C L D - D S 1 Product family data sheet 6 R e v 1 1 N Cree® XLamp® MC-E LED MC-E White MC-E Color ProDuCt DEsCriPtion FEAturEs tAbLE oF ContEnts The XLamp® MC-e LeD is a family of • Available in white (2600 K–10,000 K Characteristics lighting-class, multi-chip LeDs that CCT), easyWhite®, or color (RGBW) Complete Package ...........................2 provides high lumen output in a small • ANSI-compatible neutral & warm Per LeD Die (White) ..........................2 package. Compared to discrete LeDs, white chromaticity bins Per LeD Die (Color) ...........................2 XLamp MC-e LeDs reduce the distance • Individually addressable LeDs Flux Characteristics between LeD die, creating a small optical • MC-e easyWhite LeDs available in White, Color.......................................3 source for excellent optical control and 2- and 4-step bins, up to 85 CRI easyWhite® .......................................4 efficient color mixing. XLamp MC-E LEDs • Maximum drive current: 700 mA per Relative Spectral Power Distribution can reduce LeD system complexity by LeD die White .................................................5 reducing the number of components • Reflow solderable – JEDEC Color ..................................................5 required. J-STD-020 Relative Flux Output vs Junction • electrically neutral thermal path Temperature ...........................................6 Cree XLamp LeDs bring high • RoHS and ReACh compliant electrical Characteristics .......................7 performance and quality of light to a wide • UL® recognized component Relative Intensity vs. Current .................7 range of lighting applications, including (e349212) Typical Spatial Radiation Pattern ..........8 color-changing lighting, portable and Reflow Soldering Characteristics ..........9 personal lighting, outdoor lighting, indoor Notes ....................................................10 directional lighting, and entertainment Mechanical Dimensions ......................12 lighting. Tape and Reel .......................................13 Packaging .............................................14 p m A L X / m o C E. E R C W. W W Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, Cree, Inc. XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300

XLamp® mC-E LED ChArACtEristiCs - CoMPLEtE PACkAgE The following table lists the product characteristics for the XLamp MC-e LeD package. Characteristics unit Minimum typical Maximum Thermal Resistance, junction to solder point - white °C/W 3 Thermal Resistance, junction to solder point - color °C/W 4 viewing Angle (FWHM) - white degrees 110 viewing Angle (FWHM) - color degrees 115 eSD Withstand voltage (HBM per Mil-Std-883D) v 8000 LED Junction Temperature °C 150 ChArACtEristiCs - PEr LED DiE (WhitE, EAsyWhitE®) The following table lists the product characteristics of each individual LeD die within the XLamp MC-e White LeD package. Characteristics unit Minimum typical Maximum Temperature Coefficient of Voltage mv/°C -4 DC Forward Current mA 700 Reverse voltage v 5 Forward Voltage (@ 350 mA) v 3.1 3.9 Forward Voltage (@ 700 mA) v 3.4 ChArACtEristiCs - PEr LED DiE (CoLor) The following table lists the product characteristics for each LeD die within the XLamp MC-e Color LeD package. Characteristics unit red green blue White Temperature Coefficient of Voltage mv/°C Typical -2 -4 -4 -4 DC Forward Current mA Maximum 700 700 700 700 Reverse voltage v Maximum 5 5 5 5 Typical 2.1 3.4 3.2 3.1 Forward Voltage (@ 350 mA) v Maximum 2.5 3.9 3.9 3.9 Forward Voltage (@ 700 mA) v Typical 2.3 3.7 3.5 3.5 Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 2

