LMS202E www.ti.com SNLS160D–DECEMBER2002–REVISEDAPRIL2013 LMS202E 15KV ESD Rated, 5V Single Supply TIA/EIA-232 Dual Transceivers CheckforSamples:LMS202E FEATURES DESCRIPTION 1 • ESDProtectionforRS-232I/OPins The LMS202E features two transmitters and two 2 receivers for RS-232 communication. It has a DC-to- • ±15kV-IEC10004-2(EN61000-4-2)Contact DC converter that permits the device to operate with Discharge only a single +5V power supply. The on-chip DC-to- • ±8kV-IEC10004-2(EN61000-4-2)Air-Gap DC converter which utilizes four external 0.1μF Discharge capacitors to generate dual internal power supplies forRS-232compatibleoutputlevels. • ±15kVHumanBodyModel • Single+5VPowerSupply The device meet EIA/TIA-232E and CCITT V.28 specifications up to 230kbits/sec. The LMS202E is • 230KbpsDataRate availableina16pinnarrowandwideSOICpackage. • On-BoardDC-to-DCConverter The transmitter outputs and receiver inputs have • 0.1μFChargePumpCapacitors ±15kV electrostatic discharge (ESD) protection. The • Drop-InReplacementtoMaxim’sMAX202E LMS202E survives a ± 15kV ESD event to the RS- 232 input and output pins when subjected according APPLICATIONS to Human Body Model or IEC 1000-4-2 (EN61000-4- 2), air-gap specification. It survives a ±8kV discharge • POSEquipment(Barcodereader) when subjected to IEC 1000-4-2 (EN61000-4-2), • Hand-HeldEquipment contact specification. This device is designed for use • GeneralPurposeRS-232Communication inharshenvironmentswhereESDisaconcern. CONNECTION DIAGRAM AND TYPICAL CIRCUIT 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2002–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LMS202E SNLS160D–DECEMBER2002–REVISEDAPRIL2013 www.ti.com PINDESCRIPTIONS PinNumber PinName PinFunction 1,3 C1+,C1− Externalcapacitorconnectionpins.RecommendedexternalcapacitorC1=0.1μF(6.3V) 2 V+ PositivesupplyforTIA/EIA-232Edrivers.RecommendedexternalcapacitorC4=0.1μF(6.3V) 4,5 C2+,C2− Externalcapacitorconnectionpins.RecommendedexternalcapacitorC2=0.1μF(16V) 6 V− NegativesupplyforTIA/EIA-232Edrivers.RecommendedexternalcapacitorC3=0.1μF(16V) 7,14 T1out,T2out TransmitteroutputpinsconformtoTIA/EIA-232Elevels.Thetypicaltransmitteroutputswingis±8V whenloaded3kΩloadtoground.Theopen-circuitoutputvoltageswingsfrom(V+−0.6V)toV− 8,13 R1in,R2in ReceiverinputsacceptTIA/EIA-232 9,12 R1outandR2out ReceiveroutputpinsareTTL/CMOScompatible 10,11 Tin1,Tin2 TransmitterinputpinsareTTL/CMOScompatible.Inputsoftransmitterdonothavepull-upresistors. Connectallunusedtransmitterinputstoground 15 GND Groundpin 16 V Powersupplypinforthedevice,+5V(±10%) S Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. ABSOLUTE MAXIMUM RATINGS (1)(2) V −0.3Vto6V S V+ (V −0.3V)to+14V S V− +0.3Vto−14V DriverInputVoltage,T −0.3Vto(V++0.3V) IN ReceiverInputVoltage,R ±30V IN DriverOutputVoltageT (V−−0.3Vto(V++ O 0.3V) ReceiverOutputVoltageR −0.3to(V +0.3) O S ShortCircuitDuration,T Continuous O ESDRating IEC1000-4-2) (3) See (4) Air-GapDischarge 15kV ContactDischarge 8kV HumanBodyModel (5) See (4) 15kV See (6) 2kV ESDRating(MM) 200V (7)(6) SolderingInformation InfraredorConvection (20sec.) 235°C JunctionTemperature 150°C StorageTemperatureRange −65°Cto+150°C (1) AbsoluteMaximumRatingsindicatelimitsbeyondwhichdamagetothedevicemayoccur.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobefunctional,butspecificperformanceisnotensured.Forspecificationsandthetestconditions,seethe ElectricalCharacteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) IEC1000-4-2,330Ωinserieswith150pF (4) ESDratingappliestopins7,813and14 (5) HumanBodyModel,1.5kΩinserieswith100pF (6) ESDratingappliestopins1,2,3,4,5,6,9,10,11,12,15and16 (7) Machinemodel,0Ωinserieswith200pF 2 SubmitDocumentationFeedback Copyright©2002–2013,TexasInstrumentsIncorporated ProductFolderLinks:LMS202E

