LMV721 LMV722 www.ti.com SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 10-MHz LOW-NOISE LOW-VOLTAGE LOW-POWER OPERATIONAL AMPLIFIERS CheckforSamples:LMV721,LMV722 FEATURES 1 LMV721(cid:1)DBV or DCK PACKAGE • Power-SupplyVoltageRange:2.2Vto5.5V (TOP VIEW) • LowSupplyCurrent:930mA/Amplifierat2.2V • HighUnity-GainBandwidth:10MHz OUT 1 5 VCC+ • Rail-to-RailOutputSwing VCC− 2 IN+ 3 4 IN− – 600-Ω Load:120mVFromEitherRailat 2.2V – 2-kΩLoad:50mVFromEitherRailat2.2V LMV722(cid:1)D, DGK, OR DRG PACKAGE • InputCommon-ModeVoltageRangeIncludes (TOP VIEW) Ground • InputVoltageNoise:9nV/√Hzatf=1kHz 1OUT 1 8 VCC+ 1IN− 2 7 2OUT APPLICATIONS 1IN+ 3 6 2IN− • CellularandCordlessPhones VCC− 4 5 2IN+ • ActiveFilterandBuffers • LaptopsandPDAs • BatteryPoweredElectronics DESCRIPTION/ORDERING INFORMATION The LMV721 (single) and LMV722 (dual) are low-noise low-voltage low-power operational amplifiers that can be designed into a wide range of applications. The LMV721 and LMV722 have a unity-gain bandwidth of 10 MHz, a slewrateof5V/ms,andaquiescentcurrentof930 mA/amplifierat2.2V. The LMV721 and LMV722 are designed to provide optimal performance in low-voltage and low-noise systems. They provide rail-to-rail output swing into heavy loads. The input common-mode voltage range includes ground, and the maximum input offset voltage are 3.5 mV (over recommended temperature range) for the devices. Their capacitiveloadcapabilityisalsogoodatlowsupplyvoltages.Theoperatingrangeisfrom2.2Vto5.5V. ORDERINGINFORMATION(1) T PACKAGE(2) ORDERABLEPARTNUMBER TOP-SIDEMARKING(3) A Reelof3000 LMV721IDCKR SC-70–DCK RK_ Single Reelof250 LMV721IDCKT SOT-23–DBV Reelof3000 LMV721IDBVR RBF_ –40°Cto105°C Reelof2500 LMV722IDR SOIC–D MV722I Tubeof75 LMV722ID Dual VSSOP–DGK Reelof2500 LMV722IDGKR R6_ QFN–DRG Reelof2500 LMV722IDRGR ZYY (1) Forthemostcurrentpackageandorderinginformation,seethePackageOptionAddendumattheendofthisdocument,orseetheTI websiteatwww.ti.com. (2) Packagedrawings,thermaldata,andsymbolizationareavailableatwww.ti.com/packaging. (3) DBV/DCK/DGK:Theactualtop-sidemarkinghasoneadditionalcharacterthatdesignatesthewaferfab/assemblysite. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsofTexas Instrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2005–2010,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LMV721 LMV722 SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 www.ti.com Typical Application R5 VCC C1 Electret R3 Microphone R4 Input VCC R1 − Output + C2 R2 Absolute Maximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT V –V Supplyvoltage(2) 6 V CC+ CC– V Differentialinputvoltage(3) ±Supplyvoltage V ID Dpackage(5) 97 DBVpackage(5) 206 q Packagethermalimpedance(4) DCKpackage(5) 252 °C/W JA DGKpackage(5) 172 DRGpackage(6) 50.7 T Operatingvirtual-junctiontemperature 150 °C J T Storagetemperaturerange –65 150 °C stg (1) Stressesbeyondthoselistedunderabsolutemaximumratingsmaycausepermanentdamagetothedevice.Thesearestressratings only,andfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderrecommendedoperating conditionsisnotimplied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Allvoltagevalues(exceptdifferentialvoltagesandV