Reference Only Spec No.JELF243C-0009J-01 P.1/9 CHIP COIL (CHIP INDUCTORS) LQP18MN□□□□02D Reference Specification 1.Scope This reference specification applies to LQP18MN_02 series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ P 18 M N 1N3 C 0 2 D Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and D:Taping Characteristics *B:Bulk Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature Range. –40°C to +85°C (Ambient temperature : Rated current can be handled in this temperature range.) ・Storage Temperature Range. –40°C to +85°C DC Self Resonant Rated Customer MURATA Inductance Q Resistance Frequency Current Part Number Part Number (nH) Tolerance (min.) (Ω max.) (MHz min.) (mA) LQP18MN1N3C02D 1.3 0.3 300 LQP18MN1N5C02D 1.5 LQP18MN1N8C02D 1.8 6000 LQP18MN2N2C02D 2.2 0.4 250 LQP18MN2N7C02D 2.7 LQP18MN3N3C02D 3.3 ±0.2nH LQP18MN3N9C02D 3.9 5900 0.5 LQP18MN4N7C02D 4.7 5200 200 LQP18MN5N6C02D 5.6 0.6 4700 LQP18MN6N8C02D 6.8 0.7 4300 LQP18MN8N2C02D 8.2 0.8 3600 LQP18MN10NG02D 10 3400 17 1.0 150 LQP18MN12NG02D 12 3000 LQP18MN15NG02D 15 1.3 2700 LQP18MN18NG02D 18 1.5 2300 LQP18MN22NG02D 22 1.9 2100 LQP18MN27NG02D 27 2.4 1900 100 LQP18MN33NG02D 33 ±2% 1700 2.8 LQP18MN39NG02D 39 1400 LQP18MN47NG02D 47 2.2 1200 LQP18MN56NG02D 56 3.4 1000 LQP18MN68NG02D 68 3.5 900 50 LQP18MN82NG02D 82 4.6 800 LQP18MNR10G02D 100 6.1 700 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85 %(RH) Humidity : 60%(RH) to 70 %(RH) Atmospheric Pressure : 86kPa to 106 kPa MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243C-0009J-01 P.2/9 5. Appearance and Dimensions 5 1 0. ± 8 0. ■Unit Mass (Typical value) 1.6±0.15 0.002g 1 0. *The pattern of the coil differs in each ± 5 inductance value. 0. 0.2min. 0.2min. (in mm) 6.Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment: Agilent4291A or equivalent Measuring Frequency: 500MHz / 1.3nH to 39nH 300MHz / 47nH to 100nH Measuring Condition: Test signal level / about 7dBm Electrical length / 0.94cm Weight / about 1N to 5N Measuring Fixture: Agilent 16193A Position coil under test as shown in below and contact coil with each terminal by adding weight. Coil pattern should be a topside, 6.2 Q Q shall meet item 3. and inner end of the coil should be in the direction of the fixture for position of chip coil. 1mm Innerendofthecoil. 6.97mm Measuring Method: See P.9 <Electrical Performance: Measuring Method of Inductance/Q> 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter 6.4 Self Resonant S.R.F shall meet item 3. Measuring Equipment: Frequency(S.R.F) Agilent 8753C or equivalent 6.5 Rated Current Self temperature rise shall be The rated current is applied. limited to 25°C max. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243C-0009J-01 P.3/9 7.Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged Substrate:Glass-epoxy substrate after tested as test method. Land 0.7 (in mm) 1.0 0.6 1.0 Force:10N Hold Duration:5s±1s Applied Direction: Parallel to PCB. ChipCoil F Substrate 7.2 Bending Test Chip coil shall not be damaged Substrate: Glass-epoxy substrate after tested as test method. (100mm×40mm×1.6mm) 7 . 0 40 0.6 2.6 100 Solder resist (in mm) Speed of Applying Force:1mm / s Deflection:2mm Hold Duration:30s Pressurejig R340 F Deflection 45 45 Product (in mm) 7.3 Vibration Appearance: No damage Oscillation Frequency: Inductance Change:±10% within 10Hz to 55Hz to 10Hz for 1 min Total Amplitude:1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. 7.4 Solderability The wetting area of the electrode Flux: Ethanol solution of rosin 25(wt)% shall be at least 95% covered with (Immersed for 5s to 10s) new solder coating. Solder:Sn-3.0Ag-0.5Cu Patternside Pre-Heating:150°C±10°C / 60s to 90s Chipcoil Solder Temperature:240°C±5°C Immersion Time:3s±1s Thewettingareaoftheelectrode MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243C-0009J-01 P.4/9 No. Item Specification Test Method 7.5 Resistance to Appearance: No damage Flux: Ethanol solution of rosin 25(wt)% Soldering Heat Inductance Change:±10% within (Immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:270°C±5°C Immersion Time:10s±1s Then measured after exposure in the room condition for 24h±2h. 8.Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 8.1 Heat Resistance Appearance: No damage Temperature:85°C±2°C Inductance Change:±10% within Time:1000h (+48h.-0h) Then measured after exposure in the room condition for 24h±2h. 8.2 Cold Resistance Temperature:-40°C±2°C Time:1000h (+48h.-0h) Then measured after exposure in the room condition for 24h±2h. 8.3 Humidity Temperature:40°C±2°C Humidity:90%(RH) to 95%(RH) Time:1000h (+48h.