LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 (cid:1) Initial Accuracy D OR PW PACKAGE − ±4 mV for LT1004-1.2 (TOP VIEW) − ±20 mV for LT1004-2.5 (cid:1) NC 1 8 CATHODE Micropower Operation NC 2 7 NC (cid:1) Operates up to 20 mA NC 3 6 CATHODE (cid:1) Very Low Reference Impedance ANODE 4 5 NC (cid:1) Applications: − Portable Meter Reference NC − No internal connection Terminals 6 and 8 are internally connected. − Portable Test Instruments − Battery-Operated Systems − Current-Loop Instrumentation LP PACKAGE (TOP VIEW) description/ordering information ANODE The LT1004 micropower voltage reference is a CATHODE two-terminal band-gap reference diode designed NC to provide high accuracy and excellent temperature characteristics at very low operating NC − No internal connection currents. Optimizing the key parameters in the design, processing, and testing of the device results in specifications previously attainable only with selected units. The LT1004 is a pin-for-pin replacement for the LM285 and LM385 series of references, with improved specifications. It is an excellent device for use in systems in which accuracy previously was attained at the expense of power consumption and trimming. The LT1004C is characterized for operation from 0°C to 70°C. The LT1004I is characterized for operation from −40°C to 85°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright  2008, Texas Instruments Incorporated Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 description/ordering information (continued) (cid:1) ORDERING INFORMATION TA TVYZP PACKAGE‡ POARRDT ENRUAMBBLEER MTOAPR-KSIINDGE Tube of 75 LT1004CD-1-2 SSOOIICC ((DD)) 44CC-1122 Reel of 2500 LT1004CDR-1-2 11.22 VV Tube of 150 LT1004CPW-1-2 TTSSSSOOPP ((PPWW)) 44CC-1122 Reel of 2000 LT1004CPWR-1-2 00°°CC ttoo 7700°°CC Tube of 75 LT1004CD-2-5 SSOOIICC ((DD)) 44CC-2255 Reel of 2500 LT1004CDR-2-5 22.55 VV Tube of 150 LT1004CPW-2-5 TTSSSSOOPP ((PPWW)) 44CC-2255 Reel of 2000 LT1004CPWR-2-5 Tube of 75 LT1004ID-1-2 SSOOIICC ((DD)) 44II-1122 Reel of 2500 LT1004IDR-1-2 11.22 VV Tube of 150 LT1004IPW-1-2 TTSSSSOOPP ((PPWW)) 44II-1122 Reel of 2000 LT1004IPWR-1-2 −4400°°CC ttoo 8855°°CC Tube of 75 LT1004ID-2-5 SSOOIICC ((DD)) 44II-2255 Reel of 2500 LT1004IDR-2-5 22.55 VV Tube of 150 LT1004IPW-2-5 TTSSSSOOPP ((PPWW)) 44II-2255 Reel of 2000 LT1004IPWR-2-5 †For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. ‡Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. symbol ANODE CATHODE (A) (K) 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 schematic LT1004-1.2 CATHODE 7.5 kΩ Q12 200 kΩ Q3 Q11 Q4 Q2 Q10 Q1 20 pF 20 pF 50 kΩ 600 kΩ Q9 500 kΩ 300 kΩ Q5 Q8 500 Ω Q6 Q7 Q13 60 kΩ ANODE LT1004-2.5 CATHODE 7.5 kΩ Q12 200 kΩ Q3 Q11 Q4 Q2 Q10 500 kΩ Q1 20 pF 20 pF 50 kΩ Q9 600 kΩ 500 kΩ 300 kΩ Q5 Q8 Q13 500 ΩQ6 Q7 500 kΩ 60 kΩ ANODE NOTE A: All component values shown are nominal. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Reverse current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA R Forward current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA F Package thermal impedance, θ (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W JA PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C J Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C stg †Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions MIN MAX UNIT LT1004C 0 70 TTA OOppeerraattiinngg ffrreeee-aaiirr tteemmppeerraattuurree °°CC LT1004I −40 85 electrical characteristics at specified free-air temperature TTEESSTT LT1004-1.2 LT1004-2.5 PPAARRAAMMEETTEERR CONDITIONS TTA‡‡ MIN TYP MAX MIN TYP MAX UUNNIITT 25°C 1.231 1.235 1.239 2.48 2.5 2.52 VVZZ RReeffeerreennccee vvoollttaaggee IIZZ = 110000 µµAA FFuullll LT1004C 1.225 1.245 2.47 2.53 VV range LT1004I 1.225 1.245 2.47 2.53 (cid:1)(cid:1)VV Atteevmmeppraeegrraaettuurree ccooeeffffiicciieenntt IZ = 10 µA 2255°°CC 20 ppppmm//°°CC Z of reference voltage§ IZ = 20 µA 20 25°C 1 1 Change in IIZ = IIZ((mmiinn)) ttoo 11 mmAA Full range 1.5 1.5 ∆∆VVZ rreeffeerreennccee vvoollttaaggee 25°C 10 10 mmVV wwiitthh ccuurrrreenntt IIZ = 11 mmAA ttoo 2200 mmAA Full range 20 20 Long-term change ∆VZ/∆t in reference voltage IZ = 100 µA 25°C 20 20 ppm/khr Minimum IZ(min) reference current Full range 8 10 12 20 µA 25°C 0.2 0.6 0.2 0.6 zzz RReeffeerreennccee iimmppeeddaannccee IIZ = 110000 µAA Full range 1.5 1.5 ΩΩ Vn Bnoroisaed vboalntadge fIZ = = 1 100 H0z µ tAo, 10 kHz 25°C 60 120 µV ‡Full range is 0°C to 70°C for the LT1004C and −40°C to 85°C for the LT1004I. §The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature range. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 TYPICAL CHARACTERISTICS Table of Graphs GRAPH TITLE FIGURE LT1004x-1.2 Reverse current vs Reverse voltage 1 Reference-voltage change vs Reverse current 2 Forward voltage vs Forward current 3 Reference voltage vs Free-air temperature 4 Reference impedance vs Reference current 5 Noise voltage vs Frequency 6 Filtered output noise voltage vs Cutoff frequency 7 LT1004x-2.5 Transient response 8 Reverse current vs Reverse voltage 9 Forward voltage vs Forward current 10 Reference voltage vs Free-air temperature 11 Reference impedance vs Reference current 12 Noise voltage vs Frequency 13 Filtered output noise voltage vs Cutoff frequency 14 Transient response 15 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 TYPICAL CHARACTERISTICS† LT1004x-1.2 LT1004x-1.2 REVERSE CURRENT REFERENCE-VOLTAGE CHANGE vs vs REVERSE VOLTAGE REVERSE CURRENT 100 16 ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ TA = −55°C to 125°C TA = −55°C to 125°C ÎÎÎÎÎÎÎ V ÎÎÎÎÎÎ m − 12 A e µ g urrent − 10 ge Chan 8 C a e olt s V er e ev nc 4 R e − 1 er R ef I R − Z 0 V ∆ 0.1 − 4 0 0.2 0.4 0.6 0.8 1 1.2 1.4 0.01 0.1 1 10 100 VR − Reverse Voltage − V IR − Reverse Current − mA Figure 1 Figure 2 LT1004x-1.2 LT1004x-1.2 FORWARD VOLTAGE REFERENCE VOLTAGE vs vs FORWARD CURRENT FREE-AIR TEMPERATURE ÎÎÎÎÎ 1.2 