[ For High Quality and/or Reliability Equipment Notice for TAIYO YUDEN Products (Automotive Electronic Equipment / Industrial Equipment) ] Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product information in this catalog is as of October 2018. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or use of our products. Please note that TAIYO YUDEN shall not be in any way responsible for any damages and defects in products or equipment incorporating our products, which are caused under the conditions other than those specified in this catalog or individual product specification sheets. ■ Please contact TAIYO YUDEN for further details of product specifications as the individual product specification sheets are available. ■ Please conduct validation and verification of our products in actual condition of mounting and operating environment before using our products. ■ The products listed in this catalog are intended for use in general electronic equipment (e.g., AV equipment, OA equipment, home electric appliances, office equipment, information and communication equipment), medical equipment classified as Class I or II by IMDRF, industrial equipment, and automotive interior applications, etc. Please be sure to contact TAIYO YUDEN for further information before using the products for any equipment which may directly cause loss of human life or bodily injury (e.g., transportation equipment including, without limitation, automotive powertrain control system, train control system, and ship control system, traffic signal equipment, medical equipment classified as Class III by IMDRF). Please do not incorporate our products into any equipment requiring high levels of safety and/or reliability (e.g., aerospace equipment, aviation equipment*, medical equipment classified as Class IV by IMDRF, nuclear control equipment, undersea equipment, military equipment). *Note: There is a possibility that our products can be used only for aviation equipment that does not directly affect the safe operation of aircraft (e.g., in-flight entertainment, cabin light, electric seat, cooking equipment) if such use meets requirements specified separately by TAIYO YUDEN. Please be sure to contact TAIYO YUDEN for further information before using our products for such aviation equipment. When our products are used even for high safety and/or reliability-required devices or circuits of general electronic equipment, it is strongly recommended to perform a thorough safety evaluation prior to use of our products and to install a protection circuit as necessary. Please note that unless you obtain prior written consent of TAIYO YUDEN, TAIYO YUDEN shall not be in any way responsible for any damages incurred by you or third parties arising from use of the products listed in this catalog for any equipment requiring inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN as described above. ■ Information contained in this catalog is intended to convey examples of typical performances and/or applications of our products and is not intended to make any warranty with respect to the intellectual property rights or any other related rights of TAIYO YUDEN or any third parties nor grant any license under such rights. ■ Please note that the scope of warranty for our products is limited to the delivered our products themselves and TAIYO YUDEN shall not be in any way responsible for any damages resulting from a fault or defect in our products. Notwithstanding the foregoing, if there is a written agreement (e.g., supply and purchase agreement, quality assurance agreement) signed by TAIYO YUDEN and your company, TAIYO YUDEN will warrant our products in accordance with such agreement. ■ The contents of this catalog are applicable to our products which are purchased from our sales offices or authorized distributors (hereinafter“ TAIYO YUDEN’s official sales channel”). Please note that the contents of this catalog are not applicable to our products purchased from any seller other than TAIYO YUDEN’s official sales channel. ■ Caution for Export Some of our products listed in this catalog may require specific procedures for export according to“ U.S. Export Administration Regulations”,“ Foreign Exchange and Foreign Trade Control Law” of Japan, and other applicable regulations. Should you have any questions on this matter, please contact our sales staff. 19

Automotive Application Guide We classify automotive electronic equipment into the following four application categories and set usable application categories for each of our products. When using our products for automotive electronic equipment, please be sure to check such application categories and use our products accordingly. Should you have any questions on this matter, please contact us. Category Automotive Electronic Equipment (Typical Example) ・Engine ECU (Electronically Controlled Fuel Injector) A ・Cruise Control Unit u t ・4WS (4 Wheel Steering) o m POWERTRAIN ・Automatic Transmission o t ・Power Steering iv e ・HEV/PHV/EV Core Control (Battery, Inverter, DC-DC) A ・Automotive Locator (Car location information providing device), etc. p p ・ABS (Anti-Lock Brake System) lic a ・ESC (Electronic Stability Control) t SAFETY io ・Airbag n ・ADAS (Equipment that directly controls running, turning and stopping), etc. G u ・Wiper id ・Automatic Door e ・Power Window ・Keyless Entry System BODY & CHASSIS ・Electric Door Mirror ・Interior Lighting ・LED Headlight ・TPMS (Tire Pressure Monitoring System) ・Anti-Theft Device (Immobilizer), etc. ・Car Infotainment System ・ITS/Telematics System INFOTAINMENT ・Instrument Cluster ・ADAS (Sensor, Equipment that is not interlocked with safety equipment or powertrain), etc. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 15

MULTILAYER CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITORS REFLOW REFLOW A EACE-C Q-2Q02000 ■PART NUMBER J M K 3 1 6 △ B J 1 0 6 M L H T △ △＝Blank space ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫ ①Rated voltage ③End termination Code Rated voltage［VDC］ Code End termination A 4 K Plated J 6.3 J Soft Termination L 10 S Cu Internal Electrodes (For High Frequency) E 16 F High Reliability Application C E T 25 R G 35 ④Dimension（L×W） A U 50 Dimensions M Type EIA（inch） IC H 100 （L×W）［mm］ Q 250 063 0.6 × 0.3 0201 C S 630 1.0 × 0.5 0402 A 105 P 0.52× 1.0 ※ 0204 A ②Series name 1.6 × 0.8 0603 C 107 IT Code Series name 0.8 × 1.6 ※ 0306 O M Multilayer ceramic capacitor 212 2.0 × 1.25 0805 R V Multilayer ceramic capacitor for high frequency 1.25× 2.0 ※ 0508 S W LW reverse type multilayer capacitor 316 3.2 × 1.6 1206 325 3.2 × 2.5 1210 432 4.5 × 3.2 1812 Note : ※LW reverse type（□WK） only ⑤Dimension tolerance Code Type L［mm］ W［mm］ T［mm］ △ ALL Standard Standard Standard 063 0.6±0.05 0.3±0.05 0.3±0.05 105 1.0±0.10 0.5±0.10 0.5±0.10 107 1.6＋0.15/－0.05 0.8＋0.15/－0.05 0.8＋0.15/－0.05 A 0.85±0.10 212 2.0＋0.15/－0.05 1.25＋0.15/－0.05 1.25＋0.15/－0.05 316 3.2±0.20 1.6±0.20 1.6±0.20 325 3.2±0.30 2.5±0.30 2.5±0.30 105 1.0＋0.15/－0.05 0.5＋0.15/－0.05 0.5＋0.15/－0.05 107 1.6＋0.20/－0 0.8＋0.20/－0 0.8＋0.20/－0 B 0.85±0.10 212 2.0＋0.20/－0 1.25＋0.20/－0 1.25＋0.20/－0 316 3.2±0.30 1.6±0.30 1.6±0.30 105 1.0＋0.20/－0 0.5＋0.20/－0 0.5＋0.20/－0 C 107 1.6＋0.25/－0 0.8＋0.25/－0 0.8＋0.25/－0 212 2.0＋0.25/－0 1.25＋0.25/－0 1.25＋0.25/－0 212 2.0±0.15 1.25±0.15 0.85±0.15 1.15±0.20 K 316 3.2±0.20 1.6±0.20 1.6±0.20 325 3.2±0.50 2.5±0.30 2.5±0.30 Note: ｃｆ. STANDARD EXTERNAL DIMENSIONS △= Blank space ⑥Temperature characteristics code ■High dielectric type Applicable Temperature Capacitance Tolerance Code Ref. Temp.［℃］ Capacitance change standard range［℃］ tolerance code ±10％ K BJ EIA X5R －55～＋ 85 25 ±15％ ±20％ M ±10％ K C6 EIA X6S －55～＋105 25 ±22％ ±20％ M ±10％ K B7 EIA X7R －55～＋125 25 ±15％ ±20％ M ±10％ K C7 EIA X7S －55～＋125 25 ±22％ ±20％ M ±10％ K D7 EIA X7T －55～＋125 25 ＋22％/－33％ ±20％ M hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 18 19

■Temperature compensating type Applicable Temperature Capacitance Tolerance Code Ref. Temp.［℃］ Capacitance change standard range［℃］ tolerance code ±0.1pF B JIS CG 20 ±0.25pF C ±0.5pF D CG －55～＋125 0±30ppm/℃ ±1pF F EIA C0G 25 ±2％ G ±5％ J ⑦Nominal capacitance ⑨Thickness Code Code Thickness［mm］ Nominal capacitance （example） P 0.3 0R5 0.5pF T 010 1pF V 0.5 100 10pF C 0.7(107type or more) 101 100pF A 0.8 102 1,000pF D 0.85(212type or more) C 103 0.01μF F 1.15 E R 104 0.1μF G 1.25 A 105 1.0μF L 1.6 M 106 10μF N 1.9 IC 107 100μF M 2.5 C Note : R＝Decimal point A ⑩Special code P A ⑧Capacitance tolerance Code Special code C Code Capacitance tolerance H MLCC for Industrial and Automotive IT A ±0.05pF O B ±0.1pF ⑪Packaging R S C ±0.25pF Code Packaging D ±0.5pF F φ178mm Taping （2mm pitch） G ±2％ R φ178mm Embossed Taping （4mm pitch） J ±5％ T φ178mm Taping （4mm pitch） K ±10％ φ178mm Taping （4mm pitch, 1000 pcs/reel） P M ±20％ 325 type（Thickness code M） ⑫Internal code Code Internal code △ Standard hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 19

■STANDARD EXTERNAL DIMENSIONS W Dimension [mm] （inch） Type( EIA ) L L W T *1 e 0.6±0.03 0.3±0.03 0.3±0.03 0.15±0.05 □MK063（0201） T T (0.024±0.001) (0.012±0.001) (0.012±0.001) (0.006±0.002) □MK105（0402） 1.0±0.05 0.5±0.05 0.5±0.05 0.25±0.10 V e □MF105（0402） (0.039±0.002) (0.020±0.002) (0.020±0.002) (0.010±0.004) 0.52±0.05 1.0±0.05 0.3±0.05 0.18±0.08 □WK105（0204）※ P (0.020±0.002) (0.039±0.002) (0.012±0.002) (0.007±0.003) □MK107（0603） 1.6±0.10 0.8±0.10 0.8±0.10 0.35±0.25 A □MF107（0603） (0.063±0.004) (0.031±0.004) (0.031±0.004) (0.014±0.010) L 1.6±0.10 0.8±0.10 0.8±0.10 0.35＋0.3/－0.25 □MJ107（0603） A (0.063±0.004) (0.031±0.004) (0.031±0.004) (0.014＋0.012/－0.010) W 1.6±0.10 0.8±0.10 0.7±0.10 0.35±0.25 □VS107（0603） C (0.063±0.004) (0.031±0.004) (0.028±0.004) (0.014±0.010) 0.8±0.10 1.6±0.10 0.5±0.05 0.25±0.15 □WK107（0306）※ V C (0.031±0.004) (0.063±0.004) (0.020±0.002) (0.010±0.006) E T 0.85±0.10 R D A □MK212（0805） 2.0±0.10 1.25±0.10 (0.033±0.004) 0.5±0.25 M e □MF212（0805） (0.079±0.004) (0.049±0.004) 1.25±0.10 (0.020±0.010) IC (0.049±0.004) G ※ LW reverse type C 0.85±0.10 D A 2.0±0.10 1.25±0.10 (0.033±0.004) 0.5＋0.35/－0.25 □MJ212（0805） P (0.079±0.004) (0.049±0.004) 1.25±0.10 （0.020＋0.014/－0.010） A G C (0.049±0.004) IT 2.0±0.10 1.25±0.10 0.85±0.10 0.5±0.25 □VS212（0805） D O (0.079±0.004) (0.049±0.004) (0.033±0.004) (0.020±0.010) R 1.25±0.15 2.0±0.15 0.85±0.10 0.3±0.2 S □WK212（0508）※ D (0.049±0.006) (0.079±0.006) (0.033±0.004) (0.012±0.008) 1.15±0.10 Ｆ □MK316（1206） 3.2±0.15 1.6±0.15 (0.045±0.004) 0.5＋0.35/－0.25 □MF316（1206） (0.126±0.006) (0.063±0.006) 1.6±0.20 （0.020＋0.014/－0.010） L (0.063±0.008) 1.15±0.10 Ｆ 3.2±0.15 1.6±0.15 (0.045±0.004) 0.6＋0.4/－0.3 □MJ316（1206） (0.126±0.006) (0.063±0.006) 1.6±0.20 （0.024＋0.016/－0.012） L (0.063±0.008) 1.15±0.10 F (0.045±0.004) □MK325（1210） 3.2±0.30 2.5±0.20 1.9±0.20 0.6±0.3 N □MF325（1210） (0.126±0.012) (0.098±0.008) (0.075±0.008) (0.024±0.012) 2.5±0.20 M (0.098±0.008) 1.9±0.20 N 3.2±0.30 2.5±0.20 (0.075±0.008) 0.6＋0.4/－0.3 □MJ325（1210） (0.126±0.012) (0.098±0.008) 2.5±0.20 （0.024＋0.016/－0.012） M (0.098±0.008) 4.5±0.40 3.2±0.30 2.5±0.20 0.9±0.6 □MK432（1812） M (0.177±0.016) (0.126±0.012) (0.098±0.008) (0.035±0.024) Note : ※. LW reverse type, *1.Thickness code hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 20 19

■STANDARD QUANTITY Dimension Standard quantity［pcs］ Type EIA（inch） ［ｍｍ］ Code Paper tape Embossed tape 063 0201 0.3 T 15000 － 0402 0.5 V 105 10000 － 0204 ※ 0.30 P 0.7 C 4000 － 0.8 A 3000 0603 0.8 A － 107 （Soft Termination） 3000 0.8 A － （Soft Termination） 0306 ※ 0.50 V － 4000 0.85 D 4000 － 1.25 G － 3000 0805 212 2000 1.25 G － （Soft Termination） C 0508 ※ 0.85 D 4000 － E 1.15 F － 3000 R 316 1206 1.6 L － 2000 A M 1.15 F 325 1210 1.9 N － 2000 IC 2.5 M － 500（T），1000（P） C 432 1812 2.5 M － 500 A P Note : ※.LW Reverse type（□WK） A C IT O R S hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 21

■PART NUMBER ・ All the Multilayer Ceramic Capacitors of the catalog lineup are RoHS compliant. ・ Capacitance tolerance code is applied to [] of part number. ・ All the Multilayer Ceramic Capacitors in the catalog lineup are applicable for reflow-soldering. Note) ・ The exchange of individual specifications is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels. ・ *1: Automotive (AEC-Q200 Qualified) products for BODY & CHASSIS, and INFOTAINMENT. Please check ”Automotive Application Guide” for further details before using the products. 　　＜　 　A　EC　-　Q　2　00　 　：AEC-Q200 qualified＞ 　　　　　All the Multilayer Ceramic Capacitors of　*1 marks are tested based on the test conditions and methods defined in AEC-Q200 by family item. 　　　　　125℃　products：　AEC-Q200　Grade1 (we conduct the evaluation at the test condition of Grade1.) 　　　　　105℃　products：　AEC-Q200　Grade2 (we conduct the evaluation at the test condition of Grade2.) 　　　　　　85℃　products：　AEC-Q200　Grade3 (we conduct the evaluation at the test condition of Grade3.) 　　　　　Please consult with TAIYO YUDEN’s official sales channel for the details of the product specification and AEC-Q200 test results, etc., 　　　　　and please review and　approve TAIYO YUDEN's product specification before ordering. ・ *2: Industrial　products and Medical products ・ *3: For standard case size, please kindly refer to ④Dimension, ⑤Dimension tolerance,　⑨Thickness and STANDARD EXTERNAL DIMENSIONS. Multilayer Ceramic Capacitors (High dielectric type) C ●105TYPE (Demension:1.0×0.5mm　JIS:1005　EIA:0402） E R 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　0.5mm thickness（V） A M Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note IC UMK105 BJ471[]VHF X5R 470p ±10, ±20 2.5 200 0.5±0.05 *1, *2 C UMK105 BJ102[]VHF X5R 1000p ±10, ±20 2.5 200 0.5±0.05 *1, *2 A UMK105 BJ152[]VHF X5R 1500p ±10, ±20 2.5 200 0.5±0.05 *1, *2 P UMK105 BJ222[]VHF X5R 2200p ±10, ±20 2.5 200 0.5±0.05 *1, *2 A UMK105 BJ332[]VHF X5R 3300p ±10, ±20 2.5 200 0.5±0.05 *1, *2 C UMK105 BJ472[]VHF 50 X5R 4700p ±10, ±20 2.5 200 0.5±0.05 *1, *2 IT UMK105 BJ682[]VHF X5R 6800p ±10, ±20 2.5 150 0.5±0.05 *1, *2 O UMK105 BJ103[]VHF X5R 0.01μ ±10, ±20 3.5 200 0.5±0.05 *1, *2 R UMK105 BJ223[]VHF X5R 0.022μ ±10, ±20 5 200 0.5±0.05 *1, *2 S UMK105 BJ473[]VHF X5R 0.047μ ±10, ±20 5 200 0.5±0.05 *1, *2 UMK105 BJ104[]VHF X5R 0.1μ ±10, ±20 10 150 0.5±0.05 *1, *2 TMK105 BJ472[]VHF X5R 4700p ±10, ±20 2.5 200 0.5±0.05 *1, *2 TMK105 BJ682[]VHF X5R 6800p ±10, ±20 2.5 200 0.5±0.05 *1, *2 TMK105 BJ103[]VHF X5R 0.01μ ±10, ±20 3.5 200 0.5±0.05 *1, *2 TMK105 BJ153[]VHF X5R 0.015μ ±10, ±20 3.5 200 0.5±0.05 *1, *2 TMK105 BJ223[]VHF X5R 0.022μ ±10, ±20 3.5 200 0.5±0.05 *1, *2 25 TMK105 BJ333[]VHF X5R 0.033μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 TMK105 BJ473[]VHF X5R 0.047μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 TMK105 BJ104[]VHF X5R 0.1μ ±10, ±20 5 150 0.5±0.05 *1, *2 TMK105 BJ224[]VHF X5R 0.22μ ±10, ±20 10 150 0.5±0.05 *1, *2 TMK105ABJ474[]VHF X5R 0.47μ ±10, ±20 10 150 0.5±0.10 *1, *2 EMK105 BJ103[]VHF X5R 0.01μ ±10, ±20 3.5 200 0.5±0.05 *1, *2 EMK105 BJ153[]VHF X5R 0.015μ ±10, ±20 3.5 200 0.5±0.05 *1, *2 EMK105 BJ223[]VHF X5R 0.022μ ±10, ±20 3.5 200 0.5±0.05 *1, *2 EMK105 BJ333[]VHF X5R 0.033μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 EMK105 BJ473[]VHF 16 X5R 0.047μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 EMK105 BJ104[]VHF X5R 0.1μ ±10, ±20 5 150 0.5±0.05 *1, *2 EMK105 BJ224[]VHF X5R 0.22μ ±10, ±20 10 150 0.5±0.05 *1, *2 EMK105ABJ474[]VHF X5R 0.47μ ±10, ±20 10 150 0.5±0.10 *1, *2 EMK105 BJ105[]VHF X5R 1μ ±10, ±20 10 150 0.5±0.05 *1, *2 LMK105 BJ333[]VHF X5R 0.033μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 LMK105 BJ473[]VHF X5R 0.047μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 LMK105 BJ104[]VHF X5R 0.1μ ±10, ±20 5 150 0.5±0.05 *1, *2 LMK105 BJ224[]VHF 10 X5R 0.22μ ±10, ±20 5 150 0.5±0.05 *1, *2 LMK105ABJ474[]VHF X5R 0.47μ ±10, ±20 10 150 0.5±0.10 *1, *2 LMK105 BJ105[]VHF X5R 1μ ±10, ±20 10 150 0.5±0.05 *1, *2 LMK105ABJ225[]VHF X5R 2.2μ ±10, ±20 10 150 0.5±0.10 *1, *2 JMK105 BJ104[]VHF X5R 0.1μ ±10, ±20 5 150 0.5±0.05 *1, *2 JMK105 BJ224[]VHF X5R 0.22μ ±10, ±20 5 150 0.5±0.05 *1, *2 JMK105 BJ474[]VHF X5R 0.47μ ±10, ±20 10 150 0.5±0.05 *1, *2 6.3 JMK105 BJ105[]VHF X5R 1μ ±10, ±20 10 150 0.5±0.05 *1, *2 JMK105 BJ225[]VHF X5R 2.2μ ±10, ±20 10 150 0.5±0.05 *1, *2 JMK105BBJ475MVHF X5R 4.7μ ±20 10 150 0.5+0.15/-0.05 *1, *2 AMK105 BJ225[]VHF X5R 2.2μ ±10, ±20 10 150 0.5±0.05 *1, *2 AMK105BBJ475MVHF 4 X5R 4.7μ ±20 10 150 0.5+0.15/-0.05 *1, *2 AMK105CBJ106MVHF X5R 10μ ±20 10 150 0.5+0.20/-0 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 22 19

