LP3984 www.ti.com SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 LP3984 Micropower 150 mA Ultra Low-Dropout CMOS Voltage Regulator in Subminiature 4-I/O DSBGA Package CheckforSamples:LP3984 FEATURES DESCRIPTION 1 • Miniature4-I/ODSBGAorSOT-23-5Package The LP3984 is designed for portable and wireless 2 applications with demanding performance and space • Logiccontrolledenable requirements. • StablewithTantalumCapacitors The LP3984's performance is optimized for battery • 1µFTantalumOutputCapacitor powered systems to deliver extremely low dropout • FastTurn-On voltage and low quiescent current. Regulator ground • ThermalShutdownandShort-CircuitCurrent current increases only slightly in dropout, further prolongingthebatterylife. Limit Power supply rejection is better than 60 dB at low KEY SPECIFICATIONS frequencies and starts to roll off at 10 kHz. High power supply rejection is maintained down to low • 2.5to6.0VInputRange input voltage levels common to battery operated • 150mAOutput circuits. • 60dBPSRRat1kHz,40dBat10kHz@3.1V IN The device is ideal for mobile phone and similar • ≤1.2 µAQuiescentCurrentwhenShutDown battery powered wireless applications. It provides up • FastTurn-OnTime:20µs(typ.) to 150 mA from a 2.5V to 6V input. The LP3984 consumes less than 1.2 µA in disable mode and has • 75mVtypDropoutwith150mALoad fastturn-ontimelessthan20µs. • −40to+125°CJunctionTemperatureRangefor The LP3984 is available in a 4-bump DSBGA and 5- Operation pin SOT-23 packages. Performance is specified for • 1.5V,1.8V,2.9Vand3.1V −40°C to +125°C temperature range and is available in 1.5V, 1.8V, 2.9V and 3.1V output voltages. For APPLICATIONS other output voltage options from 1.5V to 3.5V, • CDMACellularHandsets pleasecontactTIsalesoffice. • WidebandCDMACellularHandsets • GSMCellularHandsets • PortableInformationAppliances Typical Application Circuit 1(B2) 5(B1) VIN VOUT 1PF LP3984 1PF Tant 3(A2) 4 VEN NC 2(A1) Note:PinNumbersinparenthesisindicateDSBGApackage. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2001–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LP3984 SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 www.ti.com Block Diagram PinDescriptions Name DSBGA (1) SOT Function V A2 3 EnableInputLogic,EnableHigh EN GND A1 2 CommonGround V B1 5 OutputVoltageoftheLDO OUT V B2 1 InputVoltageoftheLDO IN N.C. 4 NoConnection (1) ThepinnumberingschemefortheDSBGApackagewasrevisedinApril2002toconformtoJEDECstandards.Onlythepinnumbers wererevised.Nochangestothephysicallocationsoftheinputs/outputsweremade.Forreferencepurposes,theobsoletenumbering schemehadGNDaspin1,V aspin2,V aspin3andV aspin4. OUT IN EN Connection Diagram SOT-23-5Package Figure1. TopView SeePackageNumberDBV DSBGA,4-BumpPackage Figure2. TopView SeePackageNumberYPB0004 2 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:LP3984

LP3984 www.ti.com SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. ABSOLUTE MAXIMUM RATINGS(1)(2)(3) V ,V −0.3to6.5V IN EN V –0.3to(V +0.3)≤6.5V OUT IN JunctionTemperature 150°C StorageTemperature −65°Cto+150°C LeadTemp. 235°C PadTemp.(4) 235°C MaximumPowerDissipation(5) SOT-23-5 364mW DSBGA 235mW ESDRating(6) HumanBodyModel 2kV MachineModel 200V (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttothepotentialattheGNDpin. (3) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand specifications. (4) AdditionalinformationonpadtemperaturecanbefoundintheTIAN-1112ApplicationReport(). (5) TheAbsoluteMaximumpowerdissipationdependsontheambienttemperatureandcanbecalculatedusingtheformula:P =(T - D J T )/θ ,whereT isthejunctiontemperature,T istheambienttemperature,andθ isthejunction-to-ambientthermalresistance.The A JA J A JA 364mWratingforSOT23-5appearingunderAbsoluteMaximumRatingsresultsfromsubstitutingtheAbsoluteMaximumjunction temperature,150°C,forT,70°CforT ,and220°C/Wforθ .Morepowercanbedissipatedsafelyatambienttemperaturesbelow J A JA 70°C.Lesspowercanbedissipatedsafelyatambienttemperaturesabove70°C.TheAbsoluteMaximumpowerdissipationforSOT23- 5canbeincreasedby4.5mWforeachdegreebelow70°C,anditmustbederatedby4.5mWforeachdegreeabove70°C. (6) Thehumanbodymodelis100pFdischargedthrough1.5kΩresistorintoeachpin.Themachinemodelisa200pFcapacitordischarged directlyintoeachpin. OPERATING RATINGS(1)(2) V 2.5to6V IN V 0to(V +0.3V)≤6V EN IN JunctionTemperature −40°Cto+125°C ThermalResistance θ (SOT23-5) 220°C/W JA θ (DSBGA) 340°C/W JA MaximumPowerDissipation(3) SOT-23-5 250mW DSBGA 160mW (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) AllvoltagesarewithrespecttothepotentialattheGNDpin. (3) LiketheAbsoluteMaximumpowerdissipation,themaximumpowerdissipationforoperationdependsontheambienttemperature.The 250mWratingforSOT23-5appearingunderOperatingRatingsresultsfromsubstitutingthemaximumjunctiontemperaturefor operation,125°C,forT,70°CforT ,and220°C/Wforθ usingtheformula:P =(T -T )/θ .Morepowercanbedissipatedat J A JA D J A JA ambienttemperaturesbelow70°C.Lesspowercanbedissipatedatambienttemperaturesabove70°C.Themaximumpower dissipationforoperationcanbeincreasedby4.5mWforeachdegreebelow70°C,anditmustbederatedby4.5mWforeachdegree above70°C. Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LP3984

