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LM339PT产品简介:
ICGOO电子元器件商城为您提供LM339PT由STMicroelectronics设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 LM339PT价格参考¥2.12-¥2.42。STMicroelectronicsLM339PT封装/规格:线性 - 比较器, Comparator General Purpose CMOS, DTL, ECL, MOS, Open-Collector, TTL 14-TSSOP。您可以下载LM339PT参考资料、Datasheet数据手册功能说明书,资料中有LM339PT 详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | 集成电路 (IC)半导体 |
CMRR,PSRR(典型值) | - |
描述 | IC COMP QUAD CMOS MCRPWR 14TSSOP模拟比较器 Lo-Pwr Quad Voltage |
产品分类 | |
品牌 | STMicroelectronics |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 校验器 IC,STMicroelectronics LM339PT- |
数据手册 | |
产品型号 | LM339PT |
产品目录页面 | |
产品种类 | 模拟比较器 |
传播延迟(最大值) | - |
供应商器件封装 | 14-TSSOP |
偏转电压—最大值 | 5 mV |
元件数 | 4 |
其它名称 | 497-4048-6 |
其它有关文件 | http://www.st.com/web/catalog/sense_power/FM123/SC60/SS1089/PF63716?referrer=70071840 |
包装 | Digi-Reel® |
响应时间 | 1.3 us |
商标 | STMicroelectronics |
安装类型 | 表面贴装 |
安装风格 | SMD/SMT |
封装 | Reel |
封装/外壳 | 14-TSSOP(0.173",4.40mm 宽) |
封装/箱体 | TSSOP-14 |
工作温度 | 0°C ~ 70°C |
工厂包装数量 | 2500 |
最大功率耗散 | 710 mW |
最大工作温度 | + 70 C |
最小工作温度 | 0 C |
标准包装 | 1 |
滞后 | - |
电压-电源,单/双 (±) | 2 V ~ 32 V, ±1 V ~ 16 V |
电压-输入失调(最大值) | 5mV @ 30V |
电流-输入偏置(最大值) | 0.25µA @ 5V |
电流-输出(典型值) | 16mA @ 5V |
电流-静态(最大值) | 2.5mA |
电源电压-最大 | 36 V |
电源电压-最小 | 2 V |
电源电流 | 2 mA |
电源电流—最大值 | 2 mA |
类型 | 通用 |
系列 | LM339 |
输出电流—典型值 | 0.1 nA |
输出类型 | CMOS,DTL,ECL,MOS,开路集电极,TTL |
通道数量 | 4 Channel |
Datasheet S IGNATURE SERIES Comparators LM393xxx LM2903xx LM339xx LM2901xx General Description Key Specifications LM393xxx, LM2903xx, LM339xx, and LM2901xx Operating Supply Voltage: monolithic ICs integrate two or four independent Single Supply +2V to +36V comparator circuits on a single chip and feature high Dual Supply ±1V to ±18V gain, low power consumption, and an operating Supply Current: voltage range from 2V to 36V (single power supply). LM393xxx/LM2903xx 0.4mA (Typ) LM339xx/LM2901xx 1.1mA (Typ) Features Input Bias Current: 25nA (Typ) Input Offset Current: 5nA (Typ) Operable with a Single Power Supply Temperature Range: Wide Operating Supply Voltage Range LM393xx/LM339xxx -40°C to + 85°C Input / Output Ground Sense LM2903xx/LM2901xx -40°C to +125°C Low Supply Current Open Collector Wide Temperature Range Packages W(Typ) x D(Typ) x H(Max) SO Package8 4.90mm x 6.0mm x 1.55mm Application TSSOP8 3.00mm x 6.4mm x 1.10mm Consumer Electronics Mini SO8 3.00mm x 4.9mm x 0.95mm Current Sense Application SO Package14 8.65mm x 6.0mm x 1.55mm Battery Monitor TSSOP14 5.00mm x 6.4mm x 1.10mm Multivibrator Pin Configuration SO Package8: LM393DT (SOP-J8) LM393WDT OUTPUT 1 1 8 Vcc+ LM2903DT INVERTING 2 CH1 7 OUTPUT 2 TSSOP8: LM393PT INPUT 1 - ++ (TSSOP-B8) LM393WPT NON-INVERTING INVERTING LM2903PT 3 CH2 6 INPUT 1 + - INPUT 2 Mini SO8: LM393ST Vcc- 4 5 NON-INVERTING (TSSOP-B8J) INPUT 2 Pin Description LM393xxx/LM2903xx Pin No. Pin Name Function 1 OUTPUT 1 CH1 Output 2 INVERTING INPUT 1 CH1 Inverting Input 3 NON-INVERTING INPUT 1 CH1 Non-inverting Input 4 Vcc- Negative power supply 5 NON-INVERTING INPUT 2 CH2 Non-inverting Input 6 INVERTING INPUT 2 CH2 Inverting Input 7 OUTPUT 2 CH2 Output 8 Vcc+ Positive power supply ○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 1/34 6.July.2015 Rev.001 TSZ22111・14・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Pin Configuration SO Package14: LM339DT (SOP-J14) LM2901DT TSSOP14: LM339PT (TSSOP-B14J) LM2901PT OUTPUT 2 1 14 OUTPUT 3 OUTPUT 1 2 13 OUTPUT 4 Vcc+ 3 CH1 CH4 12 Vcc- - + - + INVERTING NON-INVERTING 4 11 INPUT 1 INPUT 4 NON-INVERTING 5 10 INVERTING INPUT 1 INPUT 4 INVERTING NON-INVERTING 6 9 INPUT 2 CH2 CH3 INPUT 3 - + - + NON-INVERTING INVERTING 7 8 INPUT 2 INPUT 3 Pin Description LM339xx/LM2901xx Pin No. Pin Name Function 1 OUTPUT 2 CH2 Output 2 OUTPUT 1 CH1 Output 3 Vcc+ Positive power supply 4 INVERTING INPUT 1 CH1 Inverting Input 5 NON-INVERTING INPUT 1 CH1 Non-inverting Input 6 INVERTING INPUT 2 CH2 Inverting Input 7 NON-INVERTING INPUT 2 CH2 Non-inverting Input 8 INVERTING INPUT 3 CH3 Inverting Input 9 NON-INVERTING INPUT 3 CH3 Non-inverting Input 10 INVERTING INPUT 4 CH4 Inverting Input 11 NON-INVERTING INPUT 4 CH4 Non-inverting Input 12 Vcc- Negative power supply 13 OUTPUT 4 CH4 Output 14 OUTPUT 3 CH3 Output www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 2/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Circuit Diagram Vcc+ OUTPUT NON-INVERTING INPUT INVERTING INPUT Vcc- Figure 1. Circuit Diagram (each channel) Absolute Maximum Ratings (T =25°C) A Ratings Parameter Symbol Unit LM393xxx LM339xx LM2903xx LM2901xx Supply Voltage Vcc+-Vcc- +36 V SO Package8 0.67(Note 1,6) - 0.67(Note 1,6) - TSSOP8 0.62(Note 2,6) - 0.62(Note 2,6) - Power Dissipation P Mini SO8 0.58(Note 3,6) - - - W D SO Package14 - 1.02(Note 4,6) - 1.02(Note 4,6) TSSOP14 - 0.84(Note 5,6) - 0.84(Note 5,6) Differential Input Voltage(Note 7) V +36 V ID Input Common-mode Voltage Range V (Vcc--0.3) to (Vcc-+36) V ICM Input Current(Note 8) II -10 mA +2.0 to +36.0 Operating Supply Voltage Vopr V (±1.0 to ±18.0) Operating Temperature Range Topr -40 to +85 -40 to +125 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax +150 °C Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (Note 1) To use at temperature above TA=25°C reduce 5.4mW. (Note 2) To use at temperature above TA=25°C reduce 5.0mW. (Note 3) To use at temperature above TA=25°C reduce 4.7mW. (Note 4) To use at temperature above TA=25°C reduce 8.2mW. (Note 5) To use at temperature above TA=25°C reduce 6.8mW. (Note 6) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm(Copper foil area less than 3%). (Note 7) The voltage difference between inverting input and non-inverting input is the differential input voltage. The input terminal voltage is set to more than Vcc-. (Note 8) An excessive input current will flow when input voltages of less than Vcc--0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 3/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Electric Characteristics ○LM393xxx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, T =25°C) A Temperature Limit Parameter Symbol Unit Conditions Range Min Typ Max 25°C - 1 7 Vcc+=5V to 30V, V =1.4V Input Offset Voltage (Note 9,10) VIO Full range - - 9 mV VICM=0 to 1.5V O 25°C - 5 50 Input Offset Current (Note 9,10) IIO nA VO=1.4V Full range - - 150 25°C - 25 250 Input Bias Current (Note 9,10) IIB nA VO=1.4V Full range - - 400 Vcc+=15V Large Signal Voltage Gain A 25°C 25 200 - V/mV V V =1.4V to 11.4V, R =15kΩ O L Supply Current (Note 10) 25°C - 0.4 1 Vcc+=5V, No Load I mA (All Comparators) CC Full range - 1 2.5 Vcc+=30V, No Load Input Common-mode 25°C 0 - Vcc+-1.5 V V - Voltage Range (Note 10) ICM Full range 0 - Vcc+-2.0 Output Saturation Voltage (Note 10) 25°C - 250 400 V mV V =-1V, I =4mA (Low Level Output Voltage) OL Full range - - 700 ID SINK Output Leakage Current (Note 10) 25°C - 0.1 - nA Vcc+=30V, V =1V I ID (High Level Output Current) LEAK Full range - - 1 μA VO=30V Output Sink Current (Note 10,11) I Full range 6 16 - mA V =-1V, V =1.5V SINK ID O R =5.1kΩ, V =5V L RL Small Signal Response Time 25°C - 1.3 - μs V =100mVp-p, t IN RE Overdrive=5mV R =5.1kΩ, V =5V Large Signal Response Time t 25°C - 300 - ns L RL REL V =TTL input, V =1.4V IN REF (Note 9) Absolute value (Note 10) Full range: T=-40°C to +85°C A (Note 11) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 4/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Electric Characteristics - continued ○LM339xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, T =25°C) A Temperature Limit Parameter Symbol Unit Conditions Range Min Typ Max 25°C - 1 7 Vcc+=5V to 30V, V =1.4V Input Offset Voltage (Note 12,13) VIO Full range - - 9 mV VICM=0 to 1.5V O 25°C - 5 50 Input Offset Current (Note 12,13) IIO nA VO=1.4V Full range - - 150 25°C - 25 250 Input Bias Current (Note 12,13) IIB nA VO=1.4V Full range - - 400 Vcc+=15V Large Signal Voltage Gain AV 25°C 25 200 - V/mV V =1.4V to 11.4V, R =15kΩ O L Supply Current (Note 13) 25°C - 1.1 2 Vcc+=5V, No Load (All Comparators) ICC Full range - 1.3 2.5 mA Vcc+=30V, No Load Input Common-mode 25°C 0 - Vcc+-1.5 Voltage Range (Note 13) VICM Full range 0 - Vcc+-2.0 V - Output Saturation Voltage (Note 13) 25°C - 250 400 (Low Level Output Voltage) VOL Full range - - 700 mV VID=-1V, ISINK=4mA Output Leakage Current (Note 13) 25°C - 0.1 - nA Vcc+=30V, V =1V (High Level Output Current) ILEAK Full range - - 1 μA VO=30V ID Output Sink Current (Note 13,14) ISINK Full range 6 16 - mA VID=-1V, VO=1.5V R =5.1kΩ, V =5V L RL Small Signal Response Time 25°C - 1.3 - μs V =100mVp-p, tRE OIvNerdrive=5mV R =5.1kΩ, V =5V Large Signal Response Time tREL 25°C - 300 - ns VL=TTL inpuRtL, V =1.4V IN REF (Note 12) Absolute value (Note 13) Full range: T=-40°C to +85°C A (Note 14) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 5/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Electric Characteristics - continued ○LM2903xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, T =25°C) A Temperature Limit Parameter Symbol Unit Conditions Range Min Typ Max 25°C - 2 7 Vcc+=5V to 30V, V =1.4V Input Offset Voltage (Note 15,16) VIO Full range - - 15 mV VICM=0 to 1.5V O 25°C - 5 50 Input Offset Current (Note 15,16) IIO nA VO=1.4V Full range - - 150 25°C - 25 250 Input Bias Current (Note 15,16) IIB nA VO=1.4V Full range - - 400 Vcc+=15V Large Signal Voltage Gain AV 25°C 25 200 - V/mV V =1.4V to 11.4V, R =15kΩ O L Supply Current (Note 16) 25°C - 0.4 1 Vcc+=5V, No Load (All Comparators) ICC Full range - 1 2.5 mA Vcc+=30V, No Load Input Common-mode 25°C 0 - Vcc+-1.5 Voltage Range (Note 16) VICM Full range 0 - Vcc+-2.0 V - Output Saturation Voltage (Note 16) 25°C - 250 400 (Low Level Output Voltage) VOL Full range - - 700 mV VID=-1V, ISINK=4mA Output Leakage Current (Note 16) 25°C - 0.1 - nA Vcc+=30V, V =1V (High Level Output Current) ILEAK Full range - - 1 μA VO=30V ID Output Sink Current (Note 16,17) ISINK Full range 6 16 - mA VID=-1V, VO=1.5V R =5.1kΩ, V =5V L RL Small Signal Response Time 25°C - 1.3 - μs V =100mVp-p, tRE OIvNerdrive=5mV RL=5.1kΩ, VRL=5V Large Signal Response Time tREL 25°C - - 1.0 μs VIN=TTL input, VREF=1.4V V at 95% O (Note 15) Absolute value (Note 16) Full range: T=-40°C to +125°C A (Note 17) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 6/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Electric Characteristics - continued ○LM2901xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, T =25°C) A Temperature Limit Parameter Symbol Unit Conditions Range Min Typ Max 25°C - 1 7 Vcc+=5V to 30V, V =1.4V Input Offset Voltage (Note 15,16) VIO Full range - - 15 mV VICM=0 to 1.5V O 25°C - 5 50 Input Offset Current (Note 15,16) IIO nA VO=1.4V Full range - - 150 25°C - 25 250 Input Bias Current (Note 15,16) IIB nA VO=1.4V Full range - - 400 Vcc+=15V Large Signal Voltage Gain AV 25°C 25 200 - V/mV V =1.4V to 11.4V, R =15kΩ O L Supply Current (Note 16) 25°C - 1.1 2 Vcc+=5V, No Load (All Comparators) ICC Full range - 1.3 2.5 mA Vcc+=30V, No Load Input Common-mode 25°C 0 - Vcc+-1.5 Voltage Range (Note 16) VICM Full range 0 - Vcc+-2.0 V - Output Saturation Voltage (Note 16) 25°C - 250 400 (Low Level Output Voltage) VOL Full range - - 700 mV VID=-1V, ISINK=4mA Output Leakage Current (Note 16) 25°C - 0.1 - nA Vcc+=30V, V =1V (High Level Output Current) ILEAK Full range - - 1 μA VO=30V ID Output Sink Current (Note 16,17) ISINK Full range 6 16 - mA VID=-1V, VO=1.5V R =5.1kΩ, V =5V L RL Small Signal Response Time 25°C - 1.3 - μs V =100mVp-p, tRE OIvNerdrive=5mV RL=5.1kΩ, VRL=5V Large Signal Response Time tREL 25°C - - 1.0 μs VIN=TTL input, VREF=1.4V V at 95% O (Note 18) Absolute value (Note 19) Full range: T=-40°C to +125°C A (Note 20) Consider the power dissipation of the IC under high temperature environment when selecting the output current value. There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 7/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Description of Electrical Characteristics Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or general document. 1. Absolute maximum ratings Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Supply Voltage (Vcc+/ Vcc-) Indicates the maximum voltage that can be applied between the positive power supply pin and negative power supply pin without deterioration or destruction of characteristics of internal circuit. (2) Differential Input Voltage (V ) ID Indicates the maximum voltage that can be applied between non-inverting and inverting pins without damaging the IC. (3) Input Common-mode Voltage Range (V ) ICM Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics. (4) Operating and storage temperature ranges (Topr, Tstg) The operating temperature range indicates the temperature range within which the IC can operate. The higher the ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics. (5) Power dissipation (PD) Indicates the power that can be consumed by the IC when mounted on a specific board at ambient temperature 25°C(normal temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the package (maximum junction temperature) and the thermal resistance of the package. 2. Electrical characteristics (1) Input Offset Voltage (V ) IO Indicates the voltage difference between non-inverting pin and inverting pins. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input Offset Current (I ) IO Indicates the difference of input bias current between the non-inverting and inverting pins. (3) Input Bias Current (I ) B Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the non-inverting and inverting pins. (4) Large Signal Voltage Gain (A ) V Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting pin and inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage. A = (Output Voltage) / (Differential Input Voltage) V (5) Supply Current (I ) CC Indicates the current that flows within the IC under specified no-load conditions. (6) Input Common-mode Voltage Range (V ) ICM Indicates the input voltage range where IC normally operates. (7) Output Saturation Voltage, Low Level Output Voltage (V ) OL Signifies the voltage range that can be output under specific output conditions. (8) Output Leakage Current, High Level Output Current (I ) LEAK Indicates the current that flows into the IC under specific input and output conditions. (9) Output Sink Current (I ) SINK Denotes the maximum current that can be output from the IC under specific output conditions. (10) Response Time (t ) RE Response time indicates the delay time between the input and output signal which is determined by the time difference from the fifty percent of input signal swing to the fifty percent of output signal swing. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 8/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves ○LM393xxx/LM2903xx 1.0 1.6 LM393DT 1.4 LM393WDT 0.8 1.2 n [W] LLMM339933WPTP T LM2903DT mA]1.0 atio0.6 nt [ wer Dissip0.4 LM2903PT pply Curre00..68 -40°C 25°C Po LM393ST Su 0.4 0.2 0.2 85°C 125°C 0.0 0.0 85 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 2. Power Dissipation vs Ambient Temperature Figure 3. Supply Current vs Supply Voltage (Derating Curve) 1.6 200 1.4 V] 1.2 m150 A] ge [ 125°C nt [m1.0 Volta 85°C urre0.8 on 100 C 36V ati 25°C upply 0.6 5V Satur S ut 0.4 utp 50 O -40°C 2V 0.2 0.0 0 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 4. Supply Current vs Ambient Temperature Figure 5. Output Saturation Voltage vs Supply Voltage (I =4mA) SINK (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393:-40°C to +85°C LM2903:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 9/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM393xxx/LM2903xx 200 2.0 1.8 mV]150 V] 1.6 e [ ge [ 1.4 ation Voltag100 2V ration Volta 11..02 125°C 25°C r u atu 5V Sat 0.8 85°C ut S 36V put 0.6 utp 50 Out -40°C O 0.4 0.2 0 0.0 -50 -25 0 25 50 75 100 125 150 0 2 4 6 8 10 12 14 16 18 20 Ambient Temperature [°C] Output Sink Current [mA] Figure 6. Output Saturation Voltage vs Figure 7. Output Saturation Voltage vs Ambient Temperature ( ISINK=4mA) Output Sink Current (Vcc+=5V) 40 8 6 30 4 A] V] m m Current [20 5V 36V Voltage [ 02 -40°C nk et 25°C 85°C 125°C utput Si 2V put Offs -2 O10 In -4 -6 0 -8 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 8. Output Sink Current vs Figure 9. Input Offset Voltage vs Supply Voltage Ambient Temperature (V =1.5V) O (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393:-40°C to +85°C LM2903:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 10/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM393xxx/LM2903xx 8 160 6 140 4 120 V] m A] ge [2 2V nt [n100 -40°C a e Volt0 Curr 80 set 5V 36V as ut Off-2 put Bi 60 25°C p n In-4 I 40 85°C 125°C -6 20 -8 0 -50 -25 0 25 50 75 100 125 150 0 5 10 15 20 25 30 35 Ambient Temperature [°C] Supply Voltage [V] Figure 10. Input Offset Voltage vs Figure 11. Input Bias Current vs Supply Voltage Ambient Temperature 160 50 40 140 30 120 nt [nA] 100 ent [nA] 1200 e r -40°C 25°C Curr 80 36V Cur 0 s et nput Bia 60 put Offs--2100 85°C 125°C I 40 In 5V -30 2V 20 -40 0 -50 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 12. Input Bias Current vs Figure 13. Input Offset Current vs Supply Voltage Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393:-40°C to +85°C LM2903:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 11/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM393xxx/LM2903xx 50 140 40 130 30 dB] 120 125°C 85°C A] 20 n [ ent [n 10 2V e Gai 110 r g ur a 25°C Offset C-100 5V 36V gnal Volt 10900 -40°C ut Si Inp-20 rge 80 a -30 L 70 -40 -50 60 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 14. Input Offset Current vs Figure 15. Large Signal Voltage Gain vs Ambient Temperature Supply Voltage 140 160 130 B]140 dB] 120 36V o [d n [ ati ai R120 G 110 n ge ctio 125°C olta 100 15V 5V eje100 85°C V 2V R al de ge Sign 8900 mon-mo 80 -40°C 25°C r a m L Co 60 70 60 40 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 16. Large Signal Voltage Gain vs Figure 17.Common-mode Rejection Ratio vs Ambient Temperature Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393:-40°C to +85°C LM2903:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 12/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM393xxx/LM2903xx 150 6 B] 125 4 d 25°C Ratio [ 100 36V mV] 2 -40°C 85°C n e [ o g ecti olta 125°C ej 75 5V V 0 e R 2V set od Off m mon- 50 Input -2 m Co 25 -4 0 -6 -50 -25 0 25 50 75 100 125 150 -1 0 1 2 3 4 5 Ambient Temperature [°C] Input Voltage [V] Figure 18. Common-mode Rejection Ratio vs Figure 19.Input Offset Voltage vs Input Voltage Ambient Temperature (Vcc+=5V) 200 5 180 Ratio [dB] 160 High) [μs]4 ejection 140 (Low to 3 R e ply 120 Tim2 ower Sup 100 esponse 1 125°C 85°C 25°C -40°C P 80 R 60 0 -50 -25 0 25 50 75 100 125 150 -100 -80 -60 -40 -20 0 Ambient Temperature [°C] Overdrive Voltage [mV] Figure 20.Power Supply Rejection Ratio vs Figure 21. Response Time (Low to High) vs AmbientTemperature Overdrive Voltage (Vcc+=5V, V =5V, R=5.1kΩ) RL L (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393:-40°C to +85°C LM2903:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 13/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM393xxx/LM2903xx 5 5 μs]4 μs] 4 High) [ Low) [ w to 3 h to 3 Lo Hig 125°C e ( e ( m m 85°C Ti2 5mV overdrive Ti2 se 20mV overdrive se 25°C n n -40°C o o esp1 100mV overdrive esp1 R R 0 0 -50 -25 0 25 50 75 100 125 150 0 20 40 60 80 100 Ambient Temperature [°C] Overdrive Voltage [mV] Figure 22. Response Time (Low to High) vs Figure 23. Response Time (High to Low) vs Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1kΩ) Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1kΩ) 5 s] 4 μ w) [ o L o h t3 g Hi 5mV overdrive e ( m Ti2 20mV overdrive e s n o 100mV overdrive p s e1 R 0 -50 -25 0 25 50 75 100 125 150 Ambient Temperature [°C] Figure 24. Response Time (High to Low) vs Ambient Temperature (Vcc+=5V, V =5V, R=5.1kΩ) RL L (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM393:-40°C to +85°C LM2903:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 14/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM339xx/LM2901xx 1.2 2.0 1.8 LM339DT 1.0 1.6 W] LM339PT 1.4 -40°C n [0.8 mA] 25°C atio LM2901DT nt [1.2 p e si0.6 urr1.0 wer Dis0.4 L M2901PT upply C0.8 o S0.6 P 0.4 0.2 85°C 125°C 0.2 0.0 0.0 85 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 25. Power Dissipation vs Ambient Temperature Figure 26.Supply Current vs Supply Voltage (Derating Curve) 2.0 200 1.8 1.6 V] m150 A]1.4 36V ge [ 125°C m a nt [1.2 Volt 85°C Curre1.0 5V ation 100 25°C ply 0.8 atur p S Su0.6 ut 0.4 2V Outp 50 -40°C 0.2 0.0 0 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 27.Supply Current vs Ambient Temperature Figure 28. Output Saturation Voltage vs Supply Voltage (I =4mA) SINK (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339:-40°C to +85°C LM2901:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 15/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM339xx/LM2901xx 200 2.0 1.8 mV]150 V] 1.6 ge [ age [ 1.4 125°C ation Volta100 2V ration Volt 11..02 25°C r u ut Satu 36V 5V put Sat 00..68 85°C utp 50 Out O 0.4 -40°C 0.2 0 0.0 -50 -25 0 25 50 75 100 125 150 0 2 4 6 8 10 12 14 16 18 20 Ambient Temperature [°C] Output Sink Current [mA] Figure 29. Output Saturation Voltage vs Figure 30. Output Saturation Voltage vs Ambient Temperature ( ISINK=4mA) Output Sink Current (Vcc+=5V) 40 8 6 30 4 A] V] m m Current [20 5V 36V Voltage [ 02 -40°C nk et 25°C 85°C 125°C utput Si 2V put Offs -2 O10 In -4 -6 0 -8 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 31. Output Sink Current vs Figure 32. Input Offset Voltage vs Supply Voltage Ambient Temperature (V =1.5V) O (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339:-40°C to +85°C LM2901:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 16/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM339xx/LM2901xx 8 160 6 140 4 120 mV] A] ge [2 2V nt [n100 -40°C a e olt urr V0 C 80 et 5V 36V s s a ut Off-2 put Bi 60 25°C p n In-4 I 40 85°C -6 20 125°C -8 0 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 33. Input Offset Voltage vs Figure 34. Input Bias Current vs Supply Voltage Ambient Temperature 160 50 40 140 30 120 nt [nA] 100 ent [nA] 1200 e r -40°C 25°C Curr 80 36V Cur 0 s et nput Bia 60 put Offs--2100 85°C 125°C I 40 In 5V -30 