MAX3222E www.ti.com.......................................................................................................................................... SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION CheckforSamples:MAX3222E FEATURES The device meets the requirements of TIA/EIA-232-F 1 and provides the electrical interface between an • ESDProtectionforRS-232BusPins asynchronous communication controller and the – ±15-kVHuman-BodyModel(HBM) serial-port connector. The charge pump and four – ±8-kVIEC61000-4-2,ContactDischarge small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at – ±15-kVIEC61000-4-2,Air-GapDischarge typical data signaling rates up to 500 kbit/s and a • MeetsorExceedstheRequirementsof maximumof30-V/μsdriveroutputslewrate. TIA/EIA-232-FandITUv.28Standards • OperatesWith3-Vto5.5-VV Supply DB, DW, OR PW PACKAGE CC (TOPVIEW) • Operatesupto500kbit/s • TwoDriversandTwoReceivers EN 1 20 PWRDOWN • LowStandbyCurrent...1μATyp C1+ 2 19 VCC • ExternalCapacitors...4×0.1μF V+ 3 18 GND • Accepts5-VLogicInputWith3.3-VSupply C1− 4 17 DOUT1 C2+ 5 16 RIN1 • AlternativeHigh-SpeedPin-CompatibleDevice C2− 6 15 ROUT1 (1Mbit/s)forSNx5C3222E V− 7 14 NC APPLICATIONS DOUT2 8 13 DIN1 RIN2 9 12 DIN2 • Battery-PoweredSystems ROUT2 10 11 NC • PDAs • Notebooks NC−No internal connection • Laptops • PalmtopPCs • Hand-HeldEquipment DESCRIPTION/ORDERING INFORMATION The MAX3222E consists of two line drivers, two line receivers,andadualcharge-pumpcircuitwith±15-kV ESD protection pin to pin (serial-port connection pins, includingGND). The MAX3222E can be placed in the power-down mode by setting the power-down (PWRDOWN) input low, which draws only 1 μA from the power supply. When the device is powered down, the receivers remain active while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to V , and V– is raised toward GND. Receiver outputs also can be placed in the CC high-impedancestatebysettingenable(EN)high. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2006–2009,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

MAX3222E SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009.......................................................................................................................................... www.ti.com ORDERINGINFORMATION T PACKAGE (1) (2) ORDERABLEPARTNUMBER TOP-SIDEMARKING A Tubeof25 MAX3222ECDW SOIC–DW MAX3222EC Reelof2000 MAX3222ECDWR Tubeof70 MAX3222ECDB 0°Cto70°C SSOP–DB MP222EC Reelof2000 MAX3222ECDBR Tubeof70 MAX3222ECPW TSSOP–PW MP222EC Reelof2000 MAX3222ECPWR Tubeof25 MAX3222EIDW SOIC–DW MAX3222EI Reelof2000 MAX3222EIDWR Tubeof70 MAX3222EIDB –40°Cto85°C SSOP–DB MP222EI Reelof2000 MAX3222EIDBR Tubeof70 MAX3222EIPW TSSOP–PW MP222EI Reelof2000 MAX3222EIPWR (1) Packagedrawings,thermaldata,andsymbolizationareavailableatwww.ti.com/packaging. (2) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. Table1.FUNCTIONTABLES XXX EACHDRIVER(1) INPUTS OUTPUT DIN PWRDOWN DOUT X L Z L H H H H L (1) H=highlevel,L=lowlevel,X=irrelevant,Z=highimpedance Table2.EACHRECEIVER(1) INPUTS OUTPUT RIN EN ROUT L L H H L L X H Z Open L H (1) H=highlevel,L=lowlevel,X=irrelevant, Z=highimpedance(off), Open=inputdisconnectedorconnecteddriveroff 2 SubmitDocumentationFeedback Copyright©2006–2009,TexasInstrumentsIncorporated ProductFolderLink(s):MAX3222E

