MAX208 www.ti.com................................................................................................................................................ SLLS596C–OCTOBER2003–REVISEDAUGUST2009 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION FEATURES 1 DB OR DW PACKAGE • ESDProtectionforRS-232I/OPins (TOPVIEW) – ±15-kVHuman-BodyModel(HBM) DOUT2 1 24 DOUT3 • MeetsorExceedstheRequirementsof DOUT1 2 23 RIN3 TIA/EIA-232-FandITUv.28Standards RIN2 3 22 ROUT3 • Operatesat5-VVCCSupply ROUT2 4 21 DIN4 • FourDriversandFourReceivers DIN1 5 20 DOUT4 • Operatesupto120kbit/s ROUT1 6 19 DIN3 • ExternalCapacitors:4×0.1m F RIN1 7 18 DIN2 GND 8 17 ROUT4 • Latch-UpPerformanceExceeds100mAPer V 9 16 RIN4 JESD78,ClassII CC C1+ 10 15 V– V+ 11 14 C2– APPLICATIONS C1– 12 13 C2+ • Battery-PoweredSystems • PDAs • Notebooks • Laptops • PalmtopPCs • Hand-HeldEquipment DESCRIPTION The MAX208 device consists of four line drivers, four line receivers, and a dual charge-pump circuit with ±15-kV HBM ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/m s driver output slewrate. ORDERINGINFORMATION(1) T PACKAGE(2) ORDERABLEPARTNUMBER TOP-SIDEMARKING A Tubeof25 MAX208CDW SOIC–DW MAX208C Reelof2000 MAX208CDWR 0°Cto70°C Tubeof60 MAX208CDB SSOP–DB MA208C Reelof2000 MAX208CDBR Tubeof25 MAX208IDW SOIC–DW MAX208I Reelof2000 MAX208IDWR –40°Cto85°C Tubeof60 MAX208IDB SSOP–DB MB208I Reelof2000 MAX208IDBR (1) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. (2) Packagedrawings,thermaldata,andsymbolizationareavailableatwww.ti.com/packaging. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2003–2009,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

MAX208 SLLS596C–OCTOBER2003–REVISEDAUGUST2009................................................................................................................................................ www.ti.com FUNCTIONTABLE EACHDRIVER(1) INPUT OUTPUT DIN DOUT L H H L (1) H=highlevel,L=lowlevel FUNCTIONTABLE EACHRECEIVER(1) INPUT OUTPUT RIN ROUT L H H L Open H (1) H=highlevel,L=lowlevel, Open=inputdisconnectedor connecteddriveroff logicdiagram(positivelogic) 5 2 DIN1 DOUT1 18 1 DIN2 DOUT2 TTL/CMOS RS-232 Inputs Outputs 19 24 DIN3 DOUT3 21 20 DIN4 DOUT4 6 7 ROUT1 RIN1 4 3 ROUT2 RIN2 TTL/CMOS RS-232 Outputs 22 23 Inputs ROUT3 RIN3 17 16 ROUT4 RIN4 2 SubmitDocumentationFeedback Copyright©2003–2009,TexasInstrumentsIncorporated ProductFolderLink(s):MAX208

