LM4030 www.ti.com SNVS552B–MARCH2008–REVISEDAPRIL2013 LM4030 SOT-23 Ultra-High Precision Shunt Voltage Reference CheckforSamples:LM4030 FEATURES DESCRIPTION 1 • HighOutputVoltageAccuracy0.05% The LM4030 is an ultra-high precision shunt voltage 2 reference, having exceptionally high initial accuracy • LowTemperatureCoefficient10ppm/°C (0.05%) and temperature stability (10ppm/°C). The • ExtendedTemperatureOperation-40-125°C LM4030 is available with fixed voltage options of 2.5V • ExcellentThermalHysteresis,75ppm and 4.096V. Despite the tiny SOT-23 package, the LM4030 exhibits excellent thermal hysteresis • ExcellentLong-TermStability,40ppm (75ppm) and long-term stability (40ppm) as well as • HighImmunitytoBoardStressEffects immunitytoboardstresseffects. • CapableofHandling50mATransients The LM4030 is designed to operate without an • VoltageOptions2.5V,4.096V external capacitor, but any capacitor up to 10µF may • SOT-23Package be used. The LM4030 can be powered off as little as 120µA (max) but is capable of shunting up to 30mA APPLICATIONS continuously. As with any shunt reference, the LM4030 can be powered off of virtually any supply • DataAcquisition/Signalpath and is a simple way to generate a highly accurate • TestandMeasurement systemreference. • Automotive&Industrial The LM4030 is available in three grades (A, B, and • Communications C). The best grade devices (A) have an initial accuracy of 0.05% with ensured temperature • Instrumentation coefficient of 10 ppm/°C or less, while the lowest • PowerManagement grade parts (C) have an initial accuracy of 0.15% and atemperaturecoefficientof30ppm/°C. Typical Application Circuit VIN IBIAS RZ ILOAD VREF 4 ISHUNT COUT 5 Connection Diagram N/C 1 5 - GND N/C or GND 2 N/C 3 4 + VREF SOT-23Package (TopView) 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©2008–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LM4030 SNVS552B–MARCH2008–REVISEDAPRIL2013 www.ti.com PINDESCRIPTIONS Pin# Name Function 1 N/C Noconnectpin,leavefloating 2 GND,N/C Groundornoconnect 3 N/C Noconnectpin,leavefloating 4 VREF Referencevoltsge 5 GND Ground Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. Absolute Maximum Ratings (1)(2) MaximumVoltageonanyinput -0.3to6V PowerDissipation(T =25°C) (3) 350mW A StorageTemperatureRange −65°Cto150°C LeadTemperature (soldering,10sec) 260°C VaporPhase(60sec) 215°C Infrared(15sec) 220°C ESDSusceptibility (4) HumanBodyModel 2kV (1) AbsoluteMaximumRatingsindicatelimitsbeyondwhichdamagemayoccurtothedevice.OperatingRatingsindicateconditionsfor whichthedeviceisintendedtobefunctional,butdonotensurespecificperformancelimits.Forensuredspecifications,seeElectrical Characteristics. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) WithoutPCBcopperenhancements.Themaximumpowerdissipationmustbede-ratedatelevatedtemperaturesandislimitedbyT JMAX (maximumjunctiontemperature),θ (junctiontoambientthermalresistance)andT (ambienttemperature).Themaximumpower J-A A dissipationatanytemperatureis:P =(T -T )/θ uptothevaluelistedintheAbsoluteMaximumRatings.θ forSOT-23 DissMAX JMAX A J-A J-A packageis220°C/W,T =125°C. JMAX (4) Thehumanbodymodelisa100pFcapacitordischargedthrougha1.5kΩresistorintoeachpin. Operating Ratings MaximumContinuousShuntCurrent 30mA MaximumShuntCurrent(<1s) 50mA JunctionTemperatureRange(T) −40°Cto+125°C J 2 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4030

