LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 LM118-N/lm218-N/LM318-N Operational Amplifiers CheckforSamples:LM118-N,LM218-N,LM318-N FEATURES DESCRIPTION 1 • 15MHzSmallSignalBandwidth The LM118 series are precision high speed 2 operational amplifiers designed for applications • Ensured50V/μsSlewRate requiring wide bandwidth and high slew rate. They • MaximumBiasCurrentof250nA feature a factor of ten increase in speed over general • OperatesfromSuppliesof±5Vto ±20V purposedeviceswithoutsacrificingDCperformance. • InternalFrequencyCompensation The LM118 series has internal unity gain frequency • InputandOutputOverloadProtected compensation. This considerably simplifies its application since no external components are • PinCompatiblewithGeneralPurposeOp necessary for operation. However, unlike most Amps internally compensated amplifiers, external frequency compensation may be added for optimum performance. For inverting applications, feedforward compensation will boost the slew rate to over 150V/μs and almost double the bandwidth. Overcompensation can be used with the amplifier for greater stability when maximum bandwidth is not needed. Further, a single capacitor can be added to reducethe0.1%settlingtimetounder1μs. The high speed and fast settling time of these op ampsmakethemusefulinA/Dconverters,oscillators, active filters, sample and hold circuits, or general purpose amplifiers. These devices are easy to apply and offer an order of magnitude better AC performance than industry standards such as the LM709. The LM218-N is identical to the LM118 except that the LM218-N has its performance specified over a −25°C to +85°C temperature range. The LM318-N is specifiedfrom0°Cto+70°C. Fast Voltage Follower Donothard-wireasvoltagefollower(R1≥5kΩ) 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1998–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LM118-N, LM218-N, LM318-N SNOSBS8C–MARCH1998–REVISEDMARCH2013 www.ti.com Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. Absolute Maximum Ratings(1)(2) SupplyVoltage ±20V PowerDissipation (3) 500mW DifferentialInputCurrent (4) ±10mA InputVoltage (5) ±15V OutputShort-CircuitDuration Continuous OperatingTemperatureRange lm118-n −55°Cto+125°C LM218-N −25°Cto+85°C LM318-N 0°Cto+70°C StorageTemperatureRange −65°Cto+150°C LeadTemperature(Soldering,10sec.) TO-99Package 300°C PDIPPackage 260°C SolderingInformation Dual-In-LinePackage Soldering(10sec.) 260°C SOICPackage VaporPhase(60sec.) 215°C Infrared(15sec.) 220°C ESDTolerance (6) 2000V (1) RefertoRETS118XforLM118HandLM118Jmilitaryspecifications. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityandspecifications. (3) Themaximumjunctiontemperatureofthelm118-nis150°C,theLM218-Nis110°C,andtheLM318-Nis110°C.Foroperatingat elevatedtemperatures,devicesintheLMCpackagemustbederatedbasedonathermalresistanceof160°C/W,junctiontoambient,or 20°C/W,junctiontocase.Thethermalresistanceofthedual-in-linepackageis100°C/W,junctiontoambient. (4) Theinputsareshuntedwithback-to-backdiodesforovervoltageprotection.Therefore,excessivecurrentwillflowifadifferentialinput voltageinexcessof1Visappliedbetweentheinputsunlesssomelimitingresistanceisused. (5) Forsupplyvoltageslessthan±15V,theabsolutemaximuminputvoltageisequaltothesupplyvoltage. (6) Humanbodymodel,1.5kΩinserieswith100pF. Electrical Characteristics (1) Parameter Conditions LM118-N/LM218-N LM318-N Units Min Typ Max Min Typ Max InputOffsetVoltage T =25°C 2 4 4 10 mV A InputOffsetCurrent T =25°C 6 50 30 200 nA A InputBiasCurrent T =25°C 120 250 150 500 nA A InputResistance T =25°C 1 3 0.5 3 MΩ A SupplyCurrent T =25°C 5 8 5 10 mA A LargeSignalVoltageGain T =25°C,V =±15V 50 200 25 200 V/mV A S V =±10V,R ≥2kΩ OUT L SlewRate T =25°C,V =±15V,A =1 (A2) S V 50 70 50 70 V/μs SmallSignalBandwidth T =25°C,V =±15V 15 15 MHz A S InputOffsetVoltage 6 15 mV InputOffsetCurrent 100 300 nA (1) Thesespecificationsapplyfor±5V≤V ≤±20Vand−55°C≤T ≤+125°C(lm118-n),−25°C≤T ≤+85°C(LM218-N),and0°C≤T ≤ S A A A +70°C(LM318-N).Also,powersuppliesmustbebypassedwith0.1μFdisccapacitors. (2) SlewrateistestedwithV =±15V.Thelm118-nisinaunity-gainnon-invertingconfiguration.V issteppedfrom−7.5Vto+7.5Vand S IN viceversa.Theslewratesbetween−5.0Vand+5.0Vandviceversaaretestedandspecifiedtoexceed50V/μs. 2 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 Electrical Characteristics (1) (continued) Parameter Conditions LM118-N/LM218-N LM318-N Units Min Typ Max Min Typ Max InputBiasCurrent 500 750 nA SupplyCurrent T =125°C 4.5 7 mA A LargeSignalVoltageGain V =±15V,V =±10V 25 20 V/mV S OUT R ≥2kΩ L OutputVoltageSwing V =±15V,R =2kΩ ±12 ±13 ±12 ±13 V S L InputVoltageRange V =±15V ±11.5 ±11. V S 5 Common-ModeRejectionRatio 80 100 70 100 dB SupplyVoltageRejectionRatio 70 80 65 80 dB Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N SNOSBS8C–MARCH1998–REVISEDMARCH2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS LM118-N,LM218-N InputCurrent VoltageGain Figure1. Figure2. PowerSupplyRejection InputNoiseVoltage Figure3. Figure4. CommonModeRejection SupplyCurrent Figure5. Figure6. 