNTRL TCR 0x0C00 Ethernet Address (Lower) ADDR_LOW MALR 0x0C04 Ethernet Address (Upper) ADDR_HIGH MAUR 0x0C08 Ethernet Hash Table (Upper) HASH_TABLE_HIGH HTUR 0x0C0C Ethernet Hash Table (Lower) HASH_TABLE_LOW HTLR 0x0C10 Ethernet Rx Descriptor Ring R_DES_START ERDSR 0x0C14 Ethernet Tx Descriptor Rin X_DES_START ETDSR 0x0C18 Ethernet Rx Buffer Size R_BUFF_SIZE EMRBR 0x0C40– FIFO RAM E_FIFO EFIFO 0x0DFF Tablexvi. USB Module Memory Map MBAR Register Name Old Mnemonic New Mnemonic Offset 0x1002 USB Frame Number Register USBFNR FNR 0x1006 USB Frame Number Match Register USBFNMR FNMR 0x100A USB Real-time Frame Monitor Register USBRTFMR RFMR 0x100E USB Real-time Frame Monitor Match Register USBRTFMMR RFMMR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor lvii

Tablexvi. USB Module Memory Map (continued) MBAR Register Name Old Mnemonic New Mnemonic Offset 0x1013 USB Function Address Register USBFAR FAR 0x1014 USB Alternate Setting Register USBASR ASR 0x1018 USB Device Request Data1 Register USBDRR1 DRR1 0x101C USB Device Request Data2 Register USBDRR2 DRR2 0x1022 USB Specification Number Register USBSPECR SPECR 0x1026 USB Endpoint 0 Status Register USBEPSR0 EP0SR 0x1028 USB Endpoint 0 IN Config Register USBEPICFG0 IEP0CFG 0x102C USB Endpoint 0 OUT Config Register USBEPOCFG0 OEP0CFG 0x1030 USB Endpoint 1 Configuration Register USBEPCFG1 EP1CFG 0x1034 USB Endpoint 2 Configuration Register USBEPCFG2 EP2CFG 0x1038 USB Endpoint 3 Configuration Register USBEPCFG3 EP3CFG 0x103C USB Endpoint 4 Configuration Register USBEPCFG4 EP4CFG 0x1040 USB Endpoint 5 Configuration Register USBEPCFG5 EP5CFG 0x1044 USB Endpoint 6 Configuration Register USBEPCFG6 EP6CFG 0x1048 USB Endpoint 7 Configuration Register USBEPCFG7 EP7CFG 0x104C USB Endpoint 0 Control Register USBEPCTL0 EP0CTL 0x1052 USB Endpoint 1 Control Register USBEPCTL1 EP1CTL 0x1056 USB Endpoint 2 Control Register USBEPCTL2 EP2CTL 0x105A USB Endpoint 3 Control Register USBEPCTL3 EP3CTL 0x105E USB Endpoint 4 Control Register USBEPCTL4 EP4CTL 0x1062 USB Endpoint 5 Control Register USBEPCTL5 EP5CTL 0x1066 USB Endpoint 6 Control Register USBEPCTL6 EP6CTL 0x106A USB Endpoint 7 Control Register USBEPCTL7 EP7CTL 0x106C USB General/Endpoint 0 Interrupt Status Register USBEPISR0 EP0ISR 0x1072 USB Endpoint 1 Interrupt Status Register USBEPISR1 EP1ISR 0x1076 USB Endpoint 2 Interrupt Status Register USBEPISR2 EP2ISR 0x107A USB Endpoint 3 Interrupt Status Register USBEPISR3 EP3ISR 0x107E USB Endpoint 4 Interrupt Status Register USBEPISR4 EP4ISR 0x1082 USB Endpoint 5 Interrupt Status Register USBEPISR5 EP5ISR 0x1086 USB Endpoint 6 Interrupt Status Register USBEPISR6 EP6ISR 0x108A USB Endpoint 7 Interrupt Status Register USBEPISR7 EP7ISR 0x108C USB Endpoint 0 Interrupt Mask Register USBEPIMR0 EP0IMR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 lviii Freescale Semiconductor

Tablexvi. USB Module Memory Map (continued) MBAR Register Name Old Mnemonic New Mnemonic Offset 0x1092 USB Endpoint 1 Interrupt Mask Register USBEPIMR1 EP1IMR 0x1096 USB Endpoint 2 Interrupt Mask Register USBEPIMR2 EP2IMR 0x109A USB Endpoint 3 Interrupt Mask Register USBEPIMR3 EP3IMR 0x109E USB Endpoint 4 Interrupt Mask Register USBEPIMR4 EP4IMR 0x10A2 USB Endpoint 5 Interrupt Mask Register USBEPIMR5 EP5IMR 0x10A6 USB Endpoint 6 Interrupt Mask Register USBEPIMR6 EP6IMR 0x10AA USB Endpoint 7 Interrupt Mask Register USBEPIMR7 EP7IMR 0x10AC USB Endpoint 0 Data Register USBEPDAT0 EP0DR 0x10B0 USB Endpoint 1 Data Register USBEPDAT1 EP1DR 0x10B4 USB Endpoint 2 Data Register USBEPDAT2 EP2DR 0x10B8 USB Endpoint 3 Data Register USBEPDAT3 EP3DR 0x10BC USB Endpoint 4 Data Register USBEPDAT4 EP4DR 0x10C0 USB Endpoint 5 Data Register USBEPDAT5 EP5DR 0x10C4 USB Endpoint 6 Data Register USBEPDAT6 EP6DR 0x10C8 USB Endpoint 7 Data Register USBEPDAT7 EP7DR 0x10CE USB Endpoint 0 Data Present Register USBEPDP0 EP0DPR 0x10D2 USB Endpoint 1 Data Present Register USBEPDP1 EP1DPR 0x10D6 USB Endpoint 2 Data Present Register USBEPDP2 EP2DPR 0x10DA USB Endpoint 3 Data Present Register USBEPDP3 EP3DPR 0x10DE USB Endpoint 4 Data Present Register USBEPDP4 EP4DPR 0x10E2 USB Endpoint 5 Data Present Register USBEPDP5 EP5DPR 0x10E6 USB Endpoint 6 Data Present Register USBEPDP6 EP6DPR 0x10EA USB Endpoint 7 Data Present Register USBEPDP7 EP7DPR 0x1400– USB Configuration RAM, 1 K Bytes USB_CFG_RAM No change 0x17FF NOTE The MBAR Offset column corresponds to the tables found in Appendix A, “List of Memory Maps.” 16- and/or 8-bit wide registers may be offset by 0, 1, 2, or 3 bytes from the offset address shown above. Refer to the appropriate discussions in this document for actual positioning of 16- or 8-bit registers in a 32-bit long word. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor lix

MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 lx Freescale Semiconductor

Chapter 1 Overview This chapter provides an overview of the MCF5272 microprocessor features, including the major functional components. 1.1 MCF5272 Key Features A block diagram of the MCF5272 is shown in Figure 1-1. The main features are as follows: • Static Version 2 ColdFire variable-length RISC processor — 32-bit address and data path on-chip — 66-MHz processor core and bus frequency — Sixteen general-purpose 32-bit data and address registers — Multiply-accumulate unit (MAC) for DSP and fast multiply operations • On-chip memories — 4-Kbyte SRAM on CPU internal bus — 16-Kbyte ROM on CPU internal bus — 1-Kbyte instruction cache • Power management — Fully-static operation with processor sleep and whole-chip stop modes — Very rapid response to interrupts from the low-power sleep mode (wake-up feature) — Clock enable/disable for each peripheral when not used — Software-controlled disable of external clock input for virtually zero power consumption (low-power stop mode) • Two universal asynchronous/synchronous receiver transmitters (UARTs) — Full-duplex operation — Based on MC68681 dual-UART (DUART) programming model — Flexible baud rate generator — Modem control signals available (CTS and RTS) — Processor interrupt and wakeup capability — Enhanced Tx, Rx FIFOs, 24 bytes each MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 1-1

Overview V2 ColdFire Processor Complex Instruction Unit JTAG IFP Instruction Address Generation Instruction Fetch FIFO Instruction Buffer (3 X 32) D [31:0] OEP Decode, Select, Operand Fetch Address Generation, Execute Local Memory SRAM Controller RAMBAR 4-Kbyte SRAM ROM Controller Local ROMBAR 16-Kbyte Memory ROM Instruction Bus Instruction Cache Local Memory Controller Data Bus ACR0 CACR ACR1 1-Kbyte Cache 31 0 4-Entry Store Buffer SYSTEM INTEGRATION MODULE (SIM) PLIC System Control Base Address Identification Parallel Port QSPI SCR PMR WRRR WCR MBAR DIR PACNT– PADDR– PADR– PDCNT PCDDR PCDR DMA SPR ALPR WIRR WER USB SDRAM Controller Chip Select Module External Interrupt Controller Bus Interface SDRAM Control 4 ICRs ISR PWM SDCR 8 8 CSORs CSBRs PITR Ethernet SDRAM Timer PIWR SDTR PIVR Two UARTs Four 8 32-Bit Data Bus 6 General- Purpose DRAM Controller Outputs CS[7:0] 32-Bit Address Bus INT[6:1] Timers Control Signals Figure1-1. MCF5272 Block Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 1-2 Freescale Semiconductor

Overview • Ethernet Module — 10 baseT capability, half or full duplex — 100 baseT capability, half duplex and limited throughput full duplex (MCF5272) — On-chip transmit and receive FIFOs — Off-chip flexible buffer descriptor rings — Media-independent interface (MII) • Universal serial bus (USB) module — 12 Mbps (full speed) — Fully compatible with USB 1.1 specifications — Eight endpoints (control, bulk, interrupt Rx, isochronous) — Endpoint FIFOs — Selectable on-chip analog interface • External memory interface — External glueless 8, 16, and 32-bit SRAM and ROM interface bus — SDRAM controller supports 16–256 Mbit devices — External bus configurable for 16 or 32 bits width for SDRAM — Glueless interface to SRAM devices with or without byte strobe inputs — Programmable wait state generator • Queued serial peripheral interface (QSPI) — Full-duplex, three-wire synchronous transfer — Up to four chip selects available — Master operation — Programmable master bit rates — Up to 16 preprogrammed transfers • Timer module — 4x16-bit general-purpose multi-mode timer – Input capture and output compare pins for timers 1 and 2 – Programmable prescaler — 15-nS resolution at 66-MHz clock frequency — Software watchdog timer — Software watchdog can generate interrupt before reset — Processor interrupt for each timer • Pulse-width modulation (PWM) unit — Three identical channels — Independent prescaler TAP point — Period/duty range variable MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 1-3

Overview • System integration module (SIM) — System configuration including internal and external address mapping — System protection by hardware watchdog — Versatile programmable chip-select signals with wait-state generation logic — Up to three 16-bit parallel input/output ports — Latchable interrupt inputs with programmable priority and edge triggering — Programmable interrupt vectors for on-chip peripherals • Physical layer interface controller (PLIC) — Allows connection using general circuit interface (GCI) or interchip digital link (IDL) physical layer protocols for 2B + D data — Three physical interfaces — Four time-division multiplex (TDM) ports • IEEE 1149.1 boundary-scan test access port (JTAG) for board-level testing • Operating voltage: 3.3 V ±0.3 V • Operating temperature: 0 –70°C • Operating frequency: DC to 66 MHz, from external CMOS oscillator • Compact ultra low-profile 196 ball-molded plastic ball-grid array package (PGBA) 1.2 MCF5272 Architecture This section briefly describes the MCF5272 core, SIM, UART, and timer modules, and test access port. 1.2.1 Version 2 ColdFire Core Based on the concept of variable-length RISC technology, ColdFire combines the simplicity of conventional 32-bit RISC architectures with a memory-saving, variable-length instruction set. The main features of the MCF5272 core are as follows: • 32-bit address bus directly addresses up to 4 Gbytes of address space • 32-bit data bus • Variable-length RISC • Optimized instruction set for high-level language constructs • Sixteen general-purpose 32-bit data and address registers • MAC unit for DSP applications • Supervisor/user modes for system protection • Vector base register to relocate exception-vector table • Special core interfacing signals for integrated memories • Full debug support MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 1-4 Freescale Semiconductor

Overview The Version 2 ColdFire core has a 32-bit address bus and a 32-bit data bus. The address bus allows direct addressing of up to 4 Gbytes. It supports misaligned data accesses and a bus arbitration unit for multiple bus masters. The Version 2 ColdFire supports an enhanced subset of the 68000 instruction set. The MAC provides new instructions for DSP applications; otherwise, Version 2 ColdFire user code runs unchanged on 68020, 68030, 68040, and 68060 processors. The removed instructions include BCD, bit field, logical rotate, decrement and branch, integer division, and integer multiply with a 64-bit result. Also, four indirect addressing modes have been eliminated. The ColdFire 2 core incorporates a complete debug module that provides real-time trace, background debug mode, and real-time debug support. 1.2.2 System Integration Module (SIM) The MCF5272 SIM provides the external bus interface for the ColdFire 2 architecture. It also eliminates most or all of the glue logic that typically supports the microprocessor and its interface with the peripheral and memory system. The SIM provides programmable circuits to perform address-decoding and chip selects, wait-state insertion, interrupt handling, clock generation, discrete I/O, and power management features. 1.2.2.1 External Bus Interface The external bus interface (EBI) handles the transfer of information between the internal core and memory, peripherals, or other processing elements in the external address space. 1.2.2.2 Chip Select and Wait State Generation Programmable chip select outputs provide signals to enable external memory and peripheral circuits, providing all handshaking and timing signals for automatic wait-state insertion and data bus sizing. Base memory address and block size are programmable, with some restrictions. For example, the starting address must be on a boundary that is a multiple of the block size. Each chip select is general purpose; however, any one of the chip selects can be programmed to provide read and write enable signals suitable for use with most popular static RAMs and peripherals. Data bus width (8-bit, 16-bit, or 32-bit) is programmable on all chip selects, and further decoding is available for protection from user mode access or read-only access. 1.2.2.3 System Configuration and Protection The SIM provides configuration registers that allow general system functions to be controlled and monitored. For example, all on-chip registers can be relocated as a block by programming a module base address, power management modes can be selected, and the source of the most recent RESET or BERR can be checked. The hardware watchdog features can be enabled or disabled, and the bus time-out period can be programmed. A software watchdog timer is also provided for system protection. If programmed, the timer causes a reset to the MCF5272 if it is not refreshed periodically by software. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 1-5

Overview 1.2.2.4 Power Management The sleep and stop power management modes reduce power consumption by allowing software to shut down the core, peripherals, or the whole device during inactive periods. To reduce power consumption further, software can individually disable internal clocks to the on-chip peripheral modules. The power-saving modes are described as follows: • Sleep mode uses interrupt control logic to allow any interrupt condition to wake the processor. As the MCF5272 is fully static, sleep mode is simply the disabling of the core’s clock after the current instruction completes. An interrupt from any internal or external source causes on-chip power management logic to reenable the core’s clock; execution resumes with the next instruction. This allows rapid return from power-down state as compared to a dynamic implementation that must perform power-on reset processing before software can handle the interrupt request. If interrupts are enabled at the appropriate priority level, program control passes to the relevant interrupt service routine. • Stop mode is entered by the disabling of the external clock input and is achieved by software setting a bit in a control register. Program execution stops after the current instruction. In stop mode, neither the core nor peripherals are active. The MCF5272 consumes very little power in this mode. To resume normal operation, the external interrupts cause the power management logic to re-enable the external clock input. The MCF5272 resumes program execution from where it entered stop mode (if no interrupt are pending), or starts interrupt exception processing if interrupts are pending. 1.2.2.5 Parallel Input/Output Ports The MCF5272 has up to three 16-bit general-purpose parallel ports, each line of which can be programmed as either an input or output. Some port lines have dedicated pins and others are shared with other MCF5272 functions. Some outputs have high drive current capability. 1.2.2.6 Interrupt Inputs The MCF5272 has flexible latched interrupt inputs each of which can generate a separate, maskable interrupt with programmable interrupt priority level and triggering edge (falling or rising). Each interrupt has its own interrupt vector. 1.2.3 UART Module The MCF5272 has two full-duplex UART modules with an on-chip baud rate generator providing both standard and non-standard baud rates up to 5 Mbps. The module is functionally equivalent to the MC68681 DUART with enhanced features including 24-byte Tx and Rx FIFOs. Data formats can be 5, 6, 7, or 8 bits with even, odd, or no parity and up to 2 stop bits in 1/16-bit increments. Receive and transmit FIFOs minimize CPU service calls. A wide variety of error detection and maskable interrupt capability is provided. Using a programmable prescaler or an external source, the MCF5272 system clock supports various baud rates. Modem support is provided with request-to-send (RTS) and clear-to-send (CTS) lines available externally. Full-duplex autoecho loopback, local loopback, and remote loopback modes can be selected. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 1-6 Freescale Semiconductor

Overview The UART can be programmed to interrupt or wake up the CPU on various normal or abnormal events. To reduce power consumption, the UART can be disabled by software if not in use. 1.2.4 Timer Module The timer module contains five timers arranged in two submodules. One submodule contains a programmable software watchdog timer. The other contains four independent, identical general-purpose timer units, each containing a free-running 16-bit timer for use in various modes, including capturing the timer value with an external event, counting external events, or triggering an external signal or interrupting the CPU when the timer reaches a set value. Each unit has an 8-bit prescaler for deriving the clock input frequency from the system clock or external clock input. The output pin associated with each timer has programmable modes. To reduce power consumption, the timer module can be disabled by software. 1.2.5 Test Access Port For system diagnostics and manufacturing testing, the MCF5272 includes user-accessible test logic that complies with the IEEE 1149.1 standard for boundary scan testing, often referred to as JTAG (Joint Test Action Group). The IEEE 1149.1 Standard provides more information. 1.3 System Design This section presents issues to consider when designing with the MCF5272. It describes differences between the MCF5272 (core and peripherals) and various other standard components that are replaced by moving to an integrated device like the MCF5272. 1.3.1 System Bus Configuration The MCF5272 has flexibility in its system bus interfacing due to the dynamic bus sizing feature in which 32-,16-, and 8-bit data bus sizes are programmable on a per-chip select basis. The programmable nature of the strobe signals (including OE/RD, R/W, BS[3:0], and CSn) should ensure that external decode logic is minimal or nonexistent. Configuration software is required upon power-on reset before chip-selected devices can be used, except for chip select 0 (CS0), which is active after power-on reset until programmed otherwise. BUSW1 and BUSW0 select the initial data bus width for CS0 only. A wake-up from sleep mode or a restart from stop mode does not require reconfiguration of the chip select registers or other system configuration registers. 1.4 MCF5272-Specific Features This section describes features peculiar to the MCF5272. 1.4.1 Physical Layer Interface Controller (PLIC) The physical layer interface controller (PLIC) allows the MCF5272 to connect at a physical level with external CODECs and other peripheral devices that use either the general circuit interface (GCI), or MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 1-7

Overview interchip digital link (IDL), physical layer protocols. This module is primarily intended to facilitate designs that include ISDN interfaces. 1.4.2 Pulse-Width Modulation (PWM) Unit The PWM unit is intended for use in control applications. With a suitable low-pass filter, it can be used as a digital-to-analog converter. This module generates a synchronous series of pulses. The duty cycle of the pulses is under software control. Its main features include the following: • Double-buffered width register • Variable-divide prescale • Three identical, independent PWM modules • Byte-wide width register provides programmable control of duty cycle. The PWM implements a simple free-running counter with a width register and comparator such that the output is cleared when the counter exceeds the value of the width register. When the counter wraps around, its value is not greater than the width register value, and the output is set high. With a suitable low-pass filter, the PWM can be used as a digital-to-analog converter. 1.4.3 Queued Serial Peripheral Interface (QSPI) The QSPI module provides a serial peripheral interface with queued transfer capability. It supports up to 16 stacked transfers at a time, making CPU intervention between transfers unnecessary. Transfer RAMs in the QSPI are indirectly accessible using address and data registers. Functionality is similar to the QSPI portion of the QSM (queued serial module) implemented in the MC68332. The QSPI has the following features: • Programmable queue to support up to 16 transfers without user intervention • Supports transfer sizes of 8 to 16 bits in 1-bit increments • Four peripheral chip-select lines for control of up to 15 devices • Baud rates from 129.4 Kbps to 33 Mbps at 66 MHz. • Programmable delays before and after transfers • Programmable clock phase and polarity • Supports wrap-around mode for continuous transfers 1.4.4 Universal Serial Bus (USB) Module The USB controller on the MCF5272 supports device mode data communications with a USB host (typically a PC). One host and up to 127 attached peripherals share USB bandwidth through a host-scheduled, token-based protocol. The USB uses a tiered star topology with a hub at the center of each star. Each wire segment is a point-to-point connection between the host connector and a peripheral connector. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 1-8 Freescale Semiconductor

Chapter 2 ColdFire Core This chapter provides an overview of the microprocessor core of the MCF5272. The chapter describes the V2 programming model as it is implemented on the MCF5272. It also includes a full description of exception handling, data formats, an instruction set summary, and a table of instruction timings. 2.1 Features and Enhancements The MCF5272 is the most highly-integrated V2 standard product, containing a variety of communications and general-purpose peripherals. The V2 core was designed to maximize code density and performance while minimizing die area. The following list summarizes MCF5272 features: • Variable-length RISC Version 2 microprocessor core • Two independent, decoupled pipelines—two-stage instruction fetch pipeline (IFP) and two-stage operand execution pipeline (OEP) • Three longword FIFO buffer provides decoupling between the pipelines • 32-bit internal address bus supporting 4 Gbytes of linear address space • 32-bit data bus • 16 user-accessible, 32-bit-wide, general-purpose registers • Supervisor/user modes for system protection • Vector base register to relocate exception-vector table • Optimized for high-level language constructs 2.1.1 Decoupled Pipelines The IFP prefetches instructions. The OEP decodes instructions, fetches required operands, then executes the specified function. The two independent, decoupled pipeline structures maximize performance while minimizing core size. Pipeline stages are shown in Figure 2-1 and are summarized as follows: • Two-stage IFP (plus optional instruction buffer stage) — Instruction address generation (IAG) calculates the next prefetch address. — Instruction fetch cycle (IC) initiates prefetch on the processor’s local instruction bus. — Instruction buffer (IB) optional stage uses FIFO queue to minimize effects of fetch latency. • Two-stage OEP — Decode, select/operand fetch (DSOC) decodes the instruction and selects the required components for the effective address calculation, or the operand fetch cycle. — Address generation/execute (AGEX) calculates the operand address, or performs the execution of the instruction. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-1

ColdFire Core Instruction IAG Address Generation Instruction Address [31:0] IC Fetch Cycle Instruction Fetch Pipeline FIFO IB Instruction Buffer D ata[31:0] Decode & Select, DSOC Operand Operand Fetch Execution Pipeline Address AGEX Generation, Execute Figure2-1. ColdFire Pipeline 2.1.1.1 Instruction Fetch Pipeline (IFP) The IFP generates instruction addresses and fetches. Because the fetch and execution pipelines are decoupled by a three longword FIFO buffer, the IFP can prefetch instructions before the OEP needs them, minimizing stalls. 2.1.1.2 Operand Execution Pipeline (OEP) The OEP is a two-stage pipeline featuring a traditional RISC datapath with a register file feeding an arithmetic/logic unit (ALU). For simple register-to-register instructions, the first stage of the OEP performs the instruction decode and fetching of the required register operands (OC), while the actual instruction execution is performed in the second stage (EX). For memory-to-register instructions, the instruction is effectively staged through the OEP twice in the following way: • The instruction is decoded and the components of the operand address are selected (DS). • The operand address is generated using the execute engine (AG). • The memory operand is fetched while any register operand is simultaneously fetched (OC). • The instruction is executed (EX). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-2 Freescale Semiconductor

ColdFire Core For register-to-memory operations, the stage functions (DS/OC, AG/EX) are effectively performed simultaneously allowing single-cycle execution. For read-modify-write instructions, the pipeline effectively combines a memory-to-register operation with a store operation. 2.1.1.2.1 Illegal Opcode Handling On Version 2 ColdFire implementations, only some illegal opcodes (0x0000 and 0x4AFC) are decoded and generate an illegal instruction exception. Additionally, attempting to execute an illegal line A or lineF opcode generates unique exception types. If any other unsupported opcode is executed, the resulting operation is undefined. 2.1.1.2.2 Hardware Multiply/Accumulate (MAC) Unit The MAC is an optional unit in Version 2 that provides hardware support for a limited set of digital signal processing (DSP) operations used in embedded code, while supporting the integer multiply instructions in the ColdFire microprocessor family. The MAC features a three-stage execution pipeline, optimized for 16 x 16 multiplies. It is tightly coupled to the OEP, which can issue a 16 x 16 multiply with a 32-bit accumulation plus fetch a 32-bit operand in a single cycle. A 32 x 32 multiply with a 32-bit accumulation requires three cycles before the next instruction can be issued. Figure 2-2 shows basic functionality of the MAC. A full set of instructions are provided for signed and unsigned integers plus signed, fixed-point fractional input operands. Operand Y Operand X X Shift 0,1,-1 +/- Accumulator Figure2-2. ColdFire Multiply-Accumulate Functionality Diagram The MAC provides functionality in the following three related areas, which are described in detail in Chapter 3, “Hardware Multiply/Accumulate (MAC) Unit.” • Signed and unsigned integer multiplies • Multiply-accumulate operations with signed and unsigned fractional operands • Miscellaneous register operations MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-3

ColdFire Core 2.1.1.2.3 Hardware Divide Unit The hardware divide unit performs the following integer division operations: • 32-bit operand/16-bit operand producing a 16-bit quotient and a 16-bit remainder • 32-bit operand/32-bit operand producing a 32-bit quotient • 32-bit operand/32-bit operand producing a 32-bit remainder 2.1.2 Debug Module Enhancements The ColdFire processor core debug interface supports system integration in conjunction with low-cost development tools. Real-time trace and debug information can be accessed through a standard interface, which allows the processor and system to be debugged at full speed without costly in-circuit emulators. On-chip breakpoint resources include the following: • Configuration/status register (CSR) • Bus attributes and mask register (AATR) • Breakpoint registers. These can be used to define triggers combining address, data, and PC conditions in single- or dual-level definitions. They include the following: — PC breakpoint register (PBR) — PC breakpoint mask register (PBMR) — Data operand address breakpoint registers (ABHR/ABLR) — Data breakpoint register (DBR) • Data breakpoint mask register (DBMR) • Trigger definition register (TDR) can be programmed to generate a processor halt or initiate a debug interrupt exception These registers can be accessed through the dedicated debug serial communication channel, or from the processor’s supervisor programming model, using the WDEBUG instruction. 2.2 Programming Model The MCF5272 programming model consists of three instruction and register groups—user, MAC (also user-mode), and supervisor, shown in Figure 2-2. User mode programs are restricted to user and MAC instructions and programming models. Supervisor-mode system software can reference all user-mode and MAC instructions and registers and additional supervisor instructions and control registers. The user or supervisor programming model is selected based on SR[S]. The following sections describe the registers in the user, MAC, and supervisor programming models. 2.2.1 User Programming Model As Figure 2-3 shows, the user programming model consists of the following registers: • 16 general-purpose 32-bit registers, D0–D7 and A0–A7 • 32-bit program counter • 8-bit condition code register MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-4 Freescale Semiconductor

ColdFire Core 31 0 D0 Data registers D1 D2 D3 D4 D5 D6 D7 31 0 A0 Address registers A1 s er A2 st gi A3 Re A4 er A5 s U A6 A7 Stack pointer PC Program counter CCR Condition code register 31 0 MACSR MAC status register ACC MAC accumulator MASK MAC mask register 15 31 19 (CCR) SR Status register Must be zeros VBR Vector base register ors ervisgister CACACRR0 CAcaccehses c coonntrtorol lr ereggisisteterr 0 pe ACR1 Access control register 1 uR S ROMBAR ROM base address register RAMBAR RAM base address register MBAR Module base address register Figure2-3. ColdFire Programming Model 2.2.1.1 Data Registers (D0–D7) Registers D0–D7 are used as data registers for bit, byte (8-bit), word (16-bit), and longword (32-bit) operations. They may also be used as index registers. 2.2.1.2 Address Registers (A0–A6) The address registers (A0–A6) can be used as software stack pointers, index registers, or base address registers and may be used for word and longword operations. 2.2.1.3 Stack Pointer (A7, SP) The processor core supports a single hardware stack pointer (A7) used during stacking for subroutine calls, returns, and exception handling. The stack pointer is implicitly referenced by certain operations and can be explicitly referenced by any instruction specifying an address register. The initial value of A7 is loaded MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-5

ColdFire Core from the reset exception vector, address 0x0000. The same register is used for user and supervisor modes, and may be used for word and longword operations. A subroutine call saves the program counter (PC) on the stack and the return restores the PC from the stack. The PC and the status register (SR) are saved on the stack during exception and interrupt processing. The return from exception instruction restores SR and PC values from the stack. 2.2.1.4 Program Counter (PC) The PC holds the address of the executing instruction. For sequential instructions, the processor automatically increments the PC. When program flow changes, the PC is updated with the target instruction. For some instructions, the PC specifies the base address for PC-relative operand addressing modes. 2.2.1.5 Condition Code Register (CCR) The CCR, Figure2-4, occupies SR[7–0], as shown in Figure2-3. CCR[4–0] are indicator flags based on results generated by arithmetic operations. 7 6 5 4 3 2 1 0 Field — X N Z V C Reset 000 Undefined R/W R R/W R/W R/W R/W R/W Figure2-4. Condition Code Register (CCR) CCR fields are described in Table 2-1. Table2-1. CCR Field Descriptions Bits Name Description 7–5 — Reserved, should be cleared. 4 X Extend condition code bit. Assigned the value of the carry bit for arithmetic operations; otherwise not affected or set to a specified result. Also used as an input operand for multiple-precision arithmetic. 3 N Negative condition code bit. Set if the msb of the result is set; otherwise cleared. 2 Z Zero condition code bit. Set if the result equals zero; otherwise cleared. 1 V Overflow condition code bit. Set if an arithmetic overflow occurs, implying that the result cannot be represented in the operand size; otherwise cleared. 0 C Carry condition code bit. Set if a carry-out of the data operand msb occurs for an addition or if a borrow occurs in a subtraction; otherwise cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-6 Freescale Semiconductor

ColdFire Core 2.2.1.6 MAC Programming Model Figure 2-3 shows the registers in the MAC portion of the user programming model. These registers are described as follows: • Accumulator (ACC)—This 32-bit, read/write, general-purpose register is used to accumulate the results of MAC operations. • Mask register (MASK)—This 16-bit general-purpose register provides an optional address mask for MAC instructions that fetch operands from memory. It is useful in the implementation of circular queues in operand memory. • MAC status register (MACSR)—This 8-bit register defines configuration of the MAC unit and contains indicator flags affected by MAC instructions. Unless noted otherwise, MACSR indicator flag settings are based on the final result, that is, the result of the final operation involving the product and accumulator. 2.2.2 Supervisor Programming Model The MCF5272 supervisor programming model is shown in Figure 2-3. Typically, system programmers use the supervisor programming model to implement operating system functions and provide memory and I/O control. The supervisor programming model provides access to the user registers and additional supervisor registers, which include the upper byte of the status register (SR), the vector base register (VBR), and registers for configuring attributes of the address space connected to the Version 2 processor core. Most supervisor-mode registers are accessed by using the MOVEC instruction with the control register definitions in Table 2-2. Table2-2. MOVEC Register Map Rc[11–0] Register Definition 0x002 Cache control register (CACR) 0x004 Access control register 0 (ACR0) 0x005 Access control register 1 (ACR1) 0x801 Vector base register (VBR) 0xC00 ROM base address register 0xC04 RAM base address register (RAMBAR) 0xC0F Module base address register (MBAR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-7

ColdFire Core 2.2.2.1 Status Register (SR) The SR stores the processor status, the interrupt priority mask, and other control bits. Supervisor software can read or write the entire SR; user software can read or write only SR[7–0], described in Section2.2.1.5, “Condition Code Register (CCR).” The control bits indicate processor states—trace mode (T), supervisor or user mode (S), and master or interrupt state (M). SR is set to 0x27xx after reset. 15 8 7 0 System Byte Condition Code Register (CCR) Field T — S M — I — X N Z V C Reset 0 0 1 0 0 111 000 — — — — — R/W R/W R R/W R/W R R/W R R/W R/W R/W R/W R/W Figure2-5. Status Register (SR) Table 2-3 describes SR fields. Table2-3. Status Field Descriptions Bits Name Description 15 T Trace enable. When T is set, the processor performs a trace exception after every instruction. 13 S Supervisor/user state. Indicates whether the processor is in supervisor or user mode 0 User mode 1 Supervisor mode 12 M Master/interrupt state. Cleared by an interrupt exception. It can be set by software during execution of the RTE or move to SR instructions so the OS can emulate an interrupt stack pointer. 10–8 I Interrupt priority mask. Defines the current interrupt priority. Interrupt requests are inhibited for all priority levels less than or equal to the current priority, except the edge-sensitive level-7 request, which cannot be masked. 7–0 CCR Condition code register. See Figure2-4. 2.2.2.2 Vector Base Register (VBR) The VBR holds the base address of the exception vector table in memory. The displacement of an exception vector is added to the value in this register to access the vector table. VBR[19–0] are not implemented and are assumed to be zero, forcing the vector table to be aligned on a 0-modulo-1-Mbyte boundary. 31 20 19 0 Field Exception vector table base address — Reset 0000_0000_0000_0000_0000_0000_0000_0000 R/W Written from a BDM serial command or from the CPU using the MOVEC instruction. VBR can be read from the debug module only. The upper 12 bits are returned, the low-order 20 bits are undefined. Rc[11–0] 0x801 Figure2-6. Vector Base Register (VBR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-8 Freescale Semiconductor

ColdFire Core 2.2.2.3 Cache Control Register (CACR) The CACR controls operation of the instruction and data cache memory. It includes bits for enabling, freezing, and invalidating cache contents. It also includes bits for defining the default cache mode and write-protect fields. See Section4.5.3.1, “Cache Control Register (CACR).” 2.2.2.4 Access Control Registers (ACR0–ACR1) The access control registers (ACR0–ACR1) define attributes for two user-defined memory regions. Attributes include definition of cache mode, write protect, and buffer write enables. See Section4.5.3.2, “Access Control Registers (ACR0 and ACR1).” 2.2.2.5 ROM Base Address Register (ROMBAR) The ROMBAR base address register determines the base address of the internal ROM module and indicates the types of references mapped to it. The ROMBAR includes a base address, write-protect bit, address space mask bits, and an enable. Note that the MCF5272 ROM contains data for the HDLC module and is not user programmable. See Section4.4.2.1, “ROM Base Address Register (ROMBAR).” 2.2.2.6 RAM Base Address Register (RAMBAR) The RAMBAR register determines the base address location of the internal SRAM module and indicates the types of references mapped to it. The RAMBAR includes a base address, write-protect bit, address space mask bits, and an enable. The RAM base address must be aligned on a 0-modulo-4-Kbyte boundary. See Section4.3.2.1, “SRAM Base Address Register (RAMBAR).” 2.2.2.7 Module Base Address Register (MBAR) The module base address register (MBAR) defines the logical base address for the memory-mapped space containing the control registers for the on-chip peripherals. See Section6.2.2, “Module Base Address Register (MBAR).” 2.3 Integer Data Formats Table 2-4 lists the integer operand data formats. Integer operands can reside in registers, memory, or instructions. The operand size for each instruction is either explicitly encoded in the instruction or implicitly defined by the instruction operation. Table2-4. Integer Data Formats Operand Data Format Size Bit 1 bit Byte integer 8 bits Word integer 16 bits Longword integer 32 bits MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-9

ColdFire Core 2.4 Organization of Data in Registers The following sections describe data organization within the data, address, and control registers. 2.4.1 Organization of Integer Data Formats in Registers Figure 2-7 shows the integer format for data registers. Each integer data register is 32 bits wide. Byte and word operands occupy the lower 8- and 16-bit portions of integer data registers, respectively. Longword operands occupy the entire 32 bits of integer data registers. A data register that is either a source or destination operand only uses or changes the appropriate lower 8 or 16 bits in byte or word operations, respectively. The remaining high-order portion does not change. The least significant bit (lsb) of all integer sizes is zero, the most-significant bit (msb) of a longword integer is 31, the msb of a word integer is 15, and the msb of a byte integer is 7. 31 30 1 0 msb lsb Bit (0 ð bit number ð 31) 31 8 7 6 1 0 Not used msb Low order byte lsb Byte (8 bits) 31 16 15 14 1 0 Not used msb Lower order word lsb Word (16 bits) 31 30 1 0 msb Longword lsb Longword (32 bits) Figure2-7. Organization of Integer Data Formats in Data Registers The instruction set encodings do not allow the use of address registers for byte-sized operands. When an address register is a source operand, either the low-order word or the entire longword operand is used, depending on the operation size. Word-length source operands are sign-extended to 32 bits and then used in the operation with an address register destination. When an address register is a destination, the entire register is affected, regardless of the operation size. Figure 2-8 shows integer formats for address registers. 31 16 15 0 Sign-Extended 16-Bit Address Operand 31 0 Full 32-Bit Address Operand Figure2-8. Organization of Integer Data Formats in Address Registers The size of control registers varies according to function. Some have undefined bits reserved for future definition by Freescale. Those particular bits read as zeros and must be written as zeros for future compatibility. All operations to the SR and CCR are word-size operations. For all CCR operations, the upper byte is read as all zeros and is ignored when written, regardless of privilege mode. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-10 Freescale Semiconductor

ColdFire Core 2.4.2 Organization of Integer Data Formats in Memory All ColdFire processors use a big-endian addressing scheme. The byte-addressable organization of memory allows lower addresses to correspond to higher order bytes. The address N of a longword data item corresponds to the address of the high-order word. The lower order word is located at address N + 2. The address N of a word data item corresponds to the address of the high-order byte. The lower order byte is located at address N + 1. This organization is shown in Figure 2-9. 31 24 23 16 15 8 7 0 Longword 0x0000_0000 Word 0x0000_0000 Word 0x0000_0002 Byte 0x0000_0000 Byte 0x0000_0001 Byte 0x0000_0002 Byte 0x0000_0003 Longword 0x0000_0004 Word 0x0000_0004 Word 0x0000_0006 Byte 0x0000_0004 Byte 0x0000_0005 Byte 0x0000_0006 Byte 0x0000_0007 . . . Longword 0xFFFF_FFFC Word 0xFFFF_FFFC Word 0xFFFF_FFFE Byte 0xFFFF_FFFC Byte 0xFFFF_FFFD Byte 0xFFFF_FFFE Byte 0xFFFF_FFFF Figure2-9. Memory Operand Addressing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-11

ColdFire Core 2.5 Addressing Mode Summary Addressing modes are categorized by how they are used. Data addressing modes refer to data operands. Memory addressing modes refer to memory operands. Alterable addressing modes refer to alterable (writable) data operands. Control addressing modes refer to memory operands without an associated size. These categories sometimes combine to form more restrictive categories. Two combined classifications are alterable memory (both alterable and memory) and data alterable (both alterable and data). Twelve of the most commonly used effective addressing modes from the M68000 family are available on ColdFire microprocessors. Table 2-5 summarizes these modes and their categories. Table2-5. ColdFire Effective Addressing Modes Category Mode Reg. Addressing Modes Syntax Field Field Data Memory Control Alterable Register direct Data Dn 000 reg. no. X — — X Address An 001 reg. no. — — — X Register indirect Address (An) 010 reg. no. X X X X Address with Postincrement (An)+ 011 reg. no. X X — X Address with Predecrement –(An) 100 reg. no. X X — X Address with Displacement (d , An) 101 reg. no. X X X X 16 Address register indirect with scaled index (d , An, 110 reg. no. X X X X 8 8-bit displacement Xi*SF) Program counter indirect with displacement (d , PC) 111 010 X X X — 16 Program counter indirect with scaled index (d , PC, 111 011 X X X — 8 8-bit displacement Xi*SF) Absolute data addressing Short (xxx).W 111 000 X X X — Long (xxx).L 111 001 X X X — Immediate #<xxx> 111 100 X X — — MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-12 Freescale Semiconductor

ColdFire Core 2.6 Instruction Set Summary The ColdFire instruction set is a simplified version of the M68000 instruction set. The removed instructions include BCD, bit field, logical rotate, decrement and branch, and integer multiply with a 64-bit result. Nine new MAC instructions have been added. Table 2-6 lists notational conventions used throughout this manual. Table2-6. Notational Conventions Instruction Operand Syntax Opcode Wildcard cc Logical condition (example: NE for not equal) Register Specifications An Any address register n (example: A3 is address register 3) Ay,Ax Source and destination address registers, respectively Dn Any data register n (example: D5 is data register 5) Dy,Dx Source and destination data registers, respectively Rc Any control register (example VBR is the vector base register) Rm MAC registers (ACC, MAC, MASK) Rn Any address or data register Rw Destination register w (used for MAC instructions only) Ry,Rx Any source and destination registers, respectively Xi index register i (can be an address or data register: Ai, Di) Register Names ACC MAC accumulator register CCR Condition code register (lower byte of SR) MACSR MAC status register MASK MAC mask register PC Program counter SR Status register Port Names DDATA Debug data port PST Processor status port Miscellaneous Operands #<data> Immediate data following the 16-bit operation word of the instruction <ea> Effective address MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-13

ColdFire Core Table2-6. Notational Conventions (continued) Instruction Operand Syntax <ea>y,<ea>x Source and destination effective addresses, respectively <label> Assembly language program label <list> List of registers for MOVEM instruction (example: D3–D0) <shift> Shift operation: shift left (<<), shift right (>>) <size> Operand data size: byte (B), word (W), longword (L) bc Instruction cache # <vector> Identifies the 4-bit vector number for trap instructions <> identifies an indirect data address referencing memory <xxx> identifies an absolute address referencing memory dn Signal displacement value, n bits wide (example: d16 is a 16-bit displacement) SF Scale factor (x1, x2, x4 for indexed addressing mode, <<1n>> for MAC operations) Operations + Arithmetic addition or postincrement indicator – Arithmetic subtraction or predecrement indicator x Arithmetic multiplication / Arithmetic division ~ Invert; operand is logically complemented & Logical AND | Logical OR ^ Logical exclusive OR << Shift left (example: D0 << 3 is shift D0 left 3 bits) >> Shift right (example: D0 >> 3 is shift D0 right 3 bits) → Source operand is moved to destination operand ←→ Two operands are exchanged sign-extended All bits of the upper portion are made equal to the high-order bit of the lower portion If <condition> Test the condition. If the condition is true, the operations in the then clause are performed. If the condition then <operations> is false and the optional else clause is present, the operations in the else clause are performed. If the else <operations> condition is false and the else clause is omitted, the instruction performs no operation. Refer to the Bcc instruction description as an example. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-14 Freescale Semiconductor

ColdFire Core Table2-6. Notational Conventions (continued) Instruction Operand Syntax Subfields and Qualifiers {} Optional operation () Identifies an indirect address d Displacement value, n-bits wide (example: d is a 16-bit displacement) n 16 Address Calculated effective address (pointer) Bit Bit selection (example: Bit 3 of D0) lsb Least significant bit (example: lsb of D0) LSB Least significant byte LSW Least significant word msb Most significant bit MSB Most significant byte MSW Most significant word Condition Code Register Bit Names C Carry N Negative V Overflow X Extend Z Zero 2.6.1 Instruction Set Summary Table 2-7 lists implemented user-mode instructions by opcode. Table2-7. User-Mode Instruction Set Summary Instruction Operand Syntax Operand Size Operation ADD Dy,<ea>x .L Source + destination → destination <ea>y,Dx .L ADDA <ea>y,Ax .L Source + destination → destination ADDI #<data>,Dx .L Immediate data + destination → destination ADDQ #<data>,<ea>x .L Immediate data + destination → destination ADDX Dy,Dx .L Source + destination + X → destination AND Dy,<ea>x .L Source & destination → destination <ea>y,Dx .L ANDI #<data>,Dx .L Immediate data & destination → destination ASL Dy,Dx .L X/C ← (Dx << Dy) ← 0 #<data>,Dx .L X/C ← (Dx << #<data>) ← 0 ASR Dy,Dx .L MSB → (Dx >> Dy) → X/C #<data>,Dx .L MSB → (Dx >> #<data>) → X/C Bcc <label> .B,.W If condition true, then PC + 2 + d → PC n MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-15

ColdFire Core Table2-7. User-Mode Instruction Set Summary (continued) Instruction Operand Syntax Operand Size Operation BCHG Dy,<ea>x .B,.L ~(<bit number> of destination) → Z, #<data>,<ea-1>x .B,.L Bit of destination BCLR Dy,<ea>x .B,.L ~(<bit number> of destination) → Z; #<data>,<ea-1>x .B,.L 0 → bit of destination BRA <label> .B,.W PC + 2 + d → PC n BSET Dy,<ea>x .B,.L ~(<bit number> of destination) → Z; #<data>,<ea-1>x .B,.L 1→ bit of destination BSR <label> .B,.W SP – 4 → SP; next sequential PC→ (SP); PC + 2 + d → PC n BTST Dy,<ea>x .B,.L ~(<bit number> of destination) → Z #<data>,<ea-1>x .B,.L CLR <ea>y,Dx .B,.W,.L 0 → destination CMP <ea>y,Ax .L Destination – source CMPA <ea>y,Dx .L Destination – source CMPI <ea>y,Dx .L Destination – immediate data DIVS <ea-1>y,Dx .W Dx /<ea>y → Dx {16-bit remainder; 16-bit quotient} <ea>y,Dx .L Dx /<ea>y → Dx {32-bit quotient} Signed operation DIVU <ea-1>y,Dx .W Dx /<ea>y → Dx {16-bit remainder; 16-bit quotient} Dy,<ea>x .L Dx /<ea>y → Dx {32-bit quotient} Unsigned operation EOR Dy,<ea>x .L Source ^ destination → destination EORI #<data>,Dx .L Immediate data ^ destination → destination EXT #<data>,Dx .B →.W Sign-extended destination → destination .W →.L EXTB Dx .B →.L Sign-extended destination → destination HALT1 None Unsized Enter halted state JMP <ea-3>y Unsized Address of <ea> → PC JSR <ea-3>y Unsized SP – 4 → SP; next sequential PC → (SP); <ea> → PC LEA <ea-3>y,Ax .L <ea> → Ax LINK Ax,#<d16> .W SP – 4 → SP; Ax → (SP); SP → Ax; SP + d16 → SP LSL Dy,Dx .L X/C ← (Dx << Dy) ← 0 #<data>,Dx .L X/C ← (Dx << #<data>) ← 0 LSR Dy,Dx .L 0 → (Dx >> Dy) → X/C #<data>,Dx .L 0 → (Dx >> #<data>) → X/C MAC Ry,RxSF .L + (.W × .W) → .L ACC + (Ry × Rx){<< 1 | >> 1} → ACC .L + (.L × .L) → .L ACC + (Ry × Rx){<< 1 | >> 1} → ACC; (<ea>y{&MASK}) → Rw MACL Ry,RxSF,<ea-1>y,Rw .L + (.W × .W) → .L, .L ACC + (Ry × Rx){<< 1 | >> 1} → ACC .L + (.L × .L) → .L, .L ACC + (Ry × Rx){<< 1 | >> 1} → ACC; (<ea-1>y{&MASK}) → Rw MOVE <ea>y,<ea>x .B,.W,.L <ea>y → <ea>x MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-16 Freescale Semiconductor

ColdFire Core Table2-7. User-Mode Instruction Set Summary (continued) Instruction Operand Syntax Operand Size Operation MOVE from MASK,Rx .L Rm → Rx MAC ACC,Rx MACSR,Rx MACSR,CCR .L MACSR → CCR MOVE to Ry,ACC .L Ry → Rm MAC Ry,MACSR Ry,MASK #<data>,ACC .L #<data> → Rm #<data>,MACSR #<data>,MASK MOVE from CCR,Dx .W CCR → Dx CCR MOVE to Dy,CCR .B Dy → CCR CCR #<data>,CCR #<data> → CCR MOVEA <ea>y,Ax .W,.L → .L Source → destination MOVEM #<list>,<ea-2>x .L Listed registers → destination <ea-2>y,#<list> .L Source → listed registers MOVEQ #<data>,Dx .B → .L Sign-extended immediate data → destination MSAC Ry,RxSF .L - (.W × .W) → .L ACC – (Ry × Rx){<< 1 | >> 1} → ACC .L - (.L × .L) → .L MSACL Ry,RxSF,<ea-1>y,Rw .L - (.W × .W) → .L, .L ACC – (Ry × Rx){<< 1 | >> 1} → ACC; .L - (.L × .L) → .L, .L (<ea-1>y{&MASK}) → Rw MULS <ea>y,Dx .W X .W → .L Source × destination → destination .L X .L → .L Signed operation MULU <ea>y,Dx .W X .W → .L Source × destination → destination .L X .L → .L Unsigned operation NEG Dx .L 0 – destination → destination NEGX Dx .L 0 – destination – X → destination NOP none Unsized Synchronize pipelines; PC + 2 → PC NOT Dx .L ~ Destination → destination OR <ea>y,Dx .L Source | destination → destination Dy,<ea>x ORI #<data>,Dx .L Immediate data | destination → destination PEA <ea-3>y .L SP – 4 → SP; Address of <ea> → (SP) PULSE none Unsized Set PST= 0x4 REMS <ea-1>,Dx .L Dx/<ea>y → Dw {32-bit remainder} Signed operation REMU <ea-1>,Dx .L Dx/<ea>y → Dw {32-bit remainder} Unsigned operation RTS none Unsized (SP) → PC; SP + 4 → SP Scc Dx .B If condition true, then 1s ⎯ destination; Else 0s → destination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-17

ColdFire Core Table2-7. User-Mode Instruction Set Summary (continued) Instruction Operand Syntax Operand Size Operation SUB <ea>y,Dx .L Destination – source → destination Dy,<ea>x .L SUBA <ea>y,Ax .L Destination – source → destination SUBI #<data>,Dx .L Destination – immediate data → destination SUBQ #<data>,<ea>x .L Destination – immediate data → destination SUBX Dy,Dx .L Destination – source – X → destination SWAP Dx .W MSW of Dx ←→ LSW of Dx TRAP #<vector> Unsized SP – 4 → SP;PC → (SP); SP – 2 → SP;SR → (SP); SP – 2 → SP; format → (SP); Vector address → PC TRAPF None Unsized PC + 2 → PC #<data> .W PC + 4 → PC .L PC + 6 → PC TST <ea>y .B,.W,.L Set condition codes UNLK Ax Unsized Ax →SP; (SP) → Ax; SP + 4 → SP WDDATA <ea>y .B,.W,.L <ea>y →DDATA port 1 By default the HALT instruction is a supervisor-mode instruction; however, it can be configured to allow user-mode execution by setting CSR[UHE]. Table 2-8 describes supervisor-mode instructions. Table2-8. Supervisor-Mode Instruction Set Summary Instruction Operand Syntax Operand Size Operation CPUSHL (bc),(Ax) Unsized Invalidate instruction cache line HALT1 none Unsized Enter halted state MOVE from SR SR, Dx .W SR → Dx MOVE to SR Dy,SR .W Source → SR #<data>,SR MOVEC Ry,Rc .L Ry → Rc Rc Register Definition 0x002 Cache control register (CACR) 0x004 Access control register 0 (ACR0) 0x005 Access control register 1 (ACR1) 0x801 Vector base register (VBR) 0xC00 ROM base address register (ROMBAR) 0xC04 RAM base address register (RAMBAR) 0xC0F Module base address register (MBAR) RTE None Unsized (SP+2) → SR; SP+4 → SP; (SP) → PC; SP + formatfield ⎯ SP STOP #<data> .W Immediate data → SR; enter stopped state WDEBUG <ea-2>y .L <ea-2>y → debug module 1 The HALT instruction can be configured to allow user-mode execution by setting CSR[UHE]. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-18 Freescale Semiconductor

ColdFire Core 2.7 Instruction Timing The timing data presented in this section assumes the following: • The OEP is loaded with the opword and all required extension words at the beginning of each instruction execution. This implies that the OEP spends no time waiting for the IFP to supply opwords and/or extension words. • The OEP experiences no sequence-related pipeline stalls. For the MCF5272,the most common example of this type of stall involves consecutive store operations, excluding the MOVEM instruction. For all store operations (except MOVEM), certain hardware resources within the processor are marked as busy for two clock cycles after the final DSOC cycle of the store instruction. If a subsequent store instruction is encountered within this two-cycle window, it is stalled until the resource again becomes available. Thus, the maximum pipeline stall involving consecutive store operations is two cycles. • The OEP can complete all memory accesses without memory causing any stall conditions. Thus, timing details in this section assume an infinite zero-wait state memory attached to the core. • All operand data accesses are assumed to be aligned on the same byte boundary as the operand size: — 16-bit operands aligned on 0-modulo-2 addresses — 32-bit operands aligned on 0-modulo-4 addresses Operands that do not meet these guidelines are misaligned. Table 2-9 shows how the core decomposes a misaligned operand reference into a series of aligned accesses. Table2-9. Misaligned Operand References A[1:0] Size Bus Operations Additional C(R/W) 1 x1 Word Byte, Byte 2(1/0) if read 1(0/1) if write x1 Long Byte, Word, Byte 3(2/0) if read 2(0/2) if write 10 Long Word, Word 2(1/0) if read 1(0/1) if write 1 Each timing entry is presented as C(r/w), described as follows: C is the number of processor clock cycles, including all applicable operand fetches and writes, as well as all internal core cycles required to complete the instruction execution. r/w is the number of operand reads (r) and writes (w) required by the instruction. An operation performing a read-modify write function is denoted as (1/1). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-19

ColdFire Core 2.7.1 MOVE Instruction Execution Times The execution times for the MOVE.{B,W,L} instructions are shown in the next tables. Table 2-12 shows the timing for the other generic move operations. NOTE For all tables in this section, the execution time of any instruction using the PC-relative effective addressing modes is equivalent to the time using comparable An-relative mode. ET with {<ea> = (d16,PC)} equals ET with {<ea> = (d16,An)} ET with {<ea> = (d8,PC,Xi*SF)} equals ET with {<ea> = (d8,An,Xi*SF)} The nomenclature “(xxx).wl” refers to both forms of absolute addressing, (xxx).w and (xxx).l. Table 2-10 lists execution times for MOVE.{B,W} instructions. Table2-10. Move Byte and Word Execution Times Destination Source Rx (Ax) (Ax)+ –(Ax) (d16,Ax) (d8,Ax,Xi*SF) (xxx).wl Dy 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) Ay 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) (Ay) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) (Ay)+ 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) –(Ay) 3(1/0) 31/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) (d16,Ay) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) — — (d8,Ay,Xi*SF) 4(1/0) 4(1/1) 4(1/1) 4(1/1) — — — (xxx).w 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — — (xxx).l 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — — (d16,PC) 3(1/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) — — (d8,PC,Xi*SF) 4(1/0) 4(1/1) 4(1/1) 4(1/1) — — — #<xxx> 1(0/0) 3(0/1) 3(0/1) 3(0/1) — — — MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-20 Freescale Semiconductor

ColdFire Core Table 2-11 lists timings for MOVE.L. Table2-11. Move Long Execution Times Destination Source Rx (Ax) (Ax)+ –(Ax) (d16,Ax) (d8,Ax,Xi*SF) (xxx).wl Dy 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) Ay 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) (Ay) 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) 3(1/1) 2(1/1) (Ay)+ 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) 3(1/1) 2(1/1) –(Ay) 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) 3(1/1) 2(1/1) (d16,Ay) 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) — — (d8,Ay,Xi*SF) 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — — (xxx).w 2(1/0) 2(1/1) 2(1/1) 2(1/1) — — — (xxx).l 2(1/0) 2(1/1) 2(1/1) 2(1/1) — — — (d16,PC) 2(1/0) 2(1/1) 2(1/1) 2(1/1) 2(1/1) — — (d8,PC,Xi*SF) 3(1/0) 3(1/1) 3(1/1) 3(1/1) — — — #<xxx> 1(0/0) 2(0/1) 2(0/1) 2(0/1) — — — Table 2-12 gives execution times for MOVE.L instructions accessing program-visible registers of the MAC unit, along with other MOVE.L timings. Execution times for moving contents of the ACC or MACSR into a destination location represent the best-case scenario when the store instruction is executed and no load, MAC, or MSAC instructions are in the MAC execution pipeline. In general, these store operations require only one cycle for execution, but if they are preceded immediately by a load, MAC, or MSAC instruction, the MAC pipeline depth is exposed and execution time is three cycles. Table2-12. Move Execution Times Effective Address Opcode <ea> Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx> move.l <ea>,ACC 1(0/0) — — — — — — 1(0/0) move.l <ea>,MACSR 2(0/0) — — — — — — 2(0/0) move.l <ea>,MASK 1(0/0) — — — — — — 1(0/0) move.l ACC,Rx 1(0/0) — — — — — — — move.l MACSR,CCR 1(0/0) — — — — — — — move.l MACSR,Rx 1(0/0) — — — — — — — move.l MASK,Rx 1(0/0) — — — — — — — MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-21

ColdFire Core 2.7.2 Execution Timings—One-Operand Instructions Table 2-13 shows standard timings for single-operand instructions. Table2-13. One-Operand Instruction Execution Times Effective Address Opcode <ea> Rn (An) (An)+ -(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #xxx clr.b <ea> 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) — clr.w <ea> 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) — clr.l <ea> 1(0/0) 1(0/1) 1(0/1) 1(0/1) 1(0/1) 2(0/1) 1(0/1) — ext.w Dx 1(0/0) — — — — — — — ext.l Dx 1(0/0) — — — — — — — extb.l Dx 1(0/0) — — — — — — — neg.l Dx 1(0/0) — — — — — — — negx.l Dx 1(0/0) — — — — — — — not.l Dx 1(0/0) — — — — — — — scc Dx 1(0/0) — — — — — — — swap Dx 1(0/0) — — — — — — — tst.b <ea> 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0) tst.w <ea> 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0) tst.l <ea> 1(0/0) 2(1/0) 2(1/0) 2(1/0) 2(1/0) 3(1/0) 2(1/0) 1(0/0) 2.7.3 Execution Timings—Two-Operand Instructions Table 2-14 shows standard timings for two-operand instructions. Table2-14. Two-Operand Instruction Execution Times Effective Address Opcode <ea> Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx> add.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0) add.l Dy,<ea> — 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) — addi.l #imm,Dx 1(0/0) — — — — — — — addq.l #imm,<ea> 1(0/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) — addx.l Dy,Dx 1(0/0) — — — — — — — and.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0) and.l Dy,<ea> — 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) — andi.l #imm,Dx 1(0/0) — — — — — — — asl.l <ea>,Dx 1(0/0) — — — — — — 1(0/0) asr.l <ea>,Dx 1(0/0) — — — — — — 1(0/0) bchg Dy,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) — bchg #imm,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) — — — MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-22 Freescale Semiconductor

ColdFire Core Table2-14. Two-Operand Instruction Execution Times (continued) Effective Address Opcode <ea> Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx> bclr Dy,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) — bclr #imm,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) — — — bset Dy,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) 5(1/1) 4(1/1) — bset #imm,<ea> 2(0/0) 4(1/1) 4(1/1) 4(1/1) 4(1/1) — — — btst Dy,<ea> 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) — btst #imm,<ea> 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — — cmp.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0) cmpi.l #imm,Dx 1(0/0) — — — — — — — divs.w <ea>,Dx 20(0/0) 23(1/0) 23(1/0) 23(1/0) 23(1/0) 24(1/0) 23(1/0) 20(0/0) divu.w <ea>,Dx 20(0/0) 23(1/0) 23(1/0) 23(1/0) 23(1/0) 24(1/0) 23(1/0) 20(0/0) divs.l <ea>,Dx 35(0/0) 38(1/0) 38(1/0) 38(1/0) 38(1/0) — — — divu.l <ea>,Dx 35(0/0) 38(1/0) 38(1/0) 38(1/0) 38(1/0) — — — eor.l Dy,<ea> 1(0/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) — eori.l #imm,Dx 1(0/0) — — — — — — — lea <ea>,Ax — 1(0/0) — — 1(0/0) 2(0/0) 1(0/0) — lsl.l <ea>,Dx 1(0/0) — — — — — — 1(0/0) lsr.l <ea>,Dx 1(0/0) — — — — — — 1(0/0) mac.w Ry,Rx 1(0/0) — — — — — — — mac.l Ry,Rx 3(0/0) — — — — — — — msac.w Ry,Rx 1(0/0) — — — — — — — msac.l Ry,Rx 3(0/0) — — — — — — — mac.w Ry,Rx,ea,Rw — 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — — mac.l Ry,Rx,ea,Rw — 5(1/0) 5(1/0) 5(1/0) 5(1/0) — — — moveq #imm,Dx — — — — — — — 1(0/0) msac.w Ry,Rx,ea,Rw — 3(1/0) 3(1/0) 3(1/0) 3(1/0) — — — msac.l Ry,Rx,ea,Rw — 5(1/0) 5(1/0) 5(1/0) 5(1/0) — — — muls.w <ea>,Dx 4(0/0) 6(1/0) 6(1/0) 6(1/0) 6(1/0) 7(1/0) 6(1/0) 4(0/0) mulu.w <ea>,Dx 4(0/0) 6(1/0) 6(1/0) 6(1/0) 6(1/0) 8(1/0) 6(1/0) 4(0/0) muls.l <ea>,Dx 6(0/0) 8(1/0) 8(1/0) 8(1/0) 8(1/0) — — — mulu.l <ea>,Dx 6(0/0) 8(1/0) 8(1/0) 8(1/0) 8(1/0) — — — or.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0) or.l Dy,<ea> — 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) — or.l #imm,Dx 1(0/0) — — — — — — — rems.l <ea>,Dx 35(0/0) 38(1/0) 38(1/0) 38(1/0) 38(1/0) — — — remu.l <ea>,Dx 35(0/0) 38(1/0) 38(1/0) 38(1/0) 38(1/0) — — — sub.l <ea>,Rx 1(0/0) 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) 1(0/0) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-23

ColdFire Core Table2-14. Two-Operand Instruction Execution Times (continued) Effective Address Opcode <ea> Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx> sub.l Dy,<ea> — 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) — subi.l #imm,Dx 1(0/0) — — — — — — — subq.l #imm,<ea> 1(0/0) 3(1/1) 3(1/1) 3(1/1) 3(1/1) 4(1/1) 3(1/1) — subx.l Dy,Dx 1(0/0) — — — — — — — 2.7.4 Miscellaneous Instruction Execution Times Table 2-15 lists timings for miscellaneous instructions. Table2-15. Miscellaneous Instruction Execution Times Effective Address Opcode <ea> Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx> cpushl (Ax) — 11(0/1) — — — — — — link.w Ay,#imm 2(0/1) — — — — — — — move.w CCR,Dx 1(0/0) — — — — — — — move.w <ea>,CCR 1(0/0) — — — — — — 1(0/0) move.w SR,Dx 1(0/0) — — — — — — — move.w <ea>,SR 7(0/0) — — — — — — 7(0/0) movec Ry,Rc 9(0/1) — — — — — — — movem.l 1 <ea>,&list — 1+n(n/0) — — 1+n(n/0) — — — movem.l &list,<ea> — 1+n(0/n) — — 1+n(0/n) — — — nop 3(0/0) — — — — — — — pea <ea> — 2(0/1) — — 2(0/1)2 3(0/1)3 2(0/1) — pulse 1(0/0) — — — — — — — stop #imm — — — — — — — 3(0/0)4 trap #imm — — — — — — — 15(1/2) trapf 1(0/0) — — — — — — — trapf.w 1(0/0) — — — — — — — trapf.l 1(0/0) — — — — — — — unlk Ax 2(1/0) — — — — — — — wddata.l <ea> — 3(1/0) 3(1/0) 3(1/0) 3(1/0) 4(1/0) 3(1/0) — wdebug.l <ea> — 5(2/0) — — 5(2/0) — — — 1 n is the number of registers moved by the MOVEM opcode. 2 PEA execution times are the same for (d16,PC). 3 PEA execution times are the same for (d8,PC,Xi*SF). 4 The execution time for STOP is the time required until the processor begins sampling continuously for interrupts. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-24 Freescale Semiconductor

ColdFire Core 2.7.5 Branch Instruction Execution Times Table 2-16 shows general branch instruction timing. Table2-16. General Branch Instruction Execution Times Effective Address Opcode <ea> Rn (An) (An)+ –(An) (d16,An) (d8,An,Xi*SF) (xxx).wl #<xxx> bra — — — — 2(0/1) — — — bsr — — — — 3(0/1) — — — jmp <ea> — 3(0/0) — — 3(0/0) 4(0/0) 3(0/0) — jsr <ea> — 3(0/1) — — 3(0/1) 4(0/1) 3(0/1) — rte — — 10(2/0) — — — — — rts — — 5(1/0) — — — — — Table 2-17 shows timing for Bcc instructions. Table2-17. Bcc Instruction Execution Times Opcode Forward Taken Forward Not Taken Backward Taken Backward Not Taken bcc 3(0/0) 1(0/0) 2(0/0) 3(0/0) 2.8 Exception Processing Overview Exception processing for ColdFire processors is streamlined for performance. Differences from previous M68000 family processors include the following: • A simplified exception vector table • Reduced relocation capabilities using the vector base register • A single exception stack frame format • Use of a single, self-aligning system stack pointer ColdFire processors use an instruction restart exception model but require more software support to recover from certain access errors. See Table 2-18 for details. Exception processing can be defined as the time from the detection of the fault condition until the fetch of the first handler instruction has been initiated. It is comprised of the following four major steps: 1. The processor makes an internal copy of the SR and then enters supervisor mode by setting SR[S] and disabling trace mode by clearing SR[T]. The occurrence of an interrupt exception also forces SR[M] to be cleared and the interrupt priority mask to be set to the level of the current interrupt request. 2. The processor determines the exception vector number. For all faults except interrupts, the processor performs this calculation based on the exception type. For interrupts, the processor performs an interrupt-acknowledge (IACK) bus cycle to obtain the vector number from a peripheral device. The IACK cycle is mapped to a special acknowledge address space with the interrupt level encoded in the address. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-25

ColdFire Core 3. The processor saves the current context by creating an exception stack frame on the system stack. ColdFire processors support a single stack pointer in the A7 address register; therefore, there is no notion of separate supervisor and user stack pointers. As a result, the exception stack frame is created at a 0-modulo-4 address on the top of the current system stack. Additionally, the processor uses a simplified fixed-length stack frame for all exceptions. The exception type determines whether the program counter in the exception stack frame defines the address of the faulting instruction (fault) or of the next instruction to be executed (next). 4. The processor acquires the address of the first instruction of the exception handler. The exception vector table is aligned on a 1-Mbyte boundary. This instruction address is obtained by fetching a value from the table at the address defined in the vector base register. The index into the exception table is calculated as 4xvector_number. When the index value is generated, the vector table contents determine the address of the first instruction of the desired handler. After the fetch of the first opcode of the handler is initiated, exception processing terminates and normal instruction processing continues in the handler. ColdFire processors support a 1024-byte vector table aligned on any 1-Mbyte address boundary; see Table 2-18. The table contains 256 exception vectors where the first 64 are defined by Freescale; the remaining 192 are user-defined interrupt vectors. Table2-18. Exception Vector Assignments Vector Vector Offset Stacked Assignment Numbers (Hex) Program Counter 1 0 000 — Initial stack pointer 1 004 — Initial program counter 2 008 Fault Access error 3 00C Fault Address error 4 010 Fault Illegal instruction 5 014 Fault Divide by zero 6–7 018–01C — Reserved 8 020 Fault Privilege violation 9 024 Next Trace 10 028 Fault Unimplemented line-a opcode 11 02C Fault Unimplemented line-f opcode 12 030 Next Debug interrupt 13 034 — Reserved 14 038 Fault Format error 15 03C Next Uninitialized interrupt 16–23 040–05C — Reserved 24 060 Next Spurious interrupt 25–31 064–07C Next Level 1–7 autovectored interrupts 32–47 080–0BC Next Trap #0–15 instructions 48–60 0C0–0F0 — Reserved MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-26 Freescale Semiconductor

ColdFire Core Table2-18. Exception Vector Assignments (continued) Vector Vector Offset Stacked Assignment Numbers (Hex) Program Counter 1 61 0F4 Fault Unsupported instruction 62–63 0F8–0FC — Reserved 64–255 100–3FC Next User-defined interrupts 1 The term ‘fault’ refers to the PC of the instruction that caused the exception. The term ‘next’ refers to the PC of the instruction that immediately follows the instruction that caused the fault. ColdFire processors inhibit sampling for interrupts during the first instruction of all exception handlers. This allows any handler to effectively disable interrupts, if necessary, by raising the interrupt mask level contained in the status register. 2.8.1 Exception Stack Frame Definition The exception stack frame is shown in Figure2-10. The first longword of the exception stack frame contains the 16-bit format/vector word (F/V) and the 16-bit status register. The second longword contains the 32-bit program counter address. 31 28 27 26 25 18 17 16 15 0 A7→ Format FS[3–2] Vector[7–0] FS[1–0] Status Register + 0x04 Program Counter [31–0] Figure2-10. Exception Stack Frame Form The 16-bit format/vector word contains three unique fields: • Format field—This 4-bit field at the top of the system stack is always written with a value of {4,5,6,7} by the processor indicating a 2-longword frame format. See Table2-19. This field records any longword misalignment of the stack pointer that may have existed when the exception occurred. Table2-19. Format Field Encoding Original A7 at Time of A7 at First Instruction of Format Field Bits Exception, Bits 1–0 Handler 31–28 00 Original A[7–8] 0100 01 Original A[7–9] 0101 10 Original A[7–10] 0110 11 Original A[7–11] 0111 • Fault status field—The 4-bit field, FS[3–0], at the top of the system stack is defined for access and address errors along with interrupted debug service routines. See Table2-20. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-27

ColdFire Core Table2-20. Fault Status Encodings FS[3–0] Definition 0000-001x Reserved 0100 Error on instruction fetch 0101–011x Reserved 1000 Error on operand write 1001 Attempted write to write-protected space 101x Reserved 1100 Error on operand read 1101–111x Reserved • Vector number—This 8-bit field, vector[7–0], defines the exception type. It is calculated by the processor for internal faults and is supplied by the peripheral for interrupts. See Table 2-18. 2.8.2 Processor Exceptions Table 2-21 describes MCF5272 exceptions. Table2-21. MCF5272 Exceptions Exception Description Access Error Caused by an error when accessing memory. For an access error on an instruction fetch, the processor postpones the error reporting until the instruction at the faulted reference is executed. Thus, faults that occur during instruction prefetches that are followed by a change of instruction flow do not generate an exception. When the processor attempts to execute an instruction with a faulted opword or extension word, the access error is signaled, and the instruction is aborted. For this type of exception, the programming model is not altered by the faulted instruction. If an access error occurs on an operand read, the processor immediately aborts the current instruction execution and initiates exception processing. In this case, any address register changes caused by the auto-addressing modes, (An)+ and -(An), have already occurred. In addition, if an access error occurs during the execution of a MOVEM instruction loading from memory, registers updated before the fault occurs contain the memory operand. Due to the processor pipeline implementation, a write cycle may be decoupled from the execution of the instruction causing the write. Thus, if an access error occurs on an operand write, the signaling of the error is imprecise. Accordingly, the PC contained in the exception stack frame represents the location in the program when the access error is signaled, not necessarily the instruction causing the fault. All programming model updates associated with the write instruction are complete. The NOP instruction can be used to help identify write access errors. A NOP is not executed until all previous operations, including any pending writes are complete. Thus if any previous write terminates with an access error, it is guaranteed to be reported on the NOP. Address Error Caused by an attempted execution transferring control to an odd instruction address (that is, if bit 0 of the target address is set), an attempted use of a word-sized index register (Xi.w) or a scale factor of 8 on an indexed effective addressing mode, or attempted execution of an instruction with a full-format indexed addressing mode. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-28 Freescale Semiconductor

ColdFire Core Table2-21. MCF5272 Exceptions (continued) Exception Description Illegal On Version 2 ColdFire implementations, only some illegal opcodes (0x0000 and 0x4AFC) are decoded and Instruction generate an illegal instruction exception. Additionally, attempting to execute an illegal line A or line F opcode generates unique exception types: vectors 10 and 11, respectively. If any other nonsupported opcode is executed, the resulting operation is undefined. ColdFire processors do not provide illegal instruction detection on extension words of any instruction, including MOVEC. Attempting to execute an instruction with an illegal extension word causes undefined results. Divide by Zero Attempted division by zero causes an exception (vector 5, offset = 0x014) except when the PC points to the faulting instruction (DIVU, DIVS, REMU, REMS). Privilege Caused by attempted execution of a supervisor mode instruction while in user mode. The ColdFire Violation Programmer’s Reference Manual lists supervisor- and user-mode instructions. Trace ColdFire processors provide instruction-by-instruction tracing. While the processor is in trace mode Exception (SR[T]=1), instruction completion signals a trace exception. This allows a debugger to monitor program execution. The only exception to this definition is the STOP instruction. If the processor is in trace mode, the instruction before the STOP executes and then generates a trace exception. In the exception stack frame, the PC points to the STOP opcode. When the trace handler is exited, the STOP instruction is executed, loading the SR with the immediate operand from the instruction. The processor then generates a trace exception. The PC in the exception stack frame points to the instruction after STOP, and the SR reflects the just-loaded value. If the processor is not in trace mode and executes a STOP instruction where the immediate operand sets the trace bit in the SR, hardware loads the SR and generates a trace exception. The PC in the exception stack frame points to the instruction after STOP, and the SR reflects the just-loaded value. Because ColdFire processors do not support hardware stacking of multiple exceptions, it is the responsibility of the operating system to check for trace mode after processing other exception types. As an example, consider a TRAP instruction executing in trace mode. The processor initiates the TRAP exception and passes control to the corresponding handler. If the system requires that a trace exception be processed, the TRAP exception handler must check for this condition (SR[15] in the exception stack frame asserted) and pass control to the trace handler before returning from the original exception. Debug Caused by a hardware breakpoint register trigger. Rather than generating an IACK cycle, the processor Interrupt internally calculates the vector number (12). Additionally, the M bit and the interrupt priority mask fields of the SR are unaffected by the interrupt. See Section2.2.2.1, “Status Register (SR).” RTE and When an RTE instruction executes, the processor first examines the 4-bit format field to validate the frame type. Format Error For a ColdFire processor, any attempted execution of an RTE where the format is not equal to {4,5,6,7} Exceptions generates a format error. The exception stack frame for the format error is created without disturbing the original exception frame and the stacked PC points to RTE.The selection of the format value provides limited debug support for porting code from M68000 applications. On M68000 Family processors, the SR was at the top of the stack. Bit 30 of the longword addressed by the system stack pointer is typically zero; so, attempting an RTE using this old format generates a format error on a ColdFire processor. If the format field defines a valid type, the processor does the following: 1 Reloads the SR operand. 2 Fetches the second longword operand. 3 Adjusts the stack pointer by adding the format value to the auto-incremented address after the first longword fetch. 4 Transfers control to the instruction address defined by the second longword operand in the stack frame. TRAP Executing TRAP always forces an exception and is useful for implementing system calls. The trap instruction may be used to change from user to supervisor mode. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 2-29

ColdFire Core Table2-21. MCF5272 Exceptions (continued) Exception Description Interrupt Interrupt exception processing, with interrupt recognition and vector fetching, includes uninitialized and Exception spurious interrupts as well as those where the requesting device supplies the 8-bit interrupt vector. Reset Asserting the reset input signal (RSTI) causes a reset exception. Reset has the highest exception priority; it Exception provides for system initialization and recovery from catastrophic failure. When assertion of RSTI is recognized, current processing is aborted and cannot be recovered. The reset exception places the processor in supervisor mode by setting SR[S] and disables tracing by clearing SR[T]. This exception also clears SR[M] and sets the processor’s interrupt priority mask in the SR to the highest level (level 7). Next, the VBR is initialized to 0x0000_0000. Configuration registers controlling the operation of all processor-local memories (cache and RAM modules on the MCF5272) are invalidated, disabling the memories. Note:Other implementation-specific supervisor registers are also affected. Refer to each of the modules in this manual for details on these registers. If the processor is not halted and it has ownership of the bus, it initiates the reset exception by performing two longword read bus cycles. The longword at address 0 is loaded into the stack pointer and the longword at address 4 is loaded into the PC. After the initial instruction is fetched from memory, program execution begins at the address in the PC. If an access error or address error occurs before the first instruction executes, the processor enters the fault-on-fault halted state. If a ColdFire processor encounters any type of fault during the exception processing of another fault, the processor immediately halts execution with the catastrophic fault-on-fault condition. A reset is required to force the processor to exit this halted state. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 2-30 Freescale Semiconductor

Chapter 3 Hardware Multiply/Accumulate (MAC) Unit This chapter describes the MCF5272 multiply/accumulate (MAC) unit, which executes integer multiply, multiply-accumulate, and miscellaneous register instructions. The MAC is integrated into the operand execution pipeline (OEP). 3.1 Overview The MAC unit provides hardware support for a limited set of digital signal processing (DSP) operations used in embedded code, while supporting the integer multiply instructions in the ColdFire microprocessor family. The MAC unit provides signal processing capabilities for the MCF5272 in a variety of applications including digital audio and servo control. Integrated as an execution unit in the processor’s OEP, the MAC unit implements a three-stage arithmetic pipeline optimized for 16 x 16 multiplies. Both 16- and 32-bit input operands are supported by this design in addition to a full set of extensions for signed and unsigned integers plus signed, fixed-point fractional input operands. The MAC unit provides functionality in three related areas: • Signed and unsigned integer multiplies • Multiply-accumulate operations supporting signed, unsigned, and signed fractional operands • Miscellaneous register operations Each of the three areas of support is addressed in detail in the succeeding sections. Logic that supports this functionality is contained in a MAC module, as shown in Figure 3-1. Operand Y Operand X X Shift 0,1,-1 +/- Accumulator Figure3-1. ColdFire MAC Multiplication and Accumulation MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 3-1

Hardware Multiply/Accumulate (MAC) Unit The MAC unit is tightly coupled to the OEP and features a three-stage execution pipeline. To minimize silicon costs, the ColdFire MAC is optimized for 16 x 16 multiply instructions. The OEP can issue a 16x16 multiply with a 32-bit accumulation and fetch a 32-bit operand in the same cycle. A 32 x 32 multiply with a 32-bit accumulation takes three cycles before the next instruction can be issued. Figure 3-1 shows the basic functionality of the ColdFire MAC. A full set of instructions is provided for signed and unsigned integers plus signed, fixed-point, fractional input operands. The MAC unit is an extension of the basic multiplier found on most microprocessors. It can perform operations native to signal processing algorithms in an acceptable number of cycles, given the application constraints. For example, small digital filters can tolerate some variance in the execution time of the algorithm; larger, more complicated algorithms such as orthogonal transforms may have more demanding speed requirements exceeding the scope of any processor architecture and requiring a fully developed DSP implementation. The M68000 architecture was not designed for high-speed signal processing, and a large DSP engine would be excessive in an embedded environment. In striking a middle ground between speed, size, and functionality, the ColdFire MAC unit is optimized for a small set of operations that involve multiplication and cumulative additions. Specifically, the multiplier array is optimized for single-cycle, 16 x 16 multiplies producing a 32-bit result, with a possible accumulation cycle following. This is common in a large portion of signal processing applications. In addition, the ColdFire core architecture has been modified to allow for an operand fetch in parallel with a multiply, increasing overall performance for certain DSP operations. 3.1.1 MAC Programming Model Figure 3-2 shows the registers in the MAC portion of the user programming model. 31 0 MACSR MAC status register ACC MAC accumulator MASK MAC mask register Figure3-2. MAC Programming Model These registers are described as follows: • Accumulator (ACC)—This 32-bit, read/write, general-purpose register is used to accumulate the results of MAC operations. • Mask register (MASK)—This 16-bit general-purpose register provides an optional address mask for MAC instructions that fetch operands from memory. It is useful in the implementation of circular queues in operand memory. • MAC status register (MACSR)—This 8-bit register defines configuration of the MAC unit and contains indicator flags affected by MAC instructions. Unless noted otherwise, the setting of MACSR indicator flags is based on the final result, that is, the result of the final operation involving the product and accumulator. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 3-2 Freescale Semiconductor

Hardware Multiply/Accumulate (MAC) Unit 3.1.2 General Operation The MAC unit supports the ColdFire integer multiply instructions (MULS and MULU) and provides additional functionality for multiply-accumulate operations. The added MAC instructions to the ColdFire ISA provide for the multiplication of two numbers, followed by the addition or subtraction of this number to or from the value contained in the accumulator. The product may be optionally shifted left or right one bit before the addition or subtraction takes place. Hardware support for saturation arithmetic may be enabled to minimize software overhead when dealing with potential overflow conditions using signed or unsigned operands. These MAC operations treat the operands as one of the following formats: • Signed integers • Unsigned integers • Signed, fixed-point, fractional numbers To maintain compactness, the MAC module is optimized for 16-bit multiplications. Two 16-bit operands produce a 32-bit product. Longword operations are performed by reusing the 16-bit multiplier array at the expense of a small amount of extra control logic. Again, the product of two 32-bit operands is a 32-bit result. For longword integer operations, only the least significant 32 bits of the product are calculated. For fractional operations, the entire 63-bit product is calculated and then either truncated or rounded to a 32-bit result using the round-to-nearest (even) method. Because the multiplier array is implemented in a 3-stage pipeline, MAC instructions can have an effective issue rate of one clock for word operations, three for longword integer operations, and four for 32-bit fractional operations. Arithmetic operations use register-based input operands, and summed values are stored internally in the accumulator. Thus, an additional MOVE instruction is necessary to store data in a general-purpose register. MAC instructions can choose the upper or lower word of a register as the input, which helps filtering operations in which one data register is loaded with input data and another is loaded with coefficient data. Two 16-bit MAC operations can be performed without fetching additional operands between instructions by alternating the word choice during the calculations. The need to move large amounts of data quickly can limit throughput in DSP engines. However, data can be moved efficiently by using the MOVEM instruction, which automatically generates line-sized burst references and is ideal for filling registers quickly with input data, filter coefficients, and output data. Loading an operand from memory into a register during a MAC operation makes some DSP operations, especially filtering and convolution, more manageable. The MACSR has a 4-bit operational mode field and three condition flags. The operational mode bits control the overflow/saturation mode, whether operands are signed or unsigned, whether operands are treated as integers or fractions, and how rounding is performed. Negative, zero, and overflow flags are also provided. The three program-visible MAC registers, a 32-bit accumulator (ACC), the MAC mask register (MASK), and MACSR, are described in Section3.1.1, “MAC Programming Model.” MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 3-3

Hardware Multiply/Accumulate (MAC) Unit 3.1.3 MAC Instruction Set Summary The MAC unit supports the integer multiply operations defined by the baseline ColdFire architecture and the new multiply-accumulate instructions. Table 3-1 summarizes the MAC unit instruction set. Table3-1. MAC Instruction Summary Instruction Mnemonic Description Multiply Signed MULS <ea>y,Dx Multiplies two signed operands yielding a signed result Multiply Unsigned MULU <ea>y,Dx Multiplies two unsigned operands yielding an unsigned result Multiply Accumulate MAC Ry,RxSF Multiplies two operands, then adds or subtracts the product to/from MSAC Ry,RxSF the accumulator Multiply Accumulate with MAC Ry,RxSF,Rw Multiplies two operands, then adds or subtracts the product to/from Load MSAC Ry,RxSF,Rw the accumulator while loading a register with the memory operand Load Accumulator MOV.L {Ry,#imm},ACC Loads the accumulator with a 32-bit operand Store Accumulator MOV.L ACC,Rx Writes the contents of the accumulator to a register Load MACSR MOV.L {Ry,#imm},MACSR Writes a value to the MACSR Store MACSR MOV.L MACSR,Rx Writes the contents of MACSR to a register Store MACSR to CCR MOV.L MACSR,CCR Writes the contents of MACSR to the processor’s CCR register Load MASK MOV.L {Ry,#imm},MASK Writes a value to MASK Store MASK MOV.L MASK,Rx Writes the contents of MASK to a register 3.1.4 Data Representation The MAC unit supports three basic operand types: • Two’s complement signed integer: In this format, an N-bit operand represents a number within the range -2(N-1) < operand < 2(N-1) - 1. The binary point is to the right of the least significant bit. • Two’s complement unsigned integer: In this format, an N-bit operand represents a number within the range 0 < operand < 2N - 1. The binary point is to the right of the least significant bit. • Two’s complement, signed fractional: In an N-bit number, the first bit is the sign bit. The remaining bits signify the first N-1 bits after the binary point. Given an N-bit number, a a a ... a a a , N-1 N-2 N-3 2 1 0 its value is given by the following formula: N –2 (i + 1– N) + ∑ 2 ⋅ ai i = 0 This format can represent numbers in the range –1 < operand < 1 – 2(N-1). For words and longwords, the greatest negative number that can be represented is –1, whose internal representation is 0x8000 and 0x0x8000_0000, respectively. The most positive word is 0x7FFF or (1 - 2-15); the most positive longword is 0x7FFF_FFFF or (1 - 2-31). 3.2 MAC Instruction Execution Timings For information on MAC instruction execution timings, refer to Section2.7, “Instruction Timing.” MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 3-4 Freescale Semiconductor

Chapter 4 Local Memory This chapter describes the MCF5272 implementation of the ColdFire Version 2 core local memory specification. It consists of the following sections. • Section4.3, “SRAM Overview,” and Section4.4, “ROM Overview,” describe the on-chip static RAM (SRAM) and ROM implementations. These chapters cover general operations, configuration, and initialization. They also provide information and examples showing how to minimize power consumption when using the ROM and SRAM. • Section4.5, “Instruction Cache Overview,” describes the cache implementation, including organization, configuration, and coherency. It describes cache operations and how the cache interfaces with other memory structures. 4.1 Interactions Between Local Memory Modules Depending on configuration information, instruction fetches and data read accesses may be sent simultaneously to the SRAM, ROM, and cache controllers. This approach is required because the controllers are memory-mapped devices and the hit/miss determination is made concurrently with the read data access. Power dissipation can be minimized by configuring the ROM and SRAM base address registers (ROMBAR and RAMBAR) to mask unused address spaces whenever possible. If the access address is mapped into the region defined by the SRAM (and this region is not masked), it provides the data back to the processor and any cache or ROM data is discarded. If the access address does not hit the SRAM, but is mapped into the region defined by the ROM (and this region is not masked), the ROM provides the data back to the processor and any cache data is discarded. Accesses from the SRAM and ROM modules are never cached. The complete definition of the processor’s local bus priority scheme for read references is as follows: if (SRAM “hits”) SRAM supplies data to the processor if (ROM “hits”) ROM supplies data to the processor else if (cache “hits”) cache supplies data to the processor else system memory reference to access data MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 4-1

Local Memory 4.2 Local Memory Registers Table 4-1 lists the local memory registers. Note the following: • Addresses not assigned to the register and undefined register bits are reserved. Write accesses to these bits have no effect; read accesses return zeros. • The reset value column indicates the register initial value at reset. Uninitialized fields may contain random values after reset. Table4-1. Memory Map of Instruction Cache Registers Address Name Width Description Reset Value (using MOVEC) 0x002 CACR 32 Cache control register 0x0000 0x004 ACR0 32 Access control register 0 0x0000 0x005 ACR1 32 Access control register 1 0x0000 0xC00 ROMBAR 32 ROM base address register Uninitialized (except V = 0) 0xC04 RAMBAR 32 SRAM base address register Uninitialized (except V = 0) 4.3 SRAM Overview The SRAM module has the following features: • 4-Kbyte SRAM, organized as 1K x 32 bits • Single-cycle access • Physically located on the ColdFire core's high-speed local bus • Byte, word, longword address capabilities • Programmable memory mapping 4.3.1 SRAM Operation The SRAM module provides a general-purpose memory block the ColdFire core can access in a single cycle. The location of the memory block can be set to any 4-Kbyte address boundary within the 4-Gbyte address space. The memory is ideal for storing critical code or data structures or for use as the system stack. Because the SRAM module is physically connected to the processor's high-speed local bus, it can quickly service core-initiated accesses or memory-referencing commands from the debug module. Section4.1, “Interactions Between Local Memory Modules,” describes priorities when an access address hits multiple local memory resources. 4.3.2 SRAM Programming Model The MCF5272 implements the SRAM base address register (RAMBAR), shown in Figure 4-1 and described in the following section. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 4-2 Freescale Semiconductor

Local Memory 4.3.2.1 SRAM Base Address Register (RAMBAR) RAMBAR determines the base address location of the internal SRAM module, as well as the definition of the types of accesses allowed for it. • RAMBAR is a 32-bit write-only supervisor control register. It is accessed in the CPU address space via the MOVEC instruction with an Rc encoding of 0xC04. RAMBAR can be read or written in background debug mode (BDM). At system reset, the V bit is cleared and the remaining bits are uninitialized. To access the SRAM module, RAMBAR must be written with the appropriate base address after system reset. • The SRAM base address register (RAMBAR) can be accessed only in supervisor mode using the MOVEC instruction with an Rc value of 0xC04. 31 12 11 9 8 7 6 5 4 3 2 1 0 Field BA — WP — C/I SC SD UC UD V Reset — 0 R/W W for CPU; R/W for debug Address CPU space + 0xC04 Figure4-1. SRAM Base Address Register (RAMBAR) RAMBAR fields are described in Table 4-2. Table4-2. RAMBAR Field Description Bits Name Description 31–12 BA Base address. SRAM module base address. The SRAM module occupies a 4-Kbyte space defined by BA. SRAM can reside on any 4-Kbyte boundary in the 4-Gbyte address space. 11–9 — Reserved, should be cleared. 8 WP Write protect. Controls read/write properties of the SRAM. 0 Allows read and write accesses to the SRAM module. 1 Allows only read accesses to the SRAM module. Any attempted write reference generates an access error exception to the ColdFire processor core. 7–6 — Reserved, should be cleared. 5–1 C/I, Address space masks (ASn). These fields allow certain types of accesses to be masked, or inhibited SC, from accessing the SRAM module. These bits are useful for power management as described in SD, Section4.3.2.3, “Programming RAMBAR for Power Management.” In particular, C/I is typically set. UC, UD The address space mask bits are follows: C/I = CPU space/interrupt acknowledge cycle mask. Note that C/I must be set if BA = 0. SC = Supervisor code address space mask SD = Supervisor data address space mask UC = User code address space mask UD = User data address space mask For each ASn bit: 0 An access to the SRAM module can occur for this address space 1 Disable this address space from the SRAM module. References to this address space cannot access the SRAM module and are processed like other non-SRAM references. 0 V Valid. Enables/disables the SRAM module. V is cleared at reset. 0 RAMBAR contents are not valid. 1 RAMBAR contents are valid. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 4-3

Local Memory The mapping of a given access into the SRAM uses the following algorithm to determine if the access hits in the memory: if (RAMBAR[0] = 1) if (requested address[31:12] = RAMBAR[31:12]) if (address space mask of the requested type = 0) Access is mapped to the SRAM module if (access = read) Read the SRAM and return the data if (access = write) if (RAMBAR[8] = 0) Write the data into the SRAM else Signal a write-protect access error 4.3.2.2 SRAM Initialization After a hardware reset, the contents of the SRAM module are undefined. The valid bit of RAMBAR is cleared, disabling the module. If the SRAM needs to be initialized with instructions or data, the following steps should be performed: 1. Load RAMBAR, mapping the SRAM module to the desired location. 2. Read the source data and write it to the SRAM. Various instructions support this function, including memory-to-memory MOVE instructions and the MOVEM opcode. The MOVEM instruction is optimized to generate line-sized burst fetches on 0-modulo-16 addresses, so this opcode generally provides the best performance. 3. After data is loaded into the SRAM, it may be appropriate to load a revised value into RAMBAR with new write-protect and address space mask attributes. These attributes consist of the write-protect and address-space mask fields. The ColdFire processor or an external BDM emulator using the debug module can perform this initialization. 4.3.2.3 Programming RAMBAR for Power Management Depending on the configuration defined by RAMBAR, instruction fetch accesses can be sent to the SRAM module, ROM module, and instruction cache simultaneously. If the access is mapped to the SRAM module, it sources the read data, discarding the instruction cache access. If the SRAM is used only for data operands, setting RAMBAR[SC,UC] lowers power dissipation by disabling the SRAM during all instruction fetches. Additionally, if the SRAM holds only instructions, setting RAMBAR[SD,UD] reduces power dissipation. Consider the examples on Table 4-3 of typical RAMBAR settings: Table4-3. Examples of Typical RAMBAR Settings Data Contained in SRAM RAMBAR[7–0] Instructions only 0x2B Data only 0x35 Both instructions and data 0x21 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 4-4 Freescale Semiconductor

Local Memory ROMBAR can be configured similarly, as described in Section4.4.2.2, “Programming ROMBAR for Power Management.” 4.4 ROM Overview The ROM modules has the following features: • 16-Kbyte ROM, organized as 4K x 32 bits • Contains data tables for soft HDLC (high-level data link control) • The ROM contents are not customizeable • Single-cycle access • Physically located on ColdFire core's high-speed local bus • Byte, word, longword address capabilities • Programmable memory mapping 4.4.1 ROM Operation The ROM module contains tabular data that the ColdFire core can access in a single cycle. The ROM can be located on any 16-Kbyte address boundary in the 4-Gbyte address space. Section4.1, “Interactions Between Local Memory Modules,” describes priorities when a fetch address hits multiple local memory resources. 4.4.2 ROM Programming Model The MCF5272 implements the ROM base address register (ROMBAR), shown in Figure 4-2 and described in the following section. 4.4.2.1 ROM Base Address Register (ROMBAR) ROMBAR determines the base address location of the internal ROM module, as well as the definition of the allowable access types. ROMBAR can be accessed in supervisor mode using the MOVEC instruction with an Rc value of 0xC00. It can also be read when the processor is in background debug mode (BDM). To access the ROM module, ROMBAR should be initialized with the appropriate base address. 31 14 13 8 7 6 5 4 3 2 1 0 Field BA — — C/I SC SD UC UD V Reset — 00 — — — — — 0 R/W W for CPU; R/W for debug Address CPU space + 0xC00 Figure4-2. ROM Base Address Register (ROMBAR) ROMBAR fields are described in Table 4-4. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 4-5

Local Memory Table4-4. ROMBAR Field Description Bits Name Description 31–14 BA Base address. Defines the ROM module base address. ROM can reside on any 16-Kbyte boundary in the 4-Gbyte address space. 13–6 — Reserved, should be cleared. 5–1 C/I, SC, Address space masks (ASn). Allows specific address spaces to be enabled or disabled, placing internal SD, UC, modules in a specific address space. If an address space is disabled, an access to the register in that UD address space becomes an external bus access, and the module resource is not accessed. These bits are useful for power management as described in Section4.4.2.2, “Programming ROMBAR for Power Management.” In particular, C/I is typically set. The address space mask bits are follows: C/I = CPU space/interrupt acknowledge cycle mask. Note that C/I must be set if BA = 0. SC = Supervisor code address space mask SD = Supervisor data address space mask UC = User code address space mask UD = User data address space mask For each ASn bit: 0 An access to the ROM module can occur for this address space 1 Disable this address space from the ROM module. References to this address space cannot access the ROM module and are processed like other non-ROM references. 0 V Valid. Indicates whether ROMBAR contents are valid. The BA value is not used and the ROM module is not accessible until V is set. 0 Contents of ROMBAR are not valid. 1 Contents of ROMBAR are valid. 4.4.2.2 Programming ROMBAR for Power Management Depending on the ROMBAR configuration, memory accesses can be sent to the ROM module and the cache simultaneously. If an access hits both, the ROM module sources read data and the instruction cache access is discarded. Because the ROM contains only for data, setting ROMBAR[SC,UC] lowers power dissipation by disabling the ROM during instruction fetches. Table 4-5 shows typical ROMBAR settings: Table4-5. Examples of Typical ROMBAR Settings Data Contained In ROM ROMBAR[7–0] Instructions only 0x2B Data only 0x35 Both instructions and data 0x21 RAMBAR can be configured similarly, as described in Section4.3.2.3, “Programming RAMBAR for Power Management.” MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 4-6 Freescale Semiconductor

Local Memory 4.5 Instruction Cache Overview The features of the instruction cache are as follows: • 1-Kbyte direct-mapped cache • Single-cycle access on cache hits • Physically located on ColdFire core's high-speed local bus • Nonblocking design to maximize performance • 16-byte line-fill buffer • Configurable cache miss-fetch algorithm 4.5.1 Instruction Cache Physical Organization The instruction cache, Figure 4-3, is a direct-mapped single-cycle memory, organized as 64 lines, each containing 16 bytes. Memory consists of a 64-entry tag array (containing addresses and a valid bit) and a 1-Kbyte instruction data array, organized as 64 x 128 bits. The two memory arrays are accessed in parallel: bits 9–4 of the instruction fetch address provide the index into the tag array; bits 9–2 address the data array. The tag array outputs the address mapped to the given cache location along with the valid bit for the line. This address field is compared to bits 31–10 of the instruction fetch address from the local bus to determine if a cache hit in the memory array has occurred. If the desired address is mapped into the cache memory, the output of the data array is driven onto the ColdFire core's local data bus completing the access in a single cycle. The tag array maintains a single valid bit per line entry. Accordingly, only entire 16-byte lines are loaded into the instruction cache. The instruction cache also contains a 16-byte fill buffer that provides temporary storage for the last line fetched in response to a cache miss. With each instruction fetch, the contents of the line-fill buffer are examined. Thus, each instruction fetch address examines both the tag memory array and the line-fill buffer to see if the desired address is mapped into either hardware resource. A cache hit in either the memory array or the line-fill buffer is serviced in a single cycle. Because the line-fill buffer maintains valid bits on a longword basis, hits in the buffer can be serviced immediately without waiting for the entire line to be fetched. If the referenced address is not contained in the memory array or the line-fill buffer, the instruction cache initiates the required external fetch operation. In most situations, this is a 16-byte line-sized burst reference. Hardware is nonblocking, meaning the ColdFire core's local bus is released after the initial access of a miss. Thus, the cache, SRAM, or ROM module can service subsequent requests while the rest of the line is being fetched and loaded into the fill buffer. Generally, longword references are used for sequential fetches. If the processor branches to an odd word address, a word-sized fetch is generated. The memory array of the instruction cache is enabled only if CACR[CENB] is asserted. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 4-7

Local Memory External Data[31:0] Local Address Bus 31 9 43210 31 4 Line Buffer Data Storage Line Buffer Address MUX = 31 0 0 Fill Hit Data 31 9 0 63 d Tag ali V MUX 31 = Local Data Bus Tag Hit Figure4-3. Instruction Cache Block Diagram 4.5.2 Instruction Cache Operation The instruction cache is physically connected to the ColdFire core's local bus, allowing it to service all instruction fetches from the ColdFire core and certain memory fetches initiated by the debug module. Typically, the debug module's memory references appear as supervisor data accesses but the unit can be programmed to generate user-mode accesses and/or instruction fetches. The instruction cache processes any instruction fetch access in the normal manner. 4.5.2.1 Interaction with Other Modules Because both the instruction cache and high-speed SRAM module are connected to the ColdFire core's local data bus, certain user-defined configurations can result in simultaneous instruction fetch processing. If the referenced address is mapped into the SRAM module, that module services the request in a single cycle. In this case, data accessed from the instruction cache is discarded without generating external memory references. If the address is not mapped into SRAM space, the instruction cache handles the request in the normal fashion. 4.5.2.2 Cache Coherency and Invalidation The instruction cache does not monitor ColdFire core data references for accesses to cached instructions. Therefore, software must maintain cache coherency by invalidating the appropriate cache entries after modifying code segments. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 4-8 Freescale Semiconductor

Local Memory Cache invalidation can be performed in the two following ways: • Setting CACR[CINVA] forces the entire instruction cache to be marked as invalid. The invalidation operation requires 64 cycles because the cache sequences through the entire tag array, clearing a single location each cycle. Any subsequent instruction fetch accesses are postponed until the invalidation sequence is complete. • The privileged CPUSHL instruction can invalidate a single cache line. When this instruction is executed, the cache entry defined by bits 9–4 of the source address register is invalidated, provided CACR[CDPI] is cleared. These invalidation operations can be initiated from the ColdFire core or the debug module. 4.5.2.3 Caching Modes For every memory reference generated by the processor or debug module, a set of effective attributes is determined based on the address and the ACRs. Caching modes determine how the cache handles an access. An access can be cacheable or cache-inhibited. For normal accesses, the ACRn[CM] bit corresponding to the address of the access specifies the caching mode. If an address does not match an ACR, the default caching mode is defined by CACR[DCM]. The specific algorithm is as follows: if (address == ACR0-address including mask) effective attributes = ACR0 attributes else if (address == ACR1-address including mask) effective attributes = ACR1 attributes else effective attributes = CACR default attributes Addresses matching an ACR can also be write protected using ACR[WP]. Reset disables the cache and clears all CACR bits. Reset does not automatically invalidate cache entries; they must be invalidated through software. The ACRs allow CACR defaults to be overridden. In addition, some instructions (for example, CPUSHL) and processor core operations perform accesses that have an implicit caching mode associated with them. The following sections discuss the different caching accesses and their associated cache modes. 4.5.2.3.1 Cacheable Accesses If ACRn[CM] or the default field of the CACR indicates the access is cacheable, a read access is read from the cache if matching data is found. Otherwise, the data is read from memory and the cache is updated. When a line is being read from memory, the longword in the line that contains the core-requested data is loaded first and the requested data is given immediately to the processor, without waiting for the three remaining longwords to reach the cache. 4.5.2.3.2 Cache-Inhibited Accesses Memory regions can be designated as cache-inhibited, which is useful for memory containing targets such as I/O devices and shared data structures in multiprocessing systems. Do not cache memory-mapped registers (for example, registers shown with an MBAR offset). If the corresponding ACRn[CM] or CACR[DCM] indicates cache-inhibited the access is cache-inhibited. The caching operation is identical for both cache-inhibited modes, which differ only regarding recovery from an external bus error. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 4-9

