Product Order Technical Tools & Support & Folder Now Documents Software Community MAX232,MAX232I SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 MAX232x Dual EIA-232 Drivers/Receivers 1 Features 3 Description • MeetsorExceedsTIA/EIA-232-FandITU The MAX232 device is a dual driver/receiver that 1 includes a capacitive voltage generator to supply RecommendationV.28 TIA/EIA-232-F voltage levels from a single 5-V • OperatesFromaSingle5-VPowerSupplyWith supply. Each receiver converts TIA/EIA-232-F inputs 1.0-µFCharge-PumpCapacitors to 5-V TTL/CMOS levels. These receivers have a • Operatesupto120kbit/s typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs. Each driver converts • TwoDriversandTwoReceivers TTL/CMOSinputlevelsintoTIA/EIA-232-Flevels. • ±30-VInputLevels • LowSupplyCurrent:8mATypical DeviceInformation(1) • ESDProtectionExceedsJESD22 ORDERNUMBER PACKAGE(PIN) BODYSIZE – 2000-VHuman-BodyModel(A114-A) SOIC(16) 9.90mm×3.91mm • UpgradeWithImprovedESD(15-kVHBM)and SOIC(16) 10.30mm×7.50mm MAX232x 0.1-µFCharge-PumpCapacitorsisAvailableWith PDIP(16) 19.30mm×6.35mm theMAX202Device SOP(16) 10.3mm×5.30mm (1) For all available packages, see the orderable addendum at 2 Applications theendofthedatasheet. • TIA/EIA-232-F • Battery-PoweredSystems • Terminals • Modems • Computers 4 Simplified Schematic 5V POWER 2 2 TOUT TIN TX RS232 2 2 RIN ROUT RX RS232 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

MAX232,MAX232I SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 www.ti.com Table of Contents 1 Features.................................................................. 1 9.1 Overview...................................................................9 2 Applications........................................................... 1 9.2 FunctionalBlockDiagram.........................................9 3 Description............................................................. 1 9.3 FeatureDescription...................................................9 9.4 DeviceFunctionalModes..........................................9 4 SimplifiedSchematic............................................. 1 10 ApplicationandImplementation........................ 10 5 RevisionHistory..................................................... 2 10.1 ApplicationInformation..........................................10 6 PinConfigurationandFunctions......................... 3 10.2 TypicalApplication................................................10 7 Specifications......................................................... 4 11 PowerSupplyRecommendations..................... 11 7.1 AbsoluteMaximumRatings .....................................4 12 Layout................................................................... 11 7.2 HandlingRatings.......................................................4 12.1 LayoutGuidelines.................................................11 7.3 RecommendedOperatingConditions......................4 12.2 LayoutExample....................................................11 7.4 ThermalInformation..................................................4 13 DeviceandDocumentationSupport................. 12 7.5 ElectricalCharacteristics––Device.........................4 7.6 ElectricalCharacteristics––Driver...........................5 13.1 RelatedLinks........................................................12 7.7 ElectricalCharacteristics––Receiver .....................5 13.2 Trademarks...........................................................12 7.8 SwitchingCharacteristics .........................................5 13.3 ElectrostaticDischargeCaution............................12 7.9 TypicalCharacteristics..............................................6 13.4 Glossary................................................................12 8 ParameterMeasurementInformation..................7 14 Mechanical,Packaging,andOrderable Information........................................................... 12 9 DetailedDescription.............................................. 9 5 Revision History ChangesfromRevisionL(March2004)toRevisionM Page • RemovedOrderingInformationtable..................................................................................................................................... 1 • AddedHandlingRatingtable,FeatureDescriptionsection,DeviceFunctionalModes,Applicationand Implementationsection,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentation Supportsection,andMechanical,Packaging,andOrderableInformationsection................................................................ 1 • MovedT toHandlingRatingstable..................................................................................................................................... 4 stg 2 SubmitDocumentationFeedback Copyright©1989–2014,TexasInstrumentsIncorporated ProductFolderLinks:MAX232

