Product Order Technical Tools & Support & Folder Now Documents Software Community MAX3232 SLLS410N–JANUARY2000–REVISEDJUNE2017 MAX3232 3-V to 5.5-V Multichannel RS-232 Line Driver/Receiver With ±15-kV ESD Protection 1 Features 3 Description • RS-232Bus-TerminalESDProtectionExceeds The MAX3232 device consists of two line drivers, two 1 line receivers, and a dual charge-pump circuit with ±15kVUsingHuman-BodyModel(HBM) ±15-kV ESD protection terminal to terminal (serial- • MeetsorExceedstheRequirementsofTIA/EIA- port connection terminals, including GND). The 232-FandITUV.28Standards device meets the requirements of TIA/EIA-232-F and • OperatesWith3-Vto5.5-VV Supply provides the electrical interface between an CC asynchronous communication controller and the • Operatesupto250kbit/s serial-port connector. The charge pump and four • TwoDriversandTwoReceivers small external capacitors allow operation from a • LowSupplyCurrent:300 μATypical single 3-V to 5.5-V supply. The devices operate at • ExternalCapacitors:4 ×0.1 μF data signaling rates up to 250 kbit/s and a maximum of30-V/μsdriveroutputslewrate. • Accepts5-VLogicInputWith3.3-VSupply • AlternativeHigh-SpeedTerminal-Compatible DeviceInformation(1) Devices(1Mbit/s) PARTNUMBER PACKAGE(PIN) BODYSIZE – SN65C3232(–40°Cto85°C) SOIC(16) 9.90mm×3.91mm – SN75C3232(0°Cto70°C) SSOP(16) 6.20mm×5.30mm MAX3232 10.30mm×7.50 2 Applications SOIC(16) mm • Battery-PoweredSystems TSSOP(16) 5.00mm×4.40mm • PDAs (1) For all available packages, see the orderable addendum at theendofthedatasheet. • Notebooks • Laptops • PalmtopPCs • Hand-HeldEquipment SimplifiedSchematic 3.3V,5V POWER 2 2 DOUT DIN TX RS232 2 2 RIN ROUT RX RS232 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

MAX3232 SLLS410N–JANUARY2000–REVISEDJUNE2017 www.ti.com Table of Contents 1 Features.................................................................. 1 8.2 FunctionalBlockDiagram.........................................8 2 Applications........................................................... 1 8.3 FeatureDescription...................................................8 3 Description............................................................. 1 8.4 DeviceFunctionalModes..........................................9 4 RevisionHistory..................................................... 2 9 ApplicationandImplementation........................ 10 9.1 ApplicationInformation............................................10 5 PinConfigurationandFunctions......................... 3 9.2 StandardApplication...............................................10 6 Specifications......................................................... 4 10 PowerSupplyRecommendations..................... 11 6.1 AbsoluteMaximumRatings .....................................4 11 Layout................................................................... 12 6.2 ESDRatings..............................................................4 6.3 RecommendedOperatingConditions......................4 11.1 LayoutGuidelines.................................................12 6.4 ThermalInformation..................................................5 11.2 LayoutExample....................................................12 6.5 ElectricalCharacteristics—Device .........................5 12 DeviceandDocumentationSupport................. 13 6.6 ElectricalCharacteristics—Driver ..........................5 12.1 ReceivingNotificationofDocumentationUpdates13 6.7 ElectricalCharacteristics—Receiver.......................5 12.2 CommunityResources..........................................13 6.8 SwitchingCharacteristics..........................................6 12.3 Trademarks...........................................................13 6.9 TypicalCharacteristics..............................................6 12.4 ElectrostaticDischargeCaution............................13 7 ParameterMeasurementInformation..................7 12.5 Glossary................................................................13 8 DetailedDescription.............................................. 8 13 Mechanical,Packaging,andOrderable Information........................................................... 13 8.1 Overview...................................................................8 4 Revision History ChangesfromRevisionM(April2017)toRevisionN Page • ChangedtheThermalInformationtable................................................................................................................................. 5 ChangesfromRevisionL(March2017)toRevisionM Page • ChangedFrom:"±"To:"to"intheV columnofTable3.................................................................................................... 11 CC ChangesfromRevisionK(January2015)toRevisionL Page • Changedpin16(V )inFigure6........................................................................................................................................ 10 CC ChangesfromRevisionJ(January2014)toRevisionK Page • AddedApplications,DeviceInformationtable,PinFunctionstable,ESDRatingstable,ThermalInformationtable, TypicalCharacteristics,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 1 ChangesfromRevisionI(January2004)toRevisionJ Page • UpdateddocumenttonewTIdatasheetformat-nospecificationchanges......................................................................... 1 • DeletedOrderingInformationtable........................................................................................................................................ 1 2 SubmitDocumentationFeedback Copyright©2000–2017,TexasInstrumentsIncorporated ProductFolderLinks:MAX3232