■PART NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.5mm thickness（V） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK105 B7221[]VHF X7R 220p ±10, ±20 2.5 200 0.5±0.05 *1, *2 UMK105 B7331[]VHF X7R 330p ±10, ±20 2.5 200 0.5±0.05 *1, *2 UMK105 B7471[]VHF X7R 470p ±10, ±20 2.5 200 0.5±0.05 *1, *2 UMK105 B7681[]VHF X7R 680p ±10, ±20 2.5 200 0.5±0.05 *1, *2 UMK105 B7102[]VHF X7R 1000p ±10, ±20 2.5 200 0.5±0.05 *1, *2 UMK105 B7152[]VHF X7R 1500p ±10, ±20 2.5 200 0.5±0.05 *1, *2 UMK105 B7222[]VHF X7R 2200p ±10, ±20 2.5 200 0.5±0.05 *1, *2 50 UMK105 B7332[]VHF X7R 3300p ±10, ±20 2.5 200 0.5±0.05 *1, *2 UMK105 B7472[]VHF X7R 4700p ±10, ±20 2.5 150 0.5±0.05 *1, *2 UMK105 B7682[]VHF X7R 6800p ±10, ±20 2.5 150 0.5±0.05 *1, *2 UMK105 B7103[]VHF X7R 0.01μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 UMK105 B7223[]VHF X7R 0.022μ ±10, ±20 10 200 0.5±0.05 *1, *2 UMK105 B7473[]VHF X7R 0.047μ ±10, ±20 10 200 0.5±0.05 *1, *2 UMK105 B7104[]VHF X7R 0.1μ ±10, ±20 10 150 0.5±0.05 *1, *2 TMK105 B7472[]VHF X7R 4700p ±10, ±20 2.5 200 0.5±0.05 *1, *2 TMK105 B7682[]VHF X7R 6800p ±10, ±20 2.5 200 0.5±0.05 *1, *2 TMK105 B7103[]VHF X7R 0.01μ ±10, ±20 3.5 200 0.5±0.05 *1, *2 C TMK105 B7153[]VHF 25 X7R 0.015μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 E TMK105 B7223[]VHF X7R 0.022μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 R TMK105 B7333[]VHF X7R 0.033μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 A TMK105 B7473[]VHF X7R 0.047μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 M TEMMKK110055 BB77110034[[]]VVHHFF XX77RR 0.00.11μμ ±±1100,, ±±2200 31.05 125000 00..55±±00..0055 **11,, **22 IC EMK105 B7153[]VHF X7R 0.015μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 C EMK105 B7223[]VHF X7R 0.022μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 A EMK105 B7333[]VHF 16 X7R 0.033μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 P EMK105 B7473[]VHF X7R 0.047μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 A EMK105 B7104[]VHF X7R 0.1μ ±10, ±20 5 150 0.5±0.05 *1, *2 C EMK105 B7224[]VHF X7R 0.22μ ±10, ±20 10 150 0.5±0.05 *1, *2 IT LMK105 B7473[]VHF X7R 0.047μ ±10, ±20 3.5 150 0.5±0.05 *1, *2 O LMK105 B7104[]VHF 10 X7R 0.1μ ±10, ±20 5 150 0.5±0.05 *1, *2 R LMK105 B7224[]VHF X7R 0.22μ ±10, ±20 10 150 0.5±0.05 *1, *2 S JMK105 B7104[]VHF X7R 0.1μ ±10, ±20 5 150 0.5±0.05 *1, *2 JMK105 B7224[]VHF 6.3 X7R 0.22μ ±10, ±20 10 150 0.5±0.05 *1, *2 JMK105 B7474[]VHF X7R 0.47μ ±10, ±20 10 150 0.5±0.05 *1, *2 AMK105 B7474[]VHF 4 X7R 0.47μ ±10, ±20 10 150 0.5±0.05 *1, *2 ●107TYPE　 (Dimension:1.6×0.8mm　JIS:1608　EIA:0603） 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK107 BJ104[]AHT X5R 0.1μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 UMK107 BJ224[]AHT X5R 0.22μ ±10, ±20 10 150 0.8±0.10 *1, *2 50 UMK107 BJ474[]AHT X5R 0.47μ ±10, ±20 10 150 0.8±0.10 *1, *2 UMK107ABJ105[]AHT X5R 1μ ±10, ±20 10 150 0.8+0.15/-0.05 *1, *2 GMK107 BJ223[]AHT X5R 0.022μ ±10, ±20 2.5 200 0.8±0.10 *1, *2 GMK107 BJ473[]AHT X5R 0.047μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 GMK107 BJ104[]AHT X5R 0.1μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 35 GMK107 BJ224[]AHT X5R 0.22μ ±10, ±20 10 150 0.8±0.10 *1, *2 GMK107ABJ474[]AHT X5R 0.47μ ±10, ±20 10 150 0.8+0.15/-0.05 *1, *2 GMK107 BJ105[]AHT X5R 1μ ±10, ±20 10 150 0.8±0.10 *1, *2 TMK107 BJ223[]AHT X5R 0.022μ ±10, ±20 2.5 200 0.8±0.10 *1, *2 TMK107 BJ473[]AHT X5R 0.047μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 TMK107 BJ104[]AHT X5R 0.1μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 TMK107 BJ224[]AHT 25 X5R 0.22μ ±10, ±20 5 150 0.8±0.10 *1, *2 TMK107 BJ474[]AHT X5R 0.47μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 TMK107 BJ105[]AHT X5R 1μ ±10, ±20 10 150 0.8±0.10 *1, *2 TMK107BBJ225[]AHT X5R 2.2μ ±10, ±20 10 150 0.8+0.20/-0 *1, *2 EMK107 BJ104[]AHT X5R 0.1μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 EMK107 BJ224[]AHT X5R 0.22μ ±10, ±20 5 150 0.8±0.10 *1, *2 EMK107 BJ474[]AHT X5R 0.47μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 16 EMK107 BJ105[]AHT X5R 1μ ±10, ±20 5 150 0.8±0.10 *1, *2 EMK107ABJ225[]AHT X5R 2.2μ ±10, ±20 10 150 0.8+0.15/-0.05 *1, *2 EMK107BBJ475[]AHT X5R 4.7μ ±10, ±20 10 150 0.8+0.20/-0 *1, *2 LMK107 BJ474[]AHT X5R 0.47μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 LMK107 BJ105[]AHT X5R 1μ ±10, ±20 5 150 0.8±0.10 *1, *2 LMK107 BJ225[]AHT 10 X5R 2.2μ ±10, ±20 10 150 0.8±0.10 *1, *2 LMK107 BJ475[]AHT X5R 4.7μ ±10, ±20 10 150 0.8±0.10 *1, *2 LMK107BBJ106MAHT X5R 10μ ±20 10 150 0.8+0.20/-0 *1, *2 JMK107 BJ105[]AHT X5R 1μ ±10, ±20 5 150 0.8±0.10 *1, *2 JMK107 BJ225[]AHT X5R 2.2μ ±10, ±20 10 150 0.8±0.10 *1, *2 6.3 JMK107 BJ475[]AHT X5R 4.7μ ±10, ±20 10 150 0.8±0.10 *1, *2 JMK107ABJ106[]AHT X5R 10μ ±10, ±20 10 150 0.8+0.15/-0.05 *1, *2 AMK107ABJ106[]AHT X5R 10μ ±10, ±20 10 150 0.8+0.15/-0.05 *1, *2 4 AMK107BBJ226MAHT X5R 22μ ±20 10 150 0.8+0.20/-0 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 23

■PART NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）, D7 : X7T（－55～＋125℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK107 B7102[]AHT X7R 1000p ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7152[]AHT X7R 1500p ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7222[]AHT X7R 2200p ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7332[]AHT X7R 3300p ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7472[]AHT X7R 4700p ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7682[]AHT X7R 6800p ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7103[]AHT X7R 0.01μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 50 UMK107 B7153[]AHT X7R 0.015μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7223[]AHT X7R 0.022μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7333[]AHT X7R 0.033μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 B7683[]AHT X7R 0.068μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 UMK107 B7104[]AHT X7R 0.1μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 UMK107 C7224[]AHTE X7S 0.22μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 GMK107 B7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 GMK107 B7104[]AHT X7R 0.1μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 C GMK107 B7224[]AHT 35 X7R 0.22μ ±10, ±20 10 150 0.8±0.10 *1, *2 E GMK107 B7474[]AHT X7R 0.47μ ±10, ±20 10 150 0.8±0.10 *1, *2 R GMK107AB7105[]AHT X7R 1μ ±10, ±20 10 150 0.8+0.15/-0.05 *1, *2 A TMK107 B7223[]AHT X7R 0.022μ ±10, ±20 2.5 200 0.8±0.10 *1, *2 M TMK107 B7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 IC TTMMKK110077 BB77120244[[]]AAHHTT 25 XX77RR 0.02.21μμ ±±1100,, ±±2200 31.05 115500 00..88±±00..1100 **11,, **22 C TMK107 B7474[]AHT X7R 0.47μ ±10, ±20 10 150 0.8±0.10 *1, *2 A TMK107AB7105[]AHT X7R 1μ ±10, ±20 10 150 0.8+0.15/-0.05 *1, *2 P EMK107 B7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 A EMK107 B7104[]AHT X7R 0.1μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 C EMK107 B7224[]AHT 16 X7R 0.22μ ±10, ±20 5 150 0.8±0.10 *1, *2 IT EMK107 B7474[]AHT X7R 0.47μ ±10, ±20 10 150 0.8±0.10 *1, *2 O EMK107 B7105[]AHT X7R 1μ ±10, ±20 10 150 0.8±0.10 *1, *2 R LMK107 B7224[]AHT X7R 0.22μ ±10, ±20 5 150 0.8±0.10 *1, *2 S LMK107 B7474[]AHT 10 X7R 0.47μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 LMK107 B7105[]AHT X7R 1μ ±10, ±20 10 150 0.8±0.10 *1, *2 LMK107BD7225[]AHT X7T 2.2μ ±10, ±20 10 200 0.8+0.20/-0 *1, *2 JMK107 B7105[]AHT X7R 1μ ±10, ±20 10 150 0.8±0.10 *1, *2 6.3 JMK107 B7225[]AHTR X7R 2.2μ ±10, ±20 10 150 0.8±0.10 *1, *2 ●212TYPE　(Dimension:2.0×1.25mm　JIS:2012　EIA:0805） 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　1.25mm thickness（G） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK212 BJ104[]GHT X5R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 UMK212 BJ224[]GHT X5R 0.22μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 50 UMK212 BJ474[]GHT X5R 0.47μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 UMK212 BJ105[]GHT X5R 1μ ±10, ±20 5 150 1.25±0.10 *1, *2 GMK212 BJ104[]GHT X5R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 GMK212 BJ224[]GHT X5R 0.22μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 GMK212 BJ474[]GHT 35 X5R 0.47μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 GMK212 BJ105[]GHT X5R 1μ ±10, ±20 5 150 1.25±0.10 *1, *2 GMK212BBJ225[]GHT X5R 2.2μ ±10, ±20 10 150 1.25+0.20/-0 *1, *2 TMK212 BJ104[]GHT X5R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 TMK212 BJ224[]GHT X5R 0.22μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 TMK212 BJ474[]GHT X5R 0.47μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 TMK212 BJ105[]GHT 25 X5R 1μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 TMK212 BJ225[]GHT X5R 2.2μ ±10, ±20 5 150 1.25±0.10 *1, *2 TMK212BBJ475[]GHT X5R 4.7μ ±10, ±20 10 150 1.25+0.20/-0 *1, *2 TMK212BBJ106[]GHT X5R 10μ ±10, ±20 10 150 1.25+0.20/-0 *1, *2 EMK212 BJ105[]GHT X5R 1μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 EMK212 BJ225[]GHT X5R 2.2μ ±10, ±20 5 150 1.25±0.10 *1, *2 16 EMK212ABJ475[]GHT X5R 4.7μ ±10, ±20 10 150 1.25+0.15/-0.05 *1, *2 EMK212BBJ106[]GHT X5R 10μ ±10, ±20 10 150 1.25+0.20/-0 *1, *2 LMK212 BJ225[]GHT X5R 2.2μ ±10, ±20 5 200 1.25±0.10 *1, *2 LMK212ABJ475[]GHT 10 X5R 4.7μ ±10, ±20 10 150 1.25+0.15/-0.05 *1, *2 LMK212ABJ106[]GHT X5R 10μ ±10, ±20 10 150 1.25+0.15/-0.05 *1, *2 JMK212ABJ475[]GHT X5R 4.7μ ±10, ±20 5 200 1.25+0.15/-0.05 *1, *2 JMK212ABJ106[]GHT 6.3 X5R 10μ ±10, ±20 10 150 1.25+0.15/-0.05 *1, *2 JMK212BBJ226MGHT X5R 22μ ±20 10 150 1.25+0.20/-0 *1, *2 AMK212ABJ226MGHT X5R 22μ ±20 10 150 1.25+0.15/-0.05 *1, *2 4 AMK212BBJ476MGHT X5R 47μ ±20 10 150 1.25+0.20/-0 *1, *2 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　0.85mm thickness（D） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note EMK212 BJ105[]DHT X5R 1μ ±10, ±20 5 200 0.85±0.10 *1, *2 EMK212ABJ225[]DHT 16 X5R 2.2μ ±10, ±20 5 150 0.85±0.10 *1, *2 EMK212BBJ475[]DHT X5R 4.7μ ±10, ±20 10 150 0.85±0.10 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 24 19

■PART NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.25mm thickness（G） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK212 B7103[]GHT X7R 0.01μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 UMK212 B7153[]GHT X7R 0.015μ ±10, ±20 2.5 200 1.25±0.10 *1, *2 UMK212 B7223[]GHT X7R 0.022μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 UMK212 B7333[]GHT X7R 0.033μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 UMK212 B7473[]GHT X7R 0.047μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 50 UMK212 B7683[]GHT X7R 0.068μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 UMK212 B7104[]GHT X7R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 UMK212 B7224[]GHT X7R 0.22μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 UMK212 C7474[]GHTE X7S 0.47μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 UMK212 B7105[]GHT X7R 1μ ±10, ±20 10 150 1.25±0.10 *1, *2 GMK212 B7224[]GHT X7R 0.22μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 35 GMK212 B7105[]GHT X7R 1μ ±10, ±20 10 150 1.25±0.10 *1, *2 TMK212 B7224[]GHT X7R 0.22μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 TMK212 B7334[]GHT X7R 0.33μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 TMK212 B7474[]GHT 25 X7R 0.47μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 TMK212 B7105[]GHTR X7R 1μ ±10, ±20 10 150 1.25±0.10 *1, *2 TMK212 B7225[]GHT X7R 2.2μ ±10, ±20 10 150 1.25±0.10 *1, *2 C EMK212 B7224[]GHT X7R 0.22μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 E EMK212 B7334[]GHT X7R 0.33μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 R EMK212 B7474[]GHT X7R 0.47μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 A 16 EMK212 B7105[]GHTR X7R 1μ ±10, ±20 10 150 1.25±0.10 *1, *2 M EEMMKK221122 ABB77242755[[]]GGHHTT XX77RR 42..72μμ ±±1100,, ±±2200 1100 115500 1.215.+205.±150/.-100.05 **11,, **22 IC LMK212 B7105[]GHTR X7R 1μ ±10, ±20 10 150 1.25±0.10 *1, *2 C LMK212 B7225[]GHT 10 X7R 2.2μ ±10, ±20 10 150 1.25±0.10 *1, *2 A LMK212 B7475[]GHT X7R 4.7μ ±10, ±20 10 150 1.25±0.10 *1, *2 P JMK212 B7475[]GHT X7R 4.7μ ±10, ±20 10 150 1.25±0.10 *1, *2 A JMK212AB7106[]GHT 6.3 X7R 10μ ±10, ±20 10 150 1.25+0.15/-0.05 *1, *2 C IT O ●316TYPE (Dimension:3.2×1.6mm　JIS:3216　EIA:1206） R 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　1.6mm thickness（L） S Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK316 BJ474[]LHT X5R 0.47μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 UMK316 BJ105[]LHT X5R 1μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 50 UMK316 BJ225[]LHT X5R 2.2μ ±10, ±20 10 150 1.6±0.20 *1, *2 UMK316ABJ475[]LHT X5R 4.7μ ±10, ±20 10 150 1.6±0.20 *1, *2 GMK316 BJ105[]LHT X5R 1μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 GMK316 BJ225[]LHT X5R 2.2μ ±10, ±20 10 150 1.6±0.20 *1, *2 35 GMK316 BJ475[]LHT X5R 4.7μ ±10, ±20 10 150 1.6±0.20 *1, *2 GMK316BBJ106[]LHT X5R 10μ ±10, ±20 10 150 1.6±0.30 *1, *2 TMK316 BJ225[]LHT X5R 2.2μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 TMK316 BJ475[]LHT 25 X5R 4.7μ ±10, ±20 5 150 1.6±0.20 *1, *2 TMK316 BJ106[]LHT X5R 10μ ±10, ±20 5 150 1.6±0.20 *1, *2 EMK316 BJ225[]LHT X5R 2.2μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 EMK316 BJ475[]LHT X5R 4.7μ ±10, ±20 5 150 1.6±0.20 *1, *2 16 EMK316 BJ106[]LHT X5R 10μ ±10, ±20 5 150 1.6±0.20 *1, *2 EMK316BBJ226MLHT X5R 22μ ±20 10 150 1.6±0.30 *1, *2 LMK316 BJ475[]LHT X5R 4.7μ ±10, ±20 5 150 1.6±0.20 *1, *2 LMK316 BJ106[]LHT 10 X5R 10μ ±10, ±20 5 150 1.6±0.20 *1, *2 LMK316ABJ226[]ＬHT X5R 22μ ±10, ±20 10 150 1.6±0.20 *1, *2 JMK316 BJ106[]LHT X5R 10μ ±10, ±20 5 200 1.6±0.20 *1, *2 JMK316ABJ226[]LHT X5R 22μ ±10, ±20 10 150 1.6±0.20 *1, *2 6.3 JMK316ABJ476MLHT X5R 47μ ±20 10 150 1.6±0.20 *1, *2 JMK316BBJ107MLHT X5R 100μ ±20 10 150 1.6±0.30 *2 AMK316ABJ107MLHT 4 X5R 100μ ±20 10 150 1.6±0.20 *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 25

