Product Sample & Technical Tools & Support & Reference Folder Buy Documents Software Community Design LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 LM2936 Ultra-Low Quiescent Current LDO Voltage Regulator 1 Features 3 Description • LM2936OperatingV rangeof5.5Vto40V The LM2936 ultra-low quiescent current regulator 1 IN features low dropout voltage and low current in the • LM2936HVOperatingV rangeof5.5Vto60V IN standby mode. With less than 15-μA quiescent • UltraLowQuiescentCurrent(IQ≤15 μAfor current at a 100-μA load, the LM2936 is ideally suited I =100μA) for automotive and other battery operated systems. OUT • Fixed3-V,3.3-Vor5-Vwith50-mAOutput The LM2936 retains all of the features that are common to low dropout regulators including a low • ±2%InitialOutputTolerance dropout PNP pass device, short circuit protection, • ±3%OutputToleranceOverLine,Load,and reverse battery protection, and thermal shutdown. Temperature The LM2936 has a 40-V maximum operating voltage • DropoutVoltageTypically200mVatI =50mA limit, a −40°C to 125°C operating temperature range, OUT and ±3% output voltage tolerance over the entire • –24-VInputVoltageProtection output current, input voltage, and temperature range. • –50-VInputTransientProtection The LM2936 is available in a TO-92 through-hole • InternalShortCircuitCurrentLimit package, as well as SOIC-8, VSSOP, SOT–223, and TO-252surfacemountpackages. • InternalThermalShutdownProtection • ShutdownPinAvailablewithLM2936BMPackage DeviceInformation(1) PARTNUMBER PACKAGE BODYSIZE(NOM) 2 Applications SOIC(8) 4.90mmx3.91mm • Automotive TO-252(3) 6.10mmx6.58mm • IndustrialControls LM2936 VSSOP(8) 3.00mmx3.00mm • PointofLoad SOT-223(4) 6.50mmx3.50mm TO-92(3) 4.30mmx4.30mm (1) For all available packages, see the orderable addendum at theendofthedatasheet. SimplifiedSchematic V IN OUT V IN OUT GND C C IN OUT 100 nF * 10 µF ** *Requiredifregulatorislocatedmorethan2″frompowersupplyfiltercapacitor. **Requiredforstability.SeeElectricalCharacteristicsfor3-VLM2936forrequiredvalues.Mustberatedover intendedoperatingtemperaturerange.Effectiveseriesresistance(ESR)iscritical,seeTypicalCharacteristics.Locate capacitorascloseaspossibletotheregulatoroutputandgroundpins.Capacitancemaybeincreasedwithoutbound. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectualpropertymattersandotherimportantdisclaimers.PRODUCTIONDATA.

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com Table of Contents 1 Features.................................................................. 1 7.3 FeatureDescription.................................................12 2 Applications........................................................... 1 7.4 DeviceFunctionalModes........................................13 3 Description............................................................. 1 8 ApplicationandImplementation........................ 14 4 RevisionHistory..................................................... 2 8.1 ApplicationInformation............................................14 8.2 TypicalApplication .................................................14 5 PinConfigurationandFunctions......................... 3 9 PowerSupplyRecommendations...................... 15 6 Specifications......................................................... 4 10 Layout................................................................... 16 6.1 AbsoluteMaximumRatings .....................................4 6.2 ESDRatings..............................................................4 10.1 LayoutGuidelines.................................................16 6.3 RecommendedOperatingConditions.......................4 10.2 LayoutExamples...................................................16 6.4 ThermalInformation..................................................4 10.3 ThermalConsiderations........................................16 6.5 ElectricalCharacteristicsfor3-VLM2936.................5 11 DeviceandDocumentationSupport................. 18 6.6 ElectricalCharacteristicsfor3.3-VLM2936..............6 11.1 DocumentationSupport........................................18 6.7 ElectricalCharacteristicsfor5-VLM2936.................7 11.2 Trademarks...........................................................18 6.8 TypicalCharacteristics..............................................8 11.3 ElectrostaticDischargeCaution............................18 7 DetailedDescription............................................ 12 11.4 Glossary................................................................18 7.1 Overview.................................................................12 12 Mechanical,Packaging,andOrderable Information........................................................... 18 7.2 FunctionalBlockDiagram.......................................12 4 Revision History NOTE:Pagenumbersforpreviousrevisionsmaydifferfrompagenumbersinthecurrentversion. ChangesfromRevisionN(March2013)toRevisionO Page • AddedPinConfigurationandFunctionssection,ESDRatingtable,FeatureDescriptionsection,DeviceFunctional Modes,ApplicationandImplementationsection,PowerSupplyRecommendationssection,Layoutsection,Device andDocumentationSupportsection,andMechanical,Packaging,andOrderableInformationsection .............................. 1 ChangesfromRevisionM(March2013)toRevisionN Page • ChangedlayoutofNationalDataSheettoTIformat........................................................................................................... 13 2 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

