ICGOO在线商城 > 光电元件 > LED 指示 - 分立 > LTST-C191TGKT
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LTST-C191TGKT产品简介:
ICGOO电子元器件商城为您提供LTST-C191TGKT由Lite-On设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 LTST-C191TGKT价格参考¥0.29-¥0.29。Lite-OnLTST-C191TGKT封装/规格:LED 指示 - 分立, 绿色 525nm LED 指示 - 分立 3.2V 0603(1608 公制)。您可以下载LTST-C191TGKT参考资料、Datasheet数据手册功能说明书,资料中有LTST-C191TGKT 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | LED GREEN CLEAR 0603 SMD标准LED-SMD Green Clear 525nm |
产品分类 | |
LED大小 | 0603 |
品牌 | Lite-On Inc |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | LED发射器,标准LED-SMD,Lite-On LTST-C191TGKT- |
数据手册 | |
产品型号 | LTST-C191TGKT |
产品种类 | 标准LED-SMD |
光强度 | 150 mcd |
其它名称 | 160-1888-6 |
包装 | Digi-Reel® |
商标 | Lite-On |
大小/尺寸 | 1.60mm 长 x 0.80mm 宽 |
安装类型 | 表面贴装 |
封装 | Reel |
封装/外壳 | 0603(1608 公制) |
封装/箱体 | 0603 |
工厂包装数量 | 5000 |
显示角 | 130 deg |
最大工作温度 | + 80 C |
最小工作温度 | - 20 C |
标准包装 | 1 |
正向电压 | 3.2 V |
正向电流 | 20 mA |
毫烛光等级 | 260.5mcd |
波长-主 | 525nm |
波长-峰值 | 530nm |
波长/色温 | 525 nm |
测试电流时的光通量 | - |
照明颜色 | Green |
电压-正向(Vf)(典型值) | 3.2V |
电流-测试 | 20mA |
视角 | 130° |
透镜样式/尺寸 | 矩形,带平顶,1mm x 0.8mm |
透镜类型 | 透明 |
透镜颜色/类型 | Water Clear |
颜色 | 绿 |
高度 | 0.55mm |
SMD LED Product Data Sheet LTST-C191TGKT Spec No. :DS22-2000-300 Effective Date: 05/04/2017 Revision: H LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto
SMD LED LTST-C191TGKT 1. Description SMD LED lamps from Lite-On are available in miniature sizes and special configurations for automated PC board assembly and space-sensitive applications. These SMD LED lamps are suitable for use in a wide variety of electronic equipment, including cordless and cellular phones, notebook computers, network systems, home appliances, and indoor signboard applications. 1.1 Features 1.2 Applications (cid:1) Meet RoHS (cid:1) Telecommunication, Office automation, home appliances, (cid:1) Super thin(0.55H mm) Chip LED industrial equipment (cid:1) Ultra bright InGaN Chip LED (cid:1) Keypad/Keyboard Backlighting (cid:1) Package in 8mm tape on 7" diameter reels. (cid:1) Status indicator (cid:1) EIA STD package (cid:1) Micro-displays (cid:1) I.C. compatible (cid:1) Signal and Symbol Luminary (cid:1) Compatible with automatic placement equipment (cid:1) Compatible with infrared reflow solder process 2. Package Dimensions Part No. Lens Color Source Color LTST-C191TGKT Water Clear InGaN Green Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±0.1 mm (.004") unless otherwise noted. 1/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 3. Rating and Characteristics 3.1 Absolute Maximum Ratings at Ta=25°C Parameter LTST-C191TGKT Unit Power Dissipation 76 mW Peak Forward Current 100 mA (1/10 Duty Cycle, 0.1ms Pulse Width) DC Forward Current 20 mA Operating Temperature Range -20 ºC to + 80 ºC Storage Temperature Range -30 ºC to + 100 ºC Infrared Soldering Condition 260 °C For 10 Seconds 3.2 Suggest IR Reflow Condition For Pb Free Process: 2/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 3.3 Electrical / Optical Characteristics at Ta=25°C LTST-C191TGKT Test Parameter Symbol Unit MIN. TY P. MAX. Condition IF =20mA Luminous Intensity IV 71 - 450 mcd Note 1 Viewing Angle 2q 1/2 130 deg Note 2 (Fig.5) Measurement Peak Emission Wavelength λP 530 nm @Peak (Fig.1) IF = 20mA Dominant Wave length λ 520 535 nm Note 3 Spectral Line Half-Width Δλ 35 nm Forward Voltage VF 2.8 3.6 V IF =20mA VR = 10V Reverse Current IR - - 10 μA Note 5 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD: Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 5. Reverse voltage (VR) condition is applied to IR test only. The device is not designed for reverse operation. 3/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 4. Bin Rank 4.1 Bin code list (cid:1) Vf Rank Forward Voltage Color :Green , Unit : V @20mA Bin Code Min. Max. D7 2.80 3.00 D8 3.00 3.20 D9 3.20 3.40 D10 3.40 3.60 Tolerance on each Forward Voltage bin is +/- 0.1V (cid:1) IV Rank Luminous Intensity Color : Green , Unit : mcd @20mA Bin Code Min. Max. Q 71.0 112.0 R 112.0 180.0 S 180.0 280.0 T 280.0 450.0 Tolerance on each Luminous Intensity bin is +/- 15% (cid:1) Hue Rank Dominant Wavelength Color :Green , Unit : nm @20mA Bin Code Min. Max. AP 520.0 525.0 AQ 525.0 530.0 AR 530.0 535.0 Tolerance for each Dominate Wavelength bin is +/- 1nm 4/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 5. Typical Electrical / Optical Characteristics Curves. (25°C Ambient Temperature Unless Otherwise Noted) 5/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 6. User Guide 6.1 Cleaning Do not use unspecified chemical liquid to clean LED they could harm the package. If clean is necessary, immerse the LED in ethyl alcohol or in isopropyl alcohol at normal temperature for less one minute. 6.2 Recommend Printed Circuit Board Attachment Pad 6.3 Package Dimensions Of Tape And Reel Note: 1. All dimensions are in millimeters (inches). 6/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 6.4 Package Dimensions of Reel Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel-5000 pieces per reel. 3. Minimum packing quantity is 500 pieces for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with ANSI/EIA 481 specifications. 