Inductor for Power Lines (Power Inductor) Soldering and Mounting 1. Standard Land Pattern Dimensions A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip inductor (chip coil) electrode. Land Pattern + Solder Resist Land Pattern Solder Resist (in mm) Series Standard Land Dimensions LQM18F/18P Part Number a b c LQM21D/21F/21P LQM2MP LQM18F Flow 0.7 2.2-2.6 0.7 LQM2HP /18P Reflow 1.8-2.0 LQM31P LQM21D/21F/21P 1.2 3.0-4.0 1.0 LQM32P LQM2MP 0.8 2.4 1.8 LQH2MC LQM2HP 1.6 3.0 1.5 LQH31C LQM31P 2.0 4.2-5.2 1.2 LQH32P LQM32P 1.9 3.6 2.7 LQH44P LQH5BP c LQH2MC 0.8 2.6 1.0 LQH55D/66S LQH31C 1.0 4.5 1.5 LQW15C_00 a LQH32P 1.3 3.8 2.0 LQW15C_10 b LQH44P 1.3 4.4 3.0 LQW18C LQH5BP 1.8 5.5 4.1 LQH55D/66S 2.0 8.0 3.5 LQW15C_00 0.4 1.4 0.6 LQW15C_10 0.4 1.4 0.66 LQW18C 0.7 2.2 1.0 LQH2HP 4 1. 0.8 3.0 LQH32C 5.5 0 0 2. 1. 1.0 1.3 1.0 LQH3NP 2.4 0.7 0.7 75 0.45 0.45 0. 3 3. 75 1.15 1.0 1.15 0. 3.3 LQH43C 7.5 LQH43P 05 3.1. 1.5 1.5 1.5 LQH55P 45˚ 2.9 6.7 1.6 Attention should be paid to potential magnetic coupling effects when using the inductor (coil) as a resonator. Continued on the following page.

Inductor for Power Lines (Power Inductor) Soldering and Mounting 2. Standard Soldering Conditions (1) Soldering method Solder: Use Sn-3.0Ag-0.5Cu solder. Chip inductor (Chip coils) can be flow or reflow soldered. Flux: Use rosin-based flux, but not strongly acidic flux (with Please contact Murata regarding other soldering chlorine content exceeding 0.2wt%). methods. Do not use water-soluble flux. As for LQH2MC/2HP/3NP/32P/44P/5BP/55D/55P/66S, The flux used for LQW15C/18C series should use the LQM32P, LQW15C/18C series, please use reflow rosin-based flux that includes middle activator soldering. equivalent to 0.06wt% to 0.1wt% chlorine. For additional mounting methods, please contact Murata. (2) Soldering profile "Flow Soldering profile (Sn-3.0Ag-0.5Cu solder) ure (°C) TT32 t2 erat T1 Heating Limit Profile p m Standard Profile e T Pre-heating time (s) t1 Standard Profile Limit Profile Pre-heating Series Heating Cycle Heating Cycle Temp. (T1) Time. (t1) Temp. (T2) Time. (t2) of flow Temp. (T3) Time. (t2) of flow LQM18F/18P LQM21D/21F/21P/2MP/2HP 2 times 2 times 150°C 60s min. 250°C 4 to 6s 265±3°C 5s max. LQM31P max. max. LQH31C LQH32C 2 times 150°C 60s min. 250°C 4 to 6s 265±3°C 5s max. 1 times LQH43C/43P max. "Reflow Soldering profile (Sn-3.0Ag-0.5Cu solder) T4 T2 C) T3 e (°180 T1 atur150 er Limit Profile p m Pre-heating t1 e Standard Profile T t2 90±30s time (s) Standard Profile Limit Profile Series Heating Peak Cycle Heating Peak Cycle temperature temperature Temp. (T1) Time. (t1) (T2) of reflow Temp. (T3) Time. (t2) (T4) of reflow LQM18F/18P LQM21D/21F/21P/2MP/2HP LQM31P/32P 2 times 2 times LQH2MC, LQH2HP 220°C 30 to 60s 245±3°C 230°C 60s max. 260°C/10s max. max. LQH31C LQH3NP/32P/43P/44P/5BP/55P LQW15C/18C LQH32C 2 times LQH43C 220°C 30 to 60s 245±3°C 230°C 60s max. 260°C/10s 1 time max. LQH55D, LQH66S Continued on the following page.