LMS202E www.ti.com SNLS160D–DECEMBER2002–REVISEDAPRIL2013 OPERATING RATINGS SupplyVoltageV 4.5Vto5.5V S AmbientTemperatureRange,T Commercial(C) 0°Cto+70°C A Industrial(I) −40°Cto+85°C PackageThermalResistance (1) SO 71°C/W WSO 55°C/W (1) ThemaximumpowerdissipationisafunctionofT θ andT Themaximumallowablepowerdissipationatanyambient J(MAX), JA, A. temperatureisP =(T −T )/θ AllnumbersapplyforpackagessoldereddirectlyontoaPCboard. D J(MAX) A JA. ELECTRICAL CHARACTERISTICS Overrecommendedoperatingsupplyandtemperaturerangesunlessotherwisespecified C1=C2=C3=C4=Cbp=0.1μF Symbol Parameter Conditions Min (1) Typ(2) Max (1) Units DCCharacteristics I SupplyCurrent NoLoad,T =25°C 1 7 mA S A Logic I InputLeakageCurrent T =0VtoV ±10 μA INPUT IN S V InputLogicThesholdLow T 0.8 V THL IN V InputLogicThesholdHigh T 2.0 V THH IN V TTL/CMOSOutputVoltage R ,I =3.2mA 0.4 V OL OUT OUT Low V TTL/CMOSOutputVoltage R ,I =−1.0mA 3.5 V −0.1 V OH OUT OUT S High RS-232ReceiverInputs V ReceiverInputVoltageRange −30 +30 V RI V ReceiverInputThesholdLow V =5V,T =25°C 0.8 1.4 V RTHL S A V ReceiverInputThesholdHigh V =5V,T =25°C 2 2.4 V RTHH S A V ReceiverInputHysteresis V =5V 0.2 0.6 1.0 V HYST S R ReceiverInputResistance V =5V,T =25°C 3 5 7 kΩ I S A RS-232TransmitterOutputs V TransmitterOutputVoltage Alltransmittersloadedwith3kΩtoGND ±5 ±8 V O Swing R OutputResistance V =V+=V−=0V, 300 Ω O S V =±2V O I OutputShortCircuitCurrent ±11 ±60 mA OS TimingCharacteristics DR MaximumDataRate C =50pFto1000pF, 230 kbps L R =3kΩto7kΩ L T ReceiverPropagationDelay C =150pF 0.08 1 μs RPLH L T RPHL T TransmitterPropagation R =3kΩ,C =2500pF 2.4 μs DPLH L L T Delay Alltransmittersloaded DPHL V TransitionRegionSlewRate T =25°C,V =5V 3 6 30 V/μs SLEW A S C =50pFto1000pF,R =3kΩto7kΩ L L Measuredfrom+3Vto−3Vorviceversa ESDPerformance:TransmitterOutputsandReceiverInputs ESDRating HumanBodyModel ±15 kV IEC1000-4-2,Contact ±8 IEC1000-4-2,Air-gap ±15 (1) Alllimitsarespecifiedbytestingorstatisticalanalysis (2) TypicalValuesrepresentthemostlikelyparametricnorm. Copyright©2002–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LMS202E

LMS202E SNLS160D–DECEMBER2002–REVISEDAPRIL2013 www.ti.com TYPICAL CHARACTERISTICS TransmitterOutputHighVoltagevs.LoadCapacitance TransmitterSlewRatevs.LoadCapacitance 4 SubmitDocumentationFeedback Copyright©2002–2013,TexasInstrumentsIncorporated ProductFolderLinks:LMS202E

