Product Order Technical Tools & Support & Folder Now Documents Software Community LM95071 SNIS137G–AUGUST2004–REVISEDAUGUST2019 LM95071 SPI/MICROWIRE 13-Bit Plus Sign Temperature Sensor 1 Features 3 Description • SmallSOT-23packagesavesspace The LM95071 is a low-power, high-resolution digital 1 temperature sensor with an SPI and MICROWIRE • Shutdownmodeconservespowerbetween compatible interface, available in the 5-pin SOT-23. temperaturereadings The host can query the LM95071 at any time to read • Operatesoverafull −40°Cto+150°Crange temperature. Its low operating current is useful in • SPIandMICROWIREbusinterface systemswherelowpowerconsumptioniscritical. • Keyspecifications: The LM95071 has 13-bit plus sign temperature resolution (0.03125°C per LSB) while operating over – Supplyvoltage:2.4Vto5.5V atemperaturerangeof−40°Cto+150°C. – Supplycurrent: The 2.4-V to 5.5-V supply voltage range, fast – Operating:280 µA(typical) conversion rate, low supply current, and simple SPI – Shutdown:6 µA(typical) interface of the LM95071 make it ideal for a wide – Temperatureaccuracy: rangeofapplications. – 0°Cto70°C±1°C(maximum) DeviceInformation(1) – −40°Cto150°C±2°C(maximum) PARTNUMBER PACKAGE BODYSIZE(NOM) – Temperatureresolution:0.03125°C LM95071 SOT-23(5) 2.90mm×1.60mm 2 Applications (1) For all available packages, see the orderable addendum at theendofthedatasheet. • Systemthermalmanagement • Portableelectronicdevices • Personalcomputers • Diskdrives • Officeelectronics • Electronictestequipment TemperatureMonitorApplication +3.3V SimpleLink LM95071 MSP432P4 0.1 µF GPIO CS VDD UCxSOMI (GPIO) SI/O 10k UCxSIMO SC GND UCxCLK 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

LM95071 SNIS137G–AUGUST2004–REVISEDAUGUST2019 www.ti.com Table of Contents 1 Features.................................................................. 1 7 ParameterMeasurementInformation..................8 2 Applications........................................................... 1 8 DetailedDescription.............................................. 9 3 Description............................................................. 1 8.1 Overview...................................................................9 4 RevisionHistory..................................................... 2 8.2 FunctionalBlockDiagram.........................................9 5 PinConfigurationandFunctions......................... 3 8.3 FeatureDescription...................................................9 8.4 DeviceFunctionalModes........................................10 6 Specifications......................................................... 3 8.5 Programming..........................................................10 6.1 AbsoluteMaximumRatings .....................................3 8.6 RegisterMaps.........................................................12 6.2 ESDRatings..............................................................3 9 DeviceandDocumentationSupport.................. 14 6.3 RecommendedOperatingRatings............................4 6.4 ThermalInformation..................................................4 9.1 ReceivingNotificationofDocumentationUpdates..14 6.5 Temperature-to-DigitalConverterCharacteristics.....4 9.2 CommunityResource..............................................14 6.6 LogicElectricalCharacteristics-DigitalDC 9.3 Trademarks.............................................................14 Characteristics...........................................................4 9.4 ElectrostaticDischargeCaution..............................14 6.7 LogicElectricalCharacteristics-SerialBusDigital 9.5 Glossary..................................................................14 SwitchingCharacteristics...........................................5 10 Mechanical,Packaging,andOrderable 6.8 TimingDiagrams.......................................................5 Information........................................................... 14 6.9 TypicalCharacteristics..............................................7 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionF(May2019)toRevisionG Page • ChangedTemperatureMonitorApplicationgraphic............................................................................................................... 1 ChangesfromRevisionE(December2018)toRevisionF Page • AddedtheTYPEcolumntothePinFunctionstable ............................................................................................................. 3 • ChangedV forCDMfrom±200Vto±250V .................................................................................................................. 3 (ESD) ChangesfromRevisionD(September2013)toRevisionE Page • UpdateddatasheetlayouttothelatestSDSformat ............................................................................................................. 1 • Movedtheautomotivedevicetoastandalonedatasheet(SNIS207) .................................................................................. 1 • AddedDeviceInformationtable,ESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,Device andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection............................... 1 • Changedkeygraphicsonthefirstpage ................................................................................................................................ 1 • ReplacedtheThermalCharacteristicstablewiththeThermalInformationtableandaddednewthermalresistance values .................................................................................................................................................................................... 4 • ChangedTemperature-to-DigitalConverterCharacteristicstablenotetoclarifyconversioninterval..................................... 4 2 SubmitDocumentationFeedback Copyright©2004–2019,TexasInstrumentsIncorporated ProductFolderLinks:LM95071

