Reference Only Spec No. JELF243B-0012K-01 P.1/8 CHIP COIL (CHIP INDUCTORS) LQM18FN□□□□00D Reference Specification 1. Scope This reference specification applies to LQM18FN_00 series, Chip Coil (Chip Inductors). 2. Part Numbering (ex) LQ M 18 F N 1R0 M 0 0 D Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and D: Taping Characteristics *B: BULK *B: Bulk packing also available 3. Rating ・Operating Temperature Range –55°C to + 125°C ・Storage Temperature Range –55°C to + 125°C Self Customer MURATA DC Rated Inductance Resonant Part Number Part Number Resistance Current Frequency (μH) Tolerance (Ω) (MHz min.) (mA) LQM18FN1R0M00D 1.0 0.20±30% 120 150 LQM18FN2R2M00D 2.2 0.40±30% 80 120 ±20% LQM18FN4R7M00D 4.7 0.60±30% 50 80 LQM18FN100M00D 10 0.90±30% 30 50 4. Appearance and Dimensions 0.3±0.2 Ferrite Electrode 0 . 8 ± 0 .1 ■Unit Mass (Typical value) 0.005g 1.6±0.1 0.8±0.1 (in mm) 5. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C ± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106kPa MURATA MFG.CO., LTD

Reference Only Spec No. JELF243B-0012K-01 P.2/8 6. Electrical Performance No. Item Specification TestMethod 6.1 Inductance Inductance shall meet item 3. Measuring Equipment: KEYSIGHT 4294A or equivalent (1mA) Measuring Frequency: 1MHz 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter Digitalmultimeter (TR6846orequivalent) a terminal1 SW terminal2 b DC resistance shall be measured after putting chip coil between the terminal 2 under the condition of opening between a and b. Every measurement the terminal 1 shall be shorted between a and b when changing chip coil. 6.3 Self Resonant S.R.F shall meet item 3. Measuring Equipment: Frequency (S.R.F) KEYSIGHT 4294A or equivalent 6.4 Rated Current Self temperature rise shall be limited The rated current is applied. to 25°C max. Inductance Change: within ±50% 7. Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged after Applied Direction tested as follows. ChipCoil F Substrate Force: 10N Hold Duration: 5s±1s Applied Direction: Parallel to PCB 7.2 Bending Test Substrate: Glass-epoxy substrate (100mm×40mm×1.6mm) Pressurejig R340 F Deflection 45 45 Product (in mm) Speed of Applying Force: 1mm / s Deflection: 2mm Hold Duration: 30s 7.3 Vibration Oscillation Frequency: 10Hz to 55Hz to 10Hz for 1 min Total Amplitude: 1.5mm Testing Time: A period of 2h in each of 3 mutually perpendicular directions. MURATA MFG.CO., LTD

Reference Only Spec No. JELF243B-0012K-01 P.3/8 No. Item Specification Test Method 7.4 Solderability The wetting area of the electrode Flux: Ethanol solution of rosin 25(wt)% shall be at least 90% covered with (Immersed for 5s to 10s) new solder coating. Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 60s to 90s Solder Temperature: 240°C±5°C Immersion Time: 3s±1s 7.5 Resistance to Appearance: No damage Flux: Ethanol solution of rosin 25(wt)% Soldering Heat Inductance Change: within ±20% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150°C±10°C / 60s to 90s Solder Temperature: 270°C±5°C Immersion Time: 10s±1s Then measured after exposure in the room condition for 24h±2h. 8. Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 8.1 Heat Resistance Appearance: No damage Temperature: 125°C±2°C Inductance Change: within ±20% Time: 1000h (+48h, -0h) Then measured after exposure in the room condition for 48h±2h. 8.2 Humidity Temperature: 40°C±2°C Humidity: 90%(RH) to 95%(RH) Time: 1000h (+48h, -0h) Then measured after exposure in the room condition for 48h±2h. 8.3 Temperature Appearance: No damage 1 cycle: Cycle Inductance Change: within ±30% 1 step: -55°C±2°C / 30 min±3 min 2 step: Ordinary temp. / 10 min to 15 min 3 step: +125°C±2°C / 30 min±3 min 4 step: Ordinary temp. / 10 min to15 min Total of 10 cycles Then measured after exposure in the room condition for 48h±2h. 9. Specification of Packaging 9.1 Appearance and Dimensions of paper tape (8mm-wide) 4.0±02..10±40..00±50.1 φ1.5±00.1 5±0.1 7 . 1 5 85±0.1 3.5±0.0 8.0±0.3 1. Directionoffeed 1.05±0.1 1.1max (in mm) MURATA MFG.CO., LTD