XLamp® mC-E LED FLuX ChArACtEristiCs - WhitE, CoLor (t = 25 °C) J The following table provides several base order codes for XLamp MC-e LeDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order- code nomenclature, please consult the XLamp MC-e LeD Binning and Labeling document. Minimum Luminous Flux CCt / Dominant Wavelength range @ 350 mA* Part Color order Code Minimum Maximum group Flux (lm) K 370 MCE4WT-A2-0000-000K01 Cool White 5000 K 10,000 K M 430 MCe4WT-A2-0000-000M01 J 320 MCE4WT-A2-0000-000JE4 Neutral White 3700 K 5000 K White K 370 MCE4WT-A2-0000-000KE4 G 240 MCe4WT-A2-0000-000Ge7 Warm White 2600 K 3700 K H 280 MCe4WT-A2-0000-000He7 J 320 MCE4WT-A2-0000-000JE7 Red 620 nm 630 nm 30.6 Green 520 nm 535 nm 67.2 A5 MCe4CT-A2-0000-00A5AAAA1 Blue 450 nm 465 nm 8.2 Cool White 5700 K 7000 K 100 Color Red 620 nm 630 nm 30.6 Green 520 nm 535 nm 67.2 A4 MCe4CT-A2-0000-00A4AAAB1 Blue 450 nm 465 nm 8.2 Neutral White 3700 K 4300 K 80 Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements, ±2 on CRI measurements and ± 1 nm on dominant wavelength measurements. See the Measurements section (page 10). • Typical CRI for cool white and neutral white (3700 K - 10,000 K CCT) is 75. • Typical CRI for warm white (2600 K - 3700 K CCT) is 80. * Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA. The flux and chromaticity of XLamp MC-E White LED are measured with all LEDs lit simultaneously. The flux and color of each LED in XLamp and MC-E Color LeDs are measured individually. Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 3

XLamp® mC-E LED FLuX ChArACtEristiCs - EAsyWhitE® MC-E LEDs (t = 25 °C) J The following table provides order codes for XLamp MC-e easyWhite LeDs. For a complete description of the order-code nomenclature, please consult the XLamp MC-e LeD Binning and Labeling document. Minimum Luminous Flux 2-step 4-step CCt @ 350 mA, 25 ° C* Color range Chromaticity Chromaticity group Flux (lm) order Code order Code region region K 370 MCEEZW-A1-0000-0000K040H MCEEZW-A1-0000-0000K040F 4000 K 40H 40F J 320 MCEEZW-A1-0000-0000J040H MCEEZW-A1-0000-0000J040F J 320 MCEEZW-A1-0000-0000J035H MCEEZW-A1-0000-0000J035F 3500 K 35H 35F H 280 MCeeZW-A1-0000-0000H035H MCeeZW-A1-0000-0000H035F Standard CRI easyWhite J 320 MCEEZW-A1-0000-0000J030H MCEEZW-A1-0000-0000J030F 3000 K 30H 30F H 280 MCeeZW-A1-0000-0000H030H MCeeZW-A1-0000-0000H030F J 320 MCEEZW-A1-0000-0000J027H MCEEZW-A1-0000-0000J027F 2700 K 27H 27F H 280 MCeeZW-A1-0000-0000H027H MCeeZW-A1-0000-0000H027F K 370 MCEEZW-H1-0000-0000K040H MCEEZW-H1-0000-0000K040F 4000 K 40H 40F J 320 MCEEZW-H1-0000-0000J040H MCEEZW-H1-0000-0000J040F J 320 MCEEZW-H1-0000-0000J035H MCEEZW-H1-0000-0000J035F 3500 K 35H 35F 80-CRI H 280 MCeeZW-H1-0000-0000H035H MCeeZW-H1-0000-0000H035F Minimum easyWhite J 320 MCEEZW-H1-0000-0000J030H MCEEZW-H1-0000-0000J030F 3000 K 30H 30F