MAX3222E www.ti.com.......................................................................................................................................... SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009 LOGICDIAGRAM(POSITIVELOGIC) 13 17 DIN1 DOUT1 12 8 DIN2 DOUT2 20 PWRDOWN Powerdown 1 EN 15 16 ROUT1 RIN1 5 k(cid:1) 10 9 ROUT2 RIN2 5 k(cid:1) PinnumbersarefortheDB,DW,andPWpackages. ABSOLUTE MAXIMUM RATINGS(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V Supplyvoltagerange(2) –0.3 6 V CC V+ Positive-outputsupplyvoltagerange(2) –0.3 7 V V– Negative-outputsupplyvoltagerange(2) 0.3 –7 V V+–V– Supplyvoltagedifference(2) 13 V Driver(EN,PWRDOWN) –0.3 6 V Inputvoltagerange V I Receiver –25 25 Driver –13.2 13.2 V Outputvoltagerange V O Receiver –0.3 V +0.3 CC DBpackage 70 θ Packagethermalimpedance(3) (4) DWpackage 58 °C/W JA PWpackage 83 T Operatingvirtualjunctiontemperature 150 °C J T Storagetemperaturerange –65 150 °C stg (1) Stressesbeyondthoselistedunder"absolutemaximumratings"maycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder"recommendedoperating conditions"isnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttonetworkGND. (3) MaximumpowerdissipationisafunctionofT(max),θ ,andT .Themaximumallowablepowerdissipationatanyallowableambient J JA A temperatureisP =(T(max)–T )/θ .OperatingattheabsolutemaximumT of150°Ccanaffectreliability. D J A JA J (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. Copyright©2006–2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):MAX3222E

MAX3222E SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009.......................................................................................................................................... www.ti.com RECOMMENDED OPERATING CONDITIONS(1) SeeFigure5 MIN NOM MAX UNIT V =3.3V 3 3.3 3.6 CC Supplyvoltage V V =5V 4.5 5 5.5 CC V =3.3V 2 CC V Driverandcontrolhigh-levelinputvoltage DIN,EN,PWRDOWN V IH V =5V 2.4 CC V Driverandcontrollow-levelinputvoltage DIN,EN,PWRDOWN 0.8 V IL V Driverandcontrolinputvoltage DIN,EN,PWRDOWN 0 5.5 V I V Receiverinputvoltage –25 25 V I MAX3222EC 0 70 T Operatingfree-airtemperature °C A MAX3222EI –40 85 (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC ELECTRICAL CHARACTERISTICS(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TESTCONDITIONS MIN TYP (2) MAX UNIT I Inputleakagecurrent(EN,PWRDOWN) ±0.01 ±1 μA I Supplycurrent Noload,PWRDOWNatV 0.3 1 mA CC I CC Supplycurrent(poweredoff) Noload,PWRDOWNatGND 1 10 μA (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A 4 SubmitDocumentationFeedback Copyright©2006–2009,TexasInstrumentsIncorporated ProductFolderLink(s):MAX3222E

MAX3222E www.ti.com.......................................................................................................................................... SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009 DRIVER SECTION abc Electrical Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) TYP PARAMETER TESTCONDITIONS MIN (2) MAX UNIT V High-leveloutputvoltage DOUTatR =3kΩtoGND, DIN=GND 5 5.4 V OH L V Low-leveloutputvoltage DOUTatR =3kΩtoGND, DIN=V –5 –5.4 V OL L CC I High-levelinputcurrent V =V ±0.01 ±1 μA IH I CC I Low-levelinputcurrent V atGND ±0.01 ±1 μA IL I V =3.6V I Short-circuitoutputcurrent(3) CC V =0V ±35 ±60 mA OS O V =5.5V CC r Outputresistance V ,V+,andV–=0V, V =±2V 300 10M Ω o CC O V =3Vto3.6V, CC ±25 V =±12V O I Outputleakagecurrent PWRDOWN=GND μA OZ V =4.5Vto5.5V, CC ±25 V =±10V O (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A (3) Short-circuitdurationsshouldbecontrolledtopreventexceedingthedeviceabsolutepowerdissipationratings,andnotmorethanone outputshouldbeshortedatatime. Switching Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TESTCONDITIONS MIN TYP (2) MAX UNIT C =1000pF, R =3kΩ, Maximumdatarate L L 250 500 kbit/s OneDOUTswitching, SeeFigure1 t Pulseskew(3) CL=150pFto2500pF, RL=3kΩto7kΩ, 300 ns sk(p) SeeFigure2 Slewrate, C =150pFto1000pF 6 30 R =3kΩto7kΩ, L SR(tr) transitionregion L V/μs (seeFigure1) VCC=3.3V CL=150pFto2500pF 4 30 (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A (3) Pulseskewisdefinedas|t –t |ofeachchannelofthesamedevice. PLH PHL ESD Protection TYP UNIT Human-BodyModel(HBM) ±15 Driveroutputs(DOUTx) IEC61000-4-2,Air-GapDischarge ±15 kV IEC61000-4-2,ContactDischarge ±8 Copyright©2006–2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):MAX3222E