specifiedforthemeasurementofI )arewithrespecttothenetworkGND. CC OS (3) DifferentialvoltagesareatIN+withrespecttoIN−. (4) MaximumpowerdissipationisafunctionofT(max),q ,andT .Themaximumallowablepowerdissipationatanyallowableambient J JA A temperatureisP =(T(max)–T )/q .OperatingattheabsolutemaximumT of150°Ccanaffectreliability. D J A JA J (5) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-7. (6) ThepackagethermalimpedanceiscalculatedinaccordancewithJESD51-5. Recommended Operating Conditions MIN MAX UNIT V –V Supplyvoltage 2.2 5.5 V CC+ CC– T Operatingvirtual-junctiontemperature –40 105 °C J ESD Protection TYP UNIT Human-BodyModel 2000 V MachineModel 100 V 2 SubmitDocumentationFeedback Copyright©2005–2010,TexasInstrumentsIncorporated ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 www.ti.com SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 Electrical Characteristics V =2.2V,V =GND,V =V /2,V =V /2,andR >1MΩ(unlessotherwisenoted) CC+ CC− ICR CC+ O CC+ L PARAMETER TESTCONDITIONS T MIN TYP MAX UNIT J 25°C 0.02 3 V Inputoffsetvoltage mV IO –40°Cto105°C 3.5 TCV Inputoffsetvoltageaveragedrift 25°C 0.6 mV/°C IO I Inputbiascurrent 25°C 260 nA IB I Inputoffsetcurrent 25°C 25 nA IO 25°C 70 88 CMMR Common-moderejectionratio V =0Vto1.3V dB ICR –40°Cto105°C 64 V =2.2Vto5V, 25°C 80 90 PSRR Power-supplyrejectionratio CC+ dB VO=0,VICR=0 –40°Cto105°C 70 CMRR≥50dB –0.3 V Inputcommon-modevoltage 25°C V ICR 1.3 R =600Ω, 25°C 75 81 L VO=0.75Vto2V –40°Cto105°C 70 A Large-signalvoltagegain dB VD R =2kΩ, 25°C 75 84 L VO=0.5Vto2.1V –40°Cto105°C 70 25°C 2.090 2.125 R =600ΩtoV /2 L CC+ –40°Cto105°C 2.065 25°C 0.071 0.120 –40°Cto105°C 0.145 V Outputswing V O 25°C 2.150 2.177 R =2kΩtoV /2 L CC+ –40°Cto105°C 2.125 25°C 0.056 0.080 –40°Cto105°C 0.105 Sourcing,V =0V, 25°C 10 14.9 O VIN(diff)=±0.5V –40°Cto105°C 5 I Outputcurrent mA O Sinking,V =2.2V, 25°C 10 17.6 O VIN(diff)=±0.5V –40°Cto105°C 5 25°C 0.93 1.3 LMV721 –40°Cto105°C 1.5 I Supplycurrent mA CC 25°C 1.81 2.4 LMV722 –40°Cto105°C 2.6 SR Slewrate(1) 25°C 4.9 V/ms GBW Gainbandwidthproduct 25°C 10 MHz Φ Phasemargin 25°C 67.4 ° m G Gainmargin 25°C –9.8 dB m V Input-referredvoltagenoise f=1kHz 25°C 9 nV/√Hz n I Input-referredcurrentnoise f=1kHz 25°C 0.3 pA/√Hz n f=1kHz,AV=1, THD Totalharmonicdistortion 25°C 0.004 % R =600Ω,V =500mV L O pp (1) Connectedasvoltagefollowerwith1-Vstepinput.Numberspecifiedistheslowerofthepositiveandnegativeslewrate. Copyright©2005–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 www.ti.com Electrical Characteristics V =5V,V =GND,V =V /2,V =V /2,andR >1MΩ(unlessotherwisenoted) CC+ CC− ICR CC+ O CC+ L PARAMETER TESTCONDITIONS T MIN TYP MAX UNIT J 25°C –0.08 3 V Inputoffsetvoltage mV IO –40°Cto105°C 3.5 TCV Inputoffsetvoltageaveragedrift 25°C 0.6 mV/°C IO I Inputbiascurrent 25°C 260 nA IB I Inputoffsetcurrent 25°C 25 nA IO 25°C 80 89 CMMR Common-moderejectionratio V =0Vto4.1V dB ICR –40°Cto105°C 75 V =2.2Vto5V, 25°C 70 90 PSRR Power-supplyrejectionratio CC+ dB VO=0,VICR=0 –40°Cto105°C 64 CMRR≥50dB –0.3 V Inputcommon-modevoltage 25°C V ICR 4.1 R =600Ω, 25°C 80 87 L VO=0.75Vto4.8V –40°Cto105°C 