MAX232,MAX232I www.ti.com SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 6 Pin Configuration and Functions TopView MAX232...D,DW,N,ORNSPACKAGE MAX232I...D,DW,ORNPACKAGE (TOPVIEW) C1+ 1 16 VCC VS+ 2 15 GND C1− 3 14 T1OUT C2+ 4 13 R1IN C2− 5 12 R1OUT VS− 6 11 T1IN T2OUT 7 10 T2IN R2IN 8 9 R2OUT PinFunctions PIN TYPE DESCRIPTION NAME NO. C1+ 1 — PositiveleadofC1capacitor VS+ 2 O Positivechargepumpoutputforstoragecapacitoronly C1- 3 — NegativeleadofC1capacitor C2+ 4 — PositiveleadofC2capacitor C2- 5 — NegativeleadofC2capacitor VS- 6 O Negativechargepumpoutputforstoragecapacitoronly T2OUT,T1OUT 7,14 O RS232linedataoutput(toremoteRS232system) R2IN,R1IN 8,13 I RS232linedatainput(fromremoteRS232system) R2OUT,R1OUT 9,12 O Logicdataoutput(toUART) T2IN,T1IN 10,11 I Logicdatainput(fromUART) GND 15 — Ground V 16 — SupplyVoltage,Connecttoexternal5Vpowersupply CC Copyright©1989–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:MAX232

MAX232,MAX232I SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V InputSupplyvoltagerange(2) –0.3 6 V CC V Positiveoutputsupplyvoltagerange V –0.3 15 V S+ CC V Negativeoutputsupplyvoltagerange –0.3 –15 V S– T1IN,T2IN –0.3 V +0.3 CC V Inputvoltagerange V I R1IN,R2IN ±30 T1OUT,T2OUT V –0.3 V +0.3 S– S+ V Outputvoltagerange V O R1OUT,R2OUT –0.3 V +0.3 CC Short-circuitduration T1OUT,T2OUT Unlimited T Operatingvirtualjunctiontemperature 150 °C J (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommendedOperating Conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttonetworkGND. 7.2 Handling Ratings MIN MAX UNIT T Storagetemperaturerange -65 150 °C stg Humanbodymodel(HBM),perANSI/ESDA/JEDECJS-001,all 0 2000 pins(1) V Electrostaticdischarge V (ESD) Chargeddevicemodel(CDM),perJEDECspecification 0 1000 JESD22-C101,allpins(2) (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. 7.3 Recommended Operating Conditions MIN NOM MAX UNIT V Supplyvoltage 4.5 5 5.5 V CC V High-levelinputvoltage(T1IN,T2IN) 2 V IH V Low-levelinputvoltage(T1IN,T2IN) 0.8 V IL R1IN, Receiverinputvoltage ±30 V R2IN MAX232 0 70 T Operatingfree-airtemperature °C A MAX232I –40 85 7.4 Thermal Information MAX232xD MAX232xDW MAX232xN MAX232xNS THERMALMETRIC(1) SOIC SOICwide PDIP SOP UNIT 16PINS 16PINS 16PINS 16PINS RθJA Junction-to-ambientthermalresistance 73 57 67 64 °C/W (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport(SPRA953). 7.5 Electrical Characteristics –– Device overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted)(seeFigure6) PARAMETER TESTCONDITIONS(1) MIN TYP(2) MAX UNIT ICC Supplycurrent VCC=5.5V,alloutputsopen,TA=25°C 8 10 mA (1) TestconditionsareC1–C4=1μFatV =5V±0.5V CC (2) AlltypicalvaluesareatV =5V,andT =25°C. CC A 4 SubmitDocumentationFeedback Copyright©1989–2014,TexasInstrumentsIncorporated ProductFolderLinks:MAX232