MAX3232 www.ti.com SLLS410N–JANUARY2000–REVISEDJUNE2017 5 Pin Configuration and Functions D,DB,DW,orPWPackage 16-PinSOIC,SSOP,orTSSOP TopView C1+ 1 16 VCC V+ 2 15 GND C1– 3 14 DOUT1 C2+ 4 13 RIN1 C2– 5 12 ROUT1 V– 6 11 DIN1 DOUT2 7 10 DIN2 RIN2 8 9 ROUT2 Not to scale PinFunctions PIN TYPE DESCRIPTION NAME NO. C1+ 1 — PositiveleadofC1capacitor V+ 2 O Positivechargepumpoutputforstoragecapacitoronly C1– 3 — NegativeleadofC1capacitor C2+ 4 — PositiveleadofC2capacitor C2– 5 — NegativeleadofC2capacitor V– 6 O Negativechargepumpoutputforstoragecapacitoronly DOUT2 7 O RS232linedataoutput(toremoteRS232system) DOUT1 14 O RS232linedataoutput(toremoteRS232system) RIN2 8 I RS232linedatainput(fromremoteRS232system) RIN1 13 I RS232linedatainput(fromremoteRS232system) ROUT2 9 O Logicdataoutput(toUART) ROUT1 12 O Logicdataoutput(toUART) DIN2 10 I Logicdatainput(fromUART) DIN1 11 I Logicdatainput(fromUART) GND 15 — Ground V 16 — SupplyVoltage,Connecttoexternal3Vto5.5Vpowersupply CC Copyright©2000–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:MAX3232

MAX3232 SLLS410N–JANUARY2000–REVISEDJUNE2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT V Supplyvoltagerange(2) –0.3 6 V CC V+ Positiveoutputsupplyvoltagerange(2) –0.3 7 V V– Negativeoutputsupplyvoltagerange(2) –7 0.3 V V+–V– Supplyvoltagedifference(2) 13 V Drivers –0.3 6 V Inputvoltagerange V I Receivers –25 25 Drivers –13.2 13.2 V Outputvoltagerange V O Receivers –0.3 V +0.3 CC T Operatingvirtualjunctiontemperature 150 °C J T Storagetemperaturerange –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttonetworkGND. 6.2 ESD Ratings VALUE UNIT Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001 15000 RIN,DOUT,andGNDpins (1) Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001 3000 V(ESD) Electrostaticdischarge Allotherpins(1) V Chargeddevicemodel(CDM),perJEDECspecificationJESD22-C101, 1000 allpins(2) (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions (seeFigure6)(1) MIN NOM MAX UNIT V =3.3V 3 3.3 3.6 CC V Supplyvoltage V CC V =5V 4.5 5 5.5 CC V =3.3V 2 CC V Driverhigh-levelinputvoltage DIN V IH V =5V 2.4 CC V Driverlow-levelinputvoltage DIN 0.8 V IL Driverinputvoltage DIN 0 5.5 V V I Receiverinputvoltage RIN –25 25 MAX3232C 0 70 T Operatingfree-airtemperature °C A MAX3232I –40 85 (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC 4 SubmitDocumentationFeedback Copyright©2000–2017,TexasInstrumentsIncorporated ProductFolderLinks:MAX3232