H 280 MCeeZW-H1-0000-0000H030H MCeeZW-H1-0000-0000H030F J 320 MCEEZW-H1-0000-0000J027H MCEEZW-H1-0000-0000J027F 2700 K 27H 27F H 280 MCeeZW-H1-0000-0000H027H MCeeZW-H1-0000-0000H027F H 280 MCeeZW-P1-0000-0000H030H MCeeZW-P1-0000-0000H030F 3000 K 30H 30F 85-CRI G 240 MCeeZW-P1-0000-0000G030H MCeeZW-P1-0000-0000G030F Minimum easyWhite H 280 MCeeZW-P1-0000-0000H027H MCeeZW-P1-0000-0000H027F 2700 K 27H 27F G 240 MCeeZW-P1-0000-0000G027H MCeeZW-P1-0000-0000G027F Notes: • Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. See the Measurements section (page 10). • For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and 2700 K CCT. * Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA and with all LEDs lit simultaneously. Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 4

XLamp® mC-E LED Relative Spectral Power Distribution (If = 350 mA per LED) - White rELAtivE sPECtrAL PoWEr Distribution (i = 350 mA PEr LED) - WhitE The following graph represents typicaFl spectral output of the XLamp MC-E White LED with all four LEDs on simultaneously. The following graph represents typical spectral output of the XLamp MC-e White LeD with all four LeDs on simultaneously. 100 ) % ( 80 r e w o P 5000 K - 10,000 K 60 t CCT n a i 3700 K - 5000 K d Ra 40 CCT e 2600 K - 3700 K v i t CCT a l 20 e R 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Relative Spectral Power Distribution (If = 350 mA per LED) - Color rELATthiveE f oslPloEwCitnrgA gLr aPpohW rEerp rDeissetnrtsib tuyptiicoanl s(pi e =c 3tr5a0l  omuAtp PuEtr o Lf EthDe) -X CLoamLopr MC-E Color LED with all four LEDs on simultaneously. F The following graph represents typical spectral output of the XLamp MC-e Color LeD with all four LeDs on simultaneously. 100 ) % 80 ( r e w o P 60 t RGBW (6000 K) n a di RGBW (4000 K) a 40 R e v ti a el 20 R 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 5

XLamp® mC-E LED rELTAhteiv fEo lsloPwEiCntgr gArLa pPho rWepErre Dseisnttsr itbypuitciaol nsp (eic =t r3a5l 0o umtApu PtE orf LthEeD )X -L CaomLpo Mr C(C-Eo nCtoilnoru LEEDD) with each LED on independently. F The following graph represents typical spectral output of the XLamp MC-e Color LeD with each LeD on independently. 100 ) % 80 ( r e w Red o P 60 Green t n a Blue di a 40 White (6000 K) R e White (4000 K) v ti a 20 el R 0 380 430 480 530 580 630 680 730 780 Wavelength (nm) RerElLaAttiivvEe F LFuXlu ouxt POutu vtsp JuuntC vtiso.n JtEuMnPEcrAtitournE (Ti =e 3m50 pmAe)rature (If = 350 mA) F TheT hfoe lfloolwloiwnign gg grarapphh rreepprreesseenntst sty tpyipcaicl aple rpfeorrmfoarnmcea nocf ee aocfh e LaecDh d LieE iDn tdhiee X inLa tmhep MXLCa-em Lpe DM. C-E LED 100% 90% x 80% u Fl 70% s u White o 60% n mi Red 50% u L Green e 40% tiv Blue a 30% el R 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 6

XLamp® mC-E LED Electrical Characteristics (Tj = 25ºC) ETLhEeC ftorlloiCwAinLg CghraAprhA reCptreEsreinsttsi Ctysp i(ctal p=e 2r5fo ˚rCm)ance of each LED die in the XLamp MC-E LED J The following graph represents typical performance of each LeD die in the XLamp MC-e LeD. 700 600 A) 500 m ( t en 400 White, Blue r r u Red C d 300 r Green a w or 200 F 100 0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage (V) Relative Intensity vs. Current (Tj = 25ºC) rELAtivE intEnsity vs. CurrEnt (t = 25 ˚C) J The following graph represents typical performance of each LeD die in the XLamp MC-e LeD. 200 180 ) % 160 ( x u 140 Fl us 120 White, Blue o min 100 Red Lu 80 Green e v ti 60 a el R 40 20 0 0 100 200 300 400 500 600 700 Forward Current (mA) Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 7

