MC74HCT4851A, MC74HCT4852A Analog Multiplexers/ Demultiplexers with Injection Current Effect Control with LSTTL www.onsemi.com Compatible Inputs MARKING DIAGRAMS Automotive Customized 16 SOIC−16 This device is pin compatible to standard HC405x and MC1405xB HCT485xAG 16 D SUFFIX analog mux/demux devices, but feature injection current effect AWLYWW CASE 751B control. This makes them especially suited for usage in automotive 1 1 applications where voltages in excess of normal logic voltage are common. The injection current effect control allows signals at disabled analog 16 input channels to exceed the supply voltage range without affecting SOIC−16 WIDE 16 HCT485xA the signal of the enabled analog channel. This eliminates the need for DW SUFFIX AWLYWWG CASE 751G external diode/ resistor networks typically used to keep the analog 1 channel signals within the supply voltage range. 1 The devices utilize low power silicon gate CMOS technology. The Channel Select and Enable inputs are compatible with standard CMOS 16 or LSTTL outputs. TSSOP−16 HCT4 Features 16 DT SUFFIX 85xA • Injection Current Cross−Coupling Less than 1mV/mA (SeeFigure 6) 1 CASE 948F ALY(cid:2)W(cid:2) • Pin Compatible to HC405x and MC1405xB Devices 1 • Power Supply Range (V − GND) = 4.5 to 5.5 V CC • In Compliance With the Requirements of JEDEC Standard No.7A X = 1 or 2 • A = Assembly Location Chip Complexity: 154 FETs or 36 Equivalent Gates WL, L = Wafer Lot • NLV Prefix for Automotive and Other Applications Requiring YY, Y = Year WW, W = Work Week Unique Site and Control Change Requirements; AEC−Q100 G or (cid:2) = Pb−Free Package Qualified and PPAP Capable • (Note: Microdot may be in either location) These Devices are Pb−Free and are RoHS Compliant ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. © Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: August, 2016 − Rev. 8 MC74HCT4851A/D

MC74HCT4851A, MC74HCT4852A FUNCTION TABLE − MC74HCT4851A Control Inputs Select 13 X0 Enable C B A ON Channels 14 X1 L L L L X0 15 X2 L L L H X1 AINNPAULTOSG/ X312 MULTIPLEXER/ 3 COMMON L L H L X2 OUTPUTS X4 1 DEMULTIPLEXER X OUTPUT/ L L H H X3 5 INPUT L H L L X4 X5 L H L H X5 2 X6 L H H L X6 4 X7 L H H H X7 11 H X X X NONE A CHANNEL 10 SELECT B INPUTS C 9 VCC X2 X1 X0 X3 A B C 6 ENABLE 16 15 14 13 12 11 10 9 PIN 16 = VCC PIN 8 = GND Figure 1. MC74HCT4851A Logic Diagram Single−Pole, 8−Position Plus Common Off 1 2 3 4 5 6 7 8 X4 X6 X X7 X5 Enable NC GND Figure 2. MC74HCT4851A 16−Lead Pinout (Top View) FUNCTION TABLE − MC74HCT4852A Control Inputs Select Enable B A ON Channels 12 X0 L L L Y0 X0 14 X1 13 L L H Y1 X1 15 X SWITCH X X2 L H L Y2 X2 11 L H H Y3 X3 X3 ANALOG COMMON H X X NONE INPUTS/OUTPUTS 1 OUTPUTS/INPUTS Y0 X = Don’t Care Y1 5 Y SWITCH 3 Y 2 Y2 4 Y3 VCC X2 X1 X X0 X3 A B 10 CHANNEL‐SELECT A 16 15 14 13 12 11 10 9 INPUTS B 9 PIN 16 = VCC PIN 8 = GND 6 ENABLE Figure 3. MC74HCT4852A Logic Diagram Double−Pole, 4−Position Plus Common Off 1 2 3 4 5 6 7 8 Y0 Y2 Y Y3 Y1 Enable NC GND Figure 4. MC74HCT4852A 16−Lead Pinout (Top View) www.onsemi.com 2

