Reference Only Spec No.JELF243A-0100F-01 P.1/15 CHIP COIL (CHIP INDUCTORS) LQW15AN□□□□80D Reference Specification 1.Scope This Reference Specification applies to LQW15AN_80 series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ W 15 A N 1N3 C 8 0 D Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and D:Taping Characteristics *B:Bulk * Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature Range. –55°C ~ +125°C ・Storage Temperature Range. –55°C ~ +125°C Self Inductance DC Rated Customer MURATA Q Resonant Resistance Current Part Number Part Number (min.) Frequency (nH) Tolerance (Ω max.) (GHz min.) (mA) LQW15AN1N3C80D 1.3 0.012 3150 LQW15AN1N3D80D LQW15AN1N5C80D 1.5 0.028 2100 LQW15AN1N5D80D C:±0.2nH 20 18.0 LQW15AN1N6C80D D:±0.5nH 1.6 0.045 1450 LQW15AN1N6D80D LQW15AN1N7C80D 1.7 0.065 1150 LQW15AN1N7D80D LQW15AN2N2B80D LQW15AN2N2C80D 2.2 LQW15AN2N2D80D LQW15AN2N2G80D LQW15AN2N3B80D LQW15AN2N3C80D 2.3 0.022 2530 LQW15AN2N3D80D LQW15AN2N3G80D 15.5 LQW15AN2N4B80D LQW15AN2N4C80D 2.4 30 LQW15AN2N4D80D LQW15AN2N4G80D LQW15AN2N5B80D LQW15AN2N5C80D 2.5 0.030 2100 LQW15AN2N5D80D B:±0.1nH LQW15AN2N5G80D C:±0.2nH LQW15AN2N6B80D D:±0.5nH LQW15AN2N6C80D G:±2% 2.6 0.035 14.5 1950 LQW15AN2N6D80D LQW15AN2N6G80D LQW15AN2N7B80D LQW15AN2N7C80D 2.7 28 14.0 LQW15AN2N7D80D LQW15AN2N7G80D LQW15AN2N8B80D LQW15AN2N8C80D 2.8 27 0.047 13.5 1500 LQW15AN2N8D80D LQW15AN2N8G80D LQW15AN2N9B80D LQW15AN2N9C80D 2.9 25 12.5 LQW15AN2N9D80D LQW15AN2N9G80D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.2/15 Self Inductance DC Rated Customer MURATA Q Resonant Resistance Current Part Number Part Number (min.) Frequency (nH) Tolerance (Ω max.) (mA) (GHz min.) LQW15AN3N0B80D LQW15AN3N0C80D 3.0 20 0.063 12.5 1350 LQW15AN3N0D80D LQW15AN3N0G80D LQW15AN3N3B80D LQW15AN3N3C80D 3.3 14.0 2000 LQW15AN3N3D80D LQW15AN3N3G80D LQW15AN3N4B80D LQW15AN3N4C80D 3.4 LQW15AN3N4D80D LQW15AN3N4G80D 30 0.030 LQW15AN3N5B80D LQW15AN3N5C80D 3.5 10.0 1950 LQW15AN3N5D80D LQW15AN3N5G80D LQW15AN3N6B80D LQW15AN3N6C80D 3.6 LQW15AN3N6D80D LQW15AN3N6G80D LQW15AN3N7B80D LQW15AN3N7C80D 3.7 LQW15AN3N7D80D LQW15AN3N7G80D LQW15AN3N8B80D B:±0.1nH LQW15AN3N8C80D C:±0.2nH 3.8 35 LQW15AN3N8D80D D:±0.5nH LQW15AN3N8G80D G:±2% 0.030 10.0 1950 LQW15AN3N9B80D LQW15AN3N9C80D 3.9 LQW15AN3N9D80D LQW15AN3N9G80D LQW15AN4N0B80D LQW15AN4N0C80D 4.0 LQW15AN4N0D80D LQW15AN4N0G80D LQW15AN4N1B80D LQW15AN4N1C80D 4.1 30 LQW15AN4N1D80D LQW15AN4N1G80D LQW15AN4N2B80D LQW15AN4N2C80D 4.2 0.044 1800 LQW15AN4N2D80D LQW15AN4N2G80D 9.6 LQW15AN4N3B80D LQW15AN4N3C80D 4.3 32 LQW15AN4N3D80D LQW15AN4N3G80D LQW15AN4N4B80D LQW15AN4N4C80D 4.4 34 0.052 1600 LQW15AN4N4D80D LQW15AN4N4G80D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.3/15 Self Inductance DC Rated Customer MURATA Q Resonant Resistance Current Part Number Part Number (min.) Frequency (nH) Tolerance (Ω max.) (mA) (GHz min.) LQW15AN4N5B80D LQW15AN4N5C80D 4.5 34 LQW15AN4N5D80D LQW15AN4N5G80D 0.060 9.6 1450 LQW15AN4N6B80D LQW15AN4N6C80D 4.6 32 LQW15AN4N6D80D