Reference Only Spec No.JELF243A-0050AA-01 P.1/14 CHIP COIL (CHIP INDUCTORS) LQW15AN□□□□00D Reference Specification 1.Scope This Reference Specification applies to LQW15AN_00 series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ W 15 A N 1N5 B 0 0 D Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and D:Taping Characteristics *B:Bulk * Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature Range. –55°C ~ +125°C ・Storage Temperature Range. –55°C ~ +125°C Self Inductance DC Rated Customer MURATA Q Resonant Part Number Part Number (nH) Tolerance (min.) R(eΩs imstaaxn.c)e (FGreHqzu meninc.y) C(umrAre)n t LQW15AN1N5B00D B:±0.1nH LQW15AN1N5C00D 1.5 C:±0.2nH 0.03 18.0 1000 LQW15AN1N5D00D D:±0.5nH LQW15AN1N6C00D 1.6 0.07 750 LQW15AN1N6D00D 10 17.0 LQW15AN1N7C00D C:±0.2nH 1.7 0.10 640 LQW15AN1N7D00D D:±0.5nH LQW15AN1N8C00D 1.8 0.16 16.0 460 LQW15AN1N8D00D LQW15AN2N4B00D LQW15AN2N4C00D 2.4 LQW15AN2N4D00D LQW15AN2N5B00D LQW15AN2N5C00D 2.5 LQW15AN2N5D00D LQW15AN2N6B00D LQW15AN2N6C00D 2.6 0.05 850 LQW15AN2N6D00D LQW15AN2N7B00D LQW15AN2N7C00D 2.7 15.0 LQW15AN2N7D00D 20 LQW15AN2N8B00D LQW15AN2N8C00D 2.8 LQW15AN2N8D00D LQW15AN2N9B00D LQW15AN2N9C00D 2.9 B:±0.1nH LQW15AN2N9D00D C:±0.2nH 0.07 750 LQW15AN3N0B00D D:±0.5nH LQW15AN3N0C00D 3.0 LQW15AN3N0D00D LQW15AN3N1B00D LQW15AN3N1C00D 3.1 0.13 570 LQW15AN3N1D00D 14.0 LQW15AN3N2B00D LQW15AN3N2C00D 3.2 15 0.17 500 LQW15AN3N2D00D LQW15AN3N9B00D LQW15AN3N9C00D 3.9 LQW15AN3N9D00D LQW15AN4N1B00D LQW15AN4N1C00D 4.1 25 0.07 10.0 750 LQW15AN4N1D00D LQW15AN4N3B00D LQW15AN4N3C00D 4.3 LQW15AN4N3D00D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.2/14 Self Inductance DC Rated Customer MURATA Q Resonant Part Number Part Number (min.) Resistance Frequency Current (nH) Tolerance (Ω max.) (GHz min.) (mA) LQW15AN4N4B00D LQW15AN4N4C00D 4.4 LQW15AN4N4D00D LQW15AN4N5B00D LQW15AN4N5C00D 4.5 LQW15AN4N5D00D LQW15AN4N6B00D LQW15AN4N6C00D 4.6 0.07 750 LQW15AN4N6D00D LQW15AN4N7B00D LQW15AN4N7C00D 4.7 LQW15AN4N7D00D LQW15AN4N8B00D LQW15AN4N8C00D 4.8 LQW15AN4N8D00D 8.0 LQW15AN4N9B00D LQW15AN4N9C00D 4.9 LQW15AN4N9D00D LQW15AN5N0B00D LQW15AN5N0C00D 5.0 0.12 600 LQW15AN5N0D00D LQW15AN5N1B00D B:±0.1nH LQW15AN5N1C00D 5.1 C:±0.2nH LQW15AN5N1D00D D:±0.5nH LQW15AN5N8B00D LQW15AN5N8C00D 5.8 LQW15AN5N8D00D LQW15AN6N2B00D LQW15AN6N2C00D 6.2 LQW15AN6N2D00D 25 LQW15AN6N3B00D LQW15AN6N3C00D 6.3 LQW15AN6N3D00D LQW15AN6N4B00D LQW15AN6N4C00D 6.4 LQW15AN6N4D00D 0.09 700 LQW15AN6N5B00D LQW15AN6N5C00D 6.5 LQW15AN6N5D00D LQW15AN6N6B00D LQW15AN6N6C00D 6.6 LQW15AN6N6D00D LQW15AN6N7B00D LQW15AN6N7C00D 6.7 LQW15AN6N7D00D 6.0 LQW15AN6N8G00D LQW15AN6N8H00D 6.8 LQW15AN6N8J00D LQW15AN6N9G00D LQW15AN6N9H00D 6.9 LQW15AN6N9J00D LQW15AN7N0G00D G:±2% LQW15AN7N0H00D 7.0 H:±3% LQW15AN7N0J00D J:±5% 0.13 570 LQW15AN7N1G00D LQW15AN7N1H00D 7.1 LQW15AN7N1J00D LQW15AN7N2G00D LQW15AN7N2H00D 7.2 LQW15AN7N2J00D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.3/14 Self Customer MURATA Inductance Q DC Resonant Rated Part Number Part Number (min.) Resistance Frequency Current (nH) Tolerance (Ω max.) (GHz min.) (mA) LQW15AN7N3G00D LQW15AN7N3H00D 7.3 LQW15AN7N3J00D 0.13 6.0 570 LQW15AN7N5G00D LQW15AN7N5H00D 7.5 LQW15AN7N5J00D LQW15AN8N2G00D LQW15AN8N2H00D 8.2 LQW15AN8N2J00D LQW15AN8N6G00D LQW15AN8N6H00D 8.6 LQW15AN8N6J00D LQW15AN8N7G00D LQW15AN8N7H00D 8.7 LQW15AN8N7J00D