70 A Large-signalvoltagegain dB VD R =2kΩ, 25°C 80 94 L VO=0.7Vto4.9V –40°Cto105°C 70 25°C 4.84 4.882 R =600ΩtoV /2 L CC+ –40°Cto105°C 4.815 25°C 0.134 0.19 –40°Cto105°C 0.215 V Outputswing V O 25°C 4.93 4.952 R =2kΩtoV /2 L CC+ –40°Cto105°C 4.905 25°C 0.076 0.11 –40°Cto105°C 0.135 Sourcing,V =0V, 25°C 20 52.6 O VIN(diff)=±0.5V –40°Cto105°C 12 I Outputcurrent mA O Sinking,V =2.2V, 25°C 15 23.7 O VIN(diff)=±0.5V –40°Cto105°C 8.5 25°C 1.03 1.4 LMV721 –40°Cto105°C 1.7 I Supplycurrent mA CC 25°C 2.01 2.4 LMV722 –40°Cto105°C 2.8 SR Slewrate(1) 25°C 5.25 V/ms GBW Gainbandwidthproduct 25°C 10 MHz Φ Phasemargin 25°C 72 ° m G Gainmargin 25°C –11 dB m V Input-referredvoltagenoise f=1kHz 25°C 8.5 nV/√Hz n I Input-referredcurrentnoise f=1kHz 25°C 0.2 pA/√Hz n f=1kHz,AV=1, THD Totalharmonicdistortion 25°C 0.001 % R =600Ω,V =500mV L O pp (1) Connectedasvoltagefollowerwith1-Vstepinput.Numberspecifiedistheslowerofthepositiveandnegativeslewrate. 4 SubmitDocumentationFeedback Copyright©2005–2010,TexasInstrumentsIncorporated ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 www.ti.com SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 TYPICAL CHARACTERISTICS SUPPLYCURRENT SOURCINGCURRENT vs vs SUPPLYVOLTAGE OUTPUTVOLTAGE 1.4 100 V =2.2V CC 1.3 TA=125°C TA=85°C 1.2 A m A –m 1.1 ent– 10 rrent 1 Curr Cu 0.9 ng y ci ppl 0.8 TA=25°C our Su 0.7 TA=–40°C –S 1 I–CC 0.6 Isource 0.5 0.1 0.4 0.001 0.01 0.1 1 10 2 2.5 3 3.5 4 4.5 5 5.5 6 OutputVoltageReferencedtoV –V V –SupplyVoltage–V CC CC SOURCINGCURRENT SINKINGCURRENT vs vs OUTPUTVOLTAGE OUTPUTVOLTAGE 100 100 VCC=5V VCC=2.2V A m A m – ent 10 nt– 10 Curr urre g C n g ci n ur ki o n S 1 Si 1 – – Isource Isink 0.1 0.1 0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10 OutputVoltageReferencedtoV –V OutputVoltageReferencedtoV –V CC CC Copyright©2005–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 www.ti.com TYPICAL CHARACTERISTICS (continued) SINKINGCURRENT OUTPUTVOLTAGESWING vs vs OUTPUTVOLTAGE SUPPLYVOLTAGE 100 0.3 V =5V CC 0.2 V A m m – nt– 10 age 0.1 urre Volt C et 0 g s kin Off Sin 1 ut -0.1 p – n Isink V–IIO -0.2 0.1 -0.3 0.001 0.01 0.1 1 10 2 2.5 3 3.5 4 4.5 5 OutputVoltageReferencedtoV –V V –SupplyVoltage–V CC CC INPUTOFFSETVOLTAGE INPUTOFFSETVOLTAGE vs vs INPUTCOMMON-MODEVOLTAGE INPUTCOMMON-MODEVOLTAGE 0.3 0.3 V =2.2V V =5V CC CC 0.2 0.2 V V m m – – ge 0.1 ge 0.1 a a olt olt V V et 0 et 0 s s Off Off ut -0.1 ut -0.1 p p n n I I – – VIO -0.2 VIO -0.2 -0.3 -0.3 0 0.3 0.6 0.9 1.2 1.5 0 0.5 1 1.5 2 2.5 3 3.5 4 V –InputCommon-ModeVoltage–V V –InputCommon-ModeVoltage–V ICR ICR 6 SubmitDocumentationFeedback Copyright©2005–2010,TexasInstrumentsIncorporated ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 www.ti.com SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 TYPICAL CHARACTERISTICS (continued) INPUTVOLTAGE INPUTVOLTAGE vs vs OUTPUTVOLTAGE OUTPUTVOLTAGE 0.3 0.3 V =2.2V V =5V CC CC 0.2 0.2 mV mV – – ge 0.1 ge 0.1 a a olt olt V V al 0 al 0 nti nti e e er er Diff -0.1 Diff -0.1 ut ut p p In -0.2 In -0.2 -0.3 -0.3 0 0.5 1 1.5 2 2.