LM95071 www.ti.com SNIS137G–AUGUST2004–REVISEDAUGUST2019 5 Pin Configuration and Functions DBVPackage 5-PinSOT-23 TopView 1 5 CS VDD LM95071/ 2 GND LM95071-Q1 3 4 SI/O SC PinFunction PIN TYPE DESCRIPTION NO. NAME 1 CS Input ChipSelectinput.Thispinreceivesanactive-lowsignalfromthecontrollertoselectthedevice. 2 GND Ground Ground.Thisisthepowerandsignalgroundreturn. SerialInput/Output.Thisserial,bidirectional,databuspintransmitsandreceivessignalstoand 3 SI/O Input/Output fromthecontroller.Schmitttriggerinputintheinputmode. 4 SC Input Serialbusclock.Thisserialclocksignalcomesfromthecontroller.Schmitttriggerinput. PositiveSupplyVoltage.SupplyaDCvoltagefrom2.4Vto5.5Vtothispinandbypasswitha 5 V Supply DD 0.1-µFceramiccapacitortoground. 6 Specifications 6.1 Absolute Maximum Ratings (1)(2)(3) MIN MAX UNIT Supplyvoltage −0.3 6 V Voltageatanypin −0.3 V +0.3 V DD Inputcurrentatanypin (4) 5 mA Storagetemperature,T −65 150 °C stg (1) AbsoluteMaximumRatingsindicatelimitsbeyondwhichdamagetothedevicemayoccur.DCandACelectricalspecificationsdonot applywhenoperatingthedevicebeyonditsratedoperatingconditions. (2) SolderingprocessmustcomplywithReflowTemperatureProfilespecifications. Refertohttp://www.ti.com/packaging. (3) Reflowtemperatureprofilesaredifferentforlead-freeandnon-lead-freepackages. (4) Whentheinputvoltage(V)atanypinexceedsthepowersupplies(V <GNDorV >V )thecurrentatthatpinshouldbelimitedto I I I DD 5mA. 6.2 ESD Ratings VALUE UNIT Electrostatic Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1)(2) ±2000 V V (ESD) discharge Charged-devicemodel(CDM),perJEDECspecificationJESD22-C101(3) ±250 (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. (2) Humanbodymodel,100pFdischargedthrougha1.5kΩresistor.Machinemodel,200pFdischargeddirectlyintoeachpin. (3) JEDECdocumentJEP157statesthat250-VCDMallowssafemanufacturingwithastandardESDcontrolprocess. Copyright©2004–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM95071