XLamp® mC-E LED tyPiCAL sPTAtyipALic raAlD iSAtpioanti PaAlt RtEardniation Pattern The followingT ghrea pfoh llroewpriensge gnrtasp thy preicparle osuentptsu tt yopf itchael sXpLeacmtrpa lM ouCt-peu Lte oDf twhieth X aLlal mfopu rM LCe-DEs L oEnD swimithu latalln feoouur sLlEy.Ds on simultaneously. 100 ) 80 % ( y sit n e nt 60 s I White u o min Color 40 u L e v ti a el 20 R 0 -90 -60 -30 0 30 60 90 Angle (º) Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 8

XLamp® mC-E LED rEFLoW soLDEring ChArACtEristiCs In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used, and therefore it is the lamp or luminaire manufacturer’s responsibility to determine applicable soldering requirements. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. t T P Critical Zone P T to T L P Ramp-up T ure L Tsmax tS t a r e p Ts m min e T ts Ramp-down Preheat 25 t 25˚C to Peak Time Profile Feature Lead-Free solder Average Ramp-Up Rate (Ts to Tp) 1.2 °C/second max Preheat: Temperature Min (Ts ) 120 °C min Preheat: Temperature Max (Ts ) 170 °C max Preheat: Time (ts to ts ) 65-150 seconds min max Time Maintained Above: Temperature (T) 217 °C L Time Maintained Above: Time (t) 45-90 seconds L Peak/Classification Temperature (Tp) 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 9

XLamp® mC-E LED notEs Measurements The luminous flux, radiant power, chromaticity, forward voltage and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are provided for informational purposes only and are not intended or provided as specifications. Pre‑Release Qualification Testing Please read the LeD Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs. Lumen Maintenance Cree now uses standardized IeS LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LeD lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document. Moisture sensitivity Cree recommends keeping XLamp MC-e LeDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LeDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp MC-E LEDs should be handled and stored as MSL 4 per JEDEC J-STD-033, meaning they have limited exposure time before damage to the LeD may occur during the Maximum Percent relative humidity temperature soldering operation. The table on the right specifies the maximum 30% 40% 50% 60% 70% 80% 90% exposure time in days depending on temperature and humidity 30 ºC 9 5 4 3 1 1 1 conditions. LEDs with exposure time longer than the specified 25 ºC 12 7 5 4 2 1 1 maximums must be baked according to the baking conditions 20 ºC 17 9 7 6 2 2 1 listed below. baking Conditions It is not necessary to bake all XLamp MC-e LeDs. Only the LeDs that meet all of the following criteria must be baked: • LeDs that have been removed from the original MBP. • LeDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above. • LeDs that have not been soldered. LEDs should be baked at 70 ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do not bake parts at temperatures higher than 70 ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 10