MC74HCT4851A, MC74HCT4852A MAXIMUM RATINGS Symbol Parameter Value Unit This device contains protection circuitry to guard against damage VCC Positive DC Supply Voltage (Referenced to GND) –0.5 to + 7.0 V due to high static voltages or electric Vin DC Input Voltage (Any Pin) (Referenced to GND) –0.5 to VCC + 0.5 V fields. However, precautions must I DC Current, Into or Out of Any Pin (cid:2)25 mA be taken to avoid applications of any voltage higher than maximum rated PD Power Dissipation in Still Air, SOIC Package† 500 mW voltages to this high−impedance cir- TSSOP Package† 450 cuit. For proper operation, Vin and Tstg Storage Temperature Range –65 to + 150 °C rVaonugt es hGoNuDld (cid:3)be ( Vcino nosr tVraoiunte) d(cid:3) t oV CtCh.e TL Lead Temperature, 1 mm from Case for 10 Seconds °C Unused inputs must always be SOIC or TSSOP Package 260 tied to an appropriate logic voltage level (e.g., either GND or VCC). Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of Unused outputs must be left open. these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC Positive DC Supply Voltage (Referenced to GND) 4.5 5.5 V Vin DC Input Voltage (Any Pin) (Referenced to GND) GND VCC V VIO* Static or Dynamic Voltage Across Switch 0.0 1.2 V TA Operating Temperature Range, All Package Types – 55 + 125 °C tr, tf Input Rise/Fall Time VCC = 2.0 V 0 1000 ns (Channel Select or Enable Inputs) VCC = 4.5 V 0 500 VCC = 6.0 V 0 400 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. *For voltage drops across switch greater than 1.2 V (switch on), excessive VCC current may be drawn; i.e., the current out of the switch may contain both VCC and switch input components. The reliability of the device will be unaffected unless the Maximum Ratings are exceeded. DC CHARACTERISTICS — Digital Section (Voltages Referenced to GND) VEE = GND, Except Where Noted Guaranteed Limit VCC Symbol Parameter Condition V −55 to 25°C ≤85°C ≤125°C Unit VIH Minimum High−Level Input Voltage, Ron = Per Spec 4.5 2.0 2.0 2.0 V Channel−Select or Enable Inputs to 5.5 VIL Maximum Low−Level Input Voltage, Ron = Per Spec 4.5 0.8 0.8 0.8 V Channel−Select or Enable Inputs to 5.5 Iin Maximum Input Leakage Current on Digital Pins Vin = VCC or GND 5.5 ±0.1 ±1.0 ±1.0 (cid:2)A (Enable/A/B/C) ICC Maximum Quiescent Supply Current Vin(digital) = VCC or GND 5.5 2.0 20 40 (cid:2)A (per Package) Vin(analog) = GND www.onsemi.com 3