Local Memory In determining whether a memory location is cacheable or cache-inhibited, the CPU checks memory-control registers using the following priority: 1. RAMBAR 2. ROMBAR 3. ACR0 4. ACR1 5. If an access does not hit in RAMBAR, ROMBAR, or the ACRs, the default is provided for all accesses in CACR. Cache-inhibited write accesses bypass the cache and a corresponding external write is performed. Cache-inhibited reads bypass the cache and are performed on the external bus, except when all of the following conditions are true: • The cache-inhibited fill-buffer bit, CACR[CEIB], is set. • The access is an instruction read. • The access is normal (that is, TT = 0). In this case, a fetched line is stored in the fill buffer and remains valid there; the cache can service additional read accesses from this buffer until another fill occurs or a cache-invalidate-all operation occurs. If ACRn[CM] indicates cache-inhibited, the controller bypasses the cache and performs an external transfer. To ensure the consistency of cached data, execute a CPUSHL instruction or set CACR[CINVA] to invalidate the entire cache before switching cache modes. CPU space-register accesses, such as MOVEC, are treated as cache-inhibited. 4.5.2.4 Reset A hardware reset clears the CACR disabling the instruction cache. NOTE Tag array contents are not affected by reset. Accordingly, system startup code must explicitly invalidate the cache by setting CACR[CINVA] before the cache can be enabled. 4.5.2.5 Cache Miss Fetch Algorithm/Line Fills As discussed in Section4.5.1, “Instruction Cache Physical Organization,” the instruction cache hardware includes a 16-byte line-fill buffer for providing temporary storage for the last fetched instruction. With the cache enabled as defined by CACR[CENB], a cacheable instruction fetch that misses in both the tag memory and the line-fill buffer generates an external fetch. The size of the external fetch is determined by the value contained in CACR[CLNF] and the miss address. Table 4-8 shows the relationships between the CLNF bits, the miss address, and the size of the external fetch. Depending on the run-time characteristics of the application and the memory response speed, overall performance may be increased by programming CLNF to values {00, 01}. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 4-10 Freescale Semiconductor

Local Memory For all cases of a line-sized fetch, the critical longword defined by miss address bits 3–2 is accessed first followed by the remaining three longwords that are accessed by incrementing the longword address in 0-modulo-16 increments, as shown below: if miss address[3:2] = 00 fetch sequence = {0x0, 0x4, 0x8, 0xC} if miss address[3:2] = 01 fetch sequence = {0x4, 0x8, 0xC, 0x0} if miss address[3:2] = 10 fetch sequence = {0x8, 0xC, 0x0, 0x4} if miss address[3:2] = 11 fetch sequence = {0xC, 0x0, 0x4, 0x0x8} When an external fetch is initiated and data is loaded into the line-fill buffer, the instruction cache maintains a special most-recently-used indicator that tracks the contents of the fill buffer versus its corresponding cache location. At the time of the miss, the hardware indicator is set, marking the fill buffer as most recently used. If a subsequent access occurs to the cache location defined by bits 9–4 of the fill buffer address, the data in the cache memory array is now most-recently used, so the hardware indicator is cleared. In all cases, the indicator defines whether the contents of the line-fill buffer or the cache memory data array are most recently used. If the entire line is present at the time of the next cache miss, the line-fill buffer contents are written into the cache memory array and the fill buffer data is still most recently used compared to the cache memory array. The fill buffer can also be used as temporary storage for line-sized bursts of non-cacheable references under control of CACR[CEIB]. With this bit set, a noncacheable instruction fetch is processed as defined by Table 4-6. For this condition, the fill buffer is loaded and subsequent references can hit in the buffer, but the data is never loaded into the cache memory array. Table 4-6 shows the relationship between CENB, CEIB, and the type of instruction fetch. Table4-6. Instruction Cache Operation as Defined by CACR[CENB,CEIB] CACR[CENB,CEIB] Type of Fetch Description 00 N/A Instruction cache and line-fill buffer are disabled; fetches are word or longword in size. 01 N/A Instruction cache is disabled but because the line-fill buffer is enabled, CACR[CLNF] defines fetch size and instructions can be bursted into the line-fill buffer. 1X Cacheable Cache is enabled; CACR[CLNF] defines fetch size and line-fill buffer contents can be written into the cache memory array. 10 Noncacheable Cache is enabled but the linefill buffer is disabled; fetches are either word or longword and are not loaded into the line-fill buffer. 11 Noncacheable Cache and line buffer are enabled; CACR[CLNF] defines fetch size; fetches are loaded into the line-fill buffer but never into the cache memory array. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 4-11

Local Memory 4.5.3 Instruction Cache Programming Model Three supervisor registers define the operation of the instruction cache and local bus controller: the cache control register (CACR) and two access control registers (ACR0, ACR1). Table 4-7 shows the memory map of the CACR and ACRs. These registers have the following characteristics: • The CACR and ACRs can be accessed only in supervisor mode using the MOVEC instruction with an Rc value of 0x002 (CACR), 0x004 (ACR0), and 0x005 (ACR1). • Addresses not assigned to the registers and undefined register bits are reserved for future expansion. Write accesses to these reserved address spaces and reserved register bits have no effect; read accesses return zeros. • The reset value column indicates the initial value of the register at reset. Uninitialized fields may contain random values after reset. • The access column indicates whether the corresponding register can be read, written or both. Attempts to read a write-only register cause zeros to be returned. Attempts to write to a read-only register are ignored. Table4-7. Memory Map of Instruction Cache Registers Address (using MOVEC) Name Width Description Reset Value 0x002 CACR 32 Cache control register 0x0000 0x004 ACR0 32 Access control register 0 0x0000 0x005 ACR1 32 Access control register 1 0x0000 4.5.3.1 Cache Control Register (CACR) The CACR controls operation of the instruction cache. It provides a set of default memory access attributes for when a reference address does not map into spaces defined by the ACRs. The supervisor-level CACR is accessed in the CPU address space using the MOVEC instruction with an Rc encoding of 0x002. The CACR can be read or written when the processor is in background debug mode (BDM). 31 30 29 28 27 26 25 24 23 16 Field CENB — CDPI CFRZ — CINVA — Reset 0000_0000_0000_0000 R/W Write (R/W by debug module) 15 10 9 8 7 6 5 4 2 1 0 Field — CEIB DCM DBWE — DWP — CLNF Reset 0000_0000_0000_0000 R/W Write (R/W by debug module) Rc 0x002 Figure4-4. Cache Control Register (CACR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 4-12 Freescale Semiconductor

Local Memory Table 4-8 describes CACR fields. Table4-8. CACR Field Descriptions Bits Name Description 31 CENB Enable cache. 0 Cache disabled. The cache is not operational, but data and tags are preserved. 1 Cache enabled. 30–29 — Reserved, should be cleared. 28 CDPI Disable CPUSHL invalidation. 0 Cache disabled 1 Cache enabled 27 CFRZ Cache freeze. Allows the user to freeze the contents of the cache. When CFRZ is asserted line fetches can be initiated and loaded into the line-fill buffer, but a valid cache entry can not be overwritten. If a given cache location is invalid, the contents of the line-fill buffer can be written into the memory array while CFRZ is asserted. 0 Normal operation 1 Freeze valid cache lines 26–25 — Reserved, should be cleared. 24 CINVA Cache invalidate all. Writing a 1 to this bit initiates entire cache invalidation. Note the caches are not cleared on power-up or normal reset. 0 No invalidation is performed. 1 Initiate invalidation of the entire cache. The cache controller sequentially clears V in all sets. Subsequent accesses stall until invalidation finishes, at which point, CINVA is automatically cleared. This operation takes 64 clock cycles. 23–11 — Reserved, should be cleared. 10 CEIB Default noncacheable fill buffer. Determines if the fill buffer can store noncacheable accesses 0 Fill buffer not used to store noncacheable instruction accesses (16 or 32 bits). 1 Fill buffer used to store noncacheable accesses. The fill buffer is used only for normal (TT = 0) instruction reads of a noncacheable region. Instructions are loaded into the fill buffer by a burst access (same as a line fill). They stay in the buffer until they are displaced, so subsequent accesses may not appear on the external bus. Note that this feature can cause a coherency problem for self-modifying code. If CEIB = 1 and a cache-inhibited access uses the fill buffer, instructions remain valid in the fill buffer until a cache-invalidate-all instruction, another cache-inhibited burst, or a miss that initiates a fill. 9 DCM Default cache mode. See Section4.5.2.3, “Caching Modes.” 0 Default cacheable 1 Default noncacheable 8 DBWE Default buffered write enable. Defines the default value for enabling buffered writes. Generally, enabled buffered writes provide higher system performance but recovery from access errors can be more difficult. For the ColdFire CPU, reporting access errors on operand writes is always imprecise and enabling buffered writes simply further decouples the write instruction from the signaling of the fault 0 Termination of an operand write cycle on the processor's local bus is delayed until the external bus cycle completes. 1 A local bus write cycle is terminated immediately and the operation buffered in the bus controller. Operand write cycles are effectively decoupled between the processor's local bus and the external bus. 7–6 — Reserved, should be cleared. 5 DWP Default write protect. 0 Read and write accesses permitted 1 Write accesses not permitted 4–2 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 4-13

Local Memory Table4-8. CACR Field Descriptions (continued) Bits Name Description 1–0 CLNF Control longword fetch. Controls the size of the memory request the cache issues to the bus controller for different initial line access offsets. Longword Address Bits CLNF 00 01 10 11 00 Line Line Line Longword 01 Line Line Longword Longword 1x Line Line Line Line 4.5.3.2 Access Control Registers (ACR0 and ACR1) The ACRs define memory reference attributes for two memory regions (one per ACR). These attributes affect every memory reference using the ACRs or the set of default attributes contained in the CACR. ACRs are examined for each memory reference not mapped to the SRAM or ROM module. The supervisor-level ACRs are accessed in the CPU address space using the MOVEC instruction with an Rc encoding of 0x004 and 0x005. ACRs can be read and written in BDM mode. 31 24 23 16 15 14 13 12 7 6 5 4 3 2 1 0 Field BA BAM EN SM — CM BWE — WP — Reset 0000_0000_0000_0000 R/W Write (R/W by debug module) Rc ACR0: 0x004; ACR1: 0x005 Figure4-5. Access Control Register Format (ACRn) Table 4-9 describes ACRn fields. I Table4-9. ACRn Field Descriptions Bits Name Description 31–24 BA Base address. Compared with A[31:24]. Eligible addresses that match are assigned the access control attributes of this register. 23–16 BAM Base address mask. Setting a BAM bit masks the corresponding BA bit. Setting low-order BAM bits can define contiguous regions exceeding 16 Mbytes. BAM can define multiple noncontiguous regions. 15 EN Enable. Enables or disables the other ACRn bits. 0 Access control attributes disabled 1 Access control attributes enabled 14–13 SM Supervisor mode. Specifies whether only user or supervisor accesses are allowed in this address range or if the type of access is a don’t care. 00 Match addresses only in user mode 01 Match addresses only in supervisor mode 1x Execute cache matching on all accesses 12–7 — Reserved; should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 4-14 Freescale Semiconductor

Local Memory Table4-9. ACRn Field Descriptions (continued) Bits Name Description 6 CM Cache mode. Defines whether the memory access is cacheable or noncacheable. 0 Caching enabled 1 Caching disabled 5 BWE Buffered write enable. Generally, the enabling of buffered writes provides higher system performance but recovery from access errors may be more difficult. For the ColdFire CPU, reporting access errors on operand writes is always imprecise; enabling buffered writes further decouples the write instruction from the signaling of the fault. 0 Termination of an operand write cycle on the processor's local bus is delayed until the external bus cycle is completed. 1 A write cycle on the local bus is terminated immediately and the operation is then buffered in the bus controller. In this mode, operand write cycles are effectively decoupled between the processor's local bus and the external bus. 4–3 — Reserved, should be cleared. 2 WP Write protect. Selects the write privilege of the memory region. 0 Read and write accesses permitted 1 Write accesses not permitted 1–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 4-15

Local Memory MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 4-16 Freescale Semiconductor

Chapter 5 Debug Support This chapter describes the Revision A enhanced hardware debug support in the MCF5272. 5.1 Overview The debug module is shown in Figure5-1. High-speed ColdFire CPU Core local bus Debug Module Control Trace Port Communication Port BKPT DSCLK, DSI, DSO Figure5-1. Processor/Debug Module Interface Debug support is divided into three areas: • Real-time trace support—The ability to determine the dynamic execution path through an application is fundamental for debugging. The ColdFire solution implements an 8-bit parallel output bus that reports processor execution status and data to an external emulator system. See Section5.3, “Real-Time Trace Support.” • Background debug mode (BDM)—Provides low-level debugging in the ColdFire processor complex. In BDM, the processor complex is halted and a variety of commands can be sent to the processor to access memory and registers. The external emulator uses a three-pin, serial, full-duplex channel. See Section5.5, “Background Debug Mode (BDM),” and Section5.4, “Programming Model.” • Real-time debug support—BDM requires the processor to be halted, which many real-time embedded applications cannot do. Debug interrupts let real-time systems execute a unique service routine that can quickly save the contents of key registers and variables and return the system to normal operation. External development systems can access saved data because the hardware supports concurrent operation of the processor and BDM-initiated commands. See Section5.6, “Real-Time Debug Support.” MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-1

Debug Support 5.2 Signal Description Table 5-1 describes debug module signals. All ColdFire debug signals are unidirectional and related to a rising edge of the processor core’s clock signal. The standard 26-pin debug connector is shown in Section5.8, “Freescale-Recommended BDM Pinout.” Table5-1. Debug Module Signals Signal Description Development Serial Internally synchronized input. (The logic level on DSCLK is validated if it has the same value on two Clock (DSCLK) consecutive rising CLKIN edges.) Clocks the serial communication port to the debug module during packet transfers. Maximum frequency is 1/5 the processor status clock (PSTCLK) speed. At the synchronized rising edge of DSCLK, the data input on DSI is sampled and DSO changes state. Development Serial Internally synchronized input that provides data input for the serial communication port to the debug Input (DSI) module. Development Serial Provides serial output communication for debug module responses. DSO is registered internally. Output (DSO) Breakpoint (BKPT) Input used to request a manual breakpoint. Assertion of BKPT puts the processor into a halted state after the current instruction completes. Halt status is reflected on processor status signals (PST[3:0]) as the value 0xF. Processor Status Delayed version of the processor clock. Its rising edge appears in the center of valid PST and DDATA Clock (PSTCLK) output. See Figure5-2. PSTCLK indicates when the development system should sample PST and DDATA values. Debug Data These output signals display the register breakpoint status as a default, or optionally, captured address (DDATA[3:0]) and operand values. The capturing of data values is controlled by the setting of the CSR. Additionally, execution of the WDDATA instruction by the processor captures operands which are displayed on DDATA. These signals are updated each processor cycle. Processor Status These output signals report the processor status. Table5-2 shows the encoding of these signals. These (PST[3:0]) outputs indicate the current status of the processor pipeline and, as a result, are not related to the current bus transfer. The PST value is updated each processor cycle. Figure 5-2 shows PSTCLK timing with respect to PST and DDATA. PSTCLK PST or DDATA Figure5-2. PSTCLK Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-2 Freescale Semiconductor

Debug Support 5.3 Real-Time Trace Support Real-time trace, which defines the dynamic execution path, is a fundamental debug function. The ColdFire solution is to include a parallel output port providing encoded processor status and data to an external development system. This port is partitioned into two 4-bit nibbles: one nibble allows the processor to transmit processor status, (PST), and the other allows operand data to be displayed (debug data, DDATA). The processor status may not be related to the current bus transfer. External development systems can use PST outputs with an external image of the program to completely track the dynamic execution path. This tracking is complicated by any change in flow, especially when branch target address calculation is based on the contents of a program-visible register (variant addressing). DDATA outputs can be configured to display the target address of such instructions in sequential nibble increments across multiple processor clock cycles, as described in Section5.3.1, “Begin Execution of Taken Branch (PST= 0x5).” Two 32-bit storage elements form a FIFO buffer connecting the processor’s high-speed local bus to the external development system through PST[3:0] and DDATA[3:0]. The buffer captures branch target addresses and certain data values for eventual display on the DDATA port, one nibble at a time starting with the least significant bit (lsb). Execution speed is affected only when both storage elements contain valid data to be dumped to the DDATA port. The core stalls until one FIFO entry is available. Table 5-2 shows the encoding of these signals. Table5-2. Processor Status Encoding PST[3:0] Definition Hex Binary 0x0 0000 Continue execution. Many instructions execute in one processor cycle. If an instruction requires more clock cycles, subsequent clock cycles are indicated by driving PST outputs with this encoding. 0x1 0001 Begin execution of one instruction. For most instructions, this encoding signals the first clock cycle of an instruction’s execution. Certain change-of-flow opcodes, plus the PULSE and WDDATA instructions, generate different encodings. 0x2 0010 Reserved 0x3 0011 Entry into user-mode. Signaled after execution of the instruction that caused the ColdFire processor to enter user mode. 0x4 0100 Begin execution of PULSE and WDDATA instructions. PULSE defines logic analyzer triggers for debug and/or performance analysis. WDDATA lets the core write any operand (byte, word, or longword) directly to the DDATA port, independent of debug module configuration. When WDDATA is executed, a value of 0x4 is signaled on the PST port, followed by the appropriate marker, and then the data transfer on the DDATA port. Transfer length depends on the WDDATA operand size. 0x5 0101 Begin execution of taken branch. For some opcodes, a branch target address may be displayed on DDATA depending on the CSR settings. CSR also controls the number of address bytes displayed, indicated by the PST marker value preceding the DDATA nibble that begins the data output. See Section5.3.1, “Begin Execution of Taken Branch (PST=0x5).” 0x6 0110 Reserved 0x7 0111 Begin execution of return from exception (RTE) instruction. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-3

Debug Support Table5-2. Processor Status Encoding (continued) PST[3:0] Definition Hex Binary 0x8– 1000– Indicates the number of bytes to be displayed on the DDATA port on subsequent clock cycles. The value is 0xB 1011 driven onto the PST port one PSTCLK cycle before the data is displayed on DDATA. 0x8 Begin 1-byte transfer on DDATA. 0x9 Begin 2-byte transfer on DDATA. 0xA Begin 3-byte transfer on DDATA. 0xB Begin 4-byte transfer on DDATA. 0xC 1100 Exception processing. Exceptions that enter emulation mode (debug interrupt or optionally trace) generate a different encoding, as described below. Because the 0xC encoding defines a multiple-cycle mode, PST outputs are driven with 0xC until exception processing completes. 0xD 1101 Entry into emulator mode. Displayed during emulation mode (debug interrupt or optionally trace). Because this encoding defines a multiple-cycle mode, PST outputs are driven with 0xD until exception processing completes. 0xE 1110 Processor is stopped. Appears in multiple-cycle format when the MCF5272 executes a STOP instruction. The ColdFire processor remains stopped until an interrupt occurs, thus PST outputs display 0xE until the stopped . mode is exited 0xF 1111 Processor is halted. Because this encoding defines a multiple-cycle mode, the PST outputs display 0xF until the processor is restarted or reset. (see Section5.5.1, “CPU Halt”) 5.3.1 Begin Execution of Taken Branch (PST = 0x5) PST is 0x5 when a taken branch is executed. For some opcodes, a branch target address may be displayed on DDATA depending on the CSR settings. CSR also controls the number of address bytes displayed, which is indicated by the PST marker value immediately preceding the DDATA nibble that begins the data output. Bytes are displayed in least-to-most-significant order. The processor captures only those target addresses associated with taken branches which use a variant addressing mode, that is, RTE and RTS instructions, JMP and JSR instructions using address register indirect or indexed addressing modes, and all exception vectors. The simplest example of a branch instruction using a variant address is the compiled code for a C language case statement. Typically, the evaluation of this statement uses the variable of an expression as an index into a table of offsets, where each offset points to a unique case within the structure. For such change-of-flow operations, the MCF5272 uses the debug pins to output the following sequence of information on successive processor clock cycles: 1. Use PST (0x5) to identify that a taken branch was executed. 2. Using the PST pins, optionally signal the target address to be displayed sequentially on the DDATA pins. Encodings 0x9–0xB identify the number of bytes displayed. 3. The new target address is optionally available on subsequent cycles using the DDATA port. The number of bytes of the target address displayed on this port is configurable (2, 3, or 4 bytes). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-4 Freescale Semiconductor

Debug Support Another example of a variant branch instruction would be a JMP (A0) instruction. Figure 5-3 shows when the PST and DDATA outputs that indicate when a JMP (A0) executed, assuming the CSR was programmed to display the lower 2 bytes of an address. PSTCLK PST 0x5 0x9 default default default default DDATA 0x0 0x0 A[3:0] A[7:4] A[11:8] A[15:12] Figure5-3. Example JMP Instruction Output on PST/DDATA PST of 0x5 indicates a taken branch and the marker value 0x9 indicates a 2-byte address. Thus, the subsequent 4 nibbles of DDATA display the lower 2 bytes of address register A0 in least-to-most-significant nibble order. The PST output after the JMP instruction completes depends on the target instruction. The PST can continue with the next instruction before the address has completely displayed on DDATA because of the DDATA FIFO. If the FIFO is full and the next instruction has captured values to display on DDATA, the pipeline stalls (PST= 0x0) until space is available in the FIFO. 5.4 Programming Model In addition to the existing BDM commands that provide access to the processor’s registers and the memory subsystem, the debug module contains nine registers to support the required functionality. These registers are also accessible from the processor’s supervisor programming model by executing the WDEBUG instruction (write only). Thus, the breakpoint hardware in the debug module can be read or written by the external development system using the debug serial interface or by the operating system running on the processor core. Software is responsible for guaranteeing that accesses to these resources are serialized and logically consistent. Hardware provides a locking mechanism in the CSR to allow the external development system to disable any attempted writes by the processor to the breakpoint registers (setting CSR[IPW]). BDM commands must not be issued if the MCF5272 is using the WDEBUG instruction to access debug module registers or the resulting behavior is undefined. These registers, shown in Figure 5-4, are treated as 32-bit quantities, regardless of the number of implemented bits. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-5

Debug Support 31 15 7 0 AATR Address attribute trigger register 31 15 0 ABLR Address low breakpoint register ABHR Address high breakpoint register 31 15 0 CSR Configuration/status register 31 15 0 DBR Data breakpoint register DBMR Data breakpoint mask register 31 15 0 PBR PC breakpoint register PBMR PC breakpoint mask register 31 15 0 TDR Trigger definition register Note: Each debug register is accessed as a 32-bit register; shaded fields above are not used (don’t care). All debug control registers are writable from the external development system or the CPU via the WDEBUG instruction. CSR is write-only from the programming model. It can be read or written through the BDM port using the . RDMREG and WDMREG commands Figure5-4. Debug Programming Model These registers are accessed through the BDM port by new BDM commands, WDMREG and RDMREG, described in Section5.5.3.3, “Command Set Descriptions.” These commands contain a 5-bit field, DRc, that specifies the register, as shown in Table 5-3. Table5-3. BDM/Breakpoint Registers DRc[4–0] Register Name Abbreviation Initial State Page 0x00 Configuration/status register CSR 0x0000_0000 p. 5-10 0x01–0x05 Reserved — — — 0x06 Address attribute trigger register AATR 0x0000_0005 p. 5-7 0x07 Trigger definition register TDR 0x0000_0000 p. 5-14 0x08 Program counter breakpoint register PBR — p. 5-13 0x09 Program counter breakpoint mask register PBMR — p. 5-13 0x0A–0x0B Reserved — — — 0x0C Address breakpoint high register ABHR — p. 5-9 0x0D Address breakpoint low register ABLR — p. 5-9 0x0E Data breakpoint register DBR — p. 5-12 0x0F Data breakpoint mask register DBMR — p. 5-12 NOTE Debug control registers can be written by the external development system or the CPU through the WDEBUG instruction. CSR is write-only from the programming model. It can be read or written through the BDM port using the RDMREG and WDMREG commands. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-6 Freescale Semiconductor

Debug Support 5.4.1 Revision A Shared Debug Resources In the Revision A implementation of the debug module, certain hardware structures are shared between BDM and breakpoint functionality as shown in Table5-4. Table5-4. Rev. A Shared BDM/Breakpoint Hardware Register BDM Function Breakpoint Function AATR Bus attributes for all memory commands Attributes for address breakpoint ABHR Address for all memory commands Address for address breakpoint DBR Data for all BDM write commands Data for data breakpoint Thus, loading a register to perform a specific function that shares hardware resources is destructive to the shared function. For example, a BDM command to access memory overwrites an address breakpoint in ABHR. A BDM write command overwrites the data breakpoint in DBR. 5.4.2 Address Attribute Trigger Register (AATR) The address attribute trigger register (AATR), Figure 5-5, defines address attributes and a mask to be matched in the trigger. The register value is compared with address attribute signals from the processor’s local high-speed bus, as defined by the setting of the trigger definition register (TDR). 15 14 13 12 11 10 8 7 6 5 4 3 2 0 Field RM SZM TTM TMM R SZ TT TM Reset 0000_0000_0000_0101 R/W Write only. AATR is accessible in supervisor mode as debug control register 0x06 using the WDEBUG instruction and through the BDM port using the WDMREG command. DRc[4–0] 0x06 Figure5-5. Address Attribute Trigger Register (AATR) Table 5-5 describes AATR fields. Table5-5. AATR Field Descriptions Bits Name Description 15 RM Read/write mask. Setting RM masks R in address comparisons. 14–13 SZM Size mask. Setting an SZM bit masks the corresponding SZ bit in address comparisons. 12–11 TTM Transfer type mask. Setting a TTM bit masks the corresponding TT bit in address comparisons. 10–8 TMM Transfer modifier mask. Setting a TMM bit masks the corresponding TM bit in address comparisons. 7 R Read/write. R is compared with the R/W signal of the processor’s local bus. 6–5 SZ Size. Compared to the processor’s local bus size signals. 00 Longword 01 Byte 10 Word 11 Reserved MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-7

Debug Support Table5-5. AATR Field Descriptions (continued) Bits Name Description 4–3 TT Transfer type. Compared with the local bus transfer type signals. 00 Normal processor access 01 Reserved 10 Emulator mode access 11 Acknowledge/CPU space access These bits also define the TT encoding for BDM memory commands. In this case, the 01 encoding indicates an external or DMA access (for backward compatibility). These bits affect the TM bits. 2–0 TM Transfer modifier. Compared with the local bus transfer modifier signals, which give supplemental information for each transfer type. TT=00 (normal mode): 000 Explicit cache line push 001 User data access 010 User code access 011 Reserved 100 Reserved 101 Supervisor data access 110 Supervisor code access 111 Reserved TT=10 (emulator mode): 0xx–100Reserved 101 Emulator mode data access 110 Emulator mode code access 111 Reserved TT=11 (acknowledge/CPU space transfers): 000 CPU space access 001–111 Interrupt acknowledge levels 1–7 These bits also define the TM encoding for BDM memory commands (for backward compatibility). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-8 Freescale Semiconductor

Debug Support 5.4.3 Address Breakpoint Registers (ABLR, ABHR) The address breakpoint low and high registers (ABLR, ABHR), Figure5-6, define regions in the processor’s data address space that can be used as part of the trigger. These register values are compared with the address for each transfer on the processor’s high-speed local bus. The trigger definition register (TDR) identifies the trigger as one of three cases: 1. identically the value in ABLR 2. inside the range bound by ABLR and ABHR inclusive 3. outside that same range 31 0 Field Address Reset — R/W Write only. ABHR is accessible in supervisor mode as debug control register 0x0C using the WDEBUG instruction and via the BDM port using the RDMREG and WDMREG commands. ABLR is accessible in supervisor mode as debug control register 0x0D using the WDEBUG instruction and via the BDM port using the WDMREG command. DRc[4–0] 0x0D (ABLR); 0x0C (ABHR) Figure5-6. Address Breakpoint Registers (ABLR, ABHR) Table 5-6 describes ABLR fields. Table5-6. ABLR Field Description Bits Name Description 31–0 Address Low address. Holds the 32-bit address marking the lower bound of the address breakpoint range. Breakpoints for specific addresses are programmed into ABLR. Table 5-7 describes ABHR fields. Table5-7. ABHR Field Description Bits Name Description 31–0 Address High address. Holds the 32-bit address marking the upper bound of the address breakpoint range. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-9

Debug Support 5.4.4 Configuration/Status Register (CSR) The configuration/status register (CSR) defines the debug configuration for the processor and memory subsystem and contains status information from the breakpoint logic. CSR is write-only from the programming model. It can be read from and written to through the BDM port. CSR is accessible in supervisor mode as debug control register 0x00 using the WDEBUG instruction and through the BDM port using the RDMREG and WDMREG commands. 31 28 27 26 25 24 23 20 19 17 16 Field BSTAT FOF TRG HALT BKPT HRL — IPW Reset 0000 0 0 0 0 0000 0 0 0 0 R/W1 R R R R R R — R/W 15 14 13 12 11 10 9 8 7 6 5 4 3 0 Field MAP TRC EMU DDC UHE BTB —1 NPL IPI SSM — Reset 0 0 0 00 0 00 0 0 0 0 0000 R/W R/W R/W R/W R/W R/W R/W R R/W R/W R/W — DRc[4–0] 0x00 1 Bit 7 is reserved for Freescale use and must be written as a zero. Figure5-7. Configuration/Status Register (CSR) Table 5-8 describes CSR fields. Table5-8. CSR Field Descriptions Bit Name Description 31–28 BSTAT Breakpoint status. Provides read-only status information concerning hardware breakpoints. BSTAT is cleared by a TDR write or by a CSR read when either a level-2 breakpoint is triggered or a level-1 breakpoint is triggered and the level-2 breakpoint is disabled. 0000 No breakpoints enabled 0001 Waiting for level-1 breakpoint 0010 Level-1 breakpoint triggered 0101 Waiting for level-2 breakpoint 0110 Level-2 breakpoint triggered 27 FOF Fault-on-fault. If FOF is set, a catastrophic halt occurred and forced entry into BDM. FOF is cleared whenever CSR is read. 26 TRG Hardware breakpoint trigger. If TRG is set, a hardware breakpoint halted the processor core and forced entry into BDM. Reset, the debug GO command, or reading CSR clear TRG. 25 HALT Processor halt. If HALT is set, the processor executed a HALT and forced entry into BDM. Reset, the debug GO command, or reading CSR clear HALT. 24 BKPT Breakpoint assert. If BKPT is set, BKPT was asserted, forcing the processor into BDM. Reset, the debug GO command, or reading CSR clear BKPT. 23–20 HRL Hardware revision level. Indicates the level of debug module functionality. An emulator could use this information to identify the level of functionality supported. 0000 Initial debug functionality (Revision A) (this is the only valid value for the MCF5272) 19–17 — Reserved, should be cleared. 16 IPW Inhibit processor writes. Setting IPW inhibits processor-initiated writes to the debug module’s programming model registers. IPW can be modified only by commands from the external development system. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-10 Freescale Semiconductor

Debug Support Table5-8. CSR Field Descriptions (continued) Bit Name Description 15 MAP Force processor references in emulator mode. 0 All emulator-mode references are mapped into supervisor code and data spaces. 1 The processor maps all references while in emulator mode to a special address space, TT=10, TM=101 or 110. 14 TRC Force emulation mode on trace exception. If TRC=1, the processor enters emulator mode when a trace exception occurs. If TRC=0, the processor enters supervisor mode. 13 EMU Force emulation mode. If EMU=1, the processor begins executing in emulator mode. See Section5.6.1.1, “Emulator Mode.” 12–11 DDC Debug data control. Controls operand data capture for DDATA, which displays the number of bytes defined by the operand reference size before the actual data; byte displays 8 bits, word displays 16 bits, and long displays 32 bits (one nibble at a time across multiple clock cycles). See Table5-2. 00 No operand data is displayed. 01 Capture all write data. 10 Capture all read data. 11 Capture all read and write data. 10 UHE User halt enable. Selects the CPU privilege level required to execute the HALT instruction. 0 HALT is a supervisor-only instruction. 1 HALT is a supervisor/user instruction. 9–8 BTB Branch target bytes. Defines the number of bytes of branch target address DDATA displays. 00 0 bytes 01 Lower 2 bytes of the target address 10 Lower 3 bytes of the target address 11 Entire 4-byte target address See Section5.3.1, “Begin Execution of Taken Branch (PST=0x5).” 7 — Reserved, should be cleared. 6 NPL Non- mode. Determines whether the core operates in pipelined or mode or not. 0 Pipelined mode 1 Nonpipelined mode. The processor effectively executes one instruction at a time with no overlap. This adds at least 5 cycles to the execution time of each instruction. Given an average execution latency of 1.6, throughput in non-pipeline mode would be 6.6, approximately 25% or less of pipelined performance. Regardless of the NPL state, a triggered PC breakpoint is always reported before the triggering instruction executes. In normal pipeline operation, the occurrence of an address and/or data breakpoint trigger is imprecise. In non-pipeline mode, triggers are always reported before the next instruction begins execution and trigger reporting can be considered precise. An address or data breakpoint should always occur before the next instruction begins execution. Therefore the occurrence of the address/data breakpoints should be guaranteed. 5 IPI Ignore pending interrupts. 1 Core ignores any pending interrupt requests signalled while in single-instruction-step mode. 0 Core services any pending interrupt requests that were signalled while in single-step mode. 4 SSM Single-step mode. Setting SSM puts the processor in single-step mode. 0 Normal mode. 1 Single-step mode. The processor halts after execution of each instruction. While halted, any BDM command can be executed. On receipt of the GO command, the processor executes the next instruction and halts again. This process continues until SSM is cleared. 3–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-11

Debug Support 5.4.5 Data Breakpoint/Mask Registers (DBR, DBMR) The data breakpoint register (DBR), Figure 5-8, specify data patterns used as part of the trigger into debug mode. DBR bits are masked by setting corresponding DBMR bits, as defined in TDR. 31 0 Field Data (DBR); Mask (DBMR) Reset Uninitialized R/W DBR is accessible in supervisor mode as debug control register 0x0E, using the WDEBUG instruction and through the BDM port using the RDMREG and WDMREG commands. DBMR is accessible in supervisor mode as debug control register 0x0F,using the WDEBUG instruction and via the BDM port using the WDMREG command. DRc[4–0] 0x0E (DBR), 0x0F (DBMR) Figure5-8. Data Breakpoint/Mask Registers (DBR and DBMR) Table 5-9 describes DBR fields. Table5-9. DBR Field Descriptions Bits Name Description 31–0 Data Data breakpoint value. Contains the value to be compared with the data value from the processor’s local bus as a breakpoint trigger. Table 5-10 describes DBMR fields. Table5-10. DBMR Field Descriptions Bits Name Description 31–0 Mask Data breakpoint mask. The 32-bit mask for the data breakpoint trigger. Clearing a DBR bit allows the corresponding DBR bit to be compared to the appropriate bit of the processor’s local data bus. Setting a DBMR bit causes that bit to be ignored. The DBR supports both aligned and misaligned references. Table 5-11 shows relationships between processor address, access size, and location within the 32-bit data bus. Table5-11. Access Size and Operand Data Location A[1:0] Access Size Operand Location 00 Byte D[31:24] 01 Byte D[23:16] 10 Byte D[15:8] 11 Byte D[7:0] 0x Word D[31:16] 1x Word D[15:0] xx Longword D[31:0] MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-12 Freescale Semiconductor

Debug Support 5.4.6 Program Counter Breakpoint/Mask Registers (PBR, PBMR) The PC breakpoint register (PBR) defines an instruction address for use as part of the trigger. This register’s contents are compared with the processor’s program counter register when TDR is configured appropriately. PBR bits are masked by setting corresponding PBMR bits. Results are compared with the processor’s program counter register, as defined in TDR. Figure 5-9 shows the PC breakpoint register. 31 0 Field Program Counter Reset — R/W Write. PC breakpoint register is accessible in supervisor mode using the WDEBUG instruction and through the BDM port using the RDMREG and WDMREG commands using values shown in Section5.5.3.3, “Command Set Descriptions.” DRc[4–0] 0x08 Figure5-9. Program Counter Breakpoint Register (PBR) Table 5-12 describes PBR fields. Table5-12. PBR Field Descriptions Bits Name Description 31–0 Address PC breakpoint address. The 32-bit address to be compared with the PC as a breakpoint trigger. Figure 5-9 shows PBMR. 31 0 Field Mask Reset — R/W Write. PBMR is accessible in supervisor mode as debug control register 0x09 using the WDEBUG instruction and via the BDM port using the wdmreg command. DRc[4–0] 0x09 Figure5-10. Program Counter Breakpoint Mask Register (PBMR) Table 5-13 describes PBMR fields. Table5-13. PBMR Field Descriptions Bits Name Description 31–0 Mask PC breakpoint mask. A zero in a bit position causes the corresponding PBR bit to be compared to the appropriate PC bit. Set PBMR bits cause PBR bits to be ignored. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-13

Debug Support 5.4.7 Trigger Definition Register (TDR) The TDR, shown in Table 5-11, configures the operation of the hardware breakpoint logic that corresponds with the ABHR/ABLR/AATR, PBR/PBMR, and DBR/DBMR registers within the debug module. The TDR controls the actions taken under the defined conditions. Breakpoint logic may be configured as a one- or two-level trigger. TDR[31–16] define the second-level trigger and bits 15–0 define the first-level trigger. NOTE The debug module has no hardware interlocks, so to prevent spurious breakpoint triggers while the breakpoint registers are being loaded, disable TDR (by clearing TDR[29,13])before defining triggers. A write to TDR clears the CSR trigger status bits, CSR[BSTAT]. Second-Level Trigger 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Field TRC EBL EDLW EDWL EDWU EDLL EDLM EDUM EDUU DI EAI EAR EAL EPC PCI Reset 0000_0000_0000_0000 First-Level Trigger 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Field — EBL EDLW EDWL EDWU EDLL EDLM EDUM EDUU DI EAI EAR EAL EPC PCI Reset 0000_0000_0000_0000 R/W Write only. Accessible in supervisor mode as debug control register 0x07 using the WDEBUG instruction and through the BDM port using the WDMREG command. DRc[4–0] 0x07 Figure5-11. Trigger Definition Register (TDR) Table 5-14 describes TDR fields. Table5-14. TDR Field Descriptions Bits Name Description 31–30 TRC Trigger response control. Determines how the processor responds to a completed trigger condition. The trigger response is always displayed on DDATA. 00 Display on DDATA only 01 Processor halt 10 Debug interrupt 11 Reserved 15–14 — Reserved, should be cleared. 29/13 EBL Enable breakpoint. Global enable for the breakpoint trigger. Setting TDR[EBL] enables a breakpoint trigger. Clearing it disables all breakpoints at that level. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-14 Freescale Semiconductor

Debug Support Table5-14. TDR Field Descriptions (continued) Bits Name Description 28–22 EDx Setting an EDx bit enables the corresponding data breakpoint condition based on the size and placement 12–6 on the processor’s local data bus. Clearing all EDx bits disables data breakpoints. 28/12 EDLW Data longword. Entire processor’s local data bus. 27/11 EDWL Lower data word. 26/10 EDWU Upper data word. 25/9 EDLL Lower lower data byte. Low-order byte of the low-order word. 24/8 EDLM Lower middle data byte. High-order byte of the low-order word. 23/7 EDUM Upper middle data byte. Low-order byte of the high-order word. 22/6 EDUU Upper upper data byte. High-order byte of the high-order word. 21/5 DI Data breakpoint invert. Provides a way to invert the logical sense of all the data breakpoint comparators. This can develop a trigger based on the occurrence of a data value other than the DBR contents. 20–18/4 EAx Enable address bits. Setting an EA bit enables the corresponding address breakpoint. Clearing all three bits –2 disables the breakpoint. 20/4 EAI Enable address breakpoint inverted. Breakpoint is based outside the range between ABLR and ABHR. 19/3 EAR Enable address breakpoint range. The breakpoint is based on the inclusive range defined by ABLR and ABHR. 18/2 EAL Enable address breakpoint low. The breakpoint is based on the address in the ABLR. 17/1 EPC Enable PC breakpoint. If set, this bit enables the PC breakpoint. 16/0 PCI Breakpoint invert. If set, this bit allows execution outside a given region as defined by PBR and PBMR to enable a trigger. If cleared, the PC breakpoint is defined within the region defined by PBR and PBMR. 5.5 Background Debug Mode (BDM) The ColdFire Family implements a low-level system debugger in the microprocessor hardware. Communication with the development system is handled through a dedicated, high-speed serial command interface. The ColdFire architecture implements the BDM controller in a dedicated hardware module. Although some BDM operations, such as CPU register accesses, require the CPU to be halted, other BDM commands, such as memory accesses, can be executed while the processor is running. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-15

Debug Support 5.5.1 CPU Halt Although most BDM operations can occur in parallel with CPU operations, unrestricted BDM operation requires the CPU to be halted. The sources that can cause the CPU to halt are listed below in order of priority: 1. A catastrophic fault-on-fault condition automatically halts the processor. 2. A hardware breakpoint can be configured to generate a pending halt condition similar to the assertion of BKPT. This type of halt is always first made pending in the processor. Next, the processor samples for pending halt and interrupt conditions once per instruction. When a pending condition is asserted, the processor halts execution at the next sample point. See Section5.6.1, “Theory of Operation.” 3. The execution of a HALT instruction immediately suspends execution. Attempting to execute HALT in user mode while CSR[UHE] = 0 generates a privilege violation exception. If CSR[UHE] =1, HALT can be executed in user mode. After HALT executes, the processor can be restarted by serial shifting a GO command into the debug module. Execution continues at the instruction after HALT. 4. The assertion of the BKPT input is treated as a pseudo-interrupt; that is, the halt condition is postponed until the processor core samples for halts/interrupts. The processor samples for these conditions once during the execution of each instruction. If there is a pending halt condition at the sample time, the processor suspends execution and enters the halted state. The assertion of BKPT should be considered in the following two special cases: • After the system reset signal is negated, the processor waits for 16 processor clock cycles before beginning reset exception processing. If the BKPT input is asserted within eight cycles after RSTI is negated, the processor enters the halt state, signaling halt status (0xF) on the PST outputs. While the processor is in this state, all resources accessible through the debug module can be referenced. This is the only chance to force the processor into emulation mode through CSR[EMU]. After system initialization, the processor’s response to the GO command depends on the set of BDM commands performed while it is halted for a breakpoint. Specifically, if the PC register was loaded, the GO command causes the processor to exit halted state and pass control to the instruction address in the PC, bypassing normal reset exception processing. If the PC was not loaded, the GO command causes the processor to exit halted state and continue reset exception processing. • The ColdFire architecture also handles a special case of BKPT being asserted while the processor is stopped by execution of the STOP instruction. For this case, the processor exits the stopped mode and enters the halted state, at which point, all BDM commands may be exercised. When restarted, the processor continues by executing the next sequential instruction, that is, the instruction following the STOP opcode. CSR[27–24] indicates the halt source, showing the highest priority source for multiple halt conditions. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-16 Freescale Semiconductor

Debug Support 5.5.2 BDM Serial Interface When the CPU is halted and PST reflects the halt status, the development system can send unrestricted commands to the debug module. The debug module implements a synchronous protocol using two inputs (DSCLK and DSI) and one output (DSO), where DSO is specified as a delay relative to the rising edge of the processor clock. See Table 5-1. The development system serves as the serial communication channel master and must generate DSCLK. The serial channel operates at a frequency from DC to 1/5 of the PSTCLK frequency. The channel uses full-duplex mode, where data is sent and received simultaneously by both master and slave devices. The transmission consists of 17-bit packets composed of a status/control bit and a 16-bit data word. As shown in Figure 5-12, all state transitions are enabled on a rising edge of the PSTCLK clock when DSCLK is high; that is, DSI is sampled and DSO is driven. C1 C2 C3 C4 PSTCLK DSCLK DSI Current Next BDM State Current State Next State Machine DSO Past Current Figure5-12. BDM Serial Interface Timing DSCLK and DSI are synchronized inputs. DSCLK acts as a pseudo clock enable and is sampled on the rising edge of the processor CLK as well as the DSI. DSO is delayed from the DSCLK-enabled CLK rising edge (registered after a BDM state machine state change). All events in the debug module’s serial state machine are based on the processor clock rising edge. DSCLK must also be sampled low (on a positive edge of CLK) between each bit exchange. The MSB is transferred first. Because DSO changes state based on an internally-recognized rising edge of DSCLK, DSDO cannot be used to indicate the start of a serial transfer. The development system must count clock cycles in a given transfer. C1–C4 are described as follows: • C1—First synchronization cycle for DSI (DSCLK is high). • C2—Second synchronization cycle for DSI (DSCLK is high). • C3—BDM state machine changes state depending upon DSI and whether the entire input data transfer has been transmitted. • C4—DSO changes to next value. NOTE A not-ready response can be ignored except during a memory-referencing cycle. Otherwise, the debug module can accept a new serial transfer after 32 processor clock periods. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-17

Debug Support 5.5.2.1 Receive Packet Format The basic receive packet, Figure 5-13, consists of 16 data bits and 1 status bit. 16 15 0 S Data Field [15:0] Figure5-13. Receive BDM Packet Table 5-15 describes receive BDM packet fields. Table5-15. Receive BDM Packet Field Description Bits Name Description 16 S Status. Indicates the status of CPU-generated messages listed below. The not-ready response can be ignored unless a memory-referencing cycle is in progress. Otherwise, the debug module can accept a new serial transfer after 32 processor clock periods. S DataMessage 0 xxxxValid data transfer 0 0xFFFFStatus OK 1 0x0000Not ready with response; come again 1 0x0001Error—Terminated bus cycle; data invalid 1 0xFFFFIllegal command 15–0 Data Data. Contains the message to be sent from the debug module to the development system. The response message is always a single word, with the data field encoded as shown above. 5.5.2.2 Transmit Packet Format The basic transmit packet, Figure 5-14, consists of 16 data bits and 1 control bit. 16 15 0 C D[15:0] Figure5-14. Transmit BDM Packet Table 5-16 describes transmit BDM packet fields. Table5-16. Transmit BDM Packet Field Description Bits Name Description 16 C Control. This bit is reserved. Command and data transfers initiated by the development system should clear C. 15–0 Data Contains the data to be sent from the development system to the debug module. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-18 Freescale Semiconductor

Debug Support 5.5.3 BDM Command Set Table 5-17 summarizes the BDM command set. Subsequent paragraphs contain detailed descriptions of each command. Issuing a BDM command when the processor is accessing debug module registers using the WDEBUG instruction causes undefined behavior. Table5-17. BDM Command Summary CPU Command Command Mnemonic Description Section State1 (Hex) Read A/D rareg/ Read the selected address or data register and return Halted 5.5.3.3.1 0x218 {A/D, register rdreg the results through the serial interface. Reg[2:0]} Write A/D wareg/ Write the data operand to the specified address or data Halted 5.5.3.3.2 0x208 {A/D, register wdreg register. Reg[2:0]} Read memory read Read the data at the memory location specified by the Steal 5.5.3.3.3 0x1900—byte location longword address. 0x1940—word 0x1980—lword Write memory write Write the operand data to the memory location Steal 5.5.3.3.4 0x1800—byte location specified by the longword address. 0x1840—word 0x1880—lword Dump dump Used with READ to dump large blocks of memory. An Steal 5.5.3.3.5 0x1D00—byte memory block initial READ is executed to set up the starting address of 0x1D40—word the block and to retrieve the first result. A DUMP 0x1D80—lword command retrieves subsequent operands. Fill memory fill Used with WRITE to fill large blocks of memory. An initial Steal 5.5.3.3.6 0x1C00—byte block WRITE is executed to set up the starting address of the 0x1C40—word block and to supply the first operand. A FILL command 0x1C80—lword writes subsequent operands. Resume go The pipeline is flushed and refilled before resuming Halted 5.5.3.3.7 0x0C00 execution instruction execution at the current PC. No operation nop Perform no operation; may be used as a null command. Parallel 5.5.3.3.8 0x0000 Read control rcreg Read the system control register. Halted 5.5.3.3.9 0x2980 register Write control wcreg Write the operand data to the system control register. Halted 5.5.3.3.10 0x2880 register Read debug rdmreg Read the debug module register. Parallel 5.5.3.3.11 0x2D {0x42 module DRc[4:0]} register Write debug wdmreg Write the operand data to the debug module register. Parallel 5.5.3.3.12 0x2C {0x42 module DRc[4:0]} register 1 General command effect and/or requirements on CPU operation: - Halted. The CPU must be halted to perform this command. - Steal. Command generates bus cycles that can be interleaved with bus accesses. - Parallel. Command is executed in parallel with CPU activity. 2 0x4 is a three-bit field. Unassigned command opcodes are reserved by Freescale. All unused command formats within any revision level perform a NOP and return the illegal command response. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-19

Debug Support 5.5.3.1 ColdFire BDM Command Format All ColdFire Family BDM commands include a 16-bit operation word followed by an optional set of one or more extension words, as shown in Figure 5-15. 15 10 9 8 7 6 5 4 3 2 0 Operation 0 R/W Op Size 0 0 A/D Register Extension Word(s) Figure5-15. BDM Command Format Table 5-18 describes BDM fields. Table5-18. BDM Field Descriptions Bit Name Description 15–10 Operation Specifies the command. These values are listed in Table5-17. 9 0 Reserved 8 R/W Direction of operand transfer. 0 Data is written to the CPU or to memory from the development system. 1 The transfer is from the CPU to the development system. 7–6 Operand Operand data size for sized operations. Addresses are expressed as 32-bit absolute values. Note that a Size command performing a byte-sized memory read leaves the upper 8 bits of the response data undefined. Referenced data is returned in the lower 8 bits of the response. Operand SizeBit Values 00 Byte8 bits 01 Word16 bits 10 Longword32 bits 11 Reserved— 5–4 00 Reserved 3 A/D Address/data. Determines whether the register field specifies a data or address register. 0 Indicates a data register. 1 Indicates an address register. 2–0 Register Contains the register number in commands that operate on processor registers. 5.5.3.1.1 Extension Words as Required Some commands require extension words for addresses and/or immediate data. Addresses require two extension words because only absolute long addressing is permitted. Longword accesses are forcibly longword-aligned and word accesses are forcibly word-aligned. Immediate data can be 1 or 2 words long. Byte and word data each requires a single extension word and longword data requires two extension words. Operands and addresses are transferred most-significant word first. In the following descriptions of the BDM command set, the optional set of extension words is defined as address, data, or operand data. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-20 Freescale Semiconductor

Debug Support 5.5.3.2 Command Sequence Diagrams The command sequence diagram in Figure 5-16 shows serial bus traffic for commands. Each bubble represents a 17-bit bus transfer. The top half of each bubble indicates the data the development system sends to the debug module; the bottom half indicates the debug module’s response to the previous development system commands. Command and result transactions overlap to minimize latency. COMMANDS TRANSMITTED TO THE DEBUG MODULE COMMAND CODE TRANSMITTED DURING THIS CYCLE HIGH-ORDER 16 BITS OF MEMORY ADDRESS LOW-ORDER 16 BITS OF MEMORY ADDRESS NONSERIAL-RELATED ACTIVITY SEQUENCE TAKEN IF OPERATION HAS NOT COMPLETED NEXT COMMAND READ READ (LONG) MS ADDR LS ADDR XXX CODE MEMORY ??? "NOT READY" "NOT READY" "NOT READY" LOCATION XXX NEXT CMD XXXXXXXX NEXT CMD "ILLEGAL" "NOT READY" MS RESULT LS RESULT XXX NEXT CMD BERR "NOT READY" DATA UNUSED FROM THIS TRANSFER SEQUENCE TAKEN IF BUS(cid:31) SEQUENCE TAKEN IF E RROR OCCURS ON ILLEGAL COMMAND MEMORY ACCESS IS RECEIVED BY DEBUG MODULE HIGH- AND LOW-ORDER RESULTS FROM PREVIOUS COMMAND 16 BITS OF RESULT RESPONSES FROM THE DEBUG MODULE Figure5-16. Command Sequence Diagram The sequence is as follows: • In cycle 1, the development system command is issued (READ in this example). The debug module responds with either the low-order results of the previous command or a command complete status of the previous command, if no results are required. • In cycle 2, the development system supplies the high-order 16 address bits. The debug module returns a not-ready response unless the received command is decoded as unimplemented, which is indicated by the illegal command encoding. If this occurs, the development system should retransmit the command. NOTE A not-ready response can be ignored except during a memory-referencing cycle. Otherwise, the debug module can accept a new serial transfer after 32 processor clock periods. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-21

Debug Support • In cycle 3, the development system supplies the low-order 16 address bits. The debug module always returns a not-ready response. • At the completion of cycle 3, the debug module initiates a memory read operation. Any serial transfers that begin during a memory access return a not-ready response. • Results are returned in the two serial transfer cycles after the memory access completes. For any command performing a byte-sized memory read operation, the upper 8 bits of the response data are undefined and the referenced data is returned in the lower 8 bits. The next command’s opcode is sent to the debug module during the final transfer. If a memory or register access is terminated with a bus error, the error status (S= 1, DATA =0x0001) is returned instead of result data. 5.5.3.3 Command Set Descriptions The following sections describe the commands summarized in Table 5-17. NOTE The BDM status bit (S) is 0 for normally completed commands; S= 1 for illegal commands, not-ready responses, and transfers with bus-errors. Section5.5.2, “BDM Serial Interface,” describes the receive packet format. Freescale reserves unassigned command opcodes for future expansion. Unused command formats in any revision level perform a NOP and return an illegal command response. 5.5.3.3.1 Read A/D Register (RAREG/RDREG) Read the selected address or data register and return the 32-bit result. A bus error response is returned if the CPU core is not halted. Command/Result Formats: 15 12 11 8 7 4 3 2 0 Command 0x2 0x1 0x8 A/D Register Result D[31:16] D[15:0] Figure5-17. RAREG/RDREG Command Format Command Sequence: RAREG/RDREG XXX NEXT CMD ??? MS RESULT LS RESULT XXX NEXT CMD BERR "NOT READY" Figure5-18. RAREG/RDREG Command Sequence Operand Data: None Result Data: The contents of the selected register are returned as a longword value, most-significant word first. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-22 Freescale Semiconductor

Debug Support 5.5.3.3.2 Write A/D Register (WAREG/WDREG) The operand longword data is written to the specified address or data register. A write alters all 32 register bits. A bus error response is returned if the CPU core is not halted. Command Format: 15 12 11 8 7 4 3 2 0 0x2 0x0 0x8 A/D Register D[31:16] D[15:0] Figure5-19. WAREG/WDREG Command Format Command Sequence WDREG/WAREG MS DATA LS DATA NEXT CMD ??? "NOT READY" "NOT READY" "CMD COMPLETE" XXX NEXT CMD BERR "NOT READY" Figure5-20. WAREG/WDREG Command Sequence Operand Data Longword data is written into the specified address or data register. The data is supplied most-significant word first. Result Data Command complete status is indicated by returning 0xFFFF (with S cleared) when the register write is complete. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-23

Debug Support 5.5.3.3.3 Read Memory Location (READ) Read data at the longword address. Address space is defined by BAAR[TT,TM]. Hardware forces low-order address bits to zeros for word and longword accesses to ensure that word addresses are word-aligned and longword addresses are longword-aligned. Command/Result Formats: 15 12 11 8 7 4 3 0 Byte 0x1 0x9 0x0 0x0 Command A[31:16] A[15:0] Result X X X X X X X X D[7:0] Word Command 0x1 0x9 0x4 0x0 A[31:16] A[15:0] Result D[15:0] Longword Command 0x1 0x9 0x8 0x0 A[31:16] A[15:0] Result D[31:16] D[15:0] Figure5-21. READ Command/Result Formats Command Sequence: READ READ (B/W) MS ADDR LS ADDR XXX MEMORY ??? "NOT READY" "NOT READY" "NOT READY" LOCATION NEXXTX XCMD RESULT XXX NEXT CMD BERR "NOT READY" READ READ (LONG) MS ADDR LS ADDR XXX MEMORY ??? "NOT READY" "NOT READY" "NOT READY" LOCATION XXXXXX NEXT CMD MS RESULT LS RESULT XXX NEXT CMD BERR "NOT READY" Figure5-22. READ Command Sequence Operand Data The only operand is the longword address of the requested location. Result Data Word results return 16 bits of data; longword results return 32. Bytes are returned in the LSB of a word result, the upper byte is undefined. 0x0001 (S= 1) is returned if a bus error occurs. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-24 Freescale Semiconductor

Debug Support 5.5.3.3.4 Write Memory Location (WRITE) Write data to the memory location specified by the longword address. The address space is defined by BAAR[TT,TM]. Hardware forces low-order address bits to zeros for word and longword accesses to ensure that word addresses are word-aligned and longword addresses are longword-aligned. Command Formats: 15 12 11 8 7 4 3 1 Byte 0x1 0x8 0x0 0x0 A[31:16] A[15:0] X X X X X X X X D[7:0] Word 0x1 0x8 0x4 0x0 A[31:16] A[15:0] D[15:0] Longword 0x1 0x8 0x8 0x0 A[31:16] A[15:0] D[31:16] D[15:0] Figure5-23. WRITE Command Format MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-25

Debug Support Command Sequence: WRITE WRITE (B/W) MS ADDR LS ADDR DATA XXX MEMORY ??? "NOT READY" "NOT READY" "NOT READY" "NOT READY" LOCATION NXEXXXT CMD "CMD COMPLETE" XXX BERR NEXT CMD "NOT READY" WRITE (LONG) MS ADDR LS ADDR MS DATA ??? "NOT READY" "NOT READY" "NOT READY" WRITE LS DATA XXX MEMORY "NOT READY" "NOT READY" LOCATION NXEXXXT CMD "CMD COMPLETE" XXX BERR NEXT CMD "NOT READY" Figure5-24. WRITE Command Sequence Operand Data This two-operand instruction requires a longword absolute address that specifies a location to which the data operand is to be written. Byte data is sent as a 16-bit word, justified in the LSB; 16- and 32-bit operands are sent as 16 and 32 bits, respectively Result Data Command complete status is indicated by returning 0xFFFF (with S cleared) when the register write is complete. A value of 0x0001 (with S set) is returned if a bus error occurs. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-26 Freescale Semiconductor

Debug Support 5.5.3.3.5 Dump Memory Block (DUMP) DUMP is used with the READ command to access large blocks of memory. An initial READ is executed to set up the starting address of the block and to retrieve the first result. If an initial READ is not executed before the first DUMP, an illegal command response is returned. The DUMP command retrieves subsequent operands. The initial address is incremented by the operand size (1, 2, or 4) and saved in a temporary register. Subsequent DUMP commands use this address, perform the memory read, increment it by the current operand size, and store the updated address in the temporary register. NOTE DUMP does not check for a valid address; it is a valid command only when preceded by NOP, READ, or another DUMP command. Otherwise, an illegal command response is returned. NOP can be used for intercommand padding without corrupting the address pointer. The size field is examined each time a DUMP command is processed, allowing the operand size to be dynamically altered. Command/Result Formats: 15 12 11 8 7 4 3 0 Byte Command 0x1 0xD 0x0 0x0 Result X X X X X X X X D[7:0] Word Command 0x1 0xD 0x4 0x0 Result D[15:0] Longword Command 0x1 0xD 0x8 0x0 Result D[31:16] D[15:0] Figure5-25. DUMP Command/Result Formats Command Sequence: READ(cid:31) DUMP (B/W) XXX MEMORY(cid:31) ??? "NOT READY" LOCATION NEXT CMD RESULT XXX NEXT CMD XXX NEXT CMD "ILLEGAL" "NOT READY" BERR "NOT READY" READ(cid:31) DUMP (LONG) XXX MEMORY(cid:31) ??? "NOT READY" LOCATION NEXT CMD NEXT CMD MS RESULT LS RESULT XXX NEXT CMD XXX NEXT CMD "ILLEGAL" "NOT READY" BERR "NOT READY" Figure5-26. DUMP Command Sequence MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-27

Debug Support Operand Data: None Result Data: Requested data is returned as either a word or longword. Byte data is returned in the least-significant byte of a word result. Word results return 16 bits of significant data; longword results return 32 bits. A value of 0x0001 (with S set) is returned if a bus error occurs. 5.5.3.3.6 Fill Memory Block (FILL) A FILL command is used with the WRITE command to access large blocks of memory. An initial WRITE is executed to set up the starting address of the block and to supply the first operand. The FILL command writes subsequent operands. The initial address is incremented by the operand size (1, 2, or 4) and saved in a temporary register after the memory write. Subsequent FILL commands use this address, perform the write, increment it by the current operand size, and store the updated address in the temporary register. If an initial WRITE is not executed preceding the first FILL command, the illegal command response is returned. NOTE The FILL command does not check for a valid address—FILL is a valid command only when preceded by another FILL, a NOP, or a WRITE command. Otherwise, an illegal command response is returned. The NOP command can be used for intercommand padding without corrupting the address pointer. The size field is examined each time a FILL command is processed, allowing the operand size to be altered dynamically. Command Formats: 15 12 11 8 7 4 3 0 Byte 0x1 0xC 0x0 0x0 X X X X X X X X D[7:0] Word 0x1 0xC 0x4 0x0 D[15:0] Longword 0x1 0xC 0x8 0x0 D[31:16] D[15:0] Figure5-27. FILL Command Format MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-28 Freescale Semiconductor

Debug Support Command Sequence: WRITE(cid:31) FFILILLL ( L(BO/WNG)) MS DATA LS DATA XXX MEMORY(cid:31) ??? "NOT READY" "NOT READY" LOCATION "NOT READY" XXX NEXT CMD NEXT CMD "ILLEGAL" "NOT READY" "CMD COMPLETE" XXX NEXT CMD BERR "NOT READY" WRITE(cid:31) FFILILL L(L (OBN/WG)) DATA XXX MEMORY(cid:31) ??? "NOT READY" "NOT READY" LOCATION NEXT CMD XXX NEXT CMD "CMD COMPLETE" "ILLEGAL" "NOT READY" XXX NEXT CMD BERR "NOT READY" Figure5-28. FILL Command Sequence Operand Data: A single operand is data to be written to the memory location. Byte data is sent as a 16-bit word, justified in the least-significant byte; 16- and 32-bit operands are sent as 16 and 32 bits, respectively. Result Data: Command complete status (0xFFFF) is returned when the register write is complete. A value of 0x0001 (with S set) is returned if a bus error occurs. 5.5.3.3.7 Resume Execution (GO) The pipeline is flushed and refilled before normal instruction execution resumes. Prefetching begins at the current address in the PC and at the current privilege level. If any register (such as the PC or SR) is altered by a BDM command while the processor is halted, the updated value is used when prefetching resumes. If a GO command is issued and the CPU is not halted, the command is ignored. 15 12 11 8 7 4 3 0 0x0 0xC 0x0 0x0 Figure5-29. GO Command Format Command Sequence: GO NEXT CMD ??? "CMD COMPLETE" Figure5-30. GO Command Sequence Operand Data: None Result Data: The command-complete response (0xFFFF) is returned during the next shift operation. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-29

Debug Support 5.5.3.3.8 No Operation (NOP) NOP performs no operation and may be used as a null command where required. Command Formats: 15 12 11 8 7 4 3 0 0x0 0x0 0x0 0x0 Figure5-31. NOP Command Format Command Sequence: NOP NEXT CMD(cid:31) ??? "CMD COMPLETE" Figure5-32. NOP Command Sequence Operand Data: None Result Data: The command-complete response, 0xFFFF (with S cleared), is returned during the next shift operation. 5.5.3.3.9 Read Control Register (RCREG) Read the selected control register and return the 32-bit result. Accesses to the processor/memory control registers are always 32 bits wide, regardless of register width. The second and third words of the command form a 32-bit address, which the debug module uses to generate a special bus cycle to access the specified control register. The 12-bit Rc field is the same as that used by the MOVEC instruction. Command/Result Formats: 15 12 11 8 7 4 3 0 Command 0x2 0x9 0x8 0x0 0x0 0x0 0x0 0x0 0x0 Rc Result D[31:16] D[15:0] Figure5-33. RCREG Command/Result Formats Rc encoding: Table5-19. Control Register Map Rc Register Definition Rc Register Definition 0x002 Cache control register (CACR) 0x806 MAC accumulator (ACC) 0x004 Access control register 0 (ACR0) 0x80E Status register (SR) 0x005 Access control register 1 (ACR1) 0x80F Program register (PC) 0x801 Vector base register (VBR) 0xC04 RAM base address register (RAMBAR) 0x804 MAC status register (MACSR) 0xC0F Module base address (MBAR) 0x805 MAC mask register (MASK) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-30 Freescale Semiconductor

Debug Support Command Sequence: READ RCREG EMXST AWDODRRD EMXST AWDODRRD XXX CMOENMTORROYL ??? "NOT READY" "NOT READY" "NOT READY" RLEOGCIASTTIOERN XXXXXX NEXT CMD MS RESULT LS RESULT XXX NEXT CMD BERR "NOT READY" Figure5-34. RCREG Command Sequence Operand Data: The only operand is the 32-bit Rc control register select field. Result Data: Control register contents are returned as a longword, most-significant word first. The implemented portion of registers smaller than 32 bits is guaranteed correct; other bits are undefined. 5.5.3.3.10 Write Control Register (WCREG) The operand (longword) data is written to the specified control register. The write alters all 32 register bits. Command/Result Formats: 15 12 11 8 7 4 3 0 Command 0x2 0x8 0x8 0x0 0x0 0x0 0x0 0x0 0x0 Rc Result D[31:16] D[15:0] Figure5-35. WCREG Command/Result Formats Command Sequence: WCREG EMXST WADODRRD EMXST AWDODRRD MS DATA ??? "NOT READY" "NOT READY" "NOT READY" WWRRITITEE LS DATA XXX CMOENMTORROYL "NOT READY" RLEOGCIASTTIEORN "NOT READY" NXEXXXT CMD "CMD COMPLETE" XXX BERR NEXT CMD "NOT READY" Figure5-36. WCREG Command Sequence MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-31

Debug Support Operand Data: This instruction requires two longword operands. The first selects the register to which the operand data is to be written; the second contains the data. Result Data: Successful write operations return 0xFFFF. Bus errors on the write cycle are indicated by the setting of bit 16 in the status message and by a data pattern of 0x0001. 5.5.3.3.11 Read Debug Module Register (RDMREG) Read the selected debug module register and return the 32-bit result. The only valid register selection for the RDMREG command is CSR (DRc = 0x00). Note that this read of the CSR clears CSR[FOF, TRG, HALT, BKPT]; as well as the trigger status bits (CSR[BSTAT]) if either a level-2 breakpoint has been triggered or a level-1 breakpoint has been triggered and no level-2 breakpoint has been enabled. Command/Result Formats: 15 12 11 8 7 5 4 0 Command 0x2 0xD 100 DRc Result D[31:16] D[15:0] Figure5-37. RDMREG BDM Command/Result Formats Table 5-20 shows the definition of DRc encoding. Table5-20. Definition of DRc Encoding—Read DRc[4:0] Debug Register Definition Mnemonic Initial State Page 0x00 Configuration/Status CSR 0x0 p. 5-10 0x01–0x1F Reserved — — — Command Sequence: RDMREG XXX NEXT CMD ??? MS RESULT LS RESULT XXX NEXT CMD "ILLEGAL" "NOT READY" Figure5-38. RDMREG Command Sequence Operand Data: None Result Data: The contents of the selected debug register are returned as a longword value. The data is returned most-significant word first. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-32 Freescale Semiconductor

Debug Support 5.5.3.3.12 Write Debug Module Register (WDMREG) The operand (longword) data is written to the specified debug module register. All 32 bits of the register are altered by the write. DSCLK must be inactive while the debug module register writes from the CPU accesses are performed using the WDEBUG instruction. Command Format: Figure5-39. WDMREG BDM Command Format 15 12 11 8 7 5 4 0 0x2 0xC 100 DRc D[31:16] D[15:0] Table 5-3 shows the definition of the DRc write encoding. Command Sequence: WDMREG MS DATA LS DATA NEXT CMD ??? "NOT READY" "NOT READY" "CMD COMPLETE" XXX NEXT CMD "ILLEGAL" "NOT READY" Figure5-40. WDMREG Command Sequence Operand Data: Longword data is written into the specified debug register. The data is supplied most-significant word first. Result Data: Command complete status (0xFFFF) is returned when register write is complete. 5.6 Real-Time Debug Support The ColdFire Family provides support debugging real-time applications. For these types of embedded systems, the processor must continue to operate during debug. The foundation of this area of debug support is that while the processor cannot be halted to allow debugging, the system can generally tolerate small intrusions into the real-time operation. The debug module provides three types of breakpoints—PC with mask, operand address range, and data with mask. These breakpoints can be configured into one- or two-level triggers with the exact trigger response also programmable. The debug module programming model can be written from either the external development system using the debug serial interface or from the processor’s supervisor programming model using the WDEBUG instruction. Only CSR is readable using the external development system. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-33

Debug Support 5.6.1 Theory of Operation Breakpoint hardware can be configured to respond to triggers in several ways. The response desired is programmed into TDR. As shown in Table 5-21, when a breakpoint is triggered, an indication (CSR[BSTAT]) is provided on the DDATA output port when it is not displaying captured processor status, operands, or branch addresses. Table5-21. DDATA[3:0]/CSR[BSTAT] Breakpoint Response DDATA[3:0]/CSR[BSTAT] 1 Breakpoint Status 0000/0000 No breakpoints enabled 0010/0001 Waiting for level-1 breakpoint 0100/0010 Level-1 breakpoint triggered 1010/0101 Waiting for level-2 breakpoint 1100/0110 Level-2 breakpoint triggered 1 Encodings not shown are reserved for future use. The breakpoint status is also posted in CSR. Note that CSR[BSTAT] is cleared by a CSR read when either a level-2 breakpoint is triggered or a level-1 breakpoint is triggered and a level-2 breakpoint is not enabled. Status is also cleared by writing to TDR. BDM instructions use the appropriate registers to load and configure breakpoints. As the system operates, a breakpoint trigger generates the response defined in TDR. PC breakpoints are treated in a precise manner—exception recognition and processing are initiated before the excepting instruction is executed. All other breakpoint events are recognized on the processor’s local bus, but are made pending to the processor and sampled like other interrupt conditions. As a result, these interrupts are imprecise. In systems that tolerate the processor being halted, a BDM-entry can be used. With TDR[TRC] =01, a breakpoint trigger causes the core to halt (PST= 0xF). If the processor core cannot be halted, the debug interrupt can be used. With this configuration, TDR[TRC]= 10, the breakpoint trigger becomes a debug interrupt to the processor, which is treated higher than the nonmaskable level-7 interrupt request. As with all interrupts, it is made pending until the processor reaches a sample point, which occurs once per instruction. Again, the hardware forces the PC breakpoint to occur before the targeted instruction executes. This is possible because the PC breakpoint is enabled when interrupt sampling occurs. For address and data breakpoints, reporting is considered imprecise because several instructions may execute after the triggering address or data is detected. As soon as the debug interrupt is recognized, the processor aborts execution and initiates exception processing. This event is signaled externally by the assertion of a unique PST value (PST= 0xD) for multiple cycles. The core enters emulator mode when exception processing begins. After the standard 8-byte exception stack is created, the processor fetches a unique exception vector, 12, from the vector table. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-34 Freescale Semiconductor

Debug Support Execution continues at the instruction address in the vector corresponding to the breakpoint triggered. All interrupts are ignored while the processor is in emulator mode. The debug interrupt handler can use supervisor instructions to save the necessary context such as the state of all program-visible registers into a reserved memory area. When debug interrupt operations complete, the RTE instruction executes and the processor exits emulator mode. After the debug interrupt handler completes execution, the external development system can use BDM commands to read the reserved memory locations. If a hardware breakpoint such as a PC trigger is left unmodified by the debug interrupt service routine, another debug interrupt is generated after the completion of the RTE instruction. 5.6.1.1 Emulator Mode Emulator mode is used to facilitate non-intrusive emulator functionality. This mode can be entered in three different ways: • Setting CSR[EMU] forces the processor into emulator mode. EMU is examined only if RSTI is negated and the processor begins reset exception processing. It can be set while the processor is halted before reset exception processing begins. See Section5.5.1, “CPU Halt.” • A debug interrupt always puts the processor in emulation mode when debug interrupt exception processing begins. • Setting CSR[TRC] forces the processor into emulation mode when trace exception processing begins. While operating in emulation mode, the processor exhibits the following properties: • All interrupts are ignored, including level-7 interrupts. • If CSR[MAP] =1, all caching of memory and the SRAM module are disabled. All memory accesses are forced into a specially mapped address space signaled by TT= 0x2, TM = 0x5 or 0x6. This includes stack frame writes and the vector fetch for the exception that forced entry into this mode. The RTE instruction exits emulation mode. The processor status output port provides a unique encoding for emulator mode entry (0xD) and exit (0x7). 5.6.2 Concurrent BDM and Processor Operation The debug module supports concurrent operation of both the processor and most BDM commands. BDM commands may be executed while the processor is running, except those following operations that access processor/memory registers: • Read/write address and data registers • Read/write control registers For BDM commands that access memory, the debug module requests the processor’s local bus. The processor responds by stalling the instruction fetch pipeline and waiting for current bus activity to complete before freeing the local bus for the debug module to perform its access. After the debug module bus cycle, the processor reclaims the bus. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-35

Debug Support Breakpoint registers must be carefully configured in a development system if the processor is executing. The debug module contains no hardware interlocks, so TDR should be disabled while breakpoint registers are loaded, after which TDR can be written to define the exact trigger. This prevents spurious breakpoint triggers. Because there are no hardware interlocks in the debug unit, no BDM operations are allowed while the CPU is writing the debug’s registers (DSCLK must be inactive). Note that the debug module requires the use of the internal bus to perform BDM commands. In Revision A, if the processor is executing a tight loop that is contained within a single aligned longword, the processor may never grant the internal bus to the debug module, for example: align4 label1: nop bra.b label1 or align4 label2: bra.w label2 The processor grants the internal bus if these loops are forced across two longwords. 5.7 Processor Status, DDATA Definition This section specifies the ColdFire processor and debug module’s generation of the processor status (PST) and debug data (DDATA) output on an instruction basis. In general, the PST/DDATA output for an instruction is defined as follows: PST= 0x1, {PST= [0x89B], DDATA= operand} where the {...} definition is optional operand information defined by the setting of the CSR. The CSR provides capabilities to display operands based on reference type (read, write, or both). A PST value {0x8, 0x9, or 0xB} identifies the size and presence of valid data to follow on the DDATA output {1, 2, or 4 bytes}. Additionally, for certain change-of-flow branch instructions, CSR[BTB] provides the capability to display the target instruction address on the DDATA output {2, 3, or 4 bytes} using a PST value of {0x9, 0xA, or 0xB}. 5.7.1 User Instruction Set Table 5-22 shows the PST/DDATA specification for user-mode instructions. Rn represents any {Dn, An} register. In this definition, the ‘y’ suffix generally denotes the source and ‘x’ denotes the destination operand. For a given instruction, the optional operand data is displayed only for those effective addresses referencing memory.The ‘DD’ nomenclature refers to the DDATA outputs. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-36 Freescale Semiconductor

Debug Support Table5-22. PST/DDATA Specification for User-Mode Instructions Instruction Operand Syntax PST/DDATA add.l <ea>y,Rx PST=0x1, {PST=0xB, DD=source operand} add.l Dy,<ea>x PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} addi.l #imm,Dx PST=0x1 addq.l #imm,<ea>x PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} addx.l Dy,Dx PST=0x1 and.l <ea>y,Dx PST=0x1, {PST=0xB, DD=source operand} and.l Dy,<ea>x PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} andi.l #imm,Dx PST=0x1 asl.l {Dy,#imm},Dx PST=0x1 asr.l {Dy,#imm},Dx PST=0x1 bcc.{b,w} if taken, then PST=0x5, else PST=0x1 bchg #imm,<ea>x PST=0x1, {PST=0x8, DD=source}, {PST=0x8, DD=destination} bchg Dy,<ea>x PST=0x1, {PST=0x8, DD=source}, {PST=0x8, DD=destination} bclr #imm,<ea>x PST=0x1, {PST=0x8, DD=source}, {PST=0x8, DD=destination} bclr Dy,<ea>x PST=0x1, {PST=0x8, DD=source}, {PST=0x8, DD=destination} bra.{b,w} PST=0x5 bset #imm,<ea>x PST=0x1, {PST=0x8, DD=source}, {PST=0x8, DD=destination} bset Dy,<ea>x PST=0x1, {PST=0x8, DD=source}, {PST=0x8, DD=destination} bsr.{b,w} PST=0x5, {PST=0xB, DD=destination operand} btst #imm,<ea>x PST=0x1, {PST=0x8, DD=source operand} btst Dy,<ea>x PST=0x1, {PST=0x8, DD=source operand} clr.b <ea>x PST=0x1, {PST=0x8, DD=destination operand} clr.l <ea>x PST=0x1, {PST=0xB, DD=destination operand} clr.w <ea>x PST=0x1, {PST=0x9, DD=destination operand} cmp.l <ea>y,Rx PST=0x1, {PST=0xB, DD=source operand} cmpi.l #imm,Dx PST=0x1 divs.l <ea>y,Dx PST=0x1, {PST=0xB, DD=source operand} divs.w <ea>y,Dx PST=0x1, {PST=0x9, DD=source operand} divu.l <ea>y,Dx PST=0x1, {PST=0xB, DD=source operand} divu.w <ea>y,Dx PST=0x1, {PST=0x9, DD=source operand} eor.l Dy,<ea>x PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} eori.l #imm,Dx PST=0x1 ext.l Dx PST=0x1 ext.w Dx PST=0x1 extb.l Dx PST=0x1 jmp <ea>x PST=0x5, {PST=[0x9AB], DD=target address} 1 jsr <ea>x PST=0x5, {PST=[0x9AB], DD=target address}, {PST=0xB, DD=destination operand}1 lea <ea>y,Ax PST=0x1 link.w Ay,#imm PST=0x1, {PST=0xB, DD=destination operand} MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-37

Debug Support Table5-22. PST/DDATA Specification for User-Mode Instructions (continued) Instruction Operand Syntax PST/DDATA lsl.l {Dy,#imm},Dx PST=0x1 lsr.l {Dy,#imm},Dx PST=0x1 mac.l PST=0x1 mac.l Ry,Rx PST=0x1 mac.l Ry,Rx,ea,Rw PST=0x1, {PST=0xB, DD=source operand} mac.w PST=0x1 mac.w Ry,Rx PST=0x1 mac.w Ry,Rx,ea,Rw PST=0x1, {PST=0xB, DD=source operand} move.b <ea>y,<ea>x PST=0x1, {PST=0x8, DD=source}, {PST=0x8, DD=destination} move.l <ea>y,<ea>x PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} move.l <ea>y,ACC PST=0x1 move.l <ea>y,MACSR PST=0x1 move.l <ea>y,MASK PST=0x1 move.l ACC,Rx PST=0x1 move.l MACSR,CCR PST=0x1 move.l MACSR,Rx PST=0x1 move.l MASK,Rx PST=0x1 move.w <ea>y,<ea>x PST=0x1, {PST=0x9, DD=source}, {PST=0x9, DD=destination} move.w CCR,Dx PST=0x1 move.w {Dy,#imm},CCR PST=0x1 movem.l #list,<ea>x PST=0x1, {PST=0xB, DD=destination},... 2 movem.l <ea>y,#list PST=0x1, {PST=0xB, DD=source},... 2 moveq #imm,Dx PST=0x1 msac.l Ry,Rx PST=0x1 msac.l Ry,Rx,ea,Rw PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} msac.w Ry,Rx PST=0x1 msac.w Ry,Rx,ea,Rw PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} muls.l <ea>y,Dx PST=0x1, {PST=0xB, DD=source operand} muls.w <ea>y,Dx PST=0x1, {PST=0x9, DD=source operand} mulu.l <ea>y,Dx PST=0x1, {PST=0xB, DD=source operand} mulu.w <ea>y,Dx PST=0x1, {PST=0x9, DD=source operand} neg.l Dx PST=0x1 negx.l Dx PST=0x1 nop PST=0x1 not.l Dx PST=0x1 or.l <ea>y,Dx PST=0x1, {PST=0xB, DD=source operand} or.l Dy,<ea>x PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} ori.l #imm,Dx PST=0x1 pea <ea>y PST=0x1, {PST=0xB, DD=destination operand} pulse PST=0x4 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-38 Freescale Semiconductor

Debug Support Table5-22. PST/DDATA Specification for User-Mode Instructions (continued) Instruction Operand Syntax PST/DDATA rems.l <ea>y,Dx:Dw PST=0x1, {PST=0xB, DD=source operand} remu.l <ea>y,Dx:Dw PST=0x1, {PST=0xB, DD=source operand} rts PST=0x1, {PST=0xB, DD=source operand}, PST=0x5, {PST=[0x9AB], DD=target address} scc Dx PST=0x1 sub.l <ea>y,Rx PST=0x1, {PST=0xB, DD=source operand} sub.l Dy,<ea>x PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} subi.l #imm,Dx PST=0x1 subq.l #imm,<ea>x PST=0x1, {PST=0xB, DD=source}, {PST=0xB, DD=destination} subx.l Dy,Dx PST=0x1 swap Dx PST=0x1 trap #imm PST=0x13 trapf PST=0x1 tst.b <ea>x PST=0x1, {PST=0x8, DD=source operand} tst.l <ea>x PST=0x1, {PST=0xB, DD=source operand} tst.w <ea>x PST=0x1, {PST=0x9, DD=source operand} unlk Ax PST=0x1, {PST=0xB, DD=destination operand} wddata.b <ea>y PST=0x4, {PST=0x8, DD=source operand wddata.l <ea>y PST=0x4, {PST=0xB, DD=source operand wddata.w <ea>y PST=0x4, {PST=0x9, DD=source operand 1 For JMP and JSR instructions, the optional target instruction address is displayed only for those effective address fields defining variant addressing modes. This includes the following <ea>x values: (An), (d16,An), (d8,An,Xi), (d8,PC,Xi). 2 For Move Multiple instructions (MOVEM), the processor automatically generates line-sized transfers if the operand address reaches a 0-modulo-16 boundary and there are four or more registers to be transferred. For these line-sized transfers, the operand data is never captured nor displayed, regardless of the CSR value. The automatic line-sized burst transfers are provided to maximize performance during these sequential memory access operations. 3 During normal exception processing, the PST output is driven to a 0xC indicating the exception processing state. The exception stack write operands, as well as the vector read and target address of the exception handler may also be displayed. Exception ProcessingPST = 0xC,{PST = 0xB,DD = destination},// stack frame {PST = 0xB,DD = destination},// stack frame {PST = 0xB,DD = source},// vector read PST = 0x5,{PST = [0x9AB],DD = target}// handler PC The PST/DDATA specification for the reset exception is shown below: Exception ProcessingPST = 0xC, PST = 0x5,{PST = [0x9AB],DD = target}// handler PC The initial references at address 0 and 4 are never captured nor displayed since these accesses are treated as instruction fetches. For all types of exception processing, the PST= 0xC value is driven at all times, unless the PST output is needed for one of the optional marker values or for the taken branch indicator (0x5). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-39

Debug Support 5.7.2 Supervisor Instruction Set The supervisor instruction set has complete access to the user mode instructions plus the opcodes shown below. The PST/DDATA specification for these opcodes is shown in Table 5-23. Table5-23. PST/DDATA Specification for Supervisor-Mode Instructions Instruction Operand Syntax PST/DDATA cpushl PST=0x1 halt PST=0x1, PST=0xF move.w SR,Dx PST=0x1 move.w {Dy,#imm},SR PST=0x1, {PST=0x3} movec Ry,Rc PST=0x1 rte PST=0x7, {PST=0xB, DD=source operand}, {PST=3},{ PST=0xB, DD=source operand}, PST=0x5, {[PST=0x9AB], DD=target address} stop #imm PST=0x1, PST=0xE wdebug <ea>y PST=0x1, {PST=0xB, DD=source, PST=0xB, DD=source} The move-to-SR and RTE instructions include an optional PST= 0x3 value, indicating an entry into user mode. Additionally, if the execution of a RTE instruction returns the processor to emulator mode, a multiple-cycle status of 0xD is signaled. Similar to the exception processing mode, the stopped state (PST= 0xE) and the halted state (PST= 0xF) display this status throughout the entire time the ColdFire processor is in the given mode. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-40 Freescale Semiconductor

Debug Support 5.8 Freescale-Recommended BDM Pinout The ColdFire BDM connector, Figure 5-41, is a 26-pin Berg connector arranged 2 x 13. Developer reserved 1 1 2 BKPT GND 3 4 DSCLK GND 5 6 Developer reserved 1 RESET 7 8 DSI Pad-Voltage2 9 10 DSO GND 11 12 PST3 PST2 13 14 PST1 PST0 15 16 DDATA3 DDATA2 17 18 DDATA1 DDATA0 19 20 GND Freescale reserved 21 22 Freescale reserved GND 23 24 PSTCLK Core-Voltage 25 26 TEA 1Pins reserved for BDM developer use. 2Supplied by target Figure5-41. Recommended BDM Connector MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 5-41

Debug Support MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 5-42 Freescale Semiconductor

Chapter 6 System Integration Module (SIM) This chapter provides detailed operation information regarding the system integration module (SIM). It describes the SIM programming model, bus arbitration, power management, and system-protection functions for the MCF5272. 6.1 Features The SIM, shown in Figure 6-1, provides overall control of the bus and serves as the interface between the ColdFire core processor complex and the internal peripheral devices. V2 COLDFIRE PROCESSOR COMPLEX PLIC QSPI SYSTEM INTEGRATION MODULE (SIM) DMA System Control Base Address Identification Parallel Port SCR PMR WRRR WCR MBAR DIR PACNT– PADDR– PADR– USB PDCNT PCDDR PCDR SPR ALPR WIRR WER PWM SDRAM Controller Chip Select Module External Interrupt Controller Ethernet Bus Interface SDRAM Control 4 ICRs ISR SDCR 8 8 Two UARTs PITR CSORs CSBRs SDRAM Timer PIWR Four SDTR PIVR General- Purpose Timers 8 32-Bit Data Bus 6 DRAM Controller Outputs CS[7:0] 32-Bit Address Bus INT[6:1] Control Signals Figure6-1. SIM Block Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 6-1

System Integration Module (SIM) The following is a list of the key SIM features: • Module base address register (MBAR) — Base address location of all internal peripherals, SIM resources, and memory-mapped registers — Address space masking to internal peripherals and SIM resources • Interrupt controller — Programmable interrupt level (1–7) for internal peripheral interrupts — Up to six external interrupt request inputs — See Chapter7, “Interrupt Controller.” • Chip select module — Eight dedicated programmable chip selects — Address masking for memory block sizes from 4 Kbytes to 2 Gbytes — Programmable wait states and port sizes — Programmable address setup — Programmable address hold for read and write — SDRAM controller interface supported with CS7/SDCS See Chapter8, “Chip Select Module.” • System protection — Hardware watchdog timer. See Section6.2.3, “System Configuration Register (SCR).” — Software watchdog timer. See Section6.2.8, “Software Watchdog Timer • Pin assignment register (PAR) configures the parallel port. See Section6.2.3, “System Configuration Register (SCR).” • Power management — Individual control for each on-chip peripheral — Choice of low-power modes See Section6.2.5, “Power Management Register (PMR).” • Bus arbitration — Configure arbitration for internal bus among ColdFire core, Ethernet controller, and DMA controller. See Section6.2.3, “System Configuration Register (SCR).” 6.2 Programming Model The following sections describe the registers incorporated into the SIM. 6.2.1 SIM Register Memory Map Table 6-1 shows the memory map for the SIM registers. The internal registers in the SIM are memory-mapped registers offset from the MBAR address pointer defined in MBAR[BA]. This supervisor-level register is described in Section6.2.2, “Module Base Address Register (MBAR).” Because SIM registers depend on the base address defined in MBAR[BA], MBAR must be programmed before SIM registers can be accessed. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 6-2 Freescale Semiconductor

System Integration Module (SIM) Table6-1. SIM Registers MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x000 Module base address register (MBAR), after initialization [p. 6-3] 0x004 System configuration register (SCR) [p. 6-5] System protection register (SPR) [p. 6-6] 0x008 Power management register (PMR) [p. 6-7] 0x00C Reserved Active low power register (ALPR) [p. 6-10] 0x010 Device identification register (DIR) [p. 6-11] 0x014– Reserved 0x01C Interrupt Controller Registers 0x020 Interrupt control register 1 (ICR1) [p. 7-4] 0x024 Interrupt control register 2 (ICR2) [p. 7-5] 0x028 Interrupt control register 3 (ICR3) [p. 7-5] 0x02C Interrupt control register 4 (ICR4) [p. 7-5] 0x030 Interrupt source register (ISR) [p. 7-6] 0x034 Programmable interrupt transition register (PITR) [p. 7-7] 0x038 Programmable interrupt wakeup register (PIWR) [p. 7-8] 0x03C Reserved Programmable interrupt vector register (PIVR) [p. 7-9] Software Watchdog Registers 0x280 Watchdog reset reference register (WRRR) [p. 6-12] Reserved 0x284 Watchdog interrupt reference register (WIRR) [p. 6-12] Reserved 0x288 Watchdog counter register (WCR) [p. 6-13] Reserved 0x28C Watchdog event register (WER) [p. 6-13] Reserved 6.2.2 Module Base Address Register (MBAR) The supervisor-level MBAR, Figure 6-2, specifies the base address and allowable access types for all internal peripherals. It is written with a MOVEC instruction using the CPU address 0xC0F. (See the ColdFire Family Programmer’s Reference Manual.) MBAR can be read or written through the debug module as a read/write register, as described in.” Once MBAR has been initialized, it can be read and written in supervisor mode at the address programmed into the base address (BA) field. The valid bit, MBAR[V], is cleared at system reset to prevent incorrect references before MBAR is written; other MBAR bits are uninitialized at reset. To access internal peripherals, write MBAR with the appropriate base address (BA) and set MBAR[V] after system reset. All internal peripheral registers occupy a single relocatable memory block along 64-Kbyte boundaries. If MBAR[V] is set, MBAR[BA] is compared to the upper 16 bits of the full 32-bit internal address to MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 6-3

System Integration Module (SIM) determine if an internal peripheral is being accessed. MBAR masks specific address spaces using the address space fields. Attempts to access a masked address space generate an external bus access. Addresses hitting overlapping memory spaces take the following priority: 1. SRAM, ROM, and cache 2. MBAR 3. Chip select Thus, if an overlapping address hits in the SRAM, ROM, or cache, the SIM will not generate a bus cycle, either externally or to an on-chip peripheral. NOTE The MBAR region must be mapped to non-cacheable space. 31 16 15 5 4 3 2 1 0 Field BA — SC SD UC UD V Reset Undefined 0 R/W W initially through MOVEC; R/W after initialization in supervisor mode Address CPU + 0x0C0F initially; MBAR+0x000 after initialization Figure6-2. Module Base Address Register (MBAR) Table 6-2 describes MBAR fields. Table6-2. MBAR Field Descriptions Bits Field Description . 31–16 BA Base address. Defines the base address for a 64-Kbyte address range 15–5 — Reserved, should be cleared. 4 SC Setting masks supervisor code space in MBAR address range 3 SD Setting masks supervisor data space in MBAR address range Attribute Mask Bits 2 UC Setting masks user code space in MBAR address range 1 UD Setting masks user data space in MBAR address range 0 V Valid. Determines whether MBAR settings are valid. 0 MBAR contents are invalid. 1 MBAR contents are valid. The following example shows how to set the MBAR to location 0x1000_0000 using the D0 register. Setting MBAR[V] validates the MBAR location. This example assumes all accesses are valid: move.1 #0x10000001,DO movec DO,MBAR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 6-4 Freescale Semiconductor

System Integration Module (SIM) 6.2.3 System Configuration Register (SCR) The system configuration register (SCR), Figure 6-3, provides information and control for a variety of system features. 15 14 13 12 11 9 8 7 6 5 4 3 2 0 Field 1 0 RSTSRC — Priority AR SoftRST — BusLock HWR Reset 1 0 seeTable6-3 0000_1000_0111 R/W R/W; except for RSTSRC[1:0], which are read only Address MBAR + 0x004 Figure6-3. System Configuration Register (SCR) Table 6-3 describes SCR fields. Table6-3. SCR Field Descriptions Bits Field Description 15-14 — Reserved. Bit 15 always reads as a 1, bit 14 as a 0. Writing to these bits has no effect. 13–12 RSTSRC Reset source. Indicates the source of the last device reset. 00 Reserved 01 RSTI asserted, DRESETEN not asserted 10 Software watchdog 11 RSTI and DRESETEN asserted 11–9 — Reserved, should be cleared. 8 Priority Selects the bus arbiter priority scheme. 0 Ethernet has highest priority, DMA has next highest priority, CPU has lowest priority. 1 CPU has highest priority, DMA has next highest priority, Ethernet has lowest priority. This bit should be cleared if the Ethernet module is enabled. 7 AR Assume request. Selects the bus mastership scheme. 0 Current bus master relinquishes the bus after the current bus cycle. 1 Assume current bus master wants the bus for the next bus cycle and include it in the arbitration process. If AR is set and the current bus master has a higher priority than other requesting masters but is not requesting the bus for the next cycle, there is a 1 clock dead cycle before the arbiter can reassign the bus to the next highest priority master. 6 SoftRST Writing a one to this bit resets the on-chip peripherals, excluding the chip select module, interrupt controller module, GPIO module, and SDRAM controller, and asserts RSTO. The CPU is not reset. The reset remains asserted for 128 clock cycles. This bit is automatically cleared on negation of the reset. 5–4 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 6-5

System Integration Module (SIM) Table6-3. SCR Field Descriptions (continued) Bits Field Description 3 BusLock Locks the ownership of the bus. 0 Ownership of the bus is determined by arbitration. 1 Current bus master retains ownership of the bus indefinitely. 2–0 HWR Hardware watchdog reference. Determines how many clocks to wait before timing out a bus cycle when SPR[HWTEN] is set. The value programmed should be longer than the response time of the slowest external peripheral in the system. 000 128 001 256 010 512 011 1024 100 2048 101 4096 110 8192 111 16384 6.2.4 System Protection Register (SPR) The system protection register (SPR), Figure 6-4, provides information about bus cycles that have generated error conditions. These error conditions can optionally generate an access error exception by using the enable bits. 15 14 13 12 11 10 9 8 Field ADC WPV SMV PE HWT RPV EXT SUV Reset 0000_0000 R/W R/W 7 6 5 4 3 2 1 0 Field ADCEN WPVEN SMVEN PEEN HWTEN RPVEN EXTEN SUVEN Reset 0000_1011 R/W R/W Address MBAR + 0x006 Figure6-4. System Protection Register (SPR) Table 6-4 describes SPR fields. Table6-4. SPR Field Descriptions Bits Fields Description 15, 7 ADC, Address decode conflict. This bit is set when an address matches against two chip selects. If ADCEN is ADCEN also set, the bus cycle is terminated with an access error exception. 14, 6 WPV, Write protect violation. This bit is set when a write access is attempted to an area for which the chip select WPVEN is set to read only. If WPVEN is also set, the bus cycle is terminated with an access error exception. 13, 5 SMV, Stopped module violation. This bit is set when an access is attempted to an on-chip peripheral whose SMVEN clock has been stopped. If SMVEN is also set, the bus cycle is terminated with an access error exception. 12, 4 PE, PEEN Peripheral error. This bit is set when an access to an on-chip peripheral is terminated with a transfer error. If PEEN is also set, the bus cycle is terminated with an access error exception. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 6-6 Freescale Semiconductor

System Integration Module (SIM) Table6-4. SPR Field Descriptions (continued) Bits Fields Description 11, 3 HWT, Hardware watchdog timeout. This bit is set when the hardware watchdog timer has reached its HWTEN programmed timeout value. If HWTEN is also set, the bus cycle is terminated with an access error exception. 10, 2 RPV, Read protect violation. This bit is set when a read access is attempted to an area for which the chip select RPVEN is set to write only. If RPVEN is also set, the bus cycle is terminated with an access error exception. 9, 1 EXT, External transfer error. This bit is set when an external transfer error is reported to the SIM on TEA. If EXTEN EXTEN is also set, the bus cycle is terminated with an access error exception. 8, 0 SUV, Supervisor/user violation. This bit is set when a user mode access is attempted to an area for which the SUVEN chip select is set to supervisor only. If SUVEN is also set, the bus cycle is terminated with an access error exception. 6.2.5 Power Management Register (PMR) The power management register (PMR), Figure 6-5, is used to control the various low-power options including low-power sleep, low-power stop, and powering down individual on-chip modules. 31 30 27 26 25 24 Field BDMPDN — ENETPDN PLIPDN DRAMPDN Reset 0000_0000 R/W R/W, Supervisor mode only 23 22 21 20 19 18 17 16 Field DMAPDN PWMPDN QSPIPDN TIMERPDN GPIOPDN USBPDN UART1PDN UART0PDN Reset 0000_0000 R/W R/W, Supervisor mode only 15 11 10 9 8 Field — USBWK UART1WK UART0WK Reset 0000_0000 R/W R/W, Supervisor mode only 7 6 5 4 3 0 Field — MOS SLPEN — Reset 0000_0000 R/W R/W, Supervisor mode only Address MBAR+0x008 Figure6-5. Power Management Register (PMR) Table 6-5 describes PMR fields. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 6-7

System Integration Module (SIM) Table6-5. PMR Field Descriptions Bits Field Description 31 BDMPDN Debug power-down enable. Controls the clocking to the debug module. 0 Clock enabled. 1 Clock disabled. 30–27 — Reserved, should be cleared. 26 ENETPDN Ethernet power-down enable. Controls the clocking to the ethernet module. 0 Clock enabled. 1 Clock disabled. 25 PLIPDN PLIC power-down enable. Controls the clocking to the PLIC module. 0 Clock enabled. 1 Clock disabled. 24 DRAMPDN DRAM controller power-down enable. Controls the clocking to the DRAM controller module. 0 Clock enabled. 1 Clock disabled. 23 DMAPDN DMA controller power-down enable. Controls the clocking to the DMA controller module. 0 Clock enabled. 1 Clock disabled. 22 PWMPDN PWM power-down enable. Controls the clocking to the PWM module. 0 Clock enabled. 1 Clock disabled. 21 QSPIPDN QSPI power-down enable. Controls the clocking to the QSPI module. 0 Clock enabled. 1 Clock disabled. 20 TIMERPDN Timer power-down enable. Controls the clocking to the timer module. 0 Clock enabled. 1 Clock disabled. 19 GPIOPDN Parallel port power-down enable. Controls the clocking to the parallel port module. 0 Clock enabled. 1 Clock disabled. 18 USBPDN USB power-down enable. Controls the clocking to the USB module. Clocking to the USB module may be turned on by USD_D+ or INT1/USB_WOR, at which time this bit is automatically cleared. 0 Clock enabled. 1 Clock disabled. 17 UART1PDN UART1 power-down enable. Controls the clocking to the UART1 module. Clocking to the UART1 module may be restored when a change in signal level is detected on UART1RxD, at which time this bit is automatically cleared. 0 Clock enabled. 1 Clock disabled. 16 UART0PDN UART0 power-down enable. Controls the clocking to the UART0 module. Clocking to the UART0 module may be restored when a change in signal level is detected on UART0RxD, at which time this bit is automatically cleared. 0 Clock enabled. 1 Clock disabled. 15-11 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 6-8 Freescale Semiconductor

System Integration Module (SIM) Table6-5. PMR Field Descriptions (continued) Bits Field Description 10 USBWK USB wakeup enable. Allows clocking to the USB module to be restored when a change in signal level is detected on USD_D+ or INT1/USB_WOR. See Table6-6 for a description of the interaction between the PDN and WK bits. 0 Wakeup disabled. 1 Wakeup enabled. USBPDN must also be set. 9 UART1WK UART1 wakeup enable. Allows clocking to the UART1 module to be restored when a change in signal level is detected on UART1RxD. See Table6-6 for a description of the interaction between the PDN and WK bits. 0 Wakeup disabled. 1 Wakeup enabled. UART1PDN must also be set. 8 UART0WK UART0 wakeup enable. Allows clocking to the UART0 module to be restored when a change in signal level is detected on UART0RxD. See Table6-6 for a description of the interaction between the PDN and WK bits. 0 Wakeup disabled. 1 Wakeup enabled. UART0PDN must also be set. 7-6 — Reserved, should be cleared. 5 MOS Main oscillator stop. Allows the MCF5272 to be put into stop mode, in which internal clocking is stopped to the entire processor. To enter stop mode, the user must write to the ALPR and then execute a STOP instruction. See Section6.2.6, “Activate Low-Power Register (ALPR).” It is not necessary to put any on-chip modules in power down mode. After setting this bit, a write access must be made to the ALPR register to actually enter stop mode. D[31:0] are driven low, and other bus signals are negated. Stop mode is exited when an interrupt is detected on one the external interrupt pins, INT[6:1]. 0 Stop mode disabled. 1 Stop mode enabled. 4 SLPEN Sleep enable. Allows the MCF5272 to be put into sleep mode in which internal clocking to the CPU is disabled.To enter sleep mode, the user must write to the ALPR and then execute a STOP instruction. See Section6.2.6, “Activate Low-Power Register (ALPR).” Individual modules may have clocking disabled through the appropriate PDN bits. After SLPEN is set, a write access must be made to ALPR to actually enter sleep mode. D[31:0] are driven low, and other bus signals are negated. Sleep mode is exited when an interrupt is detected from an on-chip peripheral or one of the external interrupt pins, INT[6:1]. 0 Sleep mode disabled. 1 Sleep mode enabled. 3-0 — Reserved, should be cleared. Table 6-6 details the interaction between the PDN and WK bits for the USB and USART modules. Table6-6. USB and USART Power Down Modes PDN WK Description 0 X Module powered up and operating normally. 1 0 Module in power down and can only be reactivated by clearing PDN. 1 1 Module in power down and can be reactivated by clearing PDN or detecting signal on the receive pins. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 6-9