XLamp® mC-E LED notEs - ContinuED storage Conditions XLamp MC-e LeDs that have been removed from the original MBP but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 ± 5 ºC and no greater than 10% RH. For LEDs stored in these conditions, storage time does not add to exposure time as defined in the above Moisture Sensitivity section. rohs Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eU Directive 2011/65/eC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product ecology section of the Cree website. rEACh Compliance ReACh substances of high concern (SvHCs) information is available for this product. Since the european Chemical Agency (eCHA) has published notice of their intent to frequently revise the SvHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date ReACh SvHC Declaration. ReACh banned substance information (ReACh Article 67) is also available upon request. uL® recognized Component This product meets the requirements to be considered a UL Recognized Component with Level 1 enclosure consideration. The LeD package or a portion thereof has not been investigated as a fire enclosure or a fire and electrical enclosure per ANSI/UL 8750. vision Advisory WARNING. Do not look at ab exposed lamp in operation. eye injury can result. For more information about LeDs and eye safety, please refer to the LeD eye Safety application note. Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 11

6 5 4 3 2 1 NOTICE REVISIONS CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION REV COMMENTS DATE APPROVED BY CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT A Initial Release 10/16/07 RC MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY B Change height due to new lens 10/23/2007 RC UOFN CARUEET IHNCO.RIZED PERSON WITHOUT THE WRITTEN CONSENT C Change recommended solder pad footprint 11/26/2007 RC D Height change due to new lens (was 3.86) 12/26/2007 RC XLamp® mC-E LED - Change package height FROM 1.5 TO 1.45 E -- ADdelde tLeE DSe rreiefes rCenocnefig duerasitgionna tsocrhsematic 5/12/2008 RC 6 5 4 6 3 5 2 4 1 6 3 5 2 - Add tabs to recomme4nded PCB footprint 1 3 2 1 NOTICE NOTICE REVISIO4N.S48±.20 NOTICE REVISIONS REVISIONS CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CREED CONFIDENTIAL. THIS PLOT AND THE INFORMATION REV COMMENTS CREE CONDAFTIEDENTIAL.A TPHPRIOSV PEDL OBYT AND THE INFORMATION REV COMMENTS DATE APPROVED BY REV COMMENTS DATE APPROVED BY CCOONNTFAIDINENEDT IWALIT IHNIFNO ARRMEA TTHIOE NPR OOFP CRIREETEA, RINY CA.N TDHIS PLOT CCOONNTFAIDINENEDT IWALIT IHNIFNO ARRMEA TTHIOE NPR OOFP CRIREETEA, RINY CA.N TDHIS PLOT A Initial Release 1.45 CCOONNTFAIDI1NE0/NE16DT/0 IWA7LIT IHNIFNO ARRMEA RTCTHIOE NPR OOFP CRIREETEA, RINY CA.N TDHIS PLOT .80 A Initial Release 10/16/07 RC D A Initial Release 10/16/07 RC MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY B Change height due to new lens MAY N1O0/2T3 /B20E07 COPIED, RRECPRODUC+E.D1 3OR DISCLOSED TO ANY TYP. B Change height due to new lens 10/23/2007 RC B Change height due to new lens 10/23/2007 RC UOFN CARUEET IHNCO.RIZED PERSON WITHOUT THE WRITTEN CONSENT UOFNM CARUEEET IHCNCOh.RIZAEDn PiECRSAONL