MBRA320, NRVBA320 Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package Employing the Schottky Barrier principle in a large area metal−to−silicon power diode. State of the art geometry features www.onsemi.com epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or SCHOTTKY BARRIER as free wheeling and polarity diodes in surface mount applications RECTIFIER where compact size and weight are critical to the system. 3.0 AMPERES 20 VOLTS Features • Small Compact Surface Mountable Package with J−Bent Leads • Rectangular Package for Automated Handling 1 2 • Cathode Anode Highly Stable Oxide Passivated Junction • Very Low Forward Voltage Drop • 2 Guardring for Stress Protection • NRVBA Prefix for Automotive and Other Applications Requiring 1 Unique Site and Control Change Requirements; AEC−Q101 SMA Qualified and PPAP Capable* CASE 403D • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MARKING DIAGRAM Mechanical Characteristics: A32 • Case: Epoxy, Molded AYWW(cid:2) • Weight: 70 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal A32 = Device Code Leads are Readily Solderable A = Assembly Location • Y = Year Lead and Mounting Surface Temperature for Soldering Purposes: WW = Work Week 260°C Max. for 10 Seconds (cid:2) = Pb−Free Package • Shipped in 12 mm tape, 5000 units per 13 inch reel (Note: Microdot may be in either location) • Polarity: Cathode Lead Indicated by Polarity Band **The Assembly Location code (A) is front side • ESD Ratings: Machine Model = C optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), ESD Ratings: Human Body Model = 3B the front side assembly code may be blank. • Device Meets MSL 1 Requirements ORDERING INFORMATION Device Package Shipping† MBRA320T3G SMA 5000 / Tape & (Pb−Free) Reel NRVBA320T3G* SMA 5000 / Tape & (Pb−Free) Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: April, 2017 − Rev. 2 MBRA320/D

MBRA320, NRVBA320 MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage VRRM 20 V Working Peak Reverse Voltage VRWM DC Blocking Voltage VR Average Rectified Forward Current IO 3.0 A (At Rated VR, TL = 100°C) Non−Repetitive Peak Surge Current IFSM 80 A (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Storage Temperature Tstg −65 to +150 °C Operating Junction Temperature TJ −65 to +125 °C Voltage Rate of Change dv/dt 10,000 V/(cid:2)s (Rated VR, TJ = 25°C) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance − Junction−to−Lead (Note 1) RθJL 15 °C/W Thermal Resistance − Junction−to−Ambient (Note 1) RθJA 80 ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 2) (IF = 3.0 A, TJ = 25°C) VF 0.50 Volts Maximum Instantaneous Reverse Current (Note 2) IR TJ = 25°C TJ = 100°C mA (VR = 20 V) 2.0 20 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4. 2. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤2.0%. TYPICAL CHARACTERISTICS 10 10 S) S) P P M M A A T ( T ( N N E E R R CUR 1 TJ = 125°C CUR 1 D D WAR TJ = 100°C WAR TJ = 125°C TJ = 100°C FOR TJ = 25°C FOR TJ = 25°C , F , F I I 0.1 TJ = −65°C 0.1 TJ = −65°C 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage www.onsemi.com 2

MBRA320, NRVBA320 TYPICAL CHARACTERISTICS S) 1.E−01 P1.E−01 M PS) T (A M1.E−02 N1.E−02 T (A RRE TJ = 100°C N U E1.E−03 C1.E−03 CURR TJ = 100°C RSE TJ = 25°C E 1.E−04 VE1.E−04 S E R R VE M RE1.E−05 TJ = 25°C MU1.E−05 , R XI I A M 1.E−060 5 10 15 20, R1.E−060 5 10 15 20 I VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current S) 6 W) 6 P T (AM 5 dc R(cid:3)JL = 15°C/W TION ( 5 N A E P R SI SQUARE RD CUR 34 SQUARE WAVE WER DIS 34 WAVE A W O R P O 2 E 2 F G dc E A G R RA 1 AVE 1 AVE 0 , FO 0 , O 50 60 70 80 90 100 110 120 130 P 0 1 2 3 4 5 I TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (A) Figure 5. Current Derating Figure 6. Forward Power Dissipation 700 TJ = 25°C 600 F) p E ( 500 C N A 400 T CI A 300 P A C C, 200 100 0 0 4 8 12 16 20 24 28 32 36 40 VR, REVERSE VOLTAGE (V) Figure 7. Typical Capacitance www.onsemi.com 3

MBRA320, NRVBA320 TYPICAL CHARACTERISTICS W) C/1000 ° E ( D = 0.5 C N 100 0.2 A ST 0.1 SI E 10 R 0.05 AL 0.02 M R 1 0.01 E H T T N 0.1 E SI SINGLE PULSE N A 0.01 R T 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 R, (t) t, TIME (S) Figure 8. Thermal Response, Junction−to−Ambient (min pad) W) C/100 ° D = 0.5 E ( NC 0.2 A 10 T S SI 0.1 RE 0.05 AL 1 0.02 M R 0.01 E H T T 0.1 N E SI SINGLE PULSE N A0.01 R T 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 R, (t) t, TIME (S) Figure 9. Thermal Response, Junction to Ambient (1 inch pad) www.onsemi.com 4

MBRA320, NRVBA320 PACKAGE DIMENSIONS SMA CASE 403D ISSUE H HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, E 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L. MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX b D A 1.97 2.10 2.20 0.078 0.083 0.087 A1 0.05 0.10 0.20 0.002 0.004 0.008 b 1.27 1.45 1.63 0.050 0.057 0.064 c 0.15 0.28 0.41 0.006 0.011 0.016 D 2.29 2.60 2.92 0.090 0.103 0.115 POLARITY INDICATOR OPTIONAL AS NEEDED E 4.06 4.32 4.57 0.160 0.170 0.180 (SEE STYLES) HE 4.83 5.21 5.59 0.190 0.205 0.220 L 0.76 1.14 1.52 0.030 0.045 0.060 A A1 L c SOLDERING FOOTPRINT* 4.000 0.157 2.000 0.079 2.000 0.079 (cid:2) (cid:3) mm SCALE 8:1 inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative ◊ www.onsemi.com MBRA320/D 5

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