MAX232,MAX232I www.ti.com SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 7.6 Electrical Characteristics –– Driver overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS(1) MIN TYP(2) MAX UNIT V High-leveloutputvoltage T1OUT,T2OUT R =3kΩtoGND 5 7 V OH L V Low-leveloutputvoltage(3) T1OUT,T2OUT R =3kΩtoGND –7 –5 V OL L r Outputresistance T1OUT,T2OUT V =V =0,V =±2V 300 Ω O S+ S– O I (4) Short-circuitoutputcurrent T1OUT,T2OUT V =5.5V,V =0V ±10 mA OS CC O I Short-circuitinputcurrent T1IN,T2IN V =0 200 µA IS I (1) TestconditionsareC1–C4=1μFatV =5V±0.5V CC (2) AlltypicalvaluesareatV =5V,T =25°C. CC A (3) Thealgebraicconvention,inwhichtheleast-positive(mostnegative)valueisdesignatedminimum,isusedinthisdatasheetforlogic voltagelevelsonly. (4) Notmorethanoneoutputshouldbeshortedatatime. 7.7 Electrical Characteristics –– Receiver overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS(1) MIN TYP(2) MAX UNIT V High-leveloutputvoltage R1OUT,R2OUT I =–1mA 3.5 V OH OH V Low-leveloutputvoltage(3) R1OUT,R2OUT I =3.2mA 0.4 V OL OL Receiverpositive-goinginputthreshold V R1IN,R2IN V =5V,T =25°C 1.7 2.4 V IT+ voltage CC A Receivernegative-goinginputthreshold V R1IN,R2IN V =5V,T =25°C 0.8 1.2 V IT– voltage CC A V Inputhysteresisvoltage R1IN,R2IN V =5V 0.2 0.5 1 V hys CC r Receiverinputresistance R1IN,R2IN V =5V,T =25°C 3 5 7 kΩ I CC A (1) TestconditionsareC1–C4=1μFatV =5V±0.5V. CC (2) AlltypicalvaluesareatV =5V,T =25°C. CC A (3) Thealgebraicconvention,inwhichtheleast-positive(mostnegative)valueisdesignatedminimum,isusedinthisdatasheetforlogic voltagelevelsonly. 7.8 Switching Characteristics overrecommendedrangesofsupplyvoltageandoperatingfree-airtemperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS(1) MIN TYP(1) MAX UNIT SR Driverslewrate RL=3kΩto7kΩ,seeFigure4 30 V/μs SR(t) Drivertransitionregionslewrate seeFigure5 3 V/μs Datarate OneTOUTswitching 120 kbit/s Receiverpropagationdelaytime, t TTLload,seeFigure3 500 ns PLH®) low-tohigh-leveloutput Receiverpropagationdelaytime, t TTLload,seeFigure3 500 ns PHL®) high-tolow-leveloutput (1) TestconditionsareC1–C4=1μFatV =5V±0.5V. CC Copyright©1989–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:MAX232

MAX232,MAX232I SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 www.ti.com 7.9 Typical Characteristics 10 12 9 11 TIN 8 10 TOUT (to RIN) 7 9 ROUT 6 8 45 7 3 6 V) 12 V) 45 ge ( –10 ge ( 23 olta ––32 olta 01 V ––––––987654 VOL V –––––54321 –10 –6 –11 VOH –7 –12 –8 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 8 9 101112131415161718 Load resistance (k(cid:13)) Time ((cid:29)s) C001 C001 Figure1.TOUTVOH&VOLvsLoadResistance,Both Figure2.DrivertoReceiverLoopbackTimingWaveform DriversLoaded 6 SubmitDocumentationFeedback Copyright©1989–2014,TexasInstrumentsIncorporated ProductFolderLinks:MAX232

MAX232,MAX232I www.ti.com SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 8 Parameter Measurement Information VCC R1OUT RL= 1.3 kΩ R1IN or or Pulse R2OUT See Note C R2IN Generator (see NoteA) CL= 50 pF (see Note B) TEST CIRCUIT ≤10ns ≤10 ns 3 V 90% 90% Input 10% 50% 50% 10% 0 V 500 ns tPLH tPHL VOH Output 1.5 V 1.5 V VOL WAVEFORMS A. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,dutycycle≤50%. O B. C includesprobeandjigcapacitance. L C. Alldiodesare1N3064orequivalent. Figure3. ReceiverTestCircuitandWaveformsfort andt Measurements PHL PLH Copyright©1989–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:MAX232

MAX232,MAX232I SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 www.ti.com Parameter Measurement Information (continued) T1IN or T2IN T1OUT or T2OUT Pulse Generator EIA-232 Output (see NoteA) RL CL= 10 pF (see Note B) TEST CIRCUIT ≤10 ns ≤10 ns 3 V 90% 90% Input 50% 50% 10% 10% 0 V 5µs tPLH tPHL 90% VOH 90% Output 10% 10% VOL tTHL tTLH 0.8(V –V ) 0.8(V –V ) OH OL OL OH SR = or t t TLH THL WAVEFORMS A. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,dutycycle≤50%. O B. C includesprobeandjigcapacitance. L Figure4. DriverTestCircuitandWaveformsfort andt Measurements(5-μsInput) PHL PLH Pulse Generator EIA-232Output (see NoteA) 3 kΩ CL= 2.5 nF TEST CIRCUIT ≤10 ns ≤10 ns Input 90% 90% 10% 1.5 V 1.5 V 10% 20µs tTHL tTLH 3 V 3 V VOH Output −3 V −3 V VOL 6V SR = t ort THL TLH WAVEFORMS A. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,dutycycle≤50%. O Figure5. TestCircuitandWaveformsfort andt Measurements(20-μsInput) THL TLH 8 SubmitDocumentationFeedback Copyright©1989–2014,TexasInstrumentsIncorporated ProductFolderLinks:MAX232