■PART NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　1.6mm thickness（L） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK316 B7473[]LHT X7R 0.047μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 UMK316 B7683[]LHT X7R 0.068μ ±10, ±20 2.5 200 1.6±0.20 *1, *2 UMK316 B7104[]LHT X7R 0.1μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 UMK316 B7154[]LHT X7R 0.15μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 UMK316 B7224[]LHT X7R 0.22μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 50 UMK316 B7334[]LHT X7R 0.33μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 UMK316 B7474[]LHT X7R 0.47μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 UMK316 B7105[]LHT X7R 1μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 UMK316 B7225[]LHT X7R 2.2μ ±10, ±20 10 150 1.6±0.20 *1, *2 UMK316AC7475[]LHTE X7S 4.7μ ±10, ±20 2.5 150 1.6±0.20 *1, *2 GMK316 B7105[]LHT X7R 1μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 GMK316 B7225[]LHT 35 X7R 2.2μ ±10, ±20 10 150 1.6±0.20 *1, *2 GMK316AB7475[]LHT X7R 4.7μ ±10, ±20 10 150 1.6±0.20 *1, *2 TMK316 B7105[]LHT X7R 1μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 TMK316 B7225[]LHT X7R 2.2μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 25 TMK316AB7475[]LHT X7R 4.7μ ±10, ±20 10 150 1.6±0.20 *1, *2 C TMK316AB7106[]LHT X7R 10μ ±10, ±20 10 150 1.6±0.20 *1, *2 E EMK316 B7225[]LHT X7R 2.2μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 R EMK316AB7475[]LHT 16 X7R 4.7μ ±10, ±20 10 150 1.6±0.20 *1, *2 A EMK316AB7106[]LHT X7R 10μ ±10, ±20 10 150 1.6±0.20 *1, *2 M LMK316 B7475[]LHT 10 X7R 4.7μ ±10, ±20 5 150 1.6±0.20 *1, *2 IC JLMMKK331166AABB77110066[[]]LLHHTT XX77RR 1100μμ ±±1100,, ±±2200 1100 115500 11..66±±00..2200 **11,, **22 C JMK316AB7226[]LHT 6.3 X7R 22μ ±10, ±20 10 150 1.6±0.20 *1, *2 A AMK316AB7226[]LHT 4 X7R 22μ ±10, ±20 10 150 1.6±0.20 *1, *2 P AMK316AC7476MLHT X7S 47μ ±20 10 150 1.6±0.20 *1, *2 A C IT ●325TYPE (Dimension:3.2×2.5mm　JIS:3225　EIA:1210） O 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　2.5mm thickness（M） R S Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK325 BJ106[]MHP 50 X5R 10μ ±10, ±20 5 150 2.5±0.20 *1, *2 GMK325 BJ106[]MHP 35 X5R 10μ ±10, ±20 5 150 2.5±0.20 *1, *2 TMK325 BJ106[]MHP 25 X5R 10μ ±10, ±20 5 150 2.5±0.20 *1, *2 EMK325 BJ226[]MHP X5R 22μ ±10, ±20 5 150 2.5±0.20 *1, *2 16 EMK325ABJ476[]MHP X5R 47μ ±10, ±20 10 150 2.5±0.30 *1, *2 LMK325 BJ226[]MHP X5R 22μ ±10, ±20 5 150 2.5±0.20 *1, *2 LMK325 BJ476[]MHP 10 X5R 47μ ±10, ±20 10 150 2.5±0.20 *1, *2 LMK325ABJ107MMHP X5R 100μ ±20 10 150 2.5±0.30 *2 JMK325 BJ476[]MHP X5R 47μ ±10, ±20 10 150 2.5±0.20 *1, *2 6.3 JMK325ABJ107MMHP X5R 100μ ±20 10 150 2.5±0.30 *2 AMK325ABJ107MMHP X5R 100μ ±20 10 150 2.5±0.30 *2 4 AMK325ABJ227MMHP X5R 220μ ±20 10 150 2.5±0.30 *2 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　1.9mm thickness（N） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK325 BJ475[]NHT 50 X5R 4.7μ ±10, ±20 10 150 1.9±0.20 *1, *2 GMK325 BJ225MNHT X5R 2.2μ ±20 3.5 200 1.9±0.20 *1, *2 35 GMK325 BJ475[]NHT X5R 4.7μ ±10, ±20 10 150 1.9±0.20 *1, *2 TMK325 BJ475[]NHT 25 X5R 4.7μ ±10, ±20 10 150 1.9±0.20 *1, *2 EMK325 BJ475MNHT X5R 4.7μ ±20 3.5 200 1.9±0.20 *1, *2 16 EMK325 BJ106[]NHT X5R 10μ ±10, ±20 5 150 1.9±0.20 *1, *2 【Temperature Characteristic C6 : X6S（－55～＋105℃）】　2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note JMK325AC6107MMHP 6.3 X6S 100μ ±20 10 150 2.5±0.30 *2 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK325 B7225[]MHP X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 *1, *2 UMK325 B7335[]MHP X7R 3.3μ ±10, ±20 3.5 200 2.5±0.20 *1, *2 50 UMK325 B7475[]MHP X7R 4.7μ ±10, ±20 5 150 2.5±0.20 *1, *2 UMK325AB7106[]MHP X7R 10μ ±10, ±20 10 150 2.5±0.30 *1, *2 GMK325AB7106[]MHP 35 X7R 10μ ±10, ±20 10 150 2.5±0.30 *1, *2 TMK325 B7335[]MHP X7R 3.3μ ±10, ±20 3.5 200 2.5±0.20 *1, *2 TMK325AB7106[]MHPR 25 X7R 10μ ±10, ±20 10 150 2.5±0.30 *1, *2 TMK325 B7226[]MHP X7R 22μ ±10, ±20 10 150 2.5±0.20 *1, *2 EMK325 B7226[]MHP 16 X7R 22μ ±10, ±20 10 150 2.5±0.20 *1, *2 LMK325 B7226[]MHP 10 X7R 22μ ±10, ±20 10 150 2.5±0.20 *1, *2 JMK325 B7226[]MHPR X7R 22μ ±10, ±20 10 150 2.5±0.20 *1, *2 6.3 JMK325 B7476[]MHPR X7R 47μ ±10, ±20 10 150 2.5±0.20 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 26 19

■PART NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.9mm thickness（N） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK325 B7105[]NHT 50 X7R 1μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 GMK325 B7225[]NHT X7R 2.2μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 35 GMK325 B7475[]NHTR X7R 4.7μ ±10, ±20 10 150 1.9±0.20 *1, *2 TMK325 B7475[]NHT 25 X7R 4.7μ ±10, ±20 10 150 1.9±0.20 *1, *2 EMK325 B7475[]NHT X7R 4.7μ ±10, ±20 3.5 150 1.9±0.20 *1, *2 16 EMK325 B7106[]NHTR X7R 10μ ±10, ±20 10 150 1.9±0.20 *1, *2 C E R A M IC C A P A C IT O R S hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 27

■PART NUMBER Multilayer Ceramic Capacitors （Temperature compensating type） ●063TYPE (Dimension:0.6×0.3mm　JIS:0603　EIA:0201） 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】　0.3mm thickness（T） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Ctaoplaecraitnacnece ［at( M1QMinH)z］ Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK063 CG0R5CTHF CG C0G 0.5p ±0.25pF 410 200 0.3±0.03 *1, *2 UMK063 CG010CTHF CG C0G 1p ±0.25pF 420 200 0.3±0.03 *1, *2 UMK063 CG1R5CTHF CG C0G 1.5p ±0.25pF 430 200 0.3±0.03 *1, *2 UMK063 CG020CTHF CG C0G 2p ±0.25pF 440 200 0.3±0.03 *1, *2 UMK063 CG030CTHF CG C0G 3p ±0.25pF 460 200 0.3±0.03 *1, *2 UMK063 CG040CTHF CG C0G 4p ±0.25pF 480 200 0.3±0.03 *1, *2 UMK063 CG050CTHF CG C0G 5p ±0.25pF 500 200 0.3±0.03 *1, *2 UMK063 CG060DTHF CG C0G 6p ±0.5pF 520 200 0.3±0.03 *1, *2 UMK063 CG070DTHF CG C0G 7p ±0.5pF 540 200 0.3±0.03 *1, *2 UMK063 CG080DTHF CG C0G 8p ±0.5pF 560 200 0.3±0.03 *1, *2 UMK063 CG090DTHF CG C0G 9p ±0.5pF 580 200 0.3±0.03 *1, *2 UMK063 CG100DTHF CG C0G 10p ±0.5pF 600 200 0.3±0.03 *1, *2 50 UMK063 CG120JTHF CG C0G 12p ±5％ 640 200 0.3±0.03 *1, *2 C UMK063 CG150JTHF CG C0G 15p ±5％ 700 200 0.3±0.03 *1, *2 E R UMK063 CG180JTHF CG C0G 18p ±5％ 760 200 0.3±0.03 *1, *2 A UMK063 CG220JTHF CG C0G 22p ±5％ 840 200 0.3±0.03 *1, *2 M UMK063 CG270JTHF CG C0G 27p ±5％ 940 200 0.3±0.03 *1, *2 UMK063 CG330JTHF CG C0G 33p ±5％ 1000 200 0.3±0.03 *1, *2 IC UMK063 CG390JTHF CG C0G 39p ±5％ 1000 200 0.3±0.03 *1, *2 UMK063 CG470JTHF CG C0G 47p ±5％ 1000 200 0.3±0.03 *1, *2 C UMK063 CG560JTHF CG C0G 56p ±5％ 1000 200 0.3±0.03 *1, *2 A UMK063 CG680JTHF CG C0G 68p ±5％ 1000 200 0.3±0.03 *1, *2 P A UMK063 CG820JTHF CG C0G 82p ±5％ 1000 200 0.3±0.03 *1, *2 C UMK063 CG101JTHF CG C0G 100p ±5％ 1000 200 0.3±0.03 *1, *2 IT TMK063 CG121JTHF CG C0G 120p ±5％ 1000 200 0.3±0.03 *1, *2 O TMK063 CG151JTHF 25 CG C0G 150p ±5％ 1000 200 0.3±0.03 *1, *2 TMK063 CG181JTHF CG C0G 180p ±5％ 1000 200 0.3±0.03 *1, *2 R TMK063 CG221JTHF CG C0G 220p ±5％ 1000 200 0.3±0.03 *1, *2 S ●105TYPE (Dimension:1.0×0.5mm　JIS:1005　EIA:0402） 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】　0.5mm thickness（V） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Ctaoplaecraitnacnece ［at( M1QMinH)z］ Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMK105 CG0R5CVHF CG C0G 0.5p ±0.25pF 410 200 0.5±0.05 *1, *2 UMK105 CG010CVHF CG C0G 1p ±0.25pF 420 200 0.5±0.05 *1, *2 UMK105 CG1R5CVHF CG C0G 1.5p ±0.25pF 430 200 0.5±0.05 *1, *2 UMK105 CG020CVHF CG C0G 2p ±0.25pF 440 200 0.5±0.05 *1, *2 UMK105 CG030CVHF CG C0G 3p ±0.25pF 460 200 0.5±0.05 *1, *2 UMK105 CG040CVHF CG C0G 4p ±0.25pF 480 200 0.5±0.05 *1, *2 UMK105 CG050CVHF CG C0G 5p ±0.25pF 500 200 0.5±0.05 *1, *2 UMK105 CG060DVHF CG C0G 6p ±0.5pF 520 200 0.5±0.05 *1, *2 UMK105 CG070DVHF CG C0G 7p ±0.5pF 540 200 0.5±0.05 *1, *2 UMK105 CG080DVHF CG C0G 8p ±0.5pF 560 200 0.5±0.05 *1, *2 UMK105 CG090DVHF CG C0G 9p ±0.5pF 580 200 0.5±0.05 *1, *2 UMK105 CG100DVHF CG C0G 10p ±0.5pF 600 200 0.5±0.05 *1, *2 UMK105 CG120JVHF CG C0G 12p ±5％ 640 200 0.5±0.05 *1, *2 UMK105 CG150JVHF CG C0G 15p ±5％ 700 200 0.5±0.05 *1, *2 UMK105 CG180JVHF CG C0G 18p ±5％ 760 200 0.5±0.05 *1, *2 UMK105 CG220JVHF CG C0G 22p ±5％ 840 200 0.5±0.05 *1, *2 UMK105 CG270JVHF CG C0G 27p ±5％ 940 200 0.5±0.05 *1, *2 UMK105 CG330JVHF CG C0G 33p ±5％ 1000 200 0.5±0.05 *1, *2 50 UMK105 CG390JVHF CG C0G 39p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG470JVHF CG C0G 47p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG560JVHF CG C0G 56p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG680JVHF CG C0G 68p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG820JVHF CG C0G 82p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG101JVHF CG C0G 100p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG121JVHF CG C0G 120p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG151JVHF CG C0G 150p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG181JVHF CG C0G 180p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG221JVHF CG C0G 220p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG271JVHF CG C0G 270p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG331JVHF CG C0G 330p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG391JVHF CG C0G 390p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG471JVHF CG C0G 470p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG561JVHF CG C0G 560p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG681JVHF CG C0G 680p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG821JVHF CG C0G 820p ±5％ 1000 200 0.5±0.05 *1, *2 UMK105 CG102JVHF CG C0G 1000p ±5％ 1000 200 0.5±0.05 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 28 19

■PART NUMBER Medium-High Voltage Multilayer Ceramic Capacitors ●107TYPE　 (Dimension:1.6×0.8mm　JIS:1608　EIA:0603） 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMK107 B7102[]AHT X7R 1000p ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7152[]AHT X7R 1500p ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7222[]AHT X7R 2200p ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7332[]AHT X7R 3300p ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7472[]AHT X7R 4700p ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7682[]AHT X7R 6800p ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7103[]AHT 100 X7R 0.01μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7153[]AHT X7R 0.015μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7223[]AHT X7R 0.022μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7333[]AHT X7R 0.033μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 B7104[]AHT X7R 0.1μ ±10, ±20 3.5 200 0.8±0.10 *1, *2 HMK107 C7224[]AHTE X7S 0.22μ ±10, ±20 3.5 150 0.8±0.10 *1, *2 C E R ●212TYPE　(Dimension:2.0×1.25mm　JIS:2012　EIA:0805） A 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　1.25mm thickness（G） M Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note IC C HMK212 B7472[]GHT X7R 4700p ±10, ±20 2.5 200 1.25±0.10 *1, *2 A HMK212 B7682[]GHT X7R 6800p ±10, ±20 2.5 200 1.25±0.10 *1, *2 P HMK212 B7103[]GHT X7R 0.01μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 A HMK212 B7153[]GHT X7R 0.015μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 C HMK212 B7223[]GHT X7R 0.022μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 IT HMK212 B7333[]GHT X7R 0.033μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 O 100 HMK212 B7473[]GHT X7R 0.047μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 R HMK212 B7683[]GHT X7R 0.068μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 S HMK212 B7104[]GHT X7R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 HMK212 B7224[]GHT X7R 0.22μ ±10, ±20 3.5 200 1.25±0.10 *1, *2 HMK212 C7474[]GHTE X7S 0.47μ ±10, ±20 3.5 150 1.25±0.10 *1, *2 HMK212BC7105[]GHTE X7S 1μ ±10, ±20 3.5 150 1.25+0.20/-0 *1, *2 QMK212 B7472[]GHT X7R 4700p ±10, ±20 2.5 150 1.25±0.10 *1, *2 QMK212 B7682[]GHT X7R 6800p ±10, ±20 2.5 150 1.25±0.10 *1, *2 QMK212 B7103[]GHT 250 X7R 0.01μ ±10, ±20 2.5 150 1.25±0.10 *1, *2 QMK212 B7153[]GHT X7R 0.015μ ±10, ±20 2.5 150 1.25±0.10 *1, *2 QMK212 B7223[]GHT X7R 0.022μ ±10, ±20 2.5 150 1.25±0.10 *1, *2 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.85mm thickness（D） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMK212 B7102[]DHT X7R 1000p ±10, ±20 2.5 200 0.85±0.10 *1, *2 HMK212 B7152[]DHT X7R 1500p ±10, ±20 2.5 200 0.85±0.10 *1, *2 100 HMK212 B7222[]DHT X7R 2200p ±10, ±20 2.5 200 0.85±0.10 *1, *2 HMK212 B7332[]DHT X7R 3300p ±10, ±20 2.5 200 0.85±0.10 *1, *2 QMK212 B7102[]DHT X7R 1000p ±10, ±20 2.5 150 0.85±0.10 *1, *2 QMK212 B7152[]DHT X7R 1500p ±10, ±20 2.5 150 0.85±0.10 *1, *2 250 QMK212 B7222[]DHT X7R 2200p ±10, ±20 2.5 150 0.85±0.10 *1, *2 QMK212 B7332[]DHT X7R 3300p ±10, ±20 2.5 150 0.85±0.10 *1, *2 ●316TYPE (Dimension:3.2×1.6mm　JIS:3216　EIA:1206） 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　1.6mm thickness（L） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMK316 B7473[]LHT X7R 0.047μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 HMK316 B7683[]LHT X7R 0.068μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 HMK316 B7104[]LHT X7R 0.1μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 HMK316 B7154[]LHT X7R 0.15μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 HMK316 B7224[]LHT 100 X7R 0.22μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 HMK316 B7334[]LHT X7R 0.33μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 HMK316 B7474[]LHT X7R 0.47μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 HMK316 B7105[]LHT X7R 1μ ±10, ±20 3.5 200 1.6±0.20 *1, *2 HMK316AC7225[]LHTE X7S 2.2μ ±10, ±20 3.5 150 1.6±0.20 *1, *2 QMK316 B7223[]LHT X7R 0.022μ ±10, ±20 2.5 150 1.6±0.20 *1, *2 QMK316 B7333[]LHT X7R 0.033μ ±10, ±20 2.5 150 1.6±0.20 *1, *2 QMK316 B7473[]LHT 250 X7R 0.047μ ±10, ±20 2.5 150 1.6±0.20 *1, *2 QMK316 B7683[]LHT X7R 0.068μ ±10, ±20 2.5 150 1.6±0.20 *1, *2 QMK316 B7104[]LHT X7R 0.1μ ±10, ±20 2.5 150 1.6±0.20 *1, *2 SMK316 B7153[]LHT X7R 0.015μ ±10, ±20 2.5 120 1.6±0.20 *1, *2 630 SMK316 B7223[]LHT X7R 0.022μ ±10, ±20 2.5 120 1.6±0.20 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 29