System Integration Module (SIM) 6.2.6 Activate Low-Power Register (ALPR) ALPR, Figure 6-6, is used to put the MCF5272 into a low power mode (sleep or stop). A low-power mode is activated by a write access with any data to ALPR followed by a STOP instruction. 15 0 Field ALPHR Reset 0000_0000_0000_0000 R/W Write only Address MBAR + 0x00E Figure6-6. Activate Low-Power Register (ALPR) The sequence to enter sleep mode is as follows: 1. Set power down and wakeup enable bits in the PMR as desired; set PMR[SLPEN]. 2. Set the CPU interrupt priority level in the status register (SR). Interrupts below this level do not reactivate the CPU. Note that any interrupt will cause the processor to exit low-power mode, but only unmasked interrupts will cause the processor to resume operation. 3. Perform a write access with any data to ALPR. 4. Execute the STOP instruction. This must be the next instruction executed after the write to the ALPR. Sleep mode is exited by an interrupt request from by either an external device or an on-chip peripheral as detailed in Table6-7. The sequence to enter stop mode is: 1. Set PMR[MOS]; clear PMR[SLPEN]. 2. Set the CPU interrupt priority level in the status register (SR). Interrupts below this level do not reactivate the CPU. 3. Perform a write access with any data to ALPR. 4. Execute the STOP instruction. This must be the next instruction executed after the write to the ALPR. Stop mode is exited by an interrupt request from an external device as detailed in Table 6-7. Table6-7. Exiting Sleep and Stop Modes Interrupt Source Exit Sleep Exit Stop USB Wake-on-Ring Interrupts, INT6–INT2 Yes Yes No Interrupt, INT1 Yes Yes Yes USART1, USART2 Yes, interrupt and Rx signal change No No QSPI Yes No No USB Yes, interrupt and Rx signal change No No PLIC Yes, interrupt No No General purpose I/O No No No MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 6-10 Freescale Semiconductor

System Integration Module (SIM) Table6-7. Exiting Sleep and Stop Modes (continued) Interrupt Source Exit Sleep Exit Stop USB Wake-on-Ring General purpose timers Yes, interrupt No No Ethernet Yes, interrupt No No DMA controller Yes, interrupt No No PWM No No No Hardware watchdog timer No No No Software watchdog timer Yes, interrupt No No 6.2.7 Device Identification Register (DIR) The DIR, Figure 6-7, contains a value representing the identification mark for the MCF5272 device. This register contains the same value as the JTAG IDCODE register. The version number field will change if a new revision of the MCF5272 is created. 31 28 27 22 21 12 11 1 0 Field Version Design Center Device Number JEDEC ID — Number Value 0010 0100_01 00_0000_0011 0000_0001_110 1 forK75N R/W Read only Address MBAR+0x010 Figure6-7. Device Identification Register (DIR) Table 6-8 describes the DIR fields. Table6-8. DIR Field Descriptions Bits Description 31–28 Version number. Indicates the revision number of the MCF5272. 27–22 Design center. Indicates the ColdFire design center 21–12 Device number. Indicates an MCF5272 11–1 Indicates the reduced JEDEC ID for Freescale. Joint Electron Device Engineering Council (JEDEC) Publication 106-A and Chapter 11 of the IEEE Standard 1149.1 give more information on this field. 6.2.8 Software Watchdog Timer The software watchdog timer prevents system lockup should the software become trapped in loops with no controlled exit. The software watchdog timer can be enabled or disabled through WRRR[EN]. If enabled, the watchdog timer requires the periodic execution of a software watchdog servicing sequence. If this periodic servicing action does not occur, the timer counts until it reaches the reset timeout value, resulting in a hardware reset with RSTO driven low for 16 clocks. SCR[RSTSRC] is updated to indicate that the software watchdog caused the reset. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 6-11

System Integration Module (SIM) If an interrupt timeout value is programmed in WIRR, and this value is reached prior to the reset timeout value, WER[WIE] is set and a maskable interrupt is issued at the level defined by ICR4[SWTOIPL]. The software watchdog consists of a 15-bit counter with a 15-bit prescaler. It counts up to a maximum of 32768, with a resolution of 32768 clock periods. Thus, at 66 MHz, the resolution of the watchdog is 0.5 msec, with a maximum timeout period of 32768 * 32768 = 230 clock periods or 16.267 S. Timeout = (WRRR +1) * 32768 clocks 6.2.8.1 Watchdog Reset Reference Register (WRRR) The watchdog reset reference register (WRRR), Figure 6-8, contains the reference value for the software watchdog timeout causing a reset. 15 1 0 Field REF EN Reset 1111_1111_1111_1110 R/W R/W Address MBAR + 0x280 Figure6-8. Watchdog Reset Reference Register (WRRR) Table 6-9 describes WRRR fields. Table6-9. WRRR Field Descriptions Bits Field Description 15–1 REF Reference value. This field determines the reset timeout value.Reset initializes this register to 0xFFFE, disabling the watchdog timer and setting it to the maximum timeout value. 0 EN Enable watchdog. When enabled, software should periodically write to WCR to avoid reaching the reset reference value. 0 Watchdog timer disabled. 1 Watchdog timer enabled. 6.2.8.2 Watchdog Interrupt Reference Register (WIRR) The watchdog interrupt reference register (WIRR), Figure 6-9, contains the reference value for the software watchdog timeout causing an interrupt. 15 1 0 Field REF IEN Reset 1111_1111_1111_1110 R/W R/W Address MBAR + 0x284 Figure6-9. Watchdog Interrupt Reference Register (WIRR) Table 6-10 describes WIRR fields. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 6-12 Freescale Semiconductor

System Integration Module (SIM) Table6-10. WIRR Field Descriptions Bits Field Description 15-1 REF Reference value. Contains the reference value for the watchdog timeout causing an interrupt. 0 IEN Enable interrupt. When enabled, software should periodically write to WCR to avoid reaching the interrupt reference value. 0 Disable interrupt. 1 Enable interrupt upon reaching interrupt reference value. If IEN is set when WER[WIE] = 1, an immediate interrupt occurs. 6.2.8.3 Watchdog Counter Register (WCR) The WCR, Figure 6-10, contains the 16 most significant bits of the software watchdog counter. Writing any value to WCR resets the counter and prescaler and should be executed on a regular basis if the watchdog is enabled. 15 0 Field COUNT Reset 0000_0000_0000_0000 R/W R/W Address MBAR + 0x288 Figure6-10. Watchdog Counter Register (WCR) 6.2.8.4 Watchdog Event Register (WER) The WER, Figure 6-11, reports when the watchdog timer reaches the WIRR value. 15 1 0 Field — WIE Reset 0000_0000_0000_0000 R/W R/W Address MBAR + 0x28C Figure6-11. Watchdog Event Register (WER) Table 6-11 describes WER fields. Table6-11. WER Field Descriptions Bits Field Description 15–1 — Reserved, should be cleared. 0 WIE Watchdog interrupt event. 0 WIRR value has not been reached. 1 WIRR value has been reached. WIE is cleared by writing a 1 to it. The timer does not negate the interrupt request to the interrupt controller until WIE is cleared. WIE is set regardless of the state of WIRR[IEN]; however, an interrupt is not asserted to the controller unless WIRR[IEN] = 1. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 6-13

System Integration Module (SIM) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 6-14 Freescale Semiconductor

Chapter 7 Interrupt Controller This chapter describes the operation of the interrupt controller portion of the system integration module (SIM). It includes descriptions of the registers in the interrupt controller memory map and the interrupt priority scheme. 7.1 Overview The SIM provides a centralized interrupt controller for all MCF5272 interrupt sources, which consist of the following: • External interrupts INT[6:1] • Timer modules • UART modules • PLIC module • USB module • DMA module • Ethernet module • QSPI module • Software watchdog timer (SWT) Figure 7-1 is a block diagram of the interrupt controller. The SIM provides the following registers for managing interrupts: • Four interrupt control registers (ICR1–ICR4), which are used to assign interrupt levels to the interrupt sources. • The interrupt source register (ISR) allows reading the instantaneous value of each interrupt source. • The programmable interrupt transition register (PITR) specifies the triggering transition of the external interrupt inputs. • The programmable interrupt wakeup register (PIWR) specifies which interrupt sources can reactivate the CPU from low-power sleep or stop mode. • The programmable interrupt vector register (PIVR) specifies which vector number is returned in response to an interrupt acknowledge cycle. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 7-1

Interrupt Controller PLIC QSPI SYSTEM INTEGRATION MODULE (SIM) DMA USB Software Watchdog Interrupt Controller Ethernet 4 ICRs ISR Two UARTs PITR PIWR Four PIVR General- Purpose Timers 6 INT[1:6] Figure7-1. Interrupt Controller Block Diagram 7.2 Interrupt Controller Registers The interrupt controller register portion of the SIM memory map is shown in Table 7-1. Table7-1. Interrupt Controller Registers MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x020 Interrupt control register 1 (ICR1) [p. 7-4] 0x024 Interrupt control register 2 (ICR2) [p. 7-5] 0x028 Interrupt control register 3 (ICR3) [p. 7-5] 0x02C Interrupt control register 4 (ICR4) [p. 7-5] 0x030 Interrupt source register (ISR) [p. 7-6] 0x034 Programmable interrupt transition register (PITR) [p. 7-8] 0x038 Programmable interrupt wakeup register (PIWR) [p. 7-9] 0x03C Reserved Programmable interrupt vector register (PIVR) [p. 7-9] All external interrupt inputs are edge sensitive, with the active edge being programmable through PITR. An interrupt must remain asserted for at least three consecutive rising edges of CPU_ExtCLK to be considered valid. The priority level of each interrupt source is programmed through the ICRs. The MCF5272 does not support auto-vectored interrupts. Interrupt service routines for all interrupts should have vectors in the user-defined interrupt region of the vector table (vectors 64–255). The location of these vectors is programmable through the PIVR. For more information on the servicing of interrupts, see MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 7-2 Freescale Semiconductor

Interrupt Controller Chapter 2, “ColdFire Core.” Pending interrupts from external sources (INT[6:1]) can be cleared using the ICRs. For an interrupt to be successfully processed, stack RAM must be available. A programmable chip select is often used for the RAM, in which case, the RAM is not immediately available at startup. Thus, no interrupts are recognized until PIVR is initialized. The RAM chip select and system stack should be set up before this initialization. If more than one interrupt source has the same interrupt priority level (IPL), the interrupt controller daisy chains the interrupts with the priority order following the bit placement in the PIWR, with INT1 having the highest priority and SWTO having the lowest priority, as shown in Figure 7-8. 7.2.1 Interrupt Controller Registers This section describes the registers associated with the interrupt controller. Table 7-2 gives the nomenclature used for the interrupt and power management registers. Table7-2. Interrupt and Power Management Register Mnemonics Mnemonic or Portion Thereof Description INT1, INT2, INT3, INT4, INT5, INT6 External interrupt signals 1–6. TMR0, TMR1, TMR2, TMR3 Timers 3–0 from timer module USB0, USB1, USB2, USB3, USB4, USB5, USB endpoint 0–7 USB6, USB7 UART1, UART2 UART1, UART2 modules PLIP PLIC 2-KHz periodic interrupt, 2B+D data PLIA PLIC asynchronous and maintenance channels interrupt DMA DMA controller interrupt ETx Ethernet module transmit data interrupt ERx Ethernet module receive data interrupt ENTC Ethernet module non-time-critical interrupt QSPI Queued serial peripheral interface IPL2, IPL1, IPL0 Interrupt priority level bits 2–0 PI Pending interrupt PDN Power down enable WK Wakeup enable SWTO Software watchdog timer time out MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 7-3

Interrupt Controller 7.2.2 Interrupt Control Registers (ICR1–ICR4) ICR1–ICR4 are used to configure interrupts from various on- and off-chip sources. When read, the data is the last value written to the register with the exception of the PI bits, which are transitory functions. These registers can be accessed as 8-, 16-, or 32-bit registers. An 8- or 16-bit write leaves the remaining bits intact. To avoid altering other IPL fields when resetting interrupts generated by INT[6:1], read the required byte, word, or longword from the appropriate ICR, AND.B/W/L its value with a mask whose IPL bits are all 1 and whose PI bits are 1 for those sources whose PI bit is to be reset and 0 for those sources whose PI bit is to be left unchanged. 7.2.2.1 Interrupt Control Register 1 (ICR1) ICR1, Figure 7-2, is used to configure interrupts from various on- and off-chip sources. 31 30 28 27 26 24 23 22 20 19 18 16 Field INT1PI INT1IPL INT2PI INT2IPL INT3PI INT3IPL INT4PI INT4IPL Reset 0000_0000_0000_0000 15 14 12 11 10 8 7 6 4 3 2 0 Field TMR0PI TMR0IPL TMR1PI TMR1IPL TMR2PI TMR2IPL TMR3PI TMR3IPL Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x020 Figure7-2. Interrupt Control Register 1 (ICR1) Table 7-3 describes ICR1 fields. Table7-3. ICR Field Descriptions Bits Name Description 31, 27, PI Pending interrupt. Writing a 1 enables the value for the corresponding IPL field to be set. Note: for 23, 19, external interrupts only, writing a one to this bit clears the corresponding interrupt latch. The external 15, 11, 7, interrupt must be toggled before another interrupt is latched. For all on-chip interrupt sources, this bit 3 is cleared when the interrupt is cleared in the module registers. 0 No interrupt pending 1 An interrupt is pending. 30–28, IPL Interrupt priority level. Specifies the IPL for the corresponding interrupt source. This field can be 26–24, changed only when a 1 is simultaneously written to the corresponding PI bit. 22–20, 000 The corresponding INT source is inhibited and cannot generate interrupts. The state of the signal 18–16, can still be read in the ISR. 14-12, 001–111The corresponding INT source is enabled and generates an interrupt with the indicated priority 10–8, level. 6–4, 2–0 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 7-4 Freescale Semiconductor

Interrupt Controller 7.2.2.2 Interrupt Control Register 2 (ICR2) ICR2, Figure 7-3, is used to configure interrupts from various on-chip sources. 31 30 28 27 26 24 23 22 20 19 18 16 Field UART1PI UART11IPL UART2PI UART2IPL PLIPPI PLIPIPL PLIAPI PLIAIPL Reset 0000_0000_0000_0000 15 14 12 11 10 8 7 6 4 3 2 0 Field USB0PI USB0IPL USB1PI USB1IPL USB2PI USB2IPL USB3PI USB3IPL Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x024 Figure7-3. Interrupt Control Register 2 (ICR2) Table 7-3 describes ICR2 fields. 7.2.2.3 Interrupt Control Register 3 (ICR3) ICR3, Figure 7-4, is used to configure interrupts from various on-chip sources. 31 30 28 27 26 24 23 22 20 19 18 16 Field USB4PI USB41IPL USB5PI USB5IPL USB6PI USB6IPL USB7PI USB7IPL Reset 0000_0000_0000_0000 15 14 12 11 10 8 7 6 4 3 2 0 Field DMAPI DMAIPL ERXPI ERXIPL ETXPI ETXIPL ENTCPI ENTCIPL Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x028 Figure7-4. Interrupt Control Register 3 (ICR3) Table 7-3 describes ICR3 fields. 7.2.2.4 Interrupt Control Register 4 (ICR4) ICR4, Figure 7-5, is used to configure interrupts from various on-chip sources. 31 30 28 27 26 24 23 22 20 19 18 16 Field QSPIPI QSPIIPL INT5PI INT5IPL INT6PI INT6IPL SWTOPI SWTOIPL Reset 0000_0000_0000_0000 15 0 Field — Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x02C Figure7-5. Interrupt Control Register 4(ICR4) Table 7-3 describes ICR4 fields. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 7-5

Interrupt Controller 7.2.3 Interrupt Source Register (ISR) The interrupt source register (ISR), Figure7-6, is used to read the instantaneous value of all interrupt sources, both internal and external. Note that the register bits give the value of the interrupt source prior to input synchronization or polarity correction. 31 30 29 28 27 26 25 24 Field INT1 INT2 INT3 INT4 TMR0 TMR1 TMR2 TMR3 Reset XXXX_1111 R/W Read only 23 22 21 20 19 18 17 16 Field UART1 UART2 PLI_P PLI_A USB0 USB1 USB2 USB3 Reset 1111_1111 R/W Read only 15 14 13 12 11 10 9 8 Field USB4 USB5 USB6 USB7 DMA ERx ETx ENTC Reset 1111_1111 R/W Read only 7 6 5 4 3 0 Field QSPI INT5 INT6 SWTO — Reset 1XX1_0000 R/W Read only Address MBAR+0x030 Figure7-6. Interrupt Source Register (ISR) Table 7-4 describes ISR fields. Table7-4. ISR Field Descriptions Bits Field Description 31–4 — 0 Interrupt source is high. 1 Interrupt source is low. 3–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 7-6 Freescale Semiconductor

Interrupt Controller 7.2.4 Programmable Interrupt Transition Register (PITR) The programmable interrupt transition register (PITR), Figure 7-7, specifies the triggering (either high-to-low or low-to-high) on each of the external interrupt inputs. 31 30 29 28 27 16 Field INT1 INT2 INT3 INT4 — Reset 0000_0000_0000_0000 15 7 6 5 4 0 Field — INT5 INT6 — Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x034 Figure7-7. Programmable Interrupt Transition Register (PITR) Table 7-5 describes PITR fields. Table7-5. PITR Field Descriptions Bits Name Description 31–28, — 0 Triggering edge of external interrupt input is high-to-low (negative edge triggered). 6, 5 1 Triggering edge of external interrupt input is low -to-high (positive edge triggered). 27–7, — Reserved, should be cleared. 4–0 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 7-7

Interrupt Controller 7.2.5 Programmable Interrupt Wakeup Register (PIWR) The programmable interrupt wakeup register (PIWR), Figure 7-8, is used to specify which interrupt sources are capable of causing the CPU to wake up from low-power SLEEP or STOP modes when their source is active. All sources are disabled on reset. Note that only the external interrupt pins INT[6:1] can wake up the CPU from STOP mode. If more than one interrupt source has the same interrupt priority level (IPL) programmed in the ICRs, the interrupt controller daisy chains the interrupts with the priority order following the bit placement in the PIWR, with INT1 having the highest priority and SWTO having the lowest priority as shown in Figure 7-8. 31 30 29 28 27 26 25 24 Field INT1 INT2 INT3 INT4 TMR0 TMR1 TMR2 TMR3 Reset 1111_1111 R/W R/W 23 22 21 20 19 18 17 16 Field UART1 UART2 PLI_P PLI_A USB0 USB1 USB2 USB3 Reset 1111_1111 R/W R/W 15 14 13 12 11 10 9 8 Field USB4 USB5 USB6 USB7 DMA ERx ETx ENTC Reset 1111_1111 R/W R/W 7 6 5 4 3 0 Field QSPI INT5 INT6 SWTO — Reset 1111_0000 R/W R/W Address MBAR+0x038 Figure7-8. Programmable Interrupt Wakeup Register (PIWR) Table 7-6 describes PIWR fields. Table7-6. PIWR Field Descriptions Bits Field Description 31–4 — 0 Interrupt cannot wake up the CPU when interrupt source is active. 1 Interrupt wakes up the CPU from low-power modes. 3–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 7-8 Freescale Semiconductor

Interrupt Controller 7.2.6 Programmable Interrupt Vector Register (PIVR) The programmable interrupt vector register (PIVR), Figure 7-9, specifies the vector numbers the interrupt controller returns in response to interrupt acknowledge cycles for the various peripherals and discrete interrupt sources. Pending interrupts are presented to the processor core in order of priority from highest to lowest. The core responds to an interrupt request by initiating an interrupt acknowledge cycle to receive a vector number, which allows the core to locate the interrupt’s service routine. The interrupt controller is able to identify the source of the highest priority interrupt that is being acknowledged and provide the interrupt vector to the core. The three most significant bits of the interrupt vector are programmed by the user in the PIVR. The lower five bits are provided by the interrupt controller, depending on the source, as shown in Table 7-7. If the core initiates an interrupt acknowledge cycle prior to the PIVR being programmed, the interrupt controller returns the uninitialized interrupt vector (0x0F). If the core initiates an interrupt acknowledge cycle after the PIVR has been initialized, but there is no interrupt pending, the interrupt controller returns the user a spurious interrupt vector (0xxxx0_0000). Because the interrupt controller responds to all interrupt acknowledges, a bus error situation cannot occur during an interrupt-acknowledge cycle. 7 5 4 0 Field IV — Reset 0000_1111 R/W R/W Address MBAR + 0x03F Figure7-9. Programmable Interrupt Vector Register (PIVR) Table 7-7 describes PIVR fields. Table7-7. PIVR Field Descriptions Bits Field Description 7-5 IV These bits provide the high three bits of the interrupt vector for interrupt acknowledge cycles from all sources. To conform to the core interrupt vector allocation, these bits should be set equal to or greater than 010. See Table2-3. 4-0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 7-9

Interrupt Controller Table 7-8 lists the values for the five least significant bits of the interrupt vector. The vector numbers shown assume PIVR[IV]=0b010. If another value of PIVR[IV] is used, the vector numbers would change accordingly. Table7-8. MCF5272 Interrupt Vector Table Vector Number Bits 4–0 Source Function 64 00000 Reserved User Spurious Interrupt 65 00001 INT1 External Interrupt Input 1 66 00010 INT2 External Interrupt Input 2 67 00011 INT3 External Interrupt Input 3 68 00100 INT4 External Interrupt Input 4 69 00101 TMR0 Timer 0 70 00110 TMR1 Timer 1 71 00111 TMR2 Timer 2 72 01000 TMR3 Timer 3 73 01001 UART1 UART 1 74 01010 UART2 UART 2 75 01011 PLIP PLIC 2KHz Periodic 76 01100 PLIA PLIC Asynchronous 77 01101 USB0 USB Endpoint 0 78 01110 USB1 USB Endpoint 1 79 01111 USB2 USB Endpoint 2 80 10000 USB3 USB Endpoint 3 81 10001 USB4 USB Endpoint 4 82 10010 USB5 USB Endpoint 5 83 10011 USB6 USB Endpoint 6 84 10100 USB7 USB Endpoint 7 85 10101 DMA DMA Controller 86 10110 ERx Ethernet Receiver 87 10111 ETx Ethernet Transmitter 88 11000 ENTC Ethernet Module Non-time-critical 89 11001 QSPI Queued Serial Peripheral Interface 90 11010 INT5 External Interrupt Input 5 91 11011 INT6 External Interrupt Input 6 92 11100 SWTO Software Watchdog Timer Timeout 93 11101 Reserved Reserved 94 11110 Reserved Reserved 95 11111 Reserved Reserved MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 7-10 Freescale Semiconductor

Chapter 8 Chip Select Module This chapter describes the chip select module, including the chip select registers, the configuration and behavior of the chip select signals, and the global chip select functions. 8.1 Overview The chip select module provides user-programmable control of the eight chip select and four byte strobe outputs. This subsection describes the operation and programming model of the chip select registers, including the chip select base and option registers. 8.1.1 Features The following list summarizes the key chip select features: • Eight dedicated programmable chip selects • Address masking for memory block sizes from 4 Kbytes to 2 Gbytes • Programmable wait states and port sizes • Programmable address setup • Programmable address hold for read and write • SDRAM controller interface supported with CS7/SDCS • Global chip select functionality 8.1.2 Chip Select Usage Each of the eight chip selects, CS0–CS7, is configurable for external SRAM, ROM, and peripherals. CS0 is used to access external boot ROM and is enabled after a reset. The data bus width of the external ROM must be configured at reset by having appropriate pull-down resistors on QSPI_CLK/BUSW1 and QSPI_CS0/BUSW0. At reset these two signals replace the bus width field in the chip select 0 base register (CSBR0[BW]). CS7 must be used for enabling an external SDRAM array. In this mode, it is referred to as SDCS. NOTE A detailed description of each bus access type supported by the MCF5272 device is given in Chapter20, “Bus Operation.” MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 8-1

Chip Select Module 8.1.3 Boot CS0 Operation CS0 is enabled after reset and is used to access boot ROM. The memory port width of CS0 is defined by the state of QSPI_CLK/BUSW1 and QSPI_CS0/BUSW0. These two bits should be configured to define the width of the boot ROM connected to CS0, as described in Section19.18, “Operating Mode Configuration Pins.” 8.2 Chip Select Registers Each chip select is controlled through two 32-bit registers. The chip select base registers (CSBR0–CSBR7) are used to enable the chip select and to configure the base address, port size, bus interface type, and address space. The chip select option registers (CSOR0–CSOR7) are used to configure the address mask, additional setup/hold, extended burst capability, wait states, and read/write access. Table8-1. CSCR and CSOR Values after Reset Offset Name Chip Select Register Reset + 0x040 CSBR0 CS base register 0 0x0000_0x011 + 0x044 CSOR0 CS option register 0 0xFFFF_F078 + 0x048 CSBR1 CS base register 1 0x0000_1300 + 0x04C CSOR1 CS option register 1 0xFFFF_F078 + 0x050 CSBR2 CS base register 2 0x0000_2300 + 0x054 CSOR2 CS option register 2 0xFFFF_F078 + 0x058 CSBR3 CS base register 3 0x0000_3300 + 0x05C CSOR3 CS option register 3 0xFFFF_F078 + 0x060 CSBR4 CS base register 4 0x0000_4300 + 0x064 CSOR4 CS option register 4 0xFFFF_F078 + 0x068 CSBR5 CS base register 5 0x0000_5300 + 0x06C CSOR5 CS option register 5 0xFFFF_F078 + 0x070 CSBR6 CS base register 6 0x0000_6300 + 0x074 CSOR6 CS option register 6 0xFFFF_F078 + 0x078 CSBR7 CS base register 7 0x0000_7700 + 0x07C CSOR7 CS option register 7 0xFFFF_F078 1 The nibble shown as x resets as 00xx, where the undefined bits represent the BW field. QSPI_CS0/BUSW0 and QSPI_CLK/BUSW1 program the bus width for CS0 at reset MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 8-2 Freescale Semiconductor

Chip Select Module 8.2.1 Chip Select Base Registers (CSBR0–CSBR7) The CSBRs, Figure8-1, provide a model internal bus cycle against which to match actual bus cycles to determine whether a specific chip select should assert. A bus cycle in a specific chip select register causes the assertion of the corresponding external chip select. 31 12 11 10 9 8 7 6 5 4 2 1 0 Field BA EBI BW SUPER TT TM CTM ENABLE Reset CSBR0: 0x0000_0x011; CSBR1: 0x0000_1300; CSBR2: 0x0000_2300; CSBR3: 0x0000_3300; CSBR4: 0x0000_4300; CSBR5: 0x0000_5300; CSBR6: 0x0000_6300; CSBR7: 0x0000_7700 R/W R/W Addr 0x040 (CSBR0); 0x048 (CSBR1); 0x050 (CSBR2); 0x058 (CSBR3); 0x060 (CSBR4); 0x068 (CSBR5); 0x070 (CSBR6); 0x078 (CSBR7) Figure8-1. Chip Select Base Registers (CSBRn) Table 8-2 describes CSBRn fields. Table8-2. CSBRn Field Descriptions Bits Name Description 31–12 BA Base address. The starting address of the memory space covered by the chip select. BA is compared with bits 31–12 of the access to determine whether the current bus cycle is intended for this chip select. Any combination of BA bits can be masked in the associated CSOR. 11–10 EBI External bus interface modes. These modes are used to multiplex outputs and determine timing of the appropriate bus interface module onto the device pins. 00 16-/32-bit SRAM/ROM. For 16-/32-bit wide memory devices with byte strobe inputs. CSBR0[EBI] = 00 at reset. Affects all chip selects. 01 SDRAM. One physical bank of SDRAM consisting of 16–256 Mbit devices. CSOR7[WS] must be set to 0x1F. Affects only CS7/SDCS. 10 Reserved 11 Use SRAM/ROM timing for 8-bit devices without byte strobe inputs. 9–8 BW Bus width. Determines data bus size of the memory-mapped resource for all chip selects except CS0. It is assumed that boot code for the processor is accessed through the global chip select CS0, so the initial bus width for this chip select must be configured at reset. QSPI_CS0/BUSW0 and QSPI_CLK/BUSW1 are used to program the bus width for CS0 at reset. 00 Longword (32 bits) 01 Byte (8 bits) 10 Word (16 bits) 11 Cache line (32 bits) 7 SUPER Supervisor mode. 0 Bus cycle may be in user or supervisor mode (neglecting conditions imposed by setting CTM). 1 The chip select asserts a match only if the transfer modifier indicates a supervisor mode access. A user access matching BA causes an access error. SUPER, CTM, TT, and TM are used to restrict bus access. For example, if TT and TM indicate a user data access and SUPER and CTM are both set, no accesses can occur. 6–5 TT Transfer type. TT and TM may be used to further qualify the address match. If CTM is set, TT and TM must match the access types for the chip select to assert. See the description of TM. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 8-3

Chip Select Module Table8-2. CSBRn Field Descriptions (continued) Bits Name Description 4–2 TM Transfer modifier. Operates with TT to determine the access type. TT TM Function 0x 000 Reserved 0x 001 User data access 0x 010 User instruction access 0x 011–100 Reserved 0x 101 Supervisor data access 0x 110 Supervisor instruction access 0x 111 Reserved 10 000–100 Reserved 10 101 Emulator mode data access 10 110 Emulator mode instruction access 10 111 Reserved 11 000 CPU space access 11 001 Interrupt acknowledge level 1 11 010 Interrupt acknowledge level 2 11 011 Interrupt acknowledge level 3 11 100 Interrupt acknowledge level 4 11 101 Interrupt acknowledge level 5 11 110 Interrupt acknowledge level 6 11 111 Interrupt acknowledge level 7 1 CTM Compare TM. Enables comparison between the access type and the TM and TT bits. 0 TT and TM register bits do not affect address match. 1 TT and TM register bits must match the access type for an address match to occur. 0 ENABLE Enable. Disables/enables the chip select. When disabled, the chip select is never asserted, regardless of the address on the internal bus. ENABLE is 0 at reset, except CS0 which is 1. 0 Chip select is disabled, no matches can occur and chip select output cannot assert. 1 Chip select is enabled, bus cycles are compared against register contents. Table 8-3 describes the interaction between CSBRn[EBI], OE/RD, R/W, and SDWE. Table8-3. Output Read/Write Strobe Levels versus Chip Select EBI Code EBI EBI Function Access Type OE/RD R/W SDWE 00 SRAM, ROM Write High Low High Read Low High High 01 SDRAM Write High High Low Read High High High 11 SRAM, ROM Write High Low High Read Low High High NOTE The MCF5272 compares the address for the current bus transfer with the address and mask bits in the CSBRs and CSORs looking for a match. The priority is listed in Table 8-4 (from highest priority to lowest priority): MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 8-4 Freescale Semiconductor

Chip Select Module Table8-4. Chip Select Memory Address Decoding Priority Priority Chip Select Highest Chip select 0 Chip select 1 Chip select 2 Chip select 3 Chip select 4 Chip select 5 Chip select 6 Lowest Chip select 7 8.2.2 Chip Select Option Registers (CSOR0–CSOR7) CSOR0–CSOR7, Figure 8-2, are used to configure the address mask, additional setup/hold, extended burst capability, wait states, and read/write access. 31 12 11 10 9 8 7 6 2 1 0 Field BAM ASET WRAH RDAH EXTBURST — WS RW MRW Reset 0xFFFF_F078 R/W R/W Addr 0x044 (CSOR0); 0x04C (CSOR1); 0x054 (CSOR2); 0x05C (CSOR3); 0x064 (CSOR4); 0x06C (CSOR5); 0x074 (CSOR6); 0x07C (CSOR7) Figure8-2. Chip Select Option Registers (CSORn) Table 8-5 describes CSORn fields. Table8-5. CSORn Field Descriptions Name Name Description 31–12 BAM Address mask. Masks equivalent CSOR[BA] bits. The BAM setting chooses which BA bits to compare with the corresponding address bit to determine a match. 0 Mask address bit 1 Compare address bit 11 ASET Address setup enable. Controls assertion of chip select with respect to assertion of a valid address that hits in the chip select address space. 0 Assert chip select on the rising edge of CLK that address is asserted. 1 Delay assertion of chip select for one CLK cycle after address is asserted. During write transfers, both chip select and R/W are delayed by 1 clock cycle. R/W asserts 1 clock cycle after assertion of the chip select. 10 WRAH Controls the address, data, and attribute hold time after the termination, internal or external with TA, of a write cycle that hits in the chip select address space. 0 Do not hold address, data, and attribute signals an extra cycle after chip select and R/W negate on writes. 1 Hold address, data, and attribute signals an extra cycle after CSx and R/W negate on writes. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 8-5

Chip Select Module Table8-5. CSORn Field Descriptions (continued) Name Name Description 9 RDAH Controls the address and attribute hold time after the termination, internal or external with TA, of a read cycle that hits in the chip select address space. 0 Do not hold address and attribute signals an extra cycle after chip select negates on reads. 1 Hold address and attribute signals an extra cycle after chip select negate on reads. 8 EXTBURST Enable extended burst. Valid only for CS7. Reserved bit for CS[0:5]. EXTBURST should be 1 when external SDRAM is configured for a data bus narrower than the width programmed for the MCF5272. EBI must be set for SDRAM and the BW must be set to the data bus width of the external SDRAM array. Example: If the MCF5272 external physical data bus width is 32 or 16 bits but the external SDRAM is 16 bits wide, EXTBURST must be set and BW must be 10 (word) for SDCS. 0 Extended bursts are not enabled. 1 Extended bursts are enabled. 7 — Reserved, should be cleared. 6–2 WS Wait state generator. Specifies the number of wait states (in system clocks) needed before the SIM generates an internal transfer acknowledge signal to terminate the access. 0x00 No wait states 0x01 1 wait state ... 0x1E 30 wait states 0x1F External access For example, WS = 0x0A introduces a 10-clock wait before the bus cycle terminates; 0x1F indicates a source external to the chip select module terminates the access. For SRAM and ROM accesses EBI codes 00 or 11 and WS = 0x1F, TA must be driven from an external source to terminate the bus cycle, otherwise the on-chip bus timeout monitor issues a bus error exception. For SRAM and ROM accesses with EBI = 00 or 11 and WS = 0x00–0x1E, the chip select module terminates the bus cycle after the programmed number of system clocks. For SDRAM accesses with SDCS, EBI = 01, and WS = 0x1F, bus cycles are terminated under control of the SDRAM controller. The CSOR0[WS] reset default is 0x1E. The default for all other CSORs is 0x00. Caution: Never drive TA as an input to terminate SDRAM peripheral accesses. 1 RW RW and MRW determine whether the selected memory region is read only or write only. 0 Read only 1 Write only 0 MRW MRW must be set for value of RW be taken into consideration. 0 Memory covered by chip select is read/write. The memory covered by the chip select is neither read nor write protected. 1 RW determines whether memory covered by chip select is read only or write only. A conflict causes either a read or write protect violation. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 8-6 Freescale Semiconductor

Chapter 9 SDRAM Controller This chapter describes configuration and operation of the synchronous DRAM controller component of the SIM including a general description of signals involved in SDRAM operations. It provides interface information for memory configurations using most common SDRAM devices for both 16- and 32-bit wide data buses. The chapter concludes with signal timing diagrams. 9.1 Overview The MCF5272 incorporates an SDRAM controller, whose main features are as follows: • Glueless interface to a variety of JEDEC-compliant SDRAM devices. • MCF5272 data bus width of 16 or 32 bits to SDRAM memory array • 16- to 256-Mbit device support • Dedicated bank address pins to provide pin out compatibility for different SDRAM sizes with a single printed circuit board layout • Page size from 256–1024 column address locations • 6-1-1-1 timing for burst-read; 3-1-1-1 timing for burst-write accesses (assuming a page hit at 66 MHz) • CAS latencies of 1 and 2 • Up to four concurrently activated banks • SDRAM power down and self refresh • Refresh timer prescaler supports system clock down to 5 MHz maintaining a 15.6-µS refresh cycle • Auto initialization of SDRAM 9.2 SDRAM Controller Signals The SDRAM controller provides all required signals for glueless interfacing to a variety of JEDEC-compliant SDRAM devices. RAS/CAS address multiplexing and the SDRAM pin A10 auto-precharge function is software configurable for different page sizes. To maintain refresh capability without conflicting with concurrent accesses on the address and data buses, RAS0, CAS0, SDWE, SDBA[0:1], SDCLKE, A10_PRECHG, and the SDRAM bank selects are dedicated SDRAM signals. Figure 9-1 shows the SDRAM controller signal configuration. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-1

SDRAM Controller SDRAM Controller 1 SDRAMCS/CS7 1 RAS0 1 CAS0 1 SDWE 4 BS[3:0] 2 SDBA[1:0] 1 SDCLKE 1 SDCLK 1 A10_PRECHG Address Multiplexer Internal 32-Bit Address Bus 8 A[22:15] 10 A[11:2]/SDA[9:0] 2 A[14:13/SDA[12:11] Dynamic Bus Sizer 32 D[31:0] Figure9-1. SDRAM Controller Signals Table 9-1 describes SDRAM controller signals. Table9-1. SDRAM Controller Signal Descriptions Signal Description A10_PRECHG A10 precharge strobe. A precharge cycle occurs only after a page miss. During precharge, the SDRAM writes the designated on-chip RAM page buffer back into the SDRAM array. Precharge latency is set in SDTR[RP]. The reset value is 2 cycles, RP = 01. BS[3:0] For SDRAM devices, these outputs should be connected to individual DQM signals. During SDRAM accesses, these signals indicate a byte transfer between SDRAM and the MCF5272 when asserted. Note that most SDRAMs associate DQM3 with the MSB, in which case BS3 should be connected to the SDRAM's DQM3 input, and so forth. CAS0 SDRAM column address strobe output DRESETEN DRESETEN is asserted to indicate that the SDRAM controller is to be reset whenever RSTI asserts. If DRESETEN is negated, RSTI does not affect the SDRAM controller, which continues to refresh external memory. This is useful for debug situations where a reset of the device is required without losing data located in SDRAM. DRESETEN is normally tied high or low depending on system requirements. It should never be tied to RSTI or RSTO. RAS0 SDRAM row address strobe output SDA[13:0]/ Fourteen address signals are multiplexed to form SDRAM_ADR[13:0], which are used for connecting A[22:0] to SDRAM devices as large as 256 Mbits. SDRAM can be configured for 16- or 32-bit wide interface to the MCF5272 data bus. For an SDRAM array with a 32-bit data bus, SDRAM address signals are multiplexed starting with A2. For a 16-bit data bus, address signals are multiplexed starting with A1. SDBA[1:0] SDRAM controller bank address select outputs. Assigned to internal high-order address signals by programming SDCR[BALOC]. This allows using SDRAM devices of different sizes without changing the board layout. See Table9-7. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-2 Freescale Semiconductor

SDRAM Controller Table9-1. SDRAM Controller Signal Descriptions (continued) Signal Description SDCLK SDRAM (bus) clock (same frequency as CPU clock). This dedicated output reduces setup and hold time uncertainty due to process and temperature variations. SDCLK is disabled for SDRAM power-down mode. SDCLKE SDRAM clock enable SDRAMCS/CS7 SDRAM chip select/CS7. The SDRAM is assigned to CS7 (SDRAMCS) of the device chip select module. SDWE SDRAM write enable Figure 9-2 is the pinout of a 16-bit SDRAM in a 54-pin TSOP (thin, small-outline package) package. Size can vary from 16–256 Mbits. 64 Mbit 128 Mbit 256 Mbit VDD VDD VDD GND GND GND 1 54 DQ0 DQ0 DQ0 DQ15 DQ15 DQ15 2 53 VDD VDD VDD GND GND GND 3 52 DQ1 DQ1 DQ1 DQ14 DQ14 DQ14 4 51 DQ2 DQ2 DQ2 DQ13 DQ13 DQ13 5 50 GND GND GND VDD VDD VDD 6 49 DQ3 DQ3 DQ3 DQ12 DQ12 DQ12 7 48 DQ4 DQ4 DQ4 DQ11 DQ11 DQ11 8 47 VDD VDD VDD GND GND GND 9 46 DQ5 DQ5 DQ5 DQ10 DQ10 DQ10 10 45 DQ6 DQ6 DQ6 DQ9 DQ9 DQ9 11 44 GND GND GND VDD VDD VDD 12 43 DQ7 DQ7 DQ7 DQ8 DQ8 DQ8 13 42 VDD VDD VDD GND GND GND 14 41 DQML DQML DQML NC NC NC 15 40 R/W R/W R/W DQMH DQMH DQMH 16 39 CAS CAS CAS CLK CLK CLK 17 38 RAS RAS RAS CKE CKE CKE 18 37 CS CS CS A12 A12 A12 19 36 BA0 BA0 BA0 A11 A11 A11 20 35 BA1 BA1 BA1 A9 A9 A9 21 34 A10 A10 A10 A8 A8 A8 22 33 A0 A0 A0 A7 A7 A7 23 32 A1 A1 A1 A6 A6 A6 24 31 A2 A2 A2 A5 A5 A5 25 30 A3 A3 A3 A4 A4 A4 26 29 VDD VDD VDD GND GND GND 27 28 Figure9-2. 54-Pin TSOP SDRAM Pin Definition MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-3

SDRAM Controller Table 9-2 shows how BS[3:0] should be connected to DQMx for 16- and 32-bit SDRAM configurations. Table9-2. Connecting BS[3:0] to DQMx 5272 SDRAM Data Signals 16 Bit 32 Bit 16 Bit 32 Bit (2 x 16) 32 Bit (1 x 32) BS3 BS3 DQMH DQMH DQM3 D[31:24] BS2 BS2 DQML DQML DQM2 D[23:16] NC BS1 NC DQMH DQM1 D[15:8] NC BS0 NC DQML DQM0 D[7:0] 9.3 Interface to SDRAM Devices The following tables describes possible memory configurations using most common SDRAM devices for 16- and 32-bit wide data buses. Table9-3. Configurations for 16-Bit Data Bus 8-Bit 16-Bit Parameter 16 Mbits 64 Mbits 16 Mbits 64 Mbits 128 Mbits 256 Mbits Number of devices 2 1 Total size 4 Mbytes 16 Mbytes 2 Mbytes 8 Mbytes 16 Mbytes 32 Mbytes Total page size 1 Kbyte 1 Kbyte 512 Kbytes 512 Kbytes 1 Kbyte 1 Kbyte Number of banks 2 4 2 4 4 4 Refresh count in 64 mS 4K 4K 4K 4K 4K 8K Table9-4. Configurations for 32-Bit Data Bus 8-Bit 16-Bit 32-Bit Parameter 16 Mbits 64Mbits 16 Mbits 64 Mbits 128 Mbits 256 Mbits 64 Mbits 128 Mbits Number of devices 4 2 1 Total size 8 Mbytes 32 Mbytes 4 Mbytes 16 Mbytes 32 Mbytes 64 Mbytes 8 Mbytes 16 Mbytes Total page size 2 Kbytes 2 Kbytes 1 Kbyte 1 Kbyte 2 Kbytes 2 Kbytes 1 Kbyte 1 Kbyte Number of banks 2 4 2 4 4 4 4 4 Refresh count in 64 mS 4K 4K 4K 4K 4K 8K 4K 8K A device’s data bus width affects its connection to SDRAM address pins. A device can be configured for external data bus width of 16 or 32 bits by appropriate configuration of the WSEL signal during reset. See Section19.18, “Operating Mode Configuration Pins.” The following tables describe address pin connections and internal address multiplexing. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-4 Freescale Semiconductor

SDRAM Controller Table9-5. Internal Address Multiplexing (16-Bit Data Bus) 8-Bit 16-Bit Device Pin SDRAM Pin 16 Mbits 64 Mbits 16 Mbits 64 Mbits 128 Mbits 256 Mbits A1 A0 A1/A10 A1/A10 A1/A9 A1/A9 A1/A10 A1/A10 A2 A1 A2/A11 A2/A11 A2/A10 A2/A10 A2/A11 A2/A11 A3 A2 A3/A12 A3/A12 A3/A11 A3/A11 A3/A12 A3/A12 A4 A3 A4/A13 A4/A13 A4/A12 A4/A12 A4/A13 A4/A13 A5 A4 A5/A14 A5/A14 A5/A13 A5/A13 A5/A14 A5/A14 A6 A5 A6/A15 A6/A15 A6/A14 A6/A14 A6/A15 A6/A15 A7 A6 A7/A16 A7/A16 A7/A15 A7/A15 A7/A16 A7/A16 A8 A7 A8/A17 A8/A17 A8/A16 A8/A16 A8/A17 A8/A17 A9 A8 A9/A18 A9/A18 A17 A17 A9/A18 A9/A18 A10 A9 A19 A19 A18 A18 A19 A19 A10_PRECHG A10/AP A20 A20 A19 A19 A20 A20 A12 A11 A21 A20 A21 A21 A13 A12 A22 SDBA0 BA0 A21 A22 A20 A21 A22 A23 SDBA1 BA1 A23 A22 A23 A24 Table9-6. Internal Address Multiplexing (32-Bit Data Bus) 8-Bit 16-Bit 32-Bit Device Pin SDRAM Pin 16 Mbits 64 Mbits 16 Mbits 64 Mbits 128 Mbits 256 Mbits 64 Mbits 128 Mbits A2 A0 A2/A11 A2/A11 A2/A10 A2/A10 A2/A11 A2/A11 A2/A10 A2/A10 A3 A1 A3/A12 A3/A12 A3/A11 A3/A11 A3/A12 A3/A12 A3/A11 A3/A11 A4 A2 A4/A13 A4/A13 A4/A12 A4/A12 A4/A13 A4/A13 A4/A12 A4/A12 A5 A3 A5/A14 A5/A14 A5/A13 A5/A13 A5/A14 A5/A14 A5/A13 A5/A13 A6 A4 A6/A15 A6/A15 A6/A14 A6/A14 A6/A15 A6/A15 A6/A14 A6/A14 A7 A5 A7/A16 A7/A16 A7/A15 A7/A15 A7/A16 A7/A16 A7/A15 A7/A15 A8 A6 A8/A17 A8/A17 A8/A16 A8/A16 A8/A17 A8/A17 A8/A16 A8/A16 A9 A7 A9/A18 A9/A18 A9/A17 A9/A17 A9/A18 A9/A18 A9/A17 A9/A17 A10 A8 A10/A19 A10/A19 A18 A18 A10/A19 A10/A19 A18 A18 A11 A9 A20 A20 A19 A19 A20 A20 A19 A19 A10_PRECHG A10/AP A21 A21 A20 A20 A21 A21 A20 A20 A13 A11 A22 A21 A22 A22 A21 A14 A12 A23 SDBA0 BA0 A22 A23 A21 A22 A23 A24 A21 A22 SDBA1 BA1 A24 A23 A24 A25 A22 A23 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-5

SDRAM Controller 9.4 SDRAM Banks, Page Hits, and Page Misses SDRAMs can have up to four banks addressed by SDBA1 and SDBA0. The two uppermost address lines of the memory space are mapped to SDBA1 and SDBA0. Specific address lines mapped depend on the size of the SDRAM array and are defined in the SDCR. Each of the four bank address registers holds the page address (lower bits of row address) of an activated page. Each bank can have one open page. A device with two banks can have two open pages. A device with four banks can have four open pages. The lower addresses of the row address are compared against the page address register content. If it does not match, the SDRAM controller precharges the open page on the accessed bank and activates the new required page. After this, the SDRAM controller executes the READ or WRITE command. Concurrently, the page address register of the bank is updated. This is called a page miss. After a bank is activated, it remains activated until the next page access causing a page miss. A precharge of a deactivated bank is allowed and simply ignored by the SDRAM. If a memory access is to an open page only the READ or WRITE command is issued to the SDRAM. This is called a page hit. In two-page SDRAMs, banks 2 and 3 are invalid and must not be addressed. To avoid address aliasing, the user should restrict the chip select address range to the space available in the SDRAMs. 9.5 SDRAM Registers The SDRAM configuration register (SDCR) and the SDRAM timing register (SDTR) are described in the following sections. Note that SDRAM provides a mode register that is not part of the SDRAM controller memory model. The SDRAM mode register is automatically configured during initialization. 9.5.1 SDRAM Configuration Register (SDCR) SDCR is used to configure the SDRAM controller address multiplexers for the type of SDRAM devices used on the system board. 15 14 13 12 11 10 8 7 6 5 4 3 2 1 0 Write — MCAS — BALOC GSL — REG INV SLEEP ACT INIT Reset 0 00 00 001 0 00 0 1 0 0 0 R/W Read/Write Read-only R/W Addr MBAR + 0x0182 Figure9-3. SDRAM Configuration Register (SDCR) Table 9-7 describes SDCR fields. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-6 Freescale Semiconductor

SDRAM Controller Table9-7. SDCR Field Descriptions Bits Name Description 15 — Reserved, should be cleared. 14–13 MCAS Maximum CAS address. Determines which device address output carries the column address msb. For example, if the SDRAM device has eight column addresses and the data bus is configured for 32 bits, the column address appears on A[9:2], so the maximum column address is A9. The lsb of the row address is therefore taken from internal address signal A10 and is used by the SDRAM controller to control address multiplexing. 00 A7 01 A8 10 A9 11 A10 12–11 — Reserved, should be cleared. 10–8 BALOC Bank address location. Determines the internal addresses that become SDRAM bank addresses. SDBA1SDBA0 000Reserved 001A21A20 010A22A21 011A23A22 100A24A23 101A25A24 110Reserved 111Reserved 7 GSL Go to sleep. Setting GSL powers down the SDRAM and puts it into auto-refresh mode. 6–5 — Reserved, should be cleared. 4 REG Register read data for 66 MHz. Writing a 1 to REG enables pipeline mode for read data access. It forces the SDRAM controller to register the read data, adding one wait state to single-read accesses and to the first word read during a burst. REG must be 1 for clock frequencies above 48MHz to meet input setup timing for data input (See electrical characteristics timing SD16). The description of INV shows how REG and INV interact. 3 INV Invert clock. Inverts SDRAM clock output for timing refinement. If REG = 0 0 Do not add wait state for read accesses. 1 Shift SDCLK edge 180o If REG = 1 0 Add wait state for read accesses, all frequencies 1 Invalid, do not use. 2 SLEEP SLEEP mode. This read-only status bit goes high when setting SDCR[GSL] has taken effect and the SDRAM is powered down. SLEEP is cleared when SDRAM is in auto-refresh mode. 1 ACT Active. This read-only status bit goes high when the SDRAM controller completes its initialization. ACT is cleared by writing to SDCR. 0 INIT Initialization enable. Setting INIT enables initialization of the SDRAM based on other SDCR bit values. Initialization starts after the first dummy write access to the SDRAM. CSOR7, CSBR7, and SDTR must be configured before setting INIT. CAUTION: CSOR7[WAITST] must equal 0x1F when CS7/SDCS is configured for SDRAM. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-7

SDRAM Controller 9.5.2 SDRAM Timing Register (SDTR) The SDTR is used to configure SDRAM controller refresh counters for the type of SDRAM devices used and the number of clocks required for each type of SDRAM access. The reset value is 0x2115. For lower CPU clock frequencies, precharge and activate times can be reduced to eliminate up to 2 clock cycles from the read and write accesses. Consult the data sheets of the SDRAMs being considered. 15 10 9 8 7 6 5 4 3 2 1 0 Write RTP RC — RP RCD CLT Reset 0010_00 01 00 01 01 01 R/W R/W Addr MBAR + 0x0186 Figure9-4. SDRAM Timing Register (SDTR) Table 9-8 describes SDTR fields. Table9-8. SDTR Field Descriptions Bits Name Description 15–10 RTP Refresh timer prescaler. Determines the number of clock cycles x 16 between refreshes. The following table describes different recommended prescaler settings for different clock frequencies including a margin of 1.2 μS. Recommended values are as follows: RTP 15.6 µs = 1/f*RTP*16 System Clock 111101 61 66 MHz 101011 43 48 MHz 011101 29 33 MHz 010110 22 25 MHz 000100 4 5 MHz (emulator) 9–8 RC Refresh count. Indicates the number of clock cycles spent in refresh state (RC + 5). Refresh occurs during the first of these clock cycles; the rest of the time is the delay that must occur before the SDRAM is ready to do anything else. 00 5 cycles 01 6 cycles (default) 10 7 cycles 11 8 cycles 7–6 — Reserved, should be cleared. 5–4 RP Precharge time. Specifies number of clock cycles taken for a precharge (RP + 1). 00 1 cycle 01 2 cycles (default) 10 3 cycles 11 4 cycles MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-8 Freescale Semiconductor

SDRAM Controller Table9-8. SDTR Field Descriptions (continued) Bits Name Description 3–2 RCD RAS-to-CAS delay. The reset value is 1, requiring 2 clock cycles for SDRAM activation. 00 1 cycle 01 2 cycles (default) 10 3 cycles 11 4 cycles 1–0 CLT CAS latency. Specifies the delay programmed into the SDRAM mode register during initialization, indicating the time between a READ command being issued to the SDRAM and data appearing on the pins. The SDRAM controller uses this value to sequence its state machine during read operations. CLT cannot be changed after the mode register is written. 00 Reserved 01 2-cycle CAS latency (default) 1x Reserved 9.6 Auto Initialization Each SDRAM requires an initialization sequence before it can be accessed. After power up, the SDRAM requires a certain time (100 µS) before it can accept the first command of the initialization procedure. After this time, one PRECHARGE ALL command and eight REFRESH commands are required. After initialization, an INITIATE LOAD REGISTER SET command is executed, which writes the SDRAM configuration into the SDRAM device mode register. SDRAM mode register data is transferred on the address signals, so all SDRAM devices are configured simultaneously. Initialization is enabled by setting SDCR[INIT] and performing a dummy write to the SDRAM address space. The SDRAM controller executes the required PRECHARGE and REFRESH commands and automatically loads the mode register, which configures the SDRAM as follows: • SDRAM internal burst is always disabled. • CAS latency is defined by SDTR[CLT]. SDCR[ACT] is set after initialization. 9.7 Power-Down and Self-Refresh The SDRAM can be powered down by setting SDCR[GSL]. The SDRAM controller executes the required power-down command sequence to ensure self-refresh during power down. The SDRAM controller completes the current memory access then automatically issues the following commands to force the SDRAM into sleep mode: precharge all banks nop auto refresh command In self-refresh mode, SDRAM devices can refresh themselves without an external clock. After power-down completes, SDCR[SLEEP] is set, the SDRAM clock output is driven high, and SDCLKE is driven low. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-9

SDRAM Controller To wake up the SDRAMs, SDCR[GSL] must be cleared. SDCR[SLEEP] remains set while the SDRAM is exiting sleep mode and is cleared when the SDRAM completes the correct sequence to exit sleep mode. 9.8 Performance The maximum performance of the SDRAM controller is determined by the required number of cycles for page activation and precharge. The read access is influenced by the CAS latency. All SDRAM accesses are in page mode. The following table shows the number of required cycles including all dead cycles for each type of read/write SDRAM access. It assumes default timing configuration using an at least PC100-compliant SDRAM device at 66 MHz. Page miss latency includes the cycles to precharge the last open page and activate the new page before the read/write access. There are no precharge cycles when an address hits an open page. In Table9-9, the timing configuration is RTP = 61, RC = negligible, RCD = 0 (or 1), RP= 1 (or 0), and CLT = 1. Table9-9. SDRAM Controller Performance, 32-Bit Port, (RCD = 0, RP = 1) or (RCD=1, RP=0) Number of System Clock Cycles SDRAM Access REG=0, INV=0 REG=1, INV=0 Single-beat read Page miss 8 9 Page hit 5 6 Single-beat write Page miss 6 6 Page hit 3 3 Burst read Page miss 8-1-1-1 = 11 9-1-1-1 = 12 Page hit 5-1-1-1 = 8 6-1-1-1 = 9 Burst write Page miss 6-1-1-1 = 9 6-1-1-1 = 9 Page hit 3-1-1-1 = 6 3-1-1-1 = 6 In Table9-10, the timing configuration is RTP = 61, RC = negligible, RCD = 0, RP = 0, and CLT = 1. Table9-10. SDRAM Controller Performance, 32–Bit Port, (RCD=0, RP=0) Number of System Clock Cycles SDRAM Access REG=0, INV=0 REG=1, INV=0 Single-beat read Page miss 7 8 Page hit 5 6 Single-beat write Page miss 5 5 Page hit 3 3 Burst read Page miss 7-1-1-1 = 10 8-1-1-1 = 11 Page hit 5-1-1-1 = 8 6-1-1-1 = 9 Burst write Page miss 5-1-1-1 = 8 5-1-1-1 = 8 Page hit 3-1-1-1 = 6 3-1-1-1 = 6 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-10 Freescale Semiconductor

SDRAM Controller In Table9-11, the timing configuration is RTP = 61, RC = negligible, RCD = 1, RP = 1, and CLT = 1. Table9-11. SDRAM Controller Performance (RCD = 1, RP = 1), 16-Bit Port Number of System Clock Cycles SDRAM Access REG=0, INV=0 REG=1, INV=0 Single-beat read Page miss 9 10 Page hit 5 6 Single-beat Page miss 9-1 10-1 longword read Page hit 5-1 6-1 Single-beat write Page miss 7 7 Page hit 3 3 Single-beat Page miss 7-1 7-1 longword write Page hit 3-1 3-1 Burst read Page miss 9-1-1-1-1-1-1-1 = 16 10-1-1-1-1-1-1-1 = 17 Page hit 5-1-1-1-1-1-1-1 = 12 6-1-1-1-1-1-1-1 = 13 Burst write Page miss 7-1-1-1-1-1-1-1 = 14 7-1-1-1-1-1-1-1 = 14 Page hit 3-1-1-1-1-1-1-1 = 10 3-1-1-1-1-1-1-1 = 10 In Table 9-12, the timing configuration is RTP = 61, RC = negligible, RCD = 0 (or 1), RP= 1 (or 0), and CLT = 1. Table9-12. SDRAM Controller Performance, 16-Bit Port, (RCD=0, RP=1) or (RCD=1, RP = 0) Number of System Clock Cycles SDRAM Access REG=0, INV=0 REG=1, INV=0 Single-beat read Page miss 8 9 Page hit 5 6 Single-beat longword read Page miss 8-1 9-1 Page hit 5-1 6-1 Single-beat write Page miss 6 6 Page hit 3 3 Single-beat longword write Page miss 6-1 6-1 Page hit 3-1 3-1 Burst read Page miss 8-1-1-1-1-1-1-1 = 15 9-1-1-1-1-1-1-1 = 16 Page hit 5-1-1-1-1-1-1-1 = 12 6-1-1-1-1-1-1-1 = 13 Burst write Page miss 6-1-1-1-1-1-1-1 = 13 6-1-1-1-1-1-1-1 = 13 Page hit 3-1-1-1-1-1-1-1 = 10 3-1-1-1-1-1-1-1 = 10 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-11

SDRAM Controller In Table9-13, the timing configuration is RTP = 61, RC = negligible, RCD = 0, RP =0, and CLT = 1. Table9-13. SDRAM Controller Performance, 16-Bit Port, (RCD=0, RP=0) Number of System Clock Cycles SDRAM Access REG=0, INV=0 REG=1, INV=0 Single-beat read Page miss 7 8 Page hit 5 6 Single-beat Page miss 7-1 8-1 longword read Page hit 5-1 6-1 Single-beat write Page miss 5 5 Page hit 3 3 Single-beat Page miss 5-1 5-1 longword write Page hit 3-1 3-1 Burst read Page miss 7-1-1-1-1-1-1-1 = 14 8-1-1-1-1-1-1-1 = 15 Page hit 5-1-1-1-1-1-1-1 = 12 6-1-1-1-1-1-1-1 = 13 Burst write Page miss 5-1-1-1-1-1-1-1 = 12 5-1-1-1-1-1-1-1 = 12 Page hit 3-1-1-1-1-1-1-1 = 10 3-1-1-1-1-1-1-1 = 10 9.9 Solving Timing Issues with SDCR[INV] When some SDRAM devices (such as 4 x 8 bit wide SDRAMs) are used, the SDCLK and other control signals are more loaded than data signals. In normal MCF5272 operation, the write data and all other control signals change with the positive edge of SDCLK. Large capacitive loads on SDCLK can cause long delays on SDCLK, possibly causing SDRAM hold-time violations during writes. The clock may arrive at the same time as the write data. The write data setup time to SDCLK edge may not meet device requirements at the SDRAM. This timing issue cannot be solved by reducing the SDCLK frequency. SDCLK must be delayed further to meet setup/hold margin on the SDRAM data input. Setting INV provides a 180° phase shift and moves the positive clock edge far beyond the data edge. Internal CLK Data bus Data setup delay SDCLK External delay of SDCLK Figure9-5. Example Setup Time Violation on SDRAM Data Input during Write MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-12 Freescale Semiconductor

SDRAM Controller As Figure9-6 shows timing relationships between SDCLK and the remaining data and control signals can be refined by setting SDCR[INV], which inverts the SDRAM clock. SDCR[REG] must always be cleared when SDCR[INV] is set. . Internal CLK Data bus Data setup delay SDCLK Shifted delay of SDCLK Figure9-6. Timing Refinement with Inverted SDCLK NOTE If the delay difference between the fastest data signal and the slowest control signal exceeds half of the clock cycle time, the clock shift can cause hold-time violations on control signals. The incoming data setup time should be inspected during reads. The active clock edge event of SDCLK now precedes the MCF5272 internal active clock edge event when (REG = 0). This behavior is frequency dependent. The two following scenarios are possible: • High-speed timing refinement with true CAS latency. See Figure 9-7. • Low-speed timing refinement with reduced effective CAS latency. If the delay between shifted SDCLK and following internal system clock edge is shorter than the read access time of the SDRAM, data is sampled with the true CAS latency. CASL = 2 Internal CLK SDCLK Data SDRAM read access time Delay SDCLK to CLK Shifted delay of SDCLK T - T < 0 => true CAS latency SDCLK_to_CLK acc Figure9-7. Timing Refinement with True CAS Latency and Inverted SDCLK MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-13

SDRAM Controller Selecting a system clock frequency low enough that the SDCLK-to-CLK delay is long compared to the SDRAM read access time reduces effective CAS latency by 1 cycle. CASL = 1 Internal CLK SDCLK Data Delay SDCLK to CLK SDRAM read access time Shifted delay of SDCLK T - T > 0 => effective CAS latency reduced by 1 SDCLK_to_CLK acc Figure9-8. Timing Refinement with Effective CAS Latency NOTE When reduced effective CAS latency is used, the SDRAM is still programmed with true CAS latency. The SDRAM controller state machine must be reprogrammed for the reduced CAS latency. SDRAM initialization software programs the CAS latency of 2 and transfers it into the SDRAM mode register. After SDRAM initialization is confirmed, initialization software should change SDTR[CLT] to CAS latency 1 but should not reinitialize the SDRAM. The SDRAM controller state machine now runs with CAS latency 1 and SDRAMs run with CAS latency 2, which increases bandwidth on the SDRAM bank and improves performance. 9.10 SDRAM Interface Setting CSBRn[EBI] to 0b01 enables chip select CS7 for use with one physical bank of SDRAM. In this case, CS7 becomes SDCS. The SDRAM memory array may have a 32- or 16-bit data bus width; an 8-bit width is not supported. An array may consist of SDRAM devices with 8, 16, or 32 bits data bus width. Each SDRAM device can have from 16–256 Mbits. The interface to the SDRAM devices is glueless. The following control signals are dedicated to SDRAM: SDCS, SDWE, A10_PRECHG, SDCLK, SDCLKE, RAS0, CAS0, and SDBA[1:0]. If SDRAM EBI mode is used, CSOR7[WAITST] should be programmed for 0x1F to ensure that the internal bus cycle termination signal is sourced from the SDRAM controller and not the chip select module. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-14 Freescale Semiconductor

SDRAM Controller NOTE The SDRAM shares address and data signals with external memory and peripherals. Due to stringent SDRAM timing requirements, it is strongly recommended to buffer the address, byte strobe, and data buses between the MCF5272 and non-SDRAM memory and peripherals. Never buffer signals to the SDRAMs. See Appendix C for details on how to buffer external memory and peripherals in a system using SDRAM. The controller allows single-beat read/write accesses and the following burst accesses: • 16-byte cache line read bursts from 32-bit wide SDRAM with access times of n-1-1-1. The value of n depends on read, write, page miss, page hit, etc. The enable extended bursts bit in chip select option register 7 (CSOR7[EXTBURST]) must be cleared, CSBR7[EBI] must be set for SDRAM, and CSBR7[BW] must be set for a 16-byte cache line width. • 16-byte cache line read bursts from 16-bit wide SDRAM with access times of n-1-1-1-1-1-1-1. CSOR7[EXTBURST] must be set, CSBR7[EBI] must be set for SDRAM, and CSBR7[BW] must be set for 16 bits. • 16-byte read or write bursts during Ethernet DMA transfers to/from SDRAM with access times of n-1-1-1 or n-1-1-1-1-1-1-1 depending on 32 or 16 bit SDRAM port width as described in the previous two paragraphs. These SDRAM accesses are shown in Figure9-9 through Figure 9-15. The SDRAM supports a low-power, self-refreshing sleep mode as shown in Figure9-14 and Figure 9-15. It is also possible to turn off the SDRAM controller completely using the power management control register in the SIM. Figures show burst read and burst writes, with a page miss and a page hit for each case. A single-cycle read or write is identical to the first access of a burst. In normal operation the SDRAM controller refreshes the SDRAM. As these examples show, SDCLKE is normally high and SDCLK is always active. SDCLKE can be forced to 0 and SDCLK can be shut off by putting the SDRAM controller into power down or self-refresh mode. 9.10.1 SDRAM Read Accesses The read examples, Figure9-9 and Figure9-10, show a CAS latency of 2, SDCR[REG] = 0 and SDCR[INV] = 1. In T1, the ColdFire core issues the address. This cycle is internal to the device and always occurs. In T2, the SDRAM controller determines if there is a page miss or hit. This cycle is internal to the device and always occurs. Because Figure 9-9 shows a page miss, the PRECHARGE command (T3) and the following cycle occur. During precharge the SDRAM writes the designated on-chip RAM page buffer back into the SDRAM array. The number of cycles for a precharge is set by programming SDTR[RP]. The default after reset is two cycles. The activate new page cycle that follows (T5) is required to open a new page due to the page miss. Cycle T6 is a wait state for SDRAM activation command. It is added due to default value of 0b01 in SDTR[RCD]. For lower clock speed systems the RCD value could be written as 00 and this clock cycle can be removed. Consult the data sheets of the SDRAM devices being used. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-15

SDRAM Controller T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 SDCLK (7) CF2 CorePagePrecharge Read Read Issue Hit orOld Page Activate 1 Read 3 Read Address Miss? New Page 2 4 SDCLKE SDADR[13:0] Row Col Col Col Col A10_PRECHG Row SDBA[1:0] Bank x Bank y Bank y CASL = 2 D[31:0] Data Data Data Data SDCS RAS0 CAS0 SDWE BS[3:0] Figure9-9. SDRAM Burst Read, 32-Bit Port, Page Miss, Access = 9-1-1-1 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-16 Freescale Semiconductor

SDRAM Controller Figure 9-10 shows a similar burst read that hits the page. As in the page-miss example, the SDRAM controller takes a clock cycle (T2) to determine whether the access is a hit or a miss. Because it is a hit, the burst operation follows immediately. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 SDCLK CF2 Core Page Read Read Issue Hit or 1 Read 3 Read Address Miss? 2 4 SDCLKE SDADR[13:0] Col Col Col Col A10_PRECHG SDBA[1:0] Bank SDCS RAS0 CAS0 SDWE BS[3:0] D[31:0] Data Data Data Data Figure9-10. SDRAM Burst Read, 32-Bit Port, Page Hit, Access = 5-1-1-1 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-17

SDRAM Controller 9.10.2 SDRAM Write Accesses Like the read operations, shown in Figure9-9 and Figure9-10, the write operations require one cycle to issue the address (T1) and another (T2) to determine whether the access is page hit or miss. In the burst-write, page-miss example, shown in Figure 9-11, after the SDRAM determines that this is a page miss (T2), the precharge old page (T3) and activate new page cycles (T5) are required. Cycle T6 is a wait state for SDRAM activation command as it is in Figure 9-9. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 SDCLK CF2 Core Page Precharge Write Write Issue Hit or Old Page Activate 1 Write 3 Write Address New Page Miss? 2 4 SDCLKE SDADR[13:0] Row Col Col Col Col A10_PRECHG Row SDBA[1:0] Bank x Bank y Bank y SDCS RAS0 CAS0 SDWE BS[3:0] D[31:0] Data Data Data Data Figure9-11. SDRAM Burst Write, 32-Bit Port, Page Miss, Access = 7-1-1-1 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-18 Freescale Semiconductor

SDRAM Controller In the burst-write, page-hit example, shown in Figure 9-12, after the SDRAM controller determines that the access is a page hit in T2, the burst transfer begins in T3. T0 T1 T2 T3 T4 T5 T6 T7 T8 SDCLK CF2 Core Page Write Write Issue Hit or 1 Write 3 Write Address Miss? 2 4 SDCLKE SDADR[13:0] Col Col Col Col A10_PRECHG SDBA[1:0] Bank SDCS RAS0 CAS0 SDWE BS[3:0] D[31:0] Data Data Data Data Figure9-12. SDRAM Burst Write, 32-Bit Port, Page Hit, Access = 3-1-1-1 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-19

SDRAM Controller 9.10.3 SDRAM Refresh Timing Figure 9-13 shows refresh-cycle timing. As in Figure 9-14, during a PRECHARGE ALL command (T1), the SDRAM writes all of its on-chip RAM page buffers into the SDRAM array. SDTR[RP] determines the number of dead cycles after a precharge. Note that self refresh occurs during T3. In refresh state, SDRAM cannot accept any other command. T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 SDCLK Precharge NOP Auto Next Command All Banks Refresh t RC SDCLKE (H) SDADR[13:0] A10_PRECHG SDBA[1:0] SDCS RAS0 CAS0 SDWE Figure9-13. SDRAM Refresh Cycle MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-20 Freescale Semiconductor

SDRAM Controller Figure 9-14 shows the timing for entering SDRAM self-refresh mode. During a PRECHARGE ALL command (T1), the SDRAM writes all of its on-chip RAM page buffers back into the SDRAM array. The SDTR[RP] value determines the number of dead cycles after a precharge. Note that auto refresh occurs in T3. SDTR[RC] determines the number of clock cycles the SDRAM remains in refresh state, during which time it cannot accept other commands. Internal Clock T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 SDCLK PrechargeNOP Self All Banks Refresh SDCR[SLEEP] SDCLKE SDADR[13:0] A10_PRECHG SDBA[1:0] SDCS RAS0 CAS0 SDWE Figure9-14. Enter SDRAM Self-Refresh Mode MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 9-21

SDRAM Controller Figure 9-15 shows the timing for exiting SDRAM self-refresh mode. Note that SDCR[GSL] is sampled on the rising edge of the internal clock. If it is 0, as it is here, SDRAM controller signals become active on the following negative clock edge. Internal Clock T0 T1 T2 T3 T4 T5 T6 T7 T8 SDCLK NOP NOP NOP NOP NOP NOP NOP SDCR[GSL] SDCR[SLEEP] SDCLKE SDADR[13:0] A10_PRECHG SDBA[1:0] SDCS RAS0 CAS0 SDWE Figure9-15. Exit SDRAM Self-Refresh Mode MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 9-22 Freescale Semiconductor

Chapter 10 DMA Controller The MCF5272 has a one-channel DMA controller that supports memory-to-memory DMA transfers that can be used for block data moves. This chapter describes in detail its signals, registers, and operating modes. 10.1 DMA Data Transfer Types A source and destination address must be specified for any dual-address DMA transfer. These addresses can have different data transfer types, but there is always a read from the source address followed by a write to the destination address. On the MCF5272, sources and destinations can be SDRAM, external SRAM, or on-chip peripheral in any combination. NOTE Memory-to-memory DMA transfers run to completion if the assume request bit in the system configuration register, SCR[AR], is set. This generally prevents the CPU from recognizing interrupts and blocks bus accesses by other on-chip bus masters. It is best not to enable SCR[AR] when the DMA controller is in use. When AR = 0, the DMA controller allows the CPU and Ethernet controller to obtain bus access. Table10-1. DMA Data Transfer Matrix Source or Destination Address Transfer Type SDRAM External SRAM On-Chip Peripheral Byte (8 bits) Yes Yes Yes Word (16 bits) Yes Yes Yes Longword (32 bits) Yes Yes Yes Burst (4 x longword) Yes No No Note that transfers to on-chip peripherals are limited by the transfer type supported by a specific peripheral. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 10-1

DMA Controller 10.2 DMA Address Modes The DMA address mode determines how the address output by the channel is updated after a transfer to be ready for the next transfer. The two following modes are supported: • Static address mode—The address remains unchanged after the transfer completes. This mode should be used when the source or destination address is the FIFO data port of an on-chip peripheral. • Increment address mode—In increment address mode, the address is incremented at the end of the transfer by the number of bytes transferred. This mode should be used when a source or destination address is in external memory. 10.3 DMA Controller Registers The MCF5272 DMA controller supports a single DMA channel which can be used for memory-to-memory transfers. 10.3.1 DMA Mode Register (DMR) The DMR controls various operation modes, principally the request and addressing modes. Fields include the transfer size and modifier, transfer direction, channel enable and reset. 31 30 29 20 19 18 17 16 Field RESET EN — RQM — Reset 0000_0000_0000_0000 R/W R/W 15 14 13 12 10 9 8 7 6 5 4 2 1 0 Field — DSTM DSTT DSTS — — SRCM SRCT SRCS Reset 0 01 1_00 01 0 0 1 1_01 01 R/W R/W Addr MBAR + 0x00E0 Figure10-1. DMA Mode Register (DMR) Table 10-2 describes DMR fields. Table10-2. DMR Field Descriptions Bits Name Description 31 RESET Reset. Writing a 1 to this location causes the DMA controller to reset to a condition where no transfers are taking place. EN is cleared, preventing new transfers. 30 EN Enable. Controls whether the DMA channel is enabled to perform transfers. 0 DMA transfers are disabled. 1 DMA transfers are enabled. The DMA controller can respond to requests from the peripheral or generates internal requests in dual address mode, so long as the conditions described under the DMA interrupt flags (see Section10.3.2, “DMA Interrupt Register (DIR)”) do not prevent transfers from going ahead. 29–20 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 10-2 Freescale Semiconductor

DMA Controller Table10-2. DMR Field Descriptions (continued) Bits Name Description 19–18 RQM Request mode. Determines the request mode of the channel. This must be 11. 00–10 Reserved, do not use. 11 Dual address request mode. Both the DMA source and DMA destination are memory addresses. The MCF5272 supports only dual-address request mode. 17–15 — Reserved, should be cleared. 14–13 DSTM Destination addressing mode for the channel. 00 Static address mode 01 Increment address mode 1x Reserved, do not use. 12–10 DSTT Destination addressing type. Used internal to the MCF5272 to qualify the address bits. This value should be compatible with the CSCRn[TM] value used for external RAM or peripheral device access. 000 Reserved 001 User data access 010 User code access 011–100 Reserved 101 Supervisor data access 110 Supervisor code access 111 Reserved 9–8 DSTS Destination data transfer type. The DMA controller buffers data from the source address data fetches until there are enough bytes to perform a destination data write of the size programmed in these bits. Thus it is possible to configure source accesses to be byte type and destination addresses to be line burst type. In this case 16 individual byte reads are performed followed by an indivisible burst write of four longwords. Longword or line bursts are the most efficient data transfers. DSTS Data Transfer Type Address Incremented by 00 Longword 4 01 Byte 1 10 Word 2 11 16-byte line burst 16. Valid only for SDRAM. 7 — Reserved, should be cleared. 6 — Reserved, should be cleared. 5 SRCM Source addressing mode of the channel. 0 Static address mode 1 Increment address mode 4–2 SRCT Source addressing type. Used internal to the MCF5272 to qualify the address bits. The value should be compatible with the CSCRn[TM] value used for external RAM or peripheral device access. 000 Reserved 001 User data access 010 User code access 011 Reserved 100 Reserved 101 Supervisor data access 110 Supervisor code access 111 Reserved MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 10-3

DMA Controller Table10-2. DMR Field Descriptions (continued) Bits Name Description 1–0 SRCS Source data transfer type. Determines the amount of data the DMA controller fetches and buffers data from the source address. When there are enough bytes to perform a destination data write of the size programmed in DSTS, the data is written to the destination address. Thus source accesses can be longword type and destination addresses can be line burst type. In this case, 4 longword reads are performed followed by an indivisible burst write of 4 longwords. The most efficient data transfer method is to use longword or line burst transfer types. SRCS Data Transfer Type Address Incremented by 00 Longword 4 01 Byte 1 10 Word 2 11 16-byte line burst 16. Valid only for SDRAM. 10.3.2 DMA Interrupt Register (DIR) The DIR, Figure 10-2, contains status bits and their corresponding interrupt enables. 15 13 12 11 10 9 8 7 5 4 3 2 1 0 Field — INVEN ASCEN — TEEN TCEN — INV ASC — TE TC Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x00E6 Figure10-2. DMA Interrupt Register (DIR) Table 10-3 describes DIR fields. Table10-3. DIR Field Descriptions Bits Name Description 15–13 — Reserved, should be cleared. 12 INVEN Invalid combination interrupt enable. 0 INV interrupt is disabled. 1 INV interrupt is enabled. 11 ASCEN Address sequence complete interrupt enable. 0 ASC interrupt is disabled. 1 ASC interrupt is enabled. 10 — Reserved, should be cleared. 9 TEEN Transfer error interrupt enable. 0 TE interrupt is disabled. 1 TE interrupt is enabled. 8 TCEN Transfer complete interrupt enable. 0 TC interrupt is disabled. 1 TC interrupt is enabled. 7–5 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 10-4 Freescale Semiconductor

DMA Controller Table10-3. DIR Field Descriptions (continued) Bits Name Description 4 INV Invalid combination. 0 No invalid combination detected. 1 An invalid combination of request and address modes is programmed into the mode register. INV remains set until it is cleared by writing a 1 to it or by a hardware reset. Writing a 0 has no effect. No further transfers can take place when this bit is set. 3 ASC Address sequence complete. 0 Address sequence is not complete. 1 The address sequence is complete. This occurs when the byte counter decrements to 0. Corresponds to DMA complete. ASC remains set until it is cleared by writing a 1 to its location or by a hardware reset. Writing a 0 has no effect. No further transfers can take place when ASC is set. It is important to ensure that the combination of source address, destination address, and transfer sizes ensures that the byte counter always decrements to 0. 2 — Reserved, should be cleared. 1 TE Transfer error. 0 No transfer error. 1 A DMA data transfer terminated with an error such as an internally generated bus error. This generally occurs when the address is not decoded successfully by an on-chip peripheral or by a chip select register. TE remains set until it is cleared by writing a 1 to its location or by a hardware reset. Writing 0 has no effect. No further transfers can take place when TE is set. 0 TC Transfer complete. 1 A data transfer completed successful. The bit is cleared when DMA module is reset. Writing a 0 to this location has no effect. This bit is available to show that the DMA transfers have started. Otherwise it is not essential to monitor the status of this bit. 10.3.3 DMA Source Address Register (DSAR) The DSAR provides a 32-bit address, which the DMA controller drives onto the internal address bus for all of the channel’s read accesses. The address value is altered after each read access according to the addressing mode. 31 0 Field SRCADR Reset 0000_0000_0000_0000_0000_0000_0000_0000 R/W R/W Addr MBAR + 0x00EC Figure10-3. DMA Source Address Register (DSAR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 10-5

DMA Controller 10.3.4 DMA Destination Address Register (DDAR) The DDAR provides a 32-bit address that the DMA controller drives onto the internal address bus for all of the channel’s write accesses. The address is altered after each write access according to the addressing mode. 31 0 Field DESTADR Reset 0000_0000_0000_0000_0000_0000_0000_0000 R/W R/W Addr MBAR + 0x00F0 Figure10-4. DMA Destination Address Register (DDAR) 10.3.5 DMA Byte Count Register (DBCR) The DBCR is initially loaded with the number of bytes to be transferred during the DMA. After each transfer, the DBCR decrements by the number of bytes transferred. DIR[ASC] is set when the byte counter reaches zero. The user must ensure that the bytes remaining to be transferred and the transfer size are such that the byte counter decrements to zero or wraps around without setting the ASC flag. 31 24 23 0 Field — BYTCNT Reset R/W R/W 0000_0000_0000_0000_0000_0000_0000_0000 Addr MBAR + 0x00E8 Figure10-5. DMA Byte Count Register (DBCR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 10-6 Freescale Semiconductor

Chapter 11 Ethernet Module This chapter begins with a feature-set overview, a functional block diagram, and transceiver connection information for both MII and seven-wire serial interfaces. The chapter concludes with detailed descriptions of operation and the programming model. 11.1 Overview The MCF5272’s integrated fast Ethernet media access controller (MAC) performs the full set of IEEE 802.3/Ethernet CSMA/CD media access control and channel interface functions. It requires an external interface adaptor and transceiver function to complete the interface to the media. 11.1.1 Features The fast Ethernet controller (FEC) incorporates the following features: • Full compliance with the IEEE 802.3 standard • Support for three different physical interfaces: — 100Mbps 802.3 media independent interface (MII) — 10Mbps 802.3 MII — 10Mbps seven-wire interface • Half-duplex 100-Mbps operation at system clock frequency Š 50MHz • 448 bytes total on-chip transmit and receive FIFO memory to support a range of bus latencies Note: the total FIFO size is 448 bytes. It is not intended to hold entire frames but only to compensate for external bus latency. The FIFO can be partitioned on any 32-bit boundary between receive and transmit, for example, 32 x 56 receive and 32x56 transmit. • Retransmission from transmit FIFO following a collision, no processor bus used • Automatic internal flushing of the receive FIFO for runts and collisions with no processor bus use 11.2 Module Operation The FEC is implemented using a combination of hardware and microcode. Figure 11-1 shows a functional block diagram of this module. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-1

Ethernet Module Random No. Slot Time and Defer Control Counter Registers Clock RCLK Peripheral Bus Generator TCLK Internal Clocks REJECT Rstrt Receiver Rx Tx Transmitter RTS = TENA Control Data Data Control CD = RENA CD = RENA Unit FIFO FIFO Unit CTS = CLSN CTS = CLSN RXD Shifter Shifter TXD Figure11-1. Ethernet Block Diagram Figure 11-2 shows a fast Ethernet module. Internal Bus Interface Dedicated DMA/ Bus Descriptor Access Controller RAM FIFO Controller RAM I/F Descriptor Controller CSRs MII Receive Transmit E_RxCLK E_TxCLK E_RxDV E_TxEN E_MDC E_RxD[3:0] E_TxD[3:0] E_MDIO E_RxER E_TxER E_CRS,E_COL Figure11-2. Fast Ethernet Module Block Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-2 Freescale Semiconductor

Ethernet Module The descriptor controller opens and closes the buffer descriptors. The DMA controller manages the data transfer. As soon as the DMA channel is initialized, it begins transferring data. An on-board RAM acts as both a transmit and receive FIFO, and also provides scratch memory for the FEC. The RAM is the focal point of all data flow in the FEC. The RAM is divided into three sections: transmit FIFO, receive FIFO, and descriptor controller memory. User data flows to or from the DMA unit from or to the receive/transmit FIFOs. Transmit data flows from the transmit FIFO into the transmit block. Receive data flows from the receive block into the receive FIFO. The user controls the FEC by writing into control registers located in each block. The control and status registers (CSRs) provide global control (for example, Ethernet reset and enable) and interrupt handling. The MII block provides a serial channel for the FEC and external physical layer device to pass control and status information. The descriptor controller manages data flow in both transmit and receive directions. It is programmed with microcode to open and close buffer descriptors, control the transmit collision recovery process, and filter received frame addresses. The descriptor controller accesses both the transmit and receive descriptor rings through the descriptor access block. The descriptor access block acts as a dedicated single channel DMA that either reads a descriptor in external user memory or writes an updated descriptor back into user memory. 11.3 Transceiver Connection The FEC supports both an MII interface for 10/100Mbps Ethernet and a seven-wire serial interface for 10 Mbps Ethernet. The interface mode is selected by RCR[MII_MODE]. In MII mode, the 802.3 standard defines and the FEC module supports 18 signals. These are shown in Table 11-1. Table11-1. MII Mode Signal Description MCF5272 Pin Transmit clock E_TxCLK Transmit enable E_TxEN Transmit data E_TxD[3:0] Transmit error E_TxER Collision E_COL Carrier sense E_CRS Receive clock E_RxCLK Receive enable E_RxDV Receive data E_RxD[3:0] Receive error E_RxER Management channel clock E_MDC Management channel serial data E_MDIO MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-3

Ethernet Module The serial mode interface operates in what is generally referred to as AMD mode. The MCF5272 configuration for seven-wire serial mode connections to the external transceiver are shown in Table 11-2. Table11-2. Seven-Wire Mode Configuration Signal Description MCF5272 Pin Transmit clock E_TxCLK Transmit enable E_TxEN Transmit data E_TxD[0] Collision E_COL Receive clock E_RxCLK Receive enable E_RxDV Receive data E_RxD[0] Unused, configure as PB14 E_RxER Unused input, tie to ground E_CRS Unused, configure as PB[13:11] E_RxD[3:1] Unused output, ignore E_TxER Unused, configure as PB[10:8] E_TxD[3:1] Unused, configure as PB15 E_MDC Input after reset, connect to ground E_MDIO 11.4 FEC Frame Transmission Figure 11-3 shows the Ethernet frame format. Stored in Receive Buffer Stored in Transmit Buffer Start Frame Destination Source Type/ Frame Check Preamble Data (Pads) Delimiter Address Address Length Sequence 7 Bytes 1 Byte 6 Bytes 6 Bytes 2 Bytes 46–1500 Bytes 4 Bytes NOTE: Short Tx frames are padded automatically by the MCF5272 Figure11-3. Ethernet Frame Format The Ethernet transmitter is designed to work with almost no host intervention. As soon as the driver enables the FEC transmitter by setting ECR[ETHER_EN] and TDAR[24], the FEC fetches the first transmit buffer descriptor (TxBD). If the user has a frame ready to transmit, DMA of the transmit data buffer(s) begins immediately. A collision window (512 bits) of transmit data is sent as a DMA to the transmit FIFO before off-chip transmission begins. When the transmit FIFO contains 512 bits of data, the FEC asserts E_TxEN and starts transmitting the preamble sequence, the start-of-frame delimiter, and then the frame data. However, if the line is busy, the controller defers the transmission (carrier sense is active). Before transmitting, the controller waits for carrier sense to become inactive. When carrier sense goes inactive, the controller waits to verify that it MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-4 Freescale Semiconductor

Ethernet Module stays inactive for 60 bit times. If so, the transmission begins after waiting an additional 36 bit times (96 bit times after carrier sense originally went inactive). If a collision occurs during the transmit frame, the FEC follows the specified backoff procedures and attempts to retransmit the frame until the retry limit is reached. The FEC stores the first 64 bytes of the transmit frame in internal RAM, so they need not be retrieved from system memory in case of a collision. This improves external bus use and reduces latency whenever the backoff process results in an immediate retransmission. See Figure11-28 on page 11-37 for the following discussion. When the end of the last transmit buffer in the current frame is reached, the 32-bit frame check sum is appended (if TxBD[TC] is set) and transmission is disabled (E_TxEN is negated). Following the transmission of the check sum, the FEC writes the frame status bits into the buffer descriptor and clears the ready bit. When the end of the current BD is reached but it is not the last buffer in the frame, then only the ready bit is cleared. Short frames are automatically padded by the transmit logic. If the transmit frame length exceeds the value programmed in the maximum frame length register, the BABT interrupt is asserted. However, the entire frame is transmitted and is not truncated. See Section11.5.14, “Maximum Frame Length Register (MFLR).” Both buffer and frame interrupts may be generated as determined by the EIMR register settings. Setting the graceful transmit stop bit, TCR[GTS], pauses transmission. The FEC transmitter stops immediately if no transmission is in progress. Otherwise it continues transmission until the current frame finishes normally or terminates with a collision. When TCR[GTS] is cleared, the FEC resumes transmission with the next frame. The FEC transmits bytes lsb first. 11.4.1 FEC Frame Reception The FEC receiver is designed to work with almost no intervention from the host and can perform address recognition, CRC, short frame checking, and maximum frame length checking. When the FEC receiver is enabled by setting ECR[ETHER_EN] and RDAR[24] it immediately starts processing receive frames. Received frame processing proceeds as follows: • When E_RxDV asserts, the receiver first checks for a valid header comprised of a preamble and start-of-frame delimiter (PA/SDF). • If the PA/SFD is valid, it is stripped off and the frame processed further by the receiver. If a valid PA/SFD is not found, the frame is ignored. • In serial mode, the first 16 bit times of E_RxD0 following assertion of E_RxDV (RENA) are ignored. • After the first 16 bit times, the data sequence is checked for alternating I/0. • If a 11 or 00 data sequence is detected during bit times 17 to 21, the remainder of the frame is ignored. • After bit time 21, the data sequence is monitored for a valid start-of-frame delimiter (SFD) of 11. If a 00 is detected, the frame is rejected. When a 11 is detected, the PA/SFD sequence is complete. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-5

Ethernet Module • In MII mode, the receiver checks for at least one byte matching the SFD. Zero or more PA bytes may occur, but if a 00 bit sequence is detected before the SFD byte, the frame is ignored. • After the first 8 bytes of the frame have been passed to the receive FIFO, the FEC performs address recognition on the frame. As soon as a collision window (512 bits) of data is received, and if address recognition has not rejected the frame, the FEC starts transferring the incoming frame to the receive buffer descriptor’s (RxBD’s) associated data buffer. If the frame is a runt (due to collision) or is rejected by address recognition, no receive buffers are filled. Thus, no collision frames are presented to the user except late collisions, which indicate serious LAN problems. When the data buffer has been filled, the FEC clears RxBD[E] and generates an RXB interrupt (if RBIEN is asserted in EIMR register). If the incoming frame exceeds the length of the data buffer, the FEC fetches the next RxBD in the table and, if it is empty, continues transferring the rest of the frame to this BD’s associated data buffer. The RxBD length is determined in the R_BUFF_SIZE value in the EMRBR register. The user should program R_BUFF_SIZE to be at least 128 bytes. R_BUFF_SIZE must be quad-word (16-byte) aligned. During reception, the FEC checks for a frame that is either too short or too long. When the frame ends (carrier sense is negated), the receive CRC field is checked and written to the data buffer. The data length written to the last BD in the Ethernet frame is the length of the entire frame. Frames shorter than 64 bytes are discarded automatically with no system bus impact. When the receive frame is complete, the FEC sets RxBD[L], writes the other frame status bits into the RxBD and clears RxBD[E]. The FEC next generates a maskable interrupt (EIR[RFINT], maskable by EIMR[RFIEN]), indicating that a frame has been received and is in memory. The FEC then waits for a new frame. The FEC receives serial data lsb first. 11.4.2 CAM Interface In addition to the FEC address recognition logic, an external CAM may be used for frame reject with no additional pins other than those in the MII interface. This CAM interface is documented in an application note titled “Using Freescale’s Fast Static RAM CAMs with the MPC860T’s Media Independent Interface,” located at the following URL: http://www.freescale.com. 11.4.3 Ethernet Address Recognition The FEC filters the received frames based on the type of destination media access controller address (hardware address). There are three destination address (DA) types: • Individual (unicast) • Group (multicast) • Broadcast (all-ones group address) The difference between an individual address and a group address is determined by the I/G bit in the destination address field. A flowchart for address recognition on received frames is illustrated in Figure 11-4 and summarized in Table 11-3. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-6 Freescale Semiconductor

Ethernet Module . Table11-3. Ethernet Address Recognition Destination FEC Address Processing Address Type individual The FEC compares the destination address field of the received frame with the 48-bit MAC address programmed into MALR and MAUR. group The FEC determines whether or not the group address is a broadcast address. If not broadcast, a hash table lookup is performed using the 64-entry hash table defined in HTLR and HTUR. broadcast The frame is accepted unconditionally. In promiscuous mode (PROM = 1 in RCR), the FEC receives all of the incoming frames regardless of their address. In this mode, the destination address lookup is still performed and RxBD[MISS] is set accordingly. If address recognition did not achieve a match, the frame is received with RxBD[MISS] set. If address recognition achieves a match, the frame is received without setting RxBD[MISS]. Check Address I I/G Address ? G True Broadcast Address ? Receive Frame False True Hash Match ? Receive Frame False False True Perfect Match ? Receive Frame Promiscuous True (RCR[PROM] = 1) Mode ? False Receive Frame (RCR[PROM] = 0) Set Miss Bit Discard Frame Figure11-4. Ethernet Address Recognition Flowchart MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-7

Ethernet Module 11.4.4 Hash Table Algorithm The hash table process used in the group hash filtering operates as follows. When a frame with the destination address I/G bit set is received by the FEC, the 48-bit destination media access control (MAC) address is mapped into one of 64 bins, which are represented by 64 bits stored in HTLR and HTUR. This is performed by passing the 48-bit MAC address through the on-chip 32-bit CRC generator and selecting 6 bits of the CRC-encoded result to generate a number between 0 and 63. Bit 31 of the CRC result selects HTUR (bit 31 = 1) or HTLR (bit 31 = 0). Bits 30–26 of the CRC result select the bit within the selected register. If the CRC generator selects a bit that is set in the hash table, the frame is accepted; otherwise, it is rejected. The result is that if eight group addresses are stored in the hash table and random group addresses are received, the hash table prevents roughly 56/64 (or 87.5%) of the group address frames from reaching memory. Those that do reach memory must be further filtered by the processor to determine if they truly contain one of the eight preferred addresses. The effectiveness of the hash table declines as the number of addresses increases. The hash table registers must be initialized by the user. The CRC32 polynomial to use in computing the hash is as follows: X32+X26+X23+X22+X16+X12+X11+X10+X8+X7+X5+X4+X2+X+1 11.4.5 Interpacket Gap Time The minimum interpacket gap time for back-to-back transmission is 96 bit times. After completing a transmission or after the backoff algorithm completes, the transmitter waits for carrier sense to negate before starting its interpacket gap time counter. Frame transmission may begin 96 bit times after carrier sense is negated if it stays negated for at least 60 bit times. If carrier sense asserts during the last 36 bit times, it is ignored and a collision will occur. The receiver receives back-to-back frames separated by at least 28 bit times. If an interpacket gap between receive frames is less than 28 bit times, the following frame may be discarded by the receiver. 11.4.6 Collision Handling If a collision occurs during transmission, the FEC continues transmitting for at least 32 bit times, sending a JAM pattern of 32 ones. The JAM pattern follows the preamble sequence if the collision occurs during preamble. If a collision occurs within 64 byte times, the retry process is initiated. The transmitter waits a random number of slot times. A slot time is 512 bit times. If a collision occurs after 64 byte times, no retransmission is performed and the end-of-frame buffer is closed with an LC error indication. 11.4.7 Internal and External Loopback Both internal and external loopback are supported by the FEC. In loopback mode, both of the FIFOs are used and the FEC actually operates in a full-duplex fashion. Both internal and external loopback are configured using combinations of RCR[LOOP]. For internal loopback, set LOOP and clear DRT. E_TxEN and E_TxER cannot assert during internal loopback. For external loopback, clear LOOP, set DRT, and configure the external transceiver for loopback. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-8 Freescale Semiconductor

Ethernet Module 11.4.8 Ethernet Error-Handling Procedure The FEC reports frame reception and transmission error conditions through the buffer descriptors and the EIR register. 11.4.8.1 Transmission Errors Transmission errors are defined in Table11-4. Table11-4. Transmission Errors Error Description Transmitter The FEC sends 32 bits that ensure a CRC error and stops transmitting. All remaining buffers for that frame Underrun are then flushed and closed, with the UN bit set in the last TxBD for that frame. The FEC continues to the next TxBD and begins transmitting the next frame. Carrier Sense When this error occurs and no collision is detected in the frame, the FEC sets the CSL bit in the last TxBD Lost during Frame for this frame. The frame is sent normally. No retries are performed as a result of this error. The CSL bit is Transmission not set if TCR[FDEN] = 1, regardless of the state of CRS. Retransmission When this error occurs, the FEC terminates transmission. All remaining buffers for that frame are then Attempts Limit flushed and closed, with the RL bit set in the last TxBD for that frame. The FEC then continues to the next Expired TxBD and begins sending the next frame. Late Collision1 The FEC stops sending. All remaining buffers for that frame are then flushed and closed, with the LC bit set in the last TxBD for that frame. The FEC then continues to the next TxBD and begins sending the next frame. Heartbeat Some transceivers have a self-test feature called heartbeat or signal-quality error. To signify a good self-test, the transceiver indicates a collision within 20 clocks after the FEC sends a frame. This heartbeat condition does not imply a real collision, but that the transceiver seems to be functioning properly. If TCR[HBC] is set and the heartbeat condition is not detected by the FEC after a frame transmission, then a heartbeat error occurs. When this error occurs, the FEC closes the buffer, sets the HB bit in the Tx BD, and generates the HBERR interrupt if it is enabled. 1 The definition of what constitutes a late collision is hard-wired in the FEC. 11.4.8.2 Reception Errors Table 11-5 describes reception errors. Table11-5. Reception Errors Error Description Overrun Error The FEC maintains an internal FIFO for receiving data. If a receiver FIFO overrun occurs, the FEC closes the buffer and sets RxBD[OV]. Non-Octet Error The FEC handles up to seven dribbling bits when the receive frame terminates non-octet aligned and it checks (Dribbling Bits) the CRC of the frame on the last octet boundary. If there is a CRC error, the frame non-octet aligned (NO) error is reported in the RxBD. If there is no CRC error, no error is reported. CRC Error When a CRC error occurs with no dribbling bits, the FEC closes the buffer and sets RxBD[CR]. CRC checking cannot be disabled, but the CRC error can be ignored if checking is not required. Frame Length When the receive frame length exceeds R_HASH[MAX_FRAME_LENGTH], EIR[BABR] is set indicating Violation babbling receive error, and the LG bit in the end of frame RxBD is set. Note: Receive frames exceeding 2047 bytes are truncated. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-9

Ethernet Module 11.5 Programming Model This section gives an overview of the registers, followed by a description of the buffers. The FEC is programmed by a combination of control/status registers (CSRs) and buffer descriptors. The CSRs are used for mode control and to extract global status information. The descriptors are used to pass data buffers and related buffer information between the hardware and software. Table 11-6 shows the FEC register memory map with each register address, name, and a brief description. Table11-6. FEC Register Memory Map Offset Name Width Description 0x840 ECR 32 Ethernet control register, [p. 11-11] 0x844 EIR 32 Interrupt event register, [p. 11-12] 0x848 EIMR 32 Interrupt mask register, [p. 11-13] 0x84C IVSR 32 Interrupt vector status register, [p. 11-14] 0x850 RDAR 32 Receive descriptor active register, [p. 11-15] 0x854 TDAR 32 Transmit descriptor active register, [p. 11-16] 0x880 MMFR 32 MII management frame register, [p. 11-17] 0x884 MSCR 32 MII speed control register, [p. 11-18] 0x8CC FRBR 32 FIFO receive bound register, [p. 11-19] 0x8D0 FRSR 32 FIFO receive start register, [p. 11-20] 0x8EC TFSR 32 FIFO transmit start register, [p. 11-22] 0x8E4 TFWR 32 Transmit FIFO watermark, [p. 11-21] 0x944 RCR 32 Receive control register, [p. 11-23] 0x948 MFLR 32 Maximum frame length register, [p. 11-24] 0x984 TCR 32 Transmit control register, [p. 11-25] 0xC00 MALR 32 Lower 32-bits of MAC address 0xC04 MAUR 32 Upper 16-bits of MAC address 0xC08 HTUR 32 Upper 32-bits of hash table, [p. 11-28] 0xC0C HTLR 32 Lower 32-bits of hash table, [p. 11-29] 0xC10 ERDSR 32 Pointer to receive descriptor ring, [p. 11-30] 0xC14 ETDSR 32 Pointer to transmit descriptor ring, [p. 11-31] 0xC18 EMRBR 32 Maximum receive buffer size, [p. 11-32] 0xC40– EFIFO 32 FIFO RAM space 0xDFF The following sections describe each register in detail. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-10 Freescale Semiconductor