MAX3232 www.ti.com SLLS410N–JANUARY2000–REVISEDJUNE2017 6.4 Thermal Information MAX3232 THERMALMETRIC(1) SOIC(D) SSOP(DB) SOIC(DW) TSSOP(PW) UNIT 16PINS R Junction-to-ambientthermalresistance 78.1 93.5 66.6 101.1 °C/W θJA R Junction-to-case(top)thermalresistance 38.5 45.8 32.4 32.9 °C/W θJC(top) R Junction-to-boardthermalresistance 36.3 44.6 31.9 47.5 °C/W θJB ψ Junction-to-topcharacterizationparameter 8.0 11.1 8.4 1.9 °C/W JT ψ Junction-to-boardcharacterizationparameter 36.0 44 31.5 46.9 °C/W JB R Junction-to-case(bottom)thermalresistance n/a n/a n/a n/a °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 6.5 Electrical Characteristics — Device overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(1)(seeFigure6) PARAMETER TESTCONDITIONS MIN TYP(2) MAX UNIT I Supplycurrent Noload, V =3.3Vto5V 0.3 1 mA CC CC (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A 6.6 Electrical Characteristics — Driver overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(1)(seeFigure6) PARAMETER TESTCONDITIONS MIN TYP(2) MAX UNIT V High-leveloutputvoltage D atR =3kΩtoGND, D =GND 5 5.4 V OH OUT L IN V Low-leveloutputvoltage D atR =3kΩtoGND, D =V –5 –5.4 V OL OUT L IN CC I High-levelinputcurrent V =V ±0.01 ±1 μA IH I CC I Low-levelinputcurrent V atGND ±0.01 ±1 μA IL I V =3.6V V =0V I (3) Short-circuitoutputcurrent CC O ±35 ±60 mA OS V =5.5V V =0V CC O r Outputresistance V ,V+,andV–=0V V =±2V 300 10M Ω O CC O (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5 CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A (3) Short-circuitdurationsshouldbecontrolledtopreventexceedingthedeviceabsolutepowerdissipationratings,andnotmorethanone outputshouldbeshortedatatime. 6.7 Electrical Characteristics — Receiver overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(1)(seeFigure6) PARAMETER TESTCONDITIONS MIN TYP(2) MAX UNIT V High-leveloutputvoltage I =–1mA V –0.6 V –0.1 V OH OH CC CC V Low-leveloutputvoltage I =1.6mA 0.4 V OL OL V =3.3V 1.5 2.4 CC V Positive-goinginputthresholdvoltage V IT+ V =5V 1.8 2.4 CC V =3.3V 0.6 1.2 CC V Negative-goinginputthresholdvoltage V IT– V =5V 0.8 1.5 CC V Inputhysteresis(V –V ) 0.3 V hys IT+ IT– r Inputresistance V =±3Vto±25V 3 5 7 kΩ I I (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A Copyright©2000–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:MAX3232

MAX3232 SLLS410N–JANUARY2000–REVISEDJUNE2017 www.ti.com 6.8 Switching Characteristics overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(1)(seeFigure6) PARAMETER TESTCONDITIONS MIN TYP(2) MAX UNIT R =3kΩ, C =1000pF L L Maximumdatarate 150 250 kbit/s OneD switching, SeeFigure3 OUT C =150to2500pF t DriverPulseskew(3) R =3kΩto7kΩ, L 300 ns sk(p) L SeeFigure4 SR(tr) Slewrate,transitionregion RL=3kΩto7kΩ, CL=150to1000pF 6 30 V/μs (seeFigure3) VCC=5V CL=150to2500pF 4 30 Propagationdelaytime,low-tohigh- t 300 PLH®) leveloutput C =150pF L Propagationdelaytime,high-tolow- ns t 300 PHL®) leveloutput t ReceiverPulseskew(1) 300 sk(p) (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A (3) Pulseskewisdefinedas|t −t |ofeachchannelofthesamedevice. PLH PHL 6.9 Typical Characteristics V =3.3V CC 6 1 VOH 5 0 –1 4 V) V) –2 V (OH3 V (OL–3 2 –4 1 –5 VOL 0 –6 0 5 10 15 20 25 0 5 10 15 20 25 Output Current (mA) Output Current (mA) C001 C001 Figure1.DOUTV vsLoadCurrent,BothDriversLoaded Figure2.DOUTV vsLoadCurrent,BothDriversLoaded OH OL 6 SubmitDocumentationFeedback Copyright©2000–2017,TexasInstrumentsIncorporated ProductFolderLinks:MAX3232