LQW15AN8N8G00D LQW15AN8N8H00D 8.8 LQW15AN8N8J00D LQW15AN8N9G00D LQW15AN8N9H00D 8.9 LQW15AN8N9J00D LQW15AN9N0G00D LQW15AN9N0H00D 9.0 LQW15AN9N0J00D LQW15AN9N1G00D LQW15AN9N1H00D 9.1 LQW15AN9N1J00D 25 LQW15AN9N2G00D LQW15AN9N2H00D 9.2 0.14 540 G:±2% LQW15AN9N2J00D H:±3% LQW15AN9N3G00D J:±5% LQW15AN9N3H00D 9.3 LQW15AN9N3J00D 5.5 LQW15AN9N4G00D LQW15AN9N4H00D 9.4 LQW15AN9N4J00D LQW15AN9N5G00D LQW15AN9N5H00D 9.5 LQW15AN9N5J00D LQW15AN9N6G00D LQW15AN9N6H00D 9.6 LQW15AN9N6J00D LQW15AN9N7G00D LQW15AN9N7H00D 9.7 LQW15AN9N7J00D LQW15AN9N8G00D LQW15AN9N8H00D 9.8 LQW15AN9N8J00D LQW15AN9N9G00D LQW15AN9N9H00D 9.9 LQW15AN9N9J00D LQW15AN10NG00D LQW15AN10NH00D 10 0.17 LQW15AN10NJ00D LQW15AN11NG00D LQW15AN11NH00D 11 500 LQW15AN11NJ00D 30 0.14 LQW15AN12NG00D LQW15AN12NH00D 12 LQW15AN12NJ00D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.4/14 Self Inductance DC Rated Customer MURATA Q Resonant Part Number Part Number (min.) Resistance Frequency Current (nH) Tolerance (Ω max.) (GHz min.) (mA) LQW15AN13NG00D LQW15AN13NH00D 13 25 0.21 430 LQW15AN13NJ00D 5.0 LQW15AN15NG00D LQW15AN15NH00D 15 30 0.16 460 LQW15AN15NJ00D LQW15AN16NG00D LQW15AN16NH00D 16 0.24 LQW15AN16NJ00D LQW15AN18NG00D LQW15AN18NH00D 18 4.5 LQW15AN18NJ00D 370 LQW15AN19NG00D LQW15AN19NH00D 19 0.27 LQW15AN19NJ00D LQW15AN20NG00D LQW15AN20NH00D 20 LQW15AN20NJ00D 4.0 LQW15AN22NG00D LQW15AN22NH00D 22 LQW15AN22NJ00D 0.30 310 LQW15AN23NG00D LQW15AN23NH00D 23 3.8 LQW15AN23NJ00D LQW15AN24NG00D LQW15AN24NH00D 24 LQW15AN24NJ00D 0.52 3.5 280 LQW15AN27NG00D LQW15AN27NH00D 27 G:±2% LQW15AN27NJ00D H:±3% LQW15AN30NG00D J:±5% LQW15AN30NH00D 30 25 0.58 3.3 270 LQW15AN30NJ00D LQW15AN33NG00D LQW15AN33NH00D 33 3.2 LQW15AN33NJ00D 0.63 260 LQW15AN36NG00D LQW15AN36NH00D 36 3.1 LQW15AN36NJ00D LQW15AN39NG00D LQW15AN39NH00D 39 LQW15AN39NJ00D LQW15AN40NG00D LQW15AN40NH00D 40 0.70 3.0 250 LQW15AN40NJ00D LQW15AN43NG00D LQW15AN43NH00D 43 LQW15AN43NJ00D LQW15AN47NG00D LQW15AN47NH00D 47 2.9 LQW15AN47NJ00D 1.08 210 LQW15AN51NG00D LQW15AN51NH00D 51 2.85 LQW15AN51NJ00D LQW15AN56NG00D LQW15AN56NH00D 56 1.17 2.8 200 LQW15AN56NJ00D LQW15AN62NG00D LQW15AN62NH00D 62 20 1.82 2.6 145 LQW15AN62NJ00D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.5/14 Self Inductance DC Rated Customer MURATA Q Resonant Resistance Current Part Number Part Number (min.) Frequency (nH) Tolerance (Ω max.) (GHz min.) (mA) LQW15AN68NG00D 68 1.96 140 LQW15AN68NJ00D 2.5 LQW15AN72NG00D 72 LQW15AN72NJ00D 2.10 135 LQW15AN75NG00D G:±2% 75 2.4 LQW15AN75NJ00D J:±5% 20 LQW15AN82NG00D 82 2.24 2.3 130 LQW15AN82NJ00D LQW15AN91NG00D 91 2.38 2.1 125 LQW15AN91NJ00D LQW15ANR10J00D 100 2.52 1.5 120 J:±5% LQW15ANR12J00D 120 2.66 1.0 110 4. Testing Conditions 《Unless otherwise specified》 《In case of doub t》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C±2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions 1.0±0.1 W ■Unit mass (Typical value) 0.0008g 0.5±0.1 5 0.0 0.5±0.1 ± 1 0. 0.2±0.1 0.2±0.1 (in mm) *Dimension of W Inductance W (in mm) 1N5～23N 0.6±0.1 24N～R12 0.5±0.1 MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.6/14 6.Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent Measuring Frequency: <Inductance> 100MHz <Q> 250MHz/ 1.5nH~43nH 200MHz/ 47nH~68nH 150MHz/ 72nH~120nH Measuring Condition: Test signal level / about 0dBm Electrical length / 0.94cm Measuring Fixture: KEYSIGHT 16193A Position coil under test as shown in below and contact coil with each terminal by adding weight. 