Ethernet Module 11.5.1 Ethernet Control Register (ECR) The ECR register, Figure 11-5, is used to enable/disable the FEC. It is written by the user and cleared at system reset. 31 26 25 24 16 Field — TX_RT — Reset 0000_0000_0000_0000 R/W Read/write 15 2 1 0 Field — ETHER_EN RESET Reset 0000_0000_0000_0000 R/W Read/write Addr MBAR + 0x840 Figure11-5. Ethernet Control Register (ECR) Table11-7. ECR Field Descriptions Bits Name Description 31–26 — Reserved, should be cleared. 25 TX_RT Transmit retime. 0 Normal operation, seven-wire serial mode. 1 The transmit output signals (E_TxD[3:0], E_TxEN, and E_TxER) are delayed by one-half of a E_TxCLK period. This bit should be set to provide compatibility with transceivers that have hold time requirements that exceed the MII specification. 24–2 — Reserved, should be cleared. 1 ETHER_EN Ethernet enable. When this bit is set, the FEC is enabled, and reception and transmission is possible. When this bit is cleared, reception is immediately stopped and transmission is stopped after a bad CRC is appended to any frame currently being transmitted. The buffer descriptor(s) for an aborted transmit frame are not updated following deassertion of ETHER_EN. When ETHER_EN is deasserted, the DMA, buffer descriptor, and FIFO control logic are reset, including FIFO pointers. 0 RESET Ethernet controller reset. When this bit is set, the equivalent of a hardware reset is performed but it is local to the FEC. ETHER_EN is cleared and all other FEC registers take their reset values. Also, any transmission/reception currently in progress is abruptly aborted. This bit is automatically cleared by hardware once the reset sequence is complete (approximately 16 clock cycles after being set). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-11

Ethernet Module 11.5.2 Interrupt Event Register (EIR) An event that sets a bit in EIR generates an interrupt if the corresponding bit in the interrupt mask register (EIMR) is set. Bits in the interrupt event register are cleared when a one is written to them. Writing a zero has no effect. 31 30 29 28 27 26 25 24 23 22 21 20 16 Field HBERR BABR BABT GRA TXF TXB RXF RXB MII EBERR UMINT — Reset 0000_0000_0000_0000 R/W Read/write 15 0 Field — Reset 0000_0000_0000_0000 R/W Read/write Addr MBAR + 0x844 Figure11-6. Interrupt Event Register (EIR) Table11-8. EIR Field Descriptions Bits Name Description 31 HBERR Heartbeat error. A heartbeat was not detected within the heartbeat window following a transmission. 30 BABR Babbling receive error. A frame was received with length in excess of MAX_FL bytes. 29 BABT Babbling transmit error. The transmitted frame length has exceeded MAX_FL bytes. This condition is usually caused by a frame that is too long being placed into the transmit data buffer(s). Truncation does not occur. 28 GRA Graceful stop complete. A graceful stop, which was initiated by setting X_CTRL[GTS], is now complete. This bit is set as soon as the transmitter has finished transmitting any frame that was in progress when GTS was set. 27 TXF Transmit frame interrupt. A frame has been transmitted and that the last corresponding buffer descriptor has been updated. 26 TXB Transmit buffer interrupt. A transmit buffer descriptor has been updated. 25 RXF Receive frame interrupt. A frame has been received and the last corresponding buffer descriptor has been updated. 24 RXB Receive buffer interrupt. A receive buffer descriptor has been updated. 23 MII MII interrupt. The MII has completed the data transfer requested. 22 EBERR FEC bus error. A bus error occurred when the FEC was accessing an internal bus. 21 UMINT Unmasked interrupt status. An interrupt is currently being asserted to the interrupt controller. This bit is not maskable. 20–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-12 Freescale Semiconductor

Ethernet Module 11.5.3 Interrupt Mask Register (EIMR) The EIMR register provides control over which possible interrupt events are allowed to actually cause an interrupt.This register is cleared upon a hardware reset. 31 30 29 28 27 26 25 24 23 22 21 16 Field HBERR BABR BABT GRA TXF TXB RXF RXB MII EBERR — Reset 0000_0000_0000_0000 R/W Read/write 15 0 Field — Reset 0000_0000_0000_0000 R/W Read/write Addr MBAR + 0x848 Figure11-7. Interrupt Mask Register (EIMR) Table11-9. EIMR Register Field Descriptions Bits Name Description 31–22 See Interrupt mask. Each bit corresponds to an interrupt source defined by the EIR register. The Figure11-7 corresponding EIMR bit determines whether an interrupt condition can generate an interrupt. At every clock, the EIR samples the signal generated by the interrupting source. The corresponding EIR bit reflects the state of the interrupt signal even if the corresponding EIMR bit is set. 0 The corresponding interrupt source is masked . 1 The corresponding interrupt source is not masked. 21–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-13

Ethernet Module 11.5.4 Interrupt Vector Status Register (IVSR) The IVSR register gives status indicating the class of interrupt being generated by the FEC. Interrupt level control is provided in the interrupt control registers of the SIMBC. 31 16 Field — Reset 0000_0000_0000_0000 R/W Read Only 15 4 3 2 1 0 Field — IVEC — Reset 0000_0000_0000_0000 R/W Read Only Addr MBAR + 0x84C Figure11-8. Interrupt Vector Status Register (IVSR) Table11-10. IVSR Field Descriptions Bit Name Description 31–4 — Reserved, should be cleared. 3–2 IVEC Interrupt vector. IVEC gives the highest outstanding priority FEC interrupt. The bit field meanings (from low priority to high priority) are as follows: 00 No pending FEC interrupt 01 Non-time critical interrupt (All interrupts except TXB, TXF, RXB, and RXF.) 10 Transmit interrupt 11 Receive interrupt 1–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-14 Freescale Semiconductor

Ethernet Module 11.5.5 Receive Descriptor Active Register (RDAR) The RDAR register, Figure 11-9, is a command register that should be written by the user to indicate that the receive descriptor ring has been updated (empty receive buffers have been produced by the driver with the E bit set). The R_DES_ACTIVE bit is set whenever the register is written. This is independent of the data actually written by the user. When set, the FEC polls the receive descriptor ring and processes receive frames (provided ETHER_EN is also set). As soon as the FEC polls a receive descriptor whose E bit is not set, it clears the R_DES_ACTIVE bit and stops polling the receive descriptor ring. The RDAR register is cleared at reset and when ETHER_EN is cleared. 31 25 24 23 16 Field — R_DES_ACTIVE — Reset 0000_0000_0000_0000 R/W Read/Write 15 0 Field — Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x850 Figure11-9. Receive Descriptor Active Register (RDAR) Table 11-11 describes the RDAR fields. Table11-11. RDAR Register Field Descriptions Bit Name Description 31–25 — Reserved, should be cleared. 24 R_DES_ACTIVE Set when this register is written, regardless of the value written. Cleared by the FEC whenever no additional empty descriptors remain in the receive ring. 23–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-15

Ethernet Module 11.5.6 Transmit Descriptor Active Register (TDAR) The TDAR register, Figure 11-10, is a command register which should be set by the user to indicate that the transmit descriptor ring has been updated, that is, transmit buffers have been defined by the driver with the ready bit set in the buffer descriptor. The X_DES_ACTIVE bit is set whenever the register is written. This is independent of the data actually written by the user. When TDAR is set, the FEC polls the transmit descriptor ring and processes transmit frames (provided ETHER_EN is also set). As soon as the FEC polls a transmit descriptor whose ready bit is not set, it clears the X_DES_ACTIVE bit and stops polling the transmit descriptor ring. The TDAR register is cleared at reset and when ETHER_EN is cleared. Figure 11-10 describes this register. 31 25 24 23 16 Field — X_DES_ACTIVE — Reset 0000_0000_0000_0000 R/W Read/Write 15 0 Field — Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR +0x854 Figure11-10. Transmit Descriptor Active Register (TDAR) Table 11-12 describes the TDAR fields. Table11-12. TDAR Field Descriptions Bits Name Description 31–25 — Reserved, should be cleared. 24 X_DES_ACTIVE Set to one when this register is written, regardless of the value written. Cleared by the FEC whenever no additional ready descriptors remain in the transmit ring. 23–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-16 Freescale Semiconductor

Ethernet Module 11.5.7 MII Management Frame Register (MMFR) The MMFR register, Figure 11-11, is used to communicate with the attached MII compatible PHY device(s), providing read/write access to their MII registers. Performing a write to the MMFR register causes a management frame to be sourced, unless the MSCR register has been programmed to 0. In the case of writing to MMFR when MSCR =0, if the MSCR register is then written to a non-zero value, an MII frame is generated with the data previously written to MMFR. This allows MMFR and MSCR to be programmed in either order if MSCR is currently zero. 31 30 29 28 27 23 22 18 17 16 Field ST OP PA RA TA Reset Undefined R/W Read/Write 15 0 Field DATA Reset Undefined R/W Read/Write Addr MBAR + 0x880 Figure11-11. MII Management Frame Register (MMFR) Table 11-13 describes the MMFR fields. Table11-13. MMFR Field Descriptions Bits Name Description 31–30 ST Start of frame delimiter. Must be programmed to 01 for a valid MII management frame 29–28 OP Operation code. This field must be programmed to 10 (read) or 01(write) to generate a valid MII management frame. A value of 11 produces a read frame operation while a value of 00 produces a write frame operation, but these frames are not MII-compliant. 27–23 PA PHY address. Specifies one of up to 32 attached PHY devices 22–18 RA Register address. Specifies one of up to 32 registers within the specified PHY device 17–16 TA Turn around. Must be programmed to 10 to generate a valid MII management frame. 15–0 DATA Management frame data. Field for data to be written to or read from PHY register To perform a read or write operation on the MII management interface, the MMFR register is written by the user. To generate a valid read or write management frame, the ST field must be written with a 01 pattern, the OP field must be written with a 01 (management register write frame) or 10 (management register read frame), and the TA field must be written with a 10. If other patterns are written to these fields, a frame is generated but will not comply with the IEEE 802.3 MII definition. OP field = 1x produces a read-frame operation, while OP = 0x produces a write-frame operation. To generate an 802.3-compliant MII management interface write frame (write to a PHY register), the user must write {01 01 PHYAD REGAD 10 DATA} to the MMFR register. Writing this pattern causes the control logic to shift out the data in the MMFR register following a preamble generated by the control state machine. The contents of MMFR are altered as the contents are serially shifted, and are unpredictable if read by the user. Once the write management frame operation completes, the MII interrupt is generated. At this time, the contents of the MMFR register match the original value written. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-17

Ethernet Module To generate an MII management interface read frame (read a PHY register), the user must write {01 10 PHYAD REGAD 10 XXXX} to MMFR (the contents of the DATA field are a don’t care). Writing this pattern causes the control logic to shift out the data in the MMFR register following a preamble generated by the control state machine.The contents of the MMFR register are altered as the contents are serially shifted, and are unpredictable if read by the user. Once the read management frame operation completes, the MII interrupt is generated. At this time the contents of the MMFR register matches the original value written except for the DATA field, whose contents are replaced by the value read from the PHY register. If the MMFR register is written while frame generation is in progress, the frame contents are altered. Software should use the MII interrupt to avoid writing to the MMFR register while frame generation is in progress. 11.5.8 MII Speed Control Register (MSCR) The MSCR register, Figure11-12, provides control of the MII clock (E_MDC pin) frequency, allows dropping the preamble on the MII management frame and provides observability (intended for manufacturing test) of an internal counter used in generating the E_MDC clock signal. 31 16 Field — Reset 0000_0000_0000_0000 R/W Read/Write 15 8 7 6 1 0 Field — DIS_PREAMBLE MII_SPEED — Reset 0000_0000 0 000_000 0 R/W Read/Write Addr MBAR + 0x884 Figure11-12. MII Speed Control Register (MSCR) Table 11-14 describes the MSCR fields. Table11-14. MSCR Field Descriptions Bits Name Description 31–8 — Reserved, should be cleared. 7 DIS_PREAMBLE Disable preamble. Asserting this bit causes the preamble of 32 consecutive 1’s not to be prepended to the MII management frame. The MII standard allows the preamble to be dropped if the attached PHY device(s) do not require it. 6–1 MII_SPEED MII frequency divider. MII_SPEED controls the frequency of the MII management interface clock (E_MDC) relative to system clock. A value of 0 in this field turns off the E_MDC and leaves it in low-voltage state. Any non-zero value results in an E_MDC frequency given by the following formula: MDC_FREQUENCY = system frequency / (4 * MII_SPEED) 0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-18 Freescale Semiconductor

Ethernet Module The MII_SPEED field must be programmed with a value to provide an E_MDC frequency of less than or equal to 2.5 MHz to be compliant with the IEEE MII specification. The MII_SPEED must be set to a non-zero value in order to source a read or write management frame. After the management frame is complete, the MSCR register may optionally be set to zero to turn off the E_MDC. The E_MDC generated will have a 50% duty cycle except when MII_SPEED is changed during operation. Change will take effect following either a rising or falling edge of E_MDC. If the system clock is 50 MHz, programming this register to 0x0000_000A results in an E_MDC frequency of 25 MHz * 1/10 = 2.5 MHz. Table11-15 shows optimum values for MII_SPEED as a function of system clock frequency. Table11-15. Programming Examples for MSCR Register System Clock Frequency [MII_SPEED] E_MDC frequency 25 MHz 0x3 2.08 MHz 33 MHz 0x4 2.06 MHz 50 MHz 0x5 2.5 MHz 66 MHz 0x7 2.36 MHz 11.5.9 FIFO Receive Bound Register (FRBR) FRBR is a read-only register used to determine the upper address boundary of the FIFO RAM. Drivers can use this value, along with the registers FRSR and TFSR, to appropriately divide the available FIFO RAM between the transmit and receive data paths. The value in this register must be added to MBAR + 0x800 to determine the absolute address. 31 16 Field — Reset 0000_0000_0000_0000 R/W Read only 15 11 10 2 1 0 Field — R_BOUND — Reset 0000_0 110_0000_00 00 R/W Read only Addr MBAR + 0x884 Figure11-13. FIFO Receive Bound Register (FRBR) Table 11-16 describes the FRBR fields. Table11-16. FRBR Field Descriptions Bits Name Description 31–11 — Reserved, should be cleared. 10–2 R_BOUND End of FIFO RAM. This field contains the ending address of the FIFO RAM, exclusive. 1–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-19

Ethernet Module 11.5.10 FIFO Receive Start Register (FRSR) The FRSR register, Figure 11-14, is programmed by the user to indicate the starting address of the receive FIFO. FRSR marks the boundary between the transmit and receive FIFOs. The transmit FIFO uses addresses from TFSR to FRSR - 4. The receive FIFO uses addresses from FRSR to FRBR - 4. The value in this register must be added to MBAR + 0x800 to determine the absolute address. FRSR needs to be written only to change the default value. 31 16 Field — Reset 0000_0000_0000_0000 R/W Read/Write 15 11 10 9 2 1 0 Field — 1 R_FSTART — Reset 0000_0 1 01_0000_00 00 R/W Read/Write Addr MBAR + 0x8D0 Figure11-14. FIFO Receive Start Register (FRSR) Table 11-17 describes the FRSR fields. Table11-17. FRSR Field Descriptions Bits Name Description 31–11 — Reserved, should be cleared. 10 1 Reserved, should be set. 9–2 R_FSTART Receive FIFO starting address. Address of first receive FIFO location. Acts as delimiter between receive and transmit FIFOs. 1–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-20 Freescale Semiconductor

Ethernet Module 11.5.11 Transmit FIFO Watermark (TFWR) The TFWR register, shown in Figure 11-15, controls the amount of data required in the transmit FIFO before transmission of a frame can begin. Setting TFWR to larger values reduces the risk of transmit FIFO underrun due to system bus latency. 31 16 Field — Reset 0000_0000_0000_0000 R/W Read/Write 15 2 1 0 Field — X_WMRK Reset 0000_0000_0000_00 00 R/W Read/Write Addr MBAR + 0x8E4 Figure11-15. Transmit FIFO Watermark (TFWR) Table 11-18 describes the TFWR fields. Table11-18. TFWR Field Descriptions Bits Name Description 31–2 — Reserved, should be cleared. 1–0 X_WMRK Transmit FIFO watermark. Frame transmission begins when the number of bytes selected by this field are written into the transmit FIFO, if an end of frame has been written to the FIFO, or if the FIFO is full before the selected number of bytes are written. The options are: 0X 64 bytes written to transmit FIFO 10 128 bytes written to transmit FIFO 11 192 bytes written to transmit FIFO MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-21

Ethernet Module 11.5.12 FIFO Transmit Start Register (TFSR) The TFSR register, Figure 11-16, can be programmed by the user to indicate the starting address of the transmit FIFO. Usually there is no need to program TFSR. For optimal RAM allocation, do not program TFSR to a value less than its reset value. The value in this register must be added to MBAR + 0x800 to determine the absolute address. The TFSR register is reset to the first available RAM address. 31 16 Field — Reset 0000_0000_0000_0000 R/W Read/Write 15 11 10 9 2 1 0 Field — 1 X_FSTART — Reset 0000_0 1 0001_1000 00 R/W Read/Write Addr MBAR + 0x8EC Figure11-16. FIFO Transmit Start Register (TFSR) Table 11-19 describes the TFSR fields. Table11-19. TFSR Field Descriptions Bits Name Description 31–11 — Reserved, should be cleared. 10 — Reserved, should be set. 9–2 X_FSTART Transmit FIFO starting address. Address of first transmit FIFO location. 1–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-22 Freescale Semiconductor

Ethernet Module 11.5.13 Receive Control Register (RCR) The RCR register, Figure 11-17, controls the operational mode of the receive block. 31 16 Field — Reset 0000_0000_0000_0000 R/W Read/Write 15 4 3 2 1 0 Field — PROM MII_MODE DRT LOOP Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x944 Figure11-17. Receive Control Register (RCR) Table 11-20 describes the RCR fields. Table11-20. RCR Field Descriptions Bits Name Description 31–4 — Reserved, should be cleared. 3 PROM Promiscuous mode. All frames are accepted regardless of address matching. 2 MII_MODE MII mode enable. Selects the external interface mode. Setting this bit to one selects MII mode, setting this bit equal to zero selects seven-wire mode (used only for serial 10 Mbps). This bit controls the interface mode for both transmit and receive blocks. 1 DRT Disable receive on transmit 0 Receive path operates independently of transmit (use for full duplex or to monitor transmit activity in half-duplex mode). 1 Disable reception of frames while transmitting (normally used for half-duplex mode). 0 LOOP Internal loopback. If set, transmitted frames are looped back internal to the FEC and the transmit output signals are not asserted. The system clock is substituted for the E_TxCLK when LOOP is asserted. DRT must be set to zero when asserting LOOP. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-23

Ethernet Module 11.5.14 Maximum Frame Length Register (MFLR) As shown in Figure 11-18, the MFLR register serves two purposes. Bits 10–0 provide the user R/W MAX_FL field. The MAX_FL field allows the user to program the maximum legal-size frame. Frames larger than this size cause the BABT interrupt (transmit frames) or BABR interrupt and receive buffer descriptor LG bit to be asserted (receive frames). Frames exceeding the MAX_FL are not truncated. Bits 31–24 provide an eight-bit read-only field that provides address recognition information from the receive block about the frame currently being received by the FEC. 31 30 29 24 23 16 Field BRDCAST MULTCAST HASH — Reset 0000_0000_0000_0000 R/W Read/Write 15 11 10 0 Field — MAX_FL Reset 0000_0 101_1110_1110 R/W Read/Write Addr MBAR + 0x948 Figure11-18. Maximum Frame Length Register (MFLR) Table 11-21 describes the MFLR fields. Table11-21. MFLR Field Descriptions Bits Name Description 31 BRDCAST Broadcast address received. Set if the current receive frame contained a destination address of all ones (the broadcast address). Cleared if the current receive frame does not correspond to a broadcast address. 30 MULTCAST Multicast address received. Set if the current receive frame contained a multi-cast destination address (the least significant bit of the DA was set). Cleared if the current receive frame does not correspond to a multi-cast address. 29–24 HASH Current hash value. Corresponds to the hash value of the current receive frame’s destination address. The hash value is a 6-bit field extracted from the least significant portion of the CRC register. 23–11 — Reserved, should be cleared. 10–0 MAX_FL Maximum frame length. Length is measured starting at DA and includes the CRC at the end of the frame. Transmit frames longer than MAX_FL cause the BABT interrupt to occur. Receive frames longer than MAX_FL cause the BABR interrupt to occur and set the LG bit in the end-of-frame buffer descriptor. Frames exceeding the MAX_FL are not truncated. Transmit frames are never truncated, but receive frames are truncated at 2k-1 bytes. The MAX_FL field resets to 1518 decimal and can be programmed either smaller or larger (up to 2k-1). The recommended default value to be programmed by the user is 1518 or 1522 (if VLAN Tags are supported). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-24 Freescale Semiconductor

Ethernet Module 11.5.15 Transmit Control Register (TCR) The TCR register, Figure 11-19, controls the operational mode of the transmit block 31 16 Field — Reset 0000_0000_0000_0000 R/W Read/Write 15 3 2 1 0 Field — FDEN HBC GTS Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x984 Figure11-19. Transmit Control Register (TCR) Table 11-22 describes the TCR fields. Table11-22. TCR Field Descriptions Bits Name Description 31–3 — Reserved, should be cleared. 2 FDEN Full duplex enable. If set, frames are transmitted independent of carrier sense and collision inputs. This bit should only be modified when ETHER_EN is deasserted. 1 HBC Heartbeat control. If set, the heartbeat check is performed following end of transmission and the HB bit in the status register is set if the collision input does not assert within the heartbeat window. This bit should be modified only when ETHER_EN is deasserted. 0 GTS Graceful transmit stop. When this bit is set, the MAC stops transmission after any current frame is complete and the GRA interrupt in the INTR_EVENT register is asserted. If frame transmission is not currently underway, the GRA interrupt is asserted immediately. Once transmission is complete, a restart is accomplished by clearing the GTS bit. The next frame in the transmit FIFO is then transmitted. If an early collision occurs during transmission when GTS = 1, transmission stops after the collision. The frame is transmitted again once GTS is cleared. Note that there may be old frames in the transmit FIFO that are transmitted when GTS is reasserted. To avoid this, deassert ETHER_EN following the GRA interrupt. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-25

Ethernet Module 11.5.16 RAM Perfect Match Address Low (MALR) The MALR register contains the lower 32 bits of the 48 bit MAC address used in the address recognition process to compare with the Destination Address field of the receive frames. This register, shown in Figure 11-20, is not reset and must be initialized by the user prior to operation. 31 16 Field ADDR_LOW Reset Undefined R/W Read/Write 15 0 Field ADDR_LOW Reset Undefined R/W Read/Write Addr MBAR + 0xC00 Figure11-20. RAM Perfect Match Address Low (MALR) Table11-23. MALR Field Descriptions Bits Name Description 31–0 ADDR_LOW Bytes 0 (bits 31–24), 1 (bits 23–16), 2 (bits 15:8), and 3 (bits 7–0) of the 6-byte address. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-26 Freescale Semiconductor

Ethernet Module 11.5.16.1 RAM Perfect Match Address High (MAUR) The MAUR register contains bytes 4 and 5 of the 48-bit MAC address used in the address recognition process to compare with the destination address field of the receive frames. Byte 0 is the first byte transmitted on the network at the start of the frame. This register is not reset and must be initialized by the user prior to operation. See Figure 11-21. 31 16 Field ADDR_HIGH Reset Undefined R/W Read/Write 15 0 Field ADDR_HIGH Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0xC04 Figure11-21. RAM Perfect Match Address High (MAUR) Table11-24. MAUR Field Descriptions Bits Name Description 31–0 ADDR_HIGH Bytes 4 (bits 31–24) and 5 (bits 23–16) of the 6-byte address. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-27

Ethernet Module 11.5.17 Hash Table High (HTUR) The HTUR register, Figure 11-22, contains the upper 32 bits of the 64-bit hash table used in the address recognition process for receive frames with a multicast address. This register is not reset and must be initialized by the user prior to operation. 31 16 Field HASH_HIGH Reset Undefined R/W Read/Write 15 0 Field HASH_HIGH Reset Undefined R/W Read/Write Addr MBAR + 0xC08 Figure11-22. Hash Table High (HTUR) Table11-25. HTUR Field Descriptions Bits Name Description 31–0 HASH_HIGH The HTUR register contains the upper 32 bits of the 64-bit hash table used in the address recognition process for receive frames with a multicast address. Bit 31 of HTUR contains hash index bit 63. Bit 0 of HTUR contains hash index bit 32. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-28 Freescale Semiconductor

Ethernet Module 11.5.18 Hash Table Low (HTLR) The HTLR register, Figure 11-23, contains the lower 32 bits of the 64-bit hash table used in the address recognition process for receive frames with a multicast address. This register is not reset and must be initialized by the user prior to operation. 31 16 Field HASH_LOW Reset Undefined R/W Read/Write 15 0 Field HASH_LOW Reset Undefined R/W Read/Write Addr MBAR + 0xC0C Figure11-23. Hash Table Low (HTLR) Table11-26. HTLR Field Descriptions Bits Name Description 31–0 HASH_LOW The HTLR register contains the lower 32 bits of the 64-bit hash table used in the address recognition process for receive frames with a multicast address. Bit 31 of HTLR contains hash index bit 31. Bit 0 of HTLR contains hash index bit 0. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-29

Ethernet Module 11.5.19 Pointer-to-Receive Descriptor Ring (ERDSR) This register, Figure11-24, provides a pointer to the start of the circular receive buffer descriptor queue in external memory. This pointer must be long-word aligned. However, it is recommended it be aligned on a 16-byte boundary (address evenly divisible by 16) in order to improve bus utilization. Bits 1 and 0 should be written to 0 by the user. Non-zero values in these two bit positions are ignored by the hardware. This register is not reset and must be initialized by the user prior to operation. 31 16 Field R_DES_START Reset Undefined R/W Read/Write 15 2 1 0 Field R_DES_START 0 0 Reset Undefined R/W Read/Write Addr MBAR + 0xC10 Figure11-24. Pointer-to-Receive Descriptor Ring (ERDSR) Table11-27. ERDSR Field Descriptions Bits Name Description 31–2 R_DES_START Pointer to start of receive buffer descriptor queue. 1–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-30 Freescale Semiconductor

Ethernet Module 11.5.20 Pointer-to-Transmit Descriptor Ring (ETDSR) This register provides a pointer to the start of the circular transmit buffer descriptor queue in external memory. This pointer must be long-word aligned. However, it is recommended it be aligned on a 16 byte boundary (address evenly divisible by 16) in order to improve bus utilization. Bits 1 and 0 should be set to 0 by the user. Non-zero values in these two bit positions are ignored by the hardware. This register is not reset and must be initialized by the user prior to operation. 31 16 Field X_DES_START Reset Undefined R/W Read/Write 15 2 1 0 Field X_DES_START 0 0 Reset Undefined R/W Read/Write Addr MBAR + 0xC14 Figure11-25. Pointer-to-Transmit Descriptor Ring (ETDSR) Table11-28. ETDSR Field Descriptions Bits Name Description 31–2 X_DES_START Pointer to start of transmit buffer descriptor queue. 1–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-31

Ethernet Module 11.5.21 Receive Buffer Size Register (EMRBR) The EMRBR register dictates the maximum size of all receive buffers. Note that because receive frames are truncated at 2k-1 bytes, only bits 10–4 are used. This value should take into consideration that the receive CRC is always written into the last receive buffer. To allow one maximum size frame per buffer, R_BUFF_SIZE must be set to MAX_FL or larger. The R_BUFF_SIZE must be evenly divisible by 16. To insure this, bits 3–0 are forced low. To minimize bus utilization (descriptor fetches), it is recommended that R_BUFF_SIZE be at least 256 bytes. This register, Figure 11-26, is not reset and must be initialized by the user prior to operation. 31 16 Field — Reset 0000_0000_0000_0000 R/W Read/Write 15 11 10 4 3 0 Field — R_BUFF_SIZE — Reset 0000_0 0000 R/W Read/Write Addr MBAR + 0xC18 Figure11-26. Receive Buffer Size (EMRBR) Table11-29. EMRBR Field Descriptions Bits Name Description 31–11 — Reserved, should be cleared. 10–4 R_BUFF_SIZE Receive buffer size. 3–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-32 Freescale Semiconductor

Ethernet Module 11.5.22 Initialization Sequence This section describes which registers and RAM locations are reset due to hardware reset, which are reset due to the FEC reset, and what locations the user must initialize before enabling the FEC. As soon as the FEC is initialized and enabled, it operates autonomously. Typically, the driver writes only to RDAR, TDAR, and EIR during operation. 11.5.22.1 Hardware Initialization In the FEC, hardware resets only those registers that generate interrupts to the MCF5272 processor or cause conflict on bidirectional buses. The registers are reset due to a hardware reset. Table11-30. Hardware Initialization User/System Register/Machine Reset Value User ECR Cleared EIR Cleared EIMR Cleared MSCR Cleared System MII State Machine Prevent conflict on MMFR Other registers reset whenever the ETHER_EN bit is cleared. Clearing ETHER_EN immediately stops all DMA and transmit activity after a bad CRC is sent, as shown in Table 11-31 Table11-31. ETHER_EN = 0 System/User Location Effect System DMA block All DMA activity is terminated XMIT block Transmission is Aborted User RDAR Cleared TDAR Cleared 11.5.23 User Initialization (Prior to Asserting ETHER_EN) The user must initialize portions the FEC prior to setting the ETHER_EN bit. The exact values depend on the particular application. The sequence is similar to the procedure defined in Table11-32. Table11-32. User Initialization Process (before ETHER_EN) Step Description 1 Set EIMR 2 Clear EIR 3 Set IVSR (define ILEVEL) 4 Set FRSR (optional) 5 Set TFSR (optional) 6 Set MAUR and MALR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-33

Ethernet Module Table11-32. User Initialization Process (before ETHER_EN) (continued) Step Description 7 Set HTUR and HTLR 8 Set EMRBR 9 Set ERDSR 10 Set ETDSR 11 Set RCR 12 Set TCR 13 Set MSCR (optional) 14 Initialize (Empty) TxBD 15 Initialize (Empty) RxBD 11.5.24 FEC Initialization In the FEC, the descriptor control machine initializes a few registers whenever the ETHER_EN control is asserted. The transmit and receive FIFO pointers are reset, the transmit backoff random number is initialized, and the transmit and receive blocks are activated. After the FEC initialization sequence is complete, the hardware is ready for operation, waiting for RDAR and TDAR to be asserted by the user. 11.5.24.1 User Initialization (after setting ETHER_EN) The user initializes portions of the FEC after setting ETHER_EN. The exact values depend on the particular application. The sequence probably resembles the steps shown in Table 11-33, though these could also be done before asserting ETHER_EN. Table11-33. User Initialization (after ETHER_EN) Step Description 1 Fill Receive Descriptor Ring with Empty Buffers 2 Set RDAR 11.6 Buffer Descriptors Data associated with the FEC controller is stored in buffers, which are referenced by buffer descriptors (BDs) organized as tables in the dual-port RAM. These tables have the same basic configuration as those used by the USB. The BD table allows users to define separate buffers for transmission and reception. Each table forms a circular queue, or ring. The FEC uses status and control fields in the BDs to inform the core that the buffers have been serviced, to confirm reception and transmission events, or to indicate error conditions. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-34 Freescale Semiconductor

Ethernet Module 11.6.1 FEC Buffer Descriptor Tables The data for the fast Ethernet frames must reside in memory external to the FEC. The data for a frame is placed in one or more buffers. Each buffer has a pointer to it in a buffer descriptor (BD). In addition to pointing to the buffer, the BD contains the current state of the buffer. To permit maximum user flexibility, the BDs are also located in external memory. Software defines buffers by allocating/initializing memory and initializing buffer descriptors. Setting the RxBD[E] or TxBD[R] produces the buffer. Software writing to either TDAR or RDAR tells the FEC that a buffer has been placed in external memory for the transmit or receive data traffic, respectively. The hardware reads the BDs and processes the buffers after they have been defined. After the data DMA is complete and the BDs have been written by the DMA engine, RxBD[E] or TxBD[R] are cleared by hardware to indicate that the buffer has been processed. Software may poll the BDs to detect when the buffers have been processed or may rely on the buffer/frame interrupts. The ETHER_EN signal operates as a reset to the BD/DMA logic. When ETHER_EN is negated, the DMA engine BD pointers are reset to point to the starting transmit and receive BDs. The buffer descriptors are not initialized by hardware during reset. At least one transmit and receive BD must be initialized by software (write 0x0000_0000 to the most significant word of buffer descriptor) before the ETHER_EN bit is set. The BDs are organized in two separate rings, one for receive buffers and one for transmit buffers. ERDSR defines the starting address of the receive BDs and ETDSR the same for the transmit BDs. The last buffer descriptor in each ring is defined by the wrap (W) bit. When set, W indicates that the next descriptor in the ring is at the location pointed to by ERDSR and ETDSR for the receive and transmit rings, respectively. Buffers descriptor rings must start on a double-word boundary. The format of the transmit and receive buffer descriptors are given in Figure 11-27 and Figure 11-28. 11.6.1.1 Ethernet Receive Buffer Descriptor (RxBD) In the RxBD, the user initializes the E and W bits in the first word and the pointer in the second word. When the buffer has been sent as a DMA, the FEC will modify the E, L, M, LG, NO, SH, CR, and OV bits and write the length of the used portion of the buffer in the first word. The M, LG, NO, SH, CR, and OV bits in the first word of the buffer descriptor are modified by the FEC only when the L bit is set. 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 +0 E RO1 W RO2 L — M BC MC LG NO SH CR OV TR +2 DATA LENGTH +4 Rx Data Buffer Pointer A[31–16] +6 Rx Data Buffer Pointer A[15–0] Figure11-27. Receive Buffer Descriptor (RxBD) The first word of the RxBD contains control and status bits. Its format is detailed below. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-35

Ethernet Module Table11-34. RxBD Field Descriptions Bits Name Description 15 E Empty. Written by the FEC (= 0) and user (= 1). 0 The data buffer associated with this BD has been filled with received data, or data reception has been aborted due to an error condition. The status and length fields have been updated as required. 1 The data buffer associated with this BD is empty, or reception is currently in progress. 14 RO1 Receive software ownership. This field is reserved for use by software. This read/write bit is not modified by hardware, nor does its value affect hardware. 13 W Wrap. Written by the user. 0 =The next buffer descriptor is found in the consecutive location. 1 =The next buffer descriptor is found at the location defined in ERDSR. 12 RO2 Receive software ownership. Reserved for use by software. This read/write bit is not modified by hardware, nor does its value affect hardware. 11 L Last in frame. Written by the FEC. 0 =The buffer is not the last in a frame. 1 =The buffer is the last in a frame. 10–9 — Reserved, should be cleared. 8 M Miss. Written by the FEC. This bit is set by the FEC for frames that were accepted in promiscuous mode, but were flagged as a miss by the internal address recognition. Thus, while in promiscuous mode, the user can use the M-bit to quickly determine whether the frame was destined to this station. Valid only if the L-bit and the PROM bit are set. 0 The frame was received because of an address recognition hit. 1 The frame was received because of promiscuous mode. 7 BC Broadcast. Written by the FEC. Will be set if DA is broadcast. (FF-FF-FF-FF-FF-FF) 6 MC Mulitcast. Written by the FEC. Is set if DA is multicast and not BC. 5 LG Rx frame length violation. Written by the FEC. A frame length greater than MAX_FL was recognized. Frames exceeding 2047 bytes are truncated to prevent wrapping hardware length counters. Valid only if the L-bit is set. 4 NO Rx non-octet-aligned frame. Written by the FEC. A frame that contained a number of bits not divisible by 8 was received, and the CRC check that occurred at the preceding byte boundary generated an error. Valid only if the L-bit is set. If this bit is set, the CR bit is not set. 3 SH Short frame. Written by the FEC. A frame length that was less than the minimum defined for this channel was recognized. The FEC does not support SH and this bit is always cleared. 2 CR Rx CRC error. Written by the FEC. Contains a CRC error and is an integral number of octets in length. Valid only if the L-bit is set. 1 OV Overrun. Written by the FEC. A receive FIFO overrun occurred during frame reception. If this bit is set, the other status bits, M, LG, NO, SH, CR, and CL, lose their normal meaning and are zero. Valid only if the L-bit is set. 0 TR Truncated receive frame. Written by the FEC. Set if the receive frame is truncated. Frames greater than or equal to 2048 bytes are truncated. Offset Data Written by the FEC. Data length is the number of octets written by the FEC into this BD’s data buffer if L + 2 Length = 0 (the value is equal to EMRBR), or the length of the frame including CRC if L = 1. It is written by the FEC once as the BD is closed. Offset Rx Buffer Written by the user. The receive buffer pointer, which always points to the first location of the associated + 4 Pointer data buffer, must always be evenly divisible by 16. The buffer must reside in memory external to the FEC. NOTE Anytime the software driver sets an E bit in a receive descriptor, the driver should immediately write to RDAR. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-36 Freescale Semiconductor

Ethernet Module 11.6.1.2 Ethernet Transmit Buffer Descriptor Data is presented to the FEC for transmission by arranging it in buffers referenced by the channel’s TxBDs. The FEC confirms transmission or indicates error conditions using the BDs to inform the host that the buffers have been serviced. In the TxBD, the user initializes the R, W, L, and TC bits and the length (in bytes) in the first word and the buffer pointer in the second words. If L = 0, then the FEC sets the R bit to 0 in the first word of the BD when the buffer is sent as a DMA. Status bits are not modified. If L = 1, then the FEC sets the R bit to 0 and will modify the DEF, HB, LC, RL, RC, UN, and CSL status bits in the first word of the BD after the buffer is sent as a DMA, and frame transmission is complete. 15 14 13 12 11 10 9 8 7 6 5 2 1 0 +0 R TO1 W TO2 L TC DEF HB LC RL RC UN CSL +2 DATA LENGTH +4 Tx Data Buffer Pointer A[31–16] +6 Tx Data Buffer Pointer A[15–0] Figure11-28. Transmit Buffer Descriptor (TxBD) The TxBD fields are detailed in Table 11-35. Table11-35. TxBD Field Descriptions Bits Name Description 15 R Ready. Written by the FEC (= 0) and user (= 1). 0 The data buffer associated with this BD is not ready for transmission. The user is free to manipulate this BD or its associated data buffer. The FEC clears this bit after the buffer has been transmitted or after an error condition is encountered. 1 The data buffer, which has been prepared for transmission by the user, has not been transmitted or is currently being transmitted. No fields of this BD may be written by the user once this bit is set. 14 TO1 Transmit software ownership bit.Reserved for use by software. This read/write bit is not modified by hardware, nor does its value affect hardware. 13 W Wrap. Written by the user. 0 The next buffer descriptor is found in the consecutive location. 1 The next buffer descriptor is found at the location defined in ETDSR. 12 TO2 Transmit software ownership bit. Reserved for use by software. This read/write bit is not modified by hardware, nor does its value affect hardware. 11 L Last in frame. Written by the user. 0 The buffer is not the last in the transmit frame. 1 The buffer is the last in the transmit frame. 10 TC Tx CRC. Written by the user and is only valid if L = 1. 0 End transmission immediately after the last data byte. 1 Transmit the CRC sequence after the last data byte. 9 DEF Defer indication. Written by the FEC and is only valid if L = 1. The FEC had to defer while trying to transmit a frame. This bit is not set if a collision occurs during transmission. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-37

Ethernet Module Table11-35. TxBD Field Descriptions (continued) Bits Name Description 8 HB Heartbeat error. Written by the FEC and is valid only if L = 1. The collision input was not asserted within the heartbeat window following the completion of transmission. Cannot be set unless the HBC bit is set in the TCR register. 7 LC Late collision. Written by the FEC and is only valid if L = 1. A collision has occurred after 56 data bytes are transmitted. The FEC terminates the transmission. 6 RL Retransmission limit. Written by the FEC and is only valid if L = 1. The transmitter has failed retry limit + 1 attempts to successfully transmit a message due to repeated collisions on the medium. 5–2 RC Retry count. Written by the FEC and is valid only if L = 1. These four bits indicate the number of retries required before this frame is successfully transmitted. If RC= 0, then the frame was transmitted correctly the first time. If RC = 15, then the frame was transmitted successfully while the retry count was at its maximum value. If RL is set, then RC has no meaning. 1 UN Underrun. Written by the FEC and is only valid if L = 1. The FEC encountered a transmit FIFO underrun while transmitting one or more of the data buffers associated with this frame. When transmit FIFO underrun occurs, transmission of the frame stops, and an incorrect CRC is appended. The remaining buffer(s) associated with this frame are sent as a DMA and dumped by the transmit logic. 0 CSL Carrier sense lost. Written by the FEC and is valid only if L = 1. Carrier sense dropped out or never asserted during transmission of a frame without collision. - Data Length Written by the user. Data length is the number of octets the FEC should transmit from this BD’s data buffer. It is never modified by the FEC. Bits [10–0] are used by the DMA engine; bits [15–11] are ignored. - Tx Buffer Pointer Written by the user. The transmit buffer pointer, which contains the address of the associated data buffer, may be even or odd. The buffer must reside in memory external to the FEC. This value is never modified by the FEC. An underrun occurs when, during transmit, the transmit FIFO empties before the end of the frame. Then, a bad CRC is appended to the partially transmitted data. In addition, the UN bit is set in the last BD for the current frame. This situation can occur if the FEC cannot access an internal bus, or if the next BD in the frame is not available. NOTE Anytime the software driver sets an R bit in a transmit descriptor, the driver should immediately write to TDAR. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-38 Freescale Semiconductor

Ethernet Module 11.7 Differences between MCF5272 FEC and MPC860T FEC The MCF5272 features the same FEC as the MPC860T with a few differences. The following list pertains to the MCF5272. • Limited throughput full-duplex 100Mbps operation. External bus use is the limiting factor. • Only big-endian mode is supported for buffer descriptors and buffers. • Separate interrupt vectors for Rx, Tx and non-time critical interrupts • Interrupt priority is set in the interrupt controller • The formula for calculating E_MDC clock frequency differs between MCF5272 and MPC860T: — MCF5272: E_MDC_FREQUENCY= system frequency / (4 * MII_SPEED) — MPC860T: E_MDC_FREQUENCY= system frequency / (2 * MII_SPEED) NOTE MCF5272 ethernet controller signal names are generally identical to those used in the MPC860T, except for a prefix of ‘E_’. For example, MDC in the MPC860T corresponds to E_MDC in the MCF5272. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 11-39

Ethernet Module MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 11-40 Freescale Semiconductor

Chapter 12 Universal Serial Bus (USB) This chapter provides an overview of the USB module of the MCF5272, including detailed operation information and the USB programming model. Connection examples and circuit board layout considerations are also provided. The USB Specification, Revision 1.1 is a recommended supplement to this chapter. It can be downloaded from http://www.usb.org. Chapter 2 of this specification, Terms and Abbreviations, provides definitions of many of the terms found here. NOTE Unless otherwise stated, all mention of the USB specification refers to revision 1.1. 12.1 Introduction The universal serial bus (USB) is an industry-standard extension to the PC architecture. The USB controller on the MCF5272 supports device mode data communication between itself and a USB host device, typically a PC. One host and up to 127 attached peripherals share USB bandwidth through a host-scheduled, token-based protocol. The USB uses a tiered star topology with a hub at the center of each star, as shown in Figure 12-1. Each wire segment is a point-to-point connection between the host A connector and a peripheral B connector. The USB cables contain four wires, two for data and two for power. The USB full-speed bit rate is 12Mbps. A limited-capability, low-speed mode is also defined at 1.5Mbps. The MCF5272 includes the following features: • Supports full-speed 12-Mbps USB devices and low-speed 1.5-Mbps devices • Full compliance with the Universal Serial Bus Specification, Revision 1.1 • Automatic processing of USB standard device requests: CLEAR_FEATURE, GET_CONFIGURATION, GET_DESCRIPTOR, GET_INTERFACE, GET_STATUS, SET_ADDRESS, SET_CONFIGURATION, SET_FEATURE, and SET_INTERFACE • Supports either internal or external USB transceiver • Programmable 512-byte receive and 512-byte transmit FIFO buffers • USB device controller with protocol control and administration for up to eight endpoints, 16 interfaces, and 16 configurations • Programmable endpoint types with support for up to eight control, interrupt, bulk, or isochronous endpoints • Independent interrupts for each endpoint MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-1

Universal Serial Bus (USB) • Supports remote wakeup • Detects start-of-frame and missed start-of-frame for isochronous endpoint synchronization • Notification of start-of-frame, reset, suspend, and resume events A B Peripheral B B Peripheral A A Hub A A Peripheral B B B A Hub A B Figure12-1. The USB “Tiered Star” Topology 12.2 Module Operation The MCF5272 USB system consists of a protocol state machine which controls the transmitter and receiver modules. The state machine implements only the USB function state diagram. The MCF5272 USB controller can serve as a USB function endpoint, but cannot serve as a USB host. 12.2.1 USB Module Architecture A block diagram of the USB module is shown in Figure 12-2. The module is partitioned into five functional blocks. These blocks are USB internal transceiver, clock generator, USB control logic, USB request processor, and endpoint controllers. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-2 Freescale Semiconductor

Universal Serial Bus (USB) To USB Internal Cable Transceiver USB_D- USB_D+ USB Control Logic USB Request USB_VDD Processor USB_GND USB_TP USB_TxEN USB_TN 512-Byte 512-Byte USB_RP OUT FIFO IN FIFO USB_RN USB_RxD USB_Susp External Transceiver Interface Endpoint 1024-Byte Clock USB_ExtCLK Controllers Configuration Generator RAM System Clock Internal Bus Figure12-2. USB Module Block Diagram 12.2.1.1 USB Transceiver Interface The USB module supports either an internal or external USB transceiver. USB_D+ and USB_D- drive USB cable D+ and D- lines, respectively. With additional external protection circuitry (see 12.5.3, “Recommended USB Protection Circuit”), equipment can be built that complies with Universal Serial Bus Specification, Rev. 1.1. Transceiver performance specifications are described in the Chapter 7 of the Universal Serial Bus Specification. See note on page , [p. 12-1]. When the internal transceiver is selected, (USBEPCTL0[AFEEN] is cleared), the driven outputs can be observed by using the parallel port A if these pins are configured for USB, using the PACNT register, 17.2.1, “Port A Control Register (PACNT)”. The USB module has separate power pins for the internal transceiver. NOTE USB_GND should always be grounded. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-3

Universal Serial Bus (USB) However, to reduce power consumption, USB_VDD may be left unconnected if either of the following is true: • The USB module is not used. • An external transceiver is used. 12.2.1.2 Clock Generator The USB module requires two clock inputs; the system clock and a 48-MHz data clock. The data clock source is selectable between the USB_ExtCLK pin or the system clock. The clock generator automatically uses the external clock as the data clock if it detects the presence of a clock signal on the USB_CLK pin during system reset. This automatic selection can be overridden by setting bit USBEPCTL0[CLK_SEL], . If a clock signal is not present on USB_CLK, the clock generator uses the system clock. NOTE In all cases, the system clock must be at least 24-MHz for the USB module to function properly. If the system clock is used for the USB data clock, the system clock frequency must be 48-MHz. 12.2.1.3 USB Control Logic The control logic performs the following functions: • For transmitted data: — Packet creation — Parallel-to-serial conversion — CRC generation — NRZI encoding — Bit stuffing • For received data: — Sync detection — Packet identification — End-of-packet detection — Serial-to-parallel conversion — CRC validation — NRZI decoding — Bit unstuffing • For error detection: — Bad CRC — Timeout waiting for end-of-packet — Bit stuffing violations MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-4 Freescale Semiconductor

Universal Serial Bus (USB) 12.2.1.4 Endpoint Controllers The MCF5272 has eight independent endpoint controllers that manage data transfer between the on-chip CPU and the USB host for each endpoint. These controllers provide event notification to the user and manage the IN and OUT FIFO dual-port RAM buffers. The USB endpoint configuration registers (USBEPOCFGn or USBEPICFGn) are used to configure each endpoint to support either control, interrupt, bulk, or isochronous transfers. USB always uses endpoint 0 as a control pipe, so it must be configured for control transfer mode. Additional control pipes can be provided by other endpoints. A total of 1024 bytes of dual-port RAM are available for transmit and receive FIFO buffers. This RAM is partitioned to provide 512 bytes for each direction. The user is responsible for configuring the FIFO for each endpoint. This configuration is flexible within the following constraints: • FIFO size must be an integral power of 2 • FIFO size must be at least twice the maximum packet size • FIFO starting address must be aligned on a boundary defined by the FIFO size. For example, an endpoint with a maximum packet size of 32 bytes can have a FIFO size of 64, 128, or 256 bytes and a starting address of 0, 64, 128, 192, 256, etc. 12.2.1.5 USB Request Processor The MCF5272 USB request processor automatically processes all of the USB standard requests listed in Table 12-1 except for SYNC_FRAME and the optional SET_DESCRIPTOR request. The SYNC_FRAME request is passed to the user as a vendor-specific request. The USB module responds with a request error when the SET_DESCRIPTOR request is issued. These standard requests are defined in Chapter 9 of the USB Specification. See beginning of Page 12-1. Table12-1. USB Device Requests Device Request USB Request Processor Action clear_feature Request processor clears the feature specified by the feature selector parameter. Currently, remote wakeup and endpoint halt are the only features defined by the USB specification. If the feature to be cleared is remote wakeup, the USB block disables the remote wakeup functionality. If the feature to be cleared is endpoint halt, the request processor activates the selected endpoint. The user is notified when the remote wakeup is disabled or an endpoint halt is cleared. get_configuration Returns the current configuration as set by a previous SET_CONFIGURATION request. No user notification is provided. No user action required. get_descriptor Reads the specified device or configuration descriptor from the configuration RAM and transfers it to the host. Requests for a configuration descriptor returns all of the descriptors associated with a given configuration including interface, endpoint, and class-specific descriptors. This request fails if the configuration RAM has not been initialized. No user notification is provided. The optional requests for string descriptors are not handled automatically by the request processor. GET_DESCRIPTOR requests for string descriptors are passed to the user as a vendor specific request. The string descriptors must be stored in external memory and not the configuration RAM. get_interface Returns the selected alternate setting for the specified interface. No user notification is provided. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-5

Universal Serial Bus (USB) Table12-1. USB Device Requests (continued) Device Request USB Request Processor Action get_status Returns the current status of the specified device, endpoint or interface. No user notification is provided, no user action required. set_address Loads the specified address into USBFAR. The control logic begins responding to the new address once the status stage of the request completes successfully. No user notification is provided unless debug mode is enabled. set_configuration Reads the configuration RAM. If the configuration is cleared, the USB module is placed into the unconfigured state. If a valid configuration is selected, the appropriate endpoint controllers are activated. An invalid configuration number or error in the configuration descriptor causes the USB module to return a STALL response to the host. The user is notified when this request completes successfully and must initialize the active endpoint controllers. set_descriptor Not supported. Returns request error. set_feature Sets the specified feature. Remote wakeup and endpoint halt are the only features defined in the USB Specification, Revision 1.0. If the specified feature is remote wakeup, the USB enables the remote wakeup functionality. If the specified feature is endpoint halt, the USB request processor halts the selected endpoint. A halted endpoint returns a STALL response to any requests. set_interface Allows the host to select an alternate setting for the specified interface. If a valid alternate setting is selected, the appropriate endpoint controllers are activated. The user is notified upon successful completion of this request and must reinitialize the affected endpoint controllers. NOTE: The user must read the descriptor structure to determine which endpoints correspond to a given interface. sync_frame Passed to the user as a vendor specific request. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-6 Freescale Semiconductor

Universal Serial Bus (USB) 12.3 Register Description and Programming Model This section contains a detailed description of each register and its specific function. 12.3.1 USB Memory Map The operation of the USB is controlled by writing control bytes into the appropriate registers. Table12-2 is a memory map for USB registers. All of the registers are longword aligned even though they are not all 32 bits wide. Table12-2. USB Memory Map Offset [31:24] [23:16] [15:8] [7:0] 0x1000 Reserved USB Frame Number Register (FNR) 0x1004 Reserved USB Frame Number Match Register (FNMR) 0x1008 Reserved USB Real-time Frame Monitor Register (RFMR) 0x100C Reserved USB Real-time Frame Monitor Match Register (RFMMR) 0x1010 Reserved USB Function Address Register (FAR) 0x1014 USB Alternate Setting Register (ASR) 0x1018 USB Device Request Data1 Register (DRR1) 0x101C USB Device Request Data2 Register (DRR2) 0x1020 Reserved USB Specification Number Register (SPECR) 0x1024 Reserved USB Endpoint 0 Status Register (EP0SR) 0x1028 USB Endpoint 0 IN Config Register (IEP0CFG) 0x102C USB Endpoint 0 OUT Config Register (OEP0CFG) 0x1030 USB Endpoint 1 Configuration Register (EP1CFG) 0x1034 USB Endpoint 2 Configuration Register (EP2CFG) 0x1038 USB Endpoint 3 Configuration Register (EP3CFG) 0x103C USB Endpoint 4 Configuration Register (EP4CFG) 0x1040 USB Endpoint 5 Configuration Register (EP5CFG) 0x1044 USB Endpoint 6 Configuration Register (EP6CFG) 0x1048 USB Endpoint 7 Configuration Register (EP7CFG) 0x104C USB Endpoint 0 Control Register (EP0CTL) 0x1050 Reserved USB Endpoint 1 Control Register (EP1CTL) 0x1054 Reserved USB Endpoint 2 Control Register (EP2CTL) 0x1058 Reserved USB Endpoint 3 Control Register (EP3CTL) 0x105C Reserved USB Endpoint 4 Control Register (EP4CTL) 0x1060 Reserved USB Endpoint 5 Control Register (EP5CTL) 0x1064 Reserved USB Endpoint 6 Control Register (EP6CTL) 0x1068 Reserved USB Endpoint 7 Control Register (EP7CTL) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-7

Universal Serial Bus (USB) Table12-2. USB Memory Map (continued) Offset [31:24] [23:16] [15:8] [7:0] 0x106C USB General/Endpoint 0 Interrupt Status Register (EP0ISR) 0x1070 Reserved USB Endpoint 1 Interrupt Status Register (EP1ISR) 0x1074 Reserved USB Endpoint 2 Interrupt Status Register (EP2ISR) 0x1078 Reserved USB Endpoint 3 Interrupt Status Register (EP3ISR) 0x107C Reserved USB Endpoint 4 Interrupt Status Register (EP4ISR) 0x1080 Reserved USB Endpoint 5 Interrupt Status Register (EP5ISR) 0x1084 Reserved USB Endpoint 6 Interrupt Status Register (EP6ISR) 0x1088 Reserved USB Endpoint 7 Interrupt Status Register (EP7ISR) 0x108C USB Endpoint 0 Interrupt Mask Register (EP0IMR) 0x1090 Reserved USB Endpoint 1 Interrupt Mask Register (EP1IMR) 0x1094 Reserved USB Endpoint 2 Interrupt Mask Register (EP2IMR) 0x1098 Reserved USB Endpoint 3 Interrupt Mask Register (EP3IMR) 0x109C Reserved USB Endpoint 4 Interrupt Mask Register (EP4IMR) 0x10A0 Reserved USB Endpoint 5 Interrupt Mask Register (EP5IMR) 0x10A4 Reserved USB Endpoint 6 Interrupt Mask Register (EP6IMR) 0x10A8 Reserved USB Endpoint 7 Interrupt Mask Register (EP7IMR) 0x10AC USB Endpoint 0 Data Register (EP0DR) 0x10B0 USB Endpoint 1 Data Register (EP1DR) 0x10B4 USB Endpoint 2 Data Register (EP2DR) 0x10B8 USB Endpoint 3 Data Register (EP3DR) 0x10BC USB Endpoint 4 Data Register (EP4DR) 0x10C0 USB Endpoint 5 Data Register (EP5DR) 0x10C4 USB Endpoint 6 Data Register (EP6DR) 0x10C8 USB Endpoint 7 Data Register (EP7DR) 0x10CC Reserved USB Endpoint 0 Data Present Register (EP0DPR) 0x10D0 Reserved USB Endpoint 1 Data Present Register (EP1DPR) 0x10D4 Reserved USB Endpoint 2 Data Present Register (EP2DPR) 0x10D8 Reserved USB Endpoint 3 Data Present Register (EP3DPR) 0x10DC Reserved USB Endpoint 4 Data Present Register (EP4DPR) 0x10E0 Reserved USB Endpoint 5 Data Present Register (EP5DPR) 0x10E4 Reserved USB Endpoint 6 Data Present Register (EP6DPR) 0x10E8 Reserved USB Endpoint 7 Data Present Register (EP7DPR) 0x1400 – USB Configuration RAM, 1 K Bytes 0x17FF MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-8 Freescale Semiconductor

Universal Serial Bus (USB) 12.3.2 Register Descriptions The following are detailed register diagrams and field descriptions. 12.3.2.1 USB Frame Number Register (FNR) Once every 1 ms, the USB host issues a start-of-frame packet containing a frame number. The FNR register captures this frame number. Figure12-3 shows the FNR. 15 11 10 0 Field — FRM Reset 0000_0000_0000_0000 R/W Read Addr MBAR + 0x1002 Figure12-3. USB Frame Number Register (FNR) Table 12-3 describes FNR fields. Table12-3. FNR Field Descriptions Bits Name Description 15–11 — Reserved, should be cleared. 10–0 FRM USB frame number. Contains the current USB frame number. FRM is updated with the new frame number each time the device successfully receives a start-of-frame (SOF) packet from the USB host. The new frame number is contained in the SOF packet. 12.3.2.2 USB Frame Number Match Register (FNMR) FNMR is used to signal, via the FRM_MAT interrupt, when a particular frame number is issued by the USB host. To avoid a false match during intermediate states of a byte write operation to the FNMR, Figure 12-4, byte accesses to this register are not supported and cause an access error. 15 11 10 0 Field — FRM_MAT Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x1006 Figure12-4. USB Frame Number Match Register (FNMR) Table 12-4 describes FNMR fields. Table12-4. FNMR Field Descriptions Bits Name Description 15–11 — Reserved, should be cleared 10–0 FRM_MAT Frame number match value. Contains the USB frame number match value. When the FNR value equals the value in the register, a FRM_MAT interrupt is generated. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-9

Universal Serial Bus (USB) 12.3.2.3 USB Real-Time Frame Monitor Register (RFMR) The value in the RFMR can be used to determine approximately how much time has elapsed since the USB host sent its last start-of-frame packet. Because the hardware does not guarantee that any of the bit values are stable during the read access: • only the higher-order bits should be used • the returned data should always be de-glitched by verifying that the same value is seen on the higher-order bits for two consecutive read cycles. Figure 12-5 shows the USB real-time frame monitor register. 15 14 13 0 Field — RTFM Reset 0000_0000_0000_0000 R/W Read Addr MBAR + 0x100A Figure12-5. USB Real-Time Frame Monitor Register (RFMR) Table 12-5 lists field descriptions for the USB real-time frame monitor register. Table12-5. RFMR Field Descriptions Bits Name Description 15–14 — Reserved, should be cleared. 13–0 RTFM Real-time frame count. Contains the current USB frame counter value. The counter is incremented one time for every USB bit time and is reset when a SOF packet from the host is detected or an artificial start of frame (ASOF) interrupt is generated. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-10 Freescale Semiconductor

Universal Serial Bus (USB) 12.3.2.4 USB Real-Time Frame Monitor Match Register (RFMMR) To avoid intermediate false values in the real-time frame monitor match register, Figure 12-6, byte accesses are not supported and cause an access error. 15 14 13 0 Field — RTFM_MAT Reset 0011_1111_1111_1111 R/W R/W Addr MBAR + 0x100E Figure12-6. USB Real-Time Frame Monitor Match Register (RFMMR) Table 12-6 lists field descriptions for the USB real-time frame monitor match register. Table12-6. RFMMR Field Descriptions BIts Name Description 15–14 — Reserved, should be cleared 13–0 RTFM_MAT Real-time frame monitor match. Contains the real-time frame monitor match value. When the RFMR value equals the value in the register, an ASOF interrupt is generated. The value programmed in this register should not be less than 0x2EE0--the nominal period between SOF packets. 12.3.2.5 USB Function Address Register (FAR) Figure 12-7 shows the USB function address register (FAR). If EP0CTL[DEBUG] is set, EP0CTL[DEV_CFG] also reflects any change in FAR. If DEBUG is zero, the MCF5272 USB controller is not notified if the function address changes. This value is for information only. 7 6 0 Field — FAD Reset 0000_0000 R/W Read Addr MBAR + 0x1013 Figure12-7. USB Function Address Register (FAR) Table 12-7 gives the USB function address register field descriptions. Table12-7. FAR Field Descriptions Bits Name Description 7 — Reserved, should be cleared 6–0 FAD USB function address. This field holds the USB address of the device. The USB module writes this field with the USB address assigned to the device with a SET_ADDRESS device request. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-11

Universal Serial Bus (USB) 12.3.2.6 USB Alternate Settings Register (ASR) Defines which of several possible interfaces is currently active. Figure 12-8 shows the USB alternate settings register. The configuration descriptors must be read by the user in order to determine which interfaces are currently valid. 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Field IF15_AS IF14_AS IF13_AS IF12_AS IF11_AS IF10_AS IF9_AS IF8_AS Reset 0000_0000_0000_0000 R/W Read 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Field IF7_AS IF6_AS IF5_AS IF4_AS IF3_AS IF2_AS IF1_AS IF0_AS Reset 0000_0000_0000_0000 R/W Read Addr MBAR + 0x1014 Figure12-8. USB Alternate Settings Register (ASR) Table 12-8 lists field descriptions for the USB alternate settings register. Table12-8. ASR Field Descriptions Bits Name Description 31–0 IFn_AS USB alternate settings for interface n. This field indicates which alternate setting is active for each interface. 00Alternate Setting 0 01Alternate Setting 1 10Alternate Setting 2 11Alternate Setting 3 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-12 Freescale Semiconductor

Universal Serial Bus (USB) 12.3.2.7 USB Device Request Data 1 and 2 Registers (DRR1/ 2) The device request data registers, Figure 12-9 and Figure 12-10, are used to notify the user that an optional standard, class-specific, or vendor-specific request has been received and to pass the request type and parameters to the application. The fields in DRR1 and DRR2 are defined in Chapter 9 of the USB Specification. See top of page, [p. 12-1]. 31 16 Field wValue Reset 0000_0000_0000_0000 R/W Read 15 8 7 0 Field bRequest bmRequestType Reset 0000_0000_0000_0000 R/W Read Addr MBAR + 0x1018 Figure12-9. USB Device Request Data 1 Register (DRR1) 31 16 Field wLength Reset 0000_0000_0000_0000 R/W Read 15 0 Field wIndex Reset 0000_0000_0000_0000 R/W Read Addr MBAR + 0x101C Figure12-10. USB Device Request Data 2 Register (DRR2) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-13

Universal Serial Bus (USB) 12.3.2.8 USB Specification Number Register (SPECR) Figure 12-11 shows the USB specification number register. 15 4 3 0 Field SPEC MRN Reset 0001_0001_0000_0001 R/W Read Addr MBAR + 0x1022 Figure12-11. USB Specification Number Register (SPECR) Table 12-9 lists field descriptions for the USB specification number register. Table12-9. SPECR Field Descriptions Bits Name Descriptions 15–4 SPEC USB specification release number. This field identifies the release of the USB Specification that the device complies with. The USB Specification Release Number is in binary-coded decimal (BCD) format. 3–0 MRN Module revision number. 12.3.2.9 USB Endpoint 0 Status Register (EP0SR) Figure 12-12 shows the USB endpoint 0 status register. Only written via the standard SET_CONFIGURATION request by the host. 15 12 11 10 3 2 1 0 Field CONFIG WAKE_ST — HALT_ST DIR — Reset 0000_0000_0000_0001 R/W Read Addr MBAR + 0x1026 Figure12-12. USB Endpoint 0 Status Register (EP0SR) Table 12-10 lists field descriptions the USB endpoint 0 status register. Table12-10. EP0SR Field Descriptions Bits Name Descriptions 15–12 CONFIG Current configuration number. Indicates which configuration is active. Receiving a SET_CONFIGURATION USB standard device request sets the active configuration. A configuration setting of 0 means that the device is unconfigured. Valid only when EPISR0[DEV_CFG] is set 11 WAKE_ST Remote wakeup status. Indicates whether the USB module has been enabled to generate remote wakeup resume signaling. 1 Enabled. The USB host has issued the SET_FEATURE request with the Remote wakeup feature selector set. 0 Disabled. The USB host has issued the CLEAR_FEATURE request with the remote wakeup feature selector set, or has not set this feature since a USB or system reset has occurred. 10–3 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-14 Freescale Semiconductor

Universal Serial Bus (USB) Table12-10. EP0SR Field Descriptions Bits Name Descriptions 2 HALT_ST Current endpoint 0 halt status. Indicates whether endpoint 0 is currently halted or active. Endpoint 0 is halted if there is an error processing a request. A halt is cleared automatically by a SETUP packet. 1 Endpoint 0 halted 0 Endpoint 0 active 1 DIR Current endpoint 0 direction. Indicates whether endpoint 0 is currently accessed as an IN or OUT endpoint. 1 The endpoint is configured as an IN endpoint 0 The endpoint is configured as an OUT endpoint 0 — Reserved, should be cleared. 12.3.2.10 USB Endpoint 0 IN Configuration Register (IEP0CFG) Figure 12-13 shows the USB Endpoint 0 IN configuration (IEP0CFG) register. 31 22 21 20 16 Field MAX_PACKET — FIFO_SIZE Reset 0000_0000_0000_0000 R/W R/W 15 11 10 9 0 Field FIFO_SIZE — FIFO_ADDR Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x1028 Figure12-13. USB Endpoint 0 IN Configuration Register (IEP0CFG) Table 12-11 lists field descriptions for the IEP0CFG register. Only longword writes are allowed. The maximum packet size for endpoint 0 is eight bytes. Writing to the register resets the FIFO. Any data in the FIFO are discarded, and the associated EPnDP register is also reset. Table12-11. IEP0CFG Field Descriptions Bits Name Descriptions 31–22 MAX_PACKET Maximum packet size. Must be written with the maximum packet size defined in the device descriptor for endpoint 0 or the endpoint descriptors for other endpoints. 21 — Reserved, should be cleared. 20–11 FIFO_SIZE Size of the FIFO. Sets the depth of the FIFO buffer for the endpoint. The FIFO size must be a power of 2. For non-isochronous endpoints, the FIFO size must be at least two times the maximum packet size. 10 — Reserved, should be cleared. 9–0 FIFO_ADDR Starting address in the FIFO buffer memory for the endpoint’s FIFO. Reading this field returns the current write pointer for IN endpoints or the read pointer for OUT endpoints for the FIFO. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-15

Universal Serial Bus (USB) 12.3.2.11 USB Endpoint 0 OUT Configuration Register (OEP0CFG) Figure 12-14 shows the USB endpoint 0 OUT configuration register. 31 22 21 20 16 Field MAX_PACKET — FIFO_SIZE Reset 0000_0000_0000_0000 R/W R/W 15 11 10 9 0 Field FIFO_SIZE — FIFO_ADDR Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x102C Figure12-14. USB Endpoint 0 OUT Configuration Register See Table 12-11 for a description of the fields. 12.3.2.12 USB Endpoint 1–7 Configuration Register (EPnCFG) Figure 12-15 shows the USB endpoint 1–7 configuration register. 31 22 21 20 16 Field MAX_PACKET — FIFO_SIZE Reset 0000_0000_0000_0000 R/W R/W 15 10 9 0 Field FIFO_SIZE — FIFO_ADDR Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x1030, 0x1034, 0x1038, 0x103C, 0x1040, 0x1044, 0x1048 Figure12-15. USB Endpoint 1–7 Configuration Register See Table 12-11 for a description of the fields. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-16 Freescale Semiconductor

Universal Serial Bus (USB) 12.3.2.13 USB Endpoint 0 Control Register (EP0CTL) Figure 12-16 shows the USB endpoint 0 control register. provides both module level and endpoint 0 specific control (bits 0-9) functions. 31 23 Field — Reset 0000_0000 R/W R/W 22 19 18 17 16 Field — DEBUG WOR_LVL WOR_EN Reset 0000_0000 R/W R/W 15 14 13 12 11 10 9 8 Field CLK_SEL RESUME AFE_EN BUS_PWR USB_EN CFG_RAM_VAL CMD_ERR CMD_OVER Reset 0000_0000 R/W R/W 7 6 5 4 3 2 1 0 Field CRC_ERR — OUT_LVL IN_LVL IN_DONE — Reset 0000_0000 R/W R/W Addr MBAR + 0x104C Figure12-16. USB Endpoint 0 Control Register (EP0CTL) Table 12-12 lists field descriptions for the USB endpoint 0 control register. Table12-12. EP0CTL Field Descriptions Bits Name Description 31–19 — Reserved, should be cleared. 18 DEBUG Debug mode. Enters debug mode. Debug mode enables CRC error generation and notification of a change of address. 0 Normal operation 1 Enable debug mode functions 17 WOR_LVL Wake-on-ring level select. Selects the active level of INT1 for the wake-on-ring function. 0 Wake-on-ring function is invoked when INT1 pin is 0. 1 Wake-on-ring function is invoked when INT1 pin is 1. 16 WOR_EN Wake-on-ring enable. Generates a RESUME when the active level is detected on INT1 pin. 0 Wake-on-ring function disabled 1 Wake-on-ring function enabled Note: the wake-on-ring function generates a RESUME only if the USB module is enabled for remote wakeup by the host, for example, WAKE_ST = 1, and is suspended. 15 CLK_SEL Clock source selection. Overrides the clock source for the USB module. If the USB_ExtCLK pin is selected after reset, setting this bit forces the USB module to use the internal system clock. 0 Clock is retrieved from the clock selected at reset. 1 Clock is retrieved from the internal system clock. Note: the selected clock must have a frequency of 48 MHz. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-17

Universal Serial Bus (USB) Table12-12. EP0CTL Field Descriptions (continued) Bits Name Description 14 RESUME Generates RESUME condition. Used to exit the SUSPEND state. The USB control logic ensures the forced resume duration is greater than 10 ms. This command bit is write-only and always returns 0 when read. 0 Default 1 Generate RESUME condition (force data lines to K state) Note: this command generates a RESUME only if the USB is both suspended and enabled for remote wakeup by the host, that is, USBEPSR0[WAKE_ST] = 1. 13 AFE_EN External USB analog front-end enable. Used to select the internal or external USB analog front end (AFE). The internal AFE is selected by default. 0 The USB internal AFE is powered up and the external transceiver interface is disabled. The driven outputs can be observed on the parallel port A signals if they are configured for USB. 1 The USB internal AFE is powered down and the external transceiver interface is enabled. The internal transceiver outputs, (USBH and USBL), are high impedance. 12 BUS_PWR Select bus-powered mode. Used to select between bus-powered and self-powered mode. This bit only affects the response to a GET_STATUS device request. This bit should be set according to the current configuration. 0 Self-powered mode 1 Bus-powered mode 11 USB_EN Enables and disables the USB control logic. Has no effect on USB register values. When cleared, the outputs are high impedance, preventing any response to the host. This bit should be set after USB module registers are initialized and the descriptors are copied into the configuration RAM. 0 Disable USB module 1 Enable USB module 10 CFG_RAM_VAL Enable USB configuration RAM. Notifies the USB module that the user has loaded the configuration RAM. Must be set in order for the USB module to process the USB standard device requests that access the configuration RAM. These requests are GET_DESCRIPTOR, SET_CONFIGURATION, and SET_INTERFACE. When this bit is set, accesses to the configuration RAM cause an access error. 0 Configuration RAM invalid 1 Configuration RAM valid 9 CMD_ERR Command error for device request interface. Used to indicate to the endpoint controller that an error has been encountered during class or vendor specific device request or SYNCH_FRAME command processing. This command bit is write only and always returns 0 when read. Result of RequestCMD_OVERCMD_ERR Processed device request successfully10 Error processing the request11 Busy processing the request0X Note: CMD_OVER and CMD_ERR have to be written simultaneously. The CMD_OVER and CMD_ERR bits control the status stage response for vendor and class specific requests. 8 CMD_OVER Command over for device request interface. Used to indicate to the endpoint controller that processing of a class or vendor specific device request or SYNCH_FRAME command has been completed by the user. This command bit is write only and always returns 0 when read. Note: CMD_OVER and CMD_ERR have to be written simultaneously. The CMD_OVER and CMD_ERR bits control the status stage response for vendor and class specific requests. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-18 Freescale Semiconductor

Universal Serial Bus (USB) Table12-12. EP0CTL Field Descriptions (continued) Bits Name Description 7 CRC_ERR CRC error generation enable. This bit enables CRC error generation for debug and test purpose. In order to use this feature, the DEBUG bit must be set. Enabling this bit causes a CRC error on the next data packet transmitted. The CRC_ERR bit must be set again in order to generate another CRC error. This bit only applies to IN transfers. This command bit is write-only and always returns 0 when read. 1 CRC error generation if DEBUG = 1 0 default value 6 — Reserved, should be cleared. 5–4 OUT_LVL Endpoint 0 OUT FIFO level for interrupt. This field selects the FIFO level to generate an OUT_LVL interrupt. The OUT_LVL interrupt is generated when the FIFO fills above the selected level. 00 FIFO 25% Full 01 FIFO 50% Full 10 FIFO 75% Full 11 FIFO 100% Full 3–2 IN_LVL Endpoint 0 IN FIFO level for interrupt. This field selects the FIFO level to generate an IN_LVL interrupt. The IN_LVL interrupt is generated when the FIFO falls below the selected level. 00 FIFO 25% Empty 01 FIFO 50% Empty 10 FIFO 75% Empty 11 FIFO 100% Empty 1 IN_DONE This bit controls the USB's response to IN tokens from the host. This bit is set at Reset and must be cleared by software when the last byte of a transfer has been written to the IN-FIFO. This bit is then subsequently set by the USB core when an end of transfer (EOT) event occurs indicating that the transfer has been completed. An end of transfer (EOT) event is indicated by one of the following: a) An IN packet is transmitted that contains less than the maximum number of bytes defined at endpoint configuration. b) A zero length IN packet is transmitted. This occurs when the previously transmitted IN packet was full, and no more data remains in the IN-FIFO. Hence a single zero length packet must be sent to indicate EOT. 0 CPU has completed writing to the IN-FIFO and transfer is in progress. The USB module will send any amount of data in the FIFO or a zero-length packet when the FIFO is empty. 1 Transfer completed or CPU Busy writing transfer into the IN-FIFO. The USB module will only send maximum size packets or NAK responses if the FIFO contains less than a maximum size packet. This bit is set at Reset and on an EOT event. 0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-19

Universal Serial Bus (USB) 12.3.2.14 USB Endpoint 1–7 Control Register (EPnCTL) Figure 12-17 shows the USB endpoint 1–7 control register. 15 8 Field — Reset 0000_0000 R/W R/W 7 6 5 4 3 2 1 0 Field CRC_ERR ISO_MODE — FIFO_LVL IN_DONE STALL Reset 0000_0004 R/W R/W Addr MBAR + 0x1052, 0x1056, 0x105A, 0x105E, 0x1062, 0x1066, 0x106A n Figure12-17. USB Endpoint 1-7 Control Register (EP CTL) Table 12-13 lists the field descriptions for the USB endpoint 1–7 control register. n Table12-13. EP CTL Field Descriptions Bits Name Description 15–8 — Reserved, should be cleared. 7 CRC_ERR CRC error generation enable. Enables CRC error generation for debug and test purposes. To use this feature, the DEBUG bit must be set. Enabling this bit causes a CRC error on the next non-zero-length data packet transmitted. The CRC_ERR bit must be set again in order to generate another CRC error. This bit is only valid for IN endpoints. This command bit is write only and always returns 0 when read. 0 Default Value 1 CRC error generation if DEBUG = 1 6 ISO_MODE Isochronous transfer mode. This bit must be set when the endpoint is configured for isochronous mode. 0 Non-isochronous transfer mode 1 Isochronous transfer mode 5–4 — Reserved, should be cleared. 3–2 FIFO_LVL Endpoint n FIFO level for interrupt. This field selects the FIFO level to generate a FIFO_LVL interrupt. The FIFO_LVL interrupt is generated when the FIFO fills above (OUT) or falls below (IN) the selected level. IN FIFOOUT FIFO 00 FIFO 25% emptyFIFO 25% full 01 FIFO 50% emptyFIFO 50% full 10 FIFO 75% emptyFIFO 75% full 11 FIFO emptyFIFO full MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-20 Freescale Semiconductor

Universal Serial Bus (USB) n Table12-13. EP CTL Field Descriptions Bits Name Description 1 IN_DONE This bit controls the USB's response to IN tokens from the host. Set at Reset and on an EOT event and must be cleared by software when the last byte of a transfer has been written to the IN-FIFO. This bit is then subsequently set by the USB core when an end of transfer (EOT) event occurs, indicating that the transfer has been completed. An end of transfer (EOT) event is indicated by one of the following: a) An IN packet is transmitted that contains less than the maximum number of bytes defined at endpoint configuration. b) A zero length IN packet is transmitted. This occurs when the previously transmitted IN packet was full, and no more data remains in the IN-FIFO. Hence a single zero length packet must be sent to indicate EOT. 0 CPU has completed writing to the IN-FIFO and transfer is in progress. The USB module sends all the data in the FIFO, or a zero-length packet when the FIFO is empty. 1 Transfer completed or CPU is busy writing to the IN-FIFO. The USB module only sends maximum-sized packets or NAK responses if the FIFO contains less data than the maximum packet size. 0 STALL Force STALL response. Causes the endpoint to return a STALL handshake when polled by either IN or OUT token by the USB host controller. The STALL handshake causes the endpoint to be halted. The STALL bit is not valid for isochronous endpoints. This command bit is write-only and always returns 0 when read. 0 Default 1 Send STALL handshake MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-21

Universal Serial Bus (USB) 12.3.2.15 USB Endpoint 0 Interrupt Mask (EP0IMR) and General/Endpoint 0 Interrupt Registers (EP0ISR) Figure 12-18 shows the USB endpoint 0 interrupt mask and general/endpoint 0 interrupt registers. 31 24 Field — Reset 0000_0000 R/W R/W 23 17 16 Field — DEV_CFG Reset 0000_0000 R/W R/W 15 14 13 12 11 10 9 8 Field VEND_REQ FRM_MAT ASOF SOF WAKE_CHG RESUME SUSPEND RESET Reset 0000_0000 R/W R/W 7 6 5 4 3 2 1 0 Field OUT_EOT OUT_EOP OUT_LVL IN_EOT IN_EOP UNHALT HALT IN_LVL Reset 0000_0000 R/W R/W Addr MBAR + 0x108C (EP0IMR); MBAR + 0x106C (EP0ISR) Figure12-18. USB Endpoint 0 Interrupt Mask (EP0IMR) and General/Endpoint 0 Interrupt Registers (EP0ISR) NOTE Interrupt bits are reset by writing a 1 to the specified bits. Writing 0 has no effect. Table 12-14 lists field descriptions for the USB endpoint 0 interrupt mask and general/endpoint 0 interrupt registers. Table12-14. EP0IMR and EP0ISR Field Descriptions Bits Name Description 31–17 — Reserved, should be cleared. 16 DEV_CFG Device configuration change interrupt. Set when a device configuration change has been received. The USB standard device requests SET_CONFIGURATION and SET_INTERFACE generate a DEV_CFG interrupt. Any IN or OUT packets to the active endpoints cause a NAK response to the host while this bit is set in order to allow the user to initialize the endpoints’ FIFO’s. Note that if one of these requests is done repeatedly and therefore the registers don’t change, a DEV_CFG interrupt is still generated. If debug mode is enabled, a change in FAR also generates an interrupt. 0 No interrupt pending 1 Device configuration change received MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-22 Freescale Semiconductor

Universal Serial Bus (USB) Table12-14. EP0IMR and EP0ISR Field Descriptions (continued) Bits Name Description 15 VEND_REQ Class or vendor specific request received. Set when a class- or vendor-specific request is received. When the application detects assertion of VEND_REQ interrupt, it should begin reading DRR1 and DRR2. 0 No interrupt pending 1 Class or vendor specific request received 14 FRM_MAT Frame number match. Set when the USB frame number matches the value written to the FNMR register. 0 No interrupt pending 1 Frame number match 13 ASOF Artificial start of frame detected. Set when an artificial SOF is generated. The ASOF is used to notify the user that a SOF packet was not detected as expected. 0 No interrupt pending 1 Artificial SOF generated 12 SOF Start of frame (SOF) detected. Set when a SOF packet is detected. 0 No interrupt pending 1 SOF detected 11 WAKE_CHG Remote wakeup status change interrupt. Indicates that a change has occurred in the EPSR0[WAKE_ST]. 0 No interrupt pending 1 Remote wakeup status bit has changed 10 RESUME Resume. Set when the USB block is in the suspend state and detects resume signaling on the USB data lines. User-initiated resume signaling also causes the RESUME interrupt to be asserted. 0 No interrupt pending 1 USB resume signal detected 9 SUSPEND Suspend. Set when the USB module detects a suspend state on the USB data lines. The USB suspends when the bus is idle for at least 3 ms. 0 No interrupt pending 1 USB suspend state detected 8 RESET USB Reset. Set when the USB module detects a USB reset. A USB reset is caused by a single-ended zero (SE0) greater than 2.5 µs. A USB reset has no effect on the registers written by the user. 0 No interrupt pending 1 USB reset signal detected 7 OUT_EOT End of transfer. Set when the end of a transfer has been reached for OUT FIFO. An OUT_EOT is generated when a packet with a size less than the maximum packet size or the first zero-length packet following maximum size packets is received. The EPDP0 must be read before clearing this interrupt in order to determine the number of bytes of remaining data in the FIFO for the last transfer. Any packets received from the host cause a NAK response until the OUT_EOT interrupt is cleared. 0 No interrupt pending 1 Transfer completed 6 OUT_EOP End of packet. Set when a packet is successfully received for endpoint 0 OUT. 0 No interrupt pending 1 OUT packet received successfully 5 OUT_LVL OUT FIFO threshold level. Indicates that the FIFO level has risen above the level set in the EPCTL0 register. 0 No interrupt pending 1 OUT FIFO threshold level reached MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-23

Universal Serial Bus (USB) Table12-14. EP0IMR and EP0ISR Field Descriptions (continued) Bits Name Description 4 IN_EOT End of transfer. This bit is set when the end of a transfer has been reached for an IN endpoint. An EOT interrupt is generated when a packet with a size less than the maximum packet size or the first zero-length packet following maximum size packets is sent. 0 No interrupt pending 1 Transfer completed 3 IN_EOP End of packet. This bit is set when a packet has been sent successfully for endpoint 0 IN. 0 No interrupt pending 1 IN packet sent successfully 2 UNHALT Unhalt. This bit is set when the endpoint 0 HALT_ST bit is cleared by a SETUP packet or USB reset. 0 No interrupt pending 1 Endpoint halt cleared 1 HALT Halt. This bit is set when the endpoint 0 HALT_ST bit is set due to a STALL response to the host. 0 No interrupt pending 1 Endpoint halted 0 IN_LVL IN FIFO threshold level. This bit indicates that the FIFO level has fallen below the level set in the EPCTL0 register. 0 No interrupt pending 1 IN FIFO threshold level reached MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-24 Freescale Semiconductor

Universal Serial Bus (USB) 12.3.2.16 USB Endpoints 1–7 Status / Interrupt Registers (EPnISR) Figure 12-19 shows the USB endpoints 1-7 status/interrupt registers. 15 14 13 12 5 4 3 2 1 0 Field HALT_ST DIR PRES — EOT EOP UNHALT HALT FIFO_LVL Reset 0000_0000_0000_0000 R/W Interrupt bits are cleared by writing a 1 to the specified bits. Bits 13–15 are read-only status bits. Addr MBAR + 0x1072, 0x1076, 0x107A, 0x107E, 0x1082, 0x1086, 0x108A Figure12-19. USB Endpoints 1–7 Interrupt Status Registers (EPnISR) Table 12-15 lists field descriptions for the USB endpoints 1–7 interrupt status registers. Table12-15. EPnISR Field Descriptions Bits Name Description 15 HALT_ST Current status of endpoint n. This bit indicates whether endpoint n is currently halted or active. HALT_ST is set due to a SET_FEATURE request with the endpoint halt feature selector set or a STALL response to an IN or OUT packet. HALT_ST is cleared by a CLEAR_FEATURE request with the endpoint halt feature selector set. 0 Endpoint n active 1 Endpoint n halted 14 DIR Current direction of endpoint n. This bit indicates whether endpoint n is currently configured as an IN or OUT endpoint. 0 Endpoint n configured as an OUT endpoint 1 Endpoint n configured as an IN endpoint 13 PRES Endpoint n present. This bit indicates whether or not endpoint n is present in the current configuration. 0 Endpoint n absent 1 Endpoint n present 12–5 — Reserved, should be cleared. 4 EOT End of transfer interrupt. Set when the end of a transfer has been reached. An EOT interrupt is generated when a packet with a size less than the maximum packet size or the first zero-length packet following maximum size packets is sent or received. For OUT endpoints, the EPDPn must be read before clearing this interrupt in order to determine the number of bytes of remaining data in the FIFO for the last transfer. For OUT endpoints, any packets received from the host cause a NAK response until the EOT interrupt is cleared. For IN endpoints, the user must wait until the EOT interrupt is set before writing the next transfer to the FIFO. 0 No interrupt pending 1 Transfer completed 3 EOP End of packet interrupt. Set when a packet is successfully sent or received on endpoint n. 0 No interrupt pending 1 Packet sent or received successfully 2 UNHALT Endpoint unhalt interrupt. Set when the endpoint n HALT_ST bit is cleared. 0 No interrupt pending 1 Endpoint n unhalted MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-25

Universal Serial Bus (USB) Table12-15. EPnISR Field Descriptions (continued) Bits Name Description 1 HALT Endpoint halt interrupt. Set when the endpoint n HALT_ST bit is set. 0 No interrupt pending 1 Endpoint n halted 0 FIFO_LVL FIFO threshold level reached interrupt. Indicates that the FIFO level has risen above or fallen below the level set in the EPCTLn register for OUT or IN endpoints, respectively. 0 No interrupt pending 1 FIFO threshold level reached 12.3.2.17 USB Endpoint 1–7 Interrupt Mask Registers (EPnIMR) Figure 12-20 shows the USB endpoint 1–7 interrupt mask register. 15 5 4 3 2 1 0 Field — EOT_EN EOP_EN UNHALT_EN HALT_EN FIFO_LVL_EN Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x1092, 0x1096, 0x109A, 0x109E, 0x10A2, 0x10A6, 0x10AA n Figure12-20. USB Endpoint 1-7 Interrupt Mask Registers (EP IMR) Table 12-16 lists field descriptions for the USB endpoint 1–7 interrupt mask register. n Table12-16. EP IMR Field Descriptions Bits Name Description 15–5 — Reserved, should be cleared. 4–0 Interrupt mask. These bits are set when the user wants to activate the interrupt source for the specific bit. Refer to Table12-15 for a description of each interrupt source. 1 Interrupt Enabled 0 Interrupt Disabled MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-26 Freescale Semiconductor

Universal Serial Bus (USB) 12.3.2.18 USB Endpoint 0–7 Data Registers (EPnDR) Figure 12-21 shows the USB endpoint 0-7 data registers. 31 16 Field DATA Reset 0000_0000_0000_0000 R/W R/W 15 0 Field DATA Reset 0000_0000_0000_0000 R/W R/W Addr MBAR + 0x10AC, 0x10B0, 0x10B4, 0x10B8, 0x10BC, 0x10C0, 0x10C4, 0x10C8 Figure12-21. USB Endpoint 0-7 Data Registers (EPnDR) Table 12-17 lists field descriptions for the USB endpoint 0–7 data registers. Table12-17. EPnDR Field Descriptions Bits Name Description 31–0 DATA The EPnDR registers allow data to be written to/from each endpoint’s FIFO. For IN endpoints, the registers are write-only and writing to a full FIFO is ignored. For OUT endpoints, the registers are read-only, and reading from an empty FIFO returns undefined data. These registers can be accessed using 8-, 16-, or 32-bit accesses in order to read/write 1, 2, or 4 bytes from/to the FIFO at one time. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-27

Universal Serial Bus (USB) 12.3.2.19 USB Endpoint 0–7 Data Present Registers (EPnDPR) Figure 12-22 shows the USB endpoint 0-7 data present registers. used to coordinate user access to FIFO with external devices to prevent data loss (overwrite) says how much free space is still available. Gives amount of data just received. 15 9 8 0 Field — DATA_PRES Reset 0000_0000_0000_0000 R/W Read Addr MBAR + 0x10CE, 0x10D2, 0x10D6, 0x10DA, 0x10DE, 0x10E2, 0x10E6, 0x10EA ( n Figure12-22. USB Endpoint 0-7 Data Present Registers EP DPR) Table 12-18 describes EPDPn fields. n Table12-18. EP DPR Field Descriptions Bits Name Description 15–9 — Reserved, should be cleared. 8–0 DATA_PRES Endpoint n data present. This field reflects the number of bytes in the endpoint’s FIFO. This field is updated when the user writes to or reads from the FIFO and when the control logic accesses the FIFO. For non-isochronous endpoints, the FIFO level is only updated when a complete packet is received or transmitted without any errors. This occurs synchronously with an EOP interrupt. For isochronous endpoints, the FIFO level is updated by the control logic in real-time rather than only after the transfer of a complete packet. Note: for non-isochronous OUT endpoints, this field is frozen while an EOT interrupt is pending in order to allow the user to determine the number of bytes to read for the last transfer. For endpoint 0, EPDP0 monitors the OUT FIFO only. 12.3.3 Configuration RAM The USB module supports up to 1KByte of USB descriptors. The configuration RAM begins at address MBAR + 0x1400 and is longword accessible only. EPCTL0[CFG_RAM_VAL] must be cleared to access the configuration RAM, otherwise an access error results. 12.3.3.1 Configuration RAM Content The USB host must configure a device before that device’s function can be used. The host configures the device by first reading the descriptors for the device. The descriptors must follow the format described in Chapter 9 of the USB specification and any relevant class specification. NOTE The USB descriptors use little endian format for word and longword fields. The MCF5272 uses big endian format for words and longwords. The user must make sure that any word or longword fields are stored in the correct byte order. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-28 Freescale Semiconductor

Universal Serial Bus (USB) A device may support multiple configurations. Within any one configuration, the device may support multiple interfaces. An interface consists of a set of endpoints that presents to the host a single feature or function of the device. An interface within a configuration may have alternate settings that redefine the characteristics of the associated endpoints. All devices must provide a device descriptor and at least one configuration, interface and endpoint descriptor. Each configuration must have at least one interface and one endpoint descriptor. Only one configuration is effective at any time, but several interfaces and their related endpoints may be operational at the same time. Only one setting for a particular interface is effective at any time. 12.3.3.2 USB Device Configuration Example The example descriptor structure in Figure 12-23 shows a device with three different configurations. Refer to Chapter 9 of the USB Specification for information on the contents of each descriptor. Device Descriptor Configuration #1 Configuration #2 Configuration #3 Descriptor Descriptor Descriptor Interface #0 Interface #1 Interface #0 Interface #0 Descriptor Descriptor Descriptor Descriptor Endpoint #1 Endpoint #2 Endpoint #3 Endpoint #1 Endpoint #1 Endpoint #2 Descriptor Descriptor Descriptor Descriptor Descriptor Descriptor Figure12-23. Example USB Configuration Descriptor Structure This example is described in the configuration RAM sequence shown below. The device descriptor begins at address MBAR + 0x1400. Each descriptor must immediately follow the previous descriptor without any empty locations between them. 1. Device Descriptor 2. Configuration #1 Descriptor 3. Interface #0 Descriptor 4. Endpoint #1 Descriptor 5. Endpoint #2 Descriptor 6. Interface #1 Descriptor 7. Endpoint #3 Descriptor 8. Configuration #2 Descriptor MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-29

Universal Serial Bus (USB) 9. Interface #0 Descriptor 10.Endpoint #1 Descriptor 11. Configuration #3 Descriptor 12.Interface #0 Descriptor 13.Endpoint #1 Descriptor 14.Endpoint #2 Descriptor 12.3.4 USB Module Access Times The access times for the USB module depend on whether the access is to a register, to an endpoint FIFO (EPnDR register), or to the configuration RAM. 12.3.4.1 Registers The USB module registers are accessed through the internal S-bus. Each register access takes 3 clock cycles for reads and writes. 12.3.4.2 Endpoint FIFOs The FIFO access time depends on the size, the time between accesses, and whether the previous FIFO access was for the same endpoint. After a longword access to an endpoint’s FIFO, the next longword in the FIFO is cached for a quicker access time on the next longword read. This mechanism is reset every time another endpoint is accessed. Table 12-19 shows the access times for the FIFOs. Table12-19. USB FIFO Access Timing Access Type Read Write Byte 5 4 Word 6 4 Long (back to back) 8-4-6-6-6-6... 4-6-6-6-6-6... Long (1 clock gap) 8-3-5-5-5-5... 4-5-5-5-5-5... Long (2 clock gap) 8-3-4-4-4-4... 4-4-4-4-4-4... Long (3+ clock gap) 8-3-3-3-3-3... 4-4-4-4-4-4... 12.3.4.3 Configuration RAM The configuration RAM is longword accessible only. Access times for reads from the configuration RAM are eight clock cycles per access. Clock cycle access times for back-to-back writes to the configuration RAM are 3-5-5-5-5-5... Access times for writes separated by at least 1 clock cycle are 3-3-3-3-3-3… MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-30 Freescale Semiconductor

Universal Serial Bus (USB) 12.4 Software Architecture and Application Notes This section describes architecture and applications. 12.4.1 USB Module Initialization At power-up, the USB module should be initialized within 20 ms if the USB port is connected. This time corresponds to the 10 ms reset signaling and 10 ms reset recovery time when a device is detected. The following steps are necessary to initialize the USB module for operation: 1. Clear EP0CTL[CFG_RAM_VAL,USB_EN]. 2. Load the configuration RAM with the descriptors from external ROM. The starting configuration RAM address is MBAR + 0x1400. 3. Select the internal or external USB transceiver in EPC0TL. 4. Write IEP0CFG and OEP0CFG to initialize the EP0 IN and OUT FIFOs. 5. Initialize the EP0 interrupt vectors. 6. Clear all interrupt bits in EP0ISR. 7. Enable the desired EP0 interrupt sources in EP0IMR. 8. Set EP0CTL[USB_EN, CFG_RAM_VALID]. 12.4.2 USB Configuration and Interface Changes Although the USB module handles the SET_CONFIGURATION and SET_INTERFACE requests, the user is still required to perform some initialization when the configuration or alternate settings change. A configuration or alternate setting change is signaled by the DEV_CFG interrupt. The following steps are required to service the DEV_CFG interrupt. 1. Read EPSR0 and ASR to determine the current configuration and alternate settings. 2. Read the endpoint descriptors for the current configuration and alternate settings to determine the endpoint type and maximum packet size for all of the active endpoints. 3. Write EPnCFG for all active endpoints to initialize the FIFOs. 4. Initialize the interrupt vectors for the active endpoints. 5. Clear all interrupt bits in the EPnISR registers for all active endpoints. 6. Enable the desired interrupt sources in the EPnIMR registers. 7. Clear the DEV_CFG interrupt bit to allow the USB module to access the FIFOs. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-31

Universal Serial Bus (USB) 12.4.3 FIFO Configuration The USB module allows a very flexible FIFO configuration. The FIFO configuration is very application dependent. The FIFO configuration depends on the current configuration number, alternate setting for each interface, and each endpoint’s type and packet size. The USB module contains two separate 512-byte FIFO spaces: one for IN and one for OUT endpoints. The following guidelines must be adhered to when configuring the FIFO’s: • The MAX_PACKET field in the EPnCFG registers must match the wMaxPacketSize field in the corresponding endpoint descriptor. An incorrect setting causes USB errors and unexpected interrupts. • EPnCFG[FIFO_SIZE] must be a power of 2 and must be at least two packets for non-isochronous endpoints. • The FIFO_ADDR field in the EPnCFG registers must be aligned to a boundary defined by the FIFO_SIZE field. For example, a FIFO with a size equal to 64 bytes can have a starting address of 0, 64, 128, 192, 256, etc. • The FIFO space for an endpoint defined by FIFO_SIZE and FIFO_ADDR must not overlap with the FIFO space for any other endpoint with the same direction. An example FIFO configuration with a variety of endpoint types and packet sizes is shown in Table 12-20. Table12-20. Example FIFO Setup Endpoint Endpoint FIFO Starting Endpoint Type Max Packet Size FIFO Size EPnCFG Value Number Direction Address 0 IN Control 8 32 480 0x020101C0 0 OUT Control 8 32 384 0x02010180 1 IN Interrupt 17 64 384 0x04420180 2 IN Bulk 64 128 256 0x10040100 3 OUT Bulk 32 128 256 0x08040100 4 IN Isochronous 5 32 448 0x014101C0 5 OUT Isochronous 5 32 416 0x014101A0 6 IN Isochronous 300 256 0 0x4B080000 7 OUT Isochronous 300 256 0 0x4B080000 12.4.4 Data Flow The handling of the data flow to and from each endpoint can be divided between isochronous and non-isochronous endpoints. Isochronous endpoints are designed to transfer streaming data which is continuous and real-time in creation, delivery, and consumption. The timely delivery of isochronous data is ensured at the expense of potential transient losses in the data stream. In other words, any error in electrical transmission in not corrected by hardware mechanisms such as retries. An example of streaming data is voice. The other endpoint types transfer message based, or bursted data where integrity of the data is more important than timely delivery. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-32 Freescale Semiconductor

Universal Serial Bus (USB) 12.4.4.1 Control, Bulk, and Interrupt Endpoints The data flow for control, bulk, and interrupt endpoints can be handled the same way for all 3 types of endpoints. Control, bulk, and interrupt endpoints all support guaranteed data delivery. If the host detects an error during the read of a packet from an IN endpoint, it requests that the packet be resent from the device. The USB FIFO mechanism takes care of this without interrupting the CPU. In a similar fashion, the USB FIFO mechanism keeps a received packet from being read by the user until the control logic validates the packet for transmission errors. 12.4.4.1.1 IN Endpoints The following example demonstrates how to transmit a transfer on an IN endpoint: 1. Wait until the last transfer is complete (an EOT interrupt has occurred). 2. Write data to the FIFO to fill it. 3. Wait for EOP interrupt or poll EOP bit. 4. Read EPnDP to determine the number of bytes that can be written to the FIFO. Normally, only one packet should be written unless the software does not service the EOP immediately. 5. Write data to the FIFO to fill it or until all of the data for the transfer has been written. 6. Repeat steps 5–7 until all of the data for the transfer has been written to the FIFO. 7. Clear EPnCTL[IN_DONE]. 8. Wait for the EOT interrupt or poll the EOT bit. The user can now begin processing the next transfer. 12.4.4.1.2 OUT Endpoints The following example demonstrates how to handle a received transfer on an OUT endpoint: 1. Wait for the EOP interrupt or poll the EOP bit. 2. Read EPnDP to determine number of bytes in the FIFO. 3. Read the indicated number of bytes of data from the FIFO into a buffer. 4. Repeat steps 1–3 until EOT is set. 5. When EOT is set, the transfer is complete. While EOT is set, the FIFO is locked and any packets sent for the next transfer cause a NAK response. 6. Read EPnDP to determine the number of bytes in the FIFO if any for the last transfer. The EOT bit can be cleared once this register has been read. 7. Read the indicated number of bytes of data from the FIFO into a buffer. 8. The user can now process the received transfer. 12.4.4.2 Isochronous Endpoints The data flow for isochronous endpoints must be handled differently than the data flow for non-isochronous endpoints. Data on isochronous endpoints is generally streaming data. Therefore, there is no concept of transfers and EOT. In addition, isochronous endpoints differ from other endpoint types in two distinct ways. Isochronous endpoints support packet sizes up to 1023 bytes and isochronous packets are never resent. In order to support the large packet sizes, the FIFO size can be less than two times the MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-33

Universal Serial Bus (USB) packet size and the EPDPn registers are updated in real-time, not just at the end of a packet as with other endpoint types. If the packet size is larger than the FIFO size, the FIFO level interrupt must be used. Isochronous packets are guaranteed to occur once per USB frame. The SOF and ASOF interrupts are provided in order for the user to synchronize the data flow with the USB. The SOF interrupt occurs every 1 ms provided the USB is active. The ASOF interrupt is generated if the USB module fails to detect a SOF packet within the set timeout period. It is strongly recommended that interrupts be used rather than polling for isochronous endpoints as isochronous endpoints do not have any error detection or flow-control mechanisms. If the packet size is larger than the FIFO size, using interrupts is required. 12.4.4.2.1 IN Endpoints The user should write one packet of data to the IN FIFO per frame. If an ASOF interrupt occurs, the user may wish to insert additional data in the data stream if the data for the frame is lost. The following example demonstrates how to handle an isochronous IN packet each frame with a packet size larger than the FIFO size: 1. Wait for the SOF interrupt for synchronization. 2. Write data to the FIFO until filled. 3. Wait for FIFO_LVL interrupt. 4. Read EPnDP to determine the number of bytes that can be written to the FIFO. 5. Write data to the FIFO to fill it or until all of the data for the packet has been written. 6. Repeat steps 3–5 until the entire packet has been written to the FIFO. 12.4.4.2.2 OUT Endpoints The user should read one packet of data from the OUT FIFO per frame. If an ASOF interrupt occurs, the user may wish to discard the data for the frame. The following example demonstrates how to handle an isochronous OUT packet each frame with a packet size larger than the FIFO size: 1. Wait for SOF interrupt for synchronization. The user may want to track that a packet is received for every frame. 2. Wait for the FIFO_LVL interrupt. 3. Read EPDPn to determine number of bytes in the FIFO. 4. Read data the indicated number of bytes from the FIFO. 5. Repeat steps 2–4 until entire packet is received. 6. Wait for EOP or SOF interrupt and read any remaining data in the FIFO. 7. An EOT interrupt indicates a short or zero-length packet. 12.4.5 Class- and Vendor-Specific Request Operation The class- and vendor-specific requests are specific to a particular device class or vendor, and are not processed by the USB request processor. When the USB module receives a class or vendor request, the parameters for the request are written to the DRR1 and DRR2 registers and the user is notified of the MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-34 Freescale Semiconductor