■PART NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.15mm thickness（F） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note SMK316 B7102[]FHT X7R 1000p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMK316 B7152[]FHT X7R 1500p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMK316 B7222[]FHT X7R 2200p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMK316 B7332[]FHT 630 X7R 3300p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMK316 B7472[]FHT X7R 4700p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMK316 B7682[]FHT X7R 6800p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMK316 B7103[]FHT X7R 0.01μ ±10, ±20 2.5 120 1.15±0.10 *1, *2 ●325TYPE (Dimension:3.2×2.5mm　JIS:3225　EIA:1210） 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMK325 B7225[]MHP X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 *1, *2 100 HMK325 C7475[]MHPE X7S 4.7μ ±10, ±20 3.5 150 2.5±0.20 *1, *2 C E 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.9mm thickness（N） R AM Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note IC HMK325 B7224[]NHT X7R 0.22μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 C HMK325 B7474[]NHT 100 X7R 0.47μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 HMK325 B7684[]NHT X7R 0.68μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 A HMK325 B7105[]NHT X7R 1μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 P A QMK325 B7473[]NHT X7R 0.047μ ±10, ±20 2.5 150 1.9±0.20 *1, *2 C QMK325 B7104[]NHT 250 X7R 0.1μ ±10, ±20 2.5 150 1.9±0.20 *1, *2 IT QQMMKK332255 BB77125244[[]]NNHHTT XX77RR 00..1252μμ ±±1100,, ±±2200 22..55 115500 11..99±±00..2200 **11,, **22 O SMK325 B7223[]NHT X7R 0.022μ ±10, ±20 2.5 120 1.9±0.20 *1, *2 R SMK325 B7333[]NHT 630 X7R 0.033μ ±10, ±20 2.5 120 1.9±0.20 *1, *2 S SMK325 B7473[]NHT X7R 0.047μ ±10, ±20 2.5 120 1.9±0.20 *1, *2 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.15mm thickness（F） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMK325 B7104[]FHT 100 X7R 0.1μ ±10, ±20 3.5 200 1.15±0.10 *1, *2 ●432TYPE (Dimension:4.5×3.2mm　JIS:4532　EIA:1812） 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMK432 B7474[]MHT X7R 0.47μ ±10, ±20 3.5 200 2.5±0.20 *1, *2 HMK432 B7105[]MHT X7R 1μ ±10, ±20 3.5 200 2.5±0.20 *1, *2 100 HMK432 B7155[]MHT X7R 1.5μ ±10, ±20 3.5 200 2.5±0.20 *1, *2 HMK432 B7225[]MHT X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 *1, *2 QMK432 B7104[]MHT X7R 0.1μ ±10, ±20 2.5 150 2.5±0.20 *1, *2 QMK432 B7224[]MHT X7R 0.22μ ±10, ±20 2.5 150 2.5±0.20 *1, *2 250 QMK432 B7334[]MHT X7R 0.33μ ±10, ±20 2.5 150 2.5±0.20 *1, *2 QMK432 B7474[]MHT X7R 0.47μ ±10, ±20 2.5 150 2.5±0.20 *1, *2 SMK432 B7473[]MHT X7R 0.047μ ±10, ±20 2.5 120 2.5±0.20 *1, *2 SMK432 B7683[]MHT 630 X7R 0.068μ ±10, ±20 2.5 120 2.5±0.20 *1, *2 SMK432 B7104[]MHT X7R 0.1μ ±10, ±20 2.5 120 2.5±0.20 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 30 19

■PART NUMBER Medium-High Voltage Multilayer Ceramic Capacitors for High Frequency Applications ●107TYPE　 (Dimension:1.6×0.8mm　JIS:1608　EIA:0603） 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】　0.7mm thickness（C） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Ctaoplaecraitnacnece ［at( M1QMinH)z］ Rated vHoTltLaTge x ％ Thickness*3 [mm] Note QVS107 CG0R2[]CHT CG C0G 0.2p ±0.05pF, ±0.1pF 804 200 0.7±0.10 *1, *2 QVS107 CG0R3[]CHT CG C0G 0.3p ±0.05pF, ±0.1pF 806 200 0.7±0.10 *1, *2 QVS107 CG0R4[]CHT CG C0G 0.4p ±0.05pF, ±0.1pF 808 200 0.7±0.10 *1, *2 QVS107 CG0R5[]CHT CG C0G 0.5p ±0.1pF, ±0.25pF 810 200 0.7±0.10 *1, *2 QVS107 CG0R6[]CHT CG C0G 0.6p ±0.1pF, ±0.25pF 812 200 0.7±0.10 *1, *2 QVS107 CG0R7[]CHT CG C0G 0.7p ±0.1pF, ±0.25pF 814 200 0.7±0.10 *1, *2 QVS107 CGR75[]CHT CG C0G 0.75p ±0.1pF, ±0.25pF 815 200 0.7±0.10 *1, *2 QVS107 CG0R8[]CHT CG C0G 0.8p ±0.1pF, ±0.25pF 816 200 0.7±0.10 *1, *2 QVS107 CG0R9[]CHT CG C0G 0.9p ±0.1pF, ±0.25pF 818 200 0.7±0.10 *1, *2 QVS107 CG010[]CHT CG C0G 1p ±0.1pF, ±0.25pF 820 200 0.7±0.10 *1, *2 QVS107 CG1R1[]CHT CG C0G 1.1p ±0.1pF, ±0.25pF 822 200 0.7±0.10 *1, *2 QVS107 CG1R2[]CHT CG C0G 1.2p ±0.1pF, ±0.25pF 824 200 0.7±0.10 *1, *2 QVS107 CG1R3[]CHT CG C0G 1.3p ±0.1pF, ±0.25pF 826 200 0.7±0.10 *1, *2 QVS107 CG1R5[]CHT CG C0G 1.5p ±0.1pF, ±0.25pF 830 200 0.7±0.10 *1, *2 C E QVS107 CG1R6[]CHT CG C0G 1.6p ±0.1pF, ±0.25pF 832 200 0.7±0.10 *1, *2 R QVS107 CG1R8[]CHT CG C0G 1.8p ±0.1pF, ±0.25pF 836 200 0.7±0.10 *1, *2 A QVS107 CG020[]CHT CG C0G 2p ±0.1pF, ±0.25pF 840 200 0.7±0.10 *1, *2 M QVS107 CG2R2[]CHT CG C0G 2.2p ±0.1pF, ±0.25pF 844 200 0.7±0.10 *1, *2 QVS107 CG2R4[]CHT CG C0G 2.4p ±0.1pF, ±0.25pF 848 200 0.7±0.10 *1, *2 IC QVS107 CG2R7[]CHT CG C0G 2.7p ±0.1pF, ±0.25pF 854 200 0.7±0.10 *1, *2 C QVS107 CG030[]CHT CG C0G 3p ±0.1pF, ±0.25pF 860 200 0.7±0.10 *1, *2 A QVS107 CG3R3[]CHT CG C0G 3.3p ±0.1pF, ±0.25pF 866 200 0.7±0.10 *1, *2 P QVS107 CG3R6[]CHT CG C0G 3.6p ±0.1pF, ±0.25pF 872 200 0.7±0.10 *1, *2 A QVS107 CG3R9[]CHT CG C0G 3.9p ±0.1pF, ±0.25pF 878 200 0.7±0.10 *1, *2 C QVS107 CG4R3[]CHT CG C0G 4.3p ±0.1pF, ±0.25pF 886 200 0.7±0.10 *1, *2 IT QVS107 CG4R7[]CHT CG C0G 4.7p ±0.1pF, ±0.25pF 894 200 0.7±0.10 *1, *2 O QVS107 CG5R1[]CHT CG C0G 5.1p ±0.25pF, ±0.5pF 902 200 0.7±0.10 *1, *2 R QVS107 CG5R6[]CHT CG C0G 5.6p ±0.25pF, ±0.5pF 912 200 0.7±0.10 *1, *2 S QVS107 CG6R2[]CHT CG C0G 6.2p ±0.25pF, ±0.5pF 924 200 0.7±0.10 *1, *2 250 QVS107 CG6R8[]CHT CG C0G 6.8p ±0.25pF, ±0.5pF 936 200 0.7±0.10 *1, *2 QVS107 CG7R5[]CHT CG C0G 7.5p ±0.25pF, ±0.5pF 950 200 0.7±0.10 *1, *2 QVS107 CG8R2[]CHT CG C0G 8.2p ±0.25pF, ±0.5pF 964 200 0.7±0.10 *1, *2 QVS107 CG9R1[]CHT CG C0G 9.1p ±0.25pF, ±0.5pF 982 200 0.7±0.10 *1, *2 QVS107 CG100[]CHT CG C0G 10p ±2％, ±5％ 1000 200 0.7±0.10 *1, *2 QVS107 CG110JCHT CG C0G 11p ±5％ 1020 200 0.7±0.10 *1, *2 QVS107 CG120JCHT CG C0G 12p ±5％ 1040 200 0.7±0.10 *1, *2 QVS107 CG130JCHT CG C0G 13p ±5％ 1060 200 0.7±0.10 *1, *2 QVS107 CG150JCHT CG C0G 15p ±5％ 1100 200 0.7±0.10 *1, *2 QVS107 CG160JCHT CG C0G 16p ±5％ 1120 200 0.7±0.10 *1, *2 QVS107 CG180JCHT CG C0G 18p ±5％ 1160 200 0.7±0.10 *1, *2 QVS107 CG200JCHT CG C0G 20p ±5％ 1200 200 0.7±0.10 *1, *2 QVS107 CG220JCHT CG C0G 22p ±5％ 1240 200 0.7±0.10 *1, *2 QVS107 CG240JCHT CG C0G 24p ±5％ 1280 200 0.7±0.10 *1, *2 QVS107 CG270JCHT CG C0G 27p ±5％ 1340 200 0.7±0.10 *1, *2 QVS107 CG300JCHT CG C0G 30p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG330JCHT CG C0G 33p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG360JCHT CG C0G 36p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG390JCHT CG C0G 39p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG430JCHT CG C0G 43p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG470JCHT CG C0G 47p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG510JCHT CG C0G 51p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG560JCHT CG C0G 56p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG620JCHT CG C0G 62p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG680JCHT CG C0G 68p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG750JCHT CG C0G 75p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG820JCHT CG C0G 82p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG910JCHT CG C0G 91p ±5％ 1400 200 0.7±0.10 *1, *2 QVS107 CG101JCHT CG C0G 100p ±5％ 1400 200 0.7±0.10 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 31

■PART NUMBER ●212TYPE　(Dimension:2.0×1.25mm　JIS:2012　EIA:0805） 【Temperature Characteristic CG : CG/C0G（－55～＋125℃）】 0.85mm thickness（D） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance Ctaoplaecraitnacnece ［at( M1QMinH)z］ Rated vHoTltLaTge x ％ Thickness*3 [mm] Note QVS212 CG0R3[]DHT CG C0G 0.3p ±0.1pF, ±0.25pF 806 200 0.85±0.10 *1, *2 QVS212 CG0R4[]DHT CG C0G 0.4p ±0.1pF, ±0.25pF 808 200 0.85±0.10 *1, *2 QVS212 CG0R5[]DHT CG C0G 0.5p ±0.1pF, ±0.25pF 810 200 0.85±0.10 *1, *2 QVS212 CG0R6[]DHT CG C0G 0.6p ±0.1pF, ±0.25pF 812 200 0.85±0.10 *1, *2 QVS212 CG0R7[]DHT CG C0G 0.7p ±0.1pF, ±0.25pF 814 200 0.85±0.10 *1, *2 QVS212 CGR75[]DHT CG C0G 0.75p ±0.1pF, ±0.25pF 815 200 0.85±0.10 *1, *2 QVS212 CG0R8[]DHT CG C0G 0.8p ±0.1pF, ±0.25pF 816 200 0.85±0.10 *1, *2 QVS212 CG0R9[]DHT CG C0G 0.9p ±0.1pF, ±0.25pF 818 200 0.85±0.10 *1, *2 QVS212 CG010[]DHT CG C0G 1p ±0.1pF, ±0.25pF 820 200 0.85±0.10 *1, *2 QVS212 CG1R1[]DHT CG C0G 1.1p ±0.1pF, ±0.25pF 822 200 0.85±0.10 *1, *2 QVS212 CG1R2[]DHT CG C0G 1.2p ±0.1pF, ±0.25pF 824 200 0.85±0.10 *1, *2 QVS212 CG1R3[]DHT CG C0G 1.3p ±0.1pF, ±0.25pF 826 200 0.85±0.10 *1, *2 QVS212 CG1R5[]DHT CG C0G 1.5p ±0.1pF, ±0.25pF 830 200 0.85±0.10 *1, *2 QVS212 CG1R6[]DHT CG C0G 1.6p ±0.1pF, ±0.25pF 832 200 0.85±0.10 *1, *2 QVS212 CG1R8[]DHT CG C0G 1.8p ±0.1pF, ±0.25pF 836 200 0.85±0.10 *1, *2 C QVS212 CG020[]DHT CG C0G 2p ±0.1pF, ±0.25pF 840 200 0.85±0.10 *1, *2 E QVS212 CG2R2[]DHT CG C0G 2.2p ±0.1pF, ±0.25pF 844 200 0.85±0.10 *1, *2 R QVS212 CG2R4[]DHT CG C0G 2.4p ±0.1pF, ±0.25pF 848 200 0.85±0.10 *1, *2 A QVS212 CG2R7[]DHT CG C0G 2.7p ±0.1pF, ±0.25pF 854 200 0.85±0.10 *1, *2 M QVS212 CG030[]DHT CG C0G 3p ±0.1pF, ±0.25pF 860 200 0.85±0.10 *1, *2 IC QVS212 CG3R3[]DHT CG C0G 3.3p ±0.1pF, ±0.25pF 866 200 0.85±0.10 *1, *2 QVS212 CG3R6[]DHT CG C0G 3.6p ±0.1pF, ±0.25pF 872 200 0.85±0.10 *1, *2 C QVS212 CG3R9[]DHT CG C0G 3.9p ±0.1pF, ±0.25pF 878 200 0.85±0.10 *1, *2 A QVS212 CG4R3[]DHT CG C0G 4.3p ±0.1pF, ±0.25pF 886 200 0.85±0.10 *1, *2 P QVS212 CG4R7[]DHT CG C0G 4.7p ±0.1pF, ±0.25pF 894 200 0.85±0.10 *1, *2 A QVS212 CG5R1[]DHT CG C0G 5.1p ±0.25pF, ±0.5pF 902 200 0.85±0.10 *1, *2 C QVS212 CG5R6[]DHT CG C0G 5.6p ±0.25pF, ±0.5pF 912 200 0.85±0.10 *1, *2 IT QVS212 CG6R2[]DHT CG C0G 6.2p ±0.25pF, ±0.5pF 924 200 0.85±0.10 *1, *2 O QVS212 CG6R8[]DHT 250 CG C0G 6.8p ±0.25pF, ±0.5pF 936 200 0.85±0.10 *1, *2 R QVS212 CG7R5[]DHT CG C0G 7.5p ±0.25pF, ±0.5pF 950 200 0.85±0.10 *1, *2 S QVS212 CG8R2[]DHT CG C0G 8.2p ±0.25pF, ±0.5pF 964 200 0.85±0.10 *1, *2 QVS212 CG9R1[]DHT CG C0G 9.1p ±0.25pF, ±0.5pF 982 200 0.85±0.10 *1, *2 QVS212 CG100JDHT CG C0G 10p ±5％ 1000 200 0.85±0.10 *1, *2 QVS212 CG110JDHT CG C0G 11p ±5％ 1020 200 0.85±0.10 *1, *2 QVS212 CG120JDHT CG C0G 12p ±5％ 1040 200 0.85±0.10 *1, *2 QVS212 CG130JDHT CG C0G 13p ±5％ 1060 200 0.85±0.10 *1, *2 QVS212 CG150JDHT CG C0G 15p ±5％ 1100 200 0.85±0.10 *1, *2 QVS212 CG160JDHT CG C0G 16p ±5％ 1120 200 0.85±0.10 *1, *2 QVS212 CG180JDHT CG C0G 18p ±5％ 1160 200 0.85±0.10 *1, *2 QVS212 CG200JDHT CG C0G 20p ±5％ 1200 200 0.85±0.10 *1, *2 QVS212 CG220JDHT CG C0G 22p ±5％ 1240 200 0.85±0.10 *1, *2 QVS212 CG240JDHT CG C0G 24p ±5％ 1280 200 0.85±0.10 *1, *2 QVS212 CG270JDHT CG C0G 27p ±5％ 1340 200 0.85±0.10 *1, *2 QVS212 CG300JDHT CG C0G 30p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG330JDHT CG C0G 33p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG360JDHT CG C0G 36p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG390JDHT CG C0G 39p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG430JDHT CG C0G 43p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG470JDHT CG C0G 47p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG510JDHT CG C0G 51p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG560JDHT CG C0G 56p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG620JDHT CG C0G 62p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG680JDHT CG C0G 68p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG750JDHT CG C0G 75p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG820JDHT CG C0G 82p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG910JDHT CG C0G 91p ±5％ 1400 200 0.85±0.10 *1, *2 QVS212 CG101JDHT CG C0G 100p ±5％ 1400 200 0.85±0.10 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 32 19