LM2936 www.ti.com SNOSC48O–JUNE2000–REVISEDDECEMBER2014 5 Pin Configuration and Functions LM2936DTTO-252(NDP)Package LM2936MPSOT-223(DCY)Package 3-Pins 4-Pins TopView TopView IN 1 IN 1 L L M M 2936D 4(T GANBD) GND 2 2936M 4(T GANBD) OUT 3 T OUT 3 P LM2936BMSOIC(D)Package LM2936MSOIC(D)Package 8-Pins 8-Pins TopView TopView OUT 1 8 IN OUT 1 8 IN GGNNDD 23 LM2936B 67 GGNNDD GGNNDD 23 LM2936M 67 GGNNDD M NC 4 5 SD NC 4 5 NC LM2936ZTO-92(LP)Package LM2936MMVSSOP(DGK)Package 3-Pins 8-Pins BottomView TopView OUT 1 OUT 1 L 8 IN M NC 2 2 7 GND GND 2 9 NC 3 36 6 NC IN 3 M NC 4 M 5 NC PinFunctions PIN D D I/O DESCRIPTION NAME NDP DGK DCY LP (LM2936BM) (LM2936M) IN 8 8 1 8 1 3 I Unregulatedinputvoltage. GND 2,3,6,7 2,3,6,7 4 7 2,4 2 — Ground. Regulatedoutputvoltage.Requiresaminimum OUT 1 1 3 1 3 1 O outputcapacitance,withspecificESR,onthispin tomaintainstability. Shutdown.LM2936BMonly.PullthispinHIGH(>2 V)toturntheoutputOFF.Ifthispinisleftopen, pulledlow(<0.6V),orconnectedtoGND,the SD 5 — — — — — I outputwillbeONbydefault.Avoidhavingany voltagebetween0.6Vand2Vonthispinasthe outputstatusmaynotbepredicableacrossthe operatingrange. Nointernalconnection,ConnecttoGND,orleave NC 4 4,5 — 2,3,4,5,6 — — — open. Copyright©2000–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM2936

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1)(2) MIN MAX UNIT Inputvoltage(survival) −50 60 V Powerdissipation (3) Internallylimited Junctiontemperature(T ) 150 JMAX °C Storagetemperature,T −65 150 stg (1) AbsoluteMaximumRatingsindicatelimitsbeyondwhichdamagetothedevicemayoccur.DCandACelectricalspecificationsdonot applywhenoperatingthedevicebeyonditsspecifiedoperatingratings. (2) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityandspecifications. (3) ThemaximumpowerdissipationisafunctionofT ,R ,andT .Themaximumallowablepowerdissipationatanyambient J(MAX) θJA A temperatureisP =(T −T )/R .Ifthisdissipationisexceeded,thedietemperaturecanriseabovetheT )of150°C,and D J(MAX) A θJA J(MAX theLM2936maygointothermalshutdown. 6.2 ESD Ratings VALUE UNIT V Electrostaticdischarge Human-bodymodel(HBM),perANSI/ESDA/JEDECJS-001(1) ±2000 V (ESD) (1) JEDECdocumentJEP155statesthat500-VHBMallowssafemanufacturingwithastandardESDcontrolprocess.. 6.3 Recommended Operating Conditions MIN MAX UNIT Temperature,T −40 125 °C J Inputvoltage,V ,LM2936 5.5 40 V IN Inputvoltage,V ,LM2936HVonly 5.5 60 V IN Shutdownpinvoltage,V ,LM2936BMonly 0 40 V SD 6.4 Thermal Information LM2936 THERMALMETRIC(1) SOIC(D) TO-252 VSSOP SOT-223 TO-92(LP) UNIT (NDP) (DGK) (DCY) 8PINS 3PINS 8PINS 4PINS 3PINS R Junction-to-ambientthermalresistance 111.4 50.5 173.4 62.8 156.8 θJA R Junction-to-case(top)thermalresistance 56.3 52.6 65.9 44.2 80.4 θJC(top) R Junction-to-boardthermalresistance 51.9 29.7 94.9 11.7 n/a θJB °C/W ψ Junction-to-topcharacterizationparameter 10.9 4.8 9.6 3.6 24.5 JT ψ Junction-to-boardcharacterizationparameter 51.4 29.3 93.3 11.6 136.0 JB R Junction-to-case(bottom)thermalresistance n/a 1.6 n/a n/a n/a θJC(bot) (1) Formoreinformationabouttraditionalandnewthermalmetrics,seetheICPackageThermalMetricsapplicationreport,SPRA953. 4 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