LM4030 www.ti.com SNVS552B–MARCH2008–REVISEDAPRIL2013 Electrical Characteristics LM4030-2.5 (V = 2.5V) OUT LimitsinstandardtypeareforT =25°Conly,andlimitsinboldfacetypeapplyoverthejunctiontemperature(T)rangeof- J J 40°Cto+125°C.MinimumandMaximumlimitsareensuredthroughtest,design,orstatisticalcorrelation.Typicalvalues representthemostlikelyparametricnormatT =25°C,andareprovidedforreferencepurposesonly. J Symbol Parameter Conditions Min (1) Typ (2) Max (1) Unit V ReverseBreakdownVoltage I =120µA 2.5 V REF SHUNT ReverseBreakdownVoltageTolerance(I =120µA) SHUNT LM4030A-2.5 (AGrade-0.05%) -0.05 0.05 % LM4030B-2.5 (BGrade-0.10%) -0.10 0.10 % LM4030C-2.5 (CGrade-0.15%) -0.15 0.15 % I MinimumOperatingCurrent 120 µA RMIN TC TemperatureCoefficient (3) LM4030A-2.5 0°C≤T ≤+85°C 10 ppm/°C J -40°C≤T ≤+125°C 20 ppm/°C J LM4030B-2.5 -40°C≤T ≤+125°C 20 ppm/°C J LM4030C-2.5 -40°C≤T ≤+125°C 30 ppm/°C J ΔV /ΔI ReverseBreakdownVoltageChange 160µA≤I ≤30mA 25 110 ppm/mA REF SHUNT SHUNT withCurrent ΔV LongTermStability (4) 1000Hrs,T =30°C 40 ppm REF A V ThermalHysteresis (5) -40°C≤T ≤+125°C 75 ppm HYST J V OutputNoiseVoltage (6) 0.1Hzto10Hz 105 µV N PP (1) Limitsare100%productiontestedat25°C.LimitsovertheoperatingtemperaturerangeareensuredthroughcorrelationusingStatistical QualityControl. (2) Typicalnumbersareat25°Candrepresentthemostlikelyparametricnorm. (3) Temperaturecoefficientismeasuredbythe"Box"method;i.e.,themaximumΔV isdividedbythemaximumΔT. REF (4) LongtermstabilityisV @25°Cmeasuredduring1000hrs.ThismeasurementistakenforI =500µA. REF R (5) Thermalhysteresisisdefinedasthechangein+25°Coutputvoltagebeforeandaftercyclingthedevicefrom(-40°Cto125°C)eight times. (6) Lowfrequencypeak-to-peaknoisemeasuredusingfirst-order0.1HzHPFandsecond-order10HzLPF. Electrical Characteristics LM4030-4.096 (V = 4.096V) OUT LimitsinstandardtypeareforT =25°Conly,andlimitsinboldfacetypeapplyoverthejunctiontemperature(T)rangeof- J J 40°Cto+125°C.MinimumandMaximumlimitsareensuredthroughtest,design,orstatisticalcorrelation.Typicalvalues representthemostlikelyparametricnormatT =25°C,andareprovidedforreferencepurposesonly. J Symbol Parameter Conditions Min (1) Typ (2) Max (1) Unit V ReverseBreakdownVoltage I =130µA 4.096 V REF SHUNT ReverseBreakdownVoltageTolerance(I =130µA) SHUNT LM4030A-4.096 (AGrade-0.05%) -0.05 0.05 % LM4030B-4.096 (BGrade-0.10%) -0.10 0.10 % LM4030C-4.096 (CGrade-0.15%) -0.15 0.15 % I MinimumOperatingCurrent 130 µA RMIN TC TemperatureCoefficient (3) LM4030A-4.096 0°C≤T ≤+85°C 10 ppm/°C J -40°C≤T ≤+125°C 20 ppm/°C J LM4030B-4.096 -40°C≤T ≤+125°C 20 ppm/°C J LM4030C-4.096 -40°C≤T ≤+125°C 30 ppm/°C J ΔV /ΔI ReverseBreakdownVoltageChange 160µA≤I ≤30mA 15 95 ppm/mA REF LOAD SHUNT withCurrent (1) Limitsare100%productiontestedat25°C.LimitsovertheoperatingtemperaturerangeareensuredthroughcorrelationusingStatistical QualityControl. (2) Typicalnumbersareat25°Candrepresentthemostlikelyparametricnorm. (3) Temperaturecoefficientismeasuredbythe"Box"method;i.e.,themaximumΔV isdividedbythemaximumΔT. REF Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM4030

