SpecNo.JELF243A-0086L-01 R e f e r e n c e O n l y P1/8 CHIP COIL(CHIP INDUCTORS) LQH5BPN□□□□T0□ REFERENCE SPECIFICATION 1. Scope This reference specification applies to LQH5BP_T0 Series, Chip coil (Chip Inductors). 2. Part Numbering (ex) LQ H 5B P N R47 N T0 L Product ID Structure Dimension Applications Category Inductance Tolerance Dimension Packaging (L×W) and (T) L:Taping(φ180mm/reel) Characteristics K: Taping (φ330mm/reel) 3. Rating ・Operating Temperature Range. (Ambient temperature; Self-temperature rise is not included) -40 to +85°C (Product temperature; Self- temperature rise is included) -40 to +125°C ・Storage Temperature Range. -40 to +125°C Inductance Self ∗3 Rated Current(A) DC Customer MURATA Resistance Resonant ∗1 Based on ∗2 Based on Part Number Part Number (µH) Tolerance (Ω) Frequency Inductance Temperature (MHz min) change rise LQH5BPNR47NT0L 0.47 0.012±20% 220 7.7 4.0 LQH5BPNR47NT0K LQH5BPN1R0NT0L 1.0 0.019±20% 90 5.8 3.1 LQH5BPN1R0NT0K LQH5BPN1R2NT0L 1.2 0.019±20% 90 5.4 3.1 LQH5BPN1R2NT0K LQH5BPN1R5NT0L 1.5 0.024±20% 70 5.0 3.0 LQH5BPN1R5NT0K LQH5BPN2R2NT0L 2.2 N:±30% 0.030±20% 55 4.0 2.6 LQH5BPN2R2NT0K LQH5BPN2R7NT0L 2.7 0.035±20% 50 3.8 2.5 LQH5BPN2R7NT0K LQH5BPN3R3NT0L 3.3 0.044±20% 40 3.5 2.3 LQH5BPN3R3NT0K LQH5BPN4R7NT0L 4.7 0.058±20% 40 3.0 2.0 LQH5BPN4R7NT0K LQH5BPN6R8NT0L 6.8 0.083±20% 30 2.5 1.65 LQH5BPN6R8NT0K LQH5BPN100MT0L 10 0.106±20% 25 2.0 1.60 LQH5BPN100MT0K LQH5BPN150MT0L 15 M:±20% 0.187±20% 18 1.6 1.20 LQH5BPN150MT0K LQH5BPN220MT0L 22 0.259±20% 15 1.4 1.05 LQH5BPN220MT0K ∗1: When applied Rated current to the Products,Inductance will be within ±30% of nominal Inductance value. ∗2: When applied Rated current to the Products , temperature rise caused by self-generated heat shall be limited to 40℃ max. ∗3: Keep the temperature(ambient temperature plus self-generation of heat) under 125℃. 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C Humidity : Ordinary Humidity (25 to 85 % (RH)) Humidity : 60 to 70 % (RH) Atmospheric Pressure : 86 to 106 kPa MURATA MFG.CO., LTD

SpecNo.JELF243A-0086L-01 R e f e r e n c e O n l y P2/8 5. Appearance and Dimensions 5.0±0.2 2.0±0.2 （0.2） 5.0±0.2 ※No Marking. ■Unit Mass (Typical value) 5.0±0.2 0.22ｇ (in mm) 1.5±0.2 1.5±0.2 6. Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment: KEYSIGHT 4192A or equivalent Measuring Frequency: 100kHz 6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter 6.3 Self Resonant S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent Frequency(S.R.F) 7. Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged. Substrate: Glass-epoxy substrate Applied Direction : Chipcoil Ｆ Substrate Force: 10N Hold Duration: 5±1s 7.2 Bending Test Chip coil shall not be damaged. Substrate:Glass-epoxy substrate (100×40×1.0mm) Speed of Applying Force: 0.5mm / s Deflection: 2mm Hold Duration: 5seconds. Pressurejig R230 F Deflection 45 45 Product (in mm) MURATA MFG.CO., LTD