LM2936 www.ti.com SNOSC48O–JUNE2000–REVISEDDECEMBER2014 6.5 Electrical Characteristics for 3-V LM2936 V =14V,I =10mA,T =25°C,unlessotherwisespecified. IN OUT J PARAMETER TESTCONDITIONS MIN(1) TYP(2) MAX(1) UNIT 3-VLM2936HVONLY Outputvoltage 5.5V≤V ≤48V,100µA≤I ≤50mA,(2) IN OUT 2.91 3 3.09 V –40°C≤T ≤125°C J Lineregulation 6V≤V ≤60V,I =1mA 10 30 mV IN OUT ALL3-VLM2936 2.94 3 3.06 Outputvoltage 4V≤V ≤26V,100µA≤I ≤50mA,(2) 2.91 3.000 3.09 V IN OUT –40°C≤T ≤125°C J Quiescentcurrent I =100μA,8V≤V ≤24V 15 20 μA OUT IN I =10mA,8V≤V ≤24V 0.2 0.5 mA OUT IN I =50mA,8V≤V ≤24V 1.5 2.5 mA OUT IN Lineregulation 9V≤V ≤16V 5 10 IN mV 6V≤V ≤40V,I =1mA 10 30 IN OUT Loadregulation 100μA≤I ≤5mA 10 30 OUT mV 5mA≤I ≤50mA 10 30 OUT Dropoutvoltage I =100μA 0.05 0.1 V OUT I =50mA 0.20 0.40 V OUT Short-circuitcurrent V =0V 65 120 250 mA OUT Outputimpedance I =30mAdcand10mArms,ƒ=1000Hz 450 mΩ OUT Outputnoisevoltage 10Hz–100kHz 500 μV Long-termstability 20 mV/1000Hr Ripplerejection V =1V ,ƒ =120Hz −40 −60 dB ripple rms ripple Reversepolarity R =500Ω,t=1ms −50 L −80 V transientinputvoltage Outputvoltagewith V =−15V,R =500Ω IN L 0 −0.3 V reversepolarityinput MaximumLineTransient R =500Ω,V ≤3.3V,T=40ms 60 V L OUT Outputbypass C =22µF,0.1mA≤I ≤50mA OUT OUT 0.3 8 Ω capacitance(C )ESR OUT SHUTDOWNINPUT−3-VLM2936BMONLY Outputvoltage,V Outputoff,V =2.4V,R =500Ω 0 0.01 V OUT SD LOAD Shutdownhigh Outputoff,R =500Ω 2 1.1 V LOAD thresholdvoltage,V IH Shutdownlow Outputon,R =500Ω 1.1 0.6 V LOAD thresholdvoltage,V IL Shutdownhigh Outputoff,V =2.4V,R =500Ω 12 μA SD LOAD current,I IH Quiescentcurrent Outputoff,V =2.4V,R =500Ω, 30 μA SD LOAD includesI current IH (1) Datasheetmin/maxspecificationlimitsareensuredbydesign,test,orstatisticalanalysis. (2) Typicalsareat25°C(unlessotherwisespecified)andrepresentthemostlikelyparametricnorm. Copyright©2000–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM2936

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com 6.6 Electrical Characteristics for 3.3-V LM2936 V =14V,I =10mA,T =25°C,unlessotherwisespecified. IN OUT J PARAMETER TESTCONDITIONS MIN(1) TYP(2) MAX(1) UNIT 3.3-VLM2936HVONLY Outputvoltage 5.5V≤V ≤48V,100µA≤I ≤50mA,(3) IN OUT 3.201 3.300 3.399 V –40°C≤T ≤125°C J Lineregulation 6V≤V ≤60V,I =1mA 10 30 mV IN OUT ALL3.3-VLM2936 3.234 3.300 3.366 Outputvoltage 4V≤V ≤26V,100µA≤I ≤50mA,(3) 3.201 3.300 3.399 V IN OUT –40°C≤T ≤125°C J Quiescentcurrent I =100μA,8V≤V ≤24V 15 20 μA OUT IN I =10mA,8V≤V ≤24V 0.2 0.5 mA OUT IN I =50mA,8V≤V ≤24V 1.5 2.5 mA OUT IN Lineregulation 9V≤V ≤16V 5 10 IN mV 6V≤V ≤40V,I =1mA 10 30 IN OUT Loadregulation 100μA≤I ≤5mA 10 30 OUT mV 5mA≤I ≤50mA 10 30 OUT Dropoutvoltage I =100μA 0.05 0.10 V OUT I =50mA 0.2 0.4 V OUT Short-circuitcurrent V =0V 65 120 250 mA OUT Outputimpedance I =30mAdcand10mArms,ƒ=1000Hz 450 mΩ OUT Outputnoisevoltage 10Hz–100kHz 500 μV Long-termstability 20 mV/1000Hr Ripplerejection V =1V ,ƒ =120Hz −40 −60 dB ripple rms ripple Reversepolarity R =500Ω,T=1ms −50 L −80 V transientinputvoltage Outputvoltagewith V =−15V,R =500Ω IN L 0 −0.3 V reversepolarityinput maximumlinetransient R =500Ω,V ≤3.63V,T=40ms 60 V L OUT Outputbypass C =22µF,0.1mA≤I ≤50mA OUT OUT 0.3 8 Ω capacitance(C )ESR OUT SHUTDOWNINPUT−3.3-VLM2936BMONLY Outputvoltage,V Outputoff,V =2.4V,R =500Ω 0 0.01 V OUT SD LOAD Shutdownhigh Outputoff,R =500Ω 2 1.1 V LOAD thresholdvoltage,V IH Shutdownlow Outputon,R =500Ω 1.1 0.6 V LOAD thresholdvoltage,V IL Shutdownhigh Outputoff,V =2.4V,R =500Ω 12 μA SD LOAD current,I IH Quiescentcurrent Outputoff,V =2.4V,R =500Ω, 30 μA SD LOAD includesI current IH (1) Datasheetmin/maxspecificationlimitsareensuredbydesign,test,orstatisticalanalysis. (2) Typicalsareat25°C(unlessotherwisespecified)andrepresentthemostlikelyparametricnorm. (3) Toensureconstantjunctiontemperature,pulsetestingisused. 6 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