Universal Serial Bus (USB) request with the VEND_REQ interrupt. The user must take the following step to process a class or vendor request: 1. Read DRR1 and DRR2 to determine the request type. 2. If the request has a data stage, the EP0 FIFO should be read or written with the number of bytes as defined in the DRR2[wLength]. Refer to for more details on accessing the FIFOs. 3. When the user has finished processing the request, EP0CTL[CMD_OVER] must be set to signal completion of the request. [CMD_ERR] must also be set simultaneously if an error was encountered while processing the request. 12.4.6 REMOTE WAKEUP and RESUME Operation The MCF5272 supports USB RESUME initiated from three different sources. Two of the sources are for remote wakeup capability. The three different resume mechanisms are listed below: • The user sets EP0CTL[RESUME]. The USB module responds to this only if the USB is in the suspended state and EP0SR[WAKE_ST] is set. The ColdFire core must be running to write E0PCTL. To meet USB timing specifications, the RESUME bit must not be set until two milliseconds have elapsed since the USB module entered suspend state. • The wake-on-ring INT1 interrupt pin is at the active level defined in EP0CTL. The USB module responds to the INT1 pin only if the wake-on-ring function is enabled, the USB is in the suspended state and EP0SR[WAKE_ST] is set. The ColdFire core may be powered down, and the resume signaling wakes up the ColdFire core. The wake-on-ring function must not be enabled until two milliseconds have elapsed since the USB module entered the suspend state in order to meet USB specification timing requirements. • The USB module detects any activity on the USB, which may be normal bus activity, resume signaling, or reset signaling. The ColdFire core may be powered down, and the resume signaling wakes up the ColdFire core. 12.4.7 Endpoint Halt Feature USB has the ability to halt endpoints due to errors. The user is notified when an endpoint is halted and when the halt is cleared. When an endpoint is halted, the user should abort the current transfer and reinitialize the FIFO for the endpoint. An endpoint can be halted for a variety of reasons. • SET_FEATURE request with the endpoint halt feature selector set. • EPnCTL[STALL] is set by the user. This bit should be set only when there is a critical error on the endpoint. • On control endpoints, an error processing a request. A halted endpoint can be cleared in several different ways: • CLEAR_FEATURE request with the endpoint halt feature selector set. • A USB reset signal. • A SET_CONFIGURATION or SET_INTERFACE request. • On control endpoints, a SETUP token for the next request. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-35

Universal Serial Bus (USB) 12.5 Line Interface The recommended line interface is shown in Figure 12-24. The transistor used to control the 1.5–kΩ pull-up resistor is optional. 3.3 V 1kΩ GP I/O pin 100Ω MCF5272 Vbus 1.5kΩ±5% USB_D+ D+ USB 33Ω Series B Receptacle USB_D- D– 33Ω GND Figure12-24. Recommended USB Line Interface 12.5.1 Attachment Detection The USB specification requires that a pull-up resistor must be placed on the D+ signal for the upstream hub to detect attachment of a full-speed device. The user may optionally want to control the attach/detach detection by software instead of only at power on and off. With software control of the pull-up resistor, the user has unlimited time to initialize the USB module. The software controlled pull-up resistor can be implemented with only a few discrete components. The recommended circuit for implementing software control of the pull-up resistor is shown in Figure12-24. 12.5.2 PCB Layout Recommendations The device has input protection on all pins and may source or sink a limited amount of current without damage. The most important considerations for PCB layout deal with noise: noise on the power supply, noise generated by the digital circuitry on the device, and noise resulting from coupling digital signals into the analog signals. The best PCB layout methods to prevent noise–induced problems are as follows: • Keep digital signals as far away from analog signals (D+ and D-) as possible. • Use short, low inductance traces for the analog circuitry to reduce inductive, capacitive, and radio frequency noise sensitivities. • Use short, low inductance traces for digital circuitry to reduce inductive, capacitive, and radio frequency radiated noise. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-36 Freescale Semiconductor

Universal Serial Bus (USB) • Bypass capacitors should be connected between the Vdd and GND pairs with minimal trace length. These capacitors help supply the instantaneous currents of the digital circuitry, in addition to decoupling the noise that may be generated by other sections of the device or other circuitry on the power supply. • Use short, wide, low inductance traces to connect all of the GND pins together and, with a single trace, connect all of the GND pins to the power supply ground. This helps to reduce voltage spikes in the ground circuit caused by high-speed digital current spikes. Suppressing these voltage spikes on the integrated circuit is the reason for multiple GND leads. A PCB with a ground plane connecting all of the digital and analog GND pins together is the optimal ground configuration, producing the lowest resistance and inductance in the ground circuit. • Use short, wide, low inductance traces to connect all of the Vdd power supply pins together and, with a single trace, connect all of the Vdd pins to the 3.3V power supply. Connecting all of the digital and analog Vdd pins to the power plane would be the optimal power distribution method for a multi-layer PCB with a power plane. • The 48-MHz oscillator must be located as close as possible to the chip package. This is required to minimize parasitic capacitance between crystal traces and ground. 12.5.3 Recommended USB Protection Circuit Figure 12-25 shows the recommended external ESD protection circuit for the USB. +3.3V +3.3V Schottky Diode 2 x MMBD301LT1 USB Port 1.5K 330 33 1 D – 2 D + 3 33 4 22pF 22pF Zener Diode 0.1μF BZX84C3V3LT1 Figure12-25. USB Protection Circuit MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 12-37

Universal Serial Bus (USB) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 12-38 Freescale Semiconductor

Chapter 13 Physical Layer Interface Controller (PLIC) This chapter provides detailed information about the MCF5272’s physical layer interface controller (PLIC), a module intended to support ISDN applications. The chapter begins with a description of operation and a series of related block diagrams starting with a high-level overview. Each successive diagram depicts progressively more internal detail. The chapter then describes timing generation, the programming model, and concludes with three application examples. The reader is assumed to have a basic familiarity with ISDN technology and terminology. A glossary containing many ISDN terms can be found on the web at the following URL: http://www.tribecatech.com/isdnterm.htm. 13.1 Introduction The physical layer interface controller (PLIC) allows the MCF5272 to connect at a physical level with external CODECs (coder/decoder) and other peripheral devices that use either the general circuit interface (GCI) or interchip digital link (IDL) physical layer protocols. This module is primarily intended to facilitate designs that include ISDN (integrated services digital network) interfaces. The MCF5272 has four dedicated physical layer interface ports for connecting to external ISDN transceivers, codecs, and other peripherals. There are three sets of pins for these interfaces. Port 0 has its own dedicated set of pins. Ports 1, 2, and 3 share a set of pins. Port3 can also be configured to use a dedicated pin set. Ports 1, 2, and 3 always share the same data clock (DCL). When the ports are operated in slave mode, the PLIC can support a DCL frequency of 4.096MHz and frame sync frequency (FSC/FSR) of 8KHz. When in master mode, DCL should be no greater than one-twentieth of the CPU clock (CLKIN), with a maximum FSC/FSR of 8KHz. This chapter is written from the perspective of connecting to an ISDN transceiver with 8-KHz frame sync. The MCF5272 PLIC has four ports, port 0 – port 3, connected through three pin sets, numbered0,1, and3. A port can service, read, or write any 2B+ D channel. As shown in Figure13-1, port0 connects through pin set 0, and ports 1 and 2 both connect through set 1. port3 can use either pin set 1 or 3. Pin set 3 consists of data in and data out. Data clock and frame sync are common to pin set 1 and 3. In the case of set 1, which connects multiple ports, separate delayed frame sync generators are provided for each port which distinguish each port’s active time slots. See Section13.6, “Application Examples” for further information. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-1

Physical Layer Interface Controller (PLIC) Figure 13-1 illustrates the basic PLIC system. Pin Set 0 Pin Set 1 PA8/FSC0/FSR0, PA9/DGNT0, FSC1/FSR1/DFSC1, Pin Set 3 DCL0/URT1_CLK, DIN0/URT1_RxD, DCL1/GDCL1_OUT, PA14, PA7/QSPI_CS3/DOUT3, DOUT0/URT1_TxD, PA10/DREQ0 PA15_INT6/DGNT1_INT6, DOUT1, DIN1 DIN3/INT4 DIN3 Pin Set 1 Mux DOUT Timing Timing Pin Set 3 Mux Timing Gen Gen Gen Port 0 Timing Port 1 Port 2 Port 3 GCI/IDL GCI/IDL GCI/IDL GCI/IDL Generator 32 32 32 32 Internal Interface Registers Internal Bus Figure13-1. PLIC System Diagram The four ports have the following timing and connectivity features: • Port 0: Connects through pin set 0. Operates as a slave-only port; that is, an external device must source frame sync clock/frame sync receive (FSC/FSR) and data clock (DCL). These pins are unidirectional inputs. Din0 and Dout0 are dedicated pins for port0. • Port 1: Connects through pin set 1. Operates as a master or slave port. In slave mode an external device must source FSC/FSR and DCL. In master mode, DCL1 and FSC1/FSR1 are outputs. These signals are in turn derived from the DCL0 and FSC/FSR from port 0. For port1 to function in master mode, port 0 must be enabled with an external transceiver sourcing DCL and FSC/FSR. The physical interface pins Din1 and Dout1 serve ports 1, 2, and 3. • Port 2: Connects through pin set 1. Operates as a slave-only port. Port2 shares a data clock with port 1: DCL1 when port 1 is in slave mode or GDCL when port1 is in master mode. A delayed frame sync, DFSC2, derived from FSC1, is connected to the DFSC2 output and fed to the port 2 IDL/GCI block. Users can synchronize the port 2 IDL/GCI block with an offset frame sync, (offset with respect to the port 1 GCI/IDL block), by programming the port 2 sync delay register, P2SDR. • Port 3: Connects through pin set 1 or 3. Operates as a slave-only port. Port 3 shares a data clock with port1: DCL1 when port1 is in slave mode, or GDCL, when port 1 is in master mode. A delayed frame sync, DFSC3, is derived from FSC1 and is fed to the port 3 IDL/GCI block. Programming the port3 sync delay register, P3SDR, allows it to be synchronized with an offset MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-2 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) frame sync (offset with respect to the port 1 GCI/IDL block). Port3 can also have dedicated data in and data out pins, DIN3 and DOUT3 of pin set 3 (see Section13.5.7, “Port Configuration Registers (P0CR–P3CR)”). This allows the MCF5272 to connect to ISDN NT1s that have a common frame sync and clock, but two sets of serial data-in and data-out pins. The MCF5272 PLIC provides two sets of D-channel arbitration control pins: • DREQ0 and DGNT0 for pin set0 • DREQ1 and DGNT1 for pin set 1 Because pin set 1 connects ports 1, 2, and 3, these ports do not have D-channel arbitration control signals. 13.2 GCI/IDL Block This section describes the GCI/IDL block. 13.2.1 GCI/IDL B- and D-Channel Receive Data Registers DCL DIN B1 Shift Register B2 Shift Register D Shift Register Demultiplexing B1 Channel B2 Channel D Channel Circuitry 32 32 8 Internal Bus Figure13-2. GCI/IDL Receive Data Flow The maximum data rate received for each GCI/IDL port is 144Kbps: the sum of two 64-Kbps B channels and one 16-Kbps D-channel. Frames of B and B channels are packed together to form longwords (32 1 2 bits). Frames of D-channels are packed together to form bytes. For channels B and D, this requires CPU service at a 2-KHz rate, because it requires four frames to fill the 32-bit B-channel register and the 8-bit D-channel register. The CPU should service the B1 and B2 registers once every 500μS. Overrun conditions can be avoided only if the CPU services these registers in a timely manner. The MCF5272 has 4 GCI/IDL interfaces. Thus the theoretical maximum is twelve 32-bit data registers to be read. For most applications the typical number is less. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-3

Physical Layer Interface Controller (PLIC) Figure 13-3 shows the shift register, shadow register, internal bus register, and multiplexor for each B receive channel. After reset, the B- and D-channel shift registers and shadow registers are initialized to all ones. Shift Register (B1 or B2) DIN 8 bits 64 Kbps DEMUX 8-KHz Rate START END Shadow Register 8 bits 8 bits 8 bits 8 bits 2-KHz transfer and interrupt 32 B1, B2, Receive 32 bits Data Register 32 Internal Bus Figure13-3. GCI/IDL B-Channel Receive Data Register Demultiplexing 13.2.2 GCI/IDL B- and D-Channel Transmit Data Registers DCL B1 Shift Register B2 Shift Register D Shift Register Dout Multiplexing B1 B2 D Circuitry 32 32 8 Internal Bus Figure13-4. GCI/IDL Transmit Data Flow The maximum transmission rate for each GCI/IDL port is 144Kbps: the sum of two 64-Kbps B channels and one 16-Kbps D-channel. Frames of B , B , and D-channels are packed together in a similar way to the 1 2 receive side. Because the reception and transmission of information on the GCI/IDL interface is deterministic, a common interrupt is generated at the 2-KHz rate. It is expected that a common interrupt service routine services the transmit and receive registers. After reset, the B- and D-channel shift registers and shadow registers are initialized to all ones. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-4 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) Shift Register 8 bits MUX 8-KHz Rate START END 8 bits 8 bits 8 bits 8 bits Shadow Register 2-KHz transfer and interrupt 32 B1, B2 Transmit 32 bits Data Register 32 Internal Bus Figure13-5. GCI/IDL B Data Transmit Register Multiplexing 13.2.3 GCI/IDL B- and D-Channel Bit Alignment Unencoded voice is normally presented on the physical line most significant bit first (left aligned). See the MC145484 data sheet for an example. Accordingly, the MCF5272 normally assumes incoming data are left-aligned. However, this convention is reversed when the data stream is HDLC (high-level data link control) encoded. HDLC-stuffing and unstuffing are done by counting bits from the lsb. The look-up table in the software HDLC on this device transmits the lsb first. 13.2.3.1 B-Channel Unencoded Data Because unencoded voice data appears on the physical interface most significant bit (msb) first, the msb is left aligned in the transmit and receive shift register; that is, the first bit of B-channel received data is aligned in the msb position as shown in Figure13-6. The CPU uses longword (32-bit) registers (like P0B1RR) to communicate B-channel data to/from the PLIC. These registers are loaded by concatenating four of the 8-bit/8-KHz frames. The four frames are aligned sequentially as shown in Figure 13-6, with the first frame in the most significant byte (MSB) position, and the fourth frame taking the least significant byte (LSB) position. See Section13.5.1, “B1 Data Receive Registers (P0B1RR–P3B1RR),” or Section13.5.5, “B2 Data Transmit Registers (P0B2TR–P3B2TR),” for more information about some of these registers. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-5

Physical Layer Interface Controller (PLIC) . DCL FSR Unencoded B B B B B B B B B B B B B B B B D D B B B B B B Din/Dout 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 0 1 7 6 5 4 3 2 HDLC Encoded Din/Dout B0B1 B2 B3 B4 B5 B6 B7 B0B1 B2 B3 B4 B5 B6 B7D0 D1 B0 B1 B2 B3 B4 B5 B 1 B 2 D Frame 0 Frame 1 32-bit B1/B2 Receive/Transmit Registers, PnB1RR, PnB2RR, PnB1TR, PnB2TR B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B B 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 Frame 0 Frame 1 Frame 2 Frame 3 Figure13-6. B-Channel Unencoded and HDLC Encoded Data 13.2.3.2 B-Channel HDLC Encoded Data When the incoming B channels contain HDLC encoded data they are presented on the physical line least significant bit (lsb) first. The Soft HDLC expects the first bit received to be aligned in the lsb position of a byte, with the last bit received aligned in the msb position. Because the presentation of HDLC encoded data on the physical interface is lsb (least significant bit) first for B1 and B2 the lsb is right-aligned in the transmit and receive shift register, that is, the first bit of the B-channel received is aligned in the lsb position through to the last received bit of a byte that is aligned in the msb position. The ordering of the bytes over four frames within the longword register is as for unencoded data; that is, the first frame is aligned in the MSB through to the fourth frame, which is aligned in the LSB position. See Figure 13-6. 13.2.3.3 D-Channel HDLC Encoded Data When the incoming D channels contain HDLC-encoded data, they are presented on the physical line lsb first. The Soft HDLC expects the first bit received to be aligned in the lsb position of a byte, with the last bit received aligned in the msb position. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-6 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) Because the presentation of HDLC encoded data on the physical interface is lsb first, the lsb is right-aligned in the transmit and receive shift register. A D-channel byte is formed by concatenating two D bits from each of four frames. This data is also right-aligned in the D-channel receive register as shown in Figure 13-7. DCL FSR Frame 0 Frame 1 Frame 2 Frame 3 HDLC Encoded D D D D D D D D Din/Dout 0 1 2 3 4 5 6 7 Unencoded D D D D D D D D Din/Dout 7 6 5 4 3 2 1 0 8-Bit D-Channel Receive/Transmit Register, RD, TD D7 D6 D5 D4 D3 D2 D1 D0 Frame 3 2 1 0 Figure13-7. D-Channel HDLC Encoded and Unencoded Data. 13.2.3.4 D-Channel Unencoded Data As with the B channel, a mechanism is provided to support incoming D channels containing unencoded data, even though as of this document’s publication date, no communication protocols using unencoded D-channel data are known. As with unencoded (PCM encoded) B-channel data, it is assumed unencoded D-channel information is presented on the physical line msb first. The msb is left-aligned in the transmit and receive shift register, that is, the first bit received is aligned in the msb position through to the last received bit of a byte that is aligned in the lsb position. A D-channel byte is formed by concatenating two D bits from each frame over four consecutive frames as shown in Figure 13-7. These 8 bits are also left-aligned in the D-channel receive register, that is, the first two D-channel bits from the first frame go into the two msbs, B and B , the next two D-channel bits from 7 6 the second frame in B and B , and so on, until the last two D-channel bits in the fourth frame are aligned 5 4 in B and B . 1 0 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-7

Physical Layer Interface Controller (PLIC) 13.2.3.5 GCI/IDL D-Channel Contention Typically, when the CPU wants to transmit a D-channel packet, it starts the HDLC framer. In IDL mode, when the CPU can start sending data from the prepared HDLC frame to the D-channel transmit register, it asserts DREQ by setting the appropriate DRQ bit in the PDRQR register. The D-channel controller hardware looks for a valid DGRANT back from the layer 1 transceiver and, assuming DREQ is also valid, begins transmitting the D-channel packet. PDCSR[DGn] reflects the value of the dedicated DGRANT pin. Refer to the MC145574 data sheet for SCIT mode information. In GCI mode the only D-channel contention control is provided by PnCR[G/S], Section13.5.7, “Port Configuration Registers (P0CR–P3CR).” Provided the PLIC operates in SCIT mode, PDCSR[DGn], Section13.5.19, “D-Channel Status Register (PDCSR),” is defined by the state of PnCR[G/S], and is used to control D-channel transmission along with PDRQR[DRQn], Section13.5.20, “D-Channel Request Register (PDRQR).” In GCI mode, the PLIC ports do not support any other form of D-channel contention such as the indirect mode found on the Freescale MC145574. In GCI mode, the DGRANT pin function found in IDL mode is disabled and the pin can be defined for other functions. Please note that the D-channel periodic interrupts in both the receive and transmit direction are not disabled even though the shift register is disabled by DREQ, DGRANT, and PDRQR[DCNTIn] (Section13.5.20, “D-Channel Request Register (PDRQR)”) configuration. An override mechanism for D-channel contention control is provided through the D-channel ignore DCNTI bit. Figure 13-8 illustrates this functionality: DGRANT DREQ DCNTI Shift Register Enable Figure13-8. D-Channel Contention 13.2.4 GCI/IDL Looping Modes The PLIC ports can be configured to operate in various looping modes as shown in Figure 13-9. These modes are useful for local and remote system diagnostic functions. The loopback modes are independent signal loopbacks for the respective ports. These loopbacks allow for the echoing of local or remote information. In auto-echo or remote-loopback modes there is no time switching or time slot assignment function. All data received on Din is transmitted on Dout during the same time slot. Similarly, in local-loopback mode, the information transmitted on the Dout pin is echoed back on Din during the same time slot. The PLIC transmitter and receiver should both be disabled when switching between modes. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-8 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.2.4.1 Automatic Echo Mode The port automatically retransmits the received data on a bit-by-bit basis in this mode. The local CPU-to-receiver communication continues normally, but the CPU-to-transmitter link is disabled. While in this mode, received data is clocked on the receiver clock and retransmitted on transmit Dout pin. 13.2.4.2 Local Loopback Mode TxData is internally connected to RxData in this mode. This mode is useful for testing the operation of a local port by sending data to the transmitter and checking data assembled by the receiver. In this manner, correct channel operations can be assured. Also, both transmitter and CPU-to-receiver communications continue normally in this mode. While in this mode, the receive Din pin is ignored, the transmit Dout is held marking, and the receiver is clocked by the transmitter clock. 13.2.4.3 Remote Loopback Mode The channel automatically transmits received data on the transmit Dout pin on a bit-by-bit basis in this mode. The local CPU-to-transmitter link is disabled. This mode is useful in testing receiver and transmitter operation of a remote channel. While in this mode, the receiver clock is used for the transmitter. Disabled Rx Din Rx Din CPU CPU Disabled Disabled Disabled Tx Dout Tx Dout (a) Automatic Echo (b) Local Loopback Disabled Disabled Rx Din CPU Disabled Disabled Tx Dout (c) Remote Loopback Figure13-9. GCI/IDL Loopback Mode 13.2.5 GCI/IDL Interrupts The PLIC module generates two interrupts—the periodic frame interrupt and the aperiodic status interrupt. 13.2.5.1 GCI/IDL Periodic Frame Interrupt The frame interrupt is a periodic 2-KHz interrupt as shown in Figure13-10. This is the normal interrupt rate for servicing the incoming and outgoing B and D channels. This service routine must execute in a timely manner. Each of the B- and D-channel transmit and receive registers should be written and read prior to the next 2-KHz interrupt for underrun or overrun conditions to be prevented. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-9

Physical Layer Interface Controller (PLIC) Note that only the active, that is enabled, B- and D-channel receive and transmit registers need to be read and written. B and D channels which are not active need not have their receive and transmit registers read and written. 500 μs 125 μs Slot 0 Slot 1 Slot 2 Slot 3 Slot 0 Slot 1 Slot 2 Slot 3 Slot 0 Slot 1 Slot 2 Frame n Frame n+1 Frame n+2 2-KHz interrupt 2-KHz interrupt 2-KHz interrupt Interrupt service routine Interrupt service routine Interrupt service routine Read Frame n -1 (B&D) Read Frame n (B&D) Read Frame n+1 (B&D) Write Frame n+1 (B&D) Write Frame n+2 (B&D) Write Frame n+3 (B&D) Figure13-10. Periodic Frame Interrupt It should be clear from Figure 13-10 that due to the double buffering through the PLIC shadow register, frame (n) is written to the PLIC transmit register during the interrupt service routine of the previous frame, frame (n-1). Similarly on the receive side, frame (n) is read from the PLIC receive register during the interrupt service routine of the following frame, frame (n+ 2). Figure 13-10 shows that the minimum delay through the PLIC, when not in loopback mode, is two 2-KHz frames, or 1mS. 13.2.5.2 GCI Aperiodic Status Interrupt The aperiodic status interrupt is an interrupt which is driven by a number of conditions. The CPU services this interrupt by reading the aperiodic status register, ASR, and by reading or writing the relevant C/I or monitor channel register or registers which have generated this interrupt. Once read, the interrupt is cleared. Each port and individual interrupts within each port is maskable. The following conditions for each of the ports can trigger this interrupt: • Monitor channel receive: ASR defines which port or ports have generated a monitor channel receive interrupt. The interrupt service routine must then read the appropriate GMR register or registers to clear the monitor channel receive interrupt. • Monitor channel transmit: ASR defines which port or ports have generated a monitor channel transmit interrupt. The interrupt service routine must then read the appropriate GMT register or registers to clear the monitor channel transmit interrupt. • C/I channel receive: ASR defines which port or ports have generated a C/I channel receive interrupt. The interrupt service routine must then read the appropriate GCIR register or registers to clear the C/I channel receive interrupt. • C/I channel transmit: ASR defines which port or ports have generated a C/I channel transmit interrupt. The interrupt service routine must then read the appropriate GCIT register or registers to clear the C/I channel transmit interrupt. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-10 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.2.5.3 Interrupt Control There are a number of control mechanisms for the periodic and aperiodic interrupts on the PLIC. • Clearing the ON/OFF bit in the port configuration register, Section13.5.7, “Port Configuration Registers (P0CR–P3CR),” turns the port off and masks all periodic and aperiodic interrupts for the affected port. • Clearing the enable bits, ENB1 or ENB2, in the port configuration register masks the periodic transmit and receive interrupts associated with the respective B1 or B2 channel. • Specific interrupt enables are provided in each port’s ICR. This includes a port interrupt enable, IE, which masks all periodic and aperiodic interrupts. In addition, there are interrupt enables for specific conditions. These are listed in Section13.5.9, “Interrupt Configuration Registers (P0ICR–P3ICR).” 13.3 PLIC Timing Generator 13.3.1 Clock Synthesis The PLIC clock generator employs a completely digital, synchronous design which can be used to synthesize a new clock by multiplying an incoming reference clock. This clock generator is not a PLL—it has no VCO or phase comparator. The frequency multiplication factor is always an integral power of two between 2 and 256 inclusive. The amount of phase jitter exhibited by the synthesized clock increases as the synthesized clock frequency approaches CLKIN’s frequency. As a general guide, the maximum generated DCL should be no greater than one-twentieth of CLKIN’s frequency. Therefore, given a CLKIN of 66MHz, the maximum frequency which can be synthesized with acceptable jitter is approximately 3.3MHz. The clock generator uses a 14-bit counter to divide CLKIN. This limits the reference clock’s minimum frequency to CLKIN divided by 16,384. To summarize these two points: • Synthesized clock x 20 < CLKIN(Recommended) • Reference clock > CLKIN / 16,384(Required) The control of the clock generator block is provided through the PCSR register detailed in Section13.5.22, “Clock Select Register (PCSR).” The process is illustrated by this example. Suppose the following: • CPU clock=66MHz • Reference clock= 64KHz • Synthesized clock= 1.024MHz The appropriate reference clock is selected by programming PLCLKSEL[CKI1, CKI0], Section13.5.22, “Clock Select Register (PCSR).” The multiplication factor is 16 (1.024MHz /64KHz) and is specified by PLCLKSEL[CMULT0-2]. The division ratio between the synthesized clock (GDCL), 1.024MHz, and the synthesized frame sync (Gen_FSC) must be set. (A Gen_FSC of 8KHz is assumed). This division ratio is selected by means of FDIV[2-0]. Finally, the clock generation block should be taken out of bypass by setting PCSR[NBP]. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-11

Physical Layer Interface Controller (PLIC) The above settings can be made by a single write of the 16-bit value 0x802B to PCSR. The following restrictions should be observed when using the clock generator module: • The smallest multiplication factor is 2. • CLKIN should be significantly greater than (> 20 times) the synthesized clock. Figure 13-11 and Figure 13-12 show the connectivity and relationship of the timing signals within the PLIC block. FSC0 2-KHz to CPU SFSC Gen FSC1 P0CR[M2-M0] P1CR[FSM] P0SDR[15:0] DFSC0 Pin DCL0/URT1_CLK Prog Delay 0 Mux 0 PA8/FSC0/FSR0 P1SDR[15:0] Port 0 DCL0 GCI/IDL DFSC0 DFSC1 Prog Delay 1 DCL1/GDCL1_OUT Pin Mux 1 DCL1 FSC1/FSR1/DFSC1 Port 1 FSC1 GCI/IDL P2SDR[15:0] P1CR[M/S] DCL1 DFSC2 Port 2 Prog Delay 2 GCI/IDL DFSC2 P3SDR[15:0] DCL1 DFSC3 Port 3 Prog Delay 3 GCI/IDL DFSC3 Figure13-11. PLIC Internal Timing Signal Routing GDCL DCL0/URT1_CLK PA8/FSC0/FSR0 Mux Multiply Divider Gen_FSC Block Block O192K CKI[1:0] CMULT[2:0] FDIV[2:0] Figure13-12. PLIC Clock Generator MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-12 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.3.2 Super Frame Sync Generation Figure 13-11 shows the generation of the 2-KHz super frame sync. The choice of either FSC0 or FSC1 is possible using P1CR[FSM]. This allows either the port0 or port1 timing to be used to generate the 2-KHz super frame sync interrupt. The SFSC block then divides this accordingly. When P1CR[FSM] is set, FSC1 is the source of the super frame sync. In case P1CR[MS] is 0 (that is, port 1 is in slave mode), the interrupt is ultimately driven by an external source. In case the M/S bit is 1 (that is, port1 is in master mode), FSC1 ultimately comes from port 0. 13.3.3 Frame Sync Synthesis Figure 13-11 illustrates the relationships between the various frame sync clocks. DFSC1 is generated through programmable delay 1 referenced to DFSC0. DFSC2 and DFSC3 are generated through programmable delays 2 and 3 referenced to DFSC1. Note well the following: • P0SDR settings affect DFSC[0–3] • P1SDR settings affect DFSC[1–3] • P2SDR settings affect only DFSC2 • P3SDR settings affect only DFSC3 13.4 PLIC Register Memory Map Table 13-1 lists the PLIC registers with their offset address from MBAR and their default value on reset. Table13-1. PLIC Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0300 Port0 B1 Data Receive (P0B1RR) 0x0304 Port1 B1 Data Receive (P1B1RR) 0x0308 Port2 B1 Data Receive (P2B1RR) 0x030C Port3 B1 Data Receive (P3B1RR) 0x0310 Port0 B2 Data Receive (P0B2RR) 0x0314 Port1 B2 Data Receive (P1B2RR) 0x0318 Port2 B2 Data Receive (P2B2RR) 0x031C Port3 B2 Data Receive (P3B2RR) 0x0320 Port0 D Data Receive Port1 D Data Receive Port2 D Data Receive Port3 D Data Receive (P0DRR) (P1DRR) (P2DRR) (P3DRR) 0x0328 Port0 B1 Data Transmit (P0B1TR) 0x032C Port1 B1 Data Transmit (P1B1TR) 0x0330 Port2 B1 Data Transmit (P2B1TR) 0x0334 Port3 B1 Data Transmit (P3B1TR) 0x0338 Port0 B2 Data Transmit (P0B2TR) 0x033C Port1 B2 Data Transmit (P1B2TR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-13

Physical Layer Interface Controller (PLIC) Table13-1. PLIC Module Memory Map (continued) MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0340 Port2 B2 Data Transmit (P2B2TR) 0x0344 Port3 B2 Data Transmit (P3B2TR) 0x0348 Port0 D Data Transmit Port1 D Data Transmit Port2 D Data Transmit Port3 D Data Transmit (P0DTR) (P1DTR) (P2DTR) (P3DTR) 0x0350 Port0 GCI/IDL Configuration register (P0CR) Port1 GCI/IDL Configuration register (P1CR) 0x0354 Port2 GCI/IDL Configuration register (P2CR) Port3 GCI/IDL Configuration register (P3CR) 0x0358 Port0 Interrupt Configuration register (P0ICR) Port1 Interrupt Configuration register (P1ICR) 0x035C Port2 Interrupt Configuration register (P2ICR) Port3 Interrupt Configuration register (P3ICR) 0x0360 Port0 GCI monitor Rx (P0GMR) Port1 GCI monitor Rx (P1GMR) 0x0364 Port2 GCI monitor Rx (P2GMR) Port3 GCI monitor Rx (P3GMR) 0x0368 Port0 GCI monitor Tx (P0GMT) Port1 GCI monitor Tx (P1GMT) 0x036C Port2 GCI monitor Tx (P2GMT) Port3 GCI monitor Tx (P3GMT) 0x0370 Reserved GCI monitor Tx status GCI monitor Tx abort Reserved (PGMTS) (PGMTA) 0x0374 Port0 GCI C/I Rx (P0GCIR) Port1 GCI C/I Rx (P1GCIR) Port2 GCI C/I Rx (P2GCIR) Port3 GCI C/I Rx (P3GCIR) 0x0378 Port0 GCI C/I Tx (P0GCIT) Port1 GCI C/I Tx (P1GCIT) Port2 GCI C/I Tx (P2GCIT) Port3 GCI C/I Tx (P3GCIT) 0x037C Reserved GCI C/I Tx Status (PGCITSR) 0x0383 Reserved GCI C/I D-Channel Status (PDCSR) 0x0384 Port0 periodic status (P0PSR) Port1 periodic status (P1PSR) 0x0388 Port2 periodic status (P2PSR) Port3 periodic status (P3PSR) 0x038C Aperiodic Interrupt status register (PASR) Reserved Loop back Control (PLCR) 0x0390 Reserved D-Channel Request (PDRQR) 0x0394 Port0 Sync Delay (P0SDR) Port1 Sync Delay (P1SDR) 0x0398 Port2 Sync Delay (P2SDR) Port3 Sync Delay (P3SDR) 0x039C Reserved Clock Select (PCSR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-14 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.5 PLIC Registers Any bits in the following registers marked0 have no function. When the register is a read/write register, these bits should be cleared. Some registers are described that control more than one port. In these cases, parentheses indicates to which port the control bits relate; for example, LM0(0) is the LM0 bit for port0. 13.5.1 B1 Data Receive Registers (P0B1RR–P3B1RR) All bits in these registers are read only and are set on hardware or software reset. The PnB1RRs contain the last four frames of data received on channel B1. (P0B1RR is the B1 channel data for port 0, P1B1RR is B1 for port1, and so on.) The data are packed from the least significant byte (LSB), up to the most significant byte (MSB). These registers are aligned on longword boundaries from MBAR+ 0x300 for P0B1RR to MBAR+ 0x30C for P3B1RR. See Section13.2.3, “GCI/IDL B- and D-Channel Bit Alignment,” for the frame and bit alignment within the 32-bit word. 31 24 23 16 Field Frame 0 Frame 1 Reset 1111_1111 1111_1111 R/W Read Only 15 8 7 0 Field Frame 2 Frame 3 Reset 1111_1111 1111_1111 R/W Read Only Addr MBAR+0x300 (P0B1RR); 0x304 (P1B1RR); 0x308 (P2B1RR); 0x30C (P3B1RR) Figure13-13. B1 Receive Data Registers P0B1RR–P3B1RR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-15

Physical Layer Interface Controller (PLIC) 13.5.2 B2 Data Receive Registers (P0B2RR–P3B2RR) All bits in these registers are read only and are set on hardware or software reset. The PnB2RR registers contain the last four frames of data received on channel B2. (P0B2RR is the B2 channel data for port 0, P1B2RR is B2 for port1, and so on.) The data are packed from LSB to MSB. These registers are aligned on long-word boundaries from MBAR+ 0x310 for P0B2RR to MBAR+ 0x31C for P3B2RR. See Section13.2.3, “GCI/IDL B- and D-Channel Bit Alignment,” for the frame and bit alignment within the 32-bit word. Figure 13-14 shows the B2 receive data registers. 31 24 23 16 Field Frame 0 Frame 1 Reset 1111_1111 1111_1111 R/W Read Only 15 8 7 0 Field Frame 2 Frame 3 Reset 1111_1111 1111_1111 R/W Read Only Addr MBAR+0x310 (P0B2RR); 0x314 (P1B2RR); 0x318 (P2B2RR); 0x31C (P3B2RR) Figure13-14. B2 Receive Data Registers P0B2RR – P3B2RR 13.5.3 D Data Receive Registers (P0DRR–P3DRR) All bits in these registers are read-only and are set on hardware or software reset. The PnDRR registers contain the last four frames of D-channel receive data packed from the least significant bit, (lsb), to the most significant bit, (msb), for each of the four physical ports on the MCF5272. P0DRR is the D-channel byte for port0, P1DRR the D channel for port1, and so on. Each of the four byte-addressable registers, P0DRR-P3DRR, are packed to form one 32-bit register, PnDRR, located at MBAR+ 0x320. P0DRR is located in the MSB of the PnDRR register, P3DRR is located in the LSB of the PnDRR register. 31 24 23 16 Field P0DRR P1DRR Reset 1111_1111 1111_1111 R/W Read Only 15 8 7 0 Field P2DRR P3DRR Reset 1111_1111 1111_1111 R/W Read Only Addr MBAR+0x320 (P0DRR); 0x321 (P1DRR); 0x322 (P2DRR); 0x323 (P3DRR) Figure13-15. D Receive Data Registers P0DRR–P3DRR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-16 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.5.4 B1 Data Transmit Registers (P0B1TR–P3B1TR) All bits in these registers are read/write and are set on hardware or software reset. The PnB1TR registers contain four frames of transmit data for channel B1. (P0B1TR is the B1 channel transmit data for port0, P1B1TR is B1 transmit for port1, and so on.) The data are packed from LSB to MSB. These registers are aligned on long-word boundaries from MBAR+ 0x328 for P0B1TR to MBAR+ 0x334 for P3B1TR. See Section13.2.3, “GCI/IDL B- and D-Channel Bit Alignment,” for the frame and bit alignment within the 32-bit word. 31 24 23 16 Field Frame 0 Frame 1 Reset 1111_1111 1111_1111 R/W Read/Write 15 8 7 0 Field Frame 2 Frame 3 Reset 1111_1111 1111_1111 R/W Read/Write Addr MBAR+0x328 (P0B1TR); 0x32C (P1B1TR); 0x330 (P2B1TR); 0x334 (P3B1TR) Figure13-16. B1 Transmit Data Registers P0B1TR–P3B1TR 13.5.5 B2 Data Transmit Registers (P0B2TR–P3B2TR) All bits in these registers are read/write and are set on hardware or software reset. The PnB2TR registers contain four frames of transmit data for portn of channel B2. (P0B2TR is the B2 channel transmit data for port0, P1B2TR is B2 transmit for port 1, and so on.) The data are packed from LSB to MSB. These registers are aligned on long-word boundaries from MBAR+ 0x338 for P0B2TR to MBAR+ 0x344 for P3B2TR. Please refer to Section13.2.3, “GCI/IDL B- and D-Channel Bit Alignment” for the frame and bit alignment within the 32-bit word. 31 24 23 16 Field Frame0 Frame1 Reset 1111_1111 1111_1111 R/W Read/Write 15 8 7 0 Field Frame2 Frame3 Reset 1111_1111 1111_1111 R/W Read/Write Addr MBAR+0x338 (P0B2TR); 0x33C (P1B2TR); 0x340 (P2B2TR); 0x344 (P3B2TR) Figure13-17. B2 Transmit Data Registers P0B2TR–P3B2TR MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-17

Physical Layer Interface Controller (PLIC) 13.5.6 D Data Transmit Registers (P0DTR–P3DTR) All bits in these registers are read/write and are set on hardware or software reset. The PLTD registers contain four frames of D-channel transmit data, packed from lsb to msb, for each of the four physical ports on the MCF5272. P0DTR is the D-channel byte for port0, P1DTR the D channel for port 1, and so on. The four byte-addressable 8-bit registers, P0DTR–P3DTR, are packed to form one 32-bit register, PLTD. PLTD is aligned on a long-word boundary at MBAR+0x348 and can be read as a single 32-bit register. P0DTR is located in the MSB of the PLTD register, P3DTR is located in the LSB of the PLTD register. 31 24 23 16 Field P0DTR P1DTR Reset 1111_1111 1111_1111 R/W Read/Write 15 8 7 0 Field P2DTR P3DTR Reset 1111_1111 1111_1111 R/W Read/Write Addr MBAR+0x348 (P0DTR); 0x349 (P1DTR); 0x34A (P2DTR); 0x34B (P3DTR) Figure13-18. D Transmit Data Registers P0DTR–P3DTR 13.5.7 Port Configuration Registers (P0CR–P3CR) 15 14 12 11 10 9 8 7 6 5 4 3 2 1 0 P0CR ON/OFF M — G/S — ACT — — — — SHB2 SHB1 ENB2 ENB1 P1CR ON/OFF — M M/S G/S FSM ACT — — — — SHB2 SHB1 ENB2 ENB1 P2CR ON/OFF — — — — — — — — — — — SHB2 SHB1 ENB2 ENB1 P3CR ON/OFF — — — — — — — DMX — — — SHB2 SHB1 ENB2 ENB1 Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR+0x350 (P0CR); 0x352 (P1CR); 0x354 (P2CR); 0x356 (P3CR) Figure13-19. Port Configuration Registers (P0CR–P3CR) PnCR are registers containing configuration information for each of the four ports on the MCF5272. All bits in these registers are read/write and are cleared on hardware or software reset. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-18 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) Table13-2. P0CR–P3CR Field Descriptions Bits Name Description 15 ON/OFF 0 Port is off and in a steady state condition. In this state, the B and D channels on the transmit side are high impedance when in GCI/IDL. The receive registers are all set. In IDL and GCI modes with the port in this state, all periodic and aperiodic interrupts associated with the port are disabled. 1 Switches on the port for operation in the configured mode. 14–12 M Mode. Selects between various modes of operation as described below. Note: bit 14 is relevant to port0 only. The IDL modes on the PLIC only support short frame sync. Port 1-3 Port 0 000 IDL8IDL8 001 IDL10IDL10 010 GCIGCI 011 ReservedReserved 10x ReservedReserved 11x ReservedReserved 11 M/S Master/Slave. Defines the direction of the DCL1 and FSC1 pins. 0 DCL1 and FSC1 are inputs and are sourced from an external master. Note: This bit is relevant to port1 only, as port0 is always in slave mode. 1 enables DCL1 and FSC1 to be outputs, that is, the MCF5272 drives DCL1 and FSC1. 10 G/S GCI/SCIT. 0 The normal mode of GCI is used (i.e. no D-channel contention control). 1 Selects SCIT mode of operation for the GCI interfaces. 9 FSM Frame Sync Master. 0 Default reset value. 2-KHz interrupt is generated from port0. 1 Port1 FSC/FSR is used to generate the 2-KHz interrupt. 8 ACT GCI Activation. 0 Default reset value. 1 Causes Dout to transition to a logic low for the respective port. This bit is only operational when the port is in GCI mode. Setting the ACT bit in any other mode has no effect. It is the responsibility of the CPU to clear the ACT bit when normal operation on Dout is required. This bit is intended to be used to request activation from the upstream DCL/FSC driver. Periodic interrupts commence as soon as the upstream device generates DCL, provided the appropriate interrupts, such as IE, B1RIE, and so on, are enabled for the port. 7 DMX Data multiplex. 0 port3 Dout and Din are multiplexed onto Dout1 and Din1. 1 enables port3 Dout and Din to be connected to dedicated output and input pins, DOUT3 and DIN3. 3 SHB2 B2 channel shift direction. 0 B2 channel data is received/transmitted msb first. The msb-first convention is often used for communication with PCM CODECs and converters. 1 B2 channel data is received/transmitted lsb first. The lsb-first convention is used when the data is to be HDLC encoded. 2 SHB1 B1 channel shift direction. See SHB2. 1 ENB2 Enable B2 data channel. 0 The B2 channel is disabled and all periodic interrupts in both receive and transmit directions are disabled. The behavior of Din and Dout in this state is shown below. Mode Din Dout IDL All 1s High Impedance GCI Operational (data on Din visible) Open drain 1 Enables the B2 data channel for the respective port. 0 ENB1 Enable B1 data channel. See ENB2. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-19

Physical Layer Interface Controller (PLIC) 13.5.8 Loopback Control Register (PLCR) All bits in this register are cleared on hardware or software reset. The PLCR is an 8-bit register containing the configuration information for all four ports on the MCF5272. 7 6 5 4 3 2 1 0 Field LM3 LM2 LM1 LM0 Reset 0000_0000 R/W Read/Write Addr MBAR+0x38F Figure13-20. Loopback Control Register (PLCR) Table13-3. PLCR Field Description Bits Name Description 7-6 LM3 Loopback mode control, port 3. 00 Normal 01 Auto-echo 10 Local Loopback 11 Remote Loopback 5-4 LM2 Loopback mode control, port 2. See LM3. 3-2 LM1 Loopback mode control, port 1. See LM3. 1-0 LM0 Loopback mode control, port 0. See LM3. NOTE In loopback mode, the respective port must be enabled (using PnCR[ON/OFF]) along with the B1 and B2 channels (using PnCR[ENB1, ENB2]) and the D channel (using PDRQR[DCNTI] when in IDL mode, for instance). Also, if more than one of ports 1, 2, or 3 are programmed in loopback mode, it is necessary to program the appropriate frame sync function using the sync delay registers discussed in Section 13.5.21, “Sync Delay Registers (P0SDR–P3SDR).” 13.5.9 Interrupt Configuration Registers (P0ICR–P3ICR) All bits in these registers are read/write and are cleared on hardware or software reset. 15 14 12 11 10 9 8 7 6 5 4 3 2 1 0 PLCIR0–3 IE — GCR GCT GMR GMT — DTIE B2TIE B1TIE DRIE B2RIE B1RIE Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR+0x0358 (P0ICR); 0x035A (P1ICR); 0x035C (P2ICR); 0x035E (P3ICR) Figure13-21. Interrupt Configuration Registers (P0ICR–P3ICR) The PnICR registers contain interrupt configuration bits for each of the four ports on the MCF5272. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-20 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) Table13-4. P0ICR–P3ICR Field Descriptions Bits Name Description 15 IE Interrupt enable. Allows the port to generate interrupts to the CPU. When cleared, the IE bit masks all periodic and aperiodic interrupts associated with the respective port. 14–12 — Reserved, should be cleared. 11 GCR Interrupt enable for the C/I channel receive. 0 Interrupt masked 1 Interrupt enabled. When set, an interrupt is enabled which occurs when the corresponding GCR status bit is set. 10 GCT C/I channel transmit Interrupt enable. 0 Interrupt masked 1 Interrupt enabled. 9 GMR Interrupt enable for the monitor channel receive. 0 Interrupt masked 1 Interrupt enabled. 8 GMT Interrupt enable for the monitor channel transmit. 0 Interrupt masked 1 Interrupt enabled. 7–6 — Reserved, should be cleared. 5 DTIE D transmit interrupt enable. 0 Interrupt masked 1 Interrupt enabled.Interrupt occurs when the corresponding PnPSR[DTDE] or PnPSR[DTUE] is set. 4 B2TIE B2 transmit interrupt enable. 0 Interrupt masked 1 Interrupt enabled. Interrupt occurs when the corresponding PnPSR[B2TDE] or PnPSR[B2TUE] is set. 3 B1TIE B1 transmit interrupt enable. 0 Interrupt masked 1 Interrupt enabled. Interrupt occurs when the corresponding PnPSR[B1TDE] or PnPSR[B1TUE] is set. 2 DRIE D receive interrupt enable. 0 Interrupt masked 1 Interrupt enabled. Interrupt occurs when the corresponding PnPSR[DRDF] or PnPSR[DROE] is set. 1 B2RIE B2 receive interrupt enable. 0 Interrupt masked 1 Interrupt enabled. Interrupt occurs when the corresponding PnPSR[B2RDF] or PnPSR[B2ROE] is set. 0 B1RIE B1 receive interrupt enable. 0 Interrupt masked 1 Interrupt enabled.Interrupt occurs when the corresponding PnPSR[B1RDF] or PnPSR[B1ROE] is set. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-21

Physical Layer Interface Controller (PLIC) 13.5.10 Periodic Status Registers (P0PSR–P3PSR) All bits in these registers are read only and are set on hardware or software reset. 15 12 11 10 9 8 7 6 5 4 3 2 1 0 P0PSR–3 — DTUE B2TUE B1TUE DROE B2ROE B1ROE DTDE B2TDE B1TDE DRDF B2RDE B1RDF Reset 0000_0000_0000_0000 R/W Read Only Addr MBAR+0x384 (P0PSR); 0x386 (P1PSR); 0x388 (P2PSR); 0x38A (P3PSR) Figure13-22. Periodic Status Registers (P0PSR–P3PSR) PnPSR are 16-bit registers containing the interrupt status information for the B- and D-channel transmit and receive registers for each of the four ports on the MCF5272. Table13-5. P0PSR–P3PSR Field Descriptions Bits Name Description 15–12 — Reserved, should be cleared. 11 DTUE D data transmit underrun error. This bit is set when the data in the PLTD transmit data register for the respective port was transferred to the transmit shadow register, which was already empty indicated by DTDE. DTUE is automatically cleared, when the PnPSR register has been read by the CPU. 10 B2TUE B2 data transmit underrun error. This bit is set when the data in the PnB2TR transmit data register for the respective port was transferred to the transmit shadow register, which was already empty indicated by B2TDE. B2TUE is automatically cleared when the PnPSR register has been read by the CPU. 9 B1TUE B1 data transmit underrun error. This bit is set when the data in the PnB1TR transmit data register for the respective port was transferred to the transmit shadow register, which was already empty indicated by B1TDE. B1TUE is automatically cleared when the PnPSR register has been read by the CPU. 8 DROE D-Channel data receive overrun error. This bit is set when the data in the D receive shadow register for the respective port has been transferred to the receive data register PnDRR, which was already full indicated by DRDF. DROE is automatically cleared when the PnPSR register has been read by the CPU. 7 B2ROE B2 data receive overrun error. This bit is set when the data in the B2 receive shadow register for the respective port has been transferred to the receive data register PnB2RR, which was already full indicated by B2RDF. B2ROE is automatically cleared when the PnPSR register has been read by the CPU. 6 B1ROE B1 data receive overrun error. This bit is set when the data in the B1 receive shadow register for the respective port has been transferred to the receive data register PnB1RR, which was already full indicated by B1RDF. B1ROE is automatically cleared when the PnPSR register has been read by the CPU. Note: Overrun and Underrun conditions are caused by the B and/or D-channel receive or transmit data registers not being read or written prior to a 2-KHz super frame arriving. 5 DTDE D data transmit data empty. This bit is set when the data in the PLTD transmit data register for the respective port has been transferred to the transmit shadow register. This bit is cleared when the CPU writes data to PLTD. 4 B2TDE B2 data transmit data empty. This bit is set when the data in the PnB2TR transmit data register for the respective port has been transferred to the transmit shadow register. This bit is cleared when the CPU writes data to PnB2TR. 3 B1TDE B1 data transmit data empty. This bit is set when the data in the PnB1TR transmit data register for the respective port has been transferred to the transmit shadow register. This bit is cleared when the CPU writes data to PnB1TR. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-22 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) Table13-5. P0PSR–P3PSR Field Descriptions Bits Name Description 2 DRDF D receive data full. This bit indicates that the D receive data register for the respective port is full. DRDF is cleared when the CPU reads the receive data register PnDRR. 1 B2RDF B2 receive data full. This bit indicates that the B2 receive data register for the respective port is full. B2RDF is cleared when the CPU reads the receive data register PnB2RR. 0 B1RDF B1 receive data full. This bit indicates that the B1 receive data register for the respective port is full. B1RDF is cleared when the CPU reads the receive data register PnB2RR. 13.5.11 Aperiodic Status Register (PASR) All bits in this register are read only and are set on hardware or software reset. 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Field GCR GCT GMR GMT GCR GCT GMR GMT GCR GCT GMR GMT GCR GCT GMR GMT 3 3 3 3 2 2 2 2 1 1 1 1 0 0 0 0 Reset 0000_0000_0000_0000 R/W Read Only Addr MBAR+0x38C Figure13-23. Aperiodic Status Register (PASR) The PASR register is a 16-bit register containing the aperiodic interrupt status information for the C/I and monitor channel transmit and receive registers for all four ports on the MCF5272. An aperiodic interrupt condition remains asserted as long as any one of the bits within the PASR register is set. Table13-6. PASR Field Descriptions Bits Name Description 15, 11, 7, 3 GCRn GCI C/I received. When set, this bit indicates that valid new data has been written to a GCI C/I receive register. An interrupt is queued when this bit is set if the GCR interrupt enable bit has been set in the corresponding PnICR register. The GCR bit and associated interrupt are automatically cleared when the corresponding PnGCIR register has been read by the CPU. 14, 10, 6, 2 GCTn GCI C/I transmitted. When set, this bit indicates that a C/I register is empty. An interrupt is queued when this bit is set if the GCT interrupt enable bit has been set in the corresponding PnICR register. The GCT bit and associated interrupt are automatically cleared when the PGCITSR register has been read by the CPU. 13, 9, 5, 1 GMRn GCI monitor received. When set, this bit indicates that data has been written to a monitor channel receive register. An interrupt is queued when this bit is set if the GMR interrupt enable bit has been set in the corresponding PnICR register. The GMR bit and associated interrupt are automatically cleared when the corresponding PnGMR register has been read by the CPU. 12, 8, 4, 0 GMTn GCI monitor transmitted. When set, this bit indicates that the monitor channel transmit register is empty. An interrupt is queued when this bit is set if the GMT interrupt enable bit has been set in the corresponding PnICR register. The GMT bit and associated interrupt are automatically cleared when the PGMTS register has been read by the CPU. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-23

Physical Layer Interface Controller (PLIC) 13.5.12 GCI Monitor Channel Receive Registers (P0GMR–P3GMR) All bits in these registers are read only and are initialized to 0x00FF on hardware or software reset. PnGMR are 16-bit registers containing the received monitor channel bits for each of the four receive ports on the MCF5272. A byte of monitor channel data received on a certain port is put into an associated register using the format shown in Figure 13-24. A maskable interrupt is generated when a byte is written into any of these four registers. 15 11 10 9 8 7 0 Field — EOM AB MC M Reset 0000_0000_1111_1111 R/W Read Only Addr MBAR+0x360 (P0GMR); 0x362 (P1GMR); 0x364 (P2GMR); 0x366 (P3GMR) Figure13-24. GCI Monitor Channel Receive Registers (P0GMR–P3GMR) Table13-7. P0GMR–P3GMR Field Descriptions Bits Name Description 15–11 — Reserved, should be cleared. 10 EOM End of message. 0 Default at reset. 1 Indicates to the CPU that an end-of-message condition has been recognized on the E bit. EOM is automatically cleared when the PnGMR register has been read by the CPU. 9 AB Abort. 0 Default at reset. 1 Indicates that the GCI controller has recognized an abort condition and is acknowledging the abort. It is automatically cleared by the CPU when the PnGMR register has been read. 8 MC Monitor change. 0 Default at reset. 1 Indicates to the CPU that the monitor channel data byte written to the respective PnGMR register has changed and that the data is available for processing. Automatically cleared by the CPU when the PnGMR register has been read. Clearing this bit by reading this register also clears the aperiodic GMR interrupt. 7–0 M Monitor channel data byte. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-24 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.5.13 GCI Monitor Channel Transmit Registers (P0GMT–P3GMT) All bits in these registers are read/write and are cleared on hardware or software reset. The PnGMT registers are 16 bit register containing the control and monitor channel bits to be transmitted for each of the four ports on the MCF5272. A byte of monitor channel data to be transmitted on a certain port is put into an associated register using the format shown in Figure13-25. A maskable interrupt is generated when this byte of data has been successfully transmitted. 15 10 9 8 7 0 Field — L R M Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR+0x368 (P0GMT); 0x36A (P1GMT); 0x36C (P2GMT); 0x36E (P3GMT) Figure13-25. GCI Monitor Channel Transmit Registers (P0GMT–P3GMT) Table13-8. P0GMT–P3GMT Field Descriptions Bits Name Description 15–10 — Reserved, should be cleared. 9 L Last. 0 Default reset value 1 Set by the CPU. Indicates to the monitor channel controller to transmit the end of message signal on the E bit. Both PnGMT[L] and PnGMT[R] must be set for the monitor channel controller to send the end of message signal. PnGMT[M7:0] are ignored and 0xFF is sent with the end of message condition necessitating sending the monitor channel information using PnGMT[R] to control the monitor channel transmitter, followed at the end of the frame by setting PnGMT[L] and PnGMT[R]. The L bit is automatically cleared by the GCI controller. 8 R Ready. 0 Default reset value. 1 Set by the CPU. Indicate to the monitor channel controller that a byte of data is ready for transmission. Automatically cleared by the GCI controller when it generates a transmit acknowledge (ACK bit in PGMTS register) or when the L bit is reset. 7–0 M Monitor channel data byte. Written by the CPU when a byte is ready for transmission. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-25

Physical Layer Interface Controller (PLIC) 13.5.14 GCI Monitor Channel Transmit Abort Register (PGMTA) All bits in this register are read/write and are cleared on hardware or software reset. The PGMTA register contains the abort control bits for each of the four ports on the MCF5272 for the transmit monitor channel. 7 6 5 4 3 0 Field AR3 AR2 AR1 AR0 — Reset 0000_0000 R/W Read/Write Addr MBAR+0x372 Figure13-26. GCI Monitor Channel Transmit Abort Register (PGMTA) Table13-9. PGMTA Field Descriptions Bits Name Description 7 AR3 Abort request, port 3. 0 Default reset value. 1 Set by the CPU, this bit causes the monitor channel controller to transmit the end of message signal on the E bit. Automatically cleared by the monitor channel controller on receiving an abort, that is, when PGMTS[AB] is set. 6 AR2 Abort request, port 2. See AR3. 5 AR1 Abort request, port 1. See AR3. 4 AR0 Abort request, port 0. See AR3. 3–0 — Reserved, should be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-26 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.5.15 GCI Monitor Channel Transmit Status Register (PGMTS) All bits in this register are read only and are cleared on hardware or software reset. The PGMTS register contains the monitor channel status bits for each of the four transmit ports on the MCF5272. 7 6 5 4 3 2 1 0 Field ACK3 ACK2 ACK1 ACK0 AB3 AB2 AB1 AB0 Reset 0000_0000 R/W Read Only Addr MBAR+0x371 Figure13-27. GCI Monitor Channel Transmit Status Register (PGMTS) Table13-10. PGMTS Field Descriptions Bits Name Description 7 ACK3 Acknowledge, port 3. 0 Default reset value. 1 Indicates to the CPU that the GCI controller has transmitted the previous monitor channel information. Automatically cleared by the CPU reading the register. The clearing of this bit by reading this register also clears the aperiodic GMT interrupt. 6 ACK2 Acknowledge, port 2. See ACK3. 5 ACK1 Acknowledge, port 1. See ACK3. 4 ACK0 Acknowledge, port 0. See ACK3. 3 AB3 Abort, port 3. 0 Default reset value. 1 Indicates to the CPU that the GCI controller has aborted the current message. This bit is automatically cleared by the CPU reading the register. When the GCI controller sets this bit, it also clears the AR bit in the PGMTA register, the ACK bit in the GMTS register, and the L and R bits in the PnGMT register. 2 AB2 Abort, port 2. See AB3. 1 AB1 Abort, port 1. See AB3. 0 AB0 Abort, port 0. See AB3. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-27

Physical Layer Interface Controller (PLIC) 13.5.16 GCI C/I Channel Receive Registers (P0GCIR–P3GCIR) All bits in these registers are read only and are cleared on hardware or software reset. The PnGCIR registers contain the received C/I bits for one of each of the four ports on the MCF5272. 31 29 28 27 26 25 24 23 21 20 19 18 17 16 Field — F C3 C2 C1 C0 — F C3 C2 C1 C0 Chan P0GCIR P1GCIR Reset 0000_0000_0000_0000 R/W Read Only 15 13 12 11 10 9 8 7 5 4 3 2 1 0 Field — F C3 C2 C1 C0 — F C3 C2 C1 C0 Chan P2GCIR P3GCIR Reset 0000_0000_0000_0000 R/W Read Only Addr MBAR+0x374 (P0GCIR), 0x375 (P1GCIR), 0x376 (P2GCIR), 0x377 (P3GCIR) Figure13-28. GCI C/I Channel Receive Registers (P0GCIR–P3GCIR) Table13-11. P0GCIR–P3GCIR Field Descriptions Bits Name Description 31–29, 23–21, — Reserved, should be cleared. 15–13, 7–5 28, 20, 12, 4 F Full. This bit is set by the C/I channel controller to indicate to the CPU that new C/I channel data has been received and is available for processing. It is automatically cleared by a CPU read. The clearing of this bit by reading this register also clears the aperiodic GCR interrupt. 27–24, 19–16, C3–C0 C/I bits. These four bits are received on the GCI or SCIT channel 0. When a change in the C/I data 11–8, 3–0 value is received in two successive frames, it is interpreted as being valid and is passed on to the CPU, via this register. A maskable interrupt is generated when data is written into any of the four available positions. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-28 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.5.17 GCI C/I Channel Transmit Registers (P0GCIT–P3GCIT) All bits in these registers are read/write and are cleared on hardware or software reset. The PnGCIT registers are 8-bit registers containing the monitor channel bits to be transmitted for each of the four ports on the MCF5272. 31 29 28 27 26 25 24 23 21 20 19 18 17 16 Field — R C3 C2 C1 C0 — R C3 C2 C1 C0 Chan P0GCIT P1GCIT Reset 0000_0000_0000_0000 R/W Read/Write 15 13 12 11 10 9 8 7 5 4 3 2 1 0 Field — R C3 C2 C1 C0 — R C3 C2 C1 C0 Chan P2GCIT P3GCIT Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR+0x378 (P0GCIT), 0x379 (P1GCIT), 0x37A (P3GCIT), 0x37B (P4GCIT) Figure13-29. GCI C/I Channel Transmit Registers (P0GCIT–P3GCIT) Table13-12. P0GCIT–P3GCIT Field Descriptions Bits Name Description 31–29, 23–21, — Reserved, should be cleared. 15–13, 7–5 28, 20, 12, 4 R Ready. This bit is set, by the CPU to indicate to the C/I channel controller that data is ready for transmission. The transition of this bit from a0 to a1 starts the C/I state machine which responds with the ACK bit once transmission of two successive C/I words is complete. This bit is automatically cleared by the GCI controller when it generates a transmit acknowledge (ACK bit in PGCITSR register). The clearing of this bit by reading this register also clears the aperiodic GCT interrupt. 27–24, 19–16, C3–C0 C/I bits. The CPU writes C/I data to be transmitted, on the GCI or SCIT channel 0, into these 11–8, 3–0 positions. The CPU must ensure that this data is not overwritten before it has been transmitted the required minimum amount of times, that is, so any change is detected and confirmed by a receiver. A maskable interrupt is generated when this data has been successfully transmitted MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-29

Physical Layer Interface Controller (PLIC) 13.5.18 GCI C/I Channel Transmit Status Register (PGCITSR) All bits in this register are read only and are cleared on hardware or software reset. The PGCITSR register is an 8-bit register containing the C/I channel status bits for each of the four transmit ports on the MCF5272. 7 4 3 2 1 0 Field — ACK3 ACK2 ACK1 ACK0 Reset 0000_0000 R/W Read Only Addr MBAR+0x37F Figure13-30. GCI C/I Channel Transmit Status Register (PGCITSR) Table13-13. PGCITSR Field Descriptions Bits Name Description 7–4 — Reserved, should be cleared. 3 ACK3 Acknowledge, port 3. 0 Default reset value. 1 Set by the C/I channel controller to indicate that the previous C/I data has been transmitted in two successive C/I words. The ACK bit is automatically cleared by the CPU when the PGCITSR register has been read. 2 ACK2 Acknowledge, port 2. See ACK3. 1 ACK1 Acknowledge, port 1. See ACK3. 0 ACK0 Acknowledge, port 0. See ACK3. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-30 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.5.19 D-Channel Status Register (PDCSR) All bits in this register are read only and are cleared on hardware or software reset. The register is also cleared after a read operation. The PDCSR register contains the D-channel status bits for all four ports on the MCF5272. 7 6 5 4 3 2 1 0 Field — DG1 DG0 DC3 DC2 DC1 DC0 Reset 0000_0000 R/W Read Only Addr MBAR+0x383 Figure13-31. D-Channel Status Register (PDCSR) Table13-14. PDCSR Field Descriptions Bits Name Description 7–6 — Reserved, should be cleared. 5 DG1 D-channel grant, port 1. 0 Default reset value. 1 In IDL mode, indicates the status of DGRANT. When the external DGNT has a logic 1, the corresponding DG1/DG0 bit is set. In GCI mode, DG1 and DG0 reflects the inverted value of the SCIT bit. The significance of this bit is the same in IDL or GCI mode, that is, in IDL mode when the DG bit is set, the D channel is granted. In GCI mode when the DG bit is set, this corresponds to the GO condition. In both cases the D channel is granted and communication may commence. 4 DG0 D-channel grant, port 0. See DG1. 3 DC3 D-channel change, port 3. 0 Default reset value. 1 Indicates that a value other than 0xFF (all ones) exists the D-channel receive register. 2 DC2 D-channel change, port 2. See DC3. 1 DC1 D-channel change, port 1. See DC3. 0 DC0 D-channel change, port 0. See DC3. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-31

Physical Layer Interface Controller (PLIC) 13.5.20 D-Channel Request Register (PDRQR) All bits in this read/write register are cleared on hardware or software reset. The PDRQR register contains D-channel control bits for all four ports on the MCF5272. 15 12 11 10 9 8 7 2 1 0 Field — SHDD(1) DCNTI(1) SHDD(0) DCNTI(0) — DRQ Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR+0x392 Figure13-32. D-Channel Request Registers (PDRQR) Table13-15. PDRQR Field Descriptions Bits Name Description 15–12 — Reserved, should be cleared. 11, 9 SHDD D-channel shift direction. 0 D-channel data is msb first. The first bit received is assumed to be the most significant bit and is loaded into the msb position of the D-channel receive register for the respective port. SHDD(1) configures the shift direction for ports 1, 2 and 3, SHDD(0) configures the shift direction for port0. 1 D-channel data is lsb first for the D channel. The first bit received is assumed to be the least significant bit and is loaded into the lsb position of the D-channel receive register for the respective port. 10, 8 DCNTI D-channel control ignore. Allows the D-Channel contention function to be ignored. 00 contention active on both ports 01 ignore contention on port0 10 ignore contention on port1 11 ignore contention on both ports 7–2 — Reserved, should be cleared. 1–0 DRQ The value written to these bits is driven onto the DREQ pins associated with port0 and port1. When set, a logic high, 1, is driven on to the corresponding pin. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-32 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.5.21 Sync Delay Registers (P0SDR–P3SDR) All bits in these registers are read/write and are cleared on hardware or software reset. The PnSDR registers contain the frame sync delay bits for each of the four ports on the MCF5272. 15 14 13 10 9 0 Field FSW1 FSW0 — SD Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR+0x394 (P0SDR); 0x396 (P1SDR); 0x398 (P2SDR); 0x39A (P3SDR) Figure13-33. Sync Delay Registers (P0SDR–P3SDR) Table13-16. P0SDR–P3SDR Field Descriptions Bits Name Description 15–14 FSW[1–0] Frame sync width. Sets the width, in clock cycles, of the output frame sync pulse. 00 Frame sync width = 1 01 Frame sync width = 2 10 Frame sync width = 8 11 Frame sync width = 16 13–10 — Reserved, should be cleared. 9–0 SD Sync delay. Range: 0–1023. Sets the delay, in DCL clock cycles, for DFSC3–DFSC0. The delay period should be doubled in GCI mode because GCI has two clock cycles per data bit. See Section13.3, “PLIC Timing Generator,” for further information. NOTE If a sync delay value of 0 is specified, that is, PnSDR[SD]= 0x000, then the programmable delay block is transparent. When bypassed, the input frame sync passes directly to the output, making the frame-sync-width function defined by PnSDR[FSW] unavailable. The 8-bit frame-sync-width should not be confused with long frame sync mode. The PLIC only supports short frame sync in IDL8 and IDL10 bit modes for interfacing to external transceivers. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-33

Physical Layer Interface Controller (PLIC) 13.5.22 Clock Select Register (PCSR) All bits in this register are read/write and are cleared on hardware or software reset. PCSR controls the PLIC clock generation block. Please refer to Section13.3, “PLIC Timing Generator,” for certain restrictions on the use of the clock generation block. 15 14 8 7 6 5 3 2 0 Field NBP — CKI FDIV CMULT Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR+0x39E Figure13-34. Clock Select Register (PCSR) Table13-17. PCSR Field Descriptions Bits Name Description 15 NBP Non-bypass mode select for the clock generation module. 0 The clock generation module is bypassed. Gen_FSC and GDCL are connected to FSC0 and DCL0. 1 Selects non-bypassed mode. Gen_FSC and GDCL are synthesized from the incoming FSC0 or DCL0. 14–8 — Reserved, should be cleared. 7–6 CKI Clock select Input. Selects the source clock for the clock generation block. 00 DCL0 01 FSC0 1x Reserved 5–3 FDIV FSC divide. Sets the divide ratio between GDCL and Gen_FSC. 000 ÷4 001 ÷8 010 ÷16 011 ÷32 100 ÷64 101 ÷128 110 ÷192 111 ÷256 2–0 CMULT Clock multiplication ratio. Sets the ratio of the reference clock frequency to the GDCL frequency. 000 x 2 001 x 4 010 x 8 011 x 16 100 x 32 101 x 64 110 x 128 111 x 256 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-34 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.6 Application Examples This section provides examples for applications. 13.6.1 Introduction The following section describes the initialization of the PLIC ports and gives three application examples demonstrating the connection of multiple transceivers or CODECs to the PLIC module. 13.6.2 PLIC Initialization The ports on the PLIC module of the MCF5272 require a number of registers to be configured after power-on reset and prior to use. The following are the steps necessary for initializing the ports. The port configuration registers, PnCR, and the interrupt configuration register, PnICR, must be initialized before using any port. 13.6.2.1 Port Configuration Example • Specify which ports are active. • Specify the operational modes, IDL8, IDL10, and so on, for the active ports, PnCR[M]. • If GCI mode is specified in PnCR[M], select whether GCI SCIT mode is to be used, PnCR[G/S] • If port 1 is used, program whether the 2-KHz frame interrupt is to be derived from port 0 or port1, PnCR[FSM]. • If port 1 is used, program whether it receives as inputs DCL and FSC or whether it drives these signals as outputs. • If the port is in GCI mode, the PnCR[ACT] bit may be set if GCI Activation should be requested. • If port 3 is used, program the PnCR[DMX] bit if this port is routed through physical interface 3 (DIN3/DOUT3). • Program the shift direction for the B1 and B2 channels, PnCR[SHB1–SHB2], to specify msb or lsb first. • Program PnCR[ENB1–ENB2] to specify whether B1 or B2 is enabled at initialization. The following example shows a basic configuration of port 1, assuming the following: • Port 1 is active as slave using IDL10 mode • 2-KHz frame interrupt derived from port1 • msb first on B1 and B2 • B1 and B2 disabled. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-35

Physical Layer Interface Controller (PLIC) FSM (port 1 Only) GCI ACT (GCI ONLY) SCIT MODE (GCI ONLY) Reserved SLAVE MODE B2 msb First IDL10 MODE B1 msb First Reserved B2 Disabled Port on B1 Disabled 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 P1CR 1 0 0 1 0 0 1 0 0 0 0 0 0 0 0 0 0x 9 2 0 0 Figure13-35. Port 1 Configuration Register (P1CR) The programming of the P1CR register in the above example is achieved with the following ColdFire code sequence assuming the equates and init sections include the following: equates and init: ... Module_Regs_Addr EQU 0x00300000 ;address of on-chip registers P1CR EQU 0x352 ;offset of P1CR register P1ICR EQU 0x35A ... move.l #Module_Regs_Addr, A5 ;reference register from A5 ... move.w #0x9200,d0 ;port 1 config ON, IDL10, SLAVE, port1 FSM ;msb first on B1 and B2, B1 and B2 disabled move.w d0,P1CR(A5) ;write to P1CR register The above code segment is an example only. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-36 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) 13.6.2.2 Interrupt Configuration Example The PnICR registers should be configured according to the specific interrupts, periodic and aperiodic, required for each port. In addition, the port interrupt enable, (PnICR[IE]) should be set for each active port prior to receiving interrupts. Assuming port 1 is configured as in the above example then the following configuration would enable periodic interrupts on port 1 with only the D channel active. Reserved DTIE enabled B2TIE disabled B1TIE disabled GCI only DRIE enabled Port0 only B2RIE disabled IE enabled B1RIE disabled 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 P1ICR 1 0 0 0 0 0 0 0 0 0 1 0 0 1 0 0 0x 8 0 2 4 Figure13-36. Port 1 Interrupt Configuration Register (P1ICR) The programming of the P1ICR in the above example is achieved with the following ColdFire code sequence assuming the equates and init sections as in the previous P1CR example: ... move.w #0x8024,d0 ; port 1 IE and D-channel interrupts enabled move.w d0,P1ICR(A5) ; write value to PnICR ... MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-37

Physical Layer Interface Controller (PLIC) 13.6.3 Example 1: ISDN SOHO PBX with Ports 0, 1, 2, and 3 In this example, all four ports are used to connect an external transceiver and six CODECs. Port0 and port 1 are programmed in slave mode. An external transceiver, MC145574, is connected to port0. Port 1, 2, and 3 are used to connect up to six external PCM CODECs. MCF5272 MC145574 DGNT0 DGrant DREQ0 DRequest Interface 0 Din0 Tx Dout0 Rx FSC0 IDL SYNC DCL0 IDL CLK MC14LC5480 CODEC 1 Vdd Din1 DT Dout1 DR BCLKR FSC1 FST FSR Interface 1 DCL1 BCLKT GND DFSC2 MC14LC5480 DFSC3 DT CODEC 2 Vdd DR BCLKR FST FSR BCLKT MC14LC5480 Vdd CODEC 3 DT DR BCLKR FST FSR BCLKT GND MC14LC5480 Vdd CODEC 4 DT DR BCLKR FST FSR BCLKT MC14LC5480 DT CODEC5 Vdd DR BCLKR FST FSR BCLKT GND MC14LC5480 CODEC6 Vdd DT DR BCLKR FST FSR BCLKT Figure13-37. ISDN SOHO PABX Example In the previous example, Freescale’s MC14LC5480 CODECs and MC145574 S/T transceiver are shown. The S/T transceiver in this example is connected to port0 and the FSC0 frame sync signal is used exclusively for synchronizing the data on the transceiver’s IDL interface. CODECs 1 and 2 are connected to frame sync 1, FSC1. CODECs 3 and 4 are connected to DFSC2 which is the output of programmable MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-38 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) delay 2. Programmable delay 2 generates a delayed frame sync with reference to FSC1. Similarly CODECs 5 and 6 are connected to DFSC3 which is the output of programmable delay 3. Programmable delay 3 generates a delayed frame sync also with reference to FSC1. The MC14LC5480 CODECs, when in IDL mode, may be programmed using the FSR pin, to select whether the CODEC is receiving and transmitting on the B1 or the B2 time slot. See the MC14LC5480 data sheet for further information. Figure 13-38 shows the IDL bus timing relationship of the CODECs and MC145574 transceiver when in standard IDL2 10-bit mode with a common frame sync. DCL FSC0 FSC1 DFSC2 DFSC3 Din0/ Dout0 B1 D B2 D MC145574 Din1/ Dout1 B1 B2 B3 B4 B5 B6 CODEC 1 CODEC 2 CODEC 3 CODEC 4 CODEC5 CODEC6 Figure13-38. Standard IDL2 10-Bit Mode The S/T transceiver is connected to port 0, Din0/Dout0. The DCL and FSC generated from the S/T transceiver are connected to DCL0, FSC0, and also feed port1, DCL1, and FSC1 because port 1 is synchronized to these S/T generated timing signals. The six CODECs are connected to Din1 and Dout1. To provide six discrete 64-Kbps channels on the port1 IDL interface, the delayed frame syncs are programmed to synchronize the CODECs on non-overlapping time slots. CODEC 1 transmits and receives in the B1 time slot. CODEC 2 transmits and receives in the B2 time slot, which starts 10 DCL cycles later, and so on for the other CODECs. CODECs 3 and 4 are synchronized to DFSC2 which is generated 20 DCL cycles after FSC1 by loading the programmable delay 2 register with 0x0014. The DFSC3 signal synchronizes CODECs 5 and 6. DFSC3 is generated 40 DCL cycles after FSC1 by loading the programmable delay 3 register with 0x0028. Only the port 0 D-channel is used in this example; DREQ0 and DGNT0 are connected to the S/T transceiver. The GCI mode of operation is analogous. In GCI mode, port0 can be configured to support the SCIT channel. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-39

Physical Layer Interface Controller (PLIC) 13.6.4 Example 2: ISDN SOHO PBX with Ports 1, 2, and 3 In this example, port 0 is not used. The port 0 pins are multiplexed with UART0 and in this example, port 0 is used to connect to an external transceiver to provide an RS232 interface. Port1 is programmed in slave mode and an external U (or S/T) transceiver is connected to port 1. Port 2 and port 3 are used to connect up to four external PCM CODECs. MCF5272 RS232 UART0 Transceiver Din1 MC145572 Dout1 Interface1 FSC1 Tx Rx DCL1 IDL SYNC IDL CLK DFSC2 DFSC3 MC14LC5480 CODEC 1 Vdd DT DR BCLKR FST FSR BCLKT GND MC14LC5480 CODEC 2 Vdd DT DR BCLKR FST FSR BCLKT MC14LC5480 CODEC 3 Vdd DT DR BCLKR FST FSR BCLKT GND MC14LC5480 CODEC 4 Vdd DT DR BCLKR FST FSR BCLKT Figure13-39. ISDN SOHO PABX Example In the above example, Freescale’s MC14LC5480 CODECs and MC145572 U transceiver are shown. The U transceiver in this example is connected to port 1 and the FSC1 frame sync signal is used exclusively for synchronizing the data on the U transceiver’s IDL interface. CODECs 1 and 2 are connected to delayed frame sync 2, DFSC2, which is the output of programmable delay 2. Programmable delay 2 generates a delayed frame sync with reference to FSC1. Similarly CODECs 3 and 4 are connected to DFSC3 which is the output of programmable delay 3. Programmable delay 3 generates a delayed frame sync also with reference to FSC1. The MC14LC5480 CODECs, when in IDL mode, may be programmed using the FSR pin to select whether the CODEC is receiving and transmitting on the B1 or the B2 time slot (see MC14LC5480 data sheet for further information). Figure 13-40 shows the IDL bus timing relationship of the CODECs and U transceiver when in standard IDL2 10-bit mode with a common frame sync. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-40 Freescale Semiconductor

Physical Layer Interface Controller (PLIC) DCL FSC1 DFSC2 DFSC3 Din1/ Dout1 B1 D B2 D B3 B4 B5 B6 U Transceiver CODEC 1 CODEC 2 CODEC 3 CODEC 4 Figure13-40. Standard IDL2 10-Bit Mode In the above example, CODEC 1 transmits and receives in the B3 time slot once the Utransceiver has completed the D channel. From the rising edge of FSC1, this is at least 19DCL clocks later. In Figure 13-40, a short, optional delay, is shown between the end of the D channel and the start of the B3 channel. For example, let us say this is 1DCL clocks long. This defines the programmable delay 1 value to be 20, (19+ 1), or 0x0014. The DFSC3 signal synchronizes CODECs 3 and 4, and the rising edge of this frame sync occurs 20clocks after DFSC2, therefore 40DCL clocks after FSC1. This defines the value for programmable delay 3to be 40, (19+ 1+20), or0x0028. 13.6.5 Example 3: Two-Line Remote Access with Ports 0 and 1 In this example, ports 0 and1 are connected to two S/T transceivers. Ports 0 and1 are programmed in slave mode. Ports 2 and3 are not used, and may be disabled. MCF5272 MC145574 #1 DGNT0 DGrant DREQ0 DRequest Interface 0 Din0 Tx Dout0 Rx FSC0 IDL SYNC DCL0 IDL CLK MC145574 #2 DGNT1 DGrant DREQ1 DRequest Interface 1 Din1 Tx Dout1 Rx FSC1 IDL SYNC DCL1 IDL CLK Figure13-41. Two-Line Remote Access MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 13-41

Physical Layer Interface Controller (PLIC) Two of Freescale’s MC145574 S/T transceivers are shown connected to ports 0 and 1. The frame sync control signal FSC0 is connected to S/T transceiver one, while FSC1 is connected to transceiver two. Figure 13-42 shows an example of the IDL bus timing relationship of the S/T transceivers when in standard IDL2 8-bit mode with a common frame sync. DCL FSC0 FSC1 MC145574 #1 Din0/ Dout0 B1 B2 D Din1/ Dout1 B1 B2 D MC145574 #2 Figure13-42. Standard IDL2 8-Bit Mode MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 13-42 Freescale Semiconductor

Chapter 14 Queued Serial Peripheral Interface (QSPI) Module This chapter describes the queued serial peripheral interface (QSPI) module. Following a feature-set overview is a description of operation including details of the QSPI’s internal RAM organization. The chapter concludes with the programming model and a timing diagram. 14.1 Overview The queued serial peripheral interface module provides a serial peripheral interface with queued transfer capability. It allows users to enqueue up to 16 transfers at once, eliminating CPU intervention between transfers. Transfer RAMs in the QSPI are indirectly accessible using address and data registers. Functionality is very similar, but not identical, to the QSPI portion of the QSM (queued serial module) implemented in the MC68332. 14.2 Features • Programmable queue to support up to 16 transfers without user intervention • Supports transfer sizes of 8 to 16 bits in 1-bit increments • Four peripheral chip-select lines for control of up to 15 devices • Baud rates from 129.4Kbps to 16.5Mbps at 66MHz • Programmable delays before and after transfers • Programmable clock phase and polarity • Supports wraparound mode for continuous transfers 14.3 Module Description The QSPI module communicates with the integrated ColdFire CPU using internal memory mapped registers located starting at MBAR + 0xA0. See also Section14.5, “Programming Model.” A block diagram of the QSPI module is shown in Figure 14-1. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 14-1

Queued Serial Peripheral Interface (QSPI) Module Queue Control Block 4 Queue Pointer 80-Byte Done QSPI Comparator RAM QSPI QSPI Address Data End Queue Register Register Pointer 4 4 Control Logic Chip MSBit LSBit Select Status 8/16 Bit Shift Reg. QSPI_Din Regs Rx/Tx Data Reg. Logic Control Array 4 Regs QSPI_Dout Command 4 Delay QSPI_CS[3:0] Counter Internal Bus Baud Rate CLKIN Divide by 2 QSPI_CLK Generator Figure14-1. QSPI Block Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 14-2 Freescale Semiconductor

Queued Serial Peripheral Interface (QSPI) Module 14.3.1 Interface and Pins The module provides as many as 15 ports and a total of seven signals: QSPI_Dout, QSPI_Din, QSPI_CLK, QSPI_CS0, QSPI_CS1, QSPI_CS2, and QSPI_CS3. Peripheral chip-select signals, QSPI_CS[0:3], are used to select an external device as the source or destination for serial data transfer. Signals are asserted at a logic level corresponding to the value of the QSPI_CS[3:0] bits in the command RAM whenever a command in the queue is executed. More than one chip-select signal can be asserted simultaneously. Although QSPI_CS[0:3] will function as simple chip selects in most applications, up to 15 ports can be selected by decoding them with an external 4-to-16 decoder. Note that chip selects QSPI_CS[3:1] are multiplexed with other pin functions. QSPI_Dout, QSPI_CLK, and QSPI_CS0 are multiplexed with MCF5272 configuration inputs that only function during system reset. Table14-1. QSPI Input and Output Signals and Functions Signal Name Hi-Z or Actively Driven Function QSPI Data Output (QSPI_Dout) Configurable Serial data output from QSPI QSPI Data Input (QSPI_Din) N/A Serial data input to QSPI Serial Clock (QSPI_CLK) Actively driven Clock output from QSPI Peripheral Chip Selects (QSPI_CS[3:0]) Actively driven Peripheral selects 14.3.2 Internal Bus Interface Because the QSPI module only operates in master mode, the master bit in the QSPI mode register (QMR[MSTR]) must be set for the QSPI to function properly. The QSPI can initiate serial transfers but cannot respond to transfers initiated by other QSPI masters. 14.4 Operation The QSPI uses a dedicated 80-byte block of static RAM accessible both to the module and the CPU to perform queued operations. The RAM is divided into three segments as follows: • 16 command control bytes (command RAM) • 16 transmit data words, (transfer RAM) • 16 receive data words (transfer RAM) RAM is organized so that 1 byte of command control data, 1 word of transmit data, and 1 word of receive data comprise 1 queue entry, 0x0–0xF. The user initiates QSPI operation by loading a queue of commands in command RAM, writing transmit data into transmit RAM, and then enabling the QSPI data transfer. The QSPI executes the queued commands and sets the completion flag in the QSPI interrupt register (QIR[SPIF]) to signal their completion. Optionally, QIR[SPIFE] can be enabled to generate an interrupt. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 14-3

Queued Serial Peripheral Interface (QSPI) Module The QSPI uses four queue pointers. The user can access three of them through fields in QSPI wrap register (QWR): • The new queue pointer, QWR[NEWQP], points to the first command in the queue. • An internal queue pointer points to the command currently being executed. • The completed queue pointer, QWR[CPTQP], points to the last command executed. • The end queue pointer, QWR[ENDQP], points to the final command in the queue. The internal pointer is initialized to the same value as QWR[NEWQP]. During normal operation, the following sequence repeats: 1. The command pointed to by the internal pointer is executed. 2. The value in the internal pointer is copied into QWR[CPTQP]. 3. The internal pointer is incremented. Execution continues at the internal pointer address unless the QWR[NEWQP] value is changed. After each command is executed, QWR[ENDQP] and QWR[CPTQP] are compared. When a match occurs, QIR[SPIF] is set and the QSPI stops unless wraparound mode is enabled. Setting QWR[WREN] enables wraparound mode. QWR[NEWQP] is cleared at reset. When the QSPI is enabled, execution begins at address 0x0 unless another value has been written into QWR[NEWQP]. QWR[ENDQP] is cleared at reset but is changed to show the last queue entry before the QSPI is enabled. QWR[NEWQP] and QWR[ENDQP] can be written at any time. When the QWR[NEWQP] value changes, the internal pointer value also changes unless a transfer is in progress, in which case the transfer completes normally. Leaving QWR[NEWQP] and QWR[ENDQP] set to 0x0 causes a single transfer to occur when the QSPI is enabled. Data is transferred relative to QSPI_CLK which can be generated in any one of four combinations of phase and polarity using QMR[CPHA, CPOL]. Data is transferred most significant bit (msb) first. The number of bits transferred defaults to eight, but can be set to any value from 8 to 16 by writing a value into the BITSE field of the command RAM, QCR[BITSE] . 14.4.1 QSPI RAM The QSPI contains an 80-byte block of static RAM that can be accessed by both the user and the QSPI. This RAM does not appear in the MCF5272 memory map because it can only be accessed by the user indirectly through the QSPI address register (QAR) and the QSPI data register (QDR). The RAM is divided into three segments with 16 addresses each: • receive data RAM, the initial destination for all incoming data • transmit data RAM, a buffer for all out-bound data • command RAM, where commands are loaded The transmit and command RAM are write-only by the user. The receive RAM is read-only by the user. Figure 14-2 shows the RAM configuration. The RAM contents are undefined immediately after a reset. The command and data RAM in the QSPI is indirectly accessible with QDR and QAR as 48 separate locations that comprise 16 words of transmit data, 16 words of receive data and 16 bytes of commands. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 14-4 Freescale Semiconductor

Queued Serial Peripheral Interface (QSPI) Module A write to QDR causes data to be written to the RAM entry specified by QAR[ADDR] and causes the value in QAR to increment. Correspondingly, a read at QDR returns the data in the RAM at the address specified by QAR[ADDR]. This also causes QAR to increment. A read access requires a single wait state. Relative Address Register Function 0x00 QTR0 Transmit RAM 0x01 QTR1 . . 16 bits wide . . . . 0x0F QTR15 0x10 QRR0 Receive RAM 0x11 QRR1 . . 16 bits wide . . . . 0x1F QRR15 0x20 QCR0 Command RAM 0x21 QCR1 . . 8 bits wide . . . . 0x2F QCR15 Figure14-2. QSPI RAM Model 14.4.1.1 Receive RAM Data received by the QSPI is stored in the receive RAM segment located at 0x10 to 0x1F in the QSPI RAM space. The user reads this segment to retrieve data from the QSPI. Data words with less than 16 bits are stored in the least significant bits of the RAM. Unused bits in a receive queue entry are set to zero upon completion of the individual queue entry. NOTE Throughout ColdFire documentation, ‘word’ is used consistently and exclusively to designate a 16-bit data unit. The only exceptions to this appear in discussions of serial communication modules such as QSPI that support variable-length data units. To simplify these discussions the functional unit is referred to as a ‘word’ regardless of length. QWR[CPTQP] shows which queue entries have been executed. The user can query this field to determine which locations in receive RAM contain valid data. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 14-5

Queued Serial Peripheral Interface (QSPI) Module 14.4.1.2 Transmit RAM Data to be transmitted by the QSPI is stored in the transmit RAM segment located at addresses 0x0 to 0xF. The user normally writes 1 word into this segment for each queue command to be executed. The user cannot read transmit RAM. Out-bound data must be written to transmit RAM in a right-justified format. The unused bits are ignored. The QSPI copies the data to its data serializer (shift register) for transmission. The data is transmitted most significant bit first and remains in transmit RAM until overwritten by the user. 14.4.1.3 Command RAM The CPU writes one byte of control information to this segment for each QSPI command to be executed. Command RAM is write-only memory from a user’s perspective. Command RAM consists of 16 bytes with each byte divided into two fields. The peripheral chip select field controls the QSPI_CS signal levels for the transfer. The command control field provides transfer options. A maximum of 16 commands can be in the queue. Queue execution proceeds from the address in QWR[NEWQP] through the address in QWR[ENDQP]. The QSPI executes a queue of commands defined by the control bits in each command RAM entry which sequence the following actions: • chip-select pins are activated • data is transmitted from transmit RAM and received into the receive RAM • the synchronous transfer clock QSPI_CLK is generated Before any data transfers begin, control data must be written to the command RAM, and any out-bound data must be written to transmit RAM. Also, the queue pointers must be initialized to the first and last entries in the command queue. Data transfer is synchronized with the internally generated QSPI_CLK, whose phase and polarity are controlled by QMR[CPHA] and QMR[CPOL]. These control bits determine which QSPI_CLK edge is used to drive outgoing data and to latch incoming data. 14.4.2 Baud Rate Selection The maximum QSPI clock frequency is one-fourth the clock frequency applied at the CLKIN pin. Baud rate is selected by writing a value from 2–255 into QMR[BAUD]. The QSPI uses a prescaler to derive the QSPI_CLK rate from the system clock, CLKIN, divided by two. A baud rate value of zero turns off the QSPI_CLK. The desired QSPI_CLK baud rate is related to CLKIN and QMR[BAUD] by the following expression: QMR[BAUD] = CLKIN / [2 × (desired QSPI_CLK baud rate)] MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 14-6 Freescale Semiconductor

Queued Serial Peripheral Interface (QSPI) Module Table14-2. QSPI_CLK Frequency as Function of CPU Clock and Baud Rate CPU Clock QMR [BAUD] 66 MHz 48 MHz 33 MHz 20 MHz 2 16,500,000 12,000,000 8,250,000 5,000,000 4 8,250,000 6,000,000 4,125,000 2,500,000 8 4,125,000 3,000,000 2,062,500 1,250,000 16 2,062,500 1,500,000 1,031,250 625,000 32 1,031,250 750,000 515,625 312,500 255 129,412 94,118 64,706 39,216 14.4.3 Transfer Delays The QSPI supports programmable delays for the QSPI_CS signals before and after a transfer. The time between QSPI_CS assertion and the leading QSPI_CLK edge, and the time between the end of one transfer and the beginning of the next, are both independently programmable. The chip select to clock delay enable (DSCK) bit in command RAM, QCR[DSCK], enables the programmable delay period from QSPI_CS assertion until the leading edge of QSPI_CLK. QDLYR[QCD] determines the period of delay before the leading edge of QSPI_CLK. The following expression determines the actual delay before the QSPI_CLK leading edge: QSPI_CS-to-QSPI_CLK delay = QCD/CLKIN frequency QCD has a range of 1–127. When QCD or DSCK equals zero, the standard delay of one-half the QSPI_CLK period is used. The delay after transmit enable (DT) bit in command RAM enables the programmable delay period from the negation of the QSPI_CS signals until the start of the next transfer. The delay after transfer can be used to provide a peripheral deselect interval. A delay can also be inserted between consecutive transfers to allow serial A/D converters to complete conversion. There are two transfer delay options: the user can choose to delay a standard period after serial transfer is complete or can specify a delay period. Writing a value to QDLYR[DTL] specifies a delay period. The DT bit in command RAM determines whether the standard delay period (DT = 0) or the specified delay period (DT = 1) is used. The following expression is used to calculate the delay: Delay after transfer = 32× QDLYR[DTL]/CLKIN frequency (DT = 1) where QDLYR[DTL] has a range of 1–255. A zero value for DTL causes a delay-after-transfer value of 8192/CLKIN frequency. Standard delay after transfer = 17/CLKIN frequency (DT = 0) Receiving devices need at least the standard delay (DT=0) between successive transfers for long data streams because the QSPI module requires time to load a transmit RAM entry for transfer. If CLKIN is operating at a slower rate, the delay between transfers must be increased proportionately. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 14-7

Queued Serial Peripheral Interface (QSPI) Module 14.4.4 Transfer Length There are two transfer length options. The user can choose a default value of 8 bits or a programmed value of 8 to 16 bits inclusive. The programmed value must be written into QMR[BITS]. The bits per transfer enable (BITSE) field in the command RAM determines whether the default value (BITSE = 0) or the BITS[3–0] value (BITSE = 1) is used. QMR[BITS] gives the required number of bits to be transferred, with 0b0000 representing 16. 14.4.5 Data Transfer Operation is initiated by setting QDLYR[SPE]. Shortly after QDLYR[SPE] is set, the QSPI executes the command at the command RAM address pointed to by QWR[NEWQP]. Data at the pointer address in transmit RAM is loaded into the data serializer and transmitted. Data that is simultaneously received is stored at the pointer address in receive RAM. When the proper number of bits has been transferred, the QSPI stores the working queue pointer value in QWR[CPTQP], increments the working queue pointer, and loads the next data for transfer from the transmit RAM. The command pointed to by the incremented working queue pointer is executed next unless a new value has been written to QWR[NEWQP]. If a new queue pointer value is written while a transfer is in progress, then that transfer is completed normally. When the CONT bit in the command RAM is set, the QSPI_CS signals are asserted between transfers. When CONT is cleared, QSPI_CS[0:3] are negated between transfers. The QSPI_CS signals are not high impedance. When the QSPI reaches the end of the queue, it asserts the SPIF flag, QIR[SPIF]. If QIR[SPIFE] is set, an interrupt request is generated when QIR[SPIF] is asserted. Then the QSPI clears QDLYR[SPE] and stops, unless wraparound mode is enabled. Wraparound mode is enabled by setting QWR[WREN]. The queue can wrap to pointer address 0x0, or to the address specified by QWR[NEWQP], depending on the state of QWR[WRTO]. In wraparound mode, the QSPI cycles through the queue continuously, even while requesting interrupt service. QDLYR[SPE] is not cleared when the last command in the queue is executed. New receive data overwrites previously received data in the receive RAM. Each time the end of the queue is reached, QIR[SPIFE] is set. QIR[SPIF] is not automatically reset. If interrupt driven QSPI service is used, the service routine must clear QIR[SPIF] to abort the current request. Additional interrupt requests during servicing can be prevented by clearing QIR[SPIFE]. There are two recommended methods of exiting wraparound mode: clearing QWR[WREN] or setting QWR[HALT]. Exiting wraparound mode by clearing QDLYR[SPE] is not recommended because this may abort a serial transfer in progress. The QSPI sets SPIF, clears QDLYR[SPE], and stops the first time it reaches the end of the queue after QWR[WREN] is cleared. After QWR[HALT] is set, the QSPI finishes the current transfer, then stops executing commands. After the QSPI stops, QDLYR[SPE] can be cleared. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 14-8 Freescale Semiconductor

Queued Serial Peripheral Interface (QSPI) Module 14.5 Programming Model The programming model for the QSPI consists of six registers. They are the QSPI mode register (QMR), QSPI delay register (QDLYR), QSPI wrap register (QWR), QSPI interrupt register (QIR), QSPI address register (QAR), and the QSPI data register (QDR). There are a total of 80 bytes of memory used for transmit, receive, and control data. This memory is accessed indirectly using QAR and QDR. Registers and RAM are written and read by the CPU. 14.5.1 QSPI Mode Register (QMR) The QMR register, shown in Figure 14-3, determines the basic operating modes of the QSPI module. Parameters such as clock polarity and phase, baud rate, master mode operation, and transfer size are determined by this register. The data output high impedance enable, DOHIE, controls the operation of QSPI_Dout between data transfers. When DOHIE is cleared, QSPI_Dout is actively driven between transfers. When DOHIE is set, QSPI_Dout assumes a high impedance state. NOTE Because the QSPI does not operate in slave mode, the master mode enable bit, QMR[MSTR], must be set for the QSPI module to operate correctly. 15 14 13 10 9 8 7 0 Field MSTR DOHIE BITS CPOL CPHA BAUD Reset 0000_0001_0000_0100 R/W R/W Address MBAR + 0x00A0 Figure14-3. QSPI Mode Register (QMR) Table 14-3 gives QMR field descriptions. Table14-3. QMR Field Descriptions Bits Name Description 15 MSTR Master mode enable. 0 Reserved, do not use. 1 The QSPI is in master mode. Must be set for the QSPI module to operate correctly. 14 DOHIE Data output high impedance enable. Selects QSPI_Dout mode of operation. 0 Default value after reset. QSPI_Dout is actively driven between transfers. 1 QSPI_Dout is high impedance between transfers. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 14-9

Queued Serial Peripheral Interface (QSPI) Module Table14-3. QMR Field Descriptions (continued) Bits Name Description 13–10 BITS Transfer size. Determines the number of bits to be transferred for each entry in the queue. ValueBits per transfer 0000 16 0001– 0111 Reserved 1000 8 1001 9 1010 10 1011 11 1100 12 1101 13 1110 14 1111 15 9 CPOL Clock polarity. Defines the clock polarity of SCK. 0 The inactive state value of QSPI_CLK is logic level 0. 1 The inactive state value of QSPI_CLK is logic level 1. 8 CPHA Clock phase. Defines the QSPI_CLK clock-phase. 0 Data captured on the leading edge of QSPI_CLK and changed on the following edge of QSPI_CLK. 1 Data changed on the leading edge of QSPI_CLK and captured on the following edge of QSPI_CLK. 7–0 BAUD Baud rate divider. The baud rate is selected by writing 0, or a value in the range 2–255. 1 is not a valid value. A value of zero disables the QSPI. The desired QSPI_CLK baud rate is related to CLKIN and QMR[BAUD] by the following expression: QMR[BAUD] = SystemClock / [2×(desired QSPI_CLK baud rate)] Figure 14-4 shows an example of a QSPI clocking and data transfer. QSPI_CLK QSPI_Dout 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 msb QSPI_Din 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 A B QSPI_CS QMR[CPOL] = 0 Chip selects are active low QMR[CPHA] = 1 A=QDLYR[QCD] QCR[CONT] = 0 B=QDLYR[DTL] Figure14-4. QSPI Clocking and Data Transfer Example MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 14-10 Freescale Semiconductor

Queued Serial Peripheral Interface (QSPI) Module Figure 14-5 shows the timing of the four SPI modes. SCK (CPOL = 0, CPHA = 0) SCK (CPOL = 0, CPHA = 1) SCK (CPOL = 1, CPHA = 0) SCK (CPOL = 1, CPHA = 1) Figure14-5. SPI Modes Timing 14.5.2 QSPI Delay Register (QDLYR) Figure 14-6 shows the QSPI delay register. 15 14 8 7 0 Field SPE QCD DTL Reset 0000_0100_0000_0100 R/W R/W Address MBAR + 0x00A4 Figure14-6. QSPI Delay Register (QDLYR) Table 14-4 gives QDLYR field descriptions. Table14-4. QDLYR Field Descriptions Bits Name Description 15 SPE QSPI enable. When set, the QSPI initiates transfers in master mode by executing commands in the command RAM. Automatically cleared by the QSPI when a transfer completes.The user can also clear this bit to abort transfer unless QIR[ABRTL] is set. The recommended method for aborting transfers is to set QWR[HALT]. 14–8 QCD QSPILCK Delay. When the DSCK bit in the command RAM, is set this field determines the length of the delay from assertion of the chip selects to valid QSPI_CLK transition. 7–0 DTL Delay after transfer.When the DT bit in the command RAM sets this field determines the length of delay after the serial transfer. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 14-11