MAX208 www.ti.com................................................................................................................................................ SLLS596C–OCTOBER2003–REVISEDAUGUST2009 ABSOLUTE MAXIMUM RATINGS(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) V Supplyvoltagerange(2) –0.3Vto6V CC V+ Positivechargepumpvoltagerange(2) V –0.3Vto14V CC V– Negativechargepumpvoltagerange(2) –14Vto0.3V V+–V– Supplyvoltagedifference(2) 13V Drivers –0.3VtoV++0.3V Inputvoltagerange VI Receivers ±30V Drivers V––0.3VtoV++0.3V V Outputvoltagerange O Receivers –0.3VtoV +0.3V CC Short-circuitdurationonDOUT Continuous DBpackage 63°C/W q Packagethermalimpedance(3)(4) JA DWpackage 46°C/W T Operatingvirtual-junctiontemperature 150°C J T Storagetemperaturerange –65°Cto150°C stg (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttonetworkGND. (3) MaximumpowerdissipationisafunctionofT(max),q ,andT .Themaximumallowablepowerdissipationatanyallowableambient J JA A temperatureisP =(T(max)–T )/q .OperatingattheabsolutemaximumT of150°Ccanimpactreliability. D J A JA J (4) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. RECOMMENDED OPERATING CONDITIONS C1toC4=0.1m FatV =5V±0.5V(seeFigure4) CC MIN NOM MAX UNIT V Supplyvoltage 4.5 5 5.5 V CC V Driverhigh-levelinputvoltage DIN 2 V IH V Driverlow-levelinputvoltage DIN 0.8 V IL Driverinputvoltage DIN 0 5.5 V V I Receiverinputvoltage –30 30 MAX208C 0 70 T Operatingfree-airtemperature °C A MAX208I –40 85 ELECTRICAL CHARACTERISTICS C1toC4=0.1m FatV =5V±0.5V(seeFigure4),overrecommendedrangesofsupplyvoltageandoperatingfree-air CC temperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT I Supplycurrent Noload,V =5V,T =25°C 11 20 mA CC CC A Copyright©2003–2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):MAX208

MAX208 SLLS596C–OCTOBER2003–REVISEDAUGUST2009................................................................................................................................................ www.ti.com DRIVER SECTION ELECTRICAL CHARACTERISTICS C1toC4=0.1m FatV =5V±0.5V(seeFigure4),overrecommendedrangesofsupplyvoltageandoperatingfree-air CC temperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V High-leveloutputvoltage DOUTatR =3kΩtoGND,DIN=GND 5 9 V OH L V Low-leveloutputvoltage DOUTatR =3kΩtoGND,DIN=V –5 –9 V OL L CC I High-levelinputcurrent V =V 15 200 m A IH I CC I Low-levelinputcurrent V =0V –15 –200 m A IL I I Short-circuitoutputcurrent(1) V =5.5V,V =0V ±10 ±60 mA OS CC O r Outputresistance V ,V+,andV–=0V,V =±2V 300 Ω o CC O (1) Short-circuitdurationsshouldbecontrolledtopreventexceedingthedeviceabsolutepowerdissipationratings,andnotmorethanone outputshouldbeshortedatatime. SWITCHING CHARACTERISTICS C1toC4=0.1m FatV =5V±0.5V(seeFigure4),overrecommendedrangesofsupplyvoltageandoperatingfree-air CC temperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP(1) MAX UNIT C =50to1000pF,OneDOUTswitching,R =3kΩto7 Maximumdatarate L L 120 kbit/s kΩ,SeeFigure1 t Propagationdelaytime, C =2500pF,Alldriversloaded,R =3kΩ,SeeFigure1 2 m s PLH(D) low-tohigh-leveloutput L L t Propagationdelaytime, C =2500pF,Alldriversloaded,R =3kΩ,SeeFigure1 2 m s PHL(D) high-tolow-leveloutput L L t Pulseskew(2) C =150pFto2500pF,SeeFigure2 300 ns sk(p) L SR(tr) Slewrate,transitionregion C =50pFto2500pF,R =3kΩto7kΩ,V =5V 3 6 30 V/m s (seeFigure1) L L CC (1) AlltypicalvaluesareatV =5VandT =25°C. CC A (2) Pulseskewisdefinedas|t –t |ofeachchannelofthesamedevice. PLH PHL ESD PROTECTION PIN TESTCONDITIONS TYP UNIT DOUT,RIN Human-BodyModel ±15 kV 4 SubmitDocumentationFeedback Copyright©2003–2009,TexasInstrumentsIncorporated ProductFolderLink(s):MAX208