LM2936 www.ti.com SNOSC48O–JUNE2000–REVISEDDECEMBER2014 6.7 Electrical Characteristics for 5-V LM2936 V =14V,I =10mA,T =25°C,unlessotherwisespecified. IN OUT J PARAMETER TESTCONDITIONS MIN(1) TYP(2) MAX(1) UNIT 5-VLM2936HVONLY Outputvoltage 5.5V≤V ≤48V,100µA≤I ≤50mA,(3) IN OUT 4.85 5 5.15 V –40°C≤T ≤125°C J Lineregulation 6V≤V ≤60V,I =1mA 15 35 mV IN OUT ALL5-VLM2936 4.9 5 5.1 Outputvoltage 5.5V≤V ≤26V,100µA≤I ≤50mA,(3) 4.85 5 5.15 V IN OUT –40°C≤T ≤125°C J Quiescentcurrent I =100μA,8V≤V ≤24V 9 15 μA OUT IN I =10mA,8V≤V ≤24V 0.2 0.5 mA OUT IN I =50mA,8V≤V ≤24V 1.5 2.5 mA OUT IN Lineregulation 9V≤V ≤16V 5 10 IN mV 6V≤V ≤40V,I =1mA 10 30 IN OUT Loadregulation 100μA≤I ≤5mA 10 30 OUT mV 5mA≤I ≤50mA 10 30 OUT Dropoutvoltage I =100μA 0.05 0.1 V OUT I =50mA 0.2 0.4 V OUT Short-circuitcurrent V =0V 65 120 250 mA OUT Outputimpedance I =30mAdcand10mArms,ƒ=1000Hz 450 mΩ OUT Outputnoisevoltage 10Hz–100kHz 500 μV Long-termstability 20 mV/1000Hr Ripplerejection V =1V ,ƒ =120Hz −40 −60 dB ripple rms ripple Reversepolarity R =500Ω,T=1ms −50 L −80 V transientinputvoltage Outputvoltagewith V =−15V,R =500Ω IN L 0 −0.3 V reversepolarityinput Maximumlinetransient R =500Ω,V ≤5.5V,T=40ms 60 V L OUT Outputbypass C =10µF,0.1mA≤I ≤50mA OUT OUT 0.3 8 Ω capacitance(C )ESR OUT SHUTDOWNINPUT−5-VLM2936BMONLY Outputvoltage,V Outputoff,V =2.4V,R =500Ω 0 0.01 V OUT SD LOAD Shutdownhigh Outputoff,R =500Ω 2 1.1 V LOAD thresholdvoltage,V IH Shutdownlow Outputon,R =500Ω 1.1 0.6 V LOAD thresholdvoltage,V IL Shutdownhigh Outputoff,V =2.4V,R =500Ω 12 μA SD LOAD current,I IH Quiescentcurrent Outputoff,V =2.4V,R =500Ω, 30 μA SD LOAD includesI current IH (1) Datasheetmin/maxspecificationlimitsareensuredbydesign,test,orstatisticalanalysis. (2) Typicalsareat25°C(unlessotherwisespecified)andrepresentthemostlikelyparametricnorm. (3) Toensureconstantjunctiontemperature,pulsetestingisused. Copyright©2000–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM2936

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com 6.8 Typical Characteristics Figure1.MaximumPowerDissipation(TO-92) Figure2.DropoutVoltage Figure3.DropoutVoltage Figure4.QuiescentCurrent Figure5.QuiescentCurrent Figure6.QuiescentCurrent 8 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

LM2936 www.ti.com SNOSC48O–JUNE2000–REVISEDDECEMBER2014 Typical Characteristics (continued) Figure7.QuiescentCurrent Figure8.QuiescentCurrent 50 Figure9.5-VLM2936C ESR OUT Figure10.3-VLM2936C ESR OUT Figure11.3.3-VLM2936C ESR Figure12.PeakOutputCurrent OUT Copyright©2000–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLinks:LM2936

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com Typical Characteristics (continued) Figure13.PeakOutputCurrent Figure14.5-VLM2936CurrentLimit Figure15.5-VLM2936LineTransientResponse Figure16.5-VLM2936OutputatVoltageExtremes Figure17.5-VLM2936RippleRejection Figure18.5-VLM2936LoadTransientResponse 10 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

LM2936 www.ti.com SNOSC48O–JUNE2000–REVISEDDECEMBER2014 Typical Characteristics (continued) Figure19.5-VLM2936LowVoltageBehavior Figure20.5-VLM2936OutputImpedance Copyright©2000–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 11 ProductFolderLinks:LM2936

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com 7 Detailed Description 7.1 Overview The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby mode. With less than 15 μA quiescent current at a 100-μA load, the LM2936 is ideally suited for automotive and other battery operated systems. The LM2936 retains all of the features that are common to low dropout regulators including a low dropout PNP pass device, short circuit protection, reverse battery input protection, and thermal shutdown. The LM2936 has a 40-V maximum operating voltage limit, a −40°C to 125°C operating temperature range, and ±3% output voltage tolerance over the entire output current, input voltage, and temperaturerange. 7.2 Functional Block Diagram IN OUT PNP Current Thermal Limit Shutdown + Bandgap Reference LM2936 GND 7.3 Feature Description 7.3.1 HighInputOperatingVoltage Unlike namy other PNP low dropout regulators, the LM2936 remains fully operational with V = 40 V, and the IN LM2936HV remains fully operational with V = 60 V . Owing to power dissipation characteristics of the available IN packages,fulloutputcurrentcannotbeensuredforallcombinationsofambienttemperatureandinputvoltage. While the LM2936HV maintains regulation to 60 V, it will not withstand a short circuit to ground on the output when V is above 40 V because of safe operating area limitations in the internal PNP pass device. Above 60V IN the LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use this device in a design where the input operating voltage may exceed 40 V, or where transients are likely to exceed60V. 7.3.2 ThermalShutdown(TSD) The TSD circuitry of the LM2936 has been designed to protect the device against temporary thermal overload conditions. The TSD circuitry is not intended to replace proper heat-sinking. Continuously running the LM2936 device at TSD may degrade device reliability as the junction temperature will be exceeding the absolute maximum junction temperature rating. If the LM2936 goes into TSD mode, the output current will be shut off until the junction temperature falls approximately 10°C, then the output current will automatically be restored. The LM2936 will continuously cycle in and out of TSD until the condition is corrected. The LM2936 TSD junction temperatureistypically160°C. 12 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