LP3984 SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 www.ti.com ELECTRICAL CHARACTERISTICS Unlessotherwisespecified:V =2.5Vfor1.5Vand1.8Voptions,V =V +0.5foroutputoptionshigherthan2.5V,C =1 IN IN OUT IN µF,I =1mA,C =1µF,tantalum.TypicalvaluesandlimitsappearinginstandardtypefaceareforT =25°C.Limits OUT OUT J appearinginboldfacetypeapplyovertheentirejunctiontemperaturerangeforoperation,−40°Cto+125°C. (1) (2) Limit Symbol Parameter Conditions Typ Units Min Max OutputVoltageTolerance −1.2 1.2 %of −2.0 2.0 V OUT(nom) LineRegulationError V =2.5Vto4.5Vfor1.5Vand1.8V IN options 0.05 −0.15 0.15 %/V ΔVOUT VIN=(VOUT+0.5V)to4.5VforVoltage optionshigherthan2.5V LoadRegulationError(3) I =1mAto150mA OUT 0.002 0.005 LP3984IM5(SOT-23-5) %/mA LP3984IBP(DSBGA) 0.0009 0.002 V =V +0.2V, IN OUT(nom) f=1kHz, 60 I =50mA,Figure4 OUT PSRR PowerSupplyRejectionRatio dB V =V +0.2V, IN OUT(nom) f=10kHz, 40 I =50mA,Figure4 OUT I QuiescentCurrent V =1.4V,I =0mA 80 125 Q EN OUT V =1.4V,I =0to150mA 110 150 µA EN OUT V =0.4V 0.005 1.2 EN DropoutVoltage(4) I =1mA 0.6 2.5 OUT I =50mA 25 40 OUT mV I =100mA 50 80 OUT I =150mA 75 120 OUT I ShortCircuitCurrentLimit OutputGrounded SC 600 mA (SteadyState) I PeakOutputCurrent V ≥V -5% 600 300 mA OUT(PK) OUT OUT(nom) T Turn-OnTime(5) 20 µs ON e OutputNoiseVoltage BW=10Hzto100kHz, n 90 µVrms C =1µFtant. OUT I MaximumInputCurrentatEN V =0.4andV =6.0 ±1 nA EN EN IN V MaximumLowLevelInputVoltage V =2.5to6.0V IL IN 0.4 V atEN V MinimumHighLevelInputVoltage V =2.5to6.0V IH IN 1.4 V atEN C OutputCapacitor Capacitance 1 22 µF OUT ESR 2 10 Ω ThermalShutdownTemperature 160 °C TSD ThermalShutdownHysteresis 20 °C (1) MinandMaxLimitsareverifiedbydesign,test,orstatisticalanalysis.Typical(Typ.)numbersarenotverified,butdorepresentthemost likelynorm. (2) Thetargetoutputvoltage,whichislabeledV ,isthedesiredvoltageoption. OUT(nom) (3) Anincreaseintheloadcurrentresultsinaslightdecreaseintheoutputvoltageandviceversa. (4) Dropoutvoltageistheinput-to-outputvoltagedifferenceatwhichtheoutputvoltageis100mVbelowitsnominalvalue.This specificationdoesnotapplyforinputvoltagesbelow2.5V. (5) Turn-ontimeistimemeasuredbetweentheenableinputjustexceedingV andtheoutputvoltagejustreaching95%ofitsnominal IH value. 4 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:LP3984

