SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.1/11 CHIP COIL (CHIP INDUCTORS) LQW2BAS□□□□00L REFERENCE SPECIFICATION 1. Scope This Reference specification applies to LQW2BAS_00 series, Chip coil (Chip Inductors). 2. Part Numbering (ex) LQ W 2B A S 2N8 J 0 0 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and L:Taping Characteristics ∗B:Bulk ∗Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3. Rating ・Operating Temperature Range –55°C ~ +125°C ・Storage Temperature Range. –55°C ~ +125°C Customer MURATA Part Inductance Q DC Self Resonant Rated Resistance Frequency Current Part Number Number (nH) Tolerance (min.) (Ω max.) (MHz min.) (mA) LQW2BAS2N7J00L 2.7 0.03 15000 910 80 LQW2BAS2N8J00L 2.8 0.06 12200 800 LQW2BAS3N0J00L 3.0 65 LQW2BAS5N6J00L 5.6 J：±5% 0.08 5900 LQW2BAS6N0J00L 6.0 70 0.03 4500 LQW2BAS6N8J00L 6.8 0.11 5600 LQW2BAS7N5J00L 7.5 0.14 4800 50 LQW2BAS8N2G00L 8.2 0.12 4400 LQW2BAS8N2J00L LQW2BAS10NG00L 10 60 0.10 4300 600 LQW2BAS10NJ00L LQW2BAS12NG00L 12 0.15 4000 LQW2BAS12NJ00L LQW2BAS15NG00L 15 50 0.17 3200 LQW2BAS15NJ00L G：±2% LQW2BAS18NG00L J：±5% 18 0.20 3100 LQW2BAS18NJ00L LQW2BAS22NG00L 22 55 2600 LQW2BAS22NJ00L 0.22 LQW2BAS24NG00L 24 50 2400 LQW2BAS24NJ00L LQW2BAS27NG00L 27 55 0.25 2580 LQW2BAS27NJ00L LQW2BAS33NG00L 33 60 2150 LQW2BAS33NJ00L 0.27 LQW2BAS36NG00L 36 55 1900 LQW2BAS36NJ00L 500 LQW2BAS39NG00L 39 0.29 2000 LQW2BAS39NJ00L LQW2BAS43NG00L 43 0.34 1800 LQW2BAS43NJ00L LQW2BAS47NG00L 47 60 0.31 1700 LQW2BAS47NJ00L G：±2% LQW2BAS56NG00L J：±5% 56 0.34 1600 LQW2BAS56NJ00L LQW2BAS68NG00L 68 0.38 1500 LQW2BAS68NJ00L LQW2BAS82NG00L 82 0.42 LQW2BAS82NJ00L 1330 LQW2BAS91NG00L 91 65 0.48 400 LQW2BAS91NJ00L LQW2BASR10G00L 100 0.46 1250 LQW2BASR10J00L MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.2/11 Customer MURATA Part Inductance Q DC Self Resonant Rated Resistance Frequency Current Part Number Number (nH) Tolerance (min.) (Ω max.) (MHz min.) (mA) LQW2BASR11G00L 110 0.48 LQW2BASR11J00L 1100 LQW2BASR12G00L 120 0.51 LQW2BASR12J00L LQW2BASR15G00L 150 50 0.56 400 LQW2BASR15J00L 920 LQW2BASR18G00L 180 0.64 LQW2BASR18J00L G：±2% LQW2BASR22G00L J：±5% 220 0.70 820 LQW2BASR22J00L LQW2BASR24G00L 240 44 770 LQW2BASR24J00L 1.00 350 LQW2BASR27G00L 270 730 LQW2BASR27J00L LQW2BASR33G00L 48 330 1.40 650 310 LQW2BASR33J00L LQW2BASR39J00L 390 1.50 600 290 LQW2BASR47J00L 470 33 1.76 300 250 LQW2BASR56J00L 560 1.90 270 230 J：±5% LQW2BASR68J00L 680 2.20 250 190 23 LQW2BASR82J00L 820 2.35 230 180 LQW2BAS1R0J00L 1000 2.40 200 170 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C±2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions 2.09±0.2 1.53±0.2 ■Unit Mass (Typical value) 0.014g 5 1 0.1 ±0. ± 5 2 2 1.4 0. 1.5±0.2 (in mm) 0.5±0.1 MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.3/11 6. Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment：KEYSIGHT 4287A or equivalent Measuring Frequency： <Inductance> 250MHz / 2.7nH～ 39nH 200MHz / 43nH～ 68nH 150MHz / 82nH～ 120nH 100MHz / 150nH～ 390nH 50MHz / 470nH 25MHz / 560nH～1000nH <Q> 1500MHz / 2.7nH～ 3.0nH 1000MHz / 5.6nH～ 8.2nH 500MHz / 10nH～ 100nH 250MHz / 110nH～ 390nH 100MHz / 470nH 50MHz / 560nH～1000nH Measuring Condition：Test signal level / about 0dBm Electrode spaces / 2.0 mm Electrical length / 10.0mm 6.2 Q Q shall meet item 3. Weight / about 1N~3N Measuring Fixture：KEYSIGHT 16197A Position coil under test as shown in below and contact coil with each terminal by adding weight. 1.5mm Measuring Method：See the endnote. <Electrical Performance：Measuring Method of Inductance / Q> 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment：Digital multi meter 6.4 Self Resonant S.R.F shall meet item 3. Measuring Equipment：KEYSIGHT 8753C or equivalent Frequency(SRF) 6.5 Rated Current Self temperature rise shall be The rated current is applied. limited to 40°C max. MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.4/11 7. Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged Substrate：Glass-epoxy substrate after tested as test method. 