LM2936 www.ti.com SNOSC48O–JUNE2000–REVISEDDECEMBER2014 Feature Description (continued) 7.3.3 Short-CircuitCurrentLimit The output current limiting circuitry of the LM2936 has been designed to limit the output current in cases where theloadimpedanceisunusuallylow.Thisincludessituationswheretheoutputmaybeshorteddirectlytoground. Continuous operation of the LM2936 at the current limit will typically result in the LM2936 transitioning into TSD mode. 7.3.4 Shutdown(SD)Pin The LM2936BM has a pin for shutting down the regulator output. Applying a Logic Level High (> 2 V) to the SD pin will cause the output to turn off. Leaving the SD pin open, connecting it to Ground, or applying a Logic Level Low(< 0.6V)willallowtheregulatoroutputtoturnon. 7.4 Device Functional Modes The LM2936 design does not include any undervoltage lockout (UVLO), or overvoltage shutdown (OVSD) functions. Generally, the output voltage will track the input voltage until the input voltage is greater than V + 1 OUT V. When the input voltage is greater than V + 1 V the LM2936 will be in linear operation, and the output OUT voltage will be regulated; however, the device will be sensitive to any small perturbation of the input voltage. Devicedynamicperformanceisimprovedwhentheinputvoltageisatleast2Vgreaterthantheoutputvoltage. Copyright©2000–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 13 ProductFolderLinks:LM2936

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validateandtesttheirdesignimplementationtoconfirmsystemfunctionality. 8.1 Application Information The LM2936 ultra-low quiescent current regulator features low dropout voltage and low current in the standby mode.TheLM2936hasa40-Vmaximumoperatingvoltagelimit,a −40°Cto125°Coperatingtemperaturerange, –24-Vinputvoltageprotectionand ±3%outputvoltagetoleranceovertheentireoutputcurrent,inputvoltage,and temperature range This following section presents a simplified discussion of the design process. Also the WEBENCH® software may be used to generate complete designs. When generating a design, WEBENCH utilizes iterative design procedure and accesses comprehensive databases of components. Please go to www.ti.com formoredetails. 8.2 Typical Application Figure 21 shows the typical application circuit for the LM2936. For the LM2936 5-V option, the output capacitor, C , must have a capacitance value of at least 10 µF with an equivalent series resistance (ESR) of at least 300 OUT mΩ, but no more than 8 Ω. For the LM2936 3.3-V and 3-V options, the output capacitor, C , must have a OUT capacitance value of at least 22 µF with an ESR of at least 300 mΩ, but no more than 8 Ω. The minimum capacitance value and the ESR requirements apply across the entire expected operating ambient temperature range. VIN IN OUT VOUT GND CIN COUT 100 nF * 10 µF ** *C isrequiredonlyiftheregulatorislocatedmorethan3inchesfromthepower-supply-filtercapacitors. IN **Requiredforstability.C mustbeatleast10µFfortheLM29365-Voption,andatleast22µFforthe3.3-Vand OUT 3-Voptions.Capacitancemustbemaintainedoverentireexpectedoperatingtemperaturerange,andlocatedasclose aspossibletotheregulator.TheESR,oftheC capacitormustatleast300mΩ,butnomorethan8Ω. OUT Figure21. LM2936TypicalApplication 8.2.1 DesignRequirements Table1.DesignParameters DESIGNPARAMETER EXAMPLEVALUE Outputvoltage 5V Inputvoltage 10Vto26V Outputcurrentrequirement 1mAto50mA Inputcapacitor 0.1µF Outputcapacitance 10µFminimum OutputcapacitorESRvalue 300mΩto8Ω 14 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

LM2936 www.ti.com SNOSC48O–JUNE2000–REVISEDDECEMBER2014 8.2.2 DetailedDesignProcedure 8.2.2.1 ExternalCapacitors The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both ESRandminimumamountofcapacitance. 8.2.2.1.1 MinimumCapacitance The minimum output capacitance required to maintain stability is at least 10 µF for the LM2936 5-V option, and at least 22 µF for the 3.3-V and 3-V options. This value may be increased without limit. Larger values of output capacitancewillgiveimprovedtransientresponse. 8.2.2.1.2 ESRLimits The ESR of the output capacitor will cause loop instability if it is too high, or too low. ESR, of the C capacitor OUT mustatleast300mΩ,butnomorethan8 Ω. 8.2.2.2 OutputCapacitorESR It is essential that the output capacitor meet the capacitance and ESR requirements, or oscillations can result. TheESRisusedwiththeoutputcapacitancein Ceramic capacitors (MLCC) can be used for C only if a series resistor is added to simulate the ESR OUT requirement. The ESR is not optional, it is mandatory. Typically, a 500-mΩ to 1-Ω series resistor is used for this purpose. When using ceramic capacitors, due diligence must be given to initial tolerances, capacitance derating due to applied DC voltage, and capacitance variations due to temperature. Dielectric types X5R and X7R are preferred. 8.2.3 ApplicationCurve Figure22. LM2936V vs.V OUT IN 9 Power Supply Recommendations This device is designed to operate from an input supply voltage from at least V + 1 V up to a maximum of 40 OUT V. The input supply should be well regulated and free of spurious noise. To ensure that the LM2936 output voltage is well regulated the input supply should be at least V + 2 V. A capacitor at the IN pin may not be OUT specifically required if the bulk input supply filter capacitors are within three inches of the IN pin, but adding one willnotbedetrimentaltooperation. While the LM2936 maintains regulation to V = 60 V, it will not withstand a short circuit on the output with V IN IN above 40 V because of safe operating area limitations in the internal PNP pass device. With V above 60 V the IN LM2936 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use this deviceinadesignwheretheinputoperatingvoltage,includingtransients,islikelytoexceed60V. Copyright©2000–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 15 ProductFolderLinks:LM2936