-0h) Then measured after exposure in the room condition for 24h±2h. 8.4 Temperature 1 cycle: Cycle 1 step:-40°C±2°C / 30min±3 min 2 step: Ordinary temp. / 10 min to 15 min 3 step:+85°C±2°C / 30min±3 min 4 step: Ordinary temp. / 10min to 15 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 9.Specification of Packaging 9.1 Appearance and Dimensions of paper tape (8mm-wide) Electrodewhichisconnectedtotheinner endof thecoil. 2.0±0.1 4.0±0.1 4.0±0.1 φ1.5±00.1 1.75±0.1 1 . 1 ±0 .3 0. .5 ±0 ± 3 0 0 . . 8 2 1.19±0.1 Directionof feed 0.8max (in mm) 9.2 Specification of Taping (1) Packing quantity (standard quantity) 4,000 pcs / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243C-0009J-01 P.5/9 (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Top tape 5N min. Bottom tape 9.4 Peeling off force of cover tape Top tape 165 to 180 degree F Speed of Peeling off 300mm/min 0.1N to 0.6N Peeling off force (minimum value is typical) Bottomtape Base tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. Trailer 160min. Leader 2.0±0.5 Label 190min. 2 10min. Emptytape To ptape φ13.0±0.2 φ60+-10 Directionoffeed φ21.0±0.8 9.0+1 -0 13.0±1.4 φ180+-30 (in mm) 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking (∗2), Quantity etc ･･･ ∗1) <Expression of Inspection No.> □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) <Expression of RoHS Marking > ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions Standard Reel Quantity (mm) Label in Outer Case (Reel) W D H H 186 186 93 5 D ∗ Above Outer Case size is typical. It depends on a quantity of an order. W MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243C-0009J-01 P.6/9 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Chipcoil c a 0.7~0.9 a SolderResist b 1.8~2.2 c 0.6~0.8 b Land (in mm) 11.2 Flux, Solder ･Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ･Use Sn-3.0Ag-0.5Cu solder. ･Standard thickness of solder paste : 100μm to 150μm. 11.3 Reflow soldering conditions ･Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ･Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile T(e℃mp). 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C～180°C 、90s±30s Heating above 220°C､30s～60s above 230°C､60s max. Peak temperature 245°C±3°C 260°C,10s Cycle of reflow 2 times 2 times MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243C-0009J-01 P.7/9 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter Φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ･ Solder shall be used not to be exceeded the upper limits as shown below. UpperLimit 1/3T≦t≦T Recommendable T : thickness of product t Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 11.6 Attention regarding P.C.B. bending The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways b direction (Length: a＜b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2) Products location on P.C.B. separation C Products (A,B,C,D) shall be located carefully Seam B so that products are not subject to the mechanical stress due to warping the board. D Because they may be subjected the mechanical b A Slit Length:a<b stress in order of A＞C＞B≅D. a 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243C-0009J-01 P.8/9 11.8 Resin coating Inductance value may be changed due to the large cure-stress of the resin when products are coated with resin. In this case, take care when you select resin to prevent the deterioration of the product quality. 11.9 Caution for use The pattern of the chip coil is covered with the protection film. But the handing the chip coil shall be taken care so that the chip coil would not be damaged with the pick-up nozzle, the sharp substance and so on. 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.11 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C ~ 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12．! Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO.,LTD

Reference Only Spec No.JELF243C-0009J-01 P.9/9 <Electrical Performance:Measuring Method of Inductance/Q> (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I1 I2 A B Zm V1 V2 Zx C D V1 A B V2 I 1 = C D I 2 Test Head Test fixture Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. V V Zm= 1 Zx= 2 I 1 ， I 2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm:measured impedance of short chip Zss:residual impedance of short chip (0.771nH) Yom:measured admittance when opening the fixture (4) Lx and Qx shall be calculated with the following equation. Im(Zx) Im(Zx) Lx :Inductance of chip coil Lx= Qx= 2πf ， Re(Zx) Qx:Q of chip coil f:Measuring frequency MURATA MFG.CO.,LTD