MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes V4 Features Chip Dimensions ♦ Low Series Resistance MA4AGP907 and MA4AGFCP910 ♦ Ultra Low Capacitance ♦ Millimeter Wave Switching & Cutoff Frequency ♦ 2 Nanosecond Switching Speed ♦ Can be Driven by a Buffered TTL ♦ Silicon Nitride Passivation ♦ Polyimide Scratch Protection ♦ RoHS Compliant Description M/A-COM Technology Solutions MA4AGP907 and MA4AGFCP910 are Aluminum Gallium Arsenide (AlGaAs) flip-chip PIN diodes. These devices are fabricated on OMCVD epitaxial wafers using a process optimized for high device uniformity and exceptionally low parasitics. The end result is a diode with an extremely low RC product, (0.1ps) and 2-3nS switching characteristics. They are fully passivated with silicon nitride and have an added polymer layer for scratch protection. The protective coating prevents damage to the junction and the anode air-bridge during handling and assembly. Notes: Applications 1. Gold Pads 14µM thick. The ultra low capacitance of the MA4AGP907 and 2. Yellow areas indicate ohmic gold mounting pads. MA4AGFCP910 make them ideal for RF switch and 3. Dimensions A thru F are identical for both devices phase shifter applications through millimeter wave frequencies. The diodes are designed for use in INCHES MM pulsed or CW applications, where single digit nS DIM switching speed is required. The low capacitance of MIN. MAX. MIN. MAX. these diodes make them ideal for use in microwave A 0.0260 0.0270 0.6604 0.6858 multi-throw switch assemblies, where the series B 0.0135 0.0145 0.3429 0.3683 capacitance of each “off” port adversely loads the input and affects VSWR. C 0.0065 0.0075 0.1651 0.1905 D 0.0043 0.0053 0.1092 0.1346 Absolute Maximum Ratings T = +25°C E 0.0068 0.0073 0.1727 0.1854 AMB (unless otherwise specified) F 0.0182 0.0192 0.4623 0.4877 Parameter Absolute Maximum MA4AGP907 -50V Reverse Voltage MA4AGFCP910 -75V Operating Temperature -55°C to +125°C Storage Temperature -55°C to +150°C Junction Temperature +175°C Dissipated Power (RF & DC ) 50mW C.W. Incident Power +23 dBm Mounting Temperature +280°C for 10 seconds 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under Visit www.macom.com for additional data sheets and product information. development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or produce in volume is not guaranteed. information contained herein without notice.

MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes V4 Electrical Specifications @ T = +25°C AMB MA4AGP907 MA4AGFCP910 Parameter Symbol Conditions Units Typ. Max. Typ. Max. MA4AGP907 -5V,1MHz Total Capacitance C pF 0.025 0.030 0.018 0.021 T MA4AGFCP910 -10V,1MHz Total Capacitance 1 C -5V, 10GHz pF 0.020 —— 0.018 0.021 T Series Resistance R +10mA, 1MHz Ω 5.2 7.0 —— —— S Series Resistance 2 R +10mA, 10GHz Ω 4.2 —— 5.2 6.0 S Forward Voltage V +10mA V 1.33 1.45 1.33 1.45 F MA4AGP907 VR = -50V Reverse Leakage Current 3 I μA —— 10 —— 10 R MA4AGFCP910 VR = -75V T Switching Speed 4 RISE 10GHz nS 2 —— 2 —— T FALL Carrier Lifetime T I = 10mA / I = 6mA nS —— —— 4 —— L F REV Notes: 1) Capacitance is determined by measuring the isolation of a single series diode in a 50Ω transmission line at 10GHz. 2) Series resistance is determined by measuring the insertion loss of a single series diode in a 50Ω transmission line at 10GHz. 3) The max rated V ( Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is R measured to be <10μA 4) Switching speed is measured between 10% and 90% or 90% to 10% RF voltage for a single series mounted diode. Driver delay is not included. 2 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 development. Performance is based on target specifications, simulated results, and/or prototype • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under Visit www.macom.com for additional data sheets and product information. development. Performance is based on engineering tests. Specifications are typical. Mechanical M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. information contained herein without notice.

MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes V4 Typical RF Performance @ T = +25°C AMB MA4AGP907 Typical Insertion Loss vs. Frequency I. Loss @5mA I. Loss @15mA I. Loss @50mA 0.0 B)dB) -0.2 d( ss (ss oo LL -0.4 on n ertitio nser Is -0.6 n I -0.8 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 FreqFureeqnuecnyc y(G (GHHzz)) MA4AGFCP910 Typical Insertion Loss vs. Frequency 0.0 5mA 10mA 15mA -0.2 B) 15 mA 10 mA 5 mA d ( s dB) os s ( L-0.4 Los n o i t r e s n I-0.6 -0.8 2 10 18 26 34 42 50 FrFreeqquueenncyc (yGH (zG)Hz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under Visit www.macom.com for additional data sheets and product information. development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or produce in volume is not guaranteed. information contained herein without notice.

MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes V4 Typical RF Performance @ T = +25°C AMB MA4AGP907 Typical return Loss vs. Frequency ( Either Port ) R. Loss @5mA R. Loss @15mA R. Loss @50mA -20.0 -22.0 -24.0 B) d -26.0 ( s -28.0 s o L -30.0 n ur -32.0 Ret -34.0 -36.0 -38.0 -40.0 2 3 4 5 6 7 8 9 0 1 2 3 4 5 1 1 1 1 1 1 Frequency (GHz) MA4AGFCP910 Typical Return Loss vs. Frequency ( Either Port Direction ) 0 5mA 10mA 15mA -5 B) -10 d 15 mA 10 mA 5 mA ( B) s oss (d Los-15 n L n Retur ur-20 t e R -25 -30 -35 2 10 18 26 34 42 50 FreFrqeuqueennccyy ((GGHHz)z) 4 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regardFinreg qa uperondcucyt M(H/Az-C) OM is considering for • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 development. Performance is based on target specifications, simulated results, and/or prototype • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under Visit www.macom.com for additional data sheets and product information. development. Performance is based on engineering tests. Specifications are typical. Mechanical M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. information contained herein without notice.

MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes V4 Typical RF Performance @ T = +25°C AMB MA4AGP907 Typical Isolation vs. Frequency Isolation @ -10V Isolation @ 0V Isolation @ -1V -5.0 -10.0 B) -15.0 d ( n o -20.0 ati ol s I -25.0 -30.0 -35.0 2 3 4 5 6 7 8 9 0 1 2 3 4 5 1 1 1 1 1 1 Frequency (GHz) MA4AGFCP910 Typical Isolation vs Frequency 0 -5 ) B-10 d ( s B)s do-15 n (L Isolatioation -20 ol s-25 0V 5V I -30 -35 2 10 18 26 34 42 50 Frequency (GHz) Frequency (GHz) 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • North America Tel: 800.366.2266 / Fax: 978.366.2266 development. Performance is based on target specifications, simulated results, and/or prototype • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 measurements. Commitment to develop is not guaranteed. • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under Visit www.macom.com for additional data sheets and product information. development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or produce in volume is not guaranteed. information contained herein without notice.

MA4AGP907 MA4AGFCP910 AlGaAs Flip Chip PIN Diodes V4 Device Installation Guidelines Cleanliness These devices should be handled in a clean environment. The chips are resistant to solvents and may cleaned using approved industry standard practices. Static Sensitivity Aluminum Gallium Arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices. These devices are rated Class 0, ( 0-199V ) per HBM MIL-STD-883, method 3015.7 [C = 100pF ±10%, R = 1.5kW ±1%]. Even though tested die pass 50V ESD, they must be handled in a static-free environment. General Handling The devices have a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed with a #27 tip vacuum pencil. Assembly Requirements using Electrically Conductive Silver Epoxy and Solder These chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be mounted onto silk-screened circuits using electrically conductive silver epoxy, approximately 1-2 mils in thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times, > 30 minutes, temperatures must be below 200°C. Eutectic Die Attached Tin rich solders ( >30% Sn by weight ) are not recommended as they will scavenge the gold on the contact Pads exposing the tungsten metallization beneath and creating a poor solder connection. Indalloy or 80/20, Au/Sn type solders are acceptable. Maximum soldering temperature must be kept below 280°C for less than 10 seconds. Note: The MA4AGSBP907 which is a solder bumped version of the MA4AGP907, is also available. The datasheet can be viewed on the M/A-COM website at: http://www.macom.com/DataSheets/MA4AGSBP907.pdf Circuit Pad Layout Ordering Information 0.013” Part Number Packaging MA4AGP907 Gel Pack 0.012” MADP-001907-13050P Pocket Tape (2) PL Part Number Packaging MA4AGFCP910 Gel Pack 0.008” (2) PL MADP-000910-13050P Pocket Tape 6 • North America Tel: 800.366.2266 / Fax: 978.366.2266 ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 development. Performance is based on target specifications, simulated results, and/or prototype • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under Visit www.macom.com for additional data sheets and product information. development. Performance is based on engineering tests. Specifications are typical. Mechanical M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. information contained herein without notice.