MAX208 www.ti.com................................................................................................................................................ SLLS596C–OCTOBER2003–REVISEDAUGUST2009 RECEIVER SECTION ELECTRICAL CHARACTERISTICS C1toC4=0.1m FatV =5V±0.5V(seeFigure4),overrecommendedrangesofsupplyvoltageandoperatingfree-air CC temperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V High-leveloutputvoltage I =–1mA 3.5 V OH OH V Low-leveloutputvoltage I =1.6mA 0.4 V OL OL V Positive-goinginputthresholdvoltage V =5V,T =25°C 1.7 2.4 V IT+ CC A V Negative-goinginputthresholdvoltage V =5V,T =25°C 0.8 1.2 V IT– CC A V Inputhysteresis(V –V ) V =5V 0.2 0.5 1 V hys IT+ IT– CC r Inputresistance V =±3Vto±25V,V =5V,T =25°C 3 5 7 kΩ i I CC A SWITCHING CHARACTERISTICS C1toC4=0.1m FatV =5V±0.5V(seeFigure4),overrecommendedrangesofsupplyvoltageandoperatingfree-air CC temperature(unlessotherwisenoted) PARAMETER TESTCONDITIONS MIN TYP(1) MAX UNIT t Propagationdelaytime,low-tohigh-leveloutput C =150pF 0.5 10 m s PLH(R) L t Propagationdelaytime,high-tolow-leveloutput C =150pF 0.5 10 m s PHL(R) L t Pulseskew(2) 300 ns sk(p) (1) AlltypicalvaluesareatV =5VandT =25°C. CC A (2) Pulseskewisdefinedas|t –t |ofeachchannelofthesamedevice. PLH PHL Copyright©2003–2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):MAX208

MAX208 SLLS596C–OCTOBER2003–REVISEDAUGUST2009................................................................................................................................................ www.ti.com PARAMETER MEASUREMENT INFORMATION 3V Input 1.5V 1.5V RS-232 0V Output Generator (see Note B) 50W CL tPHL(D) tPLH(D) RL (see Note A) VOH 3V 3V Output –3V –3V VOL TEST CIRCUIT 6V VOLTAGEWAVEFORMS SR(tr) = t ort PHL(D) PLH(D) A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics: PRR=120kbit/s,Z =50Ω,50%dutycycle,t ≤10ns,t ≤10ns. O r f Figure1.DriverSlewRate 3V RS-232 Input 1.5V 1.5V Generator Output 0V (see Note B) 50W CL tPHL(D) tPLH(D) RL (see Note A) VOH Output 50% 50% VOL TEST CIRCUIT VOLTAGEWAVEFORMS A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics: PRR=120kbit/s,Z =50Ω,50%dutycycle,t ≤10ns,t ≤10ns. O r f Figure2.DriverPulseSkew 3V Input 1.5V 1.5V Output -3 V Generator (see Note B) 50W CL tPHL(R) tPLH(R) (see Note A) VOH Output 50% 50% VOL TEST CIRCUIT VOLTAGEWAVEFORMS A. C includesprobeandjigcapacitance. L B. Thepulsegeneratorhasthefollowingcharacteristics:Z =50Ω,50%dutycycle,t ≤10ns,t ≤10ns. O r f Figure3.ReceiverPropagationDelayTimes 6 SubmitDocumentationFeedback Copyright©2003–2009,TexasInstrumentsIncorporated ProductFolderLink(s):MAX208

MAX208 www.ti.com................................................................................................................................................ SLLS596C–OCTOBER2003–REVISEDAUGUST2009 APPLICATION INFORMATION 1 24 DOUT2 DOUT3 2 23 DOUT1 RIN3 5 kW 3 22 RIN2 ROUT3 5 kW 5V ROUT2 4 400 kW 21 DIN4 5V 20 DOUT4 400 kW 5V 5 DIN1 400 kW 6 19 ROUT1 DIN3 5V 400 kW 7 18 RIN1 DIN2 5 kW GND 8 17 ROUT4 + 16 0.1 µF RIN4 - 5 kW 0.1 µF 9 VCC 16V 15 0.1 µF - V- - + 6.3V + 10 C1+ 14 C2- 11 V+ - 0.1 µF + 16V + 0.1 µF 6.3V - 12 C1- C2+ 13 A. Resistorvaluesshownarenominal. B. Non-polarizedceramiccapacitorsareacceptable.Ifpolarizedtantalumorelectrolyticcapacitorsareused,theyshould beconnectedasshown. Figure4.TypicalOperatingCircuitandCapacitorValues Copyright©2003–2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):MAX208