4 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) LM118-N,LM218-N ClosedLoopOutput Impedance CurrentLimiting Figure7. Figure8. InputCurrent UnityGainBandwidth Figure9. Figure10. VoltageFollowerSlewRate InverterSettlingTime Figure11. Figure12. Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N SNOSBS8C–MARCH1998–REVISEDMARCH2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) LM118-N,LM218-N LargeSignalFrequencyResponse OpenLoopFrequencyResponse Figure13. Figure14. VoltageFollowerPulseResponse LargeSignalFrequencyResponse Figure15. Figure16. OpenLoopFrequencyResponse InverterPulseResponse Figure17. Figure18. 6 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 Typical Performance Characteristics LM318-N InputCurrent VoltageGain Figure19. Figure20. PowerSupplyRejection InputNoiseVoltage Figure21. Figure22. CommonModeRejection SupplyCurrent Figure23. Figure24. Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N SNOSBS8C–MARCH1998–REVISEDMARCH2013 www.ti.com Typical Performance Characteristics (continued) LM318-N ClosedLoopOutputImpedance CurrentLimiting Figure25. Figure26. InputCurrent UnityGainBandwidth Figure27. Figure28. VoltageFollowerSlewRate InverterSettlingTime Figure29. Figure30. 8 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 Typical Performance Characteristics (continued) LM318-N LargeSignalFrequencyResponse OpenLoopFrequencyResponse Figure31. Figure32. VoltageFollowerPulseResponse LargeSignalFrequencyResponse Figure33. Figure34. OpenLoopFrequencyResponse InverterPulseResponse Figure35. Figure36. Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N SNOSBS8C–MARCH1998–REVISEDMARCH2013 www.ti.com AUXILIARY CIRCUITS Figure39. OffsetBalancing *Balancecircuitnecessaryforincreased slew. Slewratetypically150V/μs. Figure37. FeedforwardCompensation forGreaterInvertingSlewRate Figure40. IsolatingLargeCapacitiveLoads Figure41. Overcompensation Slewandsettlingtimeto0.1%fora10V stepchangeis800ns. Figure38. CompensationforMinimumSettling Time 10 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 TYPICAL APPLICATIONS Donothard-wireasvoltagefollower(R1≥5kΩ) Figure42. FastVoltageFollower C =Large F (C ≥50pF) F *Donothard-wireasintegratororslowinverter;inserta10k-5pFnetworkinserieswiththeinput,toprevent oscillation. Donothard-wireasvoltagefollower(R1≥5kΩ) Figure43. Figure45. DifferentialAmplifie Figure44. FastSummingAmplifier Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N SNOSBS8C–MARCH1998–REVISEDMARCH2013 www.ti.com Figure46. FastSampleandHold *Optional—Reducessettlingtime. Figure47. D/AConverterUsingLadderNetwork 12 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 ΔOutputzero. *“Y”zero +“X”zero ‡Fullscaleadjust. Figure48. FourQuadrantMultiplier *Optional—Reducessettlingtime. Figure49. D/AConverterUsingBinaryWeightedNetwork Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N SNOSBS8C–MARCH1998–REVISEDMARCH2013 www.ti.com Figure50. FastSummingAmplifierwithLowInputCurrent Figure51. WeinBridgeSineWaveOscillator Figure52. InstrumentationAmplifier 14 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 Schematic Diagram Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N SNOSBS8C–MARCH1998–REVISEDMARCH2013 www.ti.com Pin Diagram AvailableperJM38510/10107. Dual-In-LinePackage AvailableperJM38510/10107. (TopView) Dual-In-LinePackage SeePackageNumberJ(R-GDIP-T14) (TopView) SeePackageNumberNAB008A,D(R-PDSO-G8), orP(R-PDIP-T8) PinconnectionsshownonschematicdiagramandtypicalapplicationsareforTO-99package. TO-99Package (TopView) SeePackageNumberLMC(O-MBCY-W8) 16 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM118-N LM218-N LM318-N

LM118-N, LM218-N, LM318-N www.ti.com SNOSBS8C–MARCH1998–REVISEDMARCH2013 REVISION HISTORY ChangesfromRevisionB(March2013)toRevisionC Page • ChangedlayoutofNationalDataSheettoTIformat.......................................................................................................... 16 Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LM118-N LM218-N LM318-N

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM118H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM118H, LM118H) LM118H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS POST-PLATE Level-1-NA-UNLIM -55 to 125 ( LM118H, LM118H) & no Sb/Br) LM318M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 318M LM318M/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM 0 to 70 LM & no Sb/Br) 318M LM318MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM 0 to 70 LM & no Sb/Br) 318M LM318N/NOPB ACTIVE PDIP P 8 40 Green (RoHS SN Level-1-NA-UNLIM 0 to 70 LM & no Sb/Br) 318N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM318MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM318MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PackMaterials-Page2

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PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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