LM4030 SNVS552B–MARCH2008–REVISEDAPRIL2013 www.ti.com Electrical Characteristics LM4030-4.096 (V = 4.096V) (continued) OUT LimitsinstandardtypeareforT =25°Conly,andlimitsinboldfacetypeapplyoverthejunctiontemperature(T)rangeof- J J 40°Cto+125°C.MinimumandMaximumlimitsareensuredthroughtest,design,orstatisticalcorrelation.Typicalvalues representthemostlikelyparametricnormatT =25°C,andareprovidedforreferencepurposesonly. J Symbol Parameter Conditions Min (1) Typ (2) Max (1) Unit ΔV LongTermStability (4) 1000Hrs,T =30°C 40 ppm REF A V ThermalHysteresis (5) -40°C≤T ≤+125°C 75 ppm HYST J V OutputNoiseVoltage (6) 0.1Hzto10Hz 165 µV N PP (4) LongtermstabilityisV @25°Cmeasuredduring1000hrs.ThismeasurementistakenforI =500µA. REF R (5) Thermalhysteresisisdefinedasthechangein+25°Coutputvoltagebeforeandaftercyclingthedevicefrom(-40°Cto125°C)eight times. (6) Lowfrequencypeak-to-peaknoisemeasuredusingfirst-order0.1HzHPFandsecond-order10HzLPF. 4 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4030

LM4030 www.ti.com SNVS552B–MARCH2008–REVISEDAPRIL2013 Typical Performance Characteristics for 2.5V OutputVoltage vs Temperature 0.1-10HzPeak-to-PeakNoise 2.503 5 TYPICAL UNITS 2.502 )V ( E 2.501 G A T LO 2.5 V T U P 2.499 T U O 2.498 2.497 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (oC) Figure1. Figure2. StartUp-120µA StartUp-50mA Figure3. Figure4. ReverseDynamicImpedance vs ReverseBreakdownVoltageChangewithCurrent Frequency Figure5. Figure6. Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM4030

LM4030 SNVS552B–MARCH2008–REVISEDAPRIL2013 www.ti.com Typical Performance Characteristics for 4.096V OutputVoltage vs Temperature 0.1-10HzPeak-to-PeakNoise Figure7. Figure8. StartUp-130µA StartUp-50mA Figure9. Figure10. ReverseDynamicImpedance vs ReverseBreakdownVoltageChangewithCurrent Frequency Figure11. Figure12. 6 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4030

LM4030 www.ti.com SNVS552B–MARCH2008–REVISEDAPRIL2013 Typical Performance Characteristics ForwardCharacteristic LoadTransientResponse Figure13. Figure14. MinimumOperatingCurrent NoiseSpectrum Figure15. Figure16. OutputVoltage vs ThermalHysteresisDistribution ThermalCycle(-40°Cto125°C) 20 18 16 ST 14 IN U 12 F O R 10 E B 8 M UN 6 4 2 0 0 40 80 120 160 200 240 280 20 60 100 140 180 220 260 300 HYSTERESIS (PPM) Figure17. Figure18. Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM4030

LM4030 SNVS552B–MARCH2008–REVISEDAPRIL2013 www.ti.com Typical Performance Characteristics (continued) LongTermStability(T =25°C) LongTermStability(T =125°C) A A Figure19. Figure20. 8 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4030