W DITHiMOUET TnHEs WiRoITnTENs CONSENT C Change recom.m0e5n±de.d0 5solder pad footprint UOFN CARUEET1 IH1N/CO26.R/2I0Z07ED PERSONR CWITH.O75U T - . T0 H 3 E WRITTEN CONSENT C Change recommended solder pad footprint 11/26/2007 RC C Change recommended solder pad footprint 11/26/2007 RC D Height change due to new lens (was 3.86) 12/26/2007 RC 1 2 3 4 D Height change due to new lens (was 3.86) 12/26/2007 RC D Height change due to new lens (was 3.86) 12/26/2007 RC - Change package height FROM 1.5 TO 1.45 - Change package height FROM 1.5 TO 1.45 - Change package height FROM 1.5 TO 1.45 HEATSINK E --- AADddeldde ttLeaE DbSes r retioefe sr reCecnoocnmefig mdueerasnitgdionenad ts oPcCrhseB mfoaotticprint All me5a/1s2/u20r08ements RaCre ±.1 mm unless otherwise indicated. E --- ADAddeldde ttLeaE DbSes r retioefe sr reCecnoocnmefig mdueerasnitgdionenad ts oPcCrhseB mfoaotticprint 5/12/2008 RC E --- AADddeldde ttLeaE DbSes r retioefe sr reCecnoocnmefig mdueerasnitgdionenad ts oPcCrhseB mfoaotticprint 5/12/2008 RC D 4.48±.20 D 4.48±.2D0 4.48±.20 .80 D .80 D .80 D 1.45 1.45 1.45 .05±.05 CREE CO.7N5F I+- D. .0 E1 3 N3 TIAL. TNHOIT6SIC PELOT A1ND TH2E INTFYO3PR.MAT4ION 5 2.6.005±.05 A 4 9.7.05+ +- ... 02.0 1 3 3 7.50 1 32 TY3PDD.21 DD434 .05±.05REV COMM2ENTS REVISIONS .7D5A T E+- . .0 1 3 3 1 APPROVED BY 1 2 TY3P. 4 CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT A Initial Release 10/16/07 RC HEATSINK MAY NOT BEH CEOAPTISEIDN,K REPRODUCED OR DISCLOSED TO ANY HEATSINK B Change height due to new lens 10/23/2007 RC UOFN CARUEET IHNCO.RIZED PERSON WITHOUT THE WRITTEN CONSENT C Change recommended solder pad footprint 11/26/2007 RC C 6 5 4 3 2 Color 1 D Height change due to new lens (was 3.86) 12/26/2007 RC UMCCCOFORONA CENANYREUTFE CNEAITD OIIHONNENCOTNE.F RDBTIID IZEWAE ECLNIDT OITH NPIPAIFENIORLE .ASD RTNORM,H OENRIAT SET I CT WHPPEIROLEITO ONPHTRD OO OAUUFPNC TCRD EITRE DTHETH EEAO,E RWIR NIYN RD CAFIT.ION STTCDREHMNLISO AC PSTOLEIONODSNT ET NOT ANY 2.60 A D 9.0+C..02 RCAEBV7.C 5CICnO0hhitiMaaannlM ggREeeeNl ehrTeaeScsigoehmt mdueen dtoe dn esowld leeDDnr sp21ad DDfoRo34EtVpIrSinIOtNS5.40 DDDD1110112340//D22/::::136A 6//RGBWT22/E000el700ruh77edeieten A2P.P6R0ORRRCCCVED BY A .25 4.48±.20 R3.198.0+..02 7.50 D8D21 DD7.3480 61P.IT5C0 HB52S.C60 A E ---- ACADddehladden ttLegaE DebSe s pr retiaoefec sr rekCeacnogocnemef igh mdeueerigasnihtgditone FnadR ts OoPcCrMhseB 1 mf.o5ao TttiOcp r1in.4t5 9.0+..025/12/2008 7.50 RC D DD21 DD34 D Height change due to new lens (was 3.86) 12/26/2007 RC 1.45 7.00 .10 +.13 TYP. E --- CADdehladen tLegE DeSe prreiaefecs rkCeanogcneef igh deuerigasihtgiton FnaR tsOocrMhse 1m.5a TtiOc 1.45 5/12/2008 RC .05±.05 .75 - . 0 3 C C C - Add tabs to recommended PCB footprint 1 2 3 4 D C 4.48±.20 R3.18C 8 7 6 5 C R3.18 8 7 6 5 R3.18 8 7 6 5 .80 HEATSINK D 1.45 5.40 +.13 .25 TYP. 51..4500 BSC .25 5.40 1.50 BSC .25 1.50 BSC .75 - . 