MAX208 SLLS596C–OCTOBER2003–REVISEDAUGUST2009................................................................................................................................................ www.ti.com Capacitor Selection The capacitor type used for C1–C4 is not critical for proper operation. The MAX208 requires 0.1-m F capacitors, although capacitors up to 10 m F can be used without harm. Ceramic dielectrics are suggested for the 0.1-m F capacitors. When using the minimum recommended capacitor values, ensure that the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×) nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures, influencestheamountofrippleonV+andV–. Uselargercapacitors(upto10m F)toreducetheoutputimpedanceatV+andV–. Bypass V to ground with at least 0.1 m F. In applications sensitive to power-supply noise generated by the CC charge pumps, decouple V to ground with a capacitor the same size as (or larger than) the charge-pump CC capacitors(C1toC4). ESD Protection TI MAX208 devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures weredesignedtosuccessfullyprotectthesebuspinsagainstESDdischargeof±15kVwhenpowereddown. ESDTestConditions ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a reliabilityreportthatdocumentstestsetup,methodology,andresults. Human-BodyModel(HBM) The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage ofconcernandsubsequentlydischargedintotheDUTthrougha1.5-kΩresistor. RD 1.5 kW + VHBM - CS 100 pF DUT Figure5.HBMESDTestCircuit 8 SubmitDocumentationFeedback Copyright©2003–2009,TexasInstrumentsIncorporated ProductFolderLink(s):MAX208

MAX208 www.ti.com................................................................................................................................................ SLLS596C–OCTOBER2003–REVISEDAUGUST2009 1.5 V = 2 kV HBM DUT = 10-V 1-WZener Diode 1.0 A – T U D I 0.5 0.0 0 50 100 150 200 Time – ns Figure6.TypicalHBMCurrentWaveform MachineModel(MM) The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC boardassembly,theMMtestnolongerisaspertinenttotheRS-232pins. Copyright©2003–2009,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):MAX208

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) MAX208CDB ACTIVE SSOP DB 24 60 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C & no Sb/Br) MAX208CDBR ACTIVE SSOP DB 24 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C & no Sb/Br) MAX208CDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C & no Sb/Br) MAX208CDW ACTIVE SOIC DW 24 25 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C & no Sb/Br) MAX208CDWR ACTIVE SOIC DW 24 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C & no Sb/Br) MAX208IDB ACTIVE SSOP DB 24 60 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I & no Sb/Br) MAX208IDBE4 ACTIVE SSOP DB 24 60 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I & no Sb/Br) MAX208IDBG4 ACTIVE SSOP DB 24 60 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I & no Sb/Br) MAX208IDBR ACTIVE SSOP DB 24 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I & no Sb/Br) MAX208IDW ACTIVE SOIC DW 24 25 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX208I & no Sb/Br) MAX208IDWR ACTIVE SOIC DW 24 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX208I & no Sb/Br) MAX208IDWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 MAX208I & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 14-Feb-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) MAX208CDBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 MAX208CDWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 MAX208IDBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 MAX208IDWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 14-Feb-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) MAX208CDBR SSOP DB 24 2000 367.0 367.0 38.0 MAX208CDWR SOIC DW 24 2000 350.0 350.0 43.0 MAX208IDBR SSOP DB 24 2000 367.0 367.0 38.0 MAX208IDWR SOIC DW 24 2000 350.0 350.0 43.0 PackMaterials-Page2

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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,65 0,15 M 0,22 28 15 0,25 0,09 5,60 8,20 5,00 7,40 Gage Plane 1 14 0,25 A 0°–(cid:1)8° 0,95 0,55 Seating Plane 2,00 MAX 0,05 MIN 0,10 PINS ** 14 16 20 24 28 30 38 DIM A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065/E 12/01 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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