MC74LCX245 Low-Voltage CMOS Octal Transceiver With 5 V−Tolerant Inputs and Outputs (3−State, Non−Inverting) http://onsemi.com The MC74LCX245 is a high performance, non−inverting octal transceiver operating from a 2.0 to 5.5 V supply. High impedance TTL MARKING compatible inputs significantly reduce current loading to input drivers DIAGRAMS while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX245 inputs 20 to be safely driven from 5 V devices if V is less than 5.0 V. The CC SOIC−20 MC74LCX245 is suitable for memory address driving and all TTL LCX245 20 DW SUFFIX AWLYYWWG level bus oriented transceiver applications. CASE 751D Current drive capability is 24 mA at both A and B ports. The 1 1 Transmit/Receive (T/R) input determines the direction of data flow through the bi−directional transceiver. Transmit (active−HIGH) enables data from A ports to B ports; Receive (active−LOW) enables 20 data from B to A ports. The Output Enable input, when HIGH, LCX TSSOP−20 disables both A and B ports by placing them in a HIGH Z condition. 245 20 DT SUFFIX ALYW(cid:2) CASE 948E Features 1 (cid:2) • 1 Designed for 2.0 to 5.5 V V Operation CC • 5 V Tolerant − Interface Capability With 5 V TTL Logic 1 • Supports Live Insertion and Withdrawal • I Specification Guarantees High Impedance When V = 0 V OFF CC • LCX LVTTL Compatible QFN20 245 • LVCMOS Compatible CMANS ES U48F5FAIXA ALYW(cid:2) • (cid:2) 24 mA Balanced Output Sink and Source Capability • Near Zero Static Supply Current in All Three Logic States (10 (cid:2)A) Substantially Reduces System Power Requirements A = Assembly Location • Latchup Performance Exceeds 500 mA L, WL = Wafer Lot • Y, YY = Year ESD Performance: Human Body Model >2000 V W, WW = Work Week Machine Model >200 V G or (cid:2) = Pb−Free Package • NLV Prefix for Automotive and Other Applications Requiring (Note: Microdot may be in either location) Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS ORDERING INFORMATION Compliant See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: October, 2012 − Rev. 11 MC74LCX245/D

MC74LCX245 VCC OE B0 B1 B2 B3 B4 B5 B6 B7 OE 19 20 19 18 17 16 15 14 13 12 11 T/R 1 2 A0 18 B0 1 2 3 4 5 6 7 8 9 10 3 A1 T/R A0 A1 A2 A3 A4 A5 A6 A7 GND 17 19 12 B1 4 A2 20 11 16 QFN B2 PIN #1 10 5 A3 15 2 9 B3 6 Figure 1. Pinout (Top View) A4 14 B4 PIN NAMES 7 A5 PINS FUNCTION 13 B5 OE Output Enable Input T/R Transmit/Receive Input 8 A6 A0−A7 Side A 3−State Inputs or 3−State Outputs B0−B7 Side B 3−State Inputs or 3−StateOutputs 12 B6 9 A7 11 B7 TRUTH TABLE INPUTS OPERATING MODE Non−Inverting Figure 2. Logic Diagram OE T/R L L B Data to A Bus L H A Data to B Bus H X Z H = High Voltage Level L = Low Voltage Level Z = High Impedance State X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, Do Not Float Inputs http://onsemi.com 2

MC74LCX245 MAXIMUM RATINGS Symbol Parameter Value Condition Unit VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI< GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C MSL Moisture Sensitivity Level 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit VCC Supply Voltage Operating 2.0 2.5, 3.3 5.5 V Data Retention Only 1.5 2.5, 3.3 5.5 VI Input Voltage 0 5.5 V VO Output Voltage (HIGH or LOW State) 0 VCC V (3−State) 0 5.5 IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V − 24 mA VCC = 2.7 V − 3.0 V − 12 VCC = 2.3 V − 2.7 V − 8 IOL LOW Level Output Current VCC = 3.0 V − 3.6 V + 24 mA VCC = 2.7 V − 3.0 V + 12 VCC = 2.3 V − 2.7 V + 8 TA Operating Free−Air Temperature −55 +125 °C (cid:3)t/(cid:3)V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V http://onsemi.com 3

