Product Sample & Technical Tools & Support & Reference Folder Buy Documents Software Community Design LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 LP5900 150-mA Ultra-Low-Noise LDO for RF and Analog Circuits - Requires No Bypass Capacitor 1 Features 3 Description • InputVoltageRange,2.5Vto5.5V The LP5900 is an LDO capable of supplying 150-mA 1 output current. Designed to meet the requirements of • OutputVoltageRange,1.5Vto4.5V RF and analog circuits, the LP5900 device provides • Stablewith0.47-μFCeramicInputandOutput low noise, high PSRR, low quiescent current, and low Capacitors line transient response figures. Using new innovative • NoNoiseBypassCapacitorRequired design techniques the LP5900 offers class-leading device noise performance without a noise bypass • LogicControlledEnable capacitor. • Thermal-OverloadandShort-CircuitProtection The device is designed to work with 0.47-μF input • −40°Cto125°CJunctionTemperatureRangefor and output ceramic capacitors (no bypass capacitor Operation required). • OutputCurrent,150mA The device is available in a DSBGA (YZR) package • LowOutputVoltageNoise,6.5 μV RMS and a WSON package; the device is also available in • PSRR,75dBat1kHz an extremely thin DSBGA (YPF) package. For all voltage and package options available today, see the • OutputVoltageTolerance,±2% Package Option Addendum (POA) at the end of this • VirturallyZeroI (Disabled),<1 µA Q data sheet. For any other fixed output voltages from • VeryLowIQ(Enabled),25μA 1.5 V to 4.5 V in 25-mV steps and all other package • Start-upTime,150μs options,contactyourlocalTISalesoffice. • LowDropout,80mVTyp. DeviceInformation(1) 2 Applications PARTNUMBER PACKAGE BODYSIZE DSBGA(4) 1.108mm×1.083mm(MAX) • CellularPhones LP5900 WSON(6) 2.50mm×2.20mm(NOM) • PDAHandsets (1) For all available packages, see the orderable addendum at • WirelessLANDevices theendofthedatasheet. SimplifiedSchematic INPUT IN OUT OUTPUT 0.47 PF 0.47 PF LP5900 ENABLE EN GND GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 www.ti.com Table of Contents 1 Features.................................................................. 1 7.4 DeviceFunctionalModes........................................11 2 Applications........................................................... 1 8 ApplicationandImplementation........................ 12 3 Description............................................................. 1 8.1 ApplicationInformation............................................12 4 RevisionHistory..................................................... 2 8.2 TypicalApplication..................................................12 5 PinConfigurationandFunctions......................... 3 9 PowerSupplyRecommendations...................... 14 6 Specifications......................................................... 4 10 Layout................................................................... 15 6.1 AbsoluteMaximumRatings .....................................4 10.1 LayoutGuidelines.................................................15 6.2 ESDRatings..............................................................4 10.2 LayoutExamples...................................................15 6.3 RecommendedOperatingConditions.......................4 10.3 DSBGAMounting..................................................15 6.4 ThermalInformation..................................................4 10.4 DSBGALightSensitivity.......................................16 6.5 ElectricalCharacteristics...........................................5 10.5 WSONMounting...................................................16 6.6 OutputandInputCapacitor,Recommended 11 DeviceandDocumentationSupport................. 17 Specifications.............................................................6 11.1 DocumentationSupport........................................17 6.7 TypicalCharacteristics..............................................7 11.2 Trademarks...........................................................17 7 DetailedDescription............................................ 10 11.3 ElectrostaticDischargeCaution............................17 7.1 Overview.................................................................10 11.4 Glossary................................................................17 7.2 FunctionalBlockDiagram.......................................10 12 Mechanical,Packaging,andOrderable 7.3 FeatureDescription.................................................10 Information........................................................... 17 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionQ(February2015)toRevisionR Page • Changed"LinearRegulator"to"LDO"intitleandfirstsentenceofDescription ................................................................... 1 ChangesfromRevisionP(December2014)toRevisionQ Page • AddedNCandThermalPaddescriptionsinPinFunctions .................................................................................................. 3 • ChangedHandlingRatingstoESDRatingstableformat;movestoragetempspectoAbMax;deletesolderinginfo (inPOA).................................................................................................................................................................................. 4 • ChangedUnitforLineandLoadregulation .......................................................................................................................... 5 • ChangedI toI ..................................................................................................................................................................... 7 l out • ChangedI toI ..................................................................................................................................................................... 8 l out • ChangedI toI ..................................................................................................................................................................... 9 l out • AddedWSONMountingsubsection .................................................................................................................................... 16 • Addedanotherrelateddoclink............................................................................................................................................ 17 ChangesfromRevisionO(April2013)toRevisionP Page • AddedPinConfigurationandFunctionssection,HandlingRatingstable,FeatureDescriptionsection,Device FunctionalModes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layout section,DeviceandDocumentationSupportsection,andMechanical,Packaging,andOrderableInformation section;updatedpinnamesandthermalinformation ........................................................................................................... 1 ChangesfromRevisionN(April2013)toRevisionO Page • ChangedlayoutofNationalDataSheettoTIformat........................................................................................................... 16 thisistheRODforSNVS358 2 SubmitDocumentationFeedback Copyright©2005–2016,TexasInstrumentsIncorporated ProductFolderLinks:LP5900