LP3984 www.ti.com SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 Figure3. LineTransientInputTestSignal Figure4. PSRRInputTestSignal Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LP3984

LP3984 SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS Unlessotherwisespecified,C =C =1µFTantalum,V =2.5for1.5Vand1.8Voptions,V =V +0.2Vforoutput IN OUT IN IN OUT optionshigherthan2.5V,T =25°C,EnablepinistiedtoV . A IN PowerSupplyRejectionRatio(V =3.5V) PowerSupplyRejectionRatio(V =3.5V) IN IN Figure5. Figure6. PowerSupplyRejectionRatio(V =3.5V) PowerSupplyRejectionRatio(LP3984-1.5,V =2.5V) IN IN Figure7. Figure8. LineTransientResponse(LP3984-3.1) LineTransientResponse(LP3984-3.1) Figure9. Figure10. 6 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:LP3984

LP3984 www.ti.com SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unlessotherwisespecified,C =C =1µFTantalum,V =2.5for1.5Vand1.8Voptions,V =V +0.2Vforoutput IN OUT IN IN OUT optionshigherthan2.5V,T =25°C,EnablepinistiedtoV . A IN LineTransientResponse(LP3984-3.1) LineTransientResponse(LP3984-3.1) Figure11. Figure12. LineTransientResponse(LP3984-3.1) LineTransientResponse(LP3984-3.1) Figure13. Figure14. StartUpResponse StartUpResponse Figure15. Figure16. Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LP3984

LP3984 SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) Unlessotherwisespecified,C =C =1µFTantalum,V =2.5for1.5Vand1.8Voptions,V =V +0.2Vforoutput IN OUT IN IN OUT optionshigherthan2.5V,T =25°C,EnablepinistiedtoV . A IN EnableResponse LoadTransientResponse(LP3984-3.1 Figure17. Figure18. LoadTransientResponse(LP3984-3.1) LoadTransientResponse(V =4.2V) IN Figure19. Figure20. 8 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:LP3984

LP3984 www.ti.com SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 APPLICATION HINTS External Capacitors Like any low-dropout regulator, the LP3984 requires external capacitors for regulator stability. The LP3984 is specifically designed for portable applications requiring minimum board space and smallest components. These capacitorsmustbecorrectlyselectedforgoodperformance. Input Capacitors An input capacitance of ≊ 1 µF is required between the LP3984 input pin and ground (the amount of the capacitancemaybeincreasedwithoutlimit). This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean analogground.Anygoodqualityceramic,tantalum,orfilmcapacitormaybeusedattheinput. Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low- impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input, itmustbespecifiedbythemanufacturertohaveasurgecurrentratingsufficientfortheapplication. There are no requirements for the ESR on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will be ≊ 1 µF over the entire operating temperaturerange. Output Capacitor The LP3984 is designed specifically to work with tantalum output capacitors. A tantalum capacitor in 1 to 22 µF rangewith2Ωto10Ω ESRrangeissuitableintheLP3984applicationcircuit. Itmayalsobepossibletousefilmcapacitorsattheoutput,butthesearenotasattractiveforreasonsofsizeand cost. The output capacitor must meet the requirement for minimum amount of capacitance and also have an ESR (EquivalentSeriesResistance)valuewhichiswithinastablerange(2Ω to10Ω). No-Load Stability The LP3984 will remain stable and in regulation with no external load. This is specially important in CMOS RAM keep-aliveapplications. On/Off Input Operation The LP3984 is turned off by pulling the V pin low, and turned on by pulling it high. If this feature is not used, EN the V pin should be tied to V to keep the regulator output on at all times. To assure proper operation, the EN IN signalsourceusedtodrivetheV inputmustbeabletoswingaboveandbelowthespecifiedturn-on/offvoltage EN thresholdslistedintheElectricalCharacteristicssectionunderV andV . IL IH Fast On-Time The LP3984 output is turned on after V voltage reaches its final value (1.23V nominal). To speed up this ref process, the noise reduction capacitor at the bypass pin is charged with an internal 70 µA current source. The current source is turned off when the bandgap voltage reaches approximately 95% of its final value. The turn-on time is determined by the time constant of the bypass capacitor. The smaller the capacitor value, the shorter the turn-on time, but less noise gets reduced. As a result, turn-on time and noise reduction need to be taken into designconsiderationwhenchoosingthevalueofthebypasscapacitor. Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LP3984

