Product Sample & Technical Tools & Support & Folder Buy Documents Software Community LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 LM431 Adjustable Precision Zener Shunt Regulator 1 Features 3 Description • AverageTemperatureCoefficient50ppm/°C The LM431 is a 3-terminal adjustable shunt regulator 1 with ensured temperature stability over the entire • TemperatureCompensatedforOperationOver temperature range of operation. The output voltage theFullTemperatureRange may be set at any level greater than 2.5 V (V ) up REF • ProgrammableOutputVoltage to 36 V merely by selecting two external resistors that • FastTurnonResponse act as a voltage divided network. Due to the sharp turnon characteristics this device is an excellent • Low-OutputNoise replacementformanyZenerdiodeapplications. • Low-DynamicOutputImpedance The LM431 is available in space-saving SOIC-8, • AvailableinSpace-SavingSOIC-8,SOT-23,and SOT-23,andTO-92packages. TO-92Packages DeviceInformation(1) 2 Applications PARTNUMBER PACKAGE BODYSIZE(NOM) • AdjustableVoltageorCurrentLinearand SOIC(8) 4.90mm×3.91mm SwitchingPowerSupplies LM431 SOT-23(3) 2.92mm×1.30mm • VoltageMonitoring TO-92(3) 4.30mm×4.30mm • CurrentSourceandSinkCircuits (1) For all available packages, see the orderable addendum at • CircuitsRequiringPrecisionReferences theendofthedatasheet. • ZenerDiodeReplacements LM431Symbol FunctionalBlockDiagram 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com Table of Contents 1 Features.................................................................. 1 8.3 FeatureDescription.................................................10 2 Applications........................................................... 1 8.4 DeviceFunctionalModes........................................11 3 Description............................................................. 1 9 ApplicationandImplementation........................ 12 4 RevisionHistory..................................................... 2 9.1 ApplicationInformation............................................12 9.2 TypicalApplications................................................13 5 PinConfigurationandFunctions......................... 3 10 PowerSupplyRecommendations..................... 19 6 Specifications......................................................... 4 11 Layout................................................................... 19 6.1 AbsoluteMaximumRatings......................................4 6.2 ESDRatings..............................................................4 11.1 LayoutGuidelines.................................................19 6.3 RecommendedOperatingConditions.......................4 11.2 LayoutExample....................................................19 6.4 ThermalInformation..................................................4 12 DeviceandDocumentationSupport................. 20 6.5 ElectricalCharacteristics...........................................5 12.1 CommunityResources..........................................20 6.6 TypicalCharacteristics..............................................7 12.2 Trademarks...........................................................20 7 ParameterMeasurementInformation..................7 12.3 ElectrostaticDischargeCaution............................20 12.4 Glossary................................................................20 8 DetailedDescription............................................ 10 13 Mechanical,Packaging,andOrderable 8.1 Overview.................................................................10 Information........................................................... 20 8.2 FunctionalBlockDiagram ......................................10 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionG(March2013)toRevisionH Page • AddedESDRatingstable,FeatureDescriptionsection,DeviceFunctionalModes,ApplicationandImplementation section,PowerSupplyRecommendationssection,Layoutsection,DeviceandDocumentationSupportsection,and Mechanical,Packaging,andOrderableInformationsection.................................................................................................. 1 ChangesfromRevisionF(April2013)toRevisionG Page • ChangedlayoutofNationalDataSheettoTIformat........................................................................................................... 