MC74HCT4851A, MC74HCT4852A DC CHARACTERISTICS — Analog Section Guaranteed Limit Symbol Parameter Condition VCC −55 to 25°C ≤85°C ≤125°C Unit Ron Maximum “ON” Resistance Vin = VIL or VIH; VIS = VCC to 4.5 550 650 750 (cid:3) GND (Note 1); IS ≤ 2.0 mA 5.5 400 500 600 (Note 2) (cid:4)Ron Delta “ON” Resistance Vin = VIL or VIH; VIS = VCC/2 4.5 80 100 120 (cid:3) (Note 1); IS ≤ 2.0 mA (Note 2) 5.5 60 80 100 Ioff Maximum Off−Channel Leakage Current, Vin = VCC or GND (cid:2)A Any One Channel 5.5 ±0.1 ±0.1 ±0.1 Common Channel ±0.1 ±0.1 ±0.1 Ion Maximum On−Channel Leakage Vin = VCC or GND (cid:2)A Channel−to−Channel 5.5 ±0.1 ±0.1 ±0.1 1. VIS is the input voltage of an analog I/O pin. 2. IS is the currebnt flowing in or out of analog I/O pin. AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns, VCC = 5.0 V ± 10%) Symbol Parameter VCC −55 to 25°C ≤85°C ≤125°C Unit tPHL, Maximum Propagation Delay, Analog Input to Analog Output 5.0 40 45 50 ns tPLH tPHL, Maximum Propagation Delay, Enable or Channel−Select to Analog Output 5.0 80 90 100 ns tPHZ,PZH tPLH, tPLZ,PZL Cin Maximum Input Capacitance Digital Pins 10 10 10 pF (All Switches Off) Any Single Analog Pin 35 35 35 (All Switches Off) Common Analog Pin 40 40 40 CPD Power Dissipation Capacitance Typical 5.0 20 pF INJECTION CURRENT COUPLING SPECIFICATIONS (VCC = 5V, TA = −55°C to +125°C) Symbol Parameter Condition Typ Max Unit V(cid:4)out Maximum Shift of Output Voltage of Enabled Analog Channel Iin* ≤ 1 mA, RS ≤ 3,9 k(cid:3) 0.1 1.0 mV Iin* ≤ 10 mA, RS ≤ 3,9 k(cid:3) 1.0 5.0 Iin* ≤ 1 mA, RS ≤ 20 k(cid:3) 0.5 2.0 Iin* ≤ 10 mA, RS ≤ 20 k(cid:3) 5.0 20 * Iin = Total current injected into all disabled channels. www.onsemi.com 4

MC74HCT4851A, MC74HCT4852A Figure 5. Typical On Resistance V = 4.5V CC External DC P.S. Vin2 / Iin2 meas. here. VCC = 5 V Current Source 4 16 HP4155C Smu #2 X7 Vin1 = 4.9 V (Smu3) RS X0 13 3 X Vout Iin1 measure here Vm1 connected here. Vm2 connected here. 6 NOTES: Rs = 3.9 K(cid:3) or 20 K(cid:3). 8 NOTES: Vm1 & Vm2 are internal NOTES: HP4155C Voltmeters. GND or VSS Figure 6. Injection Current Coupling Specification www.onsemi.com 5

MC74HCT4851A, MC74HCT4852A 5V 6V 5V VCC VCC HCT4051A Microcontroller Sensor Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 (8x Identical Circuitry) Common Out A/D - Input Figure 7. Actual Technology Requires 32 passive components and one extra 6V regulator to suppress injection current into a standard HCT4051 multiplexer 5V VCC VCC HCT4851A Microcontroller Sensor Channel 1 Channel 2 Channel 3 Channel 4 Channel 5 Channel 6 Channel 7 Channel 8 (8x Identical Circuitry) Common Out A/D - Input Figure 8. MC74HCT4851A Solution Solution by applying the HCT4851A multiplexer www.onsemi.com 6

MC74HCT4851A, MC74HCT4852A PLOTTER VCC PROGRAMMABLE POWER MINI COMPUTER DC ANALYZER 16 VCC SUPPLY VEE OFF - + VCC VCC A NC OFF COMMON O/I DEVICE UNDER TEST VIH 6 ANALOG IN COMMON OUT 8 GND Figure 10. Maximum Off Channel Leakage Current, Figure 9. On Resistance Test Set−Up Any One Channel, Test Set−Up VCC VEE ANALOG I/O 16 VCC VCC A 16 VCC OFF ON VCC OFF A VEE OFF COMMON O/I N/C COMMON O/I VCC ANALOG I/O VIH 6 VIL 6 8 8 Figure 11. Maximum Off Channel Leakage Current, Figure 12. Maximum On Channel Leakage Current, Common Channel, Test Set−Up Channel to Channel, Test Set−Up VCC VCC 16 VCC CHANNEL ON/OFF COMMON O/I SELECT VM ANALOG I/O TEST (VI) GND OFF/ON CL* POINT tPLH tPHL 6 ANALOG 50% OUT 8 VI = GND to 3.0 V CHANNEL SELECT VM = 1.3 V *Includes all probe and jig capacitance Figure 13. Propagation Delays, Channel Select Figure 14. Propagation Delay, Test Set−Up Channel to Analog Out Select to Analog Out www.onsemi.com 7