LQW15AN4N6G80D LQW15AN4N7B80D LQW15AN4N7C80D 4.7 31 LQW15AN4N7D80D LQW15AN4N7G80D LQW15AN4N8B80D LQW15AN4N8C80D 4.8 30 0.071 8.0 1200 LQW15AN4N8D80D LQW15AN4N8G80D LQW15AN4N9B80D LQW15AN4N9C80D 4.9 27 LQW15AN4N9D80D LQW15AN4N9G80D LQW15AN5N0B80D LQW15AN5N0C80D 5.0 32 10.0 LQW15AN5N0D80D LQW15AN5N0G80D LQW15AN5N1B80D LQW15AN5N1C80D 5.1 LQW15AN5N1D80D B:±0.1nH LQW15AN5N1G80D C:±0.2nH LQW15AN5N2B80D D:±0.5nH LQW15AN5N2C80D G:±2% 5.2 LQW15AN5N2D80D LQW15AN5N2G80D LQW15AN5N3B80D LQW15AN5N3C80D 5.3 LQW15AN5N3D80D LQW15AN5N3G80D 35 LQW15AN5N4B80D LQW15AN5N4C80D 5.4 0.040 1770 LQW15AN5N4D80D LQW15AN5N4G80D 8.0 LQW15AN5N5B80D LQW15AN5N5C80D 5.5 LQW15AN5N5D80D LQW15AN5N5G80D LQW15AN5N6B80D LQW15AN5N6C80D 5.6 LQW15AN5N6D80D LQW15AN5N6G80D LQW15AN5N7B80D LQW15AN5N7C80D 5.7 LQW15AN5N7D80D LQW15AN5N7G80D 30 LQW15AN5N8B80D LQW15AN5N8C80D 5.8 LQW15AN5N8D80D LQW15AN5N8G80D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.4/15 Self Inductance DC Rated Customer MURATA Q Resonant Resistance Current Part Number Part Number (min.) Frequency (nH) Tolerance (Ω max.) (mA) (GHz min.) LQW15AN5N9B80D LQW15AN5N9C80D 5.9 30 0.040 1770 LQW15AN5N9D80D LQW15AN5N9G80D 8.0 LQW15AN6N0B80D LQW15AN6N0C80D 6.0 32 0.056 1600 LQW15AN6N0D80D B:±0.1nH LQW15AN6N0G80D C:±0.2nH LQW15AN6N1B80D D:±0.5nH LQW15AN6N1C80D G:±2% 6.1 32 LQW15AN6N1D80D LQW15AN6N1G80D 0.056 8.0 LQW15AN6N2B80D 1600 LQW15AN6N2C80D 6.2 33 LQW15AN6N2D80D LQW15AN6N2G80D LQW15AN6N3G80D 6.3 32 0.057 7.8 LQW15AN6N3J80D LQW15AN6N4G80D 6.4 33 LQW15AN6N4J80D 0.065 1380 LQW15AN6N5G80D 6.5 32 LQW15AN6N5J80D LQW15AN6N6G80D 6.6 7.0 LQW15AN6N6J80D 0.078 1280 LQW15AN6N7G80D 6.7 30 LQW15AN6N7J80D LQW15AN6N8G80D 6.8 0.068 1450 LQW15AN6N8J80D LQW15AN6N9G80D 6.9 32 8.5 LQW15AN6N9J80D LQW15AN7N0G80D 7.0 33 0.069 8.0 1420 LQW15AN7N0J80D LQW15AN7N1G80D 7.1 LQW15AN7N1J80D LQW15AN7N2G80D 7.2 32 LQW15AN7N2J80D G:±2% LQW15AN7N3G80D J:±5% 7.3 LQW15AN7N3J80D LQW15AN7N4G80D 7.4 30 LQW15AN7N4J80D LQW15AN7N5G80D 7.5 35 LQW15AN7N5J80D 7.0 LQW15AN7N6G80D 7.6 0.050 1700 LQW15AN7N6J80D LQW15AN7N7G80D 7.7 LQW15AN7N7J80D LQW15AN7N8G80D 7.8 30 LQW15AN7N8J80D LQW15AN7N9G80D 7.9 LQW15AN7N9J80D LQW15AN8N0G80D 8.0 LQW15AN8N0J80D LQW15AN8N1G80D 8.1 LQW15AN8N1J80D 32 0.069 6.5 1500 LQW15AN8N2G80D 8.2 LQW15AN8N2J80D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.5/15 Self Inductance DC Rated Customer MURATA Q Resonant Resistance Current Part Number Part Number (min.) Frequency (nH) Tolerance (Ω max.) (mA) (GHz min.) LQW15AN8N3G80D 8.3 LQW15AN8N3J80D LQW15AN8N4G80D 8.4 32 0.069 6.5 1500 LQW15AN8N4J80D LQW15AN8N5G80D 8.5 LQW15AN8N5J80D LQW15AN8N6G80D 8.6 LQW15AN8N6J80D LQW15AN8N7G80D 8.7 LQW15AN8N7J80D 31 LQW15AN8N8G80D 8.8 0.070 1420 LQW15AN8N8J80D 6.5 LQW15AN8N9G80D 8.9 LQW15AN8N9J80D LQW15AN9N0G80D 9.0 30 LQW15AN9N0J80D LQW15AN9N1G80D 9.1 0.080 LQW15AN9N1J80D 32 LQW15AN9N2G80D 9.2 LQW15AN9N2J80D LQW15AN9N3G80D 9.3 34 LQW15AN9N3J80D LQW15AN9N4G80D 9.4 33 LQW15AN9N4J80D LQW15AN9N5G80D 9.5 32 LQW15AN9N5J80D LQW15AN9N6G80D