MAX3232 www.ti.com SLLS410N–JANUARY2000–REVISEDJUNE2017 7 Parameter Measurement Information 3 V Input 1.5 V 1.5 V RS-232 0 V Output Generator (see Note B) 50Ω CL tTHL tTLH RL (see NoteA) VOH 3 V 3 V Output −3 V −3 V VOL TESTCIRCUIT 6V VOLTAGEWAVEFORMS SR(tr) = t ort THL TLH A. C includesprobeandjigcapacitance. L B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, O r t ≤10ns. f Figure3. DriverSlewRate 3 V RS-232 Input 1.5 V 1.5 V Generator Output 0 V (see Note B) 50Ω CL tPHL tPLH RL (see NoteA) VOH Output 50% 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. C includesprobeandjigcapacitance. L B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, O r t ≤10ns. f Figure4. DriverPulseSkew 3 V Input 1.5 V 1.5 V Output −3 V Generator (see Note B) 50Ω CL tPHL tPLH (see NoteA) VOH Output 50% 50% VOL TESTCIRCUIT VOLTAGEWAVEFORMS A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,50%dutycycle,t ≤10ns,t ≤10ns. O r f Figure5. ReceiverPropagationDelayTimes Copyright©2000–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:MAX3232

MAX3232 SLLS410N–JANUARY2000–REVISEDJUNE2017 www.ti.com 8 Detailed Description 8.1 Overview The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection terminal to terminal (serial-port connection terminals, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controllerandtheserial-portconnector.Thechargepumpandfoursmallexternalcapacitorsallowoperationfrom a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30- V/μsdriveroutputslewrate.Outputsareprotectedagainstshortstoground. 8.2 Functional Block Diagram 3.3V,5V POWER 2 2 DOUT DIN TX RS232 2 2 RIN ROUT RX RS232 8.3 Feature Description 8.3.1 Power The power block increases, inverts, and regulates voltage at V+ and V- pins using a charge pump that requires fourexternalcapacitors. 8.3.2 RS232Driver TwodriversinterfacestandardlogicleveltoRS232levels.BothDINinputsmustbevalidhighorlow. 8.3.3 RS232Receiver TworeceiversinterfaceRS232levelstostandardlogiclevels.AnopeninputwillresultinahighoutputonROUT. EachRINinputincludesaninternalstandardRS232load. 8 SubmitDocumentationFeedback Copyright©2000–2017,TexasInstrumentsIncorporated ProductFolderLinks:MAX3232

MAX3232 www.ti.com SLLS410N–JANUARY2000–REVISEDJUNE2017 8.4 Device Functional Modes Table1. EachDriver(1) INPUT OUTPUT DIN DOUT L H H L (1) H=highlevel,L=lowlevel Table2.EachReceiver(1) INPUT OUTPUT RIN ROUT L H H L Open H (1) H=highlevel,L=lowlevel, Open=inputdisconnectedor connecteddriveroff 8.4.1 V poweredby3Vto5.5V CC Thedevicewillbeinnormaloperation. 8.4.2 V unpowered,V =0V CC CC WhenMAX3232isunpowered,itcanbesafelyconnectedtoanactiveremoteRS232device. Copyright©2000–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:MAX3232