LM95071 SNIS137G–AUGUST2004–REVISEDAUGUST2019 www.ti.com 6.3 Recommended Operating Ratings MIN MAX UNIT Specifiedtemperature(1),T toT −40 150 °C MIN MAX Supplyvoltage(V ) 2.4 5.5 V DD (1) ThelifeexpectancyoftheoftheLM95071willbereducedwhenoperatingatelevatedtemperatures.oftheLM95071θ (thermal JA resistance,junction-to-ambient)whenattachedtoaprinted-circuitboardwith2-oz.foilissummarizedinthetablebelow. 6.4 Thermal Information LM95071 THERMALMETRIC(1) DBV(SOT-23) UNIT 5PINS R Junction-to-ambientthermalresistance 167.2 °C/W θJA R Junction-to-case(top)thermalresistance 118.8 °C/W θJC(top) R Junction-to-boardthermalresistance 30.7 °C/W θJB ψ Junction-to-topcharacterizationparameter 14.4 °C/W JT ψ Junction-to-boardcharacterizationparameter 30.1 °C/W JB R Junction-to-case(bottom)thermalresistance n/a °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report. 6.5 Temperature-to-Digital Converter Characteristics Unlessotherwisenoted,thesespecificationsapplyforV =3.3V.AlllimitsT =T =+25°C,unlessotherwisenoted. DD A J PARAMETER TESTCONDITIONS MIN(1) TYP(2) MAX(1) UNIT V =3.0Vto3.6V;T =0°Cto+70°C,T =T =T toT ±1.0 °C Temperatureerror(3) DD A A J MIN MAX V =3.0Vto3.6V;T =−40°Cto+150°C,T =T =T toT ±2.0 °C DD A A J MIN MAX V =3.6Vto5.5V;T =0°Cto+70°C +0.3 DD A Lineregulation °C/V V =3.0Vto2.4V;T =0°Cto+70°C -0.6 DD A 14 Bits Resolution 0.03125 °C Temperature See (4) TA=TJ=+25°C 130 ms conversiontime T =T =T toT 228 A J MIN MAX T =T =+25°C 280 A J Operating,serialbusinactive µA T =T =T toT 520 A J MIN MAX Quiescentcurrent T =T =+25°C 6 A J Shutdown µA T =T =T toT 28 A J MIN MAX (1) LimitsareguaranteedtoTI'sAOQL(AverageOutgoingQualityLevel). (2) TypicalsareatT =25°Candrepresentmostlikelyparametricnorm. A (3) TheoftheLM95071willoperateproperlyovertheV supplyvoltagerangeof2.4Vto5.5V. DD (4) Followingapoweronreset,theusermustallowatleast228msbeforemakingthefirstreadtransactiontoensureafirstvalid temperatureread.Afterthefirstread,inordertoensureanaccuratetemperatureresult,thetimeintervalbetweenanytwoconsecutive temperaturereadsmustbegreaterthanthemaximumconversiontimeof228ms. 6.6 Logic Electrical Characteristics - Digital DC Characteristics Unlessotherwisenoted,thesespecificationsapplyforV =2.4Vto5.5V(1). DD PARAMETER TESTCONDITIONS MIN(2) TYP(3) MAX(2) UNIT Logical“1”Input V T =T =T toT 0.7×V V +0.3 V IN(1) Voltage A J MIN MAX DD DD Logical“0”Input V T =T =T toT −0.3 0.3×V V IN(0) Voltage A J MIN MAX DD (1) TheoftheLM95071willoperateproperlyovertheV supplyvoltagerangeof2.4Vto5.5V. DD (2) LimitsareguaranteedtoTI'sAOQL(AverageOutgoingQualityLevel). (3) TypicalsareatT =25°Candrepresentmostlikelyparametricnorm. A 4 SubmitDocumentationFeedback Copyright©2004–2019,TexasInstrumentsIncorporated ProductFolderLinks:LM95071

LM95071 www.ti.com SNIS137G–AUGUST2004–REVISEDAUGUST2019 Logic Electrical Characteristics - Digital DC Characteristics (continued) Unlessotherwisenoted,thesespecificationsapplyforV =2.4Vto5.5V(1). DD PARAMETER TESTCONDITIONS MIN(2) TYP(3) MAX(2) UNIT InputHysteresis TA=TJ=+25°C 0.4 V =3Vto3.6V V Voltage DD T =T =T toT 0.33 A J MIN MAX Logical“1”Input TA=TJ=+25°C 0.005 I V =V µA IN(1) Current IN DD T =T =T toT 3 A J MIN MAX Logical“0”Input TA=TJ=+25°C −0.005 I V =0V µA IN(0) Current IN T =T =T toT −3 A J MIN MAX C AllDigitalInputs T =T =+25°C 20 pF IN A J HighLevel V I =−400µA,T =T =T toT 2.25 V OH OutputVoltage OH A J MIN MAX LowLevel V I =+1.6mA,T =T =T toT 0.4 V OL OutputVoltage OL A J MIN MAX TRI-STATE IO_TRI- ®Output VO=GND −1 +1 µA V =V ,T =T =T toT STATE LeakageCurrent O DD A J MIN MAX 6.7 Logic Electrical Characteristics - Serial Bus Digital Switching Characteristics Unlessotherwisenoted,thesespecificationsapplyforV =2.4Vto5.5V(1);C (loadcapacitance)onoutputlines=100pF DD L unlessotherwisespecified. MIN(2) TYP(3) MAX(2) UNIT T =T =T toT 0.16 A J MIN MAX t SC(Clock)Period µs 1 T =T =+25°C DC A J t CSLowtoSC(Clock)HighSet-UpTime T =T =T toT 100 ns 2 A J MIN MAX t CSLowtoDataOut(SO)Delay T =T =T toT 70 ns 3 A J MIN MAX t SC(Clock)LowtoDataOut(SO)Delay T =T =T toT 70 ns 4 A J MIN MAX t CSHightoDataOut(SO)TRI-STATE T =T =T toT 200 ns 5 A J MIN MAX t SC(Clock)HightoDataIn(SI)HoldTime T =T =T toT 50 ns 6 A J MIN MAX DataIn(SI)Set-UpTimetoSC(Clock) T =T =T toT t A J MIN MAX 30 ns 7 High t SC(Clock)HightoCSHighHoldTime T =T =T toT 50 ns 8 A J MIN MAX (1) TheoftheLM95071willoperateproperlyovertheV supplyvoltagerangeof2.4Vto5.5V. DD (2) LimitsareguaranteedtoTI'sAOQL(AverageOutgoingQualityLevel). (3) TypicalsareatT =25°Candrepresentmostlikelyparametricnorm. A 6.8 Timing Diagrams SC t2 t4 t1 t4 tr tf CS t3 SO Figure1. DataOutputTimingDiagram Copyright©2004–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM95071