Inductor for Power Lines (Power Inductor) Soldering and Mounting (3) Reworking with Soldering Iron Soldering iron power output: 80W max. Preheating at 150°C for 1 minute is required. Do not Temperature of soldering iron tip: 350°C directly touch the ceramic element with the tip of the Diameter of soldering iron end: 3.0mm max. soldering iron. The reworking soldering conditions are as Soldering time: within 3 s follows: 3. Mounting Instructions (1) Land Pattern Dimensions Solder Resist Large lands reduce Q of the mounted chip. Also, large Land protruding land areas (bordered by lines having dimensions 'c' and 'd' shown) cause floating and c electrode leaching. d (2) Land Pattern Designing (LQH series) Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to “position shift” in soldering process. (3) Magnetic Coupling Since some chip inductors (chip coils) are constructed Magnetic Coupling like an open magnetic circuit, narrow spacing between inductors (coils) may cause magnetic coupling. LQM, LQH66S and LQH_P series have a magnetically shielded structure. The structure makes their coupling coefficient smaller than that of conventional chip inductors (chip coils). (4) PCB Warping PCB should be designed so that products are not Products should be located in the sideways direction (Length: a<b) to the mechanical stress. subjected to the mechanical stress caused by warping the board. a b Poor example Good example except LQH3NP/44P/5BP The electrode part of the product should be located like the picture to the mechanical stress. electrode electrode Poor example Good example LQH3NP/44P/5BP Continued on the following page.

Inductor for Power Lines (Power Inductor) Soldering and Mounting (5) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste as shown on the right so that solder is applied. LQH_C/D/H/N/P LQH_S " Guideline of solder paste thickness · LQW15C: 50 to 100μm · LQM, LQW18C, LQH2MC/2HP, LQH3NP/32P, LQH44P/5BP/55P: 100 to 150μm LQM LQW_C · LQH31C/32C, LQH43C/43P, LQH55D, LQH66S: 200 to 300μm (6) Amount of Adhesive If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderability. In contrast, if insufficient adhesive is applied, or if the LQH_C/H/M/N LQM adhesive is not sufficiently hardened, then the chip may become detached during flow soldering. Apply the Typical Application Amount (in:mg) adhesive in accordance with the conditions shown in Part Number IR-100 chart. LQM18F/18P 0.06-0.07 LQM21D/21F/21P/2MP 0.20-0.25 LQM2HP/31P 0.25-0.30 LQH31C 0.20-0.25 LQH32C 0.27-0.35 LQH43C 0.60-0.80 4. Cleaning The following conditions should be observed when (4) Ensure that flux residue is completely removed. cleaning chip inductors (chip coils): Component should be thoroughly dried after aqueous (1) Cleaning Temperature: 60°C max. (40°C max. for agents have been removed with deionized water. alcohol cleaning agents) (2) Ultrasonic For additional cleaning methods, please contact Murata. Output: 20W/l max. Duration: 5 minutes max. Frequency: 28 to 40kHz Care should be taken not to cause resonance of the PCB and mounted products. (3) Cleaning agent The following cleaning agents have been tested on individual components. Evaluation in complete assembly should be done prior to production. (a) Alcohol cleaning agents Isopropyl alcohol (IPA) (b) Aqueous cleaning agents Pine Alpha ST-100S LQH66S series: Aqueous agents should not be used because they may cause quality deterioration or damage to appearance.