MAX3232 SLLS410N–JANUARY2000–REVISEDJUNE2017 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information Forproperoperation,addcapacitorsasshowninFigure6. 9.2 Standard Application ROUT and DIN connect to UART or general purpose logic lines. RIN and DOUT lines connect to a RS232 connectororcable. 3.3 V / 5 V CBYPASS= 0.1μF 6 1 C 1 C C1+ V + 2 15 C1− †+ V+ GND C3 − 14 3 DOUT1 C1− 13 4 RIN1 C2+ + C2 5 kΩ − 5 C2− 12 ROUT1 6 − V− 11 C4 DIN1 + 7 10 DOUT2 DIN2 8 9 RIN2 ROUT2 5 kΩ †C3canbeconnectedtoV orGND. CC A. Resistorvaluesshownarenominal. B. Nonpolarizedceramiccapacitorsareacceptable.Ifpolarizedtantalumorelectrolyticcapacitorsareused,theyshould beconnectedasshown. Figure6. TypicalOperatingCircuitandCapacitorValues 10 SubmitDocumentationFeedback Copyright©2000–2017,TexasInstrumentsIncorporated ProductFolderLinks:MAX3232

MAX3232 www.ti.com SLLS410N–JANUARY2000–REVISEDJUNE2017 Standard Application (continued) 9.2.1 DesignRequirements • RecommendedV is3.3Vor5V.3Vto5.5Visalsopossible CC • Maximumrecommendedbitrateis250kbit/s. Table3.V vsCapacitorValues CC V C1 C2,C3,C4 CC 3.3Vto0.3V 0.1µF 0.1µF 5Vto0.5V 0.047µF 0.33µF 3Vto5.5V 0.1µF 0.47µF 9.2.2 DetailedDesignProcedure • AllDIN, FORCEOFF andFORCEONinputsmustbeconnectedtovalidloworhighlogiclevels. • SelectcapacitorvaluesbasedonVCClevelforbestperformance. 9.2.3 ApplicationCurves 6 5 4 3 2 1 V) 0 e (–1 ag–2 olt–3 V –4 –5 –6 –7 DIN –8 DOUT to RIN –9 ROUT 0 1 2 3 4 5 6 7 8 9 10 Time ((cid:29)s) C001 V =3.3V CC Figure7.250kbit/sDrivertoReceiverLoopbackTimingWaveform 10 Power Supply Recommendations V shouldbebetween3Vand5.5V.ChargepumpcapacitorsshouldbechosenusingtableinFigure6. CC Copyright©2000–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:MAX3232

MAX3232 SLLS410N–JANUARY2000–REVISEDJUNE2017 www.ti.com 11 Layout 11.1 Layout Guidelines Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise andfalltimes. 11.2 Layout Example Ground 1 C1+ VCC 16 VCC C3 0.1µF C1 2 V+ GND 15 Ground 3 C1– DOUT114 4 C2+ RIN1 13 C2 5 C2– ROUT112 Ground 6 V– DIN1 11 C4 7 DOUT2 DIN2 10 8 RIN2 ROUT2 9 Figure8. LayoutDiagram 12 SubmitDocumentationFeedback Copyright©2000–2017,TexasInstrumentsIncorporated ProductFolderLinks:MAX3232

MAX3232 www.ti.com SLLS410N–JANUARY2000–REVISEDJUNE2017 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.3 Trademarks E2EisatrademarkofTexasInstruments. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriateprecautions.Failuretoobserveproperhandlingandinstallationprocedurescancausedamage. ESDdamagecanrangefromsubtleperformancedegradationtocompletedevicefailure.Precisionintegratedcircuitsmaybemore susceptibletodamagebecauseverysmallparametricchangescouldcausethedevicenottomeetitspublishedspecifications. 12.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowserbasedversionsofthisdatasheet,refertothelefthandnavigation. Copyright©2000–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:MAX3232