■PART NUMBER Soft Termination Multilayer Ceramic Capacitors ●107TYPE　 (Dimension:1.6×0.8mm　JIS:1608　EIA:0603） 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note TMJ107BB7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 TMJ107BB7104[]AHT X7R 0.1μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 TMJ107BB7224[]AHT 25 X7R 0.22μ ±10, ±20 10 150 0.8+0.20/-0 *1, *2 TMJ107BB7474[]AHT X7R 0.47μ ±10, ±20 10 150 0.8+0.20/-0 *1, *2 TMJ107CB7105[]AHR X7R 1μ ±10, ±20 10 150 0.8+0.25/-0 *1, *2 GMJ107BB7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 GMJ107BB7104[]AHT X7R 0.1μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 GMJ107BB7224[]AHT 35 X7R 0.22μ ±10, ±20 10 150 0.8+0.20/-0 *1, *2 GMJ107BB7474[]AHT X7R 0.47μ ±10, ±20 10 150 0.8+0.20/-0 *1, *2 GMJ107CB7105[]AHR X7R 1μ ±10, ±20 10 150 0.8+0.25/-0 *1, *2 UMJ107AB7102[]AHT X7R 1000p ±10, ±20 3.5 200 0.8+0.15/-0.05 *1, *2 UMJ107AB7222[]AHT X7R 2200p ±10, ±20 3.5 200 0.8+0.15/-0.05 *1, *2 UMJ107BB7472[]AHT X7R 4700p ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 UMJ107BB7103[]AHT 50 X7R 0.01μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 C UMJ107BB7223[]AHT X7R 0.022μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 E R UMJ107BB7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 A UMJ107BB7104[]AHT X7R 0.1μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 M HMJ107AB7102[]AHT X7R 1000p ±10, ±20 3.5 200 0.8+0.15/-0.05 *1, *2 HMJ107AB7222[]AHT X7R 2200p ±10, ±20 3.5 200 0.8+0.15/-0.05 *1, *2 IC HMJ107BB7472[]AHT X7R 4700p ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 C HMJ107BB7103[]AHT 100 X7R 0.01μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 A HMJ107BB7223[]AHT X7R 0.022μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 P HMJ107BB7473[]AHT X7R 0.047μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 A HMJ107BB7104[]AHT X7R 0.1μ ±10, ±20 3.5 200 0.8+0.20/-0 *1, *2 C IT O ●212TYPE　(Dimension:2.0×1.25mm　JIS:2012　EIA:0805） R 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　0.85mm thickness（D）、1.25mm thickness（G） S Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note JMJ212CB7106[]GHT 6.3 X7R 10μ ±10, ±20 10 150 1.25+0.25/-0 *1, *2 EMJ212CB7225[]GHT X7R 2.2μ ±10, ±20 10 150 1.25+0.25/-0 *1, *2 16 EMJ212CB7475[]GHT X7R 4.7μ ±10, ±20 10 150 1.25+0.25/-0 *1, *2 TMJ212CB7225[]GHT 25 X7R 2.2μ ±10, ±20 10 150 1.25+0.25/-0 *1, *2 GMJ212CB7105[]GHT 35 X7R 1μ ±10, ±20 10 150 1.25+0.25/-0 *1, *2 UMJ212BB7103[]GHT X7R 0.01μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 UMJ212BB7223[]GHT X7R 0.022μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 UMJ212BB7473[]GHT X7R 0.047μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 UMJ212BB7104[]GHT 50 X7R 0.1μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 UMJ212BB7224[]GHT X7R 0.22μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 UMJ212CC7474[]GHTE X7S 0.47μ ±10, ±20 3.5 150 1.25+0.25/-0 *1, *2 UMJ212CB7105[]GHT X7R 1μ ±10, ±20 10 150 1.25+0.25/-0 *1, *2 HMJ212KB7102[]DHT X7R 1000p ±10, ±20 3.5 200 0.85±0.15 *1, *2 HMJ212KB7222[]DHT X7R 2200p ±10, ±20 3.5 200 0.85±0.15 *1, *2 HMJ212BB7472[]GHT X7R 4700p ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 HMJ212BB7103[]GHT X7R 0.01μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 HMJ212BB7223[]GHT 100 X7R 0.022μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 HMJ212BB7473[]GHT X7R 0.047μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 HMJ212BB7104[]GHT X7R 0.1μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 HMJ212BB7224[]GHT X7R 0.22μ ±10, ±20 3.5 200 1.25+0.20/-0 *1, *2 HMJ212CC7474[]GHTE X7S 0.47μ ±10, ±20 3.5 150 1.25+0.25/-0 *1, *2 QMJ212KB7102[]DHT X7R 1000p ±10, ±20 2.5 150 0.85±0.15 *1, *2 QMJ212KB7222[]DHT X7R 2200p ±10, ±20 2.5 150 0.85±0.15 *1, *2 QMJ212BB7472[]GHT 250 X7R 4700p ±10, ±20 2.5 150 1.25+0.20/-0 *1, *2 QMJ212BB7103[]GHT X7R 0.01μ ±10, ±20 2.5 150 1.25+0.20/-0 *1, *2 QMJ212BB7223[]GHT X7R 0.022μ ±10, ±20 2.5 150 1.25+0.20/-0 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 33

■PART NUMBER ●316TYPE (Dimension:3.2×1.6mm　JIS:3216　EIA:1206） 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　1.15mm thickness（F）、1.6mm thickness（L） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note LMJ316BB7226[]LHT 10 X7R 22μ ±10, ±20 10 150 1.6±0.30 *1, *2 EMJ316BB7475[]LHT X7R 4.7μ ±10, ±20 10 150 1.6±0.30 *1, *2 16 EMJ316BB7106[]LHT X7R 10μ ±10, ±20 10 150 1.6±0.30 *1, *2 TMJ316BB7474[]LHT X7R 0.47μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 TMJ316BB7475[]LHT 25 X7R 4.7μ ±10, ±20 10 150 1.6±0.30 *1, *2 TMJ316BB7106[]LHT X7R 10μ ±10, ±20 10 150 1.6±0.30 *1, *2 GMJ316BB7474[]LHT X7R 0.47μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 GMJ316AB7225[]LHT X7R 2.2μ ±10, ±20 10 150 1.6±0.20 *1, *2 35 GMJ316BB7475[]LHT X7R 4.7μ ±10, ±20 10 150 1.6±0.30 *1, *2 GMJ316BB7106[]LHT X7R 10μ ±10, ±20 10 150 1.6±0.30 *1, *2 UMJ316BB7473[]LHT X7R 0.047μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 UMJ316BB7104[]LHT X7R 0.1μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 UMJ316BB7224[]LHT X7R 0.22μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 UMJ316BB7474[]LHT 50 X7R 0.47μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 UMJ316BB7105[]LHT X7R 1μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 C UMJ316AB7225[]LHT X7R 2.2μ ±10, ±20 10 150 1.6±0.20 *1, *2 E UMJ316BC7475[]LHTE X7S 4.7μ ±10, ±20 2.5 150 1.6±0.30 *1, *2 R HMJ316 B7102[]FHT X7R 1000p ±10, ±20 3.5 200 1.15±0.10 *1, *2 A HMJ316 B7222[]FHT X7R 2200p ±10, ±20 3.5 200 1.15±0.10 *1, *2 M HMJ316 B7472[]FHT X7R 4700p ±10, ±20 3.5 200 1.15±0.10 *1, *2 IC HMJ316KB7103[]FHT X7R 0.01μ ±10, ±20 3.5 200 1.15±0.20 *1, *2 HMJ316BB7223[]LHT X7R 0.022μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 C HMJ316BB7473[]LHT 100 X7R 0.047μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 A HMJ316BB7104[]LHT X7R 0.1μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 P HMJ316BB7224[]LHT X7R 0.22μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 A HMJ316BB7474[]LHT X7R 0.47μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 C HMJ316BB7105[]LHT X7R 1μ ±10, ±20 3.5 200 1.6±0.30 *1, *2 IT HMJ316BC7225[]LHTE X7S 2.2μ ±10, ±20 3.5 150 1.6±0.30 *1, *2 O QMJ316 B7102[]FHT X7R 1000p ±10, ±20 2.5 150 1.15±0.10 *1, *2 R QMJ316 B7222[]FHT X7R 2200p ±10, ±20 2.5 150 1.15±0.10 *1, *2 S QMJ316 B7472[]FHT X7R 4700p ±10, ±20 2.5 150 1.15±0.10 *1, *2 QMJ316KB7103[]FHT 250 X7R 0.01μ ±10, ±20 2.5 150 1.15±0.20 *1, *2 QMJ316BB7223[]LHT X7R 0.022μ ±10, ±20 2.5 150 1.6±0.30 *1, *2 QMJ316BB7473[]LHT X7R 0.047μ ±10, ±20 2.5 150 1.6±0.30 *1, *2 QMJ316BB7104[]LHT X7R 0.1μ ±10, ±20 2.5 150 1.6±0.30 *1, *2 SMJ316 B7102[]FHT X7R 1000p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMJ316 B7222[]FHT X7R 2200p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMJ316 B7472[]FHT 630 X7R 4700p ±10, ±20 2.5 120 1.15±0.10 *1, *2 SMJ316KB7103[]FHT X7R 0.01μ ±10, ±20 2.5 120 1.15±0.20 *1, *2 SMJ316BB7223[]LHT X7R 0.022μ ±10, ±20 2.5 120 1.6±0.30 *1, *2 ●325TYPE (Dimension:3.2×2.5mm　JIS:3225　EIA:1210） 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C7 : X7S（－55～＋125℃）】　1.9mm thickness（N）、2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note JMJ325KB7476[]MHP 6.3 X7R 47μ ±10, ±20 10 150 2.5±0.30 *1, *2 EMJ325KB7226[]MHP 16 X7R 22μ ±10, ±20 10 150 2.5±0.30 *1, *2 TMJ325AB7475[]MHP X7R 4.7μ ±10, ±20 5 150 2.5±0.30 *1, *2 25 TMJ325KB7106[]MHP X7R 10μ ±10, ±20 10 150 2.5±0.30 *1, *2 GMJ325AB7475[]MHP X7R 4.7μ ±10, ±20 5 150 2.5±0.30 *1, *2 35 GMJ325KB7106[]MHP X7R 10μ ±10, ±20 10 150 2.5±0.30 *1, *2 UMJ325AB7225[]MHP X7R 2.2μ ±10, ±20 3.5 200 2.5±0.30 *1, *2 UMJ325AB7475[]MHP 50 X7R 4.7μ ±10, ±20 5 150 2.5±0.30 *1, *2 UMJ325KB7106[]MHP X7R 10μ ±10, ±20 10 150 2.5±0.30 *1, *2 HMJ325 B7223[]NHT X7R 0.022μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 HMJ325 B7473[]NHT X7R 0.047μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 HMJ325 B7104[]NHT X7R 0.1μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 HMJ325 B7224[]NHT X7R 0.22μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 100 HMJ325 B7474[]NHT X7R 0.47μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 HMJ325 B7105[]NHT X7R 1μ ±10, ±20 3.5 200 1.9±0.20 *1, *2 HMJ325AB7225[]MHP X7R 2.2μ ±10, ±20 3.5 200 2.5±0.30 *1, *2 HMJ325KC7475[]MHPE X7S 4.7μ ±10, ±20 3.5 150 2.5±0.30 *1, *2 QMJ325 B7223[]NHT X7R 0.022μ ±10, ±20 2.5 150 1.9±0.20 *1, *2 QMJ325 B7473[]NHT X7R 0.047μ ±10, ±20 2.5 150 1.9±0.20 *1, *2 250 QMJ325 B7104[]NHT X7R 0.1μ ±10, ±20 2.5 150 1.9±0.20 *1, *2 QMJ325 B7224[]NHT X7R 0.22μ ±10, ±20 2.5 150 1.9±0.20 *1, *2 SMJ325 B7223[]NHT X7R 0.022μ ±10, ±20 2.5 120 1.9±0.20 *1, *2 630 SMJ325 B7473[]NHT X7R 0.047μ ±10, ±20 2.5 120 1.9±0.20 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 34 19

■PART NUMBER LW Reversal Decoupling Capacitors (LWDCTM) ●105TYPE (Dimension:0.52×1.0mm　JIS:0510　EIA:0204） 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　0.3mm thickness（P） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note TWK105 BJ104MPHF 25 X5R 0.1μ ±20 5 150 0.3±0.05 *1, *2 EWK105 BJ224MPHF 16 X5R 0.22μ ±20 10 150 0.3±0.05 *1, *2 LWK105 BJ474MPHF 10 X5R 0.47μ ±20 10 150 0.3±0.05 *1, *2 AWK105 BJ105MPHF 4 X5R 1μ ±20 10 150 0.3±0.05 *1, *2 【Temperature Characteristic C6 : X6S（－55～＋105℃）, C7 : X7S（－55～＋125℃】　0.3mm thickness（P） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note EWK105 C6104MPHF 16 X6S 0.1μ ±20 5 150 0.3±0.05 *1, *2 LWK105 C7104MPHF X7S 0.1μ ±20 5 150 0.3±0.05 *1, *2 10 LWK105 C6224MPHF X6S 0.22μ ±20 10 150 0.3±0.05 *1, *2 JWK105 C7104MPHF X7S 0.1μ ±20 5 150 0.3±0.05 *1, *2 C JWK105 C7224MPHF 6.3 X7S 0.22μ ±20 10 150 0.3±0.05 *1, *2 E JWK105 C6474MPHF X6S 0.47μ ±20 10 150 0.3±0.05 *1, *2 R AWK105 C7224MPHF 4 X7S 0.22μ ±20 10 150 0.3±0.05 *1, *2 A AWK105 C6474MPHF X6S 0.47μ ±20 10 150 0.3±0.05 *1, *2 M IC ●107TYPE (Dimension:0.8×1.6mm　JIS:0816　EIA:0306） C 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　0.5mm thickness（V） A P Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note AC LWK107 BJ105MVHT 10 X5R 1μ ±20 10 150 0.5±0.05 *1, *2 IT JWK107 BJ225MVHT X5R 2.2μ ±20 10 150 0.5±0.05 *1, *2 O 6.3 JWK107 BJ475MVHT X5R 4.7μ ±20 10 150 0.5±0.05 *1, *2 R S 【Temperature Characteristic B7 : X7R（－55～＋125℃）, C6 : X6S（－55～＋105℃）, C7 : X7S（－55～＋125℃）】　0.5mm thickness（V） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note TWK107 B7104MVHT 25 X7R 0.1μ ±20 5 150 0.5±0.05 *1, *2 EWK107 B7224MVHT X7R 0.22μ ±20 5 150 0.5±0.05 *1, *2 16 EWK107 B7474MVHT X7R 0.47μ ±20 5 150 0.5±0.05 *1, *2 LWK107 B7474MVHT 10 X7R 0.47μ ±20 5 150 0.5±0.05 *1, *2 JWK107 C7105MVHT 6.3 X7S 1μ ±20 10 150 0.5±0.05 *1, *2 AWK107 C6225MVHT X6S 2.2μ ±20 10 150 0.5±0.05 *1, *2 4 AWK107 C6475MVHT X6S 4.7μ ±20 10 150 0.5±0.05 *1, *2 ●212TYPE (Dimension:1.25×2.0mm　JIS:1220　EIA:0508） 【Temperature Characteristic BJ : X5R（－55～＋85℃）】　0.85mm thickness（D） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note LWK212 BJ475[]DHT 10 X5R 4.7μ ±10, ±20 10 150 0.85±0.10 *1, *2 JWK212 BJ106MDHT 6.3 X5R 10μ ±20 10 150 0.85±0.10 *1, *2 AWK212 BJ226MDHT 4 X5R 22μ ±20 10 150 0.85±0.10 *1, *2 【Temperature Characteristic C6 : X6S（－55～＋105℃）】　0.85mm thickness（D） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note JWK212 C6475[]DHT 6.3 X6S 4.7μ ±10, ±20 10 150 0.85±0.10 *1, *2 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 35

