LM392-N www.ti.com SNOSBT5D–APRIL1998–REVISEDMARCH2013 lm392-N Low Power Operational Amplifier/Voltage Comparator CheckforSamples:LM392-N FEATURES DESCRIPTION 1 • WidePowerSupplyVoltageRange The lm392-N series consists of 2 independent 2 building block circuits. One is a high gain, internally – SingleSupply:3Vto32V frequencycompensatedoperationalamplifier,andthe – DualSupply: ±1.5Vto ±16V other is a precision voltage comparator. Both the • LowSupplyCurrentDrain—Essentially operational amplifier and the voltage comparator IndependentofSupplyVoltage:600μA have been specifically designed to operate from a single power supply over a wide range of voltages. • LowInputBiasingCurrent:50nA Both circuits have input stages which will common- • LowInputOffsetVoltage:2mV mode input down to ground when operating from a • LowInputOffsetCurrent:5nA single power supply. Operation from split power supplies is also possible and the low power supply • InputCommon-ModeVoltageRangeIncludes current is independent of the magnitude of the supply Ground voltage. • DifferentialInputVoltageRangeEqualtothe Application areas include transducer amplifier with PowerSupplyVoltage pulseshaper,DCgainblockwithleveldetector,VCO, • ADDITIONALOPAMPFEATURES as well as all conventional operational amplifier or – InternallyFrequencyCompensatedfor voltage comparator circuits. Both circuits can be UnityGain operated directly from the standard 5 VDC power supply voltage used in digital systems, and the output – LargeDCVoltageGain: 100dB of the comparator will interface directly with either – WideBandwidth(UnityGain):1MHz TTL or CMOS logic. In addition, the low power drain – LargeOutputVoltageSwing:0VtoV+− makes the lm392-N extremely useful in the design of 1.5V portableequipment. • ADDITIONALCOMPARATORFEATURES – LowOutputSaturationVoltage:250mVat4 mA – OutputVoltageCompatiblewithallTypes ofLogicSystems ADVANTAGES • EliminatesNeedforDualPowerSupplies • AnInternallyCompensatedOpAmpanda PrecisionComparatorintheSamePackage • AllowsSensingatorNearGround • PowerDrainSuitableforBatteryOperation • Pin-OutistheSameasBoththeLM358Dual OpAmpandtheLM393DualComparator 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1998–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LM392-N SNOSBT5D–APRIL1998–REVISEDMARCH2013 www.ti.com Connection Diagram TopView (AmplifierA=Comparator) (AmplifierB=OperationalAmplifier) Figure1. SOICandPDIPPackages SeePackageNumbersD0008AandP0008E Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 2 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM392-N