2.8 Chip Coil Pattern Solder resist Substrate 1.78 (in mm) 0.76 Applied Direction： Chip Coil F Substrate Force：10N Hold Duration：5s±1s 7.2 Bending Test Substrate：Glass-epoxy substrate (100mm×40mm×1.0mm) Speed of Applying Force：1mm / s Deflection：3mm Hold Duration：5s Pressurejig R230 F Deflection 45 45 Product (inmm) 7.3 Vibration Oscillation Frequency：10Hz~2000Hz~10Hz for 15 min Total amplitude 3 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time：A period of 2 hours in each of 3 mutually perpendicular directions.(Total 6hours) 7.4 Solderability The wetting area of the electrode Flux：Ethanol solution of rosin, 25(wt)% Includes shall be at least 90% covered with activator equivalent to 0.06(wt)% chlorine. new solder coating. (immersed for 5s to 10s) Solder：Sn-3.0Ag-0.5Cu Pre-Heating：150°C±10°C / 60s to 90s Solder Temperature：240°C±5°C Immersion Time：3s±1s 7.5 Resistance to Appearance：No damage Flux：Ethanol solution of rosin, 25(wt)% Includes Soldering Heat Inductance Change：within ±5% activator equivalent to 0.06(wt)% chlorine. (immersed for 5s to 10s) Solder：Sn-3.0Ag-0.5Cu Pre-Heating：150°C±10°C / 60s to 90s Solder Temperature：270°C±5°C Immersion Time：10s±1s Then measured after exposure in the room condition for 24h±2h. MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.5/11 8. Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 8.1 Heat Resistance Appearance：No damage Temperature：125°C±2°C Inductance Change：within ±5% Time：1000h (+48h,0h) Q Change：within ±20% Then measured after exposure in the room condition for 24h±2h. 8.2 Cold Resistance Temperature：-55°C±2°C Time：1000h (+48h,-0h) Then measured after exposure in the room condition for 24±2 h. 8.3 Humidity Temperature：85°C±2°C Humidity：85%(RH) Time：1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. 8.4 Temperature 1 cycle： Cycle 1 step：-55°C±2°C / 30min±3 min 2 step：Ordinary temp. / 10min to 15 min 3 step：+125°C±2°C / 30min±3 min 4 step：Ordinary temp. / 30min±3 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 9. Specification of Packaging 9.1 Appearance and Dimensions of plastic tape (8mm-wide, 4mm-pitch) φ1.5+-00.1 1.75±0.1 0.25±0.05 5 0.0 ± 3 3±0.1 3.5 8.0±0. 2. (in mm) 4.0±0.1 4.0±0.1 11..585±±00.1.1 2.0±0.05 引き出し方向 11..615±±00..11 Direction of feed ・Dimension of the Cavity is measured at the bottom side. 9.2 Specification of Taping (1) Packing quantity (standard quantity) 2,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole Sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Pull Strength Plastic tape 5N min. Cover tape 10N min. MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.6/11 9.4 Peeling off force of cover tape Speed of Peeling off 300mm / min 165to180degree F Covertape 0.1N to 0.6N Peeling off force (minimum value is typical) Plastictape 9.5 Dimensions of Leader-tape,Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. Trailer 160min. Leader 2.0±0.5 Label 190min . 210min. Emptytape Covertape φ13.0±0.2 φ60+-10 Directionoffeed φ21.0±0.8 9.0+1 -0 13.0±1.4 φ180+-30 (in mm) 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) <Expression of Inspection No.> □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) , Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions (mm) Standard Reel Quantity Label W D H in Outer Case (Reel) 186 186 93 5 H ∗ Above Outer Case size is typical. It depends on a quantity D of an order. W 10. Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.7/11 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Recommended land patterns for reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. 2.8 Chip Coil Pattern Solder resist Substrate 1.78 (in mm) 0.76 11.2 Flux, Solder ・Use rosin-based flux. Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm to 150μm. 11.3 Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ･Reflow soldering profile Temp. 260℃ (℃) 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C～180°C 、90s±30s Heating above 220°C､30s～60s above 230°C､60s max. Peak temperature 245°C±3°C 260°C,10s Cycle of reflow 2 times 2 times MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.8/11 11.