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com 10 Layout 10.1 Layout Guidelines The dynamic performance of the LM2936 is dependent on the layout of the PCB. PCB layout practices that are adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LM2936. Best performance is achieved by placing C and C on the same side of the PCB as the LM2936, and as close as IN OUT is practical to the package. The ground connections for C and C should be back to the LM2936 ground pin IN OUT usingaswide,andasshort,ofacoppertraceasispractical. Connections using long trace lengths, narrow trace widths, and/or connections through vias should be avoided as these will add parasitic inductances and resistances that will give inferior performance, especially during transientconditions 10.2 Layout Examples V 5 4 SD 6 3 GND C C OUT GND IN 7 2 V 8 1 V IN OUT Figure23. LM2936BMSOIC(D)Layout 5 4 6 3 GND GND 7 2 V 8 1 V IN OUT Figure24. LM2936MSOIC(D)Layout Thermal Vias 4 GND CIN 1 3 COUT GND V V IN OUT Figure25. LM2936TO-252(NDP)Layout 10.3 Thermal Considerations Due to the power dissipation characteristics of the available packages (R ), full output current cannot be θJA ensuredforallcombinationsofambienttemperatureandinputvoltage. Exceeding the maximum allowable power dissipation as defined by the final package R will cause excessive θJA diejunctiontemperature,andtheregulatormaygointothermalshutdown. Powerdissipation,P ,iscalculatedfromthefollowingformula: D P =((V –V )×I )+(V ×I ) (1) D IN OUT OUT IN GND 16 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

LM2936 www.ti.com SNOSC48O–JUNE2000–REVISEDDECEMBER2014 Thermal Considerations (continued) space VIN IIN = IGND + IOUT IOUT VOUT IN OUT GND LOAD C IN I COUT GND Figure26. CurrentPathsforPowerDissipationCalculation Knowing the power dissipation (P ), the thermal resistance of the package (R ), and the ambient temperature D θJA (T ),thejunctiontemperature(T )canbeestimatedusingthefollowingformula: A J T =(P ×R )+T (2) J D θJA A Knowing the thermal resistance of the package (R ), the ambient temperature (T ), and the maximum allowed θJA A operating junction temperature (T ) of 125°C, the maximum power dissipation can be estimated using the J followingformula: P =(125°C–T )/R (3) D(MAX) A θJA Alternately,solvingfortherequiredthermalresistance(R ): θJA R =(125°C–T )/P (4) θJA A D(MAX) The maximum allowed P information from Equation 3 can be used to estimate the maximum allowed load D current(I ),orthemaximumallowed : OUT VIN V =(P /I )+V (5) IN(MAX) D(MAX) OUT OUT I =(P /(V –V )) (6) OUT(MAX) D(MAX) IN OUT As an example, an application requires : V = 14 V, V = 5 V, I = 25 mA, and T = 85°C. Find the IN OUT OUT A maximumR tokeepthejunctiontemperatureunder125°C. θJA R ≤(125°C–T )/P (7) θJA A D(MAX) R ≤(125°C–85°C)/((14V–5V)×0.025A) (8) θJA R ≤40°C/0.225W (9) θJA R ≤177°C/W (10) θJA TheEIA/JEDECstandard(JESD51-2)providesmethodologiestoestimatethejunctiontemperaturefromexternal measurements (Ψ references the temperature at the PCB, and Ψ references the temperature at the top JB JT surface of the package) when operating under steady-state power dissipation conditions. These methodologies havebeendeterminedtoberelativelyindependentofthecopperthermalspreadingareathatmaybeattachedto the package DAP when compared to the more typical R . Refer to Texas Instruments Application Report θJA SemiconductorandICPackageThermalMetrics(SPRA953),forspecifics. On the 8-pin SOIC (D) package, the four ground pins are thermally connected to the backside of the die. Adding approximately 0.04 square inches of 2 oz. copper pad area to these four pins will improve the JEDEC R rating θJA from 111.4°C/W to approximately 100°C/W. If this extra copper area is placed directly beneath the SOIC packagethereshouldnotbeanyimpactonboarddensity. The LM2936 has an internally set thermal shutdown point of typically 160°C. Thermal shutdown is outside the ensured operating temperature range and is intended as a safety feature only. Continuous operation near the thermalshutdowntemperatureshouldbeavoidedasitmayhaveanegativeaffectonthelifeofthedevice. Copyright©2000–2014,TexasInstrumentsIncorporated SubmitDocumentationFeedback 17 ProductFolderLinks:LM2936