LP5900 www.ti.com SNVS358R–JULY2005–REVISEDJUNE2016 5 Pin Configuration and Functions YZRandYPFPackages 4-PinDSBGA IN OUT OUT IN A2 B2 B2 A2 A1 B1 B1 A1 EN GND GND EN Top View Bottom View NGFPackage 6-PinWSONwithExposedThermalPad OUT 1 6 IN IN 6 1 OUT Thermal Thermal N/C 2 5 N/C N/C 5 2 N/C Pad Pad GND 3 4 EN EN 4 3 GND Top View Bottom View PinFunctions PIN TYPE DESCRIPTION DSBGA WSON NAME EN I Enableinput;disablestheregulatorwhen≤0.4V.Enablestheregulatorwhen≥ A1 4 1.2V.Aninternal1-MΩpull-downresistorconnectsthisinputtoground. A2 6 IN I Inputvoltagesupply.Connecta0.47-µFcapacitoratthisinput. B1 3 GND — Commonground OUT O Outputvoltage.A0.47-μFLowESRcapacitorshouldbeconnectedtothispin. B2 1 Connectthisoutputtotheloadcircuit. — 2 NC — Nointernalconnection. Theexposedthermalpadonthebottomofthepackagemustbeconnectedtoa copperareaonthePCBunderthepackage.TIrecommendsuseofthermalvias toremoveheatfromthepackageintothePCB.Connectthethermalpadto Thermal — ThermalPad — groundpotentialorleavefloating.Donotconnectthethermalpadtoanypotential Pad otherthanthesamegroundpotentialseenatdevicepin3.Foradditional informationonusingTI'snon-pullbackWSONpackage,seeAN-1187Leadless LeadframePackage(LLP)(SNOA401). Copyright©2005–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LP5900

LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1)(2)(3) MIN MAX UNIT Inputvoltage,V –0.3 6 IN Outputvoltage,V –0.3 V +0.3 V OUT IN Enableinputvoltage,V –0.3 V +0.3 EN IN Continuouspowerdissipation(4) InternallyLimited Junctiontemperature,T 150 °C JMAX Storagetemperature,T –65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttothepotentialattheGNDpin. (3) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand specifications. (4) Internalthermalshutdowncircuitryprotectsthedevicefrompermanentdamage. 6.2 ESD Ratings VALUE UNIT V Electrostaticdischarge Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V (ESD) (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT Inputvoltage,V 2.5 5.5 V IN Enablevoltage,V 0 V +0.3 V EN IN Outputcurrent,I (2) 0 150 mA OUT Junctiontemperature,T –40 125 °C J Ambienttemperature,T (2) –40 85 °C A (1) AllvoltagesarewithrespecttothepotentialattheGNDpin. (2) Inapplicationswherehighpowerdissipationand/orpoorpackagethermalresistanceispresent,themaximumambienttemperaturemay havetobederated.Maximumambienttemperature(T )isdependentonthemaximumoperatingjunctiontemperature(T = A-MAX J-MAX-OP 125°C),themaximumpowerdissipationofthedeviceintheapplication(P ),andthejunction-toambientthermalresistanceofthe D-MAX part/packageintheapplication(R ),asgivenbythefollowingequation:T =T –(R ×P ).SeeApplicationand θJA A-MAX J-MAX-OP θJA D-MAX Implementation. 6.4 Thermal Information LP5900 THERMALMETRIC(1) NGF YZR/YPF UNIT 6PINS 4PINS R Junction-to-ambientthermalresistance 79.8 177.7 °C/W θJA R Junction-to-case(top)thermalresistance 84.4 0.7 °C/W θJC(top) R Junction-to-boardthermalresistance 20.4 35.6 °C/W θJB ψ Junction-to-topcharacterizationparameter 2.6 5.8 °C/W JT ψ Junction-to-boardcharacterizationparameter 20.3 35.3 °C/W JB R Junction-to-case(bottom)thermalresistance 11.2 — °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 4 SubmitDocumentationFeedback Copyright©2005–2016,TexasInstrumentsIncorporated ProductFolderLinks:LP5900

