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LG226C103MAT2S1产品简介:
ICGOO电子元器件商城为您提供LG226C103MAT2S1由AVX设计生产,在icgoo商城现货销售,并且可以通过原厂、代理商等渠道进行代购。 提供LG226C103MAT2S1价格参考以及AVXLG226C103MAT2S1封装/规格参数等产品信息。 你可以下载LG226C103MAT2S1参考资料、Datasheet数据手册功能说明书, 资料中有LG226C103MAT2S1详细功能的应用电路图电压和使用方法及教程。
参数 | 数值 |
产品目录 | |
描述 | CAP CER 10000PF 6.3V X7R 0306电容器阵列与网络 6.3volts 0.010uF 20% 0306 X7R |
产品分类 | |
品牌 | AVX |
产品手册 | |
产品图片 | |
rohs | 符合RoHS无铅 / 符合限制有害物质指令(RoHS)规范要求 |
产品系列 | 陶瓷电容器,电容器阵列与网络,AVX LG226C103MAT2S1LG22 (LGA) |
数据手册 | |
产品型号 | LG226C103MAT2S1 |
产品 | Reverse Geometry Capacitor Arrays |
产品培训模块 | http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=21795http://www.digikey.cn/PTM/IndividualPTM.page?site=cn&lang=zhs&ptm=22065 |
产品目录绘图 | |
产品目录页面 | |
产品种类 | 电容器阵列与网络 |
其它名称 | 478-4627-1 |
包装 | 剪切带 (CT) |
厚度(最大值) | 0.022"(0.55mm) |
商标 | AVX |
外壳宽度 | 1.6 mm |
外壳长度 | 0.8 mm |
外壳高度 | 0.55 mm |
大小/尺寸 | 0.030" 长x 0.063" 宽(0.76mm x 1.60mm) |
安装类型 | 表面贴装,MLCC |
容差 | 20 % |
封装 | Reel |
封装/外壳 | 0306(0816 公制) |
工作温度 | -55°C ~ 125°C |
工作温度范围 | - 55 C to + 125 C |
工厂包装数量 | 4000 |
应用 | 旁通,去耦 |
引线形式 | - |
引线间距 | - |
损耗因数DF | 6.5 |
标准包装 | 1 |
温度系数 | X7R |
特性 | 低 ESL 型(倒置结构) |
特色产品 | http://www.digikey.com/cn/zh/ph/avx/lgacapacitors.html |
电压-额定 | 6.3V |
电压额定值 | 6.3 V |
电容 | 0.01 uF |
端接类型 | SMD/SMT |
等级 | - |
系列 | LGA |
高度-安装(最大值) | - |
LGA Low Inductance Capacitors 0204/0306 Land Grid Array Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX. These new LGA products are the third low inductance family developed by AVX. The innovative LGA technology sets a new standard for low inductance MLCC performance. Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal IDC low inductance MLCC with a number of advantages including: • Simplified layout of 2 large solder pads compared to 8 small pads for IDCs • Opportunity to reduce PCB or substrate contribution to system ESL by using multiple parallel vias in solder pads • Advanced FCT manufacturing process used to create uniformly flat terminations on the capacitor that resist “tombstoning” • Better solder joint reliability APPLICATIONS Semiconductor Packages Board Level Device Decoupling • Microprocessors/CPUs • Frequencies of 300 MHz or more • Graphics Processors/GPUs • ICs drawing 15W or more • Chipsets • Low voltages • FPGAs • High speed buses • ASICs 0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC 1 0.1 ) Ω ( e c n a d e p m I 0.01 0.001 1 10 100 1000 Frequency (MHz) 84 051316
LGA Low Inductance Capacitors 0204/0306 Land Grid Array SIZE LG12 (0204) LG22 (0306) Length mm (in.) 0.50 (0.020) 0.76 (0.030) Width mm (in.) 1.00 (0.039) 1.60 (0.063) Temp. Char. X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W) Working Voltage 6.3 4 6.3 4 6.3 4 10 6.3 4 6.3 4 6.3 4 6.3 4 (6) (4) (6) (4) (6) (4) (Z) (6) (4) (6) (4) (6) (4) (6) (4) Cap (μF) 0.010 (103) 0.022 (223) 0.047 (473) 0.100 (104) 0.220 (224) 0.330 (334) 0.470 (474) 1.000 (105) 2.200 (225) = X7R = X5R = X7S = X6S HOW TO ORDER LG 1 2 6 Z 104 M A T 2 S 1 Style Case Number of Working Temperature Coded Cap Termination Termination Packaging Thickness Number of Size Terminals Voltage Characteristic Cap Tolerance Style 100% Sn* Tape & Reel S = 0.55mm Capacitors 1 = 0204 2 4 = 4V C = X7R M = ±20% A = “U” Land *Contact factory for 2 = 7" Reel max 2 = 0306 6 = 6.3V D = X5R other termination 4 = 13" Reel Z = 10V Z = X7S finishes W = X6S Reverse Geometry LGA LG12, LG22 L To p Vie w BL T Sid e 1 Sid e 2 BL BW W L PART DIMENSIONS MM (INCHES) Series L W T BW BL 0.5 ± 0.05 1.00 ± 0.10 0.50 ± 0.05 0.8 ± 0.10 0.13 ± 0.08 LG12 (0204) (0.020±0.002) (0.039 ± 0.004) (0.020 ± 0.002) (0.031 ± 0.004) (0.005 ± 0.003) 0.76 ± 0.10 1.60 ± 0.10 0.50 ± 0.05 1.50 ±0.10 0.28 ± 0.08 LG22 (0306) (0.030 ± 0.004) (0.063 ± 0.004) (0.020 ± 0.002) (0.059 ± 0.004) (0.011 ± 0.003) RECOMMENDED SOLDER PAD DIMENSIONS MM (INCHES) PL Series PL PW1 G LG12 (0204) 0.50 (0.020) 1.00 (0.039) 0.20 (0.008) G LG22 (0306) 0.65 (0.026) 1.50 (0.059) 0.20 (0.008) PW1 85 051316
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