■PART NUMBER ・ All the Multilayer Ceramic Capacitors of the catalog lineup are RoHS compliant. ・ Capacitance tolerance code is applied to [] of part number. ・ All the Multilayer Ceramic Capacitors in the catalog lineup are applicable for reflow-soldering. Note) ・ The exchange of individual specifications is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels. ・ *1: Automotive (AEC-Q200 Qualified) products for POWERTRAIN, and SAFETY. Please check ”Automotive Application Guide” for further details before using the products. 　　＜　 　A　EC　-　Q　2　00　 　：AEC-Q200 qualified＞ 　　　　　All the Multilayer Ceramic Capacitors of　*1 marks are tested based on the test conditions and methods defined in AEC-Q200 family item. 　　　　　125℃　products：　AEC-Q200　Grade1 (we conduct the evaluation at the test condition of Grade1.) 　　　　　Please consult with TAIYO YUDEN’s official sales channel for the details of the product specification and AEC-Q200 test results, etc., 　　　　　and please review and　approve TAIYO YUDEN's product specification before ordering. ・ *3: For standard case size, please kindly refer to ④Dimension, ⑤Dimension tolerance,　⑨Thickness and STANDARD EXTERNAL DIMENSIONS. High Reliability Application Multilayer Ceramic Capacitors ●105TYPE (Demension:1.0×0.5mm　JIS:1005　EIA:0402） C 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.5mm thickness（V） ERA Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note M UMF105 B7102[]VHF X7R 1000p ±10, ±20 2.5 200 0.5±0.05 *1 IC UMF105 B7222[]VHF 50 X7R 2200p ±10, ±20 2.5 200 0.5±0.05 *1 UMF105 B7472[]VHF X7R 4700p ±10, ±20 2.5 150 0.5±0.05 *1 C UMF105 B7103[]VHF X7R 0.01μ ±10, ±20 3.5 200 0.5±0.05 *1 A TMF105 B7102[]VHF X7R 1000p ±10, ±20 2.5 200 0.5±0.05 *1 P TMF105 B7222[]VHF X7R 2200p ±10, ±20 2.5 200 0.5±0.05 *1 A TMF105 B7472[]VHF X7R 4700p ±10, ±20 2.5 200 0.5±0.05 *1 C TMF105 B7103[]VHF 25 X7R 0.01μ ±10, ±20 3.5 200 0.5±0.05 *1 IT TMF105 B7223[]VHF X7R 0.022μ ±10, ±20 3.5 150 0.5±0.05 *1 O TMF105 B7473[]VHF X7R 0.047μ ±10, ±20 3.5 150 0.5±0.05 *1 R EMF105 B7102[]VHF X7R 1000p ±10, ±20 2.5 200 0.5±0.05 *1 S EMF105 B7222[]VHF X7R 2200p ±10, ±20 2.5 200 0.5±0.05 *1 EMF105 B7472[]VHF X7R 4700p ±10, ±20 2.5 200 0.5±0.05 *1 EMF105 B7103[]VHF 16 X7R 0.01μ ±10, ±20 3.5 200 0.5±0.05 *1 EMF105 B7223[]VHF X7R 0.022μ ±10, ±20 3.5 200 0.5±0.05 *1 EMF105 B7473[]VHF X7R 0.047μ ±10, ±20 3.5 200 0.5±0.05 *1 EMF105 B7104[]VHF X7R 0.1μ ±10, ±20 5 150 0.5±0.05 *1 LMF105 B7102[]VHF X7R 1000p ±10, ±20 2.5 200 0.5±0.05 *1 LMF105 B7222[]VHF X7R 2200p ±10, ±20 2.5 200 0.5±0.05 *1 LMF105 B7472[]VHF X7R 4700p ±10, ±20 2.5 200 0.5±0.05 *1 LMF105 B7103[]VHF 10 X7R 0.01μ ±10, ±20 3.5 200 0.5±0.05 *1 LMF105 B7223[]VHF X7R 0.022μ ±10, ±20 3.5 200 0.5±0.05 *1 LMF105 B7473[]VHF X7R 0.047μ ±10, ±20 3.5 200 0.5±0.05 *1 LMF105 B7104[]VHF X7R 0.1μ ±10, ±20 5 200 0.5±0.05 *1 ●107TYPE (Dimension:1.6×0.8mm　JIS:1608　EIA:0603） 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　0.8mm thickness（A） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note UMF107 B7223[]AHT X7R 0.022μ ±10, ±20 3.5 200 0.8±0.10 *1 50 UMF107 B7104[]AHT X7R 0.1μ ±10, ±20 3.5 200 0.8±0.10 *1 TMF107 B7223[]AHT X7R 0.022μ ±10, ±20 3.5 200 0.8±0.10 *1 25 TMF107 B7104[]AHT X7R 0.1μ ±10, ±20 3.5 200 0.8±0.10 *1 EMF107 B7223[]AHT X7R 0.022μ ±10, ±20 3.5 200 0.8±0.10 *1 EMF107 B7104[]AHT 16 X7R 0.1μ ±10, ±20 3.5 200 0.8±0.10 *1 EMF107 B7105[]AHT X7R 1μ ±10, ±20 10 150 0.8±0.10 *1 LMF107 B7223[]AHT X7R 0.022μ ±10, ±20 3.5 200 0.8±0.10 *1 LMF107 B7104[]AHT 10 X7R 0.1μ ±10, ±20 3.5 200 0.8±0.10 *1 LMF107 B7105[]AHT X7R 1μ ±10, ±20 10 150 0.8±0.10 *1 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 36 19

■PART NUMBER ●212TYPE (Dimension:2.0×1.25mm　JIS:2012　EIA:0805） 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.25mm thickness（G） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMF212 B7103[]GHT X7R 0.01μ ±10, ±20 3.5 200 1.25±0.10 *1 100 HMF212 B7223[]GHT X7R 0.022μ ±10, ±20 3.5 200 1.25±0.10 *1 UMF212 B7103[]GHT X7R 0.01μ ±10, ±20 3.5 200 1.25±0.10 *1 UMF212 B7223[]GHT X7R 0.022μ ±10, ±20 3.5 200 1.25±0.10 *1 UMF212 B7473[]GHT X7R 0.047μ ±10, ±20 3.5 200 1.25±0.10 *1 50 UMF212 B7104[]GHT X7R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1 UMF212 B7224[]GHT X7R 0.22μ ±10, ±20 3.5 200 1.25±0.10 *1 UMF212 B7105[]GHT X7R 1μ ±10, ±20 10 150 1.25±0.10 *1 TMF212 B7103[]GHT X7R 0.01μ ±10, ±20 3.5 200 1.25±0.10 *1 TMF212 B7223[]GHT X7R 0.022μ ±10, ±20 3.5 200 1.25±0.10 *1 TMF212 B7473[]GHT X7R 0.047μ ±10, ±20 3.5 200 1.25±0.10 *1 25 TMF212 B7104[]GHT X7R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1 TMF212 B7224[]GHT X7R 0.22μ ±10, ±20 3.5 200 1.25±0.10 *1 TMF212 B7105[]GHT X7R 1μ ±10, ±20 10 200 1.25±0.10 *1 EMF212 B7473[]GHT X7R 0.047μ ±10, ±20 3.5 200 1.25±0.10 *1 EMF212 B7104[]GHT X7R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1 C EMF212 B7224[]GHT 16 X7R 0.22μ ±10, ±20 3.5 200 1.25±0.10 *1 E EMF212 B7105[]GHT X7R 1μ ±10, ±20 10 200 1.25±0.10 *1 R EMF212AB7475[]GHT X7R 4.7μ ±10, ±20 10 150 1.25+0.15/-0.05 *1 A LMF212 B7473[]GHT X7R 0.047μ ±10, ±20 3.5 200 1.25±0.10 *1 M LMF212 B7104[]GHT X7R 0.1μ ±10, ±20 3.5 200 1.25±0.10 *1 IC LMF212 B7224[]GHT 10 X7R 0.22μ ±10, ±20 3.5 200 1.25±0.10 *1 LMF212 B7105[]GHT X7R 1μ ±10, ±20 10 200 1.25±0.10 *1 C LMF212 B7475[]GHT X7R 4.7μ ±10, ±20 10 150 1.25±0.10 *1 A P A C ●316TYPE (Dimension:3.2×1.6mm　JIS:3216　EIA:1206） IT 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.15mm thickness（F） O Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note RS HMF316 B7102[]FHT X7R 1000p ±10, ±20 2.5 200 1.15±0.10 *1 HMF316 B7222[]FHT X7R 2200p ±10, ±20 2.5 200 1.15±0.10 *1 100 HMF316 B7472[]FHT X7R 4700p ±10, ±20 2.5 200 1.15±0.10 *1 HMF316 B7103[]FHT X7R 0.01μ ±10, ±20 2.5 200 1.15±0.10 *1 UMF316 B7102[]FHT X7R 1000p ±10, ±20 2.5 200 1.15±0.10 *1 UMF316 B7222[]FHT X7R 2200p ±10, ±20 2.5 200 1.15±0.10 *1 50 UMF316 B7472[]FHT X7R 4700p ±10, ±20 2.5 200 1.15±0.10 *1 UMF316 B7103[]FHT X7R 0.01μ ±10, ±20 2.5 200 1.15±0.10 *1 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.6mm thickness（L） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMF316 B7104[]LHT 100 X7R 0.1μ ±10, ±20 3.5 200 1.6±0.20 *1 UMF316 B7104[]LHT X7R 0.1μ ±10, ±20 3.5 200 1.6±0.20 *1 50 UMF316 B7105[]LHT X7R 1μ ±10, ±20 3.5 150 1.6±0.20 *1 TMF316 B7104[]LHT X7R 0.1μ ±10, ±20 3.5 200 1.6±0.20 *1 25 TMF316AB7475[]LHT X7R 4.7μ ±10, ±20 10 150 1.6±0.20 *1 EMF316AB7106[]LHT 16 X7R 10μ ±10, ±20 10 150 1.6±0.20 *1 JMF316AB7106[]LHT 6.3 X7R 10μ ±10, ±20 10 200 1.6±0.20 *1 ●325TYPE (Dimension:3.2×2.5mm　JIS:3225　EIA:1210） 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　2.5mm thickness（M） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMF325 B7225[]MHP 100 X7R 2.2μ ±10, ±20 3.5 150 2.5±0.20 *1 UMF325 B7225[]MHP X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 *1 50 UMF325 B7475[]MHP X7R 4.7μ ±10, ±20 5 150 2.5±0.20 *1 TMF325 B7225[]MHP X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 *1 25 TMF325 B7475[]MHP X7R 4.7μ ±10, ±20 5 200 2.5±0.20 *1 EMF325 B7225[]MHP X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 *1 16 EMF325 B7475[]MHP X7R 4.7μ ±10, ±20 5 200 2.5±0.20 *1 LMF325 B7225[]MHP X7R 2.2μ ±10, ±20 3.5 200 2.5±0.20 *1 10 LMF325 B7475[]MHP X7R 4.7μ ±10, ±20 5 200 2.5±0.20 *1 hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 19 37

■PART NUMBER 【Temperature Characteristic B7 : X7R（－55～＋125℃）】　1.9mm thickness（N） Part number 1 Part number 2 Rated[ Vv]oltage cThaermapceteraritsutrices Capa c[Fit]ance toClaepraanccitea n[c％e] t a[％nδ] Rated vHoTltLaTge x ％ Thickness*3 [mm] Note HMF325 B7223[]NHT X7R 0.022μ ±10, ±20 2.5 200 1.9±0.20 *1 100 HMF325 B7473[]NHT X7R 0.047μ ±10, ±20 2.5 200 1.9±0.20 *1 UMF325 B7223[]NHT X7R 0.022μ ±10, ±20 2.5 200 1.9±0.20 *1 UMF325 B7473[]NHT X7R 0.047μ ±10, ±20 2.5 200 1.9±0.20 *1 UMF325 B7104[]NHT X7R 0.1μ ±10, ±20 3.5 200 1.9±0.20 *1 50 UMF325 B7224[]NHT X7R 0.22μ ±10, ±20 3.5 200 1.9±0.20 *1 UMF325 B7474[]NHT X7R 0.47μ ±10, ±20 3.5 200 1.9±0.20 *1 UMF325 B7105[]NHT X7R 1μ ±10, ±20 3.5 200 1.9±0.20 *1 TMF325 B7224[]NHT X7R 0.22μ ±10, ±20 3.5 200 1.9±0.20 *1 TMF325 B7474[]NHT 25 X7R 0.47μ ±10, ±20 3.5 200 1.9±0.20 *1 TMF325 B7105[]NHT X7R 1μ ±10, ±20 3.5 200 1.9±0.20 *1 EMF325 B7224[]NHT X7R 0.22μ ±10, ±20 3.5 200 1.9±0.20 *1 EMF325 B7474[]NHT 16 X7R 0.47μ ±10, ±20 3.5 200 1.9±0.20 *1 EMF325 B7105[]NHT X7R 1μ ±10, ±20 3.5 200 1.9±0.20 *1 LMF325 B7224[]NHT X7R 0.22μ ±10, ±20 3.5 200 1.9±0.20 *1 LMF325 B7474[]NHT 10 X7R 0.47μ ±10, ±20 3.5 200 1.9±0.20 *1 C LMF325 B7105[]NHT X7R 1μ ±10, ±20 3.5 200 1.9±0.20 *1 E R A M IC C A P A C IT O R S hq_c_mlcc_e-E07R01 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our product specification sheets. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our website (http://www.ty-top.com/) . 38 19

Multilayer Ceramic Capacitors ■PACKAGING ①Minimum Quantity ●Taped package Thickness Standard quantity [pcs] Type(EIA) mm code Paper tape Embossed tape □MK021(008004) 0.125 K － 50000 □VS021(008004) □MK042(01005) 0.2 C, D － 40000 □VS042(01005) 0.2 C □MK063(0201) 0.3 P,T 15000 － □WK105(0204) ※ 0.3 P 10000 － 0.13 H － 20000 0.18 E － 15000 □MK105(0402) 0.2 C 20000 － □MF105(0402) 0.3 P 15000 － 0.5 V 10000 － □VK105(0402) 0.5 W 10000 － □MK107(0603) 0.45 K 4000 － □WK107(0306) ※ 0.5 V － 4000 □MF107(0603) 0.8 A 4000 － □VS107(0603) 0.7 C 4000 － □MJ107(0603) 0.8 A 3000 3000 □MK212(0805) 0.45 K 4000 － □WK212(0508) ※ 0.85 D □MF212(0805) 1.25 G － 3000 □VS212(0805) 0.85 D 4000 － 0.85 D 4000 － □MJ212(0805) 1.25 G － 2000 0.85 D 4000 － □MK316(1206) 1.15 F － 3000 □MF316(1206) 1.6 L － 2000 1.15 F － 3000 □MJ316(1206) 1.6 L － 2000 0.85 D 1.15 F □MK325(1210) － 2000 1.9 N □MF325(1210) 2.0max. Y 2.5 M － 1000 1.9 N － 2000 □MJ325(1210) 2.5 M － 500(T), 1000(P) □MK432(1812) 2.5 M － 500 Note : ※ LW Reverse type. ②Taping material ※No bottom tape for pressed carrier tape ●Card board carrier tape ●Embossed tape Top tape Top tape Base tape Sprocket hole Sprocket hole Bottom tape Chip cavity Base tape Chip cavity ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

Chip filled Chip ※ LW Reverse type. ③Representative taping dimensions ●Paper Tape（8mm wide） ●Pressed carrier tape（ 2mm pitch） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） T A B 3.5±0.05(0.138±0.002) 8.0±0.30.315±0.012) ( T1 F 2.0±0.05 4.0±0.1 (0.079±0.002) (0.157±0.004) Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ Ｔ T1 □MK063(0201) 0.37 0.67 0.45max. 0.42max. □WK105(0204) ※ 2.0±0.05 □MK105(0402) （*1 C） 0.65 1.15 0.4max. 0.3max. □MK105(0402) （*1 P） 0.45max. 0.42max. Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type. Unit：mm ●Punched carrier tape （2mm pitch） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） T A B 3.5±0.05(0.138±0.002) 8.0±0.30.315±0.012) ( F 2.0±0.05 4.0±0.1 (0.079±0.002) (0.157±0.004) Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ Ｔ □MK105 (0402) □MF105 (0402) 0.65 1.15 2.0±0.05 0.8max. □VK105 (0402) Unit：mm ●Punched carrier tape （4mm pitch） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） T A B 3.5±0.050.138±0.002) 8.0±0.3315±0.012) ( 0. ( F 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ Ｔ □MK107(0603) □WK107(0306) ※ 1.0 1.8 1.1max. □MF107(0603) 4.0±0.1 □MK212(0805) 1.65 2.4 □WK212(0508) ※ 1.1max. □MK316(1206) 2.0 3.6 Note：Taping size might be different depending on the size of the product. ※ LW Reverse type. Unit：mm ●Embossed tape（4mm wide） Unit：mm（inch） φ0.8±0.04 0.9±0.05 Sprockethole (φ0.031±0.002) (0.035±0.002) A B 1.8±0.02(0.071±0.001) 4.0±0.050.157±0.002) ( F 1.0±0.02 2.0±0.04 (0.039±0.001) (0.079±0.002) Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ K T □MK021(008004) 0.135 0.27 □VS021(008004) 1.0±0.02 0.5max. 0.25max. □MK042(01005) 0.23 0.43 □VS042(01005) Unit：mm ●Embossed tape（8mm wide） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） A B 3.5±0.050.138±0.002) 8.0±0.3315±0.012) ( 0. ( F 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ K T □MK105(0402) 0.6 1.1 2.0±0.1 0.6max 0.2±0.1 □WK107(0306) ※ 1.0 1.8 1.3max. 0.25±0.1 □MK212(0805) 1.65 2.4 □MF212(0805) □MK316(1206) 4.0±0.1 2.0 3.6 3.4max. 0.6max. □MF316(1206) □MK325(1210) 2.8 3.6 □MF325(1210) Note： ※ LW Reverse type. Unit：mm ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

●Embossed tape（12mm wide） Unit：mm（inch） φ1.5＋0.1/－0 1.75±0.1 Sprockethole (φ0.059＋0.004/-0) (0.069±0.004） B A 5.5±0.050.217±0.002) 12.0±0.3472±0.012) ( 0. ( 4.0±0.1 2.0±0.1 (0.157±0.004) (0.079±0.004) F Chip Cavity Insertion Pitch Tape Thickness Type(EIA) Ａ Ｂ Ｆ K T □MK325(1210) 3.1 4.0 8.0±0.1 4.0max. 0.6max. □MK432(1812) 3.7 4.9 8.0±0.1 4.0max. 0.6max. Unit：mm ④Trailer and Leader Blank portion Chip cavity Blank portion Leader 160mm or more 100mm or more (6.3inches or more) (3.94inches or more) 400mm or more Direction of tape feed (15.7inches or more) ⑤Reel size t E C B A R D W A B C D E R φ178±2.0 φ50min. φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0 T W 4mm wide tape 1.5max. 5±1.0 8mm wide tape 2.5max. 10±1.5 12mm wide tape 2.5max. 14±1.5 Unit：mm ⑥Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. Pull direction 0～20° Top tape Base tape ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_pack_e-E06R01

Multilayer Ceramic Capacitors ■RELIABILITY DATA 1.Operating Temperature Range Temperature Standard －55 to ＋125℃ Compensating（Class1） High Frequency Type Specification Temperature Range B －25 to ＋85℃ BJ Specified X5R －55 to ＋85℃ Value B7 X7R －55 to ＋125℃ High Permittivity （Class2） C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ D7 X7T －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacitor 2. Storage Conditions Temperature Standard －55 to ＋125℃ Compensating（Class1） High Frequency Type Specification Temperature Range B －25 to ＋85℃ BJ Specified X5R －55 to ＋85℃ Value B7 X7R －55 to ＋125℃ High Permittivity （Class2） C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ D7 X7T －55 to ＋125℃ LD(※) X5R －55 to ＋85℃ Note: ※LD Low distortion high value multilayer ceramic capacitor 3. Rated Voltage Temperature Standard 50VDC, 25VDC Specified Compensating（Class1） High Frequency Type 50VDC, 25VDC Value High Permittivity （Class2） 50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC 4. Withstanding Voltage （Between terminals） Temperature Standard Specified Compensating（Class1） High Frequency Type No breakdown or damage Value High Permittivity （Class2） Class 1 Class 2 Test Applied voltage Rated volta×3 Rated voltage×2.5 Methods and Duration 1 to 5 sec. Remarks Charge/discharge current 50mA max. 5. Insulation Resistance Temperature Standard 10000 MΩ min. Specified Compensating（Class1） High Frequency Type Value C≦0.047μF : 10000 MΩ min. High Permittivity （Class2） Note 1 C＞0.047μF : 500MΩ・μF Test Applied voltage : Rated voltage Methods and Duration : 60±5 sec. Remarks Charge/discharge current : 50mA max. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01