LP5900 www.ti.com SNVS358R–JULY2005–REVISEDJUNE2016 6.5 Electrical Characteristics Unlessotherwisenoted,specificationsapplyinFigure16with:V =V +1V,V =1.2V,C =C =0.47μF,I IN OUT(NOM) EN IN OUT OUT =1mA.(1)(2) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V Inputvoltage 2.5 5.5 V IN Outputvoltagetolerance V =(V +1V)to5.5V,I =1 −2% 2% IN OUT(NOM) OUT mAto150mA, –40°C≤T ≤125°C J ΔV OUT Lineregulation V =(V +1V)to5.5V,I =1 IN OUT(NOM) OUT 0.05 %V mA Loadregulation I =1mAto150mA 0.001 %mA OUT I Loadcurrent See(3) LOAD mA Maximumoutputcurrent –40°C≤T ≤125°C 150 J V =1.2V,I =0mA 25 EN OUT V =1.2V,I =0mA,–40°C≤T ≤ 50 EN OUT J 125°C V =1.2V,I =150mA 160 EN OUT IQ Quiescentcurrent(4) VEN=1.2V,IOUT=150mA,–40°C≤TJ≤ 230 µA 125°C V =0.3V(disabled) 0.003 EN V =0.3V(disabled,–40°C≤T ≤ EN J 1 125°C I Groundcurrent(5) I =0mA(V =2.5V) 30 µA G OUT OUT V Dropoutvoltage(6) I =150mA 80 DO OUT mV I =150mA,–40°C≤T ≤125°C 150 OUT J I Short-circuitcurrentlimit(7) 300 mA SC f=100Hz,I =150mA 85 OUT f=1kHz,I =150mA 75 OUT PSRR Powersupplyrejectionratio(8) f=10kHz,I =150mA 65 dB OUT f=50kHz,I =150mA 52 OUT f=100kHz,I =150mA 40 OUT e Outputnoisevoltage(8) BW=10Hzto100 I =0mA 7 μV n OUT RMS kHz,V =4.2V IN I =1mA 10 OUT I =150mA 6.5 OUT T Thermalshutdown Temperature 160 SHUTDOWN ºC Hysteresis 20 LOGININPUTTHRESHOLDS V Lowinputthreshold(V ) V =2.5Vto5.5V,–40°C≤T ≤125°C 0.4 V IL EN IN J V Highinputthreshold(V ) V =2.5Vto5.5V,–40°C≤T ≤125°C 1.2 V IH EN IN J V =5.5VandV =5.5V 5.5 I InputcurrentatENpin(9) EN IN μA EN V =0VandV =5.5V 0.001 EN IN (1) AllvoltagesarewithrespecttothepotentialattheGNDpin. (2) MinimumandMaximumlimitsarespecifiedbydesign,test,orstatisticalanalysis.Typicalnumbersarenotensured,butdorepresentthe mostlikelynorm. (3) Thedevicemaintainsastable,regulatedoutputvoltagewithoutaloadcurrent. (4) QuiescentcurrentisdefinedhereasthedifferenceincurrentbetweentheinputvoltagesourceandtheloadattheOUTpin. (5) Groundcurrentisdefinedhereasthetotalcurrentflowingtogroundasaresultofallinputvoltagesappliedtothedevice. (6) Dropoutvoltageisthevoltagedifferencebetweentheinputandtheoutputatwhichtheoutputvoltagedropsto100mVbelowits nominalvalue.Thisparameteronlyappliestooutputvoltagesabove2.5V. (7) Short-circuitcurrentismeasuredwithOUTpulledto0VandINworstcase=6V. (8) Thisspecificationisspecifiedbydesign. (9) Thereisa1-MΩresistorbetweenENpinandgroundonthedevice. Copyright©2005–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LP5900

LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 www.ti.com Electrical Characteristics (continued) Unlessotherwisenoted,specificationsapplyinFigure16with:V =V +1V,V =1.2V,C =C =0.47μF,I IN OUT(NOM) EN IN OUT OUT =1mA.(1)(2) PARAMETER TESTCONDITIONS MIN TYP MAX UNIT TRANSIENTCHARACTERISTICS Linetransient(8) V =(V )+1V)to(V )+ IN OUT(NOM OUT(NOM 1.6V)in30μs,I =1mA,–40°C≤T ≤ −2 OUT J 125°C mV V =(V +1.6V)to(V + IN OUT(NOM) OUT(NOM) 1V)in30μs,I =1mA,–40°C≤T ≤ 2 OUT J 125°C ΔV OUT Loadtransient(8) I =1mAto150mAin10μs,–40°C≤ OUT −110 T ≤125°C J mV I =150mAto1mAin10μs,–40°C≤ OUT 50 T ≤125°C J Overshootonstart-up(8) –40°C≤T ≤125°C 20 mV J Turnontime To95%ofV 150 300 μs OUT(NOM) 6.6 Output and Input Capacitor, Recommended Specifications(1) PARAMETER TESTCONDITIONS MIN NOM MAX UNIT C Inputcapacitance Capacitanceforstability 0.47 µF IN Capacitanceforstability,–40°C≤T ≤ 0.33 J 125°C C Outputcapacitance Capacitanceforstability 0.47 OUT Capacitanceforstability,–40°C≤T ≤ 0.33 10 J 125°C ESR Output/Inputcapacitance 5 500 mΩ (1) Theminimumcapacitancemustbegreaterthan0.33µFoverthefullrangeofoperatingconditions.Thecapacitortolerancemustbe 30%orbetteroverthefulltemperaturerange.Thefullrangeofoperatingconditionsforthecapacitorintheapplicationshouldbe consideredduringdeviceselectiontoensurethisminimumcapacitancespecificationismet.TIrecommendsX7Rcapacitors;however, capacitortypesX5R,Y5VandZ5Umaybeusedwithconsiderationoftheapplicationandconditions. 6 SubmitDocumentationFeedback Copyright©2005–2016,TexasInstrumentsIncorporated ProductFolderLinks:LP5900

LP5900 www.ti.com SNVS358R–JULY2005–REVISEDJUNE2016 6.7 Typical Characteristics Unlessotherwisespecified,C =C =0.47µF,V =V +1V,V =1.2V,I =1mA,T =25°C. IN OUT IN OUT(NOM) EN OUT A Figure1.OutputNoiseDensity Figure2.PowerSupplyRejectionRatio Figure3.PowerSupplyRejectionRatio Figure4.OutputVoltageChangevsTemperature Figure5.GroundCurrentvsV I =0mA Figure6.GroundCurrentvsV I =1mA IN, LOAD IN, LOAD Copyright©2005–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LP5900

LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 www.ti.com Typical Characteristics (continued) Unlessotherwisespecified,C =C =0.47µF,V =V +1V,V =1.2V,I =1mA,T =25°C. IN OUT IN OUT(NOM) EN OUT A Figure7.GroundCurrentvsV I =100mA Figure8.GroundCurrentvsLoadCurrent IN, LOAD Figure9.Short-CircuitCurrent Figure10.LoadTransient Figure11.LineTransient Figure12.EnableStart-upTime,(IOUT=1mA,VOUT=2.8V) 8 SubmitDocumentationFeedback Copyright©2005–2016,TexasInstrumentsIncorporated ProductFolderLinks:LP5900

LP5900 www.ti.com SNVS358R–JULY2005–REVISEDJUNE2016 Typical Characteristics (continued) Unlessotherwisespecified,C =C =0.47µF,V =V +1V,V =1.2V,I =1mA,T =25°C. IN OUT IN OUT(NOM) EN OUT A Figure13.EnableStart-upTime,(I =100mA,V =2.8 Figure14.EnableStart-upTime,(I =1mA,V =2.8V) OUT OUT OUT OUT V) Figure15.DropoutOverTemperature(100mA) Copyright©2005–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LP5900

LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 www.ti.com 7 Detailed Description 7.1 Overview DesignedtomeettheneedsofsensitiveRFandanalogcircuits,theLP5900provideslownoise,highPSRR,and low quiescent current, as well as low line and load transient response figures. Using new innovative design techniques, the LP5900 offers class-leading noise performance without the need for a separate noise filter capacitor. 7.2 Functional Block Diagram IN OUT EN POR + RF CF + VBG 1.2 V GND EN + EN 1 M(cid:13)(cid:3) V IH 7.3 Feature Description 7.3.1 No-LoadStability TheLP5900remainsstableandinregulationwithnoexternalload. 7.3.2 EnableControl The LP5900 enable (EN) pin is internally held low by a 1-MΩ resistor to GND. The EN must be higher than the V threshold to ensure that the device is fully enabled under all operating conditions. The EN pin voltage must IH belowerthantheV thresholdtoensurethatthedeviceisfullydisabled. IL 7.3.3 LowNoiseOutput Any internal noise at the LP5900 reference voltage is reduced by a first order low-pass RC filter before it is passed to the output buffer stage. This eliminates the need for the external bypass capacitor for noise suppression. 10 SubmitDocumentationFeedback Copyright©2005–2016,TexasInstrumentsIncorporated ProductFolderLinks:LP5900

LP5900 www.ti.com SNVS358R–JULY2005–REVISEDJUNE2016 Feature Description (continued) 7.3.4 Thermal-OverloadProtection Thermal-overload protection disables the output when the junction temperature rises to approximately 160°C which allows the device to cool. When the junction temperature cools to approximately 140°C, the output is enabled. Based on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This thermal cycling limits the dissipation of the regulator and protects it from damage as a resultofoverheating. 7.4 Device Functional Modes 7.4.1 OperationwithEnableControl The LP5900 may be switched ON or OFF by a logic input at the EN pin. A high voltage at this pin turns the device on. When the EN pin is low, the regulator output is off, and the device typically consumes 3 nA. However, if the application does not require the shutdown feature, the EN pin can be tied to IN pin to keep the regulator output permanently on. In this case the supply voltage must be fully established 500 μs or less to ensure correct operation of the start-up circuit. Failure to comply with this condition may cause a delayed start-up time of severalseconds. A 1 MΩ pull-down resistor ties the EN input to ground, and this ensures that the device will remain off when the EN pin is left open circuit. To ensure proper operation, the signal source used to drive the EN input must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics sectionunderV andV . IL IH 7.4.2 OperationwithMinimumOperatingInputVoltage(V ) IN The LP5900 does not include any dedicated UVLO circuitry. The LP5900 internal circuitry is not fully functional untilV isatleast2.5V.TheoutputvoltageisnotregulateduntilV ≥(V +V ). IN IN OUT DO Copyright©2005–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LP5900

LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information The LP5900 is a linear regulator capable of supplying a 150-mA output current. Designed to meet the requirements of RF and nalog circuits, the device provides low noise, high PSRR, low quiescent current, and low line transient response figures. Using new innovative design techniques the LP5900 offers class-leading device noise performance and is designed to work with 0.47-μF input and output ceramic capacitors (no bypass capacitorisrequired). 8.2 Typical Application Figure 16 shows the typical application circuit for the LP5900. Input and output capacitances may need to be increasedabovethe0.47-μFminimumforsomeapplications. INPUT IN OUT OUTPUT 0.47 PF 0.47 PF LP5900 ENABLE EN GND GND Figure16. LP5900TypicalApplication 8.2.1 DesignRequirements DESIGNPARAMETER MIN MAX UNITS Inputvoltagerange 2.5 5.5 V Outputvoltage 2.8 V Outputcurrent 150 mA Outputcapacitorrange 0.47 10 μF Input/OutputcapacitorESRrange 5 500 mΩ 8.2.2 DetailedDesignProcedure 8.2.2.1 PowerDissipation The permissible power dissipation for any package is a measure of the capability of the device to pass heat from thepowersource,thejunctionsofthedevice,totheultimateheatsink,theambientenvironment.Thusthepower dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die and ambient air. As stated in Recommended Operating Conditions, the allowable power dissipationforthedeviceinagivenpackagecanbecalculatedusingEquation1: 12 SubmitDocumentationFeedback Copyright©2005–2016,TexasInstrumentsIncorporated ProductFolderLinks:LP5900

