Product Order Technical Tools & Support & Folder Now Documents Software Community LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 LM60 2.7-V, SOT-23 or TO-92 Temperature Sensor 1 Features 3 Description • CalibratedLinearScaleFactorof6.25mV/°C The LM60 device is a precision integrated-circuit 1 temperature sensor that can sense a −40°C to • RatedforFull−40°Cto+125°CRange +125°C temperature range while operating from a • SuitableforRemoteApplications single 2.7-V supply. The output voltage of the device • AvailableinSOT-23andTO-92Packages is linearly proportional to Celsius (Centigrade) temperature (6.25 mV/°C) and has a DC offset of • KeySpecifications 424 mV. The offset allows reading negative – Accuracyat25°C: ±2°Cand±3°C(Maximum) temperatures without the need for a negative supply. – Accuracyfor −40°Cto+125°C: ±4°C The nominal output voltage of the device ranges from (Maximum) 174 mV to 1205 mV for a −40°C to +125°C temperature range. The device is calibrated to – Accuracyfor −25°Cto+125°C: ±3°C provide accuracies of ±2°C at room temperature and (Maximum) ±3°C over the full −25°C to +125°C temperature – TemperatureSlope:6.25mV/°C range. – Power-SupplyVoltageRange:2.7Vto10V The linear output of the device, 424-mV offset, and – CurrentDrainat25°C:110 μA(Maximum) factory calibration simplify external circuitry required – Nonlinearity: ±0.8°C(Maximum) in a single supply environment where reading negative temperatures is required. Because the – OutputImpedance:800 Ω(Maximum) quiescent current of the device is less than 110 μA, self-heating is limited to a very low 0.1°C in still air in 2 Applications the SOT-23 package. Shutdown capability for the • CellPhonesandComputers device is intrinsic because its inherent low power consumption allows it to be powered directly from the • PowerSupplyModules outputofmanylogicgates. • BatteryManagement • FaxMachinesandPrinters DeviceInformation(1) • HVACandDiskDrives PARTNUMBER PACKAGE BODYSIZE(NOM) • Appliances TO-92(3) 4.30mm×4.30mm LM60 SOT-23(3) 2.92mm×1.30mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. SimplifiedSchematic Full-RangeCentigradeTemperatureSensor (−40°Cto+125°C) 1.50 1 . 2 0 5 1.25 e (V) 1.00 g olta 0.75 0 . 5 8 0 V ut p Out 0.50 0 . 1 7 4 0.25 V = (+6.25 mV/°C × T °C) + 424 mV O 0.00 –50 –25 0 25 50 75 100 125 150 DUT Temperature ((cid:131)C) C001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 www.ti.com Table of Contents 1 Features.................................................................. 1 8.4 DeviceFunctionalModes..........................................9 2 Applications........................................................... 1 9 ApplicationandImplementation........................ 10 3 Description............................................................. 1 9.1 ApplicationInformation............................................10 4 RevisionHistory..................................................... 2 9.2 TypicalApplications................................................11 9.3 SystemExamples...................................................13 5 DeviceComparisonTable..................................... 3 10 PowerSupplyRecommendations..................... 13 6 PinConfigurationandFunctions......................... 4 11 Layout................................................................... 14 7 Specifications......................................................... 4 11.1 LayoutGuidelines.................................................14 7.1 AbsoluteMaximumRatings......................................4 11.2 LayoutExample....................................................14 7.2 ESDRatings ............................................................4 11.3 ThermalConsiderations........................................14 7.3 RecommendedOperatingConditions.......................5 12 DeviceandDocumentationSupport................. 16 7.4 ThermalInformation..................................................5 7.5 ElectricalCharacteristics...........................................5 12.1 ReceivingNotificationofDocumentationUpdates16 7.6 TypicalCharacteristics..............................................7 12.2 CommunityResources..........................................16 12.3 Trademarks...........................................................16 8 DetailedDescription.............................................. 9 12.4 ElectrostaticDischargeCaution............................16 8.1 Overview...................................................................9 12.5 Glossary................................................................16 8.2 FunctionalBlockDiagram.........................................9 13 Mechanical,Packaging,andOrderable 8.3 FeatureDescription...................................................9 Information........................................................... 16 4 Revision History ChangesfromRevisionE(September2015)toRevisionF Page • Movedtheautomotivedevicetoastandalonedatasheet(SNIS197)................................................................................... 1 • AddedtablenotefortheLM60B.............................................................................................................................................. 3 • AddedtablenotefortheLM60B.............................................................................................................................................. 5 ChangesfromRevisionD(November2012)toRevisionE Page • AddedPinConfigurationandFunctionssection,ESDRatingstable,FeatureDescriptionsection,DeviceFunctional Modes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection .............................. 1 2 SubmitDocumentationFeedback Copyright©2004–2017,TexasInstrumentsIncorporated ProductFolderLinks:LM60