18 2 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 5 Pin Configuration and Functions DPackage 8-PinSOIC DBZPackage TopView 3-PinSOT-23 TopView Note:NC=Notinternallyconnected. LPPackage 3-PinTO-92 TopView PinFunctions PIN I/O DESCRIPTION NAME SOIC SOT-23 TO-92 Anode 2,3,6,7 3 3 O Anodepin,normallygrounded Cathode 1 1 1 I/O Shuntcurrent/outputvoltage NC 4,5 — — — Noconnect Reference 8 2 2 I Referencepinforadjustableoutputvoltage Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings overoperatingfree-airtemperaturerange(unlessotherwisenoted)(1)(2) MIN MAX UNIT Cathodevoltage 37 V Referencevoltage –0.5 V Continuouscathodecurrent –10 150 mA Referenceinputcurrent 10 mA TO-92package 0.78 W Internalpower dissipation(3)(4) SOICpackage 0.81 W SOT-23package 0.28 W Industrial(LM431xI) –40 85 °C Operatingtemperature Commercial(LM431xC) 0 70 °C Storagetemperature –65 150 °C (1) StressesbeyondthoselistedunderAbsoluteMaximumRatingsmaycausepermanentdamagetothedevice.Thesearestressratings only,whichdonotimplyfunctionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunderRecommended OperatingConditions.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityandspecifications. (3) T =150°C. JMax (4) Ratingsapplytoambienttemperatureat25°C.Abovethistemperature,deratetheTO-92at6.2mW/°C,theSOICat6.5mW/°C,the SOT-23at2.2mW/°C. 6.2 ESD Ratings VALUE UNIT V Electrostaticdischarge Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2500 V (ESD) (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess. 6.3 Recommended Operating Conditions overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT Cathodevoltage V 37 V REF Cathodecurrent 1 100 mA 6.4 Thermal Information LM431 THERMALMETRIC(1) D(SOIC) DBZ(SOT-23) LP(TO-92) UNIT 8PINS 3PINS 3PINS R Junction-to-ambientthermalresistance 126.9 267.7 162.4 °C/W θJA R Junction-to-case(top)thermalresistance 72.2 138.3 85.8 °C/W θJC(top) R Junction-to-boardthermalresistance 67.5 61 — °C/W θJB ψ Junction-to-topcharacterizationparameter 21.1 21.5 29.4 °C/W JT ψ Junction-to-boardcharacterizationparameter 67 60.1 141.5 °C/W JB R Junction-to-case(bottom)thermalresistance — — — °C/W θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheSemiconductorandICPackageThermalMetricsapplication report,SPRA953. 4 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 6.5 Electrical Characteristics T =25°Cunlessotherwisespecified A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V =V ,I =10mA Z REF I 2.44 2.495 2.55 LM431A(Figure6) V =V ,I =10mA V Referencevoltage Z REF I 2.47 2.495 2.52 V REF LM431B(Figure6) V =V ,I =10mA Z REF I 2.485 2.5 2.51 LM431C(Figure6) Deviationofreferenceinputvoltage V =V ,I =10mA, VDEV overtemperature(1) TZ=fuRllErFangIe(Figure6) 8 17 mV A ΔVREF/ Ratioofthechangeinreferencevoltagetothe IZ=10mA VZfromVREFto10V −1.4 −2.7 mV/V ΔVZ changeincathodevoltage (Figure7) VZfrom10Vto36V −1 −2 R =10kΩ,R =∞,I =10mA I Referenceinputcurrent 1 2 I 2 4 μA REF (Figure7) Deviationofreferenceinputcurrent R =10kΩ,R =∞,I =10mA, ∝I 1 2 I 0.4 1.2 μA REF overtemperature T =fullrange(Figure7) A I Minimumcathodecurrentforregulation V =V (Figure6) 0.4 1 mA Z(MIN) Z REF I OFF-statecurrent V =36V,V =0V(Figure8) 0.3 1 μA Z(OFF) Z REF (1) Deviationofreferenceinputvoltage,V ,isdefinedasthemaximumvariationofthereferenceinputvoltageoverthefulltemperature DEV range. Theaveragetemperaturecoefficientofthereferenceinputvoltage,∝V ,isdefinedas: REF Where: T –T =fulltemperaturechange(0–70°C). 2 1 V canbepositiveornegativedependingonwhethertheslopeispositiveornegative. REF Example:V =8mV,V =2495mV,T –T =70°C,slopeispositive. DEV REF 2 1 Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com Electrical Characteristics (continued) T =25°Cunlessotherwisespecified A PARAMETER TESTCONDITIONS MIN TYP MAX UNIT V =V ,LM431A, Z REF 0.75 Frequency=0Hz(Figure6) r Dynamicoutputimpedance(2) Ω Z V =V ,LM431B,LM431C Z REF 0.5 Frequency=0Hz(Figure6) (2) Thedynamicoutputimpedance,r ,isdefinedas: Z Whenthedeviceisprogrammedwithtwoexternalresistors,R1andR2,(seeFigure7),thedynamicoutputimpedanceoftheoverall circuit,r ,isdefinedas: Z 6 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 6.6 Typical Characteristics Note: Theareasunderthecurvesrepresentconditionsthatmay causethedevicetooscillate.ForcurvesB,C,andD,R2andV+ wereadjustedtoestablishtheinitialV andI conditionswithC =0. Z Z L V+andC werethenadjustedtodeterminetherangesofstability. L Figure1.DynamicImpedancevsFrequency Figure2.StabilityBoundaryConditions 7 Parameter Measurement Information Figure3. TestCircuitforDynamicImpedancevsFrequencyCurve Figure4. TestCircuitforCurveAAbove Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com