MC74HCT4851A, MC74HCT4852A VCC 16 ANALOG I/O COMMON O/I ANALOG VCC ON TEST POINT IN (VI) 50% CL* GND tPLH tPHL 6 ANALOG 8 50% OUT VI = GND to 3.0 V VM = 1.3 V *Includes all probe and jig capacitance Figure 15. Propagation Delays, Analog In Figure 16. Propagation Delay, Test Set−Up to Analog Out Analog In to Analog Out tf tr POSITION 1 WHEN TESTING tPHZ AND tPZH 90% VCC 1 POSITION 2 WHEN TESTING tPLZ AND tPZL ENAB(VLEI) V10M% GND VCC 2 1V6CC 10k(cid:3) tPZL tPLZ HIGH 1 ANALOG I/O IMPEDANCE TEST ON/OFF ANALOG 50% 2 POINT OUT 10% CL* VOL tPZH tPHZ ENABLE 90% VOH 6 ANALOG 50% OUT 8 HIGH VI = GND to 3.0 V IMPEDANCE VM = 1.3 V Figure 17. Propagation Delays, Enable to Figure 18. Propagation Delay, Test Set−Up Analog Out Enable to Analog Out VCC VCC A 16 COMMON O/I NC ANALOG I/O VCC 6 8 11 CHANNEL SELECT Figure 19. Power Dissipation Capacitance, Test Set−Up www.onsemi.com 8

MC74HCT4851A, MC74HCT4852A Gate = VCC Disabled Analog Mux Input (Disabled) Common Analog Output Vin > VCC + 0.7V Vout > VCC P+ P+ + + + N - Substrate (on VCC potential) Figure 20. Diagram of Bipolar Coupling Mechanism Appears if V exceeds V , driving injection current into the substrate in CC 11 A INJECTION 13 CURRENT X0 CONTROL INJECTION 14 10 CURRENT X1 B CONTROL INJECTION 15 CURRENT X2 CONTROL INJECTION 12 CURRENT X3 CONTROL 9 C INJECTION 1 CURRENT X4 CONTROL INJECTION 5 6 CURRENT X5 ENABLE CONTROL INJECTION 2 CURRENT X6 CONTROL INJECTION 4 CURRENT X7 CONTROL INJECTION 3 CURRENT X CONTROL Figure 21. Function Diagram, HCT4851A www.onsemi.com 9

MC74HCT4851A, MC74HCT4852A 10 A INJECTION 13 CURRENT X0 CONTROL INJECTION 14 9 CURRENT X1 B CONTROL INJECTION 1135 CURRENT X2 CONTROL INJECTION 12 CURRENT X3 CONTROL INJECTION 3 CURRENT X CONTROL INJECTION 1 CURRENT Y0 CONTROL INJECTION 5 CURRENT Y1 CONTROL 6 ENABLE INJECTION 2 CURRENT Y2 CONTROL INJECTION 4 CURRENT Y3 CONTROL INJECTION 3 CURRENT Y CONTROL Figure 22. Function Diagram, HCT4852A www.onsemi.com 10

MC74HCT4851A, MC74HCT4852A ORDERING INFORMATION Device Package Shipping† MC74HCT4851ADG SOIC−16 48 Units / Rail (Pb−Free) MC74HCT4851ADR2G SOIC−16 2500 Units / Tape & Reel (Pb−Free) NLV74HCT4851ADRG* SOIC−16 2500 Units / Tape & Reel (Pb−Free) MC74HCT4851ADTG TSSOP−16 48 Units / Rail (Pb−Free) M74HCT4851ADTR2G TSSOP−16 2500 Units / Tape & Reel (Pb−Free) NLVHCT4851ADTR2G* TSSOP−16 2500 Units / Tape & Reel (Pb−Free) M74HCT4851ADWR2G SOIC−16 WIDE 1000 Units / Tape & Reel (Pb−Free) MC74HCT4852ADG SOIC−16 48 Units / Rail (Pb−Free) MC74HCT4852ADR2G SOIC−16 2500 Units / Tape & Reel (Pb−Free) MC74HCT4852ADTG TSSOP−16 48 Units / Rail (Pb−Free) M74HCT4852ADTR2G TSSOP−16 2500 Units / Tape & Reel (Pb−Free) NLVHCT4852ADTR2G* TSSOP−16 2500 Units / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. www.onsemi.com 11