LP5900 www.ti.com SNVS358R–JULY2005–REVISEDJUNE2016 (T - T ) JMAX A P = D RTJA (1) TheactualpowerdissipationacrossthedevicecanberepresentedbyEquation2: P =(V –V )×I (2) D IN OUT OUT Thisestablishestherelationshipbetweenthepowerdissipationallowedduetothermalconsideration,thevoltage drop across the device, and the continuous current capability of the device. These two equations should be used todeterminetheoptimumoperatingconditionsforthedeviceintheapplication. 8.2.2.2 ExternalCapacitors Like any low-dropout regulator, the LP5900 requires external capacitors for regulator stability. The LP5900 is specifically designed for portable applications requiring minimum board space and smallest components. These capacitorsmustbecorrectlyselectedforgoodperformance. 8.2.2.2.1 InputCapacitor An input capacitor is required for stability. The input capacitor should be at least equal to or greater than the output capacitor. It is recommended that a 0.47-µF capacitor be connected between the LP5900 IN pin and ground. This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean analogground.Anygoodqualityceramic,tantalum,orfilmcapacitormaybeusedattheinput. Important: To ensure stable operation it is essential that good PCB practices are employed to minimize ground impedance and keep input inductance low. If these conditions cannot be met, or if long leads are to be used to connect the battery or other power source to the LP5900, then it is recommended to increase the input capacitor to at least 2.2 µF. Also, tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input, it must be ensured by the manufacturer to have a surge current rating sufficient for the application. There are no requirements for the equivalent series resistance (ESR) on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain 0.47μF±30%overtheentireoperatingtemperaturerange. 8.2.2.2.2 OutputCapacitor The LP5900 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor (dielectric types X5R or X7R) in the 0.47 μF to 10 μF range, and with ESR between 5 mΩ to 500 mΩ, is suitable in the LP5900 application circuit. For this device the output capacitor should be connected between the OUT pin andagoodgroundconnectionandshouldbemountedwithin1cmofthedevice. It may also be possible to use tantalum or film capacitors at the device output, OUT, but these are not as attractiveforreasonsofsizeandcost(seetheCapacitorCharacteristics sectionbelow). The output capacitor must meet the requirement for the minimum value of capacitance and have an ESR value thatiswithintherange5mΩ to500mΩ forstability. 8.2.2.2.3 CapacitorCharacteristics The LP5900 is designed to work with ceramic capacitors on the input and output to take advantage of the benefitstheyoffer.Forcapacitancevaluesintherangeof0.47 μFto4.7 μF,ceramiccapacitorsarethesmallest, least expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a typical 0.47-μF ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which easily meets the equivalentseriesresistance(ESR)requirementforstabilityfortheLP5900. The temperature performance of ceramic capacitors varies by type and manufacturer. Most large value ceramic capacitors (≥ 2.2 µF) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitancedroppingbymorethan50%asthetemperaturegoesfrom25°Cto85°C. AbetterchoicefortemperaturecoefficientinaceramiccapacitorisX7R.Thistypeofcapacitoristhemoststable and holds the capacitance within ±15% over the temperature range. Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance andvoltageratingsinthe0.47μFto4.7μFrange. Copyright©2005–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LP5900

LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 www.ti.com Another important consideration is that tantalum capacitors have higher ESR values than equivalent size ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about 2:1asthetemperaturegoesfrom25°Cdownto −40°C,sosomeguardbandmustbeallowed. 8.2.3 ApplicationCurve Figure17. EnableStart-upTime,I =100mA,V =2.8V OUT OUT 9 Power Supply Recommendations Thedeviceisdesignedtooperatefromaninputvoltagesupplyrangebetween2.5Vand5.5V.Thisinputsupply must be well regulated. To ensure that the LP5900 output voltage is well regulated, the input supply must be at leastV +1V. OUT 14 SubmitDocumentationFeedback Copyright©2005–2016,TexasInstrumentsIncorporated ProductFolderLinks:LP5900