Parameter Measurement Information (continued) Figure5. TestCircuitforCurvesB,CandDAbove Figure6. TestCircuitforV =V Z REF Note: V =V (1+R1/R2)+I ×R1 Z REF REF Figure7. TestCircuitforV >V Z REF 8 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 Parameter Measurement Information (continued) Figure8. TestCircuitforOFF-StateCurrent Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com 8 Detailed Description 8.1 Overview The LM431 is an adjustable precision shunt voltage regulator with ensured temperature stability over the entire temperature range. The part has three different packages available to meet small footprint requirements, and is availableinthreedifferenttolerancegrades. 8.2 Functional Block Diagram Figure9. LM431Symbol Figure10. LM431BlockDiagram 8.3 Feature Description The LM431 is a precision Zener diode. The part requires a small quiescent current for regulation, and regulates the output voltage by shunting more or less current to ground, depending on input voltage and load. The only external component requirement is a resistor between the cathode and the input voltage to set the input current. Anexternalcapacitorcanbeusedontheinputoroutput,butisnotrequired. 10 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 Feature Description (continued) Figure11. EquivalentCircuit 8.4 Device Functional Modes The LM431 is most commonly operated in closed-loop mode, where the reference node is tied to the output voltage via a resistor divider. The output voltage remains in regulation as long as I is between 1 mA and 100 z mA. The part can also be used in open-loop mode to act as a comparator, driving the feedback node from anothervoltagesource. Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers must validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 9.1 Application Information The LM431 is an adjustable precision shunt voltage regulator with ensured temperature stability over the entire temperature range. For space critical applications, the LM431 is available in space saving SOIC-8, SOT-23 and TO-92packages.Theminimumoperatingcurrentis1mAwhilethemaximumoperatingcurrentis100mA. The typical thermal hysteresis specification is defined as the change in 25°C voltage measured after thermal cycling. The device is thermal cycled to temperature 0°C and then measured at 25°C. Next the device is thermal cycled to temperature 70°C and again measured at 25°C. The resulting VOUT delta shift between the 25°C measurements is thermal hysteresis. Thermal hysteresis is common in precision references and is induced by thermal-mechanical package stress. Changes in environmental storage temperature, operating temperature and boardmountingtemperatureareallfactorsthatcancontributetothermalhysteresis. In a conventional shunt regulator application (Figure 12), an external series resistor (R ) is connected between S the supply voltage and the LM431 cathode pin. R determines the current that flows through the load (I ) and S LOAD the LM431 (I ). Since load current and supply voltage may vary, R must be small enough to supply at least the Z S minimum acceptable I to the LM431 even when the supply voltage is at its minimum and the load current is at Z its maximum value. When the supply voltage is at its maximum and I is at its minimum, R must be large LOAD S enoughsothatthecurrentflowingthroughtheLM431islessthan100mA. R must be selected based on the supply voltage, (V+), the desired load and operating current, (I and I ), S LOAD Z andtheoutputvoltage,seeEquation1. V -V R = + O S I +I LOAD Z (1) The LM431 output voltage can be adjusted to any value in the range of 2.5 V through 37 V. It is a function of the internal reference voltage (VREF) and the ratio of the external feedback resistors as shown in Figure 12. The outputvoltageisfoundusingEquation2. V =V *(1+R /R ) O REF 1 2 where • V istheoutputvoltage(also,cathodevoltage,V ).TheactualvalueoftheinternalV isafunctionofV . (2) O Z REF Z ThecorrectedV isdeterminedbyEquation3: REF V =∆V *(∆V /∆V )+V REF Z REF Z Y where • V =2.5Vand∆V =(V –V ) Y Z Z Y • ΔV /ΔV isfoundintheElectricalCharacteristicsandistypically−1.4mV/VforV ragingfromV to10V REF Z Z REF and–1mV/VforV ragingfrom10Vto36V. (3) Z 12 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 9.2 Typical Applications 9.2.1 ShuntRegulator Figure12. ShuntRegulator 9.2.1.1 DesignRequirements Designashuntregulatorwiththefollowingrequirements: • V >V + O • V =5V O SelectR (aresistorbetweenV andV )suchthat:1mA< I <100mA S + O Z 9.2.1.2 DetailedDesignProcedure The resistor R must be selected such that current I remains in the operational region of the part for the entire S Z V range and load current range. The two extremes to consider are V at its minimum, and the load at its + + maximum, where R must be small enough for I to remain above 1 mA. The other extreme is V at its S Z + maximum, and the load at its minimum, where R must be large enough to maintain I < 100 mA. If unsure, try S Z using1mA≤ I ≤ 10mAasastartingpoint;justrememberthevalueofI varieswithinputvoltageandload. R Z UseEquation4andEquation5tosetR betweenR andR . S S_MIN S_MAX V -V R = +_MAX O S_MIN I +I LOAD_MIN Z_MAX (4) V -V R = +_MIN O S_MAX I +I LOAD_MAX Z_MIN (5) SetfeedbackresistorsR andR foraresistordividerbasedonEquation2andreproducedinEquation6 1 2 V =V *(1+R /R ) (6) O REF 1 2 So,fora5-Voutputvoltage,V ,andV of2.5V,simplecalculationyieldsR /R =1.Basedonthis,select O REF 1 2 R =1kΩandR2=1kΩ. 1 Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com Typical Applications (continued) 9.2.1.3 ApplicationCurves Figure13.InputCurrentvsV Figure14.ThermalInformation Z Figure15.InputCurrentvsV Z 9.2.2 OtherApplications Figure16. SingleSupplyComparatorWithTemperatureCompensatedThreshold 14 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 Typical Applications (continued) Figure17. SeriesRegulator Figure18. OutputControlofaThreeTerminalFixedRegulator Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com Typical Applications (continued) Figure19. HigherCurrentShuntRegulator Figure20. CrowBar 16 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 Typical Applications (continued) Figure21. OverVoltageandUnderVoltageProtectionCircuit Figure22. VoltageMonitor Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com Typical Applications (continued) Figure23. DelayTimer Figure24. CurrentLimiterorCurrentSource Figure25. ConstantCurrentSink 18 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

LM431 www.ti.com SNVS020H–MAY2000–REVISEDJANUARY2016 10 Power Supply Recommendations While a bypass capacitor is not required on the input voltage line, TI recommends reducing noise on the input whichcouldaffecttheoutput.TIrecommendsa0.1-µFceramiccapacitororlarger. 11 Layout 11.1 Layout Guidelines Place external components as close to the device as possible. Place R close to the cathode, as well as the S inputbypasscapacitor,ifused.Keepfeedbackresistorclosethedevicewheneverpossible. 11.2 Layout Example R physically close to device cathode S C physically close to device C physically close to device IN OUT Figure26. LM431LayoutRecommendation Copyright©2000–2016,TexasInstrumentsIncorporated SubmitDocumentationFeedback 19 ProductFolderLinks:LM431

LM431 SNVS020H–MAY2000–REVISEDJANUARY2016 www.ti.com 12 Device and Documentation Support 12.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TIE2E™OnlineCommunity TI'sEngineer-to-Engineer(E2E)Community.Createdtofostercollaboration amongengineers.Ate2e.ti.com,youcanaskquestions,shareknowledge,exploreideasandhelp solveproblemswithfellowengineers. DesignSupport TI'sDesignSupport QuicklyfindhelpfulE2Eforumsalongwithdesignsupporttoolsand contactinformationfortechnicalsupport. 12.2 Trademarks E2EisatrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 12.3 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 12.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 20 SubmitDocumentationFeedback Copyright©2000–2016,TexasInstrumentsIncorporated ProductFolderLinks:LM431

PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2016 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM431ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM431 ACM LM431ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 LM431 & no Sb/Br) ACM LM431ACM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 N1F & no Sb/Br) LM431ACM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI 0 to 70 N1F LM431ACM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 N1F & no Sb/Br) LM431ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 LM431 & no Sb/Br) ACM LM431ACZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS CU SN N / A for Pkg Type LM431 & no Sb/Br) ACZ LM431ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS CU SN N / A for Pkg Type LM431 & no Sb/Br) ACZ LM431ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type 0 to 70 LM431 & no Sb/Br) ACZ LM431AIM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM431 AIM