MC74AC02, MC74ACT02 Quad 2-Input NOR Gate High−Performance Silicon−Gate CMOS Features • Outputs Source/Sink 24 mA www.onsemi.com • ′ACT02 Has TTL Compatible Inputs • MARKING These are Pb−Free Devices DIAGRAMS 14 VCC SOIC−14 xxx02G 14 13 12 11 10 9 8 D SUFFIX AWLYWW 14 CASE 751A 1 1 14 xxx 1 2 3 4 5 6 7 TSSOP−14 02 GND DT SUFFIX ALYW(cid:2) Figure 1. Pinout: 14−Lead Packages Conductors 1 CASE 948G (cid:2) (Top View) 14 1 xxx = AC or ACT A = Assembly Location WL or L = Wafer Lot Y = Year WW or W= Work Week G or (cid:2) = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: January, 2015 − Rev. 8 MC74AC02/D

MC74AC02, MC74ACT02 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage (cid:2)0.5 to (cid:3)7.0 V VI DC Input Voltage (cid:2)0.5 (cid:4) VI (cid:4) VCC (cid:3)0.5 V VO DC Output Voltage (Note 1) (cid:2)0.5 (cid:4) VO (cid:4) VCC (cid:3)0.5 V IIK DC Input Diode Current (cid:5)20 mA IOK DC Output Diode Current (cid:5)50 mA IO DC Output Sink/Source Current (cid:5)50 mA ICC DC Supply Current per Output Pin (cid:5)50 mA IGND DC Ground Current per Output Pin (cid:5)50 mA TSTG Storage Temperature Range (cid:2)65 to (cid:3)150 °C TL Lead temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction temperature under Bias (cid:3)150 °C (cid:2) Thermal Resistance (Note 2) SOIC 125 °C/W JA TSSOP 170 PD Power Dissipation in Still Air at 85°C SOIC 125 mW TSSOP 170 MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 3) > 2000 V Machine Model (Note 4) > 200 Charged Device Model (Note 5) > 1000 ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 6) (cid:5)100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD51−7. 3. Tested to EIA/JESD22−A114−A. 4. Tested to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit ′AC 2.0 5.0 6.0 VCC Supply Voltage ′ACT 4.5 5.0 5.5 V Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) 0 − VCC V VCC @ 3.0 V − 150 − Input Rise and Fall Time (Note 1) tr, tf ′AC Devices except Schmitt Inputs VCC @ 4.5 V − 40 − ns/V VCC @ 5.5 V − 25 − Input Rise and Fall Time (Note 2) VCC @ 4.5 V − 10 − tr, tf ′ACT Devices except Schmitt Inputs VCC @ 5.5 V − 8.0 − ns/V TJ Junction Temperature (PDIP) − − 140 °C TA Operating Ambient Temperature Range −40 25 85 °C IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. www.onsemi.com 2

MC74AC02, MC74ACT02 DC CHARACTERISTICS 74AC 74AC Symbol Parameter V(VCC) TA = +25°C −4T0A°C = to Unit Conditions +85°C Typ Guaranteed Limits VIH Minimum High Level 3.0 1.5 2.1 2.1 VOUT = 0.1 V Input Voltage 4.5 2.25 3.15 3.15 V or VCC − 0.1 V 5.5 2.75 3.85 3.85 VIL Maximum Low Level 3.0 1.5 0.9 0.9 VOUT = 0.1 V Input Voltage 4.5 2.25 1.35 1.35 V or VCC − 0.1 V 5.5 2.75 1.65 1.65 VOH Minimum High Level 3.0 2.99 2.9 2.9 IOUT = −50 μA Output Voltage 4.5 4.49 4.4 4.4 V 5.5 5.49 5.4 5.4 *VIN = VIL or VIH 3.0 − 2.56 2.46 −12 mA V 4.5 − 3.86 3.76 IOH −24 mA 5.5 − 4.86 4.76 −24 mA VOL Maximum Low Level 3.0 0.002 0.1 0.1 IOUT = 50 μA Output Voltage 4.5 0.001 0.1 0.1 V 5.5 0.001 0.1 0.1 *VIN = VIL or VIH 3.0 − 0.36 0.44 12 mA V 4.5 − 0.36 0.44 IOL 24 mA 5.5 − 0.36 0.44 24 mA IIN MLeaaxkimaguem C Iunrpruetnt 5.5 − ±0.1 ±1.0 μA VI = VCC, GND IOLD †Minimum Dynamic 5.5 − − 75 mA VOLD = 1.65 V Max Output Current IOHD 5.5 − − −75 mA VOHD = 3.85 V Min ICC MSuapxpimlyu Cmu Qrreunietscent 5.5 − 4.0 40 μA VIN = VCC or GND Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS 74AC 74AC Symbol Parameter VCC* TA = +25°C TtAo = + −8450°C°C Unit Fig. (V) CL = 50 pF CL = 50 pF No. Min Typ Max Min Max 3.3 1.5 5.0 7.5 1.0 8.0 tPLH Propagation Delay 5.0 1.5 4.0 6.0 1.0 6.5 ns 3−5 3.3 1.5 5.0 7.5 1.0 8.0 tPHL Propagation Delay 5.0 1.5 4.5 6.5 1.0 7.0 ns 3−5 *Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V. www.onsemi.com 3