LP5900 www.ti.com SNVS358R–JULY2005–REVISEDJUNE2016 10 Layout 10.1 Layout Guidelines Thedeviceisdesignedtooperatefromaninputvoltagesupplyrangebetween2.5Vand5.5V.Thisinputsupply must be well regulated. To ensure that the LP5900 output voltage is well regulated, the input supply must be at leastV +1V. OUT 10.2 Layout Examples IN OUT LP5900TL A2 B2 CIN COUT A11 B1 Power Ground EN Figure18. DSBGALayout LP5900SD C IN IN OUT 1 6 C OUT 2 PAD 5 Power Ground 3 4 EN Figure19. WSONLayout 10.3 DSBGA Mounting The DSBGA package requires specific mounting techniques, which are detailed in AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009). For best results during assembly, alignment ordinals on the PC board may be usedtofacilitateplacementoftheDSBGAdevice. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the DSBGAdevice. Copyright©2005–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LP5900

LP5900 SNVS358R–JULY2005–REVISEDJUNE2016 www.ti.com 10.4 DSBGA Light Sensitivity Exposing the DSBGA device to direct light may cause incorrect operation of the device. Light sources such as halogenlampscanaffectelectricalperformanceiftheyaresituatedinproximitytothedevice. Light with wavelengths in the red and infra-red part of the spectrum has the most detrimental effect; thus, the fluorescentlightingusedinsidemostbuildingshasverylittleeffectonperformance. 10.5 WSON Mounting The 6-lead WSON package requires specific mounting techniques which are detailed in AN-1187 Leadless Leadframe Package (LLP) (SNOA401). Referring to the section PCB Design Recommendations, it should be noted that the pad style which should be used with the WSON package is the NSMD (non-solder mask defined) type. Additionally, it is recommended the PCB terminal pads to be 0.2 mm longer than the package pads to createasolderfillettoimprovereliabilityandinspection. The exposed thermal pad on the bottom of the WSON package must be connected to a copper area on the PCB under the package. TI recommends use of thermal vias to remove heat from the package into the PCB is recommended. Connect the thermal pad to ground potential or leave floating. Do not connect the thermal pad to anypotentialotherthanthesamegroundpotentialseenatdevicepin3. 16 SubmitDocumentationFeedback Copyright©2005–2016,TexasInstrumentsIncorporated ProductFolderLinks:LP5900

LP5900 www.ti.com SNVS358R–JULY2005–REVISEDJUNE2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 RelatedDocumentation Forrelateddocumentationseethefollowing: AN-1112DSBGAWaferLevelChipScalePackage (SNVA009) AN-1112AN-1112LeadlessLeadframePackage(LLP)(SNOA401) ICPackageThermalMetrics applicationreport(SPRA953) 11.2 Trademarks Alltrademarksarethepropertyoftheirrespectiveowners. 11.3 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. Copyright©2005–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LP5900