2V 20 -40 0 -50 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 35. Input Bias Current vs Figure 36. Input Offset Current vs Supply Voltage Ambient Temperature (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339:-40°C to +85°C LM2901:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 17/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM339xx/LM2901xx 50 140 40 130 30 dB] 120 125°C 85°C A] 20 n [ ent [n 10 e Gai 110 urr 2V ag 25°C C 0 olt 100 -40°C Offset -10 5V 36V nal V 90 g ut Si Inp-20 rge 80 a -30 L 70 -40 60 -50 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 37. Input Offset Current vs Figure 38. Large Signal Voltage Gain vs Ambient Temperature Supply Voltage 140 160 130 B] dB]140 e Gain [d 111200 36V on Ratio [120 Signal Voltag 10900 2V 15V 5V mode Rejecti100 85°C 125°C -40°C 25°C e n- 80 arg 80 mo L m 70 Co 60 60 40 -50 -25 0 25 50 75 100 125 150 0 10 20 30 40 Ambient Temperature [°C] Supply Voltage [V] Figure 39. Large Signal Voltage Gain vs Figure 40. Common-mode Rejection Ratio vs Ambient Temperature Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339:-40°C to +85°C LM2901:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 18/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM339xx/LM2901xx 150 6 B] 125 4 d 25°C n Ratio [ 100 36V e [mV] 2 -40°C 85°C o g ecti olta 125°C ej 75 V 0 e R 5V 2V set od Off mon-m 50 Input -2 m Co 25 -4 0 -6 -50 -25 0 25 50 75 100 125 150 -1 0 1 2 3 4 5 Ambient Temperature [°C] Input Voltage [V] Figure 41. Common-mode Rejection Ratio vs Figure 42. Input Offset Voltage vs Input Voltage Ambient Temperature (Vcc+=5V) 200 5 180 dB] μs]4 Ratio [ 160 High) [ Rejection 140 e (Low to 3 r Supply 110200 onse Tim2 e p 125°C 85°C w s 25°C -40°C o e1 P R 80 60 0 -50 -25 0 25 50 75 100 125 150 -100 -80 -60 -40 -20 0 Ambient Temperature [°C] Overdrive Voltage [mV] Figure 43. Power Supply Rejection Ratio vs Figure 44. Response Time (Low to High) vs Ambient Temperature Overdrive Voltage (Vcc+=5V, V =5V, R=5.1kΩ) RL L (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339:-40°C to +85°C LM2901:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 19/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Typical Performance Curves - continued ○LM339xx/LM2901xx 5 5 μs]4 μs] 4 High) [ Low) [ w to 3 h to 3 Lo Hig 125°C e ( e ( m m 85°C Ti2 Ti2 e 5mV overdrive e 25°C s 20mV overdrive s n n -40°C o o esp1 100mV overdrive esp1 R R 0 0 -50 -25 0 25 50 75 100 125 150 0 20 40 60 80 100 Ambient Temperature [°C] Overdrive Voltage [mV] Figure 45. Response Time (Low to High) vs Figure 46. Response Time (High to Low) vs Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1kΩ) Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1kΩ) 5 s] 4 μ w) [ o L o h t3 g Hi 5mV overdrive e ( m Ti2 20mV overdrive e ns 100mV overdrive o p s e1 R 0 -50 -25 0 25 50 75 100 125 150 Ambient Temperature [°C] Figure 47. Response Time (High to Low) vs Ambient Temperature (Vcc+=5V, V =5V, R=5.1kΩ) RL L (*)The above characteristics are measurements of typical sample, they are not guaranteed. LM339:-40°C to +85°C LM2901:-40°C to +125°C www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 20/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Application Information Measurement Circuit 1 NULL Method Measurement Condition Vcc+,Vcc-,E ,V unit:V K ICM Parameter VF SW1 SW2 SW3 Vcc+ Vcc- E V Calculation K ICM Input Offset Voltage VF1 ON ON ON 5 to 30 0 -1.4 0 1 Input Offset Current VF2 OFF OFF ON 5 0 -1.4 0 2 VF3 OFF ON 5 0 -1.4 0 Input Bias Current ON 3 VF4 ON OFF 5 0 -1.4 0 VF5 15 0 -1.4 0 Large Signal Voltage Gain ON ON ON 4 VF6 15 0 -11.4 0 -Calculation- |V | 1. Input Offset Voltage (VIO) VIO= 1+RF1/R [V] F S |V -V | F2 F1 2. Input Offset Current (IIO) IIO = R ×(1+R /R ) [A] I F S |V -V | F4 F3 3. Input Bias Current (IB) IB = 2 × R ×(1+R /R ) [A] I F S 10 × (1+R /R ) 4. Large Signal Voltage Gain (AV) AV =20Log F S [dB] |VF5-VF6| 0.1µF RF=50kΩ 500kΩ 0.1µF SW1 Vcc+ EK 15V RS=50Ω RI=10kΩ VO 500kΩ DUT NULL SW3 RS=50Ω RI=10kΩ 1000pF VICM RL VF SW2 50kΩ Vcc- VRL -15V Figure 48. Measurement Circuit 1 (each Comparator) www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 21/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Application Information - continued Measurement Circuit 2: Switch Condition SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7 Supply Current - ON OFF ON OFF OFF OFF OFF Output Sink Current V =1.5V ON OFF ON OFF ON ON OFF O Output