LM392-N www.ti.com SNOSBT5D–APRIL1998–REVISEDMARCH2013 Absolute Maximum Ratings (1)(2) lm392-N SupplyVoltage,V+ 32Vor±16V DifferentialInputVoltage 32V InputVoltage −0.3Vto+32V PowerDissipation (3) MoldedDIP(LM392N) 820mW SmallOutlinePackage(LM392M) 530mW OutputShort-CircuittoGround (4) Continuous InputCurrent(V <−0.3V ) (5) 50mA IN DC OperatingTemperatureRange 0°Cto+70°C StorageTemperatureRange −65°Cto+150°C LeadTemperature(Soldering,10seconds) 260°C ESDratingtobedetermined. SolderingInformation Dual-in-LinePackage Soldering(10seconds) 260°C SmallOutlinePackage VaporPhase(60seconds) 215°C Infrared(15seconds) 220°C (1) “AbsoluteMaximumRatings”indicatelimitsbeyondwhichdamagetothedevicemayoccur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdonotensurespecificperformancelimits. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTexasInstrumentsSalesOffice/Distributorsforavailabilityand specifications. (3) Foroperatingattemperaturesabove25°C,thelm392-Nmustbederatedbasedona125°Cmaximumjunctiontemperatureanda thermalresistanceof122°C/Wwhichappliesforthedevicesolderedinaprintedcircuitboard,operatinginstillairambient.The dissipationisthetotalofbothamplifiers—useexternalresistors,wherepossible,toallowtheamplifiertosaturateortoreducethepower whichisdissipatedintheintegratedcircuit. (4) ShortcircuitsfromtheoutputtoV+cancauseexcessiveheatingandeventualdestruction.Whenconsideringshortcircuitstoground, themaximumoutputcurrentisapproximately40mAfortheopampand30mAforthecomparatorindependentofthemagnitudeofV+. Atvaluesofsupplyvoltageinexcessof15V,continuousshortcircuitscanexceedthepowerdissipationratingsandcauseeventual destruction. (5) Thisinputcurrentwillonlyexistwhenthevoltageatanyoftheinputleadsisdrivennegative.Itisduetothecollector-basejunctionof theinputPNPtransistorsbecomingforwardbiasedandtherebyactingasinputdiodeclamps.Inadditiontothisdiodeaction,thereis alsolateralNPNparasitictransistoractionontheICchip.Thistransistoractioncancausetheoutputvoltagesoftheamplifierstogoto theV+voltagelevel(ortogroundforalargeoverdrive)forthetimedurationthataninputisdrivennegative.Thisisnotdestructiveand normaloutputstateswillre-establishwhentheinputvoltage,whichwasnegative,againreturnstoavaluegreaterthan−0.3V(at25°C). Electrical Characteristics (V+=5V ;specificationsapplytobothamplifiersunlessotherwisestated) (1) DC lm392-N Parameter Conditions Units Min Typ Max InputOffsetVoltage T =25°C, (2) ±2 ±5 mV A InputBiasCurrent IN(+)orIN(−),T =25°C, (3),V =0V 50 250 nA A CM InputOffsetCurrent IN(+)−IN(−),T =25°C ±5 ±50 nA A InputCommon-ModeVoltageRange V+=30V ,T =25°C, (4) 0 V+−1.5 V DC A SupplyCurrent R =∞,V+=30V 1 2 mA L SupplyCurrent R =∞,V+=5V 0.5 1 mA L (1) ThesespecificationsapplyforV+=5V,unlessotherwisestated.Forthelm392-N,temperaturespecificationsarelimitedto0°C≤T ≤ A +70°C. (2) Atoutputswitchpoint,V ≃1.4V,R =0ΩwithV+from5Vto30V;andoverthefullinputcommon-moderange(0VtoV+−1.5V). O S (3) ThedirectionoftheinputcurrentisoutoftheICduetothePNPinputstage.Thiscurrentisessentiallyconstant,independentofthe stateoftheoutputsonoloadingchangeexistsontheinputlines. (4) Theinputcommon-modevoltageoreitherinputsignalvoltageshouldnotbeallowedtogonegativebymorethan0.3V.Theupperend ofthecommon-modevoltagerangeisV+−1.5V,buteitherorbothinputscangoto32Vwithoutdamage. Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM392-N