MC74LCX245 DC ELECTRICAL CHARACTERISTICS TA = −55°C to +125°C Symbol Characteristic Condition Min Max Unit VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V 2.7 V ≤ VCC ≤ 3.6 V 2.0 VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V 2.7 V ≤ VCC ≤ 3.6 V 0.8 VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 (cid:2)A VCC−0.2 V VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 (cid:2)A 0.2 V VCC = 2.3 V; IOL= 8 mA 0.6 VCC = 2.7 V; IOL= 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 IOZ 3−State Output Current VCC = 3.6 V, VIN = VIH or VIL, ±5 (cid:2)A VOUT = 0 to 5.5 V IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 (cid:2)A IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5 (cid:2)A ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 (cid:2)A (cid:3)ICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 (cid:2)A 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 (cid:4) Limits TA = −55°C to +125°C VCC = 3.3 V ± 0.3V VCC = 2.7 V VCC = 2.5 V ± 0.2V VCC = 5.0 V CL = 50 pF CL = 50 pF CL = 30 pF CL = 50 pF Symbol Parameter Waveform Min Max Min Max Min Max Min Max Unit tPLH Propagation Delay 1 1.5 7.0 1.5 8.0 1.5 8.4 1.5 5.0 ns tPHL Input to Output 1.5 7.0 1.5 8.0 1.5 8.4 1.5 5.0 tPZH Output Enable Time 2 1.5 8.5 1.5 9.5 1.5 10.5 1.5 7.0 ns tPZL to High and Low Level 1.5 8.5 1.5 9.5 1.5 10.5 1.5 7.0 tPHZ Output Disable Time From 2 1.5 7.5 1.5 8.5 1.5 9.0 1.5 6.0 ns tPLZ High and Low Level 1.5 7.5 1.5 8.5 1.5 9.0 1.5 6.0 tOSHL Output−to−Output Skew 1.0 1.0 1.0 1.0 ns tOSLH (Note 3) 1.0 1.0 1.0 1.0 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. http://onsemi.com 4

MC74LCX245 DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Unit VOLP Dynamic LOW Peak Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 V VOLV Dynamic LOW Valley Voltage (Note 4) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V −0.8 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.6 V 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF CI/O Input/Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF VCC OE, T/R VCC Vmi Vmi 0 V An, Bn Vmi Vmi tPZH tPHZ 0 V VOH tPLH tPHL An, Bn Vmo VHZ VOH Bn, An Vmo Vmo tPZL tPLZ VOL An, Bn Vmo VLZ VOL WAVEFORM 1 − PROPAGATION DELAYS WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms VCC Symbol 3.3 V (cid:2) 0.3 V 2.7 V 2.5 V (cid:2) 0.2 V 5.0 V Vmi 1.5 V 1.5 V VCC/2 VCC/2 Vmo 1.5 V 1.5 V VCC/2 VCC/2 VHZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V VOL + 0.15 V VLZ VOH − 0.3 V VOH − 0.3 V VOH − 0.15 V VOH − 0.15 V http://onsemi.com 5

MC74LCX245 VCC 6 V OPEN PULSE DUT R1 GND GENERATOR RT CL RL TEST SWITCH tPLH, tPHL Open tPZL, tPLZ 6 V at VCC = 3.3 (cid:2)0.3 V 6 V at VCC = 2.5 (cid:2)0.2 V Open Collector/Drain tPLH and tPHL 6 V tPZH, tPHZ GND CL= 50 pF at VCC = 3.3 (cid:2)0.3 V or equivalent (includes jig and probe capacitance) CL= 30 pF at VCC = 2.5 (cid:2)0.2 V or equivalent (includes jig and probe capacitance) RL= R1 = 500 (cid:4) or equivalent RT= ZOUT of pulse generator (typically 50 (cid:4)) Figure 4. Test Circuit ORDERING INFORMATION Device Package Shipping† MC74LCX245DWR2G SOIC−20 1000 Tape & Reel (Pb−Free) MC74LCX245DWG SOIC−20 38 Units / Rail (Pb−Free) MC74LCX245DTG TSSOP−20 75 Units / Rail (Pb−Free) MC74LCX245DTR2G TSSOP−20 2500 Tape & Reel (Pb−Free) NLV74LCX245DTR2G* TSSOP−20 2500 Tape & Reel (Pb−Free) MC74LCX245MNTWG QFN20 3000 Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 6