LM431AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 LM431 & no Sb/Br) AIM LM431AIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1E LM431AIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 N1E & no Sb/Br) LM431AIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 N1E & no Sb/Br) LM431AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 LM431 & no Sb/Br) AIM LM431AIZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS CU SN N / A for Pkg Type LM431 & no Sb/Br) AIZ LM431AIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type -40 to 85 LM431 & no Sb/Br) AIZ LM431BCM/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 431 & no Sb/Br) BCM Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2016 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM431BCM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 N1D LM431BCM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 N1D & no Sb/Br) LM431BCM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 N1D & no Sb/Br) LM431BCMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 431 & no Sb/Br) BCM LM431BCZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type 0 to 70 LM431 & no Sb/Br) BCZ LM431BIM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 431 BIM LM431BIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 431 & no Sb/Br) BIM LM431BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1C LM431BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 N1C & no Sb/Br) LM431BIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 N1C LM431BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 N1C & no Sb/Br) LM431BIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 431 & no Sb/Br) BIM LM431CCM/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 431 & no Sb/Br) CCM LM431CCM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 N1B & no Sb/Br) LM431CCM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI 0 to 70 N1B LM431CCM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 N1B & no Sb/Br) LM431CCZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type 0 to 70 LM431 & no Sb/Br) CCZ LM431CIM NRND SOIC D 8 95 TBD Call TI Call TI -40 to 85 431 CIM LM431CIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 431 & no Sb/Br) CIM LM431CIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 N1A Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2016 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM431CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 N1A & no Sb/Br) LM431CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 N1A LM431CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 N1A & no Sb/Br) LM431CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type -40 to 85 LM431 & no Sb/Br) CIZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 25-Jun-2016 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2015 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM431ACM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431ACM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431ACM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431AIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431AIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431AIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431BCM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BCM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BCM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BCMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431BIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431BIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM431CCM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2015 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM431CCM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CCM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM431CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM431ACM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431ACM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431ACM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM431AIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431AIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431AIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM431BCM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431BCM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431BCM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 3-Nov-2015 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM431BCMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM431BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431BIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM431CCM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431CCM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431CCM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM431CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM431CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 PackMaterials-Page3

