LM4431 www.ti.com SNVS103C–JUNE2000–REVISEDAPRIL2013 LM4431 Micropower Shunt Voltage Reference CheckforSamples:LM4431 FEATURES DESCRIPTION 1 • SmallPackage:SOT-23 Ideal for space critical applications, the LM4431 2 voltage reference is available in the sub-miniature • NoOutputCapacitorRequired (3 mm x 1.3 mm) SOT-23 surface-mount package. • ToleratesCapacitiveLoads The LM4431's advanced design eliminates the need • FixedReverseBreakdownVoltageof2.50V for an external stabilizing capacitor while ensuring stability with any capacitive load, thus making the APPLICATIONS LM4431 easy to use. The operating current range is 100μAto15mA. • Portable,Battery-PoweredEquipment The LM4431 utilizes fuse and zener-zap reverse • DataAcquisitionSystems breakdown voltage trim during wafer sort to ensure • Instrumentation that the parts have an accuracy of better than ±2.0% • ProcessControl at 25°C. Bandgap reference temperature drift curvature correction and low dynamic impedance • EnergyManagement ensure stable reverse breakdown voltage accuracy • ProductTesting over a wide range of operating temperatures and • PowerSupplies currents. KEY SPECIFICATIONS • OutputVoltageTolerance:25°C: ±2.0%(Max) • LowOutputNoise(10Hzto10kHz):35μV rms (Typ) • WideOperatingCurrentRange:100μAto15 mA • CommercialTemperatureRange:0to+70°C • LowTemperatureCoefficient:30ppm/°C(Typ) Connection Diagram TopView *Thispinmustbeleftfloatingorconnectedtopin2. Figure1. SOT-23Package SeePackageNumberDBZ0003A Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2000–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LM4431 SNVS103C–JUNE2000–REVISEDAPRIL2013 www.ti.com Absolute Maximum Ratings(1)(2) ReverseCurrent 20mA ForwardCurrent 10mA PowerDissipation(T =25°C)(3) DBZ0003APackage 306mW A StorageTemperature −65°Cto+150°C Vaporphase(60seconds) +215°C LeadTemperature DBZ0003APackage Infrared(15seconds) +220°C HumanBodyModel(4) 2kV ESDSusceptibility MachineModel(4) 200V (1) AbsoluteMaximumRatingsindicatelimitsbeyondwhichdamagetothedevicemayoccur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdonotensurespecificperformancelimits.Forensuredspecificationsandtestconditions,seethe ElectricalCharacteristics.Thespecifiedspecificationsapplyonlyforthetestconditionslisted.Someperformancecharacteristicsmay degradewhenthedeviceisnotoperatedunderthelistedtestconditions. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) ThemaximumpowerdissipationmustbederatedatelevatedtemperaturesandisdictatedbyT (maximumjunctiontemperature), Jmax θ (junctiontoambientthermalresistance),andT (ambienttemperature).Themaximumallowablepowerdissipationatany JA A temperatureisPD =(T −T )/θ orthenumbergivenintheAbsoluteMaximumRatings,whicheverislower.FortheLM4431, max Jmax A JA T =125°C,andthetypicalthermalresistance(θ ),whenboardmounted,is326°C/WfortheSOT-23package. Jmax JA (4) Thehumanbodymodelisa100pFcapacitordischargedthrougha1.5kΩresistorintoeachpin.Themachinemodelisa200pF capacitordischargeddirectlyintoeachpin. Operating Ratings(1)(2) TemperatureRange(T ≤T ≤T ) 0°C≤T ≤+70°C min A max A ReverseCurrent LM4431-2.5 100μAto15mA (1) AbsoluteMaximumRatingsindicatelimitsbeyondwhichdamagetothedevicemayoccur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdonotensurespecificperformancelimits.Forensuredspecificationsandtestconditions,seethe ElectricalCharacteristics.Thespecifiedspecificationsapplyonlyforthetestconditionslisted.Someperformancecharacteristicsmay degradewhenthedeviceisnotoperatedunderthelistedtestconditions. (2) ThemaximumpowerdissipationmustbederatedatelevatedtemperaturesandisdictatedbyT (maximumjunctiontemperature), Jmax θ (junctiontoambientthermalresistance),andT (ambienttemperature).Themaximumallowablepowerdissipationatany JA A temperatureisPD =(T −T )/θ orthenumbergivenintheAbsoluteMaximumRatings,whicheverislower.FortheLM4431, max Jmax A JA T =125°C,andthetypicalthermalresistance(θ ),whenboardmounted,is326°C/WfortheSOT-23package. Jmax JA 2 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4431