0 3 PITCH PITCH PITCH .05±.05 1 2 3 4 7.00 .10 7.00 .10 7.00 .10 A D2 D3 top view 2.60 side view 70990.0M+C. 2PARALLEL /7 IN.5D0EPbENoDtEtNoTm view HEATSINK .0CONFIGURATION D1 D4 5.60 B 1.16 1.00 TYP. C 2.60 A 9.0+.2 7.50 D2 D3 B NEGATIVE (-) 1 8 D1 1 POSITIVE (+) 1 .0 D1 D4 C R3.18 D5 8 7 6 5 7090MC PARALLEL / INDEPENDENT 7090MC PARALLEL / INDEPENDENT 7090MC PARALLEL / INDEPENDENT 5.60 CONFIGURATION 5.60 5.40 2.00 .25 NEGATIVE (-) 2 C7ONFIGURATION D2 5.60 2 POSITIVE (+) 21P.IT5C0 HBSC CONFIGURATION 3.85 C D6 7.00 .10 C B 1.16 1.00 TYP. R3.18 8 7NEGAT6IVE (-) 15 8 B 1.16D1 1 POSI1TI.V0E0 ( +T) Y1P. 2.84 7.70 10.02 NEGABTIVEN (E-)G 1ATIVE1 8(-.)1 36 6 D1 1.B0D30 TY1P. POS3ITIVE P(+O) S1ITIVE (+) 3 NEGATIVE (-) 1 8 D1 1 POSITIBVE (+) 1 B .25 1.50 BSC 5.40 PITCH D5 D5 D7 D5 2.00 NE7G.A0T0IVE (-) 2 7 .10 D2 2 POSITIVE (+) 22.75 2.00 1.30 NEGATIVEN (E-)G 2ATIVE 7(-) 4 5 D2 D4 2 POS4ITIVE P(+O) S2ITIVE (+) 4 2.00 NEGATIVE (-) 2 7 D2 2 POSITIVE (+) 2 3.85 3.85 3.85 D6 D6 D8 D6 1.50 BSC 2.84 7.70 10.02 NEGATIVE (-) 3 6 A D3 PIT3CHPOSITIVE (+) 35.60 2.84 7.70 10.02 NEGATIVE (-) 3 76090MC CPOARNAFLIGLEULR /A DITN3IODNEPENDEN3T POSITIVE (+) 3 MUILN2LLI.EM8SSE4 ODTETIMHREESNR &WS7I OIBS.NEE7 SFS0 OPAERRCEEI FI N1FIEID0NI.S0H2. DCRHR.AECCWKhNa BlYoupeckyNEGDDAAA1TT0TEE/I1V6E/ 0(-7) 3 6 D3 4D6u0r30h aSmili,c Non.C PD 2r7Oiv7e0S3ITIVE (+) 3 D7 RECOMMENDED PCB SOLDER PAD D7 TOLERANCE UNLESS SPECIFIED: Ban Loh D7 .X ± 0.3 APPROVED DATE A 2.75 7090MC PA1R.3A0LLEL / INDEPENDENT NEGATIVE (-) 4 5 B 1.1D64 21..4 TSthooPallOednSreIa TP2r1InV C.m.E7c0 B(50+ea ) Ss sT4:okY lPwd..1ein0rd Poawds. must be .05 mm1 b.3ig0ger NNEGEGATAITVIEV E(- )( -4) 1 158.16 D4D11 2.75 41THIRPDO PAOSNISTGIILTVEIEV P E(R+ O()+ J4)E C1TION 1.30 .XX°X ± ± 1 .1°3 MATERIAL NEGATIVE (-) 4 TITLE5 O70U9T0LIMNEC D DP4RAACWKAINGGE,4 POSITIVBE (+) 4 FOR SHEET METAL PARTS ONLY CONFIGURATION D8 D8 SIZE DRAWDIN8G NO. REV. 5.60 1.50 BSC 1.50 BSC 1.50 BSCD5 ..XXX ± ± . 2.150 FINAL PROTECTIVE FINISH C 2610-00005 E B 1.16 1.00 TYP. A PITCHRECOMMENDED PCNBEG ASTOIVEL (D-) 1ER P8AD D1 1 POSITIVE (+) 1 A PI3TC.8HR5ECOMM6ENDED PCMTBUIOLNL LLESIERMSAOSEN ODTCETIELMHR UEEDS.NNRX &LWS EE I OIBS S ±SNEER SSF0S POP.A 3EEPRRCCEIEIF FAI NIFIEEIDDND:ISH.2.00 ADCRHBPR.PAECaRCWnOKhNV a LEB5oDlYohupeckyBDDDAAA1TTT0EEE/16/07 NEGAATIVE (3-). 285 74 P4D6IuT0r0hC aSmili,cH RNon.C ED 2Dr76iCv7e03O4MD2MEANDE2D PPCOSBIT IVSEO (+)L 2DER3 MPTUIOALNLLLEIERMDSASEN ODTCETIEMHR UEES.NNRX &LWS E I OIBS S ±SNEE SSF0S POP.A3EERRCCEIEIF XFI NI°FIEE IDD N : ±IS 2H°. ADCRHBPR.PAECaRCWnOKhNV a LEBoDlYohupecky DDDAAA1TTT0EEE/216/07 SCALE 20:1 4D6u0r0h aSmili,c Non.C D 2r7iv7e013 SHEET 1 OAF 1 MTUIOLNLLLEIERMSASEN ODTCETIEMHR UEES.NNRX &LWS E I OIBS S ±SNEE SSF0S POP.A3EERRCCEIEIF FI NIFIEEIDDN:ISH. ADCRHBPR.PAECaRCWnOKhNV a LEBoDlYohupecky DDDAAA1TTT0EEE/16/07 4D6u0r0h aSmili,c Non.C D 2r7iv7e03 A .XX ± .13 TITLE .XX ± .13 TITLE .XX ± .13 TITLE 1. Tolerances: .10 1. Tolerances: .10 OUTLINE DRAWING1., Tolerances: .10 OUTLINE DRAWING, OUTLINE DRAWING, 2. Solder mask windows must be .05 mm bigger D5 2. THSIRoDl dANeGrL Em PRaOsJEkC TwIOiNndows must be .0X°5 m± 1°m bigger 2.8M4ATERIAL7.70 10.02 N7EG0A9T0IVME (C-) 3 PAC6KAG2.E Solder mD3askT HwIRiDn AdNoG3Lw1E. Ps2R 4mPOOJEuSCIsTTItI7OV b.NE7 (e+) .30150 .m02m biggeXr° ± 1° MATERIAL 7090MC PACKAGE THIRD ANGLE PROJECTION X° ± 1° MATERIAL 7090MC PACKAGE than PCB Solder Pad. than PCB Solder Pad. than PCB Solder Pad. FOR SHEET METAL PARTS ONLY FOR SHEET METAL PARTS ONLY FOR SHEET METAL PARTS ONLY 3.85 2.00 NEGATIVE (-) 2 7 D2 2 POSITIVE (+) 2 ..XXX ± ± . 2.150 FINAL PROTECTIVE FINISH SIZE C DRAWING NO.2610-00005 D7 REEV. ..XXX ± ± . 