4203227/C

PACKAGE OUTLINE DBZ0003A SOT-23 - 1.12 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR 2.64 C 2.10 1.12 MAX 1.4 1.2 B A 0.1 C PIN 1 INDEX AREA 1 0.95 3.04 1.9 2.80 3 2 0.5 3X 0.3 0.10 0.2 C A B (0.95) TYP 0.01 0.25 GAGE PLANE 0.20 TYP 0.08 0.6 TYP 0 -8 TYP 0.2 SEATING PLANE 4214838/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. www.ti.com

EXAMPLE BOARD LAYOUT DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X (0.95) 2 (R0.05) TYP (2.1) LAND PATTERN EXAMPLE SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK 0.07 MAX 0.07 MIN ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214838/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBZ0003A SOT-23 - 1.12 mm max height SMALL OUTLINE TRANSISTOR PKG 3X (1.3) 1 3X (0.6) SYMM 3 2X(0.95) 2 (R0.05) TYP (2.1) SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X 4214838/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com

None

None

PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP (2.54) SEATING 2X NOTE 3 PLANE 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 3X 12.7 MIN 0.43 2X 0.55 3X 3X 0.35 2.6 0.2 0.38 2X 1.27 0.13 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION TO STRAIGHT LEAD OPTION 2.67 3X 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com

EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 FULL R TYP 0.05 MAX (1.07) ALL AROUND METAL 3X ( 0.85) HOLE TYP TYP 2X METAL (1.5) 2X (1.5) 2X SOLDER MASK OPENING 1 2 3 (R0.05) TYP 2X (1.07) (1.27) SOLDER MASK (2.54) OPENING LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ( 1.4) 2X ( 1.4) ALL AROUND METAL TYP 3X ( 0.9) HOLE METAL 2X (R0.05) TYP 1 2 3 SOLDER MASK OPENING (2.6) SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com

TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 9.75 8.5 8.50 19.0 17.5 2.9 6.75 3.7-4.3 TYP TYP 2.4 5.95 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com

IMPORTANTNOTICE TexasInstrumentsIncorporated(TI)reservestherighttomakecorrections,enhancements,improvementsandotherchangestoits semiconductorproductsandservicesperJESD46,latestissue,andtodiscontinueanyproductorserviceperJESD48,latestissue.Buyers shouldobtainthelatestrelevantinformationbeforeplacingordersandshouldverifythatsuchinformationiscurrentandcomplete. TI’spublishedtermsofsaleforsemiconductorproducts(http://www.ti.com/sc/docs/stdterms.htm)applytothesaleofpackagedintegrated circuitproductsthatTIhasqualifiedandreleasedtomarket.AdditionaltermsmayapplytotheuseorsaleofothertypesofTIproductsand services. ReproductionofsignificantportionsofTIinformationinTIdatasheetsispermissibleonlyifreproductioniswithoutalterationandis accompaniedbyallassociatedwarranties,conditions,limitations,andnotices.TIisnotresponsibleorliableforsuchreproduced documentation.Informationofthirdpartiesmaybesubjecttoadditionalrestrictions.ResaleofTIproductsorserviceswithstatements differentfromorbeyondtheparametersstatedbyTIforthatproductorservicevoidsallexpressandanyimpliedwarrantiesforthe associatedTIproductorserviceandisanunfairanddeceptivebusinesspractice.TIisnotresponsibleorliableforanysuchstatements. BuyersandotherswhoaredevelopingsystemsthatincorporateTIproducts(collectively,“Designers”)understandandagreethatDesigners remainresponsibleforusingtheirindependentanalysis,evaluationandjudgmentindesigningtheirapplicationsandthatDesignershave fullandexclusiveresponsibilitytoassurethesafetyofDesigners'applicationsandcomplianceoftheirapplications(andofallTIproducts usedinorforDesigners’applications)withallapplicableregulations,lawsandotherapplicablerequirements.Designerrepresentsthat,with respecttotheirapplications,Designerhasallthenecessaryexpertisetocreateandimplementsafeguardsthat(1)anticipatedangerous consequencesoffailures,(2)monitorfailuresandtheirconsequences,and(3)lessenthelikelihoodoffailuresthatmightcauseharmand takeappropriateactions.DesigneragreesthatpriortousingordistributinganyapplicationsthatincludeTIproducts,Designerwill