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Time 2 times Note：Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・ Solder shall be used not to be exceed the upper limits as shown below. ・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. UUppppeerr LLiimmiitt RReeccoommmmeennddaabbllee((tt)) 1/2T≦t≦T TT ⇔⇔ T：thickness of electrode 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways direction (Length:a＜b) to the mechanical b stress. 〈Poor example〉 〈Goodexample〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to A > D ∗1 the board separation surface. (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from A > C the board separation surface. C Seam B ∗1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to D the PCB, therefore A > D is invalid. b A Slit Length:a<b a (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs Screw Hole Recommended during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.9/11 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 11.10 Notice of product handling at mounting In some mounting machines,when picking up components support pin pushes up the components from the bottom of plastic tape. In this case, please remove the support pin. The support pin may damage the components and break wire. 11.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.13 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10°C to 40°C Humidity : 15% to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.10/11 12. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the agreed specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. < Electrical Performance:Measuring Method of Inductance / Q > To keep compatibility to other vender’s product, Inductance and Q value shall be measured in following method. (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I1 I2 A B Zm V1 C D V2 Zx VI 11 = CA BD VI 22 Test Head Test fixture Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. Zm= V1 ， Zx= V2 I 1 I 2 (3) Thus,the relation between Zx and Zm is following； Zm-β where, α= D / A =1 Zx= α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm： measured impedance of short chip Zss ： residual impedance of short chip (=equivalent series Inductance X) Yom： measured admittance when opening the fixture Important：X：Zss shall be defined as correction value to fit nominal inductance of other venders’ products. Please input X value instead of equivalent series Inductance (Short L) on test equipment calibration. (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Lx= , Qx = f：Measuring frequency 2πf Re(Zx) Inductance and Q value shall be measured after this calibration setting. In addition, Q value should be measured under our standard calibration setting of residual impedance, 0.771nH. MURATA MFG.CO.,LTD

SpecNo.JELF243A-0084N-01 R e f e r e n c e O n l y P.11/11 Chart. equivalent series Inductance to fit nominal inductance of other venders’ products. Inductance MURATA Part Number X [nH] Measuring equivalent series Frequency Inductance LQW2BAS2N7_00 0.121 250 LQW2BAS2N8_00 0.171 250 LQW2BAS3N0_00 0.131 250 LQW2BAS5N6_00 -0.009 250 LQW2BAS6N0_00 0.031 250 LQW2BAS6N8_00 0.301 250 LQW2BAS7N5_00 -0.299 250 LQW2BAS8N2_00 0.271 250 LQW2BAS10N_00 -0.229 250 LQW2BAS12N_00 0.371 250 LQW2BAS15N_00 0.051 250 LQW2BAS18N_00 -0.029 250 LQW2BAS22N_00 0.491 250 LQW2BAS24N_00 -0.389 250 LQW2BAS27N_00 0.931 250 LQW2BAS33N_00 0.481 250 LQW2BAS36N_00 0.531 250 LQW2BAS39N_00 0.771 250 LQW2BAS43N_00 -0.689 200 LQW2BAS47N_00 1.091 200 LQW2BAS56N_00 0.331 200 LQW2BAS68N_00 0.811 200 LQW2BAS82N_00 -0.839 150 LQW2BAS91N_00 -1.339 150 LQW2BASR10_00 0.171 150 LQW2BASR11_00 1.371 150 LQW2BASR12_00 -1.629 150 LQW2BASR15_00 -0.029 100 LQW2BASR18_00 4.071 100 LQW2BASR22_00 0.771 100 LQW2BASR24_00 3.071 100 LQW2BASR27_00 -1.429 100 LQW2BASR33_00 4.071 100 LQW2BASR39_00 0.971 100 LQW2BASR47_00 -8.829 50 LQW2BASR56_00 -8.229 25 LQW2BASR68_00 -2.229 25 LQW2BASR82_00 -8.029 25 LQW2BAS1R0_00 -6.329 25 MURATA MFG.CO.,LTD