MAX232,MAX232I www.ti.com SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 9 Detailed Description 9.1 Overview The MAX232 device is a dual driver/receiver that includes a capacitive voltage generator using four capacitors to supply TIA/EIA-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5- V TTL/CMOS levels. These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept±30-Vinputs.EachdriverconvertsTTL/CMOSinputlevelsintoTIA/EIA-232-Flevels.Thedriver,receiver, and voltage-generator functions are available as cells in the Texas Instruments LinASIC™ library. Outputs are protectedagainstshortstoground. 9.2 Functional Block Diagram 5V POWER 2 2 TOUT TIN TX RS232 2 2 RIN ROUT RX RS232 9.3 Feature Description 9.3.1 Power The power block increases and inverts the 5V supply for the RS232 driver using a charge pump that requires four1-µFexternalcapacitors. 9.3.2 RS232Driver Two drivers interface standard logic level to RS232 levels. Internal pull up resistors on TIN inputs ensures a high inputwhenthelineishighimpedance. 9.3.3 RS232Receiver TworeceiversinterfaceRS232levelstostandardlogiclevels.AnopeninputwillresultinahighoutputonROUT. 9.4 Device Functional Modes 9.4.1 V poweredby5V CC Thedevicewillbeinnormaloperation. 9.4.2 V unpowered CC WhenMAX232isunpowered,itcanbesafelyconnectedtoanactiveremoteRS232device. Table1.FunctionTableEachDriver(1) INPUT OUTPUT TIN TOUT L H H L (1) H=highlevel,L=lowlevel,X=irrelevant,Z=highimpedance Copyright©1989–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:MAX232

MAX232,MAX232I SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 www.ti.com Table2.FunctionTableEachReceiver(1) INPUTS OUTPUT RIN ROUT L H H L Open H (1) H=highlevel,L=lowlevel,X=irrelevant,Z=highimpedance(off), Open=disconnectedinputorconnecteddriveroff 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 10.1 Application Information For proper operation add capacitors as shown in Figure 6. Pins 9 through 12 connect to UART or general purposelogiclines.EIA-232lineswillconnecttoaconnectororcable. 10.2 Typical Application 5 V + CBYPASS= 1µF− 16 C3† 1µF VCC 1 2 C1 1µF 3 C1+ VS+ 8.5 V C1− 4 C2+ VS− 6 −8.5 V C2 1µF 5 C4 1µF C2− + 11 14 EIA-232 Output From CMOS or TTL 10 7 EIA-232 Output 12 13 EIA-232 Input To CMOS or TTL 9 8 EIA-232 Input 0 V 15 GND †C3 can be connected to VCCor GND. NOTES: A. Resistorvaluesshownarenominal. B. Nonpolarizedceramiccapacitorsareacceptable.Ifpolarizedtantalumorelectrolyticcapacitorsareused,theyshouldbe connectedasshown.Inadditiontothe1-µF capacitors shown, the MAX202 can operate with 0.1-µF capacitors. Figure6. TypicalOperatingCircuit 10.2.1 DesignRequirements • V minimumis4.5Vandmaximumis5.5V. CC • Maximumrecommendedbitrateis120kbps. 10.2.2 DetailedDesignProcedure Use1uFtantalumorceramiccapacitors. 10 SubmitDocumentationFeedback Copyright©1989–2014,TexasInstrumentsIncorporated ProductFolderLinks:MAX232

MAX232,MAX232I www.ti.com SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 Typical Application (continued) 10.2.3 ApplicationCurves 10 12 9 11 TIN 8 10 TOUT (to RIN) 7 9 ROUT 6 8 45 7 3 6 V) 12 V) 45 ge ( –10 ge ( 23 olta ––32 olta 01 V ––––––987654 VOL V –––––54321 –10 –6 –11 VOH –7 –12 –8 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 8 9 101112131415161718 Load resistance (k(cid:13)) Time ((cid:29)s) C001 C001 Figure7.TOUTVOH&VOLvsLoadResistance,Both Figure8.DrivertoReceiverLoopbackTimingWaveform DriversLoaded 11 Power Supply Recommendations The V voltage should be connected to the same power source used for logic device connected to TIN pins. CC V shouldbebetween4.5Vand5.5V. CC 12 Layout 12.1 Layout Guidelines Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise andfalltimes. 12.2 Layout Example Ground 1 C1+ V 16 VCC CC 1 µF 1 µF 1 µF 2 VS+ GND 15 Ground 3 C1- T1OUT 14 4 C2+ R1IN13 1 µF 5 C2- R1OUT 12 Ground 6 VS- T1IN11 1 µF 7 T2OUT T2IN10 8 R2IN R2OUT 9 Figure9. LayoutSchematic Copyright©1989–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:MAX232

