MBR1635, MBR1645, MBRB1645, NRVBB1645 Switch Mode Power Rectifiers 16 A, 35 and 45 V These state−of−the−art devices use the Schottky Barrier principle with a platinum barrier metal. http://onsemi.com Features • MARKING Guard−ring for Stress Protection • Low Forward Voltage 4 DIAGRAMS • 175°C Operating Junction Temperature • TO−220AC NRVB Prefix for Automotive and Other Applications Requiring CASE 221B Unique Site and Control Change Requirements; AEC−Q101 PLASTIC AYWWG Qualified and PPAP Capable B16x5 • KA These Devices are Pb−Free and are RoHS Compliant 1 Mechanical Characteristics: 3 1, 4 • 3 Case: Epoxy, Molded • Weight: 1.9 Grams for TO−220 A = Assembly Location 1.7 Grams for D2PAK Y = Year • WW = Work Week Finish: All External Surfaces Corrosion Resistant and Terminal B16x5 = Device Code Leads are Readily Solderable x = 3 or 4 • Lead Temperature for Soldering Purposes: KA = Diode Polarity 260°C Max. for 10 Seconds G = Pb−Free Package MAXIMUM RATINGS Rating Symbol Value Unit D2PAK B1645G 4 CASE 418B AYWW Peak Repetitive Reverse Voltage VRRM V STYLE 3 Working Peak Reverse Voltage VRWM 1 DC Blocking Voltage MBR1635 VR 35 3 1 MBR1645 45 4 MBRB1645 45 3 Average Rectified Forward Current Delay IF(AV) A B1645 = Device Code (Rated VR, TC = 163°C) Total Device 16 A = Assembly Location Peak Repetitive Forward Current, Per IFRM 32 A Y = Year Leg WW = Work Week (Rated VR, Square Wave, G = Pb−Free Package 20 kHz, TC = 157°C) Total Device ORDERING INFORMATION Non−Repetitive Peak Surge Current IFSM 150 A (Surge Applied at Rated Load Conditions Device Package Shipping Halfwave, Single Phase, 60 Hz) MBR1635G TO−220 50 Units / Rail Peak Repetitive Reverse Surge Current IRRM 1.0 A (Pb−Free) (2.0 (cid:2)s, 1.0 kHz) Storage Temperature Range Tstg −65 to +175 °C MBR1645G TO−220 50 Units / Rail (Pb−Free) Operating Junction Temperature (Note 1) TJ −65 to +175 °C MBRB1645T4G D2PAK 800 Units / Rail Voltage Rate of Change (Rated VR) dv/dt 10,000 V/(cid:2)s (Pb−Free) Stresses exceeding Maximum Ratings may damage the device. Maximum NRVBB1645T4G D2PAK 800 Units / Rail Ratings are stress ratings only. Functional operation above the Recommended (Pb−Free) Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R(cid:3)JA. © Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: April, 2014 − Rev. 12 MBR1635/D

MBR1635, MBR1645, MBRB1645, NRVBB1645 THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Maximum Thermal Resistance, Junction−to−Case R(cid:3)JC 1.5 °C/W ELECTRICAL CHARACTERISTICS Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 2) vF V (iF = 16 Amps, TC = 125°C) 0.57 (iF = 16 Amps, TC = 25°C) 0.63 Maximum Instantaneous Reverse Current (Note 2) iR mA (Rated dc Voltage, TC = 125°C) 40 (Rated dc Voltage, TC = 25°C) 0.2 2. Pulse Test: Pulse Width = 300 (cid:2)s, Duty Cycle ≤2.0%. http://onsemi.com 2