Reference Only Spec No. JELF243B-0012K-01 P.4/8 9.2 Specification of Taping (1) Packing quantity (standard quantity) 4,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Base tape and Top tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Top tape 5N min. Bottom tape 9.4 Peeling off force of top tape 165 to 180 degree Top tape Speed of Peeling off 300mm/ min F Peeling off force 0.1 to 0.6N (minimum value is typical) Bottom tape Base tape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows. 16T0ramileinr. Leader 2.0±0.5 Label 190min. 210min. Emptytape Toptape 13.0±0.2 6 0+-10 Directionoffeed 21.0±0.8 9.0+1 -0 13.0±1.4 180+-30 (in mm) 9.6 Marking for reel Customer part number, MURATA part number, Inspection number (1), RoHS Marking (2), Quantity etc ･･･ 1) <Expression of Inspection No.> □□ OOOO  (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep.  1 to 9, Oct. to Dec.  O, N, D Third, Fourth digit : Day (3) Serial No. 2) <Expression of RoHS Marking> ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number MURATA MFG.CO., LTD

Reference Only Spec No. JELF243B-0012K-01 P.5/8 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (2), Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions Standard Reel Quantity (mm) Label in Outer Case (Reel) W D H H 186 186 93 5  D  Above Outer Case size is typical. It depends on a quantity of an order. W 10. ！ Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing ChipCoil Land SolderResist c Soldering a b c Flow 2.2 to 2.6 0.7 0.7 Refｌow 1.8 to 2.0 a (in mm) b 11.2 Flux, Solder ・Use rosin-based flux. Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste: 100μm to 150μm. 11.3 Flow soldering / Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. MURATA MFG.CO., LTD

Reference Only Spec No. JELF243B-0012K-01 P.6/8 Soldering profile (1) Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile 60s min. Time.(s) Standard Profile Limit Profile Pre-heating 150℃, 60s min. Heating 250℃, 4s～6s 265℃±3℃, 5s Cycle of flow 2 times 2 times (2) Reflow soldering profile T(e℃mp). 260℃ 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150°C～180°C, 90s±30s Heating above 220°C, 30s～60s above 230°C, 60s max. Peak temperature 245°C±3°C 260°C, 10s Cycle of reflow 2 times 2 times 11.4 Reworking with soldering iron The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1, -0)s Time 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Upper Limit 1/3T≦t≦T Recommendable t T： thickness of product MURATA MFG.CO., LTD

Reference Only Spec No. JELF243B-0012K-01 P.7/8 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways b direction (Length: a‹b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 (2)Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C C Perforation B D A Slit *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. Screw Hole Recommended 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S MURATA MFG.CO., LTD

Reference Only Spec No. JELF243B-0012K-01 P.8/8 (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating Inductance value may be changed due to the large cure-stress of the resin when products are coated with resin. In this case, take care when you select resin to prevent the deterioration of the product quality. 11.9 Caution for use There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or pottery.) 11.10 Magnetic Saturation When the excessive current over rated current is applied, the inductance value may change due to magnetism. 11.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.12 Storage and Handing Requirements (1) Storage period Use the products within 6 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature ： -10°C to 40°C Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. ・Products should be stored under the airtight packaged condition. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12．! Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering. MURATA MFG.CO., LTD