LP3984 SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 www.ti.com DSBGA Mounting The DSBGA package requires specific mounting techniques which are detailed in the AN-1112 Application Report (SNVA009). Referring to the section PCB Layout ; note that the pad style which must be used with the 5- pinpackageisNSMD(non-soldermaskdefined)type. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the DSBGAdevice. DSBGA Light Sensitivity Exposing the DSBGA device to direct sunlight will cause mis-operation of the device. Light sources such as halogenlampscanaffectelectricalperformanceifbroughtneartothedevice. The wavelengths which have most detrimental effect are reds and infra-reds, which means that the fluorescent lighting used inside most buildings has very little effect on performance. A DSBGA test board was brought to within 1 cm of a fluorescent desk lamp and the effect on the regulated output voltage was negligible, showing a deviationoflessthan0.1%fromnominal. 10 SubmitDocumentationFeedback Copyright©2001–2013,TexasInstrumentsIncorporated ProductFolderLinks:LP3984

LP3984 www.ti.com SNVS160F–OCTOBER2001–REVISEDOCTOBER2013 REVISION HISTORY ChangesfromRevisionD(May2013)toRevisionE Page • ChangedlayoutofNationalDataSheettoTIformat;correcttypos ................................................................................... 10 ChangesfromRevisionE(May2013)toRevisionF Page • Deleted2.0Voptionwhichisobsoleted................................................................................................................................ 1 • Deletedlegacyorderingtable ............................................................................................................................................... 3 Copyright©2001–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LP3984

PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2016 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LP3984IMF-1.5 LIFEBUY SOT-23 DBV 5 1000 TBD Call TI Call TI LEAB LP3984IMF-1.5/NOPB LIFEBUY SOT-23 DBV 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM LEAB & no Sb/Br) LP3984IMF-1.8 LIFEBUY SOT-23 DBV 5 1000 TBD Call TI Call TI LEBB LP3984IMF-1.8/NOPB LIFEBUY SOT-23 DBV 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM LEBB & no Sb/Br) LP3984IMF-3.1/NOPB LIFEBUY SOT-23 DBV 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LEDB & no Sb/Br) LP3984IMFX-1.8 NRND SOT-23 DBV 5 TBD Call TI Call TI -40 to 125 LEBB LP3984IMFX-1.8/NOPB LIFEBUY SOT-23 DBV 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LEBB & no Sb/Br) LP3984ITP-2.9/NOPB LIFEBUY DSBGA YPB 4 250 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) LP3984ITPX-1.8/NOPB LIFEBUY DSBGA YPB 4 3000 Green (RoHS SNAGCU Level-1-260C-UNLIM -40 to 125 & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2016 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2016 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LP3984IMF-1.5 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP3984IMF-1.5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP3984IMF-1.8 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP3984IMF-1.8/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP3984IMF-3.1/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP3984IMFX-1.8/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LP3984ITP-2.9/NOPB DSBGA YPB 4 250 178.0 8.4 1.02 1.09 0.66 4.0 8.0 Q1 LP3984ITPX-1.8/NOPB DSBGA YPB 4 3000 178.0 8.4 1.02 1.09 0.66 4.0 8.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 20-Dec-2016 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LP3984IMF-1.5 SOT-23 DBV 5 1000 210.0 185.0 35.0 LP3984IMF-1.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP3984IMF-1.8 SOT-23 DBV 5 1000 210.0 185.0 35.0 LP3984IMF-1.8/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP3984IMF-3.1/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LP3984IMFX-1.8/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LP3984ITP-2.9/NOPB DSBGA YPB 4 250 210.0 185.0 35.0 LP3984ITPX-1.8/NOPB DSBGA YPB 4 3000 210.0 185.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE YPB0004 DSBGA - 0.575 mm max height SCALE 12.000 DIE SIZE BALL GRID ARRAY B E A BALL A1 CORNER D 0.575 MAX C SEATING PLANE 0.15 BALL TYP 0.11 0.05 C 0.5 B SYMM 0.5 D: Max = 1.019 mm, Min =0 .958 mm E: Max = 0.905 mm, Min =0 .844 mm A 1 2 0.18 SYMM 4X 0.16 0.015 C A B 4215097/B 07/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com

EXAMPLE BOARD LAYOUT YPB0004 DSBGA - 0.575 mm max height DIE SIZE BALL GRID ARRAY (0.5) 4X ( 0.16) 1 2 A SYMM (0.5) B SYMM LAND PATTERN EXAMPLE SCALE:40X ( 0.16) 0.05 MAX METAL UNDER 0.05 MIN METAL SOLDER MASK SOLDER MASK ( 0.16) OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED SOLDER MASK (PREFERRED) DEFINED SOLDER MASK DETAILS NOT TO SCALE 4215097/B 07/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). www.ti.com

EXAMPLE STENCIL DESIGN YPB0004 DSBGA - 0.575 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 4X ( 0.3) (R0.05) TYP 1 2 A SYMM (0.5) TYP B METAL TYP SYMM SOLDER PASTE EXAMPLE BASED ON 0.125mm THICK STENCIL SCALE:50X 4215097/B 07/2016 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com

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