7/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 7. Cautions 7.1 Application The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 7.2 Storage The package is sealed: The LEDs should be stored at 30°C or less and 90%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. The package is opened: The storage ambient for the LEDs should not exceed 30°C temperature or 60% relative humidity. It is recommended that LEDs out of their original packaging are IR-reflowed within 672 hrs(MSL 2a). For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant, or in a desiccators with nitrogen ambient. LEDs stored out of their original packaging for more than 672 hrs should be baked at about 60 deg C for at least 20 hours before solder assembly. 7.3 Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. 7.4 Soldering Recommended soldering conditions: Reflow soldering Soldering iron Pre-heat 150~200°C Temperature 300°C Max. Pre-heat time 120 sec. Max. Soldering time 3 sec. Max. Peak temperature 260°C Max. (one time only) Soldering time 10 sec. Max.(Max. two times) Notes: Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit boards, no single temperature profile works for all possible combinations. However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific characterization. LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly. The results of this testing are verified through post-reflow reliability testing. Profiles used at LITE-ON are based on JEDEC standards to ensure that all packages can be successfully and reliably surface mounted. Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint. 8/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 7.5 Drive Method A LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. 7.6 ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: (cid:1) Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs. (cid:1) All devices, equipment, and machinery must be properly grounded. (cid:1) Work tables, storage racks, etc. should be properly grounded. (cid:1) Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a result of friction between LEDs during storage and handling. ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “ no lightup ” at low currents. To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents. The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product. 9/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 8. Reliability Test Classification Test Item Test Condition Reference Standard Ta= Under Room Temperature As Per Data Sheet MIL-STD-750D:1026 Operation Life Maximum Rating MIL-STD-883D:1005 *Test Time= 1000HRS (-24HRS,+72HRS). JIS C 7021:B-1 High Temperature Ta= 65±5ºC,RH= 90~95% MIL-STD-202F:103B High Humidity *Test Time= 24 HRS±2HRS JIS C 7021:B-11 Endurance Storage Test High Temperature Ta= 105±5 ºC MIL-STD-883D:1008 *Test Time= 1000HRS ( 24HRS,+72HRS) JIS C 7021:B-10 Storage Low Temperature Ta= -55±5 ºC JIS C 7021:B-12 *Test Time=1000HRS (-24HRS,+72 HRS) Storage MIL-STD-202F:107D 105 ºC ~ 25 ºC ~ -55 ºC ~ 25 ºC Temperature MIL-STD-750D:1051 30mins 5mins 30mins 5mins MIL-STD-883D:1010 Cycling 10 Cycles JIS C 7021:A-4 MIL-STD-202F:107D Thermal 85 ± 5 ºC ~ -30 ºC ± 5 ºC MIL-STD-750D:1051 Shock 10mins 10mins 10Cycles MIL-STD-883D:1011 MIL-STD-202F:210A Solder T.sol= 260 ± 5 ºC MIL-STD-750D:2031 Dwell Time=10 ± 1secs Resistance JIS C 7021:A-1 Environmental Test Ramp-up rate(217 ºC to Peak) +3 ºC / second max Temp. maintain at 175(±25) ºC 180 seconds max Temp. maintain above 217 ºC 60-150 seconds MIL-STD-750D:2031.2 IR-Reflow Peak temperature range 260 ºC +0/-5 ºC J-STD-020D Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down rate +6 ºC /second max MIL-STD-202F:208D T.sol= 235 ± 5 ºC MIL-STD-750D:2026 Immersion time 2±0.5 sec Solder ability MIL-STD-883D:2003 Immersion rate 25±2.5 mm/sec IEC 68 Part 2-20 Coverage ≧95% of the dipped surface JIS C 7021:A-2 10/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4
SMD LED LTST-C191TGKT 9. Others The appearance and specifications of the product may be modified for improvement without prior notice. 10. Suggested Checking List Training and Certification 1. Everyone working in a static-safe area is ESD-certified? 2. Training records kept and re-certification dates monitored? Static-Safe Workstation & Work Areas 1. Static-safe workstation or work-areas have ESD signs? 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V? 3. All ionizer activated, positioned towards the units? 4. Each work surface mats grounding is good? Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with conductive flooring? 2. If conductive footwear used, conductive flooring also present where operator stand or walk? 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*? 4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs? 5. All wrist strap or heel strap checkers calibration up to date? Note: *50V for InGaN LED. Device Handling 1. Every ESDS items identified by EIA-471 labels on item or packaging? 2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation? 3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items? 4. All flexible conductive and dissipative package materials inspected before reuse or recycles? Others 1. Audit result reported to entity ESD control coordinator? 2. Corrective action from previous audits completed? 3. Are audit records complete and on file? 11/11 Part No. :LTS T-C1 91TG KT BNS-OD-FC002/A4