G:±2% 9.6 33 0.081 6.0 1400 LQW15AN9N6J80D J:±5% LQW15AN9N7G80D 9.7 33 LQW15AN9N7J80D LQW15AN9N8G80D 9.8 34 LQW15AN9N8J80D LQW15AN9N9G80D 9.9 32 LQW15AN9N9J80D LQW15AN10NG80D 10 31 LQW15AN10NJ80D LQW15AN11NG80D 11 32 0.083 6.2 LQW15AN11NJ80D LQW15AN12NG80D 12 LQW15AN12NJ80D 30 0.093 1240 LQW15AN13NG80D 13 5.2 LQW15AN13NJ80D LQW15AN14NG80D 14 0.111 LQW15AN14NJ80D 1150 LQW15AN15NG80D 15 31 0.114 5.5 LQW15AN15NJ80D LQW15AN16NG80D 16 LQW15AN16NJ80D 0.126 5.0 1000 LQW15AN17NG80D 17 LQW15AN17NJ80D LQW15AN18NG80D 18 30 0.130 5.2 1050 LQW15AN18NJ80D LQW15AN19NG80D 19 0.156 5.0 920 LQW15AN19NJ80D MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.6/15 Self Inductance DC Rated Customer MURATA Q Resonant Resistance Current Part Number Part Number (min.) Frequency (nH) Tolerance (Ω max.) (mA) (GHz min.) LQW15AN20NG80D 20 0.186 800 LQW15AN20NJ80D LQW15AN21NG80D 21 30 LQW15AN21NJ80D 0.202 4.5 780 LQW15AN22NG80D 22 LQW15AN22NJ80D LQW15AN23NG80D 23 29 0.201 760 LQW15AN23NJ80D LQW15AN24NG80D 24 31 0.212 4.0 770 LQW15AN24NJ80D LQW15AN25NG80D 25 31 0.221 750 LQW15AN25NJ80D 4.1 LQW15AN26NG80D 26 29 0.282 720 LQW15AN26NJ80D LQW15AN27NG80D 27 0.288 4.0 680 LQW15AN27NJ80D LQW15AN30NG80D 30 0.309 3.8 660 LQW15AN30NJ80D 30 LQW15AN33NG80D G:±2% 33 0.336 3.6 620 LQW15AN33NJ80D J:±5% LQW15AN36NG80D 36 0.431 3.5 540 LQW15AN36NJ80D LQW15AN39NG80D 39 28 0.456 530 LQW15AN39NJ80D 3.4 LQW15AN43NG80D 43 30 0.516 515 LQW15AN43NJ80D LQW15AN47NG80D 47 0.648 3.2 440 LQW15AN47NJ80D LQW15AN51NG80D 51 LQW15AN51NJ80D 0.696 415 LQW15AN53NG80D 53 2.9 LQW15AN53NJ80D 25 LQW15AN56NG80D 56 0.996 340 LQW15AN56NJ80D LQW15AN68NG80D 68 1.128 2.5 LQW15AN68NJ80D 320 LQW15AN75NG80D 75 1.224 2.4 LQW15AN75NJ80D 100 %) g ( atin er 50 d nt e urr C 0 0 85 125 Tempera.ture (℃) Derating of Rated Current depend on Operating Temperature 4. Testing Conditions 《Unless otherwise specified》 《In case of doub t》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C±2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.7/15 5. Appearance and Dimensions 1.0 ± 0.1 0.5 ± 0.1 0.1± 0.05 ■Unit mass (Typical value) 0.6 ± 0.1 0.0009g 0.2 ± 0.1 (in mm) 6.Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment: KEYSIGHT 4287A or equivalent Measuring Frequency: <Inductance> 100MHz <Q> 250MHz/1.3nH～43nH 200MHz/47nH～75nH Measuring Condition: Test signal level / about 0dBm Electrode spaces / 0.5mm Electrical length / 10mm Weight / about 1N~3N Measuring Fixture: KEYSIGHT 16197A 6.2 Q Q shall meet item 3. Position coil under test as shown in below and contact coil with each terminal by adding weight. 1005 Size Guide Measuring Method:See the endnote. <Electrical Performance:Measuring Method of Inductance/Q> 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter 6.4 Self Resonant S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT 8720C or Frequency(S.R.F) equivalent 6.5 Rated Current Self temperature rise shall be The rated current is applied. limited to 40°C max. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.8/15 7.Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged Substrate:Glass-epoxy substrate after tested as test method. 1.42 ChipCoil 1.2 Pattern Solderresist Substrate 0.605.66 0.5 (in mm) 0.6 Chip Coil Applied Direction: F Substrate Force:5N Hold Duration:5s±1s 7.2 Bending Test Substrate:Glass-epoxy substrate (100mm×40mm×0.8mm) Speed of Applying Force:1mm / s Deflection:2mm Hold Duration:5s Pressurejig R230 F Deflection 45 45 Product (inmm) 7.3 Vibration Oscillation Frequency: 10Hz~55Hz~10Hz for 1 min Total Amplitude:1.5mm Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6hours) 7.4 Solderability The wetting area of the electrode Flux:Ethanol solution of rosin,25(wt)% shall be at least 90% covered with Includes activator equivalent to 0.06(wt)% new solder coating. chlorine.(immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:240°C±5°C Immersion Time:3s±1s 7.5 Resistance to Appearance:No damage Flux:Ethanol solution of rosin,25(wt)% Soldering Heat Inductance Change: within ±5% Includes activator equivalent to 0.06(wt)% Chlorine.(immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:270°C±5°C Immersion Time:10s±1s Then measured after exposure in the room condition for 24h±2h. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.9/15 8.Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 8.1 Heat Resistance Appearance:No damage Temperature:125°C±2°C Inductance Change: within ±5% Time:1000h (+48h,0h) Q Change: within ±20% Then measured after exposure in the room condition for 24h±2h. 8.2 Cold Resistance Temperature:-55°C±2°C Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2 h. 8.3 Humidity Appearance:No damage Temperature:70°C±2°C Inductance Change: within ±5% Humidity:90%(RH) to 95%(RH) Q Change: within ±20% Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. 8.4 Temperature 1 cycle: Cycle 1 step:-55°C±2°C / 30min±3 min 2 step:Ordinary temp. / 10min to 15 min 3 step:+125°C±2°C / 30min±3 min 4 step:Ordinary temp. / 10min to15 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 9.Specification of Packaging 9.1 Appearance and Dimensions of paper tape (8mm-wide) 2.0±0.05 4.0±0.1 φ1.5± 0 1.75±0.1 0.1 5 03 ±0.0 0.2 0±0. 3.5 8.0± 8 1 1. (in mm) 0.75±0.03 2.0±0.05 Direction of feed 0.80 max 9.2 Specification of Taping (1) Packing quantity (standard quantity) 10,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by Cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Cover tape 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off 300mm/min Covertape F 0.1 to 0.6N 165°to180゜ Peeling off force (minimum value is typical) Basetape MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.10/15 9.5 Dimensions of Leader-tape,Trailer and Reel There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows. Trailer 160min. Leader 2.0±0.5 Label 190min. 210min. Emptytape Covertape φ13.0±0.2 φ60+-10 φ21.0±0.8 Directionoffeed 9.0+-01 (in mm) 13.0±1.4 φ180+-30 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) ,RoHS Marking(∗2), Quantity etc ･･･ ∗1) <Expression of Inspection No.