MAX232,MAX232I SLLS047M–FEBRUARY1989–REVISEDNOVEMBER2014 www.ti.com 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources,toolsandsoftware,andquickaccesstosampleorbuy. Table3.RelatedLinks TECHNICAL TOOLS& SUPPORT& PARTS PRODUCTFOLDER SAMPLE&BUY DOCUMENTS SOFTWARE COMMUNITY MAX232 Clickhere Clickhere Clickhere Clickhere Clickhere MAX232I Clickhere Clickhere Clickhere Clickhere Clickhere 13.2 Trademarks Alltrademarksarethepropertyoftheirrespectiveowners. 13.3 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 13.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronymsanddefinitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowserbasedversionsofthisdatasheet,refertothelefthandnavigation. 12 SubmitDocumentationFeedback Copyright©1989–2014,TexasInstrumentsIncorporated ProductFolderLinks:MAX232

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) MAX232D ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DE4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DG4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DR ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU | SN Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DRE4 ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DRG4 ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DWE4 ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DWG4 ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DWR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) MAX232ID ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I & no Sb/Br) MAX232IDG4 ACTIVE SOIC D 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I & no Sb/Br) MAX232IDR ACTIVE SOIC D 16 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I & no Sb/Br) MAX232IDW ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I & no Sb/Br) MAX232IDWG4 ACTIVE SOIC DW 16 40 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) MAX232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I & no Sb/Br) MAX232IDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I & no Sb/Br) MAX232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I & no Sb/Br) MAX232IN ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 MAX232IN & no Sb/Br) MAX232INE4 ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type -40 to 85 MAX232IN & no Sb/Br) MAX232N ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 MAX232N & no Sb/Br) MAX232NE4 ACTIVE PDIP N 16 25 Green (RoHS NIPDAU N / A for Pkg Type 0 to 70 MAX232N & no Sb/Br) MAX232NSR ACTIVE SO NS 16 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3

PACKAGE MATERIALS INFORMATION www.ti.com 28-Dec-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) MAX232DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232DRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232DWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX232DWRG4 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX232IDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 MAX232IDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 MAX232IDWRG4 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 28-Dec-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) MAX232DR SOIC D 16 2500 367.0 367.0 38.0 MAX232DR SOIC D 16 2500 333.2 345.9 28.6 MAX232DRG4 SOIC D 16 2500 367.0 367.0 38.0 MAX232DRG4 SOIC D 16 2500 333.2 345.9 28.6 MAX232DWR SOIC DW 16 2000 350.0 350.0 43.0 MAX232DWRG4 SOIC DW 16 2000 350.0 350.0 43.0 MAX232IDR SOIC D 16 2500 333.2 345.9 28.6 MAX232IDWR SOIC DW 16 2000 350.0 350.0 43.0 MAX232IDWRG4 SOIC DW 16 2000 350.0 350.0 43.0 PackMaterials-Page2

GENERIC PACKAGE VIEW DW 16 SOIC - 2.65 mm max height 7.5 x 10.3, 1.27 mm pitch SMALL OUTLINE INTEGRATED CIRCUIT This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4224780/A www.ti.com

PACKAGE OUTLINE DW0016A SOIC - 2.65 mm max height SCALE 1.500 SOIC C 10.63 SEATING PLANE TYP 9.97 A PIN 1 ID 0.1 C AREA 14X 1.27 16 1 10.5 2X 10.1 8.89 NOTE 3 8 9 0.51 16X 0.31 7.6 B 7.4 0.25 C A B 2.65 MAX NOTE 4 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0.3 0 - 8 0.1 1.27 0.40 DETAIL A (1.4) TYPICAL 4220721/A 07/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm, per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side. 5. Reference JEDEC registration MS-013. www.ti.com

EXAMPLE BOARD LAYOUT DW0016A SOIC - 2.65 mm max height SOIC 16X (2) SEE SYMM DETAILS 1 16 16X (0.6) SYMM 14X (1.27) 8 9 R0.05 TYP (9.3) LAND PATTERN EXAMPLE SCALE:7X METAL SOLDER MASK SOLDER MASK METAL OPENING OPENING 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4220721/A 07/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DW0016A SOIC - 2.65 mm max height SOIC 16X (2) SYMM 1 16 16X (0.6) SYMM 14X (1.27) 8 9 R0.05 TYP (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:7X 4220721/A 07/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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