LM1458, LM1558 www.ti.com SNOSBU4D–APRIL1998–REVISEDMARCH2013 LM1458/LM1558 Dual Operational Amplifier CheckforSamples:LM1458,LM1558 FEATURES 1 • NoFrequencyCompensationRequired • Low-PowerConsumption 2 • Short-CircuitProtection • 8-LeadTO-99and8-LeadPDIP • WideCommon-ModeandDifferentialVoltage • NoLatchUpWhenInputCommonMode Ranges RangeisExceeded DESCRIPTION The LM1458 and the LM1558 are general purpose dual operational amplifiers. The two amplifiers share a commonbiasnetworkandpowersupplyleads.Otherwise,theiroperationiscompletelyindependent. The LM1458 is identical to the LM1558 except that the LM1458 has its specifications guaranteed over the temperaturerangefrom0°Cto+70°Cinsteadof−55°Cto+125°C. Connection Diagram Figure1. TO-99Package Figure2.Dual-In-LinePackage (TopView) (TopView) SeePackageNumberLMC(O-MBCY-W8) SeePackageNumberD(R-PDSO-G8)or P(R-PDIP-T8) Thesedeviceshavelimitedbuilt-inESDprotection.Theleadsshouldbeshortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamagetotheMOSgates. 1 Pleasebeawarethatanimportantnoticeconcerningavailability,standardwarranty,anduseincriticalapplicationsof TexasInstrumentssemiconductorproductsanddisclaimerstheretoappearsattheendofthisdatasheet. Alltrademarksarethepropertyoftheirrespectiveowners. 2 PRODUCTIONDATAinformationiscurrentasofpublicationdate. Copyright©1998–2013,TexasInstrumentsIncorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarilyincludetestingofallparameters.

LM1458, LM1558 SNOSBU4D–APRIL1998–REVISEDMARCH2013 www.ti.com Absolute Maximum Ratings(1)(2)(3) SupplyVoltage LM1558 ±22V LM1458 ±18V PowerDissipation (4) LM1558H/LM1458H 500mW LM1458N 400mW DifferentialInputVoltage ±30V InputVoltage (5) ±15V OutputShort-CircuitDuration Continuous OperatingTemperatureRange LM1558 −55°Cto+125°C LM1458 0°Cto+70°C StorageTemperatureRange −65°Cto+150°C LeadTemperature(Soldering,10sec.) 260°C SolderingInformation PDIPPackage Soldering(10seconds) 260°C SOICPackage VaporPhase(60seconds) 215°C Infrared(15seconds) 220°C SeeAN-450“SurfaceMountingMethodsandTheirEffectonProductReliability”forothermethodsofsolderingsurfacemountdevices. ESDtolerance (6) 300V (1) “AbsoluteMaximumRatings”indicatelimitsbeyondwhichdamagetothedevicemayoccur.OperatingRatingsindicateconditionsfor whichthedeviceisfunctional,butdonotguaranteespecificperformancelimits. (2) RefertoRETS1558VforLM1558JandLM1558Hmilitaryspecifications. (3) IfMilitary/Aerospacespecifieddevicesarerequired,pleasecontacttheTISalesOffice/Distributorsforavailabilityandspecifications. (4) ThemaximumjunctiontemperatureoftheLM1558is150°C,whilethatoftheLM1458is100°C.Foroperatingatelevatedtemperatures, devicesintheLMCpackagemustbederatedbasedonathermalresistanceof150°C/W,junctiontoambientor20°C/W,junctionto case.ForthePDIPthedevicemustbederatedbasedonathermalresistanceof187°C/W,junctiontoambient. (5) Forsupplyvoltageslessthan±15V,theabsolutemaximuminputvoltageisequaltothesupplyvoltage. (6) Humanbodymodel,1.5kΩinserieswith100pF. Electrical Characteristics (1) Parameter Conditions LM1558 LM1458 Units Min Typ Max Min Typ Max InputOffsetVoltage T =25°C,R ≤10kΩ 1.0 5.0 1.0 6.0 mV A S InputOffsetCurrent T =25°C 80 200 80 200 nA A InputBiasCurrent T =25°C 200 500 200 500 nA A InputResistance T =25°C 0.3 1.0 0.3 1.0 MΩ A SupplyCurrentBoth T =25°C,V =±15V A S 3.0 5.0 3.0 5.6 mA Amplifiers LargeSignalVoltageGain T =25°C,V =±15V 50 160 20 160 V/mV A S V =±10V,R ≥2kΩ OUT L InputOffsetVoltage R ≤10kΩ 6.0 7.5 mV S InputOffsetCurrent 500 300 nA InputBiasCurrent 1.5 0.8 μA LargeSignalVoltageGain V =±15V,V =±10V 25 15 V/mV S OUT R ≥kΩ L OutputVoltageSwing V =±15V,R =10kΩ ±12 ±14 ±12 ±14 V S L R =2kΩ ±10 ±13 ±10 ±13 V L (1) ThesespecificationsapplyforV =±15Vand−55°C≤T ≤125°C,unlessotherwisespecified.WiththeLM1458,however,all S A specificationsarelimitedto0°C≤T ≤70°CandV =±15V. A S 2 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM1458 LM1558