Queued Serial Peripheral Interface (QSPI) Module 14.5.3 QSPI Wrap Register (QWR) 15 14 13 12 11 8 7 4 3 0 Field HALT WREN WRTO CSIV ENDQP – NEWQP Reset 0000_0000_0000_0000 R/W R/W Address MBAR + 0x00A8 Figure14-7. QSPI Wrap Register (QWR) Table 14-5 gives QWR field descriptions. Table14-5. QWR Field Descriptions Bits Name Description 15 HALT Halt transfers. Assertion of this bit causes the QSPI to stop execution of commands once it has completed execution of the current command. 14 WREN Wraparound enable. Enables wraparound mode. 0 Execution stops after executing the command pointed to by QWR[ENDQP]. 1 After executing command pointed to by QWR[ENDQP], wrap back to entry zero, or the entry pointed to by QWR[NEWQP] and continue execution. 13 WRTO Wraparound location. Determines where the QSPI wraps to in wraparound mode. 0 Wrap to RAM entry zero. 1 Wrap to RAM entry pointed to by QWR[NEWQP]. 12 CSIV QSPI_CS inactive level. 0 QSPI chip select outputs return to zero when not driven from the value in the current command RAM entry during a transfer (that is, inactive state is 0, chip selects are active high). 1 QSPI chip select outputs return to one when not driven from the value in the current command RAM entry during a transfer (that is, inactive state is 1, chip selects are active low). 11–8 ENDQP End of queue pointer. Points to the RAM entry that contains the last transfer description in the queue. 7–4 CPTQP Completed queue entry pointer. Points to the RAM entry that contains the last command to have been completed. This field is read only. 3–0 NEWQP Start of queue pointer. This 4-bit field points to the first entry in the RAM to be executed on initiating a transfer. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 14-12 Freescale Semiconductor

Queued Serial Peripheral Interface (QSPI) Module 14.5.4 QSPI Interrupt Register (QIR) Figure 14-8 shows the QSPI interrupt register. 15 14 13 12 11 10 9 8 7 4 3 2 1 0 Field WCEFB ABRTB — ABRTL WCEFE ABRTE — SPIFE — WCEF ABRT — SPIF Reset 0000_0000_0000_0000 R/W R/W Address MBAR + 0x00AC Figure14-8. QSPI Interrupt Register (QIR) Table 14-6 describes QIR fields. Table14-6. QIR Field Descriptions BIts Name Description 15 WCEFB Write collision access error enable. A write collision occurs during a data transfer when the RAM entry containing the command currently being executed is written to by the CPU with the QDR. When this bit is asserted, the write access to QDR results in an access error. 14 ABRTB Abort access error enable. An abort occurs when QDLYR[SPE] is cleared during a transfer. When set, an attempt to clear QDLYR[SPE] during a transfer results in an access error. 13 — Reserved, should be cleared. 12 ABRTL Abort lock-out. When set, QDLYR[SPE] cannot be cleared by writing to the QDLYR. QDLYR[SPE] is only cleared by the QSPI when a transfer completes. 11 WCEFE Write collision interrupt enable. Interrupt enable for WCEF. Setting this bit enables the interrupt, and clearing it disables the interrupt. 10 ABRTE Abort interrupt enable. Interrupt enable for ABRT flag. Setting this bit enables the interrupt, and clearing it disables the interrupt. 9 — Reserved, should be cleared. 8 SPIFE QSPI finished interrupt enable. Interrupt enable for SPIF. Setting this bit enables the interrupt, and clearing it disables the interrupt. 7–4 — Reserved, should be cleared. 3 WCEF Write collision error flag. Indicates that an attempt has been made to write to the RAM entry that is currently being executed. Writing a 1 to this bit clears it and writing 0 has no effect. 2 ABRT Abort flag. Indicates that QDLYR[SPE] has been cleared by the user writing to the QDLYR rather than by completion of the command queue by the QSPI. Writing a 1 to this bit clears it and writing 0 has no effect. 1 — Reserved, should be cleared. 0 SPIF QSPI finished flag. Asserted when the QSPI has completed all the commands in the queue. Set on completion of the command pointed to by QWR[ENDQP], and on completion of the current command after assertion of QWR[HALT]. In wraparound mode, this bit is set every time the command pointed to by QWR[ENDQP] is completed. Writing a 1 to this bit clears it and writing 0 has no effect. The command and data RAM in the QSPI is indirectly accessible with QDR and QAR as 48 separate locations that comprise 16 words of transmit data, 16 words of receive data and 16 bytes of commands. A write to QDR causes data to be written to the RAM entry specified by QAR[ADDR]. This also causes the value in QAR to increment. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 14-13

Queued Serial Peripheral Interface (QSPI) Module Correspondingly, a read at QDR returns the data in the RAM at the address specified by QAR[ADDR]. This also causes QAR to increment. A read access requires a single wait state. NOTE The QAR does not wrap after the last queue entry within each section of the RAM. 14.5.5 QSPI Address Register (QAR) The QAR, shown in Figure 14-9, is used to specify the location in the QSPI RAM that read and write operations affect. 15 6 5 0 Field — ADDR Reset 0000_0000_0000_0000 R/W R/W Address MBAR + 0x00B0 Figure14-9. QSPI Address Register 14.5.6 QSPI Data Register (QDR) The QDR, shown in Figure 14-10, is used to access QSPI RAM indirectly. The CPU reads and writes all data from and to the QSPI RAM through this register. A read or write to QDR causes the value in QAR to increment. 15 0 Field DATA Reset 0000_0000_0000_0000 R/W R/W Address MBAR + 0x00B4 Figure14-10. QSPI Data Register MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 14-14 Freescale Semiconductor

Queued Serial Peripheral Interface (QSPI) Module 14.5.7 Command RAM Registers (QCR0–QCR15) The command RAM is accessed using the upper byte of QDR. The QSPI cannot modify information in command RAM. There are 16 bytes in the command RAM. Each byte is divided into two fields. The chip select field enables external peripherals for transfer. The command field provides transfer operations. NOTE The command RAM is accessed only using the most significant byte of QDR and indirect addressing based on QAR[ADDR]. Figure 14-11 shows the command RAM register. 15 14 13 12 11 8 7 0 Field CONT BITSE DT DSCK QSPI_CS – Reset Undefined R/W Write Only Address QAR[ADDR] Figure14-11. Command RAM Registers (QCR0–QCR15) Table 14-7 gives QCR field descriptions. Table14-7. QCR0–QCR15 Field Descriptions Bits Name Description 15 CONT Continuous. 0 Chip selects return to inactive level defined by QWR[CSIV] when transfer is complete. 1 Chip selects remain asserted between transfers for a transfer of up to 16 words of data.1 14 BITSE Bits per transfer enable. 0 Eight bits 1 Number of bits set in QMR[BITS] 13 DT Delay after transfer enable. 0 Default reset value. 1 The QSPI provides a variable delay at the end of serial transfer to facilitate interfacing with peripherals that have a latency requirement. The delay between transfers is determined by QDLYR[DTL]. 12 DSCK Chip select to QSPI_CLK delay enable. 0 Chip select valid to QSPI_CLK transition is one-half QSPI_CLK period. 1 QDLYR[QCD] specifies the delay from QSPI_CS valid to QSPI_CLK. 11–8 QSPI_CS Peripheral chip selects. Used to select an external device for serial data transfer. More than one chip select may be active at once, and more than one device can be connected to each chip select. Bits 11–8 map directly to QSPI_CS[3:0], respectively. If it is desired to use those bits as a chip select value, then an external demultiplexor must be connected to the QSPI_CS[3:0] pins. 7–0 — Reserved, should be cleared. 1 In order to keep the chip setects asserted for all transfers, the QWR[CSIV] bit must be set to control the level that the chip selects return to after the first transfer. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 14-15

Queued Serial Peripheral Interface (QSPI) Module 14.5.8 Programming Example The following steps are necessary to set up the QSPI 12-bit data transfers and a QSPI_CLK of 4.125MHz. The QSPI RAM is set up for a queue of 16 transfers. All four QSPI_CS signals are used in this example. 1. Enable all QSPI_CS pins on the MCF5272. Write PACNT with 0x0080_4000 to enable QSPI_CS1 and QSPI_CS3.Write PDCNT with 0x0000_0030 to enable QSPI_CS2. 2. Write the QMR with 0xB308 to set up 12-bit data words with the data shifted on the falling clock edge, and a clock frequency of 4.125 MHz (assuming a 66-MHz CLKIN). 3. Write QDLYR with the desired delays. 4. Write QIR with 0xD00D to enable write collision, abort bus errors, and clear any interrupts. 5. Write QAR with 0x0020 to select the first command RAM entry. 6. Write QDR with 0x7E00, 0x7E00, 0x7E00, 0x7E00, 0x7D00, 0x7D00, 0x7D00, 0x7D00, 0x7B00, 0x7B00, 0x7B00, 0x7B00, 0x7700, 0x7700, 0x7700, and 0x7700 to set up four transfers for each chip select. The chip selects are active low in this example. 7. Write QAR with 0x0000 to select the first transmit RAM entry. 8. Write QDR with sixteen 12-bit words of data. 9. Write QWR with 0x0F00 to set up a queue beginning at entry 0 and ending at entry 15. 10.Set QDLYR[SPE] to enable the transfers. 11. Wait until the transfers are complete. QIR[SPIF] is set when the transfers are complete. 12.Write QAR with 0x0010 to select the first receive RAM entry. 13.Read QDR to get the received data for each transfer. 14.Repeat steps 5 through 13 to do another transfer. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 14-16 Freescale Semiconductor

Chapter 15 Timer Module This chapter describes configuration and operation of the four general-purpose timer modules, timer 0, 1, 2 and 3. 15.1 Overview The timer module has four identical general-purpose 16-bit timers and a software watchdog timer, described in Chapter6, “System Integration Module (SIM).” Each general-purpose timer consists of a timer mode register (TMRn), a timer capture register (TCAPn), a 16-bit timer counter (TCNn), a timer reference register (TRRn), and a timer event register (TERn). The TMRs contain the prescaler value programmed by the user. The four timer units have the following features: • Maximum period of 4 seconds at 66 MHz • 15-nS resolution at 66 MHz • Programmable sources for the clock input, including external clock • Input capture capability with programmable trigger edge on input pins • Output compare with programmable mode for the output pins • Free run and restart modes 15.2 Timer Operation The timer units consist of four identical, independent 16-bit timers, timers 0–3. For timers 0 and 1, the clock input to the prescaler is selected from the main clock (divided by 1 or 16) or from the corresponding timer input (TIN0 or TIN1) pin. For timers 2 and 3, the clock input to the prescaler can be selected only from the main clock (divided by 1 or 16). TIN is internally synchronized to the internal clock, with a synchronization delay between two and three main clocks. The clock input source is selected by the CLK bits of the corresponding timer mode register (TMR0–TMR3). The prescaler is programmed to divide the clock input by values from 1 to 256. The output of the prescaler is used as an input to the 16-bit counter. The maximum timer resolution is one system clock cycle (15 nS at 66 MHz). The maximum period (the reference value is all ones) is 268,435,456 cycles = 24× 28× 216 (4seconds at 66MHz). The timer can be configured to count until a reference is reached at which point it can either start a new time count immediately or continue to run. The free run/restart bit, TMRn[FRR], selects each mode. Upon reaching the reference value, the TER0 or TER1 bit is set, and an interrupt is issued if the output reference interrupt enable bit, TMR[ORI], is set. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 15-1

Timer Module Timer 1 Timer 0 15 0 System Clock or Timer Event Register (TER0) Timer System Clock/16 Clock 15 0 Generator TIN1 Timer Mode Register (TMR0) TIN0 Prescaler Mode Bits Divider Clock 15 0 Timer Counter (TCN0) Capture Detection 15 0 TOUT1 Timer Reference Register (TRR0) TOUT0 15 0 Interrupt (T1) Timer Capture Register (TCAP0) Interrupt (T0) Data [16) Timer 3 15 Timer 2 0 System Clock or Timer Event Register (TER2) System Clock/16 Timer Clock 15 0 Generator Timer Mode Register (TMR 2) Prescaler Mode Bits Divider Clock 15 0 UART1_RxD Timer Counter (TCN2) Capture UART0_RxD Detection 15 0 Timer Reference Register (TRR2) 15 0 Interrupt (T3) Timer Capture Register (TCAP2) Interrupt (T2) Figure15-1. Timer Block Diagram Timers 0 and 1 may output a signal on the timer outputs (TOUT0 or TOUT1) when the reference value is reached, as selected by the output mode bit, TMR[OM]. This signal can be an active-low pulse or a toggle of the current output, under program control. The TCAPs are used to latch counter values when the corresponding input capture edge detector detects a defined transition (of TIN0, TIN1, URT0_RxD, or URT1_RxD). The type of transition triggering the capture is selected by the capture edge bits, TMR[CE].A capture or reference event sets the TER bit and generates a maskable interrupt. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 15-2 Freescale Semiconductor

Timer Module 15.3 General-Purpose Timer Registers The following sections describe the timer registers. 15.3.1 Timer Mode Registers (TMR0–TMR3) The TMRs, Table 15-2, have fields for choosing a prescaler, a clock edge, and other parameters. 15 8 7 6 5 4 3 2 1 0 Field PRESCALER (PS) CE OM1 ORI FRR CLK RST Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x200 (TMR0); 0x220 (TMR1); 0x240 (TMR2); 0x260 (TMR3) 1 Not implemented (reserved) in TMR2 and TMR3. Figure15-2. Timer Mode Registers (TMR0–TMR3) TMRn fields are described in Table 15-1. Table15-1. TMRn Field Descriptions Bits Name Description 15–8 PS Prescaler. Programmed to divide the clock input by values from 1 to 256. The value 0000_0000 divides the clock by 1; the value 1111_1111 divides the clock by 256. 7–6 CE Capture edge and enable interrupt. 00 Disable capture and interrupt on capture event 01 Capture on rising edge only and generate interrupt on capture event 10 Capture on falling edge only and generate interrupt on capture event 11 Capture on any edge and generate interrupt on capture event 5 OM Output mode (TMR0 and TMR1 only. Reserved in TMR2 and TMR3) 0 Active-low pulse for one system clock cycle (15 nS at 66 MHz) 1 Toggle output TOUTn is high at reset but is unavailable externally until the appropriate port control register is configured for this function. See Section17.2, “Port Control Registers.” 4 ORI Output reference interrupt enable 0 Disable interrupt for reference reached (does not affect interrupt on capture function) 1 Enable interrupt upon reaching the reference value If ORI is 1 when the TER[REF] is set, an immediate interrupt occurs. 3 FRR Free run/restart 0 Free run. Timer count continues to increment after the reference value is reached. 1 Restart. Timer count is reset immediately after the reference value is reached. 2–1 CLK Input clock source for the timer 00 Stop count 01 Master system clock 10 Master system clock divided by 16. TIN0 and TIN1 are external to the MCF5272 and are not synchronized to the system clock, so successive timeout lengths may vary slightly. 11 Corresponding TIN pin, TIN0 or TIN1 (falling edge), unused in TMR2 and TMR3 The minimum high and low periods for TIN as the clock source is 1 system clock, which gives a maximum TIN frequency of clock/2. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 15-3

Timer Module Table15-1. TMRn Field Descriptions (continued) Bits Name Description 0 RST Reset timer. 0 A transition from 1 to 0 resets the timer. Other register values can be written. The counter/timer/prescaler are not clocked unless the timer is enabled. 1 Enable timer 15.3.2 Timer Reference Registers (TRR0–TRR3) Each TRR holds a 16-bit reference value that is compared with the free-running TCN as part of the output compare function. A match occurs when TCN increments to equal TRR. 15 0 Field REF (16-bit reference value) Reset 1111_1111_1111_1111 R/W Read/Write Addr MBAR + 0x204 (TRR0); 0x224 (TRR1); 0x244 (TRR2); 0x264 (TRR3) Figure15-3. Timer Reference Registers (TRR0–TRR3) 15.3.3 Timer Capture Registers (TCAP0–TCAP3) Each TCAP is used to latch the TCN value during a capture operation when an edge occurs on the respective TIN0, TIN1, UART0_RxD, or UART1_RxD, as programmed in TMRn. 15 0 Field CAP (16-bit capture counter value) Reset 0000_0000_0000_0000 R/W Read Only Addr MBAR + 0x208 (TCAP0); 0x228 (TCAP1); 0x248 (TCAP2); 0x268 (TCAP3) Figure15-4. Timer Capture Registers (TCAP0–TCAP3) 15.3.4 Timer Counters (TCN0–TCN3) TCN registers are 16-bit up counters. Reading a TCNn gives the current counter value without affecting counting. A write cycle to a TCN register causes it to be cleared. 15 0 Field COUNT (16-bit timer counter value) Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x20C (TCN0); 0x22C (TCN1); 0x24C (TCN2); 0x26C (TCN3) Figure15-5. Timer Counter (TCN0–TCN3) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 15-4 Freescale Semiconductor

Timer Module 15.3.5 Timer Event Registers (TER0–TER3) TERs are used to report events recognized by the timer. On recognition of an event, the timer sets the appropriate TERn bit, regardless of the corresponding interrupt enable bits (ORI and CE) in the TMRn. Writing a 1 to a bit clears it; writing 0 has no effect. Both bits must be cleared before the timer can negate the request to the interrupt controller. Both bits may be cleared simultaneously. 15 2 1 0 Field — REF CAP Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x210 (TER0); 0x230 (TER1); 0x250 (TER2); 0x270 (TER3) Figure15-6. Timer Event Registers (TER0–TER3) Table 15-2 describes TERn fields. Table15-2. TERn Field Descriptions Bits Name Description 15–2 — Reserved, should be cleared. 1 REF Output reference event. 0 The counter has not reached the TRR value 1 The counter reached the TRR value. TMR[ORI] is used to enable the interrupt request caused by this event. Write a 1 to this bit to clear the event condition. 0 CAP Capture event. 0 The counter value has not been latched into the TCAP. 1 The counter value is latched in the TCAP. TMR[CE] is used to enable capture and the interrupt request caused by this event. Write a 1 to this bit to clear the event condition. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 15-5

Timer Module MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 15-6 Freescale Semiconductor

Chapter 16 UART Modules This chapter describes the use of the universal asynchronous/synchronous receiver/transmitters (UARTs) implemented on the MCF5272 and includes programming examples. All references to UART refer to one of these modules. 16.1 Overview The MCF5272 contains two independent UARTs. Each UART can be clocked by either URT_CLK or CLKIN, eliminating the need for an external crystal. As Figure 16-1 shows, each UART module interfaces directly to the CPU and consists of the following: • Serial communication channel • Programmable transmitter and receiver clock generation • Internal channel control logic • Interrupt control logic UART URT_CTS Internal Channel Control Logic Serial URT_RTS Communications Channel URT_RxD URT_TxD System Integration Programmable CLKIN Module (SIM) Interrupt Control Clock or Interrupt Logic Generation External clock (URT_CLK) Controller Figure16-1. Simplified Block Diagram The serial communication channel provides a full-duplex asynchronous/synchronous receiver and transmitter deriving an operating frequency from CLKIN or an external clock of the correct frequency (URT_CLK). The transmitter converts parallel data from the CPU to a serial bit stream, inserting appropriate start, stop, and parity bits. It outputs the resulting stream on the channel transmitter serial data output (TxD). See Section16.5.2.1, “Transmitting.” The receiver converts serial data from the channel receiver serial data input (RxD) to parallel format, checks for a start, stop, and parity bits, or break conditions, and transfers the assembled character onto the bus during read operations. The receiver may be polled- or interrupt-driven. See Section16.5.2.2, “Receiver.” MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-1

UART Modules 16.2 Serial Module Overview The MCF5272 contains two independent UART modules, whose features are as follows: • Each clocked by either URT_CLK or CLKIN, eliminating a need for an external crystal • Full-duplex asynchronous/synchronous receiver/transmitter channel • 24-byte FIFO receiver — CTS receiver FIFO control — Receiver FIFO timeout • 24-byte FIFO transmitter • Independently programmable receiver and transmitter clock sources • Programmable data format: — 5–8 data bits plus parity — Odd, even, no parity, or force parity — One, one-and-a-half, or two stop bits • Each channel programmable to normal (full-duplex), automatic echo, local loop-back, or remote loop-back mode • Automatic wake-up mode for multidrop applications • Eight maskable interrupt conditions • Parity, framing, and overrun error detection • False-start bit detection • Line-break detection and generation • Detection of breaks originating in the middle of a character • Start/end break interrupt/status • Autobaud capability The MCF5272 UART modules are identical to those on other ColdFire devices, such as the MCF5206e, with the following exceptions: • The MCF5272 receiver and transmitter FIFOs have been expanded to 24 bytes. • Interrupts can be programmed to occur at various levels of FIFO fullness on both the receiver and transmitter. • Autobaud capability has been added to automatically calculate the character transmission rate from the first received character. • Registers have been added to increase accuracy in clock generation. 16.3 Register Descriptions This section contains a detailed description of each register and its specific function. Flowcharts in Section16.5.6, “Programming,” describe basic UART module programming. The operation of the UART module is controlled by writing control bytes into the appropriate registers. Table 16-1 is a memory map for UART module registers. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-2 Freescale Semiconductor

UART Modules Table16-1. UART Module Programming Model MBAR Offset [31:24] [23:16] [15:8] [7:0] UART0 UART1 0x100 0x140 UART mode — registers1—(UMR1n) [p. 16-4], (UMR2n) [p. 16-6] 0x104 0x144 (Read) UART status — registers—(USRn) [p. 16-7] (Write) UART clock-select — register1—(UCSRn) [p. 16-8] 0x108 0x148 (Read) Do not access.2 — (Write) UART command — registers—(UCRn) [p. 16-9] 0x10C 0x14C (UART/Read) UART receiver — buffers—(URBn) [p. 16-10] (UART/Write) UART — transmitter buffers—(UTBn) [p. 16-11] 0x110 0x150 (Read) UART input port — change registers—(UIPCRn) [p. 16-11] (Write) UART auxiliary control — registers1—(UACRn) [p. 16-12] 0x114 0x154 (Read) UART interrupt status — registers—(UISRn) [p. 16-12] (Write) UART interrupt mask — registers—(UIMRn) [p. 16-12] 0x118 0x158 (Read) Do not access.2 — UART divider upper — registers—(UDUn) [p. 16-14] 0x11C 0x15C (Read) Do not access.2 — UART divider lower — registers—(UDLn) [p. 16-14] 0x120 0x160 (Read) UART autobaud — register MSB—(UABUn) [p. 16-17] (Write) Do not access.2 — 0x124 0x164 (Read) UART autobaud — register LSB—(UABLn) [p. 16-17] (Write) Do not access2 — 0x128 0x168 UART Transmitter FIFO — registers—(UTFn) [p. 16-4] MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-3

UART Modules Table16-1. UART Module Programming Model (continued) MBAR Offset [31:24] [23:16] [15:8] [7:0] UART0 UART1 0x12C 0x16C UART Receiver FIFO — registers—(URFn) [p. 16-4] 0x130 0x170 UART Fractional Precision — Divider Control registers (UFPDn) [p. 16-17] 0x134 0x174 (Read) UART input port — registers—(UIPn) [p. 16-17] (Write) Do not access.2 — 0x138 0x178 (Read) Do not access.2 — (Write) UART output port bit — set command registers—(UOP1n3) [p. 16-18] 0x13C 0x17C (Read) Do not access.2 — (Write) UART output port bit — reset command registers—(UOP0n3) [p. 16-18] 1 UMR1n, UMR2n, and UCSRn should be changed only after the receiver/transmitter is issued a software reset command. That is, if channel operation is not disabled, undesirable results may occur. 2 This address is for factory testing. Reading this location results in undesired effects and possible incorrect transmission or reception of characters. Register contents may also be changed. 3 Address-triggered commands NOTE UART registers are accessible only as bytes. 16.3.1 UART Mode Registers 1 (UMR1n) The UART mode registers 1 (UMR1n) control configuration. UMR1n can be read or written when the mode register pointer points to it, at RESET or after a RESET MODE REGISTER POINTER command using UCRn[MISC]. After UMR1n is read or written, the pointer points to UMR2n. 7 6 5 4 3 2 1 0 Field RxRTS RxIRQ/FFULL ERR PM PT B/C Reset 0000_0000 R/W R/W Address MBAR + 0x100 (UART0), 0x140 (UART1). After UMR1n is read or written, the pointer points to UMR2n. Figure16-2. UART Mode Registers 1 (UMR1n) Table 16-2 describes UMR1n fields. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-4 Freescale Semiconductor

UART Modules Table16-2. UMR1n Field Descriptions Bits Name Description 7 RxRTS Receiver request-to-send. Allows the RTS output to control the CTS input of the transmitting device to prevent receiver overrun. If both the receiver and transmitter are incorrectly programmed for RTS control, RTS control is disabled for both. Transmitter RTS control is configured in UMR2n[TxRTS]. 0 The receiver has no effect on RTS. 1 When a valid start bit is received, RTS is negated if the UART's FIFO is full. RTS is reasserted when the FIFO has an empty position available. If RTS is controlled by the fill level of the receiver FIFO via UACRn[RTSL], this bit should be cleared. 6 RxIRQ/FF Receiver interrupt select. ULL 0 RxRDY is the source that generates IRQ. 1 FFULL is the source that generates IRQ. If more detail on the status of the FIFO is required, UISRn{RxFIFO] indicates a change in the FIFO status as programmed in URFn[RXS]. 5 ERR Error mode. Configures the FIFO status bits, USRn[RB,FE,PE]. 0 Character mode. The USRn values reflect the status of the character at the top of the FIFO. ERR must be 0 for correct A/D flag information when in multidrop mode. 1 Block mode. The USRn values are the logical OR of the status for all characters reaching the top of the FIFO because the last RESET ERROR STATUS command for the channel was issued. See Section16.3.5, “UART Command Registers (UCRn).” 4–3 PM Parity mode. Selects the parity or multidrop mode for the channel. The parity bit is added to the transmitted character, and the receiver performs a parity check on incoming data. The value of PM affects PT, as shown below. 2 PT Parity type. PM and PT together select parity type (PM = 0x) or determine whether a data or address character is transmitted (PM = 11). PM Parity Mode Parity Type (PT= 0) Parity Type (PT= 1) 00 With parity Even parity Odd parity 01 Force parity Low parity High parity 10 No parity n/a 11 Multidrop mode Data character Address character 1–0 B/C Bits per character. Select the number of data bits per character to be sent. The values shown do not include start, parity, or stop bits. 00 5 bits 01 6 bits 10 7 bits 11 8 bits MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-5

UART Modules 16.3.2 UART Mode Register 2 (UMR2n) UART mode registers 2 (UMR2n) control UART module configuration. UMR2n can be read or written when the mode register pointer points to it, which occurs after any access to UMR1n. UMR2n accesses do not update the pointer. 7 6 5 4 3 0 Field CM TxRTS TxCTS SB Reset 0000_0000 R/W R/W Address MBAR + 0x100, 0x140. After UMR1n is read or written, the pointer points to UMR2n. Figure16-3. UART Mode Register 2 (UMR2n) Table 16-3 describes UMR2n fields. Table16-3. UMR2n Field Descriptions Bits Name Description 7–6 CM Channel mode. Selects a channel mode. Section16.5.3, “Looping Modes,” describes individual modes. 00 Normal 01 Automatic echo 10 Local loop-back 11 Remote loop-back 5 TxRTS Transmitter ready-to-send. Controls negation of RTS to automatically terminate a message transmission when the transmitter is disabled after completion of a transmission. Attempting to program a receiver and transmitter in the same channel for RTS control is not permitted and disables RTS control for both. 0 The transmitter has no effect on RTS. 1 When the transmitter is disabled after transmission completes, setting this bit automatically clears UOP[RTS] one bit time after any characters in the channel transmitter shift and holding registers are completely sent, including the programmed number of stop bits. 4 TxCTS Transmitter clear-to-send. If both TxCTS and TxRTS are enabled, TxCTS controls the operation of the transmitter. 0 CTS has no effect on the transmitter. 1 Enables clear-to-send operation. The transmitter checks the state of CTS each time it is ready to send a character. If CTS is asserted, the character is sent; if it is negated, the channel TxD remains in the high state and transmission is delayed until CTS is asserted. Changes in CTS as a character is being sent do not affect its transmission. 3–0 SB Stop-bit length control. Selects the length of the stop bit appended to the transmitted character. Stop-bit lengths of 9/16th to 2 bits are programmable for 6–8 bit characters. Lengths of 1 1/16th to 2 bits are programmable for 5-bit characters. In all cases, the receiver checks only for a high condition at the center of the first stop-bit position, that is, one bit time after the last data bit or after the parity bit, if parity is enabled. If an external 1x clock is used for the transmitter, clearing bit 3 selects one stop bit and setting bit 3 selects 2 stop bits for transmission. SB 5 Bits 6–8 Bits SB 5 Bits 6–8 Bits SB 5–8 Bits SB 5–8 Bits 0000 1.063 0.563 0100 1.313 0.813 1000 1.563 1100 1.813 0001 1.125 0.625 0101 1.375 0.875 1001 1.625 1101 1.875 0010 1.188 0.688 0110 1.438 0.938 1010 1.688 1110 1.938 0011 1.250 0.750 0111 1.500 1.000 1011 1.750 1111 2.000 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-6 Freescale Semiconductor

UART Modules 16.3.3 UART Status Registers (USRn) The USRn, Figure 16-4, shows status of the transmitter, the receiver, and the FIFO. 7 6 5 4 3 2 1 0 Field RB FE PE OE TxEMP TxRDY FFULL RxRDY Reset 0000_0000 R/W Read only Address MBAR + 0x104 (USR0), 0x144 (USR1) Figure16-4. UART Status Registers (USRn) Table 16-4 describes USRn fields. Table16-4. USRn Field Descriptions Bits Name Description 7 RB Received break. The received break circuit detects breaks that originate in the middle of a received character. However, a break in the middle of a character must persist until the end of the next detected character time. 0 No break was received. 1 An all-zero character of the programmed length was received without a stop bit. RB is valid only when RxRDY = 1. Only a single FIFO position is occupied when a break is received. Further entries to the FIFO are inhibited until RxD returns to the high state for at least one-half bit time, which is equal to two successive edges of the UART clock. 6 FE Framing error. 0 No framing error occurred. 1 No stop bit was detected when the corresponding data character in the FIFO was received. The stop-bit check occurs in the middle of the first stop-bit position. FE is valid only when RxRDY = 1. 5 PE Parity error. Valid only if RxRDY = 1. 0 No parity error occurred. 1 If UMR1n[PM] = 0x (with parity or force parity), the corresponding character in the FIFO was received with incorrect parity. If UMR1n[PM] = 11 (multidrop), PE stores the received A/D bit. 4 OE Overrun error. Indicates whether an overrun occurs. 0 No overrun occurred. 1 One or more characters in the received data stream have been lost. OE is set upon receipt of a new character when the FIFO is full and a character is already in the shift register waiting for an empty FIFO position. When this occurs, the character in the receiver shift register and its break detect, framing error status, and parity error, if any, are lost. OE is cleared by the RESET ERROR STATUS command in UCRn. 3 TxEMP Transmitter empty. 0 The transmitter buffer is not empty. Either a character is being shifted out, or the transmitter is disabled. The transmitter is enabled/disabled by programming UCRn[TC]. 1 The transmitter has underrun (both the transmitter holding register and transmitter shift registers are empty). This bit is set after transmission of the last stop bit of a character if there are no characters in the transmitter holding register awaiting transmission. 2 TxRDY Transmitter ready. 0 The CPU loaded the transmitter holding register or the transmitter is disabled. 1 The transmitter holding register is empty and ready for a character. TxRDY is set when a character is sent to the transmitter shift register and when the transmitter is first enabled. If the transmitter is disabled, characters loaded into the transmitter holding register are not sent. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-7

UART Modules Table16-4. USRn Field Descriptions (continued) Bits Name Description 1 FFULL FIFO full. This bit is equivalent to URF[FULL]. 0 The FIFO is not full but may hold unread characters. 1 A character was received and the receiver FIFO is now full. Any characters received when the FIFO is full are lost. 0 RxRDY Receiver ready 0 The CPU has read the receiver buffer and no characters remain in the FIFO after this read. 1 One or more characters were received and are waiting in the receiver buffer FIFO. 16.3.4 UART Clock-Select Registers (UCSRn) The UART clock-select registers (UCSRn) select an external clock on the URT_CLK input (divided by 1 or 16) or a prescaled CLKIN as the clocking source for the transmitter and receiver. See Section16.5.1, “Transmitter/Receiver Clock Source.” The transmitter and receiver can use different clock sources. To use CLKIN for both, set UCSRn to 0xDD. 7 4 3 0 Field RCS TCS Reset 0000_0000 R/W Write only Address MBAR + 0x104 (UCSR0), 0x144 (UCSR1) Figure16-5. UART Clock-Select Registers (UCSRn) Table 16-5 describes UCSRn fields. Table16-5. UCSRn Field Descriptions Bits Name Description 7–4 RCS Receiver clock select. Selects the clock source for the receiver channel. 1101 Prescaled CLKIN 1110 URT_CLK divided by 16 1111 URT_CLK 3–0 TCS Transmitter clock select. Selects the clock source for the transmitter channel. 1101 Prescaled CLKIN 1110 URT_CLK divided by 16 1111 URT_CLK MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-8 Freescale Semiconductor

UART Modules 16.3.5 UART Command Registers (UCRn) The UART command registers (UCRn), Figure16-6, supply commands to the UART. Only multiple commands that do not conflict can be specified in a single write to a UCRn. For example, RESET TRANSMITTER and ENABLE TRANSMITTER cannot be specified in one write. 7 6 4 3 2 1 0 Field ENAB MISC TC RC Reset 0000_0000 R/W Write only Address MBAR + 0x108, 0x148 Figure16-6. UART Command Registers (UCRn) Table 16-6 describes UCRn fields and commands. Examples in Section16.5.2, “Transmitter and Receiver Operating Modes,” show how these commands are used. Table16-6. UCRn Field Descriptions Bits Value Command Description 7 ENAB — Enable autobaud 0 Autobaud disabled. 1 Autobaud enabled. The transmission rate is calculated from the first received character. If the rate must be recalculated, ENAB must first be cleared and reset. UISRn[ABC] indicates a transmission rate has been calculated and loaded into the UART divider registers. UDUn and UDULn must be initialized to 0x00 before enabling autobaud. 6–4 MISC Field (This field selects a single command.) 000 no command — 001 reset mode register Causes the mode register pointer to point to UMR1n. pointer 010 reset receiver Immediately disables the receiver, clears USRn[FFULL,RxRDY], and reinitializes the receiver FIFO pointer. No other registers are altered. Because it places the receiver in a known state, use this command instead of RECEIVER DISABLE when reconfiguring the receiver. 011 reset transmitter Disables the transmitter and clears USRn[TxEMP,TxRDY]. No other registers are altered. Because it places the transmitter in a known state, use this command instead of TRANSMITTER DISABLE when reconfiguring the transmitter. 100 reset error status Clears USRn[RB,FE,PE,OE]. Also used in block mode to clear all error bits after a data block is received. 101 reset break– change Clears the delta break bit, UISRn[DB]. interrupt 110 start break Forces TxD low. If the transmitter is empty, the break may be delayed up to one bit time. If the transmitter is active, the break starts when character transmission completes. The break is delayed until any character in the transmitter shift register is sent. Any character in the transmitter holding register is sent after the break. The transmitter must be enabled for the command to be accepted. This command ignores the state of CTS. 111 stop break Causes TxD to go high (mark) within two bit times. Any characters in the transmitter buffer are sent. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-9

UART Modules Table16-6. UCRn Field Descriptions (continued) Bits Value Command Description 3–2 TC Field (This field selects a single command) 00 no action taken Causes the transmitter to stay in its current mode: if the transmitter is enabled, it remains enabled; if the transmitter is disabled, it remains disabled. 01 transmitter enable Enables operation of the channel’s transmitter. USRn[TxEMP,TxRDY] are set. If the transmitter is already enabled, this command has no effect. 10 transmitter disable Terminates transmitter operation and clears USRn[TxEMP,TxRDY]. If a character is being sent when the transmitter is disabled, transmission completes before the transmitter becomes inactive. If the transmitter is already disabled, the command has no effect. 11 — Reserved, do not use. 1–0 RC (This field selects a single command) 00 no action taken Causes the receiver to stay in its current mode. If the receiver is enabled, it remains enabled; if disabled, it remains disabled. 01 receiver enable If the UART module is not in multidrop mode (UMR1n[PM] ¦ 11), RECEIVER ENABLE enables the channel's receiver and forces it into search-for-start-bit state. If the receiver is already enabled, this command has no effect. 10 receiver disable Disables the receiver immediately. Any character being received is lost. The command does not affect receiver status bits or other control registers. If the UART module is programmed for local loop-back or multidrop mode, the receiver operates even though this command is selected. If the receiver is already disabled, the command has no effect. 11 — Reserved, do not use. 16.3.6 UART Receiver Buffers (URBn) The receiver buffers contain one serial shift register and a 24-byte FIFO. RxD is connected to the serial shift register. The CPU reads from the top of the stack while the receiver shifts and updates from the bottom when the shift register is full (see Figure 16-24). RB contains the character in the receiver. 7 0 Field RB Reset 0000_0000 R/W Read only Address MBAR + 0x10C,0x14C Figure16-7. UART Receiver Buffer (URBn) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-10 Freescale Semiconductor

UART Modules 16.3.7 UART Transmitter Buffers (UTBn) The transmitter buffers consist of a 24-byte FIFO and the transmitter shift register. The FIFO accepts characters from the bus master if the channel’s USRn[TxRDY] is set. A write to the transmitter buffer clears TxRDY, inhibiting any more characters until the FIFO can accept more data. When the shift register is empty, it checks if the holding register has a valid character to be sent (TxRDY = 0). If there is a valid character, the shift register loads it and sets USRn[TxRDY] again. Writes to the transmitter buffer have no effect when the channel’s TxRDY = 0 and when the transmitter is disabled. Figure 16-8 shows UTBn. TB contains the character in the transmitter buffer. 7 0 Field TB Reset 0000_0000 R/W Write only Address MBAR + 0x10C,0x14C Figure16-8. UART Transmitter Buffers (UTBn) 16.3.8 UART Input Port Change Registers (UIPCRn) The input port change registers (UIPCRn), Figure 16-9, hold the current state and the change-of-state for CTS. 7 5 4 3 1 0 Field — COS 111 CTS Reset 0000_011 CTS R/W Read only Address MBAR + 0x110 (UIPCR0), 0x150 (UIPCR1) Figure16-9. UART Input Port Change Registers (UIPCRn) Table 16-7 describes UIPCRn fields. Table16-7. UIPCRn Field Descriptions Bits Name Description 7–5 — Reserved, should be cleared. 4 COS Change of state (high-to-low or low-to-high transition). 0 No change-of-state since the CPU last read UIPCRn. Reading UIPCRn clears UISRn[COS]. 1 A change-of-state longer than 25–50 μs occurred on the CTS input. UACRn can be programmed to generate an interrupt to the CPU when a change of state is detected. 3–1 — Reserved, should be cleared. 0 CTS Current state. Starting two serial clock periods after reset, CTS reflects the state of CTS. If CTS is detected asserted at that time, COS is set, which initiates an interrupt if UACRn[IEC] is enabled. 0 The current state of the CTS input is asserted. 1 The current state of the CTS input is negated. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-11

UART Modules 16.3.9 UART Auxiliary Control Registers (UACRn) The UART auxiliary control registers (UACRn), Figure 16-10, control the input enable as well as the RTS control based on the receiver FIFO level. 7 3 2 1 0 Field — RTSL IEC Reset 0000_0000 R/W Write only Address MBAR + 0x110 (UACR0), 0x150 (UACR1) Figure16-10. UART Auxiliary Control Registers (UACRn) Table 16-8 describes UACRn fields. Table16-8. UACRn Field Descriptions Bits Name Description 7–3 — Reserved, should be cleared. 2–1 RTSL RTS level. Determines when RTS is negated by the receiver relative to the fullness of the receiver FIFO. Note that RTS must first be manually asserted by a write to UOP0n. 00 FIFO level control disabled 01 Receiver FIFO Š 25% full 10 Receiver FIFO Š 50% full 11 Receiver FIFO Š 75% full Receiver overrun can be prevented by using the RTS output to control the CTS input of the transmitting device. Attempting to program a receiver and transmitter in the same channel for RTS control is not permitted and disables RTS control for both. 0 IEC Input enable control. 0 Setting the corresponding UIPCRn bit has no effect on UISRn[COS]. 1 UISRn[COS] is set and an interrupt is generated when the UIPCRn[COS] is set by an external transition on the CTS input (if UIMRn[COS] = 1). 16.3.10 UART Interrupt Status/Mask Registers (UISRn/UIMRn) The UART interrupt status registers (UISRn), Figure 16-11, provide status for all potential interrupt sources. UISRn contents are masked by UIMRn. If corresponding UISRn and UIMRn bits are set, the internal interrupt output is asserted. If a UIMRn bit is cleared, the state of the corresponding UISRn bit has no effect on the output. NOTE True status is provided in the UISRn regardless of UIMRn settings. UISRn is cleared when the UART module is reset. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-12 Freescale Semiconductor

UART Modules 7 6 3 2 1 0 Field COS ABC RXFIFO TXFIFO RXFTO DB FFULL/RxRDY TxRDY Reset 0000_0000 R/W Read only for status, write only for mask. Address MBAR + 0x114 (UISR0), 0x154 (UISR1); MBAR + 0x114 (UIMR0), 0x154 (UIMR1) Figure16-11. UART Interrupt Status/Mask Registers (UISRn/UIMRn) Table 16-9 describes UISRn and UIMRn fields. Table16-9. UISRn/UIMRn Field Descriptions Bits Name Description 7 COS Change-of-state. 0 UIPCRn[COS] is not selected. 1 Change-of-state occurred on CTS and was programmed in UACRn[IEC] to cause an interrupt. 6 ABC Autobaud calculation. 0 Autobaud is disabled or is waiting for the first receiver character. 1 The baud rate has been calculated and loaded into the clock source divider (UDUn and UDLn). After being set, this bit is cleared by writing to UCRn[ENAB]. 5 RxFIFO Receiver FIFO status. After being set, this bit is cleared by reading URBn. 0 FIFO status indication is disabled or the receiver status has not changed. 1 The receiver status has changed as programmed in URFn[RXS]. 4 TxFIFO Transmitter FIFO status. After being set, this bit is cleared by writing UTBn. 0 FIFO status indication is disabled or the transmitter status has not changed. 1 The transmitter status has changed as programmed in UTFn[TXS]. 3 RxFTO Receiver FIFO timeout. 0 No receiver FIFO timeout. This bit is cleared by reading all remaining data in the receiver FIFO, by receiving another character into the FIFO, or if the receiver is disabled. The count to timeout is restarted when RxFTO is cleared. 1 The receiver FIFO has timed out at 64 baud with unread data below the FIFO fullness level. 2 DB Delta break. 0 No new break-change condition to report. Section16.3.5, “UART Command Registers (UCRn),” describes the RESET BREAK-CHANGE INTERRUPT command. 1 The receiver detected the beginning or end of a received break. 1 FFULL/R RxRDY (receiver ready) if UMR1n[FFULL/RxRDY] = 0; FIFO full (FFULL) if UMR1n[FFULL/RxRDY] = 1. xRDY Duplicate of USRn[FFULL/RxRDY]. 0 TxRDY Transmitter ready. This bit is the duplication of USRn[TxRDY]. 0 The transmitter holding register was loaded by the CPU or the transmitter is disabled. Characters loaded into the transmitter holding register when TxRDY = 0 are not sent. 1 The transmitter holding register is empty and ready to be loaded with a character. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-13

UART Modules 16.3.11 UART Divider Upper/Lower Registers (UDUn/UDLn) The UDUn registers (formerly called UBG1n) hold the MSB, and the UDLn registers (formerly UBG2n) hold the LSB of the preload value. UDUn and UDLn concatenate to provide a divider to CLKIN for transmitter/receiver operation, as described in Section16.5.1.2.1, “CLKIN Baud Rates.” 7 0 Field Divider MSB Reset 0000_0000 R/W Write only Address MBAR + 0x118 (UDU0), 0x158 (UDU1) Figure16-12. UART Divider Upper Registers (UDUn) 7 0 Field Divider LSB Reset 0000_0000 R/W Write only Address MBAR + 0x11C (UDL0), 0x15C (UDL1) Figure16-13. UART Divider Lower Registers (UDLn) NOTE The minimum value that can be loaded on the concatenation of UDUn with UDLn is 0x0002. Both UDUn and UDLn are write-only and cannot be read by the CPU. 16.3.12 UART Autobaud Registers (UABUn/UABLn) The UABUn registers hold the MSB, and the UABLn registers hold the LSB of the calculated baud rate. If UCRn[ENAB] is set, the value in these registers is automatically loaded into UDUn and UDLn. 7 0 Field Autobaud MSB Reset 0000_0000 R/W Read only Address MBAR + 0x120 (UABU0), 0x160 (UABU1) Figure16-14. UART Autobaud Upper Registers (UABUn) 7 0 Field Autobaud LSB Reset 0000_0000 R/W Read only Address MBAR + 0x124 (UABL0), 0x164 (UABL1) Figure16-15. UART Autobaud Lower Registers (UABLn) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-14 Freescale Semiconductor

UART Modules 16.3.13 UART Transmitter FIFO Registers (UTFn) The UTFn registers contain control and status bits for the transmitter FIFO. Note that some bits are read-only. 7 6 5 4 0 Field TXS FULL TXB Reset 1100_0000 R/W R/W R R Address MBAR + 0x128 (UTF0), 0x168 (UTF1) Figure16-16. UART Transmitter FIFO Registers (UTFn) Table 16-10 describes UTFn fields. Table16-10. UTFn Field Descriptions Bits Name Description 7–6 TXS Transmitter status. When written to, these bits control the meaning of UISRn[TxFIFO]. 00 Inhibit transmitter FIFO status indication in UISRn. 01 Transmitter FIFO Š 25% empty 10 Transmitter FIFO Š 50% empty 11 Transmitter FIFO Š 75% empty When read, these bits indicate the emptiness level of the FIFO. 00 Transmitter FIFO < 25% empty 01 Transmitter FIFO Š 25% empty 10 Transmitter FIFO Š 50% empty 11 Transmitter FIFO Š 75% empty 5 FULL Transmitter FIFO full. 0 Transmitter FIFO is not full and can be loaded with a character. 1 Transmitter FIFO is full. Characters loaded into the transmitter FIFO when it is full are not transmitted. 4–0 TXB Transmitter buffer data level. Indicates the number of bytes, between 0 and 24, stored in the transmitter FIFO. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-15

UART Modules 16.3.14 UART Receiver FIFO Registers (URFn) The URFn registers contain control and status bits for the receiver FIFO. Note that some bits are read only. 7 6 5 4 0 Field RXS FULL RXB Reset 0000_0000 R/W R/W R R Address MBAR + 0x12C (URF0), 0x16C (URF1) Figure16-17. UART Receiver FIFO Registers (URFn) Table 16-11 describes URFn fields. Table16-11. URFn Field Descriptions Bits Name Description 7–6 RXS Receiver status. When written to, these bits control the meaning of UISRn[RxFIFO]. 00 Inhibit receiver FIFO status indication in UISRn. 01 Receiver FIFO Š 25% full 10 Receiver FIFO Š 50% full 11 Receiver FIFO Š 75% full When read, these bits indicate the emptiness level of the FIFO. 00 Receiver FIFO < 25% full 01 Receiver FIFO Š 25% full 10 Receiver FIFO Š 50% full 11 Receiver FIFO Š 75% full 5 FULL Receiver FIFO full. 0 Receiver FIFO is not full and can be loaded with a character. 1 Receiver FIFO is full. Characters loaded from the receiver when the FIFO is full are lost. This bit is identical to USRn[FFULL]. 4–0 RXB Receiver buffer data level. Indicates the number of bytes, between 0 and 24, stored in the receiver FIFO. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-16 Freescale Semiconductor

UART Modules 16.3.15 UART Fractional Precision Divider Control Registers (UFPDn) The UFPDn registers allow greater accuracy when deriving a transmitter/receiver clock source from CLKIN. The use of the UFPDn registers is optional; if the contents are left in the reset state, code written for other ColdFire devices containing UART modules will not be affected by the addition of these registers. The contents of these registers allow the frequency to be divided by a factor of up to 16. When autobaud is used, these registers are updated automatically to reflect the clock rate being used. Host software can write to these registers to make fine adjustments to the clock rate. See Section16.5.1.2, “Calculating Baud Rates,” for an example of UFPDn programming. 7 4 3 0 Field — FD Reset 0000_0000 R/W R/W Address MBAR + 0x130 (UFPD0), 0x170 (UFPD1) Figure16-18. UART Fractional Precision Divider Control Registers (UFPDn) Table 16-12 describes UFPDn fields. Table16-12. UFPDn Field Descriptions Bits Name Description 7–4 — Reserved, should be cleared. 3–0 FD Fractional divider. The value of these bits, from 0 to 15, determine the scale factor by which the clocking source for the transmitter and/or receiver is scaled. 16.3.16 UART Input Port Registers (UIPn) The UIP registers, Figure 16-19, show the current state of the CTS input. 7 1 0 Field — CTS Reset 1111_1111 R/W Read only Address MBAR + 0x134 (UIP0), 0x174 (UIP1) Figure16-19. UART Input Port Registers (UIPn) Table 16-13 describes UIPn fields. Table16-13. UIPn Field Descriptions Bits Name Description 7–1 — Reserved, should be cleared. 0 CTS CTS state.The CTS value is latched and reflects the state of the input pin when UIPn is read. Note: This bit has the same function and value as UIPCRn[RTS]. 0 The current state of the CTS input is logic 0. 1 The current state of the CTS input is logic 1. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-17

UART Modules 16.3.17 UART Output Port Command Registers (UOP1n/UOP0n) The RTS output can be asserted by writing a 1 to UOP1n[RTS] and negated by writing a 1 to UOP0n[RTS]. See Figure16-20. 7 1 0 Field — RTS Reset 0000_0000 R/W Write only Addr UART0: MBAR + 0x138 (UOP1), 0x13C (UOP0); UART1 0x178 (UOP1), 0x17C (UOP0) Figure16-20. UART Output Port Command Registers (UOP1/UOP0) Table 16-14 describes UOP1 and UOP0 fields. Table16-14. UOP1/UOP0 Field Descriptions Bits Name Description 7–1 — Reserved, should be cleared. 0 RTS Output port parallel output. Controls assertion (UOP1)/negation (UOP0) of RTS output. 0 Not affected. 1 Asserts RTS (UOP1). Negates RTS (UOP0). 16.4 UART Module Signal Definitions Figure 16-21 shows both the external and internal signal groups. CLKIN Clock Source or Generator External clock (URT_CLK) URT_RTS Output Port UART Module Internal Bus URT_CTS Input Port Control External Internal Interface Control 24-Character URT_RxD Signals Interface Address Bus Logic Receive Buffer to CPU Data 24-Character URT_TxD Transmit Buffer To Interrupt Controller IRQ (SIM) Figure16-21. UART Block Diagram Showing External and Internal Interface Signals MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-18 Freescale Semiconductor

UART Modules An internal interrupt request signal (IRQ) is provided to notify the interrupt controller of an interrupt condition. The output is the logical NOR of unmasked UISRn bits. The interrupt levels of the UART modules are programmed in SIM register ICR2. See Section7.2, “Interrupt Controller Registers.” Table 16-15 briefly describes the UART module signals. NOTE The terms ‘assertion’ and ‘negation’ are used to avoid confusion between active-low and active-high signals. ‘Asserted’ indicates that a signal is active, independent of the voltage level; ‘negated’ indicates that a signal is inactive. Table16-15. UART Module Signals Signal Description Transmitter Serial URT_TxD is held high (mark condition) when the transmitter is disabled, idle, or operating in the local Data Output loop-back mode. Data is shifted out on URT_TxD on the falling edge of the clock source, with the least (URT_TxD) significant bit (lsb) sent first. Receiver Serial Data Data received on URT_RxD is sampled on the rising edge of the clock source, with the lsb received first. Input (URT_RxD) Clear-to-Send This input can generate an interrupt on a change of state. (URT_CTS) Request-to-Send This output can be programmed to be negated or asserted automatically by either the receiver or the (URT_RTS) transmitter. It can control serial data flow when connected to a transmitter’s CTS. Clock (URT_CLK) The UART’s external clock source. It can be used in 1x or 16x mode. When both the transmitter and receiver use the timer as the clock source (UCR = 0xDD), the 16x clock is driven out on UARTCLK. If either the transmitter or receiver use an external clock (1x or 16x), URT_CLK is an input. Figure 16-22 shows a signal configuration for a UART/RS-232 interface. UART RS-232 Transceiver URT_RTS DI2 URT_CTS DO2 URT_TxD DI1 URT_RxD DO1 Figure16-22. UART/RS-232 Interface 16.5 Operation This section describes operation of the clock source generator, transmitter, and receiver. 16.5.1 Transmitter/Receiver Clock Source CLKIN serves as the basic timing reference for the clock source generator logic, which consists of a clock generator and a programmable 16+4-bit divider (UDU, UDL, UFPD) dedicated to the UART. The clock generator cannot produce standard baud rates if CLKIN is used, so the 16-bit divider should be used. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-19

UART Modules 16.5.1.1 Programmable Divider As Figure 16-23 shows, the UART transmitter and receiver can use the following clock sources: • An external clock signal on the URT_CLK pin that can be divided by 16. When not divided, URT_CLK provides a synchronous clock mode; when divided by 16, it is asynchronous. • CLKIN supplies an asynchronous clock source that is prescaled by 32 and then divided by the 16-bit value programmed in UDUn and UDLn. See Section16.3.11, “UART Divider Upper/Lower Registers (UDUn/UDLn).” The precision of this clock source can be tuned using the 4-bit value programmed in UFPDn. Note that when autobaud mode is enabled, the UFPDn, UDUn, and UDLn are automatically loaded with the calculated baud rate. However, the calculated value can be overridden by a programmed value at any time. The choice of URT_CLK or CLKIN is programmed in the UCSR. URT_CLK UART Clocking sources programmed in UCSR URT_TxD Tx Buffer x1 Prescaler Tx x16 Prescaler Rx 4-Bit 16-Bit Clock Divider Prescaler Generator (UFPD) (UDU, UDL) URT_RxD Rx Buffer 1-Bit Divider CLKIN Figure16-23. Clocking Source Diagram 16.5.1.2 Calculating Baud Rates The following sections describe how to calculate baud rates. 16.5.1.2.1 CLKIN Baud Rates When CLKIN is the UART clocking source, it goes through a divide-by-32 prescaler and then passes through the 16-bit divider of the concatenated UDUn and UDLn registers. The UFPD register can be used MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-20 Freescale Semiconductor

UART Modules to improve the accuracy of the clock source as shown in the following example using a 48 MHz CLKIN and 230kbs UART baud rate: 1. UART Divider= CLKIN / (16 x 2 x UART Baud Rate) = 48E06 / (32 x 230E03) = 6.52 = 6 (truncate to lowest whole number) UDU = 0x00, UDL = 0x06 2. The truncation has resulted in an effective 8.7% error (0.52/6) 3. Using the formula Fractional Divider = (truncated remainder * 16) = 0.52 * 16 = 8.32 = 8 (truncate to nearest whole number) UFPD = 0x08 4. This now gives an effective total error in the baud rate as: %Error = 100 x (Truncated remainder) / (16 x (UD + UFPD/16)] = 100 x 0.32 / (16 x (6 + 8/16)) = 32 / 104 = 0.31% 16.5.1.2.2 External Clock An external source clock (URT_CLK) can be used as is or divided by 16. Externalclockfrequency Baudrate = --------------------------------------------------------------------- 16or1 16.5.1.2.3 Autobaud Detection The UART can determine the clock rate of a received character stream from the timing of the received pattern. If UCRn[ENAB] is set, the autobaud detector searches for a low level on URT_RxD, indicating a start bit. Start-bit length is measured until URT_RxD returns to a high level, then the transmission rate is calculated and loaded into UDUn, UDLn, and UFPDn. The calculated transmission rate can be determined by reading UABUn and UABLn. Errors may occur in the calculation of high transmission rates due to distortion effects from the external drivers. If the calculated rate is inaccurate, UDUn, UDLn, and UFPDn must be written with the appropriate value as soon as possible to ensure that characters are properly received by the UART. The first character is always correctly captured, even though the transmission rate is not yet calculated. The first character must be an odd character such as ‘a’ or ‘A’ to ensure that it contains an isolated start bit. The parity mode can be determined by monitoring subsequent characters. The process for using the autobaud detector is as follows: • UDUn, UDLn, and UFPDn must be initialized to 0x00. • The receiver and transmitter clock sources must be set to TIMER (UCSR = 0xDD). • Autobaud must be enabled (UCR[ENAB] = 1). • The receiver must be enabled (UCR[RC] = 01). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-21

UART Modules Once enabled, the autobaud detector can calculate the transmission rate only once. If a new calculation is required, UCR[ENAB] must first be cleared and then set again. Thus, a new UART connection cannot be hot-plugged into an active UART connection if that connection is operating at a different rate without first reinitializing the autobaud detector. 16.5.2 Transmitter and Receiver Operating Modes Figure 16-24 is a functional block diagram of the transmitter and receiver showing the command and operating registers, which are described generally in the following sections and described in detail in Section16.3, “Register Descriptions.” UART UART Command Register (UCR0) W UART Mode Register 1 (UMR1) R/W UART Mode Register 2 (UMR2) R/W UART Status Register (USR0) R External UART Transmit Transmitter FIFO W Interface FIFO (UTB) (24 Bytes) Transmitter Shift Register TXD UART Receive Receiver FIFO R FIFO (URB) (24 Bytes) Receiver Shift Register RXD Figure16-24. Transmitter and Receiver Functional Diagram 16.5.2.1 Transmitting The transmitter is enabled through the UART command register (UCRn). When it is ready to accept a character, the UART sets USRn[TxRDY]. The transmitter converts parallel data from the CPU to a serial bit stream on TxD. It automatically sends a start bit followed by the programmed number of data bits, an optional parity bit, and the programmed number of stop bits. The lsb is sent first. Data is shifted from the transmitter output on the falling edge of the clock source. After the stop bits are sent, if no new character is in the transmitter holding register, the TxD output remains high (mark condition) and the transmitter empty bit, USRn[TxEMP], is set. Transmission resumes and TxEMP is cleared when the CPU loads a new character into the UART transmitter buffer (UTBn). If the transmitter receives a disable command, it continues until any character in the transmitter shift register is completely sent. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-22 Freescale Semiconductor

UART Modules If the transmitter is reset through a software command, operation stops immediately (see Section16.3.5, “UART Command Registers (UCRn)”). The transmitter is reenabled through the UCRn to resume operation after a disable or software reset. If the clear-to-send operation is enabled, CTS must be asserted for the character to be transmitted. If CTS is negated in the middle of a transmission, the character in the shift register is sent and TxD remains in mark state until CTS is reasserted. If the transmitter is forced to send a continuous low condition by issuing a START BREAK command, the transmitter ignores the state of CTS. If the transmitter is programmed to automatically negate RTS when a message transmission completes, RTS must be asserted manually before a message is sent. In applications in which the transmitter is disabled after transmission is complete and RTS is appropriately programmed, RTS is negated one bit time after the character in the shift register is completely transmitted. The transmitter must be manually reenabled by reasserting RTS before the next message is to be sent. The transmitter must be enabled prior to accepting a START BREAK command. If the transmitter is disabled while the BREAK is active, the BREAK is not terminated. The BREAK can only be terminated by using the STOP BREAK command. Figure 16-25 shows the functional timing information for the transmitter. C1 in transmission TxD C11 C2 C3 Break C4 C6 Transmitter Enabled USRn[TxRDY] internal module W2 W W W W W W W select C11 C2 C3 Start C4 Stop C5 C6 break break not transmitted CTS3 RTS4 Manually asserted Manually by BIT-SET command asserted 1 Cn = transmit characters 2 W = write 3 UMR2n[TxCTS] = 1 4 UMR2n[TxRTS] = 1 Figure16-25. Transmitter Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-23

UART Modules 16.5.2.2 Receiver The receiver is enabled through its UCRn, as described in Section16.3.5, “UART Command Registers (UCRn).” Figure16-26 shows receiver functional timing. RxD C1 C2 C3 C25 C26 C27 C28 C29 C26, C27, and C82 are lost Receiver Enabled USRn[RxRDY] USRn[FFULL] internal module select Status Status StatusStatus Data Data Data Data C26 (C1) is lost (C2) (C3) (C4) Overrun Reset by USRn[OE] command Manually asserted first time, Automatically asserted RTS4 automatically negated if overrun occurs when ready to receive UOP0[RTS] = 1 Figure16-26. Receiver Timing When the receiver detects a high-to-low (mark-to-space) transition of the start bit on RxD, the state of RxD is sampled each 16× clock for eight clocks, starting one-half clock after the transition (asynchronous operation) or at the next rising edge of the bit time clock (synchronous operation). If RxD is sampled high, the start bit is invalid and the search for the valid start bit begins again. If RxD is still low, a valid start bit is assumed and the receiver continues sampling the input at one-bit time intervals, at the theoretical center of the bit, until the proper number of data bits and parity, if any, is assembled and one stop bit is detected. Data on the RxD input is sampled on the rising edge of the programmed clock source. The lsb is received first. The data is then transferred to a receiver holding register and USRn[RxRDY] is set. If the character is less than eight bits, the most significant unused bits in the receiver holding register are cleared. After the stop bit is detected, the receiver immediately looks for the next start bit. However, if a non-zero character is received without a stop bit (framing error) and RxD remains low for one-half of the bit period after the stop bit is sampled, the receiver operates as if a new start bit were detected. Parity error, framing error, overrun error, and received break conditions set the respective PE, FE, OE, RB error, and break flags in the USRn at the received character boundary and are valid only if USRn[RxRDY] is set. If a break condition is detected (RxD is low for the entire character including the stop bit), a character of all zeros is loaded into the receiver holding register (RHR) and USRn[RB,RxRDY] are set. RxD must return to a high condition for at least one-half bit time before a search for the next start bit begins. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-24 Freescale Semiconductor

UART Modules The receiver detects the beginning of a break in the middle of a character if the break persists through the next character time. If the break begins in the middle of a character, the receiver places the damaged character in the Rx FIFO stack and sets the corresponding USRn error bits and USRn[RxRDY]. Then, if the break lasts until the next character time, the receiver places an all-zero character into the Rx FIFO and sets USRn[RB,RxRDY]. 16.5.2.3 Transmitter FIFO Whenever the CPU writes a character for transmission into UTB, the character is placed into the 24-byte transmitter FIFO. UTB fills the last spot in the FIFO and holds the last character to be transmitted. Visibility into the status of the FIFO is provided by various bits and interrupts, as shown in Table 16-16. Table16-16. Transmitter FIFO Status Bits Status Bit Indicated Condition Interrupt USR[TxEMP] = 1 The transmitter FIFO and shift register are empty and a data underrun occurred. USR[TxRDY] = 1 At least one FIFO stage is available for a character to be transmitted. If this bit is cleared, the Yes FIFO is full and a subsequent write to the FIFO will be ignored. USR[FFULL] = 1 The programmed level of emptiness (UTF[TXS]) has been reached. Yes UTF[TXS] Indicates the level of emptiness of the transmitter FIFO UTF[TXB] Indicates the number of characters, 0–24, in the transmitter FIFO 16.5.2.4 Receiver FIFO The FIFO stack is used in the UART’s receiver buffer logic. The FIFO is 24 bytes deep. The receive buffer consists of the FIFO and a receiver shift register connected to the RxD (see Figure 16-24). Data is assembled in the receiver shift register and loaded into the top empty receiver holding register position of the FIFO. Similar to the transmitter, several status bits and interrupts provide visibility into the status of the FIFO. In addition to the data byte, three status bits, parity error (PE), framing error (FE), and received break (RB), are appended to each data character in the FIFO; OE (overrun error) is not appended. By programming the ERR bit in the channel’s mode register (UMR1n), status is provided in character or block modes. USRn[RxRDY] is set when at least one character is available to be read by the CPU. A read of the receiver buffer produces an output of data from the top of the FIFO stack. After the read cycle, the data at the top of the FIFO stack and its associated status bits are popped and the receiver shift register can add new data at the bottom of the stack. The FIFO-full status bit (FFULL) is set if all 24 stack positions are filled with data. Either the RxRDY or FFULL bit can be selected to cause an interrupt. The two error modes are selected by UMR1n[ERR] as follows: • In character mode (UMR1n[ERR] = 0), status is given in the USRn for the character at the top of the FIFO. • In block mode, the USRn shows a logical OR of all characters reaching the top of the FIFO stack since the last RESET ERROR STATUS command. Status is updated as characters reach the top of the FIFO stack. Block mode offers a data-reception speed advantage where the software overhead of error-checking each character cannot be tolerated. However, errors are not detected until the check is performed at the end of an entire message—the faulting character in the block is not identified. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-25

UART Modules In either mode, reading the USRn does not affect the FIFO. The FIFO is popped only when the receive buffer is read. The USRn should be read before reading the receive buffer. If all 24 receiver holding registers are full, a new character is held in the receiver shift register until space is available. However, if a second new character is received, the character in the receiver shift register is lost, the FIFO is unaffected, and USRn[OE] is set when the receiver detects the start bit of the new overrunning character. Visibility into the status of the FIFO is provided by various bits and interrupts, as shown in Table 16-17. Table16-17. Receiver FIFO Status Bits Status Bit Indicated Condition Interrupt USR[FFULL] = 1 All FIFO positions contain data Yes USR[RxRDY] = 1 At least one character is available to be read by the CPU. Yes USR[RxFIFO] = 1 The programmed level of fullness (UTF[RXS]) has been reached. Yes USR[RxFTO] = 1 The receiver FIFO holds unread data, and the FIFO status Yes has not changed in at least 64 receiver clocks. URF[RXS] Indicates the level of fullness of the receiver FIFO URF[RXB] Indicates the number of characters, 0–24, in the receiver FIFO. To support flow control, the receiver can be programmed to automatically negate and assert RTS, in which case the receiver automatically negates RTS when a valid start bit is detected and the FIFO stack is full. The receiver asserts RTS when a FIFO position becomes available; therefore, overrun errors can be prevented by connecting RTS to the CTS input of the transmitting device. NOTE The receiver can still read characters in the FIFO stack if the receiver is disabled. If the receiver is reset, the FIFO stack, RTS control, all receiver status bits, and interrupt requests are reset. No more characters are received until the receiver is reenabled. 16.5.3 Looping Modes The UART can be configured to operate in various looping modes as shown in Figure 16-26. These modes are useful for local and remote system diagnostic functions and are described in the following paragraphs and in Section16.3, “Register Descriptions.” The UART’s transmitter and receiver should be disabled when switching between modes, as the selected mode is activated immediately upon mode selection, regardless of whether a character is being received or transmitted. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-26 Freescale Semiconductor

UART Modules 16.5.3.1 Automatic Echo Mode In automatic echo mode, shown in Figure 16-27, the UART automatically resends received data bit by bit. The local CPU-to-receiver communication continues normally, but the CPU-to-transmitter link is disabled. In this mode, received data is clocked on the receiver clock and resent on TxD. The receiver must be enabled, but the transmitter need not be. Rx RxD Input CPU Disabled Tx Disabled TxD Input Figure16-27. Automatic Echo Because the transmitter is inactive, USRn[TxEMP,TxRDY] are inactive and data is sent as it is received. Received parity is checked but is not recalculated for transmission. Character framing is also checked, but stop bits are sent as they are received. A received break is echoed as received until the next valid start bit is detected. Autobaud operation does not affect automatic echo mode; that is, the first character received is correctly echoed back. 16.5.3.2 Local Loop-Back Mode Figure 16-28 shows how TxD and RxD are internally connected in local loop-back mode. This mode is for testing the operation of a local UART module channel by sending data to the transmitter and checking data assembled by the receiver to ensure proper operations. Disabled Rx RxD Input CPU Tx Disabled TxD Input Figure16-28. Local Loop-Back Features of this local loop-back mode are as follows: • Transmitter and CPU-to-receiver communications continue normally in this mode. • RxD input data is ignored • TxD is held marking • The receiver is clocked by the transmitter clock. The transmitter must be enabled, but the receiver need not be. 16.5.3.3 Remote Loop-Back Mode In remote loop-back mode, shown in Figure 16-29, the channel automatically transmits received data bit by bit on the TxD output. The local CPU-to-transmitter link is disabled. This mode is useful in testing receiver and transmitter operation of a remote channel. For this mode, the transmitter uses the receiver clock. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-27

UART Modules Because the receiver is not active, received data cannot be read by the CPU and error status conditions are inactive. Received parity is not checked and is not recalculated for transmission. Stop bits are sent as they are received. A received break is echoed as received until the next valid start bit is detected. Disabled Disabled Rx RxD Input CPU Disabled Tx Disabled TxD Input Figure16-29. Remote Loop-Back 16.5.4 Multidrop Mode Setting UMR1n[PM] programs the UART to operate in a wake-up mode for multidrop or multiprocessor applications. In this mode, a master can transmit an address character followed by a block of data characters targeted for one of up to 256 slave stations. Although slave stations have their channel receivers disabled, they continuously monitor the master’s data stream. When the master sends an address character, the slave receiver channel notifies its respective CPU by setting USRn[RxRDY] and generating an interrupt (if programmed to do so). Each slave station CPU then compares the received address to its station address and enables its receiver if it wishes to receive the subsequent data characters or block of data from the master station. Slave stations not addressed continue monitoring the data stream. Data fields in the data stream are separated by an address character. After a slave receives a block of data, its CPU disables the receiver and repeats the process.Functional timing information for multidrop mode is shown in Figure 16-30. A character sent from the master station consists of a start bit, a programmed number of data bits, an address/data (A/D) bit flag, and a programmed number of stop bits. A/D = 1 indicates an address character; A/D = 0 indicates a data character. The polarity of A/D is selected through UMR1n[PT]. UMR1n should be programmed before enabling the transmitter and loading the corresponding data bits into the transmit buffer. In multidrop mode, the receiver continuously monitors the received data stream, regardless of whether it is enabled or disabled. If the receiver is disabled, it sets the RxRDY bit and loads the character into the receiver holding register FIFO stack provided the received A/D bit is a one (address tag). The character is discarded if the received A/D bit is zero (data tag). If the receiver is enabled, all received characters are transferred to the CPU through the receiver holding register stack during read operations. In either case, the data bits are loaded into the data portion of the stack while the A/D bit is loaded into the status portion of the stack normally used for a parity error (USRn[PE]). Detection of breaks and framing or overrun errors operates normally. The A/D bit replaces the parity bit, so parity is neither calculated nor checked. Messages in this mode may still contain error detection and correction information. If 8-bit characters are not required, software can be used to calculate parity and append it to the 5-, 6-, or 7-bit character. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-28 Freescale Semiconductor

UART Modules Master Station A/D A/D A/D TxD ADD11 C0 ADD21 Transmitter Enabled USRn[TxRDY] internal module select UMR1n[PM] = 11 ADD 1 C0 ADD 2 UMR1n[PT] = 1 UMR1n[PT] = 0 UMR1n[PT] = 2 Peripheral Station A/D A/D A/D A/D A/D RxD 0 ADD11 C0 ADD21 0 Receiver Enabled USRn[RxRDY] internal module select UMR1n[PM] = 11 ADD 1 Status Data Status Data UMR1n[PM] = 11 (C0) (ADD 2) Figure16-30. Multidrop Mode Timing Diagram 16.5.5 Bus Operation This section describes bus operation during read, write, and interrupt acknowledge cycles to the UART module. 16.5.5.1 Read Cycles The UART module responds to reads with byte data. Reserved registers return zeros. 16.5.5.2 Write Cycles The UART module accepts write data as bytes. Write cycles to read-only or reserved registers complete normally without exception processing, but data is ignored. 16.5.5.3 Interrupt Acknowledge Cycles An internal interrupt request signal notifies the interrupt controller of any unmasked interrupt conditions. The interrupt priority level is programmed in ICR2. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-29

UART Modules 16.5.6 Programming The software flowchart, Figure 16-31, consists of the following: • UART module initialization—These routines consist of SINIT and CHCHK (sheets 1 and 2). Before SINIT is called at system initialization, the calling routine allocates 2 words on the system stack. On return to the calling routine, SINIT passes UART status data on the stack. If SINIT finds no errors, the transmitter and receiver are enabled. SINIT calls CHCHK to perform the checks. When called, SINIT places the UART in local loop-back mode and checks for the following errors: — Transmitter never ready — Receiver never ready — Parity error — Incorrect character received • I/O driver routine—This routine (sheets 4 and 5) consists of INCH, the terminal input character routine which gets a character from the receiver, and OUTCH, which sends a character to the transmitter. • Interrupt handling—Consists of SIRQ (sheet 4), which is executed after the UART module generates an interrupt caused by a change-in-break (beginning of a break). SIRQ then clears the interrupt source, waits for the next change-in-break interrupt (end of break), clears the interrupt source again, then returns from exception processing to the system monitor. 16.5.6.1 UART Module Initialization Sequence NOTE UART module registers can be accessed by word or byte operations, but only data byte D[7:0] is valid. Figure 16-31 shows the UART module initialization sequence. Figure16-31. UART Mode Programming Flowchart (Sheet 1 of 5) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-30 Freescale Semiconductor

UART Modules Figure 16-31. UART Mode Programming Flowchart (Sheet 2 of 5) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-31

UART Modules Figure 16-31. UART Mode Programming Flowchart (Sheet 3 of 5) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-32 Freescale Semiconductor

UART Modules Figure 16-31. UART Mode Programming Flowchart (Sheet 4 of 5) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 16-33

UART Modules Figure 16-31. UART Mode Programming Flowchart (Sheet 5 of 5) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 16-34 Freescale Semiconductor

Chapter 17 General Purpose I/O Module This chapter describes the operation and programming model of the three general-purpose I/O (GPIO) ports on the MCF5272. It includes details about pin assignment, direction-control, and data registers. 17.1 Overview The MCF5272 provides up to 48 general-purpose I/O signals. The GPIO signal multiplexing is shown in Table 17-1. All GPIO pins are individually programmable as inputs or outputs. At reset, all configurable multifunction GPIO pins default to general purpose inputs and all multifunction pins that are not shared with a GPIO pin default to high impedance. To avoid indeterminate read values and reduce power consumption, internal pull-up resistors are active immediately upon reset, and remain active until the corresponding port direction registers are programmed. The general-purpose I/O signals are configured as three ports, each having up to 16 signals. These three general-purpose I/O ports are shared with other signals as follows: Table17-1. GPIO Signal Multiplexing GPIO Signal Also Multiplexed on the Same Pins PA[6:0] External USB transceiver interface signals PA7 QSPI_CS3 and DOUT3 PA[15:8] PLIC TDM ports 0 and 1 PB[7:0] UART1 signals and the bus control signal TA PB[15:8] Ethernet controller signals PC[15:0] Data bus signals D[15:0]. These are only available (as GPIO) when the device is configured for 16-bit data bus mode using the WSEL signal Control registers for each port select the function (GPIO or peripheral pin) assigned to each pin. Pins can have as many as four functions including GPIO. There is no configuration register for GPIO port C because its pins are configured by WSEL during device reset. An additional port, port D, has only a control register which is used to configure the pins that are not multiplexed with any GPIO signals. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 17-1

General Purpose I/O Module 17.2 Port Control Registers The port control registers are used to configure all pins that carry signals multiplexed from different on-chip modules. Each pin is configured with a two-bit field. Pin functions are referred to as function0b00–0b11. The function0 signals corresponding to GPIO ports A and B are immediately available after reset. Wherever a signal function includes a GPIO port bit, the function defaults to an input after a reset and can be read in the corresponding port data register. Pin functions are generally grouped logically. For example, all UART1 signals are multiplexed with port B and have the control register function code of 0b01. There is no port C control register. Port C is enabled when the 16-bit-wide external data bus mode is selected at reset by the input level on QSPI_DOUT/WSEL. The port D control register is used to configure pins that have multiple functions (0b01 through 0b11) but no GPIO function. CAUTION Do not attempt to program a pin function that is not defined. Where no function is defined, the function code is labeled ‘Reserved’ and is considered invalid. Programming any control register field with a reserved value has an unpredictable effect on the corresponding pin’s operation. Reserved function codes cannot be reliably read. Attempts to read them yield undetermined values. Table17-2. GPIO Port Register Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0080 Port A Control Register (PACNT) 0x0084 Port A Data Direction Register (PADDR) Reserved 0x0086 Reserved Port A Data Register (PADAT) 0x0088 Port B Control Register (PBCNT) 0x008C Port B Data Direction Register (PBDDR) Reserved 0x008E Reserved Port B Data Register (PBDAT) 0x0094 Port C Data Direction Register (PCDDR) Reserved 0x0096 Reserved Port C Data Register (PCDAT) 0x0098 Port D Control Register (PDCNT) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 17-2 Freescale Semiconductor

General Purpose I/O Module 17.2.1 Port A Control Register (PACNT) PACNT is used to configure pins that source signals multiplexed with GPIO port A. 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Field PACNT15 PACNT14 PACNT13 PACNT12 PACNT11 PACNT10 PACNT9 PACNT8 Reset 0000_0000_0000_0000 R/W Read/Write 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Field PACNT7 PACNT6 PACNT5 PACNT4 PACNT3 PACNT2 PACNT1 PACNT0 Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x0080 Figure17-1. Port A Control Register (PACNT) Table 17-3 describes PACNT fields. Table17-4 provides the same information organized by function. Table17-3. PACNT Field Descriptions Bits Name Description 31–30 PACNT15 Configure pin M3. If this pin is programmed to function as INT6, it is not available as a GPIO. 00 PA15 01 DGNT1 1x Reserved 29–28 PACNT14 Configure pin M2 00 PA14 01 DREQ1 1x Reserved 27–26 PACNT13 Configure pin L3 00 PA13 01 DFSC3 1x Reserved 25–24 PACNT12 Configure pin L2 00 PA12 01 DFSC2 1x Reserved 23–22 PACNT11 Configure pin L1 00 PA11 01 Reserved 10 QSPI_CS1 11 Reserved 21–20 PACNT10 Configure pin K5 00 PA10 01 DREQ0 1x Reserved 19–18 PACNT9 Configure pin J3 00 PA9 01 DGNT0 1x Reserved MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 17-3

General Purpose I/O Module Table17-3. PACNT Field Descriptions (continued) Bits Name Description (continued) 17–16 PACNT8 Configure pin J2 00 PA8 01 FSC0/FSR0 1x Reserved 15–14 PACNT7 Configure pin P1 00 PA7 01 QSPI_CS3 10 DOUT3 11 Reserved 13–12 PACNT6 Configure pin E1 00 PA6 01 USB_RxD 1x Reserved 11–10 PACNT5 Configure pin E2 00 PA5 01 USB_TxEN 1x Reserved 9–8 PACNT4 Configure pin E3 00 PA4 01 USB_Susp 1x Reserved 7–6 PACNT3 Configure pin E4 00 PA3 01 USB_TN 1x Reserved 5–4 PACNT2 Configure pin E5 00 PA2 01 USB_RN 1x Reserved 3–2 PACNT1 Configure pin D1 00 PA1 01 USB_RP 1x Reserved 1–0 PACNT0 Configure pin D2 00 PA0 01 USB_TP 1x Reserved INT6 is always available on pin M3. It can be enabled by programming the appropriate bits in interrupt control register 4, see Section7.2.2.4, “Interrupt Control Register 4 (ICR4), and the programmable interrupt transition register described in Section7.2.4, “Programmable Interrupt Transition Register (PITR). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 17-4 Freescale Semiconductor

General Purpose I/O Module Table17-4. Port A Control Register Function Bits PACNT[xx] = 00 PACNT[xx] = 01 PACNT[xx] = 10 PACNT[xx] = 11 Pin Number (Function 0b00) (Function 0b01) (Function 0b10) (Function 0b11) D2 PA0 USB_TP — — D1 PA1 USB_RP — — E5 PA2 USB_RN — — E4 PA3 USB_TN — — E3 PA4 USB_Susp — — E2 PA5 USB_TxEN — — E1 PA6 USB_RxD — — P1 PA7 QSPI_CS3 DOUT3 — J2 PA8 FSC0/FSR0 — — J3 PA9 DGNT0 — — K5 PA10 DREQ0 — — L1 PA11 Reserved QSPI_CS1 — L2 PA12 DFSC2 — — L3 PA13 DFSC3 — — M2 PA14 DREQ1 — — M3 PA15 DGNT11 — — 1 If this pin is programmed to function as INT6, it is not available as a GPIO. 17.2.2 Port B Control Register (PBCNT) PBCNT, shown in Figure17-2, is used to configure the pins assigned to signals that are multiplexed with GPIO port B. 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Field PBCNT15 PBCNT14 PBCNT13 PBCNT12 PBCNT11 PBCNT10 PBCNT9 PBCNT8 Reset 0000_0000_0000_0000 R/W Read/Write 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Field PBCNT7 PBCNT6 PBCNT5 PBCNT4 PBCNT3 PBCNT2 PBCNT1 PBCNT0 Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x0088 Figure17-2. Port B Control Register (PBCNT) Table 17-5 describes PBCNT fields. Table 17-6 provides the same information organized by function. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 17-5

General Purpose I/O Module Table17-5. PBCNT Field Descriptions Bits Name Description 31–30 PBCNT15 Configure pin P10 00 PB15 01 E_MDC 1x Reserved 29–28 PBCNT14 Configure pin L9 00 PB14 01 E_RxER 1x Reserved 27–26 PBCNT13 Configure pin M9 00 PB13 01 E_RxD1 1x Reserved 25–24 PBCNT12 Configure pin N9 00 PB12 01 E_RxD2 1x Reserved 23–22 PBCNT11 Configure pin P9 00 PB11 01 E_RxD3 10 Reserved 11 Reserved 21–20 PBCNT10 Configure pin L8 00 PB10 01 E_TxD1 1x Reserved 19–18 PBCNT9 Configure pin M8 00 PB9 01 E_TxD2 1x Reserved 17–16 PBCNT8 Configure pin N8 00 PB8 01 E_TxD3 1x Reserved 15–14 PBCNT7 Configure pin M6 00 PB7 01 TOUT0 1x Reserved 13–12 PBCNT6 Configure pin G4 00 PB6 01 Reserved 1x Reserved 11–10 PBCNT5 Configure pin F3 00 PB5 01 TA 1x Reserved MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 17-6 Freescale Semiconductor

General Purpose I/O Module Table17-5. PBCNT Field Descriptions (continued) Bits Name Description (continued) 9–8 PBCNT4 Configure pin G3 00 PB4 01 URT0_CLK 1x Reserved 7–6 PBCNT3 Configure pin H3 00 PB3 01 URT0_RTS 1x Reserved 5–4 PBCNT2 Configure pin H2 00 PB2 01 URT0_CTS 1x Reserved 3–2 PBCNT1 Configure pin H1. The signal URT0_RxD is always internally connected to TIN2. 00 PB1 01 URT0_RxD/TIN2 1x Reserved 1–0 PBCNT0 Configure pin H4 00 PB0 01 URT0_TxD 1x Reserved Table 17-6 provides the same information as Table 17-6, but organized by function instead of register field. Table17-6. Port B Control Register Function Bits PBCNTxx = 00 PBCNTxx = 01 PBCNTxx = 10 PBCNTxx = 11 Pin Number (Function 0b00) (Function 0b01) (Function 0b10) (Function 0b11) H4 PB0 URT0_TxD — — H1 PB1 URT0_RxD/TIN2 — — H2 PB2 URT0_CTS — — H3 PB3 URT0_RTS — — G3 PB4 URT0_CLK — — F3 PB5 TA — — G4 PB6 — — — M6 PB7 TOUT0 — — N8 PB8 E_TxD3 — — M8 PB9 E_TxD2 — — L8 PB10 E_TxD1 — — P9 PB11 E_RxD3 — — N9 PB12 E_RxD2 — — M9 PB13 E_RxD1 — — L9 PB14 E_RxER — — P10 PB15 E_MDC — — MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 17-7

General Purpose I/O Module 17.2.3 Port C Control Register There is no port C control register. Port C is enabled only when the external data bus is 16 bits wide. This is done by holding QSPI_DOUT/WSEL high during reset. When QSPI_DOUT/WSEL is low during reset, the external data bus is 32 bits wide and port C is unavailable. 17.2.4 Port D Control Register (PDCNT) PDCNT, shown in Table 17-8, is used to configure pins that have multiple functions but no associated GPIO capability. Port D has no data register nor data direction register. 31 16 Field — Reset — R/W — 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 Field PDCNT7 PDCNT6 PDCNT5 PDCNT4 PDCNT3 PDCNT2 PDCNT1 PDCNT0 Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x0098 Figure17-3. Port D Control Register (PDCNT) Table 17-7 describes PDCNT fields. Table 17-8 provides the same information organized by function. Table17-7. PDCNT Field Descriptions Bits Name Description 31–16 — Reserved 15–14 PDCNT7 Configure pin K6. 00 High impedance 01 PWM_OUT2 10 TIN1 11 Reserved 13–12 PDCNT6 Configure pin P5. 00 High impedance 01 PWM_OUT1 10 TOUT1 11 Reserved 11–10 PDCNT5 Configure pin P2. 00 High impedance 01 Reserved 10 DIN3 11 INT4 9–8 PDCNT4 Configure pin K1. 00 High impedance 01 DOUT0 10 URT1_TxD 11 Reserved MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 17-8 Freescale Semiconductor

General Purpose I/O Module Table17-7. PDCNT Field Descriptions (continued) Bits Name Description (continued) 7–6 PDCNT3 Configure pin K3. 00 High impedance 01 Reserved 10 URT1_RTS 11 INT5 5–4 PDCNT2 Configure pin K2. 00 High impedance 01 Reserved 10 URT1_CTS 11 QSPI_CS2 3–2 PDCNT1 Configure pin K1. The signal URT1_RxD is always internally connected to TIN3. 00 High impedance 01 DIN0 10 URT1_RxD/TIN3 11 Reserved 1–0 PDCNT0 Configure pin J4. 00 High impedance 01 DCL0 10 URT1_CLK 11 Reserved Table 17-8 provides the same information as Table17-7 but organized by function instead of register field. Table17-8. Port D Control Register Function Bits PDCNTxx = 00 PDCNTxx = 01 PDCNTxx = 10 PDCNTxx = 11 PIN Number (Function 0b00) (Function 0b01) (Function 0b10) (Function 0b11) J4 Pin is high Z DCL0 URT1_CLK — K1 Pin is high Z DIN0 URT1_RxD1/TIN3 — K2 Pin is high Z — URT1_CTS QSPI_CS2 K3 Pin is high Z — URT1_RTS INT5 K4 Pin is high Z DOUT0 URT1_TxD — P2 Pin is high Z — DIN3 INT4 P5 Pin is high Z PWM_OUT1 TOUT1 — K6 Pin is high Z PWM_OUT2 TIN0 — 8-15 — — — — 1 URT1_RxD is always internally connected to timer3 (TIN3). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 17-9

General Purpose I/O Module 17.3 Data Direction Registers These registers are used to program GPIO port signals as inputs or outputs. The data direction bit for any line is ignored unless that line is configured for general purpose I/O in the appropriate control register. If a GPIO line changes from an input to an output, the initial data on that pin is the last data written to the latch by the corresponding data register. At system reset, these register bits are all cleared, configuring all port I/O lines as general purpose inputs. Bootstrap software must write an appropriate value into the data direction register to configure GPIO port signals as outputs. When these registers are first written, any internal pullups on the corresponding I/O pins are disabled. A detailed description is provided only for data direction register A (PADDR). The control bits in all three registers operate in the same manner. 17.3.1 Port A Data Direction Register (PADDR) The PADDR determines the signal direction of each parallel port pin programmed as a GPIO port in the PACNT. 15 0 Field PADDR Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x0084 Figure17-4. Port A Data Direction Register (PADDR) Table17-9. PADDR Field Descriptions Bits Name Description 15–0 PADDR Data direction bits. Each data direction bit selects the direction of the signal as follows: 0 Signal is defined as an input. 1 Signal is defined as an output. 17.3.2 Port B Data Direction Register (PBDDR) The PBDDR determines the signal direction of each parallel port pin programmed as a GPIO port in the PBCNT. 15 0 Field PBDDR Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x008C Figure17-5. Port B Data Direction Register (PBDDR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 17-10 Freescale Semiconductor

General Purpose I/O Module 17.3.3 Port C Data Direction Register (PCDDR) The PCDDR determines the signal direction of each parallel port pin programmed as a GPIO port in the PCCNT. 15 0 Field PCDDR Reset 0000_0000_0000_0000 R/W Read/Write Addr MBAR + 0x0094 Figure17-6. Port C Data Direction Register (PCDDR) 17.4 Port Data Registers These 16-bit bidirectional registers are used to read or write the logic states of the GPIO lines. This register has no effect on pins not configured for general-purpose I/O. After a system reset, these register bits are all cleared. When any port lines are configured as outputs, a logic zero appears on those pins, unless the data register is written with an initial data value prior to setting the pin direction. The reset values given in the following register diagrams are the port output values written to the registers during reset, and do not reflect the value of a register read cycle. Register reads always return the instantaneous value of the corresponding pins. 17.4.1 Port Data Register (PxDAT) In the following description PxDAT refers to PADAT, PBDAT, or PCDAT. The PxDAT value for inputs corresponds to the logic level at the pin; for outputs, the value corresponds to the logic level driven onto the pin. Note that PxDAT has no effect on pins which have not been configured for GPIO. 15 0 Field PxDAT Reset Undefined R/W Read/Write Addr MBAR + 0x0086 (PADAT); 0x008E (PBDAT); 0x0096 (PCDAT) Figure17-7. Port x Data Register (PADAT, PBDAT, and PCDAT) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 17-11

General Purpose I/O Module MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 17-12 Freescale Semiconductor

Chapter 18 Pulse-Width Modulation (PWM) Module This chapter describes the configuration and operation of the pulse-width modulation (PWM) module. It includes a block diagram, programming model, and timing diagram. 18.1 Overview The PWM module shown in Figure18-1, generates a synchronous series of pulses having programmable duty cycle. With a suitable low-pass filter, the PWM can be used as a digital-to-analog converter. SYS CLOCK PWCR[CKSL] PRESCALER G. E R L O R T EN N COUNTER O C s u B nal FRC1 r e nt I PWM_OUT0 COMPARATOR GENERATOR PWM_OUT1 G. E PWM_OUT2 R H WIDTH BUFFER T D WI Figure18-1. PWM Block Diagram (3 Identical Modules) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 18-1

Pulse-Width Modulation (PWM) Module Summary of the main features include: • Double-buffered width register • Variable-divide prescale • Three independent PWM modules • Byte-wide width register provides programmable duty cycle control 18.2 PWM Operation The PWM is a simple free-running counter combined with a pulse-width register and a comparator such that the output is cleared whenever the counter value exceeds the width register value. When the counter overflows, or “wraps around,” its value becomes less than or equal to the value of the width register, and the output is set. With a suitable low-pass filter, the PWM can be used as a digital-to-analog converter. The width register is double-buffered so that a new value can be loaded for the next cycle without affecting the current cycle. At the beginning of each period, the value of the width buffer register is loaded into the width register, which feeds the comparator. This value is used for comparison during the next cycle. The prescaler contains a variable divider that can reduce the incoming clock frequency by certain values between 1 and 32768. 18.3 PWM Programming Model This section describes the registers and control bits in the PWM module. There are three independent PWM modules, each with its own control and width registers. The memory map for the PWM is shown in Table 18-1. Table18-1. PWM Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x00C0 PWM Control Register 0 Reserved (PWCR0) 0x00C4 PWM Control Register 1 Reserved (PWCR1) 0x00C8 PWM Control Register 2 Reserved (PWCR2) 0x00D0 PWM Pulse-Width Register 0 Reserved (PWWD0) 0x00D4 PWM Pulse-Width Register 1 Reserved (PWWD1) 0x00D8 PWM Pulse-Width Register 2 Reserved (PWWD2) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 18-2 Freescale Semiconductor

Pulse-Width Modulation (PWM) Module 18.3.1 PWM Control Register (PWCRn) This register, shown in Figure18-2, controls the overall operation of the PWM. Unless disabled and then re-enabled, writing to PWCR while the PWM is running will not alter its operation until the current output cycle finishes. For example, if the prescale value is changed while the PWM is enabled, the new value will not take effect until after the counter has “wrapped around”. The PWM must be disabled and then re-enabled to affect its operation before the end of the current output cycle. 7 6 5 4 3 0 Field EN FRC1 LVL — CKSEL Reset 0010_0000 R/W Read/Write Address MBAR + 0x0C0 (PWCR0); + 0x0C4 (PWCR1); + 0x0C8 (PWCR2) Figure18-2. PWM Control Registers (PWCRn) Table 18-2 gives PWCR field descriptions. Table18-2. PWCRn Field Descriptions Bits Name Description 7 EN Enable. 0 Disables the PWM. While disabled, the PWM is in low-power mode and the prescaler does not count. When the PWM is disabled, the output is forced to the value of PWCRn[LVL]. 1 Enables the PWM. 6 FRC1 Force output high. 0 Default reset value. PWM functions normally. 1 The PWM drives the output high for the entire counter period. PWCRn[FRC1] has a lower priority than PWCRn[EN], so setting PWCRn[FRC1] while PWCRn[EN] is cleared has no effect. There are two ways to drive the PWM output high. If PWCRn[EN] is cleared, PWM output immediately assumes the value of PWCRn[LVL]. If PWCRn[FRC1] is set while PWCRn[EN] is set, the PWM output does not go high until after the current output cycle completes. 5 LVL Disable level. Determines the PWM output level whenever the PWM is disabled. 0 The PWM output is low while disabled. 1 The PWM output is high while disabled. 4 — Reserved, should be cleared. 3–0 CKSL Prescale clock. These bits select the clock frequency divider, that is, the output of the divider chain, as shown below. CKSL[3:0] Divisor 0000 1 0001 2 0010 4 ...... 111132768 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 18-3

Pulse-Width Modulation (PWM) Module 18.3.2 PWM Width Register (PWWDn) This register, shown in Figure 18-3, controls the width of the output pulse. When the counter become greater than or equal to the value in this register, the output is cleared for the remainder of the period. When the counter overflows, or wraps around, the counter value becomes less than or equal to the value of the width register and the output is set high. Writing to the width register while the PWM is enabled will not alter the operation of the PWM until the end of the current output cycle. That is, the width value is not modified until after the counter has wrapped around. The PWM must be disabled and then re-enabled to affect its operation before the end of the current output cycle. 7 0 Field PW Reset 0000_0000 R/W R/W Address MBAR + 0x0D0 (PWWD0); + 0x0D4 (PWWD1); + 0x0D8 (PWWD2) Figure18-3. PWM Width Register (PWWDn) Table18-3. PWWDn Field Descriptions Bits Name Description 7–0 PW Pulse width. Range 0x00–0xFF. When the counter value become greater than PWWD[PW], the output is cleared for the remainder of the period. When the counter overflows, or wraps around, the counter value becomes less than or equal to PWWD[PW] and the output is set. Figure 18-4 shows example PWM waveforms and their dependence on PWWD[PW]. 256T PWWD[PW] = 0x00 255T PWWD[PW] = 0x01 T 128T PWWD[PW] = 0x80 128T T PWWD[PW] = 0xFF 255T PWCRn[FRC1] = 1 PWCRn[CKSL] = 0000: T = 1 x CPU clock period PWCRn[CKSL] = 1111: T = 32768 x CPU clock period Figure18-4. PWM Waveform Examples (PWCRn[EN] = 1) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 18-4 Freescale Semiconductor

Chapter 19 Signal Descriptions This chapter provides a listing and brief description of all the MCF5272 signals. It shows it shows which are inputs or outputs, how they are multiplexed, and the state of each signal at reset. The first listing is organized by function with signals appearing alphabetically within each functional group. This is followed by a second listing sorted by pin number. Some pins serve as many as four different functions. 19.1 MCF5272 Block Diagram with Signal Interfaces Figure 19-1 shows the MCF5272 block diagram and how the modules and signals interact. Refer also to Table 19-1 and Table 19-2 for a list of the signals sorted by function and pin number, respectively. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-1

Signal Descriptions INT[6:1] CLKIN HiZ DRESETEN S U B BYPASS RSTO RSTI M A R D S TDO/DSO EXT ND TMS/BKPT INTERRUPTS A[22:0]/SDA[13:0] A TTRCSKT/P/TDSDSTICC/DLLSKKI JBaTDnAdMG 16 KRBOYMTES 4 KRBAYMTES INCSATCRHUEC RTAIOMN DCR/[SW3[16::00]]/(D[31:16]/PC15:0) AL CPU MTMOD 1 KBYTE BS[3:0] N DDATA[3:0] R OE/RD E PST[3:0] T PB5/TA X TERFACE 10 BASE-T7 WIRE EEEEE_E_ER___T__RRTxxTCCCxxxxEODDDLLNVKK0L0 FAST KBUS TMKO SMWA BIRTUBCSH/ IENXTTEBERURFSNACALE TSRCSSEDDDAAACCCSS00SKLK/ECS7 EROL MII IN EE__TCxRERS CEOTNHTERRONLLEETR SSDDWBAE[1:0] CONT T PB8/E_TxD3 V2 ColdFire A10_PRECHG M E- PB9/E_TxD2 CPU DOUT0/URT1_TxD A AS PB10/E_TxD1 and MAC/DIV DIN0/URT1_RxD DR 0 B PPBB1112//EE__RRxxDD32 MBUS PLIC PA10_DREQ0 D S 10/10 PPBB1143//EE__RRxxEDR1 PORT 0 PDAC9L/0D/GUNRTT10_CLK TATE PB15/E_MDC UART1 PA8/FSC0/FSR0 CA E_MDIO URT1_RTS/INT5 DI URT1_CTS/QSPI_CS2 E PA[15:0] D PB[15:0] GPIO DOUT1 PC[15:0] DIN1 PB0/URT0_TXD PA14/DREQ1 PB1/URT0_RXD PA15_INT6/DGNT1_INT6 PB2/URT0_CTS UART0 PLIC DCL1/GDCL1_OUT PB3/URT0_RTS PORTS 1, 2, FSC1/FSR1/DFSC1 PB4/URT0_CLK and 3 PA12/DFSC2 QSPI_Dout/WSEL PA13/DFSC3 QSPI_Din PA7/QSPI_CS3/DOUT3 QSPI_CLK/BUSW1 SBUS DIN3/INT4 QSPI_CS0/BUSW0 QSPI PWM_OUT0 PA11/QSPI_CS1 PA7/QSPI_CS3/DOUT3 PWM PWM_OUT1/TOUT1 URT1_CTS/QSPI_CS2 PWM_OUT2/TIN1 TIMER/PIT USB WATCHDOG 1PNPNpND+–K 0 0 SB_WOR/INTPA0/USB_TPA3/USB_TPA1/USB_RPA2/USB_RPA4/USB_SusA5/USB_TXEPA6/USB_RXUSB_DUSB_DUSB_CL TIN PB7/TOUT U P NOTE: GPIO pins shown above are multiplexed with most other signals. Figure19-1. MCF5272 Block Diagram with Signal Interfaces MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-2 Freescale Semiconductor

Signal Descriptions 19.2 Signal List Table 19-1 summarizes the signals, showing default pin functions after system reset. General-purpose port signals all default to inputs after reset. Table 19-2 presents the same information sorted by pin number instead of signal function. NOTE: In this manual, the term ‘asserted’ indicates the active signal state; ‘negated’ indicates inactive. Names of active-low signals are given overbars, for example, INT1 and SDWE. Table19-1. Signal Descriptions Sorted by Function (Sheet 1 of 8) Configured Pin Functions Map Drive by Description BGA I/O Cpf (mA) (see notes)1 0 (Reset) 1 2 3 Pin A0 — — — A0 D10 O 6 30 A1 SDA0 — — A1/SDRAM-16bit A0 B12 O 6 30 A10 SDA9 SDA8 — A10/SDRAM-16bit D12 O 6 30 A9/SDRAM-32bit A8 A10_PRECHG — — — SDRAM A10_Precharge D14 O 10 30 A11 — SDA9 — A11/SDRAM-32bit A9 C11 O 6 30 A12 SDA11 – — A12/SDRAM-16bit A11 B11 O 6 30 A13 SDA12 SDA11 — A13/SDRAM-16bit A11 O 6 30 A12/SDRAM-32bit A11 A14 SDA13 SDA12 — A14/SDRAM-16bit C10 O 6 30 A13/SDRAM-32bit A12 A15 — — — A15 D9 O 6 30 A16 — — — A16 D8 O 6 30 A17 — — — A17 D7 O 6 30 A18 — — — A18 C6 O 6 30 A19 — — — A19 D6 O 6 30 A2 SDA1 SDA0 — A2/SDRAM-16bit A12 O 6 30 A1/SDRAM-32bit A0 A20 — — — A20 B5 O 6 30 A21 — — — A21 C5 O 6 30 A22 — — — A22 E9 O 6 30 A3 SDA2 SDA1 — A3/SDRAM-16bit A13 O 6 30 A2/SDRAM-32bit A1 A4 SDA3 SDA2 — A4/SDRAM-16bit A14 O 6 30 A3/SDRAM-32bit A2 A5 SDA4 SDA3 — A5/SDRAM-16bit B13 O 6 30 A4/SDRAM-32bit A3 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-3