MAX3222E SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009.......................................................................................................................................... www.ti.com RECEIVER SECTION abc Electrical Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure5) PARAMETER TESTCONDITIONS MIN TYP (2) MAX UNIT V High-leveloutputvoltage I =–1mA V –0.6 V –0.1 V OH OH CC CC V Low-leveloutputvoltage I =1.6mA 0.4 V OL OL V =3.3V 1.5 2.4 CC V Positive-goinginputthresholdvoltage V IT+ V =5V 1.8 2.4 CC V =3.3V 0.6 1.2 CC V Negative-goinginputthresholdvoltage V IT– V =5V 0.8 1.5 CC V Inputhysteresis(V –V ) 0.3 V hys IT+ IT– I Outputleakagecurrent EN=1 ±0.05 ±10 μA OZ r Inputresistance V =±3Vto±25V 3 5 7 kΩ i I (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A Switching Characteristics(1) overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS TYP (2) UNIT t Propagationdelaytime,low-tohigh-leveloutput C =150pF,SeeFigure3 300 ns PLH L t Propagationdelaytime,high-tolow-leveloutput C =150pF,SeeFigure3 300 ns PHL L t Outputenabletime C =150pF,R =3kΩ,SeeFigure4 200 ns en L L t Outputdisabletime C =150pF,R =3kΩ,SeeFigure4 200 ns dis L L t Pulseskew(3) SeeFigure3 300 ns sk(p) (1) TestconditionsareC1–C4=0.1μFatV =3.3V±0.3V;C1=0.047μF,C2–C4=0.33μFatV =5V±0.5V. CC CC (2) AlltypicalvaluesareatV =3.3VorV =5V,andT =25°C. CC CC A (3) Pulseskewisdefinedas|t –t |ofeachchannelofthesamedevice. PLH PHL ESD Protection TYP UNIT Human-BodyModel(HBM) ±15 Receiverinputs(RINx) IEC61000-4-2,Air-GapDischarge ±15 kV IEC61000-4-2,ContactDischarge ±8 6 SubmitDocumentationFeedback Copyright©2006–2009,TexasInstrumentsIncorporated ProductFolderLink(s):MAX3222E

MAX3222E www.ti.com.......................................................................................................................................... SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009 PARAMETER MEASUREMENT INFORMATION 3 V Input 1.5 V 1.5 V RS-232 0 V Generator Output (see Note B) 50 W CL RL (see Note A) tTHL tTLH PWR3D VOWN Output 3 V 3 V VOH −3 V −3 V VOL TEST CIRCUIT VOLTAGE WAVEFORMS SR(tr)(cid:1) 6V t ort THL TLH A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:PRR=250kbit/s,Z =50Ω,50%dutycycle,t ≤10ns, O r t ≤10ns. f Figure1. DriverSlewRate 3 V RS-232 Input 1.5 V 1.5 V Output 0 V Generator 50 W (see Note B) RL C(sLe e Note A) tPHL tPLH VOH 3 V Output 50% 50% PWRDOWN VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:PRR=250kbit/s,Z =50Ω,50%dutycycle,t ≤10ns, O r t ≤10ns. f Figure2. DriverPulseSkew EN 3 V 0 V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 W tPHL tPLH CL (see Note A) VOH Output 50% 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,50%dutycycle,t ≤10ns,t ≤10ns. O r f Figure3. ReceiverPropagationDelayTimes Copyright©2006–2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):MAX3222E