LM1458, LM1558 www.ti.com SNOSBU4D–APRIL1998–REVISEDMARCH2013 Electrical Characteristics (1) (continued) Parameter Conditions LM1558 LM1458 Units Min Typ Max Min Typ Max InputVoltageRange V =±15V ±12 ±12 V S CommonMode R ≤10kΩ S 70 90 70 90 dB RejectionRatio SupplyVoltage R ≤10kΩ S 77 96 77 96 dB RejectionRatio SCHEMATIC DIAGRAM NumbersinparenthesesarepinnumbersforamplifierB. Copyright©1998–2013,TexasInstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM1458 LM1558

LM1458, LM1558 SNOSBU4D–APRIL1998–REVISEDMARCH2013 www.ti.com REVISION HISTORY ChangesfromRevisionC(March2013)toRevisionD Page • ChangedlayoutofNationalDataSheettoTIformat............................................................................................................ 3 4 SubmitDocumentationFeedback Copyright©1998–2013,TexasInstrumentsIncorporated ProductFolderLinks:LM1458 LM1558

PACKAGE OPTION ADDENDUM www.ti.com 22-Feb-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples (1) Drawing Qty (2) (6) (3) (4/5) LM1458 MWC ACTIVE WAFERSALE YS 0 1 Green (RoHS Call TI Level-1-NA-UNLIM -40 to 85 & no Sb/Br) LM1458M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM 1458M LM1458M/NOPB ACTIVE SOIC D 8 95 Green (RoHS SN Level-1-260C-UNLIM 0 to 70 LM & no Sb/Br) 1458M LM1458MX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM 1458M LM1458MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS SN Level-1-260C-UNLIM 0 to 70 LM & no Sb/Br) 1458M LM1458N/NOPB ACTIVE PDIP P 8 40 Green (RoHS Call TI | SN Level-1-NA-UNLIM 0 to 70 LM1458N & no Sb/Br) LM1558H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM1558H, LM1558H ) LM1558H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS Call TI Level-1-NA-UNLIM -55 to 125 ( LM1558H, LM1558H & no Sb/Br) ) MC1558G ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 ( LM1558H, LM1558H ) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 22-Feb-2020 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 TAPE AND REEL INFORMATION *Alldimensionsarenominal Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1(mm) LM1458MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM1458MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 PackMaterials-Page1

PACKAGE MATERIALS INFORMATION www.ti.com 29-Sep-2019 *Alldimensionsarenominal Device PackageType PackageDrawing Pins SPQ Length(mm) Width(mm) Height(mm) LM1458MX SOIC D 8 2500 367.0 367.0 35.0 LM1458MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 PackMaterials-Page2

PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] .004 [0.1] C A PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .189-.197 [4.81-5.00] .150 NOTE 3 [3.81] 4X (0 -15 ) 4 5 8X .012-.020 B .150-.157 [0.31-0.51] .069 MAX [3.81-3.98] .010 [0.25] C A B [1.75] NOTE 4 .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 0 - 8 [0.11-0.25] .016-.050 [0.41-1.27] DETAIL A (.041) TYPICAL [1.04] 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com

EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X SOLDER MASK SOLDER MASK METAL OPENING OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL .0028 MAX .0028 MIN [0.07] [0.07] ALL AROUND ALL AROUND NON SOLDER MASK SOLDER MASK DEFINED DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com

EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] SYMM (R.002 ) TYP [0.05] 5 4 6X (.050 ) [1.27] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com

None

None

IMPORTANTNOTICEANDDISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2020, Texas Instruments Incorporated