MBR1635, MBR1645, MBRB1645, NRVBB1645 A) T ( 100 N 1.0E−01 RE 70 TJ = 150°C R 50 D CU 30 TJ = 125°C T (A)1.0E−02 125°C AR 20 100°C EN1.0E−03 RW 25°C RR S FO 71.00 E CU1.0E−04 U S O 5.0 R1.0E−05 NTANE 23..00 , REVER1.0E−06 25°C A I T S N 1.0 1.0E−07 , IF 0 0.2 0.4 0.6 0.8 1.0 0 10 20 30 40 50 i vF, INSTANTANEOUS FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current 28 20 26 dc R(cid:3)JA = 16°C/W RD 2224 RD 1168 dc R(N(cid:3)oJA H =e a6t0 S°Cin/kW) A A W 20 SQUARE W 14 GE FORENT (A)111468 GE FORENT (A) 1102 RARR12 RARR 8 dc I, AVEF(AV)CU10468 I, AVEF(AV)CU 246 SQWUAARVEE 2 0 0 145 150 155 160 165 170 175 0 25 50 75 100 125 150 175 TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) Figure 3. Current Derating, Case, Per Leg Figure 4. Current Derating, Ambient W) PATION ( 1164 (RESISTIVELOAD) IIPAKV(cid:2)(cid:4) SQUARE WAVE SI 12 S I R DI 10 (CAPACITATIVE(cid:2)LOAD) IPK(cid:2)5.0 dc E AV W 8.0 O P 10 E 6.0 G A 20 R 4.0 VE TJ = 125°C A , E) 2.0 V A 0 PF( 0 2.0 4.0 6.0 8.0 10 12 14 16 18 20 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 5. Forward Power Dissipation http://onsemi.com 3

MBR1635, MBR1645, MBRB1645, NRVBB1645 PACKAGE DIMENSIONS D2PAK CASE 418B−04 ISSUE J −B− C NOTES: 1. DIMENSIONING AND TOLERANCING 4 E PER ANSI Y14.5M, 1982. V 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, W NEW STANDARD 418B−04. INCHES MILLIMETERS S DIM MIN MAX MIN MAX 1 2 3 A 0.340 0.380 8.64 9.65 A B 0.380 0.405 9.65 10.29 C 0.160 0.190 4.06 4.83 −T− D 0.020 0.035 0.51 0.89 SEATING E 0.045 0.055 1.14 1.40 PLANE G F 0.310 0.350 7.87 8.89 G 0.100 BSC 2.54 BSC K H 0.080 0.110 2.03 2.79 W D3 PL J KJ 00..001980 00..011205 20..2496 20..6749 0.13 (0.005) M T B M L 0.052 0.072 1.32 1.83 H M 0.280 0.320 7.11 8.13 N 0.197 REF 5.00 REF VARIABLE P 0.079 REF 2.00 REF CONFIGURATION R 0.039 REF 0.99 REF ZONE N P S 0.575 0.625 14.60 15.88 R V 0.045 0.055 1.14 1.40 U STYLE 3: L L L PIN 1.ANODE 2.CATHODE 3.ANODE M M M 4.CATHODE F F F VIEW W−W VIEW W−W VIEW W−W 1 2 3 SOLDERING FOOTPRINT* 8.38 0.33 10.66 1.016 5.08 0.42 0.04 0.20 3.05 0.12 17.02 0.67 (cid:3) (cid:4) mm SCALE 3:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 4

MBR1635, MBR1645, MBRB1645, NRVBB1645 PACKAGE DIMENSIONS TO−220 CASE 221B−04 ISSUE E NOTES: C 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. Q B F T S 2. CONTROLLING DIMENSION: INCH. INCHES MILLIMETERS DIM MIN MAX MIN MAX 4 A 0.595 0.620 15.11 15.75 B 0.380 0.405 9.65 10.29 A C 0.160 0.190 4.06 4.82 U D 0.025 0.035 0.64 0.89 1 3 F 0.142 0.161 3.61 4.09 H G 0.190 0.210 4.83 5.33 H 0.110 0.130 2.79 3.30 K J 0.014 0.025 0.36 0.64 K 0.500 0.562 12.70 14.27 L 0.045 0.060 1.14 1.52 Q 0.100 0.120 2.54 3.04 L R 0.080 0.110 2.04 2.79 D R S 0.045 0.055 1.14 1.39 T 0.235 0.255 5.97 6.48 J G U 0.000 0.050 0.000 1.27 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative http://onsemi.com MBR1635/D 5

Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: O N Semiconductor: MBRB1645T4G MBR1635G MBR1645G NRVBB1645T4G