2.150 FINAL PROTECTIVE FINISH SIZE C DRAWING NO.2610-00005 REEV. ..XXX ± ± . 2.150 FINAL PROTECTIVE FINISH SIZE C DRAWING NO.2610-00005 REEV. D6 2.75 X° ± 2° 1.30 SCALE 20:1 NEGATIVE (-) 4 5 SH2EE.7T 15 OF 1D4 4 POSITIVE (+) 4 X° ± 2° SCALE 20:1 SHEET 1 OF 1 X° ± 2° SCALE 20:1 SHEET 1 OF 1 2.84 7.70 160.02 NEGATIVE (-) 3 6 5 D3 3 POSITIVE (+) 3 4 6 3 5 2 4 1 D86 3 5 2 4 1 3 2 1 1.50 BSC 2.75 1.30 NEGATIVE (-) 4 5 D7 D4 4 POSITIVE (+) 4 A PITCHRECOrMecMoEmNmDEeDn dPeCdB P SCObL DsEoRl dPeArD Pad 1.5recommended stencil Pattern MTUIOLNLLLEIERMSASEN ODTCETIEMHR UEESNNR &LWSEI OIBSSSNEE SSFS POPAEERRCCEIEIF FI NIFIEEIDDN:ISH. DCRHBR.AECaCWnKhN a LBolYohupecky DDAA1TT0EE/16/07 4D6u0r0h aSmili,c Non.C D 2r7iv7e03 .X ± 0.3 APPROVED DATE A D8 1. Tolerances: .10 (shaded Area is open) .XX ± .13 TITLE OUTLINE DRAWING, 1.50 BSC 2. Solder mask windows must be .05 mm bigger THIRD ANGLE PROJECTION X° ± 1° MATERIAL 7090MC PACKAGE A PITCHRECOMMENDED PCB SOLDER PAD MTUIOLNLLLEIERMSASEN ODTCETIEMHR UEESNNR &LWSEI OIBSSSNEE SSFS POPAEERRCCEIEIF FI NIICFIEEnIDDNoc:IpS. HyU.rLig®h at n©dDC R 2HBRt.AECah0CWnKheN0 a L B8UolYoh-uR2p 0teloh1cgka8yo nC a rPreDDeAAe1CTT 0EE,r /eBI1n6g /cSi0s.o7 tAeldlrle erdigr thPratasd dreem.searrvkesd o. fT UhLe LinLfCo.rmation i4Dn6u0 r0ht ahSmilii,c sNon. C dD 2r7oiv7e0c3ument is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered traFOdRe SmHEEaT rMk..EXXsTX A o L ± Pf± A . 2C.R15T0rSe OeN,L Y FINAL PROTECTIVE FINISH SIZE C DRAWING NO.2610-00005 REEV. .X ± 0.3 APPROVED DATE A X° ± 2°12 SCALE 20:1 SHEET 1 OF 1 .XX ± .13 TITLE 1. Tolerances: .10 6 OUTLINE DRAWING, 5 4 3 2 1 2. Solder mask windows must be .05 mm bigger THIRD ANGLE PROJECTION X° ± 1° MATERIAL 7090MC PACKAGE than PCB Solder Pad. FOR SHEET METAL PARTS ONLY SIZE DRAWING NO. REV. ..XXX ± ± . 2.150 FINAL PROTECTIVE FINISH C 2610-00005 E X° ± 2° SCALE 20:1 SHEET 1 OF 1 6 5 4 3 2 1

200.0 A B A SECTION A-A SCALE 2 : 1 DETAIL B SCALE 2 : 1 XLamp® mC-E LED tAPE AnD rEEL All Cree carrier tapes conform to eIA-481D, Automated Component Handling Systems Standard. except as noted, all measurements in mm. 4.0±.1 1.5±.1 12.0±.1 5.5±.1 1.75±.10 Cathode Side +.3 16.0 .0 Anode Side (denoted by chamfer) User Feed Direction END START Loaded Pockets Trailer Leader (200 Lamps) 160mm (min) of 400mm (min) of empty pockets empty pockets with sealed with tape at least 100mm (13 pockets min.) sealed by tape (34 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 13

XLamp® mC-E LED PACkAging Unpackaged Reel Vacuum-Sealed MVaocuisutmu-rSee aBleadrrier Bag Moisture Barrier Bag CLRaEbEe Bli nw Ciotdhe Cree Bin &C oBadreco,d Qe Ltayb, eLlot # Label with Cree Bin Code, Quantity, Reel ID LLaabbeel wl iwthi tChu sCtormeeer Bin CP/oNd, Qet,y ,Q Lotyt ,# , LPoOt # # Packaged Reel Patent Label Dessicant (inside bag) LLaabbeel lw iwthi tChus tComreere O Orderrd er Code, Code, Qty, Reel ID, PO # Quantity, Reel ID, PO # Humidity Indicator Card (inside bag) Label with Cree Bin Code, Quantity, Reel ID Boxed Reel Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Patent Label (on bottom of box) Copyright © 2008-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo, XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 14