> □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) <Expression of RoHS Marking > ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions Standard Reel Quantity (mm) Label in Outer Case (Reel) W D H H 186 186 93 5 D W ∗ Above Outer Case size is typical. It depends on a quantity of an order. 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.11/15 11.1 Land pattern designing Recommended land patterns for reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. ChipCoil Land c a 0.6 Solderresist b 1.42 c 0.66 (in mm) a b 11.2 Flux, Solder ・Use rosin-based flux. Includes middle activator equivalent to 0.06(wt)% to 0.1(wt) % Chlorine. Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 50μm to 100μm. 11.3 Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile T(e℃mp). 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C～180°C 、90s±30s Heating above 220°C､30s～60s above 230°C､60s max. Peak temperature 245°C±3°C 260°C,10s Cycle of reflow 2 times 2 times 11.4 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. UUppppeerr LLiimmiitt RReeccoommmmeennddaabbllee((tt)) 1/3T≦t≦T TT ⇔⇔ T：thickness of product MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.12/15 11.5 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways b direction (Length:a＜b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C C Seam B D b A Slit Length:a<b a *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.13/15 11.6 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.7 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.8 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 11.9 Notice of product handling at mounting In some mounting machines,when picking up components support pin pushes up the components from the bottom of base tape. In this case, please remove the support pin. The support pin may damage the components and break wire. In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser recognition. (There is no problem with the permeation and reflection type.) MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.14/15 11.10Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.11 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity ・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12． ! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243A-0100F-01 P.15/15 < Electrical Performance:Measuring Method of Inductance/Q> (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I1 I2 A B Zm V1 V2 Zx C D V1 = A B V2 Test Head Test fixture Product I 1 C D I 2 (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. V V Zm= 1 Zx= 2 I 1 ， I 2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx=α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0.556nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Lx :Inductance of chip coil Lx= Qx= 2πf ， Re(Zx) Qx:Q of chip coil f :Measuring frequency MURATA MFG.CO.,LTD