Signal Descriptions Table19-1. Signal Descriptions Sorted by Function (Sheet 2 of 8) Configured Pin Functions Map Drive by Description BGA I/O Cpf (mA) (see notes)1 0 (Reset) 1 2 3 Pin A6 SDA5 SDA4 — A6/SDRAM-16bit B14 O 6 30 A5/SDRAM-32bit A4 A7 SDA6 SDA5 — A7/SDRAM-16bit C12 O 6 30 A6/SDRAM-32bit A5 A8 SDA7 SDA6 — A8/SDRAM-16bit C13 O 6 30 A7/SDRAM-32bit A6 A9 SDA8 SDA7 — A9/SDRAM-16bit C14 O 6 30 A8/SDRAM-32bit A7 BS0 — — — Byte strobe 0 A9 O 6 30 BS1 — — — Byte strobe 1 C8 O 6 30 BS2 — — — Byte strobe 2 E12 O 6 30 BS3 — — — Byte strobe 3 E13 O 6 30 CAS0 — — — SDRAM column select C9 O 10 30 strobe CLKIN — — — CPU external clock input M14 I BUSW[1:0]2 CS0/Boot — — — Chip select 0 K9 O 6 30 CS1 — — — Chip select 1 K10 O 6 30 CS2 — — — Chip select 2 P11 O 6 30 CS3 — — — Chip select 3 N11 O 6 30 CS4 — — — Chip select 4 M11 O 6 30 CS5 — — — Chip select 5 L11 O 6 30 CS6 — — — Chip select 6 P12 O 6 30 WSEL pin2 D0 PC0 — — D0/port C bit 0 L12 I/O 6 30 WSEL pin2 D1 PC1 — — D1/port C bit 1 L13 I/O 6 30 WSEL pin2 D10 PC10 — — D10/port C bit 10 H11 I/O 6 30 WSEL pin2 D11 PC11 — — D11/port C bit 11 G11 I/O 6 30 WSEL pin2 D12 PC12 — — D12/port C bit 12 F11 I/O 6 30 WSEL pin2 D13 PC13 — — D13/port C bit 13 E11 I/O 6 30 WSEL pin2 D14 PC14 — — D14/port C bit 14 D11 I/O 6 30 WSEL pin2 D15 PC15 — — D15/port C bit 15 E10 I/O 6 30 WSEL pin2 D16 D0 — — D16/D0 A5 I/O 6 30 WSEL pin2 D17 D1 — — D17/D1 B6 I/O 6 30 WSEL pin2 D18 D2 — — D18/D2 A6 I/O 6 30 WSEL pin2 D19 D3 — — D19/D3 C7 I/O 6 30 WSEL pin2 D2 PC2 — — D2/port C bit 2 L14 I/O 6 30 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-4 Freescale Semiconductor

Signal Descriptions Table19-1. Signal Descriptions Sorted by Function (Sheet 3 of 8) Configured Pin Functions Map Drive by Description BGA I/O Cpf (mA) (see notes)1 0 (Reset) 1 2 3 Pin WSEL pin2 D20 D4 — — D20/D4 B7 I/O 6 30 WSEL pin2 D21 D5 — — D21/D5 A7 I/O 6 30 WSEL pin2 D22 D6 — — D22/D6 A8 I/O 6 30 WSEL pin2 D23 D7 — — D23/D7 B8 I/O 6 30 WSEL pin2 D24 D8 — — D24/D8 F12 I/O 6 30 WSEL pin2 D25 D9 — — D25/D9 F13 I/O 6 30 WSEL pin2 D26 D10 — — D26/D10 F14 I/O 6 30 WSEL pin2 D27 D11 — — D27/D11 G12 I/O 6 30 WSEL pin2 D28 D12 — — D28/D12 G13 I/O 6 30 WSEL pin2 D29 D13 — — D29/D13 G14 I/O 6 30 WSEL pin2 D3 PC3 — — D3/port C bit 3 K11 I/O 6 30 WSEL pin2 D30 D14 — — D30/D14 H14 I/O 6 30 WSEL pin2 D31 D15 — — D31/D15 H13 I/O 6 30 WSEL pin2 D4 PC4 — — D4/port C bit 4 K12 I/O 6 30 WSEL pin2 D5 PC5 — — D5/port C bit 5 K13 I/O 6 30 WSEL pin2 D6 PC6 — — D6/port C bit 6 K14 I/O 6 30 WSEL pin2 D7 PC7 — — D7/port C bit 7 J11 I/O 6 30 WSEL pin2 D8 PC8 — — D8/port C bit 8 J12 I/O 6 30 WSEL pin2 D9 PC9 — — D9/port C bit 9 J13 I/O 6 30 HIZ — — — High impedance enable N14 I 30 DCL1/ — — — PLIC ports 1, 2, 3 data M1 I/O 4 30 GDCL1_OUT clock/Generated DCL out DDATA0 — — — Debug data 0 C3 O 4 30 DDATA1 — — — Debug data 1 A2 O 4 30 DDATA2 — — — Debug data 2 B2 O 4 30 DDATA3 — — — Debug data 3 A1 O 4 30 DIN1 — — — PLIC ports 1, 2, 3 data N2 I input DOUT1 — — — PLIC ports 1, 2, 3 data N1 O 2 30 output DRESETEN — — — DRAM controller reset N12 I enable E_COL — — — Collision P6 I E_CRS — — — Carrier sense (100 L10 I base-T Ethernet only) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-5

Signal Descriptions Table19-1. Signal Descriptions Sorted by Function (Sheet 4 of 8) Configured Pin Functions Map Drive by Description BGA I/O Cpf (mA) (see notes)1 0 (Reset) 1 2 3 Pin E_MDIO — — — Management channel N10 I/O 2 serial data (100 base-T only) E_RxCLK — — — Ethernet Rx clock N7 I E_RxD0 — — — Ethernet Rx data P7 I E_RxDV — — — Ethernet Rx data valid M7 I E_Tx CLK — — — Ethernet Tx clock L7 I E_TxD0 — — — Ethernet Tx data N6 O 4 30 E_TxEN — — — Ethernet Tx enable P8 O 2 30 E_TxER — — — Transmit error (100 M10 O 2 30 base-T Ethernet only) FSC1/FSR1/ — — — PLIC port 1 IDL FSR/GCI L4 I/O 2 30 DFSC1 FSC1/Generated frame sync 1 Out GND Ground — — E[7,8] F[7,8] G[6–9] H[6–9] J[7,8] Port D Cntl High Z DCL0 URT1_CLK — Port 0 data clock/UART1 J4 I Reg3 baud clock Port D Cntl High Z DIN0 URT1_RxD — IDL/GCI data in/UART1 K1 I Reg3 Rx data Port D Cntl High Z – URT1_ QSPI_ UART1 CTS/QSPI_CS2 K2 I/O 2 30 Reg3 CTS CS2 Port D Cntl High Z – URT1_RTS INT5 UART1 RTS/INT5 K3 I/O 2 30 Reg3 Port D Cntl High Z DOUT0 URT1_TxD — IDL-GCI data Out/UART1 K4 O 2 30 Reg3 Tx data Port D Cntl High Z – DIN3 INT4 Interrupt 4 input/PLIC P2 I Reg3 port 3 data input Port D Cntl High Z PWM_ TOUT1 — PWM output compare 1 P5 O 4 30 Reg3 OUT1 /Timer 1 output compare Port D Cntl High Z PWM_ TIN1 — PWM output compare 2 K6 I/O 4 30 Reg3 OUT2 /Timer 1 input INT1/ — — — Interrupt input 1/USB M4 I USB_WOR wake-on-ring INT2 — — — Interrupt input 1 P3 I INT3 — — — Interrupt input 3 N3 I MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-6 Freescale Semiconductor

Signal Descriptions Table19-1. Signal Descriptions Sorted by Function (Sheet 5 of 8) Configured Pin Functions Map Drive by Description BGA I/O Cpf (mA) (see notes)1 0 (Reset) 1 2 3 Pin MTMOD — — — 0 selects JTAG mode, 1 B3 I selects BDM mode OE/RD — — — Output enable/Read P13 O 4 30 Port A Cntl PA0 USB_TP — — Port A bit 0/ D2 I/O 2 30 Reg3 USB Tx positive Port A Cntl PA1 USB_RP — — Port A bit 1/ D1 I/O 2 30 Reg3 USB Rx positive Port A Cntl PA10 DREQ0 — — Port A bit 10/IDL DREQ0 K5 I/O 2 30 Reg3 Port A Cntl PA11 — QSPI_CS1 — Port A bit 11/QSPI chip L1 I/O 2 30 Reg3 select 1 Port A Cntl PA12 DFSC2 — — Port A bit 12/Delayed L2 I/O 2 30 Reg3 frame sync 2 Port A Cntl PA13 DFSC3 — — Port A bit 13/Delayed L3 I/O 2 30 Reg3 frame sync 3 Port A Cntl PA14 DREQ1 — — Port A bit 14/PLIC port 1 M2 I/O 4 30 Reg3 IDL D-channel request Port A Cntl PA15_INT6 DGNT1_INT6 — — Port A bit 15/PLIC port 1 M3 I/O 2 30 Reg3 D-channel grant/Interrupt 6 input Port A Cntl PA2 USB_RN — — Port A bit 2/ E5 I/O 2 30 Reg3 USB Rx negative Port A Cntl PA3 USB_TN — — Port A bit 3/ E4 I/O 2 30 Reg3 USB Tx negative Port A Cntl PA4 USB_ — — Port A bit 4/ E3 I/O 2 30 Reg3 Susp Suspend USB driver Port A Cntl PA5 USB_TxEN — — Port A bit 5/USB E2 I/O 2 30 Reg3 transmitter enable Port A Cntl PA6 USB_RxD — — Port A bit 6/USB receive E1 I/O 2 30 Reg3 data output Port A Cntl PA7 QSPI_CS3 DOUT3 — PA7/QSPI chip select P1 I/O 2 30 Reg3 4/PLIC port 3 data output Port A Cntl PA8 FSC0/ — — Port A bit 8/IDL FSR0 & J2 I/O 2 30 Reg3 FSR0 GCI FSC0 Port A Cntl PA9 DGNT0 — — Port A bit 9//IDL DGNT0 J3 I/O 2 30 Reg3 Port B Cntl PB0 URT0_TxD — — Port B bit 0/UART0 Tx H4 I/O 4 30 Reg3 data Port B Cntl PB1 URT0_RxD — — Port B bit 1/UART0 Rx H1 I/O 2 30 Reg3 data MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-7

Signal Descriptions Table19-1. Signal Descriptions Sorted by Function (Sheet 6 of 8) Configured Pin Functions Map Drive by Description BGA I/O Cpf (mA) (see notes)1 0 (Reset) 1 2 3 Pin Port B Cntl PB10 E_TxD1 — — Port B bit 10/Tx data bit 1 L8 I/O 4 30 Reg3 (100 Base-T Ethernet only) Port B Cntl PB11 E_RxD3 — — Port B bit 11/Rx data bit 3 P9 I/O 2 30 Reg3 (100 Base-T Ethernet only) Port B Cntl PB12 E_RxD2 — — Port B bit 12/Rx data bit 2 N9 I/O 2 30 Reg3 (100 Base-T Ethernet only) Port B Cntl PB13 E_RxD1 — — Port B bit 13/Rx data bit 1 M9 I/O 2 30 Reg3 (100 Base-T Ethernet only) Port B Cntl PB14 E_RxER — — Port B bit 14/Receive L9 I/O 2 30 Reg3 Error (100 Base-T Ethernet only) Port B Cntl PB15 E_MDC — — Port B bit 15/ P10 I/O 2 30 Reg3 Management Channel Clock (100 Base-T only) Port B Cntl PB2 URT0_ — — Port B bit 2/UART0 CTS H2 I/O 2 30 Reg3 CTS Port B Cntl PB3 URT0_ — — Port B bit 3/UART0 RTS H3 I/O 4 30 Reg3 RTS Port B Cntl PB4 URT0_CLK — — Port B bit 4/UART0 baud G3 I/O 2 30 Reg3 clock Port B Cntl PB5 TA — — Port B bit 5/Transfer F3 I/O 2 Reg3 acknowledge Port B Cntl PB6 — — — Port B bit 6 G4 I/O 2 30 Reg3 Port B Cntl PB7 TOUT0 — — Port B bit 7/Timer 0 M6 I/O 4 30 Reg3 output compare Port B Cntl PB8 E_TxD3 — — Port B bit 8/Tx data bit 3 N8 I/O 4 30 Reg3 (100 Base-T Ethernet only) Port B Cntl PB9 E_TxD2 — — Port B bit 9/Tx data bit 2 M8 I/O 4 30 Reg3 (100 Base-T Ethernet only) PST0 — — — Internal processor status B1 O 4 30 0 PST1 — — — Internal processor status C2 O 4 30 1 PST2 — — — Internal processor status C1 O 4 30 2 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-8 Freescale Semiconductor

Signal Descriptions Table19-1. Signal Descriptions Sorted by Function (Sheet 7 of 8) Configured Pin Functions Map Drive by Description BGA I/O Cpf (mA) (see notes)1 0 (Reset) 1 2 3 Pin PST3 — — — Internal processor status D3 O 4 30 3 PWM_OUT0 — — — PWM output compare 0 N5 O 4 30 QSPI_CLK/ — — — QSPI serial clock/CS0 L5 O 4 30 BUSW1 bus width bit 1 QSPI_CS0/ — — — QSPI peripheral chip M5 O 2 30 BUSW0 select 0/CS0 bus width bit 0 QSPI_Din — — — QSPI data input P4 I QSPI_Dout/ — — — QSPI data output/Bus N4 I/O 4 30 WSEL width selection R/W — — — Read/Write P14 O 10 30 RAS0 — — — SDRAM row select A10 O 10 30 strobe RSTI — — — Device reset M12 I RSTO — — — Reset output strobe F4 O 4 30 SDBA0 — — — SDRAM bank 0 select J14 O 10 30 SDBA1 — — — SDRAM bank 1 select H12 O 10 30 SDCLK — — — SDRAM (bus) clock, E14 O 10 30 Same frequency as CPU clock SDCLKE — — — SDRAM clock enable D13 O 10 30 SDCS/ — — — SDRAM chip select/CS7 B10 O 10 30 CS7 SDWE — — — SDRAM write enable B9 O 10 30 BYPASS — — — Bypass internal test M13 O 4 30 mode MTMOD4 TCK PSTCLK — — JTAG test clock in/ C4 I/O 4 30 BDM PSTCLK output MTMOD4 TDI DSI — — JTAG test data in/BDM A4 I data in MTMOD4 TDO DSO — — JTAG test data out D5 O 4 30 /BDM data out TEA — — — BDM debug transfer error A3 I acknowledge TEST — — — Device test mode enable E6 I TIN0 — — — Timer 0 input L6 I MTMOD4 TMS BKPT — — JTAG test mode/BDM B4 I select breakpoint input MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-9

Signal Descriptions Table19-1. Signal Descriptions Sorted by Function (Sheet 8 of 8) Configured Pin Functions Map Drive by Description BGA I/O Cpf (mA) (see notes)1 0 (Reset) 1 2 3 Pin MTMOD4 TRST DSCLK — — JTAG reset/BDM clock D4 I USB_CLK — — — USB external 48-MHz J1 I clock input USB_D+ — — — USB line driver high, F1 O – 30 analog5 USB_D– — — — USB line driver low, F2 O – 30 analog5 USB_GND — — — USB transceiver GND G2 I USB_VDD — — — USB transceiver VDD G1 I VDD +3.3V — — F[5,6] F[9,10] G[5,10] H[5,10] J[5,6] J[9,10] K[7,8] N13 1 No entry in this column means that after reset the pin is not reconfigurable and has only one definition. 2 WSEL, BUSW1, BUSW0, HIZ, and others, refers to function determined by pull-up or pull-down value as seen by these address pins during reset. 3 “Port x Cntl Reg” refers to pin function programmed by software writing to GPIO port configuration registers. 4 MTMOD means that pin function is determined by state of the MTMOD signal. 5 Requires external protection circuitry to meet USB 1.1 electrical requirements under all conditions (see 12.5.3, “Recommended USB Protection Circuit”). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-10 Freescale Semiconductor

Signal Descriptions Table 19-2 presents signal names, functions, and descriptions sorted by pin numbers. Table19-2. Signal Name and Description by Pin Number (Sheet 1 of 8) Map Pin Functions BGA Name Description I/O Pin 0 (Reset) 1 2 3 A1 DDATA3 — — — DDATA3 Debug data 3 O A2 DDATA1 — — — DDATA1 Debug data 1 O A3 TEA — — — TEA BDM debug transfer error I acknowledge A4 TDI DSI — — TDI/DSI JTAG test data in/BDM I data in A5 D16 D0 — — D16/D0 D16/D0 I/O A6 D18 D2 — — D18/D2 D18/D2 I/O A7 D21 D5 — — D21/D5 D21/D5 I/O A8 D22 D6 — — D22/D6 D22/D6 I/O A9 BS0 — — — BS0 Byte strobe 0 O A10 RAS0 — — — RAS0 SDRAM row select strobe O A11 A13 SDA12 SDA11 — A13/SDA12/SDA11 A13/SDRAM-16bit O A12/SDRAM-32bit A11 A12 A2 SDA1 SDA0 — A2/SDA1/SDA0 A2/SDRAM-16bit O A1/SDRAM-32bit A0 A13 A3 SDA2 SDA1 — A3/SDA2/SDA1 A3/SDRAM-16bit O A2/SDRAM-32bit A1 A14 A4 SDA3 SDA2 — A4/SDA3/SDA2 A4/SDRAM-16bit O A3/SDRAM-32bit A2 B1 PST0 — — — PST0 Internal processor status O 0 B2 DDATA2 — — — DDATA2 Debug data 2 O B3 MTMOD — — — MTMOD 0 selects JTAG mode, 1 I selects BDM mode B4 TMS BKPT — — TMS/BKPT JTAG test mode/BDM I select breakpoint input B5 A20 — — — A20 A20 O B6 D17 D1 — — D17/D1 D17/D1 I/O B7 D20 D4 — — D20/D4 D20/D4 I/O B8 D23 D7 — — D23/D7 D23/D7 I/O B9 SDWE — — — SDWE SDRAM write enable O B10 SDCS/ — — — SDCS / CS7 SDRAM chip select/CS7 O CS7 B11 A12 SDA11 — — A12/SDA11 A12/SDRAM-16bit A11 O MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-11

Signal Descriptions Table19-2. Signal Name and Description by Pin Number (Sheet 2 of 8) Map Pin Functions BGA Name Description I/O Pin 0 (Reset) 1 2 3 B12 A1 SDA0 — — A1/SDA0 A1/SDRAM-16bit A0 O B13 A5 SDA4 SDA3 — A5/SDA4/SDA3 A5/SDRAM-16bit O A4/SDRAM-32bit A3 B14 A6 SDA5 SDA4 — A6/SDA5/SDA4 A6/SDRAM-16bit O A5/SDRAM-32bit A4 C1 PST2 — — — PST2 Internal processor status O 2 C2 PST1 — — — PST1 Internal processor status O 1 C3 DDATA0 — — — DDATA0 Debug data 0 O C4 TCK PSTCLK — — TCK/PSTCLK JTAG test clock in/ I/O BDM PSTCLK output C5 A21 — — — A21 A21 O C6 A18 — — — A18 A18 O C7 D19 D3 — — D19/D3 D19/D3 I/O C8 BS1 — — — BS1 Byte strobe 1 O C9 CAS0 — — — CAS0 SDRAM column select O strobe C10 A14 SDA13 SDA12 — A14/SDA13/SDA12 A14/SDRAM-16bit O A13/SDRAM-32bit A12 C11 A11 — SDA9 — A11/SDA9 A11/SDRAM-32bit A9 O C12 A7 SDA6 SDA5 — A7/SDA6/SDA5 A7/SDRAM-16bit O A6/SDRAM-32bit A5 C13 A8 SDA7 SDA6 — A8/SDA7/SDA6 A8/SDRAM-16bit O A7/SDRAM-32bit A6 C14 A9 SDA8 SDA7 — A9/SDA8/SDA7 A9/SDRAM-16bit O A8/SDRAM-32bit A7 D1 PA1 USB_RP — — PA1/USB_RP Port A bit 1/ I/O USB Rx positive D2 PA0 USB_TP — — PA0/USB_TP Port A bit 0/ I/O USB Tx positive D3 PST3 — — — PST3 Internal processor O status 3 D4 TRST DSCLK — — TRST/DSCLK JTAG reset/BDM clock I D5 TDO DSO — — TDO/DSO JTAG test data out O /BDM data out D6 A19 — — — A19 A19 O D7 A17 — — — A17 A17 O MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-12 Freescale Semiconductor

Signal Descriptions Table19-2. Signal Name and Description by Pin Number (Sheet 3 of 8) Map Pin Functions BGA Name Description I/O Pin 0 (Reset) 1 2 3 D8 A16 — — — A16 A16 O D9 A15 — — — A15 A15 O D10 A0 — — — A0 A0 O D11 D14 PC14 — — D14/PC14 D14/port C bit 14 I/O D12 A10 SDA9 SDA8 — A10/SDA9/SDA8 A10/SDRAM-16bit O A9/SDRAM-32bit A8 D13 SDCLKE — — — SDCLKE SDRAM clock enable O D14 A10_PRECHG — — — A10_PRECHG SDRAM A10_Precharge O E1 PA6 USB_RxD — — PA6/USB_RxD Port A bit 6/USB receive I/O data output E2 PA5 USB_TxEN — — PA5/USB_TxEN Port A bit 5/USB I/O transmitter enable E3 PA4 USB_ — — PA4/USB_Susp Port A bit 4/ I/O Susp Suspend USB driver E4 PA3 USB_TN — — PA3/USB_TN Port A bit 3/ I/O USB Tx negative E5 PA2 USB_RN — — PA2/USB_RN Port A bit 2/ I/O USB Rx negative E6 TEST – — — TEST Device test mode enable I E7 GND Ground — — GND E8 GND Ground — — GND E9 A22 – — — A22 A22 O E10 D15 PC15 — — D15/PC15 D15/port C bit 15 I/O E11 D13 PC13 — — D13/PC13 D13/port C bit 13 I/O E12 BS2 — — — BS2 Byte strobe 2 O E13 BS3 — — — BS3 Byte strobe 3 O E14 SDCLK — — — SDCLK SDRAM (bus) clock, O Same frequency as CPU clock F1 USB_D+ — — — USB_D+ USB line driver high, O analog F2 USB_D- — — — USB_D- USB line driver low, O analog F3 PB5 TA — — PB5/TA Port B bit 5/Transfer I/O acknowledge F4 RSTO — — — RSTO Reset output strobe O F5 VDD +3.3V — — VDD MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-13

Signal Descriptions Table19-2. Signal Name and Description by Pin Number (Sheet 4 of 8) Map Pin Functions BGA Name Description I/O Pin 0 (Reset) 1 2 3 F6 VDD +3.3V — — VDD F7 GND Ground — — GND F8 GND Ground — — GND F9 VDD +3.3V — — VDD F10] VDD +3.3V — — VDD F11 D12 PC12 — — D12/PC12 D12/port C bit 12 I/O F12 D24 D8 — — D24/D8 D24/D8 I/O F13 D25 D9 — — D25/D9 D25/D9 I/O F14 D26 D10 — — D26/D10 D26/D10 I/O G1 USB_VDD — — — USB_VDD USB transceiver VDD I G2 USB_GND — — — USB_GND USB transceiver GND I G3 PB4 URT0_CLK — — PB4/URT0_CLK Port B bit 4/UART0 baud I/O clock G4 PB6 — — — PB6 Port B bit 6 I/O G5 VDD +3.3V — — VDD G6 GND Ground — — GND G7 GND Ground — — GND G8 GND Ground — — GND G9 GND Ground — — GND G10 VDD +3.3V — — VDD G11 D11 PC11 — — D11/PC11 D11/port C bit 11 I/O G12 D27 D11 — — D27/D11 D27/D11 I/O G13 D28 D12 — — D28/D12 D28/D12 I/O G14 D29 D13 — — D29/D13 D29/D13 I/O H1 PB1 URT0_RxD — — PB1/URT0_RxD Port B bit 1/UART0 Rx I/O data H2 PB2 URT0_ — — PB2/URT0_CTS Port B bit 2/UART0 CTS I/O CTS H3 PB3 URT0_ — — PB3/URT0_RTS Port B bit 3/UART0 RTS I/O RTS H4 PB0 URT0_TxD — — PB0/URT0_TxD Port B bit 0/UART0 Tx I/O data H5 VDD +3.3V — — VDD H6 GND Ground — — GND H7 GND Ground — — GND MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-14 Freescale Semiconductor

Signal Descriptions Table19-2. Signal Name and Description by Pin Number (Sheet 5 of 8) Map Pin Functions BGA Name Description I/O Pin 0 (Reset) 1 2 3 H8 GND Ground — — GND H9 GND Ground — — GND H10 VDD +3.3V — — VDD H11 D10 PC10 — — D10/PC10 D10/port C bit 10 I/O H12 SDBA1 — — — SDBA1 SDRAM bank 1 select O H13 D31 D15 — — D31/D15 D31/D15 I/O H14 D30 D14 — — D30/D14 D30/D14 I/O J1 USB_CLK — — — USB_CLK USB external 48-MHz I clock input J2 PA8 FSC0/ — — PA8/FSC0/FSR0 Port A bit 8/IDL FSR0 & I/O FSR0 GCI FSC0 J3 PA9 DGNT0 — — PA9/DGNT0 Port A bit 9//IDL DGNT0 I/O J4 High Z DCL0 URT1_CLK — DCL0/URT1_CLK Port 0 data clock/UART1 I baud clock J5 VDD +3.3V — — VDD J6 VDD +3.3V — — VDD J7 GND Ground — — GND J8 GND Ground — — GND J9 VDD +3.3V — — VDD J10 VDD +3.3V — — VDD J11 D7 PC7 — — D7/PC7 D7/port C bit 7 I/O J12 D8 PC8 — — D8/PC8 D8/port C bit 8 I/O J13 D9 PC9 — — D9/PC9 D9/port C bit 9 I/O J14 SDBA0 — — — SDBA0 SDRAM bank 0 select O K1 High Z DIN0 URT1_RxD — DIN0/URT1_RxD IDL/GCI data in/UART1 I Rx data K2 High Z — URT1_ QSPI_ URT1_CTS/QSPI_CS2 UART1 CTS/QSPI_CS2 I/O CTS CS2 K3 High Z — URT1_RTS INT5 URT1_RTS/INT5 UART1 RTS/INT5 I/O K4 High Z DOUT0 URT1_TxD — DOUT0/URT1_TxD IDL-GCI data Out/UART1 O Tx data K5 PA10 DREQ0 — — PA10/DREQ0 Port A bit 10/IDL DREQ0 I/O K6 High Z PWM_ TIN1 — PWM_OUT2/TIN1 PWM output compare 2 I/O OUT2 /Timer 1 input K7 VDD +3.3V — — VDD K8 VDD +3.3V — — VDD MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-15

Signal Descriptions Table19-2. Signal Name and Description by Pin Number (Sheet 6 of 8) Map Pin Functions BGA Name Description I/O Pin 0 (Reset) 1 2 3 K9 CS0/Boot — — — CS0/Boot Chip select 0 O K10 CS1 — — — CS1 Chip select 1 O K11 D3 PC3 — — D3/PC3 D3/port C bit 3 I/O K12 D4 PC4 — — D4/PC4 D4/port C bit 4 I/O K13 D5 PC5 — — D5/PC5 D5/port C bit 5 I/O K14 D6 PC6 — — D6/PC6 D6/port C bit 6 I/O L1 PA11 — QSPI_CS1 — PA11/QSPI_CS1 Port A bit 11/QSPI chip I/O select 1 L2 PA12 DFSC2 — — PA12/DFSC2 Port A bit 12/Delayed I/O frame sync 2 L3 PA13 DFSC3 — — PA13/DFSC3 Port A bit 13/Delayed I/O frame sync 3 L4 FSC1/FSR1/ — — — FSC1/FSR1/DFSC1 PLIC port 1 IDL FSR/GCI I/O DFSC1 FSC1/Generated frame sync 1 Out L5 QSPI_CLK/ — — — QSPI_CLK / BUSW1 QSPI serial clock/CS0 O BUSW1 bus width bit 1 L6 TIN0 — — — TIN0 Timer 0 input I L7 E_Tx CLK — — — E_Tx CLK Ethernet Tx clock I L8 PB10 E_TxD1 — — PB10/E_TxD1 Port B bit 10/Tx data bit 1 I/O (100 Base-T Ethernet only) L9 PB14 E_RxER — — PB14/E_RxER Port B bit 14/Receive I/O Error (100 Base-T Ethernet only) L10 E_CRS — — — E_CRS Carrier sense (100 I base-T Ethernet only) L11 CS5 — — — CS5 Chip select 5 O L12 D0 PC0 — — D0/PC0 D0/port C bit 0 I/O L13 D1 PC1 — — D1/PC1 D1/port C bit 1 I/O L14 D2 PC2 — — D2/PC2 D2/port C bit 2 I/O M1 DCL1/ — — — DCL1/GDCL1_OUT PLIC ports 1, 2, 3 data I/O GDCL1_OUT clock/Generated DCL out M2 PA14 DREQ1 — — PA14/DREQ1 Port A bit 14/PLIC port 1 I/O IDL D-channel request M3 PA15_INT6 DGNT1_INT6 — — PA15_INT6/DGNT1_INT6 Port A bit 15/PLIC port 1 I/O D-channel grant/Interrupt 6 input MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-16 Freescale Semiconductor

Signal Descriptions Table19-2. Signal Name and Description by Pin Number (Sheet 7 of 8) Map Pin Functions BGA Name Description I/O Pin 0 (Reset) 1 2 3 M4 INT1/ — — — INT1/ USB_WOR Interrupt input 1/USB I USB_WOR wake-on-ring M5 QSPI_CS0/ — — — QSPI_CS0 / BUSW0 QSPI peripheral chip O BUSW0 select 0/CS0 bus width bit 0 M6 PB7 TOUT0 — — PB7/TOUT0 Port B bit 7/Timer 0 I/O output compare M7 E_RxDV — — — E_RxDV Ethernet Rx data valid I M8 PB9 E_TxD2 — — PB9/E_TxD2 Port B bit 9/Tx data bit 2 I/O (100 Base-T Ethernet only) M9 PB13 E_RxD1 — — PB13/E_RxD1 Port B bit 13/Rx data bit 1 I/O (100 Base-T Ethernet only) M10 E_TxER — — — E_TxER Transmit error (100 O base-T Ethernet only) M11 CS4 — — — CS4 Chip select 4 O M12 RSTI — — — RSTI Device reset I M13 BYPASS — — — BYPASS Bypass internal test O mode M14 CLKIN — — — CLKIN CPU external clock input I N1 DOUT1 — — — DOUT1 PLIC ports 1, 2, 3 data O output N2 DIN1 — — — DIN1 PLIC ports 1, 2, 3 data I input N3 INT3 — — — INT3 Interrupt input 3 I N4 QSPI_Dout/ — — — QSPI_Dout / WSEL QSPI data output/Bus I/O WSEL width selection N5 PWM_OUT0 — — — PWM_OUT0 PWM output compare 0 O N6 E_TxD0 — — — E_TxD0 Ethernet Tx data O N7 E_RxCLK — — — E_RxCLK Ethernet Rx clock I N8 PB8 E_TxD3 — — PB8/E_TxD3 Port B bit 8/Tx data bit 3 I/O (100 Base-T Ethernet only) N9 PB12 E_RxD2 — — PB12/E_RxD2 Port B bit 12/Rx data bit 2 I/O (100 Base-T Ethernet only) N10 E_MDIO — — — E_MDIO Management channel I/O serial data (100 base-T only) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-17

Signal Descriptions Table19-2. Signal Name and Description by Pin Number (Sheet 8 of 8) Map Pin Functions BGA Name Description I/O Pin 0 (Reset) 1 2 3 N11 CS3 — — — CS3 Chip select 3 O N12 DRESETEN — — — DRESETEN DRAM controller reset I enable N13 VDD +3.3V — — N14 HIZ — — — HiZ High impedance enable I P1 PA7 QSPI_CS3 DOUT3 — PA7/QSPI_CS3/DOUT3 PA7/QSPI chip select I/O 4/PLIC port 3 data output P2 High Z — DIN3 INT4 DIN3/INT4 Interrupt 4 input/PLIC I port 3 data input P3 INT2 — — — INT2 Interrupt input 1 I P4 QSPI_Din — — — QSPI_Din QSPI data input I P5 High Z PWM_ TOUT1 — PWM_OUT1/TOUT1 PWM output compare 1 O OUT1 /Timer 1 output compare P6 E_COL — — — E_COL Collision I P7 E_RxD0 — — — E_RxD0 Ethernet Rx data I P8 E_TxEN — — — E_TxEN Ethernet Tx enable O P9 PB11 E_RxD3 — — PB11/E_RxD3 Port B bit 11/Rx data bit 3 I/O (100 Base-T Ethernet only) P10 PB15 E_MDC — — PB15/E_MDC Port B bit 15/ I/O Management Channel Clock (100 Base-T only) P11 CS2 — — — CS2 Chip select 2 O P12 CS6 — — — CS6/AEN Chip select 6 O P13 OE/RD — — — OE/RD Output enable/Read O P14 R/W — — — R/W Read/Write O MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-18 Freescale Semiconductor

Signal Descriptions 19.3 Address Bus (A[22:0]/SDA[13:0]) The 23 dedicated address signals, A[22:0], define the address of external byte, word, and longword accesses. These three-state outputs are the 23 lsbs of the internal 32-bit address bus and are multiplexed with the SDRAM controller row and column addresses (SDA[13:0]). Fourteen address signals are used for connecting to SDRAM devices as large as 256 Mbits. The MCF5272 supports SDRAM widths of 16 or 32 bits. For a 32-bit width, SDRAM address signals are multiplexed starting with A2. For a 16-bit width, address signals are multiplexed starting with A1. 19.4 Data Bus (D[31:0]) The 32-bit, three-state, bidirectional, non-multiplexed data bus transfers data to and from the MCF5272. A read or write operation can transfer 8, 16, or 32 bits in one bus cycle. When a 16-bit data bus is used, mode parallel port C pins can be multiplexed onto D[15:0]. Data read from or written to on-chip peripherals is visible on the external data bus when the device’s external bus width is 32 bits. When the device is configured for external 16-bit wide data bus and the data access is 32 bits wide, the lower 16 bits of on-chip data are not visible externally. On-chip cache, ROM, and SRAM accesses are not visible externally. 19.4.1 Dynamic Data Bus Sizing When the device is in normal mode, dynamic bus sizing lets the programmer change data bus width between 8, 32, and 16 bits for each chip select. The initial width for the bootstrap program chip select, CS0, is determined by the state of BUSW[1:0]. The program should select bus widths for the other chip selects before accessing the associated memory space. 19.5 Chip Selects (CS7/SDCS, CS[6:0]) The eight chip selects, CS[7:0], allow the MCF5272 to interface directly to SRAM, EPROM, EEPROM, and external memory-mapped peripherals. These signals can be programmed for an address location, with masking capabilities, port size, burst capability indication, and wait-state generation. CS0 provides a special function as a global chip select that allows access to boot ROM at reset. CS0 can have its address redefined after reset. CS0 is the only chip select initialized and enabled during reset. All other chip selects are disabled at reset and must be initialized by device initialization software. CS7/SDCS can be configured to access RAM or ROM or one physical bank of SDRAM. Only CS7 can be used for SDRAM chip select. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-19

Signal Descriptions 19.6 Bus Control Signals This section describes bus control signals. 19.6.1 Output Enable/Read (OE/RD) The output enable/read signal (OE/RD) defines the data transfer direction for the data bus D[31:0] for accesses to SRAM, ROM or external peripherals. A low (logic zero) level indicates a read cycle while a high (logic one) indicates a write cycle. This signal is normally connected to the OE pins of external SRAM, ROM, or FLASH. 19.6.2 Byte Strobes (BS[3:0]) The byte strobes (BS[3:0]) define the flow of data on the data bus. During SRAM and peripheral accesses, these outputs indicate that data is to be latched or driven onto a byte of the data when driven low. BSn signals are asserted only to the memory bytes used during a read or write access. BSn signals are asserted during accesses to on-chip peripherals but not to on-chip SRAM, cache, or ROM. During SDRAM accesses, these signals indicate a byte transfer between SDRAM and the MCF5272 when driven high. For SRAM or FLASH devices, BS[3:0] outputs should be connected to individual byte strobe signals. For SDRAM devices, BS[3:0] should be connected to individual SDRAM DQM signals. Note that most SDRAMs associate DQM3 with the MSB, in which case BS3 should be connected to the SDRAM's DQM3 input. Table19-3. Byte Strobe Operation for 32-Bit Data Bus BS3 BS2 BS1 BS0 Access Type Access Size Data Located On 1 1 1 1 None None — 1 1 1 0 FLASH/SRAM Byte D[31:24] 1 1 0 1 FLASH/SRAM D[23:16] 1 0 1 1 FLASH/SRAM D[15:8] 0 1 1 1 FLASH/SRAM D[7:0] 1 1 0 0 FLASH/SRAM Word D[31:16] 0 0 1 1 FLASH/SRAM D[15:0] 0 0 0 0 FLASH/SRAM Longword D[31:0] 1 1 1 0 SDRAM Byte D[7:0] 1 1 0 1 SDRAM D[15:8] 1 0 1 1 SDRAM D[23:16] 0 1 1 1 SDRAM D[31:24] 1 1 0 0 SDRAM Word D[15:0] 0 0 1 1 SDRAM D[31:16] 0 0 0 0 SDRAM Longword D[31:0] MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-20 Freescale Semiconductor

Signal Descriptions Table19-4. Byte Strobe Operation for 16-Bit Data Bus—SRAM Cycles BS1 BS0 Access Size Data Located On 1 1 None — 1 0 Byte D[31:24] 0 1 Byte D[23:16] 0 0 Word D[31:16] Table19-5. Byte Strobe Operation for 16-Bit Data Bus—SDRAM Cycles BS3 BS2 Access Type Data Located On 1 1 None — 1 0 Byte D[23:16] 0 1 Byte D[31:24] 0 0 Word D[31:16] NOTE In 16-bit bus mode, longword accesses are performed as two sequential word accesses. Table 19-6 shows how BS[3:0] should be connected to DQMx for 16- and 32-bit SDRAM configurations. Table19-6. Connecting BS[3:0] to DQMx 5272 SDRAM Data Signals 16 Bit 32 Bit 16 Bit 32 Bit (2 x 16) 32 Bit (1 x 32) BS3 BS3 DQMH DQMH DQM3 D[31:24] BS2 BS2 DQML DQML DQM2 D[23:16] NC BS1 NC DQMH DQM1 D[15:8] NC BS0 NC DQML DQM0 D[7:0] 19.6.3 Read/Write (R/W) R/W is programmed on a per-chip-select basis for use with SRAM and external peripheral write accesses. It should be connected to the external peripheral or memory write enable signal. R/W acts as a write strobe to external SRAM when the decoded chip select is configured for either of the two SRAM/ROM modes. It is asserted during on-chip peripherals accesses and negated during on-chip SRAM accesses. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-21

Signal Descriptions 19.6.4 Transfer Acknowledge (TA/PB5) Assertion of the transfer acknowledge (TA/PB5) input terminates an external bus cycle. It is enabled on a per chip select basis by programming the wait state field to 0x1F in the corresponding chip select option register (CSORn[WS]). This pin requires a 4.7-K¾ pull-up resistor or external logic that drives inactive high. TA must always be returned high before it can be detected again. Asserting TA into the next bus cycle has no effect and does not terminate the bus cycle. NOTE: Even though EBI modes set to SDRAM require setting the wait state field in the chip select option register to 31, a low signal should never be applied to TA during such accesses. For SDRAM accesses the bus cycle is terminated internally by circuitry in the SDRAM module. 19.6.5 Hi-Z HiZ is a test signal. When it is connected to GND during reset, all output pins are driven to high impedance. A 4.7-K¾ pullup resistor should be connected to this signal if the Hi-Z function is not used. Hi-Z configuration input is sampled on the rising edge of Reset Output (RSTO). 19.6.6 Bypass Bypass is a Freescale test mode signal. This signal should be left unconnected. 19.6.7 SDRAM Row Address Strobe (RAS0) RAS0 is the SDRAM row address strobe output. 19.6.8 SDRAM Column Address Strobe (CAS0) CAS0 is the SDRAM column address strobe output. 19.6.9 SDRAM Clock (SDCLK) The SDRAM clock output (SDCLK) is the same frequency as the CPU clock. 19.6.10 SDRAM Write Enable (SDWE) This output is the SDRAM write enable. 19.6.11 SDRAM Clock Enable (SDCLKE) This output is the SDRAM clock enable. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-22 Freescale Semiconductor

Signal Descriptions 19.6.12 SDRAM Bank Selects (SDBA[1:0]) These outputs are the SDRAM bank select signals. 19.6.13 SDRAM Row Address 10 (A10)/A10 Precharge (A10_PRECHG) This output is the SDRAM row address 10 and the precharge strobe. 19.7 CPU Clock and Reset Signals This section describes clock and reset signals in the CPU. 19.7.1 RSTI RSTI is the primary reset input to the device. Asserting RSTI immediately resets the CPU and peripherals. However, the reset of the SDRAM controller and hence SDRAM contents depend on DRESETEN. Asserting RSTI also causes RSTO to be asserted for 32K CPU clock cycles. 19.7.2 DRESETEN DRESETEN is asserted to indicate that the SDRAM controller is to be reset whenever RSTI asserts. If DRESETEN is high, RSTI does not affect the SDRAM controller, which continues to refresh external memory. This is useful for debug situations where a reset of the device is required without losing data located in SDRAM. DRESETEN is normally tied high or low depending on system requirements. It should never be tied to RSTI or RSTO. 19.7.3 CPU External Clock (CLKIN) CLKIN should be connected to an external clock oscillator. The CLKIN input frequency can range from DC to 66 MHz. The frequency input to this signal must be greater than twice the frequency applied at E_Tx CLK. The clock frequency applied to CLKIN must exceed 24 MHz when the system uses a USB peripheral. 19.7.4 Reset Output (RSTO) Reset output (RSTO) is driven low for 128 CPU clocks when the soft reset bit of the system configuration register (SCR[SOFTRST]) is set. It is driven low for 32K CPU clocks when the software watchdog timer times out or when a low input level is applied to RSTI. 19.8 Interrupt Request Inputs (INT[6:1]) The six interrupt request inputs (INT[6:1]) can generate separate, maskable interrupts on negative edge (high to low) or positive edge (low to high) transitions. In addition to the triggering edge being programmable, the priority can also be programmed. Each interrupt input has a separate programmable interrupt level. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-23

Signal Descriptions After a device reset, INT[4:1] are enabled but the function is masked. INT4/DIN3 function can be changed by software. INT[3:1] functions are always assigned to dedicated pins. Interrupts INT[6:4] are multiplexed with other functions as follows: • DGNT1_INT6/PA15_INT6 • INT5/URT1_RTS • INT4/DIN3 INT1 is also internally connected to the USC_WOR function. The INT6 function is always available regardless of the other functions enabled on this pin. 19.9 General-Purpose I/O (GPIO) Ports Each of the three GPIO ports is 16 bits wide. Each port line can be individually configured as input or output. Except where indicated, each pin function is independently selectable between the corresponding port pin or the other functions that may be multiplexed onto the pin. After reset all pins multiplexed with GPIO signals default to inputs. Port A general purpose I/O, PA[15:8] are multiplexed with PLIC TDM port 1 pins. Port A general purpose I/O, PA[6:0] are multiplexed with USB module signals. PA7 is multiplexed with QSPI_CS3 and DOUT3. Port B general purpose I/O, PB[4:0] are multiplexed with the UART0 interface pins. If the UART0 interface is enabled, PB[4:0] are unavailable. PB5 is multiplexed with TA. PB6 is dedicated. PB7 is multiplexed with TOUT0. Port B general purpose I/O, PB[15:8] are multiplexed with the Ethernet interface pins. If the Ethernet interface is enabled, PB[15:8] are unavailable. Port C general purpose I/O, PC[15:0] are multiplexed with D[15:0]. When 32-bit wide bus mode is selected, port C is unavailable. 19.10 UART0 Module Signals and PB[4:0] The UART0 module uses the signals in this section for data and clock signals. These signals are multiplexed with the GPIO port B signals PB[4:0]. 19.10.1 Transmit Serial Data Output (URT0_TxD/PB0) UART0 mode: URT0_TxD is the transmitter serial data output for the UART0 module. The output is held high (mark condition) when the transmitter is disabled, idle, or in the local loopback mode. Data is shifted out, lsb first, on this pin at the falling edge of the serial clock source. Port B mode: This pin can also be configured as the PB0 I/O. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-24 Freescale Semiconductor

Signal Descriptions 19.10.2 Receive Serial Data Input (URT0_RxD/PB1) UART0 mode: URT0_RxD is the receiver serial data input for the UART0 module. Data received on this pin is sampled on the rising edge of the serial clock source lsb first. When the UART0 clock is stopped for power-down mode, any transition on this pin restarts it. Port B mode: This pin can also be configured as the PB1 I/O. 19.10.3 Clear-to-Send (URT0_CTS/PB2) UART0 mode: Asserting the URT0_CTS input is the clear-to-send (CTS) input, indicating to the UART0 module that it can begin data transmission. Port B mode: This pin can also be configured as the PB2 I/O. 19.10.4 Request to Send (URT0_RTS/PB3) UART0 mode: Asserting URT0_RTS output is an automatic request to send output from the UART0 module. URT0_RTS can also be configured to be asserted and negated as a function of the RxFIFO level. Port B mode: This pin can also be configured as the PB3 I/O. 19.10.5 Clock (URT0_CLK/PB4) UART0 mode: URT0_CLK provides a clock input that can be a 1x or 16x baud rate clock. Port B mode: This pin can also be configured as the PB4 I/O. 19.11 USB Module Signals and PA[6:0] The USB module uses the signals in this section for data and clock signals. These signals are multiplexed with the GPIO port A signals PA[6:0]. 19.11.1 USB Transmit Serial Data Output (USB_TP/PA0) USB mode: USB_TP is the non-inverted data transmit output. Port A mode: This pin can also be configured as the PA0 I/O. 19.11.2 USB Receive Serial Data Input (USB_RP/PA1) USB mode: USB_RP is the non-inverted receive data input. Port A mode: This pin can also be configured as the PA1 I/O. 19.11.3 USB Receive Data Negative (USB_RN/PA2) USB mode: USB_RN is the inverted receive data input. Port A mode: This pin can also be configured as the PA2 I/O. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-25

Signal Descriptions 19.11.4 USB Transmit Data Negative (USB_TN/PA3) USB mode: USB_TN is the inverted data transmit output. Port A mode: This pin can also be configured as the PA3 I/O. 19.11.5 USB Suspend Driver (USB_SUSP/PA4) USB mode: USB_SUSP is used to put the USB driver in suspend operation. Port A mode: This pin can also be configured as the PA4 I/O. 19.11.6 USB Transmitter Output Enable (USB_TxEN/PA5) USB mode: USB_TxEN enables the transceiver to transmit data on the bus. It requires a 4.7-K¾ pullup resistor to ensure that the external USB Tx driver is off between the MCF5272 coming out of reset and initializing the port A pin configuration register. Port A mode: This pin can also be configured as the PA5 I/O. 19.11.7 USB Rx Data Output (USB_RxD/PA6) USB mode: USB_RxD is the receive data output from the differential receiver inputs USB_RN and USB_RP. Port A mode: This pin can also be configured as the PA6 I/O. 19.11.8 USB_D+ and USB_D- USB_D+ and USB_D- are the on-chip USB interface transceiver signals. When these signals are enabled, the USB module uses them to communicate to an external USB bus. When not used, each signal should be pulled to VDD using a 4.7-K¾ resistor. 19.11.9 USB_CLK USB_CLK is used to connect an external 48-MHz oscillator to the USB module. When this pin is tied to GND or VDD, the USB module automatically uses the internal CPU clock. In this case the CLKIN must be 48 MHz if the system is to use the USB function. 19.11.10 INT1/USB Wake-on-Ring (USB_WOR) The USB module allows for INT1 to generate the USB wake-on-ring signal to the USB host controller. This function is enabled by a control bit in the USB module. WOR is provided to allow the CPU and the USB interface to be woken up when in power down mode. This occurs when the USB controller detects a resume state at the USB inputs. The interrupt output of an ISDN transceiver, such as the MC145574, can be connected to INT1/USB_WOR. Before putting the device into sleep mode, the USB module’s wake on ring function MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-26 Freescale Semiconductor

Signal Descriptions can be enabled, the INT1 interrupt can be disabled, and USB power-down modes can be enabled along with its interrupt. Then when the ISDN transceiver is activated, its interrupt request can generate the USB wake on ring signal, which causes the host controller on the PC to initiate USB traffic to the device. This in turn causes the USB module to wake up the CPU. Note that USB_WOR, when configured by setting USBEPCTL0[WOR_EN], is level-sensitive. 19.12 Timer Module Signals This section describes timer module signals. 19.12.1 Timer Input 0 (TIN0) The timer input (TIN0) can be programmed to cause events to occur in timer counter 1. It can either clock the event counter or provide a trigger to the timer value capture logic. 19.12.2 Timer Output (TOUT0)/PB7 Timer mode: Timer output (TOUT0) is the output from timer 0. Port B mode: This pin can also be configured as I/O pin PB7. 19.12.3 Timer Input 1 (TIN1)/PWM Mode Output 2 (PWM_OUT2) Timer mode: Timer input 1 (TIN1) can be programmed as an input that causes events to occur in timer counter 2. This can either clock the event counter or provide a trigger to the timer value capture logic. PWM mode: Pulse-width modulator 2 (PWM_OUT2) compare output. 19.12.4 Timer Output 1 (TOUT1)/PWM Mode Output 1 (PWM_OUT1) Timer mode: Timer output (TOUT1) is the output from timer 1. PWM mode: Pulse-width modulator 1 (PWM_OUT1) compare output. 19.13 Ethernet Module Signals The following signals are used by the Ethernet module for data and clock signals. These signals are multiplexed with the parallel port B PB15–PB8 signals. 19.13.1 Transmit Clock (E_TxCLK) This is an input clock which provides a timing reference for E_TxEN, E_TxD[3:0] and E_TxER. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-27

Signal Descriptions 19.13.2 Transmit Data (E_TxD0) E_TxD0 is the serial output Ethernet data and is only valid during the assertion of Tx_EN. This signal is used for 10-Mbps Ethernet data. This signal is also used for MII mode data in conjunction with E_TxD[3:1]. 19.13.3 Collision (E_COL) The E_COL input is asserted upon detection of a collision and remains asserted while the collision persists. This signal is not defined for full-duplex mode. 19.13.4 Receive Data Valid (E_RxDV) Asserting the receive data valid (E_RxDV) input indicates that the PHY has valid nibbles present on the MII. E_RxDV should remain asserted from the first recovered nibble of the frame through to the last nibble. Assertion of E_RxDV must start no later than the SFD and exclude any EOF. 19.13.5 Receive Clock (E_RxCLK) The receive clock (E_RxCLK) input provides a timing reference for E_RxDV, E_RxD[3:0], and E_RxER. 19.13.6 Receive Data (E_RxD0) E_RxD0 is the Ethernet input data transferred from the PHY to the media-access controller when E_RxDV is asserted. This signal is used for 10-Mbps Ethernet data. This signal is also used for MII mode Ethernet data in conjunction with E_RxD[3:1]. 19.13.7 Transmit Enable (E_TxEN) The transmit enable (E_TxEN) output indicates when valid nibbles are present on the MII. This signal is asserted with the first nibble of a preamble and is negated before the first E_TxCLK following the final nibble of the frame. 19.13.8 Transmit Data (E_TxD[3:1]/PB[10:8]) Ethernet mode: These pins contain the serial output Ethernet data and are valid only during assertion of E_TxEN in MII mode. Port B mode: These pins can also be configured as I/O pins PB[10:8]. 19.13.9 Receive Data (E_RxD[3:1]/PB[13:11]) Ethernet mode: These pins contain the Ethernet input data transferred from the PHY to the media-access controller when E_RxDV is asserted in MII mode operation. Port B mode: These pins can also be configured as I/O pins PB[13:11]. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-28 Freescale Semiconductor

Signal Descriptions 19.13.10 Receive Error (E_RxER/PB14) Ethernet mode: E_RxER is an input signal which when asserted along with E_RxDV signals that the PHY has detected an error in the current frame. When E_RxDV is not asserted E_RxER has no effect. Applies to MII mode operation. Port B mode: This pin can also be configured as PB14 I/O. 19.13.11 Management Data Clock (E_MDC/PB15) Ethernet mode: E_MDC is an output clock which provides a timing reference to the PHY for data transfers on the E_MDIO signal. Applies to MII mode operation. Port B mode: This pin can also be configured as I/O pin PB15. 19.13.12 Management Data (E_MDIO) The bidirectional E_MDIO signal transfers control information between the external PHY and the media-access controller. Data is synchronous to E_MDC. Applies to MII mode operation. This signal is an input after reset. When the FEC is operated in 10Mbps 7-wire interface mode, this signal should be connected to Vss. 19.13.13 Transmit Error (E_TxER) Ethernet mode: When the E_TxER output is asserted for one or more clock cycles while E_TxEN is also asserted, the PHY sends one or more illegal symbols. E_TxER has no effect at 10 Mbps or when E_TxEN is negated. Applies to MII mode operation. 19.13.14 Carrier Receive Sense (E_CRS) E_CRS is an input signal which when asserted signals that transmit or receive medium is not idle. Applies to MII mode operation. 19.14 PWM Module Signals (PWM_OUT0–PWM_OUT2]) PWM_OUT0–PWM_OUT2 are the outputs of the compare logic within the pulse-width modulator (PWM) modules. • PWM_OUT0 is always available. • PWM_OUT1 is multiplexed with TOUT1. • PWM_OUT2 is multiplexed with TIN1. 19.15 Queued Serial Peripheral Interface (QSPI) Signals This section describes signals used by the queued serial peripheral interface (QSPI) module. Four QSPI chip selects, QSPI_CS[3:0], are multiplexed with the physical layer interface pins and GPIO port A. QSPI_CS0 is always available. QSPI_CS3 is multiplexed with DOUT3 and PA7. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-29

Signal Descriptions 19.15.1 QSPI Synchronous Serial Data Output (QSPI_Dout/WSEL) The QSPI synchronous serial data output (QSPI_Dout) can be programmed to be driven on the rising or falling edge of SCK. Each byte is sent msb first. WSEL configuration input is sampled on the rising edge of Reset Output (RSTO). 19.15.2 QSPI Synchronous Serial Data Input (QSPI_Din) The QSPI synchronous serial data input (QSPI_Din) can be programmed to be sampled on the rising or falling edge of QSPI_CLK. Each byte is written to RAM lsb first. 19.15.3 QSPI Serial Clock (QSPI_CLK/BUSW1) The QSPI serial clock (QSPI_CLK/BUSW1) provides the serial clock from the QSPI. The polarity and phase of QSPI_CLK are programmable. The output frequency is programmed according to the following formula, in which n can be any value between 1 and 255: QSPI_CLK = CLKIN/(2 × n) At reset, QSPI_CLK/BUSW1 is used to configure the width of memory connected to CS0. BUSW1 configuration input is sampled on the rising edge of Reset Output (RSTO). 19.15.4 Synchronous Peripheral Chip Select 0 (QSPI_CS0/BUSW0) The synchronous peripheral chip select 0 (QSPI_CS0) output provides a QSPI peripheral chip select that can be programmed to be active high or low. During reset, this pin is used to configure the width of memory connected to CS0. BUSW0 configuration input is sampled on the rising edge of Reset Output (RSTO). 19.15.5 Synchronous Peripheral Chip Select 1 (QSPI_CS1/PA11) See Section19.16.1.9, “QSPI Chip Select 1 (QSPI_CS1/PA11).” QSPI_CS1 can be programmed to be active high or low. 19.15.6 Synchronous Peripheral Chip Select 2 (QSPI_CS2/URT1_CTS) See Section19.16.1.5, “UART1 CTS (URT1_CTS/QSPI_CS2).” 19.15.7 Synchronous Peripheral Chip Select 3 (PA7/DOUT3/QSPI_CS3) See Section19.16.3.3, “QSPI_CS3, Port 3 GCI/IDL Data Out 3, PA7 (PA7/DOUT3/QSPI_CS3).” See description for GPIO ports. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-30 Freescale Semiconductor

Signal Descriptions 19.16 Physical Layer Interface Controller TDM Ports and UART 1 The MCF5272 has four dedicated physical layer interface ports for connecting to external ISDN transceivers, CODECs and other peripherals. There are three sets of pins for these interfaces. Port 0 has its own dedicated set of pins. Ports 1, 2, and 3 share a set of pins. Port3 can also be configured to use a dedicated pin set. Ports 1, 2, and 3 always share the same data clock (DCL). 19.16.1 GCI/IDL TDM Port 0. This section describes signals used by the PLIC module port 0 interface. 19.16.1.1 Frame Sync (FSR0/FSC0/PA8) IDL mode: FSR0 is an input for the 8-KHz frame sync for port 0. GCI mode: FSC0 is an input for the 8-KHz frame sync for port 0. It is active high in this mode. Normally the GCI FSC signal is two clocks wide and is aligned with the first B-channel bit of the GCI frame. Many U-interface devices including the MC145572 and MC145576 change the width of FSC to one clock every 12 mS. This indicates U-interface super frame boundary. Port A mode: This pin can be independently configured as PA8. 19.16.1.2 D-Channel Grant (DGNT0/PA9) IDL mode: This pin can be independently configured as the input, DGNT0, used by a layer-one ISDN S/T transceiver to indicate that D-channel access has been granted. Port A mode: This pin can be independently configured as I/O pin PA9. 19.16.1.3 Data Clock (DCL0/URT1_CLK) IDL mode: This pin is the clock used to clock data in and out of DIN0 and DOUT0 for IDL port 0. Data is clocked into DIN0 on the falling edge and clocked out of DOUT0 on the rising edge of DCL0. GCI mode: This pin is used to clock data in and out of DIN0 and DOUT0 for GCI port 0. DCL0 is twice the bit rate (two clocks per data bit). UART1: URT1_CLK provides a clock input which can be the baud rate clock. 19.16.1.4 Serial Data Input (DIN0/URT1_RxD) IDL mode: The DIN0 input is for clocking data into IDL port 0. Data is clocked into DIN0 on the falling edge of DCL0. GCI mode: The DIN0 input is for clocking data into GCI port 0. DCL0 is twice the bit rate (two clocks per data bit). UART1: URT1_RxD is the receiver serial data input for the UART1 module. Data received on this pin is sampled on the rising edge of the serial clock source with the least significant bit first. When the UART1 clock is stopped for power-down mode, any transition on this pin restarts it. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-31

Signal Descriptions 19.16.1.5 UART1 CTS (URT1_CTS/QSPI_CS2) UART1: URT1_CTS is the clear-to-send input indicating to the UART1 module that it can begin data transmission. QSPI mode: This output pin provides a QSPI peripheral chip select, QSPI_CS2, when in Master mode. QSPI_CS2 can be programmed to be active high or low. 19.16.1.6 UART1 RTS (URT1_RTS/INT5) Interrupt mode: This pin can be used as INT5. UART1: The URT1_RTS output is an automatic request to send output from the UART1 module. It can be configured to be asserted and negated as a function of the RxFIFO level. 19.16.1.7 Serial Data Output (DOUT0/URT1_TxD) IDL mode: The DOUT0 output is for clocking data out of IDL port 0. Data is clocked out of DOUT0 on the rising edge of DCL0. GCI mode: The DOUT0 output is for clocking data out of GCI port 0. DCL0 is twice the bit rate (two clocks per data bit). UART1: URT1_TxD is the transmitter serial data output for the UART1 module. The output is held high ('mark' condition) when the transmitter is disabled, idle, or operating in the local loop back mode. Data is shifted out, least significant bit first, on this pin at the falling edge of the serial clock source. 19.16.1.8 D-Channel Request(DREQ0/PA10) IDL mode: This pin can be independently configured as the DREQ0 output for signaling to a layer-1 S/T transceiver that a frame of data is ready to be sent on the port 0 D channel. Port A mode: In GCI or IDL modes this pin can be independently configured as PA10. 19.16.1.9 QSPI Chip Select 1 (QSPI_CS1/PA11) QSPI mode: QSPI_CS1 is a QSPI peripheral chip select. Port A mode: In GCI or IDL modes this pin can be independently configured as PA11. 19.16.2 GCI/IDL TDM Port 1 Physical Layer Interface port 1 is an additional GCI/IDL port. Also internally connected to these pins are GCI/IDL serial ports 2 and 3. 19.16.2.1 GCI/IDL Data Clock (DCL1/GDCL1_OUT) IDL mode: DCL1 is the data clock used to clock data in and out of the DIN1 and DOUT1 pins for IDL port 1. Data is clocked in to DIN1 on the falling edge of DCL1. Data is clocked out of DOUT1 on the rising edge of DCL1. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-32 Freescale Semiconductor

Signal Descriptions GCI mode: GDCL1_OUT is used to clock data in and out of DIN1 and DOUT1 for GCI port 1. DCL1 is twice the bit rate; that is, two clocks per data bit. When this pin is configured as an output, the GDCL1_OUT clock signal from the on-chip synthesizer clock generator is output on this pin. Also GDCL1_OUT is used to internally drive all ports and delayed sync generators associated with ports 1, 2, and 3. 19.16.2.2 GCI/IDL Data Out (DOUT1) IDL mode: The DOUT1 output is for clocking data out of IDL port 1. Data is clocked out of DOUT1 on the rising edge of DCL1. DOUT1 is also used for clocking data from ports 2 and 3. GCI mode: The DOUT1 output is for clocking data out of GCI port 1. DCL1 is twice the bit rate, that is, two clocks per data bit. 19.16.2.3 GCI/IDL Data In (DIN1) IDL mode: The DIN1 input is for clocking data into IDL port 1. Data is clocked into DIN1 on the falling edge of DCL1. DIN1 is also used for clocking data into ports 2 and 3. GCI mode: The DIN1 input is for clocking data into GCI port 1. DCL1 is twice the bit rate, that is, two clocks per data bit. DIN1 is also used for clocking data into ports 2 and 3. 19.16.2.4 GCI/IDL Frame Sync (FSC1/FSR1/DFSC1) IDL mode: FSR1 is an input for the 8-KHz frame sync for port 1. GCI mode: FSC1 is an input for the 8-KHz frame sync for port 1. Normally the GCI FSC signal is two clocks wide and is aligned with the first B channel bit of the GCI frame. Many U-interface devices including the MC145572 and MC145576 change the width of FSC to one clock every 12 mS, indicating a U-interface super frame boundary. The MCF5272 can accept either frame sync width. When this pin is configured as an output, the DFSC1 sync signal from the on-chip clock synthesizer is output on this pin. Also DFSC1 is used to internally drive the port 1 frame sync and the delayed sync generators associated with ports 2 and 3. The width of DFSC1 can be configured for 1, 2, 8, or 16 DCL clocks duration. The location of DFSC1 is programmable in single clock increments up to a maximum count of 0x3FF. 19.16.2.5 D-Channel Request (DREQ1/PA14) IDL mode: This pin can be configured as the DREQ1 output in IDL mode for signalling to a layer 1 S/T transceiver that a frame of data is ready to be sent on the port 1 D channel. Port A mode: I/O pin PA14. 19.16.2.6 D-Channel Grant (DGNT1_INT6/PA15_INT6) This pin can be independently configured as the input, DGNT1, used by a Layer one ISDN S/T transceiver to indicate that D-channel access has been granted. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-33

Signal Descriptions Port A mode: I/O pin PA15. Special interrupt mode: The INT6 interrupt can be enabled independently of the pin being configured for DGNT1 or PA15. This is particularly useful when configured for PA15 operation because INT6 can be used to signal a change of data on the PAx pins. 19.16.3 GCI/IDL TDM Ports 2 and 3 Physical Layer Interface port 2 is an additional GCI/IDL port. This Physical Layer Interface shares the DIN1, DOUT1, and DCL1 pins of Physical Layer Interface port 1. The operating mode is selected by the same register control bit that selects the operating mode for port 1. Physical Layer Interface port 3 is an additional GCI/IDL port. This Physical Layer Interface shares the DIN1, DOUT1, and DCL1 pins of Physical Layer Interface port 1. The operating mode is selected by the same register control bit that selects the operating mode for port 1. Port 3 can also have its input and output signals redirected to DIN3 and DOUT3 respectively. 19.16.3.1 GCI/IDL Delayed Frame Sync 2 (DFSC2/PA12) IDL/GCI Modes: DFSC2 is used as a programmable delayed frame sync for external IDL/GCI devices that use port 2 but are connected to the port 1 data pins. Port 2 uses the DFSC2 frame sync internally to ensure alignment with external devices synchronized with DFSC2. The width of this signal can be configured for 1, 2, 8, or 16 DCL clocks duration. The location of this frame sync is programmable in single clock increments up to a maximum count of 0x3FF. Port A mode: I/O pin PA12. 19.16.3.2 GCI/IDL Delayed Frame Sync 3 (DFSC3/PA13) Output pin DFSC3. This active high signal is used as a programmable delayed frame sync for external IDL/GCI devices that use port 3 but are connected to the port 1 or port 3 data pins. Port 3 uses the DFSC3 frame sync internally to ensure alignment with external devices synchronized with DFSC3. The width of this signal can be configured for 1, 2, 8, or 16 DCL clocks duration. The location of this frame sync is programmable in single clock increments up to a maximum count of 0x3FF. Port A mode: I/O pin PA13. 19.16.3.3 QSPI_CS3, Port 3 GCI/IDL Data Out 3, PA7 (PA7/DOUT3/QSPI_CS3) QSPI mode: The QSPI chip select, QSPI_CS3, is the default configuration after device reset. QSPI_CS3 can be programmed to be active high or low. IDL mode: This pin can be configured as a dedicated output for clocking data out of IDL port 3. Data is clocked out of DOUT3 on the rising edge of DCL1. After device reset port 3 is connected to DOUT1 by setting a bit in the PLIC module configuration register, this pin can be configured as a dedicated output for IDL/GCI port 3. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-34 Freescale Semiconductor

Signal Descriptions GCI mode: This pin can be configured as a dedicated output for clocking data out of GCI port 3. Data is clocked out of DOUT3 on the rising edge of DCL1. DCL1 is twice the bit rate, that is, two clocks per data bit. This is done by setting a bit in the PLIC module configuration register this pin can be configured as a dedicated output for IDL/GCI port 3. Port A mode: I/O pin PA7. 19.16.3.4 INT4 and Port 3 GCI/IDL Data In (INT4/DIN3) IDL mode: This pin can be configured as a dedicated input, DIN3, for clocking data into IDL port 3. Data is clocked into DIN3 on the falling edge of DCL1. Data is clocked into DIN3 on the falling edge of DCL1. This is done by setting a bit in the PLIC module configuration register. Note that the appropriate bits must be set in the pin configuration register to reassign this pin from the interrupt module to the PLIC module. GCI mode: This pin can be configured as a dedicated input, DIN3, for clocking data into GCI port 3. DCL1 is twice the bit rate, that is, two clocks per data bit. This is done by setting a bit in the PLIC module configuration register. Note that the appropriate bits must be set in the pin configuration register to reassign this spin from the interrupt module to the PLIC module. Interrupt mode: This signal can be configured as interrupt input 4. 19.17 JTAG Test Access Port and BDM Debug Port The MCF5272 supports the Freescale background debug mode (BDM) for ColdFire processors. It also supports a JTAG test interface. The following signals do not support JTAG due to the critical timing required to support SDRAM memory: BS[3:0], RAS0, CAS0, SDCLK, SDCLKE, SDRAMCS/CS7, SDWE, A10_PRECHG, SDBA[1:0], D[31:0], A[15:0]. 19.17.1 Test Clock (TCK/PSTCLK) JTAG mode: TCK is the dedicated JTAG test logic clock, independent of the CPU system clock. This input provides a clock for on-board test logic defined by the IEEE 1149.1 standard. TCK should be grounded if the JTAG port is not used and MTMOD is tied low. BDM mode: PSTCLK is an output at the same frequency as the CPU clock. It is used for indicating valid processor status data on the PST and DDATA pins. 19.17.2 Test Mode Select and Force Breakpoint (TMS/BKPT) JTAG mode: The TMS input controls test mode operations for on-board test logic defined by the IEEE 1149.1 standard. Connecting TMS to VDD disables the test controller, making all JTAG circuits transparent to the system. BDM mode: The hardware breakpoint input, BKPT, requires a 10-K¾ pullup resistor. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-35

Signal Descriptions 19.17.3 Test and Debug Data Out (TDO/DSO) JTAG mode: The TDO output is for shifting data out of the serial data port logic. Shifting out of data depends on the state of the JTAG controller state machine and the instructions currently in the instruction register. This data shift occurs on the falling edge of TCK. When TDO is not outputting data it is placed in a high-impedance state. TDO can also be three-stated to allow bussed or parallel connections to other devices having JTAG test access ports. BDM mode: DSO is the debug data output. 19.17.4 Test and Debug Data In (TDI/DSI) JTAG mode: The TDI input is for loading the serial data port shift registers (boundary scan registers, bypass register and instruction register). Shifting in of data depends on the state of the JTAG controller state machine and the instruction currently in the instruction register. Data is shifted in on the rising edge of TCK. BDM mode: DSI is the debug serial data input. This signal requires a 10-K¾ pullup resistor. 19.17.5 JTAG TRST and BDM Data Clock (TRST/DSCLK) JTAG mode: TRST asynchronously resets the JTAG TAP logic when low. BDM mode: DSCLK is the BDM serial data clock input. It requires a 10-K¾ pullup resistor. 19.17.6 Freescale Test Mode Select (MTMOD) MTMOD: When the MTMOD input is low, JTAG mode is enabled. When it is high, BDM mode is enabled. 19.17.7 Debug Transfer Error Acknowledge (TEA) An external slave asserts the TEA input to indicate an error condition for the current bus transfer. It is provided to allow full debug port capability. The assertion of TEA causes the MCF5272 to abort the current bus cycle. If a 10-K¾ pullup resistor is not connected, external logic must drive TEA high when it is inactive. TEA has no effect during SDRAM accesses. If high parasitic capacitance occurs on the printed circuit board, a lower value pullup resistor may be needed. 19.17.8 Processor Status Outputs (PST[3:0]) PST[3:0] outputs indicate core status, as shown in Table 19-7. Debug mode timing is synchronous with the processor clock; status is unrelated to the current bus transfer. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-36 Freescale Semiconductor

Signal Descriptions Table19-7. Processor Status Encoding PST[3:0] Definition 0000 Continue execution 0001 Begin execution of an instruction 0010 Begin execution of PULSE instruction or WDDATA. 0011 Entry into user mode 0100 Begin execution of PULSE instruction 0101 Begin execution of taken branch 0110 Reserved 0111 Begin execution of RTE instruction 1000 Begin 1 byte transfer on DDATA 1001 Begin 2 byte transfer on DDATA 1010 Begin 3 byte transfer on DDATA 1011 Begin 4 byte transfer on DDATA 1100 1 Exception processing 1101 1 Emulator mode entry exception processing 1110 1 Processor is stopped, waiting for an interrupt 1111 1 Processor is halted 1 These encodings are asserted for multiple cycles. 19.17.9 Debug Data (DDATA[3:0]) Debug data signals (DDATA[3:0]) display captured processor data and breakpoint status. 19.17.10 Device Test Enable (TEST) TEST is used to put the device into various manufacturing test modes. It should be tied to VDD for normal operation. 19.18 Operating Mode Configuration Pins The MCF5272 has four mode-select signals, some of which are shared with output signals used during normal device operation. These signals are HI-Z, QSPI_Dout/WSEL, QSPI_CLK/BUSW1, and QSPI_CS0/BUSW0. BYPASS is a Freescale test mode signal and should never have a pull-down resistor. The remaining three mode-select signals must each have a 4.7-K¾ pull-up or pull-down resistor. These signals are sampled on the rising edge of Reset Output (RSTO). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 19-37

Signal Descriptions Table19-8. MCF5272 Bus Width Selection WSEL Data Bus Width 0 32 bits 1 16 Bits Table19-9. MCF5272 CS0 Memory Bus Width Selection BUSW1 BUSW0 CS0 Bus Width 0 0 32 bits 0 1 8 bits 1 0 16 bits 1 1 Reserved, do not use. Table19-10. MCF5272 High Impedance Mode Selection HI-Z Data Bus Width 0 Enable HI-Z mode, all pins are high impedance 1 Normal operation 19.19 Power Supply Pins The VDD/GND pins are connected to 3.3 V supply and associated ground. When the on-chip USB transceiver is used, the USB_VDD and USB_GND pins are connected to the 3.3 V device supply and associated ground. When the on-chip USB transceiver is not used, USB_GND should be connected to the device GND and USB_VDD left unconnected. Refer to Section 12.2.1.1 USB Transceiver Interface. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 19-38 Freescale Semiconductor

Chapter 20 Bus Operation The MCF5272 bus interface supports synchronous data transfers that can be terminated synchronously or asynchronously and also can be burst or burst-inhibited between the MCF5272 and other devices in the system. This chapter describes the functioning of the bus for data-transfer operations, error conditions, bus arbitration, and reset operations. It includes detailed timing diagrams showing signal interaction. Refer also to Figure 19-1 for an overview of how the signals interact with each module of the MCF5272. Operation of the bus is defined for transfers initiated by the MCF5272 as a bus master. The MCF5272 does not support external bus masters. The MCF5272 has three on-chip bus masters—the CPU, the Ethernet controller, and the memory-to-memory DMA controller. 20.1 Features The following list summarizes the key bus operation features: • 23 bits of address and 32 bits of data • Device physical data bus width configurable for 16 or 32 bits • Accesses 8-, 16-, and 32-bit port sizes • Generates byte, word, longword, and line size transfers • Burst and burst-inhibited transfer support • Internal termination generation 20.2 Bus and Control Signals Table 20-1 summarizes MCF5272 bus signals described in Chapter19, “Signal Descriptions.” Table20-1. ColdFire Bus Signal Summary Signal Name Description I/O A[22:0] Address bus O BS[3:0] Byte strobes O CS[7:0] Chip selects O D[31:0] Data bus I/O INT[6:1] Interrupt request I OE Output enable O R/W Read/write O TA Transfer acknowledge I TEA Transfer error acknowledge I MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-1

Bus Operation 20.2.1 Address Bus (A[22:0]) These output signals provide the location of a bus transfer. The address can be external SRAM, ROM, FLASH, SDRAM, or peripherals. NOTE The ColdFire core outputs 32 bits of address to the internal bus controller. Of these 32 bits, only A[22:0] are output to pins on the MCF5272. 20.2.2 Data Bus (D[31:0]) These three-state bidirectional signals provide the general-purpose data path between the MCF5272 and all other devices. The data bus can transfer 8, 16, 32, or 128 bits of data per bus transfer. The MCF5272 can be configured for an external physical data bus of 32- or 16-bits width. When configured for 16-bit external data bus width, D[15:0] become GPIO port C. A write cycle drives all 32 or 16 bits of the data bus regardless of the chip select port width and operand size. 20.2.3 Read/Write (R/W) This output signal defines the data transfer direction for the current bus cycle. A high (logic one) level indicates a read cycle; a low (logic zero) level indicates a write cycle. During SDRAM bus cycles R/W is driven high. When the CPU is in SLEEP or STOP modes, this signal is driven high. NOTE Use the OE signal to control any external data bus transceivers. In systems containing numerous external peripherals, the chip selects should be used to qualify any external transceivers. This ensures the transceivers are active only when the desired peripheral is accessed. Using only the R/W signal to control an external transceiver may lead to data bus conflicts in some system architectures. 20.2.4 Transfer Acknowledge (TA) This active-low synchronous input signal indicates the successful completion of a requested data transfer operation. During MCF5272-initiated transfers, transfer acknowledge (TA) is an asynchronous input signal from the referenced slave device indicating completion of the transfer. The MCF5272 edge-detects and retimes the TA input. This means that an additional wait state may or may not be inserted. For example if the active chip select is used to immediately generate the TA input, one or two wait states may be inserted in the bus access. The TA signal function is not available after reset. It must be enabled by configuring the appropriate pin configuration register bits along with the value of CSORn[WS]. If TA is not used, it should either have a pullup resistor or be driven through gating logic that always ensures the input is inactive. TA should be negated on the negating edge of the active chip select. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-2 Freescale Semiconductor

Bus Operation TA must always be negated before it can be recognized as asserted again. If held asserted into the following bus cycle, it has no effect and does not terminate the bus cycle. NOTE For the MCF5272 to accept the transfer as successful with a transfer acknowledge, TEA must be negated throughout the transfer. TA is not used for termination during SDRAM accesses. 20.2.5 Transfer Error Acknowledge (TEA) An external slave asserts this active-low input signal to abort a transfer. The assertion of TEA immediately aborts the bus cycle. The assertion of TEA has precedence over the assertion of TA. The MCF5272 edge-detects and retimes the TEA input. TEA is an asynchronous input signal. The TEA signal function is available after reset. If TEA is not used, a pullup resistor or gating logic must be used to ensure the input is inactive. TEA should be negated on the negating edge of the active chip select. TEA must always be negated before it can be recognized as asserted again. If held asserted into the following bus cycle, it has no effect and does not abort the bus cycle. TEA has no affect during SDRAM accesses. 20.3 Bus Exception: Double Bus Fault When a bus error or an address error occurs during the exception processing sequence for a previous bus error, a previous address error, or a reset exception, the bus or address error causes a double bus fault. If the MCF5272 experiences a double bus fault, it enters the halted state. To exit the halt state, reset the MCF5272. 20.4 Bus Characteristics The MCF5272 uses the address bus (A[22:0]) to specify the location for a data transfer and the data bus (D[31:0] or D[31:16]) to transfer the data. Control signals indicate the direction of the transfer. The selected device or the number of wait states programmed in the chip select base registers (CSBRs), the chip select option registers (CSORs), the SDRAM configuration and SDRAM timing registers (SDCR, SDTR) control the length of the cycle. The MCF5272 clock is distributed internally to provide logic timing. All SRAM and ROM mode bus signals should be considered as asynchronous with respect to CLKIN. SDCR[INV] allows the SDRAM control signals to be asserted and negated synchronous with the rising or falling edge of SDCLK. The SDRAM control signals are BS[3:0], SDBA[1:0], RAS0, CAS0, SDWE, A10_PRECHG, SDCLKE, and CS7/SDCS. The asynchronous INT[6:1] signals are internally synchronized to resolve the input to a valid level before being used. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-3

Bus Operation 20.5 Data Transfer Mechanism The MCF5272 supports byte, word, and longword operands and allows accesses to 8-, 16-, and 32-bit data ports. The MCF5272 supports port sizes of the specific memory, enables internal generation of transfer termination, and sets the number of wait states for the external slave being accessed by programming the CSBRs, CSORs, SDCR, and SDTR. For more information on programming these registers, refer to the SIM, chip select, and SDRAM controller chapters. NOTE The MCF5272 compares the address for the current bus transfer with the address and mask bits in the CSBRs and CSORs looking for a match. The priority is listed in Table 20-2 (from highest priority to lowest priority): Table20-2. Chip Select Memory Address Decoding Priority Priority Chip Select Highest Chip Select 0 Chip Select 1 Chip Select 2 Chip Select 3 Chip Select 4 Chip Select 5 Chip Select 6 Lowest Chip Select 7 20.5.1 Bus Sizing The MCF5272 can be configured for an external physical data bus width of 16 bits by pulling QSPI_Dout/WSEL high, or for 32 bits by pulling QSPI_Dout/WSEL low during reset. When the external physical address bus size is configured for 16 bits, the signals D[15:0] become general purpose I/O port C. The MCF5272 determines the port size for each transfer from the CSBRs at the start of each bus cycle. This allows the MCF5272 to transfer operands from 8-, 16-, or 32-bit ports. The size of the transfer is adjusted to accommodate the port size indicated. A 32-bit port must reside on data bus bits D[31:0], a 16-bit port must reside on data bus bits D[31:16], and an 8-bit port must reside on data bus bits D[31:24]. This requirement ensures that the MCF5272 correctly transfers valid data to 8-, 16-, and 32-bit ports. The bytes of operands are designated as shown in Figure20-1. The most significant byte of a longword operand is OP0; OP3 is the least significant byte. The two bytes of a word length operand are OP2 (most significant) and OP3. The single byte of a byte length operand is OP3. These designations are used in the figures and descriptions that follow. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-4 Freescale Semiconductor

Bus Operation 31 0 OP0 OP1 OP2 OP3 LONGWORD OPERAND 15 0 OP2 OP3 WORD OPERAND 7 0 OP3 BYTE OPERAND Figure20-1. Internal Operand Representation Figure 20-2 shows the required organization of data ports on the MCF5272 for 8-, 16-, and 32 bit devices. The four bytes shown are connected through the internal data bus and data multiplexer to the external data bus. This path is how the MCF5272 supports programmable port sizing and operand misalignment. The data multiplexer establishes the necessary connections for different combinations of address and data sizes. REGISTER OP0 OP1 OP2 OP3 INTERNAL TO MULTIPLEXER ROUTING AND DUPLICATION MCF5272 EXTERNAL D[31:24] D[23:16] D[15:8] D[7:0] DATA BUS ADDRESS A1 A0 0 0 BYTE 0 BYTE 1 BYTE 2 BYTE 3 32-BIT PORT 0 0 BYTE 0 BYTE 1 16-BIT PORT 1 0 BYTE 2 BYTE 3 0 0 BYTE 0 0 1 BYTE 1 8-BIT PORT 1 0 BYTE 2 1 1 BYTE 3 Figure20-2. MCF5272 Interface to Various Port Sizes The multiplexer takes the four bytes of the 32-bit bus and routes them to their required positions. For example, OP3 can be routed to D[7:0], as would be the normal case when interfacing to a 32-bit port. OP3 can be routed to D[23:16] for interfacing to a 16-bit port, or it can be routed to D[31:24] for interfacing to an 8-bit port. The operand size, address, and port size of the memory being accessed determines the positioning of bytes. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-5

Bus Operation Table 20-3 through Table20-5 describe data bus byte strobes. Note that most SDRAMs associate DQM3 with the MSB, thus BS3 should be connected to the SDRAM's DQM3 input. Table20-3. Byte Strobe Operation for 32-Bit Data Bus BS3 BS2 BS1 BS0 Access Type Access Size Data Located On 1 1 1 1 None None — 1 1 1 0 FLASH/SRAM Byte D[31:24] 1 1 0 1 FLASH/SRAM D[23:16] 1 0 1 1 FLASH/SRAM D[15:8] 0 1 1 1 FLASH/SRAM D[7:0] 1 1 0 0 FLASH/SRAM Word D[31:16] 0 0 1 1 FLASH/SRAM D[15:0] 0 0 0 0 FLASH/SRAM Longword D[31:0] 1 1 1 0 SDRAM Byte D[7:0] 1 1 0 1 SDRAM D[15:8] 1 0 1 1 SDRAM D[23:16] 0 1 1 1 SDRAM D[31:24] 1 1 0 0 SDRAM Word D[15:0] 0 0 1 1 SDRAM D[31:16] 0 0 0 0 SDRAM Longword D[31:0] Table20-4. Byte Strobe Operation for 16-Bit Data Bus—SRAM Cycles BS1 BS0 Access Size Data Located On 1 1 None — 1 0 Byte D[31:24] 0 1 Byte D[23:16] 0 0 Word D[31:16] Table20-5. Byte Strobe Operation for 16-Bit Data Bus—SDRAM Cycles BS3 BS2 Access Type Data Located On 1 1 None — 1 0 Byte D[23:16] 0 1 Byte D[31:24] 0 0 Word D[31:16] MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-6 Freescale Semiconductor

Bus Operation Table 20-6 lists the bytes that should be driven on the data bus during read cycles by the external peripheral device being accessed, and the pattern of the data transfer for write cycles to the external data bus. For read cycles, the entries shown as Byte X are portions of the requested operand that are read. The operand being read is defined by the size of the transfer and A[1:0] for the bus cycle. Bytes labeled “X” are don’t cares and are not required during that read cycle. Bytes labeled “–” are not valid transfers. For write cycles from the internal multiplexer of the MCF5272 to the external data bus A[1:0] is incremented according to the transfer size. For example, if a longword transfer is generated to a 16-bit port, the MCF5272 starts the cycle with A[1:0] set to 0x0 and reads the first word. The address in then incremented to 0x2 and the second word is read. The data for both word reads is taken from D[31:16]. Bytes labeled “X” are don’t cares. Table20-6. Data Bus Requirement for Read/Write Cycles External Data Bytes Required Transfer Size A[1:0] 32-Bit Port 16-Bit Port 8-Bit Port D[31:24] D[23:16] D[15:8] D[7:0] D[31:24] D[23:16] D[31:24] Byte 00 Byte 0 X X X Byte 0 X Byte 0 01 X Byte 1 X X X Byte 1 Byte 1 10 X X Byte 2 X Byte 2 X Byte 2 11 X X X Byte 3 X Byte 3 Byte 3 Word 00 Byte 0 Byte 1 X X Byte 0 Byte 1 Byte 0 01 — — — — — — Byte 1 10 X X Byte2 Byte 3 Byte 2 Byte 3 Byte 2 11 — — — — — — Byte 3 Longword 00 Byte 0 Byte 1 Byte 2 Byte 3 Byte 0 Byte 1 Byte 0 01 — — — — — — Byte 1 10 — — — — Byte 2 Byte 3 Byte 2 11 — — — — — — Byte 3 Line 00 Byte 0 Byte 1 Byte 2 Byte 3 Byte 0 Byte 1 Byte 0 01 — — — — — — Byte 1 10 — — — — Byte 2 Byte 3 Byte 2 11 — — — — — — Byte 3 20.6 External Bus Interface Types The MCF5272 supports three types of external bus interfaces. The interface type is programmed using CSBRn[EBI]. The EBI codes are summarized in Table 20-7. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-7

Bus Operation Table20-7. External Bus Interface Codes for CSBRs A0 CSBRn[EBI] Applicable Chip Select Note 16-/32-bit 00 All For 16/32 bit wide memory devices with byte strobe inputs. BS[3:0] SRAM/ROM are byte read/write enables in this mode. CSBR0[EBI] = 00 at reset. SDRAM 01 CS7/SDCS only One physical bank of SDRAM consisting of 16–256 Mbit devices. The CS7/SDCS CSORn[WS] must be set to 0x1F. Reserved 10 — — 8-bit 11 All SRAM/ROM timing for 8 bit wide memory devices without byte SRAM/ROM strobe inputs. BS[3:0] function as byte write enables in this mode. 20.6.1 Interface for FLASH/SRAM Devices with Byte Strobes CSBRn[EBI] is 00 for FLASH/SRAM devices and peripherals having 16- or 32-bit data bus widths. These memory devices have separate pins for independent byte strobes, write enable, chip select, and output enable. All chip selects support this EBI mode. The number of wait states required for the external memory or peripheral is programmed through CSORn[WS]. The external transfer acknowledge signal, TA, is provided to allow off-chip control of wait states. External control of wait states is enabled when CSORn[WS] is 0x1F. When TA is used to terminate the bus cycle, the bus cycle will have a minimum of one wait states. Additional wait states can be added by delaying the assertion of TA. SDCLK C1 C2 A[22:0] D[31:0] OE, BS[3:0] R/W (H) CSn TA (H) Figure20-3. Longword Read; EBI = 00; 32-Bit Port; Internal Termination NOTE Wait states, if needed, are added immediately after C2 in Figure20-3. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-8 Freescale Semiconductor

Bus Operation SDCLK C1 C2 A[22:0] D[31:0] OE (H) R/W CSn BS[1:0] BS[3:2] (H) TA (H) Figure20-4. Word Write; EBI = 00; 16-/32-Bit Port; Internal Termination SDCLK C1 C2 C3 A[22:0] D[31:0] OE, BS[3:0] R/W (H) CSn TA (H) Figure20-5. Longword Read with Address Setup; EBI = 00; 32-Bit Port; Internal Termination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-9

Bus Operation SDCLK C1 C2 C3 A[22:0] D[31:0] OE (H) R/W CSn BS[3:0] (H) TA Figure20-6. Longword Write with Address Setup; EBI = 00; 32-Bit Port; Internal Termination SDCLK C1 C2 C3 A[22:0] D[31:0] OE, BS[3:0] R/W (H) CSn TA (H) Figure20-7. Longword Read with Address Hold; EBI = 00; 32-Bit Port; Internal Termination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-10 Freescale Semiconductor

Bus Operation SDCLK C1 C2 C3 A[22:0] D[31:0] OE (H) R/W CSn BS[3:0] (H) TA Figure20-8. Longword Write with Address Hold; EBI = 00; 32-Bit Port; Internal Termination SDCLK C1 C2 CW C3 A[22:0] D[31:0] OE R/W CSn BS[3:0] TA Figure20-9. Longword Read; EBI = 00; 32-Bit Port; Terminated by TA with One Wait State MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-11

Bus Operation 20.6.2 Interface for FLASH/SRAM Devices without Byte Strobes CSBRn[EBI] is 11 for FLASH/SRAM devices and for peripherals having 8-bit data bus widths and no byte strobe inputs. These type of memory devices have separate pins for write enable, chip select, and output enable. All chip selects support this EBI mode. The key difference between EBI = 11 and EBI = 00 is that BS[3:0] can be directly connected to the R/W inputs of the 8-bit wide SRAM devices and the R/W output from the MCF5272 can be left unconnected. The number of wait states required for the external memory or peripheral can be programmed in CSORn[WS]. The external transfer acknowledge signal, TA, is provided to allow off-chip control of wait states. External control of wait states is enabled when CSORn[WS] is 0x1F. SDCLK C1 C2 A[22:0] D[31:0] OE R/W (H) CSn BS[3:0] (H) TA (H) Figure20-10. Longword Read; EBI=11; 32-Bit Port; Internal Termination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-12 Freescale Semiconductor

Bus Operation SDCLK C1 C2 A[22:0] D[31:0] OE (H) R/W CSn BS[1:0] BS[3:2] (H) TA (H) Figure20-11. Word Write; EBI=11; 16/32-Bit Port; Internal Termination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-13

Bus Operation SDCLK C1 C2 C3 A[22:0] D[31:0] OE (H) R/W CSn (H) BS[3:0] (H) TA Figure20-12. Read with Address Setup; EBI=11; 32-Bit Port; Internal Termination SDCLK C1 C2 C3 A[22:0] D[31:0] OE (H) R/W CSn BS[3:0] (H) TA Figure20-13. Longword Write with Address Setup; EBI=11; 32-Bit Port; Internal Termination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-14 Freescale Semiconductor

Bus Operation SDCLK C1 C2 C3 A[22:0] D[31:0] OE R/W (H) CSn BS[3:0] (H) TA (H) Figure20-14. Read with Address Hold; EBI=11; 32-Bit Port; Internal Termination SDCLK C1 C2 C3 A[22:0] D[31:0] OE (H) R/W CSn BS[3:0] TA (H) Figure20-15. Longword Write with Address Hold; EBI=11; 32-Bit Port; Internal Termination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-15

Bus Operation SDCLK C1 C2 C3 C4 A[22:0] D[31:0] OE R/W (H) CSn BS[3:0] (H) TA (H) Figure20-16. Longword Read with Address Setup and Address Hold; EBI = 11; 32-Bit Port, Internal Termination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-16 Freescale Semiconductor

Bus Operation SDCLK C1 C2 C3 C4 A[22:0] D[31:0] OE (H) R/W CSn BS[3:0] TA (H) Figure20-17. Longword Write with Address Setup and Address Hold; EBI = 11; 32-Bit Port, Internal Termination 20.7 Burst Data Transfers The MCF5272 uses line read transfers to access 16 bytes to support cache line filling DMA transfers, and MOVEM instructions, when appropriate. A cache line read accesses a block of four longwords, aligned to a longword memory boundary, by supplying a starting address that points to one of the longwords and incrementing A[3:0] of the supplied address for each transfer. A longword read accesses a single longword aligned to a longword boundary and increments A1 and A0 if the accessed port size is smaller than 32 bits. A word read accesses a single word of data, aligned to a word boundary and increments A0 if the accessed port size is smaller than 16 bits. The MCF5272 uses line write transfers to access a 16-byte operand for MOVEM instructions and DMA transfers, when appropriate. A line write accesses a block of four longwords, aligned to a longword memory boundary, by supplying a starting address that points to one of the longwords and increments A[3:0] of the supplied address for each transfer. A longword write accesses a single longword aligned to a longword boundary and increments A1 and A0 if the accessed port size is smaller than 32 bits. A word write accesses a single word of data, aligned to a word boundary and increments A0 if the accessed port size is smaller than 16 bits. The MCF5272 hardware supports the following types of burst transfers. • Sixteen byte cache line read bursts from 32-bit wide SDRAM with access times of n-1-1-1. The value of n depends on read, write, page miss, page hit, etc. See Chapter9, “SDRAM Controller,” MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-17

Bus Operation for complete details of access times. To enable this type of transfer, CSOR7[EXTBURST] must be cleared, CSBR7[EBI] must be 01, and CSBR7[BW] must be 11. • Sixteen byte cache line read bursts from 16-bit wide SDRAM with access times of n-1-1-1-1-1-1-1. CSOR7[EXTBURST] must be set, CSBR7[EBI] must be 01, and CSBR7[BW] must be 10. • Sixteen byte read or write bursts during Ethernet DMA transfers to/from SDRAM with access times of n-1-1-1 or n-1-1-1-1-1-1-1 depending on 32 or 16 bit SDRAM port width as described in the previous two paragraphs. All bursts to and from SRAM or from ROM appear as a sequence of four single longword accesses in the case of 32-bit wide memory. In the case of 16-bit wide SRAM or ROM memory, a burst appears as a sequence of eight single word accesses. In the case of 8 bit wide SRAM or ROM memory a burst appears as a sequence of sixteen single byte accesses. It is never necessary to set CSORn[EXTBURST] when CSORn[EBI] = 00 or 11. CSBRn[BW] = 11 is invalid for SRAM/ROM; it should be programmed with the port size. 20.8 Misaligned Operands All MCF5272 data formats can be located in memory on any byte boundary. A byte operand is properly aligned at any address; a word operand is misaligned at an odd address; and a longword is misaligned at an address that is not evenly divisible by four. However, because operands can reside at any byte boundary, they can be misaligned. Although the MCF5272 does not enforce any alignment restrictions for data operands (including program counter (PC) relative data addressing), significant performance degradation can occur when additional bus cycles are required for longword or word operands that are misaligned. For maximum performance, data items should be aligned on their natural boundaries. All instruction words and extension words must reside on word boundaries. An address error exception occurs with any attempt to prefetch an instruction word at an odd address. The MCF5272 converts misaligned operand accesses to a sequence of aligned accesses. Figure 20-18 illustrates the transfer of a longword operand from a byte address to a 32-bit port, requiring more than one bus cycle. Figure 20-19 is similar to the example illustrated in Figure 20-18 except that the operand is word-sized and the transfer requires only two bus cycles. 31 24 23 16 15 8 7 0 A[2:0] Transfer 1 — Byte 0 — — 001 Transfer 2 — — Byte 1 Byte 2 010 Transfer 3 Byte 3 — — — 100 Figure20-18. Example of a Misaligned Longword Transfer 31 24 23 16 15 8 7 0 A[2:0] Transfer 1 — — — Byte 0 001 Transfer 2 Byte 1 — — — 100 Figure20-19. Example of a Misaligned Word Transfer MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-18 Freescale Semiconductor

Bus Operation 20.9 Interrupt Cycles All interrupt vectors are internally generated. The MCF5272 does not support external interrupt acknowledge cycles. The System Integration Module prioritizes all interrupt requests and issues the appropriate vector number in response to an interrupt acknowledge cycle. Refer to the System Integration chapter for details on the interrupt vectors and their priorities. When an external peripheral device requires the services of the CPU, it can signal the ColdFire core to take an interrupt exception. The external peripheral devices use the interrupt request signals (INTx) to signal an interrupt condition to the MCF5272. The interrupt exception transfers control to a routine that responds appropriately. There are a total of six external interrupt inputs, INT[6:1]. Depending on the pin configuration between three and six of these pins are available. Each interrupt input pin is dedicated to an external peripheral. It is possible to have multiple external peripherals share an INTx pin but software must then determine which peripheral caused the interrupt. The interrupt priority level and the signal level of each interrupt pin are individually programmable. The MCF5272 continuously samples the external interrupt input signals and synchronizes and debounces these signals. An interrupt request must be held constant for at least two consecutive CLK periods to be considered a valid input. MCF5272 latches the interrupt and the interrupt controller responds as programmed. The interrupt service routine must clear the latch in the ICR registers. NOTE All internal interrupts are level sensitive only. External interrupts are edge-sensitive as programmed in the PITR. Interrupts must remain stable and held valid for two clock cycles while they are internally synchronized and latched. The MCF5272 takes an interrupt exception for a pending interrupt within one instruction boundary after processing any other pending exception with a higher priority. Thus, the MCF5272 executes at least one instruction in an interrupt exception handler before recognizing another interrupt request. 20.10 Bus Errors The system hardware can use the transfer error acknowledge (TEA) signal to abort the current bus cycle when a fault is detected. A bus error is recognized during a bus cycle when TEA is asserted. NOTE The signal TEA is not intended for use in normal operation since each chip select can be programmed to automatically terminate a bus cycle at a time defined by the bits programmed into the wait state field of the Chip Select Option Register. There is an on chip bus monitor which can be configured to generate an internal TEA signal. When the MCF5272 recognizes a bus error condition for an access, the access is terminated immediately. An access that requires more than one transfer aborts without completing the remaining transfers if TEA is asserted, regardless of whether the access uses burst or non-burst transfers. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-19

Bus Operation Figure 20-20 shows a longword write access to a 32-bit port with a transfer error. SDCLK C1 C2 C3 Cx C4 A[22:0] D[31:0] OE (H) R/W CSn BS[3:0] TEA Figure20-20. Longword Write Access To 32-Bit Port Terminated with TEA Timing Clock 1 (C1) The write cycle starts in C1. During C1, the MCF5272 places valid values on the address bus (A[22:0]) and the chip select signal. Clock 2 (C2) During C2, the MCF5272 drives the data bus, the byte strobes, and R/W. Clock 3 (C3) During C3, the selected device detects an error and asserts TEA. At the end of C3 or Cx, the MCF5272 samples the level of TEA. If it is asserted, the transfer of the longword is aborted and the transfer terminates. NOTE This example shows TEA being asserted during C3. TEA can be asserted earlier or later than C3. NOTE If TA is asserted when debug transfer error-acknowledge (TEA) is asserted, the transfer is terminated with a bus error. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-20 Freescale Semiconductor

Bus Operation NOTE TEA normally should be asserted for no more than three CLKIN periods. The minimum is two clock periods. NOTE TEA is internally synchronized on the rising edge of CLKIN. Depending on when this synchronization takes place, the Cx cycle may not occur. 20.11 Bus Arbitration The MCF5272 does not allow external bus masters. There are three on-chip bus masters. These are the ColdFire core, the Fast Ethernet Controller, and the memory-to-memory DMA Controller. 20.12 Reset Operation The MCF5272 supports four types of reset, two of which are external hardware resets (master reset and normal reset), a soft reset, which is generated by setting SCR[SOFTRST], and the software watchdog reset. There are two reset input pins, RSTI and DRESETEN. When DRESETEN is asserted, any of the reset sources reset the SDRAM controller. When DRESETEN is negated, the SDRAM controller is not reset. This is useful during software debugging since it is preferable to retain SDRAM data in the case of catastrophic system failure. In a production system, if may be preferable to tie DRESETEN low. Master reset resets the entire MCF5272 including the SDRAM controller. Master reset occurs when both RSTI and DRESETEN are asserted simultaneously. This is the reset that should be applied to the MCF5272 device at power up. Normal reset resets all of the MCF5272 with the exception of the SDRAM controller. Normal reset occurs when RSTI is asserted and DRESETEN is negated. Normal reset allows DRAM refresh cycles to continue at the programmed rate and with the programmed waveform timing while the remainder of the system is being reset, maintaining the data stored in DRAM. SCR[SOFTRST] resets all on-chip peripherals and devices connected to RSTO. It resets the SDRAM controller only when DRESETEN is asserted. The software watchdog reset acts as an internally generated normal reset when DRESETEN is negated. It resets the SDRAM controller only when DRESETEN is asserted. NOTE Master reset must be asserted for all power-on resets. This is done by driving RSTI and DRESETEN low simultaneously. Failure to assert master reset during power-on sequences results in unpredictable DRAM controller behavior. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-21