LM392-N SNOSBT5D–APRIL1998–REVISEDMARCH2013 www.ti.com Electrical Characteristics (continued) (V+=5V ;specificationsapplytobothamplifiersunlessotherwisestated)(1) DC lm392-N Parameter Conditions Units Min Typ Max Amplifier-to-AmplifierCoupling f=1kHzto20kHz,T =25°C,InputReferred, (5) −100 dB A InputOffsetVoltage (2) ±7 mV InputBiasCurrent IN(+)orIN(−) 400 nA InputOffsetCurrent IN(+)−IN(−) 150 nA InputCommon-ModeVoltageRange V+=30V , (4) 0 V+−2 V DC DifferentialInputVoltage KeepAllV 's≥0V (orV−,ifused) (6) 32 V IN DC OPAMPONLY LargeSignalVoltageGain V+=15V ,V swing=1V to11V ,R =2 25 100 V/mV DC o DC DC L kΩ,T =25°C A OutputVoltageSwing R =2kΩ,T =25°C 0 V+−1.5 V L A Common-ModeRejectionRatio DC,T =25°C,V =0,V toV+−1.5V 65 70 dB A CM DC DC PowerSupplyRejectionRatio DC,T =25°C 65 100 dB A OutputCurrentSource V =1V ,V =0V , VI+N=(+)15V D,CV I=N(2−)V ,TDC=25°C 20 40 mA DC o DC A OutputCurrentSink V =1V ,V =0V , 10 20 mA IN(−) DC IN(+) DC V+=15V ,V =2V ,T =25°C DC o DC A V =1V ,V =0V , 12 50 µA IN(−) DC IN(+) DC V+=15V ,V =200mV,T =25°C DC o A InputOffsetVoltageDrift R =0Ω 7 μV/°C S InputOffsetCurrentDrift R =0Ω 10 pA /°C S DC COMPARATORONLY VoltageGain R ≥15kΩ,V+=15V ,T =25°C 50 200 V/mV L DC A LargeSignalResponseTime(7) V =TTLLogicSwing,V =1.4V 300 ns IN REF DC V =5V ,R =5.1kΩ,T =25°C RL DC L A ResponseTime V =5V ,R =5.1kΩ,T =25°C 1.3 µs RL DC L A OutputSinkCurrent V =1V ,V =0V , 6 16 mA IN(−) DC IN(+) DC V ≥1.5V ,T =25°C O DC A SaturationVoltage V ≥1V ,V =0, 250 400 mV IN(−) DC IN(+) I ≤4mA,T =25°C SINK A V ≥1V ,V =0, 700 mV IN(−) DC IN(+) I ≤4mA SINK OutputLeakageCurrent V =0,V ≥1V , 0.1 nA IN(−) IN(+) DC V =5V ,T =25°C o DC A V =0,V ≥1V , 1.0 μA IN(−) IN(+) DC V =30V o DC (5) Duetoproximityofexternalcomponents,insurethatcouplingisnotoriginatingviathestraycapacitancebetweentheseexternalparts. Thistypicallycanbedetectedasthistypeofcapacitivecouplingincreasesathigherfrequencies. (6) Positiveexcursionsofinputvoltagemayexceedthepowersupplylevel.Aslongastheotherinputvoltageremainswithinthecommon- moderange,thecomparatorwillprovideaproperoutputstate.Theinputvoltagetotheopampshouldnotexceedthepowersupply level.Theinputvoltagestatemustnotbelessthan−0.3V(or0.3Vbelowthemagnitudeofthenegativepowersupply,ifused)oneither amplifier. (7) Theresponsetimespecifiedisfora100mVinputstepwith5mVoverdrive.Forlargeroverdrivesignals300nscanbeobtained. 4 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM392-N

LM392-N www.ti.com SNOSBT5D–APRIL1998–REVISEDMARCH2013 Schematic Diagram Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM392-N

LM392-N SNOSBT5D–APRIL1998–REVISEDMARCH2013 www.ti.com APPLICATION HINTS PleaserefertotheapplicationhintssectionoftheLM193andtheLM158datasheets. 6 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM392-N

LM392-N www.ti.com SNOSBT5D–APRIL1998–REVISEDMARCH2013 REVISION HISTORY ChangesfromRevisionC(March2013)toRevisionD Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 6 Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM392-N

PACKAGE OPTION ADDENDUM www.ti.com 19-Mar-2015 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM392M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM392 M LM392M/NOPB ACTIVE SOIC D 8 95 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 LM392 & no Sb/Br) M LM392MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM 0 to 70 LM392 & no Sb/Br) M LM392N/NOPB ACTIVE PDIP P 8 40 Green (RoHS CU SN Level-1-NA-UNLIM 0 to 70 LM & no Sb/Br) 392N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 19-Mar-2015 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2016 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM392MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2016 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM392MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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