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) MAX3232CD ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDB ACTIVE SSOP DB 16 80 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CDBE4 ACTIVE SSOP DB 16 80 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CDBG4 ACTIVE SSOP DB 16 80 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CDBR ACTIVE SSOP DB 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CDE4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDG4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDR ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDWG4 ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDWR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C & no Sb/Br) MAX3232CPW ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) MAX3232CPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232CPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C & no Sb/Br) MAX3232ID ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IDB ACTIVE SSOP DB 16 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I & no Sb/Br) MAX3232IDBE4 ACTIVE SSOP DB 16 80 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I & no Sb/Br) MAX3232IDBR ACTIVE SSOP DB 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I & no Sb/Br) MAX3232IDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I & no Sb/Br) MAX3232IDE4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IDG4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IDR ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IDRG4 ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) MAX3232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I & no Sb/Br) MAX3232IPW ACTIVE TSSOP PW 16 90 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I & no Sb/Br) MAX3232IPWR ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM -40 to 85 MB3232I & no Sb/Br) MAX3232IPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I & no Sb/Br) MAX3232IPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF MAX3232 : •Enhanced Product: MAX3232-EP NOTE: Qualified Version Definitions: •Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) MAX3232CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX3232CDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX3232CDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX3232CDWRG4 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX3232CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 MAX3232CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 MAX3232CPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 MAX3232IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX3232IDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX3232IDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX3232IDWRG4 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX3232IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 MAX3232IPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 MAX3232IPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 17-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) MAX3232CDR SOIC D 16 2500 333.2 345.9 28.6 MAX3232CDRG4 SOIC D 16 2500 333.2 345.9 28.6 MAX3232CDWR SOIC DW 16 2000 350.0 350.0 43.0 MAX3232CDWRG4 SOIC DW 16 2000 350.0 350.0 43.0 MAX3232CPWR TSSOP PW 16 2000 367.0 367.0 35.0 MAX3232CPWR TSSOP PW 16 2000 364.0 364.0 27.0 MAX3232CPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 MAX3232IDR SOIC D 16 2500 333.2 345.9 28.6 MAX3232IDRG4 SOIC D 16 2500 333.2 345.9 28.6 MAX3232IDWR SOIC DW 16 2000 350.0 350.0 43.0 MAX3232IDWRG4 SOIC DW 16 2000 350.0 350.0 43.0 MAX3232IPWR TSSOP PW 16 2000 364.0 364.0 27.0 MAX3232IPWR TSSOP PW 16 2000 367.0 367.0 35.0 MAX3232IPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE PW0016A TSSOP - 1.2 mm max height SCALE 2.500 SMALL OUTLINE PACKAGE SEATING PLANE C 6.6 TYP 6.2 A 0.1 C PIN 1 INDEX AREA 14X 0.65 16 1 2X 5.1 4.55 4.9 NOTE 3 8 9 0.30 B 4.5 16X 0.19 1.2 MAX 4.3 0.1 C A B NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.05 0.75 0.50 0 -8 DETA 20AIL A TYPICAL 4220204/A 02/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. www.ti.com

EXAMPLE BOARD LAYOUT PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL UNDER SOLDER MASK OPENING METAL SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000R MASK DETAILS 4220204/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0016A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 16X (1.5) SYMM (R0.05) TYP 1 16X (0.45) 16 SYMM 14X (0.65) 8 9 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4220204/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

GENERIC PACKAGE VIEW DW 16 SOIC - 2.65 mm max height 7.5 x 10.3, 1.27 mm pitch SMALL OUTLINE INTEGRATED CIRCUIT This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4224780/A www.ti.com

PACKAGE OUTLINE DW0016A SOIC - 2.65 mm max height SCALE 1.500 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 14X 1.27 16 1 10.5 2X 10.1 8.89 NOTE 3 8 9 0.51 16X 0.31 7.6 B 7.4 0.25 C A B 2.65 MAX NOTE 4 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0.3 0 - 8 0.1 1.27 0.40 DETAIL A (1.4) TYPICAL 4220721/A 07/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0016A SOIC - 2.65 mm max height SOIC 16X (2) SEE SYMM DETAILS 1 16 16X (0.6) SYMM 14X (1.27) 8 9 R0.05 TYP (9.3) LAND PATTERN EXAMPLE SCALE:7X METAL SOLDER MASK SOLDER MASK METAL OPENING OPENING 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220721/A 07/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0016A SOIC - 2.65 mm max height SOIC 16X (2) SYMM 1 16 16X (0.6) SYMM 14X (1.27) 8 9 R0.05 TYP (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:7X 4220721/A 07/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,65 0,15 M 0,22 28 15 0,25 0,09 5,60 8,20 5,00 7,40 Gage Plane 1 14 0,25 A 0°–(cid:1)8° 0,95 0,55 Seating Plane 2,00 MAX 0,05 MIN 0,10 PINS ** 14 16 20 24 28 30 38 DIM A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065/E 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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