Bus Operation 20.12.1 Master Reset To perform a master reset, an external device asserts RSTI and DRESETEN simultaneously for a minimum of six CLKIN cycles after VDD is within tolerance. This should always be done when power is initially applied. A master reset resets the entire device including the SDRAM controller. Figure 20-21 is a functional timing diagram of the master reset operation, illustrating relationships among VDD, RSTI, DRESETEN, RSTO, mode selects, and bus signals. CLKIN must be stable by the time VDD reaches the minimum operating specification. RSTI and DRESETEN are internally synchronized on consecutive rising and falling clocks before being used. They must meet the specified setup and hold times to the falling edge of CLKIN only if recognition by a specific falling edge is required . T >= 6 T = 32,768 T >= 22 CLK CYCLES CLK CYCLES CLK CYCLES CLKIN VDD RSTI DRESETEN Mode Select Inputs RSTO BUS SIGNALS Figure20-21. Master Reset Timing When the assertion of RSTI is recognized internally, the MCF5272 asserts the reset out pin (RSTO). The RSTO pin is asserted as long as RSTI is asserted and remains asserted for 32,768 CLKIN cycles after RSTI is negated. During the master reset period, all outputs are driven to their default levels. Once RSTO negates, all bus signals continue to remain in this state until the ColdFire core begins the first bus cycle for reset exception processing. The levels of the mode select inputs, QSPI_Dout/WSEL, QSPI_CLK/BUSW1, and QSPI_CS0/BUSW0, are sampled when RSTO negates and they select the port size of CS0 and the physical data bus width after a master reset occurs. The INTx signals are synchronized and are registered on the last falling edge of CLKIN where RSTI is asserted. A master reset causes any bus cycle (including SDRAM refresh cycles) to terminate. In addition, master reset initializes registers appropriately for a reset exception. During an external master reset, SCR[RSTSRC] is set to 0b11 to indicate that assertion of RSTI and DRESETEN caused the previous reset. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-22 Freescale Semiconductor

Bus Operation 20.12.2 Normal Reset External normal resets should be performed anytime it is important to maintain the data stored in SDRAM during a reset. An external normal reset is performed when an external device asserts RSTI while negating DRESETEN. At power on reset both RSTI and DRESETEN must be asserted simultaneously. If DRESETEN is not asserted at the same time as RSTI at power up, the SDRAMC cannot be initialized by software. During an external normal reset, RSTI must be asserted for a minimum of six CLKINs. Figure 20-22 is a functional timing diagram of external normal reset operation, illustrating relationships among RSTI, DRESETEN, RSTO, mode selects, and bus signals. RSTI and DRESETEN are internally synchronized on consecutive falling and rising clocks before being used and must meet the specified setup and hold times to the falling edge of CLKIN only if recognition by a specific falling edge is required . T >= 6 T = 32,768 T >= 22 CLK CYCLES CLK CYCLES CLK CYCLES CLKIN VDD RSTI (H) DRESETEN Mode Select Inputs RSTO BUS SIGNALS Figure20-22. Normal Reset Timing The levels of the mode select inputs, QSPI_Dout/WSEL, QSPI_CLK/BUSW1, QSPI_CS0/BUSW0, and HiZ are sampled when RSTO negates and they select the port size of CS0 and the physical data bus width after a master reset occurs. RSTO is asserted as long as RSTI is asserted and remains asserted for 32,768 CLKIN cycles after RSTI is negated. For proper normal reset operation, DRESETEN must be negated as long as RSTI is asserted. The levels of the mode select inputs, QSPI_Dout/WSEL, QSPI_CLK/BUSW1, and QSPI_CS0/BUSW0, are sampled when RSTO negates and they select the port size of CS0 and the physical data bus width after a master reset occurs. The INTx signals are synchronized and are registered on the last falling edge of CLKIN where RSTI is asserted. During the normal reset period, all outputs are driven to their default levels. Once RSTO negates, all bus signals continue to remain in this state until the ColdFire core begins the first bus cycle for reset exception processing. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-23

Bus Operation A normal reset causes all bus activity except SDRAM refresh cycles to terminate. During a normal reset, SDRAM refresh cycles continue to occur at the programmed rate and with the programmed waveform timing. In addition, normal reset initializes registers appropriately for a reset exception. During a normal reset, SCR[RSTSRC] is set to 0b01 to indicate assertion of RSTI with DRESETEN negated caused the previous reset. 20.12.3 Software Watchdog Timer Reset Operation A software watchdog timer is provided to allow periodic monitoring of software activity. If the software watchdog is not periodically accessed by software it can programmed to generate a reset after a timeout period. When the timeout occurs, an internal reset is asserted for 32K clocks, resetting internal registers as with a normal reset. The RSTO pin simultaneously asserts for 32K clocks after the software watchdog timeout. Figure 20-23 illustrates the timing of RSTO when asserted by a software watchdog timeout. T = 32K CLKIN CYCLES CLKIN SOFTWARE WATCHDOG TIMEOUT INTERNAL RSTI RSTO BUS SIGNALS Figure20-23. Software Watchdog Timer Reset Timing NOTE Like the normal reset, the internal reset generated by a software watchdog timeout does not reset the SDRAM controller unless DRESETEN is low during the reset. When DRESETEN is high, SDRAM refreshes continue to be generated during and after the reset at the programmed rate and with the programmed waveform timing. During the software watchdog timer reset period, all outputs are driven to their default levels. Once RSTO negates, all bus signals continue to remain in this state until the ColdFire core begins the first bus cycle for reset exception processing. During a software watchdog timer reset, SCE[RSTSRC] is set to 0b10 to indicate the software watchdog as the source of the previous reset. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-24 Freescale Semiconductor

Bus Operation NOTE The levels of the mode pins are not sampled during a software watchdog reset. If the port size and acknowledge features of CS0 are different from the values programmed in CSBR0 and CSOR0 at the time of the software watchdog reset, you must assert RSTI during software watchdog reset to cause the mode pins to be resampled. 20.12.4 Soft Reset Operation If the soft reset bit, SCR[SOFTRST], is programmed to generate a reset, RSTO is asserted for 128 clocks, resetting all external devices as with a normal or master reset. All internal peripherals with the exception of the SIM, chip select, interrupt controller, GPIO module, and SDRAM controller are reset also. The SDRAM controller is reset only when DRESETEN is tied low. SCR[SOFTRST] is automatically cleared at the end of the 128 clock period. Software can monitor this bit to determine the end of the soft reset. Figure20-24 shows the timing of RSTO when asserted by SCR[SOFTRST]. T = 128 CLK CYCLES CLKIN SoftRST RSTO INTERNAL PERIPHERALS RSTI Figure20-24. Soft Reset Timing NOTE Like the normal reset, the soft reset does not reset the SDRAM controller unless DRESETEN is asserted during the reset. When DRESETEN is negated, SDRAM refreshes continue to be generated during and after reset at the programmed rate and with the programmed waveform timing. During the soft reset period, all bus signals continue to operate normally. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 20-25

Bus Operation MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 20-26 Freescale Semiconductor

Chapter 21 IEEE 1149.1 Test Access Port (JTAG) This chapter describes the dedicated user-accessible test logic implemented on the MCF5272. This test logic complies fully with the IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture. This chapter describes those items required by the standard and provides additional information specific to the MCF5272 implementation. For internal details and sample applications, see the IEEE 1149.1 document. 21.1 Overview Problems with testing high-density circuit boards led to development of this standard under the sponsorship of the Test Technology Committee of IEEE and the Joint Test Action Group (JTAG). The MCF5272 supports circuit board test strategies based on this standard. The test logic includes a test access port (TAP) consisting a 16-state controller, an instruction register, and three test registers (a 1-bit bypass register, a 265-bit boundary-scan register, and a 32-bit ID register). The boundary scan register links the device’s pins into one shift register. The contents of this register can be found at the ColdFire website at http://www.freescale.com. Test logic, implemented using static logic design, is independent of the device system logic. The TAP includes the following dedicated signals: • TCK—Test clock input to synchronize the test logic. • TMS—Test mode select input (with an internal pullup resistor) that is sampled on the rising edge of TCK to sequence the TAP controller's state machine. • TDI—Test data input (with an internal pull-up resistor) that is sampled on the rising edge of TCK. • TDO—three-state test data output that is actively driven in the shift-IR and shift-DR controller states. TDO changes on the falling edge of TCK. These signals, described in detail in Table 21-1, are enabled by negating the Freescale test mode signal (MTMOD). The MCF5272 implementation can do the following: • Perform boundary scan operations to test circuit board electrical continuity • Sample MCF5272 system pins during operation and transparently shift out the result in the boundary scan register • Bypass the MCF5272 for a given circuit board test by effectively reducing the boundary-scan register to a single bit • Disable the output drive to pins during circuit-board testing • Drive output pins to stable levels MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 21-1

IEEE 1149.1 Test Access Port (JTAG) NOTE Precautions to ensure that the IEEE 1149.1 test logic does not interfere with non-test operation are described in Section21.7, “Non-IEEE 1149.1 Operation.” Figure 21-1 shows the MCF5272 implementation of IEEE 1149.1. Test Data Register Boundary-Scan Register Bypass (1 Bit) ID (32 bits) TDI Decoder 3 0 4-Bit Instruction Register TDC TMS TAP Controller TCK Figure21-1. Test Access Port Block Diagram 21.2 JTAG Test Access Port and BDM Debug Port The JTAG test interface shares pins with the debug modules (see Table21-1). Table21-1. JTAG Signals Signal Description TCK/ Test clock. TCK is the dedicated JTAG test logic clock input, independent of the CPU system clock. It provides a PSTCLK clock for on-board test logic defined by the IEEE 1149.1 standard. TCK should be grounded if the JTAG port is not used and MTMOD is tied low. TMS/ Test mode select. This input controls test mode operations for on-board test logic defined by the IEEE 1149.1 BKPT standard. Connecting TMS to VDD disables the test controller, making all JTAG circuits transparent to the system. TDO/ Test and debug data out. Output for shifting data out of serial data port logic. Shifting out data depends on the state DSO of the JTAG controller state machine and the instructions in the instruction register. The shift occurs on the falling edge of TCK. When not outputting data, TDO is placed in high-impedance state. TDO can also be three-stated to allow bused or parallel connections to other devices having JTAG test access ports. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 21-2 Freescale Semiconductor

IEEE 1149.1 Test Access Port (JTAG) Table21-1. JTAG Signals (continued) Signal Description TDI/DSI Test and debug data in. Input provided for loading serial data port shift registers (boundary-scan, bypass, and instruction registers). Shifting in of data depends on the state of the JTAG controller state machine and the instruction currently in the instruction register. Data is shifted in on the rising edge of TCK. TRST/ JTAG test reset. TRST asynchronously resets the JTAG TAP logic when low. DSCLK MTMOD Freescale test mode select. Negating MTMOD enables JTAG mode; asserting it enables BDM mode. 21.3 TAP Controller The TAP controller is a synchronous state machine that controls JTAG logic and interprets the sequence of logical values on TMS. The value adjacent to each arrow in the state machine in Figure21-2 reflects the value of TMS sampled on the rising edge of TCK. For a description of the TAP controller states, refer to the IEEE 1149.1 document. Figure21-2. TAP Controller State Machine MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 21-3

IEEE 1149.1 Test Access Port (JTAG) 21.4 Boundary Scan Register The boundary scan register contains bits for all device signal and clock pins and associated control signals. Bidirectional pins include a single scan bit for data (IO.Cell) as shown in Figure 21-6. These bits are controlled by an enable cell, shown in Figure 21-5. The control bit value determines whether the bidirectional pin is an input or an output. One or more bidirectional data bits can be serially connected to a control bit as shown in Figure 21-7. Note that when bidirectional data bits are sampled, bit data can be interpreted only after examining the I/O control bit to determine pin direction. Open-drain bidirectional bits require separate input and output cells as no direction control is available from which to determine signal direction. Programmable open-drain signals also have an enable cell (XXX.de) to select whether the pin is open drain or push-pull. Signals with pull-up or pull-down resistors have an associated enable cell (XXX.pu); one enable cell can control multiple resistors. Figure 21-3 to Figure21-8 show the four MCF5272 cell types. 1 = EXTEST, CLAMP, HI-Z To next 0 = Otherwise Shift DR cell G1 Data from system 1 To output logic MUX buffer 1 G1 1 MUX 1 D 1 1 D C1 C1 From last cell Clock DR Update DR Figure21-3. Output Cell (O.Cell) (BC–1) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 21-4 Freescale Semiconductor

IEEE 1149.1 Test Access Port (JTAG) Figure21-4. Input Cell (I.Cell). Observe only (BC–4) 1 = EXTEST, CLAMP, HI-Z To next 0 = Otherwise Shift DR cell 0 = HI-Z 1 = Otherwise G1 Output control To output from system 1 buffer logic MUX I/O direction 1 G1 1 MUX 1 D 1 1 D C1 C1 From last cell Clock DR Update DR Figure21-5. Output Control Cell (En.Cell) (BC–4) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 21-5

IEEE 1149.1 Test Access Port (JTAG) 1 = EXTEST, CLAMP, HI-Z 0 = Otherwise 1 = Output To next 0 = Input Shift DR cell G1 Data from system 1 To output logic MUX buffer 1 G1 Data 1 From input to system MUX buffer logic 1 G1 G1 1 MUX 1 1 MUX 1 D 1 1 D C1 C1 From last cell Clock DR Update DR Figure21-6. Bidirectional Cell (IO.Cell) (BC–6) Figure21-7. General Arrangement for Bidirectional Pins MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 21-6 Freescale Semiconductor

IEEE 1149.1 Test Access Port (JTAG) 21.5 Instruction Register The MCF5272 IEEE 1149.1 implementation includes the three mandatory public instructions (EXTEST, SAMPLE/PRELOAD, and BYPASS), the optional public ID instruction, plus two additional public instructions (CLAMP and HI-Z) defined by IEEE 1149.1. The MCF5272 includes a 4-bit instruction register without parity, consisting of a shift register with four parallel outputs. Data is transferred from the shift register to the parallel outputs during the update-IR controller state. The 4 bits are used to decode the instructions in Table21-2. The parallel output of the instruction register is reset to 0001 in the test-logic-reset controller state. Note that this preset state is equivalent to the ID instruction. Table21-2. Instructions B[3:0] Instruction Description 0000 EXTEST The external test (EXTEST) instruction selects the boundary scan register. EXTEST asserts internal reset for the MCF5272 system logic to force a predictable benign internal state while performing external boundary scan operations. By using the TAP, the register is capable of a) scanning user-defined values into the output buffers, b) capturing values presented to input pins, c) controlling the direction of bidirectional pins, and d) controlling the output drive of three-state output pins. For more details on the function and uses of EXTEST, please refer to the IEEE 1149.1 document. 0001 ID During the capture-IR controller state, the parallel inputs to the instruction shift register are loaded with the 4-bit binary value (0001). The parallel outputs, however, remain unchanged by this action since an update-IR signal is required to modify them. 0010 SAMPLE/ The SAMPLE/PRELOAD instruction selects the boundary scan register and provides two separate PRELOAD functions. First, it provides a means to obtain a snapshot of system data and control signals. The snapshot occurs on the rising edge of TCK in the capture-DR controller state. The data can be observed by shifting it transparently through the boundary scan register. Because there is no internal synchronization between the IEEE 1149.1 clock (TCK) and the system clock (CLKOUT), the user must provide some form of external synchronization to achieve meaningful results. The second function of SAMPLE/PRELOAD is to initialize the boundary scan register output bits prior to selection of EXTEST. This initialization ensures that known data appears on the outputs when entering the EXTEST instruction. 1001 HI-Z The HI-Z instruction anticipates the need to backdrive the output pins and protect the input pins from random toggling during circuit board testing. The HIGHZ instruction selects the bypass register, forcing all output and bidirectional pins to the high-impedance state. The HI-Z instruction goes active on the falling edge of TCK in the update-IR state when the data held in the instruction shift register is equivalent to octal 5. 1100 CLAMP When the CLAMP instruction is invoked, the boundary scan multiplexer control signal EXTEST is asserted, and the BYPASS register is selected. CLAMP should be invoked after valid data has been shifted into the boundary scan register, e.g., by SAMPLE/PRELOAD. CLAMP allows static levels to be presented at the MCF5272 output and bidirectional pins, like EXTEST, but without the shift latency of the boundary scan register from TDI to TDO. 1101 Reserved Reserved 1111 BYPASS The BYPASS instruction selects the single-bit bypass register as shown in Figure21-8. This creates a shift register path from TDI to the bypass register and, finally, to TDO, circumventing the boundary scan register. This instruction is used to enhance test efficiency when a component other than the MCF5272 becomes the device under test. When the bypass register is selected by the current instruction, the shift register stage is set to a logic zero on the rising edge of TCK in the capture-DR controller state. Therefore, the first bit to be shifted out after selecting the bypass register is always a logic zero. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 21-7

IEEE 1149.1 Test Access Port (JTAG) Figure 21-8 shows the structure of the bypass register. Figure21-8. Bypass Register 21.6 Restrictions The control afforded by the output enable signals using the boundary scan register and the EXTEST instruction requires a compatible circuit board test environment to avoid configurations that could damage the device. The user must avoid situations in which the MCF5272 output drivers are enabled into actively driven networks. Overdriving the TDO driver when it is active is not recommended. 21.7 Non-IEEE 1149.1 Operation In non-IEEE 1149.1 operation, IEEE 1149.1 test logic must be made transparent to system logic by forcing the TAP controller into test-logic-reset state, which takes at least five consecutive TCK rising edges with TMS high. TMS has an internal pull-up resistor and may be left unconnected. If TMS is unconnected or connected to V , the TAP controller cannot exit test-logic-reset state, CC regardless of the TCK state. This requires the TMS, TCK, and TDI inputs to be high. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 21-8 Freescale Semiconductor

Chapter 22 Mechanical Data This chapter contains drawings showing the pinout and the packaging and mechanical characteristics of the MCF5272. 22.1 Pinout Figure 22-1 shows a pinout of the MCF5272. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A DDATA3 DDATA1 TEA TDDSII/ DD106/ DD128/ DD251/ DD262/ BS0 RAS0 SSDAD1AA311/21/ SSDAD2AA/10/ SSDAD3AA/21/ SSDAD4AA/32/ B PST0 DDATA2 MTMOD BTKMPST/ A20 DD117/ DD240/ DD273/ SDWE SCDSC7S/ SAD1A21/1 SAD1A/0 SSDAD5AA/43/ SSDAD6AA/54/ C PST2 PST1 DDATA0 PSTTCCKL/K A21 A18 DD139/ BS1 CAS0 SSDAD1AA411/32/ SAD1A19/ SSDAD7AA/65/ SSDAD8AA/76/ SSDAD9AA/87/ D USPBA_1R/P USPBA_0T/P PST3 DTSRCSLTK/ TDDSOO/ A19 A17 A16 A15 A0 PDC1144/ SSADD1AA098// SDCLKE A10_PRECHG E USPBA_6R/XD USBP_AT5X/EN USBP_AS4U/SP USPBA_3T/N USPBA_2R/N TEST GND GND A22 PDC1155/ PDC1133/ BS2 BS3 SDCLK F USB_D+ USB_D- PTBA5/ RSTO VDD VDD GND GND VDD VDD PDC1122/ DD284/ DD295/ DD2160/ G USB_VDD USB_GND URPTB04_C/LK PB6 VDD GND GND GND GND VDD PDC1111/ DD2171/ DD2182/ DD2193/ H URTP0B_1R/XD URTP0B_2C/TS URTP0B_3R/TS URTP0B_0T/XD VDD GND GND GND GND VDD PDC1100/ SDBA1 DD3115/ DD3104/ J USB_CLK FFPSSACR800// DPGAN9T/0 URDTC1L_0C/LK VDD VDD GND GND VDD VDD D7 D8 D9 SDBA0 K URDT1IN_0R/XD UQRSTP1I__CCST2S/ URTIN1T_5RTS/ URDTO1U_TT0X/D DPRAE1Q00/ PWMT_INO1UT2/ VDD VDD BCOSO0T/ CS1 PDC33/ PDC44/ PDC55/ PDC66/ L QSPPAI1_1C/S1 DPFAS1C22/ DPFAS1C33/ DFFFSSSCRC111// QSBPUIS_WC1LK/ TIN0 E_TXCLK EP_BT1X0D/1 EP_BR1X4E/R E_CRS CS5 PDC00/ PDC11/ PDC22/ M GDCDLC1L_1O/UT DPRAE1Q41/ DPGAN1T51_I_NINTT66/ USIBN_TW1/OR QSBPUIS_WCS00/ TPOBU7T/0 E_RXDV E_PTBX9D/2 EP_BR1X3D/1 E_TXER CS4 RSTI BYPASS CLKIN N DOUT1 DIN1 INT3 QSPWI_SDEOLUT/ PWM_OUT0 E_TXD0 E_RXCLK E_PTBX8D/3 EP_BR1X2D/2 E_MDIO CS3 DTREENSE VDD HiZ P QSDPPOIA_U7CT/S33/ DININT34/ INT2 QSPI_DIN PWTMO_UOTU1T1/ E_COL E_RXD0 E_TXEN EP_BR1X1D/3 EP_BM1D5C/ CS2 CS6 ORED/ R/W Figure22-1. MCF5272 Pinout (196 MAPBGA) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 22-1

Mechanical Data 22.2 Package Dimensions Figure 22-2 shows MCF5272 package dimensions. Figure22-2. 196 MAPBGA Package Dimensions (Case No. 1128A-01) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 22-2 Freescale Semiconductor

Chapter 23 Electrical Characteristics This chapter describes AC and DC electrical specifications and thermal characteristics for the MCF5272 microcontroller. Because additional speeds may have become available since the publication of this book, consult Freescale’s ColdFire web page, http://www.freescale.com, to confirm that this is the latest information. 23.1 Maximum Ratings This section contains information on the maximum ratings of the MCF5272 microcontroller. 23.1.1 Supply, Input Voltage, and Storage Temperature Table 23-1 lists maximum voltages and temperatures. Table23-1. Maximum Supply, Input Voltage and Storage Temperature Rating Symbol Value Unit Supply voltage V –0.3 to + 4.0 V DD Maximum operating voltage V +3.6 V DD Minimum operating voltage V +3.0 V DD Input voltage V –0.5 to +5.5 V in Storage temperature range T –55 to 150 °C stg The ratings in Table23-1 define maximum conditions to which the MCF5272 may be subjected without being damaged. However, the device cannot operate normally while exposed to these electrical extremes. This device contains circuitry that protects against damage from high static voltages or electrical fields; however, normal precautions should be taken to avoid application of voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability improves when unused inputs are tied to an appropriate logic voltage level (GND or V ). DD MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-1

Electrical Characteristics 23.1.2 Operating Temperature Table 23-2 lists operating temperatures. Table23-2. Operating Temperature Value Characteristic Symbol Unit Standard Extended Maximum operating junction temperature T 100 115 °C J Maximum operating ambient temperature T 701 851 °C Amax Minimum operating ambient temperature T 0 -40 °C Amin 1 Use this maximum operating ambient temperature only as a system design guideline. All device operating parameters are guaranteed only when the junction temperature lies within the specified range. 23.1.3 Resistance Table 23-3 lists thermal resistance values. Table23-3. Thermal Resistance Characteristic Symbol Value Unit Junction to ambient, natural convection Single layer board (1s) θ 511,2 °C/W JA Junction to ambient, natural convection Four layer board (2s2p) θ 261,3 °C/W JMA Junction to ambient (@200 ft/min) Single layer board (1s) θ 411,3 °C/W JMA Junction to ambient (@200 ft/min) Four layer board (2s2p) θ 231,3 °C/W JMA Junction to board θ 154 °C/W JB Junction to case θ 105 °C/W JC Junction to top of package Natural convection Ψ 21,6 °C/W jt 1 θ and Ψ parameters are simulated in accordance with EIA/JESD Standard 51-2 for natural convection. Freescale JA jt recommends the use of θ and power dissipation specifications in the system design to prevent device junction temperatures JA from exceeding the rated specification. System designers should be aware that device junction temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature specification can be verified by physical measurement in the customer’s system using the Ψ parameter, the device power dissipation, and jt the method described in EIA/JESD Standard 51-2. 2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal. 3 Per JEDEC JESD51-6 with the board horizontal. 4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-2 Freescale Semiconductor

Electrical Characteristics 23.2 DC Electrical Specifications Table 23-4 lists DC electrical temperatures. Table23-4. DC Electrical Specifications Characteristic Symbol Min Max Unit Operation voltage range V 3.0 3.6 V DD Input high voltage V 2. 0 5.0 V IH Input low voltage V GND 0.8 V IL Input signal undershoot — — 0.8 V Input signal overshoot — — 0.8 V Input leakage current @ GND, V CLKIN, D[31:0], PA[15:0], PB[15:0], TIN[1:0], I — 20 μA DD in IRQ[6:1], CLK, TEA, PST[3:0], DDATA[3:0], RSTI, DRESETEN, TDI, TCK, HIZ, MTMOD HI-Z (three-state) leakage current @GND, V , A[22:0], D[31:0], OE/RD, R/W, I — 20 μΑ DD TSI TDO/DSO Signal low input current, V = 0.8 V, TMS/BKPT, TDI/DSI, TRST/DSCLK I 0 1 mA IL IL Signal high input current, V = 2.0 V TMS/BKPT, TDI/DSI, TRST/DSCLK I 0 1 mA IH IH Output high voltage V 2.4 — V OH Output low voltage V — 0.5 V OL Pin capacitance1 C — 10 pF in 1 This specification periodically sampled but not 100% tested. 23.2.1 Output Driver Capability and Loading Table 23-5 lists values for drive capability and output loading. Table23-5. I/O Driver Capability Signal Drive Capability Output Load (C L) A[22:0] 6 mA 30 pF D[31:0] 6 mA 30 pF CS[6:0] 6 mA 30 pF BS 6 mA 30 pF OE/RD 4 mA 30 pF DACK/HIZ 4 mA 30 pF TC/BYPASS 4 mA 30 pF A10_PRECHG 10 mA 30 pF R/W 10 mA 30 pF SDBA[1:0] 10 mA 30 pF RAS0 10 mA 30 pF CAS0 10 mA 30 pF SDCLK 10 mA 30 pF MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-3

Electrical Characteristics Table23-5. I/O Driver Capability (continued) Signal Drive Capability Output Load (C L) SDWE 10 mA 30 pF SDCLKE 10 mA 30 pF SDCS/CS7 10 mA 30 pF TDO/DSO 4 mA 30 pF TCK/PSTCLK 4 mA 30 pF DDATA[3:0] 4 mA 30 pF PST[3:0] 4 mA 30 pF RSTO 4 mA 30 pF PA[13:0] 2 mA 30 pF PA14 4 mA 30 pF PA15_INT6 2 mA 30 pF PB0,PB3,PB7 4 mA 30 pF PB[2:1],PB[6:4] 2 mA 30 pF PB[10:8] 4 mA 30 pF PB[15:11] 2 mA 30 pF USB_D+ 1 — USB_D- 1 — DOUT1 2 mA 30 pF FSC1 2 mA 30 pF DCL1 4 mA 30 pF URT2_CTS 2 mA 30 pF URT2_RTS 2 mA 30 pF URT2_TxD 2 mA 30 pF QSPI_Dout 4 mA 30 pF QSPI_CLK 4 mA 30 pF QSPI_CS0 2 mA 30 pF PWM_OUT[3:1] 4 mA 30 pF E_TxD0 4 mA 30 pF E_TxEN 2 mA 30 pF E_MDIO 2 mA 30 pF E_TxERR 2 mA 30 pF 1 Requires external protection circuitry to meet USB 1.1 electrical requirements under all conditions (see 12.5.3, “Recommended USB Protection Circuit”). MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-4 Freescale Semiconductor

Electrical Characteristics 23.3 AC Electrical Specifications NOTE AC timing specifications may be subject to change during ongoing qualification. AC timing specifications assume maximum output load capacitance on all output pins including SDCLK. If this value is different, the input and output timing specifications would need to be adjusted to match the clock load. AC timing specifications referenced to SDCLK assume SDRAM control register bit 3 is 0. After reset this bit is set. 23.3.1 Clock Input and Output Timing Specifications Table 23-6 lists clock input and output timings. Table23-6. Clock Input and Output Timing Specifications 0–66 MHz Name Characteristic Unit Min Max Frequency of operation 0 66.00 MHz C1 CLKIN period (T) 1 15 — nS C2 2 CLKIN fall time (from V = 2.4 V to V = 0.5 V) — 2 nS h l C3 2 CLKIN rise time (from V = 0.5 V to V = 2.4 V) — 2 nS l h C4 CLKIN duty cycle (measured at 1.5 V) 45 55 % C4a3 CLKIN pulse-width high (measured at 1.5 V) 6.75 8.25 nS C4b3 CLKIN pulse-width low (measured at 1.5 V) 6.75 8.25 nS 1 The clock period is referred to as T in the electrical specifications. The time for T is always in nS. Timing specifications can be given in terms of T. For example, 2T+5 nS 2 Specification values are not tested. 3 Specification values listed are for maximum frequency of operation. Clock input and output timings listed in Table23-6 are shown in Figure23-1. C1 C2 C3 V h CLKIN V l (input) C4a C4b Figure23-1. Clock Input Timing Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-5

Electrical Characteristics 23.3.2 Processor Bus Input Timing Specifications Table 23-7 lists processor bus input timings. NOTE All processor bus timings are synchronous; that is, input setup/hold and output delay with respect to the rising edge of a reference clock. The reference clock is the SDCLK output. All other timing relationships can be derived from these values. Table23-7. Processor Bus Input Timing Specifications 0–66 MHz Name Characteristic1 Unit Min Max Control Inputs B1a 2 RSTI valid to SDCLK (setup) 6.5 — nS B1b 2 TA valid to SDCLK (setup) 8 — nS B1c 2 TEA valid to SDCLK (setup) 8 — nS B1d 2 INTx valid to SDCLK (setup) 8 — nS B1e 2 BKPT valid to PSTCLK (setup) 10 — nS B1f Mode selects (BUSW[1:0], WSEL, HiZ) valid to SDCLK (setup) (when RSTI asserted) 8 — nS B2d SDCLK to asynchronous control inputs (RSTI, TA, TEA, INTx) invalid (hold) 2 — nS B2e SDCLK to mode selects (BUSW[1,0], WSEL, HIZ) invalid (hold) (when RSTI asserted) 2 — nS B2f PSTCLK to asynchronous control input BKPT invalid (hold) 0 — nS B3 RSTI width low 10T — nS Data Inputs B4 Data input (D[31:0]) valid to SDCLK (setup) 14 — nS B5 SDCLK to data input (D[31:0]) invalid (hold) 0 — nS 1 All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0. 2 RSTI, TA, TEA, and INTx are synchronized internally. The setup time must be met only if recognition is needed on a particular clock edge. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-6 Freescale Semiconductor

Electrical Characteristics Timings listed in Table 23-7 are shown in Figure 23-2. 1.5V SDCLK Output T SETUP T HOLD Input Setup And Hold Invalid 1.5V Valid 1.5V Invalid t = 1.5 nS rise V = V h IH Input Rise Time Vl = VIL t = 1.5 nS fall V = V h IH Input Fall Time V = V l IL SDCLK B4 B5 Inputs * The timings are also valid for inputs sampled on the negative clock edge. Figure23-2. General Input Timing Requirements MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-7

Electrical Characteristics 23.3.3 Processor Bus Output Timing Specifications Table 23-8 lists processor bus output timings. Table23-8. Processor Bus Output Timing Specifications 0–66 MHz Name Characteristic 1 Unit Min Max Control Outputs B6a SDCLK to chip selects (CS[6:0]) valid — 12 nS B6b SDCLK to byte enables (BS[3:0]) valid — 9.5 nS B6c SDCLK to output enable (OE) valid — 9.0 nS B6d SDCLK to write enable (R/W) valid — 8 nS B6e SDCLK to reset output (RSTO) valid — 13.5 nS B7a SDCLK to control output (CS[6:0], OE) invalid (output hold) 1.5 — nS B7b SDCLK to control output (BS[3:0], R/W) invalid (output hold) 1.0 — nS B7c SDCLK to reset output (RSTO) invalid (output hold) 4 — nS Address and Attribute Outputs B8 SDCLK to address (A[22:0]) valid — 13.0 nS B9 SDCLK to address (A[22:0]) invalid (output hold) 1.5 — nS Data Outputs B11 SDCLK to data output (D[31:0]) valid — 11 nS B122 SDCLK to data output (D[31:0]) invalid (output hold) 1 — nS B13 SDCLK to data output (D[31:0]) high impedance — 6 nS 1 All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0. 2 Data output is held valid for one CPU clock period after deassertion of BS[3:0] NOTE Above 48 MHz, the memory bus may need to be configured for one wait state. It is the responsibility of the user to determine the actual frequency at which to insert a wait state since this depends on the access time of SRAM or SDRAM used in a particular system implementation. Wait states are inserted for SRAM accesses by programming bits 6–2 of the chip select option registers. A wait state is added for SDRAM read accesses by setting bit 4 of the SDRAM control register. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-8 Freescale Semiconductor

Electrical Characteristics Read/write SRAM bus timings listed in Table 23-8 are shown in Figure23-3, Figure 23-4, Figure 23-5, and Figure23-6. S0 S1 S2 S3 S4 S5 S0 S1 S2 S3 S4 S5 S0 S1 S2 SDCLK B6a B7a B6a B7a CSn B8 B9 B8 B9 A[22:0] B6c B7a OE B6d B7b R/W (H) B6b B7b B6b B7b BS[3:0] B12 B4 B11 D[31:0] B5 B13 TA (H) TEA (H) Figure23-3. Read/Write SRAM Bus Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-9

Electrical Characteristics Figure 23-4 shows an SRAM bus cycle terminated by TA showing timings listed in Table 23-8. S0 S1 S2 S3 S4 S5 SW0 SW1 S0 S1 SDCLK B6a B7a CSn B8 B9 A[22:0] B6c B7a OE R/W (H) B6b B7b BS[3:0] B4 D[31:0] B1b B5 TA B2d TEA (H) Figure23-4. SRAM Bus Cycle Terminated by TA MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-10 Freescale Semiconductor

Electrical Characteristics Figure 23-5 shows an SRAM bus cycle terminated by TEA showing timings listed in Table 23-8. S0 S1 S2 S3 S4 S5 SW0 SW1 S0 S1 SDCLK B6a B7a CSn B8 B9 A[22:0] B6c B7a OE R/W(H) B6b B7b BS[3:0] D[31:0] TA (H) B1c B2d TEA Figure23-5. SRAM Bus Cycle Terminated by TEA MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-11

Electrical Characteristics Figure 23-6 shows reset and mode Select/HIZ configuration timing showing parameters listed in Table 23-8. SDCLK B3 Reset is asynchronous. RSTI Assert for at least 2 consecutive SDCLK rising edges B1f Mode selects (BUSW[1,0], WSEL,HIZ) B2e Figure23-6. Reset and Mode Select/HIZ Configuration Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-12 Freescale Semiconductor

Electrical Characteristics 23.4 Debug AC Timing Specifications Table 23-9 lists specifications for the debug AC timing parameters shown in Figure 23-8. Table23-9. Debug AC Timing Specification 0-66 MHz Num Characteristic Units Min Max D1 PST[3:0], DDATA[3:0] to PSTCLK valid — 8.5 nS D2 PSTCLK to PST[3:0], DDATA[3:0] hold 1 — nS D3 DSI-to-DSCLK setup 1 — PSTCLKs D4 1 DSCLK-to-DSO hold 4 — PSTCLKs D5 DSCLK cycle time 5 — PSTCLKs 1 DSCLK and DSI are synchronized internally. D4 is measured from the synchronized DSCLK input relative to the rising edge of PSTCLK. Figure 23-7 shows real-time trace timing for the values in Table 23-9. PSTCLK D1 D2 PST[3:0], DDATA[3:0] Figure23-7. Real-Time Trace AC Timing Figure 23-8 shows BDM serial port AC timing for the values in Table 23-9. PSTCLK D5 DSCLK D3 DSI Current Next D4 DSO Past Current Figure23-8. BDM Serial Port AC Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-13

Electrical Characteristics 23.5 SDRAM Interface Timing Specifications Table 23-10 lists SDRAM interface timings. Table23-10. SDRAM Interface Timing Specifications 0–66 MHz Name Characteristic 1 Unit Min Max Control Inputs SD1 SDCLK to address output A[22:0] valid — 13.0 nS SD2 SDCLK to address output A[22:0] invalid (output hold) 1 — SD3 SDCLK to DQM[3:0] valid — 9 nS SD4 SDCLK to DQM[3:0] invalid (output hold) 1.0 — SD5 SDCLK to data output (D[31:0]) valid (signal from driven or three-state) — 13.0 nS SD6 SDCLK to data output (D[31:0]) invalid (output hold) 1 — SD7 SDCLK to CAS0, RAS0, SDBA[1:0], SDCLKE, SDRAMWE, valid — 7 nS SD8 SDCLK to CAS0, RAS0, SDBA[1:0], SDCLKE, SDRAMWE, invalid (output hold) 1 — SD9 SDCLK to SDCS valid — 8 nS SD10 SDCLK to SDCS invalid (output hold) 1.0 — SD11 SDCLK to A10_PRECHG valid — 9.5 SD12 SDCLK to A10_PRECHG invalid (output hold) 1.0 — SD13 SDCLK to data output (D[31:0]) high impedance — 6 nS SD14 Data input (D[31:0]) valid to SDCLK (setup) (pipeline mode, SDRAM control register b4 5.5 — nS = 1) SD15 Data input (D[31:0]) valid to SDCLK (setup) (straight-through mode, SDRAM control 13.0 — nS register b4 = 0) SD16 SDCLK to data input (D[31:0]) invalid (hold) 0 — nS 1 All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0. Figure 23-9 shows SDRAM timings listed in Table23-10. NOTE Above 48 MHz, the memory bus may need to be configured for one wait state. It is the responsibility of the user to determine the actual frequency at which to insert a wait state since this depends on the access time of SRAM or SDRAM used in a particular system implementation. Wait states are inserted for SRAM accesses by programming bits 6–2 of the chip select option registers. A wait state is added for SDRAM read accesses by setting bit 4 of the SDRAM control register. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-14 Freescale Semiconductor

Electrical Characteristics T0 T1 T2 T3 T4 T5 T6 SDCLK SD1 SDADR[13:0] Col Col Col Col SD2 SD11 A10_PRECHG SD12 SD7 SDBA[1:0] SD8 SD9 SDCS SD10 SD8 RAS0 SD7 SD7 CAS0 SD8 SD7 SDCLKE SD8 SDWE SD7 SD8 SD4 SD3 DQMx SD14 DATA IN (READ SDCR (b4=1)) SD16 SD15 DATA IN (READ SDCR (b4=0)) SD16 SD5 SD6 SD13 DATA OUT (WRITE) Figure23-9. SDRAM Signal Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-15

Electrical Characteristics Figure 23-10 shows SDRAM self-refresh timings listed in Table23-10. SDCLK SD7 SDWE SD7 RAS0 SD8 SD7 CAS0 SD8 Figure23-10. SDRAM Self-Refresh Cycle Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-16 Freescale Semiconductor

Electrical Characteristics 23.6 Fast Ethernet AC Timing Specifications MII signals use TTL signal levels compatible with devices operating at either 5.0 V or 3.3 V. 23.6.1 MII Receive Signal Timing (E_RxD[3:0], E_RxDV, E_RxER, and E_RxCLK) The receiver functions correctly up to a E_RxCLK maximum frequency of 25 MHz +1%. There is no minimum frequency requirement. In addition, the processor clock frequency must exceed twice the E_RxCLK frequency. Table 23-11 lists MII receive channel timings. Table23-11. MII Receive Signal Timing Num Characteristic 1 Min Max Unit M1 E_RxD[3:0], E_RxDV, Rx_ERR to E_RxCLK setup 5 — nS M2 E_RxCLK to E_RxD[3:0], E_RxDV, Rx_ERR hold 5 — nS M3 E_RxCLK pulse-width high 35% 65% E_RxCLK period M4 E_RxCLK pulse-width low 35% 65% E_RxCLK period 1 E_RxDV, E_RxCLK, and E_RxD0 have same timing in 10 Mbit 7-wire interface mode. Figure 23-11 shows MII receive signal timings listed in Table23-11. M3 E_RxCLK (input) M4 E_RxD[3:0] (inputs) E_RxDV E_RxER M1 M2 Figure23-11. MII Receive Signal Timing Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-17

Electrical Characteristics 23.6.2 MII Transmit Signal Timing (E_TxD[3:0], E_TxEN, E_TxER, E_TxCLK) Table 23-12 lists MII transmit channel timings. The transmitter functions correctly up to a E_TxCLK maximum frequency of 25MHz+1%. There is no minimum frequency requirement. In addition, the processor clock frequency must exceed twice the E_TxCLK frequency. The transmit outputs (E_TxD[3:0], E_TxEN, E_TxER) can be programmed to transition from either the rising or falling edge of E_TxCLK, and the timing is the same in either case. This options allows the use of non-compliant MII PHYs. Refer to the Ethernet chapter for details of this option and how to enable it. Table23-12. MII Transmit Signal Timing Num Characteristic1 Min Max Unit M5 E_TxCLK to E_TxD[3:0], E_TxEN, E_TxER invalid 5 — nS M6 E_TxCLK to E_TxD[3:0], E_TxEN, E_TxER valid — 25 nS M7 E_TxCLK pulse-width high 35% 65% E_TxCLK period M8 E_TxCLK pulse-width low 35% 65% E_TxCLK period 1 E_TxCLK, ETxD0, and E_TxEN have the same timing in 10 Mbit 7-wire interface mode. Figure 23-12 shows MII transmit signal timings listed in Table 23-12. M7 E_TxCLK (input) M5 M8 E_TxD[3:0] (outputs) E_TxEN E_TxER M6 Figure23-12. MII Transmit Signal Timing Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-18 Freescale Semiconductor

Electrical Characteristics 23.6.3 MII Async Inputs Signal Timing (CRS and COL) Table 23-13 lists MII asynchronous inputs signal timing. Table23-13. MII Async Inputs Signal Timing Num Characteristic Min Max Unit M91 E_CRS, E_COL minimum pulse width 1.5 — E_TxCLK period 1 E_COL has the same timing in 10 Mbit 7-wire interface mode. Figure 23-13 shows MII asynchronous input timings listed in Table23-13. E_CRS, E_COL M9 Figure23-13. MII Async Inputs Timing Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-19

Electrical Characteristics 23.6.4 MII Serial Management Channel Timing (MDIO and MDC) Table 23-14 lists MII serial management channel timings. The FEC functions correctly with a maximum MDC frequency of 2.5 MHz. Table23-14. MII Serial Management Channel Timing Num Characteristic Min Max Unit M10 MDC falling edge to MDIO output invalid (minimum propagation delay) 0 — nS M11 MDC falling edge to MDIO output valid (max prop delay) — 25 nS M12 MDIO (input) to MDC rising edge setup 10 — nS M13 MDIO (input) to MDC rising edge hold 0 — nS M14 MDC pulse-width high 40% 60% MDC period M15 MDC pulse-width low 40% 60% MDC period Figure 23-14 shows MII serial management channel timings listed in Table23-14. M14 M15 MDC (output) M10 MDIO (output) M11 MDIO (input) M12 M13 Figure23-14. MII Serial Management Channel Timing Diagram MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-20 Freescale Semiconductor

Electrical Characteristics 23.7 Timer Module AC Timing Specifications Table 23-15 lists timer module AC timings. Table23-15. Timer Module AC Timing Specifications 0–66 MHz Name Characteristic 1 Unit Min Max T1 TIN1 cycle time 3T — nS T2 TIN1 valid to SDCLK (setup) 6 — nS T3 SDCLK to TIN[1:0] invalid (hold) 0 — nS T4 TIN1 pulse width 1T — nS 1 All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0. Figure 23-15 shows timer module timings listed in Table 23-15. SDCLK T4 TIN1 IN (Capture Mode Synchronization) T2 T3 T1 TIN1 IN (Clock Mode) T2 T2 T3 Figure23-15. Timer Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-21

Electrical Characteristics 23.8 UART Modules AC Timing Specifications Table 23-16 lists UART AC timings. Table23-16. UART Modules AC Timing Specifications 0–66 MHz Name Characteristic 1 Unit Min Max UT1 URTnRxD valid to SDCLK (setup) 6 — nS UT2 SDCLK to URTn_RxD invalid (hold) 0 — nS UT3 URTn_CTS valid to SDCLK (setup) 6 — nS UT4 SDCLK to URTn_CTS invalid (hold) 0 — nS UT5 SDCLK to URTn_TxD valid — 7 nS UT6 SDCLK to URTn_TxD invalid (output hold) 3 — nS UT7 SDCLK to URTn_RTS valid — 7 nS UT8 SDCLK to URTn_RTS invalid (output hold) 3 — nS 1 All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0. Figure 23-16 shows UART module timings listed in Table 23-16. SDCLK UT1 URTn_RxD UT2 UT3 URTn_CTS UT4 UT5 URTn_TxD UT6 UT7 URTn_RTS UT8 Figure23-16. UART Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-22 Freescale Semiconductor

Electrical Characteristics 23.9 PLIC Module: IDL and GCI Interface Timing Specifications Table 23-17 shows timing for IDL master mode, PLIC ports 1, 2, and 3. Table23-17. IDL Master Mode Timing, PLIC Ports 1, 2, and 3 Name Characteristic Min Typ Max Unit P1 1, 2 DFSC[1:3] period 125 µS P2 Delay from rising edge of GDCL1_OUT to rising edge of DFSC[3:1] — — 20 nS P3 Delay from rising edge of GDCL1_OUT to DFSC[3:1] Invalid (output Hold 2 — — nS P4 3, 2 GDCL1_OUT clock period 20T — — P5 4, 2 GDCL1_OUT pulse-width high 45 50 55 % of period P6 4, 2 GDCL1_OUT pulse-width low 45 50 55 % of period P7 Delay from rising edge of GDCL1_OUT to Low-Z and valid data on DOUT[1,3] — — 30 nS P8 Delay from rising edge of GDCL1_OUT to DOUT[3:1] Invalid (Output Hold) 2 — — nS P9 Delay from rising edge of GDCL1_OUT to High-Z on DOUT[1,3] — — 30 nS P10 Data valid on DIN[1:3] before falling edge of GDCL1_OUT (setup time) 25 — — nS P11 Data valid on DIN[1:3] after falling edge of GDCL1_OUT (hold time) 25 — — nS 1 For most telecommunications applications the period should be set to 125 µS. Refer to clock generator planning in PLIC chapter. 2 Same as DCL0 and FSC0 if internal clock generator configured for pass-through mode. 3 GDCL1_OUT must be less than 1/20th of the CPU operating frequency. This is to ensure minimum jitter to CODECs that may be connected to Ports 1,2,3. 4 Based on generated GDCL1_OUT less than 1/20 of CPU clock frequency. Figure 23-17 shows IDL master timings listed in Table23-17. P1 DFSC[3:1] P2 P3 P4 P5 GDCL1_OUT P6 P8 P9 P7 DOUT1, DOUT3 P11 P10 DIN1, DIN3 Figure23-17. IDL Master Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-23

Electrical Characteristics Table 23-18 lists timing for IDL slave mode. Table23-18. IDL Slave Mode Timing, PLIC Ports 0–3 Name Characteristic Min Typ Max Unit P14 1 FSR0, FSR1 period — 125 — μs P15a FSR0 or FSC0 valid before the falling edge of DCL0 (setup time) 25 — — nS P22 DCL clock frequency 256 — 4096 Khz P23 DCL pulse-width high 45 — 55 % of DCL period P24 DCL pulse-width low 45 — 55 % of DCL period P15b FSR1 or FSC1 valid before the falling edge of DCL1 (setup time) 25 — — nS P16a DCL0 to FSR0 or FSC0 input Invalid (hold time) 25 — — nS P16b DCL1 to FSR1 or FSC1 input Invalid (hold time) 25 — — nS P17a Delay from rising edge of DCL0 to low-z and valid data on DOUT0 — — 30 nS P17b Delay from rising edge of DCL1 to low-z and valid data on DOUT1 and — — 30 nS DOUT3 P19a Delay from rising edge of DCL0 to high-z on DOUT0 — — 30 nS P19b Delay from rising edge of DCL1 to high-z on DOUT1 and DOUT3 — — 30 nS P20 2 Delay from rising edge of DCL1 to DFSC2, DFSC3 Invalid (output hold) 2 — — nS P25 Data valid on DIN0 before falling edge of DCL0 (setup time) 25 — — nS P25 Data valid on DIN1, DIN3 before falling edge of DCL1 (setup time) 25 — — nS P26 Data valid on DIN0 after falling edge of DCL0 (hold time) 25 — — nS P26 Data valid on DIN1, DIN3 after falling edge of DCL1 (hold time) 25 — — nS 1 FSR occurs on average every 125 μs. 2 In IDL slave mode, DCL may be any frequency multiple of 8 KHz between 256 KHz and 4.096 MHz inclusive. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-24 Freescale Semiconductor

Electrical Characteristics Figure 23-18 shows IDL slave timings listed in Table 23-18. P14 FSR[0,1] P16 P15 DOUT[0,1,3] P18 P19 P17 P22 DCL[0:1] P23 P20 P21 P24 DFSC[2:3] P14 P26 P25 DIN[0:3] Figure23-18. IDL Slave Timing Table 23-19 lists timings for GCI slave mode. Table23-19. GCI Slave Mode Timing, PLIC Ports 0–3 Name Characteristic Min Max Unit P30 FSC input high before the falling edge of DCL0, DCL1 (setup time) 25 — nS P31 FSC0 input low before the rising edge of DCL0 (deassertion setup time), 25 nS FSC1 input low before the rising edge of DCL1 (deassertion setup time) P32 FSC0 input high after the falling edge of DCL0 (hold time), 25 — nS FSC1 input high after the falling edge of DCL1 (hold time) P33 DCL0, DCL1 clock frequency — 8192 KHz P34 DCL0, DCL1 pulse-width low 45 55 % of DCL period P35 DCL0, DCL1 pulse-width high 45 55 % of DCL period P38 Delay from rising edge of FSC0 to low-z and valid data on DOUT0 — 30 nS Delay from rising edge of FSC1 to low-z and valid data on DOUT1 Delay from rising edge of DFSC2 to low-z and valid data on DOUT1 Delay from rising edge of DFSC3 to low-z and valid data on DOUT1, DOUT3 P39 Delay from rising edge of DCL0 to data valid on DOUT0, — 30 nS Delay from rising edge of DCL1 to data valid on DOUT1, DOUT3 P40 Delay from rising edge of DCL0 to high-z on DOUT0, — 30 nS Delay from rising edge of DCL1 to high-Z on DOUT1, DOUT3 P41 Data valid on DIN0 before rising edge of DCL0, 25 — nS Data valid on DIN1 or DIN3 before rising edge of DCL1 P42 Data valid on DIN0 after rising edge of DCL0, 25 — nS Data valid on DIN1 or DIN3 after rising edge of DCL1 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-25

Electrical Characteristics Figure 23-19 shows GCI slave timings listed in Table23-19. P33 P35 DCL[0:1] P30 P31 P34 P32 FSC[0,1] DFSC[2,3] P38 P39 P40 DOUT[0,1,3] P41 P42 DIN[0,1,3] Figure23-19. GCI Slave Mode Timing Table 23-20 lists timings for GCI master mode. Table23-20. GCI Master Mode Timing, PLIC PORTs 1, 2, 3 Name Characteristic Min Max Unit Name P50 1 Delay from rising edge of GDCL1_OUT to rising edge of DFSC[1:3] — — 20 nS P51 1 Delay from rising edge of GDCL1_OUT to falling edge of DFSC[1:3] — — 20 nS P52 2,3 GDCL1_OUT clock period 20T — — nS P53 2,4 GDCL1_OUT pulse-width low 45 50 55 % of period P54 2,4 GDCL1_OUT pulse-width high 45 50 55 % of period P57 Delay from rising edge of GDCL1_OUT to Low-Z and valid data on DOUT[1,3] — — 30 nS P58 Delay from rising edge of GDCL1_OUT to data valid on DOUT[1,3] — — 30 nS P59 Delay from rising edge of GDCL1_OUT to High-Z on DOUT[1,3] — — 30 nS P60 Data valid on DIN[1:3] before rising edge of GDCL1_OUT (setup time) 25 — — nS P61 Data valid on DIN[1:3] after rising edge of GDCL1_OUT (hold time) 25 — — nS 1 For most telecommunications applications the period of DFSC[1:3] should be set to 125 µS. Refer to clock generator planning in PLIC chapter. 2 GDCL1_OUT must be less than 1/20th of the CPU operating frequency to ensure minimum jitter to CODECs connected to Ports 1, 2, 3. 3 Same as DCL0 and FSC0 if internal clock generator configured for pass-through mode. 4 Based on generated GDCL1_OUT less than 1/20 of CPU clock frequency. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-26 Freescale Semiconductor

Electrical Characteristics Figure 23-20 shows GCI master timings listed in Table 23-20. P52 P54 GDCL1_OUT P51 P53 P50 DFSC1 DFSC2 DFSC3 P57 P58 P59 DOUT1 DOUT3 P60 P61 DIN1 DIN3 Figure23-20. GCI Master Mode Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-27

Electrical Characteristics 23.10 General-Purpose I/O Port AC Timing Specifications Table 23-21 lists GPIO port timings. Table23-21. General-Purpose I/O Port AC Timing Specifications 0–66 MHz Name Characteristic 1 Unit Min Max G1 PORTx input setup time to SDCLK (rising) 6 — nS G2 PORTx input hold time from SDCLK (rising) 0 — nS G3 SDCLK to PORTx output valid — 11.5 nS G4 SDCLK to PORTx output invalid (output hold) 1 — nS 1 All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0. Figure 23-21 shows GPIO timings listed in Table 23-21. SDCLK P1 PORTx IN P2 P3 PORTx OUT P4 Figure23-21. General-Purpose I/O Port Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-28 Freescale Semiconductor

Electrical Characteristics 23.11 USB Interface AC Timing Specifications Table 23-22 lists USB interface timings. Table23-22. USB Interface AC Timing Specifications 48-66 MHz Name Characteristic Unit Min Max US1 USB_CLK frequency of operation 1 48 48 MHz US2 2 USB_CLK fall time (from V = 2.4V to V = 0.5V) — 2 nS h l US3 2 USB_CLK rise time (from V = 0.5V to V = 2.4V) — 2 nS l h US4 USB_CLK duty cycle (measured at 1.5 V) 45 55 % US5 USB Inputs (USB_RP, USB_RN, USB_RxD) setup time to USB_CLK (rising) 6 — nS US6 USB Inputs (USB_RP, USB_RN, USB_RxD) hold time from USB_CLK (rising) 6 — nS US7 USB_CLK to USB outputs valid (USB_TP, USB_TN, USB_SUSP, USB_TxEN) — 12 nS US8 USB_CLK to USB outputs invalid (output hold) (USB_TP, USB_TN, USB_SUSP, USB_TxEN) 3 — nS 1 USB_CLK accuracy should be +- 500ppm or better. USB_CLK may be stopped to conserve power. 2 Specification values are not tested. NOTE USB signals are sampled; setup and hold times are not normally required in a transceiver connection. Figure 23-22 shows USB timings listed in Table 23-22. US1 US2 US3 V USB_CLK h (input) Vl US4b US4a US5 USB_RP USB_RN USB_RxD US6 USB_TP US7 USB_TN USB_SUSP USB_TxEN US8 Figure23-22. USB Interface Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-29

Electrical Characteristics 23.12 IEEE 1149.1 (JTAG) AC Timing Specifications Table 23-23 lists JTAG timings. Table23-23. IEEE 1149.1 (JTAG) AC Timing Specifications 0–66 MHz Name Characteristic Unit Min Max — TCK frequency of operation 0 10 MHz J1 TCK cycle time 100 — nS J2a TCK clock pulse high width measured at 1.5 V 40 — nS J2b TCK clock pulse low width measured at 1.5 V 40 — nS J3a TCK fall time (from V = 2.4 V to V = 0.5 V) — 5 nS h l J3b TCK rise time (from V = 0.5 V to V = 2.4 V) — 5 nS l h J4 TDI, TMS to TCK rising (setup) 10 — nS J5 TCK rising edge to TDI, TMS invalid (hold) 15 — nS J6 Boundary scan data valid to TCK rising edge (setup) 10 — nS J7 Boundary scan data invalid to TCK rising edge (hold) 15 — nS J8 TRST pulse-width (asynchronous to clock edges) 15 — nS J9 TCK falling edge to TDO valid (signal from driven or three-state) — 30 nS J10 TCK falling edge to TDO high impedance — 30 nS J11 TCK falling edge to boundary scan data valid (signal from driven or three-state) — 35 nS J12 TCK falling edge to boundary scan data high impedance — 35 nS Figure 23-23 shows JTAG timings listed in Table 23-23. J1 J3a J3b V h TCK V l J2b J2a J4 TDI, TMS J5 J6 Boundary Scan Data Inputs J7 J8 TRST J9 J10 TDO J11 J12 Boundary Scan Data Outputs Figure23-23. IEEE 1149.1 (JTAG) Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-30 Freescale Semiconductor

Electrical Characteristics 23.13 QSPI Electrical Specifications Table 23-24 lists QSPI timings. Table23-24. QSPI Modules AC Timing Specifications 0–66 MHz Name Characteristic Unit Min Max QS1 QSPI_CS[3:0] to QSPI_CLK 1T1 127T1 nS QS2 QSPI_CLK high to QSPI_DOUT valid. — 20 nS QS3 QSPI_CLK high to QSPI_DOUT invalid. (Output hold) 0 — nS QS4 QSPI_DIN to QSPI_CLK (Input setup) 10 — nS QS5 QSPI_DIN to QSPI_CLK (Input hold) 10 — nS 1 T is defined as clock period in nS. See Table23-6. The values in Table 23-24 correspond to Figure 23-24. QS1 QSPI_CS[3:0] QSPI_CLK QS2 QSPI_DOUT QS3 QS4 QS5 QSPI_DIN Figure23-24. QSPI Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor 23-31

Electrical Characteristics 23.14 PWM Electrical Specifications Table 23-25 lists PWM timings. Table23-25. PWM Modules AC Timing Specifications 0–66 MHz Name Characteristic 1 Unit Min Max PW1 2 SDLCK high to PWM_OUT[2:0] valid, high or low. — 11 nS PW2 2 SDLCK high to PWM_OUT[2:0] invalid. (Output hold) 2.5 — nS 1 All timing references to SDCLK are given to its rising edge when bit 3 of the SDRAM control register is 0. 2 Parameter tested The values in Table 23-25 correspond to Figure 23-25. SDCLK PW1 PW2 PWM_OUT[2:0] Figure23-25. PWM Timing MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 23-32 Freescale Semiconductor

Appendix A List of Memory Maps The MCF5272 memory map is given in this section. The addresses for the system configuration registers are absolute addresses in the MCF5272 CPU space memory map. The on-chip peripheral modules are configured as a group by programming the module base address register, (MBAR). In the title block for each module is shown the offset address of the given register from the base address programmed in MBAR. The following formula allows calculation of the absolute address of a given register. Absolute address = MBAR + register offset A.1 List of Memory Map Tables TableA-1. On-Chip Module Base Address Offsets from MBAR Module Base Module Mnemonic Address Configuration Registers MBAR+0x0000 CFG_Base Interrupt Registers MBAR+0x0020 INT_Base Chip Select Registers MBAR+0x0040 CS_Base Ports Registers MBAR+0x0080 GPIO_Base QSPI Module Registers MBAR+0x00A0 QSPI_Base PWM Module Registers MBAR+0x00C0 PWM_Base DMA Module Registers MBAR+0x00E0 DMAC_Base UART0 Module Registers MBAR+0x0100 UART0_Base UART1 Module Registers MBAR+0x0140 UART1_Base SDRAM Controller Registers MBAR+0x0180 SDRAMC_Base Timer Module Registers MBAR+0x0200 Timer_Base PLIC Module Registers MBAR+0x0300 PLIC_Base Ethernet Module Registers MBAR+0x0800 ENET_Base USB Module Registers MBAR+0x1000 USB_Base MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor A-1

List of Memory Maps TableA-2. CPU Space Registers Memory Map CPU SPACE NAME Size SYSTEM CONFIGURATION REGISTERS Program Access Debug Access ADDRESS 0x0002 (CACR) 32 Cache Control Register MOVEC RCREG, WCREG 0x0004 (ACR0) 32 Cache Access Control Register 0 MOVEC RCREG, WCREG 0x0005 (ACR1) 32 Cache Access Control Register 1 MOVEC RCREG, WCREG 0x008x A7:A0 32 Address registers A7:A0 MOVE RAREG, WAREG 0x008x D7:D0 32 Data registers D7:D0 MOVE RDREG, WDREG 0x0801 (VBR) 32 Vector Base Register MOVEC RCREG, WCREG 0x080E CCR 8 Condition Code Register (Debug only) MOVE to/from CCR RCREG, WCREG 0x080F PC 32 Program Counter (Debug only) RCREG, WCREG 0x0C00 ROMBAR 32 ROM Base Address Register MOVEC RCREG, WCREG 0x0C04 RAMBAR 32 SRAM Base Address Register MOVEC RCREG, WCREG 0x0C0F MBAR 32 Module Base Address Register MOVEC NOTE MBAR must only be written using the MOVEC instruction. Writing to address MBAR+0x0000 causes unpredictable device operation. TableA-3. On-Chip Peripherals and Configuration Registers Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0000 Module Base Address Register, Read Only (MBAR) 0x0004 System Configuration Register (SCR) Reserved 0x0006 Reserved System Protection Register (SPR) 0x0008 Power Management Register (PMR) 0x000E Reserved Activate Low Power Register (ALPR) 0x0010 Device Identification Register (DIR) TableA-4. Interrupt Control Register Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0020 Interrupt Control Register 1 (ICR1) 0x0024 Interrupt Control Register 2 (ICR2) 0x0028 Interrupt Control Register 3 (ICR3) 0x002C Interrupt Control Register 4 (ICR4) 0x0030 Interrupt Source Register (ISR) 0x0034 Programmable Interrupt Transition Register (PITR) 0x0038 Programmable Interrupt Wakeup Register (PIWR) 0x003F Reserved Programmable Interrupt Vector Register (PIVR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 A-2 Freescale Semiconductor

List of Memory Maps TableA-5. Chip Select Register Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0040 CS Base Register 0 (CSBR0) 0x0044 CS Option Register 0 (CSOR0) 0x0048 CS Base Register 1 (CSBR1) 0x004C CS Option Register 1 (CSOR1) 0x0050 CS Base Register 2 (CSBR2) 0x0054 CS Option Register 2 (CSOR2) 0x0058 CS Base Register 3 (CSBR3) 0x005C CS Option Register 3 (CSOR3) 0x0060 CS Base Register 4 (CSBR4) 0x0064 CS Option Register 4 (CSOR4) 0x0068 CS Base Register 5 (CSBR5) 0x006C CS Option Register 5 (CSOR5) 0x0070 CS Base Register 6 (CSBR6) 0x0074 CS Option Register 6 (CSOR6) 0x0078 CS Base Register 7 (CSBR7) 0x007C CS Option Register 7 (CSOR7) TableA-6. GPIO Port Register Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0080 Port A Control Register (PACNT) 0x0084 Port A Data Direction Register (PADDR) Reserved 0x0086 Reserved Port A Data Register (PADAT) 0x0088 Port B Control Register (PBCNT) 0x008C Port B Data Direction Register (PBDDR) Reserved 0x008E Reserved Port B Data Register (PBDAT) 0x0094 Port C Data Direction Register (PCDDR) Reserved 0x0096 Reserved Port C Data Register (PCDAT) 0x0098 Port D Control Register (PDCNT) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor A-3

List of Memory Maps TableA-7. QSPI Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x00A0 QSPI Mode Register (QMR) Reserved 0x00A4 QSPI Delay Register (QDLYR) Reserved 0x00A8 QSPI Wrap Register (QWR) Reserved 0x00AC QSPI Interrupt Register (QIR) Reserved 0x00B0 QSPI Address Register (QAR) Reserved 0x00B4 QSPI Data Register (QDR) Reserved TableA-8. PWM Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x00C0 PWM Control Register 1 Reserved (PWCR1) 0x00C4 PWM Control Register 2 Reserved (PWCR2) 0x00C8 PWM Control Register 3 Reserved (PWCR3) 0x00D0 PWM Pulse-Width Register Reserved 1 (PWWD1) 0x00D4 PWM Pulse-Width Register Reserved 2 (PWWD2) 0x00D8 PWM Pulse-Width Register Reserved 3 (PWWD3) TableA-9. DMA Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x00E0 DMA Mode Register (DCMR) 0x00E6 DMA Interrupt Register (DCIR) 0x00E8 DMA Byte Count Register (DBCR) 0x00EC DMA Source Address Register (DSAR) 0x00F0 DMA Destination Address Register (DDAR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 A-4 Freescale Semiconductor

List of Memory Maps TableA-10. UART0 Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0100 UART0 Mode Register 1/2 Reserved (U0MR1/U0MR2) 0x0104 UART0 Status (U0SR) Reserved 0x0104 UART0 Clock Select Reserved Register (U0CSR) 0x0108 UART0 Command Register Reserved (U0CR) 0x010C UART0 Receive Buffer Reserved (U0RxB) 0x010C UART0 Transmit Buffer Reserved (U0TxB) 0x0110 UART0 CTS Change Reserved Register (U0CCR) 0x0110 UART0 Auxiliary Control Reserved Register (U0ACR) 0x0114 UART0 Interrupt Status Reserved Register (U0ISR) 0x0114 UART0 Interrupt Mask Reserved Register (U0IMR) 0x0118 UART0 Baud Prescaler Reserved MSB (U0BG1) 0x011C UART0 Baud Prescaler Reserved LSB (U0BG2) 0x0120 UART0 AutoBaud MSB Reserved Register (U0ABR1) 0x0124 UART0 AutoBaud LSB Reserved Register (U0ABR2) 0x0128 UART0 TxFIFO Reserved Control/Status Register (U0TxFCSR) 0x012C UART0 RxFIFO Reserved Control/Status Register (U0RxFCSR) 0x130 UART0 Fractional Precision Reserved Divider Control Registers (UFPDn) 0x0134 UART0 CTS Unlatched Reserved Input (U0IP) 0x0138 UART0 RTS O/P Bit Set Reserved Command Register (U0OP1) 0x013C UART0 RTS O/P Bit Reset Reserved Command Register (U0OP0) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor A-5

List of Memory Maps TableA-11. UART1 Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0140 UART1 Mode Register 1/2 Reserved (U1MR1/U1MR2) 0x0144 UART1 Status (U1SR) Reserved 0x0144 UART1 Clock Select Reserved Register (U1CSR) 0x0148 UART1 Command Register Reserved (U1CR) 0x014C UART1 Receive Buffer Reserved (U1RxB) 0x014C UART1 Transmit Buffer Reserved (U1TxB) 0x0150 UART1 CTS Change Reserved Register (U1CCR) 0x0150 UART1 Auxiliary Control Reserved Register (U1ACR) 0x0154 UART1 Interrupt Status Reserved Register (U1ISR) 0x0154 UART1 Interrupt Mask Reserved Register (U1IMR) 0x0158 UART1 Baud Prescaler Reserved MSB (U1BG1) 0x015C UART1 Baud Prescaler Reserved LSB (U1BG2) 0x0160 UART1 AutoBaud MSB Reserved Register (U1ABR1) 0x0164 UART1 AutoBaud LSB Reserved Register (U1ABR2) 0x0168 UART1 TxFIFO Reserved Control/Status Register (U1TxFCSR) 0x016C UART1 RxFIFO Reserved Control/Status Register (U1RxFCSR) 0x170 UART1 Fractional Precision Reserved Divider Control Registers (UFPDn) 0x0174 UART1 CTS Unlatched Reserved Input (U1IP) 0x0178 UART1 RTS O/P Bit Set Reserved Command Register (U1OP1) 0x017C UART1 RTS O/P Bit Reset Reserved Command Register (U1OP0) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 A-6 Freescale Semiconductor

List of Memory Maps TableA-12. SDRAM Controller Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0180 Reserved SDRAM Configuration Register (SDCR) 0x0184 Reserved SDRAM Timing Register (SDTR) TableA-13. Timer Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0200 Timer 0 Mode Register (TMR0) Reserved 0x0204 Timer 0 Reference Register (TRR0) Reserved 0x0208 Timer 0 Capture Register (TCAP0) Reserved 0x020C Timer 0 Counter Register (TCN0) Reserved 0x0210 Timer 0 Event Register (TER0) Reserved 0x0220 Timer 1 Mode Register (TMR1) Reserved 0x0224 Timer 1 Reference Register (TRR1) Reserved 0x0228 Timer 1 Capture Register (TCAP1) Reserved 0x022C Timer 1 Counter Register (TCN1) Reserved 0x0230 Timer 1 Event Register (TER1) Reserved 0x0240 Timer 2 Mode Register (TMR2) Reserved 0x0244 Timer 2 Reference Register (TRR2) Reserved 0x0248 Timer 2 Capture Register (TCAP2) Reserved 0x024C Timer 2 Counter Register (TCN2) Reserved 0x0250 Timer 2 Event Register (TER2) Reserved 0x0260 Timer 3 Mode Register (TMR3) Reserved 0x0264 Timer 3 Reference Register (TRR3) Reserved 0x0268 Timer 3 Capture Register (TCAP3) Reserved 0x026C Timer 3 Counter Register (TCN3) Reserved 0x0270 Timer 3 Event Register (TER3) Reserved 0x0280 Watchdog Reset Reference Register (WRRR) Reserved 0x0284 Watchdog Interrupt Reference Register (WIRR) Reserved 0x0288 Watchdog Counter Register (WCR) Reserved 0x028C Watchdog Event Register (WER) Reserved MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor A-7

List of Memory Maps TableA-14. PLIC Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0300 Port0 B1 Data Receive (P0B1RR) 0x0304 Port1 B1 Data Receive (P1B1RR) 0x0308 Port2 B1 Data Receive (P2B1RR) 0x030C Port3 B1 Data Receive (P3B1RR) 0x0310 Port0 B2 Data Receive (P0B2RR) 0x0314 Port1 B2 Data Receive (P1B2RR) 0x0318 Port2 B2 Data Receive (P2B2RR) 0x031C Port3 B2 Data Receive (P3B2RR) 0x0320 Port 0 D Data Receive Port 1 D Data Receive Port 2 D Data Receive Port 3 D Data Receive (P0DRR) (P1DRR) (P2DRR) (P3DRR) 0x0328 Port0 B1 Data Transmit (P0B1TR) 0x032C Port1 B1 Data Transmit (P1B1TR) 0x0330 Port2 B1 Data Transmit (P2B1TR) 0x0334 Port3 B1 Data Transmit (P3B1TR) 0x0338 Port0 B2 Data Transmit (P0B2TR) 0x033C Port1 B2 Data Transmit (P1B2TR) 0x0340 Port2 B2 Data Transmit (P2B2TR) 0x0344 Port3 B2 Data Transmit (P3B2TR) 0x0348 Port 0 D Data Transmit Port 1 D Data Transmit Port 2 D Data Transmit Port 3 D Data Transmit (P0DTR) (P1DTR) (P2DTR) (P3DTR) 0x0350 Port0 GCI/IDL Configuration Register (P0CR) Port1 GCI/IDL Configuration Register (P1CR) 0x0354 Port2 GCI/IDL Configuration Register (P2CR) Port3 GCI/IDL Configuration Register (P3CR) 0x0358 Port0 Interrupt Configuration Register (P0ICR) Port1 Interrupt Configuration Register (P1ICR) 0x035C Port2 Interrupt Configuration Register (P2ICR) Port3 Interrupt Configuration Register (P3ICR) 0x0360 Port0 GCI Monitor RX (P0GMR) Port1 GCI Monitor RX (P1GMR) 0x0364 Port2 GCI Monitor RX (P2GMR) Port3 GCI Monitor RX (P3GMR) 0x0368 Port0 GCI Monitor TX (P0GMT) Port1 GCI Monitor TX (P1GMT) 0x036C Port2 GCI Monitor TX (P2GMT) Port3 GCI Monitor TX (P3GMT) 0x0370 Reserved GCI Monitor TX Status GCI Monitor TX abort Reserved (PGMTS) (PGMTA) 0x0374 Port0 GCI C/I RX (P0GCIR) Port1 GCI C/I RX (P1GCIR) Port2 GCI C/I RX (P2GCIR) Port3 GCI C/I RX (P3GCIR) 0x0378 Port0 GCI C/I TX (P0GCIT) Port1 GCI C/I TX (P1GCIT) Port2 GCI C/I TX (P2GCIT) Port3 GCI C/I TX (P3GCIT) 0x037C Reserved GCI C/I TX Status (PGCITSR) 0x0383 Reserved GCI D-Channel Status (PDCSR) 0x0384 Port0 Periodic Status (P0PSR) Port1 Periodic Status (P1PSR) 0x0388 Port2 Periodic Status (P2PSR) Port3 Periodic Status (P3PSR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 A-8 Freescale Semiconductor

List of Memory Maps TableA-14. PLIC Module Memory Map (continued) MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x038C Aperiodic Interrupt Status Register (PASR) Reserved Loop back Control (PLCR) 0x0392 Reserved D Channel Request (PDRQR) 0x0394 Port0 Sync Delay (P0SDR) Port1 Sync Delay (P1SDR) 0x0398 Port2 Sync Delay (P2SDR) Port3 Sync Delay (P3SDR) 0x039C Reserved Clock Select (PCSR) TableA-15. Ethernet Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x0840 Ethernet Control Register (ECR) 0x0844 Ethernet Interrupt Event Register (EIR) 0x0848 Ethernet Interrupt Mask Register (EIMR) 0x084C Ethernet Interrupt Vector Status (IVSR) 0x0850 Ethernet Rx Ring Updated Flag (RDAR) 0x0854 Ethernet Tx Ring Updated Flag (TDAR) 0x0880 Ethernet MII Data Register (MMFR) 0x0884 Ethernet MII Speed Register (MSCR) 0x08CC Ethernet Receive Bound Register (FRBR) 0x08D0 Ethernet Rx FIFO Start Address (FRSR) 0x08E4 Transmit FIFO Watermark (TFWR) 0x08EC Ethernet Tx FIFO Start Address (TFSR) 0x0944 Ethernet Rx Control Register (RCR) 0x0948 Maximum Frame Length Register (MFLR) 0x0984 Ethernet Tx Control Register (TCR) 0x0C00 Ethernet Address (Lower) (MALR) 0x0C04 Ethernet Address (Upper) (MAUR) 0x0C08 Ethernet Hash Table (Upper) (HTUR) 0x0C0C Ethernet Hash Table (Lower) (HTLR) 0x0C10 Ethernet Rx Descriptor Ring (ERDSR) 0x0C14 Ethernet Tx Descriptor Rin (ETDSR) 0x0C18 Ethernet Rx Buffer Size (EMRBR) 0x0C40– FIFO RAM (EFIFO) 0x0DFF MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor A-9

List of Memory Maps TableA-16. USB Module Memory Map MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x1002 Reserved USB Frame Number Register (FNR) 0x1006 Reserved USB Frame Number Match Register (FNMR) 0x100A Reserved USB Real-time Frame Monitor Register (RFMR) 0x100E Reserved USB Real-time Frame Monitor Match Register (RFMMR) 0x1013 Reserved USB Function Address Register (FAR) 0x1014 USB Alternate Setting Register (ASR) 0x1018 USB Device Request Data1 Register (DRR1) 0x101C USB Device Request Data2 Register (DRR2) 0x1022 Reserved USB Specification Number Register (SPECR) 0x1026 Reserved USB Endpoint 0 Status Register (EP0SR) 0x1028 USB Endpoint 0 IN Config Register (IEP0CFG) 0x102C USB Endpoint 0 OUT Config Register (OEP0CFG) 0x1030 USB Endpoint 1 Configuration Register (EP1CFG) 0x1034 USB Endpoint 2 Configuration Register (EP2CFG) 0x1038 USB Endpoint 3 Configuration Register (EP3CFG) 0x103C USB Endpoint 4 Configuration Register (EP4CFG) 0x1040 USB Endpoint 5 Configuration Register (EP5CFG) 0x1044 USB Endpoint 6 Configuration Register (EP6CFG) 0x1048 USB Endpoint 7 Configuration Register (EP7CFG) 0x104C USB Endpoint 0 Control Register (EP0CTL) 0x1052 Reserved USB Endpoint 1 Control Register (EP1CTL) 0x1056 Reserved USB Endpoint 2 Control Register (EP2CTL) 0x105A Reserved USB Endpoint 3 Control Register (EP3CTL) 0x105E Reserved USB Endpoint 4 Control Register (EP4CTL) 0x1062 Reserved USB Endpoint 5 Control Register (EP5CTL) 0x1066 Reserved USB Endpoint 6 Control Register (EP6CTL) 0x106A Reserved USB Endpoint 7 Control Register (EP7CTL) 0x106C USB General/Endpoint 0 Interrupt Status Register (EP0ISR) 0x1092 Reserved USB Endpoint 1 Interrupt Status Register (EP1ISR) 0x1096 Reserved USB Endpoint 2 Interrupt Status Register (EP2ISR) 0x109A Reserved USB Endpoint 3 Interrupt Status Register (EP3ISR) 0x109E Reserved USB Endpoint 4 Interrupt Status Register (EP4ISR) 0x10A2 Reserved USB Endpoint 5 Interrupt Status Register (EP5ISR) 0x10A6 Reserved USB Endpoint 6 Interrupt Status Register (EP6ISR) 0x10AA Reserved USB Endpoint 7 Interrupt Status Register (EP7ISR) MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 A-10 Freescale Semiconductor

List of Memory Maps TableA-16. USB Module Memory Map (continued) MBAR [31:24] [23:16] [15:8] [7:0] Offset 0x108C USB Endpoint 0 Interrupt Mask Register (EP0IMR) 0x1090 Reserved USB Endpoint 1 Interrupt Mask Register (EP1IMR) 0x1094 Reserved USB Endpoint 2 Interrupt Mask Register (EP2IMR) 0x1098 Reserved USB Endpoint 3 Interrupt Mask Register (EP3IMR) 0x109C Reserved USB Endpoint 4 Interrupt Mask Register (EP4IMR) 0x10A0 Reserved USB Endpoint 5 Interrupt Mask Register (EP5IMR) 0x10A4 Reserved USB Endpoint 6 Interrupt Mask Register (EP6IMR) 0x10A8 Reserved USB Endpoint 7 Interrupt Mask Register (EP7IMR) 0x10AC USB Endpoint 0 Data Register (EP0DR) 0x10B0 USB Endpoint 1 Data Register (EP1DR) 0x10B4 USB Endpoint 2 Data Register (EP2DR) 0x10B8 USB Endpoint 3 Data Register (EP3DR) 0x10BC USB Endpoint 4 Data Register (EP4DR) 0x10C0 USB Endpoint 5 Data Register (EP5DR) 0x10C4 USB Endpoint 6 Data Register (EP6DR) 0x10C8 USB Endpoint 7 Data Register (EP7DR) 0x10CE Reserved USB Endpoint 0 Data Present Register (EP0DPR) 0x10D2 Reserved USB Endpoint 1 Data Present Register (EP1DPR) 0x10D6 Reserved USB Endpoint 2 Data Present Register (EP2DPR) 0x10DA Reserved USB Endpoint 3 Data Present Register (EP3DPR) 0x10DE Reserved USB Endpoint 4 Data Present Register (EP4DPR) 0x10E2 Reserved USB Endpoint 5 Data Present Register (EP5DPR) 0x10E6 Reserved USB Endpoint 6 Data Present Register (EP6DPR) 0x10EA Reserved USB Endpoint 7 Data Present Register (EP7DPR) 0x1400 – USB Configuration RAM, 1 K Bytes 0x17FF MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor A-11

List of Memory Maps MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 A-12 Freescale Semiconductor

Appendix B Buffering and Impedance Matching When required: • SDRAM and a large number of external peripherals are required for a particular system configuration. • Some peripherals may have excessive input capacitance. • Minimize signal reflections at higher clock speeds. • Minimize capacitive loading on signals to SDRAMs. • Operation of MCF5272 at highest frequencies, i.e. 66MHz, requires clean signals to ensure setup and hold times are met and to minimize EMC noise in terms of overshoot and undershoot of signals. What to do: • Add buffers on address and control signals shared by SDRAM and other peripherals. • NEVER put buffers between the MCF5272 device and the SDRAMs. • Put termination resistors as close as possible to outputs. • Or use buffers that have integral termination resistors. MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor B-1

Buffering and Impedance Matching 74LVC245 OE R4 DIR Signal = BS[3:0] = Ax:A2 (32 bit bus) = Ax:A1 (16 bit bus) CS0 R1 RA1, RA2, RA3, ... = Resistor Arrays 10-75 ohms CS1 R1 R1, R2, ... = resistor 10-75 ohms RA3 EN CS2 R1 CS3 R1 32 B[7:0] RA5 RA3 A[7:0] R R R R 32 A A A A D31:D0 RA1 7 8 9 10 n Signals RA2 RA6 D D D D M CF5272 RA4 31:D 31:D 31:D 31:D 0 0 0 0 SDRAM CS7 R2 Flash Device Device Device #1 #2 #3 CS0 CS1 CS2 CS3 FigureB-1. Buffering and Termination MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 B-2 Freescale Semiconductor

Index A C Access control register,4-14 Cache ACR0 and ACR1,4-14 configuration register,2-9 Activate low-power register,6-10 registers, access control,2-9 Address bus,20-2 Cache control register,4-12 Address variant,5-4 Caches Addressing coherency and validation,4-8 mode summary,2-12 miss fetch algorithm/line fills,4-10 Addressing mode summary,2-12 CAM interface,11-6 Arbitration, bus,20-21 CCR,2-6 Architecture overview,1-4 Chip select Async inputs signal timing,23-19 base registers,8-3 Audience,1-xl CS0 special case,8-2 option registers,8-5 B overview, features, usage,8-1 registers,8-2 Baud rate Chip selects calculating,16-20 general overview,1-5 selection,14-6 Clock generator, USB,12-4 Branch instruction execution ColdFire timing,2-25 documentation,1-xliii Buffer descriptors ColdFire core Ethernet,11-34 addressing mode summary,2-12 USB controller,11-34 condition code register (CCR),2-6 Buffering and impedance matching,B-1 exception processing overview,2-25 Bus features and enhancements,2-1 arbitration,20-21 instruction set summary,2-13 burst data transfers,20-17 integer data formats,2-9 configurations overview,1-7 programming model,2-4 data transfer mechanism,20-4 status register,2-8 errors,20-19 supervisor programming model,2-7 exceptions,20-3 user programming mode,2-4 external interface,1-5 Condition code register,2-6 external interface types,20-7 Conventions interface for FLASH/SRAM,20-8 notational,1-xliv interrupt acknowledge cycles,20-19 terminology,1-xlvii master reset,20-22 Core misaligned operands,20-18 version 2 normal reset,20-23 overview,1-4 read/write (R/W),20-2 reset operation,20-21 D sizing,20-4 soft reset operation,20-25 Data software watchdog timer reset operation,20-24 bus,20-2 transfer acknowledge (TA),20-2 Debug transfer error acknowledge (TEA),20-3 attribute trigger register,5-7 Byte strobes,20-8 BDM command set summary,5-19 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor Index-1

Index breakpoint operation,5-34 FEC initialization,11-34 module enhancements,2-4 FIFO real-time support,5-33 receive bound register,11-19 taken branch,5-4 receive start register,11-20 theory,5-34 transmit start register,11-22 Device identification register,6-11 frame DMA reception,11-5 address modes,10-2 transmission,11-4 byte count register,10-6 hardware initialization,11-33 controller registers,10-2 hash table data transfer types,10-1 algorithm,11-8 destination address register,10-6 high register,11-28 interrupt register,10-4 low register,11-29 mode register,10-2 initialization sequence,11-33 source address register,10-5 internal and external loopback,11-8 Documentation,1-xliii interpacket gap time,11-8 DSCLK,5-2 interrupt event register,11-12 E mask register,11-13 vector status register,11-14 Electrical specifications loopbacks,11-8 AC,23-5 maximum frame length register,11-24 AC timing MII debug,23-13 management frame register,11-17 fast Ethernet,23-17 speed control register,11-18 GPIO port,23-28 module operation,11-1 IEEE 1149.1 (JTAG),23-30 programming model,11-10 USB interface,23-29 RAM perfect match address register clock input and output timing,23-5 high,11-27 DC,23-3 low,11-26 DL and GCI interface timing,23-23 receive buffer size register,11-32 maximum ratings,23-1 receive control register,11-23 MII async inputs signal timing,23-19 transceiver connection,11-3 operating temperature,23-2 transmit output loading,23-3 control register,11-25 processor bus input timing,23-6 descriptor active register,11-16 QSPI,23-31,23-32 FIFO watermark,11-21 SDRAM interface timing,23-14 user initialization,11-33 supply, input voltage, and storage temperature,23-1 Exception processing thermal resistance,23-2 overview,2-25 timer module AC timing,23-21 processor exceptions,2-28 USART module AC timing,23-22 stack frame definition,2-27 Ethernet Exceptions address recognition,11-6 bus,20-3 buffer descriptors Execution timings receive,11-35 miscellaneous,2-24 transmit,11-37 one operand,2-22 CAM interface,11-6 two operands,2-22 collision handling,11-8 External bus interface overview,1-5 control register,11-11 descriptor active register,11-15 F descriptor ring register pointer-to-receive,11-30 Fault-on-fault halt,5-16 pointer-to-transmit,11-31 Features overview,1-1 error handling,11-9 Frame reception,11-5 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Index-2 Freescale Semiconductor

Index G restrictions,21-8 TAP controller,21-3 GPIO test access port,21-2 overview,17-1 port L control registers,17-2,17-8 data direction registers,17-10 Local memory data registers,17-11 module interactions,4-1 registers,4-2 H Loopback, Ethernet internal and external,11-8 Halt, fault-on-fault,5-16 M Hardware Ethernet initialization,11-33 MAC Hash table data representation,3-4 Ethernet algotithm,11-8 hardware support,2-3 instruction execution timings,3-4 I instruction set summary,3-4 operation,3-3 Initialization sequence programming model,2-4,2-7 Ethernet,11-33 programming modelProgramming models Instruction cache MAC,3-2 interaction with other modules,4-8 Matching operation,4-8 buffering and impedance,B-1 overview,4-7 MBAR,7-6,7-8 physical organization,4-7 Mechanical data programming model,4-12 package dimensions,22-2 reset,4-10 pinout,22-1 Instruction execution times,2-24 Memory Instruction set integer data formats,2-11 fetch pipeline,2-2 Memory maps general summary,2-13 list of tables,A-1 MAC summary,3-4 USB,12-7 MAC unit execution times,3-4 Memory, SIM register,6-2 summary,2-15 MII Integer data formats,2-9 serial management channel timing,23-20 memory,2-11 transmit signal timing,23-18 registers,2-10 Modules Integer data formats in memory,2-11 base address register,2-9 Integer data formats in registers,2-10 debug,2-4 Interrupt controller MOVE instructions timing,2-20 overview,7-1 pending and mask registers,7-4,7-5,7-5,7-5 N Interrupts bus acknowledge cycles,20-19 Non-IEEE 1149.1 operation,21-8 PLIC GCI,13-10 request inputs,19-23 O Opcodes J illegal handling,2-3 JTAG Organization,1-xl BDM debug port,21-2 Output port command registers,16-18 boundary scan register,21-4 IDCODE register,6-11 P instruction register,21-7 overview,21-1 Parallel input/output ports,1-6 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor Index-3

Index Pin descriptions,??–19-38 GCI monitor channel address bus,19-19 receive registers,13-24 byte strobes,19-20 transmit abort register,13-26 clock,19-25 transmit registers,13-25 data bus,19-19 transmit status register,13-27 dynamic data bus sizing,19-19 GCI/IDL general-purpose I/O ports,19-24 B- and D-Channel interrupt request inputs,19-23 receive data registers,13-3 JTAG test access port and BDM debug port,19-35–19-37 transmit data registers,13-4 operating mode configuration,19-37 B- and D-Channel bit alignment,13-5 PLI TDM ports,19-30–19-35 block,13-3 power supply,19-38 D-Channel contention,13-8 QSPI signals,19-29–?? looping modes,13-8 RSTI,19-23 periodic frame interrupts,13-9 SDRAM initialization,13-35 bank selects,19-23 interrupt configuration clock enable,19-22 example,13-37 column address strobe,19-22 registers,13-20 row address 10,19-23 interrupt control,13-11 row address strobe,19-22 introduction,13-1 write enable,19-22 local loopback mode,13-9 UART0 module signals,19-24–19-25 loopback control register,13-20 USB module signals and PA,19-25–19-27 periodic status registers,13-22 Pipelines port configuration instruction fetch,2-2 example,13-35 operand execution,2-2 registers,13-18 PLIC register memory map,13-13 aperiodic status register,13-23 registers, general,13-15 application examples,13-35–13-42 remote loopback mode,13-9 automatic echo mode,13-9 super frame sync generation,13-13 B1 data sync delay registers,13-33 receive registers,13-15 timing generator,13-11 transmit registers,13-17 Ports B2 data parallel input/output,1-6 receive registers,13-16 Power management registers,6-7 transmit registers,13-17 Program counter,2-6 B-Channel Programming model HDLC encoded data,13-6 PWM,18-2 unencoded data,13-5 QSPI,14-9 clock select register,13-34 Programming models clock synthesis,13-11 Ethernet,11-10 D data instruction cache,4-12 receive registers,13-16 MAC,2-7 transmit registers,13-18 overview,2-4 D-Channel ROM,4-5 HDLC encoded data,13-6 SIM,6-2 unencoded data,13-7 SRAM,4-2 D-Channel request register,13-32 supervisor,2-7,2-7 D-Channel status register,13-31 user,2-4 frame sync synthesis,13-13 PST outputs,5-3 GCI C/I channel PULSE instruction,5-3 receive registers,13-28 PWM transmit registers,13-29 control register,18-3 transmit status register,13-30 operation,18-2 GCI interrupts aperiodic status,13-10 overview,18-1 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Index-4 Freescale Semiconductor

Index programming model,18-2 CACR,2-9 width register,18-4 CCR,2-6 chip select Q base,8-3 general,8-2 QSPI option,8-5 address register,14-14 condition code,2-6,2-6 baud rate selection,14-6 condition code (CCR),2-6 command RAM bit description,14-15 CSBR,8-3 data register,14-14 CSOR,8-5 delay register,14-11 CSR,5-10 interrupt,14-13 D data receive,13-16 mode register,14-9 D0–D7,2-5 module description,14-1 data,2-5 operation,14-3 data breakpoint/mask,5-12 overview and features,14-1 data D0 - D7,2-5 programming DBCR,10-6 example,14-16 D-Channel request,13-32 model,14-9 DDAR,10-6 RAM debug attribute trigger,5-7 command,14-6 descriptor active,11-15 model,14-4 device identification,6-11 receive,14-5 DIR,10-4 transmit,14-6 DMA slave bus interface,14-3 byte count,10-6 transfer controller,10-2 data,14-8 destination address,10-6 delays,14-7 interrupt,10-4 length,14-8 mode,10-2 wrap register,14-12 sourse address,10-5 DMR,10-2 R DSAR,10-5 Ethernet control,11-11 RAM FIFO QSPI command bit description,14-15 receive bound,11-19 USB configuration,12-28,12-30 receive start,11-20 RAM base address registers,2-9 transmit start,11-22 RAMBAR GCI overview,4-3 C/I channel transmit status,13-30 power management programming,4-4 monitor channel transmit abort,13-26 Read/write, bus,20-2 GPIO Registers control port,17-2–17-8 A0–A6,2-5 data,17-11 A7,2-5 data direction,17-10 AATR,5-7 hash table ABLR/ABHR,5-6,5-9 high,11-28 access control,2-9,4-14 low,11-29 activate low-power,6-10 IDCODE,6-11 address,2-5 integer data formats in,2-10 address (A0 – A6),2-5 interrupt ALPR,6-10 event,11-12 B2 data transmit,13-17 mask,11-13 BI data receive,13-15 vector status,11-14 cache configuration,2-9 interrupt controller cache control,4-12 pending and mask,7-5,7-5 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor Index-5

Index interrupt controller, pending and mask,7-4,7-5 periodic status,13-22 JTAG instruction,21-7 port configuration,13-18 local memory,4-2 receive data,13-3 MASK,2-6 sync delay,13-33 maximum frame length,11-24 transmit data,13-4 MBAR,2-9,6-3 PMR,6-7 MII management frame,11-17 pointer-to-receive descriptor ring,11-30 MII speed control,11-18 pointer-to-transmit descriptor ring,11-31 module base address,2-9 power management,6-7 output port command,16-18 PWM control,18-3 P0B1RR–P3B1RR,13-15 PWM width,18-4 P0B2RR–P3B2RR,13-16 QSPI P0CR–P3CR,13-18 address,14-14 P0GCIR–P3GCIR,13-28 data,14-14 P0GMT–P3GMT,13-25 delay,14-11 P0ICR–P3ICR,13-20 interrupt,14-13 P0PSR–P3PSR,13-22 mode,14-9 P0SDR–P3SDR,13-33 wrap,14-12 P3B1TR–P0B1TR,13-17 RAM base address,2-9 P3B2TR–P0B2TR,13-17 RAM perfect match address P3DRR–P0DRR,13-16 high,11-27 P3DTR–P0DTR,13-18 low,11-26 P3GCIT–P0GCIT,13-29 RAMBAR,2-9 P3GMR–P0GMR,13-24 RAREG/RDREG,5-22 PADDR,17-10 RCREG,5-30 PAR,7-9 RDMREG,5-32 PASR,13-23 read control,5-30 PBDDR,17-10 read debug module,5-32 PBR,5-13 receive buffer size,11-32 PCDDR,17-11 receive control,11-23 PCSR,13-34 ROM base address,4-5 PDCSR,13-31 SCR,6-5 PDRQR,13-32 SDCR,9-6 PGCITSR,13-30 SDRAM PGMTA,13-26 configuration,9-6 PGMTS,13-27 general,9-6 PLCR,13-20 timing,9-8 PLIC SDTR,9-8 aperiodic status,13-23 SIM B1 data transmit,13-17 base address,7-6,7-8 B2 data receive,13-16 memory map,6-2 clock select,13-34 module base address,6-3 D data transmit,13-18 SPR,6-6 D-Channel status,13-31 SR,2-8 GCI C/I channel SRAM base address,4-3 receive,13-28 status,2-8,2-8 transmit,13-29 system configuration,6-5 GCI monitor channel system protection,6-6 general,13-24 TCR,15-4 transmit,13-25 TDR,5-14 transmit status,13-27 TER,15-5 general,13-15 timer interrupt configuration,13-20 capture,15-4 loopback control,13-20 event,15-5 memory map,13-13 general-purpose,15-3 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Index-6 Freescale Semiconductor

Index mode,15-3 S reference,15-4 SDCR,9-12 TMR,15-3 SDRAM transmit auto initialization,9-9 control,11-25 banks, page hits, page misses,9-6 descriptor active,11-16 configuration register,9-6 FIFO watermark,11-21 controller signals,9-1 trigger definition,5-14 devices interface,9-4 TRR,15-4 interface,9-14 UACR,16-12 performance,9-10 UART modules,16-2–16-18 power-down and self-refresh,9-9 UCR,16-9 read accesses,9-15 UCSR,16-8 refresh timing,9-20 UDU/UDL,16-14,16-14,16-15,16-16 registers,9-6 UIP,16-17 solving timing issues,9-12 UIPCR,16-11 timing register,9-8 UISR,16-12 write accesses,9-18 USB Serial management channel timing,23-20 access,12-30 Signals alternate settings,12-12 bus control,19-20–19-23 endpoint bypass,19-22 control,12-17–12-20 chip selects,19-19 data,12-27 clear-to-send,19-25 data present,12-28 CPU clock and reset,19-23 interrupt mask,12-26 CPU external clock,19-23 status interrupt,12-25 DRESETEN,19-23 frame number,12-9 Ethernet module,19-27–19-29 function address,12-11 Hi-Z,19-22 USB general,12-9–12-28 output enable/read,19-20 VB,2-8 PWM module,19-29 vector base,2-8,2-8 read/write,19-21 WAREG/WDREG,5-23 receive serial data input,19-25 watchdog request to send,19-25 counter,6-13 reset output,19-23 event,6-13 timer module,19-27,19-27 interrupt reference,6-12 transfer acknowledge,19-22 WCR,6-13 transmit serial data output,19-24 WCREG,5-31 USB WDMREG,5-33 receive data negative,19-25 WER,6-13 receive serial data input,19-25 WIRR,6-12 Rx data output,19-26 write control,5-31 suspend driver,19-26 write debug module,5-33 transmit data negative,19-26 Reset transmit serial data output,19-25 instruction cache,4-10 transmitter output enable,19-26 ROM USB_CLK,19-26 base address register,4-5 USB_D+ and USB_D-,19-26 operation,4-5 wake-on-ring,19-26 overview,4-5 SIM programming model,4-5 overview,1-5 ROMBAR programming model,6-2 overview,4-5 register memory map,6-2 power management programming,4-6 Software watchdog timer,6-11 SRAM MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor Index-7

Index base address register,4-3 U initialization,4-4 UART modules overview and operation,4-2 bus operation programming model,4-2 interrupt acknowledge cycles,16-29 Stack pointer,2-5,2-5 read cycles,16-29 Status register,2-8 write cycles,16-29 STOP instruction,5-4,5-16 clock source baud rates,16-20 Suggested reading,1-xliii external clock,16-21 Supervisor FIFO stack in UART0,16-25 programming model,2-7 initialization sequence,16-30 System configuration and protection,1-5 looping modes,16-26 System protection register,6-6 automatic echo,16-27 local loop-back,16-27 T remote loop-back,16-27 TAP controller,21-3 mode registers,16-4 TCN0–TCN3,15-4 multidrop mode,16-28 Test access port,1-7 overview,1-6 Timer module programming,16-30 capture registers,15-4 receiver enabled,16-24 counters,15-4 register description,16-2 event registers,15-5 serial overview,16-2 general-purpose registers,15-3 signal definitions,16-18 mode registers,15-3 transmitter/receiver operation,15-1 clock source,16-19 overview,1-7,15-1 modes,16-22 reference registers,15-4 transmitting in UART mode,16-22 Timers USB bus software watchdog,20-24 access times,12-30 Timing alternate settings register,12-12 branch instruction execution,2-25 architecture,12-2 clock input and output,23-5 attachment detection,12-36 fast Ethernet AC,23-17 buffer descriptors,11-34 GPIO port AC,23-28 class- and vendor-specific request operation,12-34 JTAG AC,23-30 clock generator,12-4 MAC unit instructions,3-4 configuration and interface changes,12-31 MII configuration RAM,12-28,12-30 transmit signal,23-18 control logic,12-4 MII async input signal,23-19 control, bulk, and interrupt endpoints,12-33 MOVE instructions,2-20 data flow,12-32 one operand,2-22 device configuration example,12-29 PLI,23-23 endpoint processor bus input,23-6 controllers,12-5 SDRAM interface,23-14 data present registers,12-28 serial management channel,23-20 data registers,12-27 timer module AC,23-21 FIFOs,12-30 two operands,2-22 halt feature,12-35 USART AC,23-22 interrupt mask registers,12-26 USB interface AC,23-29 status interrupt registers,12-25 Timings endpoint control registers,12-17,12-20 SDRAM refresh,9-20 FIFO configuration,12-32 Transmit signal timing,23-18 frame number match register,12-9 function address register,12-11 IN endpoints,12-33,12-34 initialization,12-31 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Index-8 Freescale Semiconductor

Index isochronous endpoints,12-33 line interface,12-36 memory map,12-7 module operation,12-2 OUT endpoints,12-33,12-34 overview,12-1 PCB layout recommendations,12-36 register access,12-30 descriptions,12-9,12-28 remote wakeup and resume operation,12-35 request processor,12-5 software architecture and application notes,12-31 transceiver interface,12-3 User programming model,2-5 V Variant address,5-4 Vector base register,2-8,2-8 Version 2 ColdFire core overview,1-4 W Wait state generation overview,1-5 Watchdog counter register,6-13 event register,6-13 interrupt reference register,6-12 WDDATA execution,5-3 MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Freescale Semiconductor Index-9

Index MCF5272 ColdFire® Integrated Microprocessor User’s Manual, Rev. 3 Index-10 Freescale Semiconductor

Overview 1 ColdFire Core 2 Hardware Multiply/Accumulate (MAC) Unit 3 Local Memory 4 Debug Support 5 System Integration Module (SIM) 6 Interrupt Controller 7 Chip-Select Module 8 SDRAM Controller 9 DMA Controller Module 10 Ethernet Module 11 Universal Serial Bus (USB) 12 Physical Layer Interface Controller (PLIC) 13 Queued Serial Peripheral Interface (QSPI) Module 14 Timer Module 15 UART Modules 16 General-Purpose I/O Module 17 Pulse-Width Modulation (PWM) Module 18 Signal Descriptions 19 Bus Operation 20 IEEE 1149.1 Test Access Port (JTAG) 21 Mechanical Data 22 Electrical Characteristics 23 Appendix A: List of Memory Maps A Appendix B: Buffering and Impedence Matching B Index IND

1 Overview 2 ColdFire Core 3 Hardware Multiply/Accumulate (MAC) Unit 4 Local Memory 5 Debug Support 6 System Integration Module (SIM) 7 Interrupt Controller 8 Chip-Select Module 9 SDRAM Controller 10 DMA Controller Module 11 Ethernet Module 12 Universal Serial Bus (USB) 13 Physical Layer Interface Controller (PLIC) 14 Queued Serial Peripheral Interface (QSPI) Module 15 Timer Module UART Modules 16 General-Purpose I/O Module 17 Pulse-Width Modulation (PWM) Module 18 Signal Descriptions 19 Bus Operation 20 IEEE 1149.1 Test Access Port (JTAG) 21 Mechanical Data 22 Electrical Characteristics 23 Appendix A: List of Memory Maps A Appendix B: Buffering and Impedence Matching B Index IND

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