6. Capacitance （Tolerance） C□ 0.2pF≦C≦5pF : ±0.25pF Standard U□ 0.2pF≦C≦10pF : ±0.5pF Temperature SL C＞10pF : ±5% or ±10% Specified Compensating（Class1） 0.3pF≦C≦2pF : ±0.1pF Value High Frequency Type CH C＞2pF : ±5% BJ, B7, C6, C7, D7, LD(※) : ±10% or ±20% High Permittivity （Class2） Note: ※LD Low distortion high value multilayer ceramic capacitor Class 1 Class 2 Standard High Frequency Type C≦10μF C＞10μF Test Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2 Methods and Measuring frequency 1ＭHz±10% 1kHz±10% 120±10Hz Remarks Measuring voltage Note 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1rms Bias application one 7. Q or Dissipation Factor C＜30pF : Q≧400＋20C Temperature Standard C≧30pF : Q≧1000 （C：Nominal capacitance） Specified Compensating（Class1） Value High Frequency Type Refer to detailed specification High Permittivity （Class2） Note 1 BJ, B7, C6, C7, D7：2.5% max. Class 1 Class 2 Standard High Frequency Type C≦10μF C＞10μF Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2 Test Measuring frequey 1ＭHz±10% 1GHz 1ｋHz±10% 120±10Hz Methods and Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms Remarks Bias application None High Frequency Type Measuring equipment : HP4291A Measuring jig : HP16192A 8. Temperature Characteristic （Without voltage application） Temperature Characteristic ［ppm/℃］ Tolerance ［ppm/℃］ G : ±30 C□ : 0 CG,CH, CJ, CK H : ±60 Standard Temperature U□ : －750 UJ, UK J : ±120 Compensating（Class1） K : ±250 SL : ＋350 to －1000 Temperature Characteristic ［ppm/℃］ Tolerance ［ppm/℃］ High Frequency Type C□ : 0 CH H : ±60 Specified Capacitance Reference Value Specification Temperature Range change temperature B ±10% 20℃ －25 to ＋85℃ BJ X5R ±15% 25℃ －55 to ＋85℃ B7 X7R ±15% 25℃ －55 to ＋125℃ High Permittivity （Class2） C6 X6S ±22% 25℃ －55 to ＋105℃ C7 X7S ±22% 25℃ －55 to ＋125℃ D7 X7S ＋22/－33% 25℃ －55 to ＋125℃ LD(※) X5R ±15% 25℃ －55 to ＋85℃ Note : ※LD Low distortion high value multilayer ceramic capacitor Class 1 Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. （C －C ） 85 20 ×106（ppm/℃） C ×△T △T＝65 20 Test Class 2 Methods and Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following Remarks equation. Step B X5R、X7R、X6S、X7S、X7T 1 Minimum operating temperature 2 20℃ 25℃ 3 Maximum operating temperature ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01

（C－C） 2 ×100（%） C 2 C ：Capacitance in Step 1 or Step 3 C2 ：Capacitance in Step 2 9. Deflection Appearance : No abnormality Standard Temperature Capacitance change : Within ±5% or ±0.5 pF, whichever is larger. Compensating（Class1） Appearance : No abnormality Specified High Frequency Type Cpaitance change : Within±0.5 pF Value Appearance : No abnormality High Permittivity （Class2） Capacitance change : Within ±12.5%（BJ, B7, C6, C7, D7, LD(※)） Note: ※LD Low distortion high value multilayer ceramic capacitor Multilayer Ceramic Capacitors 042, 063, ※１105 Type The other types Board Glass epoxy-resin substrate Test Thickness 0.8mm 1.6mm Methods and Warp 1mm （Soft Termination type:3mm） Remarks Duration 10 sec. ※１：105 Type thickness, C： 0.2mm ,P： 0.3mm. Capacitance measurement shall be conducted with the board bent 10. Body Strength Temperature Standard － Specified Compensating（Class1） High Frequency Type No mechanical damage. Value High Permittivity （Class2） － High Frequency Type Applied force : 5N Test Duration : 10 sec. Methods and Remarks 11. Adhesive Strength of Terminal Electrodes Temperature Standard Specified Compensating（Class1） High Frequency Type No terminal separation or its indication. Value High Permittivity （Class2） Multilayer Ceramic Capacitors Test 042, 063 Type 105 Type or more Methods and Applied force 2N 5N Remarks Duration 30±5 sec. 12. Solderability Temperature Standard Specified Compensating（Class1） High Frequency Type At least 95% of terminal electrode is covered by new solder. Value High Permittivity （Class2） Eutectic solder Lead-free solder Test Solder type H60A or H63A Sn-3.0Ag-0.5Cu Methods and Solder temperature 230±5℃ 245±3℃ Remarks Duration 4±1 sec. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01

13. Resistance to Soldering Appearance : No abnormality Capacitance change : Within ±2.5% or ±0.25pF, whichever is larger. Standard Q : Initial value Insulation resistance : Initial value Temperature Withstanding voltage （between terminals） : No abnormality Compensating（Class1） Appearance : No abnormality Capacitancecange : Within ±2.5% Specified High Frequency Type Q : Initial value Value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Appearance : No abormality Capactace change : Within ±7.5%（BJ, B7, C6, C7, D7, LD(※)） Dissipation factor : Initial value High Permittivity （Class2） Note 1 Insulation resistance : Initial value Withstanding voltage （between terminals）: No abnormality Note: ※LD Low distortion high value multilayer ceramic capacitor lss 1 042, 063 Type 105 Type Preconditioning None 80 to 100℃, 2 to 5 min. Preheating 150℃, 1 to 2 min. 150 to 200℃, 2 to 5 min. Solder temp. 270±5℃ Duration 3±0.5 sec. Test Recovery 6 to 24 hrs （Standard condition） Noe 5 Methods and Remarks Class 2 042、063 Type 105, 107, 212 Type 316, 325 Type Preconditioning Thermal treatment （at 150℃ for 1 hr） Note 2 80 to 100℃, 2 to 5 min. 80 to 100℃, 5 to 10 min. Preheating 150℃, 1 to 2 min. 150 to 200℃, 2 to 5 min. 150 to 200℃, 5 to 10 min. Solder temp. 270±5℃ Duration 3±0.5 sec. Recovery 24±2 hrs （Standard condition） Note 5 14. Temperature Cycle (Thermal Shock） Appearance : No abnormality Capacitance change : Within ±2.5% or ±0.25pF, whichever is larger. Standard Q : Initial value Insulation resistance : Initial value Temperature Withstanding voltage （between terminals） : No abnormality Compensating（Class1） Appearance : No abnormality Capacitance change : Within ±0.25pF Specified High Frequency Type Q : Initial value Value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Appearance : No abnormality Capacitance change : Within ±7.5% （BJ, B7, C6, C7, D7, LD(※)） Dissipation factor : Initial value High Permittivity （Class2） Note 1 Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Note: ※LD Low distortion high value multilayer ceramic capacitor Class 1 Class 2 Thermal treatment （at 150℃ for 1 hr） Preconditioning None Note 2 Step Temperature（℃） Time（min.） Test 1 Minimum operating temperature 30±3 Methods and 1 cycle 2 Normal temperature 2 to 3 Remarks 3 Maximum operating temperature 30±3 4 Normal temperature 2 to 3 Number of cycles 5 times Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01

15. Humidity （Steady State） Appearance : No abnormality Capacitance change : Within ±5% or ±0.5pF, whichever is larger. Q : C＜10pF : Q≧200＋10C Standard 10≦C＜30pF : Q≧275＋2.5C Temperature C≧30pF:Q≧350（C：Nominal capacitance） Compensating（Class1） Insulation resistance : 1000 MΩ min. Specified Appearance : No abnormality Value High Frequency Type Capacitance change : Within ±0.5pF, Insulation resistance : 1000 MΩ min. Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)） High Permittivity （Class2） Note 1 Dissipation factor : 5.0% max.（BJ, B7, C6, C7, D7, LD(※)） Insulation resistance : 50 MΩμF or 1000 MΩ whichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor Class 1 Class 2 Standard High Frequency Type All items Test Preconditioning None Thermal treatment（ at 150℃ for 1 hr） Note 2 Methods and Temperature 40±2℃ 60±2℃ 40±2℃ Remarks Humidity 90 to 95%RH 90 to 95%RH Duration 500＋24/－0 hrs 500＋24/－0 hrs Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5 16. Humidity Loading Appearance : No abnormality Capacitance change : Within ±7.5% or ±0.75pF, whichever is larger. Standard Q : C＜30pF：Q≧100＋10C/3 C≧30pF：Q≧200 （C：Nominal capacitance） Temperature Insulation resistance : 500 MΩ min. Compensating（Class1） Appearance : No abnormality Capacitance change : C≦2pF：Within ±0.4 pF Specified High Frequency Type C＞2pF：Within ±0.75 pF Value （C：Nominal capacitance） Insulation resistance : 500 MΩ min. Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)） High Permittivity （Class2） Note 1 Dissipation factor : 5.0% max. （BJ, B7, C6, C7, D7, LD(※)） Insulation resistance : 25 MΩμF or 500 MΩ, whichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor Class 1 Class 2 Standard High Frequency Type All items Preconditioning Voltage treatment None （Rated voltage are applied for 1 hour at 40℃） Note 3 Test Temperature 40±2℃ 60±2℃ 40±2℃ Methods and Humidity 90 to 95%RH 90 to 95%RH Remarks Duration 500＋24/－0 hrs 500＋24/－0 hrs Applied voltage Rated voltage Rated voltage Charge/discharge 50mA max. 50mA max. current Recovery 6 to 24 hrs （Standard condition） Note 5 24±2 hrs（Standard condition） Note 5 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01

17. High Temperature Loading Appearance : No abnormality Capacitance change : Within ±3% or ±0.3pF, whichever is larger. Q : C＜10pF： Q≧200＋10C Standard 10≦C＜30pF：Q≧275＋2.5C Temperature C≧30pF： Q≧350（C：Nominal capacitance） Compensating（Class1） Insulation resistance : 1000 MΩ min. Specified Appearance : No abnormality Value High Frequency Type Capacitance change : Within ±3% or ±0.3pF, whichever is larger. Insulation resistance : 1000 MΩ min. Appearance : No abnormality Capacitance change : Within ±12.5% （BJ, B7, C6, C7, D7, LD(※)） High Permittivity （Class2） Note 1 Dissipation factor : 5.0% max.（BJ, B7, C6, C7, D7, LD(※)） Insulation resistance : 50 MΩμF or 1000 MΩ, whichever is smaller. Note: ※LD Low distortion high value multilayer ceramic capacitor Class 1 Class 2 Standard High Frequency Type BJ, LD(※) C6 B7, C7, D7 Voltage treatment（Twice the rated voltage shall be applied for Preconditioning None 1 hour at 85℃, 105℃ or 125℃） Note 3, 4 Temperature Maximum operating temperature Maximum operating temperature Test Duration 1000＋48/－0 hrs 1000＋48/－0 hrs Methods and Applied voltage Rated voltage×2 Rated voltage×2 Note 4 Remarks Charge/discharge 50mA max. 50mA max. current Recovery 6 to 24hr （Standard condition） Note 5 24±2 hrs （Standard condition） Note 5 Note: ※LD Low distortion high value multilayer ceramic capacitor Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail. Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours. Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2hours. Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information. Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_reli_e-E06R01

Medium-High Voltage Multilayer Ceramic Capacitor ■RELIABILITY DATA 1. Operating Temperature Range Temperature Compensating(High Frequency type) CG(C0G) : －55 to ＋125℃ Specified Value High permittivity X7R, X7S : －55 to ＋125℃ X5 : －55 to ＋85℃ B : －25 to ＋85℃ 2. Storage Temperature Range Temperature Compensating(High Frequency type) CG(C0G) : －55 to ＋125℃ Specified Value High permittivity X7R, X7S : －55 to ＋125℃ X5R : －55 to ＋85℃ B : －25 to ＋85℃ 3. Rated Voltage Specified Value 100VDC(HMK,HMJ), 250VDC(QMK,QMJ,QVS), 630VDC(SMK,SMJ) 4. Withstanding Voltage（Between terminals） Specified Value No breakdown or damage Applied voltage : Rated voltage×2.5（HMK,HMJ）, Rated voltage×2（QMK,QMJ,QVS）, Rated voltage×1.2（SMK,SMJ） Test Methods and Duration : 1 to 5sec. Remarks Carge/discharge current : 50mA max. ５．Insulation Resistance Temperature Compensating(High Frequency type) 10000MΩ min Specified Value High permittivity 100MΩμF or 10GΩ, whichever is smaller. Applied voltage : Rated voltage（HMK,HMJ, QMK,QMJ,QVS）, 500V（SMK,SMJ） Test Methods and Duration : 60±5sec. Remarks Charge/discharge current : 50mA max. 6．Capacitance （Tolerance） Temperature Compensating(High Frequency type) ±0.1pF (C＜5pF) ±0.25pF (C＜10pF) ±0.5pF (5pF≦C＜10pF) ±2%(C=10pF) ±5%(C≧10pF) Specified Value High permittivity ±10%, ±20% Temperature Compensating(High Frequency type) Measuring frequency : 1MHz±10% Measuring voltage : 0.5 to 5Vrms Bias application : None Test Methods and Remarks High permittivity Measuring frequency : 1kHz±10% Measuring voltage : 1±0.2Vrms Bias application : None ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_mhv_reli_e-E06R01

7．Q or Dissipation Factor Temperature Compensating(High Frequency type) C＜30pF : Q≧800＋20C C≧30pF : Q≧1400 C:Normal Capacitance(/pF) Specified Value High permittivity 3.5%max（HMK,HMJ） 2.5%max（QMK,QMJ, SMK,SMJ） Temperature Compensating(High Frequency type) Measuring frequency : 1MHz±10% Measuring voltage : 0.5 to 5Vrms Bas application : None Test Methods and Remarks High permittivity Measuring frequency : 1kHz±10% Measuring voltage : 1±0.2Vrms Bas application : None 8．Temperature Characteristic of Capacitance Temperature Compensating(High Frequency type) C0G :±30ppm（25 to ＋125℃） High permittivity Specified Value B : ±10%（－25 to ＋85℃） X5R : ±15%（－55 to ＋85℃） X7R : ±15%（－55 to ＋125℃） X7S : ±22%（－55 to ＋125℃） Temperature Compensating(High Frequency type) Capacitance at 25℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the ｆollowing equation. （C －C ） 85 25 ×106×[ppm/℃] C ×ΔT 25 High permittivity Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. Test Methods and Step B X5R、X7R、X7S Remarks 1 Minimum operating tempeature 2 20℃ 25℃ 3 Maximum operating temperature （C－C） 2 ×100（%） C 2 C : Capacitance value in Step 1 or Step 3 C2 : Capacitance value in Step 2 9．Deflection Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change :±5% or ±0.5pF, whichever is larger. Specified Value High permittivity Appearance : No abnormality Capacitance change : Within±10% Warp : 1mm （Soft Termination type:3mm） Duration : 10sec. Test board : Glass epoxy-resin substrate Test Methods and Thicknss : 1.6mm Remarks Capacitance measurement shall be conducted with the board bent. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_mhv_reli_e-E06R01

10．Adhesive Strength of Terminal Electrodes Specified Value No terminal separation or its indication. Temperature Compensating(High Frequency type) Applied force : 2N Duration : 10±5sec. Test Methods and Remarks High permittivity Applied force : 5N Duration : 30±5sec. 11．Solderability Specified Value At least 95% of terminal electrode is covered by new solder Eutectic solder Lead-free solder Test Methods and Solder type H60A or H63A Sn-3.0Ag-0.5Cu Remarks Solder temperature 230±5℃ 245±3℃ Duration 4±1 sec. 12．Resistance to Soldering Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦10pF :±0.25pF C※＞10pF :±2.5% ※Normal capacitance Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Specified Value High permittivity Appearance : No abnormality Capacitance change : Within±15%（HMK,HMJ）, ±10%（QMK,QMJ, SMK,SMJ） Dissipation factor : Inital value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Preconditioning : Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity) Solder temperature : 270±5℃ Test Methods and Duration : 3±0.5sec. Remarks Preheating conditions : 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5min. Recovery : 24±2hrs under the stadard condition Note3 13．Temperature Cycle （Thermal Shock） Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦10pF :±0.25% C※＞10pF :±2.5% Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Specified Value High permittivity Appearance : No abnormality Capacitance change : Within±15%（HMK,HMJ）, ±7.5%（QMK,QMJ, SMK,SMJ） Dissipation factor : Initial value Insulation resistance : Initial value Withstanding voltage （between terminals） : No abnormality Preconditioning : Thermal treatment （at 150℃ for 1hr） Note1 Conditions for 1 cycle Step temperature（℃） Time（min.） 1 Minimum operating temperature 30±3min. Test Methods and 2 Normal temperature 2 to 3min. Remarks 3 Maximum operating temperature 30±3min. 4 Normal temperature 2 to 3min. Number of cycles : 5 times Recovery : 24±2hrs under the standard condition Note3 ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_mhv_reli_e-E06R01

14．Humidity （Steady state） Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦10pF :±0.5pF C※＞10pF :±5% ※Normal capacitance Insulation resistance : 1000MΩmin Specified Value High permittivity Appearance : No abnormality Capacitance change : Within±15% Dissipation factor : 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）. Insulation resistance : 25MΩμF or 1000MΩ, whichever is smaller. Preconditioning : Thermal treatment（at 150℃ for 1hr） Note1 (Only High permittivity) Temperature : 40±2℃ Test Methods and Humidity : 90 to 95%RH Remarks Duration : 500 ＋24/－0 hrs Recovery : 24±2hrs under the standard condition Note3 15．Humidity Loading Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦2.0pF :±0.4pF 2.0pF＜C≦10pF : ±0.75pF C※＞10pF :±7.5% : ※Normal capacitance Insulation resistance : 500MΩmin Specified Value High permittivity Appearance : No abnormality Capacitance change : Within±15% Dissipation factor : 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）. Insulation resistance : 10MΩμF or 500MΩ, whichever is smaller. According to JIS 5102 clause 9.9. Preconditioning : Voltage treatment Note2 (Only High permittivity) Temperature : 40±2℃ Test Methods and Humidity : 90 to 95%RH Remarks Applied voltage : Rated voltage Charge/discharge current : 50mA max. Duration : 500 ＋24/－0 hrs Recovery : 24±2hrs under the standard condition Note3 16．High Temperature Loading Temperature Compensating(High Frequency type) Appearance : No abnormality Capacitance change : C※≦10pF :±0.3pF C※＞10pF :±3% Insulation resistance :1000MΩmin Specified Value High permittivity Appearance : No abnormality Capacitance change : Within±15% Dissipation factor : 7%max（HMK,HMJ）, 5%max（QMK,QMJ, SMK,SMJ）. Insulation resistance : 50MΩμF or 1000MΩ, whichever is smaller. According to JIS 5102 clause 9.10. Preconditioning : Voltage treatment Note2 (Only High permittivity) Temperature : Maximum operating temperature Test Methods and Applied voltage : Rated voltage×2（HMK,HMJ,QVS） Rated voltage×1.5（QMK,QMJ） Rated voltage×1.2（SMK,SMJ） Remarks Charge/discharge current : 50mA max. Duration : 1000 ＋24/－0 hrs Recovery : 24±2hrs under the standard condition Note3 Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for 24±2hours. Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and kept at room temperature for 24±2hours. Note3 Standard condition : Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_mhv_reli_e-E06R01