6.2 Q Q shall meet item 3. 0.5mm Measuring Method: See the endnote. <Electrical Performance:Measuring Method of Inductance/Q> 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter 6.4 Self Resonant S.R.F shall meet item 3. Measuring Equipment:KEYSIGHT N5230A Frequency(S.R.F) or equivalent 6.5 Rated Current Self temperature rise shall be The rated current is applied. limited to 20°C max. 7.Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged Substrate:Glass-epoxy substrate after tested as test method. ChipCoil 1.2 Pattern Solderresist Substrate 0.65 0.5 (in mm) Applied Direction: Chip Coil F Substrate Force:5N Hold Duration:5s±1s 7.2 Bending Test Substrate:Glass-epoxy substrate (100mm×40mm×0.8mm) Speed of Applying Force:1mm / s Deflection:2mm Hold Duration:5s Pressurejig R340 F Deflection 45 45 Produ c t (in mm) MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.7/14 No. Item Specification Test Method 7.3 Vibration Chip coil shall not be damaged Oscillation Frequency: after tested as test method. 10Hz~55Hz~10Hz for 1 min Total Amplitude:1.5mm Testing Time: A period of 2 hours in each of mutually perpendicular directions. 7.4 Solderability The wetting area of the electrode Flux:Ethanol solution of rosin,25(wt)% shall be at least 90% covered with Includes activator equivalent to 0.06(wt)% new solder coating. chlorine.(immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:240°C±5°C Immersion Time:3s±1s 7.5 Resistance to Appearance:No damage Flux:Ethanol solution of rosin,25(wt)% Soldering Heat Inductance Change: within ±5% Includes activator equivalent to 0.06(wt)% Chlorine.(immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:270°C±5°C Immersion Time:10s±1s Then measured after exposure in the room condition for 24h±2h. 8.Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 8.1 Heat Resistance Appearance:No damage Temperature:125°C±2°C Inductance Change: within ±5% Time:1000h (+48h,0h) Q Change: within ±20% Then measured after exposure in the room condition for 24h±2h. 8.2 Cold Resistance Temperature:-55°C±2°C Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2 h. 8.3 Humidity Temperature:70°C±2°C Humidity:90%(RH) to 95%(RH) Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. 8.4 Temperature 1 cycle: Cycle 1 step:-55°C±2°C / 30min±3 min 2 step:Ordinary temp. / 10min to 15 min 3 step:+125°C±2°C / 30min±3 min 4 step:Ordinary temp. / 10min to15 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.8/14 9.Specification of Packaging 9.1 Appearance and Dimensions of paper tape (8mm-wide) 2.0±0.05 4.0±0.1 φ1.5±00.1 1.75±0.1 5 03 5±0.0 0.2 B0. 3. 0± 8± 8. 1 1. A 2.0±0.05 0 . 8 m a x . (in mm) Direction of feed A* (mm) B* (mm) Inductance (Tolerance ±0.03) (Tolerance ±0.03) 1N5, 2N4～2N8, 3N9～4N8, 5N8～6N8, 8N2～9N9, 11N, 12N, 15N 0.69 1.18 1N6～1N8, 2N9, 3N0, 3N1, 3N2, 4N9～5N1, 6N9-7N5, 10N, 13N, 0.66 1.18 16N～23N, R10, R12 24N～91N 0.64 1.18 ＊Typical value 9.2 Specification of Taping (1) Packing quantity (standard quantity) 10,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by Cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Cover tape 5N min. 9.4 Peeling off force of cover tape Covertape Speed of Peeling off 300mm/min 