LM95071 SNIS137G–AUGUST2004–REVISEDAUGUST2019 www.ti.com Timing Diagrams (continued) SC SC CS CS t5 t5 SO SO Figure2. TRI-STATEDataOutputTimingDiagram SC SC t7 t7 t8 t8 t6 t6 CS CS SI SI Figure3. DataInputTimingDiagram 6 SubmitDocumentationFeedback Copyright©2004–2019,TexasInstrumentsIncorporated ProductFolderLinks:LM95071

LM95071 www.ti.com SNIS137G–AUGUST2004–REVISEDAUGUST2019 6.9 Typical Characteristics Figure4.StaticSupplyCurrentvs.Temperature Figure5.MaximumTemperatureError Figure6.ConversionTimevsTemperature Figure7.TypicalOutputNoiseat30°C Copyright©2004–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM95071

LM95071 SNIS137G–AUGUST2004–REVISEDAUGUST2019 www.ti.com 7 Parameter Measurement Information 01,0010,1100,0000 Output Code +25°C +0.03125°C 00,0011,0010,0000 00,0000,0000,0001 Temperature 00,0000,0000,0000 0°C -40°C +150°C 11,1111,1111,1111 11,1100,1110,0000 -0.03125°C -25°C 11,1011,0000,0000 Figure8. Temperature-to-DigitalTransferFunction(Non-LinearScaleforClarity) +3.3V IOL = 1.6 mA To LM95071/ LM95071-Q1 1.4V SI/O Pin 80 pF IOH = -1.6 mA Figure9. TRI-STATETestCircuit 8 SubmitDocumentationFeedback Copyright©2004–2019,TexasInstrumentsIncorporated ProductFolderLinks:LM95071

LM95071 www.ti.com SNIS137G–AUGUST2004–REVISEDAUGUST2019 8 Detailed Description 8.1 Overview The LM95071 temperature sensor incorporates a temperature sensor and 13-bit-plus-sign ΔΣ ADC (Delta-Sigma Analog-to-Digital Converter). Compatibility of the LM95071's three-wire serial interface with SPI and MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can be used to optimize current drain for different applications. A Manufacturer/Device ID register identifies the LM95071asaTexasInstrumentsproduct. 8.2 Functional Block Diagram VDD LM95071/ LM95071-Q1 Temperature 14-Bit Sensor Delta-Sigma Circuitry A/D Converter Control Manufacturer's Temperature Logic ID Register Register Three-Wire SI/O CS Serial Interface SC 8.3 Feature Description 8.3.1 PowerUpandPowerDown The LM95071 always powers up in a known state and in the continuous conversion mode. Immediately after powerup,theLM95071willoutputanerroneouscodeuntilthefirsttemperatureconversionhascompleted. When the supply voltage is less than about 1.6V (typical), the LM95071 is considered powered down. As the supply voltage rises above the nominal 1.6-V power up threshold, the internal registers are reset to the power up defaultstatedescribedabove. 8.3.2 TemperatureDataFormat Temperature data is represented by a 14-bit, two's complement word with an LSB (Least Significant Bit) equal to 0.03125°C: Table1.DigitalOutputforTemperatureData DigitalOutput Temperature Binary Hex +150°C 0100101100000011 4B03 +125°C 0011111010000011 3E83 +25°C 0000110010000011 0C83 +0.03125°C 0000000000000111 0007 0°C 0000000000000011 0003 Copyright©2004–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM95071