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LP5900SD-1.5/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L15 & no Sb/Br) LP5900SD-1.8/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L17 & no Sb/Br) LP5900SD-2.0/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L18 & no Sb/Br) LP5900SD-2.2/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L19 & no Sb/Br) LP5900SD-2.5 NRND WSON NGF 6 1000 TBD Call TI Call TI -40 to 125 L13 LP5900SD-2.5/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L13 & no Sb/Br) LP5900SD-2.7/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L14 & no Sb/Br) LP5900SD-2.8/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L12 & no Sb/Br) LP5900SD-3.0/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L20 & no Sb/Br) LP5900SD-3.3/NOPB ACTIVE WSON NGF 6 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L16 & no Sb/Br) LP5900SDX-1.8/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L17 & no Sb/Br) LP5900SDX-2.5/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L13 & no Sb/Br) LP5900SDX-2.7/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L14 & no Sb/Br) LP5900SDX-2.8/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L12 & no Sb/Br) LP5900SDX-3.0/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L20 & no Sb/Br) LP5900SDX-3.3/NOPB ACTIVE WSON NGF 6 4500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 L16 & no Sb/Br) LP5900TL-1.5/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LP5900TL-1.8/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-1.9/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.0/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.2/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.3/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.5/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.6/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.65/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.7/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.75/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.8/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-2.85/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-3.0/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-3.3/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TL-4.5/NOPB ACTIVE DSBGA YZR 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-1.5/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-1.8/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-2.1/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LP5900TLX-2.3/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-2.5/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-2.6/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-2.7/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-2.75/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-2.8/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-2.85/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-3.0/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900TLX-3.3/NOPB ACTIVE DSBGA YZR 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900XR-2.8/NOPB ACTIVE DSBGA YPF 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP5900XRX-2.8/NOPB ACTIVE DSBGA YPF 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LP5900SD-1.5/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-1.8/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-2.0/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-2.2/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-2.5 WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-2.5/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-2.7/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-2.8/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-3.0/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SD-3.3/NOPB WSON NGF 6 1000 178.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SDX-1.8/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SDX-2.5/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SDX-2.7/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SDX-2.8/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SDX-3.0/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900SDX-3.3/NOPB WSON NGF 6 4500 330.0 12.4 2.8 2.5 1.0 8.0 12.0 Q1 LP5900TL-1.5/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-1.8/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LP5900TL-1.9/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.0/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.2/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.3/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.5/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.6/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.65/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.7/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.75/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.8/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-2.85/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-3.0/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-3.3/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TL-4.5/NOPB DSBGA YZR 4 250 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-1.5/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-1.8/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-2.1/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-2.3/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-2.5/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-2.6/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-2.7/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-2.75/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-2.8/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-2.85/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-3.0/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900TLX-3.3/NOPB DSBGA YZR 4 3000 178.0 8.4 1.15 1.16 0.79 4.0 8.0 Q1 LP5900XR-2.8/NOPB DSBGA YPF 4 250 178.0 8.4 1.16 1.2 0.4 4.0 8.0 Q1 LP5900XRX-2.8/NOPB DSBGA YPF 4 3000 178.0 8.4 1.16 1.2 0.4 4.0 8.0 Q1 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LP5900SD-1.5/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-1.8/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-2.0/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-2.2/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-2.5 WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-2.5/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-2.7/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-2.8/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-3.0/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SD-3.3/NOPB WSON NGF 6 1000 210.0 185.0 35.0 LP5900SDX-1.8/NOPB WSON NGF 6 4500 367.0 367.0 35.0 LP5900SDX-2.5/NOPB WSON NGF 6 4500 367.0 367.0 35.0 LP5900SDX-2.7/NOPB WSON NGF 6 4500 367.0 367.0 35.0 LP5900SDX-2.8/NOPB WSON NGF 6 4500 367.0 367.0 35.0 LP5900SDX-3.0/NOPB WSON NGF 6 4500 367.0 367.0 35.0 LP5900SDX-3.3/NOPB WSON NGF 6 4500 367.0 367.0 35.0 LP5900TL-1.5/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-1.8/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-1.9/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.0/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 PackMaterials-Page3

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LP5900TL-2.2/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.3/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.5/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.6/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.65/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.7/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.75/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.8/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-2.85/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-3.0/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-3.3/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TL-4.5/NOPB DSBGA YZR 4 250 210.0 185.0 35.0 LP5900TLX-1.5/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-1.8/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-2.1/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-2.3/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-2.5/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-2.6/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-2.7/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-2.75/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-2.8/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-2.85/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-3.0/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900TLX-3.3/NOPB DSBGA YZR 4 3000 210.0 185.0 35.0 LP5900XR-2.8/NOPB DSBGA YPF 4 250 210.0 185.0 35.0 LP5900XRX-2.8/NOPB DSBGA YPF 4 3000 210.0 185.0 35.0 PackMaterials-Page4

MECHANICAL DATA YZR0004xxx D 0.600±0.075 E TLA04XXX (Rev D) D: Max = 1.108 mm, Min =1 .047 mm E: Max = 1.083 mm, Min =1 .022 mm 4215042/A 12/12 NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.com

MECHANICAL DATA NGF0006A www.ti.com

MECHANICAL DATA YPF0004 D 0.250±0.045 E TOP SIDE OF PACKAGE BOTTOM SIDE OF PACKAGE XRA04XXX (Rev C) D: Max = 1.108 mm, Min =1 .047 mm E: Max = 1.083 mm, Min =1 .022 mm 4215204/A 12/12 NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.com

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