MC74HCT4851A, MC74HCT4852A PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE K −A− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 16 9 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) −B− P8 PL PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR 1 8 0.25 (0.010) M B S PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. G MILLIMETERS INCHES DIM MIN MAX MIN MAX A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 F K R X 45(cid:3) C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 C G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 −T− SEATING K 0.10 0.25 0.004 0.009 PLANE M J M 0 (cid:3) 7 (cid:3) 0 (cid:3) 7 (cid:3) D 16 PL P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 0.25 (0.010) M T B S A S SOLDERING FOOTPRINT 8X 6.40 16X1.12 1 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS www.onsemi.com 12

MC74HCT4851A, MC74HCT4852A PACKAGE DIMENSIONS SOIC−16 WB DW SUFFIX CASE 751G−03 ISSUE D D A (cid:2) NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 16 9 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. M 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. B 5. DIMENSION B DOES NOT INCLUDE DAMBAR H8X 5M E (cid:3)X 45 PPERRXCOOETTSRRSUU SSOIIFOO NNTH. SAEHL BAL LODLWI MBAEEB N0LS.E1I 3OD NTAO MATBTA AMLR AINXIMUM 0.2 h MATERIAL CONDITION. MILLIMETERS DIM MIN MAX 1 8 A 2.35 2.65 A1 0.10 0.25 16XB B B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 0.25 M T A S B S E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 A q 0 (cid:3) 7 (cid:3) L 14X C e A1 T SEATING PLANE SOLDERING FOOTPRINT* 16X0.58 11.00 1 16X 1.62 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 13

MC74HCT4851A, MC74HCT4852A PACKAGE DIMENSIONS TSSOP−16 CASE 948F ISSUE B 16X K REF 0.10 (0.004) M T U S V S NOTES: (cid:3)(cid:4)1. DIMENSIONING AND TOLERANCING PER ANSI 0.15 (0.006) T U S K Y14.5M, 1982. (cid:3)(cid:4)2. CONTROLLING DIMENSION: MILLIMETER. K1 (cid:3)(cid:4)3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR ÇÉÇÉÇÉ GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER 16 9 SIDE. 2XL/2 J1 ÇÉÇÉÇÉ (cid:3)(cid:4)4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER B SECTION N−N SIDE. L −U− J (cid:3)(cid:4)5.PRODTIMREUNSSIOIONN. AKL DLOOWESA BNLOET D INACMLBUADRE P DRAOMTBRAURSION PIN 1 SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K IDENT. N DIMENSION AT MAXIMUM MATERIAL CONDITION. (cid:3)(cid:4)6. TERMINAL NUMBERS ARE SHOWN FOR 1 8 0.25 (0.010) REFERENCE ONLY. (cid:3)(cid:4)7. DIMENSION A AND B ARE TO BE DETERMINED AT M DATUM PLANE -W-. 0.15 (0.006) T U S MILLIMETERS INCHES A DIM MIN MAX MIN MAX −V− N A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 F C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 DETAIL E F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008 −W− C J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 0.10 (0.004) K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC −T− SEATING H DETAIL E M 0 (cid:3) 8 (cid:3) 0 (cid:3) 8 (cid:3) PLANE D G SOLDERING FOOTPRINT 7.06 1 0.65 PITCH 16X 16X 0.36 1.26 DIMENSIONS: MILLIMETERS ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative www.onsemi.com MC74HCT4851A/D 14

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: M74HCT4851ADTR2G M74HCT4851ADWR2G MC74HCT4851ADG MC74HCT4851ADR2G MC74HCT4851ADTG M74HCT4852ADTR2G MC74HCT4852ADG MC74HCT4852ADR2G MC74HCT4852ADTG NLV74HCT4851ADRG NLVHCT4851ADTR2G NLVHCT4852ADTR2G