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 OutputVoltage–V OutputVoltage–V INPUTVOLTAGENOISE INPUTCURRENTNOISE vs vs FREQUENCY FREQUENCY 100 100 √HzHz √HzHz µV/ pA/ 10 – – e e s s oi oi N 10 N ge nt Volta Curre 1 ut ut p p n n I I 1 0.1 1.E1+001 1.1E0+002 1.E1+k03 1.1E0+k04 11.E0+00k5 1.E1+001 1.1E0+002 1.E1+k03 1.E1+00k4 f–Frequency–Hz f–Frequency–Hz Copyright©2005–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 www.ti.com TYPICAL CHARACTERISTICS (continued) PSRR PSRR vs vs FREQUENCY FREQUENCY 120 120 V =2.2V V =5V CC CC 100 100 80 80 B B d d – – R 60 R 60 R R S S P P 40 40 20 20 0 0 1.1E0+002 1.E1+k03 1.1E0+k04 11.E0+00k5 1.E1+M06 1.1E0+M07 1.1E0+002 1.E1+k03 1.1E0+k04 11.E0+00k5 1.E1+M06 1.1E0+M07 f–Frequency–Hz f–Frequency–Hz GAINANDPHASE GAINANDPHASE vs vs FREQUENCY FREQUENCY 80 130 80 130 V =2.2V V =5V CC CC 70 115 70 115 Phase Phase 60 100 60 100 Gain 50 85 50 Gain 85 40 70 g 40 70 g B e B e d d d d – 30 55 – – 30 55 – ain ase ain ase G 20 40 h G 20 40 h P P 10 25 10 25 0 10 0 10 -10 -5 -10 -5 -20 -20 -20 -20 1.E1+k03 1.1E0+k04 11.E0+00k5 1.E1+M06 1.1E0+M07 11.E00+M08 1.E1+k03 1.1E0+k04 11.E0+00k5 1.E1M+06 1.1E0+M07 11.0E0+M08 f–Frequency–Hz f–Frequency–Hz 8 SubmitDocumentationFeedback Copyright©2005–2010,TexasInstrumentsIncorporated ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 www.ti.com SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 TYPICAL CHARACTERISTICS (continued) SLEWRATE THD vs vs SUPPLYVOLTAGE FREQUENCY 6 1 V =2.2V CC 5.8 5.6 0.1 s 5.4 µ V/ – 5.2 % e at – 0.01 R 5 D w Rising TH Sle 4.8 – R 4.6 S 0.001 4.4 Falling 4.2 0.0001 4 110000 1010k0 11000k00 1010000k00 2 2.5 3 3.5 4 4.5 5 f–Frequency–Hz V –SupplyVoltage–V CC PULSERESPONSE PULSERESPONSE V =R 5=V,2Rk©= ,2C kΩ=,2C1.=2 2n1F.,2R nF=,R0©= 0Ω V R= 5=V2,kR©=, C2 k=Ω2,1C.2=n 2F1,.R2 n=F,2R.1©= 2.1Ω CC L L L L O O CC L L L L O O n n o o si si vi vi Di Di r r e e p p V V 5 5 2 2 0. 0. 2µsperDivision 2µsperDivision Copyright©2005–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 www.ti.com TYPICAL CHARACTERISTICS (continued) PULSERESPONSE PULSERESPONSE V R= 5=V2,kR©=, C2 k=Ω2,1C.2=n 2F1,.R2 n=F,9R.5©= 9.5Ω V R= 5=V1,0Rk©= ,1C0 k=Ω2,1C.2=n 2F1,.R2 n=F,0R©= 0Ω CC L L L L O O CC L L L L O O n n o o si si vi vi Di Di r r e e p p V V 5 5 2 2 0. 0. 2µsperDivision 2µsperDivision PULSERESPONSE PULSERESPONSE V R= 5=V6,0R0©=, 6C00=Ω2,1C.2=n F2,1R.2 n=F0,R©= 0Ω V = R2.2=V2,R©,=C 2=Ω2,C.12=n 2F.,1R2 n=F,0R©= 0Ω CC L L L L O O CC L L L L O O Division Division per per V V m 5 2 0 0. 25 2µsperDivision 1µsperDivision PULSERESPONSE PULSERESPONSE VCC= 2R.L2=V,2RkL©= ,2C kLΩ=,2C.L1=2 2n.F1,2R nOF=,R0O©= 0Ω VCC= R2L.2=V1,0RkL=© ,1C0 Lk=Ω,2C.1L2=n 2F.1,2R On=F,0R©O= 0Ω n n o o si si vi vi Di Di r r e e p p V V m m 0 0 5 5 2 2 1µsperDivision 1µsperDivision 10 SubmitDocumentationFeedback Copyright©2005–2010,TexasInstrumentsIncorporated ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 www.ti.com SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 TYPICAL CHARACTERISTICS (continued) PULSERESPONSE PULSERESPONSE V = 2R.2V=,1R0=k ©10, CkΩ=,C2.1=2 2n.1F2, RnF,=R2.2= ©2.2Ω V = R2.2=V1,0Rk=© 1,0C kΩ=,2C.12= n2F.1,2R nF=,1R1.5= ©11.5Ω CC L L L L O O CC L L L L O O n n o o si si vi vi Di Di r r e e p p V V m m 0 0 5 5 2 2 1µsperDivision 1µsperDivision PULSERESPONSE V = R2.2=V6,0R0©= ,6C00=Ω1,C.89=n 1F.,8R9 n=F,0R©= 0Ω CC L L L L O O n o si vi Di r e p V m 0 5 2 1µsperDivision Copyright©2005–2010,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLink(s):LMV721LMV722