MC74LCX245 PACKAGE DIMENSIONS SOIC−20 DW SUFFIX CASE 751D−05 ISSUE G D NOTES: A (cid:2) 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD 20 11 M PROTRUSION. B 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. (cid:3) 5. DIMENSION B DOES NOT INCLUDE DAMBAR H M 45 PROTRUSION. ALLOWABLE PROTRUSION 10X 0.25 E hX SDCHIOMANELDNLI TSBIIOEO NN0.. 1A3T TMOATXAILM IUNM E MXCATEESRSI AOLF B 1 10 MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 20X B B 0.35 0.49 C 0.23 0.32 0.25 M T A S B S D 12.65 12.95 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 A L 0.50 0.90 L (cid:2) 0 (cid:3) 7 (cid:3) SEATING 18X e A1 TPLANE C http://onsemi.com 7

MC74LCX245 PACKAGE DIMENSIONS TSSOP−20 CASE 948E−02 ISSUE C NOTES: 20X K REF K 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 0.15 (0.006) T U S 0.10 (0.004) M T U S V S K1 2. CONTROLLING DIMENSION: MILLIMETER. ÍÍÍÍ 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE 20 11 J JÍ1 ÍÍÍ BURRS. MOLD FLASH OR GATE BURRS 2X L/2 SHALL NOT EXCEED 0.15 (0.006) PER SIDE. ÍÍÍÍ 4. DIMENSION B DOES NOT INCLUDE B SECTION N−N INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION L −U− SHALL NOT EXCEED 0.25 (0.010) PER SIDE. PIN 1 5. DIMENSION K DOES NOT INCLUDE IDENT 0.25 (0.010) DAMBAR PROTRUSION. ALLOWABLE N DAMBAR PROTRUSION SHALL BE 0.08 1 10 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL M CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR 0.15 (0.006) T U S REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE A DETERMINED AT DATUM PLANE −W−. N MILLIMETERS INCHES −V− DIM MIN MAX MIN MAX F A 6.40 6.60 0.252 0.260 B 4.30 4.50 0.169 0.177 DETAIL E C --- 1.20 --- 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 −W− G 0.65 BSC 0.026 BSC C H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 D G H K 0.19 0.30 0.007 0.012 DETAIL E K1 0.19 0.25 0.007 0.010 0.100 (0.004) ML 06 (cid:3).40 BSC8 (cid:3) 00 (cid:3).252 BSC8 (cid:3) −T− SEATING PLANE SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 16X 0.36 1.26 DIMENSIONS: MILLIMETERS http://onsemi.com 8

MC74LCX245 PACKAGE DIMENSIONS QFN20, 2.5x4.5 MM CASE 485AA ISSUE B D A NOTES: 1. DIMENSIONING AND TOLERANCING PER B ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED PIN ONE REFERENCE ÉÉÉ TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED ÉÉÉ PAD AS WELL AS THE TERMINALS. ÉÉÉ MILLIMETERS DIM MIN MAX ÉÉÉ A 0.80 1.00 E A1 0.00 0.05 A3 0.20 REF b 0.20 0.30 D 2.50 BSC 2X D2 0.85 1.15 E 4.50 BSC 0.15 C E2 2.85 3.15 e 0.50 BSC 2X K 0.20 --- 0.15 C L 0.35 0.45 TOP VIEW 0.10 C A 20X 0.08 C (A3) A1 C SEATING SIDE VIEW PLANE D2 e 11 20X L 9 12 e E2 20X b 0.10 C A B 2 19 20X 0.05 C NOTE 3 1 20 K BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com MV74LCX245/D 9

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: MC74LCX245DTG MC74LCX245DTR2G MC74LCX245DWG MC74LCX245DWR2G MC74LCX245MNTWG NLV74LCX245DTR2G