MC74AC02, MC74ACT02 DC CHARACTERISTICS 74ACT 74ACT Symbol Parameter V(VCC) TA = +25°C −4T0A°C = to Unit Conditions +85°C Typ Guaranteed Limits VIH Minimum High Level 4.5 1.5 2.0 2.0 VOUT = 0.1 V V Input Voltage 5.5 1.5 2.0 2.0 or VCC − 0.1 V VIL Maximum Low Level 4.5 1.5 0.8 0.8 VOUT = 0.1 V V Input Voltage 5.5 1.5 0.8 0.8 or VCC − 0.1 V VOH Minimum High Level 4.5 4.49 4.4 4.4 IOUT = −50 μA V Output Voltage 5.5 5.49 5.4 5.4 *VIN = VIL or VIH 4.5 − 3.86 3.76 V −24 mA 5.5 − 4.86 4.76 IOH −24 mA VOL Maximum Low Level 4.5 0.001 0.1 0.1 IOUT = 50 μA V Output Voltage 5.5 0.001 0.1 0.1 *VIN = VIL or VIH 4.5 − 0.36 0.44 V 24 mA 5.5 − 0.36 0.44 IOL 24 mA IIN MLeaaxkimaguem C Iunrpruetnt 5.5 − ±0.1 ±1.0 μA VI = VCC, GND ΔICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC −2.1 V IOLD †Minimum Dynamic 5.5 − − 75 mA VOLD = 1.65 V Max Output Current IOHD 5.5 − − −75 mA VOHD = 3.85 V Min ICC MSuapxpimlyu Cmu Qrreunietscent 5.5 − 4.0 40 μA VIN = VCC or GND Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS 74ACT 74ACT Symbol Parameter VCC* TA = +25°C TtAo = + −8450°C°C Unit Fig. (V) CL = 50 pF CL = 50 pF No. Min Typ Max Min Max tPLH Propagation Delay 5.0 1.5 − 8.5 1.0 9.0 ns 3−6 tPHL Propagation Delay 5.0 1.5 − 9.5 1.0 10 ns 3−6 *Voltage Range 5.0 V is 5.0 V ±0.5 V. CAPACITANCE Value Symbol Parameter Unit Test Conditions Typ CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 30 pF VCC = 5.0 V www.onsemi.com 4

MC74AC02, MC74ACT02 DEVICE ORDERING INFORMATION Device Package Shipping† MC74AC02DG SOIC−14 55 Units / Rail (Pb−Free) MC74AC02DR2G SOIC−14 2500 / Tape & Reel (Pb−Free) MC74ACT02DG SOIC−14 55 Units / Rail (Pb−Free) MC74ACT02DR2G SOIC−14 2500 / Tape & Reel (Pb−Free) MC74AC02DTR2G TSSOP−14 2500 / Tape & Reel (Pb−Free) MC74ACT02DTR2G TSSOP−14 2500 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5

MC74AC02, MC74ACT02 PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE K D A NOTES: B 1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2.CONTROLLING DIMENSION: MILLIMETERS. 14 8 3.DIMENSION b DOES NOT INCLUDE DAMBAR A3 PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. H E 4.DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. L 5.MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 1 7 DETAIL A MILLIMETERS INCHES 0.25 M B M 13Xb DIM MIN MAX MIN MAX A 1.35 1.75 0.054 0.068 0.25 M C A S B S A1 0.10 0.25 0.004 0.010 A3 0.19 0.25 0.008 0.010 DETAIL A b 0.35 0.49 0.014 0.019 h A D 8.55 8.75 0.337 0.344 X 45(cid:3) E 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.019 e A1 C SEATING M ML 0.04 0(cid:3) 1.72 5(cid:3) 0.001 6(cid:3) 0.074 9(cid:3) PLANE SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6

MC74AC02, MC74ACT02 PACKAGE DIMENSIONS TSSOP−14 CASE 948G ISSUE B 14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER 0.10 (0.004) M T U S V S ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 0.15 (0.006) T U S 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. N MOLD FLASH OR GATE BURRS SHALL NOT 0.25 (0.010) EXCEED 0.15 (0.006) PER SIDE. 2XL/2 14 8 4I.NTDEIMRLEENASDIO FNL ABS DHO OERS PNROOT TINRCULSUIODNE. M INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. L B 5. DIMENSION K DOES NOT INCLUDE DAMBAR −U− N PROTRUSION. ALLOWABLE DAMBAR PIN 1 PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN IDENT. F EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 1 7 DETAIL E 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. 0.15 (0.006) T U S A K MILLIMETERS INCHES −V− K1 DIM MIN MAX MIN MAX ÇÉÇÉÇÉ A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 J J1 ÇÉÇÉÇÉ C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 SECTION N−N G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 −W− J1 0.09 0.16 0.004 0.006 C K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 0.10 (0.004) L 6.40 BSC 0.252 BSC M 0 (cid:3) 8 (cid:3) 0 (cid:3) 8 (cid:3) −T− SEATING D G H DETAIL E PLANE SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 14X 0.36 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7

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Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: MC74AC02DG MC74AC02DR2G MC74AC02DTR2G MC74ACT02DG MC74ACT02DR2G MC74ACT02DTR2G