LMV721 LMV722 SLOS470C–JUNE2005–REVISEDSEPTEMBER2010 www.ti.com REVISION HISTORY ChangesfromRevisionB(August2010)toRevisionC Page • Changedalltemperatureparametersfrommaxof85°Cto105°C ...................................................................................... 1 • Changedsupplyvoltagemaxvalueto6inAbsoluteMaximumRatingstable ..................................................................... 2 • ChangedsupplyvoltageMAXvalueto5.5inRecommendedOperatingConditionstable ................................................. 2 • ChangedA ,V testconditonsforR =600Ω:0.75Vto4.8V ........................................................................................ 4 VD O L • ChangedA ,V testconditonsforR =2kΩΩ:0.75Vto4.8V ....................................................................................... 4 VD O L 12 SubmitDocumentationFeedback Copyright©2005–2010,TexasInstrumentsIncorporated ProductFolderLink(s):LMV721LMV722

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LMV721IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 105 (RBFA, RBFM) & no Sb/Br) LMV721IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 105 (RKA, RKM) & no Sb/Br) LMV721IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 105 (RKA, RKM) & no Sb/Br) LMV722ID ACTIVE SOIC D 8 75 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 105 MV722I & no Sb/Br) LMV722IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 105 R6E & no Sb/Br) LMV722IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 105 R6E & no Sb/Br) LMV722IDR ACTIVE SOIC D 8 2500 Green (RoHS NIPDAU Level-1-260C-UNLIM -40 to 105 MV722I & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LMV722 : •Automotive: LMV722-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LMV721IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 LMV721IDBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 LMV721IDCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 LMV721IDCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 LMV721IDCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3 LMV721IDCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 LMV722IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 LMV722IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2020 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LMV721IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 LMV721IDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 LMV721IDCKR SC70 DCK 5 3000 180.0 180.0 18.0 LMV721IDCKR SC70 DCK 5 3000 202.0 201.0 28.0 LMV721IDCKT SC70 DCK 5 250 202.0 201.0 28.0 LMV721IDCKT SC70 DCK 5 250 180.0 180.0 18.0 LMV722IDGKR VSSOP DGK 8 2500 346.0 346.0 35.0 LMV722IDR SOIC D 8 2500 340.5 338.1 20.6 PackMaterials-Page2

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PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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