1.245 ÎTÎA = Î25°CÎ ÎIÎZ = 1Î00 εA Î 1 1.24 V V − − ge 0.8 ge a a Volt Volt 1.235 rd 0.6 ce a n w e or er F ef − 0.4 R 1.23 F − V Z V 0.2 1.225 0 0.01 0.1 1 10 100 −55 −35 −15 5 25 45 65 85 105 125 IF − Forward Current − mA TA − Free-Air Temperature − °C Figure 3 Figure 4 †Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 TYPICAL CHARACTERISTICS† LT1004x-1.2 LT1004x-1.2 REFERENCE IMPEDANCE NOISE VOLTAGE vs vs REFERENCE CURRENT FREQUENCY 100 700 ÎÎÎÎÎÎÎ ÎÎÎÎ ÎfT ÎA= =2 5−Î 5H5z°ÎC toÎ 125ΰC Î 600 ÎÎITZA ÎÎ= = 1 205ÎÎ0° CµAÎÎ Ω e − Hz 500 c an 10 V/ d n mpe e − 400 g nce I Volta 300 re e e s ef 1 oi R N 200 − − zz Vn 100 0.1 0 0.01 0.1 1 10 100 10 100 1 k 10 k 100 k IZ − Reference Current − mA f − Frequency − Hz Figure 5 Figure 6 TL1004x-1.2 FILTERED OUTPUT NOISE VOLTAGE vs LT1004x-1.2 CUTOFF FREQUENCY TRANSIENT RESPONSE 70 ÎÎÎÎIZ =ÎÎ 100ÎÎ µAÎÎ ÎRÎC LÎow ÎPassÎ 2 V 60 ÎÎTA Î= 25ΰC Î ÎÎÎÎÎ µage − 50 100 µA ges − V 1.5 ÎOÎutpuÎt Î e Volt 40 R Volta 1 36 kΩ ut Nois 30 C Output 0.5 VI VO utp nd 0 O a ed 20 put er n Filt I 10 5 ÎÎÎ Input 0 0 0.1 1 10 100 0 100 500 600 Cutoff Frequency − kHz t − Time − µs Figure 7 Figure 8 †Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 TYPICAL CHARACTERISTICS† LT1004x-2.5 LT1004x-2.5 REVERSE CURRENT FORWARD VOLTAGE vs vs REVERSE VOLTAGE FORWARD CURRENT 100 1.2ÎÎÎÎ ÎTAÎ = −Î55°CÎ to 1Î25°ÎC ÎTA Î= 25ΰC Î 1 V µ−A 10 ge − 0.8 ent olta Curr rd V 0.6 se wa er or v F Re 1 − 0.4 − F R V I 0.2 0.1 0 0 0.5 1 1.5 2 2.5 3 0.01 0.1 1 10 100 VR − Reverse Voltage − V IF − Forward Current − mA Figure 9 Figure 10 LT1004x-2.5 REFERENCE VOLTAGE vs FREE-AIR TEMPERATURE ÎÎÎÎÎ 2.52 ÎIZÎ = 1Î00 µÎA Î 2.515 2.51 V − ge 2.505 a olt V 2.5 e c n e 2.495 r e ef R 2.49 − Z V 2.485 2.48 2.475 −55 −35 −15 5 25 45 65 85 105 125 TA − Free-Air Temperature − °C Figure 11 †Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 TYPICAL CHARACTERISTICS† LT1004x-2.5 LT1004x-2.5 REFERENCE IMPEDANCE NOISE VOLTAGE vs vs REFERENCE CURRENT FREQUENCY 1000 ÎÎÎÎÎÎ 1400 ÎÎÎÎ Îf =Î 25 HÎz ÎÎÎ ÎÎIZ ÎÎ = 10ÎÎ0 µAÎÎ TA = −55°C to 125°C 1200 TA = 25°C ÎÎÎÎÎÎ Ω− 100 Hz 1000 e anc nV/ d − 800 mpe 10 age e I olt 600 c V eferen Noise 400 − R 1 − n z V z 200 0.1 0 0.01 0.1 1 10 100 10 100 1 k 10 k 100 k IZ − Reference Current − mA f − Frequency − Hz Figure 12 Figure 13 TL1004x-2.5 FILTERED OUTPUT NOISE VOLTAGE vs LT1004x-2.5 CUTOFF FREQUENCY TRANSIENT RESPONSE 120 ÎÎIZ ÎÎ = 10ÎÎ0 µAÎÎ 4 ÎTAÎ = 2Î5°CÎ V 100 µ − ÎÎÎÎÎ V 3 age ÎÎRC LÎow ÎPasÎs s − Output olt 80 ge 2 e V 100 µA olta 24 kΩ Nois 60 R ut V 1 VI VO ut C utp d Outp 40 and O 0 re ut e p Filt 20 In 5 Input 0 0 0.1 1 10 100 0 100 500 Cutoff Frequency − kHz t − Time − µs Figure 14 Figure 15 †Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 APPLICATION INFORMATION 100 pF 24 V 24 V 600 µs RC + 22 kΩ 12 kΩ LM301A Output 21 V − 16.9 kΩ† LT1004-1.2 −5 V 0.05 µF 1.05 kΩ† 10 kΩ TTL Input 2N3904 56 kΩ −5 V †1% metal-film resistors Figure 16. V Generator for EPROMs (No Trim Required) I(PP) Network Detail YSI 44201 Brown RT Network Green 15 V YSI 44201 6250 Ω Red 2.7 kΩ 5% 2765 Ω 302 kΩ − 0.1% 10 kΩ 1/2 + 0.1% TLE2022 1/2 LT1004-1.2 + TLE2022 0−10 V 0°C−100°C − 10 kΩ 10 kΩ 0.1% 168.3 Ω 0.1% 0.1% Figure 17. 