LM60 www.ti.com SNIS119F–MAY2004–REVISEDAUGUST2017 5 Device Comparison Table ORDERNUMBER ACCURACYOVERSPECIFIED SPECIFIEDTEMPERATURERANGE TEMPERATURERANGE LM60BIM3 ±3 –25°C≤T ≤+125°C(1) A LM60BIM3X LM60CIM3 ±4 –40°C≤T ≤+125°C A LM60CIM3X LM60QIM3 ±4 –40°C≤T ≤+125°C A LM60QIM3X LM60BIZ ±3 –25°C≤T ≤+125°C A LM60CIZ ±4 –40°C≤T ≤+125°C A (1) LM60Bwilloperatedownto–40°Cwithoutdamagebuttheaccuracyisonlyensuredfrom–25°Cto125°C. Copyright©2004–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM60

LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 www.ti.com 6 Pin Configuration and Functions DBZPackage 3-PinSOT-23 LPPackage TopView 3-PinTO-92 BottomView PinFunctions PIN TYPE DESCRIPTION NAME SOT-23 TO92 GND 3 3 GND Deviceground,connectedtopowersupplynegativeterminal V 2 2 O Temperaturesensoranalogoutput OUT +V 1 1 POWER Positivepowersupplypin S 7 Specifications 7.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT Supplyvoltage −0.2 12 V Outputvoltage −0.6 V +0.6 V S Outputcurrent 10 mA Inputcurrentatanypin(2) 5 mA Maximumjunctiontemperature(T ) 125 °C JMAX Storagetemperature(T ) −65 150 °C stg (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) Whentheinputvoltage(V)atanypinexceedspowersupplies(V <GNDorV >+V ),thecurrentatthatpinshouldbelimitedto5mA. I I I S 7.2 ESD Ratings VALUE UNIT LM60inDBZPackage Human-bodymodel(HBM) ±2500 V Electrostaticdischarge(1) V (ESD) Machinemodel(MM) ±250 LM60inLPPackage Human-bodymodel(HBM) ±2500 V Electrostaticdischarge(1) V (ESD) Machinemodel(MM) ±200 (1) Thehumanbodymodelisa100-pFcapacitordischargedthrougha1.5-kΩresistorintoeachpin.Themachinemodelisa200-pF capacitordischargeddirectlyintoeachpin. 4 SubmitDocumentationFeedback Copyright©2004–2017,TexasInstrumentsIncorporated ProductFolderLinks:LM60

