MC74LCX244 Low-Voltage CMOS Octal Buffer With 5 V−Tolerant Inputs and Outputs (3−State, Non−Inverting) www.onsemi.com The MC74LCX244 is a high performance, non−inverting octal buffer operating from a 2.3 to 5.5 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX244 inputs to be safely driven from 5 V devices. The MC74LCX244 is suitable SOIC−20 WB TSSOP−20 QFN20 for memory address driving and all TTL level bus oriented transceiver DW SUFFIX DT SUFFIX MN SUFFIX CASE 751D CASE 948E CASES 485AA applications. & 485CB Current drive capability is 24 mA at the outputs. The Output Enable (OE) input, when HIGH, disables the output by placing them in MARKING DIAGRAMS aHIGH Z condition. 20 Features • LCX244 Designed for 2.3 to 5.5 V V Operation CC AWLYYWWG • 5 V Tolerant − Interface Capability With 5 V TTL Logic • Supports Live Insertion and Withdrawal 1 • I Specification Guarantees High Impedance When V = 0 V SOIC−20 WB OFF CC • LVTTL Compatible • 20 LVCMOS Compatible • 24 mA Balanced Output Sink and Source Capability LCX 244 • Near Zero Static Supply Current in All Three Logic States (10 (cid:2)A) ALYW(cid:2) (cid:2) Substantially Reduces System Power Requirements • 1 Latchup Performance Exceeds 500 mA • ESD Performance: TSSOP−20 ♦ Human Body Model >2000 V 1 ♦ Machine Model >200 V 1 • NLV Prefix for Automotive and Other Applications Requiring LCX Unique Site and Control Change Requirements; AEC−Q100 244 244 Qualified and PPAP Capable ALYW(cid:2) ALYW(cid:2) • (cid:2) (cid:2) These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant QFN20 − 485AA QFN20 − 485CB A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week G or (cid:2) = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: October, 2017 − Rev. 20 MC74LCX244/D

MC74LCX244 VCC 2OE 1O0 2D0 1O1 2D1 1O2 2D2 1O3 2D3 1OE 1 20 19 18 17 16 15 14 13 12 11 2 18 1D0 1O0 4 16 1D1 1O1 6 14 1D2 1O2 1 2 3 4 5 6 7 8 9 10 1OE 1D0 2O0 1D1 2O1 1D2 2O2 1D3 2O3 GND 8 12 1D3 1O3 19 12 19 20 11 2OE QFN PIN #1 10 17 3 2D0 2O0 2 9 15 5 2D1 2O1 Figure 1. Pinouts: 20−Lead (Top View) 13 7 2D2 2O2 PIN NAMES 11 9 2D3 2O3 PINS FUNCTION nOE Output Enable Inputs Figure 2. Logic Diagram 1Dn, 2Dn Data Inputs 1On, 2On 3−State Outputs TRUTH TABLE INPUTS OUTPUTS 1OE 1Dn 2OE 2Dn 1On, 2On L L L L H H H X Z H = High Voltage Level L = Low Voltage Level Z = High Impedance State X = High or Low Voltage Level and Transitions are Acceptable For ICC reasons, DO NOT FLOAT Inputs www.onsemi.com 2

MC74LCX244 MAXIMUM RATINGS Symbol Parameter Value Condition Units VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage −0.5 ≤ VO ≤ +7.0 Output in 3−State V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V IIK DC Input Diode Current −50 VI < GND mA IOK DC Output Diode Current −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case TL = 260 °C for 10 Seconds TJ Junction Temperature Under Bias TJ = 150 °C (cid:3)JA Thermal Resistance (Note 2) (cid:3)JA = 140 °C/W MSL Moisture Sensitivity Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Units VCC Supply Voltage V Operating 2.0 2.5, 3.3 5.5 Data Retention Only 1.5 2.5, 3.3 5.5 VI Input Voltage 0 5.5 V VO Output Voltage V HIGH or LOW State 0 VCC 3−State 0 5.5 IOH HIGH Level Output Current mA VCC = 3.0 V − 3.6 V −24 VCC = 2.7 V − 3.0 V −12 IOL LOW Level Output Current mA VCC = 3.0 V − 3.6 V 24 VCC = 2.7 V − 3.0 V 12 TA Operating Free−Air Temperature −55 +125 °C (cid:4)t/(cid:4)V Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3