LMS202E www.ti.com SNLS160D–DECEMBER2002–REVISEDAPRIL2013 APPLICATION INFORMATION CAPACITOR SELECTION The recommended capacitors are 0.1μF. However, larger capacitors for the charge pump may be used to minimizedripplesonV+andV−pins. POWER SUPPLY DECOUPLING In some applications that are sensitive to power supply noise from the charge pump, place a decoupling capacitor, Cbp, from V to GND. Use at least a 0.1µF capacitor or the same size as the charge pump capacitors S (C1−C4). CHARGED PUMP The dual internal charged-pump provides the ±10V to the to transmitters. Using capacitor C1, the charge pump converts +5V to +10V then stores the +10V in capacitor C3. The charge pump uses capacitor C2 to invert the +10Vto−10V.The−10VisthenstoredincapacitorC4. ELECTROSTATIC DISCHARGE PROTECTION ESD protection has been placed at all pins to protect the device from ESD. All pins except for the transmitter output pins (pins 7 and 14) and receiver input pins (pins 8 and 13) have a ESD rating of 2kV Human Body Model (HBM) and 200V Machine Model (MM). The RS-232 bus pins (pins 7, 8, 13 and 14) have a more robust ESD protection. The RS-232 bus pins have a ESD rating of 15kV HBM and IEC 1000-4-2, air-gap. In addition the bus pins meet an ESD rating of 8kV with IEC 1000-4-2, contact. The ESD structures can withstand a high ESD event under the following conditions: powered-on, powered-off, and Input connected to high and low with outputs unloaded. HUMAN BODY MODEL The Human Body Model is an ESD testing standard, defined in Mil-STD-883C method 3015.7. It simulates a human discharging an ESD charge to the IC device. The rise time is approximately 10 ns and decay time is approximately 150 ns. The waveform is obtained by discharging 2kV volts capacitor through a resistor, R2 = 1.5 kΩ.Thepeakcurrentisapproximately1.33A. Figure1. HBMESDTestModel Copyright©2002–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LMS202E

LMS202E SNLS160D–DECEMBER2002–REVISEDAPRIL2013 www.ti.com Figure2. HBMWaveform MACHINE MODEL TheMachineModelisthestandardESDtestmethodinJapanandtheautomotiveindustry.Itsimulatesacharge on large object discharging through the IC device. This takes place in automated test and handling systems. The equipment can accumulate static charge due to improper grounding, which is transmitted through the IC when it ispickedandplaced. Thewaveformisobtainedbydischarging400Vvoltscapacitortothedevice.Resistor,R2=0Ω. The parasitic inductance, L, from the PCB affects the peak current and period of the waveform. For L = 0.5µF, the peak current is approximately 7A with a period of 60 ns. For L = 2.5µH, the peak current is reduced to 4A withaperiodof140ns. Figure3. MMESDModel Figure4. MMWaveform 6 SubmitDocumentationFeedback Copyright©2002–2013,TexasInstrumentsIncorporated ProductFolderLinks:LMS202E

LMS202E www.ti.com SNLS160D–DECEMBER2002–REVISEDAPRIL2013 IEC 1000-4-2 (EN61000-4-2) The European Union requires ESD immunity testing for all electronic products as a condition for EMC Mark before shipping to any member countries. This is not a IC requirement but an overall system requirement. IEC 1000-4-2specifiesESDtestingbothbycontactandair-gapdischarge.ESDtestingbycontactaregenerallymore repeatable than air-gap but is less realistic to actual ESD event. However, air-gap discharge is more realistic but ESDresultsmayvarywidelydependentonenvironmentalconditions(temperature,humidity,....)Thewaveformis obtained by discharging 150pF capacitor through a resistor, R2 = 330Ω. A typical peak current may be high as 37Awith10kV. Figure5. IECESDModel Figure6. IECWaveform Copyright©2002–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LMS202E

LMS202E SNLS160D–DECEMBER2002–REVISEDAPRIL2013 www.ti.com REVISION HISTORY ChangesfromRevisionC(April2013)toRevisionD Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 7 8 SubmitDocumentationFeedback Copyright©2002–2013,TexasInstrumentsIncorporated ProductFolderLinks:LMS202E

PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LMS202ECM/NOPB ACTIVE SOIC D 16 48 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 LMS202ECM & no Sb/Br) LMS202ECMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 LMS202ECM & no Sb/Br) LMS202EIM/NOPB ACTIVE SOIC D 16 48 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 LMS202EIM & no Sb/Br) LMS202EIMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 LMS202EIM & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 25-Feb-2015 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LMS202ECMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 LMS202EIMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LMS202ECMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 LMS202EIMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 PackMaterials-Page2

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