Saturation Voltage I =4mA ON OFF ON OFF OFF OFF ON SINK Output Leakage Current V =36V ON OFF ON OFF OFF OFF ON O R =5.1kΩ L Response Time ON ON OFF ON OFF ON OFF V =5V RL Vcc+ A + - SW1 SW4 SW5 SW6 SW7 SW2 SW3 Vcc- RL A VIN+ VIN- V VRL VO Figure 49. Measurement C ircuit 2 (each Comparator) Input Voltage Input Voltage 1.5V 1.405V ∆ov=5mV V =1.4V REF Overdrive Voltage Overdrive Voltage V =1.4V REF ∆ov=5mV 1.3V t t Input wave Input wave Output Voltage Output Voltage Vcc+ Vcc+ Vcc+/2 Vcc+/2 0V 0V tR E( Low to High) tRE(High to Low) t Figure 50. Response Time www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 22/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Example of Circuit ○Reference voltage is V IN- IN Vcc+ V RL IN + RL VREF OUT - t Reference voltage VREF Vcc- OUT High When the input voltage is bigger than reference voltage, output voltage is high. When the input voltage is smaller than Low reference voltage, output voltage is low. t ○Reference voltage is V IN IN+ Vcc+ V V RL REF Reference + RL voltage OUT t VREF - IN OUT Vcc- High When the input voltage is smaller than reference voltage, output voltage is high. When the input voltage is bigger than Low reference voltage, output voltage is low. t www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 23/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Power Dissipation Power dissipation (total loss) indicates the power that the IC can consume at T =25°C (normal temperature). As the IC A consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and consumable power. Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold resin or lead frame of the package. Thermal resistance, represented by the symbol θ °C/W, indicates this heat dissipation JA capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance. Figure 51(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the Thermal resistance (θ ), given the ambient temperature (T ), maximum junction temperature (T ), and power dissipation JA A Jmax (P ). D θJA = (TJmax-TA) / PD °C/W The Derating curve in Figure 51(b) indicates the power that the IC can consume with reference to ambient temperature. Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal resistance (θ ), which depends on the chip size, power consumption, package, ambient temperature, package condition, JA wind velocity, etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 51(c) and (d) shows an example of the derating curve for LM393xxx, LM2903xx, LM339xx, and LM2901xx. Power dissipation of LSI [W] PDmax θJA=(TJmax-TA)/ PD °C/W P2 of IC θJA2 < θJA1 Ambient temperature TA [ °C ] on ssipati P1 θJA2 di wer o P TJmax θ JA1 0 25 50 75 100 125 150 Chip surface temperature TJ [ °C ] Ambient temperature TA [ °C ] (b) Derating Curve (a) Thermal Resistance 1.0 1.2 LM393DT(Note 21) LM339DT(Note 24) 0.8 LM393WDT(Note 21) 1.0 C] C] LM339PT(Note 25) pation [°0.6 LLMM339933LWPMTP(2NT9o(t0Ne o32t2eD) 2T2)( Note 21) pation [°0.8 L LMM22990011DPTT((NNoottee 2254)) ssi LM2903PT(Note 22) ssi0.6 Di0.4 Di er er 0.4 w w o LM393ST(Note 23) o P P 0.2 0.2 0.0 0.0 85 85 0 25 50 75 100 125 150 0 25 50 75 100 125 150 Ambient Temperature [°C] Ambient Temperature [°C] (c) LM393xxx/LM2903xx (d) LM339xx/LM2901xx (Note 21) (Note 22) (Note 23) (Note 24) (Note 25) Unit 5.4 5.0 4.7 8.2 6.8 mW/°C When using the unit above T=25°C, subtract the value above per Celsius degree. A Power dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted. Figure 51. Thermal Resistance and Derating Curve www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 24/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the PD rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 25/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Operational Notes – continued 11. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B B Pin B C Pin A E B C P+ P P+ P+ N P P+ N N N N Parasitic N N N E Element Parasitic P Substrate P Substrate Element GND GND GND GND Parasitic Parasitic Parasitic element Element Element or Transistor Figure 52. Example of Monolithic IC Structure 12. Unused Circuits When there are unused circuits it is recommended that they be connected as in Figure 53, setting the non-inverting input pin to a potential within the in-phase input voltage range (V ). ICM Vcc+ Please keep this potential in VICM + OPEN - V ICM Vcc- Figure 53. Disable Circuit Example 13. Input Voltage Applying Vcc- + 36V to the input pin is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common-mode input voltage range of the electric characteristics. 