LBP01 LED bypass protection − Datasheet production data Features ■ Bidirectional device: LBP01-0810B ■ Unidirectional device: LBP01-0803SC5 ■ RoHS compliant Benefits SMB SOT23-5L ■ Keep LED strings on in case of LED open (DO-214AA) LBP01-0803SC5 mode failure LBP01-0810B ■ Reduced maintenance cost Figure 1. Functional diagrams ■ Increase lifetime of the lighting system Complies with the following standards: ■ IEC61000-4-2 level 4 Control circuit – ±15 kV (air discharge) – ±8 kV (contact discharge) ■ IEC 61000-4-5 LBP01-0810B – ±1kV / 24 A 1 3 4 5 Control Applications circuit This device shunts failed LEDs in applications 2 where LED strings can not be turned-off for safety LBP01-0803SC5 reason due to a LED failure. Main applications are: Description ■ Automotive headlights ■ Traffic lights The LBP01 series are bypass switches to be connected in parallel with 1 or 2 LEDs. In case of ■ Aircraft runaway lights LED failure, this allows the current to flow through ■ Emergency lighting systems the other LEDs. ■ Display panel backlighting It also provides an overvoltage protection against ■ Street lighting surges defined in IEC 61000-4-2 and IEC 61000-4-5 Their robust dice also protect LEDs against surge. These devices are compatible with LEDs up to 1A. LBP01 are packaged either in SMB or SOT23-5L March 2012 Doc ID 022950 Rev 1 1/8 This is information on a product in full production. www.st.com 8

Characteristics LBP01 1 Characteristics Table 1. A bsolute maximum ratings (T = 25 °C) amb Symbol Parameter Value Unit V Peak pulse voltage IEC 61000-4-2 contact discharge 30 kV PP I Repetitive peak pulse current (8/20µs) 24 A PP SOT23-5L 0.35 A I On-state DC current F SMB 1 A T Operating junction temperature range -55 to 150 °C j T Storage temperature range -65 to 150 °C stg T Maximum lead temperature for soldering during 10 s 260 °C L Table 2. E lectrical characteristics (T = 25 °C) amb Symbol Test conditions Min. Typ. Max. Unit I V = 3 V 100 nA RM RM V 8 15 V BO SOT23-5L 200 I mA H SMB 200 I = 0.35 A (1) SOT23-5L 2 V on V I = 0.35 A SMB 1.3 V on on I = 1 A SMB 1.5 V on dV/dt 300 V/µs SOT23-5L 140 °C/W R On recommended pad layout with copper area of 1 cm2 th(j-a) SMB 100 °C/W 1. Measured between pin 1, 3, 4, or 5 and pin 2 2/8 Doc ID 022950 Rev 1

LBP01 Ordering information scheme Figure 2. T hermal resistance, junction to Figure 3. Thermal resistance, junction to ambient, versus copper area under ambient, versus copper area under each lead (SMB) each lead (SOT23-5L) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 200 240 220 180 200 160 180 140 160 120 140 100 120 SCu(mm2) SCu(mm2) 100 80 0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200 2 Ordering information scheme Figure 4. Ordering information scheme LBP 01 - vv ii p LED bypass protection Version Breakdown voltage Forward DC current Delivery mode SC5 = SOT23-5L B = SMB Doc ID 022950 Rev 1 3/8

Package information LBP01 3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. T able 3. SMB dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 D A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 E c 0.15 0.40 0.006 0.016 A1 D 3.30 3.95 0.130 0.156 C A2 E 5.10 5.60 0.201 0.220 L b E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 F igure 5. Footprint, dimensions in mm Figure 6. Marking(1) (inches) 1.62 2.60 1.62 (0.064) (0.102) (0.064) ECOPACK compliance 2.18 XXX: Marking (0.086) x x x Z: Manufacturing location Y: Year WW: week z y ww 5.84 (0.23) 1. Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. 4/8 Doc ID 022950 Rev 1

LBP01 Package information T able 4. SOT23-5L dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.45 0.035 0.057 c A1 q L A1 0 0.10 0 0.004 A H A2 0.90 1.30 0.035 0.051 E b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008 e D 2.80 3.05 0.11 0.118 D b E 1.50 1.75 0.059 0.069 e e 0.95 0.037 A2 H 2.60 3.00 0.102 0.118 L 0.10 0.60 0.004 0.024 M 0° 10° 0° 10° F igure 7. Footprint, dimensions in mm Figure 8. Marking (inches) 0.60 (0.024) 1.20 (0.047) 0.95 xx x x 3.50 2.30 (0.037) 1.10 (0.138) (0.091) (0.043) Doc ID 022950 Rev 1 5/8

Recommendations on PCB assembly LBP01 4 Recommendations on PCB assembly 4.1 PCB design 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Figure 9. Printed circuit board layout 4.2 Reflow profile Figure 10. ST ECOPACK® recommended soldering reflow profile for PCB mounting 240-245 °C Temperature (°C) -2°C/sto 250 2 - 3 °C/s -3°C/s -6°C/smax 200 60sec (90max) 150 100 0.9 °C/s 50 Time (s) 0 30 60 90 120 150 180 210 240 270 300 Note: Minimize air convection currents in the reflow oven to avoid component movement. 6/8 Doc ID 022950 Rev 1

LBP01 Ordering information 5 Ordering information T able 5. Ordering information Order code Marking Package Weight Base qty Delivery mode LBP01-0803SC5 XT08 SOT23-5L 16 mg 3000 Tape and reel LBP01-0810B L08(1) SMB 0.11 g 2500 Tape and reel 1. The marking can be rotated by 90° to differentiate assembly location. 6 Revision history T able 6. Document revision history Date Revision Changes 20-Mar-2012 1 Initial release. Doc ID 022950 Rev 1 7/8

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