MC74LCX244 DC ELECTRICAL CHARACTERISTICS TA = −55°C to +125°C Symbol Characteristic Condition Min Max Units VIH HIGH Level Input Voltage (Note 3) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V 2.7 V ≤ VCC ≤ 3.6 V 2.0 VIL LOW Level Input Voltage (Note 3) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V 2.7 V ≤ VCC ≤ 3.6 V 0.8 VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 (cid:2)A VCC−0.2 V VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 (cid:2)A 0.2 V VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 IOZ 3−State Output Current VCC = 3.6 V, VIN = VIH or VIL, ±5 (cid:2)A VOUT = 0 to 5.5 V IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 (cid:2)A IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5 (cid:2)A ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 (cid:2)A (cid:4)ICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 (cid:2)A Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 (cid:5)) Limits TA = −55°C to +125°C VCC = 3.0 V to 3.6 V VCC = 2.7 V VCC = 2.5 V ±0.2 CL = 50 pF CL = 50 pF CL = 30 pF Symbol Parameter Waveform Min Max Min Max Min Max Units tPLH Propagation Delay 1 1.5 6.5 1.5 7.5 1.5 7.8 ns tPHL Input to Output 1.5 6.5 1.5 7.5 1.5 7.8 tPZH Output Enable Time to 2 1.5 8.0 1.5 9.0 1.5 10 ns tPZL High and Low Level 1.5 8.0 1.5 9.0 1.5 10 tPHZ Output Disable Time From 2 1.5 7.0 1.5 8.0 1.5 8.4 ns tPLZ High and Low Level 1.5 7.0 1.5 8.0 1.5 8.4 tOSHL Output−to−Output Skew 1.0 ns tOSLH (Note 4) 1.0 4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition Min Typ Max Units VOLP Dynamic LOW Peak Voltage (Note 5) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 VOLV Dynamic LOW Valley Voltage (Note 5) VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V −0.8 V VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.6 5. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. www.onsemi.com 4

MC74LCX244 CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Units CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF VCC 1Dn, 2Dn Vmi Vmi 0 V tPLH tPHL VOH 1On, 2On Vmo Vmo VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC 1OE, 2OE Vmi Vmi 0 V tPZH tPHZ VCC VOH - 0.3 V 1On, 2On Vmo ≈ 0 V tPZL tPLZ ≈ 3.0 V 1On, 2On Vmo VOL + 0.3 V GND WAVEFORM 2 − OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Figure 3. AC Waveforms VCC Symbol 3.3 V ± 0.3 V 2.7 V 2.5 V ± 0.2 V Vmi 1.5 V 1.5 V VCC/2 Vmo 1.5 V 1.5 V VCC/2 VHZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V VLZ VOH − 0.3 V VOH − 0.3 V VOH − 015 V www.onsemi.com 5

MC74LCX244 VCC 6 V OPEN PULSE DUT R1 GND GENERATOR RT CL RL TEST SWITCH tPLH, tPHL Open tPZL, tPLZ 6 V at VCC = 3.3 ±0.3 V 6 V at VCC = 2.5 ±0.2 V Open Collector/Drain tPLH and tPHL 6 V tPZH, tPHZ GND CL= 50 pF at VCC = 3.3 ±0.3 V or equivalent (includes jig and probe capacitance) CL= 30 pF at VCC = 2.5 ±0.2 V or equivalent (includes jig and probe capacitance) RL= R1 = 500 (cid:5) or equivalent RT= ZOUT of pulse generator (typically 50 (cid:5)) Figure 4. Test Circuit ORDERING INFORMATION Device Package Shipping† MC74LCX244DWG SOIC−20 WB 38 Units / Rail (Pb−Free) MC74LCX244DWR2G SOIC−20 WB 1000 / Tape & Reel (Pb−Free) MC74LCX244DTG TSSOP−20 75 Units / Rail (Pb−Free) MC74LCX244DTR2G TSSOP−20 2500 / Tape & Reel (Pb−Free) NLV74LCX244DTR2G* TSSOP−20 2500 / Tape & Reel (Pb−Free) MC74LCX244MNTWG QFN20, 2.5x4.5 3000 / Tape & Reel (Pb−Free) MC74LCX244MN2TWG QFN20, 2.5x3.5 3000 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable www.onsemi.com 6

MC74LCX244 PACKAGE DIMENSIONS SOIC−20 WB CASE 751D−05 ISSUE H D A (cid:2) NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. M 20 11 2. INTERPRET DIMENSIONS AND TOLERANCES B PER ASME Y14.5M, 1994. (cid:3) 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD H M 45 PROTRUSION. 10X 0.25 E hX 45.. MDPRIAMOXEITMNRSUUIMOS INMO NOB .LD ADOL PELROSO WNTAORBTUL ISENI COPLNRU O0DT.1ER5 UD PSAEIMORBN SAIRDE. SHALL BE 0.13 TOTAL IN EXCESS OF B 1 10 DIMENSION AT MAXIMUM MATERIAL CONDITION. B MILLIMETERS 20X B DIM MIN MAX 0.25 M T A S B S A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 12.65 12.95 A E 7.40 7.60 e 1.27 BSC L H 10.05 10.55 SEATING h 0.25 0.75 18X e A1 TPLANE C (cid:2)L 0.05 0(cid:3) 0.79 0(cid:3) RECOMMENDED SOLDERING FOOTPRINT* 20X 20X 1.30 0.52 20 11 11.00 1 10 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7