LM60 www.ti.com SNIS119F–MAY2004–REVISEDAUGUST2017 7.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1) MIN MAX UNIT LM60B(T ≤T ≤T ) –25(2) 125 °C MIN A MAX LM60C(T ≤T ≤T ) –40 125 °C MIN A MAX Supplyvoltage(+V ) 2.7 10 V S (1) SolderingprocessmustcomplywithNationalSemiconductor'sReflowTemperatureProfilespecifications.Referto www.national.com/packaging.Reflowtemperatureprofilesaredifferentforlead-freeandnon-lead-freepackages. (2) LM60Bwilloperatedownto–40°Cwithoutdamagebuttheaccuracyisonlyensuredfrom–25°Cto125°C. 7.4 Thermal Information LM60 THERMALMETRIC(1) DBZ(SOT-23) LP(TO-92) UNIT 3PINS 3PINS R (2) Junction-to-ambientthermalresistance 266 162 °C/W θJA R Junction-to-case(top)thermalresistance 135 85 °C/W θJC(top) R Junction-to-boardthermalresistance 59 — °C/W θJB ψ Junction-to-topcharacterizationparameter 18 29 °C/W JT ψ Junction-to-boardcharacterizationparameter 58 142 °C/W JB (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductororICPackageThermalMetricsapplication report. (2) Thejunctiontoambientthermalresistance(R )isspecifiedwithoutaheatsinkinstillair. θJA 7.5 Electrical Characteristics Unlessotherwisenoted,thesespecificationsapplyfor+V =3V andI =1μA.AlllimitsT =T =25°Cunless S DC LOAD A J otherwisenoted. PARAMETER TESTCONDITIONS MIN(1) TYP(2) MAX(1) UNIT –2 2 LM60B T =T =T °C A J MIN –3 3 toT Accuracy(3) MAX –3 3 LM60C T =T =T °C A J MIN –4 4 toT MAX Outputvoltageat0°C 424 mV T =T =T LM60B A J MIN –0.6 ±0.6 toT Nonlinearity(4) MAX °C T =T =T LM60C A J MIN –0.8 ±0.8 toT MAX 6.25 T =T =T LM60B A J MIN 6.06 6.44 Sensorgain(averageslope) toT mV/°C MAX T =T =T LM60C A J MIN 6 6.5 toT MAX Outputimpedance T =T =T toT 800 Ω A J MIN MAX (1) LimitsarespecifiedtoTI'sAOQL(AverageOutgoingQualityLevel). (2) TypicalsareatT =T =25°Candrepresentmostlikelyparametricnorm. J A (3) Accuracyisdefinedastheerrorbetweentheoutputvoltageand6.25mV/°Ctimesthecasetemperatureofthedeviceplus424mV,at specifiedconditionsofvoltage,current,andtemperature(expressedin°C). (4) Nonlinearityisdefinedasthedeviationoftheoutput-voltage-versus-temperaturecurvefromthebest-fitstraightline,overtherated temperaturerangeofthedevice. Copyright©2004–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM60

LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 www.ti.com Electrical Characteristics (continued) Unlessotherwisenoted,thesespecificationsapplyfor+V =3V andI =1μA.AlllimitsT =T =25°Cunless S DC LOAD A J otherwisenoted. PARAMETER TESTCONDITIONS MIN(1) TYP(2) MAX(1) UNIT T =T =T 3V≤+V ≤10V A J MIN –0.3 0.3 mV/V S toT Lineregulation(5) MAX T =T =T 2.7V≤+V ≤3.3V A J MIN –2.3 2.3 mV S toT MAX 82 110 μA Quiescentcurrent 2.7V≤+VS≤10V TA=TJ=TMIN 125 μA toT MAX Changeofquiescentcurrent 2.7V≤+V ≤10V ±5 μA S Temperaturecoefficientof 0.2 μA/°C quiescentcurrent T =T =125°C Long-termstability(6) J MAX ±0.2 °C for1000hours (5) Regulationismeasuredatconstantjunctiontemperature,usingpulsetestingwithalowdutycycle.Changesinoutputduetoheating effectscanbecomputedbymultiplyingtheinternaldissipationbythethermalresistance. (6) Forbestlong-termstability,anyprecisioncircuitwillgivebestresultsiftheunitisagedatawarmtemperature,temperaturecycledforat least46hoursbeforelong-termlifetestbeginsforbothtemperatures.Thisisespeciallytruewhenasmall(surface-mount)partiswave- soldered;allowtimeforstressrelaxationtooccur.Themajorityofthedriftwilloccurinthefirst1000hoursatelevatedtemperatures. Thedriftafter1000hourswillnotcontinueatthefirst1000hourrate. 6 SubmitDocumentationFeedback Copyright©2004–2017,TexasInstrumentsIncorporated ProductFolderLinks:LM60

LM60 www.ti.com SNIS119F–MAY2004–REVISEDAUGUST2017 7.6 Typical Characteristics Togeneratethesecurves,thedevicewasmountedtoaprinted-circuitboardasshowninFigure20. Figure1.ThermalResistanceJunctiontoAir Figure2.ThermalTimeConstant Figure3.ThermalResponseinStillAirWithHeatSink Figure4.ThermalResponseinStirredOilBathWithHeat Sink 0 Figure5.ThermalResponseinStillAirWithoutaHeatSink Figure6.Start-UpVoltagevsTemperature Copyright©2004–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM60

LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 www.ti.com Typical Characteristics (continued) Togeneratethesecurves,thedevicewasmountedtoaprinted-circuitboardasshowninFigure20. Figure7.QuiescentCurrentvsTemperature Figure8.AccuracyvsTemperature Figure9.NoiseVoltage Figure10.SupplyVoltagevsSupplyCurrent SVA-1268122 Figure11.Start-UpResponse 8 SubmitDocumentationFeedback Copyright©2004–2017,TexasInstrumentsIncorporated ProductFolderLinks:LM60

LM60 www.ti.com SNIS119F–MAY2004–REVISEDAUGUST2017 8 Detailed Description 8.1 Overview TheLM60 devices are precision analog bipolar temperature sensors that can sense a −40°C to +125°C temperature range while operating from a single 2.7-V supply. The output voltage of the LM60 is linearly proportional to Celsius (Centigrade) temperature (6.25 mV/°C) and has a DC offset of 424 mV. The offset allows reading negative temperatures with a single positive supply. The nominal output voltage of the device ranges from 174 mV to 1205 mV for a −40°C to +125°C temperature range. The device is calibrated to provide accuraciesof±2.0°Catroomtemperatureand±3°Coverthefull−25°Cto+125°Ctemperaturerange. With a quiescent current of the device is less than 110 μA, self-heating is limited to a very low 0.1°C in still air in the SOT-23 package. Shutdown capability for the device is intrinsic because its inherent low power consumption allowsittobepowereddirectlyfromtheoutputofmanylogicgates. The output of the LM60 is a Class A base emitter follower, thus the LM60 can source quite a bit of current while sinking less than 1 µA. In any event load current should be minimized in order to limit it's contribution to the total temperature error. The temperature-sensing element is based on a delta V topology of two transistors (Q1 and BE Q2inFunctionalBlockDiagram)thataresizedwitha10:1arearatio. 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 LM60TransferFunction The LM60 follows a simple linear transfer function to achieve the accuracy as listed in Electrical Characteristics asgiven: V =(6.25mV/°C×T°C)+424mV O where • Tisthetemperature • V istheLM60outputvoltage (1) O 8.4 Device Functional Modes Theonlyfunctionalmodeforthisdeviceisananalogoutputdirectlyproportionaltotemperature. Copyright©2004–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM60

LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information Thedevicehasalowsupplycurrentandawidesupplyrange,thereforeitcaneasilybedrivenbyabattery. 9.1.1 CapacitiveLoads The device handles capacitive loading well. Without any special precautions, the device can drive any capacitive load as shown in Figure 12. Over the specified temperature range the device has a maximum output impedance of 800 Ω. In an extremely noisy environment, adding some filtering to minimize noise pick-up may be required. TI recommends that 0.1 μF be added from +V to GND to bypass the power supply voltage, as shown in Figure 13. S In a noisy environment, adding a capacitor from the output to ground may be required. A 1-μF output capacitor with the 800-Ω output impedance forms a 199-Hz, low-pass filter. Because the thermal time constant of the device is much slower than the 6.3-ms time constant formed by the RC, the overall response time of the device is not be significantly affected. For much larger capacitors, this additional time lag increases the overall response timeofthedevice. TI Device Copyright © 2017, Texas Instruments Incorporated Figure12. NoDecouplingRequiredforCapacitiveLoad Figure13. FilterAddedforNoisyEnvironment 10 SubmitDocumentationFeedback Copyright©2004–2017,TexasInstrumentsIncorporated ProductFolderLinks:LM60

LM60 www.ti.com SNIS119F–MAY2004–REVISEDAUGUST2017 9.2 Typical Applications 9.2.1 Full-RangeCentigradeTemperatureSensor Because the LM60 is a simple temperature sensor that provides an analog output, design requirements related tothelayoutarealsoimportant.RefertoLayout fordetails. V =(6.25mV/°C×T°C)+424mV O Figure14. Full-RangeCentigradeTemperatureSensor(−40°Cto+125°C) OperatingFromaSingleLi-IonBatteryCell 9.2.1.1 DesignRequirements Forthisdesignexample,usethedesignparameterslistedinTable1. Table1.TemperatureandTypicalV Valuesof O Figure14 TEMPERATURE(T) TYPICALV O 125°C 1205mV 100°C 1049mV 25°C 580mV 0°C 424mV –25°C 268mV –40°C 174mV Copyright©2004–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM60

LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 www.ti.com 9.2.1.2 DetailedDesignProcedure SelectionoftheLM60isbasedontheoutputvoltagetransferfunctionbeingabletomeettheneedsoftherestof thesystem. 9.2.1.3 ApplicationCurve 1.50 1 . 2 0 5 1.25 e (V) 1.00 g olta0.75 0 . 5 8 0 V ut p Out0.50 0 . 1 7 4 0.25 VO = (+6.25 mV/°C × T °C) + 424 mV 0.00 –50 –25 0 25 50 75 100 125 150 DUT Temperature ((cid:131)C) C001 Figure15. LM60OutputTransferFunction 9.2.2 CentigradeThermostatApplication V+ R3 R4 4.1V R1 VT (High = overtemp alarm) + U1 VOUT TI Device U3 0.1 PF - R2 LM7211 V+ TI Device VTemp U2 Copyright © 2017, Texas Instruments Incorporated Figure16. CentigradeThermostat 9.2.2.1 DesignRequirements A simple thermostat can be created by using a reference (LM4040) and a comparator (LM7211) as shown in Figure16. 9.2.2.2 DetailedDesignProcedure UseEquation2andEquation3tocalculatethethresholdvaluesforT1andT2. (4.1)R2 VT1 = R2 + R1||R3 (2) (4.1)R2||R3 VT2 = R1 + R2||R3 (3) 12 SubmitDocumentationFeedback Copyright©2004–2017,TexasInstrumentsIncorporated ProductFolderLinks:LM60

LM60 www.ti.com SNIS119F–MAY2004–REVISEDAUGUST2017 9.2.2.3 ApplicationCurve V TEMP V T1 V T2 V OUT Figure17. ThermostatOutputWaveform 9.3 System Examples 9.3.1 ConservingPowerDissipationWithShutdown The LM60 draws very little power, therefore it can simply be shutdown by driving the LM60 supply pin with the outputofalogicgateasshowninFigure18. Figure18. ConservingPowerDissipationWithShutdown 10 Power Supply Recommendations Inanextremelynoisyenvironment,addsomefilteringtominimizenoisepick-up.Adding0.1 μFfrom+V toGND S is recommended to bypass the power supply voltage, as shown in Figure 13. In a noisy environment, add a capacitorfromtheoutputtoground. Copyright©2004–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM60

LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 www.ti.com 11 Layout 11.1 Layout Guidelines The LM60 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM60 is sensing will be within about +0.1°C of the surface temperaturethattheleadsofthLM60areattachedto. This presumes that the ambient air temperature is almost the same as the surface temperature. If the air temperature were much higher or lower than the surface temperature, the actual temperature of the device die wouldbeatanintermediatetemperaturebetweenthesurfacetemperatureandtheairtemperature. ToensuregoodthermalconductivitythebacksideofthedevicedieisdirectlyattachedtotheGNDpin.Thelands and traces to the device will, of course, be part of the printed-circuit board, which is the object whose temperatureisbeingmeasured.Theseprinted-circuitboardlandsandtracesdonotcausethetemperatureofthe devicetodeviatefromthedesiredtemperature. Alternatively, the device can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the device and accompanying wiring and circuits must be kept insulated and dry to avoid leakage and corrosion. Specifically when the device operates at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating andepoxypaintsordipsareoftenusedtoensurethatmoisturecannotcorrodethedeviceorconnections. 11.2 Layout Example +VS 1 3 GND VO 2 Via to ground plane Via to power plane 1/2-inchsquareprintedcircuitboardwith2-oz.copperfoilorsimilar. Figure19. PCBLayout 11.3 Thermal Considerations The thermal resistance junction to ambient (R ) is the parameter used to calculate the rise of a device junction θJA temperature due to the device power dissipation. Use Equation 4 to calculate the rise in the die temperature of thedevice. T =T +R [(+V I )+(+V −V )I ] J A θJA S Q S O L where • I isthequiescentcurrent Q • I istheloadcurrentontheoutput (4) L 14 SubmitDocumentationFeedback Copyright©2004–2017,TexasInstrumentsIncorporated ProductFolderLinks:LM60