LM4030 www.ti.com SNVS552B–MARCH2008–REVISEDAPRIL2013 APPLICATION INFORMATION THEORY OF OPERATION The LM4030 is an ultra-high precision shunt voltage reference, having exceptionally high initial accuracy (0.05%) and temperature stability (10ppm/°C). The LM4030 is available with fixed voltage options of 2.5V and 4.096V. Despite the tiny SOT-23 package, the LM4030 exhibits excellent thermal hysteresis (75ppm) and long-term stability (25ppm). The LM4030 is designed to operate without an external capacitor, but any capacitor up to 10 µF may be used. The LM4030 can be powered off as little as 120 µA (max) but is capable of shunting up to 30 mAcontinuously.ThetypicalapplicationcircuitfortheLM4030isshowninFigure21. VIN IBIAS RZ ILOAD VREF 4 ISHUNT COUT 5 Figure21. TypicalApplicationCircuit COMPONENT SELECTION A resistor must be chosen to set the maximum operating current for the LM4030 (R in Figure 21). The value of Z theresistorcanbecalculatedusingthefollowingequation: R =(V -V )/(I +I ) (1) Z IN REF MIN_OPERATING LOAD_MAX R is chosen such that the total current flowing through R is greater than the maximum load current plus the Z Z minimum operating current of the reference itself. This ensures that the reference is never starved for current. Running the LM4030 at higher currents is advantageous for reducing noise. The reverse dynamic impedance of the V node scales inversely with the shunted current (see Figure 22) leading to higher rejection of noise REF emanatingfromtheinputsupplyandfromEMI(electro-magneticinterferrence). Figure22. ReverseDynamicImpedancevsI OUT The LM4030 is designed to operate with or without a bypass capacitor (C in Figure 21) and is stable with OUT capacitors of up to 10 μF. The use of a bypass capacitor can improve transient response and reduce broadband noise. Additionally, a bypass capacitor will counter the rising reverse dynamic impedance at higher frequencies improvingnoiseimmunity(seeFigure23). Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM4030

LM4030 SNVS552B–MARCH2008–REVISEDAPRIL2013 www.ti.com Figure23. ReverseDynamicImpedancevsC OUT As with other regulators, an external capacitor reduces the amplitude of the V transient when a sudden REF change in loading takes place. The capacitor should be placed as close to the part as possible to reduce the effectsofunwantedboardparasitics. THERMAL HYSTERESIS Thermal hysteresis is the defined as the change in output voltage at 25°C after some deviation from 25°C. This is to say that thermal hysteresis is the difference in output voltage between two points in a given temperature profile.AnillustrativetemperatureprofileisshowninFigure24. 125oC VREF1 25oC Time VREF2 -40oC Figure24. IllustrativeTemperatureProfile Thismaybeexpressedanalyticallyasthefollowing: lV -V l V = REF1 REF2 x 106 ppm HYS V REF where • V =Thermalhysteresisexpressedinppm HYS • V =Nominalpresetoutputvoltage REF • V =V beforetemperaturefluctuation REF1 REF • V =V aftertemperaturefluctuation (2) REF2 REF The LM4030 features a low thermal hysteresis of 75 ppm (typical) from -40°C to 125°C after 8 temperature cycles. 10 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4030

LM4030 www.ti.com SNVS552B–MARCH2008–REVISEDAPRIL2013 TEMPERATURE COEFFICIENT Temperature drift is defined as the maximum deviation in output voltage over the temperature range. This deviationovertemperaturemaybeillustratedasshowninFigure25. Voltage VREF_MAX e g a olt V ut p ut Temperature n O e i g n a h C VREF_MIN Temperature Range Figure25. IllustrativeV vsTemperatureProfile REF Temperaturecoefficientmaybeexpressedanalyticallyasthefollowing: (V -V ) T = REF_MAX REF_MIN x 106 ppm D V x’T REF where • T =Temperaturedrift D • V =Nominalpresetoutputvoltage REF • V =Minimumoutputvoltageoveroperatingtemperaturerange REF_MIN • V =Maximumoutputvoltageoveroperatingtemperaturerange REF_MAX • ΔT=Operatingtemperaturerange (3) TheLM4030featuresalowtemperaturedriftof10ppm(max)to30ppm(max),dependingonthegrade. DYNAMIC OFFSET CANCELLATION AND LONG TERM STABILITY Aside from initial accuracy and drift performance, other specifications such as thermal hysteresis and long-term stability can affect the accuracy of a voltage reference, especially over the lifetime of the application. The reference voltage can also shift due to board stress once the part is mounted onto the PCB and during subsequent thermal cycles. Generally, these shifts in VREF arise due to offsets between matched devices within the regulation loop. Both passive and active devices naturally experience drift over time and stress and temperature gradients across the silicon die also generate offset. The LM4030 incorporates a dynamic offset cancellation scheme which compensates for offsets developing within the regulation loop. This gives the LM4030 excellent long-term stability (40 ppm typical) and thermal hysteresis performance (75ppm typical), as well as substantialimmunitytoPCBstresseffects,despitebeingpackagedinatinySOT-23. EXPRESSION OF ELECTRICAL CHARACTERISTICS Electrical characteristics are typically expressed in mV, ppm, or a percentage of the nominal value. Depending on the application, one expression may be more useful than the other. To convert one quantity to the other one mayapplythefollowing: ppmtomVerrorinoutputvoltage: V x ppm REF ERROR = V 103 ERROR where • V isinvolts(V)andV isinmilli-volts(mV) (4) REF ERROR Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM4030