LM95071 SNIS137G–AUGUST2004–REVISEDAUGUST2019 www.ti.com Table1.DigitalOutputforTemperature Data(continued) DigitalOutput Temperature Binary Hex −0.03125°C 1111111111111111 FFFF −25°C 1111001110000011 F383 −40°C 1110110000000011 EC03 The first data byte is the most significant byte with most significant bit first, permitting only as much data as necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature data indicate an overtemperature condition, the host processor could immediately take action to remedy the excessivetemperatures. 8.3.3 TightAccuracy,FineResolutionandLowNoise The LM95071 is well suited for applications that require tight temperature measurement accuracy. In many applications, from process control to HVAC, the low temperature error can mean better system performance and, byeliminatingasystemcalibrationstep,lowerproductioncost. With fine digital resolution, the LM95071 senses and reports very small changes in its temperature, making it ideal for applications where temperature sensitivity is important. For example, the LM95071 enables the system toquicklyidentifythedirectionoftemperaturechange,allowingtheprocessorto take compensating action before thesystemreachesacriticaltemperature. The LM95071 has very low output noise (see Figure 7 in the Typical Characteristics section), which makes it ideal for applications where stable thermal compensation is a priority. For example, in a temperature- compensated oscillator application, the very small deviation in successive temperature readings translates to a stablefrequencyoutputfromtheoscillator. 8.4 Device Functional Modes 8.4.1 ShutdownMode/ManufacturerID The master controller may enable the shutdown mode for the purpose of reducing power consumption or for reading the Manufacturer/Device ID information. The shutdown mode is enabled by writing XX FF hex to the LM95071 as shown in Figure 13c. The serial bus is still active when the LM95071 is in shutdown. When in shutdown mode the LM95071 always will output 1000 0000 0000 1111. This is the Manufacturer/Device ID information.Thefirst5-bitsofthefield(10000XXX)arereservedforthemanufacturerID. 8.5 Programming 8.5.1 SerialBusInterface TheLM95071operatesasaslaveandiscompatiblewithSPIorMICROWIREbusspecifications.Dataisclocked out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete communication is framed by falling and rising chip select (CS) signal. The CS signal should be held high for at least one clock cycle (160 ns minimum) between communications. The transmit-only communication (register read) consists of 16 clock cycles. A complete transmit/receive communication will consist of 32 serial clocks (see Serial Bus Timing Diagrams). The first 16 clocks comprise the transmit phase of communication, while the second16clocksarethereceivephase. When CS is high SI/O will be in TRI-STATE. Communication should be initiated by taking chip select (CS) low. This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O) will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of the data will be clocked out by the falling edge of SC. CS can be taken high at any time during the transmit phase. If CS is brought low in the middle of a conversion the LM95071 will complete the conversion and the outputshiftregisterwillbeupdatedafter CSisbroughtbackhigh. 10 SubmitDocumentationFeedback Copyright©2004–2019,TexasInstrumentsIncorporated ProductFolderLinks:LM95071

LM95071 www.ti.com SNIS137G–AUGUST2004–REVISEDAUGUST2019 Programming (continued) The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The LM95071/LM95071-Q1 will read the data available on the SI/O line on the rising edge of the serial clock. Input data is to an 8-bit shift register. The part will detect the last eight bits shifted into the register. The receive phase can last up to 16 SC periods. All ones must be shifted in order to place the part into shutdown. All zeros must be shifted in order to place the LM95071 into continuous conversion mode. Only the following codes should be transmittedtothe LM95071: • 00hexforcontinuousconversion • FFhexforshutdown Another code may place the part into a test mode. Test modes are used by Texas Instruments to thoroughly test the function of the LM95071 during production testing. Only eight bits have been defined above since only the lasteighttransmittedaredetectedbythe LM95071,beforeCSistakenHIGH. ThefollowingcommunicationcanbeusedtodeterminetheManufacturer's/DeviceID and then immediately place thepartintocontinuousconversionmode.With CScontinuouslylow: • Read16bitsoftemperaturedata • Write16bitsofdatacommandingshutdown • Read16bitsofManufacture's/DeviceIDdata • Write8to16bitsofdatacommandingConversionMode • TakeCSHIGH. Note that 228 ms (max) will have to pass for a conversion to complete before the LM95071 actually transmits temperaturedata. 8.5.2 SerialBusTimingDiagrams 1 8 SC CS SO D15 D14 D8 Figure10. ReadingContinuousConversion-SingleEight-BitFrame 1 8 1 8 SC CS SO D15 D14 D7 D2 TRI-STATE Figure11. ReadingContinuousConversion-TwoEight-BitFrames Copyright©2004–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM95071