MAX3222E SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009.......................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC GND 3 V Input 1.5V 1.5V S1 0 V RL tPHZ tPZH 3 V or 0 V Output S1 at GND) (S1 at GND) VOH CL Output 50% EN (see Note A) 0.3 V tPLZ Generator 50 W (S1 at VCC) (see Note B) 0.3 V Output 50% VOL tPZL TEST CIRCUIT (S1 at VCC) VOLTAGE WAVEFORMS A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,50%dutycycle,t ≤10ns,t ≤10ns. O r f Figure4. ReceiverEnableandDisableTimes 8 SubmitDocumentationFeedback Copyright©2006–2009,TexasInstrumentsIncorporated ProductFolderLink(s):MAX3222E

MAX3222E www.ti.com.......................................................................................................................................... SLLS708A–JANUARY2006–REVISEDSEPTEMBER2009 APPLICATION INFORMATION 1 20 EN Powerdown PWRDOWN 2 19 C1+ VCC + CBYPASS − = 0.1 m F + 3 18 C1 + V+ GND − C3† − 4 17 C1− DOUT1 16 5 RIN1 C2+ 5 k(cid:1) + C2 − 6 15 C2− ROUT1 7 14 V− NC − C4 + 8 13 DOUT2 DIN1 9 RIN2 12 DIN2 5 k(cid:1) 10 11 ROUT2 NC †C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. NC − No internal connection C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, and C4 3.3 V (cid:1) 0.3 V 0.1 m F 0.1 m F 5 V (cid:1) 0.5 V 0.047 m F 0.33 m F 3 V to 5.5 V 0.1 m F 0.47 m F Figure5. TypicalOperatingCircuitandCapacitorValues Copyright©2006–2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):MAX3222E

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) MAX3222ECDB ACTIVE SSOP DB 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MP222EC & no Sb/Br) MAX3222ECDBR ACTIVE SSOP DB 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MP222EC & no Sb/Br) MAX3222ECDW ACTIVE SOIC DW 20 25 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3222EC & no Sb/Br) MAX3222ECDWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3222EC & no Sb/Br) MAX3222ECPW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MP222EC & no Sb/Br) MAX3222ECPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MP222EC & no Sb/Br) MAX3222ECPWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MP222EC & no Sb/Br) MAX3222EIDB ACTIVE SSOP DB 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MP222EI & no Sb/Br) MAX3222EIDBR ACTIVE SSOP DB 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MP222EI & no Sb/Br) MAX3222EIDW ACTIVE SOIC DW 20 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3222EI & no Sb/Br) MAX3222EIDWR ACTIVE SOIC DW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3222EI & no Sb/Br) MAX3222EIPW ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MP222EI & no Sb/Br) MAX3222EIPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MP222EI & no Sb/Br) MAX3222EIPWR ACTIVE TSSOP PW 20 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MP222EI & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) MAX3222ECDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 MAX3222ECDWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 MAX3222ECPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 MAX3222EIDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 MAX3222EIDWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 MAX3222EIPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 2-Oct-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) MAX3222ECDBR SSOP DB 20 2000 367.0 367.0 38.0 MAX3222ECDWR SOIC DW 20 2000 367.0 367.0 45.0 MAX3222ECPWR TSSOP PW 20 2000 367.0 367.0 38.0 MAX3222EIDBR SSOP DB 20 2000 367.0 367.0 38.0 MAX3222EIDWR SOIC DW 20 2000 367.0 367.0 45.0 MAX3222EIPWR TSSOP PW 20 2000 367.0 367.0 38.0 PackMaterials-Page2

PACKAGE OUTLINE DB0020A SSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 5.85 6.9 NOTE 3 10 11 0.38 20X 0.22 5.6 B 0.1 C A B 5.0 NOTE 4 2 MAX (0.15) TYP 0.25 SEE DETAIL A GAGE PLANE 0 -8 0.95 0.05 MIN 0.55 DETA 15AIL A TYPICAL 4214851/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com

EXAMPLE BOARD LAYOUT DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK METAL METAL UNDER SOLDER MASK OPENING SOLDER MASK OPENING EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON-SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDE15.000 R MASK DETAILS 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20X (0.45) 20 SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 18X 1.27 20 1 13.0 2X 12.6 11.43 NOTE 3 10 11 0.51 20X 7.6 0.31 2.65 MAX B 7.4 0.25 C A B NOTE 4 0.33 TYP 0.10 0.25 SEE DETAIL A GAGE PLANE 0.3 1.27 0 - 8 0.1 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 10 11 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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