thoroughlytestsuchapplicationsandthefunctionalityofsuchTIproductsasusedinsuchapplications. TI’sprovisionoftechnical,applicationorotherdesignadvice,qualitycharacterization,reliabilitydataorotherservicesorinformation, including,butnotlimitedto,referencedesignsandmaterialsrelatingtoevaluationmodules,(collectively,“TIResources”)areintendedto assistdesignerswhoaredevelopingapplicationsthatincorporateTIproducts;bydownloading,accessingorusingTIResourcesinany way,Designer(individuallyor,ifDesignerisactingonbehalfofacompany,Designer’scompany)agreestouseanyparticularTIResource solelyforthispurposeandsubjecttothetermsofthisNotice. TI’sprovisionofTIResourcesdoesnotexpandorotherwisealterTI’sapplicablepublishedwarrantiesorwarrantydisclaimersforTI products,andnoadditionalobligationsorliabilitiesarisefromTIprovidingsuchTIResources.TIreservestherighttomakecorrections, enhancements,improvementsandotherchangestoitsTIResources.TIhasnotconductedanytestingotherthanthatspecifically describedinthepublisheddocumentationforaparticularTIResource. Designerisauthorizedtouse,copyandmodifyanyindividualTIResourceonlyinconnectionwiththedevelopmentofapplicationsthat includetheTIproduct(s)identifiedinsuchTIResource.NOOTHERLICENSE,EXPRESSORIMPLIED,BYESTOPPELOROTHERWISE TOANYOTHERTIINTELLECTUALPROPERTYRIGHT,ANDNOLICENSETOANYTECHNOLOGYORINTELLECTUALPROPERTY RIGHTOFTIORANYTHIRDPARTYISGRANTEDHEREIN,includingbutnotlimitedtoanypatentright,copyright,maskworkright,or otherintellectualpropertyrightrelatingtoanycombination,machine,orprocessinwhichTIproductsorservicesareused.Information regardingorreferencingthird-partyproductsorservicesdoesnotconstitutealicensetousesuchproductsorservices,orawarrantyor endorsementthereof.UseofTIResourcesmayrequirealicensefromathirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,oralicensefromTIunderthepatentsorotherintellectualpropertyofTI. TIRESOURCESAREPROVIDED“ASIS”ANDWITHALLFAULTS.TIDISCLAIMSALLOTHERWARRANTIESOR REPRESENTATIONS,EXPRESSORIMPLIED,REGARDINGRESOURCESORUSETHEREOF,INCLUDINGBUTNOTLIMITEDTO ACCURACYORCOMPLETENESS,TITLE,ANYEPIDEMICFAILUREWARRANTYANDANYIMPLIEDWARRANTIESOF MERCHANTABILITY,FITNESSFORAPARTICULARPURPOSE,ANDNON-INFRINGEMENTOFANYTHIRDPARTYINTELLECTUAL PROPERTYRIGHTS.TISHALLNOTBELIABLEFORANDSHALLNOTDEFENDORINDEMNIFYDESIGNERAGAINSTANYCLAIM, INCLUDINGBUTNOTLIMITEDTOANYINFRINGEMENTCLAIMTHATRELATESTOORISBASEDONANYCOMBINATIONOF PRODUCTSEVENIFDESCRIBEDINTIRESOURCESOROTHERWISE.INNOEVENTSHALLTIBELIABLEFORANYACTUAL, DIRECT,SPECIAL,COLLATERAL,INDIRECT,PUNITIVE,INCIDENTAL,CONSEQUENTIALOREXEMPLARYDAMAGESIN CONNECTIONWITHORARISINGOUTOFTIRESOURCESORUSETHEREOF,ANDREGARDLESSOFWHETHERTIHASBEEN ADVISEDOFTHEPOSSIBILITYOFSUCHDAMAGES. UnlessTIhasexplicitlydesignatedanindividualproductasmeetingtherequirementsofaparticularindustrystandard(e.g.,ISO/TS16949 andISO26262),TIisnotresponsibleforanyfailuretomeetsuchindustrystandardrequirements. WhereTIspecificallypromotesproductsasfacilitatingfunctionalsafetyorascompliantwithindustryfunctionalsafetystandards,such productsareintendedtohelpenablecustomerstodesignandcreatetheirownapplicationsthatmeetapplicablefunctionalsafetystandards andrequirements.Usingproductsinanapplicationdoesnotbyitselfestablishanysafetyfeaturesintheapplication.Designersmust ensurecompliancewithsafety-relatedrequirementsandstandardsapplicabletotheirapplications.DesignermaynotuseanyTIproductsin life-criticalmedicalequipmentunlessauthorizedofficersofthepartieshaveexecutedaspecialcontractspecificallygoverningsuchuse. Life-criticalmedicalequipmentismedicalequipmentwherefailureofsuchequipmentwouldcauseseriousbodilyinjuryordeath(e.g.,life support,pacemakers,defibrillators,heartpumps,neurostimulators,andimplantables).Suchequipmentincludes,withoutlimitation,all medicaldevicesidentifiedbytheU.S.FoodandDrugAdministrationasClassIIIdevicesandequivalentclassificationsoutsidetheU.S. TImayexpresslydesignatecertainproductsascompletingaparticularqualification(e.g.,Q100,MilitaryGrade,orEnhancedProduct). Designersagreethatithasthenecessaryexpertisetoselecttheproductwiththeappropriatequalificationdesignationfortheirapplications andthatproperproductselectionisatDesigners’ownrisk.Designersaresolelyresponsibleforcompliancewithalllegalandregulatory requirementsinconnectionwithsuchselection. DesignerwillfullyindemnifyTIanditsrepresentativesagainstanydamages,costs,losses,and/orliabilitiesarisingoutofDesigner’snon- compliancewiththetermsandprovisionsofthisNotice. MailingAddress:TexasInstruments,PostOfficeBox655303,Dallas,Texas75265 Copyright©2017,TexasInstrumentsIncorporated