LM4431 www.ti.com SNVS103C–JUNE2000–REVISEDAPRIL2013 LM4431-2.5 Electrical Characteristics BoldfacelimitsapplyforT =T =T toT ;allotherlimitsT =T =25°C. A J MIN MAX A J Symbol Parameter Conditions Typical(1) LLMim44it3s1(2M)3 (ULinmitist) V ReverseBreakdownVoltage I =100μA 2.500 V R R ReverseBreakdownVoltageTolerance I =100μA ±50 mV(max) R I 45 μA RMIN MinimumOperatingCurrent 100 μA(max) ΔV /ΔT I =10mA ±30 ppm/°C R R AverageReverseBreakdownVoltage I =1mA ±30 ppm/°C TemperatureCoefficient R I =100μA ±30 ppm/°C R ΔV /ΔI I ≤I ≤1mA 0.4 mV R R RMIN R 1.0 mV(max) ReverseBreakdownVoltageChange 1.2 mV(max) withOperatingCurrentChange 1mA≤I ≤15mA 2.5 mV R 8.0 mV(max) 25 mV(max) Z I =1mA,f=120Hz, R ReverseDynamicImpedance R 1.0 Ω I =0.1I AC R e I =100μA, N WidebandNoise R 35 μV 10Hz≤f≤10kHz rms ΔV t=1000hrs R ReverseBreakdownVoltageLongTerm T=25°C±0.1°C 120 ppm Stability I =100μA R (1) TypicalsareatT =25°Candrepresentmostlikelyparametricnorm. J (2) Limitsare100%productiontestedat25°C.LimitsovertemperatureareensuredthroughcorrelationusingStatisticalQualityControl (SQC)methods.ThelimitsareusedtocalculateAOQL. Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM4431

LM4431 SNVS103C–JUNE2000–REVISEDAPRIL2013 www.ti.com Typical Performance Characteristics TemperatureDriftforDifferent OutputImpedance AverageTemperatureCoefficient vsFrequency Figure2. Figure3. ReverseCharacteristicsand MinimumOperatingCurrent NoiseVoltage Figure4. Figure5. Start-Up Characteristics Figure6.TestCircuit Figure7.LM4431-2.5,R =30k S 4 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4431

LM4431 www.ti.com SNVS103C–JUNE2000–REVISEDAPRIL2013 Functional Block Diagram APPLICATIONS INFORMATION The LM4431 is a micro-power curvature-corrected 2.5V bandgap shunt voltage reference. For space critical applications, the LM4431 is available in the sub-miniature SOT-23 surface-mount package. The LM4431 has been designed for stable operation without the need of an external capacitor connected between the “+” pin and the “−” pin. If, however, a bypass capacitor is used, the LM4431 remains stable. The operating current range is 100μAto15mA. The LM4431's SOT-23 package has a parasitic Schottky diode between pin 2 (−) and pin 3 (Die attach interface contact).Therefore,pin3oftheSOT-23packagemustbeleftfloatingorconnectedtopin2. Inaconventionalshuntregulatorapplication(Figure8),anexternalseriesresistor(R )isconnectedbetweenthe S supply voltage and the LM4431. R determines the current that flows through the load (I ) and the LM4431 (I ). S L Q Since load current and supply voltage may vary, R should be small enough to supply at least the minimum S acceptable I to the LM4431 even when the supply voltage is at its minimum and the load current is at its Q maximum value. When the supply voltage is at its maximum and I is at its minimum, R should be large enough L S sothatthecurrentflowingthroughtheLM4431islessthan15mA. R is determined by the supply voltage, (V ), the load and operating current, (I and I ), and the LM4431's S S L Q reversebreakdownvoltage,V . R (1) Typical Applications Figure8. ShuntRegulator Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM4431

LM4431 SNVS103C–JUNE2000–REVISEDAPRIL2013 www.ti.com Figure9. Boundedamplifierreducessaturation-induceddelays andcanpreventsucceedingstagedamage. Nominalclampingvoltageis±3.9V(LM4431’sreversebreakdownvoltage+2diodeV ). F Figure10. ProtectingOpAmpinput. Theboundingvoltageis±4VwiththeLM4431(LM4431’sreversebreakdownvoltage+3diodeV ). F 6 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4431

LM4431 www.ti.com SNVS103C–JUNE2000–REVISEDAPRIL2013 Figure11. ProgrammableCurrentSource Figure12. Precision1μAto1mACurrentSources Copyright©2000–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM4431

LM4431 SNVS103C–JUNE2000–REVISEDAPRIL2013 www.ti.com REVISION HISTORY ChangesfromRevisionB(April2013)toRevisionC Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 7 8 SubmitDocumentationFeedback Copyright©2000–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4431

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM4431M3-2.5 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 S2E LM4431M3-2.5/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS SN Level-1-260C-UNLIM 0 to 70 S2E & no Sb/Br) LM4431M3X-2.5/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS SN Level-1-260C-UNLIM 0 to 70 S2E & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM4431M3-2.5 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM4431M3-2.5/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM4431M3X-2.5/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM4431M3-2.5 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM4431M3-2.5/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM4431M3X-2.5/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 PackMaterials-Page2

4203227/C

PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR 2.64 C 2.10 1.12 MAX 1.4 1.2 B A 0.1 C PIN 1 INDEX AREA 1 0.95 3.04 1.9 2.80 3 2 0.5 3X 0.3 0.10 0.2 C A B (0.95) TYP 0.01 0.25 GAGE PLANE 0.20 TYP 0.08 0.6 TYP 0 -8 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com

EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com

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