MC74LCX244 PACKAGE DIMENSIONS TSSOP−20 CASE 948E ISSUE D NOTES: 20X K REF K 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 0.15 (0.006) T U S 0.10 (0.004) M T U S V S ÍÍKÍ1 Í 2. CONTROLLING DIMENSION: MILLIMETER. ÍÍÍÍ 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE 2X L/2 20 11 J JÍ1 ÍÍÍ BSHUARLRLS N. OMTO ELDXC FELEADS H0 .O15R ( G0.A0T06E) BPUERRR SSIDE. 4. DIMENSION B DOES NOT INCLUDE B SECTION N−N INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION L −U− SHALL NOT EXCEED 0.25 (0.010) PER SIDE. PIN 1 5. DIMENSION K DOES NOT INCLUDE IDENT 0.25 (0.010) DAMBAR PROTRUSION. ALLOWABLE N DAMBAR PROTRUSION SHALL BE 0.08 1 10 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL M CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR 0.15 (0.006) T U S REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE A DETERMINED AT DATUM PLANE −W−. N MILLIMETERS INCHES −V− DIM MIN MAX MIN MAX F A 6.40 6.60 0.252 0.260 DETAIL E B 4.30 4.50 0.169 0.177 C --- 1.20 --- 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 −W− G 0.65 BSC 0.026 BSC C H 0.27 0.37 0.011 0.015 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 D G H K 0.19 0.30 0.007 0.012 DETAIL E K1 0.19 0.25 0.007 0.010 0.100 (0.004) ML 06 (cid:3).40 BSC8 (cid:3) 00 (cid:3).252 BSC8 (cid:3) −T− SEATING PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 16X 16X 0.36 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8

MC74LCX244 PACKAGE DIMENSIONS QFN20, 2.5x4.5 MM CASE 485AA ISSUE B D A NOTES: 1. DIMENSIONING AND TOLERANCING PER B ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. ÉÉÉ 3. DIMENSIONS b APPLIES TO PLATED PIN ONE REFERENCE TERMINAL AND IS MEASURED BETWEEN ÉÉÉ 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED ÉÉÉ PAD AS WELL AS THE TERMINALS. MILLIMETERS ÉÉÉ DIM MIN MAX A 0.80 1.00 ÉÉÉ E A1 0.00 0.05 A3 0.20 REF b 0.20 0.30 D 2.50 BSC 2X D2 0.85 1.15 E 4.50 BSC 0.15 C E2 2.85 3.15 e 0.50 BSC 2X K 0.20 --- 0.15 C L 0.35 0.45 TOP VIEW 0.10 C A 20X 0.08 C (A3) A1 C SEATING SIDE VIEW PLANE D2 e 11 20X L 9 12 e E2 20X b 0.10 C A B 2 19 20X 0.05 C NOTE 3 1 20 K BOTTOM VIEW www.onsemi.com 9

MC74LCX244 PACKAGE DIMENSIONS QFN20, 2.5x3.5, 0.4P CASE 485CB ISSUE O D A N1O.TDEISM:ENSIONING AND TOLERANCING PER B L L ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED PIN ONE ÉÉÉ L1 TERMINAL AND IS MEASURED BETWEEN REFERENCE 0.15 AND 0.30 MM FROM TERMINAL TIP. ÉÉÉ 4. COPLANARITY APPLIES TO THE EXPOSED DETAIL A PAD AS WELL AS THE TERMINALS. ÉÉÉ ALTERNATE TERMINAL MILLIMETERS CONSTRUCTIONS E DIM MIN MAX A 0.80 1.00 A1 0.00 0.05 A3 0.20 REF EXPOSED Cu MOLD CMPD b 0.15 0.25 2X 0.15 C ÇÉÇÉÇÉ D 2.50 BSC D2 0.90 1.10 ÉÉÉ E 3.50 BSC 2X 0.15 C TOP VIEW DETAIL B Ee2 2.000.40 BS2C.20 A ALTERNATE L 0.35 0.45 DETAIL B CONSTRUCTIONS L1 --- 0.15 0.10 C (A3) A1 0.08 C NOTE 4 SIDE VIEW C SPELAATNIENG SOLDERING FOOTPRINT* 3.80 0.10 C A B D2 2.24 PACKAGE 20XL OUTLINE 9 12 0.10 C A B DETAIL A 2.80 1.14 20X 0.63 E2 1 20Xb 0.40 20X 2 19 0.10 C A B PITCH 0.25 1 0.05 C NOTE 3 DIMENSIONS: MILLIMETERS e *For additional information on our Pb−Free strategy and soldering e/2 details, please download the ON Semiconductor Soldering and BOTTOM VIEW Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative ◊ www.onsemi.com MC74LCX244/D 10

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: MC74LCX244DTG MC74LCX244DTR2G MC74LCX244DWG MC74LCX244DWR2G MC74LCX244MNTWG NLV74LCX244DTR2G