LM95071 SNIS137G–AUGUST2004–REVISEDAUGUST2019 www.ti.com Programming (continued) 1 8 1 8 1 8 1 8 SC CS SI/O D15 D14 D7 D2 D15 D14 D8 D7 D6 D0 Data from the LM95071/ TRI- Data from the Controller LM95071-Q1 STATE Figure12. WritingShutdownMode 1 8 1 8 1 8 1 8 SC CS SI/O D15 D14 D7 D2 D15 D14 D8 D7 D6 D0 Data from the LM95071/ TRI- Data from the Controller LM95071-Q1 STATE Figure13. WritingConversionMode 8.6 Register Maps 8.6.1 InternalRegisterStructure The LM95071 has three registers: the temperature register, the configuration register and the Manufacturer/Device identification register. The temperature and Manufacturer/Device identification registers are readonly.Theconfigurationregisteriswriteonly. 8.6.1.1 ConfigurationRegister (Selectsshutdownorcontinuousconversionmodes): Table2.(WriteOnly): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X X X X X X Shutdown D0–D15settoXXFFhexenablesshutdownmode. D0–D15settoXX00hexsetscontinuous-conversionmode. Note: setting D0-D15 to any other values may place the LM95071 into a manufacturer's test mode, upon which the LM95071 will stop responding as described. These test modes are to be used for Texas Instruments productiontestingonly.SeeSerialBusInterface foracompletediscussion. 8.6.1.2 TemperatureRegister Table3.(ReadOnly): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 MSB Bit12 Bit11 Bit10 Bit9 Bit8 Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 LSB 1 1 12 SubmitDocumentationFeedback Copyright©2004–2019,TexasInstrumentsIncorporated ProductFolderLinks:LM95071

LM95071 www.ti.com SNIS137G–AUGUST2004–REVISEDAUGUST2019 D0–D1:Logic1willbeoutputonSI/0. D2–D15:TemperatureData.OneLSB=0.03125°C.Two'scomplementformat. 8.6.1.3 Manufacturer/DeviceIDRegister Table4.(ReadOnly): D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 1 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 D0–D1:Logic1willbeoutputonSI/0. D2–D15:Manufacturer/DeviceIDData.Thisregisterisaccessedwheneverthe LM95071isinshutdownmode. Copyright©2004–2019,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM95071

LM95071 SNIS137G–AUGUST2004–REVISEDAUGUST2019 www.ti.com 9 Device and Documentation Support 9.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 9.2 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 9.3 Trademarks E2EisatrademarkofTexasInstruments. TRI-STATEisaregisteredtrademarkofNationalSemiconductorCorporation. Allothertrademarksarethepropertyoftheirrespectiveowners. 9.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 9.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 10 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 14 SubmitDocumentationFeedback Copyright©2004–2019,TexasInstrumentsIncorporated ProductFolderLinks:LM95071

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM95071CIMF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 150 T18C LM95071CIMF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 150 T18C & no Sb/Br) LM95071CIMFX NRND SOT-23 DBV 5 3000 TBD Call TI Call TI -40 to 150 T18C LM95071CIMFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS SN Level-1-260C-UNLIM -40 to 150 T18C & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM95071 : •Automotive: LM95071-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM95071CIMF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM95071CIMF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM95071CIMFX SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM95071CIMFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM95071CIMF SOT-23 DBV 5 1000 210.0 185.0 35.0 LM95071CIMF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM95071CIMFX SOT-23 DBV 5 3000 210.0 185.0 35.0 LM95071CIMFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

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