LM2936 SNOSC48O–JUNE2000–REVISEDDECEMBER2014 www.ti.com 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 RelatedDocumentation Forrelateddocumentationseethefollowing: TexasInstrumentsApplicationReportSemiconductorandICPackageThermalMetrics(SPRA953) 11.2 Trademarks WEBENCHisaregisteredtrademarkofTexasInstruments. Allothertrademarksarethepropertyoftheirrespectiveowners. 11.3 Electrostatic Discharge Caution Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 11.4 Glossary SLYZ022—TIGlossary. Thisglossarylistsandexplainsterms,acronyms,anddefinitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of thisdocument.Forbrowser-basedversionsofthisdatasheet,refertotheleft-handnavigation. 18 SubmitDocumentationFeedback Copyright©2000–2014,TexasInstrumentsIncorporated ProductFolderLinks:LM2936

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM2936BM-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6B3.3 LM2936BM-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6B5.0 LM2936BMX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6B3.3 LM2936BMX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6B5.0 LM2936DT-3.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS SN Level-2-260C-1 YEAR -40 to 125 LM2936D & no Sb/Br) T-3.0 LM2936DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS SN Level-2-260C-1 YEAR -40 to 125 LM2936D & no Sb/Br) T-3.3 LM2936DT-5.0 NRND TO-252 NDP 3 75 TBD Call TI Call TI -40 to 125 LM2936D T-5.0 LM2936DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS SN Level-2-260C-1 YEAR -40 to 125 LM2936D & no Sb/Br) T-5.0 LM2936DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS SN Level-2-260C-1 YEAR -40 to 125 LM2936D & no Sb/Br) T-3.3 LM2936DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS SN Level-2-260C-1 YEAR -40 to 125 LM2936D & no Sb/Br) T-5.0 LM2936HVBMA-3.3 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H BM3.3 LM2936HVBMA-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 2936H & no Sb/Br) BM3.3 LM2936HVBMA-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H BM5.0 LM2936HVBMA-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 2936H & no Sb/Br) BM5.0 LM2936HVBMAX3.3 NRND SOIC D 8 2500 TBD Call TI Call TI 2936H BM3.3 LM2936HVBMAX3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM 2936H & no Sb/Br) BM3.3 LM2936HVBMAX5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM 2936H & no Sb/Br) BM5.0 Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM2936HVMA-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 2936H M-5.0 LM2936HVMA-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 2936H & no Sb/Br) M-5.0 LM2936HVMAX-5.0 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 2936H M-5.0 LM2936HVMAX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 2936H & no Sb/Br) M-5.0 LM2936M-3.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6M-3 LM2936M-3.3 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LM293 6-3.3 LM2936M-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6-3.3 LM2936M-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LM293 6M-5 LM2936M-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6M-5 LM2936MM-3.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KBC & no Sb/Br) LM2936MM-3.3 NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 KBB LM2936MM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KBB & no Sb/Br) LM2936MM-5.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KBA & no Sb/Br) LM2936MMX-3.3/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KBB & no Sb/Br) LM2936MMX-5.0 NRND VSSOP DGK 8 3500 TBD Call TI Call TI -40 to 125 KBA LM2936MMX-5.0/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KBA & no Sb/Br) LM2936MP-3.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS SN Level-1-260C-UNLIM KACA & no Sb/Br) LM2936MP-3.3 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 KABA LM2936MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KABA & no Sb/Br) LM2936MP-5.0 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 KAAA Addendum-Page 2

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM2936MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KAAA & no Sb/Br) LM2936MPX-3.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KACA & no Sb/Br) LM2936MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KABA & no Sb/Br) LM2936MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 KAAA & no Sb/Br) LM2936MX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6-3.3 LM2936MX-5.0 NRND SOIC D 8 2500 TBD Call TI Call TI -40 to 125 LM293 6M-5 LM2936MX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM -40 to 125 LM293 & no Sb/Br) 6M-5 LM2936Z-3.3/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN N / A for Pkg Type -40 to 125 LM2936 & no Sb/Br) Z-3.3 LM2936Z-5.0/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS SN N / A for Pkg Type LM293 & no Sb/Br) 6Z-5 LM2936Z-5.0/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS SN N / A for Pkg Type LM293 & no Sb/Br) 6Z-5 LM2936Z-5.0/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS SN N / A for Pkg Type LM293 & no Sb/Br) 6Z-5 LM2936Z-5.0/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS SN N / A for Pkg Type -40 to 125 LM293 & no Sb/Br) 6Z-5 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. Addendum-Page 3

PACKAGE OPTION ADDENDUM www.ti.com 6-Feb-2020 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM2936BMX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936BMX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM2936DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM2936HVBMAX3.3 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936HVBMAX3.3/NOP SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 B LM2936HVBMAX5.0/NOP SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 B LM2936HVMAX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936HVMAX-5.0/NOP SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 B LM2936MM-3.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MM-3.3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MM-5.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MMX-3.3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MMX-5.0 VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2936MMX-5.0/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM2936MP-3.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MP-3.3 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MP-5.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MPX-3.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3 LM2936MX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936MX-5.0 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM2936MX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM2936BMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2936BMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2936DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM2936DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM2936HVBMAX3.3 SOIC D 8 2500 367.0 367.0 35.0 LM2936HVBMAX3.3/NOP SOIC D 8 2500 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) B LM2936HVBMAX5.0/NOP SOIC D 8 2500 367.0 367.0 35.0 B LM2936HVMAX-5.0 SOIC D 8 2500 367.0 367.0 35.0 LM2936HVMAX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2936MM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MM-5.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM2936MMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM2936MMX-5.0 VSSOP DGK 8 3500 367.0 367.0 35.0 LM2936MMX-5.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM2936MP-3.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MP-3.3 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0 LM2936MPX-3.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2936MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2936MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0 LM2936MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM2936MX-5.0 SOIC D 8 2500 367.0 367.0 35.0 LM2936MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 PackMaterials-Page3