LM4030 SNVS552B–MARCH2008–REVISEDAPRIL2013 www.ti.com Biterror(1bit)tovoltageerror(mV): V REF x 103 = V 2n ERROR (5) V isinvolts(V),V isinmilli-volts(mV),andnisthenumberofbits. REF ERROR mVtoppmerrorinoutputvoltage: V ERROR x 103 = ppm V ERROR REF where • V isinvolts(V)andV isinmilli-volts(mV) (6) REF ERROR Voltageerror(mV)topercentageerror(percent): V ERROR x 0.1= Percent_Error V REF where • V isinvolts(V)andV isinmilli-volts(mV) (7) REF ERROR PRINTED CIRCUIT BOARD and LAYOUT CONSIDERATIONS The LM4030 has a very small change in reverse voltage with current (25ppm/mA typical) so large variations in load current (up to 50mA) should not appreciably shift VREF. Parasitic resistance between the LM4030 and the load introduces a voltage drop proportional to load current and should be minimized. The LM4030 should be placed as close to the load it is driving as the layout will allow. The location of R is not important, but C Z OUT shouldbeasclosetotheLM4030aspossiblesoaddedESRdoesnotdegradethetransientperformance. 12 SubmitDocumentationFeedback Copyright©2008–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM4030

LM4030 www.ti.com SNVS552B–MARCH2008–REVISEDAPRIL2013 REVISION HISTORY ChangesfromRevisionA(April2013)toRevisionB Page • ChangedlayoutofNationalDataSheettoTIformat.......................................................................................................... 12 Copyright©2008–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM4030

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM4030AMF-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5JA & no Sb/Br) LM4030AMF-4.096/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5KA & no Sb/Br) LM4030AMFX-2.5/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5JA & no Sb/Br) LM4030BMF-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5JB & no Sb/Br) LM4030BMF-4.096/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5KB & no Sb/Br) LM4030BMFX-2.5/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5JB & no Sb/Br) LM4030BMFX4.096/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5KB & no Sb/Br) LM4030CMF-2.5/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5JC & no Sb/Br) LM4030CMF-4.096/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5KC & no Sb/Br) LM4030CMFX-2.5/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5JC & no Sb/Br) LM4030CMFX4.096/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 R5KC & no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM4030AMF-2.5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030AMF-4.096/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030AMFX-2.5/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030BMF-2.5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030BMF-4.096/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030BMFX-2.5/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030BMFX4.096/NOP SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 B LM4030CMF-2.5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030CMF-4.096/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030CMFX-2.5/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 LM4030CMFX4.096/NOP SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 B PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 24-Aug-2017 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM4030AMF-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030AMF-4.096/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030AMFX-2.5/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030BMF-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030BMF-4.096/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030BMFX-2.5/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030BMFX4.096/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030CMF-2.5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030CMF-4.096/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0 LM4030CMFX-2.5/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 LM4030CMFX4.096/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 0.1 C 1.75 1.45 1.45 B A 0.90 PIN 1 INDEX AREA 1 5 2X 0.95 3.05 2.75 1.9 1.9 2 4 3 0.5 5X 0.3 0.15 0.2 C A B (1.1) TYP 0.00 0.25 GAGE PLANE 0.22 TYP 0.08 8 TYP 0.6 0 0.3 TYP SEATING PLANE 4214839/E 09/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com

EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK SOLDER MASK METAL UNDER METAL OPENING OPENING SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MAX 0.07 MIN ARROUND ARROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAILS 4214839/E 09/2019 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM 2 (1.9) 2X(0.95) 3 4 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/E 09/2019 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. www.ti.com

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