Reference Only Spec No. JELF243A-0034R-01 P.1/8 CHIP COIL（CHIP INDUCTORS）LQH31HN□□□□03L REFERENCE SPECIFICATION 1.Scope This reference specification applies to LQH31HN series, Chip coil (Chip Inductors). 2.Part Numbering (ex) LQ H 31 H N 54N K 0 3 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and L:Taping Characteristics 3.Rating ・Operating Temperature Range. – 40 °C to + 85 °C ・Storage Temperature Range. – 40 °C to + 85 °C Customer MURATA Inductance Q DC Self Resonant Rated Resistance Frequency Current Part Number Part Number (nH) Tolerance (min) (Ω) (MHz min) (mA) LQH31HN54NK03L 54 50 0.035±30% 800 920 K:±10% LQH31HN95NK03L 95 0.047±30% 650 790 LQH31HNR14J03L 145 0.061±30% 500 700 LQH31HNR14K03L LQH31HNR21J03L 215 0.11±30% 430 520 LQH31HNR21K03L LQH31HNR29J03L 290 0.17±30% 360 420 LQH31HNR29K03L LQH31HNR39J03L 390 0.26±30% 300 330 LQH31HNR39K03L J: ± 5 % 60 LQH31HNR50J03L K:±10 % 500 0.44±30% 270 260 LQH31HNR50K03L LQH31HNR61J03L 610 0.48±30% 240 250 LQH31HNR61K03L LQH31HNR75J03L 750 0.79±30% 220 190 LQH31HNR75K03L LQH31HNR88J03L 880 0.86±30% 200 180 LQH31HNR88K03L 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20 ± 2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa 5. Appearance and Dimensions 2.3±0.2 1.6±0.2 2 ±0. 8 1. ■Unit Mass (Typical value) 0.029g 3.2±0.3 1.6±0.2 * No Marking. 0.7 0.7 0.7 min min min (inmm) MURATA MFG.CO., LTD

Reference Only Spec No. JELF243A-0034R-01 P.2/8 6. Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment : KEYSIGHT E4991A or equivalent Measuring Frequency : 1MHz Measuring Method:See P.8 <Electrical Performance:Measuring Method of Inductance> 6.2 Q Q shall meet item 3. Measuring Equipment : KEYSIGHT E4991A or equivalent Measuring Frequency : 100MHz 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment : Digital multi meter 6.4 Self Resonant S.R.F shall meet item 3. Measuring Equipment : KEYSIGHT E4991A or equivalent Frequency(S.R.F) 6.5 Rated Current Self temperature rise shall be The rated Current is applied. limited to 20 °C max. Inductance Change : within ± 10 % 7. Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged after Substrate : Glass-epoxy substrate tested as test method. ChipCiol 4.5 Pattern Solderresist Substrate 1.5 (inmm) 1 Applied Direction : ChipCoil F Substrate Force : 10 N Hold Duration : 5s ± 1s 7.2 Bending Test Substrate : Glass-epoxy substrate (100mm×40mm×1.6mm) Speed of Applying Force : 1mm / s Deflection : 2mm Hold Duration : 30 s Pressurejig R340 F Deflection 45 45 Product (inmm) 7.3 Vibration Oscillation Frequency :10Hz ~ 55Hz ~ 10Hz for 1 min Total Amplitude : 1.5mm Testing Time : A period of 2 hours in each of 3 mutually perpendicular directions.(Total 6 hours) 7.4 Solderability The wetting area of the electrode shall Flux: Ethanol solution of rosin,25(wt)% be at least 90% covered with (Immersed for 5s to 10s) new solder coating. Solder : Sn-3.0Ag-0.5Cu Pre-Heating : 150±10°C / 60 to 90seconds Solder Temperature : 240±5°C Immersion Time : 3±1 s MURATA MFG.CO., LTD

Reference Only Spec No. JELF243A-0034R-01 P.3/8 No. Item Specification Test Method 7.5 Resistance to Appearance : No damage Flux: Ethanol solution of rosin,25(wt)% Soldering Heat Inductance Change : within ± 5 % (Immersed for 5s to 10s) Solder : Sn-3.0Ag-0.5Cu Pre-Heating:150±10°C / 60 to 90seconds Solder Temperature:270±5°C Immersion Time:10±1 s Then measured after exposure in the room condition for 24±2 hours. 8.Environmental Performance (It shall be soldered on the substrate.) No. Item Specification Test Method 8.1 Heat Resistance Appearance : No damage Temperature : 85 °C ± 2 °C Inductance Change : within ± 5 % Time : 1000 h (+48h , -0h) Q Change : within ± 20 % Then measured after exposure in the room condition for 24±2 hours. 8.2 Cold Resistance Temperature : - 40 °C ± 2 °C Time : 1000 h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 8.3 Humidity Temperature : 40 °C ± 2 °C Humidity : 90 %(RH) to 95 %(RH) Time : 1000 h (+48h , -0h) Then measured after exposure in the room condition for 24±2 hours. 8.4 Temperature 1 cycle : Cycle 1 step : - 40 °C ± 2 °C / 30 min ± 3 min 2 step : Ordinary temp. / 10 min to 15 min 3 step : + 85 °C ± 2 °C / 30 min ± 3 min 4 step : Ordinary temp. / 10 min to 15 min Total of 10 cycles Then measured after exposure in the room condition for 24±2 hours. 9. Specification of Packaging 9.1 Appearance and Dimensions of plastic tape φ1.5+-00.1 ※Lead-in/outwire 1.75±0.1 ( 0 . 2 ) ※Thepackingdirectionsofthechipcoil 05 ±0. 2 intapingareunifiedwiththein/out 6±0.1 3.5 8.0±0. positionsoftheleadwire. 3. 4.0±0.1 4.0±0.1 1.9±0.1 2.0±0.05 Directionoffeed 2.0±0.1 (inmm) Dimension of the Cavity is measured at the bottom side. 9.2 Specification of Taping (1) Packing quantity (standard quantity) 2,000 pcs / reel (2) Packing Method Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept. MURATA MFG.CO., LTD