MECHANICAL DATA MPDS094A – APRIL 2001 – REVISED JUNE 2002 DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE 6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 4 0,10 (0.004) M 7,30 (0.287) 3,70 (0.146) 6,70 (0.264) 3,30 (0.130) Gauge Plane 1 2 3 0,84 (0.033) 0°–10° 0,25 (0.010) 2,30 (0.091) 0,66 (0.026) 0,10 (0.004) M 4,60 (0.181) 0,75 (0.030) MIN 1,70 (0.067) 1,80 (0.071) MAX 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane 0,10 (0.0040) 0,08 (0.003) 0,02 (0.0008) 4202506/B 06/2002 NOTES: A. All linear dimensions are in millimeters (inches). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC TO-261 Variation AA. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265

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PACKAGE OUTLINE NDP0003B TO-252 - 2.55 mm max height SCALE 1.500 TRANSISTOR OUTLINE 10.42 9.40 6.22 1.27 B 5.97 0.88 A (2.345) 1 2.285 (2.5) 2 5.46 6.73 4.57 4.96 6.35 3 0.88 3X 0.64 1.02 PKG OPTIONAL 0.64 0.25 C A B 8 8 TOP & BOTTOM 1.14 0.89 C 2.55 MAX SEATING PLANE 0.88 0.17 0.60 0.46 0.46 0.51 MIN 4.32 MIN 3 2 4 1 4219870/A 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-252. www.ti.com

EXAMPLE BOARD LAYOUT NDP0003B TO-252 - 2.55 mm max height TRANSISTOR OUTLINE SEE SOLDER MASK DETAIL 2X (2.15) 2X (1.3) (5.7) 1 4 SYMM (4.57) (5.5) 3 (R0.05) TYP (4.38) (2.285) PKG LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 8X 0.07 MAX METAL EDGE 0.07 MIN ALL AROUND ALL AROUND METAL UNDER EXPOSED SOLDER MASK METAL EXPOSED METAL SOLDER MASK SOLDER MASK OPENING OPENING NON SOLDER MASK SOLDER MASK DEFINED DEFINED (PREFERRED) SOLDER MASK DETAIL 4219870/A 03/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004). 5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. www.ti.com

EXAMPLE STENCIL DESIGN NDP0003B TO-252 - 2.55 mm max height TRANSISTOR OUTLINE (1.35) TYP 2X (2.15) (0.26) 2X (1.3) (R0.05) TYP (1.32) TYP (4.57) 16X (1.12) 16X (1.15) (4.38) PKG SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 8X 4219870/A 03/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

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PACKAGE OUTLINE LP0003A TO-92 - 5.34 mm max height SCALE 1.200 SCALE 1.200 TO-92 5.21 4.44 EJECTOR PIN OPTIONAL 5.34 4.32 (1.5) TYP (2.54) SEATING 2X NOTE 3 PLANE 4 MAX (0.51) TYP 6X 0.076 MAX SEATING PLANE 3X 12.7 MIN 0.43 2X 0.55 3X 3X 0.35 2.6 0.2 0.38 2X 1.27 0.13 FORMED LEAD OPTION OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION TO STRAIGHT LEAD OPTION 2.67 3X 2.03 4.19 3.17 3 2 1 3.43 MIN 4215214/B 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Lead dimensions are not controlled within this area. 4. Reference JEDEC TO-226, variation AA. 5. Shipping method: a. Straight lead option available in bulk pack only. b. Formed lead option available in tape and reel or ammo pack. c. Specific products can be offered in limited combinations of shipping medium and lead options. d. Consult product folder for more information on available options. www.ti.com

EXAMPLE BOARD LAYOUT LP0003A TO-92 - 5.34 mm max height TO-92 FULL R TYP 0.05 MAX (1.07) ALL AROUND METAL 3X ( 0.85) HOLE TYP TYP 2X METAL (1.5) 2X (1.5) 2X SOLDER MASK OPENING 1 2 3 (R0.05) TYP 2X (1.07) (1.27) SOLDER MASK (2.54) OPENING LAND PATTERN EXAMPLE STRAIGHT LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 0.05 MAX ( 1.4) 2X ( 1.4) ALL AROUND METAL TYP 3X ( 0.9) HOLE METAL 2X (R0.05) TYP 1 2 3 SOLDER MASK OPENING (2.6) SOLDER MASK OPENING (5.2) LAND PATTERN EXAMPLE FORMED LEAD OPTION NON-SOLDER MASK DEFINED SCALE:15X 4215214/B 04/2017 www.ti.com

TAPE SPECIFICATIONS LP0003A TO-92 - 5.34 mm max height TO-92 13.7 11.7 32 23 (2.5) TYP 0.5 MIN 16.5 15.5 11.0 9.75 8.5 8.50 19.0 17.5 2.9 6.75 3.7-4.3 TYP TYP 2.4 5.95 13.0 12.4 FOR FORMED LEAD OPTION PACKAGE 4215214/B 04/2017 www.ti.com

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