0°C-to-100°C Linear-Output Thermometer 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 APPLICATION INFORMATION VI = 6.5 V to 15 V V+ R LM334 V− 5.6 kΩ 7 3 + 8 6 TLC271 VO = 5 V 2 − 4 3.01 MΩ LT1004-1.2 150 pF 1% 1 MΩ 1% Figure 18. Micropower 5-V Reference VI ≥ 5 V 9 V 100 µA 22 Ω 510 kΩ Output + 1.235 V LT1004-1.2 50 µF LT1004-1.2 Figure 19. Low-Noise Reference Figure 20. Micropower Reference From 9-V Battery † 100 kΩ R1 Lith3iu Vm 1684 Ω 5 kΩ at 25°C‡ THERMTYOPCEOUPLE R1 LT1004-1.2 + J 232 kΩ K 298 kΩ 187 Ω 1800 Ω T 301 kΩ S 2.1 MΩ + − − †Quiescent current ≅ 15 µA ‡Yellow Springs Inst. Co., Part #44007 NOTE A: This application compensates within ±1°C from 0°C to 60°C. Figure 21. Micropower Cold-Junction Compensation for Thermocouples POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 APPLICATION INFORMATION LT1084 VI ≥ 8 V IN OUT 5 V 5 V + ADJ + 10 µF 301 Ω 50 kΩ 10 µF 1% LT1004-2.5 2.5 V 100 Ω LT1004-2.5 1% Figure 22. 2.5-V Reference Figure 23. High-Stability 5-V Regulator VCC+ ≥ 5 V 15 V 250 kΩ 250 kΩ 2 kΩ† Output LT1004-1.2 Input R1 − (see Note A) TLE2027 2N3904 + IO (see Note A) −5 V 200 kΩ LT1004-1.2 60 kΩ †May be increased for small output currents VCC− ≤ −5 V NOTE A: R1 ≈ IO +2 1 V0 µA, IO = 1.2R315 V Figure 25. Amplifier With Constant Gain Figure 24. Ground-Referenced Current Source Over Temperature V+ R LM334 1.5 V (see Note A) 3 kΩ 6.8 kΩ R ≤ 5 kΩ 1.235 V LT1004-1.2 LT1004-1.2 1.3 V IO ≈ R NOTE A: Output regulates down to 1.285 V for IO = 0. Figure 27. Terminal Current Source Figure 26. 1.2-V Reference From 1.5-V Battery With Low Temperature Coefficient 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

LT1004-1.2, LT1004-2.5 MICROPOWER INTEGRATED VOLTAGE REFERENCES SLVS022M − JANUARY 1989 − REVISED MAY 2008 APPLICATION INFORMATION Battery Output R1† 1 MΩ 12 V 1% + TLC271 LO = Battery Low − 133 kΩ 1% LT1004-1.2 †R1 sets trip point, 60.4 kΩ per cell for 1.8 V per cell. Figure 28. Lead-Acid Low-Battery-Voltage Detector LT1084 VI VI VO VO + ADJ 10 µF 120 Ω + 10 µF LT1004-1.2 R1 ≤ VCC − 1 V R1 2 kΩ 0.015 VCC− Figure 29. Variable-Voltage Supply POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LT1004CD-1-2 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 4C-12 & no Sb/Br) LT1004CD-2-5 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 4C-25 & no Sb/Br) LT1004CDR-1-2 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 4C-12 & no Sb/Br) LT1004CDR-2-5 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 4C-25 & no Sb/Br) LT1004CDRG4-2-5 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 4C-25 & no Sb/Br) LT1004CPW-1-2 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4C-12 & no Sb/Br) LT1004CPWR-1-2 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 