Precautions on the use of Multilayer Ceramic Capacitors ■PRECAUTIONS 1. Circuit Design ◆Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. Precautions ◆Operating Voltage （Verification of Rated voltage） 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design ◆Pattern configurations （Design of Land-patterns） 1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: （1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. Precautions （2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. ◆Pattern configurations （Capacitor layout on PCBs） After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. ◆Pattern configurations （Design of Land-patterns） The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. （1）Recommended land dimensions for typical chip capacitors ●Multilayer Ceramic Capacitors : Recommended land dimensions Land patterns for PCBs （unit: mm） Land pattern Wave-soldering Chip capacitor Solder-resist Type 107 212 316 325 L 1.6 2.0 3.2 3.2 Size C W 0.8 1.25 1.6 2.5 A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 B A B C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Chip capacitor W L Technical Reflow-soldering considerations Type 042 063 105 107 212 316 325 432 L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5 Size W 0.2 0.3 0.5 0.8 1.25 1.6 2.5 3.2 A 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5 B 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8 C 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5 Note：Recommended land size might be different according to the allowance of the size of the product. ●LWDC: Recommended land dimensions for reflow-soldering LWDC （unit: mm） Type 105 107 212 L 0.52 0.8 1.25 Size W W 1.0 1.6 2.0 A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7 B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5 C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1 L ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01

（2）Examples of good and bad solder application Items Not eommended Recommended Lead wire of component Solder-resist Mixed mounting of SMD and leaded components Chassis Solder (for grounding) Solder-resist Component placement close to the chassis Electrode pattern Lead wire of component Soldering iron Hand-soldering of leaded Solder-resist Components near mounted components Solder-resist Horizontal component placement ◆Pattern configurations （Capacitor layout on PCBs） 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or deflection. Items Not recommended Recommended Place the product at a right angle to the direction of the Deflection of board anticipated mechanical stress. 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. E D Perforation C A B Slit Magnitude of stress A＞B＝C＞D＞E 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting ◆Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. ◆Selection of Adhesives Precautions 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01

◆Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. （1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. （2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads. （3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: Items Not recommended Recommended chipping Single-sided mounting or cracking supporting pins or back-up pins Double-sided mounting chipping supporting pins or cracking or back-up pins Technical 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical considerations impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. ◆Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. （1）Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. （2）The recommended amount of adhesives is as follows; ［Recommended condition］ Amount adhesive After capacitor are bonded Figure 212/316 case sizes as examples a a a 0.3mm min b b 100 to 120μm c Adhesives shall not contact land c c 4. Soldering ◆Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; （1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall not be applied. （2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. Precautions （3）When water-soluble flux is used, special care shall be taken to properly clean the boards. ◆Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. ◆Selection of Flux 1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. Technical 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted considerations and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01

◆Soldering ･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. ･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. ･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃. ･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃. ［Reflow soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 300 300 Preheating 230℃ Peak Within 10sec. 260℃ Max. ℃） 200 60Msine.c . 6M0sine.c ℃） 200 Within 10sec. mperature（ 100 Slow cooling mperature（ 100 cSoololiwn g Te Te Preheating150℃ Heating above 60sec. Min. 230℃ 0 0 40sec. Max. 1/2T～1/3T Caution Capacitor ①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the Solder T thickness of a capacitor. PC board ②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. ③Allowable number of reflow soldering : 2 times max. ［Wave soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 300 300 230～250℃ Peak Preheating Within 3sec. 260℃ Max. ℃） 200 120sec. Min. ℃） 200 120sec. Min. Within 10sec. mperature（ 100 Slow cooling mperature（ 100 P15re0h℃ea ting cSoololiwng Te Te 0 0 Caution ①Wave soldering must not be applied to capacitors designated as for reflow soldering only. ②Allowable number of wave soldering : 1 times max. ［Hand soldering］ 【Recommended conditions for eutectic soldering】 【Recommended condition for Pb-free soldering】 400 400 400 230～280℃ Peak Peak Within 3sec. 350℃ Max. 280℃ Max. 300 300 Within 3sec. 300 Within 3sec. Temperature（℃） 210000 Slow cooling Temperature（℃） 210000 ⊿T P15re0h℃ea tMiningS. low cooling 温度（℃） 210000 ⊿T P15re0h℃ea tMinSinglo. w cooling Preheating 0 60sec. Min. 0 60sec. Min. 0 60sec. Min. ⊿T ⊿T 316type or less ⊿T≦150℃ 325type or more ⊿T≦130℃ Caution ①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. ②The soldering iron shall not directly touch capacitors. ③Allowable number of hand soldering : 1 times max. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01

5. Cleaning ◆Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use Precautions of the cleaning. （e.g. to remove soldering flux or other materials from the production process.） 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）. 2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the Technical cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall considerations be carefully checked; Ultrasonic output : 20 W/ℓ or less Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less 6. Resin coating and mold 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. Precautions 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling ◆Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. Precautions ◆Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. （1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. （2）Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions ◆Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature : Below 30℃ Humidity : Below 70% RH Precautions The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. ・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150℃ for 1hour. If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and Technical quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the considerations above period, please check solderability before using the capacitors. ※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_prec_e-E07R01

High Reliability Application Multilayer Ceramic Capacitors ■RELIABILITY DATA 1. Operating Temperature Range Specified Value X7R（－55℃ to ＋125℃） Test Methods and Continuous use is available in this range. （reference temperature : 25℃） Remarks 2.Highest Operating temperature Range Specified Value X7R（－55℃ to ＋125℃） Test Methods and Maximum ambient temperature at which capacitors can be continuously used with rated voltage applied. Remarks 3. Rated Voltage Specified Value Please refer to the page of the "PART NUMBERS". Test Methods and Continuous maximum applied voltage. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than Remarks the rated voltage of the capacitor. 4. Shape and Dimensions Specified Value Please refer to the page of the "EXTERNAL DIMENSIONS". ５. Heat Treatment （ClassⅡ） Test Methods and Initial value shall be measured after test sample is heat－treated at 150＋0/－10℃ for an hour and kept at room temperature for 24 ± Remarks 2 hours. 6. Voltage Treatment （ClassⅡ） Test Methods and Initial value shall be measured after test sample is voltage－treated for an hour at temperature and voltage which are specified as test Remarks conditions, and kept at room temperature for 24 ±2 hours. ７. Dielectric Withstanding Voltage （between terminals） Specified Value No abnormality. Applied voltage : Rated voltage × 2.5 Test Methods and Duration : 1 to 5 seconds. Remarks Charging and discharging current shall be 50mA max. 8. Insulation Resistance Specified Value Larger than whichever smaller of 500 MΩ・μF or 104 MΩ Applied voltage : Rated voltage Test Methods and Duration : 60±5 seconds. Remarks Charging and discharging current shall be 50mA max. 9. Capacitance and Tolerance Specified Value Please refer to the page of the "PART NUMBERS". Measurement frequency : 1kHz±10%（C≦10μF） Test Methods and Measurement voltage : 1±0.2Vrms（C≦10μF） Remarks 0.5±0.1V（6.3V rated voltage） Heat treatment specified in No.5 of the specification shall be conducted prior to measurement. 10. Q or Dissipation factor （tanδ） Specified Value Please refer to the page of the "PART NUMBERS". Measurement frequency : 1kHz±10%（C≦10μF） Test Methods and Measurement voltage : 1±0.2Vrms（C≦10μF） Remarks 0.5±0.1V（6.3V rated voltage） Heat treatment specified in No.5 of the specification shall be conducted prior to measurement. NO DC bias is applied. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_hra_reli_e-E06R01

11. Temperature Characteristic （without DC bias） Specified Value X7R（－55℃ to ＋125℃）：±15% Confirming to EIA RS－198－D （1991） Heat treatment specified in No.5 of the specification shall be conducted prior to measurement. Change of the maximum capacitance deviation in step 1 to 5. step Temperature（℃） Test Methods and 1 ＋25 Remarks 2 Minimum operating temperature 3 ＋25 4 Maximum operating temperature 5 ＋25 12. Adhesive Force of Terminal Electrodes Specified Value Appearance：Terminal electrodes shall be no exfoliation or a sign of exfoliation. Solder lands refer to fig.1. 1608 size larger than 2012 size Applying force 5N 10Ｎ Duration 30±5 seconds. Board Glass epoxy-resin substrate Thickness 1.6mm Test Methods and Remarks Case size Dimension 1608 2012 3216 3225 a 1.0 1.2 2.2 2.2 b 3.0 4.0 5.0 5.0 c 1.2 1.65 2.0 2.9 Fig.1 13. Vibration Appearance : No abnormality Capacitance change : Initial value shall be satisfied. Specified Value Dissipation factor : Initial value shall be satisfied. Insulation resistance : Initial value shall be satisfied. Heat treatment specified in No.5 of the specification shall be conducted prior to test. Measurement shall be conducted after test sample is heat treated as specified in No.5. Solder lands refer to figure 1. Test Methods and Direction of the vibration test : X, Y, Z each of 3 orientations for 2 hours respectively （total 6 hours） Remarks Vibrationfrequency : 10 to 55 to 10Hz （1 minutes each） Total amplitude : 1.5 mm Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours. 14. Resistance to Soldering Heat Appearance : No abnormality Capacitance change : ≦±7.5% Specified Value Dissipation ｆactor : Initial value shall be satisfied. Insulation resistance : Initial value shall be satisfied. Dielectric withstanding voltage （between terminals） : No abnormality Heat treatment specified in No.5 of the specification shall be conducted prior to test. Immerse test sample in an solder solution （Sn-3Ag-0.5Cu）. Soldering temperature : 270℃±5℃ Test Methods and Duration : 3±0.5 seconds Remarks Soaking position : Test sample is soaked until the termnal electrode is covered in solder solution. Preheating condition : 3216 size or smaller size：120 to 150℃ for 1 minute, 3225 size：100 to 120℃ for 1 minute, 170 to 200℃ for 1 minute. Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours. 15. Solderability Specified Value More than 95% of terminal electrode shall be covered with fresh solder. Heat treatment specified in No.5 of the specification shall be conducted prior to test. Immerse test sample in an solder solution（Sn-3Ag-0.5Cu）. Test Methods and Soldering temperature : 245℃±5℃ Remarks Duration : 4±1 seconds Dipping position : Test sample is immersed until the terminal electrode is covered in solder solution. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_hra_reli_e-E06R01

16. Thermal shock Appearance : No abnormality Capacitance change : ≦±7.5% Specified Value Dissipation factor : Initial value shall be satisfied. Insulation resistance : Initial value shall be satisfied. Dielectric withstanding voltage （between terminals） : No abnormality Heat treatment specified in No.5 of the specification shall be conducted prior to test. Measurement shall be conducted after test sample is heat treated as specified in No.5. condition of the one cycle （Air－Air） Step Temperature（℃） Time（min.） Transfer time 1 Minimum usage temperature 15 within 20 seconds 2 Maximum usage temperature 15 within 20 seconds Test Methods and Test cycles：100 times. Remarks Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours. Case size Dimension 1608 2012 3216 3225 a 0.6 0.8 2.0 2.0 b 2.2 3.0 4.4 4.4 c 0.9 1.3 1.7 2.6 Fig.2 17. Humidity Loading Appearance : No abnormality Specified Value Capacitance change : ±12.5% Note1 Dissipation factor : 5.0%max. Insulation resistance : Larger than whichever smaller of 25MΩ・μF or 500MΩ Test condition : 85℃/85%RH. Duration : 1000 ＋48/－0 hours. Test Methods and DC bias : Applied rated voltage. Remarks Voltage treatment specified in No.6 of the specification shall be conducted prior to test. Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours. 18. High Temperature Loading Appearance : No abnormality Specified Value Capacitance change : ≦±12.5% Note1 Dissipation factor : 5.0%max. Insulation resistance : Larger than whichever smaller of 25MΩ・μF or 500MΩ Voltage treatment specified in No.6 of the specification shall be conducted prior to test. Test sample shall be put in thermostatic oven with maximum temperature. Test Methods and Applied voltage : Rated voltage x 2 Remarks Duration : 1000 ＋48/－0 hours. Charging and discharging current shall be 50mA or less. Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours. 19. Resistance to Flexure of substrate Appearance : No abnormality Capacitance change : ≦±12.5% Specified Value Dissipation factor : 5.0%max. Insulation resistance : Initial value shall be satisfied. Warp : 1ｍｍ Testing board : Grass epoxy - resin substrate Thickness : 1.6ｍｍ Test board and solder lands : Refer to fig. 3. Case size Test Methods and Dimension 1608 2012 3216 3225 Remarks a 0.6 0.8 2.0 2.0 b 2.2 3.0 4.4 4.4 c 0.9 1.3 1.7 2.6 Fig.4 Fig.3 Measurement shall be made with board in the bent position.（fig.4） ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_hra_reli_e-E06R01

20. High Temperature Exposure Appearance : No abnormality Specified Value Capacitance change : ≦±12.5% Note1 Dissipation factor : 5.0%max. Insulation resistance : Larger than whichever smaller of 500MΩ・μF or 10000MΩ Heat treatment specified in No.5 of the specification shall be conducted prior to test. Test sample shall be put in thermostatic oven with maximum temperature. Test Methods and Duration : 1000 ＋48/－0 hours. Remarks Initial value shall be measured after test sample is heat－treated specified No.5. Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours. 21. Temperature Cycling Appearance : No abnormality Specified Value Capacitance change : ≦±7.5% Note1 Dissipation factor : Initial value shall be satisfied Insulation resistance : Initial value shall be satisfied Heat treatment specified in No.5 of the specification shall be conducted prior to test. Measurement shall be conducted after test sample is heat treated as specified in No.5. condition of the one cycle Step Temperature（℃） Time（min.） 1 Minimum usage temperature 30±3 Test Methods and 2 ＋25 2 to 3 Remarks 3 Maximum usage temperature 30±3 4 ＋25 2 to 3 Test cycles：200 times Solder lands refer to fig. 2. Measurement after the test shall be made after test sample is kept at room temperature for 24 ±2 hours. 22. Body strength Specified Value No mechanical damage Applying force : 10Ｎ Applying time : 10 seconds Test Methods and Remarks Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_hra_reli_e-E06R01

Precautions on the use of High Reliability Application Multilayer Ceramic Capacitors ■PRECAUTIONS 1.Circuit Design ◆Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any capacitors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. ◆Operating Voltage （Verification of Rated voltage） Precautions 1. The operating voltage for capacitors must always be lower than their rated values. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than the rated value of the capacitor chosen. For a circuit where both an AC and a pulse voltage may be present, the sum of their peak voltages should also be lower than the capacitor's rated voltage. 2. Even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high frequency AC voltage or a pulse voltage having rapid rise time is present in the circuit. 2. PCB Design ◆Pattern configurations （Design of Land-patterns） 1. When capacitors are mounted on a PCB, the amount of solder used （size of fillet） can directly affect capacitor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: （1）The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. Precautions （2）When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. ◆Pattern configurations （Capacitor layout on panelized [breakaway] PC boards） 1. After capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.） For this reason, planning pattern configurations and the position of SMD capacitors should be carefully performed to minimize stress. ◆Pattern configurations （Design of Land-patterns） 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts. （larger fillets which extend above the component end terminations） Examples of improper pattern designs are also shown. （1）Recommended land dimensions for a typical chip capacitor land patterns for PCBs Recommended land dimensions for reflow-soldering（unit: mm） Land patterns for PCBs Type 107 212 316 325 Land pattern L 1.6 2.0 3.2 3.2 Chip capacitor Solder-resist Size W 0.8 1.25 1.6 2.5 A 0.8～1.0 0.8～1.2 1.8～2.5 1.8～2.5 C B 0.6～0.8 0.8～1.2 1.0～1.5 1.0～1.5 C 0.6～0.8 0.9～1.6 1.2～2.0 1.8～3.2 B A B Chip capacitor W Technical considerations L Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_hra_prec_e-E07R01

（2）Examples of good and bad solder application Items Not recommended Recommended Lead wire of component Solder-resist Mixed mounting of SMD and leaded components Chassis Solder (for grounding) Solder-resist Component placement close to the chassis Electrode pattern Lead wire of component Soldering iron Hand-soldering of leaded Solder-resist components near mounted components Solder-resist Horizontal component placement ◆Pattern configurations （Capacitor layout on panelized [breakaway] PC boards） 1-1. The following is examples of good and bad capacitor layout; SMD capacitors should be located to minimize any possible mechanical stresses from board warp or deflection. Items Not recommended Recommended Place the product at a right angle to the direction of the Deflection of board anticipated mechanical stress. 1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on capacitor layout. The example below shows recommendations for better design. E D Perforation C A B Slit Magnitude of stress A＞B＝C＞D＞E 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting procedure. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_hra_prec_e-E07R01

3.Soldering ◆Selection of Flux 1. Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; （1）Flux used should be with less than or equal to 0.1 wt% （equivalent to chlorine） of halogenated content. Flux having strong acidity content should not be applied. （2）When soldering capacitors on the board, the amount of flux applied should be controlled at the optimum level. Precautions （3）When using water-soluble flux, special care should be taken to properly clean the boards. ◆Soldering 1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions. Sn-Zn solder paste can affect MLCC reliability performance. Please contact us prior to usage. ◆Selection of Flux 1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. ◆Soldering 1-1. Preheating when soldering Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃. Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. 【Recommended conditions for soldering】 【Recommended conditions for Pd Free soldering】 ［Reflow soldering］ Temperature profile 300 300 Preheating 230℃ Peak Technical Within 10sec. 260℃ Max. considerations ℃） 200 60Msinec. . 6M0sine.c ℃） 200 Within 10sec. mperature（ 100 Slow cooling mperature（ 100 cSoololiwn g Te Te Preheating150℃ Heating above 60sec. Min. 230℃ 40sec. Max. 0 0 ※Ceramic chip components should be preheated to within 100 to 130℃ of the soldering. ※Assured to be reflow soldering for 2 times. Caution ①The ideal condition is to have solder mass （fillet） controlled to 1/2 to 1/3 of the thickness of the capacitor, as shown below: 1/2T～1/3T Capacitor Solder T PC board ②Because excessive dwell times can detrimentally affect solderability, soldering duration should be kept as close to recommended times as possible. ▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . hq_c_mlcc_hra_prec_e-E07R01