14. Power Supply (single/dual) The comparator operates when the specified voltage supplied is between Vcc+ and Vcc-. Therefore, the single supply comparator can be used as a dual supply comparator as well. 15. Terminal short-circuits When the output and Vcc+ pins are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently, destruction. 16. IC Handling Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 26/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Physical Dimension, Tape and Reel information Package Name SO Package8 (SOP-J8) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 27/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name TSSOP8 (TSSOP-B8) <Tape and Reel information> Tape Embossed carrier tape Quantity 3000pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 28/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name Mini SO8 (TSSOP-B8J) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 29/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name SO Package14 (SOP-J14) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 30/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Physical Dimension, Tape and Reel Information – continued Package Name TSSOP14 (TSSOP-B14J) <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs E2 Direction of feed (The direction is the 1pin of product is at the upper left when you hold ) reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 31/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Ordering Information L M x x x x x x T Part Number ESD Tolerance Package type Packaging and forming specification LM393DT applicable D : S.O package T: Embossed tape and reel LM393WDT W : 2kV P : SSOP LM393PT None : Normal S : Mini SO LM393WPT LM393ST LM339DT LM339PT LM2903DT LM2903PT LM2901DT LM2901PT Line-up Orderable Topr Channels ESD Package Part Number SO Package8 Reel of 2500 LM393DT Normal TSSOP8 Reel of 2500 LM393PT 2 Mini SO8 Reel of 2500 LM393ST -40°C to +85°C SO Package8 Reel of 2500 LM393WDT 2kV TSSOP8 Reel of 2500 LM393WPT SO Package14 Reel of 2500 LM339DT 4 Normal TSSOP14 Reel of 2500 LM339PT SO Package8 Reel of 2500 LM2903DT 2 TSSOP8 Reel of 2500 LM2903PT -40°C to +125°C Normal SO Package14 Reel of 2500 LM2901DT 4 TSSOP14 Reel of 2500 LM2901PT www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 32/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Marking Diagram SOP-J8(TOP VIEW) TTSSSSOOPP--BB88((TTOOPP VVIIEEWW)) PPaarrtt NNuummbbeerr MMaarrkkiinngg Part Number Marking LOT Number LLOOTT NNuummbbeerr 1PIN MARK 11PPIINN MMAARRKK TSSOP-B8J(TOP VIEW) SOP-J14(TOP VIEW) Part Number Marking Part Number Marking LOT Number LOT Number 1PIN MARK 1PIN MARK TSSOP-B14J (TOP VIEW) Part Number Marking LOT Number 1PIN MARK Product Name Package Type Marking DT SO Package8 (SOP-J8) PT TSSOP8 (TSSPO-B8) LM393 ST Mini SO8 (TSSOP-B8J) 393 WDT SO Package8 (SOP-J8) WPT TSSOP8 (TSSPO-B8) DT SO Package14 (SOP-J14) LM339 339 PT TSSOP14 (TSSOP-B14J) DT SO Package8 (SOP-J8) LM2903 2903 PT TSSOP8 (TSSPO-B8) DT SO Package14 (SOP-J14) LM2901 2901 PT TSSOP14 (TSSOP-B14J) www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 33/34 6.July.2015 Rev.001 TSZ22111・15・001
LM393xxx LM2903xx LM339xx LM2901xx Datasheet Land Pattern Data All dimensions in mm Land pitch Land space Land length Land width PKG e MIE ≥ℓ 2 b2 SO Package8 (SOP-J8) 1.27 3.90 1.35 0.76 SO Package14 (SOP-J14) TSSOP8 (TSSPO-B8) 0.65 4.60 1.20 0.35 TSSOP14 (TSSOP-B14J) Mini SO8 (TSSOP-B8J) 0.65 3.20 1.15 0.35 SOP-J8, TSSOP-B8, TSSOP-B8J, SOP-J14, TSSOP-B14J MIE e 2 b ℓ 2 Revision History Date Revision Changes 6.July.2015 001 New Release www.rohm.com TSZ02201-0RFR0G200530-1-2 © 2015 ROHM Co., Ltd. All rights reserved. 34/34 6.July.2015 Rev.001 TSZ22111・15・001
DDaattaasshheeeett Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.
DDaattaasshheeeett Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.
DDaattaasshheeeett General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sale s representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved.
Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: R OHM Semiconductor: LM2901PWR LM2903DGKR LM2903PT LM2903PWR LM339DR LM2903VQDR LM393DR LM393DT LM2903MX LM2903DT LM2903DR LM393MX LM393WDT LM339PWR LM2903VQPWR LM393PWR LM393DGKR LM2901PT LM393WPT LM2901DR LM393PT LM339PT LM2901VQPWR LM393ST LM2901MX LM2901VQDR LM2901DT LM339DT LM339MX