4C-12 & no Sb/Br) LT1004CPWR-2-5 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM 0 to 70 4C-25 & no Sb/Br) LT1004ID-1-2 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 4I-12 & no Sb/Br) LT1004ID-2-5 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM 4I-25 & no Sb/Br) LT1004IDG4-2-5 ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4I-25 & no Sb/Br) LT1004IDR-1-2 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4I-12 & no Sb/Br) LT1004IDR-2-5 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM 4I-25 & no Sb/Br) LT1004IDRE4-2-5 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4I-25 & no Sb/Br) LT1004IDRG4-1-2 ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4I-12 & no Sb/Br) LT1004IPW-1-2 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4I-12 & no Sb/Br) LT1004IPW-2-5 ACTIVE TSSOP PW 8 150 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4I-25 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LT1004IPWR-1-2 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4I-12 & no Sb/Br) LT1004IPWR-2-5 ACTIVE TSSOP PW 8 2000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 85 4I-25 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 15-Feb-2016 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LT1004CDR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LT1004CDR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LT1004CDR-2-5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LT1004CPWR-1-2 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LT1004CPWR-2-5 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LT1004IDR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LT1004IDR-2-5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LT1004IPWR-1-2 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LT1004IPWR-2-5 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 15-Feb-2016 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LT1004CDR-1-2 SOIC D 8 2500 367.0 367.0 35.0 LT1004CDR-1-2 SOIC D 8 2500 340.5 338.1 20.6 LT1004CDR-2-5 SOIC D 8 2500 340.5 338.1 20.6 LT1004CPWR-1-2 TSSOP PW 8 2000 367.0 367.0 35.0 LT1004CPWR-2-5 TSSOP PW 8 2000 367.0 367.0 35.0 LT1004IDR-1-2 SOIC D 8 2500 340.5 338.1 20.6 LT1004IDR-2-5 SOIC D 8 2500 340.5 338.1 20.6 LT1004IPWR-1-2 TSSOP PW 8 2000 367.0 367.0 35.0 LT1004IPWR-2-5 TSSOP PW 8 2000 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP SEATING PLANE 6.2 PIN 1 ID A 0.1 C AREA 6X 0.65 8 1 3.1 2X 2.9 NOTE 3 1.95 4 5 0.30 8X 0.19 4.5 1.2 MAX B 0.1 C A B 4.3 NOTE 4 (0.15) TYP SEE DETAIL A 0.25 GAGE PLANE 0.15 0.75 0 - 8 0.05 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) 1 TYP 8 SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOOPLEDNEINRG MASK METAL MSOELTDAEL RU NMDAESRK SOOPLEDNEINRG MASK 0.05 MAX 0.05 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) SYMM (R0.05) TYP 8X (0.45) 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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