165°to180゜ F 0.1 to 0.6N Peeling off force (minimum value is typical) Basetape 9.5 Dimensions of Leader-tape,Trailer and Reel There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows. Trailer 2.0±0.5 160min. Leader Label 190min. 210m in. Emptytape Covertape φ13.0±0.2 φ60+-10 φ21.0±0.8 Directionoffeed 9.0+1 -0 13.0±1.4 (in mm) φ180+-30 MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.9/14 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) ,RoHS Marking(∗2), Quantity etc ･･･ ∗1) <Expression of Inspection No.> □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) <Expression of RoHS Marking > ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions Standard Reel Quantity (mm) Label in Outer Case (Reel) W D H H 186 186 93 5 D W ∗ Above Outer Case size is typical. It depends on a quantity of an order. 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Recommended land patterns for reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. ChipCoil Land c a 0.50 Solderresist b 1.2 c 0.65 (in mm) a b MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.10/14 11.2 Flux, Solder ・Use rosin-based flux. Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine. Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm to 150μm. 11.3 Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile T(e℃mp). 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C～180°C 、90s±30s Heating above 220°C､30s～60s above 230°C､60s max. Peak temperature 245°C±3°C 260°C,10s Cycle of reflow 2 times 2 times 11.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Time 2 times Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. UUppppeerr LLiimmiitt RReeccoommmmeennddaabbllee((tt)) 1/3T≦t≦T TT ⇔⇔ T：thickness of product MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.11/14 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways b direction (Length:a＜b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C C Seam B D b A Slit Length:a<b a *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.12/14 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 11.10 Notice of product handling at mounting In some mounting machines,when picking up components support pin pushes up the components from the bottom of base tape. In this case, please remove the support pin. The support pin may damage the components and break wire. In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser recognition. (There is no problem with the permeation and reflection type.) 11.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.13/14 11.12 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity ・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12． ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0050AA-01 P.14/14 < Electrical Performance:Measuring Method of Inductance/Q> (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I1 I2 A B V A B V Zm V1 V2 Zx I 11 = C D I 22 C D Test Head Test fixture Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. V V Zm= 1 ， Zx= 2 I 1 I 2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm : measured impedance of short chip Zssa: residual impedance of short chip (0.556nH) Yom: measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Lx :Inductance of chip coil Lx= , Qx = 2πf Re(Zx) Qx :Q of chip coil f :Measuring frequency MURATA MFG.CO.,LTD