Reference Only Spec No. JELF243A-0034R-01 P.4/8 9.3 Pull Strength Plastic tape 10N min. Cover tape 9.4 Peeling off force of cover tape Speed of Peeling off 300mm / min 165to180degree F Covertape 0.2N to 0.7N Peeling off force (minimum value is typical) Plastictape 9.5 Dimensions of Leader-tape, Trailer and Reel There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows. Trailer Lead er 2.0±0.5 160min. Label 190min. 210min. Emptytape Covertape φ13.0±0.2 φ60±10 φ21.0±0.8 Directionoffeed 9±10 13±1.4 φ180±03 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･ ∗1) <Expression of Inspection No.> □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D Third, Fourth digit : Day (3) Serial No. ∗2) « Expression of RoHS marking » ROHS – Y (△) (1) (2) (1) RoHS regulation conformity (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS marking (∗2) ,Quantity, etc ･･･ 9.8. Specification of Outer Case Outer Case Dimensions (mm) Standard Reel Quantity Label W D H in Outer Case (Reel) H 186 186 93 5 ∗Above Outer Case size is typical. It depends on a quantity D of an order W 10. Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above MURATA MFG.CO., LTD

Reference Only Spec No. JELF243A-0034R-01 P.5/8 11. Notice This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Recommended land patterns for flow and reflow soldering are as follows: It has been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process. ChipCoil Land c a 1.0 Solderresist b 4.5 c 1.5 a (in mm) b 11.2 Flux, Solder ・Use rosin-based flux. Flux ・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder Solder ・Standard thickness of solder paste : 200μm to 300μm Other flux (except above) Please contact us for details, then use. 11.3 Flow soldering / Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. Soldering profile (1)Flow soldering profile Temp. (℃) 265℃±3℃ 250℃ Limit Profile 150 Heating Time Standard Profile 60s min. Time.(s) Standard Profile Limit Profile Pre-heating 150℃、60s min. Heating 250℃、4s～6s 265℃±3℃、5s Cycle of flow 2 times 2 times MURATA MFG.CO., LTD

Reference Only Spec No. JELF243A-0034R-01 P.6/8 (2)Reflow soldering profile Temp. 260℃ (℃) 245℃±3℃ 230℃ 220℃ Limit Profile 180 150 30s～60s Standard Profile 60s max. 90s±30s Time.(s) Standard Profile Limit Profile Pre-heating 150～180°C 、90s±30s Heating above 220°C、30s～60s above 230°C、60s max. Peak temperature 245±3°C 260°C,10s Cycle of reflow 2 times 2 times 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・Solder shall be used not to be exceeded the upper limits as shown below. ・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. UpperLimit 1/3T≦t≦T Recommendable T: Lower flange thickness T t 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. ［Products direction］ a Products shall be located in the sideways b direction (Length:a<b) to the mechanical stress. 〈Poorexample〉 〈Goodexample〉 C (2) Products location on P.C.B. separation Seam B Products (A,B,C,D) shall be located carefully so hat products are not subject to the mechanical D stress due to warping the board. b A Because they may be subjected the mechanical Slit Length:a<b stress in order of A>C>B ≅ D. a MURATA MFG.CO., LTD

Reference Only Spec No. JELF243A-0034R-01 P.7/8 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for alcohol type cleaner.) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alternative cleaner ・Isopropyl alcohol (IPA) 2. Aqueous agent ・PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core 11.10 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening crew to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting 11.11 Storage and Handing Requirements (1) Storage period Use the products within 12 months after delivered. Solderability should be checked if this period is exceeded. (2) Storage conditions ・Products should be stored in the warehouse on the following conditions. Temperature : -10 °C to 40 °C Humidity : 15 % to 85 % relative humidity No rapid change on temperature and humidity The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking of winding wire caused by the collision between the products. ・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on. ・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on. (3) Handling Condition Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12. Note (1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. (2) You are requested not to use our product deviating from the reference specifications. (3) The contents of this reference specification are subject to change without advance notice. Please approve our product specifications or transact the approval sheet for product specifications before ordering MURATA MFG.CO., LTD

Reference Only Spec No. JELF243A-0034R-01 P.8/8 <Electrical Performance:Measuring Method of Inductance/Q> (1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following. I1 I2 A B V A B V Zm V1 V2 Zx I 11 = C D I 22 C D Test Head Test fixture Product (2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage. V V Zm= 1 ， Zx= 2 I 1 I 2 (3) Thus,the relation between Zx and Zm is following; Zm-β where, α= D / A =1 Zx= α 1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss Γ= C / A =Yom Zsm : measured impedance of short chip Zssa: residual impedance of short chip (0.771nH) Yom: measured admittance when opening the fixture (4) Lx shall be calculated with the following equation. Im(Zx) Im(Zx) Lx :Inductance of chip coil Lx= , Qx = 2πf Re(Zx) Qx :Q of chip coil f :Measuring frequency MURATA MFG.CO., LTD