LM60 www.ti.com SNIS119F–MAY2004–REVISEDAUGUST2017 Thermal Considerations (continued) Table 2 summarizes the rise in die temperature of the LM60 without any loading, and the thermal resistance for different conditions. The values in Table 2 were actually measured where as the values shown in Thermal Information where calculated using modeling methods as described in the Semiconductor and IC Package ThermalMetrics(SPRA953)applicationreport. Table2.TemperatureRiseofLM60DuetoSelf-HeatingandThermalResistance(R ) θJA SOT-23(1) SOT-23(2) TO-92(1) TO-92(3) NOHEATSINK SMALLHEATFIN NOHEATFIN SMALLHEATFIN R T −T R T −T R T −T R T −T θJA J A θJA J A θJA J A θJA J A (°C/W) (°C) (°C/W) (°C) (°C/W) (°C) (°C/W) (°C) Stillair 450 0.17 260 0.1 180 0.07 140 0.05 Movingair — — 180 0.07 90 0.034 70 0.026 (1) Partsolderedto30gaugewire. (2) Heatsinkusedis1/2-insquareprinted-circuitboardwith2-oz.foilwithpartattachedasshowninFigure20. (3) Partgluedorleadssolderedto1-insquareof1/16-inprinted-circuitboardwith2-oz.foilorsimilar. Ground Plane on 062 copper clad board. 1/2" 1 Q 0- " 6 2 M 1/ 0/L 6 M L 1/2-inSquarePrinted-CircuitBoardwith2-oz.CopperFoilorSimilar. Figure20. Printed-CircuitBoardUsedforHeatSinktoGenerateThermalResponseCurves Copyright©2004–2017,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM60

LM60 SNIS119F–MAY2004–REVISEDAUGUST2017 www.ti.com 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed.Forchangedetails,reviewtherevisionhistoryincludedinanyreviseddocument. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.3 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.4 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.5 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 16 SubmitDocumentationFeedback Copyright©2004–2017,TexasInstrumentsIncorporated ProductFolderLinks:LM60

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM60BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -25 to 125 T6B LM60BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS SN Level-1-260C-UNLIM -25 to 125 T6B & no Sb/Br) LM60BIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -25 to 125 T6B LM60BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS SN Level-1-260C-UNLIM -25 to 125 T6B & no Sb/Br) LM60BIZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS SN N / A for Pkg Type LM60 & no Sb/Br) BIZ LM60BIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN N / A for Pkg Type -25 to 125 LM60 & no Sb/Br) BIZ LM60CIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 T6C LM60CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 T6C & no Sb/Br) LM60CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 T6C LM60CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 T6C & no Sb/Br) LM60CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN N / A for Pkg Type -40 to 125 LM60 & no Sb/Br) CIZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM60 : •Automotive: LM60-Q1 NOTE: Qualified Version Definitions: •Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM60BIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM60BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM60BIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM60CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM60CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM60CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM60CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM60BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM60CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM60CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP (2.54) SEATING 2X NOTE 3 PLANE 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 3X 12.7 MIN 0.43 2X 0.55 3X 3X 0.35 2.6 0.2 0.38 2X 1.27 0.13 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION TO STRAIGHT LEAD OPTION 2.67 3X 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com

EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 FULL R TYP 0.05 MAX (1.07) ALL AROUND METAL 3X ( 0.85) HOLE TYP TYP 2X METAL (1.5) 2X (1.5) 2X SOLDER MASK OPENING 1 2 3 (R0.05) TYP 2X (1.07) (1.27) SOLDER MASK (2.54) OPENING LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ( 1.4) 2X ( 1.4) ALL AROUND METAL TYP 3X ( 0.9) HOLE METAL 2X (R0.05) TYP 1 2 3 SOLDER MASK OPENING (2.6) SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com

TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 9.75 8.5 8.50 19.0 17.5 2.9 6.75 3.7-4.3 TYP TYP 2.4 5.95 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com

4203227/C

PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR 2.64 C 2.10 1.12 MAX 1.4 1.2 B A 0.1 C PIN 1 INDEX AREA 1 0.95 3.04 1.9 2.80 3 2 0.5 3X 0.3 0.10 0.2 C A B (0.95) TYP 0.01 0.25 GAGE PLANE 0.20 TYP 0.08 0.6 TYP 0 -8 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com

EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com

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