SpecNo.JELF243A-0086L-01 R e f e r e n c e O n l y P3/8 No. Item Specification Test Method 7.3 Vibration Chip coil shall not be damaged. Oscillation Frequency: 10~2000~10Hz for 20minutes Total Amplitude: 1.5mm Testing Time: A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6 hours) 7.4 Solderability The wetting area of the electrode Flux: Ethanol solution of rosin,25(wt)% shall be at least 90% covered with (Immersed for 5s to 10s) new solder coating. Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150±10°C / 60 to 90seconds Solder Temperature: 240±5°C Immersion Time: 3±1 s 7.5 Resistance to Appearance:No damage Flux: Ethanol solution of rosin,25(wt)% Soldering Heat Inductance Change: within ±10% (Immersed for 5s to 10s) Solder: Sn-3.0Ag-0.5Cu Pre-Heating: 150±10°C / 60 to 90seconds Solder Temperature: 270±5°C Immersion Time: 10±1 s Then measured after exposure in the room condition for 24±2 hours. 8. Environmental Performance (It shall be soldered on the substrate.) No. Item Specification Test Method 8.1 Heat Resistance Appearance:No damage Temperature: 85±2°C Inductance Change: within ± 10% Time: 1000h (+48h , -0h) DC Resistance Change: Then measured after exposure in the room condition for within ± 10% 24±2 hours. 8.2 Cold Resistance Temperature: -40±2°C Time: 1000h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 8.3 Humidity Temperature: 70±2°C Humidity: 90~95%(RH) Time: 1000h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 8.4 Temperature Cycle 1 cycle: 1 step: -40±2°C / 30±3 minutes 2 step: Ordinary temp. / 10 to 15 minutes 3 step: +85±2°C / 30±3 min 4 step: Ordinary temp. / 10 to 15 minutes Total of 10 cycles Then measured after exposure in the room condition for 24±2 hours. 9. Specification of Packaging 9.1 Appearance and Dimensions of plastic tape 1 φ 1.5 -+00 .1 2.0±0.05 4.0±0.1 75±0. (0.3) . 1 5 0 0.1 5±0. ±0.2 Dimension of the Cavity is measured 5.3± 5. 12.0 at the bottom side. *Lead-in/out wire 8.0±0.1 Direction of feed 2.4±0.1 (in mm) 5.3±0.1 MURATA MFG.CO., LTD

SpecNo.JELF243A-0086L-01 R e f e r e n c e O n l y P4/8 9.2 Specification of Taping (1) Packing quantity (standard quantity) φ180 mm reel : 500 pcs. / reel φ330 mm reel : 3000 pcs. / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. 9.3 Pull Strength Embossed carrier tape 10N min. Cover tape 5N min. 9.4 Peeling off force of cover tape Speed of Peeling off 300mm/min 165to180degree F Cover tape 0.2 to 0.7N Peeling off force (minimum value is typical) Plastictape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. « Packaging Code : L (φ180mm reel) » Trailer : 160min. Leader 2.0±0.5 Label 190 min 210min Emptytape Covertape φ13.0±0.2 φ60±1 0 φ21.0±0.8 13.0±1 Directionof feed 0 17.0±1.4 φ180±0 (inmm) 3 « Packaging Code : K (φ330mm reel) » Trailer Leader 2. 0± 0 . 5 160min. Label 190min. 210min.. Empty Tape Cover tape φ50min. φ 13 . 0 ± 0. 2 13.5±1.0 φ 21 . 0± 0. 8 Direction of feed 17.5±1.0 φ330±2.0 (in m m) MURATA MFG.CO., LTD

SpecNo.JELF243A-0086L-01 R e f e r e n c e O n l y P5/8 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) <Expression of Inspection No.> □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) , Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions (mm) Standard Reel Reel Quantity in Outer Label W D H Case (Reel) H φ180mm 186 186 93 4 D φ330mm 340 340 95 4 W ∗Above Outer Case size is typical. It depends on a quantity of an order. 10. Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing (Reflow Soldering) Recommended land patterns for reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. Land Chip Colil 5.5 Solder Resist 4.1 (in mm) 1.8 1.85 MURATA MFG.CO., LTD

SpecNo.JELF243A-0086L-01 R e f e r e n c e O n l y P6/8 11.2 Flux, Solder ・Use rosin-based flux. Flux ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. Solder ・Standard thickness of solder paste : 100μm to 150μm 11.3 Soldering conditions (Reflow) ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Reflow soldering profile Temp. 260℃ (℃) 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150～180°C 、90s±30s Heating above 220°C、30s～60s above 230°C、60s max. Peak temperature 245±3°C 260°C,10s Cycle of reflow 2 times 2 times 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 380°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Excessively Recommendable MURATA MFG.CO., LTD

SpecNo.JELF243A-0086L-01 R e f e r e n c e O n l y P7/8 11.6 Product's location The following shall be considered when designing and laying out P.C.B.’s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ Electrod The electorode part of the products should be located like the picture to the mechanical stress. (Poor example) (Good example) Electrod (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to A > D ∗1 the board separation surface. (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from A > C the board separation surface. Seam B C ∗1 A > D is valid when stress is added vertically to Electrode the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to A D the PCB, therefore A > D is invalid. Slit Electrode (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component Screw Hole Recommended in a position as far away from the screw holes as possible. 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max. (3) Cleaner Alcohol-based cleaner: IPA Aqueous agent: PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. MURATA MFG.CO., LTD

SpecNo.JELF243A-0086L-01 R e f e r e n c e O n l y P8/8 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.11 Storage and Handling Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 ~ 40°C Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12. Note (1)Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2)You are requested not to use our product deviating from the reference specifications. (3)The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering MURATA MFG.CO., LTD